Thermal module comprising heat dissipation plate having middle part slit formed therethrough

Abstract

A thermal module according to the present invention comprises: a sample holder in which a sample is received: a heat dissipation plate including a base part and a heat transfer member formed under the base part; and a thermoelectric element disposed between the sample holder and the heat dissipation plate, wherein: the heat transfer member includes a solid part having a predetermined shape and a plurality of fins formed to extend from the solid part; a plurality of slits is formed between the plurality of fins, the plurality of slits having upper ends forming a boundary with the solid part and being formed to allow air to pass therethrough; some of the plurality of slits, which are formed on the middle part of the solid part, has upper ends positioned closer to the base part than others of the plurality of slits, which are formed on the side surface part of the solid part. Accordingly, the present invention can improve heat uniformity and a ramp rate of the sample holder.

Description

Thermal module including a heat sink with a slit formed in the middle

[0001] The present invention relates to a thermal module including a heat sink having a slit formed in the middle.

[0002] With increasing health concerns and increasing life expectancy, the importance of nucleic acid-based in vitro molecular diagnostics, including accurate pathogen analysis and patient genetic analysis, is growing, and demand is on the rise. Nucleic acid-based molecular diagnostics involves extracting nucleic acids from a specimen sample and then confirming the presence of target nucleic acids within the extracted nucleic acids.

[0003] Polymerase chain reaction (PCR) is the most widely used nucleic acid amplification reaction, which involves repeated cycles of denaturation of double-stranded DNA, annealing of oligonucleotide primers to a DNA template, and extension of the primers by DNA polymerase (Mullis et al., U.S. Pat. Nos. 4,683,195, 4,683,202, and 4,800,159; Saiki et al., (1985) Science 230, 1350-1354).

[0004] A typical real-time PCR (real-time polymerase chain reaction) device consists of a thermal cycler installed at the bottom where a nucleic acid amplification reaction occurs and an optics mechanism installed at the top that analyzes or monitors the nucleic acid amplification reaction in real time.

[0005] DNA denaturation occurs at approximately 95°C, while annealing and primer extension occur at temperatures lower than 95°C, typically between 55°C and 75°C. Therefore, thermal cyclers are designed to allow for repeated temperature increases and decreases in the thermal block. Typically, thermal cyclers include a heat block, also known as a sample holder or thermal block, capable of accommodating multiple reaction vessels. The heat block includes a sample well capable of accommodating the reaction vessels and is typically made of metal for rapid heat conduction.

[0006] As the temperature of the heat block rapidly changes by the thermal cycler, a nucleic acid amplification reaction of samples contained in reaction vessels is performed. As the reaction vessel, a reaction plate in the form of a plurality of tube-shaped reaction vessels connected together can be used.

[0007] At this time, the heat provided to the heat block may be generated by a thermoelectric element, and the thermoelectric element may be a Peltier element. In general, the heat generated from one side of the Peltier element is not uniform, and as the heat is discharged to the outside through the heat sink, the edge part (outer part) of the heat block tends to cool more quickly.

[0008] Since the reaction efficiency at each stage of a PCR reaction can vary depending on temperature, various developments have been made to minimize temperature variations between reaction vessels. Conventional techniques have shown that when a fan is driven to dissipate heat from a heat block through a heat sink, the cooling efficiency and thermal uniformity of the heat block vary depending on the shape of the heat sink. US 10,049,895 B2 and US 9,718,061 B2 disclose methods for energy-efficiently and quickly cooling a heat block through a heat sink.

[0009] US 10049895 B2 attempted to address the imbalance in cooling efficiency caused by air heating as it passes through the heat sink by fabricating multiple fins of a heat sink with varying lengths. However, this type of heat sink requires additional components, such as ducts, to ensure air effectively passes between the fins and prevent turbulence, resulting in poor space efficiency and ease of manufacture.

[0010] In US 9718061 B2, a heat sink is designed with multiple radiating fins arranged in a non-parallel configuration to ensure thermal uniformity in the heat block, with the fins spreading downward from the base plate of the heat sink. However, this type of heat sink is also inherently space-inefficient, and since each fin is connected to the base plate at an angle, it is vulnerable to deformation or external impact, and may have poor durability.

[0011] Therefore, there is a need to develop a new heat sink and a thermal cycler including the same that can minimize temperature deviation between reaction plates or reaction vessels by improving the thermal uniformity of the heat block and also secure space efficiency, ease of manufacturing, and durability.

[0012] Against this backdrop, one embodiment of the present invention provides a novel heat sink that minimizes temperature deviation between reaction plates or reaction vessels by improving thermal uniformity of the heat block, and also secures space efficiency, ease of manufacturing, and durability.

[0013] Additionally, one embodiment of the present invention provides a thermal module including the heat sink that improves thermal uniformity and energy efficiency.

[0014] In order to achieve the above object, one aspect of the present invention provides a thermal module including: a sample holder for accommodating a sample; a heat sink including a base portion and a heat transfer member formed downward on the base portion; and a thermoelectric element disposed between the sample holder and the heat sink, wherein the heat transfer member includes a solid portion having a predetermined shape and a plurality of fins formed extending from the solid portion, and a plurality of slits formed between the plurality of fins, the plurality of slits having upper ends forming a boundary with the solid portion and formed to allow air to pass through, and a portion of the plurality of slits formed in the middle portion of the solid portion has an upper end positioned closer to the base portion than another portion of the plurality of slits formed in a side portion of the solid portion.

[0015] Additionally, the plurality of slits may be formed so that more air passes through the middle portion than through the side portion.

[0016] Additionally, some of the plurality of fins formed in the middle portion may provide a wider air contact area than other parts of the plurality of fins formed in the side portion.

[0017] Additionally, the plurality of pins are formed parallel to each other and may be longer in length in the middle portion than in the side portion.

[0018] Additionally, the plurality of pins may be formed at regular intervals.

[0019] Additionally, the device may further include a fan that forms a flow so that the air passes between the plurality of fins through the plurality of slits.

[0020] Additionally, the rotation axis of the fan may be positioned on a line higher than the lower surface of the plurality of fins formed in the middle portion.

[0021] Additionally, the fan includes a first fan and a second fan, and the heat transfer member can be positioned between the first fan and the second fan at a predetermined distance from each other.

[0022] Additionally, when the fan is driven, the thermal uniformity of the sample holder can be improved by the heat sink.

[0023] Additionally, the base portion includes a lower portion having a first footprint and an upper portion formed upward from the lower portion and having a second footprint, and the heat transfer member has a third footprint, and the third footprint may be larger than or equal to the second footprint.

[0024] Additionally, the thermoelectric element may be placed on the upper surface.

[0025] In addition, the thermoelectric elements may be provided in multiple numbers and may be arranged on the heat sink so that their centers are aligned along the middle portion.

[0026] Additionally, the thermoelectric element may be a bar-type Peltier element.

[0027] Additionally, the heat sink may be formed of a thermally conductive material.

[0028] Additionally, the heat transfer member may have a rectangular form factor.

[0029] According to one embodiment of the present invention, the thermal uniformity of the sample holder can be improved by the shape of the new heat sink.

[0030] In addition, according to one embodiment of the present invention, energy-efficient cooling is possible because unnecessary air resistance is not generated due to the shape and arrangement of the slits formed in the heat sink.

[0031] Additionally, according to one embodiment of the present invention, the ramp rate can be improved by securing heat capacity by the top of the heat sink.

[0032] Additionally, according to one embodiment of the present invention, a thermal cycler can be manufactured compactly and space-efficiently by the rectangular form factor of the heat sink.

[0033] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0034] Fig. 1 is a perspective view showing a heat sink according to a first embodiment of the present invention.

[0035] Fig. 2 is a longitudinal cross-sectional view showing a cross-section of a heat sink according to the first embodiment of the present invention.

[0036] Figure 3 is a bottom view of a heat sink according to the first embodiment of the present invention.

[0037] Fig. 4 is a perspective view showing a heat sink according to a second embodiment of the present invention.

[0038] FIG. 5 is a perspective view showing a part of a configuration of a thermal module including a heat sink according to a first embodiment of the present invention.

[0039] FIG. 6 is a front view showing a part of a configuration of a thermal module including a heat sink according to the first embodiment of the present invention.

[0040] Fig. 7 is a cross-sectional view showing a cross-section cut along line A-A' of Fig. 6.

[0041] Hereinafter, the present invention will be described in detail through examples and illustrative drawings. These examples are intended solely to illustrate the present invention more specifically. It will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples, as they reflect the gist of the invention.

[0042] Additionally, when assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing the present invention, if a detailed description of a related known configuration or function is deemed likely to obscure the gist of the present invention, the detailed description will be omitted.

[0043] Additionally, terms such as first, second, A, B, (a), (b), (i), and (ii) may be used to describe components of the present invention. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by the terms. When a component is described as being "connected," "coupled," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but another component may be "connected," "coupled," or "connected" between each component.

[0044] The "thermal module" of the present invention is a main module for controlling the temperature of a sample holder (heat block) in a thermal cycler, and refers to a thermal module to which a heat sink according to embodiments of the present invention is applied, and can be provided in a detection device for detecting a target analyte in a sample.

[0045] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that a person having ordinary skill in the art to which the present invention pertains can easily practice the present invention.

[0046] First, a heat sink (1000) according to a first embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 is a perspective view showing a heat sink (1000) according to a first embodiment of the present invention. As illustrated in FIG. 1, the heat sink (1000) includes a base portion (1100) and a heat transfer member (1200) formed downward on the base portion (1100). The heat sink (1000) is formed of a thermally conductive material and is used to control the temperature of a sample holder, also called a heat block in a thermal module.

[0047] The base portion (1100) of the heat sink (1000) according to the first embodiment of the present invention may include a lower portion (1110) having a first footprint, and an upper portion (1120) formed upward from the lower portion (1110) and having a second footprint. Here, the first footprint is preferably larger than the second footprint.

[0048] A heat transfer member (1200) of a heat sink (1000) according to a first embodiment of the present invention may include a solid portion (1210) having a predetermined shape and a plurality of fins (1211) formed to extend from the solid portion (1210). A plurality of slits (1220) formed to allow air to pass through may be formed between the plurality of fins (1211). This heat transfer member (1200) has a third footprint, and it is preferable that the third footprint is larger than or equal to the second footprint.

[0049] Next, the detailed configuration of the heat sink (1000) according to the first embodiment of the present invention will be described in more detail with further reference to FIG. 2. FIG. 2 is a longitudinal cross-sectional view showing the cross-section of the heat sink (1000) according to the first embodiment of the present invention. As illustrated in FIG. 2, the base portion (1100) and the heat transfer member (1200) can be formed as an integral body to constitute the heat sink (1000).

[0050] The base portion (1100) may include a lower portion (1110) having a first height (h1) and an upper portion (1120) having a second height (h2). In particular, as the second height (h2) of the upper portion (1120) is sufficiently secured, the operational efficiency imbalance characteristic of the thermoelectric element mounted on the upper portion (1120) may be alleviated and the thermal uniformity may be improved. Here, the thermoelectric element may be, for example, a bar-type Peltier element.

[0051] Additionally, the volume of the upper portion (1120) can also be determined according to the second height (h2) of the upper portion (1120), and the temperature difference between the central portion and the outer portion of the heat sink (1000) can be reduced by the upper portion (1120) having sufficient volume. Due to this reduction in temperature difference, the thermal uniformity of the sample holder placed on the upper portion (1120) can be improved. In one embodiment of the present invention, the second height (h2) of the heat sink can be, for example, 7 mm to 15 mm, more preferably, 11 mm to 15 mm. In this case, the first height (h1) can be, for example, 5 mm to 10 mm, more preferably, 7 mm to 10 mm.

[0052] Additionally, the lower portion (1110) may be formed so that the heat sink (1000) can be easily mounted and coupled to the housing (not shown) of the thermal module. The housing of the thermal module according to one embodiment of the present invention may include an upper structure capable of covering the heat sink (1000) and a lower structure capable of accommodating the lower portion of the heat sink (1000).

[0053] Here, the lower part (1110) can be divided into a lower upper part (1111) that can be easily combined with the upper structure of the housing of such a thermal module, and a lower lower part (1112) that can be easily combined with the lower structure of the housing of the thermal module. At this time, the first footprint may mean the maximum footprint of the lower lower part (1112) or the lower upper part (1111). The lower lower part (1112) and the lower upper part (1111) may have different footprints, and it is preferable that the footprint of the lower upper part (1111) is smaller than the footprint of the lower lower part (1112).

[0054] The lower upper portion (1111) has a larger footprint than the upper portion (1120), so that it can be easily fixed to at least a portion of the upper structure of the housing. For example, grooves or holes may be formed in the upper portion of the lower portion (1110) and the upper structure, so that they can be fixed to each other by a fixing means such as screws. In addition, the lower lower portion (1112) has a larger footprint than the heat transfer member (1200), so that it can be easily fixed to at least a portion of the lower structure of the housing. For example, grooves or holes may also be formed in the lower portion of the lower portion (1110) and the lower structure, so that they can be fixed to each other by a fixing means such as screws.

[0055] Next, the heat transfer member (1200) is described in more detail. The heat transfer member (1200) has a third footprint, and the third footprint may be greater than or equal to the second footprint of the upper portion (1120). That is, the lower portion (1110) of the base portion (1100) in the heat sink (1000) may have the largest footprint, and on both sides of the lower portion (1110) having such a footprint, the upper portion (1120) and the heat transfer member (1200) having smaller footprints may be formed, respectively.

[0056] According to one embodiment of the present invention, the heat transfer member (1200) of the heat sink (1000) is not formed by only a plurality of fins, but includes a solid portion (1210), thereby ensuring sufficient heat capacity while maintaining the size of the heat sink (1000) compact. As is known, the heat capacity of a heat sink affects the ramp rate, and according to one embodiment of the present invention, the heat sink (1000) can secure heat capacity in a compact size, thereby improving the ramp rate.

[0057] As illustrated in FIG. 2, a plurality of fins (1211) are formed to extend from a solid portion (1210), and a plurality of slits (1220) are formed between the plurality of fins (1211). The slits (1220) are formed to allow air to pass through, and have an upper end (1221) that forms a boundary with the solid portion (1210). Some of the plurality of slits (1220) in the middle portion (M) of the solid portion (1210) have upper ends (1221) positioned closer to the base portion (1100) than other parts of the plurality of slits (1220) formed in the side portions (S1, S2) of the solid portion (1210). That is, among the slits (1220) formed in the heat sink (1000), the slits (1220) in the middle portion (M) may be formed to be deeper. Therefore, more air can pass through the middle part (M) of the heat sink (1000) than through the side parts (S1, S2).

[0058] Here, the middle part (M) refers to a section including the center of the heat sink (1000), and the side parts (S1, S2) refer to a section excluding the middle part (M). The center of the heat sink (1000) refers to the center of the left and right sides of the heat sink (1000) in a cross-sectional view such as FIG. 2. In other words, when the middle part (M) and the side parts (S1, S2) are viewed as a space occupied three-dimensionally, the heat sink (1000) can be largely divided into three sections.

[0059] More specifically, two boundary surfaces dividing the zones along the same direction as the direction in which the plurality of slits (1220) cross the heat sink (1000) may be formed, which are indicated by dotted lines in Fig. 2. For convenience of explanation, the zones are indicated by dotted lines and "M, S1, S2" in Fig. 2, but are not limited thereto. That is, in another embodiment, the middle portion (M) may be larger or smaller than the zones indicated in Fig. 2, and the side portions (S1, S2) may also have smaller or larger zones accordingly.

[0060] Some of the plurality of fins (1211) formed in the middle portion (M) may provide a wider air contact area than other parts of the plurality of fins (1211) formed in the side portions (S1, S2). The plurality of fins (1211) are preferably formed parallel to each other at regular intervals, and are preferably longer in length in the middle portion (M) than in the side portions (S1, S2).

[0061] In the first embodiment of the present invention, the lower sides of the plurality of fins (1211) are all on the same plane, but this is not limited thereto. That is, the heat transfer member (1200) preferably has a rectangular form factor as illustrated in the drawings, but is not limited thereto. For example, in another embodiment of the heat transfer member (1200), the shape of the lower side may be formed to be curved or angular.

[0062] Referring further to FIG. 3, a heat sink (1000) according to a first embodiment of the present invention will be described. FIG. 3 is a bottom view of the heat sink (1000) according to the first embodiment of the present invention. As illustrated in FIG. 3, the third footprint, which is the area occupied by the heat transfer member (1200) in the bottom view, may be smaller than the first footprint of the lower portion (1110).

[0063] Since the first footprint of the lower portion (1110) is larger than the third footprint of the heat transfer member (1200), the heat sink (1000) can be easily fixed to at least a portion of the lower structure of the housing when mounted on the thermal module. For example, at least a portion of the lower portion (1110) can be hung on the housing by having a catch function, and can be screw-connected to the housing by a protruding portion such as the lower joint portion (1112a, 1112b).

[0064] Additionally, as illustrated in FIG. 3, a plurality of fins (1211) may be formed parallel to each other at regular intervals, and a plurality of slits (1220) may likewise be formed parallel to each other at regular intervals. It is preferable that the fins (1211) be formed thinner than the intervals between the slits (1220).

[0065] The following describes a heat sink (2000) according to a second embodiment of the present invention with reference to FIG. 4. FIG. 4 is a perspective view showing a heat sink (2000) according to a second embodiment of the present invention. The heat sink (2000) according to the second embodiment of the present invention has a configuration that is mostly similar to that of the heat sink (1000) according to the first embodiment, and overlapping configurations are referred to using the same names, and a description thereof is partially omitted.

[0066] As illustrated in FIG. 4, the heat sink (2000) includes a base portion (2100) and a heat transfer member (2200) formed downwardly on the base portion (2100). The base portion (2100) of the heat sink (2000) may include a lower portion (2110) having a first footprint, and an upper portion (2120) formed upwardly from the lower portion (2110) and having a second footprint. Here, the first footprint is preferably larger than the second footprint.

[0067] Unlike the first embodiment of the present invention, in the second embodiment, a plurality of guides (2121) may be additionally formed on the upper portion (2120). The guides (2121) may be formed to protrude partially from the upper portion (2120) and are intended to facilitate the placement of thermoelectric elements. In particular, the guide (2121) illustrated in FIG. 4 is suitable for guiding the placement of thermoelectric elements, which are bar-type Peltier elements, and can prevent a plurality of thermoelectric elements from overlapping or twisting.

[0068] In the second embodiment of the present invention, a total of 20 guides (2121) may be configured so that each of the positions of the six bar-type Peltier elements can be fixed by five guides (2121) (two on one side, two on the other side, and one on the narrow side), but this is not limited thereto. Here, the guides (2121) positioned between the Peltier elements fix the Peltier elements on both sides.

[0069] In another embodiment of the present invention, a total of 17 guides may be configured so that each of the six bar-type Peltier elements can be fixed in position by four guides (two on one side, one on the other side, and one on the narrow side). Here, the guides positioned between the Peltier elements can also function to fix the Peltier elements on both sides.

[0070] A heat transfer member (2200) of a heat sink (2000) may include a solid portion (2210) having a predetermined shape and a plurality of fins (2211) formed to extend from the solid portion (2210). A plurality of slits (2220) formed to allow air to pass through may be formed between the plurality of fins (2211). This heat transfer member (2200) has a third footprint, and it is preferable that the third footprint is larger than or equal to the second footprint.

[0071] Unlike the first embodiment of the present invention, in the second embodiment, some of the plurality of fins (2211) may be formed to have different lengths, so that some of the plurality of slits (2220) may also be formed to have partially different shapes. If some of the plurality of fins (2211) are formed to have shorter lengths, the heat sink (2000) may be fixed to the housing using a pillar-shaped fixing member, and a configuration such as a separately protruding lower coupling portion (1112a, 1112b) at the lower end (2110) of the base portion (2100) may be eliminated. That is, the heat sink (1000) of the first embodiment and the heat sink (2000) of the second embodiment may be coupled to the housing of the thermal module in different ways.

[0072] However, the heat sink (1000) of the first embodiment and the heat sink (2000) of the second embodiment have in common that the slit (1220, 2220) in the middle portion (M) among the plurality of slits (1220, 2220) can be formed to be deeper. Accordingly, more air can pass through the middle portion (M) than the side portions (S1, S2) of the heat sink (1000, 2000).

[0073] The following describes a part of the configuration of a thermal module including a heat sink (1000) according to a first embodiment of the present invention with further reference to FIGS. 5 to 7. FIG. 5 is a perspective view showing a part of the configuration of a thermal module including a heat sink (1000) according to a first embodiment of the present invention. FIG. 6 is a front view showing a part of the configuration of a thermal module including a heat sink (1000) according to the first embodiment of the present invention. FIG. 7 is a cross-sectional view showing a cross-section taken along line A-A' of FIG. 6.

[0074] First, the main configuration of a thermal module according to one embodiment of the present invention will be described with reference to FIG. 5. The thermal module of the present invention includes a sample holder (10) for accommodating a sample, a heat sink (1000), and a thermoelectric element (20) disposed between the sample holder (10) and the heat sink (1000). Here, the sample holder (10) is made of a thermally conductive material, for example, metal, and is formed so that a reaction vessel can be inserted therein.

[0075] Reaction vessels are used to accommodate the samples to be analyzed, and include various types of containers, such as tubes, vials, strips in which multiple single tubes are connected, plates in which multiple tubes are connected, microcards, chips, cuvettes, or cartridges.

[0076] The thermoelectric element (20) is arranged closely to the sample holder (10) so as to be in thermal contact with at least a portion thereof. The thermoelectric element (20) is arranged on the upper portion (1120) of the heat sink (1000). At this time, the footprint of the upper portion (1120) may be set to be substantially the same as the area occupied by the thermoelectric element (20) when arranged. Accordingly, the upper portion (1120) is in thermal contact with the thermoelectric element (20), and heat conduction is achieved to the lower portion (1110) and the heat transfer member (1200).

[0077] The thermoelectric element (20) of the present invention may be a bar-type Peltier element, and a plurality of such elements may be provided. In particular, in the case of a thermal module applied to a PCR device using a 96-well plate, six bar-type Peltier elements may be provided. In this case, the centers of each bar-type Peltier element may be arranged in parallel along the middle portion (M) of the heat sink (1000).

[0078] In addition, the thermal module of the present invention may further include a fan (30) that forms a flow so that air passes between the plurality of fins (1211) through the plurality of slits (1220). When the fan (30) is driven, the temperature of the sample holder (10) can be uniformly cooled by the heat sink (1000). The thermal module of the present invention may be equipped with one or more fans (30), and as illustrated in FIGS. 5 and 6, a first fan (30a) and a second fan (30b) may be equipped.

[0079] As illustrated in Fig. 6, the heat transfer member (1200) may be positioned between the first fan (30a) and the second fan (30b) at a predetermined distance from each other. Accordingly, the wind generated by each fan (30a, 30b) may pass through the heat transfer member (1200) and cool the sample holder (10).

[0080] The following describes the arrangement relationship with respect to the rotation axis of the fan (30) and the heat sink (1000). The fan center (31) illustrated in FIG. 7 includes the rotation axis of the fan (30), and is preferably arranged on a line higher than the line B-B' indicating the lower surface of the plurality of fins (1211) formed in the middle portion (M) of the heat sink (1000). That is, the fan center (31) may be formed to span the line B-B', but the fan (30) may be arranged so that more than half of the wind generated when the fan (30) is driven passes through the heat sink (1000).

[0081] In addition, the distance between the line T-T' indicating the position formed closest to the base part (1100) among the upper ends (1221) of the slits (1220) and the line BB' indicating the lower surfaces of the plurality of fins (1211) is greater than the depth of the remaining slits (1220), thereby reducing the area blocking the wind of the fan (30) and ensuring heat capacity by the solid part (1210).

[0082] One embodiment of the present disclosure may relate to a detection device for detecting a target analyte in a sample. As used herein, a "sample" may include biological samples (e.g., cells, tissues, and fluids from biological sources) and non-biological samples (e.g., food, water, and soil). The biological samples may be viruses, bacteria, tissues, cells, blood (e.g., whole blood, plasma, and serum), lymph, bone marrow fluid, saliva, sputum, swabs, aspirations, milk, urine, feces, eye fluid, semen, brain extracts, spinal fluid, synovial fluid, thymic fluid, bronchial lavage fluid, ascites, and amniotic fluid. Additionally, the sample may include natural and synthetic nucleic acid molecules isolated from a biological source. According to one embodiment of the present invention, the sample may include additional substances such as water, deionized water, saline solution, pH buffer, acidic solution, or basic solution.

[0083] A thermal cycler according to one embodiment of the present specification may include a nucleic acid amplification device. A nucleic acid amplification device refers to a device capable of performing a nucleic acid amplification reaction to amplify a nucleic acid having a specific nucleotide sequence. Methods for amplifying the nucleic acid include polymerase chain reaction (PCR), ligase chain reaction (LCR), transcription-mediated amplification, nucleic acid sequence-based amplification (NASBA), rolling circle amplification (RCA), and Q-Beta Replicase.

[0084] A thermal cycler according to one embodiment of the present disclosure may be a device that performs a nucleic acid amplification reaction while undergoing temperature changes. For example, to amplify DNA (deoxyribonucleic acid) having a specific base sequence, the nucleic acid amplification device may perform a denaturing step, an annealing step, and an extension (or amplification) step.

[0085] The denaturation step is a step in which a solution containing a sample and reagents containing double-stranded DNA as a template nucleic acid is heated to a specific temperature, for example, about 95°C, to separate the double-stranded DNA into single-stranded DNA. The annealing step is a step in which an oligonucleotide primer having a nucleotide sequence complementary to the nucleotide sequence of the nucleic acid to be amplified is provided, and the primer is cooled to a specific temperature, for example, 60°C, together with the separated single-stranded DNA, to bind the primer to a specific nucleotide sequence of the single-stranded DNA to form a partial DNA-primer complex. The extension step is a step in which, after the annealing step, the solution is maintained at a specific temperature, for example, 72°C, to allow a DNA polymerase to form double-stranded DNA based on the primer of the partial DNA-primer complex.

[0086] By repeating the three steps described above, for example, 10 to 50 times, DNA having the specific nucleotide sequence can be exponentially amplified. In some cases, the nucleic acid amplification device can perform the annealing and extension steps simultaneously. In this case, the nucleic acid amplification device can complete the first cycle by performing two steps: a denaturation step and an annealing / extension step.

[0087] In particular, a thermal cycler according to one embodiment of the present specification may be a device that performs a nucleic acid amplification reaction and a reaction that generates an optical signal dependent on the presence of a nucleic acid while accompanying a change in temperature, and detects the generated optical signal.

[0088] A thermal cycler according to one embodiment of the present disclosure may include a thermal module, an optical module, and a main control unit. The thermal module may include a heat sink (1000), a sample holder (10), a thermoelectric element (20), and a fan (30) of the present invention as described above. The thermal module according to one embodiment may perform thermal cycling by applying heat to the sample holder (10) and cooling the sample holder (10). For example, the thermal module may perform a nucleic acid amplification reaction of a sample while performing thermal cycling.

[0089] The optical module may include a luminescence module and a detection module. In one embodiment, the luminescence module supplies an appropriate optical stimulus to a sample accommodated in a sample holder (heat block), and the detection module detects an optical signal generated from the sample in response thereto. The optical signal may be luminescence, phosphorescence, chemiluminescence, fluorescence, polarized fluorescence, or another colored signal. The optical signal may be an optical signal generated in response to an optical stimulus applied to the sample.

[0090] The above description is merely an illustrative illustration of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential quality of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate, rather than limit, the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. Sample holder in which the sample is accommodated; A heat sink including a base portion and a heat transfer member formed downward on the base portion; and A thermoelectric element disposed between the sample holder and the heat sink; The above heat transfer member includes a solid portion having a predetermined shape and a plurality of fins formed by extending from the solid portion. Between the plurality of pins, a plurality of slits are formed, each having an upper end that forms a boundary with the solid portion and configured to allow air to pass through. A thermal module, characterized in that some of the plurality of slits formed in the middle portion of the solid portion have their upper ends positioned closer to the base portion than other parts of the plurality of slits formed in the side portions of the solid portion.

2. In paragraph 1, A thermal module, characterized in that the plurality of slits are formed to allow more air to pass through the middle portion than through the side portion.

3. In paragraph 1, A thermal module, characterized in that some of the plurality of fins formed in the middle portion provide a wider air contact area than other some of the plurality of fins formed in the side portion.

4. In paragraph 3, A thermal module, characterized in that the plurality of fins are formed parallel to each other and have a longer length in the middle portion than in the side portion.

5. In paragraph 3, A thermal module, characterized in that the plurality of pins are formed at regular intervals.

6. In paragraph 3, A thermal module further comprising a fan configured to form a flow through the plurality of slits so that the air passes between the plurality of fins.

7. In paragraph 6, A thermal module, characterized in that the rotation axis of the fan is arranged on a line higher than the lower surface of the plurality of fins formed in the middle portion.

8. In paragraph 6, The above fan includes a first fan and a second fan, A thermal module, characterized in that the heat transfer member is arranged between the first fan and the second fan at a predetermined distance from each other.

9. In paragraph 6, A thermal module characterized in that when the fan is driven, the thermal uniformity of the sample holder is improved by the heat sink.

10. In paragraph 1, The above base portion includes a lower portion having a first footprint and an upper portion formed upward from the lower portion and having a second footprint. The above heat transfer member has a third footprint, A thermal module, characterized in that the third footprint is larger than or equal to the second footprint.

11. In Article 10, A thermal module, characterized in that the thermoelectric element is arranged on the upper side.

12. In paragraph 10, A thermal module characterized in that the thermoelectric elements are provided in multiple numbers and are arranged on the heat sink so that their centers are aligned along the middle portion.

13. In paragraph 12, A thermal module, characterized in that the thermoelectric element is a bar-type Peltier element.

14. In paragraph 1, A thermal module, characterized in that the above heat sink is formed of a thermally conductive material.

15. In paragraph 1, A thermal module characterized in that the heat transfer member has a rectangular form factor.

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