Active heat dissipation apparatus

Abstract

The present invention relates to an active heat dissipation apparatus comprising: a heat-conducting panel body having therein a refrigerant flow space in which a refrigerant is filled and flows; and a refrigerant damper which is disposed in the middle of the refrigerant flow space in the thickness direction and, when the refrigerant freezes and expands, elastically absorbs the expansion of the frozen refrigerant within a range that does not increase the separation distance between one side surface and the other side surface of the refrigerant flow space. Therefore, the present invention provides the advantage of making it possible to prevent product damage during extreme cold weather.

Description

Active heat dissipation mechanism

[0001] The present invention relates to an active heat dissipation apparatus, and more particularly, to an active heat dissipation apparatus that can improve heat dissipation performance by actively transferring heat generated from a heat generating device (e.g., an electronic device) through a phase change of a refrigerant that is more effective than the heat conducting material properties of the device itself.

[0002] In diverse industries such as communications, electronics, and electrical engineering, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Consequently, the development of appropriate cooling systems is essential.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into Active Cooling Devices and Passive Cooling Devices. Active Cooling Devices mainly utilize Forced Convection by fans, while Passive Cooling Devices can be classified as a technology that utilizes Natural Convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving, advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues, and heat dissipation devices are being developed to address this issue.

[0006] Phase change refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat energy.

[0007] A phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not undergo a phase change is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, radiators have a problem: since temperature and pressure are proportional, pressure increases as temperature increases. This can lead to the rupture of the radiator itself if the high temperature transmitted from the heating element within the sealed radiator increases pressure. To address this, pressure must be prevented from increasing, and the radiator must have sufficient internal volume to ensure pressure equilibrium during the phase change cycle of the material.

[0009] In particular, it is most desirable for a phase change material to be able to change between a gaseous state and a liquid state in a narrow temperature range while being inexpensive and having less impact on the environment. A representative phase change material is water.

[0010] However, water freezes into solid ice below 0℃, and its physical property of greatly increasing its volume when frozen also points out the problem of causing damage to components that contain water as a refrigerant.

[0011]

[0012] The purpose of the present invention is to provide an active heat dissipation mechanism capable of improving the heat dissipation performance of a heat generating device (electronic device) in order to solve the above-mentioned technical problem.

[0013] In addition, another object of the present invention is to provide an active heat dissipation mechanism capable of maximizing the heat transport capacity of a refrigerant filled therein.

[0014] In addition, another object of the present invention is to provide an active heat dissipation mechanism with excellent manufacturability.

[0015] In addition, another object of the present invention is to provide an active heat dissipation mechanism that can produce a product at a low cost by replacing it with a metal material having low thermal conductivity, while exhibiting an effect equivalent to or greater than that of existing heat dissipation performance.

[0016] In addition, another object of the present invention is to provide an active heat dissipation mechanism that can use water as a refrigerant, which is low cost and has little impact on environmental pollution, and can solve the problem of component damage due to volume increase when water freezes.

[0017] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0018]

[0019] One embodiment of an active heat dissipation mechanism according to the present invention includes a heat-conducting panel body having a refrigerant flow space in which refrigerant is filled and flows therein, and a refrigerant damper disposed in the middle of the thickness direction of the refrigerant flow space to elastically absorb volume expansion of the refrigerant after freezing without increasing a distance between one side and the other side of the refrigerant flow space when the volume expands due to freezing of the refrigerant.

[0020] Here, the refrigerant flow space includes a first refrigerant passage provided in an evaporation region in which liquid refrigerant among the refrigerants is stored and the stored liquid refrigerant is phase-changed into a gaseous state by heat supplied from a heat-radiating housing body that is a heat-generating target, and a plurality of second refrigerant passages formed in a direction of gravity or inclined with respect to the direction of gravity toward the first refrigerant passage and guiding the liquid refrigerant that has been phase-changed from a gaseous state to a liquid state among the refrigerants to flow toward the first refrigerant passage, and the refrigerant damper may be arranged on the side of the second refrigerant passage.

[0021] Additionally, the refrigerant damper may be placed in a condensation area excluding the evaporation area.

[0022] In addition, the heat conductive panel body includes a one-side heat conductive panel forming one side of the refrigerant flow space and a other-side heat conductive panel forming the other side of the refrigerant flow space, and the refrigerant damper can be fixed to the refrigerant flow space corresponding to a middle portion of the one-side heat conductive panel and the other-side heat conductive panel.

[0023] In addition, the refrigerant damper may be arranged so that one side has a predetermined distance from the inner surface of the one-side heat-conducting panel, and the other side has a predetermined distance from the inner surface of the other-side heat-conducting panel.

[0024] In addition, the heat conductive panel body is further provided with a plurality of strength reinforcing members protruding from the one side heat conductive panel and the other side heat conductive panel toward the refrigerant flow space, and the refrigerant damper can be fixed by the plurality of strength reinforcing members that are mutually contacted in the refrigerant flow space.

[0025] In addition, the refrigerant damper may be formed with a plurality of penetration holes formed to allow a plurality of strength reinforcing parts formed on the one-side heat-conducting panel and the other-side heat-conducting panel to penetrate and be interviewed within the refrigerant flow space.

[0026] In addition, when the plurality of strength reinforcement parts have a flat joint surface with a predetermined diameter formed at each tip portion, the plurality of through holes formed in the refrigerant damper can be formed to have an inner diameter larger than the diameter of the joint surface of the plurality of strength reinforcement parts.

[0027] In addition, the heat conductive panel body may further include a plurality of inclined guides formed so as to protrude toward the refrigerant flow space from the one side heat conductive panel and the other side heat conductive panel but at a depth that does not touch each other, and to induce the condensed liquid refrigerant to flow downwardly inclined with respect to the direction of gravity, and one surface of the refrigerant damper may be fixed in close contact with the inclined guide of the one side heat conductive panel, and the other surface of the refrigerant damper may be fixed in close contact with the inclined guide of the other side heat conductive panel.

[0028] In addition, the refrigerant damper may be formed of an elastic material that is deformed by an external force, but has a thickness when no external force is applied that is greater than the minimum separation distance between the inclined guide of the one-side heat-conducting panel and the inclined guide of the other-side heat-conducting panel.

[0029] In addition, the inner diameter of the plurality of through holes formed in the refrigerant damper may be formed to a size that does not come into contact with the ends of the plurality of strength reinforcing parts when one side and the other side of the refrigerant damper are fixed in close contact with the inclined guides formed on the one side and the other side of the one side heat-conducting panel and the other side heat-conducting panel, respectively.

[0030] Additionally, some of the plurality of strength reinforcing members may be joined to each other by welding after being interviewed through the plurality of through holes formed in the refrigerant damper when joining a single metal panel member after bending or when joining two metal panel members.

[0031] In addition, the refrigerant damper may be placed at a relatively lower portion of the heat-conducting panel body in the direction of gravity when the heat-conducting panel body is fixed to a press-fit portion formed in a direction of gravity or inclined with respect to the direction of gravity on the back surface of the heat-dissipating housing body.

[0032] In addition, the refrigerant damper may be made of an elastic material including a rubber material that can elastically absorb at least the expanded volume when the volume expands due to freezing of the refrigerant.

[0033]

[0034] According to one embodiment of the active heat dissipation mechanism according to the present invention, the following various effects can be achieved.

[0035] First, by minimizing the heat concentration phenomenon caused by the rising airflow of heat on the back of the heat dissipation housing body and enabling active heat transfer through the phase change of the refrigerant, the overall heat dissipation performance can be significantly improved.

[0036] Second, the effect of improving heat dissipation performance can be achieved by maximizing the heat transport capacity by shortening the gas-liquid circulation cycle time of the refrigerant filled inside.

[0037] Third, the material of the heat-conducting panel body, which constitutes the refrigerant flow space in which the refrigerant changes phase and flows, is replaced with SUS material, which is a lower metal material than aluminum material, but it can achieve the effect of implementing higher heat dissipation performance than that of the existing aluminum material.

[0038] Fourth, since a refrigerant damper is installed in the lower part of the gravity direction where the liquid refrigerant is mainly stored, it has the effect of preventing product damage due to freezing in extreme cold even when distilled water (water) is used as the refrigerant filled in the SUS material heat-conducting panel body.

[0039]

[0040] Figure 1 is a perspective view showing an example of installation on the back surface of an antenna device of an active heat dissipation mechanism according to one embodiment of the present invention.

[0041] Figure 2 is an exploded perspective view of Figure 1,

[0042] Figure 3 is a development diagram showing an active heat dissipation mechanism according to one embodiment of the present invention.

[0043] FIG. 4 is a process diagram showing a manufacturing process of an active heat dissipation mechanism according to one embodiment of the present invention according to the bending method of FIG. 3.

[0044] Figure 5 is a plan view of an active heat dissipation mechanism according to one embodiment of the present invention, and is a perspective view showing the inside thereof.

[0045] Fig. 6 is a perspective view showing the inside of the refrigerant flow space with one side of the heat conduction panel body of Fig. 5 removed.

[0046] Figure 7 is an enlarged perspective view of a portion of Figure 6,

[0047] Fig. 8 is a perspective view showing a refrigerant damper among the configurations of Fig. 6.

[0048] Fig. 9 is a cross-sectional view taken along line AA of Fig. 5 and an enlarged view of a portion thereof.

[0049]

[0050] <Explanation of symbols>

[0051] 100: Antenna device 110: Heat dissipation housing body

[0052] 200: Active heat dissipation mechanism 200-1: One-sided heat-conducting panel

[0053] 200-2: Other side heat conduction panel 201: Press-fit end

[0054] 203: Heat sink section 205: Refrigerant flow space

[0055] 210: First refrigerant path 215: Slant guide

[0056] 220: Second refrigerant flow path 230: Third refrigerant flow path

[0057] 240: Multiple strength reinforcement parts 250: Refrigerant damper

[0058] 255: Through hole 300: Absorber

[0059] T: arbitrary baseline

[0060]

[0061] Hereinafter, embodiments of an active heat dissipation mechanism according to the present invention will be described in detail with reference to the attached drawings.

[0062] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0063] In describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0064]

[0065] In general, heat generating devices (electronic devices) are manufactured in various forms throughout the industry. However, the applicant of the present invention is a company engaged in the manufacturing of other wireless communication equipment, and a representative heat generating device (electronic device) among wireless communication equipment is an antenna device. The antenna device will be described below as a specific example.

[0066] However, the active heat dissipation mechanism according to the embodiments of the present invention described below should not be interpreted as being limited to being applied only to antenna devices.

[0067] An antenna device (100) to which an active heat dissipation mechanism (200) according to embodiments of the present invention is applied, as shown in FIGS. 1 and 2, includes a heat dissipation housing body (110) formed in a rectangular shape having a receiving space opened forward and a front-back receiving width that is approximately long and thin in the vertical direction.

[0068] The heat dissipation housing body (110) may be made of a thermally conductive material (particularly, a metal material) so as to effectively transfer heat by making surface thermal contact with the heat generating elements (not shown).

[0069] Inside the receiving space of the heat dissipation housing body (110), although not shown in the drawing, a main board with a plurality of MBF (Micro Bellows Filter) elements mounted on the front via a clamshell as a substrate for a PAU (Power Amplifier Unit) and a DTU (Digital Transceiving Unit) and a type of heat generating element mounted on the back can be stacked.

[0070] Here, the main board may be defined as a heat-generating element that generates a large amount of heat during operation, such as an RFIC element or a PA (Power Amplifier) ​​element. However, it should be noted that in the embodiments of the present invention, the description is limited to adopting an electronic device as an antenna device, and the heat-generating elements are not limited to the above configuration. For example, representative heat-generating elements such as semiconductors or a PC CPU may also be adopted as heat-generating elements.

[0071] A radome panel (50) is installed on the front of the receiving space of the heat-radiating housing body (110), which can protect the radiating elements implemented as antenna elements from the outside and at the same time ensure smooth radiation from the radiating elements.

[0072] However, among electronic devices, the antenna device, which has a relatively high need for heat dissipation, has a radome panel (50) that is not suitable for heat dissipation installed on the front of the heat dissipation housing body (110) as described above, and thus the need for concentrated heat dissipation through the remaining area except the front of the heat dissipation housing body (110) is greater, and an effective heat dissipation design through a limited heat dissipation area is required.

[0073] Meanwhile, an active heat dissipation mechanism (200) according to embodiments of the present invention may be installed on the back surface of the heat dissipation housing body (110).

[0074] The active heat dissipation mechanism (200) according to embodiments of the present invention is provided in the form of a heat dissipation fin, and more precisely, unlike the fixed heat dissipation fin (200F-1, 200F-2) described below, it can be characterized by being provided in the form of a thin vapor chamber filled with a refrigerant, which is a material that can change phase by heat supplied from the outside.

[0075] Here, the inside of the active heat dissipation mechanism (200) according to embodiments of the present invention may include an absorber (not shown) that absorbs liquid refrigerant among refrigerants, retains it in a position close to the heat generating elements, and promotes evaporation of the liquid refrigerant into gaseous refrigerant.

[0076] The concept of retaining liquid refrigerant by an absorbent is not limited to simply absorbing and storing liquid refrigerant, but is understood as a concept that includes at least causing liquid refrigerant to flow in the opposite direction (upward) to the direction of gravity higher than its surface by absorption force (or capillary force).

[0077] Typically, a well-known vapor chamber is typically equipped with a wick member having a wick structure with a plurality of pores formed therein. The wick member here may be manufactured by sintering a metal powder so that a plurality of pores are formed through which a liquid refrigerant filled inside a panel member made of a heat-conductive material moves toward the side equipped with the heat generating elements by capillary force, while a gaseous refrigerant can freely flow to the outside.

[0078] However, the above wick member is not limited to the sintered metal wick member described above, but can be defined as a concept including all possible materials, such as fiber materials, regardless of any name, such as the absorbent, etc., to the extent that it can promote absorption and dispersion or vaporization of liquid refrigerant.

[0079] As shown in FIGS. 1 and 2, a trench structure (170) may be provided on the back surface of the heat dissipation housing body (110) with an empty portion that divides the middle portion between the left and right ends into upper and lower portions.

[0080] Here, on the back surface of the heat dissipation housing body (110) corresponding to the left and right sides of the trench structure (170), a plurality of press-fit portions (150) may be provided so that a plurality of active heat dissipation mechanisms (200) according to one embodiment of the present invention are arranged to be inclined upward toward the left and right ends, respectively. That is, the press-fit portions (150) are provided to be inclined upward to the left and right, respectively, with the trench structure (170) as the center, and the active heat dissipation mechanisms (200) fixed thereto may be arranged in a pattern in the vertical direction with a pair forming a 'V' shape.

[0081] Meanwhile, the active heat dissipation mechanism (200) according to one embodiment of the present invention is formed in a rectangular shape of the same size and length in the same longitudinal direction, and as shown in FIGS. 1 and 2, when the active heat dissipation mechanism (200) of the same size is installed in a plurality of press-fit portions (150), one inverted triangle-shaped portion on the upper back surface of the heat dissipation housing body (110) and two right triangle-shaped portions on the lower left and right back surfaces of the heat dissipation housing body (110) are not occupied by the active heat dissipation mechanism (200), and fixed heat dissipation fins (200F-1, 200F-2) can be arranged therein.

[0082] Here, the fixed heat dissipation fins (200F-1, 200F-2) may include an upper fixed heat dissipation fin (200F-1) arranged on the upper side of the rear surface of the heat dissipation housing body (110) that is not occupied by the active heat dissipation mechanism (200) according to one embodiment of the present invention, as referenced in FIG. 2, and a lower fixed heat dissipation fin (200F-2) arranged on the lower left and right sides of the rear surface of the heat dissipation housing body (110) that is not occupied by the active heat dissipation mechanism (200) according to embodiments of the present invention.

[0083] Unlike the active heat dissipation mechanism (200) according to embodiments of the present invention, the fixed heat sink fin (200F-1, 200F-2) is provided in the form of a general heat sink fin that does not contain a refrigerant inside, and may be processed from an aluminum material or an aluminum alloy material having excellent thermal conductivity among metal materials.

[0084] In the area where the trench structure (170) formed on the back surface of the heat dissipation housing body (110) implemented as the first installation implementation example is provided and in the area (inverted triangle area, 130) where the upper fixed heat dissipation fin (200F-1) among the fixed heat dissipation fins (200F-1, 200F-2) is installed, a heat transfer medium (not shown) formed in a general vapor chamber type may be provided.

[0085] Meanwhile, on the back surface of the heat dissipation housing body (110), as referenced in FIG. 2, a press-fit portion (150) may be formed for press-fitting installation of an active heat dissipation mechanism (200) according to an embodiment of the present invention, which is provided in multiple pieces.

[0086] At this time, although not shown in the drawing, it is preferable to press-fit the press-fit portion (150) after thermal epoxy treatment to improve heat transfer efficiency.

[0087] FIG. 3 is a development diagram showing an active heat dissipation mechanism according to one embodiment of the present invention, and FIG. 4 is a process diagram showing a manufacturing process of an active heat dissipation mechanism according to one embodiment of the present invention according to the bending method of FIG. 3.

[0088] An active heat dissipation mechanism (200) according to one embodiment of the present invention includes a heat-conducting panel body (200-1, 200-2) having a refrigerant flow space in which refrigerant is filled and flows through an internal bonding process as a single metal panel member, as referenced in FIGS. 3 and 4.

[0089] That is, an active heat dissipation mechanism (200) according to one embodiment of the present invention can be manufactured by bending a heat-conducting panel body (200-1, 200-2), which is a single metal panel member, with respect to a predetermined arbitrary reference line (T) as referenced in FIG. 4 and then bonding the bent heat-conducting panel body so that a sealed refrigerant flow space (205) is formed inside it.

[0090] Here, the heat-conducting panel body (200-1, 200-2) is a single metal panel member, and can be formed in a predetermined manner to form a refrigerant flow space (205), and in particular, the active heat dissipation mechanism (200) according to one embodiment of the present invention can directly form at least a first refrigerant flow path (210) described later among the refrigerant flow spaces (205) in which refrigerant is filled and flows through the interior through a bending and bonding process among predetermined methods.

[0091] Here, the refrigerant flow space (205) may include a first refrigerant passage (210) which is provided in a portion located relatively lower with respect to the direction of gravity so as to facilitate capture (retention) or storage of liquid refrigerant, and which forms an evaporation region in which liquid refrigerant (liquid refrigerant) is phase-changed into gaseous refrigerant (gaseous refrigerant), and a second refrigerant passage (220) which is provided in a condensation region other than the first refrigerant passage (210), and which guides the flow of liquid refrigerant that has been phase-changed from gaseous refrigerant (gaseous refrigerant) into the above-described evaporation region.

[0092] That is, when the area where the first refrigerant passage (210) is provided and the area formed through the bending is defined as an evaporation area where the liquid refrigerant among the refrigerants evaporates, and the area remaining outside the evaporation area is defined as a condensation area, the second refrigerant passage (220) can be provided in the condensation area.

[0093] In particular, the first refrigerant passage (210) is a portion of a single metal panel member that has been shaped by bending in the above-described manner, and is formed so that liquid refrigerant among the refrigerants is filled in with a distance corresponding to the thickness of the material of the metal panel member between the heating elements or the press-fit portion (150) equipped with the heating elements.

[0094] In this case, the first refrigerant passage (210) is a portion where the liquid refrigerant filled in the refrigerant flow space (205) is stored and retained, and may be arranged vertically in the direction of gravity or at least inclined at the top and bottom with respect to the direction of gravity. Therefore, the liquid refrigerant stored in the first refrigerant passage (210) is positioned at a portion closer to the bottom among the upper and lower portions arranged at an inclined angle as described above.

[0095] However, the first refrigerant passage (210) is not a concept that is physically completely separated (compartmentalized) from the condensation area in which a plurality of second refrigerant passages (220) are formed, and even if defined as the first refrigerant passage (210), as described above, the area lower than the refrigerant water surface is filled with refrigerant, but a first refrigerant passage (210) higher than the refrigerant water surface may also exist, and a configuration such as the above-described absorber may be required to raise the stored refrigerant to the first refrigerant passage (210) higher than the water surface.

[0096] Meanwhile, an active heat dissipation mechanism (200) according to one embodiment of the present invention can be manufactured by bending a single heat-conducting panel body (200-1, 200-2) based on a predetermined arbitrary reference line (T, see details in FIG. 4) described later and then joining them so that a sealed refrigerant flow space (205) is formed inside.

[0097] Therefore, the first refrigerant passage (210) can be defined as a refrigerant filling and flow space in which liquid refrigerant is filled, with a distance corresponding to the material thickness of the metal panel member between the heating elements or the press-fit portion (150) equipped with the heating elements as a portion that has been shaped by the bending.

[0098] However, the manufacturing method of the active heat dissipation mechanism according to the present invention is not limited to manufacturing a single metal panel member by bending as described above, and it may also be possible to manufacture two metal panel members by directly joining them without a bending process.

[0099] Meanwhile, a plurality of second refrigerant passages (220) are formed within the condensation area excluding the first refrigerant passage (210), and the liquid refrigerant condensed from a gaseous state to a liquid state from the other end in the width direction of the heat conductive panel body (200-1, 200-2) can act as a flow path toward the first refrigerant passage (210) by surface tension or gravity.

[0100] More specifically, the second refrigerant flow path (220) provides a flow path that allows a uniform amount of liquid refrigerant to flow down and be supplied toward the first refrigerant flow path (210) when the gaseous refrigerant (gaseous refrigerant) condenses into a liquid refrigerant (liquid refrigerant) through a heat exchange process with the outside air in the condensation region, thereby gradually increasing in volume at a position within the refrigerant flow space (205) where condensation takes place and flowing down in the direction of gravity.

[0101] In particular, the second refrigerant flow path (220) can be defined between a plurality of inclined guides (215), as described later, and when the liquid refrigerant that has been condensed in the condensation region flows toward the first refrigerant flow path (210), the dispersion flow can be suppressed toward the second refrigerant flow path (220) adjacent to the second refrigerant flow path (220), which is a magnetic flow path, due to surface tension.

[0102] That is, since the plurality of inclined guides (215) have a narrower flow space than the second refrigerant passage (220), the surface tension acts to suppress the flow toward the adjacent second refrigerant passage (220).

[0103] In this way, when the dispersion flow of the condensed liquid refrigerant is suppressed by the plurality of inclined guides (215) and the second refrigerant passage (220), the liquid refrigerant can be minimized from falling directly downward in the direction of gravity, and the condensed liquid refrigerant can be supplied in a uniform amount toward the first refrigerant passage (210) without being biased in the condensation region by each lower end connected at a uniform interval to the first refrigerant passage (210).

[0104] In addition, a plurality of second refrigerant passages (220) can be defined between a plurality of inclined guides (215) that protrude from the facing surfaces of the heat-conducting panel bodies (200-1, 200-2) into the refrigerant flow space (205).

[0105] Referring to (a) of FIG. 4, an active heat dissipation mechanism (200) according to one embodiment of the present invention can simultaneously form the first refrigerant flow path (210) and the second refrigerant flow path (220) described above and a plurality of inclined guides (215) described below for implementing them, by performing a press process before bending a heat-conductive panel body (200-1, 200-2) made of a single member of a predetermined heat-conductive material.

[0106] At this time, if the thermal conductive panel body (200-1, 200-2) that is spread out flat before the bending process is formed into a rectangular shape whose width in the left-right direction is smaller than its length in the up-down direction in the drawing of Fig. 4, the arbitrary reference line (T) is arranged to cross the exact center portion of the left and right ends in the up-down direction, and can serve as a reference during bending. At this time, the exact center portion of the left and right ends of the thermal conductive panel body (200-1, 200-2) is the center portion, and can be understood as the portion that serves as the boundary between one side thermal conductive panel (200-1) and the other side thermal conductive panel (200-2).

[0107] Referring to (b) and (c) of FIG. 4, a heat-conducting panel (200-1) on the left side and a heat-conducting panel (200-2) on the right side can be bent using a bending jig (not shown) so that they are in contact with each other based on an arbitrary reference line (T).

[0108] At this time, in addition to the first refrigerant passage (210) and the second refrigerant passage (220), a third refrigerant passage (230) additionally formed according to the embodiment can be formed, and a plurality of strength reinforcing members (240) required for joining can be formed to face each other.

[0109] Referring to (d) of FIG. 4, when one side of the thermal conductive panel (200-1) and the other side of the thermal conductive panel body (200-1, 200-2) are mutually contacted, they are mutually contacted using a predetermined contact method along the edge ends thereof, and at the same time, each of the plurality of mutually contacted strength reinforcing parts (240) can be mutually contacted using a predetermined contact method.

[0110] At this time, one end and the other end of the first refrigerant passage (210) formed through the bending process can be formed to be in communication with the outside and the refrigerant flow space (205) for the refrigerant filling process and caulking process described later, and the remaining part (heat sink part (203)) can be sealed so that the refrigerant flow space (205) is completely blocked from the outside.

[0111] More specifically, an active heat dissipation mechanism (200) according to one embodiment of the present invention includes, as referenced in FIG. 4, a heat-conducting panel body (200-1, 200-2) formed with a left end before bending based on an arbitrary reference line (T) defined in a straight line shape in the vertical direction, a heat-conducting panel body (200-1, 200-2) including a heat-conducting panel (200-1) on one side forming a left end before bending and a heat-conducting panel (200-2) on the other side forming a right end before bending. Here, it is sufficient to understand that the heat-conducting panel (200-1) on one side and the heat-conducting panel (200-2) on the other side define the heat-conducting panel body (200-1, 200-2) before the bending process.

[0112] For example, the heat conductive panel body (200-1, 200-2) is a part formed by bending and bonding, and can be defined as including a press-fit end (201) that is press-fitted into the press-fit portion (150) formed to be inclined upward to the left and right, respectively, with respect to a trench structure (170) formed on the back surface of the heat conductive housing body (110) as the heat dissipation target, and a heat dissipation plate part (203) that performs heat dissipation according to a phase change of a refrigerant and heat exchange with external air (outside air) as a part defined by the edge end of the heat conductive panel body (200-1, 200-2) excluding the press-fit end (201).

[0113] That is, the heat sink portion (203) is preferably defined as all areas, excluding the above-described press-fit end portion (201), in which heat is exchanged between the refrigerant (particularly, gaseous refrigerant) filled inside and the outside air (outside air) and then heat is dissipated. The fact that the gaseous refrigerant within the heat sink portion (203) exchanges heat with the outside air means that the gaseous refrigerant condenses and changes into a liquid refrigerant.

[0114] Meanwhile, in the heat sink portion (203), a plurality of strength reinforcing portions (240) can be formed to protrude into the refrigerant flow space (205) from the inner surface of one side heat-conducting panel (200-1) and the inner surface of the other side heat-conducting panel (200-2) spaced apart in the thickness direction.

[0115] In addition, as described later, a plurality of strength reinforcing parts (240) are formed simultaneously with the second refrigerant passage (220), the third refrigerant passage (230) and the plurality of inclined guides (215) through a pressing process, and it can be understood that they are formed to be sunken from the outside to the inside of the heat sink part (203) when observed from the outside after joining.

[0116] The first refrigerant passage (210) is located at the lower side based on the direction of gravity, and when the refrigerant that has been phase-changed into a liquid refrigerant (liquid refrigerant) mainly flows downward along the direction of gravity in the refrigerant flow space (205), it can be defined as a passage that performs the role of uniformly moving and dispersing the liquid refrigerant throughout the entire evaporation region by capturing it on the same inclined guide (215) and changing it into a gas phase by heat transferred from the heat generating elements of the heat dissipation housing body (110). At this time, the uniform movement and distribution of the liquid refrigerant among the functions of the first refrigerant passage (210) may be a concept meaning that the liquid refrigerant is transported in a direction different from the direction of gravity at least by an absorber described later.

[0117] In addition, it will be sufficient to understand that the uniform movement and distribution of the liquid refrigerant among the functions of the first refrigerant passage (210) means that the liquid refrigerant is evenly supplied and transported by a plurality of second refrigerant passages (220) or a plurality of inclined guides (215) formed at an angle with respect to a single first refrigerant passage (210).

[0118] An absorbent, as described later, is inserted and installed inside the first refrigerant passage (210), thereby facilitating the capture and dispersion of the liquid refrigerant, and its transport in a direction different from the direction of gravity.

[0119] Here, the first refrigerant flow path (210) can be formed symmetrically in the thickness direction of the refrigerant flow space (205) with respect to an arbitrary reference line (T) as referenced in FIG. 4 after bending.

[0120] Among the metal materials that make up the heat conductive panel body (200-1, 200-2) that serves as a practical medium in transferring heat generated from heating elements to the refrigerant filled in the refrigerant flow space (205), the material most widely used in the current industrial field is aluminum.

[0121] Aluminum (Al) is, as is well known, one of the most widely used materials for heat dissipation because of its low thermal conductivity of approximately 230 (W / mK) and specific gravity of 2.7.

[0122] However, although the aluminum material itself has excellent thermal conductivity and specific gravity, it has the disadvantage of being relatively expensive compared to its cost and having a limited variety of refrigerants that can be filled inside. In particular, when the refrigerant is distilled water (water), the aluminum material has the problem of generating a hydrogen compound within the closed refrigerant flow space (205) by causing a certain chemical reaction with the water it comes into contact with, thereby increasing the internal pressure. Therefore, distilled water (water), which is inexpensive and has no effect on the environment, must be excluded from the available refrigerants.

[0123] Hereinafter, in an active heat dissipation mechanism (200) according to one embodiment of the present invention, in order to solve the problem of increased cost and the problem of excluding distilled water (water) when aluminum is selected as the material of the heat-conducting panel body (200-1, 200-2) as described above, the SUS (stainless steel) material, which has minimal chemical reaction when in contact with distilled water (water) as an acceptable refrigerant and has a relatively low manufacturing cost, is selected, but it is explained on the premise that the thermal conductivity (heat dissipation performance) corresponding to the case where aluminum is selected can be secured.

[0124] FIG. 5 is a plan view of an active heat dissipation mechanism according to one embodiment of the present invention, and is a perspective view showing the inside thereof, FIG. 6 is a perspective view showing the inside of a refrigerant flow space with one side of the heat conduction panel body of FIG. 5 removed, FIG. 7 is an enlarged perspective view of a portion of FIG. 6, FIG. 8 is a perspective view showing a refrigerant damper among the components of FIG. 6, and FIG. 9 is a cross-sectional view taken along line AA of FIG. 5 and a partially enlarged view thereof.

[0125] In the following, the explanation is limited to distilled water (water) as the refrigerant, and the phase change characteristics of water in its natural state are assumed.

[0126] In an active heat dissipation device (200) according to one embodiment of the present invention, the refrigerant filled in the refrigerant flow space (205) is distilled water (water), and considering the change in volume during the phase change, the refrigerant can be filled to an extent that a water surface in a liquid refrigerant state is formed relatively in a lower portion in the direction of gravity.

[0127] For example, when the refrigerant changes phase from liquid to gaseous refrigerant, its volume increases significantly, so taking this into consideration, a small amount of liquid refrigerant is charged in advance.

[0128] Meanwhile, in the case of the active heat dissipation mechanism (200) according to one embodiment of the present invention, only the case where the refrigerant evaporates from a liquid state and changes into a gaseous state, and condenses from a gaseous state and changes into a liquid state is envisaged, but there is a concern that the liquid refrigerant may freeze within the sealed refrigerant flow space (205) during a period of extreme cold when the antenna device is stopped from operating or the external temperature drops rapidly.

[0129] In particular, as in the active heat dissipation mechanism (200) according to one embodiment of the present invention, when the material of the heat-conducting panel body (200-1, 200-2) can be selected as SUS material and the refrigerant filled therein can be selected as water, a problem may arise in which the liquid refrigerant easily freezes at temperatures below zero, which is the freezing point of water.

[0130] Freezing of the liquid refrigerant within the sealed refrigerant flow space (205) begins from the inner surface of one side heat-conducting panel (200-1) and the inner surface of the other side heat-conducting panel (200-2) that are substantially in contact with the outside air (outside air) toward the middle part of the refrigerant flow space (205), and the volume expansion rate of water during freezing reaches 10%, which weakens the bonding strength of a plurality of strength reinforcing parts (240) due to the expansion of the frozen volume, and in some cases, leads to a problem in which the product itself is damaged.

[0131] An active heat dissipation mechanism (200) according to one embodiment of the present invention may further include a refrigerant damper (250) that is arranged in the middle of the thickness direction of the refrigerant flow space (205) as shown in FIGS. 5 to 9 to prevent product damage due to freezing of the refrigerant as described above, and elastically absorbs the volume expansion of the refrigerant after freezing without increasing the distance between one side and the other side of the refrigerant flow space (205) when the volume expands due to freezing of the refrigerant.

[0132] Here, the refrigerant damper (250) can be fixed to the refrigerant flow space (205) corresponding to the middle portion of the one-side heat-conducting panel (200-1) and the other-side heat-conducting panel (200-2).

[0133] At this time, the refrigerant damper (250) may be arranged so that one side has a predetermined distance from the inner side of the one-side heat-conducting panel (200-1), as shown in FIG. 9, and the other side has a predetermined distance from the inner side of the other-side heat-conducting panel (200-2).

[0134] Through the space between one side of the refrigerant damper (250) and the inner side of the one-side heat-conducting panel (200-1) and the space between the other side of the refrigerant damper (250) and the inner side of the other-side heat-conducting panel (200-2), the gaseous refrigerant (water vapor) evaporated from the first refrigerant passage (210) corresponding to the evaporation area can become a space for diffusing and flowing within the condensation area where the refrigerant damper (250) is arranged.

[0135] Therefore, the refrigerant damper (250) may be limited to being placed in a condensation area excluding the evaporation area where the first refrigerant passage (210) is formed so as not to impede the evaporation activity of the refrigerant on the side of the first refrigerant passage (210).

[0136] Meanwhile, the refrigerant damper (250) can be fixed by a plurality of strength reinforcing members (240) provided to be mutually contacted in the refrigerant flow space (205).

[0137] More specifically, as referenced in FIG. 7, a plurality of strength reinforcing members (240) protrude from the inner surface of one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-2) toward the refrigerant flow space (205), and a flat joint surface (240P) having a predetermined diameter is formed at the tip portion, and the joint surfaces (240P) of each tip portion are provided to be joined within the refrigerant flow space (205) through a joint method such as a mutual welding method.

[0138] Here, in the refrigerant damper (250), a plurality of through holes (255) may be formed so that a plurality of strength reinforcing members (240) formed on one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-2) penetrate and are interviewed within the refrigerant flow space (205).

[0139] At this time, the plurality of through holes (255) formed in the refrigerant damper (250) may be formed to have an inner diameter (D) larger than the diameter of the joint surface (240P) of the plurality of strength reinforcing members (240), as shown in FIG. 7.

[0140] Meanwhile, in the heat conductive panel body (200-1, 200-2), as described above, a plurality of inclined guides (215) may be further formed so as to protrude toward the refrigerant flow space (205) from one side of the heat conductive panel (200-1) and the other side of the heat conductive panel (200-2) but at a depth that does not touch each other, and to induce the condensed liquid refrigerant to flow downwardly inclined with respect to the direction of gravity.

[0141] Here, one side of the refrigerant damper (250) can be fixed in close contact with the inclined guide (215) of the one-side heat-conducting panel (200-1), and the other side of the refrigerant damper (250) can be fixed in close contact with the inclined guide (215) of the other-side heat-conducting panel (200-2).

[0142] That is, when the refrigerant damper (250) is installed in the refrigerant flow space (205) between one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-2), the refrigerant damper (250) is fixed by a plurality of strength reinforcement members (240) by mutually connecting a plurality of through-holes (255) through which a plurality of strength reinforcement members (240) respectively pass, and at the same time, one side and the other side are fixed in close contact by a plurality of inclined guides (215) formed to protrude toward the refrigerant flow space (205) on the one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-2), so that the refrigerant damper (250) can be stably fixed without flowing due to an external force transmitted from the outside or a change in internal pressure due to a phase change of the refrigerant.

[0143] Here, assuming that the refrigerant damper (250) is made of an elastic material that is deformed by an external force as described later, the thickness (t) in a state where no external force is applied can be formed to be greater than the minimum separation distance between the inclined guide (215) of one side heat-conducting panel (200-1) and the inclined guide (215) of the other side heat-conducting panel (200-2).

[0144] This is to ensure that the refrigerant damper (250) is stably fixed through shape deformation due to compression by the respective inclined guides (215) of the one-sided heat-conducting panel (200-1) and the other-sided heat-conducting panel (200-2) when the refrigerant flow space (205) is formed by joining the respective edge ends of the one-sided heat-conducting panel (200-1) and the other-sided heat-conducting panel (200-2).

[0145] However, some of the multiple strength reinforcement parts (240) (the strength reinforcement parts (240) positioned at the lower portion based on the gravity direction described later) can be joined to each other at their joint surfaces (240P) by welding after being interviewed through multiple through holes (255) formed in the refrigerant damper (250) when bending and joining a single metal panel member or joining two metal panel members.

[0146] Since the welding heat at this time may affect the refrigerant damper (250), it is preferable that the inner diameter (D) of the plurality of through holes (255) formed in the refrigerant damper (250) be formed to a size that does not come into contact with the tips (including the edges of the joining surfaces (240P)) of the plurality of strength reinforcing parts (240) when one side and the other side of the refrigerant damper (250) are fixed in close contact with the inclined guides (215) formed on the one side heat-conducting panel (200-1) and the one side and the other side heat-conducting panel (200-2), respectively, as referenced in FIG. 7.

[0147] In particular, the refrigerant damper (250) can be placed at a relatively lower portion in the direction of gravity among the refrigerant flow space (205) of the heat-conducting panel body (200-1, 200-2) when the heat-conducting panel body (200-1, 200-2) is fixed to the press-fit portion (150) formed in the direction of gravity or inclined with respect to the direction of gravity on the back surface of the heat-dissipating housing body (110). This is because, as described above, the proportion occupied by the liquid refrigerant is only a portion of the total volume of the refrigerant flow space in consideration of the phase change described above, and the liquid refrigerant is stored at a lower portion in the direction of gravity.

[0148] The above-described refrigerant damper (250) may be made of an elastic material including a rubber material that can elastically absorb at least the expanded volume when the volume expands due to freezing of the refrigerant.

[0149] In this way, the active heat dissipation mechanism (200) according to one embodiment of the present invention provides the advantage of preventing damage to the product by actively absorbing the expansion volume of the refrigerant provided as distilled water (water) when it freezes by fixing and installing the refrigerant damper (250) at a lower portion based on the direction of gravity where the liquid refrigerant is mainly stored in the refrigerant flow space (205).

[0150] In addition, it provides the advantage of improving the durability of the product by allowing the refrigerant damper (250) to be stably fixed without flow (shaking) even by external forces such as changes in internal pressure within the refrigerant flow space (205) or random vibrations transmitted from the outside during the phase change process of the refrigerant.

[0151]

[0152] Above, one embodiment of an active heat dissipation mechanism according to the present invention has been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it will be understood that those skilled in the art can make various modifications and equivalent implementations within the scope of the present invention. Therefore, the true scope of the present invention is defined by the claims set forth below.

Claims

1. A heat-conducting panel body having a refrigerant flow space in which refrigerant is filled and flows inside; and An active heat dissipation mechanism, comprising: a refrigerant damper disposed in the middle of the thickness direction of the refrigerant flow space and elastically absorbing the volume expansion of the refrigerant after freezing without increasing the distance between one side and the other side of the refrigerant flow space when the volume expands due to freezing of the refrigerant.

2. In claim 1, The above refrigerant flow space is, A first refrigerant path provided in an evaporation region in which a liquid refrigerant among the above refrigerants is stored and the stored liquid refrigerant is phase-changed into a gaseous state by heat supplied from a heat-radiating housing body which is a heat-generating target; and A plurality of second refrigerant channels formed in a direction of gravity or inclined relative to the direction of gravity toward the first refrigerant channel and guiding the liquid refrigerant that has changed from a gaseous state to a liquid state among the refrigerant to flow toward the first refrigerant channel; The above refrigerant damper is an active heat dissipation mechanism arranged on the second refrigerant passage side.

3. In claim 2, The above refrigerant damper is an active heat dissipation mechanism, which is placed in a condensation area excluding the evaporation area.

4. In claim 1, The above heat-conducting panel body, A one-sided heat-conducting panel forming one side of the above refrigerant flow space; and Including a heat-conducting panel on the other side forming the other side of the refrigerant flow space; The above refrigerant damper is an active heat dissipation mechanism that is fixed to the refrigerant flow space corresponding to the middle portion between the one-side heat-conducting panel and the other-side heat-conducting panel.

5. In claim 4, The above refrigerant damper is an active heat dissipation mechanism, wherein one side is positioned so as to have a predetermined distance from the inner surface of the one-side heat-conducting panel, and the other side is positioned so as to have a predetermined distance from the inner surface of the other-side heat-conducting panel.

6. In claim 4, In the above heat-conducting panel body, a plurality of strength reinforcing parts are further formed so as to protrude from the one side heat-conducting panel and the other side heat-conducting panel toward the refrigerant flow space, The above refrigerant damper is an active heat dissipation mechanism, which is fixed by a plurality of strength reinforcing members that are mutually contacted in the above refrigerant flow space.

7. In claim 6, An active heat dissipation mechanism in which the above refrigerant damper has a plurality of penetration holes formed through which a plurality of strength reinforcing members formed on the one-side heat-conducting panel and the other-side heat-conducting panel penetrate and are exposed within the refrigerant flow space.

8. In claim 7, In the case where the above multiple strength reinforcing members have a flat joint surface of a predetermined diameter formed at each tip, An active heat dissipation mechanism, wherein a plurality of through holes formed in the above refrigerant damper have an inner diameter larger than the diameter of the joint surface of the plurality of strength reinforcing parts.

9. In claim 7, In the above heat-conducting panel body, a plurality of inclined guides are further formed, which protrude from the one side heat-conducting panel and the other side heat-conducting panel toward the refrigerant flow space but do not touch each other, and are inclined downward to induce the condensed liquid refrigerant to flow downwardly inclined with respect to the direction of gravity. An active heat dissipation mechanism, wherein one side of the refrigerant damper is fixed in close contact with the inclined guide of the one-side heat-conducting panel, and the other side of the refrigerant damper is fixed in close contact with the inclined guide of the other-side heat-conducting panel.

10. In claim 9, The above refrigerant damper is an active heat dissipation mechanism, which is formed of an elastic material that is shaped and deformed by an external force, and has a thickness when no external force is applied that is greater than the minimum separation distance between the inclined guide of the one-side heat-conducting panel and the inclined guide of the other-side heat-conducting panel.

11. In claim 9, An active heat dissipation mechanism, wherein the inner diameter of a plurality of through holes formed in the above refrigerant damper is formed to a size that does not contact the ends of the plurality of strength reinforcing parts when one side and the other side of the above refrigerant damper are fixed in close contact with the inclined guides formed on the one side and the other side of the one side heat-conducting panel and the other side heat-conducting panel, respectively.

12. In claim 7, Some of the above multiple strength reinforcing members are used when joining a single metal panel member after bending, or when joining two metal panel members. An active heat dissipation mechanism, which is welded and then interconnected through a plurality of through holes formed in the above refrigerant damper.

13. In claim 2, The above refrigerant damper is, when the heat-conducting panel body is fixed to a press-fit portion formed in a direction of gravity or inclined with respect to the direction of gravity on the back surface of the heat-dissipating housing body, An active heat dissipation mechanism, which is placed relatively lower in the direction of gravity among the above heat-conducting panel bodies.

14. In claim 1, The above refrigerant damper is an active heat dissipation mechanism made of an elastic material including a rubber material that can elastically absorb at least the expanded volume when the refrigerant expands due to freezing.

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