Heat sink

Abstract

The heat sink according to the present embodiment comprises: a base; a plurality of heat dissipation fins protruding from a first surface of the base; and a plurality of heat conductive patterns formed on a second surface of the base, wherein the plurality of heat conductive patterns is formed to be spaced apart from each other.

Description

heatsink

[0001] The present invention relates to a heat sink, and more particularly, to a heat sink with improved heat dissipation efficiency.

[0002] Components mounted on various electronic devices and other equipment generate heat when operated, and if the generated heat accumulates, it can have a negative effect on the operation of the components or peripheral devices, so various cooling methods are used.

[0003] In general, a heat sink is a component used to dissipate heat generated from various components by exchanging heat with the air, and is attached to printed circuit boards, etc.

[0004] When installing a heat sink on these devices to dissipate heat, various methods are being studied to efficiently dissipate the heat from the devices.

[0005] The technical problem to be solved by the present invention is to provide a heat sink with improved heat dissipation efficiency by improving thermal conductivity.

[0006] In order to solve the above technical problem, a heat sink according to the present embodiment includes a base; a plurality of heat dissipation fins protruding from a first surface of the base; and a plurality of heat-conducting patterns formed on a second surface of the base, wherein the plurality of heat-conducting patterns are spaced apart from each other.

[0007] In addition, a groove corresponding to the shape of the plurality of heat-conducting patterns may be formed on the second surface of the base, and the plurality of heat-conducting patterns may be arranged in the groove.

[0008] Additionally, a gap formed between two adjacent heat-conducting patterns among the plurality of heat-conducting patterns may be included, spaced apart by a predetermined distance.

[0009] In addition, the plurality of heat dissipation fins may include a plurality of plates spaced apart from each other in a first direction, and the plurality of heat conduction patterns may be formed to cross the plurality of plates in the first direction.

[0010] In addition, each of the plurality of heat-conducting patterns corresponds to at least one heat-generating element, and the heat-generating element can be arranged in the direction of the second surface of the base.

[0011] In addition, the plurality of thermal conductive patterns may include a first thermal conductive pattern and a second thermal conductive pattern, and the first thermal conductive pattern may correspond to one of the heat generating elements, and the second thermal conductive pattern may correspond to a plurality of the heat generating elements.

[0012] In addition, a first heat generating element corresponds to the first heat conducting pattern, a second heat generating element and a third heat generating element correspond to the second heat conducting pattern, and the heat generating amount of the third heat generating element may be lower than the heat generating amounts of the first heat generating element and the second heat generating element.

[0013] Additionally, at least two of the plurality of heat-conducting patterns may have different thicknesses depending on the heat generation amount of the corresponding heat-conducting element.

[0014] Additionally, at least two of the plurality of heat-conducting patterns may have different areas depending on the heat generation amount of the corresponding heat-conducting element.

[0015] Additionally, the thermal conductivity of the plurality of thermal conductive patterns may be higher than the thermal conductivity of the base.

[0016] Additionally, it may include a first bonding layer disposed between the second surface of the base and the plurality of heat-conducting patterns.

[0017] Additionally, it may include a second bonding layer disposed between the plurality of heat-conducting patterns and the heating element.

[0018] According to an embodiment of the present invention, heat dissipation can be efficiently achieved through spaced-apart heat conduction patterns corresponding to the heat of a plurality of heat generating elements. In addition, since the first adhesive layer and the heat conducting pattern are formed by being embedded within the groove, the heat dissipation efficiency of the heat generating elements can be improved without increasing the thickness of the entire heat sink, and since the heat conducting pattern is formed to cross the air layer and the heat dissipation fins, the heat dissipation efficiency can be increased. Furthermore, since the heat conducting pattern can be formed to have different thicknesses and widths depending on the heat generation amount of the heat generating elements, the heat dissipation efficiency of the heat sink can be increased.

[0019] FIG. 1 is a side view of a heat sink according to one embodiment of the present invention.

[0020] FIG. 2 is a side view of a substrate on which a heat sink is arranged according to an embodiment of the present invention.

[0021] FIG. 3 is a cross-sectional view taken along line AA' of a heat sink according to the embodiment of FIG. 2.

[0022] Figures 4 and 5 are schematic drawings showing the heat released from a heating element according to an embodiment of the present invention.

[0023] FIGS. 6 to 10 are cross-sectional views taken along line AA' of a heat sink having a thermal conductive pattern formed to correspond to a plurality of heat generating elements according to an embodiment of the present invention.

[0024] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0025] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0026] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0027] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0028] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0029] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0030] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0031] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0032] Hereinafter, the configuration of a heat sink according to an embodiment of the present invention will be described with reference to the drawings.

[0033] Fig. 1 is a side view of a heat sink according to an embodiment of the present invention. Fig. 2 is a side view of a substrate on which a heat sink according to an embodiment of the present invention is arranged. Fig. 3 is a cross-sectional view taken along line AA' of the heat sink according to the embodiment of Fig. 2. Figs. 4 and 5 are schematic drawings showing how heat is released from a heat generating element according to an embodiment of the present invention.

[0034] As illustrated in FIGS. 1 to 3, a heat sink (100) according to an embodiment of the present invention is composed of a base (110), a heat dissipation fin (120), and a heat conduction pattern (300), and may include a first adhesive layer (200) and a second adhesive layer (400).

[0035] The heat sink (100) receives heat from a heat generating element (500) formed on a printed circuit board (700) and releases the heat to the outside. The heat sink (100) may be in direct contact with the heat generating element (500) or may receive heat indirectly through a heat dissipation member or the like. The heat sink (100) may be coupled to the printed circuit board (700) by a spacer (600). The printed circuit board (700) and the heat sink (100) may be fixed by the spacer (600) to maintain a gap therebetween. A coupling hole may be formed inside the spacer (600) to allow the printed circuit board (700) and the heat sink (100) to be screw-coupled, and various other coupling methods may also be used.

[0036] The heat sink (100) may be formed in a structure in which heat dissipation fins (120) extend and protrude from the base (110). A plurality of heat dissipation fins (120) may be formed on the first surface (111) of the base (110). The heat dissipation fins (120) dissipate heat transferred from the base (110) to the outside, and may be formed to protrude from the first surface (111) of the base (110).

[0037] The heat dissipation fin (120) can be formed on the opposite side of the second surface (112) where the base (110) and the heat generating element (500) come into contact, and can quickly release heat transferred from the heat generating element (500) into the air.

[0038] The heat dissipation fin (120) may be formed with a structure having a large contact area with the air in order to quickly release heat to the outside. In an embodiment of the present invention, the heat dissipation fin (120) may be formed so that a plurality of plate shapes are arranged in a first direction at regular intervals, perpendicular to the base (120).

[0039] An air layer (115) can be formed between the plurality of plate shapes to maximize contact with air.

[0040] As shown in Fig. 2, when viewed in plan view, the heat dissipation fin (120) may be formed in such a way that the air layer (115) and the heat dissipation fin (120) are formed in a parallel and cross-sectional manner in the x-direction. In the y-direction perpendicular to the x-direction, the heat dissipation fin (120) may be formed to be long in the longitudinal direction. Here, the first direction may be the x-direction.

[0041] The heat dissipation fin (120) can be formed integrally with the base (110) and can be formed by a die casting method. Since it is formed by a die casting method, it can be formed in a shape other than a plurality of plates.

[0042] The base (110) and the heat dissipation fin (120) may be composed of a material with high thermal conductivity. For example, they may be formed of aluminum (Al), an aluminum alloy, etc., and may be manufactured through a die casting process, etc.

[0043] A groove (130) may be formed on the second surface (112), which is the opposite surface of the first surface (111) of the base (110).

[0044] A groove (130) formed on a second surface (112) of a base (110) is formed to correspond to a heat-conducting pattern (300), and a heat-conducting pattern (300) can be arranged inside. The groove (130) can be formed by etching the first surface (111) of the base (110) to correspond to the shape of the heat-conducting pattern (300). A first adhesive layer (200) can be formed between the heat-conducting pattern (300) and the groove (130).

[0045] The first adhesive layer (200) and the thermal conductive pattern (300) can be embedded inside the groove (130).

[0046] The first adhesive layer (200) may be formed of a thermal interface material (TIM). That is, the first adhesive layer (200) may be formed of a material that eliminates the air layer between the thermal conductive pattern (300) and the base (110) and facilitates interfacial adhesion and thermal conductivity. The first adhesive layer (200) may be formed of a polymer material such as silicone, epoxy, polyimide, or a material to which a thermal filler is added.

[0047] However, the first adhesive layer (200) is not limited thereto, and may be formed of thermal grease, thermal gap filler, thermal paint, thermal pad, thermal sheet, tape, film, or metal-based thermal interface material (TIM).

[0048] The surface of the thermal conductive pattern (300) disposed in the groove (130) of the second surface (112) and exposed in the direction in which the second surface faces may have the same height as the surface of the second surface (112) of the base (110). However, the present invention is not limited thereto, and depending on the thickness of the thermal conductive pattern (300), the second surface (112) of the base (110) and the surface of the thermal conductive pattern (300) may have the same or different heights.

[0049] When the thermal conductive pattern (300) is embedded in the groove (130) inward from the surface of the second surface (112), a step may be created between the second surface (112) of the base (110) and the surface of the thermal conductive pattern (300).

[0050] Additionally, if the thickness of the first adhesive layer (200) and the thermal conductive pattern (300) is thicker than the thickness of the groove (130), a step may be created so that the thermal conductive pattern (300) protrudes outward from the surface of the second surface (112).

[0051] Since the first adhesive layer (200) and the thermal conductive pattern (300) are embedded and formed inside the home (130), the heat dissipation efficiency of the heat generating element can be improved without increasing the thickness of the entire heat sink (100).

[0052] The heat conduction pattern (300) is formed in the shape of a pattern on the second surface (112) of the base (110) facing the heat generating element (500) and can receive heat generated from the heat generating element (500).

[0053] The thermal conductive pattern (300) can be formed of a material having a higher thermal conductivity than the material of the base (110) so as to quickly transfer heat generated from the heat generating element (500).

[0054] The base (110) is formed of an aluminum alloy having high thermal conductivity, and the thermal conductive pattern (300) can be formed of aluminum (Al), copper (Cu), aluminum / copper alloy (Aluminum / Copper Alloy), or ceramic material having higher thermal conductivity than the base (110). The thermal conductive pattern (300) can be patterned with a material having high thermal conductivity and bonded to the second surface (112) of the base (110) through thermal contact.

[0055] The thermal conductive pattern (300) may be formed to correspond to the heat generating element (500) formed on the printed circuit board (700). Here, the thermal conductive pattern (300) may correspond to the position of the heat generating element (500) formed on the printed circuit board (700) and may overlap with the heat generating element (500) in the direction of the second surface of the base (110).

[0056] A plurality of heat generating elements (500) can be arranged on a printed circuit board (700), and a heat conducting pattern (300) corresponding to at least one heat generating element can be formed.

[0057] A first element (510) and a second element (520) may be arranged on a printed circuit board (700), and as illustrated in FIG. 2, a first thermal conductive pattern (310) and a second thermal conductive pattern (320) may be formed in the areas where the first element (510) and the second element (520) are arranged, respectively.

[0058] The thickness of the thermal conductive pattern (300) may vary depending on the heat generation amount of the heat generating element (500) formed on the corresponding printed circuit board (700). The first thermal conductive pattern (310) and the second thermal conductive pattern (320) may be formed to have the same thickness or different thicknesses depending on the heat generation amounts of the first element (510) and the second element (520). If the first element (510) generates more heat than the second element (520), the first thermal conductive pattern (310) corresponding to the first element (510) may be formed to be thicker than the second thermal conductive pattern (320).

[0059] Alternatively, the thickness of the corresponding thermal conductive pattern (300) may vary depending on the heights of the first element (510) and the second element (520). For example, if the height of the first element (510) is lower than that of the second element (520), the gap between them and the second surface (112) of the base (110) may be different, and if the thicknesses of the corresponding thermal conductive patterns (300) are the same, there may be a problem in that the first element (510) does not contact the thermal conductive pattern (300) but is spaced apart. In this case, the thickness of the first thermal conductive pattern (300) corresponding to the first element (510) may be formed thicker than the thickness of the second thermal conductive pattern (300) corresponding to the second element (520), so that both the first element (510) and the second element (520) may contact the corresponding thermal conductive pattern (300).

[0060] The area of ​​the thermal conductive pattern (300) may vary depending on the heat generation amount of the first element (510) and the second element (520) formed on the printed circuit board (700). The first thermal conductive pattern (310) and the second thermal conductive pattern (320) may be formed to have the same area or different areas depending on the heat generation amount of the first element (510) and the second element (520). If the first element (510) generates more heat than the second element (520), the area of ​​the first thermal conductive pattern (310) corresponding to the first element (510) may be formed to be larger than the area of ​​the second thermal conductive pattern (320).

[0061] Since the heat conduction pattern (300) can be formed to have different thicknesses and widths depending on the heat generation amount of the heat generating element, the heat dissipation efficiency of the heat sink can be increased.

[0062] A gap (G) spaced apart by a predetermined distance may be formed between two adjacent heat-conducting patterns among a plurality of heat-conducting patterns (300). In order to prevent heat transferred to one heat-conducting pattern from being transferred to another heat-conducting pattern and causing heat to be concentrated, a gap (G) spaced apart by a predetermined distance may be formed between two adjacent heat-conducting patterns. The distance of the gap (G) may be set according to the heat generation amount of the heat-generating element, or may be set to minimize interference between them through simulation or the like, or may be set by the user.

[0063] A gap (G) can be formed along the opposing surfaces between two adjacent heat-conducting patterns. That is, the two adjacent heat-conducting patterns are formed so that the opposing surfaces correspond to each other, but are spaced apart by a predetermined interval, so that the heat-conducting pattern (300) can be formed with the maximum area on the second surface (112) of the base (110). The heat-conducting pattern (300) is formed in a form in which a single plate shape is cut into a plurality of heat-conducting patterns through the gap (G), and is formed with the minimum interval required through the gap (G), so that the heat-conducting pattern (300) can be formed by maximally utilizing the second surface (112) of the base (110). Through this, the loss of the plate forming the heat-conducting pattern (300) can also be minimized. As shown in Fig. 2, a gap (G) may be formed between the first heat-conducting pattern (310) and the second heat-conducting pattern (320) to minimize interaction between heat sources.

[0064] The heat conduction pattern (300) can be formed long in the first direction so as to cross the air layer (115) of the heat dissipation fin (120).

[0065] The heat dissipation fins (120) are formed in parallel in a plurality of plate shapes perpendicular to the base (120). When viewed in plan, the air layer (115) and the plurality of plate-shaped heat dissipation fins (120) are formed in an x-direction while intersecting each other, and the heat conduction pattern (300) can also be formed in the x-direction. That is, the heat conduction pattern (300) is formed to cross the air layer (115) and the heat dissipation fins (120), thereby increasing heat dissipation efficiency. The heat conduction pattern (300) overlaps with the plurality of heat dissipation fins (120), thereby allowing heat to be dissipated through the plurality of heat dissipation fins (120). Since the heat conduction pattern (300) is formed in the longitudinal direction of the heat dissipation fin (120) and overlaps with a small number of heat dissipation fins (120), heat may be concentrated on a specific heat dissipation fin, which may reduce heat dissipation efficiency. Therefore, the heat conduction pattern (300) is formed to cross the air layer (115) and the heat dissipation fin (120), thereby increasing heat dissipation efficiency.

[0066] The first thermal conductive pattern (310) corresponding to the first element (510) may be formed long in the first direction so as to cross the air layer (115) and the heat dissipation fin (120). The second thermal conductive pattern (320) corresponding to the second element (520) may also be formed long so as to cross the air layer (115) and the heat dissipation fin (120).

[0067] A gap (G) is formed between the first heat-conducting pattern (310) and the second heat-conducting pattern (320), and the gap (G) can also be formed long in the x direction so as to cross the air layer (115) and the heat-dissipating fin (120).

[0068] The first heat-conducting pattern (310) and the second heat-conducting pattern (320) are each formed to be long in the x direction, and may be formed to be longer in the x direction than in the y direction.

[0069] A second adhesive layer (400) may be formed between the thermal conductive pattern (300) and the heat generating element (500). The second adhesive layer (400) may be formed of a thermal interface material (TIM). That is, the second adhesive layer (400) may be formed of a material that eliminates an air layer between the thermal conductive pattern (300) and the heat generating element (500) and facilitates interfacial adhesion and thermal conductivity. The second adhesive layer (400) may be formed of a polymer material such as silicone, epoxy, polyimide, or a material obtained by adding a thermal filler to such a material.

[0070] However, the second adhesive layer (400) is not limited thereto, and may be formed of thermal grease, thermal gap filler, thermal paint, thermal pad, thermal sheet, tape, film, or metal-based thermal interface material (TIM).

[0071] Figures 4 and 5 are schematic diagrams showing how heat from a heat generating element is dissipated. As shown in Figures 4 and 5, a heat conducting pattern (300) corresponding to a heat generating element (500) is formed on a heat sink (100), thereby improving heat transfer efficiency without any areas where heat transfer is insufficient.

[0072] FIGS. 6 to 10 are cross-sectional views taken along line AA' of a heat sink in which a heat conduction pattern (300) is formed to correspond to a heat generating element (500) when two or more heat generating elements are included according to an embodiment of the present invention.

[0073] Fig. 6 shows a thermal conduction pattern (300) of a heat sink having two heat generating elements (500) formed therein, corresponding to that illustrated in Fig. 3. As illustrated in Fig. 6, the shape of the thermal conduction pattern (300) may vary depending on the size or position of the heat generating elements (500).

[0074] Figures 7 to 10 show a heat conduction pattern (300) of a heat sink in which two or more heat generating elements (500) are formed.

[0075] As shown in FIGS. 6 to 10, the thermal conduction pattern (300) can be formed differently depending on the size and position of the heat generating element (500).

[0076] To minimize interaction between heat sources, a gap (G) is formed between each heat-conducting pattern (300). The gap (G) may be formed long in the x-direction so as to cross the air layer (115) and the heat dissipation fin (120).

[0077] Additionally, each heat conduction pattern (300) is formed to be long in the x direction so as to cross the air layer (115) and the heat dissipation fin (120), and may be formed to be longer in the x direction than in the y direction.

[0078] The thermal conductive pattern (300) for each heat generating element (500) may be formed with the same area. However, the present invention is not limited thereto, and the area of ​​each heat conducting pattern (300) may be different depending on the heat generating amount of each heat generating element (500). In addition, although not shown in the drawing, the thickness of each heat conducting pattern (300) may also be formed differently depending on the heat generating amount of each heat generating element (500).

[0079] Depending on the arrangement and heat generation amount of the heat generating element (500), each heat conducting pattern (300) may have a different shape. That is, as illustrated in Fig. 9, it may be formed in various shapes other than a square.

[0080] When the heat generating elements (500) are arranged adjacently, a single heat conducting pattern can be formed to correspond to multiple heat generating elements, as illustrated in FIG. 9.

[0081] FIG. 9 is an example in which a third element (530) and a fourth element (540) are arranged adjacently on a printed circuit board, and a fifth element (550) is arranged at a distance from the third element (530). In this case, since the third element (530) and the fourth element (540) are adjacent, a third thermal conductive pattern (330) can be formed to correspond to the third element (530) and the fourth element (540). In addition, a fourth thermal conductive pattern (340) can be formed to correspond to the fifth element (550).

[0082] Since the third element (530) and the fourth element (540) are adjacent, in cases where it is difficult to form the thermal conduction pattern (300) separately, the third element (530) and the fourth element (540) can be grouped to form the thermal conduction pattern (300).

[0083] Additionally, depending on the heat generation amount of the heat generating element (500), the heat generating elements (500) can be grouped to form a heat conduction pattern (300).

[0084] When the total heat generation of the third element (530) and the fourth element (540) is similar to the heat generation of the fifth element (550), the third element (530) and the fourth element (540) can be grouped to form a thermal conductive pattern (300). Alternatively, in the third element (530), the fourth element (540), and the fifth element (550), the third element (530) and the fifth element (550) having high heat generation can each form a thermal conductive pattern (300), while the fourth element (540) having low heat generation can be grouped with the third element (530) to form the same thermal conductive pattern (300). In this case, the heat generation of the third element (530) can be lower than the heat generation of the fifth element (550). That is, at least one or more heat generating elements (500) can be grouped according to the characteristics of the heat generating elements, such as heat generation amount, location, and height, and formed to correspond to one heat conduction pattern (500).

[0085] In Fig. 10, only three heat generating elements (500) are shown, but in a complex circuit where many heat generating elements (500) are arranged, the heat generating elements (500) can be grouped according to the amount of heat generated to form a heat conduction pattern (300).

[0086] As described above, according to an embodiment of the present invention, heat dissipation can be efficiently achieved through spaced-apart heat conduction patterns corresponding to the heat of a plurality of heat generating elements. In addition, since the first adhesive layer and the heat conducting pattern are formed by being embedded within the groove, the heat dissipation efficiency of the heat generating elements can be improved without increasing the thickness of the entire heat sink, and since the heat conducting pattern is formed to cross the air layer and the heat dissipation fins, the heat dissipation efficiency can be increased. Furthermore, since the heat conducting pattern can be formed to have different thicknesses and widths depending on the heat generation amount of the heat generating elements, the heat dissipation efficiency of the heat sink can be increased.

[0087] Although the embodiments of the present invention have been described with reference to the attached drawings, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential features thereof. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.

Claims

1. Base; A plurality of heat dissipation fins protruding from the first surface of the base; and Including a plurality of heat-conducting patterns formed on the second surface of the above base, The above multiple heat conduction patterns are spaced apart from each other in the heat sink.

2. In paragraph 1, A groove corresponding to the shape of the plurality of heat-conducting patterns is formed on the second surface of the base, The above plurality of heat-conducting patterns are heat sinks arranged in the grooves.

3. In paragraph 1, A heat sink including a gap formed between two adjacent heat-conducting patterns among the plurality of heat-conducting patterns and spaced apart by a predetermined distance.

4. In paragraph 1, The above plurality of heat dissipation fins are, Contains a plurality of plates spaced apart in a first direction, A heat sink in which the plurality of heat-conducting patterns are formed to cross the plurality of plates in the first direction.

5. In paragraph 1, The above plurality of heat conduction patterns correspond to at least one heating element for each pattern, The above heat generating element is a heat sink arranged in the direction of the second surface of the base.

6. In paragraph 5, The above plurality of heat-conducting patterns include a first heat-conducting pattern and a second heat-conducting pattern, The above first heat conduction pattern corresponds to one of the above heat generating elements, The above second heat conduction pattern is a heat sink corresponding to a plurality of the above heat generating elements.

7. In paragraph 6, The first heat generating element corresponds to the first heat conducting pattern, The second heating element and the third heating element correspond to the second heat conduction pattern, A heat sink in which the heat generation amount of the third heat generation element is lower than that of the first heat generation element and the second heat generation element.

8. In paragraph 1, A heat sink in which at least two of the plurality of heat-conducting patterns have different thicknesses depending on the heat generation amount of the corresponding heat-generating element.

9. In paragraph 1, A heat sink in which at least two of the plurality of heat-conducting patterns have different areas depending on the heat generation amount of the corresponding heat-generating element.

10. In paragraph 1, A heat sink wherein the thermal conductivity of the above plurality of thermal conductive patterns is higher than the thermal conductivity of the base.

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