Foldable device and flexible printed circuit

Abstract

The embodiments of the present application relate to the field of electronic devices. Provided are a foldable device and a flexible printed circuit. The present application aims to reduce the space of a hinge for accommodating interconnecting wires and save on hinge-crossing resources. In the specific solution, the foldable device comprises a radio-frequency integrated circuit, a system on chip, a first power management chip, a second power management chip, a first main body and a second main body. The radio-frequency integrated circuit and the first power management chip are disposed on the first main body; the system on chip and the second power management chip are disposed on the second main body; and the second power management chip does not supply power to the radio-frequency integrated circuit and the first power management chip. Electrical components on the second main body are powered by a second battery, and electrical components on the first main body are powered by a first battery. Hinge-crossing power lines are reduced and hinge-crossing resources are saved on. A cellular antenna is disposed on the first main body, and a short-range antenna is disposed on the second main body. A radio-frequency power amplifier and the system on chip are disposed on different main bodies, thereby avoiding heat concentration.

Description

Folding devices and flexible circuit boards

[0001] This application claims priority to Chinese patent application filed on February 4, 2024, with application number 202410163446.X and entitled "Folding Device and Flexible Circuit Board", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic devices, and more particularly to a folding device and a flexible circuit board. Background Technology

[0003] Foldable devices (such as foldable phones) are gradually becoming a development trend for future mobile electronic products. When unfolded, foldable devices offer a larger display area, enhancing the viewing experience. When folded, they achieve a smaller size, making them easier for users to carry. A foldable device mainly consists of a first main body, a hinge, and a second main body arranged sequentially. Components on the first and second main bodies are interconnected via interconnecting lines. The number of interconnecting lines affects the size of the space on the hinge that accommodates these interconnecting lines.

[0004] Summary of the Invention

[0005] This application provides a folding device and a flexible circuit board, designed to reduce the space required for the hinge to accommodate interconnects.

[0006] To achieve the above objectives, this application adopts the following technical solution.

[0007] In a first aspect, embodiments of this application provide a folding device. The folding device includes a first main body, a hinge, and a second main body. When the folding device is in a flattened state, the first main body, the hinge, and the second main body are arranged sequentially. The folding device also includes a radio frequency integrated circuit (RF integrated circuit), a system-on-a-chip (SoC), a flexible circuit board, a first battery, a second battery, a first power management chip, and a second power management chip. The RF integrated circuit is used to generate radio frequency signals by performing radio frequency processing on the data transmitted by the SoC, and the RF integrated circuit is disposed on the first main body. The SoC is used to receive and transmit data with the RF integrated circuit. The SoC is disposed on the second main body; the RF integrated circuit and the SoC are electrically connected through the flexible circuit board. The first battery is disposed on the first main body; the second battery is disposed on the second main body. The first power management chip is electrically connected to the first battery and is used to supply power to the RF integrated circuit. The second power management chip is electrically connected to the second battery and is used to supply power to the SoC, but does not supply power to the first power management chip. Thus, the SoC and the RF integrated circuit are respectively disposed on different main bodies of the folding device. This design avoids the clutter caused by placing the system-on-a-chip (SoC) and RF integrated circuit (RIC) on the same main body, allowing for a more rational allocation of components across the two main bodies. It also frees up more space for other components (such as the battery). Furthermore, since the SoC and RF IPC have high power, separating them into two main bodies prevents excessive localized heat generation during operation, improving the device's heat dissipation. Moreover, because the second power management chip on the second main body does not power the first power management chip on the first main body, the power supply line for the first power management chip can be located solely on the first main body. In other words, the power supply line for the first power management chip does not need to extend from the second main body across the hinge to the first main body. This reduces the number of power lines that need to extend from the second main body to the first main body; for example, it can be used solely for charging the first battery, saving space on the hinge for accommodating the power lines and reducing the overall volume of the hinge used to house them.

[0008] In conjunction with the first aspect, in some feasible implementations, the second power management chip does not supply power to the RF integrated circuit. Thus, the power supply line for the RF integrated circuit does not need to extend to the hinge and the second body, saving space on the hinge used to accommodate the power supply line.

[0009] In conjunction with the first aspect, in some feasible embodiments, the first battery is used to output a power supply voltage, which is used to provide the power supply voltage to the first power management chip. The folding device also includes a voltage adjustment circuit. The voltage adjustment circuit is disposed on the first main body and electrically connected to the first battery, used to reduce the power supply voltage and supply the reduced voltage to the first power management chip and the radio frequency integrated circuit. Since the first battery, voltage adjustment circuit, first power management chip, and radio frequency integrated circuit are all disposed on the first main body, the power lines electrically connecting the first battery and voltage adjustment circuit, the power lines electrically connecting the voltage adjustment circuit and the first power management chip, and the power lines electrically connecting the voltage adjustment circuit and the radio frequency integrated circuit are all located on the first main body. The aforementioned power lines do not need to extend to the hinge and the second main body, nor do they need to be electrically connected to devices on the hinge and the second main body. This reduces the number and length of power lines on the second main body. It also reduces the space on the hinge for accommodating the power lines. This facilitates the miniaturization of the folding device.

[0010] In conjunction with the first aspect, in some feasible implementations, the voltage adjustment circuit includes: a first buck converter, a second buck converter, and a first regulator. The first buck converter is disposed on the first main body; electrically connected to the first battery, it reduces the power supply voltage to a first voltage and provides the first voltage to the first power management chip. The second buck converter is disposed on the first main body; electrically connected to the first battery, it reduces the power supply voltage to a second voltage and provides the second voltage to the first power management chip. The first regulator is disposed on the first main body; electrically connected to the first buck converter, it reduces the first voltage to a third voltage and provides the third voltage to the first power management chip and the radio frequency integrated circuit. Thus, the power lines providing the first, second, and third voltages are all located on the first main body, eliminating the need for the power lines to extend to the hinge and the second main body, resulting in a more compact power line layout and facilitating miniaturization of the folding device.

[0011] In conjunction with the first aspect, in some feasible embodiments, the folding device further includes an RF switch. The RF switch is disposed on the first main body. The voltage adjustment circuit further includes a third buck converter and a second voltage regulator. The third buck converter is disposed on the first main body and electrically connected to the first battery, used to reduce the power supply voltage to a fourth voltage and to provide the fourth voltage to the second voltage regulator. The second voltage regulator is disposed on the first main body and electrically connected to the third buck converter, used to reduce the fourth voltage to a fifth voltage and to provide the fifth voltage to the RF switch. Thus, the RF switch and the power lines providing the fourth and fifth voltages are all disposed on the first main body. The aforementioned power lines do not need to extend to the hinge, and the hinge does not need to provide a space to accommodate the power lines, avoiding a reduction in the hinge's support strength and an increase in the hinge's manufacturing complexity due to such a space.

[0012] In conjunction with the first aspect, in some feasible embodiments, the folding device further includes: an RF power amplifier disposed on the first main body; the third step-down device and the first battery are both electrically connected to the RF power amplifier, the third step-down device also being used to provide the fourth voltage to the RF power amplifier; and the first battery also being used to provide the power supply voltage to the RF power amplifier. Thus, the power line providing power to the RF power amplifier can be disposed only on the first main body, without extending to the hinge and the second main body. The hinge does not need to provide space to accommodate the power line, avoiding the reduction in the hinge's support strength and the increased manufacturing difficulty due to such space. Furthermore, the RF power amplifier and the system-on-a-chip (SoC) have high power, and both release a significant amount of heat during operation of the folding device. Distributing the RF power amplifier and the SoC separately on the first and second main bodies avoids the concentration of heat released by the RF power amplifier and the SoC, thereby improving the heat dissipation performance of the folding device.

[0013] In conjunction with the first aspect, in some feasible implementations, the foldable device further includes a charging manager. The charging manager is located in the second main body; both the first battery and the second battery are electrically connected to the charging manager. The charging manager is used to acquire the voltage of the first battery and the voltage of the second battery; and output a control command based on the difference between the voltages of the first battery and the second battery; wherein the control command is used to: control the first battery to charge the second battery when the difference is greater than or equal to a threshold and the voltage of the first battery is greater than the voltage of the second battery; or, the control command is used to: control the second battery to charge the first battery when the difference is greater than or equal to the threshold and the voltage of the first battery is less than the voltage of the second battery. Thus, the charging manager can control the voltage difference between the first battery and the second battery to be small, less than the aforementioned threshold, avoiding the problem of one battery having a low charge and the other a high charge.

[0014] In conjunction with the first aspect, in some feasible implementations, the folding device further includes a hardware module, a first aggregation chip, a first signal line, and a second signal line. The hardware module is disposed on the first main body. The first aggregation chip is disposed on the first main body. The hardware module is electrically connected to the first aggregation chip via the first signal line. The system single-chip is electrically connected to the first aggregation chip via the second signal line. The number of first signal lines is greater than the number of second signal lines. Because both the transmission hardware module and the first aggregation chip are disposed on the first main body, the first signal lines are also located on the first main body. The system single-chip is disposed on the second main body, so the second signal lines extend from the first main body to the second main body. Because the number of first signal lines is greater than the number of second signal lines, reducing the number of signal lines can save space on the hinge for accommodating the signal lines, while still satisfying the signal interaction between the hardware module and the system single-chip, thereby giving the hinge higher support strength.

[0015] In conjunction with the first aspect, in some feasible implementations, the folding device further includes: a second aggregation chip and a third signal line; the second aggregation chip is disposed on the second main body; the second aggregation chip is electrically connected to the first aggregation chip via the second signal line; the second aggregation chip is electrically connected to the system single chip via the third signal line. The number of the third signal lines is equal to the number of the first signal lines. This reduces the number of signal lines on the second main body.

[0016] In conjunction with the first aspect, in some feasible implementations, the flexible circuit board has a first region and a bending region. When the folding device is in a flattened state, the vertical projection of the pivot on the flexible circuit board overlaps with the bending region. The flexible circuit board includes: a shielding layer, a first layer structure, a second layer structure, and a third layer structure stacked sequentially along the thickness direction of the flexible circuit board. In the bending region, there is a first gap between the first layer structure and the second layer structure, and a second gap between the second layer structure and the third layer structure. The flexible circuit board also includes: a fourth signal line for connecting the radio frequency integrated circuit and the system chip. The fourth signal line includes a first conductive segment and a second conductive segment electrically connected. The first conductive segment is located in the first region and formed in the second layer structure, and the second conductive segment is located in the bending region and formed in the first layer structure. The vertical projection of the shielding layer on the first layer structure overlaps with the second conductive segment. Thus, during the folding process of the folding device, the relative movement of the first layer structure, the second layer structure, and the third layer structure located in the first region is small or almost non-existent. Because the first conductive segment is located in the first region, the distance between the first conductive segment and the first conductive layer along the first direction remains almost constant. Similarly, the distance between the first conductive segment and the third conductive layer along the first direction also remains almost constant. The first conductive segment experiences almost no signal loss due to movement relative to the first and third conductive layers, resulting in minimal signal loss within the first conductive segment. During the folding process of the folding device, the distance between the first and second conductive layers, and the distance between the third and second conductive layers, located in the bending region, continuously changes. If the second conductive segment is also formed on the second conductive layer, the aforementioned distance changes would lead to significant signal loss on the second conductive segment. In the embodiments of this application, the second conductive segment is formed on the first conductive layer, which effectively improves the signal loss on the second conductive segment caused by the aforementioned distance changes. Furthermore, the shielding layer is attached to the first covering layer, and the distance between the shielding layer and the second conductive segment remains almost unchanged. The vertical projection of the shielding layer onto the first conductive layer overlaps with the second conductive segment. The shielding layer serves to prevent interference to the signal of the second conductive segment and has minimal impact on signal loss on the second conductive segment.

[0017] In some feasible implementations, the first layer structure includes a first cover layer, a first conductive layer, and a first protective layer stacked along the thickness direction of the flexible circuit board. The second layer structure includes a second cover layer, a second conductive layer, and a second protective layer stacked sequentially along the thickness direction of the flexible circuit board; the second cover layer is located between the first protective layer and the second conductive layer. The third layer structure includes a third cover layer, a third conductive layer, and a third protective layer stacked sequentially along the thickness direction of the flexible circuit board; the third cover layer is located between the second protective layer and the third conductive layer. A first conductive segment is formed in the second conductive layer, and the second conductive segment is formed in the first conductive layer.

[0018] In conjunction with the first aspect, in some feasible embodiments, the fourth signal line further includes a conductive via that penetrates the first layer and the second layer along the thickness direction of the flexible circuit board; the first conductive segment and the second conductive segment are electrically connected through the conductive via.

[0019] In conjunction with the first aspect, in some feasible embodiments, the flexible circuit board further includes a first adhesive layer and a second adhesive layer. The first adhesive layer and the second adhesive layer are located in the first region, with the first adhesive layer situated between the first layer and the second layer; the second adhesive layer is situated between the second layer and the third layer. The first and second layers are connected by the first adhesive layer, preventing relative movement between the first and second layers located in the first region. The second and third layers are connected by the second adhesive layer, preventing relative movement between the second and third layers located in the first region.

[0020] In conjunction with the first aspect, in some feasible embodiments, the shielding layer's vertical projection onto the first layer structure covers the second conductive segment. Thus, the shielding layer provides better shielding performance for the second conductive segment, reducing the impact of other wiring on the signal of the second conductive segment, and similarly reducing the impact of the second conductive segment on other wiring.

[0021] In conjunction with the first aspect, in some feasible implementations, the flexible circuit board further includes a second region, with the first region, the bending region, and the second region sequentially connected. The fourth signal line also includes a third conductive segment located in the second region and electrically connected to the second conductive segment, and the third conductive segment is formed in the second layer structure. During the folding process of the folding device, along the first direction, the distance between the third conductive segment and the first conductive layer remains unchanged or changes only slightly, and the distance between the third conductive segment and the third layer structure remains unchanged or changes only slightly. Signal loss is minimal within the third conductive segment formed in the second region.

[0022] In conjunction with the first aspect, in some feasible implementations, the flexible circuit board further includes a clock signal line formed in the second layer structure. This clock signal line is electrically isolated from the fourth signal line; the vertical projection of the fourth signal line onto the second layer structure does not overlap with the clock signal line. Therefore, the fourth signal line and the clock signal line do not overlap in the thickness direction of the flexible circuit board, effectively reducing interference between them, increasing the isolation of the clock signal line, and resulting in more accurate clock signals transmitted within the clock signal line.

[0023] In conjunction with the first aspect, in some feasible methods, the distance between the clock signal line and the fourth signal line is greater than or equal to 0.4 mm. This greater distance between the fourth signal line and the clock signal line reduces interference between them, thus improving the isolation of the clock signal line.

[0024] In conjunction with the first aspect, in some feasible embodiments, the folding device further includes a cellular antenna and a short-range antenna, the cellular antenna being disposed on the first body and electrically connected to the radio frequency integrated circuit. The short-range antenna is disposed on the second body and electrically connected to the system single chip.

[0025] Secondly, embodiments of this application provide a flexible circuit board. The flexible circuit board has a first region and a bending region. The flexible circuit board includes a first layer structure, a second layer structure, a third layer structure, signal lines, and a shielding layer. The second layer structure is stacked with the first layer structure; in the bending region, a first gap exists between the first layer structure and the second layer structure. The second layer structure is located between the third layer structure and the first layer structure; in the bending region, a second gap exists between the second layer structure and the third layer structure. The signal line includes a first conductive segment and a second conductive segment electrically connected. The first conductive segment is located in the first region and formed in the second layer structure, and the second conductive segment is located in the bending region and formed in the first layer structure. The first layer structure is located between the second layer structure and the shielding layer, and the vertical projection of the shielding layer onto the first layer structure overlaps with the second conductive segment. Attached Figure Description

[0026] Figure 1a is a schematic diagram of the structure of the folding device in its flattened state.

[0027] Figure 1b is a schematic diagram of the folding device in the folded state.

[0028] Figure 2 is an exploded view of the folding device.

[0029] Figure 3 is a schematic diagram of the antenna distribution of the folding device provided in the embodiment of this application.

[0030] Figure 4a is a schematic diagram of the battery circuit of the folding device provided in the embodiment of this application.

[0031] Figure 4b is a control diagram of a charging manager provided in an embodiment of this application.

[0032] Figure 5a is a simplified diagram of the wiring structure of the hardware module on the folding device provided in the embodiment of this application.

[0033] Figure 5b is a simplified diagram of another wiring structure for the hardware module on the folding device provided in the embodiment of this application.

[0034] Figure 6 is a schematic diagram of the structure of the flexible circuit board provided in the embodiment of this application.

[0035] Figure 7a is a partial structural schematic diagram of the flexible circuit board provided in an embodiment of this application.

[0036] Figure 7b is an exploded view of the flexible circuit board provided in an embodiment of this application.

[0037] Figure 8a is a cross-sectional schematic diagram of a flexible circuit board provided in an embodiment of this application.

[0038] Figure 8b is an exploded view of a first conductive layer, a second conductive layer, and a third conductive layer provided in an embodiment of this application.

[0039] Figure 8c is a cross-sectional schematic diagram of another flexible circuit board provided in an embodiment of this application.

[0040] Figure 9 is a schematic diagram of the structure of an electrical connector provided in an embodiment of this application.

[0041] In the diagram: 001 - Folding device; 10 - First main body; 20 - Second main body; 30 - Hinge; 110 - First middle frame; 120 - First back cover; 111 - First frame; 112 - First middle plate; 140 - First printed circuit board; 210 - Second middle frame; 211 - Second frame; 212 - Second middle plate; 220 - Second back cover; 240 - Second printed circuit board; 50 - Flexible circuit board; 40 - Flexible display screen; 31 - First door panel; 32 - Second door panel; 33 - Shaft; 101 - Radio frequency integrated circuit; 102 - First power management chip; 103 - First battery; 104 - Cellular antenna; 104a - First cellular antenna Antenna; 104b - Second cellular antenna; 104c - Third cellular antenna; 104d - Fourth cellular antenna; 104e - Fifth cellular antenna; 105 - RF switch; 106 - RF power amplifier; 107a - Hardware module; 107b - Hardware module; 108 - First aggregation chip; 109 - Second aggregation chip; 60 - Voltage adjustment circuit; 601 - First buck converter; 602 - Second buck converter; 603 - First voltage regulator; 604 - Third buck converter; 605 - Second voltage regulator; V0 - Power supply voltage; V1 - First voltage; V2 - Second voltage; V3 - Third voltage; V4 - Fourth voltage; V5 - Fifth voltage; 201- System single chip; 202- Second power management chip; 203- Second battery; 204- Short-range antenna; 204a- First short-range antenna; 204b- Second short-range antenna; 205- Charge manager; 501- First area; 502- Bending area; 503- Second area; 504- Conductive via; 51- First gap; 52- Second gap; 510- First layer structure; 511- First cover layer; 512- First conductive layer; 513- First protective layer; 520- Second layer structure; 521- Second cover layer; 522- Second conductive layer; 523- Second protective layer; 530- Third layer structure; 5 31-Third covering layer; 532-Third conductive layer; 533-Third protective layer; 540-Shielding layer; 550-Fourth signal line; 551-First conductive segment; 552-Second conductive segment; 553-Third conductive segment; 554-Clock signal line; 555-Isolation conductive structure; 561-First adhesive layer; 562-Second adhesive layer; 70a-First electrical connector; 70b-Second electrical connector; 71-Connector male; 72-Connector female; 73-First shielding cover; 74-Second shielding cover; 01-First signal line; 02-Second signal line; 03-Third signal line; 555-Isolation conductive structure; 556-Fifth signal line. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0043] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0044] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0045] This application provides a foldable device, which can be, for example, a mobile phone, a tablet computer, a personal digital assistant (PDA), or a television. For ease of explanation, a mobile phone will be used as an example for illustration below.

[0046] Figure 1a is a structural diagram of the folding device 001 in its flattened state. Figure 1b is a structural diagram of the folding device 001 in its folded state. Referring to Figures 1a and 1b, the folding device 001 can be folded or unfolded, thus changing its size according to actual needs and usage scenarios. For example, when viewing a screen, the folding device 001 can be unfolded as shown in Figure 1a, expanding its flexible display screen for better viewing. When answering or making phone calls, the folding device 001 can be folded as shown in Figure 1b, making it easier for the user to hold and improving the user experience.

[0047] It is understood that the folding state of the folding device 001 is not limited to the state shown in FIG1b. The folding device 001 may have multiple folding states, for example, between the flattened state in FIG1a and the folding state in FIG1b.

[0048] As shown in Figure 1a, the folding device 001 includes a first main body 10, a second main body 20, and a rotating shaft 30. Both the first main body 10 and the second main body 20 are connected to the rotating shaft 30. When the folding device 001 is in the unfolded state, and the first main body 10, the second main body 20, and the rotating shaft 30 are in the flattened state, the first main body 10, the second main body 20, and the rotating shaft 30 are arranged sequentially along the x-direction.

[0049] For ease of description, the thickness direction of the folding device 001 is defined as the first direction, and the z direction is used to indicate the first direction in the following text and figures. The axial extension direction of the rotating shaft 30 is defined as the second direction, and the y direction is used to indicate the second direction in the following text and figures. The x, y and z directions are perpendicular to each other.

[0050] It is understood that the aforementioned perpendicularity allows for assembly and manufacturing errors. For example, the perpendicularity of the x and z directions is not limited to an angle of 90° between them. Exemplarily, the angle between the x and z directions can be 85° to 95°. For example, it can be 85°, 87°, 88°, 89°, 90°, 91°, 92°, 93°, or 95°, etc. The rest of the descriptions of perpendicularity in the text are similar.

[0051] Figure 2 is an exploded structural diagram of the folding device 001. Referring to Figure 2, the first main body 10 includes a first middle frame 110 and a first rear cover 120. The first middle frame 110 includes a first side frame 111 and a first middle plate 112. The first side frame 111 is connected to the pivot 30.

[0052] The first middle plate 112 is located within the area formed by the first frame 111 and is connected to the inner wall of the first frame 111. For example, the first frame 111 and the first middle plate 112 are connected as an integral part. The first rear cover 120 is connected to the first frame 111, and the first rear cover 120 and the first middle plate 112 are stacked along the z-direction.

[0053] In some embodiments, there is a gap between the first rear cover 120 and the first middle plate 112, and the first rear cover 120, the first middle plate 112, and the first frame 111 together form a receiving space. The circuit board, battery, and other components of the folding device 001 are received within this receiving space.

[0054] Exemplarily, the first body 10 may further include a first printed circuit board (PCB) 140. In some embodiments, the first PCB 140 is located between the first rear cover 120 and the first middle plate 112. In some embodiments, the first middle plate 112 is located between the first PCB 140 and the first rear cover 120.

[0055] It is understood that the aforementioned first middle frame 110, first back cover 120, and first printed circuit board 140 are merely examples of some of the components on the first main body 10. The first main body 10 may also be equipped with devices such as cameras, antennas, or sensors.

[0056] The second body 20 may include a second middle frame 210 and a second rear cover 220. The second middle frame 210 may include a second side frame 211 and a second middle plate 212. The second side frame 211 is connected to the pivot 30. The second body 20 may also include a second printed circuit board 240. For a structural description of the second body 20, please refer to the description of the first body 10 above.

[0057] It is understood that the devices housed in the aforementioned receiving space of the first main body 10 and the devices housed in the receiving space of the second main body 20 may not be exactly the same. The shapes of the first intermediate plate 112 and the second intermediate plate 212 may be different. This application embodiment does not limit this.

[0058] In some embodiments, the folding device 001 further includes a flexible printed circuit (FPC) 50, one end of which is located on the first body 10 and the other end of which is located on the second body 20. Devices on the first body 10 and the second body 20 can communicate via signal lines formed on the flexible printed circuit board 50. For example, one end of the flexible printed circuit board 50 is electrically connected to the first printed circuit board 140, and the other end of the flexible printed circuit board 50 is electrically connected to the second printed circuit board 240.

[0059] In some embodiments, the flexible circuit board 50 is inserted through the pivot 30, which can make full use of the thickness of the pivot 30 along the z direction to save the thickness of the folding device 001. In addition, during the folding or unfolding process of the folding device 001, the pivot 30 can also constrain the space for movement of the flexible circuit board 50, and prevent the flexible circuit board 50 from moving too much along the z direction.

[0060] This application does not limit the structure of the pivot 30. Exemplarily, the pivot 30 includes a first door panel 31, a second door panel 32, and a shaft 33. When the folding device 001 is in a flattened state, the first door panel 31, the second door panel 32, and the shaft 33 are arranged along the x-direction. The first door panel 31 and the shaft 33 are rotatably connected, for example, through an arc-shaped groove and a slider; in an embodiment where the flexible circuit board 50 passes through the pivot 30, the flexible circuit board 50 passes through the arc-shaped groove. Alternatively, the first door panel 31 and the shaft 33 are rotatably connected by a hinge. Similarly, the second door panel 32 and the shaft 33 are rotatably connected, for example, through an arc-shaped groove and a slider; or, the second door panel 32 and the shaft 33 are rotatably connected by a hinge. The first frame 111 is connected to the first door panel 31, for example, by screws or snap-fit. The second frame 211 is connected to the second door panel 32, for example, by screwing or snap-fitting.

[0061] In some embodiments, the folding device 001 may further include a flexible display screen 40. The first body 10, the second body 20, and the pivot 30 jointly support the flexible display screen 40. When the folding device 001 is in a folded state, the angle between the surface of the first body 10 facing the flexible display screen 40 and the surface of the second body 20 facing the flexible display screen 40 can be -10° to 10°, and the opening of this angle faces the flexible display screen 40, for example, it can be ±10°, ±9°, ±8°, ±7°, ±6°, ±5°, ±4°, ±3°, ±2°, ±1°, or 0°, etc. When the folding device 001 is in a flattened state, the angle between the surface of the first main body 10 facing the flexible display screen 40 and the surface of the second main body 20 facing the flexible display screen 40 can be 170° to 190°, and the opening of the angle faces the flexible display screen 40. For example, it can be 170°, 172°, 175°, 178°, 179°, 180°, 181°, 182°, 185°, 188° or 190°.

[0062] This application does not limit the folding type of the folding device 001. In some embodiments, the folding device 001 has an inward folding structure, that is, when the folding device 001 is in the folded state, the flexible display screen 40 is located between the first main body 10 and the second main body 20. In other embodiments, the folding device 001 has an outward folding structure, that is, when the folding device 001 is in the folded state, both the first main body 10 and the second main body 20 are located between opposite ends of the flexible display screen 40.

[0063] For example, the flexible display screen 40 may be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a flexible light-emitting diode (FLED) display screen, a MiniLED display screen, a MicroLED display screen, a Micro-OLED display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0064] Figure 3 is a schematic diagram of the antenna distribution of the folding device 001 provided in an embodiment of this application. Referring to Figure 3, in this embodiment, the folding device 001 further includes a radio frequency integrated circuit (RFIC) 101, a first power management chip 102, a first battery 103, a system on chip (SOC) 201, a second power management chip 202, and a second battery 203. The RFIC 101 is used to generate radio frequency signals by performing radio frequency processing on the data transmitted by the system on chip 201. The system on chip 201 is used to receive and transmit data with the RFIC 101.

[0065] In some embodiments, the power management chip is also referred to as a power management unit (PMU). The radio frequency integrated circuit 101 may include a radio frequency transceiver and a radio frequency system (RF system).

[0066] For example, the system-on-a-chip 201 may include an application processor (AP) and a modem. The application processor is used to control applications. The modem is used to control network standards and internet access, download speeds, etc.

[0067] The radio frequency integrated circuit 101, the first power management chip 102, and the first battery 103 are all disposed on the first main body 10. The system-on-a-chip 201, the second power management chip 202, and the second battery 203 are all disposed on the second main body 20. Both the radio frequency integrated circuit 101 and the system-on-a-chip 201 are electrically connected to the flexible circuit board 50. The system-on-a-chip 201 and the radio frequency transceiver in the radio frequency integrated circuit 101 exchange signals through the flexible circuit board 50.

[0068] The first battery 103 is electrically connected to the first power management chip 102. The first battery 103 supplies power to the first power management chip 102, which in turn supplies power to the radio frequency integrated circuit 101. The second battery 203 is electrically connected to the second power management chip 202. The second battery 203 supplies power to the second power management chip 202, which supplies power to the system single chip 201. The second power management chip 202 does not supply power to the first power management chip 102.

[0069] Thus, the system-on-a-chip 201 and the radio frequency integrated circuit 101 are respectively disposed on different main bodies of the folding device 001. This avoids the situation where the system-on-a-chip 201 and the radio frequency integrated circuit 101 are disposed on the same main body, which would cause the components on that main body to be crowded, and facilitates a more reasonable distribution of components on the two main bodies. More space can be freed up for other components (such as the battery). In addition, since the system-on-a-chip 201 and the radio frequency integrated circuit 101 have high power, distributing the system-on-a-chip 201 and the radio frequency integrated circuit 101 on two separate main bodies can avoid excessive local heat generation during the operation of the folding device 001, thereby improving the heat dissipation performance of the folding device 001.

[0070] Since the second power management chip 202 located in the second body 20 does not supply power to the first power management chip 102 located in the first body 10, the power cable supplying power to the first power management chip 102 can be located only on the first body 10. In other words, the power cable supplying power to the first power management chip 102 does not need to extend to the hinge 30 and the second body 20. Reducing the power cable that needs to extend from the second body 20 to the first body 10, for example, it can be set only as a charging cable for charging the first battery 103, saving space in the hinge 30 for accommodating the power cable and reducing the volume of space in the hinge 30 for accommodating the power cable. This increases the supporting strength of the hinge 30 while also facilitating the miniaturization of the folding device 001.

[0071] The aforementioned statement that the power cord does not need to extend to the hinge 30 and the second body 20 means that the power cord does not need to be directly connected to the components on the hinge 30 and the second body 20. In some scenarios, it is permissible for the power cord to be stacked with the hinge 30. In other words, it is permissible for the projection of the power cord on the hinge 30 to overlap with the hinge 30. For example, depending on the component layout requirements on the first body 10, the power cord can cover part of the hinge 30.

[0072] For example, the flexible circuit board 50 (as shown in FIG. 2) does not need to have the aforementioned power line extending from the second body 20 across the pivot 30 to the first body 10. For example, the number of pins on the flexible circuit board 50 can be reduced by 25-40, which is beneficial to reducing the size of the flexible circuit board 50 in the y-direction. In the embodiment where the flexible circuit board 50 passes through the pivot 30, the size of the flexible circuit board 50 is reduced, and the space in the pivot 30 for accommodating the flexible circuit board 50 is reduced, saving space in the pivot 30 while avoiding the problem of reduced mechanical strength of the pivot 30 due to a large space.

[0073] Furthermore, the second power management chip 202 does not supply power to the RF integrated circuit 101. Therefore, the power supply line for the RF integrated circuit 101 does not need to extend to the hinge 30 and the second body 20. This saves space in the hinge 30 used to accommodate the power supply line.

[0074] In the embodiments of this application, a power line refers to a line used to supply power to a device. It is located on the discharge path of the power supply and is functionally different from a signal line that transmits signals to a device. The rest of the description of power lines in this document is similar.

[0075] In some embodiments, the folding device 001 further includes a cellular antenna 104 and a short-range antenna 204. The cellular antenna 104 is disposed on the first main body 10 and electrically connected to the radio frequency integrated circuit 101. The short-range antenna 204 is disposed on the second main body 20 and electrically connected to the system single chip 201. The short-range antenna 204 can transmit data using short-range communication technology after receiving third data sent by the system single chip 201. The radio frequency integrated circuit 101 receives the data sent by the system single chip 201, performs radio frequency processing on the data sent by the system single chip 201 to generate a radio frequency signal, and transmits the radio frequency signal to the cellular antenna 104. The cellular antenna 104 receives and transmits radio frequency signals based on mobile cellular communication technology.

[0076] Compared to a design where both the cellular antenna 104 and the short-range antenna 204 are housed in the same main body, the cellular antenna 104 and the short-range antenna 204 are housed in two separate main bodies. This allows for more options in the placement of the cellular antenna 104, more space for its placement, and more options in its shape, enabling optimal configuration and improved functionality. Similarly, the short-range antenna 204 offers more space for its placement, more options in its location and shape, and optimal configuration, further enhancing its functionality.

[0077] Exemplarily, the cellular antenna 104 can be disposed on the first frame 111, and the short-range antenna 204 can be disposed on the second frame 211. The cellular antenna 104 and the short-range antenna 204 are disposed on two separate bodies. In embodiments where the cellular antenna 104 and the short-range antenna 204 are slotted antennas, the first frame 111 can have fewer slots, and the second frame 211 can have fewer slots, making the appearance of the first frame 111 and the second frame 211 more complete. In all scenarios, it can meet industry-standard requirements and provide a good communication experience.

[0078] For example, the cellular antenna 104 is an antenna that supports mobile cellular communication technology. There can be multiple cellular antennas 104. For example, in FIG3, the cellular antenna 104 includes a first cellular antenna 104a, a second cellular antenna 104b, a third cellular antenna 104c, a fourth cellular antenna 104d, a fifth cellular antenna 104e, and a sixth cellular antenna 104f.

[0079] In some embodiments, the cellular antenna 104 may include a parasitic module, which may be a medium and high frequency (MHF) parasitic module or a low frequency (LF) parasitic module. The parasitic module of the cellular antenna 104 may be disposed in the second body 20, for example, in the second frame 211 of the second body 20.

[0080] The short-range antenna 204 is an antenna for short-range communication technology. The short-range antenna 204 may include a first short-range antenna 204a and a second short-range antenna 204b. For example, the short-range antenna 204 may include a global positioning system (GPS), wireless fidelity (WIFI), a Bluetooth module (BT), etc.

[0081] Figure 4a is a simplified circuit diagram of the folding device 001 provided in an embodiment of this application. Referring to Figure 4a, the first battery 103 is used to power the first power management chip 102 and the radio frequency integrated circuit 101. The second battery 203 is used to power the system single chip 201 and the second power management chip 202.

[0082] Typically, the system single-chip 201 and the second power management chip 202 have multiple operating voltages, and the magnitudes of these multiple operating voltages are not exactly the same. The first power management chip 102 and the radio frequency integrated circuit 101 also have multiple operating voltages, and the magnitudes of these multiple operating voltages are not exactly the same.

[0083] Exemplarily, the first battery 103 is used to provide a power supply voltage V0. In some embodiments, the folding device 001 further includes a voltage adjustment circuit 60 disposed on the first body 10. The voltage adjustment circuit 60 and the first battery 103 are electrically connected. The voltage adjustment circuit 60 is used to reduce the power supply voltage V0 and supply the reduced voltage to the first power management chip 102 and the radio frequency integrated circuit 101.

[0084] Since the first battery 103, voltage adjustment circuit 60, first power management chip 102, and radio frequency integrated circuit 101 are all located on the first main body 10, the power lines electrically connecting the first battery 103 and voltage adjustment circuit 60, the power lines electrically connecting the voltage adjustment circuit 60 and first power management chip 102, and the power lines electrically connecting the voltage adjustment circuit 60 and radio frequency integrated circuit 101 are all located on the first main body 10. These power lines do not need to extend to the pivot 30 and the second main body 20, nor do they need to be electrically connected to the devices on the pivot 30 and the second main body 20. This reduces the number and length of power lines on the second main body 20. It also reduces the space on the pivot 30 for accommodating the power lines. This facilitates the miniaturization of the folding device 001.

[0085] This application does not limit the magnitude of the power supply voltage V0. It can be set according to the usage scenario of the folding device 001. For example, the magnitude of the power supply voltage V0 can be 3.0V (volts) to 4.53V; for example, the magnitude of the power supply voltage V0 can be 3.8V, 3.9V, 4.0V, 4.1V, or 4.2V, etc.

[0086] In some embodiments, the voltage adjustment circuit 60 may include a first buck converter 601, a second buck converter 602, and a first voltage regulator 603. The first buck converter 601, the second buck converter 602, and the first voltage regulator 603 are all disposed on the first main body 10. For example, the first buck converter 601, the second buck converter 602, and the first voltage regulator 603 are all disposed on the first printed circuit board 140 (as shown in FIG. 2). The first buck converter 601 and the second buck converter 602 are both electrically connected to the first battery 103. The first battery 103 provides a power supply voltage V0 to the first power management chip 102, the first buck converter 601, and the second buck converter 602. The first buck converter 601 reduces the power supply voltage V0 to a first voltage V1 and provides the first voltage V1 to the first power management chip 102. The second buck converter 602 reduces the power supply voltage V0 to a second voltage V2 and provides the second voltage V2 to the first power management chip 102. The first voltage regulator 603 is electrically connected to the first buck regulator 601. The first voltage regulator 603 reduces the first voltage V1 to a third voltage V3 and provides the third voltage V3 to the first power management chip 102 and the radio frequency integrated circuit 101. Thus, the voltage adjustment circuit 60 reduces the power supply voltage V0 to obtain the first voltage V1, the second voltage V2, and the third voltage V3; and provides the first voltage V1, the second voltage V2, and the third voltage V3 to the first power management chip 102, and provides the third voltage V3 to the radio frequency integrated circuit 101. The power lines providing the first voltage V1, the second voltage V2, and the third voltage V3 are all located in the first main body 10. These power lines do not need to extend to the pivot 30 and the second main body 20, making the power line layout more compact and beneficial for miniaturization of the folding device.

[0087] The magnitudes of the first voltage V1, the second voltage V2, and the third voltage V3 are set according to the requirements of the first power management chip 102 and the radio frequency integrated circuit 101. For example, the magnitude of the first voltage V1 can be 1.8V-2.0V, such as 1.8V, 1.85V, 1.90V, 1.95V, or 2.0V. The magnitude of the second voltage V2 can be 0.8V-1.0V, such as 0.8V, 0.85V, 0.90V, 0.95V, or 1.0V. The third voltage V3 is less than the first voltage V1, and the magnitude of the third voltage V3 can be 1.7V-1.9V, such as 1.7V, 1.75V, 1.8V, 1.85V, or 1.90V.

[0088] Both the aforementioned step-down and voltage regulator devices have the function of reducing voltage. For example, step-down devices are suitable for scenarios with high current and low voltage fluctuation requirements. Voltage regulator devices are suitable for scenarios with low current and small voltage fluctuations.

[0089] This application embodiment does not limit the type of the first buck device 601. For example, the first buck device 601 may include an external buck switching power supply. This application embodiment does not limit the type of the first voltage regulator 603. For example, the first voltage regulator 603 may include an external voltage regulator chip (External LDO).

[0090] For example, the first power management chip 102 is used to supply power to the radio frequency integrated circuit 101. The voltage supplied by the first power management chip 102 to the radio frequency integrated circuit 101 can be set according to the operating voltage of the components in the radio frequency integrated circuit 101.

[0091] In some embodiments, the folding device 001 may further include a radio frequency switch 105 disposed on the first body 10. The voltage adjustment circuit 60 may further include a third buck converter 604 and a second voltage regulator 605. Both the third buck converter 604 and the second voltage regulator 605 are disposed on the first body 10. The third buck converter 604 is electrically connected to a first battery 103, which provides a power supply voltage V0 to the third buck converter 604. The third buck converter 604 reduces the power supply voltage V0 to a fourth voltage V4 and provides the fourth voltage V4 to the second voltage regulator 605. The second voltage regulator 605 is electrically connected to the third buck converter 604, and reduces the fourth voltage V4 to a fifth voltage V5 and provides the fifth voltage V5 to the radio frequency switch 105.

[0092] Similarly, the RF switch 105 and the power lines providing the fourth voltage V4 and the fifth voltage V5 are both located on the first body 10. The aforementioned power lines do not need to extend to the rotating shaft 30, and the rotating shaft 30 does not need to provide a space to accommodate the power lines, thus avoiding the reduction of the support strength of the rotating shaft 30 and the increase of the manufacturing difficulty of the rotating shaft 30 due to the space.

[0093] For example, the magnitude of the fourth voltage V4 can be 3.3V-3.6V; the magnitude of the fourth voltage V4 can be, for example, 3.3V, 3.4V, 3.45V, 3.5V, 3.55V, or 3.6V. The magnitude of the fifth voltage V5 can be 2.70V-3.0V; the magnitude of the fifth voltage V5 can be, for example, 2.70V, 2.75V, 2.8V, 2.85V, 2.90V, 2.95V, or 3.0V, etc.

[0094] In some embodiments, the folding device 001 may further include a radio frequency power amplifier (PA) 106, which is disposed with the first body 10. For example, the radio frequency power amplifier 106 is disposed on the first printed circuit board 140. A third step-down device 604 and a first battery 103 are both electrically connected to the radio frequency power amplifier 106. The third step-down device 604 is also used to provide a fourth voltage V4 to the radio frequency power amplifier 106; the first battery 103 is also used to provide a power supply voltage V0 to the radio frequency power amplifier 106.

[0095] Similarly, the power supply line for the RF power amplifier 106 can be located only in the first body 10, without extending to the hinge 30 and the second body 20. The hinge 30 does not need to provide a space to accommodate the power supply line, thus avoiding the reduction of the support strength of the hinge 30 and the increase of the manufacturing difficulty of the hinge 30 due to such a space.

[0096] In addition, the RF power amplifier 106 and the system single chip 201 have high power, and both release a lot of heat when the folding device 001 is working. The RF power amplifier 106 and the system single chip 201 are respectively located in the first main body 10 and the second main body 20, which avoids the concentration of heat released by the RF power amplifier 106 and the system single chip 201, thus improving the heat dissipation performance of the folding device 001. Compared with the RF power amplifier 106 and the system single chip 201 being located in the same main body, their separate locations in different main bodies significantly improve the heat dissipation performance of the folding device 001, both in scenarios with good communication signals and in scenarios with poor communication signals (e.g., when the user uses the folding device underground where the signal is weak). In scenarios with good communication signals, the heat dissipation performance of the folding device 001 in the folded state is improved by 2mA / ℃ to 5mA / ℃; and the heat dissipation performance of the folding device 001 in the flattened state is improved by 6mA / ℃ to 9mA / ℃. In scenarios with poor communication signals, the heat dissipation performance of the foldable device 001 is improved by 6mA / ℃-9mA / ℃ in the folded state; and by 10mA / ℃-13mA / ℃ in the flattened state.

[0097] This application embodiment does not limit the positional relationship of the radio frequency power amplifier 106 on the first body 10. Exemplarily, the radio frequency power amplifier 106 is located at the edge of the first body 10 away from the rotation axis 30. In this way, the distance between the radio frequency power amplifier 106 and the cellular antenna 104 (as shown in FIG. 3) disposed on the first frame 111 (FIG. 3) is small, which can shorten the signal transmission distance between the radio frequency power amplifier 106 and the cellular antenna 104.

[0098] Furthermore, the radio frequency power amplifier 106 is disposed at the edge of the first body 10 away from the pivot 30. The first printed circuit board 140 for supporting the radio frequency power amplifier 106 is also disposed near the edge of the first body 10 away from the pivot 30. The first battery 103 can be disposed between the pivot 30 and the first printed circuit board 140. In this way, the space on the first body 10 for accommodating the first battery 103 is correspondingly increased, and a larger first battery 103 with high energy storage capacity can be disposed.

[0099] In the embodiments of this application, the voltage adjustment circuit 60 is not limited to the first buck device 601, the second buck device 602, the first voltage regulator 603, the third buck device 604, and the second voltage regulator 605 described above. In some embodiments, the voltage adjustment circuit 60 may also include a fourth buck device, a fifth buck device, a sixth buck device, etc., and the voltage adjustment circuit 60 may also include a third voltage regulator, a fourth voltage regulator, a fifth voltage regulator, etc. It can be configured according to the operating voltage of the first power management chip 102 and the operating voltage of the radio frequency integrated circuit 101.

[0100] It is understood that, in the embodiments of this application, the first battery 103 is not limited to powering the RF power amplifier 106, the RF switch 105, the first power management chip 102, and the RF integrated circuit 101. In some embodiments, the first main body 10 may also include a hardware module 107a, and the first battery 103 powers the hardware module 107a. The voltage supplied to the hardware module 107a is set according to the operating voltage of the hardware module 107a.

[0101] As described above, the second battery 203 supplies power to the second power management chip 202, and the second power management chip 202 supplies power to the system chip 201. In some embodiments, the second power management chip 202 and the system chip 201 can be integrated together. In some embodiments, the second power management chip 202 and the system chip 201 can be configured independently.

[0102] Similarly, the second battery 203 is not limited to powering only the second power management chip 202 and the system chip 201. The second battery 203 can also power the hardware module 107b located in the second body 20.

[0103] For example, hardware modules 107a (107b) may include: an audio module, a speaker, a receiver, a microphone, a sensor, storage, buttons, a front-facing camera, a rear-facing camera, a display screen, an antenna chip, a secure digital storage card (SD), and a subscriber identification module (SIM), etc. The antenna chip may include a Wi-Fi antenna chip, a BitTorrent (BT) antenna chip, a Near Field Communication (NFC) antenna chip, etc. The storage may include, for example, double data rate synchronous dynamic random access memory (DDR SDRAM) and universal flash storage (UFS), etc.

[0104] The aforementioned hardware module 107a (107b) can be disposed on the first main body 10 or on the second main body 20 as needed. In some embodiments, signal quality degradation due to the signal line connecting the rear camera and the system single chip 201 passing through the hinge 30 can be avoided, and the rear camera is disposed on the second main body 20.

[0105] In some embodiments, the folding device 001 may further include a charger 205. The charger 205 is disposed on the second body 20. Both the first battery 103 and the second battery 203 are electrically connected to the charger 205. The charger 205 is electrically connected to the first battery 103 and the second battery 203 via a charging cable. Exemplarily, the second body 20 is also provided with charging terminals, which are electrically connected to the charger 205 via a charging cable. When the folding device 001 is being charged, the charging terminals are connected to a power source, and current flows through the charging terminals to the charger 205, and then through the charger 205 to charge the first battery 103 and the second battery 203.

[0106] For example, the aforementioned charging terminal may include a Universal Serial Bus (USB) interface. The USB interface may be a Mini USB interface, a Micro USB interface, a USB Type-C interface, etc. Furthermore, this application does not limit the function of the charging terminal to charging only; for example, it can also be used for data transfer between the foldable device 001 and other devices (such as mobile phones, computers, external hard drives, etc.).

[0107] In the embodiments of this application, the first battery 103 supplies power to the first power management chip 102 and the radio frequency integrated circuit 101, while the second battery 203 supplies power to the second power management chip 202 and the system-on-a-chip 201. Since the devices on the first body 10 and the devices on the second body 20 consume different amounts of power, in some usage scenarios, the capacity of the first battery 103 may be less than that of the second battery 203, or vice versa. Therefore, the charging manager 205 can control the battery with higher capacity to charge the battery with lower capacity.

[0108] In some embodiments of this application, the second body 20 may also be provided with a charging manager. For example, the charging terminals are electrically connected to the charging manager 205 provided in the first body 10 and the charging manager provided in the second body 20, respectively.

[0109] Figure 4b is a control diagram of a charging manager 205 provided in an embodiment of this application. Referring to Figure 4b, exemplarily, the charging manager 205 is used to acquire the voltage of the first battery 103 and the voltage of the second battery 203, and outputs a control command based on the difference between the voltages of the first battery 103 and the second battery 203. Specifically, the control command is used to: control the first battery 103 to charge the second battery 203 when the difference is greater than or equal to a threshold and the voltage of the first battery is greater than the voltage of the second battery. Alternatively, the control command is used to: control the second battery 203 to charge the first battery 103 when the difference is greater than or equal to the threshold and the voltage of the first battery is less than the voltage of the second battery. In this way, the charging manager 205 can control the voltage difference between the first battery 103 and the second battery 203 to be small, less than the aforementioned threshold, avoiding the problem of one battery having a low charge and the other having a high charge.

[0110] The aforementioned threshold value can be set according to requirements. Furthermore, the charging manager 205 controls the second battery 203 to charge the first battery 103 until the voltage difference between the second battery 203 and the first battery 103 is small.

[0111] For example, when the difference is greater than or equal to a first threshold, and the voltage of the first battery is greater than the voltage of the second battery, the first battery 103 is controlled to charge the second battery 203 until the difference is less than or equal to a second threshold. The second threshold is less than the first threshold. The difference between the second threshold and the first threshold can be set as needed. Similarly, when the difference is greater than or equal to the first threshold, and the voltage of the first battery is less than the voltage of the second battery, the second battery 203 is controlled to charge the first battery 103 until the difference is less than or equal to the second threshold.

[0112] It is understandable that the second power management chip 202 does not supply power to the first power management chip 102, nor does it supply power to the radio frequency integrated circuit 101. This does not restrict the second power management chip 202 from being electrically connected to the first power management chip 102, nor does it restrict the second power management chip 202 from being electrically connected to each other.

[0113] As shown in Figure 4a, in some embodiments, the RF integrated circuit 101, the first buck converter 601, the second buck converter 602, and the third buck converter 604 are all electrically connected to the second power management chip 202 via signal lines (e.g., the fifth signal line described later). The second power management chip 202 is electrically connected to the enable terminal of the RF integrated circuit 101. The aforementioned enable terminal refers to the control terminal for turning the RF integrated circuit 101 on or off.

[0114] As described above, the system-on-a-chip 201 located in the second main body 20 and the radio frequency transceiver in the radio frequency integrated circuit 101 located in the first main body 10 interact via a flexible circuit board 50 (as shown in Figure 3). It is understood that the components on the first main body 10 that need to interact with the system-on-a-chip 201 are not limited to the radio frequency integrated circuit 101. For example, some or all of the hardware modules 107a located in the first main body 10 also need to interact with the system-on-a-chip 201. Therefore, the signal lines used for the interaction between the hardware modules 107a and the system-on-a-chip 201 need to extend from the first main body 10 to the second main body 20.

[0115] Figure 5a is a simplified wiring diagram of the hardware module 107a on the folding device 001 provided in this embodiment. Referring to Figure 5a, the hardware module 107b includes an antenna chip, an SD card, a SIM card, an audio module, storage, a rear camera, and sensors. The hardware module 107b is disposed on the second main body 20. The hardware module 107a includes a front camera and a flexible display screen 40. It is understood that the distribution relationship of the hardware module 107a(b) in Figure 5a is merely an example, and this embodiment does not limit the types of hardware modules disposed on the first main body 10 and the second main body 20. For example, the antenna chip, SD card, SIM card, audio module, storage, etc., can also be disposed on the first main body 10.

[0116] In some embodiments, in order to reduce the number of signal lines used for signal interaction between hardware module 107a and system single chip 201, a first aggregation chip 108 can be provided on the first body 10. The first aggregation chip 108 is used to aggregate signals to reduce the number of signal lines used for electrical connection transmission between hardware module 107a and system single chip 201.

[0117] Exemplarily, the folding device 001 may further include a first signal line 01 and a second signal line 02. The transmission hardware module 107a is electrically connected to the first aggregation chip 108 via the first signal line 01. The system single-chip 201 is electrically connected to the first aggregation chip 108 via the second signal line 02. Exemplarily, the second signal line 02 is disposed on the flexible circuit board 50. The number of first signal lines 01 is greater than the number of second signal lines 02. Because both the transmission hardware module 107a and the first aggregation chip 108 are located on the first body 10, the first signal line 01 is also located on the first body 10. The system single-chip 201 is located on the second body 20, so the second signal line 02 extends from the first body 10 to the second body 20. Because the number of first signal lines 01 is greater than the number of second signal lines 02, reducing the number of signal lines can save space in the hinge 30 for accommodating signal lines while satisfying the signal interaction between the hardware module 107a and the system single-chip 201, thereby giving the hinge 30 higher support strength.

[0118] Figure 5b is a simplified diagram of another wiring structure for the hardware module 107a on the folding device 001 provided in this embodiment. Referring to Figure 5b, the difference between Figure 5b and Figure 5a is that in Figure 5b, the folding device 001 further includes a third signal line 03 and a second aggregation chip 109. The second aggregation chip 109 is disposed on the second main body 20. The second aggregation chip 109 is electrically connected to the first aggregation chip 108 via the second signal line 02. The second aggregation chip 109 is electrically connected to the system single chip 201 via the third signal line 03. The number of third signal lines 03 is equal to the number of first signal lines 01.

[0119] This application does not limit the type of the first aggregation chip 108. Exemplarily, the first aggregation chip 108 may be an input / output die, etc. In some embodiments, peripheral component interconnect express (PCIE) is used to communicate data and control signals of the first aggregation chip 108; PCIE is a high-speed serial bus. In some embodiments, the first aggregation chip 108 adopts a serial-to-serial bus standard.

[0120] This application embodiment does not limit the number of the first signal line 01 and the second signal line 02. The number can be set according to the signal interaction requirements between the hardware module 107a and the system single chip 201. The difference between the number of the first signal line 01 and the second signal line 02 is also not limited; the number of the first signal line 01 simply needs to be greater than the number of the second signal line 02.

[0121] As described above, the system-on-a-chip 201 and the radio frequency integrated circuit 101 communicate via the flexible circuit board 50. The signal loss across the flexible circuit board 50 can be reduced to decrease the loss in the link between the system-on-a-chip 201 and the radio frequency integrated circuit 101.

[0122] Figure 6 is a schematic diagram of the structure of the flexible circuit board 50 provided in an embodiment of this application. Referring to Figure 6, the flexible circuit board 50 has a first region 501 and a bending region 502. The first region 501 and the bending region 502 are connected. When the folding device is in a flattened state, the vertical projection of the pivot 30 (as shown in Figure 2) on the flexible circuit board 50 overlaps with the bending region 502.

[0123] The aforementioned vertical projection refers to the area enclosed by the projection of the outer contour of the rotating shaft 30 onto the plane where the flexible circuit board 50 is located, in a direction perpendicular to the flexible circuit board 50. The rest of the descriptions of vertical projection in this text follow the same logic.

[0124] In the embodiment where the flexible circuit board 50 passes through the rotating shaft 30 (as shown in Figure 5a), the bending area 502 passes through the rotating shaft 30. The thickness direction of the flexible circuit board 50 is the thickness direction of the folding device, both being the first direction (the z-direction in Figure 7a).

[0125] This application does not limit the length of the bending area 502 along the x-direction in its embodiments. In some embodiments, when the folding device 001 is in the unfolded state, the length of the bending area 502 along the x-direction is greater than or equal to the length of the rotating shaft 30 along the x-direction. In some embodiments, when the folding device 001 is in the unfolded state, the length of the bending area 502 along the x-direction may be less than the length of the rotating shaft 30 along the x-direction.

[0126] When the folding device is adjusted from a folded state to a flattened state, the bending area 502 is unfolded. The bending area 502 can compensate for the change in length of the flexible circuit board 50 during the adjustment from the folded state to the flattened state, thereby reducing the internal stress of the flexible circuit board 50.

[0127] The "bending" in bending area 502 refers to the fact that bending area 502 has a bendable property, not that bending area 502 is restricted to a bent state. For example, in Figure 6, bending area 502 has multiple folds, which can be flattened or gathered.

[0128] Figure 7a is a partial structural schematic diagram of the flexible circuit board 50 provided in an embodiment of this application. Referring to Figure 7a, the flexible circuit board 50 includes a fourth signal line 550 (as shown in Figure 8a), a shielding layer 540, a first layer structure 510, a second layer structure 520, and a third layer structure 530. The radio frequency integrated circuit 101 and the system single chip 201 are electrically connected through the fourth signal line 550.

[0129] Figure 7b is an exploded view of the flexible circuit board 50 provided in an embodiment of this application. Referring to Figure 7b, the shielding layer 540, the first layer structure 510, the second layer structure 520, and the third layer structure 530 are stacked along the z-direction. The shielding layer 540 is attached to the first layer structure 510, and the shielding layer 540 is located in the bending region 502.

[0130] In the bending area 502 of the flexible circuit board 50, there is a first gap 51 between the first layer structure 510 and the second layer structure 520, and a second gap 52 between the second layer structure 520 and the third layer structure 530. Because the first layer structure 510, the second layer structure 520, and the third layer structure 530 are stacked along the z-direction, and the distances between the first layer structure 510, the second layer structure 520, and the third layer structure 530 and the rotating shaft 30 are different, the arc lengths of the first layer structure 510, the second layer structure 520, and the third layer structure 530 on the bending area 502 are different during the folding process of the folding device. There is a tendency for relative movement between adjacent layers of the first layer structure 510, the second layer structure 520, and the third layer structure 530. The first gap 51 and the second gap 52 can release this tendency for relative movement, making the bending of the first layer structure 510, the second layer structure 520, and the third layer structure 530 smoother, while releasing internal stress to prevent the layer structure from being torn.

[0131] Furthermore, when the folding device is adjusted from a folded state to a flattened state, the first zone 501 does not move or moves only a small distance. Within the first zone 501, the first layer structure 510, the second layer structure 520, and the third layer structure 530 do not move relative to each other or move only a small distance relative to each other.

[0132] In embodiments of this application, the length of the first gap 51 along the x-direction is greater than or equal to the length of the bending region 502 along the x-direction; in other words, a portion of the first gap 51 may be located within the first region 501. In some embodiments, the length of the first gap 51 along the x-direction is greater than or equal to the length of the bending region 502 along the x-direction. The dimensions of the second gap 52 are similar.

[0133] Figure 8a is a cross-sectional schematic diagram of a flexible circuit board 50 provided in an embodiment of this application. Referring to Figure 8a, the first layer structure 510 includes a first cover layer 511, a first conductive layer 512, and a first protective layer 513 sequentially stacked along the z-direction. A shielding layer 540 is attached to the first cover layer 511, and the first cover layer 511 is located between the shielding layer 540 and the first conductive layer 512. The second layer structure 520 includes a second cover layer 521, a second conductive layer 522, and a second protective layer 523 sequentially stacked along the z-direction. The second cover layer 521 is located between the first protective layer 513 and the second conductive layer 522. A first gap 51 is located between the second cover layer 521 and the first protective layer 513. The third layer structure 530 includes a third cover layer 531, a third conductive layer 532, and a third protective layer 533 sequentially stacked along the z-direction. The third cover layer 531 is located between the second protective layer 523 and the third conductive layer 532. The second gap 52 is located between the third covering layer 531 and the second protective layer 523.

[0134] Figure 8b is an exploded view of a first conductive layer 512, a second conductive layer 522, and a third conductive layer 532 provided in an embodiment of this application. Referring to Figure 8b, the fourth signal line 550 includes a first conductive segment 551 and a second conductive segment 552 that are electrically connected. The first conductive segment 551 is located in the first region 501, and the second conductive segment 552 is located in the bending region 502. The first conductive segment 551 is formed in the second layer structure 520, and the second conductive segment 552 is formed in the first layer structure 510.

[0135] Please refer back to Figure 8a. The vertical projection of the shielding layer 540 on the first conductive layer 512 overlaps with the second conductive segment 552.

[0136] During the folding process of the folding device, the relative movement of the first layer structure 510, the second layer structure 520, and the third layer structure 530 located in the first region 501 is small or almost non-existent. Because the first conductive segment 551 is located in the first region 501, the distance along the z-direction between the first conductive segment 551 and the first conductive layer 512 remains almost constant. Similarly, the distance along the z-direction between the first conductive segment 551 and the third conductive layer 532 remains almost constant. The first conductive segment 551 experiences almost no signal loss due to its movement relative to the first conductive layer 512 and the third conductive layer 532, resulting in minimal signal loss within the first conductive segment 551.

[0137] As described above, the first layer structure 510, the second layer structure 520, and the third layer structure 530 located in the bending area 502 will undergo relative movement. During the folding process of the folding device, the distance between the first conductive layer 512 and the second conductive layer 522, and the distance between the third conductive layer 532 and the second conductive layer 522, will continuously change. If the second conductive segment 552 is also formed on the second conductive layer 522, the aforementioned distance changes will lead to significant signal loss on the second conductive segment 552. In the embodiments of this application, the second conductive segment 552 is formed on the first conductive layer 512, which can effectively improve the signal loss on the second conductive segment 552 caused by the aforementioned distance changes. In addition, the shielding layer 540 is attached to the first covering layer 511, and the distance between the shielding layer 540 and the second conductive segment 552 remains almost unchanged. The vertical projection of the shielding layer 540 on the first conductive layer 512 overlaps with the second conductive segment 552. The shielding layer 540 has the function of preventing interference to the signal of the second conductive segment 552, and has little impact on the signal loss on the second conductive segment 552.

[0138] Exemplarily, the fourth signal line 550 is used to transmit high-speed radio frequency signals between the radio frequency integrated circuit 101 and the system single chip 201. The fourth signal line 550 can be regarded as a high-speed radio frequency signal line connecting the radio frequency integrated circuit 101 and the system single chip 201. Connectors (e.g., BTB as described below) are provided at both ends of the high-speed radio frequency signal line. The aforementioned high-speed radio frequency signal may include a serializer signal and a deserializer signal. Exemplarily, the operating frequency of the aforementioned high-speed radio frequency signal may be in the range of 1 GHz (gigahertz) to 5.5 GHz. In some embodiments, the fourth signal line 550 is a differential signal line.

[0139] The aforementioned shielding layer 540's vertical projection onto the first conductive layer 512 overlaps with the second conductive segment 552, meaning that the vertical projection of the shielding layer 540 onto the first conductive layer 512 covers a portion of the second conductive segment 552. Alternatively, the vertical projection of the shielding layer 540 onto the first conductive layer 512 covers the entire second conductive segment 552. Thus, the shielding layer 540 provides good shielding performance for the second conductive segment 552, reducing the impact of other wiring on the signal of the second conductive segment 552, and also reducing the impact of the second conductive segment 552 on other wiring. In some embodiments, the shielding layer 540 covers the entire bending region 502.

[0140] In some embodiments, the vertical projection of the shielding layer 540 onto the first conductive layer 512 does not completely cover the first region 501, because the first conductive layer 512 and the third conductive layer 532 in the first region 501 have a shielding effect. The shielding layer 540 not completely covering the first region 501 results in a smaller thickness of the first region 501, which is beneficial for the flexibility of the flexible circuit board 50. For example, the vertical projection of the shielding layer 540 onto the first conductive layer 512 may be located outside the first region 501.

[0141] It is understood that, in the embodiments of this application, the flexible circuit board 50 is not limited to a three-layer structure. For example, the flexible circuit board 50 may also include a fourth layer structure, a fifth layer structure, etc. The fourth layer structure, the fifth layer structure, etc., are located on the side of the third layer structure 530 opposite to the second layer structure 520.

[0142] This application does not limit the structure of the shielding layer 540. Exemplarily, the shielding layer 540 is an electromagnetic interference (EMI) shielding film. The shielding layer 540 may include a conductive film; in some embodiments, the shielding layer 540 may further include a polymer film covering the surface of the conductive film. In some embodiments, the polymer film of the shielding layer 540 and the first cover layer 511 may be made of the same material, i.e., the polymer film of the shielding layer 540 and the first cover layer 511 may be shared, or the polymer film of the shielding layer 540 and the first cover layer 511 may be considered as a single film layer. Exemplarily, the shielding layer 540 and the first cover layer 511 may be connected by an adhesive layer.

[0143] Exemplarily, the first conductive segment 551 and the second conductive segment 552 are electrically connected through a conductive via 504. The conductive via 504 penetrates the first protective layer and the second cover layer. In some embodiments, the conductive via 504 is located in the first region 501. Since the first region 501 hardly bends during the folding process of the folding device, the conductive via 504 also hardly deforms, resulting in good connection performance between the first conductive segment 551 and the second conductive segment 552. In some embodiments, the conductive via 504 may also be located in the bending region 502.

[0144] This application does not limit the materials of the first conductive layer 512, the second conductive layer 522, and the third conductive layer 532. Exemplarily, the material of the first conductive layer 512 may include at least one of copper and its alloys, aluminum and its alloys, titanium and its alloys, carbon fiber, or graphene. For example, the material of the first conductive layer 512 may be rolled copper foil or electrodeposited copper foil. The same applies to the second conductive layer 522 and the third conductive layer 532.

[0145] The first cover layer 511 can prevent the first conductive layer 512 from being oxidized. The same applies to the second cover layer 521 and the third cover layer 531. This application embodiment does not limit the materials of the first cover layer 511, the second cover layer 521, and the third cover layer 531. Exemplarily, the material of the first cover layer 511 may include at least one of polyimide (PI) or polyester (PET). The same applies to the second cover layer 521 and the third cover layer 531.

[0146] The first protective layer 513 can support the first conductive layer 512 while preventing the first conductive layer 512 from being exposed on the surface, and the same applies to the second protective layer 523 and the third protective layer 533. This application embodiment does not limit the materials of the first protective layer 513, the second protective layer 523, and the third protective layer 533. For example, the material of the first protective layer 513 may include at least one of polyimide (PI), polyester (PET), or polytetrafluoroethylene (PTFE). The same applies to the second protective layer 523 and the third protective layer 533.

[0147] For example, the conductors in the shielding layer 540, the second conductive layer 522, the first conductive layer 512, and the third conductive layer 532 that are not electrically connected to the fourth signal line 550 are all electrically connected to the floor of the folding device. For example, the third conductive layer 532 and the shielding layer 540 are both electrically connected to the floor.

[0148] The aforementioned "ground" can refer to at least a portion of any grounding layer, grounding plate, or grounding metal layer within the folding device 001, or at least a portion of any combination of the aforementioned grounding layers, grounding plates, or grounding components. "Ground" can be used for grounding components within electronic devices. Examples include the grounding layer of the first printed circuit board 140 or the second printed circuit board 240, the grounding metal layer formed by the metal film on the backlight side of the flexible display screen, the conductive grounding layer of the battery, and conductive or metallic components electrically connected to the aforementioned grounding layer / grounding plate / metal layer.

[0149] In some embodiments of this application, as shown in FIG8a, the flexible circuit board 50 may further include a first adhesive layer 561 and a second adhesive layer 562; both the first adhesive layer 561 and the second adhesive layer 562 are located in the first region 501, with the first adhesive layer 561 located between the first protective layer 513 and the second cover layer 521; the first protective layer 513 and the second cover layer 521 are connected by the first adhesive layer 561, which can prevent relative movement between the first protective layer 513 and the second cover layer 521 located in the first region 501. The second adhesive layer 562 is located between the second protective layer 523 and the third cover layer 531. Similarly, the second protective layer 523 and the third cover layer 531 are connected by the second adhesive layer 562, which can prevent relative movement between the second protective layer 523 and the third cover layer 531 located in the first region 501.

[0150] In some embodiments of this application, the flexible circuit board 50 may also have a second region 503, with the first region 501, the bending region 502, and the second region 503 connected in sequence.

[0151] Figure 8c is a cross-sectional view of another flexible circuit board 50 provided in an embodiment of this application. Referring to Figure 8c, the fourth signal line 550 may further include a third conductive segment 553, which is located in the second region 503 and electrically connected to the second conductive segment 552. The third conductive segment 553 is formed in the second conductive layer 522. In other words, the third conductive segment 553 is formed in the second conductive layer 522 of the second region 503.

[0152] Similar to the first conductive segment 551 mentioned above, during the folding process of the folding device, along the z-direction, the distance between the third conductive segment 553 and the first conductive layer 512 does not change or changes only slightly, and the distance between the third conductive segment 553 and the third conductive layer 532 does not change or changes only slightly. Therefore, signal loss is minimal within the third conductive segment 553 formed in the second region 503.

[0153] For the description of the third conductive segment 553 and the second region 503, please refer to the description of the first conductive segment 551 and the first region 501 mentioned above, which will not be repeated here.

[0154] Furthermore, shortening the distance of the fourth signal line 550 can also reduce the loss of high-speed radio frequency signals transmitted within the fourth signal line 550. For example, making the extension direction of the fourth signal line 550 a straight line can shorten the distance of the fourth signal line 550. For example, the vertical projection of the fourth signal line 550 on the second conductive layer 522 is a straight line. This straight line is perpendicular to the y-direction. In addition, shortening the distance of the fourth signal line 550 can be achieved by adjusting the placement of the system single chip 201 and the radio frequency integrated circuit 101. For example, making the distance between the system single chip 201 and the radio frequency integrated circuit 101 along the y-direction closer, and adjusting the distance between the system single chip 201 and the radio frequency integrated circuit 101 and the bending region 502 closer, can shorten the distance of the fourth signal line 550, thereby reducing the loss of high-speed radio frequency signals transmitted within the fourth signal line 550.

[0155] The signals transmitted between the system-on-a-chip 201 and the radio frequency integrated circuit 101 are not limited to the aforementioned high-speed radio frequency signals. In some embodiments, the signals transmitted between the system-on-a-chip 201 and the radio frequency integrated circuit 101 also include clock signals. The system-on-a-chip 201 and the radio frequency integrated circuit 101 transmit the clock signal via a clock signal line. Because the clock signal requires high precision, the isolation requirement of the clock signal line is correspondingly increased.

[0156] In Figure 8b, the flexible circuit board 50 also includes a clock signal line 554, which is electrically isolated from the fourth signal line 550. The clock signal line 554 is formed in the second conductive layer 522. The vertical projection of the fourth signal line 550 onto the second conductive layer 522 does not overlap with the clock signal line 554. Therefore, the fourth signal line 550 and the clock signal line 554 do not overlap in the thickness direction (i.e., the z-direction) of the flexible circuit board 50, which effectively reduces interference between the fourth signal line 550 and the clock signal line 554, increases the isolation of the clock signal line 554, and makes the clock signal transmitted within the clock signal line 554 more accurate.

[0157] The aforementioned electrical isolation between clock signal line 554 and fourth signal line 550 means that clock signal line 554 and fourth signal line 550 are not directly electrically connected, nor are they electrically connected through other conductors (such as wires). The same applies to the other descriptions of electrical isolation in the text.

[0158] For example, the signal transmitted within the aforementioned clock signal line 554 can be a radio frequency integrated circuit clock signal.

[0159] In some embodiments, the distance between the fourth signal line 550 and the clock signal line 554 is greater than or equal to 0.4 mm. This greater distance reduces interference between the two lines, improving the isolation of the clock signal line 554. Exemplarily, the distance between the fourth signal line 550 and the clock signal line 554 can be, for example, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2.5 mm, 3 mm, 3.5 mm, or 4 mm. Exemplarily, the clock signal line 554 is located at the edge of the flexible circuit board 50. Compared to the remaining wiring on the flexible circuit board 50, the distance between the clock signal line 554 and the edge of the flexible circuit board 50 is minimal.

[0160] In embodiments of this application, the flexible circuit board 50 is not limited to providing the aforementioned fourth signal line 550 and clock signal line 554. For example, the aforementioned second signal line 02 can also be provided on the flexible circuit board 50. Exemplarily, the aforementioned second signal line 02 is formed in the second conductive layer 522. The second signal line 02, the fourth signal line 550, and the clock signal line 554 are electrically isolated from each other. For example, the fourth signal line 550 is located between the clock signal line 554 and the second signal line 02. The second signal line 02 is farther away from the clock signal line 554 than the fourth signal line 550, and the second signal line 02 causes less interference to the signal within the clock signal line 554.

[0161] In some embodiments, an isolation conductive structure 555 is further provided between the clock signal line 554 and the second signal line 02. This isolation conductive structure 555 is formed in the second conductive layer 522, located on one side of the clock signal line 554, and between the fourth signal line 550 and the second signal line 02. The isolation conductive structure 555 is electrically connected to the ground plane. The electrical isolation effect of the isolation conductive structure 555 can improve the isolation between the fourth signal line 550 and the second signal line 02, preventing mutual interference between their signals. Exemplarily, the isolation conductive structure 555 can be a conductive plate or a conductive wire, which is electrically connected to the ground plane.

[0162] In the embodiments of this application, in addition to the aforementioned fourth signal line 550, second signal line 02, and clock signal line 554, the flexible circuit board 50 may also be provided with other signal lines, such as a fifth signal line 556. The fifth signal line 556 is formed in the second conductive layer 522. The fifth signal line 556 can be a signal line of the flexible display screen 40, or a signal line electrically connecting the second power management chip 202, the radio frequency integrated circuit 101, the first step-down device 601, the second step-down device 602, and the third step-down device 604.

[0163] It is understood that, in the embodiments of this application, the arrangement of other signal lines on the flexible circuit board 50 can also adopt the arrangement of the fourth signal line 550. For example, if other signal lines require reduced loss, some conductive segments can be formed in the second conductive layer 522 of the first region 501, and some conductive segments can be formed in the first conductive layer 512 of the bending region 502. In other words, the embodiments of this application do not limit the fourth signal line 550, used for transmitting high-speed radio frequency signals, to being partially formed in the second conductive layer 522 of the first region 501 and partially formed in the first conductive layer 512 of the bending region 502. The arrangement of other signal lines can also be the same as that of the fourth signal line 550.

[0164] As described above, the radio frequency integrated circuit 101 is disposed on the first printed circuit board 140, and the radio frequency integrated circuit 101 is electrically connected to the fourth signal line 550 formed on the flexible circuit board 50. In some embodiments, the flexible circuit board 50 and the first printed circuit board 140 are electrically connected via a first electrical connector 70a (as shown in FIG. 3) and a second electrical connector 70b. For example, both the first electrical connector 70a and the second electrical connector 70b include board-to-board connectors (BTB).

[0165] For example, the first electrical connector 70a is used for transmitting radio frequency signals, such as the fourth signal line 550 and the clock signal line 554 mentioned above being electrically connected to the first electrical connector 70a. The second electrical connector 70b is used for transmitting non-radio frequency signals, such as the second signal line 02 and the fifth signal line 556 mentioned above being electrically connected to the second electrical connector 70b.

[0166] Figure 9 is a schematic diagram of the structure of a first electrical connector 70a provided in an embodiment of this application. Referring to Figure 9, the first electrical connector 70a may include a male connector 71 and a female connector 72, which can be engaged with each other. In some embodiments, the male connector 71 is disposed on the flexible circuit board 50, and the female connector 72 is disposed on the first printed circuit board 140. In other embodiments, the male connector 71 is disposed on the first printed circuit board 140, and the female connector 72 is disposed on the flexible circuit board 50. When the male connector 71 and the female connector 72 are engaged together, circuit communication between the first printed circuit board 140 and the flexible circuit board 50 can be achieved.

[0167] The present application does not limit the connection method between the male connector 71 or the female connector 72 and the flexible circuit board 50, for example, it can be soldering. Similarly, the connection method between the male connector 71 or the female connector 72 and the first printed circuit board 140 is not limited, for example, it can be soldering.

[0168] In some embodiments, the first electrical connector 70a may further include a first shield 73 and a second shield 74. The first shield 73 is connected to the male connector 71 and disposed on the outer periphery of the male connector 71. The second shield 74 is connected to the female connector 72 and disposed on the outer periphery of the female connector 72. When the male connector 71 and the female connector 72 are engaged, the first shield 73 and the second shield 74 are also engaged, for example, the first shield 73 extends into the second shield 74, or the second shield 74 extends into the first shield 73. The engagement of the first shield 73 and the second shield 74 can improve the isolation of the first electrical connector 70a. At operating frequencies of 0 GHz to 8 GHz, the external isolation of the first electrical connector 70a can reach less than or equal to -50 dB.

[0169] The embodiments of this application do not limit the structure of the first shielding cover 73 and the second shielding cover 74. For example, both the first shielding cover 73 and the second shielding cover 74 can be annular structures. Similarly, the structure of the electrical connector connecting the second printed circuit board 240 and the flexible circuit board 50 can also adopt the first electrical connector 70a shown in FIG9.

[0170] It is understood that in some embodiments of this application, the first shield 73 and the second shield 74 on the first electrical connector 70a are not necessary and may not be provided.

[0171] The structure of the second electrical connector 70a can be referred to the description of the first electrical connector 70a above. In some embodiments, the second electrical connector 70a is used to transmit non-radio frequency signals. If the isolation requirements of the aforementioned non-radio frequency signals are not high, the second electrical connector 70a may not be provided with the aforementioned first shield 73 and second shield 74.

[0172] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A folding device, characterized in that, The folding device includes: A first main body, a rotating shaft, and a second main body; when the folding device is in a flattened state, the first main body, the rotating shaft, and the second main body are arranged in sequence. A radio frequency integrated circuit is used to perform radio frequency processing on the data transmitted by the system single chip to generate a radio frequency signal; it is disposed in the first main body; The system single chip is used to receive and transmit data with the radio frequency integrated circuit; it is disposed in the second main body; A flexible circuit board, through which the radio frequency integrated circuit and the system single chip are electrically connected; A first battery is disposed on the first main body; A second battery is disposed in the second main body; A first power management chip is disposed in the first main body and electrically connected to the first battery, and is used to supply power to the radio frequency integrated circuit. The second power management chip is disposed in the second main body and electrically connected to the second battery. It is used to supply power to the system single chip, but does not supply power to the first power management chip.

2. The folding device according to claim 1, characterized in that, The second power management chip does not supply power to the radio frequency integrated circuit.

3. The folding device according to claim 1 or 2, characterized in that, The first battery is used to output power voltage, and the first battery is used to provide the power voltage to the first power management chip; The folding device also includes: A voltage adjustment circuit is disposed in the first main body and electrically connected to the first battery, for reducing the power supply voltage and supplying the reduced voltage to the first power management chip and the radio frequency integrated circuit.

4. The folding device according to claim 3, characterized in that, The voltage adjustment circuit includes: A first step-down device is disposed on the first main body; it is electrically connected to the first battery and is used to reduce the power supply voltage to a first voltage and to provide the first voltage to the first power management chip. A second step-down device is disposed on the first main body; it is electrically connected to the first battery and is used to reduce the power supply voltage to a second voltage and to provide the second voltage to the first power management chip. A first voltage regulator is disposed on the first main body; it is electrically connected to the first buck regulator and is used to reduce the first voltage to a third voltage and to provide the third voltage to the first power management chip and the radio frequency integrated circuit.

5. The folding device according to claim 4, characterized in that, The folding device further includes: a radio frequency switch disposed on the first main body; The voltage adjustment circuit further includes a third step-down device and a second voltage regulator. The third step-down device is disposed in the first main body and electrically connected to the first battery. It is used to reduce the power supply voltage to a fourth voltage and to provide the fourth voltage to the second voltage regulator. The second voltage regulator is disposed on the first body and electrically connected to the third buck device, and is used to reduce the fourth voltage to the fifth voltage and to provide the fifth voltage to the radio frequency switch.

6. The folding device according to claim 5, characterized in that, The folding device further includes: a radio frequency power amplifier disposed on the first main body; the third step-down device and the first battery are both electrically connected to the radio frequency power amplifier, the third step-down device is also used to provide the fourth voltage to the radio frequency power amplifier; the first battery is also used to provide the power supply voltage to the radio frequency power amplifier.

7. The folding device according to any one of claims 1-6, characterized in that, The folding device also includes: A charging manager is located in the second main body; both the first battery and the second battery are electrically connected to the charging manager. The charging manager is used to obtain the voltage of the first battery and the voltage of the second battery; Output control commands based on the difference between the voltage of the first battery and the voltage of the second battery; The control command is used to: when the difference is greater than or equal to a threshold and the voltage of the first battery is greater than the voltage of the second battery, control the first battery to charge the second battery; Alternatively, the control command is used to: control the second battery to charge the first battery when the difference is greater than or equal to a threshold and the voltage of the first battery is less than the voltage of the second battery.

8. The folding device according to any one of claims 1-7, characterized in that, The folding device also includes: The hardware module is located in the first main body; A first polymer chip is disposed on the first main body; The hardware module is electrically connected to the first aggregation chip via the first signal line. The second signal line is used to electrically connect the system single chip to the first aggregation chip. The number of the first signal lines is greater than the number of the second signal lines.

9. The folding device according to claim 8, characterized in that, The folding device further includes: a second aggregation chip and a third signal line; the second aggregation chip is disposed on the second main body; the second aggregation chip is electrically connected to the first aggregation chip through the second signal line; the second aggregation chip is electrically connected to the system single chip through the third signal line. The number of the third signal lines is equal to the number of the first signal lines.

10. The folding device according to any one of claims 1-9, characterized in that, The flexible circuit board has a first area and a bending area. When the folding device is in a flattened state, the vertical projection of the rotating shaft on the flexible circuit board overlaps with the bending area. The flexible circuit board includes: a shielding layer, a first layer structure, a second layer structure, and a third layer structure stacked sequentially along the thickness direction of the flexible circuit board; in the bending region, there is a first gap between the first layer structure and the second layer structure, and a second gap between the second layer structure and the third layer structure; The flexible circuit board further includes: a fourth signal line for connecting the radio frequency integrated circuit and the system single chip; the fourth signal line includes a first conductive segment and a second conductive segment electrically connected, the first conductive segment being located in the first region and formed in the second layer structure, the second conductive segment being located in the bending region and formed in the first layer structure; the vertical projection of the shielding layer on the first layer structure overlaps with the second conductive segment.

11. The folding device according to claim 10, characterized in that, The fourth signal line further includes a conductive via, which penetrates the first layer and the second layer along the thickness direction of the flexible circuit board; the first conductive segment and the second conductive segment are electrically connected through the conductive via.

12. The folding device according to claim 10 or 11, characterized in that, The flexible circuit board further includes a first adhesive layer and a second adhesive layer; the first adhesive layer and the second adhesive layer are located in the first region, the first adhesive layer is located between the first layer structure and the second layer structure; the second adhesive layer is located between the second layer structure and the third layer structure.

13. The folding device according to any one of claims 10-12, characterized in that, The vertical projection of the shielding layer onto the first layer structure covers the second conductive segment.

14. The folding device according to any one of claims 10-13, characterized in that, The flexible circuit board also has a second region, and the first region, the bending region and the second region are connected in sequence. The fourth signal line further includes a third conductive segment, which is located in the second region and electrically connected to the second conductive segment, and the third conductive segment is formed in the second layer structure.

15. The folding device according to claim 14, characterized in that, The flexible circuit board also includes a clock signal line, which is formed on the second layer structure. The clock signal line and the fourth signal line are electrically isolated. The vertical projection of the fourth signal line on the second layer structure does not overlap with the clock signal line.

16. The folding device according to claim 15, characterized in that, The distance between the clock signal line and the fourth signal line is greater than or equal to 0.4 mm.

17. The folding device according to any one of claims 1-16, characterized in that, The folding device further includes a cellular antenna and a short-range antenna, wherein the cellular antenna is disposed on the first main body and electrically connected to the radio frequency integrated circuit; and the short-range antenna is disposed on the second main body and electrically connected to the system single chip.

18. A flexible circuit board, characterized in that, The flexible circuit board has a first region and a bending region; the flexible circuit board includes: First layer structure; The second layer structure is stacked on top of the first layer structure; in the bending area, there is a first gap between the first layer structure and the second layer structure. A third layer structure, wherein the second layer structure is located between the third layer structure and the first layer structure; a second gap is present between the second layer structure and the third layer structure in the bending region; and The signal line includes a first conductive segment and a second conductive segment that are electrically connected. The first conductive segment is located in the first region and formed in the second layer structure, and the second conductive segment is located in the bending region and formed in the first layer structure. A shielding layer, wherein the first layer structure is located between the second layer structure and the shielding layer, and the vertical projection of the shielding layer on the first layer structure overlaps with the second conductive segment.

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