Refrigerator including thermoelectric module

Abstract

A refrigerator according to embodiments of the present disclosure may comprise: a storage compartment; a main body including the storage compartment; and a cold air supply device for supplying cold air to the storage compartment. The cold air supply device may comprise at least one of a thermoelectric module, a cooling sink, and a heat dissipation sink. The thermoelectric module comprises: a lower substrate; a lower conductive pattern layer formed on the lower substrate; a thermoelectric element layer formed on the lower conductive pattern layer; an upper conductive pattern layer formed on the thermoelectric element layer; an upper substrate formed on the upper conductive pattern layer; and at least one SMD connector electrically connected to the lower conductive pattern layer.

Description

Refrigerator containing a thermoelectric module

[0001] Various embodiments of the present disclosure relate to a refrigerator including a thermoelectric module.

[0002] A refrigerator is a home appliance that prevents food spoilage or deterioration by cooling or storing food at low temperatures in its storage compartment, and keeps it fresh. The storage compartment includes a refrigerator, which is maintained at approximately 0 to 5 degrees Celsius, for refrigerated storage, and a freezer, which is maintained at approximately 0 to -30 degrees Celsius, for frozen storage. A door is provided on the front of the unit, allowing the storage compartment to be opened and closed. The door is swivel-mounted on the front of the unit, allowing the storage compartment to be opened and closed. Additionally, the door is provided as a drawer, allowing the storage compartment to be opened and closed.

[0003] Meanwhile, a refrigerator may include a storage compartment capable of storing food and a cooling device for cooling the storage compartment. The refrigerator uses the cooling device to freeze / refrigerate the storage compartment, thereby keeping the food stored there fresh for a long period of time. Generally, cooling devices can be classified into refrigeration cycle devices that utilize a refrigeration cycle and Peltier cooling devices that utilize a Peltier element, depending on how they generate cooling air.

[0004] For example, a refrigeration cycle device can obtain cold air by circulating a refrigerant along a closed circuit consisting of a compressor, a condenser, an expander, and an evaporator.

[0005] For example, a Peltier refrigeration device can generate cooling by utilizing a thermoelectric module that generates the Peltier effect. The Peltier effect refers to a phenomenon in which, when a potential difference is applied to both sides of an object, heat flows along with the current, heating one side and cooling the other.

[0006] Various embodiments of the present disclosure can provide a refrigerator including a thermoelectric module having an SMD connector mounted thereon that receives power from an external source through a wire, and a thermoelectric module for a refrigerator having an SMD connector mounted thereon that receives power from an external source through a wire.

[0007] A refrigerator according to embodiments of the present disclosure may include a storage compartment, a main body including the storage compartment, and a cold air supply device for supplying cold air to the storage compartment. The cold air supply device may include a thermoelectric module. The thermoelectric module may include a lower substrate, a lower conductive pattern layer formed on the lower substrate, a thermoelectric element layer formed on the lower conductive pattern layer, an upper conductive pattern layer formed on the thermoelectric element layer, an upper substrate formed on the upper conductive pattern layer, and at least one SMD (Surface Mount Device) connector electrically connected to the lower conductive pattern layer.

[0008] A method for manufacturing a thermoelectric module for a refrigerator according to embodiments of the present disclosure may include an operation of forming a lower conductive pattern layer on a lower substrate, an operation of forming an upper conductive pattern layer on an upper substrate, an operation of forming a thermoelectric element layer on the lower conductive pattern layer, an operation of performing a reflow process on the lower substrate, the thermoelectric element layer, and the upper substrate, and an operation of soldering at least one SMD (Surface Mount Device) connector to the lower conductive pattern layer.

[0009] Various embodiments of the present disclosure can provide a refrigerator including a thermoelectric module having an SMD connector mounted thereon that receives power from an external source through a wire, and a thermoelectric module for a refrigerator having an SMD connector mounted thereon that receives power from an external source through a wire.

[0010] According to various embodiments of the present disclosure, a refrigerator including a thermoelectric module of the present disclosure, and a method for manufacturing a thermoelectric module for a refrigerator, may include a thermoelectric module having an SMD connector mounted thereon that receives power from an external source through a wire.

[0011] Therefore, the refrigerator including the thermoelectric module of the present disclosure and the method for manufacturing a thermoelectric module for a refrigerator do not require a separate process of soldering a power supply wire after the manufacturing process of the thermoelectric module, thereby simplifying the manufacturing process of the thermoelectric module and reducing the manufacturing cost.

[0012] In addition, a refrigerator including a thermoelectric module of the present disclosure and a method for manufacturing a thermoelectric module for a refrigerator can increase heat transfer efficiency and improve the performance of the thermoelectric module by precise electrical connection between a conductive pattern layer of the thermoelectric module and an SMD connector.

[0013] In addition, the refrigerator including the thermoelectric module of the present disclosure and the method for manufacturing a thermoelectric module for a refrigerator can reduce the disposal rate of the thermoelectric module and increase the lifespan of the thermoelectric module, as the thermoelectric module is easily maintained, repaired, and replaced as the SMD connector is mounted on the thermoelectric module.

[0014] The effects that can be obtained from the exemplary embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from implementing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0015] FIG. 1 schematically illustrates the internal and external appearance of a refrigerator according to one embodiment of the present disclosure.

[0016] FIG. 2 schematically illustrates the block configuration of a refrigerator from the perspective of function and control according to one embodiment of the present disclosure.

[0017] FIG. 3 illustrates a configuration of a cold air supply device according to one embodiment of the present disclosure.

[0018] FIG. 4 illustrates a cross-section of a thermoelectric module according to one embodiment of the present disclosure.

[0019] FIG. 5 illustrates thermoelectric cooling by the Peltier effect of a thermoelectric module according to one embodiment of the present disclosure.

[0020] FIG. 6 illustrates thermoelectric power generation by the Seebeck effect of a thermoelectric module according to one embodiment of the present disclosure.

[0021] FIG. 7 illustrates a perspective view of a thermoelectric module according to one embodiment of the present disclosure.

[0022] FIG. 8 illustrates a plan view of a thermoelectric module according to one embodiment of the present disclosure.

[0023] FIG. 9a illustrates a perspective view of an SMD connector according to one embodiment of the present disclosure.

[0024] FIG. 9b illustrates a plan view of an SMD connector according to one embodiment of the present disclosure.

[0025] FIG. 10 illustrates a perspective view of a thermoelectric module according to one embodiment of the present disclosure.

[0026] FIG. 11 illustrates a plan view of a thermoelectric module according to one embodiment of the present disclosure.

[0027] FIG. 12a illustrates a perspective view of an SMD connector according to one embodiment of the present disclosure.

[0028] FIG. 12b illustrates a plan view of an SMD connector according to one embodiment of the present disclosure.

[0029] FIG. 13 illustrates a method for manufacturing a thermoelectric module for a refrigerator according to one embodiment of the present disclosure.

[0030] The terms used in this document are used solely to describe specific embodiments and are not intended to limit the technical features of this document. For example, a component expressed in the singular should be understood to include both singular and plural components, unless the context clearly indicates otherwise.

[0031] In this document, the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" each may include any one of the items listed with the phrase, or all possible combinations thereof. The term "and / or" as used herein should be understood to encompass any and all possible combinations of one or more of the items listed with the term. The terms "first", "second", "first", or "second" as used herein may be used merely to distinguish the corresponding element from other elements and do not limit the corresponding elements in any other respect (e.g., importance or order).

[0032] When a component (e.g., a first component) is referred to as being "coupled," "connected," "connected," "joined," "supported," "connected," or "in contact with" another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it includes instances where the component is directly coupled, connected, joined, supported, or in contact with the other component, as well as instances where the component is indirectly coupled, connected, joined, supported, or in contact with the other component through a third component.

[0033] The terms "include" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described herein, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. When it is said that a component is located "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where another component is present between the two components.

[0034] The expression "configured to" as used herein can be used interchangeably with, for example, "suitable for," "capable of," "designed to," "modified to," "made to," or "capable of." The term "configured to" does not necessarily mean something that is "specially designed" in terms of hardware. Instead, in some contexts, the expression "a device configured to" can mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a device configured (or set) to perform A, B, and C" can mean a dedicated device for performing the actions in question, or a general-purpose device that can perform various actions including the actions in question.

[0035] The terms “upper side,” “lower side,” and “front-rear direction” used in this document are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0036] While the description herein focuses on specific embodiments, it should be understood that this document is not limited to such specific embodiments, but rather encompasses various modifications, equivalents, and / or alternatives of the various embodiments described herein. In connection with the description of the drawings, similar reference numerals may be used to refer to similar or related components.

[0037] The refrigerators according to the various examples in this document can be classified into types according to the shape of the storage compartment and the door. For example, the refrigerator may be one of various types of refrigerators, including but not limited to, a TMF (Top Mounted Freezer) type refrigerator in which the storage compartment is divided vertically by horizontal bulkheads to form a freezer compartment on the top and a refrigerator compartment on the bottom, a BMF (Bottom Mounted Freezer) type refrigerator in which the refrigerator compartment is formed on the top and a freezer compartment on the bottom, a SBS (Side By Side) type refrigerator in which the storage compartment is divided left and right by vertical bulkheads to form a freezer compartment on one side and a refrigerator compartment on the other, and an FDR (French Door Refrigerator) type refrigerator in which the storage compartment is divided vertically by horizontal bulkheads to form a refrigerator compartment on the top and a freezer compartment on the bottom, but the upper refrigerator compartment is opened and closed by a pair of doors.

[0038] Hereinafter, various exemplary refrigerators will be described in detail with reference to the drawings.

[0039] Figure 1 schematically illustrates the internal and external appearance of a refrigerator (1) according to one embodiment.

[0040] A refrigerator (1) may include a main body (10). The main body (10) may include an outer case (11) and an inner case (12) disposed inside the outer case (11). The outer case (11) may be provided to form at least a portion of the outer appearance of the main body (10). In one example, the outer case (11) may be configured to include a metal material having excellent durability and aesthetics. The inner case (12) may be provided to define a space of a storage compartment (20). The inner case (12) may include a case, a plate, a panel, and / or a liner forming the storage compartment (20). The inner case (12) may be formed as a single body or may be formed by assembling a plurality of plates. In one example, the inner case (12) may be integrally injection-molded using a plastic material, and the present document is not limited thereto.

[0041] Although not shown, a receiving space may be formed between the outer case (11) and the inner case (12). At least a portion of the receiving space may be provided with an insulating material (not shown) that insulates the storage room (20). The insulating material may insulate the inside of the storage room (20) and the outside of the storage room (20) so that the temperature inside the storage room (20) can be maintained at a set appropriate temperature without being affected by the external environment of the storage room (20).

[0042] In one example, the insulation may include foam insulation. In one example, the foam insulation may be formed by fixing the inner case (12) and the outer case (11) with a jig or the like, and then injecting and foaming a urethane foam mixed with polyurethane and a foaming agent into the space between the inner case (12) and the outer case (11). In one example, the insulation may include a vacuum insulation in addition to or instead of the foam insulation. The vacuum insulation may include a core and an outer shell that accommodates the core and seals the interior at a vacuum or near-vacuum pressure. The vacuum insulation may further include an adsorbent that adsorbs gas and moisture to stably maintain a vacuum state. The insulation of the refrigerator (1) is not limited to the foam insulation or vacuum insulation described above, and may be formed using various materials that can be used for insulation.

[0043] For example, a refrigerator (1) may include a storage compartment (20). The storage compartment (20) may store food. Food may include edible or drinkable food, and specifically, may include meat, fish, seafood, fruits, vegetables, water, ice, beverages, kimchi, or alcoholic beverages such as wine. In addition to food, the storage compartment (20) may also store medicines or cosmetics, and there is no limitation on the items that may be stored in the storage compartment (20).

[0044] In one example, a refrigerator (1) may include one or more storage compartments (20). When two or more storage compartments (20) are formed in the refrigerator (1), each storage compartment may have a different purpose and may be maintained at a different temperature. To this end, each storage compartment (20) may be partitioned from each other by a partition wall (14) including an insulating material. In one example, the storage compartments may be referred to as a "refrigerator," a "freezer," or a "variable temperature compartment" depending on the purpose and / or temperature range. For example, a refrigerator compartment may refer to a storage compartment maintained at a temperature appropriate for refrigerating food, and a freezer compartment may refer to a storage compartment maintained at a temperature appropriate for freezing food. "Refrigeration" may mean cooling food to a temperature that does not freeze it, and for example, a refrigerator compartment may be maintained in a range of 0 degrees Celsius to +7 degrees Celsius. "Freezing" may refer to cooling food to keep it frozen or frozen. For example, a freezer may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius. A variable temperature room may refer to a storage room that can be maintained at a predetermined variable temperature, either by user selection or not. In one example, a storage room may be configured so that part of it is used as a refrigerator and the other part as a freezer. In addition to the aforementioned names "refrigerator room," "freezer room," and "variable temperature room," a storage room may also be referred to by various other names, such as a "vegetable room," "fresh room," "cooling room," and "ice room."

[0045] According to one example, the number, size, and / or shape of the storage compartment (20) may vary depending on the shape or position of the bulkhead (14). According to one example, the bulkhead (14) may be formed integrally with the main body (10). According to one example, the bulkhead (14) may be a separate partition that is provided separately from the main body (10) and assembled to the main body (10).

[0046] According to one example, the storage room (20) can be partitioned left and right by vertical bulkheads (14v) (bulkheads extending vertically). The sizes of the storage rooms (20) partitioned left and right can vary depending on the position of the vertical bulkheads (14v). For example, the vertical bulkhead (14v) can be provided in the center so that the storage rooms (20) partitioned left and right can be provided in a mirror symmetry manner. According to one example, there can be multiple vertical bulkheads. When there are multiple vertical bulkheads, the storage room can be partitioned into three or more partitions in the left and right directions.

[0047] For example, the storage room (20) may be partitioned vertically by horizontal bulkheads (14h) (bulkheads extending horizontally). The size of the storage room (20) partitioned vertically may vary depending on the position of the horizontal bulkheads (14h). For example, there may be multiple horizontal bulkheads. In the case where there are multiple horizontal bulkheads, the storage room may be partitioned vertically into three or more.

[0048] The refrigerator may be configured to include a plurality of storage compartments of various sizes and shapes, depending on various combinations of vertical and horizontal bulkheads.

[0049] According to one example, a plurality of shelves (24) and / or a plurality of storage containers (25) may be provided inside the storage room (20). Each of the plurality of shelves (24) and the plurality of storage containers (25) may be separable from the space inside the storage room (20).

[0050] In one example, each storage compartment (20) may be formed to have at least one side openable for putting food in and taking out. In one example, the refrigerator (1) may include a respective door (30) for opening and closing each storage compartment (20). In one example, the door (30) may be arranged on the front of the main body (10) and the storage compartment (20) to open and close the storage compartment (20). The door (30) may be configured to seal the storage compartment (20) while the door is closed. The door (30) may include an insulating material, like the main body (10), to insulate the storage compartment (20) from the external environment while the door (30) is closed.

[0051] According to one example, the door (30) may be configured to be opened and closed by rotating around a hinge (16), but the present disclosure is not limited thereto. In one example, the door may be configured to be opened and closed in a sliding manner.

[0052] According to one example, the door (30) may include a door panel (30a) and / or a door body (30b). The door panel (30a) and the door body (30b) may be detachably coupled. The door body (30b) may, for example, have one side fixed to the main body (10) by a hinge (16). The door panel (30a) may form a part of the front exterior appearance of the refrigerator (1). Therefore, the door panel (30a) may be an important element of the appearance when the refrigerator (1) is placed indoors. The door panel (30a) may have various colors and / or various designs and may be configured to be replaceable so that the user can decorate the front exterior appearance of the refrigerator (1) according to his / her taste. According to one example, the door panel (30a) and the door body (30b) may be formed integrally.

[0053] According to an example, the door (30) may include a door handle (not shown), a door shelf (313), a shelf support (314), and / or a gasket (315). A user may open and close the door (30) using the door handle. The door handle may be recessed into the bottom or top surface of the door (30), or may be protruded from the front surface of the door (30), and is not limited to a specific shape.

[0054] A door shelf (313) may be provided to store food. Shelf supports (314) may be provided on both left and right sides of the door shelf (313) to support the door shelf (313). The shelf supports (314) may, for example, be formed to extend vertically from the door (30). For example, the shelf supports (314) may be provided to protrude from the rear surface of the door (the inner surface facing the storage compartment (20)) toward the storage compartment (20) and extend vertically. The shelf supports (314) may be provided as a separate component detachable from the door (30), or alternatively, may be formed integrally with the door (30).

[0055] The gasket (315) may be provided to surround the edge of the door body (30b). The gasket (315) may be provided to seal the gap between the main body (10) and the door (30) when the door (30) is closed.

[0056] In one example, a refrigerator (1) may include a cold air supply device. The cold air supply device may include a machine, mechanism, electronic device, and / or a system combining these that can generate cold air and guide the generated cold air to a storage compartment to cool the storage compartment. In one example, the cold air supply device may be provided inside the main body (10) to supply cold air to each storage compartment (20), for example.

[0057] Fig. 2 schematically illustrates the block configuration of a refrigerator (1) from the perspective of function and control according to one embodiment.

[0058] According to an example, the refrigerator (1) may include an input unit (40). The input unit (40) may be configured to obtain user input for controlling the refrigerator (1).

[0059] In one example, the input unit (40) may be installed on a door (e.g., door (30) of FIG. 1) for the convenience of the user. The input unit (40) may include any type of user input means, including one or more buttons or switches. Setting data (e.g., desired storage temperature, etc.) by the user may be input through the input unit (40). For example, the input unit (40) may include a touch panel that receives a user's touch input and generates an electrical signal corresponding to the received touch input, and the present document is not limited to a specific type of input unit. In one example, the touch panel constituting the input unit (40) may be formed of a transparent material that does not distort the image displayed on the display panel and is located on the front of a separate display panel provided in the refrigerator (1). In one example, the input unit (40) may include an infrared signal receiving unit. The user may input setting data remotely through a remote control, and the input setting data may be received by the input unit (40) as an infrared signal. In one example, the input unit (40) may include a microphone, and setting data by the user's voice may be acquired through the microphone.

[0060] Setting data (e.g., desired storage room temperature, etc.) acquired through the input unit (40) may be transmitted to the control unit (100) described later. In one example, the setting data acquired through the input unit (40) may be transmitted externally through the communication unit (50) described later, and this document is not limited thereto.

[0061] According to one example, the refrigerator (1) may include a communication unit (50) that supports signal transmission and reception with the outside. In one example, the communication unit (50) may receive and / or transmit wired / wireless signals between an external wired / wireless communication system, an external server, and / or other devices according to a predetermined wired / wireless communication protocol. In one example, the communication unit (50) may include one or more modules that connect the refrigerator (1) to one or more networks. In one example, the communication unit (50) may include at least one of a mobile communication module, a wired / wireless Internet module, a short-range communication module, and / or a location information module.

[0062] In one example, the mobile communication module may transmit and receive wireless signals with at least one of an external base station, an external terminal, and an external server through a mobile communication network according to any of various communication protocols for mobile communication. The wireless signals may include various types of data signals. In one example, the wireless signals may include voice call signals, video call call signals, and text / multimedia message signals, but this document is not limited thereto.

[0063] In one example, the wired / wireless Internet module may support, but is not limited to, wireless LAN (WLAN), wireless-fidelity (Wi-Fi), Wi-Fi Direct, digital living network alliance (DLNA), wireless broadband (WiBro), world interoperability for microwave access (WiMAX), high speed downlink packet access (HSDPA), high speed uplink packet access (HSUPA), long term evolution (LTE), or long term evolution-advanced (LTE-A). In one example, the wired / wireless Internet module of the communication unit (50) may transmit and receive data according to at least one wired / wireless Internet technology among the Internet technologies not listed above.

[0064] The short-range communication module is for short-range communication, and can support short-range communication using at least one of Bluetooth, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), UWB (Ultra-Wide Band), ZigBee, NFC (Near Field Communication), Wi-Fi, Wi-Fi Direct, and Wireless USB (Universal Serial Bus) technologies, for example. The short-range communication module can support wireless communication between a refrigerator (1) and a wireless communication system, between the refrigerator (1) and another device, or between the refrigerator (1) and a network in which another device is located, for example, through a short-range wireless communication network.

[0065] The location information module is, for example, a module for obtaining the location of a refrigerator (1), and may be a GPS (Global Positioning System) module or a Wi-Fi module. If the refrigerator (1) utilizes a GPS module, information regarding the location of the refrigerator (1) can be received using signals transmitted from GPS satellites. If the refrigerator (1) utilizes a Wi-Fi module, information regarding the location of the refrigerator (1) can be received based on information from a wireless AP (Wireless Access Point) that transmits and receives wireless signals with the Wi-Fi module.

[0066] In one example, the communication unit (50) may receive a setting data signal input by a user from the user's mobile terminal in the form of a wireless signal according to a predetermined wireless communication protocol. In one example, the communication unit (50) may receive information and / or commands for controlling the operation of the refrigerator (1) from an external server in the form of signals according to a predetermined wired / wireless communication protocol. The communication unit (50) may transmit various received signals to the control unit (100) described below. In one example, the communication unit (50) may transmit various data generated or acquired on the refrigerator (1) in the form of wired / wireless signals according to a predetermined wired / wireless communication protocol, for example, to the user's mobile terminal or an external server.

[0067] In one example, the refrigerator (1) may include a sensor unit (60). In one example, the sensor unit (60) may include a temperature sensor (61), a distance sensor (62), a proximity sensor (63), and / or a camera (64). However, the types of sensors listed herein are merely exemplary and this document is not limited thereto.

[0068] In one example, the temperature sensor (61) may include a plurality of temperature sensors that are installed inside each storage compartment (20) to detect the temperature inside the storage compartment (e.g., the storage compartment (20) of FIG. 1). The plurality of temperature sensors may be installed in each of the plurality of storage compartments (20) to detect the temperature of each storage compartment (20). An electrical signal corresponding to the detected temperature may be transmitted to the control unit (100). Each of the plurality of temperature sensors may include a thermistor whose electrical resistance changes depending on the temperature. In one example, the temperature sensor (61) may include an external temperature sensor that is installed outside the refrigerator (1) (e.g., at a location of the outer case (11) of FIG. 1) to detect the external temperature around the refrigerator (1).

[0069] In one example, the distance sensor (62) can measure the distance to an object located around the refrigerator (1), for example, a user. The distance sensor (62) can be, for example, an ultrasonic sensor or an infrared sensor, but is not limited thereto. The distance sensor (62) can detect an object or a user around the refrigerator (1) and transmit a detected electrical signal to the control unit (100).

[0070] In one example, a proximity sensor (63) may be provided to detect the opening and closing of a door (30). The proximity sensor (63) may detect whether the door (30) is in contact with a main body (e.g., main body (10) of FIG. 1) and is closing the storage compartment (20). A plurality of proximity sensors (63) may be installed on each of a plurality of doors (30). The proximity sensor (63) may transmit an electrical signal regarding the detected opening and closing state of the door (30) to the control unit (100).

[0071] In one example, a camera (64) may be installed inside each storage compartment (20) to obtain an internal image of each storage compartment (20). In one example, the camera (64) may be installed on the outside of the refrigerator (1) (e.g., at a location of the outer case (11) of FIG. 1) to obtain an external image of the surroundings of the refrigerator (1). The camera (64) may include image sensors that capture images and convert them into electrical signals. The image sensors may include, for example, a charge-coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor. An electrical signal regarding an image captured by the camera (64) may be transmitted to the control unit (100).

[0072] In one example, the refrigerator (1) may include a cold air supply device (70). In one example, the cold air supply device (70) may include a compressor (71), a condenser (72), an expander (73), and an evaporator (74). Although not shown, the cold air supply device (70) may include a refrigerant pipe connecting the compressor (71), the condenser (72), the expander (73), and the evaporator (74). The refrigerant may circulate between the compressor (71), the condenser (72), the expander (73), and the evaporator (74) through the refrigerant pipe.

[0073] The compressor (71) can compress the refrigerant to a high temperature and high pressure state. For example, the compressor (71) can receive electric energy from the outside and compress the gaseous refrigerant to a high temperature and high pressure state by using the rotational power of an electric motor or the like. The compressor (71) is a variable capacity compressor, and the capacity can be varied by changing the frequency according to a driving control command. The compressed refrigerant can be moved to the condenser (72) by the refrigerant pipe. The condenser (72) can condense the compressed refrigerant transferred from the compressor (71). The condenser (72) can radiate the heat generated while condensing the refrigerant to the outside of the condenser (72). The condensed refrigerant passing through the condenser (72) can be moved to the expander (73). The condensed refrigerant can be converted into a low temperature and low pressure liquid state while passing through the expander (73). In one example, the expander (73) may be implemented as an electronic expansion valve capable of controlling the opening ratio (an electronic expansion valve capable of controlling the ratio of the cross-sectional area of ​​the valve's flow path in a partially opened state to the cross-sectional area of ​​the valve's flow path in a fully opened state). In such a case, the amount of refrigerant passing through the expander (73) may be controlled depending on the opening ratio of the electronic expansion valve. In one example, the expander (73) may be implemented as a capillary device. The liquid refrigerant may pass through the expander (73) and move to the evaporator (74). The evaporator (74) may exchange heat with the surrounding gas as the liquid refrigerant evaporates. As the liquid refrigerant evaporates by the evaporator (74), it absorbs latent heat from the surroundings, thereby cooling the gas surrounding the evaporator (74), thereby generating cold air. The generated cold air can be moved to the storage chamber (20) through a passage provided between the outer case (e.g., the outer case (12) of Fig. 1) and the inner case (e.g., the inner case (11) of Fig. 1). The refrigerant vaporized in the evaporator (74) can be moved to the compressor (71) again and circulated.

[0074] In one example, the cooling supply device (70) may include a thermoelectric element. The thermoelectric element may cool the storage compartment (20) through heat generation and cooling through the Peltier effect.

[0075] In one example, although not specifically illustrated, the refrigerator (1) may include a machine room in which at least some components of a cold air supply device (70) are arranged. The machine room may be configured to be partitioned and insulated from the storage room (20) to prevent heat generated from the components arranged in the machine room from being transferred to the storage room (20). The interior of the machine room may be configured to be in communication with the exterior of the main body (10) to dissipate heat from the components arranged inside the machine room.

[0076] According to one example, the refrigerator (1) may include a display unit (80). In one example, the display unit (80) may be installed on the door (30). In one example, the display unit (80) may display various setting data (e.g., desired storage compartment temperature, etc.) obtained from a user or the outside through the input unit (40) and / or the communication unit (50) or operation control information of the refrigerator (1). In one example, the display unit (80) may display various sensing information obtained from the sensor unit (60) (e.g., one or more temperature information measured by a temperature sensor (61), the current operation status of the refrigerator (1), and / or various warning / error messages. The display unit (80) may be one of various visual display means capable of displaying images, characters, numbers, etc., including a liquid crystal display (LCD) panel, a light emitting diode (LED) panel, an organic light emitting diode (OLED) panel, a micro light emitting diode (uLED) panel, and a plasma display panel (PDP), and is not limited to a specific type of display unit. In one example, the display unit (80) may include a speaker and may provide each of the above-described information in the form of sound through the speaker.

[0077] According to an example, the refrigerator (1) may include a lighting unit (90). The lighting unit (90) may be installed in each storage compartment (20) to illuminate the interior of the storage compartment (20).

[0078] In one example, a refrigerator (1) may include a control unit (100) that controls the overall operation of the refrigerator (1). The control unit (100) may include a memory (102) that stores programs and / or data for controlling each component of the refrigerator (1), and a processor (101) that generates a control signal for controlling each component of the refrigerator (1), including a cold air supply device (70), according to the programs and / or data stored in the memory (102) and information obtained from each of the other components.

[0079] In one example, the processor (101) of the control unit (100) can receive various input / setting information, such as desired storage compartment temperature information, from the input unit (40) and / or the communication unit (50) described above. The processor (101) can obtain detection information from the sensor unit (60), such as one or more temperature information detected by the temperature sensor (62), a detection signal detected by the distance sensor (62), door open / close information detected by the proximity sensor (63), and / or image information detected by the camera (64). In one example, the control unit (100) can obtain information about the state of the inside or outside of the storage compartment (20) of the refrigerator (1) by receiving the image information obtained by the camera (64) and analyzing the received image information.

[0080] In one example, the processor (101) of the control unit (100) may generate an operation control command for each component of the refrigerator (1) based on various pieces of information received from the input unit (40), the communication unit (50), and / or the sensor unit (60). In one example, the processor (101) may control the operation of the cold air supply device (70), for example, the compressor (71) and / or the expander (73), to control the temperature inside the storage compartment (20). In one example, the control unit (100) may control the operation of each component of the cold air supply device (70) using information about the temperature of each storage compartment (20) received from the temperature sensor (61). For example, when the temperature inside the storage compartment (20) is higher than a preset temperature, the control unit (100) may operate the compressor (71) of the cold air supply device (70) to lower the temperature of the storage compartment (20). In one example, the processor (101) may generate a command to control whether and how information is displayed through the display unit (80). In one example, the processor (101) may generate a command to control turning on the lighting unit (90) of the opened storage compartment (20) based on information about the opening of the door (30) from the proximity sensor (63). For example, the processor (101) may generate a command to control the operating state of each of the input unit (40), the communication unit (50), the sensor unit (60), and / or the lighting unit (90) described above.

[0081] In this drawing, the control unit (100) is disclosed as a single comprehensive configuration that controls all components included in the refrigerator (1), but this document is not limited thereto. In one example, the refrigerator (1) may be configured to include a plurality of control unit configurations that individually control some of the components of the refrigerator (1). In one example, the refrigerator (1) may include a separate control unit having a processor and a memory for controlling the operation of the cold air supply device (70) according to the output of the temperature sensor (61). In one example, the refrigerator (1) may include a separate control unit having a processor and a memory for controlling the operation of a user interface according to a user input. The processor (101) of the control unit (100) may include a plurality of processors, and the memory (102) may include a plurality of memory devices.

[0082] FIG. 3 illustrates the configuration of a cold air supply device (70) according to one embodiment of the present disclosure.

[0083] Referring to FIG. 3, the cooling supply device (70) may include a thermoelectric module (75), a cooling sink (76), and a heat sink (77). The thermoelectric module (75) may include a low-temperature section and a high-temperature section, and a temperature difference between the low-temperature section and the high-temperature section may be determined according to a voltage applied to the thermoelectric module (75). The thermoelectric module (75) may be installed such that the low-temperature section faces upward and the high-temperature section faces downward.

[0084] The outer periphery of the thermoelectric module (75) may be insulated with an insulating material. The thermoelectric module (75) and the insulating material may partition the cooling device room into a low-temperature chamber and a high-temperature chamber. Accordingly, the high-temperature section of the thermoelectric module (75) may not affect the low-temperature section of the thermoelectric module (75).

[0085] The cooling sink (76) may be installed so as to be in contact with or adjacent to the exposed surface of the low-temperature part of the thermoelectric module (75), i.e., the low-temperature surface. Accordingly, the cooling sink (76) may be installed on the upper side of the thermoelectric module (75). That is, the cooling sink (76) may be installed in the low-temperature room of the cooling device room.

[0086] The cooling sink (76) may include a cooling plate (76a) and cooling fins (76b). The cooling plate (76a) may be installed to be in contact with the thermoelectric module (75). The cooling plate (76a) may contact the low-temperature portion of the thermoelectric module (75) and transfer heat from the low-temperature portion of the thermoelectric module (75) to the cooling fins (76b). The cooling plate (76a) may be formed of a material with high thermal conductivity. For example, the cooling plate (76a) may be formed in a rectangular shape.

[0087] The cooling fins (76b) may be installed to be in contact with the cooling plate (76a). The cooling fins (76b) may be formed to protrude from one surface of the cooling plate (76a). For example, the cooling fins (76b) may be positioned on the upper portion of the cooling plate (76a). At least a portion of the cooling fins (76b) may be positioned in a low-temperature chamber within the cooling device room, and may cool the air through heat exchange with the air within the low-temperature chamber. For example, the cooling fins (76b) may be formed in multiple pieces to increase the heat exchange area with the air. The cooling fins (76b) may be formed in a rectangular shape and may be installed vertically and spaced apart at regular intervals on the upper surface of the cooling plate (76a). Accordingly, air introduced into the low-temperature chamber by the cooling fan (78) may flow between the multiple cooling fins (76b) and exchange heat with the air within the low-temperature chamber. The air supplied to the cooling sink (76) can be guided by a plurality of cooling fins (76b) and introduced into the cooling passage (13).

[0088] The heat sink (77) may be installed so as to be in contact with or adjacent to the exposed surface of the high temperature section of the thermoelectric module (75), i.e., the high temperature surface. Accordingly, the heat sink (77) may be installed on the lower side of the thermoelectric module (75). For example, the cooling sink (76) may be installed closer to the storage compartment than the heat sink (77).

[0089] The cold air supply device (70) may include a cooling fan (78) for circulating air in the storage room and a heat dissipation fan (79) for circulating outside air. The cooling fan (78) is installed above the cooling sink (76) and may circulate air in the storage room through the cooling sink (76). For example, the cooling fan (78) may be installed above the cooling sink (76) in the low-temperature room. Accordingly, air in the storage room may be sucked into the low-temperature room of the cooling device room by the cooling fan (78), passed through the cooling sink (76), and then discharged back into the storage room along the cooling path. Accordingly, the cooling fan (78) may circulate air in the storage room of the main body (10) to lower the temperature of the storage room.

[0090] An inlet port communicating with the storage room may be provided on the upper part of the cooling fan (78), i.e., on the upper surface of the cooling device room. Accordingly, when the cooling fan (78) operates, air from the storage room can be introduced into the low-temperature room of the cooling device room through the inlet port. The cooling fan (78) may be configured to supply air from the storage room to the cooling sink (76). Accordingly, when the cooling fan (78) operates, air from the storage room can be introduced into the low-temperature room and supplied to the plurality of cooling fins (76b) of the cooling sink (76). The air introduced by the cooling fan (78) can move along the plurality of cooling fins (76b) and exchange heat with the plurality of cooling fins (76b), thereby lowering its temperature. The air introduced by the cooling fan (78) can be introduced into the cooling passage. The cold air introduced into the cooling passage can be discharged into the storage room of the main body (10) through the discharge port.

[0091] The heat sink (77) can be installed so as to be in contact with or adjacent to the exposed surface of the high temperature part of the thermoelectric module (75), i.e., the high temperature surface. Accordingly, the heat sink (77) can be installed on the lower side of the thermoelectric module (75). That is, the heat sink (77) can be installed in the high temperature room of the cooling device room.

[0092] In one embodiment, a heat dissipation block (HB) may be installed between the heat sink (77) and the thermoelectric module (75). For example, one end of the heat dissipation block (HB) may be installed so that it contacts the high-temperature surface of the thermoelectric module (75), and the other end contacts the heat sink (77).

[0093] Meanwhile, in another embodiment, the heat sink (77) may be installed so as to be in direct contact with the high temperature surface of the thermoelectric module (75).

[0094] The heat sink (77) may include a heat sink (77a) and a heat sink fin (77b). The heat sink (77a) may be installed to be in contact with the thermoelectric module (75). The heat sink (77a) may contact a high-temperature portion of the thermoelectric module (75) and transfer heat from the high-temperature portion of the thermoelectric module (75) to the heat sink fin (77b). The heat sink (77a) may be formed of a material with high thermal conductivity. For example, the heat sink (77a) may be formed in a rectangular shape.

[0095] The heat dissipation fin (77b) may be installed to be in contact with the heat dissipation plate (77a). The heat dissipation fin (77b) may be formed to protrude from one surface of the heat dissipation plate (77a). The heat dissipation fin (77b) may be positioned at the lower portion of the heat dissipation plate (77a). At least a portion of the heat dissipation fin (77b) may be positioned in a high-temperature chamber within the cooling device room, and may cool the heat dissipation fin (77b) through heat exchange with external air introduced into the high-temperature chamber. The heat dissipation fin (77b) may be formed in multiple pieces to increase the heat exchange area with the external air. The heat dissipation fin (77b) may be formed in a rectangular shape and may be installed vertically at regular intervals on the lower surface of the heat dissipation plate (77a). Accordingly, the external air introduced by the heat dissipation fan (79) may flow between the multiple heat dissipation fins (77b) and exchange heat with the multiple heat dissipation fins (77b). The external air supplied to the heat sink (77) can be guided by a plurality of heat dissipation fins (77b) and discharged to the outside of the high-temperature room.

[0096] The heat dissipation fan (79) is installed on the lower side of the heat dissipation sink (77) and can be formed so as to circulate air outside the refrigerator (1) through the heat dissipation sink (77). That is, the heat dissipation fan (79) can be installed on the lower side of the heat dissipation sink (77) in the high-temperature room of the cooling device room. Accordingly, outside air can be sucked into the high-temperature room by the heat dissipation fan (79), pass through the heat dissipation sink (77), and then discharged back to the outside of the refrigerator (1). Accordingly, the heat dissipation fan (79) can lower the temperature of the heat dissipation sink (77) by sucking in outside air. That is, the heat dissipation fan (79) can lower the temperature of the high-temperature part of the thermoelectric module (75) by using the outside air.

[0097] An inlet and an outlet communicating with the outside may be provided on one side of the heat dissipation fan (79), i.e., on the side of the high-temperature room of the cooling device room. When the heat dissipation fan (79) operates, outside air may be drawn into the high-temperature room through the inlet, pass through the heat dissipation sink (77), and then be discharged to the outside of the high-temperature room through the outlet. Therefore, when the heat dissipation fan (79) operates, the heat dissipation sink (77) of the high-temperature room may be cooled by the outside air.

[0098] The heat dissipation fan (79) may be formed to supply outside air to the heat dissipation sink (77). Accordingly, when the heat dissipation fan (79) operates, outside air may be introduced into the high-temperature room and supplied to the plurality of heat dissipation fins (77b) of the heat dissipation sink (77). The outside air introduced into the high-temperature room by the heat dissipation fan (79) may move along the plurality of heat dissipation fins (77b) and exchange heat with the plurality of heat dissipation fins (77b), thereby lowering the temperature of the plurality of heat dissipation fins (77b). The air heated by the heat exchange with the plurality of heat dissipation fins (77b) may be discharged to the outside of the high-temperature room through the exhaust port. Accordingly, the heat dissipation fan (79) may release heat from the high-temperature part of the heat dissipation sink (77), i.e., the thermoelectric module (75), to the outside of the cooling device room, i.e., the outside of the main body (10).

[0099] FIG. 4 illustrates a cross-section of a thermoelectric module (400) according to one embodiment of the present disclosure, FIG. 5 illustrates thermoelectric cooling by the Peltier effect of a thermoelectric module (400) according to one embodiment of the present disclosure, and FIG. 6 illustrates thermoelectric power generation by the Seebeck effect of a thermoelectric module (400) according to one embodiment of the present disclosure.

[0100] Referring to FIG. 4, the thermoelectric module (400) of the present disclosure may include a lower substrate (410), a lower conductive pattern layer (420) formed on the lower substrate (410), a thermoelectric element layer (430) formed on the lower conductive pattern layer (420), an upper conductive pattern layer (440) formed on the thermoelectric element layer (430), an upper substrate (450) formed on the upper conductive pattern layer (440), and at least one SMD (Surface Mount Device) connector (460) electrically connected to the lower conductive pattern layer (420).

[0101] The lower substrate (410) can support the lower conductive pattern layer (420) and the thermoelectric element layer (430). The lower substrate (410) can be at least one of the cooling surface and the heat dissipation surface of the thermoelectric module (400). For example, the lower substrate (410) can be a ceramic substrate including at least one of alumina (Al2O3), aluminum nitride (AlN), beryllia (BeO), and silicon nitride (Si3N4). For example, the lower substrate (410) can be a metal substrate including at least one of aluminum (Al2O3), copper (Copper), stainless steel (Stainless Steel), and nickel (Nickel). However, the material of the lower substrate (410) of the present disclosure is not limited thereto, and for example, the lower substrate (410) may be implemented with various materials including at least one of sapphire, silicon, silicon carbide (SiC), aluminum silicon carbide composite (AlSiC), and quartz.

[0102] The lower conductive pattern layer (420) may include at least one lower electrode pattern. The at least one lower electrode pattern may be in electrical contact with at least one thermoelectric element. For example, the at least one lower electrode pattern may be in electrical contact with at least one of an n-type thermoelectric element and a p-type thermoelectric element. The at least one lower electrode pattern may be electrically connected to at least one SMD connector (460). For example, the at least one lower electrode pattern may include at least one of a positive terminal and a negative terminal that are electrically connected to the at least one SMD connector (460).

[0103] The thermoelectric element layer (430) may include at least one thermoelectric element. For example, the thermoelectric element layer (430) may include at least one of an n-type thermoelectric element and a p-type thermoelectric element. For example, the thermoelectric element layer (430) may include n-type thermoelectric elements and p-type thermoelectric elements that are alternately arranged.

[0104] At least one of the n-type thermoelectric element and the p-type thermoelectric element may include a thermoelectric material. For example, the thermoelectric material may include at least one of bismuth telluride (Bi2Te3), lead telluride (PbTe), silicon germanium (SiGe), skutterudite, a metal halide compound, and hafnium hydride (HfH2).

[0105] The upper conductive pattern layer (440) may include at least one upper electrode pattern. The at least one upper electrode pattern may be in electrical contact with at least one thermoelectric element. For example, the at least one upper electrode pattern may be in electrical contact with at least one of an n-type thermoelectric element and a p-type thermoelectric element.

[0106] The upper substrate (450) can support the upper conductive pattern layer (440). The upper substrate (450) can be at least one of a cooling surface and a heat dissipation surface of the thermoelectric module (400). For example, the upper substrate (450) can be a ceramic substrate including at least one of alumina (Al2O3), aluminum nitride (AlN), beryllia (BeO), and silicon nitride (Si3N4). For example, the upper substrate (450) can be a metal substrate including at least one of aluminum (Al2O3), copper (Copper), stainless steel (Stainless Steel), and nickel (Nickel). However, the material of the upper substrate (450) of the present disclosure is not limited thereto, and for example, the upper substrate (450) may be implemented with various materials including at least one of sapphire, silicon, silicon carbide (SiC), aluminum silicon carbide composite (AlSiC), and quartz.

[0107] At least one SMD connector (460) may be electrically connected to the lower conductive pattern layer (420). The at least one SMD connector (460) may include a body portion, an electrode connection portion electrically connected to at least one lower electrode pattern, and a wire connection portion to which at least one wire is connected.

[0108] At least one SMD connector (460) can be electrically connected to at least one lower electrode pattern to supply power to the thermoelectric element layer (430). For example, at least one SMD connector (460) can be connected to at least one positive terminal. The at least one positive terminal can be in electrical contact with the n-type thermoelectric element. For example, at least one SMD connector (460) can be connected to at least one negative terminal. The at least one negative terminal can be in electrical contact with the p-type thermoelectric element.

[0109] In one embodiment, when the thermoelectric module (400) is powered on, power may be transmitted to the thermoelectric module (400) via at least one SMD connector (460). For example, when the thermoelectric module (400) is powered on, current may flow from the positive terminal to the n-type thermoelectric element. For example, when the thermoelectric module (400) is powered on, current may flow from the negative terminal to the p-type thermoelectric element. For example, the at least one SMD connector (460) may be electrically connected to an external power source via at least one wire.

[0110] For example, as shown in FIG. 5, at least one lower electrode pattern may include at least one of a positive terminal in electrical contact with an n-type thermoelectric element and a negative terminal in electrical contact with a p-type thermoelectric element. The thermoelectric module (400) may receive power from an external power supply source through the positive terminal and the negative terminal. For example, when a DC voltage is applied from an external power supply source to the thermoelectric module (400), heat generation and heat absorption may occur at both ends of the thermoelectric element layer (430) as holes in the p-type thermoelectric element and electrons in the n-type thermoelectric element move.

[0111] For example, as shown in Fig. 6, at least one of the lower electrode pattern of the lower conductive pattern layer (420) and the upper electrode pattern of the upper conductive pattern layer (440) may be exposed to a heat source. When heat is supplied by an external heat source, the thermoelectric module (400) may generate power by generating current in the thermoelectric element as electrons and holes move.

[0112] FIG. 7 illustrates a perspective view of a thermoelectric module (400) according to one embodiment of the present disclosure, FIG. 8 illustrates a plan view of a thermoelectric module (400) according to one embodiment of the present disclosure, FIG. 9A illustrates a perspective view of an SMD connector (460) according to one embodiment of the present disclosure, and FIG. 9B illustrates a plan view of an SMD connector (460) according to one embodiment of the present disclosure.

[0113] Referring to FIGS. 7 to 9b, the thermoelectric module (400) of the present disclosure may include a lower substrate (410), a lower conductive pattern layer (420) formed on the lower substrate (410), a thermoelectric element layer (430) formed on the lower conductive pattern layer (420), an upper conductive pattern layer (440) formed on the thermoelectric element layer (430), an upper substrate (450) formed on the upper conductive pattern layer (440), and at least one SMD connector (460) electrically connected to the lower conductive pattern layer (420).

[0114] As shown in FIG. 7, the thermoelectric element layer (430) can be disposed between the lower conductive pattern layer (420) and the upper conductive pattern layer (440). The thermoelectric element layer (430) can include at least one thermoelectric element. For example, the thermoelectric element layer (430) can include at least one of an n-type thermoelectric element (430a) and a p-type thermoelectric element (430b). For example, as shown in FIGS. 7 and 8, the thermoelectric element layer (430) can include n-type thermoelectric elements (430a) and p-type thermoelectric elements (430b) that are alternately arranged.

[0115] The lower conductive pattern layer (420) may include at least one lower electrode pattern (420p). At least one lower electrode pattern (420p) may be electrically connected to at least one thermoelectric element.

[0116] The upper conductive pattern layer (440) may include at least one upper electrode pattern (440p). At least one upper electrode pattern (440p) may be electrically connected to at least one thermoelectric element.

[0117] The at least one lower electrode pattern (420p) may include a positive terminal electrically connected to the at least one SMD connector (460), and a negative terminal electrically connected to the at least one SMD connector (460).

[0118] For example, the positive terminal may be in electrical contact with an n-type thermoelectric element (430a). For example, the negative terminal may be in electrical contact with a p-type thermoelectric element (430b).

[0119] The at least one SMD connector (460) is connected to an external power supply source through at least one wire and can transmit current applied from the power supply source to the lower conductive pattern layer (420).

[0120] In one embodiment, the at least one SMD connector (460) may be a 1-pin SMD connector (460a, 460b) connected to at least one of the positive terminal and the negative terminal. For example, the at least one SMD connector (460) may include a positive 1-pin SMD connector (460a) connected to the positive terminal and a negative 1-pin SMD connector (460b) connected to the negative terminal.

[0121] As shown in FIGS. 7 and 8, the positive 1-pin SMD connector (460a) and the negative 1-pin SMD connector (460b) can be mounted spaced apart from each other on the lower conductive pattern layer (420). For example, the positive terminal and the negative terminal can be disposed spaced apart from each other on the lower conductive pattern layer (420). For example, the positive 1-pin SMD connector (460a) and the negative 1-pin SMD connector (460b) can be mounted spaced apart from each other on the lower conductive pattern layer (420) by being connected to the positive terminal and the negative terminal, respectively.

[0122] Referring to FIGS. 9a and 9b, at least one SMD connector (460) may include a body portion (461), an electrode connection portion (462) electrically connected to at least one lower electrode pattern (420p), and a wire connection portion (463) to which at least one wire is connected.

[0123] The body portion (461) may be a frame of at least one SMD connector (460). The body portion (461) may support an electrode connection portion (462) and a wire connection portion (463). An internal hole into which at least one wire can be inserted may be formed inside the body portion (461).

[0124] The electrode connector (462) may be electrically connected to at least one lower electrode pattern (420p). For example, the electrode connector (462) may include an electrode pin connected to at least one of a positive terminal and a negative terminal.

[0125] The wire connection portion (463) can be connected to at least one wire. For example, the wire connection portion (463) can stably transmit current applied from an external power source by supporting at least one wire.

[0126] FIG. 10 illustrates a perspective view of a thermoelectric module (400) according to one embodiment of the present disclosure, FIG. 11 illustrates a plan view of a thermoelectric module (400) according to one embodiment of the present disclosure, FIG. 12a illustrates a perspective view of an SMD connector (460) according to one embodiment of the present disclosure, and FIG. 12b illustrates a plan view of an SMD connector (460) according to one embodiment of the present disclosure.

[0127] Referring to FIGS. 10 to 12b, the thermoelectric module (400) of the present disclosure may include a lower substrate (410), a lower conductive pattern layer (420) formed on the lower substrate (410), a thermoelectric element layer (430) formed on the lower conductive pattern layer (420), an upper conductive pattern layer (440) formed on the thermoelectric element layer (430), an upper substrate (450) formed on the upper conductive pattern layer (440), and at least one SMD connector (460) electrically connected to the lower conductive pattern layer (420).

[0128] As shown in FIG. 10, the thermoelectric element layer (430) can be disposed between the lower conductive pattern layer (420) and the upper conductive pattern layer (440). The thermoelectric element layer (430) can include at least one thermoelectric element. For example, the thermoelectric element layer (430) can include at least one of an n-type thermoelectric element (430a) and a p-type thermoelectric element (430b). For example, as shown in FIGS. 10 and 11, the thermoelectric element layer (430) can include n-type thermoelectric elements (430a) and p-type thermoelectric elements (430b) that are alternately arranged.

[0129] The lower conductive pattern layer (420) may include at least one lower electrode pattern (420p). At least one lower electrode pattern (420p) may be electrically connected to at least one thermoelectric element.

[0130] The upper conductive pattern layer (440) may include at least one upper electrode pattern (440p). At least one upper electrode pattern (440p) may be electrically connected to at least one thermoelectric element.

[0131] The at least one lower electrode pattern (420p) may include a positive terminal electrically connected to the at least one SMD connector (460), and a negative terminal electrically connected to the at least one SMD connector (460).

[0132] For example, the positive terminal may be in electrical contact with an n-type thermoelectric element (430a). For example, the negative terminal may be in electrical contact with a p-type thermoelectric element (430b).

[0133] The at least one SMD connector (460) is connected to an external power supply source through at least one wire and can transmit current applied from the power supply source to the lower conductive pattern layer (420).

[0134] In one embodiment, the at least one SMD connector (460) may be a two-pin SMD connector (460) each connected to at least one of the positive terminal and the negative terminal. For example, the at least one SMD connector (460) may be a two-pin SMD connector (460) including a first pin connected to the positive terminal and a second pin connected to the negative terminal.

[0135] As shown in FIGS. 10 and 11, the first pin and the second pin of the 2-pin SMD connector (460) can be mounted adjacently on the lower conductive pattern layer (420). For example, the positive terminal and the negative terminal can be disposed adjacently on the lower conductive pattern layer (420). For example, the first pin and the second pin of the 2-pin SMD connector (460) can be mounted adjacently on the lower conductive pattern layer (420) by being connected to the positive terminal and the negative terminal, respectively.

[0136] Referring to FIGS. 12a and 12b, at least one SMD connector (460) may include a body portion (461), an electrode connection portion (462) electrically connected to at least one lower electrode pattern (420p), and a wire connection portion (463) to which at least one wire is connected.

[0137] The body portion (461) may be a frame of at least one SMD connector (460). The body portion (461) may support an electrode connection portion (462) and a wire connection portion (463). An internal hole into which at least one wire can be inserted may be formed inside the body portion (461).

[0138] The electrode connector (462) may be electrically connected to at least one lower electrode pattern (420p). For example, the electrode connector (462) may include a first pin (462a) connected to the positive terminal and a second pin (462b) connected to the negative terminal.

[0139] The wire connection portion (463) can be connected to at least one wire. For example, the wire connection portion (463) can stably transmit current applied from an external power source by supporting at least one wire.

[0140] Accordingly, a refrigerator including a thermoelectric module (400) of the present disclosure does not need to perform a separate process of soldering a power supply wire after the manufacturing process of the thermoelectric module (400), thereby simplifying the manufacturing process of the thermoelectric module (400) and reducing the manufacturing cost.

[0141] In addition, a refrigerator including a thermoelectric module (400) of the present disclosure can increase heat transfer efficiency and improve the performance of the thermoelectric module (400) by precise electrical connection between the conductive pattern layer of the thermoelectric module (400) and the SMD connector (460).

[0142] In addition, a refrigerator including a thermoelectric module (400) can reduce the disposal rate of the thermoelectric module (400) and increase the lifespan of the thermoelectric module (400), as the maintenance, repair, and replacement of the thermoelectric module (400) is easy since an SMD connector (460) is mounted on the thermoelectric module (400).

[0143] Meanwhile, although FIGS. 1 to 3 illustrate an embodiment in which the thermoelectric module (400) of the present disclosure is applied to a refrigerator, the refrigerator is merely an example of an electronic device to which the thermoelectric module (400) of the present disclosure is applied, and does not limit the electronic device to which the thermoelectric module (400) of the present disclosure is applied. For example, the electronic device to which the thermoelectric module (400) of the present disclosure is applied may include not only a refrigerator, but also various electronic devices to which thermoelectric elements can be applied, such as a dishwasher, an electric range, an electric oven, an air conditioner, a clothes manager, a washing machine, a dryer, and a microwave oven.

[0144] FIG. 13 illustrates a method for manufacturing a thermoelectric module for a refrigerator according to one embodiment of the present disclosure.

[0145] Referring to FIG. 13, a method for manufacturing a thermoelectric module for a refrigerator according to embodiments of the present disclosure may include an operation of forming (1310) a lower conductive pattern layer (420) on a lower substrate (410), an operation of forming (1320) an upper conductive pattern layer (440) on an upper substrate (450), an operation of forming (1330) a thermoelectric element layer (430) on the lower conductive pattern layer (420), an operation of performing (1340) a reflow process on the lower substrate (410), the thermoelectric element layer (430), and the upper substrate (450), and an operation of soldering (1350) at least one SMD connector (460) to the lower conductive pattern layer (420).

[0146] According to an example, in operation 1310, a method of manufacturing a thermoelectric module may form a lower conductive pattern layer (420) on a lower substrate (410). For example, the lower substrate (410) may support the lower conductive pattern layer (420) and the thermoelectric element layer (430). The lower substrate (410) may be at least one of a cooling surface and a heat dissipation surface of the thermoelectric module (400). For example, the lower substrate (410) may be a ceramic substrate including at least one of alumina (Al2O3), aluminum nitride (AlN), beryllia (BeO), and silicon nitride (Si3N4). For example, the lower substrate (410) may be a metal substrate including at least one of aluminum (Al2O3), copper (Copper), stainless steel (Stainless Steel), and nickel (Nickel). However, the material of the lower substrate (410) of the present disclosure is not limited thereto, and for example, the lower substrate (410) may be implemented with various materials including at least one of sapphire, silicon, silicon carbide (SiC), aluminum silicon carbide composite (AlSiC), and quartz.

[0147] The lower conductive pattern layer (420) may include at least one lower electrode pattern (420p). The at least one lower electrode pattern (420p) may be in electrical contact with at least one thermoelectric element. For example, the at least one lower electrode pattern (420p) may be in electrical contact with at least one of an n-type thermoelectric element (430a) and a p-type thermoelectric element (430b).

[0148] According to an example, in operation 1320, a method for manufacturing a thermoelectric module may form an upper conductive pattern layer (440) on an upper substrate (450). For example, the upper substrate (450) may support the upper conductive pattern layer (440). The upper substrate (450) may be at least one of a cooling surface and a heat dissipation surface of the thermoelectric module (400). For example, the upper substrate (450) may be a ceramic substrate including at least one of alumina (Al2O3), aluminum nitride (AlN), beryllia (BeO), and silicon nitride (Si3N4). For example, the upper substrate (450) may be a metal substrate including at least one of aluminum (Al2O3), copper (Copper), stainless steel (Stainless Steel), and nickel (Nickel). However, the material of the upper substrate (450) of the present disclosure is not limited thereto, and for example, the upper substrate (450) may be implemented with various materials including at least one of sapphire, silicon, silicon carbide (SiC), aluminum silicon carbide composite (AlSiC), and quartz.

[0149] The upper conductive pattern layer (440) may include at least one upper electrode pattern (440p). The at least one upper electrode pattern (440p) may be in electrical contact with at least one thermoelectric element. For example, the at least one upper electrode pattern (440p) may be in electrical contact with at least one of an n-type thermoelectric element (430a) and a p-type thermoelectric element (430b).

[0150] According to an example, in operation 1330, a method for manufacturing a thermoelectric module may form a thermoelectric element layer (430) on the lower conductive pattern layer (420). For example, the thermoelectric element layer (430) may include at least one thermoelectric element. For example, the thermoelectric element layer (430) may include at least one of an n-type thermoelectric element (430a) and a p-type thermoelectric element (430b). For example, the thermoelectric element layer (430) may include n-type thermoelectric elements (430a) and p-type thermoelectric elements (430b) that are alternately arranged.

[0151] According to an example, in operation 1340, the method for manufacturing a thermoelectric module may perform a reflow process on the lower substrate (410), the thermoelectric element layer (430), and the upper substrate (450). For example, the lower substrate (410), the thermoelectric element layer (430), and the upper substrate (450) may be sequentially laminated in the reflow process and fixed through solder paste. For example, in the reflow process, the lower conductive pattern layer (420), the thermoelectric element layer (430), and the upper conductive pattern layer (440) may be electrically connected.

[0152] In one example, in operation 1350, the method for manufacturing a thermoelectric module may solder at least one SMD connector (460) to the lower conductive pattern layer (420). For example, the at least one SMD connector (460) may be electrically connected to the lower conductive pattern layer (420). The at least one SMD connector (460) may be electrically connected to at least one lower electrode pattern (420p), thereby supplying power to the thermoelectric element layer (430). For example, the at least one SMD connector (460) may be connected to at least one positive terminal. The at least one positive terminal may be in electrical contact with an n-type thermoelectric element (430a). For example, the at least one SMD connector (460) may be connected to at least one negative terminal. The at least one negative terminal may be in electrical contact with a p-type thermoelectric element (430b).

[0153] In this way, the method for manufacturing a thermoelectric module (400) for a refrigerator of the present disclosure can manufacture a thermoelectric module (400) equipped with an SMD connector (460) that receives power from the outside through a wire.

[0154] Therefore, the method for manufacturing a thermoelectric module (400) for a refrigerator of the present disclosure does not require a separate process of soldering a power supply wire after the manufacturing process of the thermoelectric module (400), thereby simplifying the manufacturing process of the thermoelectric module (400) and reducing the manufacturing cost.

[0155] In addition, the method for manufacturing a thermoelectric module (400) for a refrigerator of the present disclosure can increase heat transfer efficiency and improve the performance of the thermoelectric module (400) by precise electrical connection between the conductive pattern layer of the thermoelectric module (400) and the SMD connector (460).

[0156] In addition, the method for manufacturing a thermoelectric module (400) for a refrigerator can reduce the disposal rate of the thermoelectric module (400) and increase the lifespan of the thermoelectric module (400), as the SMD connector (460) is mounted on the thermoelectric module (400), making maintenance, repair, and replacement of the thermoelectric module (400) easy.

[0157] However, since this has been described above, a duplicate explanation will be omitted.

[0158] A refrigerator (1) according to embodiments of the present disclosure may include a storage compartment (20), a main body (10) including the storage compartment (20), and a cold air supply device (70) for supplying cold air to the storage compartment (20). The cold air supply device (70) may include a thermoelectric module (400). The thermoelectric module (400) may include a lower substrate (410), a lower conductive pattern layer (420) formed on the lower substrate (410), a thermoelectric element layer (430) formed on the lower conductive pattern layer (420), an upper conductive pattern layer (440) formed on the thermoelectric element layer (430), an upper substrate (450) formed on the upper conductive pattern layer (440), and at least one SMD connector (460) electrically connected to the lower conductive pattern layer (420).

[0159] In one embodiment, the lower conductive pattern layer (420) may include at least one lower electrode pattern (420p). The at least one lower electrode pattern (420p) may include a positive terminal electrically connected to the at least one SMD connector (460), and a negative terminal electrically connected to the at least one SMD connector (460).

[0160] In one embodiment, the thermoelectric element layer (430) may include n-type thermoelectric elements (430a) and p-type thermoelectric elements (430b) arranged alternately.

[0161] In one embodiment, the positive terminal may be in electrical contact with an n-type thermoelectric element (430a). The negative terminal may be in electrical contact with a p-type thermoelectric element (430b).

[0162] In one embodiment, the at least one SMD connector (460) is connected to an external power supply source via at least one wire and can transmit current applied from the power supply source to the lower conductive pattern layer (420).

[0163] In one embodiment, the at least one SMD connector (460) may include a body portion (461), an electrode connection portion (462) electrically connected to at least one lower electrode pattern (420p), and a wire connection portion (463) to which at least one wire is connected.

[0164] In one embodiment, the at least one SMD connector (460) may be a 1-pin SMD connector connected to at least one of the positive terminal and the negative terminal.

[0165] In one embodiment, the positive terminal and the negative terminal may be spaced apart from each other on the lower conductive pattern layer (420).

[0166] In one embodiment, the at least one SMD connector (460) may be a two-pin SMD connector each connected to at least one of the positive terminal and the negative terminal.

[0167] In one embodiment, the positive terminal and the negative terminal may be adjacently disposed on the lower conductive pattern layer (420).

[0168] A method for manufacturing a thermoelectric module for a refrigerator according to embodiments of the present disclosure may include an operation of forming a lower conductive pattern layer (420) on a lower substrate (410), an operation of forming an upper conductive pattern layer (440) on an upper substrate (450), an operation of forming a thermoelectric element layer (430) on the lower conductive pattern layer (420), an operation of performing a reflow process on the lower substrate (410), the thermoelectric element layer (430), and the upper substrate (450), and an operation of soldering at least one SMD connector (460) to the lower conductive pattern layer (420).

[0169] In one embodiment, the operation of forming the lower conductive pattern layer (420) on the lower substrate (410) may include the operation of forming the lower conductive pattern layer (420) including at least one lower electrode pattern (420p) on the lower substrate (410). The operation of forming the lower conductive pattern layer (420) may include the operation of forming a positive terminal electrically connected to the at least one SMD connector (460), and the operation of forming a negative terminal electrically connected to the at least one SMD connector (460).

[0170] In one embodiment, the operation of forming a thermoelectric element layer (430) on the lower conductive pattern layer (420) may include an operation of forming an n-type thermoelectric element (430a) and a p-type thermoelectric element (430b) that are alternately arranged on the lower conductive pattern layer (420).

[0171] In one embodiment, the positive terminal may be in electrical contact with an n-type thermoelectric element (430a). The negative terminal may be in electrical contact with a p-type thermoelectric element (430b).

[0172] In one embodiment, the at least one SMD connector (460) is connected to an external power supply source via at least one wire and can transmit current applied from the power supply source to the lower conductive pattern layer (420).

[0173] In one embodiment, the at least one SMD connector (460) may include a body portion (461), an electrode connection portion (462) electrically connected to at least one lower electrode pattern (420p), and a wire connection portion (463) to which at least one wire is connected.

[0174] In one embodiment, the at least one SMD connector (460) may be a 1-pin SMD connector connected to at least one of the positive terminal and the negative terminal.

[0175] In one embodiment, the positive terminal and the negative terminal may be spaced apart from each other on the lower conductive pattern layer (420).

[0176] In one embodiment, the at least one SMD connector (460) may be a two-pin SMD connector each connected to at least one of the positive terminal and the negative terminal.

[0177] In one embodiment, the positive terminal and the negative terminal may be adjacently disposed on the lower conductive pattern layer (420).

Claims

1. In the refrigerator (1), Storage room (20); A main body (10) including the storage room; and Includes a cold air supply device (70) that supplies cold air to the above storage room, The above cooling device includes a thermoelectric module (75), The above thermoelectric module (75) is Lower substrate (410); A lower conductive pattern layer (420) formed on the lower substrate (410); A thermoelectric element layer (430) formed on the lower conductive pattern layer (420); An upper conductive pattern layer (440) formed on the above thermoelectric element layer (430); An upper substrate (450) formed on the upper conductive pattern layer (440); and At least one SMD (Surface Mount Device) connector (460) electrically connected to the lower conductive pattern layer (420), refrigerator.

2. In paragraph 1, The above lower conductive pattern layer (420) includes at least one lower electrode pattern (420p), At least one of the lower electrode patterns (420p) above, A positive terminal electrically connected to at least one SMD connector (460); and including a negative terminal electrically connected to at least one SMD connector (460); refrigerator.

3. In paragraph 2, The above thermoelectric element layer (430) is Comprising alternately arranged n-type thermoelectric elements (430a) and p-type thermoelectric elements (430b), refrigerator.

4. In paragraph 2, The above positive terminal is in electrical contact with the n-type thermoelectric element (430a), The above negative terminal is in electrical contact with the p-type thermoelectric element (430b). refrigerator.

5. In any one of paragraphs 2 to 4, At least one SMD connector (460) above, Connected to an external power supply source through at least one wire, and transmitting current applied from the power supply source to the lower conductive pattern layer (420), refrigerator.

6. In any one of paragraphs 2 to 4, At least one SMD connector (460) above, Body part (461); An electrode connection (462) electrically connected to at least one lower electrode pattern; and Including a wire connection portion (463) to which at least one wire is connected; refrigerator.

7. In any one of paragraphs 2 to 6, The above at least one SMD connector (460) is a 1-pin SMD connector connected to at least one of the positive terminal and the negative terminal. refrigerator.

8. In paragraph 7, The positive terminal and the negative terminal are spaced apart from each other on the lower conductive pattern layer (420). refrigerator.

9. In any one of paragraphs 2 to 6, The above at least one SMD connector (460) is a 2-pin SMD connector each connected to at least one of the positive terminal and the negative terminal. refrigerator.

10. In paragraph 9, The positive terminal and the negative terminal are arranged adjacently on the lower conductive pattern layer (420). refrigerator.

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