Coupling platform, coupling method, and related apparatus

Abstract

The present application relates to the field of optoelectronics. Disclosed are a coupling platform, a coupling method, and a related apparatus. The coupling platform is used for coupling a first optoelectronic chip and a first optical element, the first optoelectronic chip being placed under an illumination condition. The coupling platform comprises: an imaging unit, a control unit and an adjustment unit, wherein the first optical element is arranged between the first optoelectronic chip and the imaging unit. By means of the coupling platform, the coupling between a first optoelectronic chip and a first optical element can be completed only by means of a control unit controlling an adjustment unit on the basis of a first image, and then making the adjustment unit execute a corresponding control instruction so as to adjust relative poses of the first optoelectronic chip and first optical element. There is no need to perform complex power-on and power-off processes, simple operations and low time consumption are achieved, and automatic assembly of optical products can also be realized, thereby reducing the cycle time of an optical product assembly process, and improving the assembly efficiency and the units per hour of optical products.

Description

Coupling platform, coupling method and related devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on January 19, 2024, with application number 202410083390.7 and application name “Coupling platform, coupling method and related devices”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optoelectronics, and in particular to a coupling platform, a coupling method, and related devices. Background Art

[0003] Optical products often face high assembly difficulty due to small assembly tolerances (e.g., less than 5 microns). Passive assembly methods cannot guarantee assembly accuracy. Therefore, active assembly methods are often used to ensure assembly accuracy in optical products. For example, active alignment (AA), commonly used in lens modules, involves loading, powering on (e.g., illuminating the TX / RX board), calibration, and unloading. The power-on process is complex, time-consuming, and difficult to automate. Summary of the Invention

[0004] This application provides a coupling platform, coupling method, and related devices, all related to the field of optoelectronics. The coupling platform uses active illumination to achieve clear imaging of optical components on an imaging unit. The coupling platform provided in this application is simple to operate, time-efficient, and easily automates the coupling process.

[0005] In a first aspect, the present application provides a coupling platform for coupling a first optoelectronic chip and a first optical element, wherein the first optoelectronic chip is placed under illumination conditions. The coupling platform includes an imaging unit, a control unit, and an adjustment unit, wherein the first optical element is disposed between the first optoelectronic chip and the imaging unit. The imaging unit is configured to receive a light beam passing through the first optical element and generate a first image, the first image including an image of a light spot on the first optoelectronic chip. The control unit is configured to control the adjustment unit based on the first image. The adjustment unit is configured to adjust the relative position of the first optoelectronic chip and the first optical element.

[0006] The present application provides a coupling platform, which includes an imaging unit, a control unit and an adjustment unit. The coupling platform is used to couple a first optoelectronic chip and a first optical element, and the first optical element is arranged between the first optoelectronic chip and the imaging unit. Among them, the first optoelectronic chip (also called a photosensitive chip) is, for example, a light emitter or a light receiver, which will display a preset pattern when it is placed under lighting conditions. The present application does not limit the number of lenses contained in the optical element. For example, the first optical element includes one or more lenses. The present application also does not limit the type of optical element. For example, the first optical element is an emitting optical system or a receiving optical system.

[0007] The above-mentioned first optical element is arranged between the first optoelectronic chip and the imaging unit. It can be understood that the light beam reflected by the first optoelectronic chip can pass through the first optical element to reach the imaging unit, so the first image generated by the imaging unit includes the image of the light spot on the first optoelectronic chip.

[0008] The control unit controls the adjustment unit based on the first image, so as to allow the adjustment unit to adjust the relative position of the first optoelectronic chip and the first optical element. Alternatively, the control unit controls the adjustment unit based on the clarity of the first image. Specifically, the control unit can obtain the through-focus curve of the first optical element through the first image, thereby obtaining the optimal focal length of the first optical element, and control the adjustment unit based on the optimal focal length of the first optical element. The adjustment unit adjusts the relative position of the first optoelectronic chip and the first optical element so that the first optoelectronic chip is located in the focal plane of the first optical element, thereby completing the coupling of the first optoelectronic chip and the first optical element.

[0009] The coupling platform simply requires the control unit to control the adjustment unit based on the first image, and then have the adjustment unit execute corresponding control instructions to adjust the relative position of the first optoelectronic chip and the first optical element to complete the coupling between the first optoelectronic chip and the first optical element. This eliminates the need for complex power-up and power-down procedures, making the operation simple and time-saving. It also enables automated assembly of optical products, reducing the process cycle time (CT) and improving assembly efficiency and the units per hour (UPH) of optical products.

[0010] In one possible embodiment, the adjustment unit controls the relative position of the first optoelectronic chip and the first optical element, so that the imaging unit obtains multiple first images, the control unit obtains the defocus curve of the first optical element based on the multiple first images, and then the control unit controls the adjustment unit based on the defocus curve, so that the adjustment unit adjusts the relative position of the first optoelectronic chip and the first optical element.

[0011] In the above embodiment, the relative position of the first optoelectronic chip and the first optical element is adjusted based on the defocus curve so that the first optoelectronic chip is coupled to the first optical element, which has the advantages of simple control logic and high precision.

[0012] In a possible implementation, the coupling platform further includes an illumination unit, and the illumination unit is configured to provide an illumination beam for the first optoelectronic chip.

[0013] In the above embodiment, the coupling platform also includes an illumination unit for providing an illumination beam for the first optoelectronic chip, so that the imaging unit can clearly observe the illuminated pattern on the first optoelectronic chip, which facilitates accurate control by the control unit and helps save time in coupling the first optoelectronic chip and the first optical element.

[0014] In a possible implementation, the light beam provided by the lighting unit may pass through the first optical element to illuminate the first optoelectronic chip, and the light beam reflected by the first optoelectronic chip may then pass through the first optical element to be received by the imaging unit and imaged.

[0015] In the above embodiment, the light beam provided by the lighting unit can pass through the first optical element to illuminate the first optoelectronic chip, making the design of the lighting unit relatively simple, easy to implement and low in cost. For example, the lighting unit is a combination of a floodlight, optical fiber and frosted glass.

[0016] In another possible embodiment, the light beam provided by the lighting unit can directly illuminate the first optoelectronic chip (or, the light beam provided by the lighting unit can directly illuminate the first optoelectronic chip without passing through the first optical element), and the light beam reflected by the first optoelectronic chip passes through the first optical element and is received by the imaging unit to perform imaging.

[0017] In the above embodiment, the light beam provided by the illumination unit directly illuminates the first optoelectronic chip without passing through the first optical element. This ensures that the light beam provided by the illumination unit is not interfered with by the first optical element, providing the first optoelectronic chip with a balanced light beam of appropriate brightness. This allows the imaging unit to clearly observe the illuminated pattern on the first optoelectronic chip, facilitates accurate control by the control unit, and reduces the time required to couple the first optoelectronic chip to the first optical element.

[0018] In a possible implementation, the adjusting unit is used to adjust the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

[0019] In the above embodiment, the adjustment unit is used to adjust the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element. For example, using a three-dimensional coordinate system (x, y, z) as an example, adjusting the spatial position may include adjusting one or more of the following: the x-axis, the y-axis, the z-axis, and the rotation angle about each axis.

[0020] In one possible embodiment, the coupling platform is configured to couple a second optoelectronic chip to a second optical element, wherein the second optoelectronic chip is placed under illumination, and the second optical element is positioned between the second optoelectronic chip and an imaging unit. The imaging unit is further configured to receive a light beam passing through the second optical element and generate a second image, the second image comprising an image of the light spot on the second optoelectronic chip. The control unit is further configured to control the adjustment unit based on the first and second images. The adjustment unit is further configured to adjust the relative position of the second optoelectronic chip and the second optical element.

[0021] In the above embodiment, the coupling platform is also used to couple the second optoelectronic chip and the second optical element. The second optoelectronic chip is placed under lighting conditions, and the second optical element is arranged between the second optoelectronic chip and the above imaging unit. For the introduction of the second optoelectronic chip and the second optical element, reference can be made to the introduction of the first optoelectronic chip and the first optical element, which will not be repeated here. It should be noted that the first optoelectronic chip is different from the second optoelectronic chip, and the first optical element is also different from the second optical element. Alternatively, the first optoelectronic chip and the first optical element belong to the first lens module, the second optoelectronic chip and the second optical element belong to the second lens module, and the first lens module is different from the second lens module. Therefore, the above coupling platform can couple two sets of lens modules at the same time, thereby improving the assembly efficiency and the hourly output of optical products.

[0022] The imaging unit generates a first image and a second image by receiving the light beam passing through the first optical element and the light beam passing through the second optical element, respectively. The first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip. The control unit controls the adjustment unit based on the first and second images, causing the adjustment unit to adjust the relative position of the second optoelectronic chip and the second optical element.

[0023] The adjustment process of the adjustment unit can be that the control unit controls the adjustment unit based on the clarity of the light spot image on the second optoelectronic chip. Specifically, the control unit can obtain the through-focus curve of the second optical element from the second image, thereby obtaining the optimal focal length of the second optical element, and control the adjustment unit based on the optimal focal length of the second optical element. The adjustment unit adjusts the relative position of the second optoelectronic chip and the second optical element so that the second optoelectronic chip is located in the focal plane of the second optical element, thereby achieving coupling between the second optoelectronic chip and the second optical element.

[0024] The adjustment process of the adjustment unit may also be such that the control unit obtains the relative position of the image of the light spot on the first optoelectronic chip and the image of the light spot on the second optoelectronic chip using the first image and the second image, and controls the adjustment unit based on the relative position. The adjustment unit adjusts the relative position of the second optoelectronic chip and the second optical element so that the image of the light spot on the first optoelectronic chip overlaps with the image of the light spot on the second optoelectronic chip, thereby completing the coupling of the first lens module and the second lens module.

[0025] Optionally, the above-mentioned coupling process of the first lens module and the second lens module can also be achieved by the adjustment unit adjusting the relative position of the first optoelectronic chip and the first optical element, or it can be achieved by the adjustment unit simultaneously adjusting the relative position of the first optoelectronic chip and the first optical element, and the relative position of the second optoelectronic chip and the second optical element.

[0026] The above-mentioned coupling platform only needs to control the adjustment unit based on the first image and the second image, and then let the adjustment unit execute the corresponding control instructions to adjust the relative position of the second optoelectronic chip and the second optical element, so as to complete the coupling of the second optoelectronic chip and the second optical element and the coupling of the first lens module (including the first optical element and the first optoelectronic chip) and the second lens module (including the second optical element and the second optoelectronic chip). On the one hand, the above-mentioned coupling platform can simultaneously couple the first optoelectronic chip with the first optical element and the second optoelectronic chip with the second optical element, which can improve the assembly efficiency and the hourly output of optical products. On the other hand, the above-mentioned coupling platform, on the basis of realizing the coupling between the optical element and the optoelectronic chip, can also realize the automatic coupling of the first lens module and the second lens module, which also helps to reduce the process time of the optical product assembly process, improve the assembly efficiency and the hourly output of optical products.

[0027] In one possible embodiment, the adjustment unit controls the relative position of the second optoelectronic chip and the second optical element, so that the imaging unit obtains multiple second images, and the control unit obtains the defocus curve of the second optical element based on the multiple second images. Then, the control unit controls the adjustment unit based on the defocus curve, so that the adjustment unit adjusts the relative position of the second optoelectronic chip and the second optical element.

[0028] In the above embodiment, the relative position of the second optoelectronic chip and the second optical element is adjusted based on the defocus curve so that the second optoelectronic chip is coupled with the second optical element, which has the advantages of simple control logic and high precision.

[0029] In a possible implementation, the coupling platform further includes an illumination unit, and the illumination unit is configured to provide an illumination beam for the second optical element.

[0030] In the above embodiment, the above-mentioned lighting unit is also used to provide an illumination beam for the second optoelectronic chip, so that the imaging unit can clearly observe the illuminated pattern on the second optoelectronic chip, which facilitates the control unit to perform accurate control and helps save time in coupling the second optoelectronic chip and the second optical element.

[0031] In a possible implementation, the light beam provided by the lighting unit may pass through the second optical element to illuminate the second optoelectronic chip, and the light beam reflected by the second optoelectronic chip may then pass through the second optical element to be received by the imaging unit and imaged.

[0032] In the above embodiment, the light beam provided by the lighting unit can pass through the second optical element to illuminate the second optoelectronic chip, making the design of the lighting unit relatively simple, easy to implement and low in cost. For example, the lighting unit is a combination of a floodlight, optical fiber and frosted glass.

[0033] In another possible embodiment, the light beam provided by the lighting unit can directly illuminate the second optoelectronic chip (or, the light beam provided by the lighting unit can directly illuminate the second optoelectronic chip without passing through the second optical element), and the light beam reflected by the second optoelectronic chip passes through the second optical element and is received by the imaging unit to perform imaging.

[0034] In the above embodiment, the light beam provided by the illumination unit directly illuminates the second optoelectronic chip without passing through the second optical element. This ensures that the light beam provided by the illumination unit is not interfered with by the second optical element, providing the second optoelectronic chip with a balanced light beam of appropriate brightness. This allows the imaging unit to clearly observe the illuminated pattern on the second optoelectronic chip, facilitates accurate control by the control unit, and reduces the time required to couple the second optoelectronic chip to the second optical element.

[0035] In a possible implementation, the adjusting unit is further configured to adjust the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

[0036] In the above embodiment, the adjustment unit is used to adjust the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element. For example, using a three-dimensional coordinate system (x, y, z) as an example, adjusting the spatial position may include adjusting one or more of the following: the x-axis, the y-axis, the z-axis, and the rotation angle about each axis.

[0037] In one possible embodiment, the first optoelectronic chip is a light emitting chip, and the second optoelectronic chip is a light receiving chip. Alternatively, the first optoelectronic chip is a light receiving chip, and the second optoelectronic chip is a light emitting chip. Alternatively, both the first optoelectronic chip and the second optoelectronic chip are light emitting chips. Alternatively, both the first optoelectronic chip and the second optoelectronic chip are light receiving chips.

[0038] In the above embodiment, when the first optoelectronic chip is a light emitting chip and the second optoelectronic chip is a light receiving chip, the first optical element is an emitting optical system (light emitting lens) and the second optical element is a receiving optical system (light receiving lens). When the first optoelectronic chip is a light receiving chip and the second optoelectronic chip is a light emitting chip, the first optical element is a receiving optical system (light receiving lens) and the second optical element is an emitting optical system (light emitting lens). When the first optoelectronic chip and the second optoelectronic chip are both light emitting chips, the first optical element and the second optical element are both emitting optical systems (light emitting lenses). When the first optoelectronic chip and the second optoelectronic chip are both light receiving chips, the first optical element and the second optical element are both receiving optical systems (light receiving lenses).

[0039] In a possible implementation, the first optoelectronic chip is rigidly connected to the second optoelectronic chip, and / or the first optical element is rigidly connected to the second optical element.

[0040] In the above embodiment, the first optoelectronic chip is rigidly connected to the second optoelectronic chip, which can be understood as the relative position of the first optoelectronic chip and the second optoelectronic chip is fixed. Similarly, the first optical element is rigidly connected to the second optical element, which can be understood as the relative position of the first optical element and the second optical element is fixed. The first optoelectronic chip is rigidly connected to the second optoelectronic chip, so that the adjustment unit can simultaneously adjust the spatial position of the first optoelectronic chip and the second optoelectronic chip. The first optical element is rigidly connected to the second optical element, so that the adjustment unit can simultaneously adjust the spatial position of the first optical element and the second optical element, thereby reducing the process time of the optical product assembly process and improving the assembly efficiency and the hourly output of the optical product.

[0041] In a possible implementation, the adjustment unit includes a six-dimensional adjustment stage or a three-dimensional adjustment stage.

[0042] In the above embodiment, the number of six-dimensional adjustment platforms or three-dimensional adjustment platforms included in the adjustment unit is not limited. For example, when the adjustment unit is used to adjust the relative position of the first optoelectronic chip and the first optical element, two three-dimensional adjustment platforms can be used to adjust the relative position of the first optoelectronic chip and the first optical element respectively, or two six-dimensional adjustment platforms can be used to adjust the relative position of the first optoelectronic chip and the first optical element respectively, or one six-dimensional adjustment platform can be used to adjust the relative position of the first optoelectronic chip or the first optical element, or one six-dimensional adjustment platform and one three-dimensional adjustment platform can be used to adjust the relative position of the first optoelectronic chip and the first optical element respectively. Various positions can be adjusted by the six-dimensional adjustment platform or the three-dimensional adjustment platform, thereby reducing the process time of the optical product assembly process, improving the assembly efficiency and the hourly output of the optical product.

[0043] In one possible implementation, the imaging unit includes an imaging optical element and an image sensor, wherein the imaging optical element includes a telephoto lens or a collimator, and the image sensor is configured to generate an image based on a light beam captured by the imaging optical element.

[0044] In the above embodiment, the imaging unit includes an imaging optical element and an image sensor, wherein the imaging optical element includes a telephoto lens or a parallel light tube, both of which have a high magnification, can obtain the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip, and reduce the interference of stray light beams on the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip, so that the image sensor can clearly image the light spot on the first optoelectronic chip and the light spot on the second optoelectronic chip, thereby facilitating accurate control of the control unit, which is beneficial to saving the assembly time of the first optoelectronic chip and the first optical element.

[0045] Optionally, the angular resolution A of the imaging optical element and the angular resolution B of the first optical element satisfy the following relationship: A≥10B. Similarly, the angular resolution A of the imaging optical element and the angular resolution C of the second optical element also satisfy the following relationship: A≥10C.

[0046] Optionally, the image sensor is a high resolution and low light detector.

[0047] Optionally, an imaging optical element with a suitable magnification may be selected based on one or more of the following factors: for example, specifications (eg, angular resolution) of the first optical element and the second optical element, and pixel sizes of the first optoelectronic chip and the second optoelectronic chip.

[0048] In a possible implementation, the lighting unit includes any one or more of the following: an optical fiber, an optical fiber, frosted glass, or a reflector.

[0049] In the above embodiments, the lighting unit includes any one or more of the following: an optical fiber, an optical fiber, frosted glass, or a reflector. For example, the optical fiber and frosted glass can form a floodlight source, which can then be reflected by the reflector toward the first optoelectronic chip and / or the second optoelectronic chip. In another example, the optical fiber can directly provide light to the first optoelectronic chip and / or the second optoelectronic chip. Optical fibers, optical fibers, frosted glass, or reflectors are low-cost and simple to operate, thus reducing the cost of the coupling platform.

[0050] In a second aspect, the present application provides a coupling platform, which is used to couple a first lens module and a second lens module, wherein the first lens module and the second lens module are equidistant from the imaging unit. The first lens module includes a first optoelectronic chip and a first optical element, the second lens module includes a second optoelectronic chip and a second optical element, and the first optoelectronic chip and the second optoelectronic chip are placed under lighting conditions. The above-mentioned coupling platform includes an imaging unit, a control unit and an adjustment unit, wherein the imaging unit is used to receive a light beam passing through the first optical element and the second optical element and generate a first image and a second image respectively. The first image includes an image of a light spot on the first optoelectronic chip, and the second image includes an image of a light spot on the second optoelectronic chip. The control unit is used to control the adjustment unit based on the first image and the second image. The adjustment unit is used to adjust the relative posture of the first lens module and the second lens module.

[0051] The present application provides a coupling platform comprising an imaging unit, a control unit, and an adjustment unit. The coupling platform is used to couple a first lens module and a second lens module, wherein the first lens module comprises a first optoelectronic chip and a first optical element, and the second lens module comprises a second optoelectronic chip and a second optical element. The first optoelectronic chip and the second optoelectronic chip are also referred to as photosensitive chips, for example, light emitters or light detectors, which display a predetermined pattern when exposed to light. The present application does not limit the number of lenses contained in the optical elements; for example, the first optical element and the second optical element each comprise one or more lenses. The present application also does not limit the type of optical elements; for example, the first optical element may be a transmitting optical system, and the second optical element may be a receiving optical system. Another example is the first optical element may be a receiving optical system, and the second optical element may be a transmitting optical system. It is understood that the first lens module or the second lens module refers to a coupling module formed by an optoelectronic chip and an optical element. For example, the first optoelectronic chip and the first optical element may be coupled to form the first lens module using any of the embodiments of the first aspect described above and related possible embodiments. The second optoelectronic chip and the second optical element may be coupled to form the second lens module using any of the embodiments of the first aspect described above and related possible embodiments.

[0052] The distances between the first lens module and the second lens module and the imaging unit are equal, so that the sizes of the light spot images on the first optoelectronic chip and the second optoelectronic chip obtained by the imaging unit are equal, which facilitates the control unit to perform reasonable control, thereby allowing the first lens module and the second lens module to complete coupling quickly.

[0053] The imaging unit generates a first image and a second image respectively by receiving a light beam passing through the first optical element and a light beam passing through the second optical element. The first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip. The control unit controls the adjustment unit based on the first image and the second image, so as to allow the adjustment unit to adjust the relative position of the first lens module and the second lens module. For example, the control unit obtains the relative position of the image of the light spot on the first optoelectronic chip and the image of the light spot on the second optoelectronic chip through the first image and the second image, and controls the adjustment unit based on the relative position. The adjustment unit adjusts the relative position of the first lens module and the second lens module so that the image of the light spot on the first optoelectronic chip coincides with the image of the light spot on the second optoelectronic chip, thereby completing the coupling of the first lens module and the second lens module.

[0054] The coupling platform simply requires a control unit to control the adjustment unit based on the first and second images, and then have the adjustment unit execute corresponding control instructions to adjust the relative position of the first and second lens modules to complete the coupling of the first and second lens modules. This eliminates the need for complex power-up and power-down procedures, making the operation simple and time-saving. It also enables automated assembly of optical products, reducing process time and improving assembly efficiency and hourly output.

[0055] Optionally, when the distances between the first lens module, the second lens module and the imaging unit are not equal, the adjustment unit can adjust the relative positions of the first lens module and the second lens module so that the distances between the first lens module and the second lens module and the imaging unit are equal.

[0056] In a possible implementation, the coupling platform further includes an illumination unit, and the illumination unit is configured to provide an illumination light beam for the first optoelectronic chip and / or the second optoelectronic chip.

[0057] In the above embodiment, the coupling platform also includes a lighting unit for providing an illumination beam for the first optoelectronic chip and / or the second optoelectronic chip, so that the imaging unit can clearly observe the illuminated pattern on the first optoelectronic chip and / or the second optoelectronic chip, which facilitates the control unit to perform accurate control and helps save time in coupling the first lens module and the second lens module.

[0058] In one possible implementation, the light beam provided by the lighting unit may pass through a first optical element to illuminate the first optoelectronic chip. The light beam reflected by the first optoelectronic chip then passes through the first optical element to be received by the imaging unit for imaging. Similarly, the light beam provided by the lighting unit may pass through a second optical element to illuminate the second optoelectronic chip. The light beam reflected by the second optoelectronic chip then passes through the second optical element to be received by the imaging unit for imaging.

[0059] In the above embodiment, the light beam provided by the lighting unit can pass through the first optical element to illuminate the first optoelectronic chip, and can also pass through the second optical element to illuminate the second optoelectronic chip, making the design of the lighting unit relatively simple, easy to implement, and low in cost. For example, the lighting unit is a combination of a floodlight, optical fiber, and frosted glass.

[0060] In another possible embodiment, the light beam provided by the lighting unit can directly illuminate the first optoelectronic chip (or, the light beam provided by the lighting unit can directly illuminate the first optoelectronic chip without passing through the first optical element). The light beam reflected by the first optoelectronic chip passes through the first optical element and is received by the imaging unit for imaging. Similarly, the light beam provided by the lighting unit can directly illuminate the second optoelectronic chip (or, the light beam provided by the lighting unit can directly illuminate the second optoelectronic chip without passing through the second optical element). The light beam reflected by the second optoelectronic chip passes through the second optical element and is received by the imaging unit for imaging.

[0061] In the above embodiment, the light beam provided by the illumination unit directly illuminates the first and second optoelectronic chips without passing through the first and second optical elements. This ensures that the light beam provided by the illumination unit is not interfered with by the first and second optical elements, providing a balanced light beam with appropriate brightness to the first and second optoelectronic chips. This allows the imaging unit to clearly observe the illuminated patterns on the first and second optoelectronic chips, facilitates accurate control by the control unit, and reduces the time required to couple the first and second lens modules.

[0062] In a possible implementation, the adjustment unit is used to adjust the spatial position of the first lens module and / or the second lens module.

[0063] In the above embodiment, the adjustment unit is used to adjust the spatial position of the first lens module and / or the second lens module. For example, taking the three-dimensional coordinate system (x, y, z) as an example, adjusting the spatial position may refer to adjusting one or more of the following: the x-axis, the y-axis, the z-axis, and the rotation angle on each axis.

[0064] In a possible implementation, the first lens module is a light emitting module, and the second lens module is a light receiving module.

[0065] In a possible implementation, the adjustment unit includes a six-dimensional adjustment stage or a three-dimensional adjustment stage.

[0066] In the above embodiment, the number of six-dimensional adjustment platforms or three-dimensional adjustment platforms included in the adjustment unit is not limited. For example, when the adjustment unit is used to adjust the relative position of the first lens module and the second lens module, two three-dimensional adjustment platforms can be used to adjust the first lens module and the second lens module respectively, two six-dimensional adjustment platforms can be used to adjust the first lens module and the second lens module respectively, one six-dimensional adjustment platform can be used to adjust the first lens module and the second lens module, and one six-dimensional adjustment platform and a three-dimensional adjustment platform can be used to adjust the first lens module and the second lens module respectively. Various positions can be adjusted by the six-dimensional adjustment platform or the three-dimensional adjustment platform, thereby reducing the process time of the optical product coupling process, improving assembly efficiency and the hourly output of optical products.

[0067] In one possible implementation, the imaging unit includes an imaging optical element and an image sensor, wherein the imaging optical element includes a telephoto lens or a collimator, and the image sensor is configured to generate an image based on a light beam captured by the imaging optical element.

[0068] In the above embodiment, the imaging unit includes an imaging optical element and an image sensor, wherein the imaging optical element includes a telephoto lens or a parallel light tube, both of which have a high magnification, can obtain the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip, and reduce the interference of stray light beams on the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip, so that the image sensor can clearly image the light spot on the first optoelectronic chip and the light spot on the second optoelectronic chip, thereby facilitating accurate control of the control unit, which is beneficial to saving the time of coupling the first lens module and the second lens module.

[0069] Optionally, the angular resolution A of the imaging optical element and the angular resolution B of the first optical element satisfy the following relationship: A≥10B. Similarly, the angular resolution A of the imaging optical element and the angular resolution C of the second optical element also satisfy the following relationship: A≥10C.

[0070] Optionally, the image sensor is a high resolution and low light detector.

[0071] Optionally, an imaging optical element with a suitable magnification may be selected based on one or more of the following factors: for example, specifications (eg, angular resolution) of the first optical element and the second optical element, and pixel sizes of the first optoelectronic chip and the second optoelectronic chip.

[0072] In a possible implementation, the lighting unit includes any one or more of the following: an optical fiber, an optical fiber, frosted glass, or a reflector.

[0073] In the above embodiments, the lighting unit includes any one or more of the following: an optical fiber, an optical fiber, frosted glass, or a reflector. For example, the optical fiber and frosted glass can form a floodlight source, which can then be reflected by the reflector toward the first optoelectronic chip and / or the second optoelectronic chip. In another example, the optical fiber can directly provide light to the first optoelectronic chip and / or the second optoelectronic chip. Optical fibers, optical fibers, frosted glass, or reflectors are low-cost and simple to operate, thus reducing the cost of the coupling platform.

[0074] In a third aspect, the present application provides a coupling method, comprising: receiving a light beam passing through a first optical element and generating a first image; and adjusting the relative position of a first optoelectronic chip and the first optical element based on the first image. The first optoelectronic chip is placed under illumination conditions, and the first image includes an image of a light spot on the first optoelectronic chip.

[0075] The coupling method provided in this application can be applied to the coupling platform shown in the first aspect above.

[0076] In a possible implementation, adjusting the relative position of the first optoelectronic chip and the first optical element includes: adjusting the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

[0077] In one possible embodiment, the method further includes receiving the light beam passing through the second optical element and generating a second image, the second image including an image of the light spot on the second optoelectronic chip, the first optoelectronic chip being placed under the illumination condition. Based on the first and second images, the relative position of the second optoelectronic chip and the second optical element is adjusted.

[0078] In a possible implementation manner, adjusting the relative position of the second optoelectronic chip and the second optical element includes: adjusting the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

[0079] In one possible implementation, the first optoelectronic chip is a light emitting chip, and the second optoelectronic chip is a light receiving chip. Alternatively, both the first optoelectronic chip and the second optoelectronic chip are light emitting chips. Alternatively, both the first optoelectronic chip and the second optoelectronic chip are light receiving chips.

[0080] In a possible implementation manner, the first optoelectronic chip is rigidly connected to the second optoelectronic chip, and / or the first optical element is rigidly connected to the second optical element.

[0081] Regarding the beneficial effects of the third aspect and any possible embodiment, reference may be made to the beneficial effects of the corresponding embodiment in the first aspect, which will not be repeated here.

[0082] In a fourth aspect, the present application provides a coupling method for coupling a first lens module and a second lens module, wherein the first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element. The method includes: receiving a light beam passing through the first optical element and the second optical element and generating a first image and a second image, respectively, wherein the first image includes an image of a light spot on the first optoelectronic chip, and the second image includes an image of a light spot on the second optoelectronic chip, and the first optoelectronic chip and the second optoelectronic chip are placed under lighting conditions. Based on the first image and the second image, the relative position of the first lens module and the second lens module is adjusted.

[0083] In a possible implementation, adjusting the relative posture of the first lens module and the second lens module includes: an adjustment unit for adjusting the spatial position of the first lens module and / or the second lens module.

[0084] In a possible implementation manner, the first lens module is a light emitting module, and the second lens module is a light receiving module.

[0085] Regarding the beneficial effects of the fourth aspect and any possible embodiment, reference may be made to the beneficial effects of the corresponding embodiment in the second aspect, which will not be repeated here.

[0086] In a fifth aspect, the present application provides a coupling device, which includes at least one coupling platform as shown in the first aspect, or the coupling platform as shown in the second aspect.

[0087] In a possible implementation manner, the coupling device is used to perform the method of any one of the third to fourth aspects and any possible implementation manner.

[0088] In a sixth aspect, the present application provides a coupling device, which includes a processor and a memory, wherein the memory is used to store a computer program and the processor is used to execute the computer program, so that the coupling device executes the method of any aspect from the third to the fourth aspect above and any possible implementation method.

[0089] In a seventh aspect, the present application provides a computer-readable storage medium for storing a computer program (also referred to as code or instructions). When the computer program is run on a computer, the method of any of the third to fourth aspects and any possible implementation thereof is implemented.

[0090] In an eighth aspect, the present application provides a computer program product, comprising: a computer program (also referred to as code or instructions). When the computer program is executed, the computer executes the method of any one of the third to fourth aspects and any possible implementation methods described above.

[0091] In a ninth aspect, the present application provides a chip comprising a processor for executing instructions. When the processor executes the instructions, the chip executes the method of any one of the third to fourth aspects and any possible implementation method.

[0092] In a tenth aspect, the present application provides a terminal device, which includes at least one coupling platform such as the first aspect, or the coupling platform of the second aspect, or the coupling device of the fifth aspect, or the coupling device of the sixth aspect, or the chip of the ninth aspect.

[0093] In the present application, a coupling platform is provided, which includes an imaging unit, a control unit and an adjustment unit. The imaging unit generates a first image by receiving a light beam passing through a first optical element, and the first image includes an image of a light spot on a first optoelectronic chip. The control unit controls the adjustment unit based on the acquired first image, so as to allow the adjustment unit to adjust the relative position of the first optoelectronic chip and the first optical element, thereby completing the coupling of the first optoelectronic chip and the first optical element. The above-mentioned coupling platform only needs the control unit to control the adjustment unit based on the first image, and then allow the adjustment unit to execute the corresponding control instructions to adjust the relative position of the first optoelectronic chip and the first optical element, thereby completing the coupling of the first optoelectronic chip and the first optical element. There is no need to perform a complicated power-on and power-off process, which is not only simple to operate and time-saving, but also can realize the automatic coupling between the first optoelectronic chip and the first optical element, thereby reducing the process time of the optical product coupling process, improving the assembly efficiency and the hourly output of the optical product. BRIEF DESCRIPTION OF THE DRAWINGS

[0094] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0095] FIG1 is a schematic diagram of a coupling platform provided in an embodiment of the present application;

[0096] FIG2 is a schematic diagram of another coupling platform provided in an embodiment of the present application;

[0097] FIG3 is a schematic diagram of another coupling platform provided in an embodiment of the present application;

[0098] FIG4 is a schematic diagram of another coupling platform provided in an embodiment of the present application;

[0099] FIG5 is a schematic diagram of another coupling platform provided in an embodiment of the present application;

[0100] FIG6 is a schematic diagram of another coupling platform provided in an embodiment of the present application;

[0101] FIG7 is a schematic diagram of a coordinate system provided in an embodiment of the present application;

[0102] FIG8A is a schematic diagram of measuring image clarity provided by an embodiment of the present application;

[0103] FIG8B is a schematic diagram of a light spot image on a photoelectric chip provided in an embodiment of the present application;

[0104] FIG8C is a schematic diagram of a defocus curve provided in an embodiment of the present application;

[0105] FIG9A is a schematic diagram of a lighting unit provided in an embodiment of the present application;

[0106] FIG9B is a schematic diagram of another lighting unit provided in an embodiment of the present application;

[0107] FIG10 is a schematic diagram of a coupling method provided in an embodiment of the present application;

[0108] FIG11A is a schematic diagram of a coupling process provided in an embodiment of the present application;

[0109] FIG11B is a schematic diagram of another coupling process provided in an embodiment of the present application;

[0110] FIG12A is a schematic diagram of another coupling process provided in an embodiment of the present application;

[0111] FIG12B is a schematic diagram of an imaging method provided in an embodiment of the present application;

[0112] FIG12C is a schematic diagram of another coupling process provided in an embodiment of the present application;

[0113] FIG13 is a schematic diagram of another coupling method provided in an embodiment of the present application;

[0114] FIG14 is a schematic diagram of another coupling method provided in an embodiment of the present application;

[0115] FIG15A is a schematic diagram of another coupling process provided in an embodiment of the present application;

[0116] FIG15B is another imaging schematic diagram provided in an embodiment of the present application;

[0117] FIG15C is another imaging schematic diagram provided in an embodiment of the present application;

[0118] FIG16A is a schematic diagram of another coupling process provided in an embodiment of the present application;

[0119] FIG16B is another imaging schematic diagram provided in an embodiment of the present application;

[0120] FIG16C is another imaging schematic diagram provided in an embodiment of the present application;

[0121] FIG16D is another imaging schematic diagram provided in an embodiment of the present application;

[0122] FIG17A is another imaging schematic diagram provided in an embodiment of the present application;

[0123] FIG17B is another imaging schematic diagram provided in an embodiment of the present application. DETAILED DESCRIPTION

[0124] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be described below in conjunction with the drawings in this application.

[0125] The terms "first" and "second" in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to the process, method, product, or device.

[0126] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it refer to independent or alternative embodiments that are mutually exclusive of other embodiments. It will be understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0127] It should be understood that in the present application, "at least one (item)" refers to one or more, "more than one" refers to two or more, "at least two (items)" refers to two or three and more than three, and "and / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0128] In order to more clearly describe the solution of this application, some technical terms related to the following are first introduced below.

[0129] 1. Through-focus

[0130] The defocus curve refers to changing the axial distance (the distance in the optical axis direction) between the optical element (abbreviated as optical element) and the optoelectronic chip (photosensitive chip) in the test light path, and measuring the resolution data of each identification pattern on the target plate corresponding to each axial distance, and then drawing a curve of each identification pattern based on these measured data. In other words, each identification pattern can measure the corresponding measured defocus curve. In the measured defocus curve, the horizontal axis can represent the axial distance, and the vertical axis can represent the resolution data, such as the spatial frequency response (SFR) value and the modulation transfer function (MTF) value. Simply put, the defocus curve is a curve that represents the image clarity and the deviation of the optoelectronic chip from the optimal focal length. The horizontal axis can be set to the value of the optoelectronic chip's deviation from the optimal focal length, and the vertical axis can be set to the image clarity value.

[0131] In some scenarios, since the optoelectronic chip itself has a pattern, the corresponding image can be obtained by imaging the light beam emitted by the optoelectronic chip. Therefore, the defocus curve of the optical element and the optoelectronic chip can be obtained without using a target plate.

[0132] 2. Relative posture

[0133] Relative position refers to the relative position and relative posture of two objects. Among them, the relative position of two objects can be understood as the relative position of the two objects in space. Relative posture can be understood as the relative posture of two objects. Taking optical components and optoelectronic chips as an example, by adjusting the relative posture of the two, the optical axes of the two can be made to overlap, be parallel, intersect, or not intersect with each other. Adjusting the relative position of two objects can refer to adjusting the position and / or posture of one of the objects, or it can refer to adjusting the position and / or posture of both objects at the same time. Adjusting the position and / or posture includes adjustment methods such as translation and rotation.

[0134] 3. Optoelectronic chips

[0135] The optoelectronic chip includes a light emitting chip and / or a light receiving chip.

[0136] As a possible implementation, the light emitting chip includes one or more of the following light sources: vertical cavity surface emitting laser (VCSEL), photonic crystal surface emitting semiconductor lasers (PCSEL), edge emitting laser (EEL), laser diode (LD), distributed feedback laser diode (DFB-LD), grating coupled sampling reflection laser diode (GCSR-LD), or micro opto electro mechanical system laser diode (MOEMS-LD). For example, the light emitting chip includes one or more VCSEL chips, or the light emitting chip includes multiple EEL chips.

[0137] As a possible implementation, the light receiving chip includes a detector and / or an image sensor. The detector is used to obtain point cloud and / or ranging information, such as TOF information, and is also called a radar detector or ranging detector in some solutions. Exemplarily, the detector includes one or more of the following detection units: single-photon avalanche diode (SPAD), silicon photomultiplier (SiPM), multi-pixel photon counter (MPPC), semiconductor avalanche photodiode (APD), or "positive-intrinsic-negative" (PIN) type diode (or called P-type semiconductor-impurity-N-type semiconductor diode), etc. In the case where the detector includes multiple detection units, the multiple detection units can be arranged in an array to form an array detector. For example, the receiving module includes a SPAD array detector. Image sensors include one or more of the following photosensitive elements: complementary metal oxide semiconductor (CMOS), charge-coupled device (CCD), Live MOS, etc. For example, image sensors include CMOS image sensors (CIS), which are used to convert optical images into electronic signals.

[0138] The description of the above technical terms can be optionally used in the following embodiments.

[0139] As described in the background technology, the AA process of optical products includes: loading, powering on (for example, lighting up the TX / RX board), calibration, and unloading. Among them, the power-on process is time-consuming and difficult to automate. The present application provides a coupling platform, coupling method, and related devices related to the field of optoelectronics. Without the need for complex power-on and power-off processes, it is not only simple to operate and time-saving, but also enables the automatic assembly of optical products, thereby reducing the process time of the optical product assembly process, improving assembly efficiency and the hourly output of optical products.

[0140] Next, this application will be introduced with reference to the accompanying drawings.

[0141] Please refer to Figure 1, which is a schematic diagram of a coupling platform provided in an embodiment of the present application. The coupling platform 100 includes an imaging unit 101, a control unit 102, and an adjustment unit 103. The coupling platform 100 is used to couple a first optical element 104 and a first optoelectronic chip 105. As shown in Figure 1, the first optical element 104 and the first optoelectronic chip 105 can be placed on the coupling platform 100. Furthermore, the first optical element 104 and / or the first optoelectronic chip can be disposed on the adjustment unit 103.

[0142] The first optoelectronic chip 105 is placed under lighting conditions. In some embodiments, the first optoelectronic chip 105 may be provided with a pattern. In this case, when the first optoelectronic chip 105 is placed under lighting conditions, the pattern on the first optoelectronic chip 105 may be illuminated. Optionally, the lighting conditions may be provided by natural light or artificial light.

[0143] The first optical element 104 is disposed between the first optoelectronic chip 105 and the imaging unit 101. Exemplarily, the first optical element 104 includes one or more lenses. Furthermore, the first optical element 104 may be an imaging lens. In some embodiments, the first optical element 104 may be used for imaging. For example, the first optical element 104 is an imaging lens with a converging function. When a light beam passes through the first optical element 104 from the object side, the light beam is converged and formed on the other side of the first optical element 104. It is not difficult to understand that since the first optoelectronic chip 105 is placed under illumination conditions, when the light beam from the first optoelectronic chip 105 passes through the first optical element 104, the light beam can be formed on the imaging unit 101.

[0144] Imaging unit 101 is used to receive a light beam and form an image based on the received light beam. For its definition and possible implementations, see the detailed description of the imaging unit below. For example, imaging unit 101 may be an image sensor, such as a contact image sensor (CIS), or an RGB sensor, a monosensor, or the like. As one possible implementation, the light beam received by imaging unit 101 includes a light beam reflected from a pattern on first optoelectronic chip 105. Therefore, the first image generated by imaging unit 101 includes an image of the light spot on first optoelectronic chip 105.

[0145] The control unit 102 is used to control the adjustment unit 103. For its definition and possible implementations, please refer to the detailed description of the control unit below. As one possible implementation, the control unit 102 can control the adjustment unit 103 based on the first image. For example, the control unit 102 generates corresponding control instructions by analyzing the image of the light spot on the first optoelectronic chip 105, and uses these instructions to control the adjustment unit 103. For example, the control unit 102 generates control instructions for adjusting the relative distance between the first optical element 104 and the first optoelectronic chip 105 by analyzing the clarity of the image of the light spot on the first optoelectronic chip 105. These control instructions are used to control the adjustment unit 103, causing the adjustment unit 103 to adjust the relative distance between the first optical element 104 and the first optoelectronic chip 105. For specific implementations, please refer to the relevant descriptions below.

[0146] The adjustment unit 103 is used to adjust the relative position of the first optical element 104 and the first optoelectronic chip 105. For its definition and possible implementation, please refer to the detailed description of the adjustment unit below. Optionally, the adjustment unit 103 can adjust the position and / or posture of the first optical element 104 and / or the first optoelectronic chip 105. Exemplarily, the adjustment unit 103 adjusts the relative position of the first optoelectronic chip 105 and the first optical element 104 based on the control instructions of the control unit 102, so that the first image generated by the imaging unit 101 includes a clear and complete image of the light spot on the first optoelectronic chip 105, thereby completing the coupling of the first optical element 104 and the first optoelectronic chip 105.

[0147] In short, the coupling platform simply requires the control unit to control the adjustment unit based on the first image, and then have the adjustment unit execute corresponding control instructions to adjust the relative position of the first optoelectronic chip and the first optical element to complete the coupling of the first optoelectronic chip and the first optical element. This eliminates the need for complex power-up and power-down procedures, making the operation simple and time-saving. It also enables automated assembly of optical products, reducing process time and improving assembly efficiency and hourly output.

[0148] To facilitate understanding, the following explanation is briefly explained: the image of the illuminated pattern on the optoelectronic chip, as formed by the imaging unit, is referred to as the image of the light spot on the optoelectronic chip. For example, the image of the illuminated pattern on the first optoelectronic chip 105, as formed by the imaging unit, is referred to as the image of the light spot on the first optoelectronic chip 105. For another example, the image of the illuminated pattern on the second optoelectronic chip 107, as formed by the imaging unit, is referred to as the image of the light spot on the second optoelectronic chip 107. For ease of understanding, the "image of the light spot on the first optoelectronic chip 105" may be referred to as "Image A," and the "image of the light spot on the second optoelectronic chip 107" may be referred to as "Image B."

[0149] The optical path in the coupling platform 100 includes the following two situations:

[0150] Case 1: The light beam passing through the first optical element 104 illuminates the first optoelectronic chip 105. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 101, as shown by the dotted line with an arrow in FIG1 .

[0151] Case 2: The light beam directly illuminates the first optoelectronic chip 105 without passing through the first optical element 104. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 101, as shown by the solid line with arrows in FIG1 .

[0152] In a possible implementation, the coupling platform 100 further includes an illumination unit, which is used to provide an illumination beam for the first optoelectronic chip 105 . For its definition and possible implementation, please refer to the detailed introduction of the illumination unit below.

[0153] Please refer to Figure 2, which is a schematic diagram of another coupling platform provided in an embodiment of the present application. The coupling platform 100 includes an imaging unit 101, a control unit 102, an adjustment unit 103, and an illumination unit. The illumination unit is the illumination unit 108 and / or the illumination unit 109 shown in Figure 2.

[0154] In a possible lighting design, the light beam provided by the lighting unit 108 passes through the first optical element 104 and illuminates the first optoelectronic chip 105 . The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 101 .

[0155] In another possible lighting design, the light beam provided by the lighting unit 109 does not pass through the first optical element 104 but directly illuminates the first optoelectronic chip 105 . The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 101 .

[0156] Of course, the above two lighting designs can also be combined. For example, the coupling platform 100 includes both the lighting unit 108 and the lighting unit 109 to provide sufficient lighting for the first optoelectronic chip 105 so that the imaging unit 101 can generate a clear image A.

[0157] By providing an illumination beam to the first optoelectronic chip 105 through the illumination unit, the pattern on the first optoelectronic chip 105 can be clearly illuminated, thereby avoiding the situation where the first optoelectronic chip 105 is unevenly illuminated, thereby enabling the imaging unit 101 to generate a clear image A, facilitating accurate control by the control unit 102, and saving time in coupling the first optoelectronic chip 105 and the first optical element 104.

[0158] The coupling platform 100 shown in Figures 1 and 2 is capable of coupling a set of optical products at the same time, such as a first optical element 104 and a first optoelectronic chip 105. To further improve the assembly efficiency of optical products, the present application provides another coupling platform capable of coupling two sets of optical products at the same time, thereby improving the assembly efficiency and hourly output of optical products.

[0159] Please refer to Figure 3, which is a schematic diagram of another coupling platform provided in an embodiment of the present application. The coupling platform 200 includes an imaging unit 201, a control unit 202, and an adjustment unit 203. In addition to being used to couple the first optical element 104 and the first optoelectronic chip 105, the coupling platform is also used to couple the second optical element 106 and the second optoelectronic chip 107. As shown in Figure 3, the first optical element 104, the first optoelectronic chip 105, the second optical element 106, and the second optoelectronic chip 107 can be placed on the coupling platform 200. Furthermore, one or more of the first optical element 104, the first optoelectronic chip 105, the second optical element 106, and the second optoelectronic chip 107 can be disposed on the adjustment unit 203.

[0160] The first optoelectronic chip 105 and the second optoelectronic chip 107 are placed under lighting conditions. In some embodiments, the first optoelectronic chip 105 and the second optoelectronic chip 107 may be provided with patterns. In this case, when the first optoelectronic chip 105 and the second optoelectronic chip 107 are placed under lighting conditions, the patterns on the first optoelectronic chip 105 and the second optoelectronic chip 107 may be illuminated. Optionally, the lighting conditions may be provided by natural light or artificial light.

[0161] The first optical element 104 is disposed between the first optoelectronic chip 105 and the imaging unit 201, and the second optical element 106 is disposed between the second optoelectronic chip 107 and the imaging unit 201. Exemplarily, the first optical element 104 and the second optical element 106 include one or more lenses. In another exemplary embodiment, the first optical element 104 and the second optical element 106 may be imaging lenses. In some embodiments, the first optical element 104 and the second optical element 106 may be used for imaging. For example, the first optical element 104 and the second optical element 106 may be imaging lenses with a converging function. When a light beam passes through the first optical element 104 from the object side, the light beam may be converged and formed on the other side of the first optical element 104. Similarly, when a light beam passes through the second optical element 106 from the object side, the light beam may be converged and formed on the other side of the second optical element 106. It is easy to understand that since the first optoelectronic chip 105 and the second optoelectronic chip 107 are placed under illumination conditions, when the light beam from the first optoelectronic chip 105 passes through the first optical element 104, the light beam may be formed on the imaging unit 201. Likewise, when the light beam from the second optoelectronic chip 107 passes through the second optical element 106 , the light beam may also be imaged on the imaging unit 201 .

[0162] Optionally, the first optoelectronic chip 105 is a light emitting chip, and the second optoelectronic chip 107 is a light receiving chip; or, the first optoelectronic chip 105 is a light receiving chip, and the second optoelectronic chip 107 is a light emitting chip; or, both the first optoelectronic chip 105 and the second optoelectronic chip 107 are light emitting chips; or, both the first optoelectronic chip 105 and the second optoelectronic chip 107 are light receiving chips. Accordingly, when the first optoelectronic chip 105 comprises a light emitting chip, the first optical element 104 comprises an emitting optical system (light emitting lens). When the first optoelectronic chip 105 comprises a light receiving chip, the first optical element 104 comprises a receiving optical system (light receiving lens). When the second optoelectronic chip 107 is a light emitting chip, the second optical element 106 comprises an emitting optical system (light emitting lens). When the second optoelectronic chip 107 is a light receiving chip, the second optical element 106 comprises a receiving optical system (light receiving lens).

[0163] The imaging unit 201 is used to receive a light beam and form an image based on the received light beam. For its definition and possible implementations, please refer to the detailed description of the imaging unit below. For example, the imaging unit 201 can be an image sensor, such as a CIS, or an RGB sensor, a monosensor, etc. As one possible implementation, the light beam received by the imaging unit 201 includes a light beam reflected by a pattern on the first optoelectronic chip 105. Therefore, the first image generated by the imaging unit 201 includes image A. As another possible implementation, the light beam received by the imaging unit 201 includes a light beam reflected by a pattern on the second optoelectronic chip 107. Therefore, the second image generated by the imaging unit 201 includes image B.

[0164] The control unit 202 is used to control the adjustment unit 203. For its definition and possible implementation, please refer to the detailed description of the control unit below. As one possible implementation, the control unit 202 can control the adjustment unit 203 based on the first image. For example, the control unit 202 generates corresponding control instructions by analyzing image A, and uses them to control the adjustment unit 203. For example, the control unit 202 generates a control instruction for adjusting the relative distance between the first optical element 104 and the first optoelectronic chip 105 by analyzing the clarity of image A, and uses it to control the adjustment unit 203 so that the adjustment unit 203 adjusts the relative distance between the first optical element 104 and the first optoelectronic chip 105. For specific implementation methods, please refer to the relevant introduction below. As another possible implementation, the control unit 202 can control the adjustment unit 203 based on the second image. For example, the control unit 202 generates corresponding control instructions by analyzing image B, and uses them to control the adjustment unit 203. For example, the control unit 202 generates a control instruction for adjusting the relative distance between the second optical element 106 and the second optoelectronic chip 107 by analyzing the clarity of image B, and is used to control the adjustment unit 203 so that the adjustment unit 203 adjusts the relative distance between the second optical element 106 and the second optoelectronic chip 107. For specific implementations, please refer to the relevant introduction below. As another possible implementation, the control unit 202 can control the adjustment unit 203 based on the first image and the second image. For example, the lens module obtained by coupling the first optical element 104 and the first optoelectronic chip 105 is called the first lens module, and the lens module obtained by coupling the second optical element 106 and the second optoelectronic chip 107 is called the second lens module. The control unit 202 controls the adjustment unit 203 by analyzing image A and image B. For example, the control unit generates a control instruction for adjusting the relative position of the first lens module and the second lens module by analyzing the relative position of image A and image B. The control instruction is used to control the adjustment unit 203, so that the adjustment unit 203 adjusts the relative position of the first optical element 104 and the first optoelectronic chip 105, and / or the relative position of the second optical element 106 and the second optoelectronic chip 107, so that image A and image B overlap, thereby completing the coupling of the first lens module and the second lens module. For specific implementations, please refer to the relevant description below.

[0165] The difference between the adjustment unit 203 and the adjustment unit 103 is that the adjustment unit 203 can simultaneously adjust the relative positions of optical elements and optoelectronic chips in multiple sets of optical products, thereby improving the assembly efficiency of the optical products and the hourly output of the optical products.

[0166] The adjustment unit 203 is used to adjust the relative position and posture of the first optical element 104 and the first optoelectronic chip 105, and / or the relative position and posture of the second optical element 106 and the second optoelectronic chip 107. For its definition and possible implementation, please refer to the detailed description of the adjustment unit below. As a possible implementation, the adjustment unit 203 can adjust the position and / or posture of the first optical element 104 and / or the first optoelectronic chip 105. Exemplarily, based on the control instructions of the control unit 202, the adjustment unit 203 adjusts the relative position and posture of the first optical element 104 and the first optoelectronic chip 105 so that the first image generated by the imaging unit 201 includes a clear and complete image A, thereby completing the coupling of the first optical element 104 and the first optoelectronic chip 105. As another possible implementation, the adjustment unit 203 can adjust the position and / or posture of the second optical element 106 and / or the second optoelectronic chip 107. Exemplarily, the adjustment unit 203 adjusts the relative position of the second optical element 106 and the second optoelectronic chip 107 based on the control instructions of the control unit 202, so that the second image generated by the imaging unit 201 includes a clear and complete image B, thereby completing the coupling of the second optical element 106 and the second optoelectronic chip 107.

[0167] In short, the coupling platform simply requires a control unit to control an adjustment unit based on the first and second images, and then have the adjustment unit execute corresponding control instructions to adjust the relative position of the first optoelectronic chip and the first optical element, and the relative position of the second optoelectronic chip and the second optical element, thereby completing the coupling of the first optoelectronic chip with the first optical element, and the second optoelectronic chip with the second optical element. This eliminates the need for complex power-up and power-down procedures, making the operation simple and time-saving. It also enables automated assembly of optical products, reducing process time and improving assembly efficiency and hourly output.

[0168] The optical path in the coupling platform 200 includes the following two situations:

[0169] In case 1, the light beam passing through the first optical element 104 illuminates the first optoelectronic chip 105. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 201. The light beam passing through the second optical element 106 illuminates the second optoelectronic chip 107. The light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 again and is received by the imaging unit 201. This is shown by the dotted arrow line in FIG3 .

[0170] In the second scenario, the light beam directly illuminates the first optoelectronic chip 105 without passing through the first optical element 104. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 201. The light beam directly illuminates the second optoelectronic chip 107 without passing through the second optical element 106. The light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 and is received by the imaging unit 201. This is shown by the solid arrow line in FIG. 3 .

[0171] In a possible implementation, the coupling platform 200 further includes an illumination unit for providing an illumination beam for the first optoelectronic chip 105 and the second optoelectronic chip 107 . For its definition and possible implementation, please refer to the detailed introduction of the illumination unit below.

[0172] Please refer to Figure 4, which is a schematic diagram of another coupling platform provided in an embodiment of the present application. The coupling platform 200 includes an imaging unit 201, a control unit 202, an adjustment unit 203, and an illumination unit. The illumination unit is the illumination unit 401 and / or the illumination unit 402 shown in Figure 4.

[0173] In one possible lighting design, the light beam provided by the lighting unit 401 passes through the first optical element 104 and illuminates the first optoelectronic chip 105. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 201. The light beam provided by the lighting unit 401 also passes through the second optical element 106 and illuminates the second optoelectronic chip 107. The light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 again and is received by the imaging unit 201. It should be noted that, in a specific implementation, the lighting unit can be composed of two sets of light sources, each for illuminating the first optoelectronic chip 105 and the second optoelectronic chip 107. Alternatively, the lighting unit can be composed of a single light source capable of simultaneously illuminating the first optoelectronic chip 105 and the second optoelectronic chip 107.

[0174] In another possible lighting design, the light beam provided by the lighting unit 402 does not pass through the first optical element 104 and directly illuminates the first optoelectronic chip 105. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 201. The light beam provided by the lighting unit 402 also does not pass through the second optical element 106 and directly illuminates the second optoelectronic chip 107. The light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 and is received by the imaging unit 201.

[0175] Of course, the above two lighting designs can also be combined. For example, the coupling platform 200 can also use the lighting unit 401 and the lighting unit 402 simultaneously to provide sufficient lighting for the first optoelectronic chip 105 and the second optoelectronic chip 107, so that the imaging unit 201 can generate clear images A and B.

[0176] By providing an illumination beam to the first optoelectronic chip 105 and the second optoelectronic chip 107 through the illumination unit, the patterns on the first optoelectronic chip 105 and the second optoelectronic chip 107 can be clearly illuminated, thereby avoiding the situation where the first optoelectronic chip 105 and the second optoelectronic chip 107 are unevenly illuminated, thereby enabling the imaging unit 201 to generate clear images A and B, facilitating accurate control by the control unit 202, and saving the time spent on coupling the first optoelectronic chip 105 with the first optical element 104, and saving the time spent on coupling the second optoelectronic chip 107 with the second optical element 106.

[0177] Some devices include at least two lens modules. Only when the lens modules of the device are in a coupled state can the device work normally (realizing functions such as shooting and detection). Among them, the lens module is, for example, a module obtained by coupling an optical element with an optoelectronic chip, that is, the optical element in the lens module and the optoelectronic chip are in the best coupling state. For example, the transmitting lens module and the receiving lens module of the laser radar need to be placed in a preset position to ensure that the laser radar can work properly. For example, it is necessary to ensure that the optical axes of the transmitting lens module and the receiving lens module of the laser radar are parallel to ensure the normal operation of the laser radar. Furthermore, on the basis that the optical axes of the transmitting lens module and the receiving lens module are parallel, it is also necessary to ensure that the interval between the transmitting lens module and the receiving lens module is a preset value (for example, the interval is less than 3mm).

[0178] In view of this, the present application provides a schematic diagram of another coupling platform for coupling a first lens module and a second lens module.

[0179] As shown in FIG5 , the coupling platform 300 includes an imaging unit 301, a control unit 302, and an adjustment unit 303. The coupling platform 300 is used to couple a first lens module 501 and a second lens module 502. As shown in FIG5 , the first lens module 501 and the second lens module 502 can be placed on the coupling platform 300. Furthermore, the first lens module 501 and / or the second lens module 502 can be set on the adjustment unit 303.

[0180] The first lens module 501 is formed by coupling a third optical element and a third optoelectronic chip, while the second lens module 502 is formed by coupling a fourth optical element and a fourth optoelectronic chip. The third optical element is, for example, the first optical element 104, and the third optoelectronic chip is, for example, the first optoelectronic chip 105. The fourth optical element is, for example, the second optical element 106, and the fourth optoelectronic chip is, for example, the second optoelectronic chip 107.

[0181] Optionally, the first lens module 501 is a light emitting module, and the second lens module 502 is a receiving lens module; or, the first lens module 501 is a light receiving module, and the second lens module 502 is a transmitting lens module. For example, the light emitting module is used to generate and emit a detection beam, and the light receiving module is used to receive a beam reflected by a target object.

[0182] The third and fourth optoelectronic chips are placed under lighting conditions. In some embodiments, the third and fourth optoelectronic chips may be provided with patterns. In this case, when the third and fourth optoelectronic chips are placed under lighting conditions, the patterns on the third and fourth optoelectronic chips may be illuminated. Optionally, the lighting conditions may be provided by natural light or artificial light.

[0183] The first lens module 501 and the second lens module 502 are at equal distances from the imaging unit 301. For example, the distances between the center of mass of the first lens module 501 and the second lens module 502 and the center of mass of the imaging unit 301 can be set to be equal. For another example, the distances between the third optoelectronic chip and the fourth optoelectronic chip and the center of mass of the imaging unit 301 are equal. By controlling the distances between the first lens module 501 and the second lens module 502 and the imaging unit 301 to be equal, the sizes of the images of the light spots on the third optoelectronic chip and the fourth optoelectronic chip generated by the imaging unit 301 can be equal, which facilitates reasonable control by the control unit 302, thereby allowing the first lens module 501 and the second lens module 502 to quickly complete coupling. As a possible implementation, the control unit 302 adjusts the control position of the first lens module 501 and / or the second lens module 502 by controlling the adjustment unit so that the sizes of the images of the light spots on the third optoelectronic chip and the fourth optoelectronic chip are equal.

[0184] Optionally, the imaging unit 301 is used to receive a light beam and form an image based on the received light beam. For its definition and possible implementation, please refer to the detailed description of the imaging unit below. Exemplarily, the imaging unit 301 can be an image sensor, such as a CIS, or an RGB sensor, a monosensor, etc. As one possible implementation, the light beam received by the imaging unit 301 includes a light beam reflected by a pattern on the third optoelectronic chip. Therefore, the third image generated by the imaging unit 301 includes an image of the light spot on the third optoelectronic chip. As another possible implementation, the light beam received by the imaging unit 301 includes a light beam reflected by a pattern on a fourth optoelectronic chip. Therefore, the fourth image generated by the imaging unit 301 includes an image of the light spot on the fourth optoelectronic chip.

[0185] The control unit 302 is used to control the adjustment unit 303. For its definition and possible implementations, please refer to the detailed description of the control unit below. As one possible implementation, the control unit 302 can control the adjustment unit 303 based on the third image and the fourth image. For example, the control unit 302 generates corresponding control instructions by analyzing the image of the light spot on the third optoelectronic chip and the image of the light spot on the fourth optoelectronic chip, and uses them to control the adjustment unit 303. For example, the control unit 302 generates control instructions by analyzing the clarity of the image of the light spot on the third optoelectronic chip and the image of the light spot on the fourth optoelectronic chip. The control instructions are used to control the adjustment unit 303, causing the adjustment unit 303 to adjust the distance between the first lens module 501, the second lens module 502, and the imaging unit 301. For more detailed implementation details, please refer to the relevant description below.

[0186] The adjustment unit 303 is used to adjust the relative position and posture of the first lens module 501 and the second lens module 502. Its definition and possible implementation can be found in the detailed description of the adjustment unit below. Optionally, the adjustment unit 303 can adjust the position and / or posture of the first lens module 501 and the second lens module 502. Exemplarily, the adjustment unit 303 adjusts the relative position and posture of the first lens module 501 and the second lens module 502 based on the control instructions of the control unit 302, so that the image of the light spot on the third optoelectronic chip generated by the imaging unit 301 overlaps with the image of the light spot on the fourth optoelectronic chip, thereby completing the coupling of the first lens module 501 and the second lens module 502.

[0187] In short, the coupling platform simply requires the control unit to control the adjustment unit based on the third and fourth images, and then have the adjustment unit execute corresponding control instructions to adjust the relative position of the first lens module and the second lens module to complete the coupling of the first and second lens modules. This eliminates the need for complex power-up and power-down processes, making the operation simple and time-saving. It also enables automated assembly of optical products, reducing process time and improving assembly efficiency and hourly output.

[0188] Continuing with the nomenclature of "Image A" and "Image B" above, the image of the illuminated pattern on the third optoelectronic chip as formed in the imaging unit can be referred to as the image of the light spot on the third optoelectronic chip, abbreviated as "Image C." The image of the illuminated pattern on the fourth optoelectronic chip as formed in the imaging unit can be referred to as the image of the light spot on the fourth optoelectronic chip, abbreviated as "Image D."

[0189] The optical path in the coupling platform 300 is as follows: the light beam passes through the third optical element and illuminates the third optoelectronic chip. The light beam reflected by the pattern on the third optoelectronic chip passes through the third optical element again and is received by the imaging unit 301. The light beam passes through the fourth optical element and illuminates the fourth optoelectronic chip. The light beam reflected by the pattern on the fourth optoelectronic chip passes through the fourth optical element again and is received by the imaging unit 301. This is shown by the dotted line in FIG5 .

[0190] In one possible embodiment, the coupling platform 300 further includes a lighting unit, which is used to provide a lighting beam for the first lens module and the second lens module. Specifically, the lighting unit is used to provide a lighting beam for the third optoelectronic chip included in the first lens module and the fourth optoelectronic chip included in the second lens module. For its definition and possible implementation, please refer to the detailed introduction to the lighting unit below.

[0191] Please refer to FIG. 6 , which is a schematic diagram of another coupling platform provided in an embodiment of the present application. The coupling platform 300 includes an imaging unit 301 , a control unit 302 , an adjustment unit 303 and an illumination unit 601 .

[0192] As shown in Figure 6, the light beam provided by the lighting unit 601 enters the first lens module 501 and the second lens module 502, and illuminates the optoelectronic chips included in the first lens module 501 and the second lens module 502. The light beams reflected by the spot images on the two optoelectronic chips are received by the imaging unit 301.

[0193] In one possible lighting design, where the first lens module 501 includes a third optical element and a third optoelectronic chip, and the second lens module 502 includes a fourth optical element and a fourth optoelectronic chip, the optical path of the coupling platform 300 is as follows: the light beam provided by the illumination unit 601 passes through the third and fourth optical elements and is received by the third and fourth optoelectronic chips, respectively. The light beam reflected by the spot images on the third and fourth optoelectronic chips again passes through the third and fourth optical elements and is received by the imaging unit 301. The imaging unit 301 generates a third image and a fourth image, where the third image includes image C and the fourth image includes image D.

[0194] By providing an illumination beam to the first lens module 501 and the second lens module 502 through the illumination unit 601, the patterns on the third optoelectronic chip included in the first lens module 501 and the fourth optoelectronic chip included in the second lens module 502 can be clearly illuminated, thereby avoiding the situation where the third optoelectronic chip and the fourth optoelectronic chip are unevenly illuminated, thereby enabling the imaging unit 301 to generate clear images C and D, facilitating accurate control by the control unit 302, and saving time in coupling the first lens module 501 and the second lens module 502.

[0195] In order to clearly describe how the adjustment unit adjusts the relative posture between the optical element and the optoelectronic chip, the above-mentioned relative posture is further introduced in conjunction with the accompanying drawings.

[0196] Pose refers to the position and attitude of an object in space. For example, position refers to the position of the first optoelectronic chip 105 in space, or the position refers to the position of the center of mass of the first optoelectronic chip 105 in space. Attitude can refer to the orientation of the first optoelectronic chip 105 in space, or the direction of the optical axis of the first optoelectronic chip 105 in space. Relative pose refers to the relative position and attitude of two objects. It is easy to understand that the relative pose of two objects can be generated based on their position.

[0197] For example, the position and posture of an object in space can be represented by a coordinate system, such as a Cartesian coordinate system, a spherical coordinate system, or a cylindrical coordinate system, etc., which is not limited in this application. For ease of understanding, the embodiments of this application provide a possible coordinate system, as shown in Figure 7.

[0198] Please refer to Figure 7, which is a schematic diagram of a coordinate system provided in an embodiment of the present application, wherein the coordinate system includes an x-axis, a y-axis, and a z-axis. The origin of the coordinate system, the directions of the x-axis, the y-axis, and the z-axis can be predefined.

[0199] The posture of an optical product can be described by measuring its Euler angles relative to the coordinate system. For example, an optical product coordinate system is established with its center of mass as the origin. The x-axis is parallel to the optical axis of the optical product and points in the direction of light reception (or light emission). The y-axis is perpendicular to the optical axis and points to the left (or right) of the optical product. The z-axis is perpendicular to the x-axis and points upward (or downward) from the optical product. The angles through which the optical product rotates around the three axes of the optical product coordinate system are the pitch angle (x-axis), roll angle (y-axis), and yaw angle (z-axis). The relationship between the optical product and the coordinate system shown in Figure 7 is represented by three Euler angles, which reflect the posture of the optical product relative to the coordinate system. Euler angles are the simplest way to express rotation. Formally, they are three-dimensional vectors whose values ​​represent the rotation angles of the object around the three axes of the coordinate system (x, y, and z). These values ​​are called pitch, roll, and yaw, respectively, and can be translated as pitch, roll, and yaw.

[0200] The optical product is, for example, the first optical element 104, the first optoelectronic chip 105, the second optical element 106, or the second optoelectronic chip 107. Optionally, the optical product may also be the first lens module or the second lens module mentioned below.

[0201] For example, taking the center of mass of the first optical element 104 as the origin to establish an optical product coordinate system, the relative position of the first optical element 104 and the first optoelectronic chip 105 can be determined based on the coordinate value (0,0,0) of the first optical element 104, the three Euler angles of the first optical element 104, the coordinate value of the first optoelectronic chip 105 and the three Euler angles of the first optoelectronic chip 105.

[0202] For example, the three Euler angles of the first optical element 104 are (0°, 0°, 0°), the coordinate values ​​of the first optoelectronic chip 105 are (10, 5, 3), and the three Euler angles of the first optoelectronic chip 105 are (10°, -10°, 0°). Therefore, the relative position of the first optical element 104 and the first optoelectronic chip 105 is (10, 5, 3), and the relative posture of the first optical element 104 and the first optoelectronic chip 105 is (10°, -10°, 0°). The relative posture of the first optical element 104 and the first optoelectronic chip 105 can be represented by the relative position (10, 5, 3) and relative posture (10°, -10°, 0°).

[0203] Optionally, the units of the three coordinate axes in the above optical product coordinate system may be micrometers (um), millimeters (mm), centimeters (cm) or meters (m), which is not limited in this application.

[0204] In the same way, the relative position of the second optical element 106 and the second optoelectronic chip 107 can be determined, and the relative position of the first lens module and the second lens module described below can also be determined.

[0205] It should be noted that the above method for determining relative posture is exemplary and does not constitute a limitation to this application.

[0206] As can be seen from the above, the accuracy of optical product coupling affects the clarity of the image in the imaging unit. Therefore, the clarity of the image generated by the imaging unit when the optical products are in different relative positions can be measured, and the relative position of the optical products can be adjusted based on data such as image clarity, thereby achieving optical product coupling. To this end, this application provides a method for measuring image clarity.

[0207] Please refer to Figure 8A, which is a schematic diagram of a method for measuring image clarity provided in an embodiment of the present application, which is used to measure the clarity (also known as resolution) of an image generated by an imaging unit of an optical product at different relative postures.

[0208] As shown in FIG8A , FIG8A includes an imaging unit, an optical element, and an optoelectronic chip. The imaging unit is, for example, the imaging unit 101, the imaging unit 201, or the imaging unit 301 described above; the optical element is, for example, the first optical element 104 or the second optical element 106 described above; and the optoelectronic chip is, for example, the first optoelectronic chip 105 or the second optoelectronic chip 107 described above.

[0209] Please refer to Figure 8B, which is a schematic diagram of a light spot image on a photoelectric chip provided in an embodiment of the present application. The light spot image shown in Figure 8B is, for example, the imaging of the pattern on the photoelectric chip shown in Figure 8A in the imaging unit. In order to obtain the clarity of the image generated by the imaging unit when the optical product is in different relative postures, one or more points can be preset on the image generated by the imaging unit as sampling points for clarity. As shown in Figure 8B, points A, B, C, D and E are preset as sampling points for the image clarity of the light spot on the photoelectric chip, where point E is the center point of the image of the light spot on the chip, and points A, B, C and D are the edges of the light spot image, respectively.

[0210] When the optical product is in different relative positions, the imaging unit can generate images with the same pattern but different clarity, or it can generate images with different patterns but the same clarity. To facilitate measurement, the imaging unit should ensure that the pattern generated is the same when the optical product is in different relative positions. For example, adjusting the spacing between the optical element and the optoelectronic chip along the optical axis of the imaging unit can ensure that the pattern generated by the imaging unit is the same.

[0211] A possible implementation method is to adjust the distance between the optoelectronic chip and the optical element in the direction of the optical axis of the imaging unit, and enable the imaging unit to generate images corresponding to different spacings. Furthermore, the clarity of each image at point A, point B, point C, point D, and point E is obtained respectively, thereby generating a curve graph showing the change in clarity of each point with the distance between the optoelectronic chip and the optical element (also called the defocus curve corresponding to each point). Based on the defocus curve graph, the optimal clarity of the image and the distance between the optoelectronic chip and the optical element when the image is at the optimal clarity can be obtained. This application does not limit how to express clarity. For example, the clarity of the image can be expressed by SFR value or MTF value.

[0212] Exemplarily, as shown in FIG8A , the position of the optoelectronic chip is adjusted along the optical axis of the imaging unit to position A, position B (the focal plane of the optical element), …, and position N, where N is an integer greater than 2. The imaging unit generates images of the light spot on the optoelectronic chip when the optoelectronic chip is at position A, position B, …, and position N, respectively, and further generates defocus curves for multiple points based on preset sampling points (for example, point A, point B, point C, point D, and point E shown in FIG8B ).

[0213] Optionally, adjusting the distance between the optoelectronic chip and the optical element in the optical axis direction of the imaging unit can be achieved by:

[0214] Method 1: Adjust the position of the optoelectronic chip in the optical axis direction of the imaging unit.

[0215] Method 2: Adjust the position of the optical element in the optical axis direction of the imaging unit.

[0216] Method three: adjusting the positions of the optical element and the optoelectronic chip in the optical axis direction of the imaging unit.

[0217] This application does not limit how to adjust the distance between the optoelectronic chip and the optical element in the optical axis direction of the imaging unit.

[0218] Please refer to Figure 8C, which is a schematic diagram of a defocus curve provided in an embodiment of the present application. As shown in Figure 8C, the horizontal axis is used to represent the distance between the optical element and the optoelectronic chip, and the vertical axis is used to represent the clarity (MTF). Figure 8C shows the defocus curves corresponding to points A, B, C, D and E. As shown in Figure 8C, the MTF values ​​of the best clarity of imaging of points A, B, C, D and E in the imaging unit are all 70% (in actual implementation, the best imaging clarity of multiple points may be different). When the distance between the optical element and the optoelectronic chip is 1.78 mm, the defocus curve corresponding to point E indicates that the imaging of point E in the imaging unit has the best clarity. Since point E is the center point of the image of the light spot on the optoelectronic chip, the distance between the optical element and the optoelectronic chip at point E at the best clarity can be used as the focal length of the optical element, and the focal plane of the optical element can be calculated.

[0219] It should be noted that, in the specific implementation process, other methods may also be used to obtain the clarity of the imaging unit's imaging, and the embodiments of the present application do not limit this.

[0220] Next, the imaging unit, control unit, adjustment unit and lighting unit provided in this application are introduced in turn.

[0221] 1. Imaging unit

[0222] The imaging unit is, for example, the imaging unit 101, imaging unit 201, or imaging unit 301 described above. The imaging unit includes an imaging optical element and an image sensor. The imaging optical element is configured to capture a light beam reflected by a pattern on an optoelectronic chip (e.g., the first optoelectronic chip 105, the second optoelectronic chip 107, the third optoelectronic chip, or the fourth optoelectronic chip), and the image transmitter is configured to generate an image based on the light beam captured by the imaging optical element.

[0223] In a possible implementation, the angular resolution of the imaging optical element is greater than or equal to X times the angular resolution of the optical element to be coupled, where X is an integer greater than or equal to 5.

[0224] The optical element to be coupled is, for example, the first optical element 104 , the second optical element 106 , the third optical element or the fourth optical element.

[0225] For example, if X=10, the angular resolution of the imaging optical element is greater than or equal to 10 times the angular resolution of the optical element to be coupled. For example, if the angular resolution of the optical element to be coupled is 8 pixels per degree (PPD), the angular resolution of the imaging optical element must be at least 80 PPD.

[0226] Optionally, the focal length of the imaging optical element is greater than or equal to 80 mm, for example, the focal length of the imaging optical element is 80 mm, 200 mm, 300 mm, or 500 mm.

[0227] Optionally, the imaging optical element is, for example, a telephoto lens or a collimator. The telephoto lens has a focal length greater than or equal to 80 mm, such as 100 mm, 300 mm, or 500 mm. The collimator has a focal length greater than or equal to 200 mm, such as 200 mm, 300 mm, 600 mm, or 800 mm.

[0228] Optionally, the focal length of the imaging optical element is related to the properties of the optical product to be coupled.

[0229] For example, the focal length of the imaging optical element is related to the size of the pixels on the optoelectronic chip in the optical product to be coupled. If the area occupied by the pixels on the optoelectronic chip is large, an imaging optical element with a short focal length can be used; if the area occupied by the pixels on the optoelectronic chip is small, an imaging optical element with a long focal length can be used. This ensures that the size of the light spot image on the optoelectronic chip in the image generated by the imaging unit is moderate, making it easier to interpret. This avoids the situation where the pixels on the optoelectronic chip appear too small or too large in the imaging unit, which can lead to inaccurate or difficult interpretation.

[0230] In a possible implementation, the imaging unit is a high-resolution detector.

[0231] Exemplarily, the resolution of the imaging unit is greater than or equal to 1080 pixels per inch (PPI). For example, the resolution of the imaging unit is 1080 PPI, 2056 PPI, or 4080 PPI. The imaging unit is a high-resolution detector that can make the image generated by the imaging unit clearer, making it easier for the control unit to analyze and process the image, thereby generating accurate control instructions and improving assembly accuracy (coupling accuracy).

[0232] Optionally, the imaging unit also has the capability of low-light detection.

[0233] Exemplarily, the minimum brightness that the imaging unit can capture is 1 lux (illumination / illuminance). For example, the minimum brightness that the imaging unit can capture is 10 lux or 25 lux. The imaging unit has low-light detection capabilities, enabling it to generate an image of the light spot on the optoelectronic chip at lower light intensities, avoiding the situation where the image of the light spot on the optoelectronic chip cannot be generated, and expanding the application scenarios of the coupling platform.

[0234] 2. Control unit

[0235] The control unit may be implemented as the control unit 102, the control unit 202, or the control unit 302. The control unit is used to process the image generated by the imaging unit and generate control instructions for controlling the adjustment unit based on the processing results. For example, it may include one or more of the following forms:

[0236] In the first embodiment, the control unit sends a control instruction to the adjustment unit, instructing it to adjust the spacing between the optical element and the optoelectronic chip in the optical product along the axis of the imaging unit. The control unit then obtains a defocus curve for the optical element based on the multiple images generated by the imaging unit. For a detailed description of the implementation, please refer to the description of Figures 8A-8C above and will not be repeated here.

[0237] Form 2: Based on the size of the image of the light spot on the photoelectric chip, the distance between the photoelectric chip and the imaging unit is controlled.

[0238] For example, if the image of the pattern on the optoelectronic chip is too small in the imaging unit, the distance between the optoelectronic chip and the imaging unit can be reduced. Another example is if the image of the optoelectronic chip is too large in the imaging unit, the distance between the optoelectronic chip and the imaging unit can be increased. This approach ensures that the image of the light spot on the optoelectronic chip is of moderate size, facilitating subsequent analysis and processing.

[0239] Form three: Based on the clarity of the image of the light spot on the optoelectronic chip, the relative position of the optoelectronic chip and the imaging unit is controlled so that the clarity of the image of the light spot on the optoelectronic chip is optimal.

[0240] Referring to Figure 8C above, the spacing between the optoelectronic chip and the optical element along the optical axis is first adjusted to optimize the image clarity at point E. Then, by adjusting one or more of the pitch, roll, and yaw angles, the images at points A, B, C, and D are optimized, completing the coupling between the optoelectronic chip and the optical element.

[0241] Form 4: Based on the size of the image of the light spot on the optoelectronic chip in the two lens modules and the position in the imaging unit, the relative posture of the two lens modules is controlled so that the size of the image of the light spot on the optoelectronic chip in the two lens modules and the position in the imaging unit are the same, thereby completing the coupling of the two lens modules.

[0242] It should be noted that the two lens modules can be the first lens module 501 and the second lens module 502, and the two lens modules can also be the lens module obtained by coupling the first optical element 104 with the first optoelectronic chip 105, and the lens module obtained by coupling the second optical element 106 with the second optoelectronic chip 107.

[0243] In one possible implementation, the control unit can be implemented in the form of a processor calling software. For example, the device includes a processor, the processor is connected to a memory, and instructions are stored in the memory. The processor calls the instructions stored in the memory to implement any of the above control forms or to implement the functions of each unit of the device, wherein the processor is, for example, a general-purpose processor, such as a central processing unit (CPU) or a microprocessor, and the memory is a memory within the device or a memory outside the device. Alternatively, the units in the device can be implemented in the form of hardware circuits, and the functions of some or all units can be implemented by designing the hardware circuits. The hardware circuit can be understood as one or more processors. For example, the hardware circuit is an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a field programmable gate array (FPGA).

[0244] 3. Adjustment unit

[0245] The adjusting unit is, for example, the adjusting unit 103, the adjusting unit 203 or the adjusting unit 303 in the above embodiment. The adjusting unit is used to adjust the relative positions of the optical products to be coupled, thereby completing the coupling between the optical products to be coupled.

[0246] In one possible embodiment, the adjustment unit includes a three-dimensional adjustment frame and / or a six-dimensional adjustment frame. The three-dimensional adjustment frame can realize the adjustment of the object in three dimensions, and the six-dimensional adjustment frame can realize the adjustment of the object in six dimensions. In conjunction with Figure 7 above, the three-dimensional adjustment frame can adjust the values ​​of the object in any three dimensions of the x-axis, y-axis, z-axis, pitch angle, roll angle and yaw angle. For example, the three-dimensional adjustment frame can adjust the values ​​of the object in the x-axis, y-axis and z-axis. For another example, the three-dimensional adjustment frame can adjust the values ​​of the object in the pitch angle, roll angle and yaw angle. The six-dimensional adjustment frame can adjust the values ​​of the object in the x-axis, y-axis, z-axis, pitch angle, roll angle and yaw angle.

[0247] Taking the products to be coupled as the first optical element 104 and the first optoelectronic chip 105 as an example, the adjustment unit can have the following combinations:

[0248] Combination 1. The adjustment unit is a six-dimensional adjustment frame, and the adjustment unit adjusts the relative posture of the first optical element 104 and the first optoelectronic chip 105 by adjusting the posture of the first optical element 104 and the first optoelectronic chip 105.

[0249] Combination 2. The adjustment unit is two six-dimensional adjustment frames, and the adjustment unit adjusts the posture of the first optical element 104 and the first optoelectronic chip 105 respectively through the two six-dimensional adjustment frames to adjust the relative posture of the first optical element 104 and the first optoelectronic chip 105.

[0250] Combination 3. The adjustment unit is two three-dimensional adjustment frames, and the adjustment unit adjusts the posture of the first optical element 104 and the first optoelectronic chip 105 respectively through the two three-dimensional adjustment frames to adjust the relative posture of the first optical element 104 and the first optoelectronic chip 105.

[0251] Optionally, when the products to be coupled are the second optical element 106 and the second optoelectronic chip 107, or when the products to be coupled are the first lens module 501 and the second lens module 502, the specific implementation of the adjustment unit can refer to the above corresponding content and will not be repeated here.

[0252] Optionally, when the product to be coupled includes the first optical element 104 and the first optoelectronic chip 105, and the second optical element 106 and the second optoelectronic chip 107, the adjustment unit may be two six-dimensional adjustment frames, three six-dimensional adjustment frames, four six-dimensional adjustment frames, or four three-dimensional adjustment frames. For example, when the adjustment unit is two six-dimensional adjustment frames, the two six-dimensional adjustment frames are used to adjust the posture of the first optical element 104 and the second optical element 106, or the two six-dimensional adjustment frames are used to adjust the posture of the first optical element 104 and the second optoelectronic chip 107, or the two six-dimensional adjustment frames are used to adjust the posture of the first optoelectronic chip 105 and the second optical element 106, or the two six-dimensional adjustment frames are used to adjust the posture of the first optoelectronic chip 105 and the second optoelectronic chip 107. For the specific implementation of how the adjustment unit performs adjustment when the adjustment unit is in other combinations, please refer to the relevant description above and will not be introduced here one by one.

[0253] In a possible implementation, the adjustment unit is used to adjust the spatial position of the optical product to be coupled.

[0254] Taking the coupled products as the first optical element 104 and the first optoelectronic chip 105 as an example, the adjustment unit is used to adjust the spatial position of the first optical element 104 and / or the first optoelectronic chip 105. For example, the adjustment unit is a six-dimensional adjustment frame for adjusting the spatial position of the first optical element 104 and / or the first optoelectronic chip 105. In another example, the adjustment unit is two six-dimensional adjustment frames for adjusting the spatial position of the first optical element 104 and the first optoelectronic chip 105, respectively. In another example, the adjustment unit is two three-dimensional adjustment frames for adjusting the spatial position of the first optical element 104 and the first optoelectronic chip 105, respectively.

[0255] Taking the second optical element 106 and the second optoelectronic chip 107 as an example, the adjustment unit is used to adjust the spatial position of the second optical element 106 and / or the second optoelectronic chip 107. For specific implementation, please refer to the above description of the first optical element 104 and the first optoelectronic chip 105 as the products to be coupled, and will not be repeated here.

[0256] Taking the coupled products as the first lens module 501 and the second lens module 502 as an example, the adjustment unit is used to adjust the spatial position of the first lens module 501 and / or the second lens module 502. For specific implementation, please refer to the above description of the coupled products as the first optical element 104 and the first optoelectronic chip 105, and will not be repeated here.

[0257] 4. Lighting unit

[0258] The lighting unit is, for example, the lighting unit 108, lighting unit 109, lighting unit 401, lighting unit 402, or lighting unit 601. The lighting unit is used to provide an illumination beam to the optoelectronic chip, so that the imaging unit can clearly observe the illuminated pattern on the optoelectronic chip, facilitate accurate control by the control unit, and help save coupling time.

[0259] In a possible implementation, the lighting unit includes any one or more of the following: an optical fiber, an optical lens, an optical fiber, frosted glass, or a reflector.

[0260] The optical fiber and frosted glass can form a floodlight, which, combined with a reflector, can illuminate the optoelectronic chip. Due to its small size, the optical fiber can directly transmit the light beam to the optoelectronic chip and illuminate it.

[0261] Optionally, the lighting unit 108, lighting unit 401 and lighting unit 601 are composed of, for example, optical fibers, frosted glass and reflectors to provide a floodlight source. This approach is simple to operate and has low production costs, which helps save the cost of the coupling platform.

[0262] Optionally, lighting unit 108, lighting unit 401, and lighting unit 601 may be composed of, for example, an optical fiber, an optical lens, and a reflector, and may be used to provide a directional light source. This method provides a fixed light source, which can increase the light intensity received by the optoelectronic chip. This avoids situations where the imaging unit receives low light intensity reflected by the optoelectronic chip due to a small aperture of the optical element or a weak reflective ability of the optoelectronic chip, thereby ensuring that the imaging unit can clearly image the illuminated pattern on the optoelectronic chip.

[0263] Optionally, the lighting unit 109 and the lighting unit 402 are composed of optical fibers, for example.

[0264] One possible implementation method is to select a suitable light source based on the properties of the optical product to be coupled, which may include one or more of the following situations:

[0265] In case 1, a suitable light source can be selected based on the aperture of the optical element in the optical product to be coupled.

[0266] For example, when the aperture of the optical element is large, a floodlight source can be selected. For example, a lighting unit consisting of an optical fiber, frosted glass, and a reflector can be used to generate a floodlight source and provide an illumination beam for the optoelectronic chip. Please refer to FIG9A , which is a schematic diagram of a lighting unit provided in an embodiment of the present application. As shown in FIG9A , FIG9A includes an optical fiber, frosted glass, and a reflector. The optical fiber and frosted glass form a floodlight source, and the floodlight beam provided by the floodlight source is reflected by the reflector, thereby illuminating the optoelectronic chip.

[0267] For example, when the aperture of the optical element is small, a directional light source can be selected for illumination. For example, a lighting unit consisting of an optical fiber, an optical lens, and a reflector is used to generate a directional light source and provide an illumination beam for the optoelectronic chip. Please refer to Figure 9B, which is a schematic diagram of another lighting unit provided in an embodiment of the present application. As shown in Figure 9B, Figure 9B includes an optical fiber, an optical lens, and a reflector. The optical fiber and the optical lens constitute a directional light source. The directional light beam provided by the directional light source is reflected by the reflector, thereby illuminating the optoelectronic chip.

[0268] In the second case, a suitable light source can be selected based on the reflective ability of the optoelectronic chip in the optical product to be coupled.

[0269] For example, if the optoelectronic chip has a strong reflective capability, a floodlight source can be used. For example, a lighting unit composed of optical fiber, frosted glass, and a reflector can be used to generate a floodlight source and provide an illumination beam for the optoelectronic chip. For specific implementations, please refer to the description of FIG. 9A above.

[0270] For example, if the optoelectronic chip has a weak reflective capability, a directional light source can be used for illumination. For example, a lighting unit consisting of an optical fiber, an optical lens, and a reflector can be used to generate a directional light source and provide an illumination beam for the optoelectronic chip. For specific implementations, please refer to the description of FIG. 9B above.

[0271] The embodiment of the present application does not limit the illumination intensity of the optical fiber or optical fiber in the lighting unit. The light beam intensity provided by the lighting unit is sufficient so that the light beam reflected by the optoelectronic chip can meet the requirements of the imaging unit for clear imaging.

[0272] In the above description, the optical components (e.g., the first optical component 104, the second optical component 106, the third optical component, or the fourth optical component) or optoelectronic chips (e.g., the first optoelectronic chip 105, the second optoelectronic chip 107, the third optoelectronic chip, or the fourth optoelectronic chip) included in the optical product to be coupled are all independent. In some scenarios, two optical components or two optoelectronic chips may be rigidly connected. For example, the first optical component 104 may be rigidly connected to the second optical component 106, or the first optoelectronic chip 105 may be rigidly connected to the second optoelectronic chip 107.

[0273] It is understandable that when coupling multiple sets of optical products (for example, the coupling platform 200 can simultaneously couple the first optical element 104 with the first optoelectronic chip 105, and the second optical element 106 with the second optoelectronic chip 107), the optical elements and / or optoelectronic chips to be coupled are rigidly connected, so that the adjustment unit can simultaneously adjust the positions of multiple optical elements (for example, the first optical element 104 and the second optical element 106) and / or multiple optoelectronic chips (for example, the first optoelectronic chip 105 and the second optoelectronic chip 107), thereby reducing the process time of the optical product assembly process, improving the assembly efficiency and the hourly output of the optical product. For specific implementation methods, please refer to the description of the relevant embodiments below and will not be described in detail here.

[0274] In other scenarios, there are also situations where multiple optical elements or multiple optoelectronic chips are rigidly connected. This application will not give examples one by one. The coupling scenario where multiple optical elements and / or multiple optoelectronic chips are connected can refer to the coupling scenario where two optical elements and / or two optoelectronic chips are connected.

[0275] The above contents respectively introduce the coupling platform 100, the coupling platform 200 and the coupling platform 300. Next, the coupling method provided in the present application is introduced and applied to the above coupling platforms to achieve coupling of optical products to be coupled.

[0276] Please refer to Figure 10, which is a schematic diagram of a coupling method provided in an embodiment of the present application, for coupling a first optical element and a first optoelectronic chip, with the first optoelectronic chip being placed under illumination conditions. As shown in Figure 10, the coupling method described in Figure 10 includes steps S1001 and S1002, and is applied to the coupling platform 100 or coupling platform 200 described above. The details are as follows:

[0277] Step S1001: The coupling platform receives a light beam passing through a first optical element and generates a first image.

[0278] The coupling platform is, for example, the coupling platform 100 or the coupling platform 200. For an introduction to coupling platform 100, reference may be made to the description of FIG. 1 or FIG. 2 , and will not be repeated here. For an introduction to coupling platform 200, reference may be made to the description of FIG. 3 or FIG. 4 , and will not be repeated here.

[0279] In a possible implementation, the imaging unit in the coupling platform receives the light beam passing through the first optical element and generates a first image.

[0280] Exemplarily, the imaging unit 101 in the coupling platform 100 receives a light beam passing through the first optical element and generates a first image. The light beam received by the imaging unit 101 includes a light beam reflected by the illuminated pattern on the first optoelectronic chip, and the first image includes image A. For an introduction to the imaging unit 101, reference may be made to the corresponding content above and will not be repeated here. The first optical element is, for example, the first optical element 104 shown in FIG. 1 or FIG. 2 , and the first optoelectronic chip is, for example, the first optoelectronic chip 105 shown in FIG. 1 or FIG. 2 . For an introduction to the first optical element 104 and the first optoelectronic chip 105, reference may be made to the relevant description in FIG. 1 or FIG. 2 , and will not be repeated here.

[0281] Exemplarily, the imaging unit 201 in the coupling platform 200 receives a light beam passing through the first optical element and generates a first image. The light beam received by the imaging unit 201 includes a light beam reflected by the illuminated pattern on the first optoelectronic chip, and the first image includes an image of the light spot on the first optoelectronic chip. For an introduction to the imaging unit 201, reference may be made to the corresponding content above, which will not be repeated here. The first optical element is, for example, the first optical element 104 shown in FIG. 3 or FIG. 4 , and the first optoelectronic chip is, for example, the first optoelectronic chip 105 shown in FIG. 3 or FIG. 4 . For an introduction to the first optical element 104 and the first optoelectronic chip 105, reference may be made to the relevant description in FIG. 3 or FIG. 4 , which will not be repeated here.

[0282] It should be noted that the coupling platform 200 is used to simultaneously couple two sets of optical products. For example, the coupling platform 200 is used to simultaneously couple the first optical element 104 and the first optoelectronic chip 105, and the second optical element 106 and the second optoelectronic chip 107. However, in some scenarios, the coupling platform 200 may also be used to couple a set of optical products. For example, the coupling platform 200 is used to couple the first optical element 104 and the first optoelectronic chip 105, or the coupling platform 200 is used to couple the second optical element 106 and the second optoelectronic chip 107.

[0283] Step S1002: The coupling platform adjusts the relative position of the first optoelectronic chip and the first optical element.

[0284] In a possible implementation, a control unit in the coupling platform controls an adjustment unit in the coupling platform based on the first image, and the adjustment unit adjusts the relative position of the first optoelectronic chip and the first optical element based on a control instruction of the control unit.

[0285] The control unit is, for example, the control unit 102 or the control unit 202. If the control unit is the control unit 102, the adjustment unit is the adjustment unit 103; if the control unit is the control unit 202, the adjustment unit is the adjustment unit 203. For a detailed description of the control unit 102, the control unit 202, the adjustment unit 103, or the adjustment unit 203, please refer to the corresponding descriptions of Figures 1-4 above and will not be repeated here.

[0286] Optionally, the control unit can obtain the defocus curve of the first optical element based on the first image. The specific implementation process can refer to the relevant description of Figures 8A to 8C above, which will not be repeated here. The above-mentioned acquisition of the defocus curve of the first optical element can be to obtain the defocus curves of multiple points, for example, the defocus curves corresponding to point A, point B, point C, point D and point E. It should be noted that the defocus curve is a graph used to represent the relationship between imaging clarity and the distance between the object and the focal plane. In the specific implementation process, it can also be represented by other means such as tables, matrices, databases, etc. to represent the relationship between imaging clarity and the distance between the object and the focal plane. Furthermore, the storage form and representation form of the defocus curve in the control unit are not limited by this application. Being able to obtain the focal plane of the first optical element based on the first image falls within the scope of protection of this application.

[0287] After obtaining the defocus curve and calculating the focal plane of the first optical element, the control unit can control the adjustment unit to allow the adjustment unit to adjust the relative position of the first optoelectronic chip and the first optical element so that the first optoelectronic chip is in the focal plane of the first optical element, thereby completing the coupling of the first optoelectronic chip and the first optical element. In conjunction with Figure 8B above, the focal plane of the first optical element can be a plane determined based on the optimal clarity of point A, point B, point C, point D, or point E. For example, if the spacing corresponding to the optimal clarity of point E is 1.78 mm, then the focal distance of the first optical element determined based on the optimal clarity of point E is 1.78 mm, and the focal plane of the first optical element is the plane containing the focus.

[0288] Next, several possible adjustment methods are exemplarily shown in conjunction with FIG. 7 :

[0289] It should be noted that all control instructions issued by the adjustment unit in the following description are issued by the control unit. For the sake of fluency and brevity, the following description focuses on the adjustment unit as the main body performing the adjustment action, and the description of the control unit issuing the control instructions is not shown. Therefore, it should not be understood that the control unit does not issue any control instructions or perform any actions during the adjustment process.

[0290] Adjustment method 1: The adjustment unit adjusts the axial distance (z-axis direction) between the first optical element and the first optoelectronic chip so that a certain position of the first optoelectronic chip is located in the focal plane of the first optical element.

[0291] Based on the information shown in Figures 8A-8C above, the focal plane of the first optical element can be obtained. By adjusting the axial spacing between the first optical element and the first optoelectronic chip, a certain position of the first optoelectronic chip can be positioned within the focal plane of the first optical element. In conjunction with Figure 8B , by adjusting the axial spacing between the first optical element and the first optoelectronic chip, point E of the first optoelectronic chip can be positioned within the focal plane of the first optical element, i.e., the spacing between the optical element and the optoelectronic chip is 1.78 mm.

[0292] It should be noted that the above-mentioned adjustment of the axial spacing between the first optical element and the first optoelectronic chip can be achieved by adjusting the position of the first optical element in the x-axis direction, or by adjusting the position of the first optoelectronic chip in the x-axis direction, or by jointly adjusting the positions of the first optical element and the first optoelectronic chip in the x-axis direction.

[0293] Adjustment Method 2: The adjustment unit can also adjust the relative positions of the first optical element and the first optoelectronic chip in the vertical, horizontal, and horizontal directions so that the imaging unit can generate a complete image of the light spot on the first optoelectronic chip. See Figure 11A, which is a schematic diagram of a coupling process provided in an embodiment of the present application, illustrating a situation where the imaging unit cannot generate a complete light spot on the first optoelectronic chip.

[0294] As shown in Figure 11A, the first optical element and the first optoelectronic chip do not completely overlap. For example, the first optical element and the first optoelectronic chip do not completely overlap in the y-axis direction, and / or the first optical element and the first optoelectronic chip do not completely overlap in the z-axis direction. The area of ​​the first optoelectronic chip that overlaps with the first optical element is referred to as Area 1. The area of ​​the first optoelectronic chip that does not overlap with the first optical element is referred to as Area 2. As can be seen in Figure 11A, the light beam reflected by Area 1 can pass through the first optical element and be received by the imaging unit. Since Area 2 does not overlap with the first optical element, the light beam reflected by Area 2 cannot pass through the first optical element and thus be received by the imaging unit. Therefore, the first image generated by the imaging unit may not include the entire image of the pattern on the first optoelectronic chip. By adjusting the relative positions of the first optical element and the first optoelectronic chip in the vertical, horizontal, and horizontal directions, the first image can include the entire image of the pattern on the first optoelectronic chip. It should be noted that Area 2 shown in Figure 11A may not be illuminated because it does not overlap with the first optical element, resulting in Area 2 not reflecting the light beam and, consequently, not including the entire image of the pattern on the first optoelectronic chip in the first image.

[0295] Please refer to Figure 11B, which is another coupling process schematic diagram provided in an embodiment of the present application, used to show that the first optical element and the first optoelectronic chip completely overlap in the up and down (z-axis direction) and / or left and right (y-axis direction).

[0296] As shown in FIG11B , the first optical element and the first optoelectronic chip shown in FIG11B completely overlap, so that the light beam reflected by area 2 on the first optoelectronic chip can be received by the imaging unit, or, the light beam reflected by area 2 on the first optoelectronic chip can be illuminated, so that the light beam reflected by it can also be received by the imaging unit.

[0297] It should be noted that the above-mentioned adjustment of the relative position of the first optical element and the first optoelectronic chip in the up, down, left and right directions can be achieved by adjusting the position of the first optical element in the y-axis direction and / or the z-axis direction, or by adjusting the position of the first optoelectronic chip in the y-axis direction and / or the z-axis direction, or by jointly adjusting the positions of the first optical element and the first optoelectronic chip in the y-axis direction and / or the z-axis direction.

[0298] Adjustment Method 3: The adjustment unit can also adjust the Euler angles between the first optical element and the first optoelectronic chip so that the first optoelectronic chip is in the focal plane of the first optical element. See Figure 12A, which is a schematic diagram of another coupling process provided in an embodiment of the present application, illustrating a situation where the Euler angles of the first optical element and the first optoelectronic chip are inconsistent.

[0299] As shown in FIG12A , the Euler angles of the first optical element and the first optoelectronic chip are inconsistent. For example, one or more of the roll angles or yaw angles of the first optical element and the first optoelectronic chip are inconsistent, which will result in inconsistent clarity of the image of the pattern on the first optoelectronic chip in the imaging unit. As shown in FIG12A , the light beams reflected from points A, C, and E on the optoelectronic chip are respectively shown, where points A and C are not located in the focal plane of the first optical element, and point E is located in the focal plane of the first optical element. Therefore, the clarity of the corresponding images of points A and C in the imaging unit will be lower than the clarity of the corresponding image of point E in the imaging unit. By adjusting the Euler angles of the first optical element and the first optoelectronic chip, the first optoelectronic chip can be located in the focal plane of the first optical element, so that the image of the pattern on the first optoelectronic chip in the imaging unit has optimal clarity, and the clarity of the image of each position on the first optoelectronic chip in the imaging unit is consistent.

[0300] For another example, the angle at which the pattern on the first optoelectronic chip is imaged in the imaging unit may be adjusted by adjusting the pitch angle of the first optoelectronic chip (rotating around the optical axis).

[0301] Please refer to FIG. 12B , which is a schematic diagram of an imaging method provided in an embodiment of the present application, and is used to illustrate the imaging of the illuminated pattern on the first optoelectronic chip in the imaging unit.

[0302] As shown in Figure 12B , Figure 12B (a) shows the image of the pattern on the first optoelectronic chip in the imaging unit before adjusting the pitch angle of the first optoelectronic chip. Figure 12B (b) shows the image of the pattern on the first optoelectronic chip in the imaging unit after adjusting the pitch angle of the first optoelectronic chip. It can be understood that by adjusting the pitch angle of the first optoelectronic chip, the angle of Image A can be adjusted.

[0303] Please refer to FIG. 12C , which is another schematic diagram of a coupling process provided in an embodiment of the present application, and is used to illustrate the situation where the Euler angles of the first optical element and the first optoelectronic chip are consistent.

[0304] As shown in FIG12C , the Euler angles of the first optical element and the first optoelectronic chip are consistent, and the first optoelectronic chip is located in the focal plane of the first optical element. This ensures that the image of the light spot on the first optoelectronic chip has optimal clarity, and the clarity of the images at various locations on the first optoelectronic chip (points A, C, and E) in the imaging unit is consistent. Furthermore, the image of the light spot on the first optoelectronic chip can be made consistent with a preset image.

[0305] It should be noted that the above-mentioned adjustment of the Euler angle of the first optical element and the first optoelectronic chip can be achieved by adjusting the Euler angle of the first optical element, or by adjusting the Euler angle of the first optoelectronic chip, or by jointly adjusting the Euler angle of the first optical element and the first optoelectronic chip.

[0306] Optionally, in a specific adjustment process, the execution order of the above three adjustment methods is not limited.

[0307] For example, adjustment method 1 can be performed first to ensure that a certain position of the first optoelectronic chip is located in the focal plane of the first optical element. Adjustment method 2 can then be performed to ensure that the entire light spot of the first optoelectronic chip is generated on the imaging unit. Finally, adjustment method 3 can be performed to ensure that the entire first optoelectronic chip is located in the focal plane of the first optical element, thereby completing the coupling.

[0308] For another example, adjustment method 2 can be first performed to generate a complete light spot of the first optoelectronic chip on the imaging unit. Adjustment method 1 can then be performed to ensure that a certain position of the first optoelectronic chip is located in the focal plane of the first optical element. Finally, adjustment method 3 can be performed to ensure that the entire first optoelectronic chip is located in the focal plane of the first optical element, thereby completing the coupling.

[0309] For another example, adjustment method 3 can be first performed to ensure that the first optoelectronic chip is perpendicular to the optical axis of the first optical element. Adjustment method 2 can then be performed to ensure that a complete light spot of the first optoelectronic chip is generated on the imaging unit. Finally, adjustment method 1 can be performed to ensure that the entire first optoelectronic chip is located in the focal plane of the first optical element, thereby completing the coupling.

[0310] Optionally, in a specific adjustment process, the above three adjustment methods can be adjusted in sequence, or multiple adjustment methods can be adjusted simultaneously.

[0311] For example, adjustment method 1 and adjustment method 2 can be executed simultaneously, adjustment method 2 and adjustment method 3 can be executed simultaneously, adjustment method 1 and adjustment method 3 can be executed simultaneously, and adjustment method 1, adjustment method 2 and adjustment method 3 can be executed simultaneously.

[0312] The above describes by way of example how to couple a set of optical products (e.g., the first optical element 104 and the first optoelectronic chip 105). Next, the following describes by way of example how to simultaneously couple two or more sets of optical products. For example, the coupling platform 200 can simultaneously couple the first optical element 104 and the first optoelectronic chip 105, and the second optical element 106 and the second optoelectronic chip 107.

[0313] Please refer to Figure 13, which is a schematic diagram of another coupling method provided in an embodiment of the present application, for simultaneously coupling a first optical element and a first optoelectronic chip, and a second optical element and a second optoelectronic chip, with the first optoelectronic chip and the second optoelectronic chip being placed under illumination conditions. As shown in Figure 13, the coupling method described in Figure 13 includes steps S1301 and S1302, and is applied to the coupling platform 200 described above. A detailed description is as follows:

[0314] Step S1301: The coupling platform receives a light beam passing through a first optical element and generates a first image. The coupling platform also receives a light beam passing through a second optical element and generates a second image.

[0315] The coupling platform is, for example, the coupling platform 200. For an introduction to the coupling platform 200, reference may be made to the relevant descriptions of FIG3 or FIG4, which will not be repeated here.

[0316] In one possible implementation, the imaging unit in the coupling platform receives the light beam passing through the first optical element and generates a first image. The specific implementation process can be referred to the description of step S1001 above and will not be repeated here.

[0317] In a possible implementation, the imaging unit in the coupling platform receives the light beam passing through the second optical element and generates a second image.

[0318] Exemplarily, the imaging unit 201 in the coupling platform 200 receives a light beam passing through the second optical element and generates a second image. The light beam received by the imaging unit 201 includes a light beam reflected by the illuminated pattern on the second optoelectronic chip, and the second image includes image B. For an introduction to the imaging unit 201, reference can be made to the corresponding content above and will not be repeated here. The second optical element is, for example, the second optical element 106 shown in FIG. 3 or FIG. 4 , and the second optoelectronic chip is, for example, the second optoelectronic chip 107 shown in FIG. 3 or FIG. 4 . For an introduction to the second optical element 106 and the second optoelectronic chip 107, reference can be made to the relevant description in FIG. 3 or FIG. 4 , and will not be repeated here.

[0319] Step S1302: The coupling platform adjusts the relative position between the first optoelectronic chip and the first optical element. The coupling platform also adjusts the relative position between the second optoelectronic chip and the second optical element.

[0320] In one possible implementation, a control unit in the coupling platform controls an adjustment unit in the coupling platform based on the first image. The adjustment unit adjusts the relative position of the first optoelectronic chip and the first optical element based on control instructions from the control unit. The specific implementation process can be found in the description of step S1002 above and will not be repeated here.

[0321] In another possible implementation, the control unit in the coupling platform controls the adjustment unit in the coupling platform based on the second image, and the adjustment unit adjusts the relative position of the second optoelectronic chip and the second optical element based on a control instruction of the control unit.

[0322] The control unit is, for example, the control unit 202, and the regulating unit is, for example, the regulating unit 203. For a detailed description of the control unit 202 and the regulating unit 203, please refer to the corresponding descriptions of FIG3 and FIG4, which will not be repeated here.

[0323] Regarding how the control unit adjusts the relative position of the second optoelectronic chip and the second optical element based on the second image, please refer to the relevant description in the above step S1002, in which the control unit adjusts the relative position of the first optoelectronic chip and the first optical element based on the first image, which will not be repeated here.

[0324] It is understood that the coupling platform 200 can couple only one set of optical products, for example, only the first optical element and the first optoelectronic chip, or only the second optical element and the second optoelectronic chip. It can also couple two sets of optical products simultaneously, for example, simultaneously coupling the first optical element and the first optoelectronic chip, and the second optical element and the second optoelectronic chip. It should be noted that "simultaneously coupling two sets of optical products" does not mean simultaneously starting and / or simultaneously ending the coupling of both sets of optical products. It simply means that the coupling platform 200 is capable of performing coupling operations on both sets of optical products simultaneously.

[0325] In addition to being able to perform coupling operations on two sets of optical products at the same time, the above-mentioned coupling platform 200 can also couple two sets of optical modules. For specific implementation, please refer to the corresponding content of the subsequent Figure 14, which will not be described in detail here.

[0326] In one possible implementation, the first optical element is rigidly connected to the second optical element, and / or the first optoelectronic chip is rigidly connected to the second optoelectronic chip. The following describes the implementation process of the coupling platform in each case.

[0327] Case 1: The first optical element and the second optical element are rigidly connected.

[0328] The coupling platform may first couple one of the optical products based on the coupling method shown in Figure 10. For example, the first optical element and the first optoelectronic chip may be coupled based on the coupling method shown in Figure 10.

[0329] The coupling platform then achieves coupling between the second optical element and the second optoelectronic chip by adjusting the spatial position of the second optoelectronic chip. The specific implementation process can also refer to the coupling method shown in FIG10 , except that only the spatial position of the second optoelectronic chip is adjusted in this implementation process.

[0330] Optionally, the coupling platform can also achieve coupling between the second optical element and the second optoelectronic chip by adjusting the spatial position of the second optical element. During this process, it is necessary to ensure that the relative position of the first optical element and the first optoelectronic chip remains unchanged (because the first optical element and the first optoelectronic chip are already coupled).

[0331] Case 2: The first optoelectronic chip and the second optoelectronic chip are rigidly connected.

[0332] The coupling platform may first couple one of the optical products based on the coupling method shown in Figure 10. For example, the first optical element and the first optoelectronic chip may be coupled based on the coupling method shown in Figure 10.

[0333] The coupling platform then adjusts the spatial position of the second optical element to achieve coupling between the second optical element and the second optoelectronic chip. The specific implementation process can also refer to the coupling method shown in FIG10 , except that only the spatial position of the second optical element is adjusted in this implementation process.

[0334] Optionally, the coupling platform can also achieve coupling between the second optical element and the second optoelectronic chip by adjusting the spatial position of the second optoelectronic chip. During this implementation, it is necessary to ensure that the relative position of the first optical element and the first optoelectronic chip remains unchanged (because the first optical element and the first optoelectronic chip are already coupled).

[0335] Case 3: The first optical element is rigidly connected to the second optical element, and the first optoelectronic chip is rigidly connected to the second optoelectronic chip.

[0336] In this case, the coupling unit can also first couple one set of optical products using the coupling method shown in Figure 10. For example, the first optical element and the first optoelectronic chip can be coupled using the coupling method shown in Figure 10. Then, by adjusting the pitch angle (rotation about the x-axis) of the first optical element and / or the first optoelectronic chip, the second optical element and the second optoelectronic chip can be coupled.

[0337] Furthermore, based on the images of the illuminated pattern on the first optoelectronic chip and the illuminated pattern on the second optoelectronic chip in the imaging unit, it is possible to ensure that during the relative position adjustment process, the first optoelectronic chip is simultaneously located in the focal plane of the first optical element and the second optoelectronic chip is simultaneously located in the focal plane of the second optical element, thereby achieving coupling. This implementation method can save optical product assembly time and improve assembly efficiency.

[0338] Some devices include at least two lens modules. Only when the lens modules of the device are in a coupled state can the device work normally (realizing functions such as shooting and detection). For example, the transmitting lens module and the receiving lens module of the laser radar need to be placed in a preset position to ensure that the laser radar can work normally. For example, it is necessary to ensure that the optical axes of the transmitting lens module and the receiving lens module of the laser radar are parallel to ensure the normal operation of the laser radar. Furthermore, on the basis that the optical axes of the transmitting lens module and the receiving lens module are parallel, it is also necessary to ensure that the spacing between the transmitting lens module and the receiving lens module is a preset value (for example, the spacing is less than 3mm).

[0339] The above describes by way of example how to couple to obtain a set of optical products (eg, a lens module), and the following describes by way of example how to couple the lens module.

[0340] Please refer to Figure 14, which is a schematic diagram of another coupling method provided in an embodiment of the present application, for coupling a first lens module and a second lens module. The first lens module is, for example, obtained by coupling a third optical element and a third optoelectronic chip, and the second lens module is, for example, obtained by coupling a fourth optical element and a fourth optoelectronic chip, and the third optoelectronic chip and the fourth optoelectronic chip are placed under lighting conditions. As shown in Figure 14, the coupling method described in Figure 14 includes steps S1401 and S1402, and is applied to the above-mentioned coupling platform 200 or the above-mentioned coupling platform 300. The specific description is as follows:

[0341] Step S1401: The coupling platform receives the light beams passing through the third optical element and the fourth optical element and generates a third image and a fourth image respectively.

[0342] The coupling platform is, for example, coupling platform 200 or coupling platform 300. For an introduction to coupling platform 200, reference may be made to the description of FIG. 3 or FIG. 4 , and will not be repeated here. For an introduction to coupling platform 300, reference may be made to the description of FIG. 5 or FIG. 6 , and will not be repeated here.

[0343] Optionally, the first lens module is, for example, the above-mentioned first lens module 501, and the second lens module is, for example, the above-mentioned second lens module 502. For the introduction of the first lens module 501 and the second lens module 502, please refer to the relevant description of Figure 5 or Figure 6 above, and will not be repeated here.

[0344] Optionally, the first lens module is, for example, obtained by coupling the first optical element 104 with the first optoelectronic chip 105, and the second lens module is, for example, obtained by coupling the second optical element 106 with the second optoelectronic chip 107. Correspondingly, the third optical element is, for example, the first optical element 104, the third optoelectronic chip is, for example, the first optoelectronic chip 105, the fourth optical element is, for example, the second optical element 106, and the fourth optoelectronic chip is, for example, the second optoelectronic chip 107.

[0345] In a possible implementation, the imaging unit in the coupling platform receives the light beam passing through the third optical element and the fourth optical element and generates a third image and a fourth image respectively.

[0346] The imaging unit may be, for example, the imaging unit 201 described above, or may be the imaging unit 301 described above. The light beam passing through the third optical element includes the light beam reflected from the illuminated pattern on the third optoelectronic chip, and the light beam passing through the fourth optical element includes the light beam reflected from the illuminated pattern on the fourth optoelectronic chip. The specific implementation of how the imaging unit receives the light beam passing through the third optical element to generate the third image and how the imaging unit receives the light beam passing through the fourth optical element to generate the fourth image can be found in the description of step S1001 above and will not be repeated here.

[0347] Step S1402: The coupling platform adjusts the relative posture of the first lens module and the second lens module based on the third image and the fourth image.

[0348] Because the first lens module and the second lens module are two lens modules to be coupled, images C and D have the same shape. Furthermore, when the first lens module and the second lens module are coupled, images C and D completely overlap. The first lens module and the second lens module being coupled, with images C and D completely overlapping, can be referred to as implementation method one.

[0349] In some possible implementations, when the first lens module and the second lens module are coupled, image C and image D may not completely overlap. The first lens module and the second lens module are coupled, and image C and image D do not completely overlap, which can be referred to as implementation method two. In this case, there is still a preset standard that can be used to determine the coupling status of the first lens module and the second lens based on the characteristics of image C and image D. For example, when the first lens module and the second lens module are coupled, image C and image D are adjacent, which is not limited in this application.

[0350] For ease of understanding, the coupling process between the first lens module and the second lens module is exemplarily introduced below using the above-mentioned "Implementation Method 1" as an example.

[0351] In one possible implementation, the control unit in the coupling platform controls the adjustment unit in the coupling platform based on the third image and the fourth image, and the adjustment unit adjusts the relative posture of the first lens module and the second lens module based on the control instructions of the control unit.

[0352] The control unit is, for example, the control unit 202 or the control unit 302. If the control unit is the control unit 202, the adjustment unit is the adjustment unit 203; if the control unit is the control unit 302, the adjustment unit is the adjustment unit 303. For a detailed description of the control unit 202, the control unit 302, the adjustment unit 203, or the adjustment unit 303, please refer to the corresponding descriptions of Figures 3-6 above and will not be repeated here.

[0353] The control unit can control the adjustment unit to adjust the relative posture of the first lens module and the second lens module so that image C and image D completely overlap, thereby completing the coupling of the first lens module and the second lens module.

[0354] Next, several possible adjustment methods are exemplarily shown in conjunction with FIG. 7 :

[0355] It should be noted that all control instructions issued by the adjustment unit in the following description are issued by the control unit. For the sake of fluency and brevity, the following description focuses on the adjustment unit as the main body performing the adjustment action, and the description of the control unit issuing the control instructions is not shown. Therefore, it should not be understood that the control unit does not issue any control instructions or perform any actions during the adjustment process.

[0356] Adjustment method A: The adjustment unit adjusts the distance between the first lens module, the second lens module and the imaging unit in the axial direction (x-axis direction) so that the size of image C and image D are equal.

[0357] Please refer to Figure 15A, which is a schematic diagram of another coupling process provided in an embodiment of the present application, used to illustrate a situation where the distances between the first lens module, the second lens module, and the imaging unit are unequal. As shown in Figure 15A, the distance between the first lens module 501 and the imaging unit is spacing A, and the distance between the second lens module 502 and the imaging unit is spacing B, and spacing A and spacing B are unequal.

[0358] Please refer to Figure 15B, which is another imaging diagram provided in an embodiment of the present application, used to illustrate the imaging of the optoelectronic chips in the first lens module and the second lens module in the imaging unit. Taking the above-mentioned spacing A being greater than spacing B as an example, Figure 15B shows that image C is smaller than image D.

[0359] By adjusting the axial distance between the first lens module 501 and / or the second lens module 502 and the imaging unit, the distance A can be made equal to the distance B, so that the image C and the image D are the same size, as shown in FIG15C .

[0360] Adjustment method B, the adjustment unit can also make the center point of image C coincide with the center point of image D by adjusting one or more of the yaw angle, roll angle, y-axis spatial position and z-axis spatial position of the first lens module and / or the second lens module.

[0361] Please refer to Figure 16A, which is another schematic diagram of a coupling process provided in an embodiment of the present application, used to illustrate the situation where the center point of image C does not coincide with the center point of image D.

[0362] It can be understood that since the imaging unit uses an imaging optical element such as a telephoto lens or a parallel light tube, when the first lens module 501 and the second lens module 502 are coupled, the center points of image C and image D coincide or basically coincide (the center points are less than 1 mm apart).

[0363] Please refer to Figure 16B, which is another imaging diagram provided in an embodiment of the present application, illustrating the positions of the center points of image C and image D when the first lens module 501 and the second lens module 502 are uncoupled. As shown in Figure 16B, the distance between the center points of image C and image D is spacing C. In conjunction with Figure 7 above, the distance between the center points of image C and image D in the y-axis direction is spacing D, and the distance in the z-axis direction is spacing E.

[0364] For example, the distance between the center point of image C and the center point of image D in the z-axis direction can be reduced by adjusting the roll angle of the first lens module 501 and / or the second lens module 502. Please refer to Figure 16C, which is another imaging schematic diagram provided in an embodiment of the present application, used to show the situation where the distance between the center point of image C and the center point of image D in the z-axis direction is 0 (the distance E shown in Figure 16B is equal to 0, and the distance C is equal to the distance D). Optionally, the distance between the center point of image C and the center point of image D in the z-axis direction can also be reduced by adjusting the spatial position of the first lens module 501 and / or the second lens module 502 in the z-axis direction.

[0365] For example, the distance between the center point of image C and the center point of image D in the y-axis direction can be reduced by adjusting the navigation angle of the first lens module 501 and / or the second lens module 502. Please refer to Figure 16D, which is another imaging schematic diagram provided in an embodiment of the present application, used to show the situation where the distance between the center point of image C and the center point of image D in the y-axis direction is 0 (the distance D shown in Figure 16B is equal to 0, and the distance C is equal to the distance E). Optionally, the distance between the center point of image C and the center point of image D in the y-axis direction can also be reduced by adjusting the spatial position of the first lens module 501 and / or the second lens module 502 in the y-axis direction.

[0366] It should be noted that the above-mentioned adjustment of one or more of the yaw angle, roll angle, y-axis spatial position and z-axis spatial position of the first lens module and / or the second lens module can be achieved by adjusting one or more of the yaw angle, roll angle, y-axis spatial position and z-axis spatial position of the first lens module, and can also be achieved by adjusting one or more of the yaw angle, roll angle, y-axis spatial position and z-axis spatial position of the second lens module.

[0367] Adjustment method C: The adjustment unit can also adjust the pitch angle of the first lens module and / or the second lens module so that image C overlaps or substantially overlaps with image D.

[0368] It can be understood that when the first lens module and the second lens module are coupled, image C and image D overlap or substantially overlap (the distance between the center points of image C and image D is less than 1 mm).

[0369] Please refer to Figure 17A, which is another imaging schematic diagram provided in an embodiment of the present application, used to show the situation where the center points of image C and image D coincide with each other, but image C and image D do not completely coincide with each other.

[0370] As shown in FIG17A , the center points of image C and image D coincide with each other, but due to the different rotation angles of image C and image D around the x-axis, image C and image D do not completely coincide with each other. Therefore, by adjusting the pitch angle of the first lens module and / or the second lens module, image C and image D can be completely coincident.

[0371] Please refer to Figure 17B, which is another imaging schematic diagram provided in an embodiment of the present application, used to show the situation where image C and image D completely overlap.

[0372] Exemplarily, by adjusting the pitch angle of the first lens module and / or the second lens module, image C and image D are made to overlap, thereby completing the coupling of the first lens module and the second lens module.

[0373] Optionally, in a specific adjustment process, the execution order of the above three adjustment methods is not limited.

[0374] For example, adjustment method A can be first performed to make the sizes of images C and D equal. Adjustment method B can then be performed to make the center points of images C and D coincide with each other. Finally, adjustment method C can be performed to make images C and D coincide or substantially coincide with each other, thereby completing the coupling.

[0375] For another example, adjustment method B can be first performed to make the center points of image C coincide with the center points of image D. Adjustment method A can then be performed to make the sizes of image C and image D equal. Finally, adjustment method C can be performed to make image C coincide with or substantially coincide with image D, thereby completing the coupling.

[0376] Optionally, in a specific adjustment process, the above three adjustment methods can be adjusted in sequence, or multiple adjustment methods can be adjusted simultaneously.

[0377] For example, adjustment method A and adjustment method B can be executed simultaneously, adjustment method B and adjustment method C can be executed simultaneously, adjustment method A and adjustment method C can be executed simultaneously, and adjustment method A, adjustment method B and adjustment method C can be executed simultaneously.

[0378] In summary, the coupling platform provided by this application only requires a control unit to control the adjustment unit based on the first image, and then have the adjustment unit execute corresponding control instructions to adjust the relative position of the first optoelectronic chip and the first optical element to complete the coupling of the first optoelectronic chip and the first optical element. Without the need for complex power-on and power-off processes, the operation is not only simple and time-saving, but also enables the automatic assembly of optical products, thereby reducing the process time of the optical product assembly process and improving assembly efficiency and the hourly output of optical products.

[0379] In addition, the coupling platform provided by the present application can also couple multiple sets of optical products at the same time. Furthermore, the coupling platform used in the present application can also couple lens modules.

[0380] An embodiment of the present application further provides a coupling device, which includes a coupling platform shown in one or more of FIG. 1 , FIG. 2 , FIG. 3 , FIG. 4 , FIG. 5 or FIG. 6 .

[0381] An embodiment of the present application further provides a coupling device, which includes a processor and a memory, wherein the memory is used to store a computer program and the processor is used to execute the computer program, so that the device executes the coupling method described in Figure 10, Figure 13 or Figure 14 above.

[0382] An embodiment of the present application provides a computer program product, which includes: a computer program (also referred to as code, or instructions); when the computer program is executed, the computer executes the coupling method described in Figure 10, Figure 13 or Figure 14 above.

[0383] An embodiment of the present application provides a chip, which includes a processor, and the processor is used to execute instructions. When the processor executes the instructions, the chip executes the coupling method described in Figure 10, Figure 13 or Figure 14 above.

[0384] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores instructions. When the instructions are executed on at least one processor, the coupling method described in FIG. 10 , FIG. 13 , or FIG. 14 is implemented.

[0385] Those skilled in the art will understand that all or part of the steps to implement the above embodiments may be accomplished by hardware, or by a program to instruct the relevant hardware, and the program may be stored in a computer-readable storage medium, which may be a read-only memory, a disk, or an optical disk, etc.

Claims

1. A coupling platform, characterized in that, The coupling platform is used to couple a first optoelectronic chip with a first optical element. The first optoelectronic chip is placed under illumination conditions. The coupling platform includes: an imaging unit, a control unit, and an adjustment unit. The first optical element is disposed between the first optoelectronic chip and the imaging unit; The imaging unit is configured to receive the light beam passing through the first optical element and generate a first image, where the first image includes an image of the light spot on the first optoelectronic chip; The control unit is configured to control the adjustment unit based on the first image; The adjustment unit is configured to adjust the relative position and orientation between the first optoelectronic chip and the first optical element.

2. The coupling platform according to claim 1, wherein the coupling platform further includes an illumination unit, and the illumination unit is configured to provide an illumination light beam for the first optoelectronic chip.

3. The coupling platform according to claim 1 or 2, characterized in that, The adjustment unit is configured to adjust the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

4. The coupling platform according to any one of claims 1-3, characterized in that The coupling platform is used to couple a second optoelectronic chip with a second optical element. The second optoelectronic chip is placed under illumination conditions. The second optical element is disposed between the second optoelectronic chip and the imaging unit; The imaging unit is further configured to receive the light beam passing through the second optical element and generate a second image, where the second image includes an image of the light spot on the second optoelectronic chip; The control unit is further configured to control the adjustment unit based on the first image and the second image; The adjustment unit is further configured to adjust the relative position and orientation between the second optoelectronic chip and the second optical element.

5. The coupling platform according to claim 4, wherein, The adjustment unit is further configured to adjust the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

6. The coupling platform according to claim 4 or 5, characterized in that, The first optoelectronic chip is a light-emitting chip, and the second optoelectronic chip is a light-receiving chip; or, the first optoelectronic chip is a light-receiving chip, and the second optoelectronic chip is a light-emitting chip; or, both the first optoelectronic chip and the second optoelectronic chip are light-emitting chips; or, both the first optoelectronic chip and the second optoelectronic chip are light-receiving chips.

7. The coupling platform according to any one of claims 4-6, characterized in that, The first optoelectronic chip and the second optoelectronic chip are rigidly connected, and / or, the first optical element and the second optical element are rigidly connected.

8. The coupling platform according to any one of claims 1-7, characterized in that The adjustment unit includes a six-axis adjustment stage or a three-axis adjustment stage.

9. The coupling platform according to any one of claims 1-8, characterized in that, The imaging unit includes an imaging optical element and an image sensor; the imaging optical element includes a telephoto lens or a collimator, and the image sensor is configured to generate an image based on the light beam collected by the imaging optical element.

10. The coupling platform according to claim 2, characterized in that, The illumination unit includes any one or more of the following: Optical fiber, optical fiber, ground glass, or mirror.

11. A coupling platform, characterized in that, The coupling platform is used to couple a first lens module and a second lens module. The coupling platform includes an imaging unit, a control unit, and an adjustment unit; the first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element; the first optoelectronic chip and the second optoelectronic chip are placed under illumination conditions, and the distances between the first lens module and the second lens module and the imaging unit are equal; The imaging unit is configured to receive the light beams that have passed through the first optical element and the second optical element and generate a first image and a second image respectively; the first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip; The control unit is configured to control the adjustment unit based on the first image and the second image; The adjustment unit is configured to adjust the relative pose of the first lens module and the second lens module.

12. The coupling platform according to claim 11, wherein the coupling platform further includes an illumination unit configured to provide an illumination light beam for the first optoelectronic chip and / or the second optoelectronic chip.

13. The coupling platform according to claim 11 or 12, characterized in that, The adjustment unit is configured to adjust the spatial position of the first lens module and / or the second lens module.

14. The coupling platform according to any one of claims 11-13, characterized in that, The first lens module is a light emitting module, and the second lens module is a light receiving module.

15. The coupling platform according to any one of claims 11-14, characterized in that, The adjustment unit includes a six-axis adjustment stage or a three-axis adjustment stage.

16. The coupling platform according to any one of claims 11-15, characterized in that, The imaging unit includes an imaging optical element and an image sensor; the imaging optical element includes a telephoto lens or a collimator, and the image sensor is configured to generate an image based on the light beam collected by the imaging optical element.

17. The coupling platform according to any one of claims 11-16, characterized in that, The illumination unit includes any one or more of the following: Optical fiber, optical fiber, ground glass or mirror.

18. A coupling method, characterized in that The method includes: Receiving the light beam that has passed through the first optical element and generating a first image, the first image including an image of the light spot on the first optoelectronic chip, and the first optoelectronic chip is placed under an illumination condition; Adjusting the relative pose of the first optoelectronic chip and the first optical element based on the first image.

19. The method according to claim 18, characterized in that, Adjusting the relative pose of the first optoelectronic chip and the first optical element includes: Adjusting the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

20. The method according to claim 18 or 19, characterized in that, The method further includes: Receiving the light beam that has passed through the second optical element and generating a second image, the second image including an image of the light spot on the second optoelectronic chip, and the first optoelectronic chip is placed under an illumination condition; Adjusting the relative pose of the second optoelectronic chip and the second optical element based on the first image and the second image.

21. The method according to claim 20, wherein Adjusting the relative pose of the second optoelectronic chip and the second optical element includes: Adjusting the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

22. The method according to claim 20 or 21, characterized in that, The first optoelectronic chip is a light emitting chip, and the second optoelectronic chip is a light receiving chip; or, both the first optoelectronic chip and the second optoelectronic chip are light emitting chips; or, both the first optoelectronic chip and the second optoelectronic chip are light receiving chips.

23. The method according to any one of claims 20-22, characterized in that, The first optoelectronic chip and the second optoelectronic chip are rigidly connected, and / or, the first optical element and the second optical element are rigidly connected.

24. A coupling method, characterized in that, The method is used for coupling a first lens module and a second lens module, the first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element; the method includes: Receive the light beams passing through the first optical element and the second optical element and generate a first image and a second image respectively. The first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip. The first optoelectronic chip and the second optoelectronic chip are placed under illumination conditions; Based on the first image and the second image, adjust the relative pose of the first lens module and the second lens module.

25. The method according to claim 24, wherein Adjusting the relative pose of the first lens module and the second lens module includes: The adjusting unit is used to adjust the spatial position of the first lens module and / or the second lens module.

26. The method according to claim 24 or 25, characterized in that The first lens module is a light emitting module, and the second lens module is a light receiving module.

27. A coupling device, characterized in that, The device includes the coupling platform according to any one of claims 1-10, or the coupling platform according to any one of claims 11-17.

28. The device according to claim 27, wherein The device is used to execute the method according to any one of claims 18-23, or the method according to any one of claims 24-26.

29. A coupling device, characterized in that, The device includes a processor and a memory. Among them, the memory is used to store a computer program, and the processor is used to execute the computer program so that the device executes the method according to any one of claims 18-23, or the method according to any one of claims 24-26.

30. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes instructions, and when the instructions are run by a processor, the method according to any one of claims 18-23, or the method according to any one of claims 24-26 is implemented.

31. A computer program product, characterized in that, The computer program product includes instructions, and when the instructions are run by a processor, the method according to any one of claims 18-23, or the method according to any one of claims 24-26 is implemented.

Images