Polyimide composition comprising eco-friendly solvent and polyimide varnish for display produced therefrom

Abstract

The present invention provides a polyimide composition comprising: an aromatic dianhydride monomer; an aromatic diamine monomer; an amino silane having an amine group (-NH2) at the terminal end; an amino silane; and an eco-friendly solvent.

Description

Polyimide composition containing an eco-friendly solvent and polyimide varnish for display manufactured therefrom

[0001] The present invention relates to a polyimide composition containing an environmentally friendly solvent and a polyimide varnish for display purposes manufactured therefrom. Specifically, the present invention relates to a polyimide composition containing a small amount of amino silane and a polyimide varnish for display purposes manufactured therefrom, which has improved adhesion and transmittance and superior surface properties.

[0002] Polyimide (PI) is a polymer material characterized by excellent heat resistance, chemical resistance, electrical insulation, chemical resistance, and weather resistance among organic materials, based on a rigid aromatic backbone and an imide ring with excellent chemical stability. It can be manufactured into various forms, such as films, fibers, and membranes. These properties make polyimide widely used in advanced materials and insulating coatings for electrical and electronic applications, semiconductors, displays, automobiles, aviation, and space applications.

[0003] Polyimides can be manufactured by dissolving an acid dianhydride having two acid anhydride groups per molecule and a diamine having two amino groups per molecule in a solvent, synthesizing a polyimide precursor called polyamic acid (PAA), followed by coating, drying, and heat treating at about 350°C to imidize it. Polyimides are currently manufactured in solvents classified as hazardous, such as N-methylpyrrolidone (NMP), dimethylformamide (DMF), and dimethylacetamide (DMAc). NMP is a particularly good solvent for certain polyimide or polyamic acid polymers, dissolving them that other solvents cannot. However, NMP is a reproductive toxicant, or reprotoxin. In the electronics industry, many polymer applications require spin coating, slot-die coating, or other deposition techniques that require the polymer to remain in solution until the solvent is removed to cast the film, and the viscosity of such polymer compositions must be suitable for such deposition techniques. Such requirements pose a problem, limiting the range of solvents available for polyimides. There is a need for a suitable solvent to replace NMP for use with polyimides in the manufacture of electronic devices.

[0004] Therefore, there is a need to develop a polyimide with excellent adhesion, permeability, and surface properties while using a suitable solvent to replace NMP.

[0005] The purpose of the present invention is to provide a polyimide composition, polyimide varnish and polyimide coating using an eco-friendly solvent and having excellent adhesion, permeability and surface properties.

[0006] In addition, the present invention aims to provide a polyimide varnish for a display.

[0007] The present invention is susceptible to various modifications and embodiments. Therefore, specific embodiments are illustrated and described in detail. However, this is not intended to limit the present invention to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention.

[0008] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0009] When amounts, concentrations, or other values ​​or parameters are given herein as a range, preferred range, or enumeration of an upper preferred value and a lower preferred value, it should be understood that this specifically discloses any range formed by any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed.

[0010] When a range of numerical values ​​is mentioned in this specification, unless otherwise stated, it is intended that the endpoints of the range and the scope of the invention within the range are not limited to the specific values ​​mentioned in defining the range.

[0011] As used herein, "dianhydride" is intended to include precursors or derivatives thereof, also referred to as "dianhydric acids," "dianhydrides," or "acid dianhydrides." While these may not technically be dianhydrides, they will nonetheless react with diamines to form polyamic acids, which can then be converted to polyimides.

[0012] As used herein, "diamine" is intended to include precursors or derivatives thereof, which may not technically be diamines, but which will nonetheless react with a dianhydride acid to form a polyamic acid, which in turn can be converted to a polyimide.

[0013] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and shall not be construed in an idealized or overly formal sense unless explicitly defined herein. Specific details for implementing the invention are described below.

[0014] The present invention relates to a polyimide composition containing an environmentally friendly solvent and a polyimide varnish for display manufactured therefrom.

[0015] Polyimide composition and polyimide varnish prepared therefrom

[0016] The present invention provides a polyimide composition comprising an aromatic dianhydride monomer; an aromatic diamine monomer; an amino silane having an amine group (-NH2) at a terminal; and an environmentally friendly solvent.

[0017] The above-mentioned eco-friendly solvent may include at least one selected from the group consisting of dimethylpropionamide (DMPA), N,N-diethylacetamide (DEAc), N,N-diethylformamide (DEF), N-ethylpyrrolidone (NEP), diethylpropionamide (DEPA), 3-methoxy-N,N-dimethylpropanamide, and tetramethyl urea (TMU), and preferably may include dimethylpropionamide (DMPA). The DMPA is an eco-friendly organic solvent that can be processed without a separate purification process after the polymerization reaction, thereby reducing costs.

[0018] The amino silane having an amine group (-NH2) at the terminal may include at least one selected from the group consisting of 3-aminopropyl trimethoxy silane (APTMS), 3-aminopropyl methyl dimethoxysilane, 3-aminopropyl methyl diethoxysilane, 3-(2-aminoethyl)aminopropyl trimethoxysilane, 3-aminopropyl triethoxy silane (APTES) and 1,3-Bis(3-aminopropyl)tetramethyldisiloxane (SIDA), preferably 3-aminopropyl triethoxy silane (APTES) and It may include at least one selected from the group consisting of 1,3-Bis(3-aminopropyl)tetramethyldisiloxane (SIDA).

[0019] The polyimide composition may contain 0.01 to 1 mol% of the amino silane based on 100 mol% of the polyimide composition, preferably 0.02 to 0.7 mol%, 0.03 to 0.5 mol%, 0.04 to 0.3 mol%, and more preferably 0.05 to 0.1 mol%. By containing 0.01 to 1 mol% of the amino silane, a polyamic acid and / or polyimide having a target repeating unit can be formed, and a polyimide composition, polyimide varnish, and polyimide coating having improved adhesion and permeability and excellent surface properties can be provided.

[0020] The above aromatic dianhydride monomers are biphenyl tetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride (BPAF), 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), oxydiphthalic dianhydride (ODPA), diphenylsulfone-3,4,3',4'-tetracarboxylic dianhydride (DSDA), bis(3,4-dicarboxyphenyl)sulfide dianhydride, 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,2-Bis(3,4-dicarboxyphenyl)propane dianhydride, p-phenylenebis(trimellitic monoester acid anhydride), p-biphenylenebis(trimellitic monoester acid anhydride), m-terphenyl-3,4,3',4'-tetracarboxylic dianhydride, p-terphenyl-3,4,3',4'-tetracarboxylic dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, 2,2-bis〔(3,4-dicarboxy phenoxy)phenyl〕propane dianhydride (BPADA), 2,3,6,7-naphthalene tetracarboxylic acid It may include at least one selected from the group consisting of dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride and 4,4'-(2,2-hexafluoroisopropylidene)diphthalic acid dianhydride, and preferably biphenyl tetracarboxylic dianhydride (BPDA).

[0021] The above aromatic diamine monomers are 1,4-diaminobenzene (PPD), 4,4'-diaminodiphenyl ether (4,4'-ODA), 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFMB), 2,2'-dimethyl-4,4'-diaminobiphenyl (m-tolidine), 2,2-bisaminophenoxyphenylpropane (BAPP), metaphenylenediamine, 3,3'-dimethylbenzidine, 2,2'-dimethylbenzidine, 2,4-diaminotoluene, 2,6-diaminotoluene, 3,5-diaminobenzoic acid (DABA), 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-dicarboxy-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, 4,4'-diaminobenzanilide, 3,3'-dimethoxybenzidine, 2,2'-dimethoxybenzidine, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diamino-4,4'-dichlorobenzophenone, 3,3'-diamino-4,4'-dimethoxybenzophenone, 3,3'-Diaminodiphenylmethane, 3,4'-Diaminodiphenylmethane, 4,4'-Diaminodiphenylmethane, 2,2-Bis(3-aminophenyl)propane, 2,2-Bis(4-aminophenyl)propane, 2,2-Bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2-Bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 3,3'-Diaminodiphenylsulfoxide, 3,4'-Diaminodiphenylsulfoxide, 4,4'-Diaminodiphenylsulfoxide, 1,3-Bis(3-aminophenyl)benzene, 1,3-Bis(4-aminophenyl)benzene, 1,4-Bis(3-aminophenyl)benzene, 1,4-Bis(4-aminophenyl)benzene, 1,3-bis(4-aminophenoxy)benzene (TPE-R), 1,4-bis(3-aminophenoxy)benzene (TPE-Q), 1,3-bis(3-aminophenoxy)-4-trifluoromethylbenzene,3,3'-Diamino-4-(4-phenyl)phenoxybenzophenone, 3,3'-diamino-4,4'-di(4-phenylphenoxy)benzophenone, 1,3-bis(3-aminophenylsulfide)benzene, 1,3-bis(4-aminophenylsulfide)benzene, 1,4-bis(4-aminophenylsulfide)benzene, 1,3-bis(3-aminophenylsulfone)benzene, 1,3-bis(4-aminophenylsulfone)benzene, 1,4-bis(4-aminophenylsulfone)benzene, 1,3-bis〔2-(4-aminophenyl)isopropyl〕benzene, 1,4-bis〔2-(3-aminophenyl)isopropyl〕benzene, 1,4-bis〔2-(4-aminophenyl)isopropyl〕benzene, 3,3'-bis(3-aminophenoxy)biphenyl, 3,3'-Bis(4-aminophenoxy)biphenyl, 4,4'-bis(3-aminophenoxy)biphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis〔3-(3-aminophenoxy)phenyl〕ether, bis〔3-(4-aminophenoxy)phenyl〕ether, bis〔4-(3-aminophenoxy)phenyl〕ether, bis〔4-(4-aminophenoxy)phenyl〕ether, bis〔3-(3-aminophenoxy)phenyl〕ketone, bis〔3-(4-aminophenoxy)phenyl〕ketone, bis〔4-(3-aminophenoxy)phenyl〕ketone, bis〔3-(3-aminophenoxy)phenyl〕sulfide, bis〔3-(4-aminophenoxy)phenyl〕sulfide, Bis〔4-(3-aminophenoxy)phenyl〕sulfide, bis〔4-(4-aminophenoxy)phenyl〕sulfide, bis〔3-(3-aminophenoxy)phenyl〕sulfone, bis〔3-(4-aminophenoxy)phenyl〕sulfone, bis〔4-(3-aminophenoxy)phenyl〕sulfone, bis〔4-(4-aminophenoxy)phenyl〕sulfone, bis〔3-(3-aminophenoxy)phenyl〕methane, bis〔3-(4-aminophenoxy)phenyl〕methane, bis〔4-(3-aminophenoxy)phenyl〕methane, bis〔4-(4-aminophenoxy)phenyl〕methane, 2,2-bis〔3-(3-aminophenoxy)phenyl〕propane, 2,2-bis〔3-(4-aminophenoxy)phenyl〕propane, 2,2-bis〔4-(3-aminophenoxy)phenyl〕propane, 2,2-bis〔3-(3-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane, 2,2-bis〔3-(4-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane, 2,It may include at least one selected from the group consisting of 2-bis〔4-(3-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane and 2,2-bis〔4-(4-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane, and preferably may include 1,4-diaminobenzene (PPD).

[0022] The molar ratio of the above-mentioned dihydride monomer and the above-mentioned diamine monomer may be 0.5:1 to 2:1, preferably 0.9:1 to 1.5:1, 0.95:1 to 1.2:1, 0.97:1 to 1.1:1, and more preferably 0.98:1 to 1:1.

[0023] The polyamic acid may contain 95 to 105 mol% of the dianhydride monomer based on 100 mol% of the diamine monomer, and for example, the lower limit may be 95.5 mol% or more, 96 mol% or more, 96.5 mol% or more, 97 mol% or more, 97.5 mol% or more, 98 mol% or more, 98.5 mol% or more, 99 mol% or more, or 99.5 mol% or more, and the upper limit may be 105 mol% or less, 104 mol% or less, 103 mol% or less, 102 mol% or less, 101 mol% or less, or 100 mol% or less.

[0024] After curing, the polyimide composition may have an average transmittance of 60% or more at 380 to 780 nm. For example, the lower limit of the transmittance may be 61% or more, 62% or more, 63% or more, 64% or more, or 65% or more, and the upper limit is not particularly limited, but may be 90% or less or 85% or less.

[0025] The above average transmittance can be measured by measuring the light transmittance at 380 to 780 nm using an ultraviolet / visible spectrophotometer (UV-Vis Spectrophotometer) and calculating the average value. In this case, measuring the light transmittance at 380 to 780 nm means measuring the light transmittance at all wavelengths from 380 nm to 780 nm.

[0026] The adhesion of the polyimide composition to an a-Si substrate after curing may be 0.7 to 1.5 S / cm. For example, the lower limit of the adhesion may be 0.75 S / cm or more, 0.76 S / cm or more, 0.8 S / cm or more, 0.85 S / cm or more, 0.86 S / cm or more, 0.87 S / cm or more, 0.88 S / cm or more, 0.89 S / cm or more, or 0.9 S / cm or more, and the upper limit may be 1.4 S / cm or less, 1.35 S / cm or less, 1.32 S / cm or less, 1.31 S / cm or less, or 1.3 S / cm or less.

[0027] The above adhesive strength can be measured using INSTRON's UTM 5546 model under conditions of 90° Peel mode and Cross Head Speed ​​50 mm / min after cutting the cured polyimide composition in the form of a film on an a-Si substrate into 100x10 mm.

[0028] The present invention provides a polyimide varnish manufactured from the above polyimide composition.

[0029] The above polyimide varnish can be used in a display.

[0030] The cured product of the polyimide varnish according to the present invention may be in the form of a film, and the thickness of the cured product may be appropriately selected in consideration of the intended use, usage environment, physical properties, etc.

[0031] In one embodiment, the polyimide varnish according to the present invention may have a thickness of 20 to 40 μm after curing, for example, the lower limit may be 21 μm or more, 22 μm or more, 23 μm or more, or 24 μm or more, and the upper limit may be 35 μm or less, 30 μm or less, 29 μm or less, 28 μm or less, or 27 μm or less.

[0032] The present invention provides a polyimide coating comprising a cured product of the above polyimide varnish.

[0033] Method for manufacturing polyimide varnish

[0034] The present invention provides a method for producing a polyimide varnish, comprising the steps of mixing an aromatic dianhydride monomer, an aromatic diamine monomer, and an amino silane in an environmentally friendly solvent and polymerizing the mixture to produce a polyimide varnish.

[0035] The step of manufacturing the above polyimide varnish may include (a) a step of mixing an aromatic diamine monomer and an amino silane in an environmentally friendly solvent to manufacture a mixed solution; and (b) a step of introducing an aromatic dianhydride monomer into the mixed solution and reacting the mixture to manufacture a polyimide precursor.

[0036] The reaction of step (b) can be carried out at room temperature (20 to 25°C) for 4 to 24 hours, preferably 8 to 20 hours, more preferably 12 to 18 hours, and even more preferably 15 to 17 hours. By carrying out the reaction for 4 to 24 hours, a polyamic acid and / or polyimide having a target repeating unit can be formed, and when looking at the extent to which the production amount of the polyamic acid and / or polyimide increases with time, a polyimide varnish can be efficiently manufactured.

[0037] Another embodiment of the present invention provides a polyimide varnish manufactured by the method for manufacturing the polyimide varnish.

[0038] The polyimide composition according to the present invention and the polyimide varnish produced therefrom use an environmentally friendly solvent and have excellent adhesion, transmittance, and surface properties after curing.

[0039] The polyimide coating according to the present invention has excellent adhesion, transmittance, and surface properties by including a cured product of the polyimide varnish.

[0040] In addition, the method for manufacturing the above polyimide varnish has the effect of manufacturing a polyimide varnish having excellent adhesion, transmittance, and surface properties after curing by introducing amino silane during the polyamic acid reaction.

[0041] In addition, the polyimide composition according to the present invention and the polyimide varnish produced therefrom have an effect that can be applied to displays.

[0042] To aid in understanding the present invention, examples are presented. The following examples are provided solely to facilitate a better understanding of the present invention, and the scope of the present invention is not limited by the examples.

[0043] <Example: Manufacturing of polyimide varnish>

[0044] Example 1

[0045] A mixed solution was prepared by mixing 100 mol% of environmentally friendly solvents, dimethylpropionamide (DMPA) and p-phenylenediamine (PPD), and 0.1 mol% of 1,3-Bis(3-aminopropyl)tetramethyldisiloxane (SIDA) in a reactor.

[0046] Afterwards, 98.9 mol% of biphenyl tetracarboxylic dianhydride (BPDA) was mixed into the above mixed solution and reacted at 25°C for 16 hours to produce a polyimide varnish.

[0047] Examples 2 to 4 and Comparative Examples 1 to 4

[0048] Polyimide varnish was manufactured in the same manner as in Example 1, except that the content and type of each monomer were used differently, as shown in Table 1 below.

[0049] Table 1 below lists the types and contents of monomers used in manufacturing polyimide varnishes according to Examples 1 to 4 and Comparative Examples 1 to 4.

[0050] Classification Aromatic dianhydride monomer Aromatic diamine monomer Amino silane Solvent type Content (mol%) Example 1 BPDAPPDSIDA 0.1 DMPA Example 2 SIDA 0.05 DMPA Example 3 APTES 0.1 DMPA Example 4 APTES 0.05 DMPA Comparative Example 1--NMP Comparative Example 2--DMPA Comparative Example 3 GLYMO 0.1 DMPA Comparative Example 4 GLYMO 0.05 DMPA

[0051] The abbreviations for the substances used in Table 1 above are as follows.

[0052] BPDA: Biphenyl tetracarboxylic dianhydride

[0053] PPD: p-phenylene diamine

[0054] SIDA: 1,3-Bis(3-aminopropyl)tetramethyldisiloxane

[0055] APTES: 3-aminopropyl triethoxy silane

[0056] GLYMO: (3-glycidyloxypropyl)trimethoxysilane

[0057] DMPA: Dimethylpropionamide

[0058] NMP: N-methylpyrrolidone

[0059] <Experimental Example: Evaluation of the Physical Properties of Polyimide Varnish>

[0060] Preparation of cured polyimide varnish in film form for property measurement

[0061] The polyimide varnishes manufactured in Examples 1 to 4 and Comparative Examples 1 to 4 were subjected to high-speed rotation at 2,200 rpm to remove air bubbles. Thereafter, the polyimide varnishes were applied onto an a-Si sacrificial layer substrate using a spin-coater by calculating the solvent and solid ratio and setting an appropriate rpm and time. Thereafter, the polyimide varnishes were maintained at 120°C for 20 minutes, then heated from 120°C to 470°C at a rate of 7°C / min, maintained at 470°C for 45 minutes, and then cooled to 25°C to produce a cured product in the form of a film. At this time, the cured product had a thickness of 10±1 μm.

[0062] Experimental Example 1. Confirmation of surface properties of cured product

[0063] The surface of the polyimide cured film manufactured from the polyimide varnishes of the above examples and comparative examples was visually observed to determine whether bubbles were present. The results are shown in Table 2 according to the criteria below.

[0064] ○: Good interior and exterior

[0065] △: The interior is good, but bubbles have formed on the outside.

[0066] ×: Internal and external bubbles

[0067] Experimental Example 2. Measurement of transmittance of cured product

[0068] The light transmittance of the film-shaped polyimide cured products manufactured from the polyimide varnishes of the above examples and comparative examples was measured at 380 to 780 nm using an ultraviolet / visible spectrophotometer (UV-Vis Spectrophotometer), and the average value was calculated. Specifically, the measurement of the light transmittance at 380 to 780 nm refers to measuring the light transmittance at all wavelengths from 380 nm to 780 nm. The measurement results are shown in Table 2 below.

[0069] Experimental Example 3. Measurement of adhesive strength of cured product

[0070] The adhesion strength of the polyimide cured film manufactured from the polyimide varnishes of the above examples and comparative examples to an a-Si substrate was measured. The adhesion strength was measured using an INSTRON UTM 5546 model under conditions of 90° Peel mode and Cross Head Speed ​​50 mm / min after cutting the polyimide cured film on the a-Si substrate into 100 x 10 mm pieces. The measurement results are shown in Table 2 below.

[0071] Table 2 below summarizes the surface properties, transmittance, and adhesive strength measurement results of the film-shaped polyimide cured products manufactured from the polyimide varnishes of Examples 1 to 4 and Comparative Examples 1 to 4.

[0072] Surface characteristics Transmittance (%) Adhesion (S / cm) Example 1 ○681.21 Example 2 ○691.03 Example 3 ○640.98 Example 4 △660.76 Comparative Example 1 ○700.80 Comparative Example 2 × 670.37 Comparative Example 3 △640.67 Comparative Example 4 × 650.54

[0073] According to Table 2, it can be confirmed that when DMPA is used as a solvent (Comparative Example 2), it has lower permeability, lower adhesive strength, and poor surface properties compared to when NMP is used as a solvent (Comparative Example 1).

[0074] However, it was confirmed that the cured products (Examples 1 to 4) prepared from polyimide varnish using a small amount of amino silane (SIDA and APTES) while using DMPA as a solvent had improved adhesion and permeability and excellent surface properties.

[0075] In particular, when SIDA is used as an amino silane (Examples 1 and 2), it can be confirmed that the transmittance is similar to that when NMP is used as a solvent (Comparative Example 1), and the adhesive strength is superior to that of Comparative Example 1.

[0076] Meanwhile, Comparative Examples 3 and 4 using GLYMO, an epoxy silane rather than an amino silane, have poor surface properties and can be confirmed to have lower permeability and lower adhesive strength compared to Examples 1 to 4 using SIDA and APTES.

[0077] The specification omits detailed descriptions of matters that would be readily apparent and inferred by those skilled in the art. Furthermore, various modifications, other than the specific examples described herein, are possible without altering the technical spirit or essential configuration of the invention. Therefore, the present invention may be practiced in ways other than those specifically described and exemplified herein, as will be readily apparent to those skilled in the art.

Claims

1. Aromatic dianhydride monomer; Aromatic diamine monomer; Amino silane having an amine group (-NH2) at the terminal; and Eco-friendly solvent; A polyimide composition comprising:

2. In paragraph 1, A polyimide composition, wherein the eco-friendly solvent comprises at least one selected from the group consisting of dimethylpropionamide (DMPA), N,N-diethylacetamide (DEAc), N,N-diethylformamide (DEF), N-ethylpyrrolidone (NEP), diethylpropionamide (DEPA), 3-methoxy-N,N-dimethylpropanamide, and tetramethyl urea (TMU).

3. In paragraph 1, A polyimide composition, wherein the amino silane having an amine group (-NH2) at the terminal thereof comprises at least one selected from the group consisting of 3-aminopropyl trimethoxy silane (APTMS), 3-aminopropyl methyl dimethoxysilane, 3-aminopropyl methyl diethoxysilane, 3-(2-aminoethyl)aminopropyl trimethoxysilane, 3-aminopropyl triethoxy silane (APTES), and 1,3-Bis(3-aminopropyl)tetramethyldisiloxane (SIDA).

4. In paragraph 3, A polyimide composition, wherein the amino silane comprises at least one selected from the group consisting of 3-aminopropyl triethoxy silane (APTES) and 1,3-Bis(3-aminopropyl)tetramethyldisiloxane (SIDA).

5. In paragraph 1, A polyimide composition, wherein the polyimide composition contains 0.01 to 1 mol% of the amino silane based on 100 mol% of the aromatic diamine monomer.

6. In paragraph 1, The above aromatic dianhydride monomers are biphenyl tetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride (BPAF), 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), oxydiphthalic dianhydride (ODPA), diphenylsulfone-3,4,3',4'-tetracarboxylic dianhydride (DSDA), bis(3,4-dicarboxyphenyl)sulfide dianhydride, 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,2-Bis(3,4-dicarboxyphenyl)propane dianhydride, p-phenylenebis(trimellitic monoester acid anhydride), p-biphenylenebis(trimellitic monoester acid anhydride), m-terphenyl-3,4,3',4'-tetracarboxylic dianhydride, p-terphenyl-3,4,3',4'-tetracarboxylic dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, 2,2-bis〔(3,4-dicarboxy phenoxy)phenyl〕propane dianhydride (BPADA), 2,3,6,7-naphthalene tetracarboxylic acid A polyimide composition comprising at least one selected from the group consisting of dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, and 4,4'-(2,2-hexafluoroisopropylidene)diphthalic acid dianhydride.

7. In paragraph 6, A polyimide composition, wherein the aromatic dianhydride monomer comprises biphenyl tetracarboxylic dianhydride (BPDA).

8. In paragraph 1, The above aromatic diamine monomers are 1,4-diaminobenzene (PPD), 4,4'-diaminodiphenyl ether (4,4'-ODA), 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFMB), 2,2'-dimethyl-4,4'-diaminobiphenyl (m-tolidine), 2,2-bisaminophenoxyphenylpropane (BAPP), metaphenylenediamine, 3,3'-dimethylbenzidine, 2,2'-dimethylbenzidine, 2,4-diaminotoluene, 2,6-diaminotoluene, 3,5-diaminobenzoic acid (DABA), 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-dicarboxy-4,4'-diaminodiphenylmethane, 3,3',5,5'-Tetramethyl-4,4'-diaminodiphenylmethane, 4,4'-diaminobenzanilide, 3,3'-dimethoxybenzidine, 2,2'-dimethoxybenzidine, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diamino-4,4'-dichlorobenzophenone, 3,3'-diamino-4,4'-dimethoxybenzophenone, 3,3'-Diaminodiphenylmethane, 3,4'-Diaminodiphenylmethane, 4,4'-Diaminodiphenylmethane, 2,2-Bis(3-aminophenyl)propane, 2,2-Bis(4-aminophenyl)propane, 2,2-Bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2-Bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 3,3'-Diaminodiphenylsulfoxide, 3,4'-Diaminodiphenylsulfoxide, 4,4'-Diaminodiphenylsulfoxide, 1,3-Bis(3-aminophenyl)benzene, 1,3-Bis(4-aminophenyl)benzene, 1,4-Bis(3-aminophenyl)benzene, 1,4-Bis(4-aminophenyl)benzene, 1,3-Bis(4-aminophenoxy)benzene (TPE-R), 1,4-Bis(3-aminophenoxy)benzene (TPE-Q), 1,3-Bis(3-aminophenoxy)-4-trifluoromethylbenzene,3,3'-Diamino-4-(4-phenyl)phenoxybenzophenone, 3,3'-diamino-4,4'-di(4-phenylphenoxy)benzophenone, 1,3-bis(3-aminophenylsulfide)benzene, 1,3-bis(4-aminophenylsulfide)benzene, 1,4-bis(4-aminophenylsulfide)benzene, 1,3-bis(3-aminophenylsulfone)benzene, 1,3-bis(4-aminophenylsulfone)benzene, 1,4-bis〔2-(4-aminophenyl)isopropyl〕benzene, 1,4-bis〔2-(3-aminophenyl)isopropyl〕benzene, 1,4-bis〔2-(4-aminophenyl)isopropyl〕benzene, 3,3'-bis(3-aminophenoxy)biphenyl, 3,3'-Bis(4-aminophenoxy)biphenyl, 4,4'-bis(3-aminophenoxy)biphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis〔3-(3-aminophenoxy)phenyl〕ether, bis〔3-(4-aminophenoxy)phenyl〕ether, bis〔4-(3-aminophenoxy)phenyl〕ether, bis〔4-(4-aminophenoxy)phenyl〕ether, bis〔3-(3-aminophenoxy)phenyl〕ketone, bis〔3-(4-aminophenoxy)phenyl〕ketone, bis〔4-(3-aminophenoxy)phenyl〕ketone, bis〔3-(3-aminophenoxy)phenyl〕sulfide, bis〔3-(4-aminophenoxy)phenyl〕sulfide, Bis〔4-(3-aminophenoxy)phenyl〕sulfide, bis〔4-(4-aminophenoxy)phenyl〕sulfide, bis〔3-(3-aminophenoxy)phenyl〕sulfone, bis〔3-(4-aminophenoxy)phenyl〕sulfone, bis〔4-(3-aminophenoxy)phenyl〕sulfone, bis〔4-(4-aminophenoxy)phenyl〕sulfone, bis〔3-(3-aminophenoxy)phenyl〕methane, bis〔3-(4-aminophenoxy)phenyl〕methane, bis〔4-(3-aminophenoxy)phenyl〕methane, bis〔4-(4-aminophenoxy)phenyl〕methane, 2,2-bis〔3-(3-aminophenoxy)phenyl〕propane, 2,2-bis〔3-(4-aminophenoxy)phenyl〕propane, 2,2-Bis〔4-(3-aminophenoxy)phenyl〕propane, 2,2-bis〔3-(3-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane, 2,2-bis〔3-(4-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane, 2,A polyimide composition comprising at least one selected from the group consisting of 2-bis〔4-(3-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane and 2,2-bis〔4-(4-aminophenoxy)phenyl〕-1,1,1,3,3,3-hexafluoropropane.

9. In paragraph 8, A polyimide composition, wherein the aromatic diamine monomer comprises 1,4-diaminobenzene (PPD).

10. In paragraph 1, A polyimide composition having an average transmittance of 60% or more at 380 to 780 nm after curing of the polyimide composition.

11. In paragraph 1, A polyimide composition having an adhesion to an a-Si substrate of 0.7 to 1.5 S / cm after curing of the polyimide composition.

12. A polyimide varnish manufactured from a polyimide composition according to paragraph 1.

13. In paragraph 12, A polyimide varnish, wherein the polyimide varnish is used for a display.

14. A polyimide coating comprising a cured product of a polyimide varnish according to Article 12.

15. A method for producing a polyimide varnish, comprising the steps of mixing an aromatic dianhydride monomer, an aromatic diamine monomer, and an amino silane in an eco-friendly solvent and polymerizing the mixture to produce a polyimide varnish.

16. In paragraph 15, The step of manufacturing the above polyimide varnish (a) a step of preparing a mixed solution by mixing an aromatic diamine monomer and amino silane in an eco-friendly solvent; and (b) a step of adding an aromatic dianhydride monomer to the mixed solution and reacting the mixture to produce a polyimide precursor; A method for producing a polyimide varnish.

17. In paragraph 16, A method for manufacturing polyimide varnish, wherein the reaction of step (b) is performed at room temperature (20 to 25°C) for 4 to 24 hours.