Cassette device, sensor assembly pickup method, and analyte monitoring system

Abstract

The present disclosure describes a cassette device, a sensor assembly pickup method, and an analyte monitoring system. The cassette device comprises a housing having an accommodating space, a support mechanism detachably supporting a sensor assembly, and a booster mechanism. The support mechanism, the booster mechanism, and the sensor assembly supported by the support mechanism are located in the accommodating space. The support mechanism is tightly combined with the sensor assembly to restrict the movement of the sensor assembly. When the sensor assembly is separated from the support mechanism under the action of a pickup device coupled to the sensor assembly, the booster mechanism provides an acting force to the pickup device in a direction away from the support mechanism. According to the present disclosure, the cassette device with high reliability during the sensor assembly pickup process, the sensor assembly pickup method, and the analyte monitoring system can be provided.

Description

Cartridge device, sensor assembly picking method, and analyte monitoring system Technical Field

[0001] The present disclosure relates to the field of medical devices, and in particular to a cartridge device, a method for picking up a sensor assembly, and an analyte monitoring system. Background Art

[0002] Diabetes and its chronic complications have become one of the most serious diseases affecting human health today. To delay and reduce the chronic complications of diabetes, strict glucose control is necessary. Currently, continuous glucose monitoring systems (CGMS), which dynamically reflect glucose fluctuations, are widely used.

[0003] CGMS typically uses a subcutaneous sensor connected to an electronic component to monitor glucose concentration in body fluids. Since the sensor needs to be implanted in the host during use, the probe must be thoroughly sterilized and disinfected before use for the host's health and safety. Common sensor sterilization methods involve radiation sterilization (e.g., electron beam sterilization and gamma ray sterilization). Radiation sterilization of both the electronic component and the sensor component can damage the electronic component's circuitry. Therefore, existing technologies sterilize the sensor component separately and then assemble the sensor component with the electronic component before use. Specifically, a separate container is typically used to house the sensor component, sterilize it, and seal it. Before use, an application device containing the electronic component is used to pick up the sensor component from the container. The electronic component and sensor component are coupled to form a complete sensor control device, which is then removed from the container by the application device. The application device is then used to apply the sensor control device to the user's body surface. To ensure that the sensor control device applied to the user easily detaches from the application device and remains on the user's body surface, the electronic component is typically detachably mounted within the application device, and the application device does not exert excessive force on the electronic component.

[0004] However, during the process of the electronic component and the sensor component being coupled to form a sensor control device and then separated from the container, if the container has a strong holding force on the sensor component, when overcoming the force and releasing the sensor component from the holding state, the electronic component may be pulled by the force and shifted or even fall off from the applying device, affecting the overall reliability of the monitoring kit. Summary of the Invention

[0005] The present disclosure is proposed in view of the above-mentioned state of the prior art, and its purpose is to provide a cartridge device, a sensor component picking method, and an analyte monitoring system with high reliability in the sensor component picking process.

[0006] To this end, a first aspect of the present disclosure provides a box device for holding a sensor assembly, the box device comprising a shell having a accommodating space, a supporting mechanism for detachably supporting the sensor assembly, and a boosting mechanism, the supporting mechanism, the boosting mechanism, and the sensor assembly supported by the supporting mechanism are located in the accommodating space, the supporting mechanism is tightly combined with the sensor assembly to limit the movement of the sensor assembly, when the sensor assembly leaves the supporting mechanism under the action of a picking device coupled to the sensor assembly, the boosting mechanism provides a force to the picking device away from the supporting mechanism.

[0007] In the box device involved in the first aspect of the present disclosure, the box device includes a supporting mechanism and a boosting mechanism. The supporting mechanism is tightly combined with the sensor assembly to stably set the sensor assembly in the box device, and it is convenient for the two to be aligned when the pickup device is used to pick up the sensor assembly later. The boosting mechanism provides a force to the pickup device away from the supporting mechanism when the pickup device leaves the supporting mechanism after picking up the sensor assembly, which can reduce the influence of the holding force of the supporting mechanism on the sensor assembly on the pickup device's own structure (that is, the thrust provided by the boosting mechanism can partially offset the holding force of the supporting mechanism). This is conducive to the sensor assembly tightly combined with the supporting mechanism to smoothly detach from the supporting mechanism under the action of the pickup device, thereby improving the reliability of the pickup device picking up the sensor assembly. Thus, a box device that can stably hold the sensor assembly and improve the reliability of the pickup device picking up the sensor assembly can be provided.

[0008] In addition, in the box device involved in the first aspect of the present disclosure, optionally, the picking device includes an applying device that detachably holds the electronic component, the applying device is coupled to the box device to pick up the sensor component so that the sensor component and the electronic component are coupled to form an application component, and the boosting mechanism provides a force to the electronic component away from the support mechanism. In this case, after the applying device couples the electronic component and the sensor component to form an application component, the force applied by the applying device to the electronic component away from the support mechanism is transmitted to the sensor component through the electronic component. Conversely, when the sensor component is separated from the support mechanism, the holding force of the support mechanism on the sensor component is transmitted to the electronic component via the sensor component. At this time, the electronic component detachably held on the applying device is simultaneously subjected to the force away from the support mechanism and the resistance converted from the holding force of the support mechanism. The force provided to the electronic component by the boosting mechanism can offset part of the resistance, reducing the occurrence of undesirable displacement of the electronic component due to the resistance or even separation from the applying device. Therefore, the reliability of the applying device picking up the sensor component from the box device via the detachable electronic component can be improved.

[0009] In addition, in the cartridge device according to the first aspect of the present disclosure, optionally, the boost mechanism includes a drive unit, and during the process of the applicator assembly leaving the support mechanism, the drive unit abuts against a surface of the electronic component facing away from the application device to provide a force to move the electronic component away from the support mechanism. In this case, when the drive unit provides a force to move the electronic component away from the support mechanism to partially offset the resistance of the support mechanism, the force can also help press the electronic component toward the application device, further improving the stability of the electronic component held on the application device.

[0010] In addition, in the box device involved in the first aspect of the present disclosure, optionally, the driving portion includes an elastic element, and the elastic element is in a compressed state when the applying device picks up the sensor component; and during the process of the applying component leaving the supporting mechanism, the end of the driving portion contacts the surface of the electronic component facing away from the applying device to provide a force to the electronic component away from the supporting mechanism. In this case, the elastic element in a compressed state after the picking is completed stores elastic potential energy, and during the process of the applying component leaving the supporting mechanism, the driving portion including the elastic element contacts the surface of the electronic component and can use the elastic potential energy to provide a force to the electronic component away from the supporting mechanism.

[0011] In addition, in the box device involved in the first aspect of the present disclosure, optionally, the surface of the electronic component facing away from the application device is a sticky surface, and the contact area between the drive unit and the sticky surface accounts for no more than 10% of the total area of ​​the sticky surface. When in use, the application device generally applies the application component to the host's body surface. In this case, setting the surface of the electronic component facing away from the application device to a sticky surface can facilitate the electronic component to be detached from the application device and remain on the host's body surface by adhering to the host's body surface after being applied to the host's body surface; configuring the contact area between the drive unit and the sticky surface to account for no more than 10% of the total area of ​​the surface can effectively realize the force transmission between the boosting mechanism and the electronic component, reduce the pulling force on the electronic component caused by adhesion when the drive unit is detached from the sticky surface, thereby facilitating the electronic component to be stably maintained on the application device.

[0012] In addition, in the box device involved in the first aspect of the present disclosure, optionally, the surface of the electronic component facing away from the applying device includes a first area with stickiness, and a second area with less stickiness than the first area, the first area is located on the periphery of the second area, and the driving part is in contact with the second area. In this case, setting the surface of the electronic component facing away from the applying device to include the first area with stickiness can facilitate the electronic component to be detached from the applying device and maintained on the host's body surface by adhesion to the host's body surface after being applied to the host's body surface. In addition, setting a second area with less stickiness than the first area and configuring the driving part to be in contact with the second area can effectively achieve force transmission while reducing the pulling force on the electronic component caused by adhesion when the driving part is detached from the second area, thereby facilitating the electronic component to be stably maintained on the applying device.

[0013] In addition, in the box device involved in the first aspect of the present disclosure, optionally, the outer contour of the portion of the driving unit that contacts the electronic component is a curved surface. In this case, while effectively achieving force transmission, the contact area between the driving unit and the electronic component can be reduced, thereby reducing the pulling force on the electronic component caused by adhesion when the driving unit and the electronic component are separated, so that the electronic component can be stably retained on the application device. In addition, compared to a sharp surface, setting the contact surface as a curved surface can also reduce the damage to the electronic component that may be caused by the driving unit applying force to the electronic component.

[0014] In addition, the cartridge device according to the first aspect of the present disclosure may optionally further include a retaining portion for tightly retaining the sensor assembly, wherein the retaining portion is a male-female mechanical mating structure provided on the support mechanism and the sensor assembly, respectively, and the male-female mechanical mating structure is a clearance fit and / or an interference fit. In this case, the sensor assembly and the support mechanism can be tightly coupled by the male-female mechanical mating structure.

[0015] In addition, in the box device involved in the first aspect of the present disclosure, optionally, it further includes a limit cover located in the storage space, the limit cover is arranged above the sensor assembly and has a limit structure arranged on the periphery of at least part of the components of the sensor assembly in a manner that does not contact the sensor assembly, and the sensor assembly is in a pick-up state after the limit cover leaves the storage space. The box device may shake during transportation. In this case, the limit cover having a limit structure arranged on the periphery of part of the structure of the sensor assembly can further limit the undesirable displacement and / or rotation of the sensor assembly, and maintain the sensor assembly in a predetermined position to facilitate alignment when the subsequent picking device picks it up; compared with the method of direct contact with the sensor assembly, the limit structure is arranged on the periphery of the sensor assembly in a manner that does not contact the sensor assembly, which can reduce the situation where the friction between the two caused by the movement of the limit structure causes undesirable displacement of the sensor assembly.

[0016] In addition, the box device according to the first aspect of the present disclosure may optionally further include a retaining mechanism for retaining the position-limiting cover, wherein the retaining mechanism is configured to provide a predetermined retaining force to the position-limiting cover, wherein the retaining force is greater than the self-weight of the position-limiting cover. During transportation or when the box device is opened by a user, the box device as a whole may shake or even invert. In such cases, using the retaining mechanism to retain the position-limiting cover can reduce the possibility of the position-limiting cover moving unintentionally within the housing or even falling out of the housing.

[0017] In addition, the cartridge device according to the first aspect of the present disclosure may optionally further include an opening and a sealing portion, wherein the housing space of the housing communicates with the outside via the opening, and the sealing portion is detachably mounted on the opening to seal the housing space. In this case, after sterilization, the housing space is a sealed chamber, which can reduce contamination from the external environment. When the housing space is to be used, the sealing portion can be removed from the opening to release the seal and access components within the housing.

[0018] A second aspect of the present disclosure provides a method for picking up a sensor assembly, comprising: using a support mechanism in a container to tightly and detachably hold the sensor assembly; using a picking device that can be coupled to the container to pick up the sensor assembly, and during the picking process, using a boosting mechanism to provide a force to the picking device away from the support mechanism.

[0019] In the picking method involved in the second aspect of the present disclosure, the support mechanism in the box device is tightly combined with the sensor assembly to detachably hold the sensor assembly, which can stably set the sensor assembly in the box device and facilitate the alignment of the two when the pickup device is subsequently used to pick up the sensor assembly; the boosting mechanism provides a force to the pickup device away from the support mechanism when the pickup device leaves the support mechanism after picking up the sensor assembly, which can reduce the influence of the holding force of the support mechanism on the pickup device's own structure on the sensor assembly (that is, the thrust provided by the boosting mechanism can partially offset the holding force of the support mechanism), which is conducive to the sensor assembly tightly combined with the support mechanism to smoothly detach from the support mechanism under the action of the pickup device, thereby improving the reliability of the pickup device picking up the sensor assembly. As a result, a highly reliable pickup method for sensor assemblies can be provided.

[0020] The third aspect of the present disclosure provides an analyte monitoring system, comprising a sensor assembly, a box device that detachably holds the sensor assembly, an electronic assembly, and an application device that detachably holds the electronic assembly, the box device comprising a supporting mechanism that detachably supports the sensor assembly, and a boosting mechanism, the supporting mechanism being tightly combined with the sensor assembly to limit the movement of the sensor assembly, the application device being coupled to the box device to couple the electronic assembly and the sensor assembly to form an application assembly, and when the sensor assembly leaves the supporting mechanism under the action of the electronic assembly and the application device, the boosting mechanism provides a force to the electronic assembly away from the supporting mechanism.

[0021] In the analyte monitoring system involved in the third aspect of the present disclosure, the box device includes a supporting mechanism and a boosting mechanism. The supporting mechanism is tightly combined with the sensor assembly to stably set the sensor assembly in the box device, and it is convenient for the two to be aligned when the application device is used to pick up the sensor assembly later. The boosting mechanism provides a force to the electronic assembly away from the supporting mechanism when the application device picks up the sensor assembly and leaves the supporting mechanism, which can reduce the influence of the holding force of the support mechanism on the sensor assembly on the structure of the pickup device itself (that is, the thrust provided by the boosting mechanism can partially offset the holding force of the support mechanism), reduce the situation where the electronic assembly occurs unexpected displacement or even detaches from the application device due to the resistance, and facilitate the sensor assembly tightly combined with the supporting mechanism to smoothly detach from the supporting mechanism under the action of the application device, thereby improving the reliability of the application device picking up the sensor assembly. Thus, a analyte monitoring system with high reliability in the pickup process of the sensor assembly can be provided.

[0022] In addition, in the analyte monitoring system involved in the third aspect of the present disclosure, optionally, the sensor assembly includes a connecting seat, and a sensor and a sharp object arranged on the connecting seat, the electronic assembly includes a housing and a receiving portion for receiving the sensor assembly, the receiving portion includes a accommodating portion, and a through hole longitudinally passing through the housing, and when the electronic assembly is coupled with the sensor assembly, the connecting seat is embedded in the accommodating portion and the sharp object is at least partially located in the through hole. In this case, the box device can accommodate the sensor and the sharp object to be inserted into the host so as to facilitate simultaneous sterilization, and by arranging both the sensor and the sharp object on the connecting seat, it is possible to keep both in a predetermined position, thereby facilitating alignment during subsequent picking; and the connection seat being embedded in the accommodating portion can improve the stability of the coupling between the electronic assembly and the sensor assembly, and can facilitate the application device to act on the electronic device and carry the sensor assembly away from the support mechanism during the picking process.

[0023] In addition, in the analyte monitoring system involved in the third aspect of the present disclosure, optionally, the application device includes a first drive mechanism, a second drive mechanism, and a proximal end close to the host and a distal end away from the host during operation, the first drive mechanism is configured to apply an action to the application assembly in a manner toward the proximal end, the application assembly is driven toward the proximal end by the first drive mechanism to place the sensor at least partially under the skin of the host through the sharp object, and the sharp object is driven toward the distal end by the second drive mechanism after reaching a predetermined position so that the sharp object is removed from the host. Thus, the two drive mechanisms of the application device can achieve the effect of applying the application assembly to the host and removing the sharp object from the host.

[0024] According to the present disclosure, it is possible to provide a cartridge device, a sensor component picking-up method, and an analyte monitoring system that can improve the reliability of a sensor component picking-up process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present disclosure will now be explained in further detail, by way of example only, with reference to the accompanying drawings.

[0026] FIG1 is a diagram showing an application scenario of an analyte monitoring system according to an example of the present disclosure.

[0027] FIG. 2A is a schematic diagram illustrating a sensor assembly and an electronic assembly according to an example of the present disclosure from a first perspective.

[0028] FIG2B is a schematic diagram showing a second perspective of the sensor assembly and the electronic assembly according to an example of the present disclosure.

[0029] FIG. 2C is a schematic diagram illustrating a sensor assembly and an electronic assembly according to an example of the present disclosure coupled to form an applicator assembly.

[0030] FIG. 3 is a schematic diagram illustrating a cartridge device according to an example of the present disclosure.

[0031] FIG. 4 is a schematic cross-sectional view showing a cartridge device according to an example of the present disclosure.

[0032] FIG. 5 is an exploded schematic diagram illustrating a cartridge device according to an example of the present disclosure.

[0033] FIG. 6A is a schematic diagram illustrating a support mechanism according to an example of the present disclosure.

[0034] FIG6B is a schematic diagram showing that the sensor assembly according to an example of the present disclosure is supported by a support mechanism.

[0035] FIG. 7A is a schematic diagram showing the boost mechanism according to an example of the present disclosure in a natural state.

[0036] FIG. 7B is a schematic diagram showing the boost mechanism according to an example of the present disclosure in a compressed state.

[0037] FIG8 is a schematic diagram showing that the limiting cover according to the example of the present disclosure is located inside the housing.

[0038] FIG. 9A is a first flow chart illustrating a picking method according to an example of the present disclosure.

[0039] FIG. 9B is a second flow chart illustrating a picking method according to an example of the present disclosure.

[0040] FIG. 10 is an exploded schematic diagram showing an application device according to an example of the present disclosure. DETAILED DESCRIPTION

[0041] The preferred embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. In the following description, identical components are assigned identical reference numerals, and duplicate descriptions are omitted. In addition, the accompanying drawings are merely schematic, and the proportions of the dimensions of the components and the shapes of the components may differ from the actual ones.

[0042] It should be noted that the terms "including" and "having" and any variations thereof in this disclosure, such as a process, method, system, product or device that includes or has a series of steps or units, are not necessarily limited to those steps or units clearly listed, but may include or have other steps or units that are not clearly listed or are inherent to these processes, methods, products or devices.

[0043] It should be noted that, in this article, relative position and relative direction terms such as "above", "towards above", "below", "towards downward", "up and down direction", "left side", "towards the left side", "left direction", "towards the left", "right side", "towards the right side", "right side", "towards the right", "left and right direction", "front", "towards the front", "back", "towards the back", "front and back direction" are with reference to the normal operating posture and should not be considered as restrictive.

[0044] The present disclosure relates to a box device, which can be used to hold a sensor assembly, and a picking device can be used to cooperate with the box device to pick up the sensor assembly. The box device of the present disclosure can improve the reliability of the picking device in the process of picking up the sensor assembly. In some examples, the picking device may include a removal device that can detachably hold the component to be assembled, and the removal device can be coupled with the box device to pick up the sensor assembly to couple the component to be assembled with the sensor assembly to form a target assembly. In some examples, the removal device can be an application device, and the component to be assembled can be an electronic assembly. That is, the picking device can include an application device that can detachably hold the electronic assembly. The electronic assembly and the sensor assembly can be coupled to form an applicator assembly by coupling the application device with the box device to remove the sensor assembly. At this time, the box device can be used as part of an analyte monitoring system. In the present disclosure, the box device can also be referred to as a packaging box, a packaging container, a containing box, a sterilization container, a sterilization box, etc.

[0045] In the present disclosure, the term “detachably held” means that a component held by a holding assembly can be released from the holding assembly and leave the holding assembly under the action of an external force.

[0046] The present disclosure also relates to a method for picking up a sensor assembly. In the present disclosure, the method for picking up a sensor assembly may be referred to as a picking method, an assembly method, or the like.

[0047] The present disclosure relates to an analyte monitoring system, which can be used to monitor analytes. In the present disclosure, the analyte monitoring system can be referred to as a monitoring system, and can also be referred to as an analyte detection system, an analyte measurement system or a physiological parameter monitoring system, etc. The analyte monitoring system can include a box device that accommodates a sensor component and an application device that accommodates an electronic component. The application device can be coupled with the box device to assemble the electronic component and the sensor component into an application component to pick up the sensor component, and then the application component is applied to the host. The application component applied to the host can obtain parameters related to the analyte and monitor the target analyte (for example, continuous monitoring can be performed). In the present disclosure, the application component can also be referred to as a medical device, a continuous monitoring device, or an analyte monitoring device.

[0048] In the present disclosure, an analyte may refer to a target substance to be analyzed. For example, the analyte may be one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, human chorionic gonadotropin, creatine kinase, creatine, creatinine, DNA, fructosamine, glutamine, growth hormone, hormone, ketone body, lactate, oxygen, peroxide, prostate-specific antigen, prothrombin, RNA, thyroid-stimulating hormone, or troponin.

[0049] The following describes the cartridge device of the present disclosure in detail with reference to the accompanying drawings. For ease of understanding, the cartridge device is described in detail using the example of a pickup device including an application device that detachably holds an electronic component (i.e., using the cartridge device as part of an analyte monitoring system). It should be noted that the present disclosure is not limited to this embodiment, and the pickup device may also be other devices for picking up sensor components.

[0050] FIG1 is a diagram showing an application scenario of an analyte monitoring system 100 according to an example of the present disclosure.

[0051] In the present disclosure, an analyte monitoring system 100 may include an applicator assembly 3, an applicator 5, and a cartridge 1. Applicator assembly 3 may be divided into two parts, each contained within applicator 5 and cartridge 1. Applicator 5 may remove a portion of the components contained within cartridge 1 to form a complete applicator assembly 3, which is then applied to the host's body surface, thereby enabling monitoring of target analytes through applicator assembly 3. Referring to FIG. 1 , applicator assembly 3 may be placed on the host's body surface.

[0052] In some examples, the patch assembly 3 can be divided into an electronic assembly 30 and a sensor assembly 40 (shown later). The electronic assembly 30 can be detachably retained in the application device 5, and the sensor assembly 40 can be detachably retained in the cartridge device 1. In other words, the electronic assembly 30 and the sensor assembly 40 can be coupled to form the patch assembly 3.

[0053] In some examples, the surface of the electronic component 30 facing away from the application device 5 can be an adhesive surface. In this case, after the electronic component 30 is applied to the host's body surface by the application device 5, the adhesive surface can adhere to the host's skin. When the application device 5 is removed from the body surface, the electronic component 30 can be separated from the application device 5 under the action of the adhesive force and remain on the host's body surface.

[0054] FIG2A is a schematic diagram illustrating a first perspective of the sensor assembly 40 and the electronic assembly 30 according to an example of the present disclosure. FIG2B is a schematic diagram illustrating a second perspective of the sensor assembly 40 and the electronic assembly 30 according to an example of the present disclosure. FIG2C is a schematic diagram illustrating the sensor assembly 40 and the electronic assembly 30 according to an example of the present disclosure coupled to form an applicator assembly 3.

[0055] In some examples, the sensor assembly 40 may include a sensor 41 (see FIG2A ). The sensor 41 may be partially or completely placed under the skin of the host so that it can react with the analyte in the body fluid and generate an analyte signal. In this case, by reacting with the analyte in the body fluid by the sensor 41, the analyte information in the body fluid can be obtained. In some examples, the sensor 41 may include a head, a tail, and a connecting portion connecting the head and the tail. The head includes a conductive area and is electrically connected to the electronic component 30 when the sensor assembly 40 is assembled to the electronic component 30, and the tail includes an implantable portion that can be implanted under the skin of the host. The tail is set to the host's subcutaneous signal measured and can be transmitted to the electronic component 30 via the conductive area of ​​the head.

[0056] In some examples, the sensor assembly 40 may include a connector 42 (see FIG. 2A ). In some examples, the sensor 41 may be mounted on the electronic assembly 30 via a connector. In some examples, the sensor 41 may be electrically connected to the electronic assembly 30 via a connector.

[0057] In some examples, the sensor assembly 40 may include a sharp object 43 (see FIG. 2A ). The sharp object 43 may be used to guide the sensor 41 into the subcutaneous tissue of the host. In some examples, the sensor 41 and the sharp object 43 may be disposed on a connecting seat 42. In this case, by disposing both the sensor 41 and the sharp object 43 on the connecting seat 42, it is possible to maintain both in a predetermined position, thereby facilitating alignment when the sensor assembly 40 is subsequently picked up. In some examples, the sharp object 43 may include a needle-shaped portion 431 and a supporting portion 432. The needle-shaped portion 431 may be used to accommodate the sensor 41, and the supporting portion 432 may be used to support the needle-shaped portion 431. In some examples, the needle-shaped portion 431 may have a recessed structure 433 for accommodating the sensor 41 (see FIG. 2A ). In this case, it is possible to facilitate the sharp object 43 guiding the sensor 41 to penetrate the subcutaneous tissue of the host during the process of the patch assembly 3 being applied to the host by the application device 5. In some examples, the needle-shaped portion 431 may be assembled in the application device 5 via the supporting portion 432.

[0058] In some examples, connector 42 may have a sensor coupling hole. When sensor 41 is coupled to connector 42, the axis of sensor 41 may pass through the sensor coupling hole. In this case, the sensor coupling hole facilitates coupling of sharp object 43 to sensor 41, thereby facilitating at least partial placement of sensor 41 under the patient's skin via sharp object 43.

[0059] In some examples, the electronic component 30 may include a housing 31 and a receiving portion 311 (see Figure 2B). The receiving portion 311 can be used to receive the sensor component 40. In some examples, the receiving portion 311 may include a receiving portion 312 and a through hole 314 that longitudinally passes through the housing 31 (see Figure 2B). When the electronic component 30 is coupled with the sensor component 40, the connecting seat 42 can be embedded in the receiving portion 312 and the sharp object 43 can be at least partially located in the through hole 314. In this case, the stability of the coupling between the electronic component 30 and the sensor component 40 can be improved, and during the picking process, it can be convenient for the applying device 5 to act on the electronic device and carry the sensor component 40 away from the box device 1. Referring to Figures 2A and 2B, the electronic component 30 can move along the direction D1 and couple with the sensor component 40 to form the applying component 3 shown in Figure 2C. When the two components are coupled, the connecting seat 42 can be embedded in the receiving portion 311.

[0060] In some examples, the connector 42 may include a structure for securely connecting to the electronic component 30. Secure connection means that the connector 42, connected to the electronic component 30, will not separate from the electronic component 30 unless subjected to a force greater than a predetermined magnitude. In some examples, the connector 42 may include a snap-fitting portion 421 disposed on its periphery (see FIG. 2A ), and the receiving portion 312 may include a slot 313 (see FIG. 2B ) that mates with the snap-fitting portion 421. The snap-fitting portion 421 and the slot 313 mate to securely assemble the connector 42 with the electronic component 30. In some examples, there may be one or more snap-fitting portions 421, and the number of slots 313 may match the number of snap-fitting portions 421. For example, the number of snap-fitting portions 421 may be one, two, three, or four. In some examples, multiple snap-fitting portions 421 may be distributed around the periphery of the connector 42. This facilitates a secure fit between the connector 42 and the electronic component 30.

[0061] In the present disclosure, the box device 1 can accommodate the sensor assembly 40. That is, the box device 1 can be used to hold the sensor assembly 40.

[0062] FIG3 is a schematic diagram illustrating a cartridge device 1 according to an example of the present disclosure. FIG4 is a schematic cross-sectional diagram illustrating a cartridge device 1 according to an example of the present disclosure. In FIG4 , some components that may cause misunderstanding are omitted for clarity. FIG5 is an exploded schematic diagram illustrating a cartridge device 1 according to an example of the present disclosure. In FIG5 , line CA schematically represents the central axis of cartridge device 1.

[0063] In some examples, the cartridge device 1 may include a housing 10 (see FIG3 ). The housing 10 may have an accommodation space 11. The sensor assembly 40 held in the cartridge device 1 may be located in the accommodation space 11 (see FIG4 ).

[0064] In some examples, the box device 1 may include an opening portion 12 (see Figure 4). The accommodating space 11 may be connected to the outside via the opening portion 12. In some examples, the box device 1 may include a lower bottom portion 120 (see Figure 4). The lower bottom portion 120 and the opening portion 12 may be located at both ends of the shell 10, respectively. For ease of understanding, the direction from the lower bottom portion 120 to the opening portion 12 will be understood as upward, and the direction from the opening portion 12 to the lower bottom portion 120 will be understood as downward. See Figure 4, where direction D1 schematically indicates downward, and direction D2 schematically indicates upward. That is, the upper surface of the component arranged in the accommodating space 11 refers to the surface closer to the opening portion 12, and the lower surface refers to the surface closer to the lower bottom portion 120. In some examples, the picking device can enter the accommodating space 11 of the shell 10 via the opening portion 12 to pick up the sensor assembly 40 and remove the sensor assembly 40 from the box device 1.

[0065] In some examples, the box device 1 may include a sealing portion 13 (see Figure 3). The sealing portion 13 can be used to seal the accommodating space 11. Specifically, the sealing portion 13 can be detachably provided on the opening portion 12 to seal the accommodating space 11. In this case, after sterilization, the accommodating space 11 is a sealed chamber, which can reduce the pollution of the external environment. When it is needed, the sealing portion 13 can be removed from the opening portion 12 to release the sealed state and operate the components inside the shell 10. In some examples, the sealing portion 13 can be a flexible film, and the flexible film can be provided on the opening portion 12 by pressing to seal the accommodating space 11. Thereby, it can be helpful to maintain the sealing of the box device 1.

[0066] Fig. 6A is a schematic diagram showing the support mechanism 14 according to an example of the present disclosure. Fig. 6B is a schematic diagram showing the sensor assembly 40 according to an example of the present disclosure being supported by the support mechanism 14.

[0067] In some examples, the cartridge device 1 may include a support mechanism 14 (see FIG. 4 ). The support mechanism 14 may be used to support the sensor assembly 40, which may be retained in the cartridge device 1 via the support mechanism 14. In some examples, the support mechanism 14 may detachably support the sensor assembly 40. That is, the sensor assembly 40 may be released from the support mechanism 14 and move away from the support mechanism 14 under the action of an external force.

[0068] In some examples, the support mechanism 14 can be located in the accommodation space 11 of the housing 10 (see FIG6 a). The sensor assembly 40 supported by the support mechanism 14 can also be located in the accommodation space 11. In some examples, the support mechanism 14 can be tightly integrated with the sensor assembly 40. In this case, the support mechanism 14 can limit undesirable movement of the sensor assembly 40, ensuring that the sensor assembly 40 is stably positioned in the cartridge device 1, facilitating alignment of the sensor assembly 40 when the sensor assembly 40 is subsequently picked up by a pickup device.

[0069] In some examples, the cartridge device 1 may include a retaining portion 15 (see FIG6B ). The retaining portion 15 may be used to tightly retain the sensor assembly 40. In some examples, the support mechanism 14 may retain the sensor assembly 40 via the retaining portion 15. In some examples, the retaining portion 15 may be a male-female mechanical mating structure provided on the support mechanism 14 and the sensor assembly 40, respectively. In this case, the sensor assembly 40 may be tightly coupled to the support mechanism 14 via the male-female mechanical mating structure. In some examples, the male-female mechanical mating structure may include a concave structure 151 and a convex structure 152 that matches the concave structure 151. In other words, in some examples, the retaining portion 15 may include a concave structure 151 and a convex structure 152 that matches the concave structure 151, and the concave structure 151 and the convex structure 152 may be provided on the support mechanism 14 and the sensor assembly 40, respectively (see FIG6A and FIG6B ). In this case, by coordinating the convex structure 152 with the concave structure 151, the sensor assembly 40 can be combined with the support mechanism 14, that is, the sensor assembly 40 can be maintained on the support mechanism 14; moreover, the sensor assembly 40 can be tightly combined with the support mechanism 14 by snapping together; in addition, the snap-fit ​​structure is relatively simple, which facilitates the installation and process production of the two.

[0070] In some examples, the support mechanism 14 may include a support surface 141 (see FIG6A ). The sensor assembly 40 held by the support mechanism 14 may be in contact with the support surface 141 (see FIG6B ). In some examples, preferably, a concave structure 151 may be provided on the sensor assembly 40, and a convex structure 152 may be provided on the support mechanism 14. Specifically, the retaining portion 15 may include a convex structure 152 protruding from the support surface 141, and a concave structure 151 provided inwardly recessed from the outer surface of the sensor assembly 40 (see FIG6A ). When the sensor assembly 40 is supported on the support mechanism 14, the concave structure 151 on the sensor assembly 40 may be accommodated in the convex structure 152 on the support mechanism 14. Thereby, it is possible to facilitate the support mechanism 14 to stably support the sensor assembly 40.

[0071] In some examples, the concave structure 151 can be recessed inward from the bottom of the connection base 42, and the convex structure 152 can be raised upward from the support surface 141 (see FIG6A ). "Raising upward from the support surface 141" means raising from the support surface 141 toward the opening 12. In this case, the sensor assembly 40 can be moved downward to be mounted on the support mechanism 14. Referring to FIG6A , the sensor assembly 40 can be moved along direction D1 until it engages with the support mechanism 14, forming the state shown in FIG6B .

[0072] In some examples, the number of convex structures 152 and concave structures 151 can be one or more, and the number of convex structures 152 and concave structures 151 can be the same. For example, the number of convex structures 152 and concave structures 151 can be one, two, three, four, five, or six. Referring to FIG6A , the number of convex structures 152 and concave structures 151 can be three, with the three convex structures 152 being convex structure 152a, convex structure 152b, and convex structure 152c. Due to the angle, only two concave structures 151 are visible in FIG6A , namely concave structure 151a and concave structure 151b. In some examples, multiple concave structures can be arranged on the periphery of sensor assembly 40, with the multiple convex structures 152 corresponding to the positions of the multiple concave structures 151. In this case, the sensor 41 can be held from multiple directions, thereby facilitating limiting the movement of the sensor assembly 40 on the support surface 141 and further improving the stability of the sensor assembly 40 assembled to the support mechanism 14 .

[0073] In some examples, the male and female mechanical mating structures may be a clearance fit and / or an interference fit. In some examples, the convex structure 152 and the concave structure 151 may be a clearance fit and / or an interference fit. In some examples, where the retaining portion 15 includes only one convex structure 152 and one concave structure 151, the convex structure 152 and the concave structure 151 may be an interference fit. In this case, the sensor assembly 40 can be tightly coupled to the support mechanism 14, improving the stability of the sensor assembly 40 supported on the support mechanism 14. In some examples, where the retaining portion 15 includes multiple convex structures 152 and multiple concave structures 151, at least one of the multiple convex structures 152 may be an interference fit with the corresponding concave structure 151, while the others may be a clearance fit. In this case, while the sensor assembly 40 is tightly coupled to the support mechanism 14, the force required to subsequently remove the sensor assembly 40 from the support mechanism 14 is reduced, thereby facilitating removal. In some examples, in the example where the retaining portion 15 includes a plurality of convex structures 152 and a plurality of concave structures 151 , the plurality of convex structures 152 and the plurality of concave structures 151 may also be interference fit.

[0074] In some examples, at least one convex structure 152 among the plurality of convex structures 152 may be configured to be higher than the other convex structures 152, and the depth of the concave structure 151 corresponding to the convex structure 152 may also be deeper than the other concave structures 151. This can further improve the stability of the combination of the support mechanism 14 and the sensor assembly 40.

[0075] In some examples, the support mechanism 14 may include a hollow portion 142 (see FIG. 6A ). Hollow portion 142 may be used to accommodate a portion of the sharp object 43 and sensor 41 of the sensor assembly 40. Specifically, in the sensor assembly 40, a portion of the sharp object 43 and sensor 41 may extend from the bottom of the connection base 42. When the sensor assembly 40 is supported by the support mechanism 14, the bottom of the connection base 42 may contact the support surface 141, and the portion of the sharp object 43 and sensor 41 extending from the bottom of the connection base 42 may be located within the hollow portion 142.

[0076] In some examples, the support mechanism 14 can be disposed on the lower bottom portion 120 and facing the opening 12. In this case, the sensor assembly 40 held by the support mechanism 14 can face the opening 12, facilitating subsequent pickup of the sensor assembly 40 by a pickup device. In some examples, the support mechanism 14 can be integrally formed with the cartridge device 1. In this case, the support mechanism 14 can be reduced in potential undesirable movement when subjected to external forces, thereby improving the stability of the support mechanism 14 and, consequently, the stability of the sensor assembly 40 when held on the support mechanism 14. In some examples, the convex structure 152 can be integrally formed with the support mechanism 14. In other words, the convex structure 152 can be considered part of the support mechanism 14.

[0077] In some examples, the box device 1 may include a boosting mechanism 16 (see FIG4 ). The boosting mechanism 16 may provide a force to the pickup device to move away from the support mechanism 14 after the pickup device picks up the sensor assembly 40. That is, when the sensor assembly 40 leaves the support mechanism 14 under the action of the pickup device coupled to the sensor assembly 40, the boosting mechanism 16 may provide a force to the pickup device to move away from the support mechanism 14. In this case, the influence of the holding force of the support mechanism 14 on the sensor assembly 40 on the pickup device's own structure can be reduced (i.e., the thrust provided by the boosting mechanism 16 may partially offset the holding force of the support mechanism 14), which is conducive to the sensor assembly 40 tightly coupled to the support mechanism 14 being smoothly separated from the support mechanism 14 under the action of the pickup device, thereby improving the reliability of the pickup device picking up the sensor assembly 40. In some examples, the boosting mechanism 16 may be located in the accommodating space 11 of the shell 10 of the box device 1.

[0078] FIG7A is a schematic diagram illustrating the boosting mechanism 16 according to an example of the present disclosure in its natural state. FIG7B is a schematic diagram illustrating the boosting mechanism 16 according to an example of the present disclosure in its compressed state. In FIG7B , the boosting mechanism 16 is compressed by the force applied by the pickup device. For a clearer illustration, the other components of the cartridge device 1 and the applying device 5 are omitted, and only the electronic component 30 is used for illustration. The direction of the arrow schematically indicates the direction of the force applied by the boosting mechanism 16 to the electronic component 30.

[0079] In some examples, the assist mechanism 16 may include a driving portion 160 (see FIG7A ). During the process of the pickup device carrying the sensor assembly 40 away from the support mechanism 14 (hereinafter referred to as the “leaving process”), the driving portion 160 abuts against a surface of the pickup device to provide a force for the pickup device to move away from the support mechanism 14.

[0080] In some examples, the driving portion 160 may include an elastic element. When the pickup device picks up the sensor assembly 40, the elastic element may be in a compressed state (see FIG. 7B ). When the pickup device carries the sensor assembly 40 away from the support mechanism 14, the end of the elastic element may abut against the surface of the pickup device to provide a force to move the pickup device away from the support mechanism 14. In this case, when the pickup device carries the sensor assembly 40 away from the support mechanism 14, the elastic element releases the stored elastic potential energy to provide a force to move the pickup device away from the support mechanism 14. In some examples, the elastic element may be a spring or a spring.

[0081] In some examples, when the sensor assembly 40 is kept in the standby state of the box device 1, the elastic element can be in a free, uncompressed state; when the pickup device picks up the sensor assembly 40, the elastic element can be compressed by the pickup device and be in a compressed state. Since long-term compression may affect the performance of the elastic element, such as causing undesirable non-elastic deformation (plastic deformation or material creep) and reducing the elastic potential energy that can be stored in the elastic element, in this case, the present disclosure configures the elastic element to be in a free state in the standby state and then compresses it when picking up. This can reduce the situation where the elastic potential energy that can be stored in the elastic element is reduced due to long-term compression, thereby being able to stably provide the pickup device with a force away from the support mechanism 14 when picking up.

[0082] In some examples, the driving unit 160 may include an actuator 162 (see FIG. 7A ). The actuator 162 may be connected to the elastic element, and force may be transmitted through contact between the actuator 162 and the pickup device. In some examples, the actuator 162 may be substantially cylindrical.

[0083] In some examples, the drive unit 160 can be a spring-loaded pin structure (see FIG7A ). Specifically, the drive unit 160 can include a housing 161 having a storage space, and an actuator 162 connected to an elastic element. The elastic element can be disposed within the housing 161, and the elastic direction of the elastic element is aligned with the length of the housing 161. The first end of the actuator 162 connected to the elastic element is located within the storage space, while the second end 163 is exposed from the housing 161. Force can be transmitted by contacting the pickup device through the second end 163 of the actuator 162. In this case, force transmission can be effectively achieved through the spring-loaded pin structure, and the overall spring-loaded pin structure occupies a small space, facilitating miniaturization of the cartridge device 1.

[0084] In some examples, the outer contour of the portion of the driver 160 that contacts the pickup device can be a curved surface (see FIG7A ). In this case, while effectively achieving force transmission, it can reduce damage to the pickup device caused by the driver 160 applying force to the pickup device. For example, in an example where the driver 160 is a spring-loaded pin structure, the outer contour of the second end 163 of the actuator 162 can be a curved surface.

[0085] In some examples, the assist mechanism 16 may be adjacent to the support mechanism 14 (see FIG. 4 ). In this case, when the pickup device picks up the sensor assembly 40 located on the support mechanism 14, it is convenient for the pickup device to contact and interact with the assist mechanism 16. In some examples, the assist mechanism 16 may be disposed on the lower base 120. In this case, it is convenient for the assist mechanism 16 to provide a force to move the pickup device away from the support mechanism 14.

[0086] In some examples, the upper surface of the driving portion 160 of the boosting mechanism 16 when not compressed can be higher than the supporting surface 141 of the supporting mechanism 14. The upper surface of the driving portion 160 refers to the surface of the driving portion 160 closest to the opening 12. This makes it easier for the driving portion 160 to apply a thrust to the pickup device during the entire process of the sensor assembly 40 being separated from the supporting mechanism 14. In some examples, in an example where the retaining portion 15 includes a plurality of concave structures 151 and convex structures 152, and the convex structure 152 is provided on the supporting mechanism 14, the upper surface of the driving portion 160 of the boosting mechanism 16 when not compressed can be higher than the upper surface of at least one convex structure 152. In this case, at least during the process of the sensor assembly 40 being separated from the convex structure 152, the boosting mechanism 16 can provide an upward thrust to the pickup device to stably separate the sensor assembly 40 from the supporting mechanism 14.

[0087] In some examples, the boosting mechanism 16 and the support mechanism 14 may both face the opening 12. That is, the sensor assembly 40 may pass through the opening 12 into the housing 10 of the cartridge device 1 and be assembled onto the support mechanism 14. The distance between the sensor assembly 40 supported by the support mechanism 14 and the opening 12 is smaller than the distance between the support mechanism 14 and the opening 12. In this case, the pickup device passes through the opening 12 of the cartridge device 1 into the accommodating space 11 of the housing 10 to pick up the sensor assembly 40. When the pickup device leaves, the boosting mechanism 16 applies a force toward the opening 12 to the pickup device, which can help the pickup device carry the sensor assembly 40 away from the support mechanism 14.

[0088] As previously described, in some examples, the pickup device may include an application device 5 that detachably holds the electronic assembly 30. The application device 5 may be coupled to the cartridge device 1 to couple the electronic assembly 30 and the sensor assembly 40 to form an applicator assembly 3, and the sensor assembly 40 may be removed. The cartridge device 1 may then function as part of the analyte monitoring system 100.

[0089] In some examples, the application device 5 can be coupled with the box device 1 to pick up the sensor assembly 40 so that the sensor assembly 40 is coupled with the electronic assembly 30 to form the application assembly 3. In some examples, the boosting mechanism 16 can provide a force to move the electronic assembly 30 away from the support mechanism 14. In this case, after the applying device 5 couples the electronic component 30 and the sensor component 40 to form the applying component 3, the force applied by the applying device 5 to the electronic component 30 away from the supporting mechanism 14 is transmitted to the sensor component 40 through the electronic component 30. Conversely, when the sensor component 40 is separated from the supporting mechanism 14, the holding force of the supporting mechanism 14 on the sensor component 40 is transmitted to the electronic component 30 via the sensor component 40. At this time, the electronic component 30 detachably held on the applying device 5 is simultaneously subjected to the force away from the supporting mechanism 14 and the resistance converted from the holding force of the supporting mechanism 14. The force provided to the electronic component 30 by the boosting mechanism 16 can offset part of the resistance, reducing the occurrence of unexpected displacement of the electronic component 30 due to the resistance or even separation from the applying device 5. Thus, the reliability of the applying device 5 picking up the sensor component 40 from the box device 1 via the detachable electronic component 30 can be improved.

[0090] In some examples, during the process of the applicator assembly 3 leaving the support mechanism 14, the driving unit 160 contacts the surface of the electronic component 30 facing away from the application device 5, providing a force to move the electronic component 30 away from the support mechanism 14. The surface of the electronic component 30 facing away from the application device 5 refers to the surface of the electronic component 30 facing the opening of the application device 5 (hereinafter referred to as the "bottom surface of the electronic component 30"). In this case, while the driving unit 160 provides a force to move the electronic component 30 away from the support mechanism 14 to partially offset the resistance of the support mechanism 14, this force can also help press the electronic component 30 toward the application device 5, further improving the stability of the electronic component 30 on the application device 5.

[0091] In some examples, the elastic element of the driving portion 160 may be in a compressed state when the applicator 5 picks up the sensor assembly 40; during the process of the applicator assembly 3 leaving the support mechanism 14, the end of the driving portion 160 may contact the bottom surface of the electronic component 30 to provide a force to move the electronic component 30 away from the support mechanism 14. In this case, the elastic element in a compressed state after the pickup is completed stores elastic potential energy. During the process of the applicator assembly 3 leaving the support mechanism 14, the driving portion 160 including the elastic element contacts the surface of the electronic component 30, and can use this elastic potential energy to provide a force to move the electronic component 30 away from the support mechanism 14.

[0092] In some examples, as described above, the bottom surface of the electronic component 30 can be a sticky surface (hereinafter referred to as the sticky surface). In some examples, the contact area between the driving unit 160 and the sticky surface accounts for no more than 10% of the total area of ​​the sticky surface. In this case, while effectively transmitting force between the boosting mechanism 16 and the electronic component 30, the pulling force on the electronic component 30 caused by adhesion when the driving unit 160 is separated from the sticky surface can be reduced, thereby facilitating the stable retention of the electronic component 30 on the application device 5.

[0093] In some examples, preferably, the contact area between the drive unit 160 and the sticky surface accounts for no more than 5% of the total area of ​​the sticky surface. For example, the contact area between the drive unit 160 and the sticky surface may account for 1%, 2%, 3%, 4%, or 5% of the total area of ​​the sticky surface. This can further reduce the adhesive force generated by the contact between the drive unit 160 and the sticky surface. In the example described above where the drive unit 160 is a spring-loaded pin structure, the smaller size of the actuator 162 can reduce the contact area between the drive unit 160 and the sticky surface, thereby reducing adhesion between the drive unit 160 and the sticky surface.

[0094] In some examples, the bottom surface of the electronic component 30 may include a first area with adhesiveness and a second area. The adhesiveness of the second area may be weaker than that of the first area, and the driving unit 160 may be in contact with the second area. In this case, the bottom surface of the electronic component 30 is configured to include the first area with adhesiveness, which can facilitate the electronic component 30 to be detached from the application device 5 and maintained on the host's body surface by adhesion to the host's body surface after being applied to the host's body surface; in addition, a second area with weaker adhesiveness than the first area is provided, and the driving unit 160 is configured to be in contact with the second area. On the basis of effectively realizing force transmission, it can reduce the pulling force on the electronic component 30 caused by adhesion when the driving unit 160 is detached from the second area, thereby facilitating the electronic component 30 to be stably maintained on the application device 5.

[0095] In some examples, the second area may not have stickiness. In this case, the separation of the drive unit 160 from the second area will not generate a pulling force caused by adhesion. In some examples, the first area may be located on the periphery of the second area. In this case, the drive unit 160 acting on the center of the bottom surface close to the electronic component 30 can more conveniently achieve force transmission, thereby facilitating the electronic component 30 to remain smoothly on the applying device 5 during the departure process. It should be noted that the second area without stickiness can be regarded as the second area having a viscosity of 0, which still falls within the scope of "the second area having a viscosity weaker than the first area" described in this disclosure.

[0096] In some examples, the outer contour of the portion of the driving unit 160 that contacts the electronic component 30 can be a curved surface. In this case, while effectively achieving force transmission, the contact area between the driving unit 160 and the electronic component 30 can be reduced, thereby reducing the pulling force on the electronic component 30 caused by adhesion when the driving unit 160 and the electronic component 30 are separated, allowing the electronic component 30 to be stably retained on the application device 5. In addition, compared to a sharp surface, setting the contact surface as a curved surface can also reduce the damage to the electronic component 30 that may be caused by the driving unit 160 applying force to the electronic component 30.

[0097] In some examples, the application device 5 holding the electronic component 30 can enter the storage space 11 of the box device 1 and move downward to the picking position, so that the electronic component 30 and the sensor component 40 are coupled as one, and at this time the bottom surface of the electronic component 30 contacts the boosting mechanism 16 to compress it. After the picking is completed, the application device 5 moves upward with the application component 3, and at the same time the boosting mechanism 16 applies an upward thrust to the electronic component 30, so that the sensor component 40 is separated from the supporting mechanism 14. After the application device 5 completely leaves the storage space 11 of the box device 1, the picking action is completed.

[0098] FIG8 is a schematic diagram showing that the limiting cover 17 according to an example of the present disclosure is located inside the housing 10 .

[0099] In some examples, the cartridge device 1 may include a position-limiting cover 17 (see FIG. 5 ). The position-limiting cover 17 may be used to limit the position of the sensor assembly 40. In some examples, the position-limiting cover 17 may be located within the accommodating space 11 of the housing 10. During transportation, the cartridge device 1 may experience vibration. In such cases, the position-limiting cover 17 can further limit undesirable displacement and / or rotation of the sensor assembly 40, maintaining the sensor assembly 40 in a predetermined position to facilitate alignment and engagement when the cartridge device is subsequently picked up.

[0100] In some examples, the limit cover 17 can be provided above the sensor assembly 40 (see FIG8 ). When the limit cover 17 leaves the accommodating space 11, the sensor assembly 40 can be placed in a state where it can be picked up. In the prior art, there is a method of using a limit platform that can move up and down in a box device to protect the sensor. When the limit platform is higher than the sensor assembly, it is surrounded and further fixed. When picking up, the limit platform is pressed down by the application device and the limit platform to release the lock of the sensor assembly and expose it to allow the application device to pick up. However, such a structure of unlocking and matching is relatively complicated and requires the design of various guide grooves and locks and other structures. Therefore, in contrast to such a structure, in the present disclosure, the limit cover 17 is configured to be able to put the sensor assembly 40 in a state where it can be picked up after leaving the accommodating space 11, which can simplify the complex matching structure, and the housing 10 of the box device 1 does not need to be designed to have a large depth for the limit platform to move, which is conducive to the miniaturization of the box device 1.

[0101] In some examples, the limiting cover 17 may include a limiting structure 171 (see FIG5 ). The limiting structure 171 may be disposed on the periphery of at least a portion of the sensor assembly 40 without contacting the sensor assembly 40. In this case, compared to direct contact with the sensor assembly 40, disposing the limiting structure 171 on the periphery of the sensor assembly 40 without contacting the sensor assembly 40 can reduce the possibility of undesirable displacement of the sensor assembly 40 caused by friction between the limiting structure 171 and the sensor assembly 40 due to movement (e.g., movement when the limiting cover 17 is removed).

[0102] In some examples, where the cartridge device 1 includes both the support mechanism 14 and the limiting cover 17, the sensor assembly 40 can be tightly coupled to the support mechanism 14, and the limiting cover 17 can be disposed around the periphery of the sensor assembly 40 without contacting the sensor assembly 40. This allows for stable retention of the sensor assembly 40. Furthermore, even after the limiting cover 17 is removed, the support mechanism 14 can still tightly retain the sensor assembly 40 within the cartridge device 1, facilitating subsequent pickup.

[0103] In some examples, the position-limiting cover 17 may include a cover body 172, and the position-limiting structure 171 may be a channel formed in the cover body 172 (see FIG5 ). When the position-limiting cover 17 is positioned over the sensor assembly 40, the sensor assembly 40 may be at least partially located within the channel (see FIG8 ). In this case, the inner wall of the cover body 172 may surround the outer circumference of the sensor assembly 40. In this manner, the possibility of undesired displacement of the sensor assembly 40 due to overall shaking of the cartridge device 1 can be reduced.

[0104] In some examples, the position-limiting cover 17 may include a gripping portion 173 (see FIG. 5 ). The gripping portion 173 may be a protrusion formed on the cover body 172 and facing the opening 12 . In this case, acting on the gripping portion 173 facilitates removal of the position-limiting cover 17 from the accommodating space 11 . In some examples, the position-limiting structure 171 may be a channel formed on the gripping portion 173 . In this case, there is no need to design a separate protrusion structure for forming the position-limiting channel, which facilitates the manufacture of the position-limiting cover 17 .

[0105] In some examples, the cover 172 may include an upper leg 175 extending toward the opening 12 (see FIG5 ). In some examples, the cover 172 may include a lower leg 174 extending toward the lower bottom 120 (see FIG5 ). In some examples, the lower leg 174 may abut against the lower bottom 120 of the box device 1 or a component provided on the lower bottom 120. Thus, the position limiting cover 17 can be stably maintained in the housing 10. In some examples, the upper leg 175 and / or the lower leg 174 can extend from the outer periphery of the cover 172 in a predetermined direction, and the upper leg 175 and / or the lower leg 174 can contact the inner wall of the housing 10. In this case, the position limiting cover 17 can have a larger contact area with the housing 10, thereby helping to suppress the undesirable movement of the position limiting cover 17 within the housing 10.

[0106] In some examples, the cartridge device 1 may include a first guide structure 18 (see FIG. 5 ). The first guide structure 18 can guide the position-limiting cover 17 to move in a desired direction within the housing 10. This facilitates assembly of the housing 10 and allows the position-limiting cover 17 to be removed without contacting the sensor assembly 40. In some examples, the first guide structure 18 can be a male-female mechanically mating structure provided on the housing 10 and the position-limiting cover 17, respectively. For example, the first guide structure 18 can include a first guide groove 181 provided on the housing 10 and a first rib 182 provided on the position-limiting cover 17 (see FIG. 5 ). In this case, the cooperation between the first rib 182 and the first guide groove 181 can guide the movement direction of the position-limiting cover 17 within the housing 10. In some examples, the first guide structure 18 can include a first guide groove 181 provided on the housing 10 and a protrusion provided on the position-limiting cover 17. Thus, the cooperation between the protrusion, the first guide groove 181, and the protrusion can guide the movement direction of the position-limiting cover 17 within the housing 10.

[0107] In some examples, the box device 1 may include a retaining mechanism 19 (see FIG. 5 ). The retaining mechanism 19 may be used to retain the position-limiting cover 17. Specifically, the retaining mechanism 19 may be configured to provide a predetermined retaining force to the position-limiting cover 17, the retaining force being greater than the weight of the position-limiting cover 17. During transportation or when the box device 1 is opened by a user, the entire box device 1 may shake or even invert. In such cases, using the retaining mechanism 19 to retain the position-limiting cover 17 can reduce the risk of the position-limiting cover 17 unexpectedly moving within the housing 10 or even falling out of the housing 10.

[0108] In some examples, the retaining mechanism 19 can be a male-female mechanical mating structure provided on the position-limiting cover 17 and the housing 10, respectively. For example, the retaining mechanism 19 can include a biasing arm 191 that can be biased away from and / or toward the central axis CA of the housing device 1, and a groove 192 (see FIG. 5 ) that cooperates with the biasing arm 191. When the position-limiting cover 17 is located within the housing 10, the biasing arm 191 can be at least partially located within the groove 192. When the position-limiting cover 17 is to be removed from the housing 10, a force applied to the position-limiting cover 17 to remove it from the housing 10 can cause the biasing arm 191 to disengage from the groove 192. In some examples, when the biasing arm 191 is provided on the position-limiting cover 17 and the groove 192 is provided on the housing 10, the biasing arm 191 can have a tendency to move away from the central axis CA of the housing device 1 (i.e., a tendency to expand outward). Thus, after the position-limiting cover 17 enters the housing 10, the biasing arm 191 can automatically expand outward into the groove 192 to retain the position-limiting cover 17. Conversely, when the biasing arm 191 is disposed on the housing 10 and the groove 192 is disposed on the limiting cover 17, the biasing arm 191 may have a tendency to approach the central axis CA of the cartridge device 1 (i.e., a tendency to converge inward). In some examples, the surface where the biasing arm 191 contacts the groove 192 may be a curved surface. This facilitates the biasing arm 191 to enter and exit the groove 192.

[0109] In some examples, the box device 1 may include a loading platform. The loading platform may have a storage space. In some examples, a desiccant may be stored in the storage space of the loading platform. This can help to form a dry environment in the box device 1, thereby facilitating the preservation of the sensor assembly 40. In some examples, the loading platform may be provided at the lower bottom portion 120, and the supporting mechanism 14 and the boosting mechanism 16 may be provided at the bottom portion of the housing 10 and exposed through the loading platform. In this case, the stability of the supporting mechanism 14 and the boosting mechanism 16 can be further improved by the loading platform. In some examples, the lower support leg 174 of the limiting cover 17 may contact the loading platform so that the entire limiting cover 17 is mounted above the loading platform.

[0110] In summary, in the first aspect of the present disclosure, it is possible to provide a cartridge device 1 that can stably hold the sensor assembly 40 and improve the reliability of the pickup device in picking up the sensor assembly 40 .

[0111] A second aspect of the present disclosure relates to a method for picking up a sensor assembly 40 (referred to as a picking up method for short). In the present disclosure, the picking up method may also be referred to as an assembly method, an assembling method, etc.

[0112] FIG. 9A is a first flow chart illustrating a picking method according to an example of the present disclosure.

[0113] In this embodiment, the picking method may include: using a support mechanism in a container to tightly hold the sensor assembly (step S100); using a picking device that can be coupled to the container to pick up the sensor assembly, and during the picking process, using a boosting mechanism to provide a force to the picking device away from the support mechanism (step S110) (see Figure 9A). In this case, using the support mechanism in the container to tightly combine with the sensor assembly to detachably hold the sensor assembly can stably set the sensor assembly in the container and facilitate the alignment of the two when the picking device is subsequently used to pick up the sensor assembly; by providing a force to the picking device away from the support mechanism when the picking device leaves the support mechanism after picking up the sensor assembly, the picking device's own structure can be reduced from the influence of the holding force of the supporting mechanism on the sensor assembly (i.e., the thrust provided by the boosting mechanism can partially offset the holding force of the supporting mechanism), which is conducive to the sensor assembly that is tightly combined with the supporting mechanism to smoothly detach from the supporting mechanism under the action of the picking device, thereby improving the reliability of the picking device picking up the sensor assembly. Thus, a method for picking up sensor assemblies with high reliability can be provided.

[0114] FIG9B is a second flow chart illustrating a picking method according to an example of the present disclosure.

[0115] In some examples, the container described in the picking method of the present disclosure may refer to the box device 1 of the first aspect of the present disclosure. The specific components and structures (such as the support mechanism 14 and the boost mechanism 16) are the same as those of the box device 1 of the first aspect of the present disclosure and will not be repeated here. That is, the picking method of the present disclosure may include: making the box device 1 detachably hold the sensor component 40, the box device 1 includes a support mechanism 14 and a boost mechanism 16, the support mechanism 14 is tightly combined with the sensor component 40 to limit the movement of the sensor component 40 (step S200); using a picking device to couple with the sensor component 40 held in the box device 1 to pick up the sensor component 40 (step S210); under the action of the picking device, the sensor component 40 is separated from the support mechanism 14, and in the process of the sensor component 40 leaving the support mechanism 14, the boost mechanism 16 is used to provide a force to the picking device away from the support mechanism 14 (step S220) (see Figure 9B). In this way, a method for picking up a sensor component 40 with high reliability can be provided.

[0116] The third aspect of the present disclosure relates to an analyte monitoring system 100. The analyte monitoring system 100 of the third aspect of the present disclosure is the same as the analyte monitoring system 100 described in the first aspect of the present disclosure when describing the cartridge device 1, and the aforementioned contents are not repeated here.

[0117] As previously mentioned, in some examples, the analyte monitoring system 100 may include an applicator assembly 3, an application device 5, and a cartridge device 1. The cartridge device 1 and the applicator assembly 3 are identical to the cartridge device 1 and the applicator assembly 3 described in the first aspect of the present disclosure. For details on the structural components, please refer to the aforementioned content and will not be described in detail here.

[0118] That is, in some examples, the analyte monitoring system 100 may include a sensor assembly 40, a cartridge device 1 that detachably holds the sensor assembly 40, an electronic assembly 30, and an application device 5 that detachably holds the electronic assembly 30. The cartridge device 1 includes a support mechanism 14 that detachably supports the sensor assembly 40, and a boost mechanism 16. The support mechanism 14 is tightly combined with the sensor assembly 40 to limit the movement of the sensor assembly 40. The application device 5 cooperates with the cartridge device 1 to couple the electronic assembly 30 and the sensor assembly 40 to form an application assembly 3. When the sensor assembly 40 leaves the support mechanism 14 under the action of the electronic assembly 30 and the application device 5, the boost mechanism 16 provides a force to move the electronic assembly 30 away from the support mechanism 14. In this case, the box device 1 includes a support mechanism 14 and a boosting mechanism 16. The support mechanism 14 is tightly coupled with the sensor assembly 40, so that the sensor assembly 40 can be stably arranged in the box device 1, and the alignment of the two can be facilitated when the application device 5 is used to pick up the sensor assembly 40. The boosting mechanism 16 provides a force to the electronic assembly 30 away from the support mechanism 14 when the application device 5 picks up the sensor assembly 40 and leaves the support mechanism 14. This can reduce the influence of the holding force of the support mechanism 14 on the sensor assembly 40 on the structure of the pickup device itself (that is, the thrust provided by the boosting mechanism 16 can partially offset the holding force of the support mechanism 14), reduce the electronic assembly 30 from being displaced unexpectedly or even separated from the application device 5 due to the resistance, and facilitate the sensor assembly 40 tightly coupled with the support mechanism 14 to smoothly separate from the support mechanism 14 under the action of the application device 5, thereby improving the reliability of the application device 5 picking up the sensor assembly 40. Thus, an analyte monitoring system 100 with high reliability in the pickup process of the sensor assembly 40 can be provided.

[0119] In some examples, as described above, the sensor assembly 40 may include a connection base 42, and a sensor 41 and a sharp object 43 disposed on the connection base 42. In this case, the cartridge device 1 can accommodate the sensor 41 and the sharp object 43 to be placed in the host, so as to facilitate simultaneous sterilization. Furthermore, by placing both the sensor 41 and the sharp object 43 on the connection base 42, the two can be easily maintained in a predetermined position, thereby facilitating alignment during subsequent pickup.

[0120] In some examples, as described above, the electronic assembly 30 may include a housing 31 and a receiving portion 311 for receiving the sensor assembly 40. The receiving portion 311 includes a receiving portion 312 and a through hole 314 extending longitudinally through the housing 31. When the electronic assembly 30 is coupled to the sensor assembly 40, the connecting seat 42 is embedded in the receiving portion 312, and the sharp object 43 is at least partially located within the through hole 314. In this case, the stability of the coupling between the electronic assembly 30 and the sensor assembly 40 can be improved, and during the pickup process, it is easier for the application device 5 to act on the electronic device and carry the sensor assembly 40 away from the support mechanism 14.

[0121] In some examples, the electronic assembly 30 may include an electronic device. The electronic device may be disposed within the housing 31. In some examples, the electronic device may include a printed circuit board. The printed circuit board may be used to receive physiological information of the host measured by the sensor 41, process it, and then transmit it to the smart device. FIG10 is an exploded schematic diagram of the application device 5 involved in examples of the present disclosure.

[0122] In some examples, the application device 5 may include a proximal end that is closer to the host during operation and a distal end that is farther away from the host. In some examples, the application device 5 may include a first drive mechanism 51 (see FIG. 10 ). The first drive mechanism 51 may be configured to apply an action toward the applicator assembly 3 toward the proximal end, and the applicator assembly 3 is driven toward the proximal end by the first drive mechanism 51 to at least partially place the sensor 41 under the host's skin via the sharp object 43.

[0123] In some examples, the application device 5 may include a second drive mechanism 52 (see FIG. 10 ). After the sharp object 43 reaches a predetermined position, the second drive mechanism 52 can drive the sharp object 43 distally to remove the sharp object 43 from the host. In the present disclosure, the sensor assembly 40 and the electronic assembly 30, which are applied to the host's body surface and do not include the sharp object 43, may be referred to as a sensor control device.

[0124] In some examples, the application device 5 may include a first drive mechanism 51 and a second drive mechanism 52. Thus, the two drive mechanisms can be used to apply the patch assembly 3 to the host and remove the sharp object 43 from the host.

[0125] In some examples, the application device 5 may include an applicator housing 53 (see FIG. 10 ). The applicator housing 53 may have a storage space. The electronic component 30 held by the application device 5 may be located in the storage space of the applicator housing 53 .

[0126] In some examples, the applicator housing 53 can enter the receiving space 11 of the cartridge device 1 together with the electronic assembly 30 to pick up the sensor assembly 40. In some examples, the applicator housing 53 can include a flange. The flange can cooperate with the first guide groove 181 on the housing 10 of the cartridge device 1 to enable the applicator housing 53 to move in a desired direction within the housing 10 of the cartridge device 1. In this case, the coupling between the two can be facilitated, and the applicator housing 53 and the limiting cover 17 share a guide groove, which can reduce redundant design.

[0127] In some examples, the application device 5 may include an auxiliary mechanism 54 (see FIG10 ) configured to be movable relative to the applicator housing 53. The applicator housing 53 may have a proximal end that is close to the host during operation and a distal end that is away from the host. The auxiliary mechanism 54 may be releasably retained in the applicator housing 53 and may accommodate the application assembly 3. In some examples, after being released, the auxiliary mechanism 54 may move along a predetermined path and apply the application assembly 3 to a predetermined location.

[0128] In some examples, the auxiliary mechanism 54 may include a moving body 541, a first receiving portion 542, and a second receiving portion 543 (see Figure 10). The moving body 541 can be releasably retained in the applicator shell 53, the first receiving portion 542 can detachably retain the electronic component 30, and the second receiving portion 543 can retain the sharp object 43. After being released, the moving body 541 can move toward the proximal end of the applicator shell 53, and the first receiving portion 542 and the second receiving portion 543 also move toward the proximal end of the applicator shell 53, and the sharp object 43 carries the sensor 41 together and penetrates the host's subcutaneous tissue, thereby placing the sensor 41 at least partially under the host's subcutaneous tissue. In some examples, the second receiving portion 543 can detachably retain the sharp object 43.

[0129] In some examples, the first drive mechanism 51 can be configured to apply force to the movable body 541 in a proximal direction. When the movable body 541 is released, the movable body 541 can be driven proximally by the first drive mechanism 51 to push the application assembly 3 contained in the first receiving portion 542 and the second receiving portion 543 toward the host. In other examples, the application device 5 may not include the first drive mechanism 51. In this case, when the movable body 541 is released, the movable body 541 can also be manually driven to move proximally.

[0130] In some examples, the second receiving portion 543 can be releasably disposed on the movable body 541, and the second receiving portion 543 can be configured to move relative to the first receiving portion 542 when released. For example, when the second receiving portion 543 is released, it can move relative to the first receiving portion 542 in a direction away from the host. In this case, after the sharp object 43 held in the second receiving portion 543 and the sensor 41 are inserted into the subcutaneous tissue of the host to a predetermined position, the sharp object 43 can be moved away from the host under the action of the second receiving portion 543 to retract the sharp object 43 from the subcutaneous tissue of the host and separate it from the electronic component 30. In some examples, the second receiving portion 543 can hold the sharp object 43 by clamping the supporting portion 432 of the sharp object 43 having an annular recess.

[0131] In some examples, when the second receiving portion 543 is released, the second receiving portion 543 can be driven distally by the second driving mechanism 52 to remove the sharp object 43 from the host. In other examples, the application device 5 may not include the second driving mechanism 52. In this case, the second receiving portion 543 can be manually driven away from the host. In some examples, the second receiving portion 543 can also be integrally connected to the movable body 541, and the sharp object 43 can be removed from the host by manually moving the movable body 541 away from the host.

[0132] In the present disclosure, the various functional modules within the application device 5 may also refer to conventional designs in the art, as long as they can achieve the function of pushing the applicator assembly 3 to the host, and will not be described in detail here. In summary, the third aspect of the present disclosure can provide an analyte monitoring system 100 with high reliability in the pickup process of the sensor assembly 40.

[0133] In summary, according to the present disclosure, a cartridge device 1 , a method for picking up a sensor component 40 , and an analyte monitoring system 100 can be provided, in which the pickup process of the sensor component 40 is highly reliable.

[0134] Although the present disclosure has been described in detail above with reference to the accompanying drawings and examples, it will be understood that the above description does not limit the present disclosure in any form. Those skilled in the art may modify and change the present disclosure as needed without departing from the spirit and scope of the present disclosure, and such modifications and variations all fall within the scope of the present disclosure.

Claims

1. A cassette device for holding a sensor assembly, characterized in that: The cassette device includes a housing having an accommodation space, a support mechanism for detachably supporting the sensor assembly, and a boosting mechanism. The support mechanism, the boosting mechanism, and the sensor assembly supported by the support mechanism are located in the accommodation space. The support mechanism is tightly combined with the sensor assembly to limit the movement of the sensor assembly. When the sensor assembly leaves the support mechanism under the action of a pickup device coupled to the sensor assembly, the boosting mechanism provides a force away from the support mechanism to the pickup device.

2. The cassette device according to claim 1, characterized in that: The pickup device includes an application device for detachably holding an electronic component. The application device is coupled to the cassette device to pick up the sensor assembly so that the sensor assembly is coupled to the electronic component to form an application assembly. The boosting mechanism provides a force away from the support mechanism to the electronic component.

3. The cassette device according to claim 2, characterized in that: The boosting mechanism includes a driving part. During the process of the application assembly leaving the support mechanism, the driving part abuts against the surface of the electronic component facing away from the application device to provide a force away from the support mechanism to the electronic component.

4. The cassette device according to claim 3, characterized in that: The driving part includes an elastic element. When the application device picks up the sensor assembly, the elastic element is in a compressed state; during the process of the application assembly leaving the support mechanism, the end of the driving part contacts the surface of the electronic component facing away from the application device to provide a force away from the support mechanism to the electronic component.

5. The cassette device according to claim 3, characterized in that: The surface of the electronic component facing away from the application device is a sticky surface, and the proportion of the contact area of the driving part with the sticky surface in the total area of the sticky surface is not greater than 10%.

6. The cassette device according to claim 3, characterized in that: The surface of the electronic component facing away from the application device includes a first area with stickiness and a second area with weaker stickiness than the first area. The first area is located on the outer periphery of the second area, and the driving part contacts the second area.

7. The cassette device according to claim 5 or 6, characterized in that: The outer contour of the part of the driving part in contact with the electronic component is a curved surface.

8. The cassette device according to claim 1, characterized in that: It further includes a holding part for tightly holding the sensor assembly. The holding part is a male-female mechanical fitting structure respectively arranged on the support mechanism and the sensor assembly, and the male-female mechanical fitting structure is a clearance fit and / or an interference fit.

9. The cassette device according to claim 1, characterized in that: It further includes a limiting cover located in the accommodation space. The limiting cover covers the upper part of the sensor assembly and has a limiting structure arranged on the outer periphery of at least part of the components of the sensor assembly in a manner that does not contact the sensor assembly. After the limiting cover leaves the accommodation space, the sensor assembly is in a pick-up state.

10. The cartridge device according to claim 9, characterized in that: It further includes a holding mechanism for holding the limiting cover. The holding mechanism is configured to provide a holding force of a predetermined magnitude to the limiting cover, and the holding force is greater than the self-gravity of the limiting cover.

11. The cartridge device according to claim 1, characterized in that: It further includes an opening and a sealing portion. The accommodation space of the housing communicates with the outside through the opening, and the sealing portion is detachably arranged at the opening to seal the accommodation space.

12. A method for picking up a sensor assembly, characterized in that: It includes: Using a support mechanism in a container to tightly and separably hold the sensor assembly; Picking up the sensor assembly by using a picking device that can be coupled with the container. During the picking process, a boosting mechanism is used to provide a force acting away from the support mechanism to the picking device.

13. An analyte monitoring system, characterized in that: It includes a sensor assembly, a cartridge device that separably holds the sensor assembly, an electronic component, and an application device that separably holds the electronic component, The cartridge device includes a support mechanism that separably supports the sensor assembly and a boosting mechanism. The support mechanism is tightly combined with the sensor assembly to limit the movement of the sensor assembly, The application device is coupled with the cartridge device to couple the electronic component with the sensor assembly to form a patch assembly. When the sensor assembly leaves the support mechanism under the action of the electronic component and the application device, the boosting mechanism provides a force acting away from the support mechanism to the electronic component.

14. The analyte monitoring system according to claim 13, characterized in that: The sensor assembly includes a connection base, and a sensor and a sharp object arranged on the connection base, The electronic component includes a housing and a receiving portion for receiving the sensor assembly. The receiving portion includes a receiving portion and a through hole longitudinally penetrating the housing, When the electronic component is coupled with the sensor assembly, the connection base is embedded in the receiving portion and the sharp object is at least partially located in the through hole.

15. The analyte monitoring system according to claim 14, characterized in that: The application device includes a first driving mechanism, a second driving mechanism, and a proximal end that is close to the host and a distal end that is far from the host during operation. The first driving mechanism is configured to act on the patch assembly in a manner towards the proximal end. The patch assembly is driven towards the proximal end by the first driving mechanism to place at least part of the sensor under the skin of the host through the sharp object, and after the sharp object reaches a predetermined position, it is driven towards the distal end by the second driving mechanism to make the sharp object leave the host.

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