Electronic device

Abstract

Provided in the present application is an electronic device, comprising a display screen, a middle frame, a battery and an adhesive layer structure, wherein the display screen and the battery are arranged on two opposite sides of the middle frame. The adhesive layer structure comprises a pressure-sensitive adhesive layer, a substrate layer, an electrically conductive metal layer and an electrically induced adhesion-reducing adhesive layer, which are stacked in sequence. The middle frame comprises a metal portion, and the adhesive layer structure is arranged between the middle frame and the battery, with one side of the pressure-sensitive adhesive layer being bonded to the battery, and one side of the electrically induced adhesion-reducing adhesive layer being bonded to the metal portion of the middle frame; and / or the adhesive layer structure is arranged between the middle frame and the display screen; alternatively, the middle frame is a plastic middle frame, and the adhesive layer structure is arranged between the middle frame and the display screen, with one side of the electrically induced adhesion-reducing adhesive layer being bonded to the display screen, and one side of the pressure-sensitive adhesive layer being bonded to the middle frame. In the electronic device, by means of using a special adhesive layer structure to bond and fix the battery or the display screen, the battery and the display screen can be easily detached from the electronic device, thereby avoiding damage to the battery and the display screen due to direct detaching by pulling.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 31, 2024, with application number 202420247328.2 and application name “Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of electronic technology, and in particular to an electronic device. Background Art

[0003] At present, in electronic devices such as mobile phones and tablets, the conventional adhesive used to bond the screen and the middle frame, as well as the battery and the middle frame, has strong adhesion. Direct pulling and disassembly can easily damage the copper foil on the side of the screen installation surface, or easily cause deformation and damage to the battery, thereby causing safety problems.

[0004] Summary of the Invention

[0005] In view of this, an embodiment of the present application provides an electronic device that uses a special adhesive layer structure to install and remove a battery or display screen, so that the battery and display screen can be easily removed from the electronic device, avoiding damage to the battery and display screen caused by direct pulling and removal.

[0006] According to a first aspect of an embodiment of the present application, an electronic device is provided, comprising a display screen, a middle frame, a battery, and a glue layer structure, wherein the display screen and the battery are respectively disposed on opposite sides of the middle frame, and a copper foil is disposed on a surface of the display screen on a side adjacent to the middle frame; the glue layer structure comprises a pressure-sensitive adhesive layer, a substrate layer, a conductive metal layer, and an electrolytic adhesive layer stacked in sequence;

[0007] The middle frame includes a metal portion, the adhesive layer structure is disposed between the middle frame and the battery, and one side of the pressure-sensitive adhesive layer of the adhesive layer structure is bonded to the battery, and one side of the electrolytic viscosity-reducing adhesive layer is bonded to the metal portion of the middle frame; and / or the adhesive layer structure is disposed between the middle frame and the display screen;

[0008] Alternatively, the middle frame is a plastic middle frame, the adhesive layer structure is arranged between the middle frame and the display screen, and one side of the electrolytic adhesive layer of the adhesive layer structure is bonded to the display screen, and one side of the pressure-sensitive adhesive layer is bonded to the middle frame.

[0009] The electronic device provided in the embodiment of the present application adopts a special adhesive layer structure for installing a battery or display screen. When the battery and the display screen need to be removed from the electronic device, the battery and the display screen can be conveniently removed from the electronic device by simply energizing the electro-viscosity-reducing adhesive layer, which reduces or loses its viscosity after energization. This achieves non-destructive disassembly, avoids damage to the battery and the display screen caused by direct pulling and disassembly, and effectively avoids residual adhesive layer.

[0010] In the embodiment of the present application, the middle frame includes a metal portion, and the adhesive layer structure is provided between the middle frame and the display screen. Specifically,

[0011] One side of the pressure-sensitive adhesive layer of the adhesive layer structure is bonded to the display screen, and one side of the electrolytic viscosity-reducing adhesive layer is bonded to the metal part of the middle frame; or one side of the electrolytic viscosity-reducing adhesive layer of the adhesive layer structure is bonded to the display screen, and one side of the pressure-sensitive adhesive layer is bonded to the middle frame.

[0012] In the embodiment of the present application, the electrically-induced viscosity-reducing adhesive layer is an adhesive layer whose viscosity is reduced or loses after being energized.

[0013] In the embodiment of the present application, the thickness of the electrically-induced viscosity-reducing adhesive layer is 50 μm-100 μm.

[0014] In the embodiment of the present application, the difference in viscosity of the electrically induced viscosity reducing layer before and after power is applied is greater than or equal to 70%.

[0015] In the embodiment of the present application, the conductive metal layer is selected from an aluminum layer, an iron layer, a chromium layer, a zinc layer, a copper layer, a silver layer, a tin layer or a nickel layer.

[0016] In the embodiment of the present application, the thickness of the conductive metal layer is 50nm-100nm.

[0017] In the embodiment of the present application, the substrate layer is a polymer material layer, and the thickness of the substrate layer is 10 μm-50 μm.

[0018] In the embodiment of the present application, the pressure-sensitive adhesive layer is selected from an acrylic pressure-sensitive adhesive layer, a rubber pressure-sensitive adhesive layer, a polyurethane pressure-sensitive adhesive layer or a thermoplastic elastomer pressure-sensitive adhesive layer.

[0019] In the embodiment of the present application, the thickness of the pressure-sensitive adhesive layer is 50 μm-100 μm.

[0020] In the embodiment of the present application, at least part of the portion where the middle frame and the electrically-induced viscosity-reducing adhesive layer are bonded is the metal portion.

[0021] In the embodiment of the present application, at the outer edge of the glue layer structure, the conductive metal layer is partially exposed to form a tab.

[0022] In some embodiments of the present application, the middle frame includes a metal portion, and the electronic device is further provided with a first external port and / or a second external port;

[0023] The positive terminal of the first external port is electrically connected to the conductive metal layer in the adhesive layer structure bonded to the battery, and the negative terminal of the first external port is electrically connected to the metal portion of the middle frame. The first external port is used to connect to an external power source.

[0024] The positive terminal of the second external port is electrically connected to the conductive metal layer in the glue layer structure bonded to the display screen, and the negative terminal of the second external port is electrically connected to the metal portion of the middle frame or the copper foil on one surface of the display screen. The second external port is used to connect to an external power source.

[0025] The external power source is used to energize the electrically induced viscosity-reducing adhesive layer in the adhesive layer structure bonded to the battery, and the viscosity is reduced or lost after the power is energized.

[0026] In some other embodiments of the present application, the middle frame is a plastic middle frame, and the electronic device is further provided with a second external port, wherein a positive terminal of the second external port is electrically connected to a conductive metal layer in a glue layer structure bonded to the display screen, and a negative terminal of the second external port is electrically connected to the copper foil on a side surface of the display screen, and the second port is used to connect to an external power source;

[0027] The external power source is used to energize the electrically induced viscosity-reducing adhesive layer in the adhesive layer structure bonded to the display screen, and the adhesiveness is reduced or lost after being energized.

[0028] In some other embodiments of the present application, the electronic device further includes a mainboard, and the middle frame includes a metal portion;

[0029] The metal portion of the middle frame and the conductive metal layer in the adhesive layer structure bonded to the battery are electrically connected to the mainboard, and the mainboard is used to control the electrically induced viscosity-reducing adhesive layer in the adhesive layer structure bonded to the battery to be energized so that the viscosity is reduced or lost after the energization;

[0030] And / or, the metal portion of the middle frame or the copper foil on one side surface of the display screen, and the conductive metal layer in the glue layer structure bonded to the display screen are electrically connected to the mainboard, and the mainboard is used to control the electrically induced viscosity-reducing glue layer in the glue layer structure bonded to the display screen to be energized and reduce or lose viscosity after energization.

[0031] In an embodiment of the present application, the electronic device further includes a cover plate provided on a side of the display screen away from the middle frame, and a back cover provided on a side of the battery away from the middle frame, and the middle frame is fixedly connected between the cover plate and the back cover.

[0032] The electronic device provided in the embodiment of the present application can realize easy installation and removal of the display screen and battery, and is simple and practical to operate, thereby facilitating the user to remove and replace the display screen and battery by themselves, better meeting user needs, and can be widely used in various electronic devices that require installation and removal of display screens and batteries. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a schematic cross-sectional view of an electronic device 10 according to an embodiment of the present application;

[0034] FIG2 is a schematic cross-sectional view of an electronic device 10 according to another embodiment of the present application;

[0035] FIG3 is a schematic cross-sectional view of an electronic device 10 provided in another embodiment of the present application;

[0036] FIG4 is a schematic structural diagram of the adhesive layer structure 100 in an embodiment of the present application;

[0037] FIG5 is a schematic diagram of the electrically induced viscosity-reducing adhesive layer 104 in FIG4 being electrically reduced in viscosity;

[0038] FIG6 is a schematic diagram of the specific structure of FIG1;

[0039] FIG7 is a schematic diagram of the electrically induced viscosity-reducing adhesive layer 104 in FIG6 being electrically reduced;

[0040] FIG8 is a schematic diagram of the specific structure of FIG2;

[0041] FIG9 is a schematic diagram of the electrically induced viscosity-reducing adhesive layer 104 in FIG8 being electrically reduced;

[0042] FIG10 is a schematic diagram of the specific structure of FIG2;

[0043] FIG11 is a schematic diagram of the electrically induced viscosity-reducing adhesive layer 104 in FIG8 being electrically de-viscous;

[0044] 12 and 13 are schematic diagrams of the specific structure of FIG. 3 ;

[0045] FIG14 is a schematic diagram of the bonding between the battery 13 and the middle frame 12;

[0046] FIG15 is a schematic diagram of bonding the display screen 11 and the middle frame 12;

[0047] FIG16 is a schematic diagram showing the arrangement of the first external port 111 in the electronic device 10 according to an embodiment of the present application;

[0048] FIG17 is a schematic diagram illustrating the configuration of the second external port 112 in the electronic device 10 according to an embodiment of the present application;

[0049] FIG18 is a schematic diagram showing the connection between the metal portion and the conductive metal layer 102 and the mainboard;

[0050] FIG19 is a schematic diagram showing the connection between the metal portion or the copper foil on one surface of the display screen 11 and the conductive metal layer 102 and the mainboard. DETAILED DESCRIPTION

[0051] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0052] Referring to Figures 1, 2, and 3, which are schematic cross-sectional views of an electronic device 10 according to an embodiment of the present application, the electronic device 10 includes a display screen 11, a midframe 12, a battery 13, and a glue layer structure 100. The display screen 11 and the battery 13 are disposed on opposite sides of the midframe 12, respectively. A copper foil is disposed on the surface of the display screen 11 adjacent to the midframe 12.

[0053] In this application, the electronic device 10 can be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a large screen, a wearable device (such as glasses, a bracelet, a watch, etc.), a vehicle-mounted device, etc.

[0054] Referring to Figure 4, Figure 4 is a schematic diagram of the structure of the adhesive layer structure 100 in an embodiment of the present application. The adhesive layer structure 100 includes a substrate layer 101, a conductive metal layer 102 and a pressure-sensitive adhesive layer 103 disposed on opposite sides of the substrate layer 101, and an electro-viscosity reducing adhesive layer 104 disposed on a side of the conductive metal layer 102 away from the substrate layer 101; that is, the adhesive layer structure 100 includes the pressure-sensitive adhesive layer 103, the substrate layer 101, the conductive metal layer 102, and the electro-viscosity reducing adhesive layer 104 stacked in sequence.

[0055] In embodiments of the present application, the electrically-induced viscosity-reducing adhesive layer 104 is an adhesive layer whose viscosity decreases or loses after power is applied. In some embodiments of the present application, the electrically-induced viscosity-reducing adhesive layer 104 includes a pressure-sensitive adhesive and a movable electrolyte. The pressure-sensitive adhesive may include an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, a polyurethane pressure-sensitive adhesive, or a thermoplastic elastomer pressure-sensitive adhesive. The movable electrolyte may include an ionic liquid or a solid conductive salt.

[0056] See Figure 5, which is a schematic diagram of the electrically induced viscosity reduction layer 104 in Figure 4. In this application, the mechanism of the electrically induced viscosity reduction of the electrically induced viscosity reduction layer 104 can be:

[0057] The adhesive layer structure 100 is bonded to the conductive substrate 1 via the electro-viscosity reducing adhesive layer 104. By electrifying the conductive metal layer 102 and the conductive substrate 1, the randomly distributed movable electrolytes in the electro-viscosity reducing adhesive layer 104 migrate directionally within the electro-viscosity reducing adhesive layer 104 under the action of the electric field, with cations moving to the negative electrode and anions moving to the positive electrode. In the presence of the electric field, an electrochemical reaction rapidly occurs at the contact interface between the electro-viscosity reducing adhesive layer 104 and the conductive substrate 1, reducing or eliminating the adhesion between the electro-viscosity reducing adhesive layer 104 and the conductive substrate 1, thus achieving electro-viscosity reduction. This makes it easier to peel the electro-viscosity reducing adhesive layer 104 from the conductive substrate 1, thereby allowing the conductive substrate 1 to be easily peeled. This mechanism shows that one side of the electro-viscosity reducing adhesive layer 104 of the adhesive layer structure 100 needs to be bonded to a conductive surface in order to achieve peeling after electrification.

[0058] To better achieve good peeling under power, in the embodiment of the present application, the difference in viscosity of the electro-viscosity reducing adhesive layer 104 before and after power is applied is greater than or equal to 70%. In some embodiments, the difference in viscosity of the electro-viscosity reducing adhesive layer 104 before and after power is applied is greater than or equal to 80%, or greater than or equal to 85%, or greater than or equal to 90%, or greater than or equal to 95%. It can be understood that the greater the difference in viscosity of the electro-viscosity reducing adhesive layer 104 before and after power is applied, the more conducive it is to maintaining a stable bond between the adhered components on both sides of the adhesive layer structure 100 when power is not applied, while also achieving easy peeling of the adhesive layer structure 100 and the adhered components after power is applied.

[0059] In the embodiment of the present application, the thickness of the electrically-induced anti-viscosity adhesive layer 104 is 50 μm-100 μm. In some embodiments, the thickness of the electrically-induced anti-viscosity adhesive layer 104 may be, but is not limited to, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm. A suitable thickness facilitates the electrically-induced anti-viscosity adhesive layer 104 to effectively adhere to the substrate when no power is applied, while also facilitating easy peeling of the adhesive layer structure after power is applied.

[0060] In the present application, the conductive metal layer 102 is used to connect to an external power source together with the conductive substrate 1 to energize the electrically-induced viscosity-reducing adhesive layer 104, which reduces or loses its viscosity after energization, thereby facilitating separation of the conductive substrate 1 from the adhesive layer structure 100. Specifically, in the electronic device 10, the conductive substrate 1 can be a copper foil on the surface of the display screen 11 or a metal portion of the middle frame 12.

[0061] In an embodiment of the present application, the conductive metal layer 102 may be selected from an aluminum layer, an iron layer, a chromium layer, a zinc layer, a copper layer, a silver layer, a tin layer or a nickel layer. These metal material layers have good electrical conductivity and can be well connected as electrodes to an external power source to form a circuit. In an embodiment of the present application, the thickness of the conductive metal layer 102 may be 50nm-100nm. In some embodiments, the thickness of the conductive metal layer 102 may be, but not limited to, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm. The conductive metal layer 102 may be plated by electroplating, sputtering, etc., that is, the conductive metal layer 102 is a conductive metal plating layer. The above thickness can not only achieve good conductive performance, but also avoid the negative effects of the adhesive layer structure 100 being too thick as a whole, such as occupied space and increased cost.

[0062] In the embodiment of the present application, the substrate layer 101 is a polymer material layer, specifically for example, a polyethylene terephthalate (PET) layer or a polyimide (PI) layer. In the embodiment of the present application, the thickness of the substrate layer 101 may be 10 μm-50 μm. In some embodiments, the thickness of the substrate layer 101 may be, but is not limited to, 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm. The substrate layer 101 is made of a polymer material, which not only plays a good load-bearing role, but also facilitates the formation of the conductive metal layer 102 and can better fit with the adhered parts. The control of the thickness of the substrate layer 101 is conducive to playing a load-bearing role and keeps the adhesive layer structure 100 thin as a whole.

[0063] In the embodiments of the present application, the pressure-sensitive adhesive layer 103 can be selected from an acrylic pressure-sensitive adhesive layer, a rubber pressure-sensitive adhesive layer, a polyurethane pressure-sensitive adhesive layer, or a thermoplastic elastomer pressure-sensitive adhesive layer. A specific example of a thermoplastic elastomer pressure-sensitive adhesive layer can be a styrene thermoplastic elastomer pressure-sensitive adhesive layer. The pressure-sensitive adhesive used in the pressure-sensitive adhesive layer 103 is a type of pressure-sensitive adhesive that exhibits excellent adhesion and aging resistance, thereby enhancing the reliability of the bond between the adhered components.

[0064] In the embodiments of the present application, the thickness of the pressure-sensitive adhesive layer 103 is 50 μm to 100 μm. In some embodiments, the thickness of the pressure-sensitive adhesive layer 103 may be, but is not limited to, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm. As the adhesive layer directly bonded to the adhered component, proper thickness control of the pressure-sensitive adhesive layer 103 helps ensure the bonding strength between the pressure-sensitive adhesive layer and the adhered component, while also avoiding negative effects such as space occupation caused by an overly thick adhesive layer structure 100.

[0065] 4 , in some embodiments of the present application, at the outer edge of the glue layer structure 100 , the conductive metal layer 102 is partially exposed to form a tab 105 .

[0066] In some embodiments of the present application, the middle frame 12 includes a metal portion. See Figures 1 and 6. Figure 6 is a schematic diagram of the specific structure of Figure 1. The adhesive layer structure 100 is arranged between the middle frame 12 and the battery 13, and one side of the pressure-sensitive adhesive layer 103 of the adhesive layer structure 100 is bonded to the battery 13, and one side of the electrolytic adhesive layer 104 is bonded to the metal portion of the middle frame 12. Referring to FIG. 7 , FIG. 7 is a schematic diagram of the electrically-induced viscosity-reducing adhesive layer 104 in FIG. 6 undergoing viscosity reduction by electrical power. When the metal portion of the middle frame 12 and the conductive metal layer 102 are connected to an external power source together, the conductive metal layer 102 is connected to the positive electrode of the external power source, and the metal portion of the middle frame 12 is connected to the negative electrode of the external power source. A conductive path is constructed between the conductive metal layer 102 and the metal portion of the middle frame 12. When the electrically-induced viscosity-reducing adhesive layer 104 is energized, under the action of the electric field, cations in the electrically-induced viscosity-reducing adhesive layer 104 move toward the negative electrode side, and anions move toward the positive electrode side. The cations undergo an electrochemical reaction on the negative electrode side, reducing or eliminating the adhesion between the electrically-induced viscosity-reducing adhesive layer 104 and the metal portion of the middle frame 12, thereby enabling the adhesive layer structure 100 to be peeled off from the middle frame 12, and the battery 13 to be removed from the middle frame 12.

[0067] In some other embodiments of the present application, the middle frame 12 includes a metal portion. Referring to FIG. 2 , the adhesive layer structure 100 is disposed between the middle frame 12 and the display screen 11 .

[0068] In some embodiments, referring to FIG. 8 , FIG. 8 is a schematic diagram of the specific structure of FIG. 2 ; the adhesive layer structure 100 is disposed between the middle frame 12 and the display screen 11 , specifically: one side of the pressure-sensitive adhesive layer 103 of the adhesive layer structure 100 is bonded to the display screen 11 , and one side of the electro-decoupling adhesive layer 104 is bonded to the metal portion of the middle frame 12 . Referring to FIG. 9 , FIG. 9 is a schematic diagram of the electrically conductive adhesive layer 104 in FIG. 8 undergoing adhesive reduction by electrical power. When the metal portion of the middle frame 12 and the conductive metal layer 102 are connected to an external power source together, the conductive metal layer 102 is connected to the positive electrode of the external power source, and the metal portion of the middle frame 12 is connected to the negative electrode of the external power source. A conductive path is constructed between the conductive metal layer 102 and the metal portion of the middle frame 12. When the electrically conductive adhesive layer 104 is energized, under the action of the electric field, cations in the electrically conductive adhesive layer 104 move toward the negative electrode side, and anions move toward the positive electrode side. The cations undergo an electrochemical reaction on the negative electrode side, reducing or eliminating the adhesive force between the electrically conductive adhesive layer 104 and the metal portion of the middle frame 12. This allows the adhesive layer structure 100 to be peeled off from the middle frame 12, and the display screen 11 is removed from the middle frame 12.

[0069] In other embodiments, referring to FIG. 10 , FIG. 10 is a schematic diagram of the specific structure of FIG. 2 ; the adhesive layer structure 100 is disposed between the middle frame 12 and the display screen 11 , specifically: one side of the electro-viscosity-reducing adhesive layer 104 of the adhesive layer structure 100 is bonded to the display screen 11 , and one side of the pressure-sensitive adhesive layer 103 is bonded to the middle frame 12 . Referring to FIG11 , FIG11 is a schematic diagram of the electrically conductive adhesive layer 104 in FIG8 undergoing electrical bonding. When the copper foil on the side of the display screen 11 near the middle frame 12 is connected to an external power source together with the conductive metal layer 102, wherein the conductive metal layer 102 is connected to the positive electrode of the external power source and the copper foil on the surface of the display screen 11 is connected to the negative electrode of the external power source, a conductive path is established between the conductive metal layer 102 and the copper foil on the surface of the display screen 11. When the electrically conductive adhesive layer 104 is energized, under the action of the electric field, the cations in the electrically conductive adhesive layer 104 migrate toward the negative electrode side and the anions migrate toward the positive electrode side. The cations undergo an electrochemical reaction on the negative electrode side, reducing or eliminating the adhesion between the electrically conductive adhesive layer 104 and the display screen 11, thereby enabling the adhesive layer structure 100 to be peeled off from the display screen 11, allowing the display screen 11 to be removed from the middle frame 12. Compared to the structure shown in FIG8 , the structure shown in FIG10 can better protect the display screen 11 from damage during removal.

[0070] In some other embodiments of the present application, the middle frame 12 includes a metal portion, see Figure 12, the glue layer structure 100 is arranged between the middle frame 12 and the battery 13, and one side of the pressure-sensitive adhesive layer 103 of the glue layer structure 100 is bonded to the battery 13, and one side of the electrolytic adhesive layer 104 is bonded to the metal portion of the middle frame 12; at the same time, the glue layer structure 100 is arranged between the middle frame 12 and the display screen 11, one side of the electrolytic adhesive layer 104 of the glue layer structure 100 is bonded to the display screen 11, and one side of the pressure-sensitive adhesive layer 103 is bonded to the middle frame 12.

[0071] In some other embodiments of the present application, the middle frame 12 includes a metal portion, see Figure 13, the glue layer structure 100 is arranged between the middle frame 12 and the battery 13, and one side of the pressure-sensitive adhesive layer 103 of the glue layer structure 100 is bonded to the battery 13, and one side of the electrolytic adhesive layer 104 is bonded to the metal portion of the middle frame 12; at the same time, the glue layer structure 100 is arranged between the middle frame 12 and the display screen 11, one side of the pressure-sensitive adhesive layer 103 of the glue layer structure 100 is bonded to the display screen 11, and one side of the electrolytic adhesive layer 104 is bonded to the metal portion of the middle frame 12.

[0072] In the embodiments of the present application, when the metal portion of the middle frame 12 serves as the negative electrode, to better achieve tackification or loss of adhesion of the electro-viscosity reducing adhesive layer upon power-up, at least a portion of the portion where the middle frame 12 and the electro-viscosity reducing adhesive layer 104 are bonded is formed as a metal portion. It is understood that the more metal portions bonded between the middle frame 12 and the electro-viscosity reducing adhesive layer 104, the more favorable it is for the electro-viscosity reducing adhesive layer 104 to achieve uniform distribution of cations on the side of the electro-viscosity reducing adhesive layer 104 near the negative electrode after power is applied, ultimately achieving good separation of the entire surface of the electro-viscosity reducing adhesive layer 104 near the negative electrode from the metal portion of the middle frame 12. In some embodiments, the portion where the middle frame 12 and the electro-viscosity reducing adhesive layer 104 are bonded is entirely formed as a metal portion.

[0073] In some embodiments of the present application, the electronic device 10 further includes a cover plate disposed on the side of the display screen 11 away from the middle frame 12, and a back cover disposed on the side of the battery 13 away from the middle frame 12, with the middle frame 12 fixedly connected between the cover plate and the back cover. The middle frame 12 and the back cover may be separate structures or may be integrally formed.

[0074] Referring to Figure 14, which is a schematic diagram illustrating the bonding of the battery 13 to the middle frame 12, the battery 13 is bonded to the battery compartment of the middle frame 12, and the adhesive side of the battery, to which the adhesive layer structure 100 is bonded, is bonded to the middle frame 12. To facilitate application of voltage to the electrically conductive adhesive layer 104, in some embodiments of the present application, a tab 1051 is provided on the conductive metal layer 102 of the adhesive layer structure 100 as a positive tab, and a tab 106 is provided on the metal portion of the middle frame 12 as a negative tab.

[0075] Referring to Figure 15 , which is a schematic diagram illustrating the bonding of the display screen 11 to the middle frame 12, the copper foil side of the display screen 11 is bonded to the adhesive layer side of the middle frame 12, to which the adhesive layer structure 100 is attached. The adhesive layer structure 100 may be positioned corresponding to the edge region of the display screen 11. The present application does not impose any particular restrictions on the specific location and dimensions of the adhesive layer structure 100 between the display screen 11 and the middle frame 12, as long as it securely bonds the display screen 11. To facilitate application of voltage to the electro-viscosity-reducing adhesive layer 104, in some embodiments of the present application, a tab 1052 is provided on the conductive metal layer 102 of the adhesive layer structure 100 as a positive tab, and a tab 107 is provided on the copper foil of the display screen 11 as a negative tab. In other embodiments, a tab may be provided on the conductive metal layer 102 of the adhesive layer structure 100 as a positive tab, while a tab may be provided on the metal portion of the middle frame 12 as a negative tab.

[0076] In some embodiments of the present application, the middle frame 12 includes a metal portion. To connect an external power source, an external port can be provided on the electronic device 10 to connect the external power source, thereby energizing the electrically-induced viscosity-reducing adhesive layer 104. Referring to Figures 16 and 17 , in some embodiments, the electronic device 10 is further provided with a first external port 111 and / or a second external port 112; Figure 16 is a schematic diagram illustrating the configuration of the first external port 111 in the electronic device 10 in one embodiment of the present application; and Figure 17 is a schematic diagram illustrating the configuration of the second external port 112 in the electronic device 10 in one embodiment of the present application.

[0077] As shown in Figure 16, the positive terminal of the first external connection port 111 is electrically connected to the conductive metal layer 102 in the adhesive layer structure 100 bonded to the battery 13, and the negative terminal of the first external connection port 111 is electrically connected to the metal portion of the middle frame 12. The first external connection port 111 is used to connect to an external power source, thereby energizing the electrically induced viscosity-reducing adhesive layer 104 in the adhesive layer structure 100 bonded to the battery 13, thereby reducing or eliminating its viscosity. In one specific embodiment, the tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the battery 13 serves as the positive tab, and the metal portion of the middle frame 12 is provided with a tab serving as the negative tab. The positive tab is connected to the positive terminal of the first external connection port 111 via a wire, and the negative tab is connected to the negative terminal of the first external connection port 111 via a wire.

[0078] In the present application, the first external port 111 can be provided on the frame of the electronic device 10, specifically on the middle frame 12. The specific location of the first external port 111 on the middle frame 12 is not limited and can be provided on either side, the top, or the bottom. The location of the first external port 111 in FIG. 16 is for illustration only and does not limit the location of the first external port 111 on the middle frame 12 of the present application.

[0079] As shown in Figure 17, the positive terminal of the second external port 112 is electrically connected to the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11, while the negative terminal of the second external port 112 is electrically connected to the metal portion of the middle frame 12 or the copper foil on one side of the display screen 11. The second external port 112 is used to connect to an external power source; the external power source is used to energize the electrically induced viscosity-reducing adhesive layer in the adhesive layer structure 100 bonded to the display screen 11, reducing or eliminating its viscosity upon energization. In one specific embodiment, the tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11 serves as the positive tab, while a tab provided on the metal portion of the middle frame 12 serves as the negative tab. The positive tab is connected to the positive terminal of the second external port 112 via a wire, while the negative tab is connected to the negative terminal of the second external port 112 via a wire. In another specific embodiment, the tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11 serves as a positive tab, and a tab is provided on the copper foil on one side of the display screen 11 as a negative tab. The positive tab is connected to the positive terminal of the second external port 112 through a wire, and the negative tab is connected to the negative terminal of the second external port 112 through a wire.

[0080] In the present application, the second external port 112 can be provided on the frame of the electronic device 10, specifically on the middle frame 12. The specific location of the second external port 112 on the middle frame 12 is not limited and can be provided on either side, the top, or the bottom. The location of the second external port 112 in FIG. 17 is for illustration only and does not limit the location of the second external port 112 on the middle frame 12 of the present application.

[0081] In some other embodiments of the present application, the middle frame 12 includes a metal part, and the electronic device 10 also includes a mainboard. The mainboard can also be controlled to energize the electrically induced viscosity-reducing adhesive layer 104, and the mainboard is disposed inside the electronic device 10.

[0082] See Figure 18, which schematically illustrates the connection between the metal portion and the conductive metal layer 102 and the mainboard. As shown in Figure 18, the metal portion of the middle frame 12 and the conductive metal layer in the adhesive layer structure bonded to the battery 13 are electrically connected to the mainboard. The mainboard is used to control the energization of the electrically conductive adhesive layer 104 in the adhesive layer structure 100 bonded to the battery 13, which reduces or loses its viscosity upon energization. In one specific embodiment, the tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the battery 13 serves as the positive tab, while the metal portion of the middle frame 12 is provided with a tab serving as the negative tab. The positive and negative tabs are connected to corresponding connection points on the mainboard via wires. The mainboard includes a controller and a switch. The controller controls the opening and closing of the switch to energize and deenergize the electrically conductive adhesive layer 104.

[0083] See Figure 19, which shows a schematic diagram of the connection between the metal portion or copper foil on one side of the display screen 11, and the conductive metal layer 102, and the motherboard. As shown in Figure 19, the copper foil on the metal portion of the middle frame 12 or on one side of the display screen 11, as well as the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11, are electrically connected to the motherboard. The motherboard controls the electrical conduction of the electrically induced viscosity-reducing adhesive layer 104 in the adhesive layer structure 100 bonded to the display screen 11, causing it to reduce or lose viscosity upon energization. In one specific embodiment, the tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11 serves as the positive tab, while the metal portion of the middle frame 12 is provided with a tab serving as the negative tab. The positive and negative tabs are connected to corresponding connection points on the motherboard via wires. In another specific embodiment, a tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11 serves as a positive tab, and a tab provided on the copper foil on one side of the display screen 11 serves as a negative tab. The positive and negative tabs are connected to corresponding connection points on the mainboard via wires. The mainboard includes a controller and a switch. The controller controls the opening and closing of the switch to energize and deenergize the electrically induced anti-viscosity adhesive layer 104.

[0084] It can be understood that in a normal bonding state, the mainboard controls the electrically anti-adhesion adhesive layer 104 to be in a power-off state, and when disassembly is required, the mainboard controls the electrically anti-adhesion adhesive layer 104 to be in a power-on state.

[0085] In the embodiment of the present application, when a glue layer structure 100 is provided between the display screen 11 and the middle frame 12, and between the battery 13 and the middle frame 12, the two glue layer structures 100 can both use the above-mentioned external port to realize the electrification of the electro-reducing adhesive layer 104; or both use the above-mentioned mainboard control method to realize the electrification of the electro-reducing adhesive layer 104; or one of them can use the above-mentioned external port method to realize the electrification of the electro-reducing adhesive layer 104, and the other can use the above-mentioned mainboard control method to realize the electrification of the electro-reducing adhesive layer 104.

[0086] In other embodiments of the present application, the middle frame 12 is a plastic middle frame. Referring to FIG10 , an adhesive layer structure 100 is disposed between the middle frame 12 and the display screen 11. One side of the electrically conductive adhesive layer 104 of the adhesive layer structure 100 is bonded to the display screen 11, while one side of the pressure-sensitive adhesive layer 103 is bonded to the middle frame 12. The mechanism of electrically conductive adhesive layer 104 reducing adhesion upon application of electricity is shown in FIG11 and will not be further described here.

[0087] In this embodiment, referring to FIG. 17 , to facilitate connection to an external power source, the electronic device 10 is further provided with a second external port 112. The positive terminal of the second external port 112 is electrically connected to the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11, while the negative terminal of the second external port 112 is electrically connected to the metal portion of the middle frame 12 or the copper foil on one side of the display screen 11. The second external port 112 is used to connect to an external power source. The external power source is used to energize the electrically debonding adhesive layer in the adhesive layer structure 100 bonded to the display screen 11, thereby reducing or eliminating its viscosity. In one specific embodiment, a tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11 serves as the positive tab, while a tab provided on the copper foil on one side of the display screen 11 serves as the negative tab. The positive tab is connected to the positive terminal of the second external port 112 via a wire, while the negative tab is connected to the negative terminal of the second external port 112 via a wire.

[0088] In this embodiment, referring to FIG17 , the copper foil on one surface of the display screen 11 and the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11 are electrically connected to the mainboard. The mainboard is used to control the energization of the electrically induced viscosity-reducing adhesive layer 104 in the adhesive layer structure 100 bonded to the display screen 11, which reduces or eliminates its viscosity upon energization. In one specific embodiment, the tab 105 provided on the conductive metal layer 102 in the adhesive layer structure 100 bonded to the display screen 11 serves as the positive tab, while a tab provided on the copper foil on one surface of the display screen 11 serves as the negative tab. The positive and negative tabs are connected to corresponding connection points on the mainboard via wires.

[0089] The electronic device provided in the embodiment of the present application can achieve effective viscosity reduction of the adhesive layer structure by applying a certain voltage, which is beneficial to reducing disassembly damage, thereby realizing non-destructive disassembly and recycling of the battery and display screen; and because the display screen and battery can be easily installed and disassembled, it is convenient for users to complete the disassembly and replacement of the display screen and battery by themselves, better meeting user needs.

[0090] It should be understood that the first, second and various numerical numbers involved in this document are only distinguished for the convenience of description and are not intended to limit the scope of this application.

[0091] In this application, "and / or" describes the relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the related objects are in an "or" relationship.

[0092] In this application, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0093] In this application, “-” represents a range value, including the endpoint values ​​at both ends. For example, the value of a can be 0.5-15, which means that the value of a can be between 0.5 and 15, and includes the endpoint values ​​0.5 and 15.

[0094] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. Some or all of the steps can be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: The electronic device includes a display screen, a middle frame, a battery, and a glue layer structure. The display screen and the battery are respectively arranged on opposite sides of the middle frame. A copper foil is provided on a surface of the display screen on a side close to the middle frame. The glue layer structure includes a pressure-sensitive adhesive layer, a substrate layer, a conductive metal layer, and an electrolytic adhesive layer stacked in sequence. The middle frame includes a metal portion, the adhesive layer structure is disposed between the middle frame and the battery, and one side of the pressure-sensitive adhesive layer of the adhesive layer structure is bonded to the battery, and one side of the electrolytic viscosity-reducing adhesive layer is bonded to the metal portion of the middle frame; and / or the adhesive layer structure is disposed between the middle frame and the display screen; Alternatively, the middle frame is a plastic middle frame, the adhesive layer structure is arranged between the middle frame and the display screen, and one side of the electrolytic adhesive layer of the adhesive layer structure is bonded to the display screen, and one side of the pressure-sensitive adhesive layer is bonded to the middle frame.

2. The electronic device according to claim 1, wherein The middle frame includes a metal portion, and the adhesive layer structure is provided between the middle frame and the display screen. Specifically, One side of the pressure-sensitive adhesive layer of the adhesive layer structure is bonded to the display screen, and one side of the electrolytic viscosity-reducing adhesive layer is bonded to the metal part of the middle frame; or one side of the electrolytic viscosity-reducing adhesive layer of the adhesive layer structure is bonded to the display screen, and one side of the pressure-sensitive adhesive layer is bonded to the middle frame.

3. The electronic device according to claim 1 or 2, wherein: The electrically induced viscosity-reducing adhesive layer is an adhesive layer whose viscosity is reduced or loses after being energized; the thickness of the electrically induced viscosity-reducing adhesive layer is 50 μm-100 μm.

4. The electronic device according to claim 3, wherein: The difference in viscosity of the electrically induced viscosity-reducing layer before and after power is applied is greater than or equal to 70%.

5. The electronic device according to claim 1, wherein The conductive metal layer is selected from an aluminum layer, an iron layer, a chromium layer, a zinc layer, a copper layer, a silver layer, a tin layer or a nickel layer.

6. The electronic device according to claim 1 or 5, wherein: The thickness of the conductive metal layer is 50nm-100nm.

7. The electronic device according to claim 1 or 2, wherein: The substrate layer is a polymer material layer, and the thickness of the substrate layer is 10 μm-50 μm.

8. The electronic device according to claim 1, wherein The pressure-sensitive adhesive layer is selected from an acrylic pressure-sensitive adhesive layer, a rubber pressure-sensitive adhesive layer, a polyurethane pressure-sensitive adhesive layer or a thermoplastic elastomer pressure-sensitive adhesive layer.

9. The electronic device according to claim 1 or 8, wherein: The thickness of the pressure-sensitive adhesive layer is 50 μm-100 μm.

10. The electronic device according to claim 1 or 2, wherein: The portion where the middle frame is bonded to the electrically-induced viscosity-reducing adhesive layer is at least partially the metal portion.

11. The electronic device according to claim 1 or 2, wherein: At the outer edge of the glue layer structure, the conductive metal layer is partially exposed to form a tab.

12. The electronic device according to claim 1 or 2, wherein: The middle frame includes a metal portion, and the electronic device is further provided with a first external port and / or a second external port; The positive terminal of the first external port is electrically connected to the conductive metal layer in the adhesive layer structure bonded to the battery, and the negative terminal of the first external port is electrically connected to the metal portion of the middle frame. The first external port is used to connect to an external power source. The positive terminal of the second external port is electrically connected to the conductive metal layer in the glue layer structure bonded to the display screen, and the negative terminal of the second external port is electrically connected to the metal portion of the middle frame or the copper foil on one surface of the display screen. The second external port is used to connect to an external power source. The external power source is used to energize the electrically induced viscosity-reducing adhesive layer in the adhesive layer structure bonded to the battery, and the viscosity is reduced or lost after the power is energized.

13. The electronic device according to claim 1 or 2, wherein: The middle frame is a plastic middle frame, and the electronic device is further provided with a second external port. The positive terminal of the second external port is electrically connected to the conductive metal layer in the glue layer structure bonded to the display screen, and the negative terminal of the second external port is electrically connected to the copper foil on one surface of the display screen. The second external port is used to connect to an external power supply, and the external power supply is used to energize the electrically induced viscosity-reducing adhesive layer in the glue layer structure bonded to the display screen, so that the viscosity is reduced or lost after energization.

14. The electronic device according to claim 1 or 2, wherein: The electronic device further includes a mainboard, and the middle frame includes a metal portion; The metal portion of the middle frame and the conductive metal layer in the adhesive layer structure bonded to the battery are electrically connected to the mainboard, and the mainboard is used to control the electrically induced viscosity-reducing adhesive layer in the adhesive layer structure bonded to the battery to be energized so that the viscosity is reduced or lost after the energization; And / or, the metal portion of the middle frame or the copper foil on one side surface of the display screen, and the conductive metal layer in the glue layer structure bonded to the display screen are electrically connected to the mainboard, and the mainboard is used to control the electrically induced viscosity-reducing glue layer in the glue layer structure bonded to the display screen to be energized and reduce or lose viscosity after energization.

15. The electronic device according to claim 1 or 2, wherein: The electronic device further includes a cover plate provided on a side of the display screen away from the middle frame, and a back cover provided on a side of the battery away from the middle frame, wherein the middle frame is fixedly connected between the cover plate and the back cover.

Images