Circuit board assembly and electronic apparatus

Abstract

Embodiments of the present application provide a circuit board assembly and an electronic apparatus. The circuit board assembly comprises a circuit board, a connecting board, and a second electronic device. The circuit board comprises a circuit board body and a first electronic device, and the first electronic device is located on the circuit board body. The circuit board body is provided with first signal vias. The connecting board is located on the side of the circuit board body opposite to the first electronic device, and is connected to the first electronic device by means of the first signal vias. The second electronic device is connected to the connecting board. While achieving signal transmission between the first electronic device and the second electronic device, the circuit board assembly in the present application can fully utilize the first signal vias, avoiding signal stub formation in the first signal vias between the first electronic device and the second electronic device, thus improving the quality of a signal between the first electronic device and the second electronic device.

Description

Circuit board assemblies and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on February 8, 2024, with application number 202410175838.8 and application name “Circuit Board Assembly and Electronic Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a circuit board assembly and an electronic device. Background Art

[0003] Nowadays, electronic devices such as laptops and tablets play an important role in people's daily lives and work. The existence of these electronic devices has greatly facilitated people's lives and work. As electronic technology continues to advance, people's requirements for the performance of electronic devices are also constantly increasing.

[0004] Electronic devices contain circuit boards. As a core component of electronic devices, circuit boards play an important role. The performance of the circuit board directly affects the performance of the electronic device. The circuit board consists of a circuit board body and a large number of electronic devices, with the circuit board body carrying a large number of electronic devices. Currently, the circuit board body in the circuit board is often provided with signal holes, so that signal transmission between the electronic devices carried on the circuit board can be achieved through the signal holes. For example, the signal holes on the circuit board can achieve signal transmission between the central processing unit on the circuit board body and the double-rate synchronous dynamic random access memory (DDRSDRAM).

[0005] When the CPU and RAM transmit signals through the signal hole, a stub forms on the circuit board itself. This degrades signal quality, preventing the RAM from increasing to the maximum speed supported by the electronic device, and thus limiting the performance of the circuit board. Summary of the Invention

[0006] The present application provides a circuit board assembly and an electronic device, so that during the transmission process of the signal between the first electronic device and the second electronic device, the first signal hole can be fully utilized to avoid the generation of residual stubs during transmission in the first signal hole, thereby improving the quality of the signal between the first electronic device and the second electronic device.

[0007] A first aspect of an embodiment of the present application provides a circuit board assembly, the circuit board assembly comprising:

[0008] The circuit board comprises a circuit board body and a first electronic device, wherein the first electronic device is located on the circuit board body; the circuit board body comprises a signal hole, wherein the signal hole comprises a first signal hole;

[0009] a connecting plate, located on a side of the circuit board body opposite to the first electronic device, and connected to the first electronic device through the first signal hole;

[0010] The second electronic device is electrically connected to the connecting board.

[0011] In the circuit board assembly of the embodiment of the present application, the connection plate is provided so that the first electronic device can utilize the first signal hole on the circuit board body and achieve conduction with the second electronic device through the connection plate. This allows the signal between the first electronic device and the second electronic device (hereinafter referred to as the second electronic device signal) to fully utilize the first signal hole during transmission, thereby avoiding the generation of residual piles in the first signal hole. This application does not require a backdrilling process, allowing the second electronic device to be close to the first electronic device, improving the quality of the second electronic device signal and ensuring better performance of the second electronic device.

[0012] In some possible implementations, the connection board is a high-density interconnect board, and a first signal path is defined within the connection board. A first end of the first signal path is electrically connected to the first electronic device through a first signal hole, and a second end of the first signal path is electrically connected to the second electronic device.

[0013] When the signal between the second electronic device and the first electronic device is transmitted in the first signal path, the connection board does not generate a stub at the first signal path.

[0014] In this way, the connecting board realizes conduction between the first electronic device and the second electronic device through the first signal path, so as to ensure that the first electronic device and the second electronic device are electrically connected. At the same time, the signal of the second electronic device can fully utilize the first signal hole and the first signal path during transmission, and no residual piles will be generated in the first signal hole and the first signal path.

[0015] Compared with the method of using a high-density interconnection board in the circuit board body to solve the problem of the second electronic device signal generating residual stubs in the first signal hole, the present application only needs to set up a connecting board to avoid the second electronic device signal generating residual stubs in the first signal hole, which can reduce the production cost of the circuit board assembly.

[0016] In some possible embodiments, a first conductive portion is provided between the first electronic device and the circuit board body, and the first electronic device is connected to the first end of the first signal hole through the first conductive portion; a second conductive portion is provided between the connecting board and the circuit board body, and the second end of the first signal hole is connected to the first end of the first signal path through the second conductive portion.

[0017] The first and second conductive portions enable electrical connection between the first electronic device and the first end of the first signal path. Furthermore, the introduction of the connecting plate reduces the signal fan-out area of ​​the first electronic device, allowing the second electronic device to be placed closer to the first electronic device, further reducing insertion loss and improving signal quality.

[0018] In some possible implementations, the first signal hole is located on the side of the first conductive portion, which can simplify the formation process of the first signal hole and reduce the manufacturing cost of the circuit board assembly.

[0019] In some possible implementations, there are multiple first conductive portions, and each first conductive portion is correspondingly provided with a first signal hole and a second conductive portion;

[0020] The connecting board is provided with a first signal path corresponding to each second conductive portion so as to form multiple transmission paths between the first electronic device and the second electronic device. The multiple second electronic device signals are transmitted through their respective transmission paths, which can improve the transmission rate of the second electronic device signals and avoid mutual interference between the second electronic device signals.

[0021] In some possible implementations, a third conductive portion is provided between the second electronic device and the connecting board, and the third conductive portion is connected between the second end of the first signal path and the second electronic device to achieve conduction between the second electronic device and the connecting board through the third conductive portion.

[0022] In some possible embodiments, the second electronic device is located on the side of the connecting board facing the first electronic device; the first end of the first signal path and the second end of the first signal path are both formed on the side of the connecting board facing the circuit board body to ensure that the first signal path is connected to the first electronic device and the second electronic device.

[0023] In some possible embodiments, the second electronic device is connected to a side of the circuit board body on which the first electronic device is provided to ensure that the first electronic device and the second electronic device are conductive, avoid residual stubs generated when the signal of the second electronic device is transmitted in the first signal hole, and improve the quality of the signal of the second electronic device while enabling the first electronic device and the second electronic device to be arranged on the same surface of the circuit board body.

[0024] In some possible implementations, the signal hole further includes a second signal hole, and the circuit board body has the second signal hole at a position corresponding to the third conductive portion;

[0025] A first end of the second signal hole is connected to the second electronic component, and a second end of the second signal hole is connected to the third conductive portion.

[0026] By connecting the second signal hole with the second electronic device and the third conductive portion, the second electronic device and the connecting board are connected to each other, and the second electronic device signal can fully utilize the second signal hole during transmission to avoid the generation of residual stubs in the second signal hole.

[0027] In some possible implementations, a fourth conductive portion is provided between the second electronic device and the circuit board body, and the second electronic device is connected to the first end of the second signal hole via the fourth conductive portion to achieve conduction between the second electronic device and the connecting board.

[0028] In some possible embodiments, the circuit board assembly further includes an adapter board, and the second electronic device is connected to the first end of the second signal hole via the adapter board, so as to achieve conduction between the second electronic device and the circuit board body through the adapter board while ensuring that the second signal hole is opened on the circuit board body.

[0029] In some possible implementations, the second electronic component has a second projection area on the circuit board body;

[0030] The projection of the connecting board on the circuit board body and the second projection area have a second overlapping area; the second signal hole is located in the second overlapping area, so that the second electronic device can be connected to the connecting board through the second signal hole while being closer to the first electronic device, thereby improving the quality of the signal of the second electronic device.

[0031] In some possible implementations, the second electronic device is located within the circuit board body, and while achieving electrical connection between the second electronic device and the second electronic device, the second electronic device can be hidden within the circuit board body to avoid the circuit board assembly being too thick and affecting the thickness of the electronic device.

[0032] In some possible implementations, the second electronic device is located on a side of the connecting board away from the first electronic device, so that the second electronic device and the first electronic device are arranged on different sides of the circuit board body;

[0033] The first end of the first signal path is formed on the side of the connecting plate facing the circuit board body, and the second end of the first signal path is formed on the side of the connecting plate facing the second electronic device, so as to achieve conduction between the second electronic device and the first electronic device through the first signal path.

[0034] In some possible embodiments, the number of third conductive portions is equal to the number of first signal paths and corresponds one to one, so that each first signal path of the connecting board can be connected to the second electronic device through a third conductive portion to realize the transmission of the second electronic device signal within each transmission path.

[0035] In some possible embodiments, the connecting plate includes a conductive portion and a plurality of stacked conductive circuit layers, wherein adjacent conductive circuit layers are insulated from each other; at least two conductive circuit layers located in the middle layer of the connecting plate form a core plate unit of the connecting plate, and adjacent conductive circuit layers located on the sides of the core plate unit are interconnected through the conductive portion;

[0036] The first signal path is formed at least at the conductive portion of the core board unit facing the circuit board body, so that the first signal path is formed by utilizing the conductive portions interconnected between adjacent conductive circuit layers, so that the second electronic device signal can be transmitted within the first signal path while avoiding the second electronic device signal from passing through useless conductive circuit layers when passing through the first signal path, thereby avoiding the generation of residual piles.

[0037] In some possible implementations, adjacent conductive circuit layers within the core plate unit are interconnected via conductive parts.

[0038] In some possible implementations, the signal hole is a signal via hole or a signal buried hole on the circuit board body to solve the problem of residual stubs generated when the second electronic device signal is transmitted in the signal via hole or signal buried hole of the circuit board body.

[0039] In some possible implementations, the first electronic device has a first projection area on the circuit board body;

[0040] The projection of the connecting plate on the circuit board body has a first overlapping area with the first projection area; the first signal hole is located in the first overlapping area, so that the signal fan-out area of ​​the first electronic device can be zero, further improving the quality of the signal of the second electronic device.

[0041] In some possible implementations, the circuit board body has a first surface and a second surface in a thickness direction, and the second surface faces the keyboard of the electronic device;

[0042] The first electronic device is arranged on the first surface, and the connecting plate is arranged on the second surface, so that the connecting plate is located on the side of the circuit board body opposite to the first electronic device, so as to ensure that the connecting plate can be connected to the first electronic device through the first signal hole, while facilitating the heat dissipation of the first electronic device and improving the user experience of the electronic device.

[0043] In some possible implementations, the circuit board assembly further includes an isolator that blocks at least one side of the second electronic device to shield the second electronic device through the isolator, thereby preventing the second electronic device from affecting other signals of the electronic device.

[0044] In some possible implementations, the isolation member includes an isolation cover or an isolation plate, which not only shields the second electronic device but also makes the structure of the isolation member more diverse to adapt to the design requirements of the circuit board assembly for the isolation member in different scenarios.

[0045] In some possible implementations, the first electronic device includes a processor, and the second electronic device includes a memory, so as to improve the performance of the memory and enable the speed of the memory to be increased to the maximum speed supported by the electronic device.

[0046] A second aspect of an embodiment of the present application provides an electronic device, which includes a housing and a circuit board assembly as described above. The circuit board assembly is located inside the housing to ensure that the performance of the second electronic device in the circuit board assembly is better utilized to improve the performance of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0048] FIG2 is a schematic diagram of the internal structure of an electronic device provided in an embodiment of the present application;

[0049] FIG3 is a partial schematic diagram of the core area of ​​a first circuit board provided in the related art;

[0050] FIG4 is a partial detail view of the circuit board body at the first signal hole and the second signal hole in FIG3 ;

[0051] FIG5 is a partial schematic diagram of the core area of ​​a second circuit board provided in the related art;

[0052] FIG6 is a partial schematic diagram of a circuit board assembly provided in the related art;

[0053] FIG7 is a partial schematic diagram of another circuit board assembly provided in the related art;

[0054] FIG8 is a schematic diagram of a structure of a backdrilling method for eliminating residual piles on a circuit board body provided in the related art;

[0055] FIG9 is a schematic structural diagram of a first circuit board assembly provided in an embodiment of the present application;

[0056] FIG10 is a schematic structural diagram of a connecting plate provided in an embodiment of the present application;

[0057] FIG11 is a schematic structural diagram of another connecting plate provided in an embodiment of the present application;

[0058] FIG12 is a schematic structural diagram of another connecting plate provided in an embodiment of the present application;

[0059] FIG13 is a schematic structural diagram of another connecting plate provided in an embodiment of the present application;

[0060] FIG14 is a schematic diagram of signal routing within a low-order high-density interconnect board provided by an embodiment of the present application;

[0061] FIG15 is a schematic structural diagram of a second circuit board assembly provided in an embodiment of the present application;

[0062] FIG16 is a schematic structural diagram of a third circuit board assembly provided in an embodiment of the present application;

[0063] FIG17 is a schematic structural diagram of a fourth circuit board assembly provided in an embodiment of the present application;

[0064] FIG18 is a schematic diagram of a first routing method of a second electronic device signal within a connection board when a first electronic device and a second electronic device are disposed on the same surface of a connection board according to an embodiment of the present application;

[0065] FIG19 is a schematic diagram of a second routing method of a signal of the second electronic device within the connection board when the first electronic device and the second electronic device are arranged on the same surface of the connection board according to an embodiment of the present application;

[0066] FIG20 is a schematic diagram of a third routing method of the second electronic device signal within the connecting board when the first electronic device and the second electronic device are arranged on the same surface of the connecting board according to an embodiment of the present application;

[0067] FIG21 is a schematic structural diagram of a fifth circuit board assembly provided in an embodiment of the present application;

[0068] FIG22 is a schematic structural diagram of a sixth circuit board assembly provided in an embodiment of the present application;

[0069] FIG23 is a schematic diagram of a first routing method of a signal of the second electronic device within the connection board when the first electronic device and the second electronic device are arranged on different surfaces of the connection board according to an embodiment of the present application;

[0070] FIG24 is a schematic diagram of a second routing method of a signal of the second electronic device within the connection board when the first electronic device and the second electronic device are arranged on different surfaces of the connection board according to an embodiment of the present application;

[0071] FIG25 is a schematic diagram of a third routing method of the second electronic device signal within the connecting board when the first electronic device and the second electronic device are arranged on different surfaces of the connecting board according to an embodiment of the present application.

[0072] Reference numerals: 100 - electronic device; 1 - screen member; 11 - screen housing; 12 - display screen; 2 - housing; 21 - base; 22 - keyboard; 23 - touchpad; 3 - hinge mechanism; 4 - circuit board; 41 - circuit board body; 411 - first signal hole; 412 - second signal hole; 413 - working layer; 414 - first conducting portion; 415 - second conducting portion; 416 - third conducting portion; 417 - fourth conducting portion; 418 - fifth conducting portion; 42 - central processing unit; 421 - substrate; 422 - chip; 423 - packaging layer; 43 - random access memory; 44 - core area; 45 - first connecting portion; 46 - second connecting portion; 47 - third connecting portion; 48 - first electronic component; 49 - second electronic component; 5 - fan; 6-connecting board; 61-first signal path; 62-conductive circuit layer; 63-insulating layer; 64-core board unit; 641-first side; 642-second side; 65-conductive part; 651-first conductive part; 652-second conductive part; 653-third conductive part; 654-fourth conductive part; 655-fifth conductive part; 66-signal buried via; 67-conductive group; 7-adapter board; 71-second signal path; 8-drill bit; 9-isolator; S0-signal fan-out area; S1-first overlapping area; S2-second overlapping area. DETAILED DESCRIPTION

[0073] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0074] The present application provides an electronic device, which may include, but is not limited to, a computer, a mobile phone, an unmanned aerial vehicle (UAV), a netbook, a personal digital assistant (PDA), an ultra-mobile personal computer (UMPC), a handheld computer, a smart wearable device, a virtual reality (VR) device, a server, a point of sales (POS), and other mobile or fixed terminals. Computers may include laptops, tablet computers (i.e., pads), and the like.

[0075] Fig. 1 schematically shows the structure of an electronic device 100, which is a laptop computer. The structure of the electronic device 100 will be further described below using a laptop computer as an example.

[0076] As shown in Figure 1, electronic device 100 may include a screen 1 and a body 2. Screen 1 may be used to display information and provide an interactive interface for the user. Body 2 may include an input device that the user may operate on body 2 to facilitate user input when using electronic device 100.

[0077] As shown in Figure 1, the electronic device 100 may further include a hinge mechanism 3. The hinge mechanism 3 is located at the connection between the screen component 1 and the base 21, and the screen component 1 is rotatably connected to the base 21 through the hinge mechanism 3. By rotating the screen component 1, the configuration of the electronic device 100 can be changed. For example, by rotating the screen component 1, the electronic device 100 can be switched from a closed state to an open state (as shown in Figure 1). For another example, by rotating the screen component 1, the electronic device 100 can be switched from an open state to a closed state. When the electronic device 100 is in a closed state, the screen component 1 is stacked on the base 21. When the electronic device 100 is in an open state, the screen component 1 is set at an angle relative to the body 2.

[0078] In some embodiments, the screen member 1 can be mounted on the body 2 and detachable from the body 2. For example, the screen member 1 can be mounted on the body 2 using magnets, allowing it to be separated from the body 2. After separation, the screen member 1 and the body 2 can become two independent devices. The screen member 1 can be used independently. By changing the position of the screen member 1 relative to the body 2, the user's needs can be met in a variety of application scenarios.

[0079] The structure of the electronic device 100 will be further described below by taking the laptop computer in which the screen member 1 is rotatably connected to the base 21 as shown in FIG. 1 as an example.

[0080] Continuing with Figure 1 , the screen assembly 1 may include a screen housing 11 and a display screen 12. The display screen 12 is mounted on the screen housing 11 and, together with the screen housing 11, constitutes the screen assembly 1. When mounted on the screen housing 11, the display screen 12 is exposed on the side of the screen housing 11 facing the body 2, allowing the display screen 12 to display information and provide an interactive interface for the user.

[0081] 1 , the screen component 1 further includes a camera module (not shown), etc. The camera module is located in the screen housing 11 to enable the camera module to be assembled on the screen component 1 .

[0082] Continuing with Figure 1 , the body 2 includes a base 21. The electronic device 100 includes a housing, which includes the base 21 and the screen housing 11. A hinge mechanism 3 is located between the screen housing 11 and the base 21. The screen housing 11 is rotatably connected to the base 21 via the hinge mechanism 3, thereby achieving a rotational connection between the screen member 1 and the body 2. Rotating the screen housing 11 allows the electronic device 100 to switch between an open and closed state.

[0083] The side of the screen housing 11 facing away from the display screen 12 forms the A side of the electronic device 100. The side of the screen member 1 provided with the display screen 12 forms the B side of the electronic device 100.

[0084] Continuing with Figure 1 , the input device on the housing 2 may include a keyboard 22. The keyboard 22 includes a language input module, a numeric input module, and a symbol input keyboard 22. The keyboard 22 is mounted on the side of the housing 21 facing the display screen 12, thereby facilitating assembly of the keyboard 22 on the housing 21. Users can operate on the keyboard 22, facilitating user input when using the electronic device 100.

[0085] In addition to the keyboard 22, the input device on the housing 2 may also include a touchpad 23. As another input module for the electronic device 100, the touchpad 23 may also be mounted on the side of the housing 21 facing the display screen 12 to issue commands to the electronic device 100 or input data. The touchpad 23 may be located on the side of the housing 21 away from the hinge mechanism 3, so that when the user is using the electronic device 100, the touchpad 23 is close to the user, making it easier for the user to use the touchpad 23.

[0086] The side of the base 21 on which the keyboard 22 and the touchpad 23 are provided constitutes the C side of the electronic device 100 , and the side of the base 21 opposite to the keyboard 22 or the touchpad 23 constitutes the D side of the electronic device 100 .

[0087] Figure 2 shows a schematic diagram of the internal structure of a body 2 of an electronic device 100. As shown in Figure 2, the electronic device 100 also has a circuit board 4. The circuit board 4 can be arranged in the base 21 to realize the installation of the circuit board 4 in the body 2. The circuit board 4 includes a circuit board body 41 (not marked) and a large number of electronic components. For the convenience of the description below, the length direction of the circuit board body 41 is defined as the X direction, the width direction of the circuit board body 41 is defined as the Y direction, and the thickness direction of the circuit board body 41 is defined as the Z direction. A large number of electronic components (not shown in the figure) are usually provided on the circuit board body 41 to realize the control function of the circuit board 4 on the electronic device 100. For example, the circuit board 4 can be connected to the display screen 12 to realize the display control function of the display screen 12.

[0088] A large number of electronic devices include processors, memories, and electrical connectors. For example, processors may include a central processing unit (CPU), an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, a display processing unit (DPU), and the like.

[0089] The processor (e.g., central processing unit 42) can be electrically connected to the display screen 12 via an electrical connector on the circuit board body 41, so that signals between the processor and the display screen 12 can be transmitted between the processor and the display screen 12, thereby realizing the display control function of the processor on the display screen 12. The electrical connector can be an electrical connection socket, etc.

[0090] The memory can be used to store computer executable program code and data (such as audio data, phone book) created during the use of the electronic device 100. The executable program code includes instructions. The memory can include a high-speed random access memory or a non-volatile memory. For example, the high-speed random access memory can include a double data rate synchronous dynamic random access memory (DDR, referred to as random access memory 43). For example, the non-volatile memory can include a flash memory.

[0091] The processor and the memory are electrically connected to each other to enable signal transmission between the processor and the memory. For example, when the processor (such as the central processing unit 42) is electrically connected to the memory, not only can the memory store instructions or data that have just been used or are recycled by the processor, but the processor can also execute various functional applications and data processing of the electronic device 100 by running the instructions stored in the memory.

[0092] In addition to the processor, memory, and electrical connector, the circuit board 4 also carries electronic components such as a power management module and a charging management module.

[0093] Because at least most processors are heat-generating devices, they generate a significant amount of heat during operation. For example, processors such as the central processing unit 42, graphics processor, and application processor are heat-generating devices that generate a significant amount of heat during operation. Therefore, when electronic components are laid out on the circuit board 4, the processors and other heat-generating devices are centrally arranged so that they can be dissipated by the heat dissipation system within the housing 2, thereby ensuring normal operation of the electronic device 100.

[0094] The area on the circuit board body 41 where the processor is centrally arranged is called the core area 44 of the circuit board 4. The heat dissipation system may include active heat sinks and passive heat sinks. Passive heat sinks may include heat pipes, heat spreaders, etc. Passive heat sinks are mainly used to be arranged on heating devices, passively absorbing heat from the heating devices to achieve heat dissipation of the heating devices. Active heat sinks may include fans 5. The fans 5 can carry away the heat from the passive heat sinks, thereby achieving continuous heat dissipation of the heating devices by the passive heat sinks. The fans 5 are usually arranged on the side of the circuit board body 41. The number of fans 5 can be two. The core area 44 of the circuit board 4 can be located in the area of ​​the circuit board body 41 between the two fans 5.

[0095] As a core component of the electronic device 100, the circuit board 4 plays an important role in the electronic device 100. The performance of the circuit board 4 directly affects the performance of the electronic device 100.

[0096] Figure 3 schematically shows the local structure of the first circuit board in the related art in the core area 44. As shown in Figure 3, the circuit board body 41a is a circuit board on which the circuit board 4a carries electronic devices. Under the premise of ensuring the signal transmission between the electronic devices carried on the circuit board 4a, and limited by the production cost of the electronic device 100, the circuit board body 41a in the circuit board 4a is mostly set as a signal hole. The signal hole in the circuit board body 41a is a signal via. The signal between the electronic devices carried on the circuit board 4a can be transmitted through the signal hole. The signal via can be a metal via on the circuit board body 41a. The metal via can be understood as a through hole on the circuit board body 41a plated with conductive metal. For example, the conductive metal can be copper or the like.

[0097] For example, referring to FIG3 , in order to facilitate the electrical connection between the random access memory 43 and the central processing unit 42 , the random access memory 43 is also arranged in the core area 44 (not marked), and signal transmission between the central processing unit 42 and the random access memory 43 can be achieved through the signal hole on the circuit board 4 .

[0098] Continuing with FIG3 , the CPU 42 may include a substrate 421, a chip 422, and an encapsulation layer 423. The chip 422 is soldered to the substrate 421. The encapsulation layer 423 is encapsulated on the outside of the chip 422 and the substrate 421. The substrate 421 is soldered to the circuit board body 41a via a plurality of first connecting portions 45. The first connecting portion 45 is a soldering portion. For example, the soldering portion may include a solder pad and a solder ball on the solder pad. The RAM 43 may be disposed on the same surface of the circuit board body 41a as the CPU 42. The RAM 43 is soldered to the circuit board body 41a via a plurality of second connecting portions 46. The second connecting portion 46 is the soldering portion mentioned above.

[0099] The circuit board body 41a is provided with a first signal hole 411a corresponding to the first connection portion 45, and a second signal hole 412a corresponding to the second connection portion 46. The CPU 42 is electrically connected to the RAM 43 via the first connection portion 45, the first signal hole 411a, the second signal hole 412a, and the second connection portion 46, thereby achieving electrical connection between the CPU 42 and the RAM 43 and facilitating signal transmission between the CPU 42 and the RAM 43 (hereinafter referred to as the RAM signal).

[0100] The first connection portion 45 , the first signal hole 411 a , the second signal hole 412 a and the second connection portion 46 may constitute a transmission path between the central processing unit 42 and the random access memory 43 , and the transmission path is used for transmitting the random access memory signal between the central processing unit 42 and the random access memory 43 .

[0101] Figure 3 only shows one transmission path between the CPU 42 and the RAM 43, and does not limit the number of transmission paths between the CPU 42 and the RAM 43. There are multiple RAM signals. Multiple transmission paths exist between the CPU 42 and the RAM 43, so that each RAM signal can be transmitted through one transmission path. In this case, the CPU 42 can be electrically connected to the RAM 43 via multiple first connectors 45. The multiple first connectors 45 are evenly arranged on the circuit board body 41 along the periphery of the CPU 42. Each first connector 45 is correspondingly provided with a first signal hole 411, a second signal hole 412, and a second connector 46, forming multiple transmission paths between the CPU 42 and the RAM 43. Each signal transmission path is correspondingly provided with a first connector 45, a first signal hole 411, a second signal hole 412, and a second connector 46. In this application, there is no specific limit on the number of transmission paths between the CPU 42 and the RAM 43. The following further explains the transmission of random access memory signals by taking one of the transmission paths as an example.

[0102] Due to manufacturing costs for the circuit board 4a, the first signal hole 411a is typically located in a blank area on the side of the first connection portion 45 of the circuit board body 41a, and the second signal hole 412a is typically located in a blank area on the side of the second connection portion 46 of the circuit board body 41a. The first signal hole 411a is located in correspondence with and connected to the first connection portion 45, while the second signal hole 412a is connected via a working layer 413 (not shown) within the circuit board body 41a. The second signal hole 412a is also located in correspondence with and connected to the second connection portion 46, thereby enabling communication between the CPU 42 and the RAM 43 via the first connection portion 45, the first signal hole 411a, the second signal hole 412a, and the second connection portion 46.

[0103] Figure 4 schematically illustrates a partial detail of the first signal hole 411a and the second signal hole 412a of the circuit board body 41a in Figure 3 . As shown in Figure 4 , the conventional circuit board body 41a includes a multi-layer stack of working layers 413. The working layers 413 include a top layer and a bottom layer of copper located on the circuit board body 41a. The working layers 413 also include an intermediate layer located on the circuit board body 41a. For example, the intermediate layer can be a circuit layer, etc. Adjacent working layers 413 are insulated from each other. Signal holes extend through each working layer 413. Each first signal hole 411a can be connected to a second signal hole 412a via the intermediate layer within the circuit board body 41a.

[0104] When the random access memory signal is transmitted in the first signal hole 411 a , it only passes through a portion of the working layer 413 of the circuit board body 41 a in the first signal hole 411 , and the first signal hole 411 a may be too long.

[0105] The working layer 413, through which the random access memory signal does not pass, will form a stub in the first signal hole 411a. The stub will reflect the high-speed signal in the first signal hole 411a, causing the quality of the high-speed signal to deteriorate. For example, in some examples, a high-speed signal can be understood as a signal with a rate greater than 2G. In some examples, the rate of a high-speed signal can also be defined by other conditions (such as a rate greater than 5G). In this application, a signal with a rate greater than 2G is used as an example of a high-speed signal to further illustrate the electronic device 100.

[0106] The RAM signal is a high-speed signal. Therefore, the residual pile seriously deteriorates the quality of the RAM signal, causing the RAM 43 rate to be unable to increase to the maximum rate supported by the electronic device 100, limiting the performance improvement of the circuit board 4a.

[0107] Similarly, when the random access memory signal is transmitted in the second signal hole 412a, since the random access memory signal only passes through part of the working layer 413 of the circuit board body 41a in the second signal hole 412a, the working layer 413 that the random access memory signal does not pass through will form a stub in the second signal hole 412a, which will cause the quality of the random access memory signal to deteriorate.

[0108] FIG5 illustrates a partial schematic diagram of the core area 44 (not shown) of the second circuit board provided in the related art. The difference between the second circuit board 4 and the first circuit board (circuit board 4a) in FIG3 is that, as shown in FIG5 , the random access memory 43 in the second circuit board (circuit board 4b) is soldered to the side of the circuit board body 41a opposite to the central processing unit 42 through the second connecting portion 46. In other words, the random access memory 43 and the central processing unit 42 are arranged on different surfaces on the circuit board body 41a. Similarly, when the random access memory 43 and the central processing unit 42 are arranged on different surfaces on the circuit board body 41a, the two technical problems existing in the first circuit board 4 (circuit board 4a) will also exist, resulting in the deterioration of the quality of the random access memory signal.

[0109] 3 and 5 illustrate conventional arrangements of an existing random access memory 43 on a circuit board body 41. In this conventional arrangement, the spacing between adjacent second connection portions 46 of the circuit board body 41a is large enough to accommodate the arrangement of the second signal hole 412a on the circuit board body 41a.

[0110] Figure 6 illustrates a partial schematic diagram of a circuit board assembly in the related art. Figure 6 illustrates an unconventional arrangement of a conventional random access memory 43 on a circuit board body 41a. As shown in Figure 6, compared to the first circuit board (circuit board 4a) and the second circuit board (circuit board 4b) mentioned above, the number of second connecting portions 46 between the random access memory 43 and the circuit board body 41a is increased, and the spacing between adjacent second connecting portions 46 is smaller.

[0111] As described above, the second signal holes 412a are generally disposed in the blank area of ​​the circuit board body 41a beside the second connection portion 46. When the spacing between adjacent second connection portions 46 is smaller, there will be insufficient space between adjacent second connection portions 46 on the circuit board body 41a to provide the second signal holes 412a.

[0112] Therefore, referring to Figure 6, in an unconventional setting, the random access memory 43 is connected to the circuit board body 41a via the adapter plate 7a. The second connecting portion 46 can be located between the adapter plate 7a and the random access memory 43. The circuit board body 41a is connected to the adapter plate 7a via the third connecting portion 47. The third connecting portion 47 is the welding portion mentioned above. For example, the circuit board body 41a is provided with a third connecting portion 47 corresponding to each second signal hole 412a. The second signal hole 412a is connected to the corresponding third connecting portion 47. The adapter plate 7a has a signal path (not shown) at each third connecting portion 47. The second signal hole 412a is electrically connected to the random access memory 43 via the corresponding third connecting portion 47, the signal path in the adapter plate 7a and the second connecting portion 46 to realize the transmission of the random access memory signal between the second connecting portion 46 and the second signal hole 412a.

[0113] 6 , when the RAM 43 is connected to the circuit board body 41a via the adapter plate 7a, the RAM 43 can be connected to the side of the circuit board body 41a where the CPU 42 is located. In other words, the RAM 43 and the CPU 42 can be located on the same side of the circuit board body 41a.

[0114] Considering the heat dissipation of the CPU 42 and the user experience of the electronic device 100 , when the circuit board body 41 a is disposed in the body 2 , the CPU 42 is usually disposed on the side of the circuit board body 41 a facing the D surface of the electronic device 100 .

[0115] FIG7 illustrates a partial schematic diagram of another circuit board assembly provided in the related art. Referring to FIG7 , if the RAM 43 is connected to the side of the circuit board body 41 a opposite the CPU 42 via the adapter plate 7 a, that is, the RAM 43 and the CPU 42 are arranged on different sides of the circuit board body 41 a, the RAM 43 will be oriented toward the C-side of the electronic device 100, making the RAM 43 too close to the keyboard 22.

[0116] If the thickness of the housing 2 remains constant, if the RAM 43 is too close to the keyboard 22, the distance between the RAM 43 and the keyboard 22 will not meet the design requirements of the electronic device 100. Therefore, when the RAM 43 is connected to the circuit board body 41a via the adapter plate 7a, the RAM 43 and the CPU 42 are typically arranged on the same surface of the circuit board body 41a, with the RAM 43 facing the D surface of the electronic device 100.

[0117] Similarly, when the random access memory 43 is connected to the circuit board body 41 through the adapter board 7a, the two technical problems existing in the first circuit board (circuit board 4a) will also exist, resulting in the deterioration of the quality of the random access memory signal.

[0118] In the related art, a back drilling process is usually used to remove the residual piles in the circuit board body 41a.

[0119] Taking the circuit board assembly in Figure 6 as an example, Figure 8 illustrates a schematic structural diagram of backdrilling to eliminate the residual stumps on the circuit board body 41a. Referring to Figure 8, taking the first signal hole 411a as an example, the process of backdrilling to eliminate the residual stumps in the signal hole is briefly described. Continuing to refer to Figure 8, in the backdrilling process, the size of the drill bit 8 is larger than the aperture of the first signal hole 411a, and the drill bit 8 can be located at the end (the unused end) of the circuit board body 41a where the residual stump is generated in the first signal hole 411a. By drilling the circuit board body 41a with the drill bit 8, the residual stump generated in the first signal hole 411a can be eliminated. Similarly, the residual stump generated in the second signal hole 412a can also be eliminated through the backdrilling process.

[0120] However, the backdrilling process cannot be widely used in electronic devices 100 such as laptop computers. The specific reasons include three points.

[0121] The first point is that due to the limited alignment accuracy of the existing drill bit 8 on the signal hole on the circuit board body 41a, the size of the drill hole formed by the drill bit 8 on the circuit board body 41a will be larger than the preset drill hole size. In order to prevent the drill bit 8 from damaging the working layer 413 of the circuit board body 41a on the side of the drill hole during the drilling process, it is necessary to increase the distance between the signal hole and the surrounding working layer 413 in the initial setting of the circuit board body 41a. This will cause the drill bit 8 to require a larger space on the circuit board body 41a during the back drilling process. When a larger space is required on the circuit board body 41 during the back drilling process, the area of ​​the circuit board 4 in the core area 44 will be too large. Since the size of the core area 44 of the circuit board needs to be coupled with the size of the passive heat sink, and the electronic device 100 requires the size of the circuit board in the core area 44 to be as small as possible, this will cause the use of the back drilling process to be contrary to the requirements of the electronic device 100.

[0122] Continuing with FIG8 and in conjunction with FIG6 , the second point is that when backdrilling requires increasing the distance between the signal holes and the peripheral working layer 413, the distance between adjacent signal holes in the circuit board body 41a increases. For example, when the distance between two adjacent first signal holes 411a increases, some of the first signal holes 411a shift toward the side of the RAM 43 along the width direction (Y direction) of the circuit board body 41a. This, in turn, shifts the RAM 43 along the Y direction toward a side away from the CPU 42. This increases the design area required for the RAM 43 on the circuit board body 41, placing the RAM 43 further away from the CPU 42.

[0123] When the RAM 43 is far away from the CPU 42 , the insertion loss of the RAM signal will increase, and the quality of the RAM signal will deteriorate.

[0124] The third point is that an additional back-drilling process is required during the manufacturing process of the circuit board body 41 a , which will increase the manufacturing cost of the circuit board.

[0125] In summary, the backdrilling process cannot be widely used in electronic devices 100 such as laptop computers. The problem of deterioration of the RAM signal quality caused by the residual stubs and the RAM 43 and the CPU 42 has not been effectively solved.

[0126] To this end, an embodiment of the present application provides a circuit board assembly. Figure 9 shows a schematic structural diagram of the first circuit board assembly of the present application. As shown in Figure 9, by adding a connecting plate 6 to the circuit board assembly, the first electronic device 48 can utilize the first signal hole 411 on the circuit board body 41, and realize conduction with the second electronic device 49 through the connecting plate 6, so as to realize the transmission of the signal between the first electronic device 48 and the second electronic device 49 (referred to as the second electronic device signal). At the same time, the second electronic device signal can fully utilize (100% utilize) the first signal hole 411 during the transmission process, thereby avoiding the generation of residual piles in the first signal hole 411. Therefore, the circuit board assembly of the present application does not require a backdrilling process, so that the second electronic device 49 is close to the first electronic device 48, while improving the quality of the signal between the first electronic device 48 and the second electronic device 49 and ensuring that the performance of the second electronic device 49 is better utilized, it effectively solves the technical problems brought about by the backdrilling process.

[0127] The first electronic device 48 may include a processor. For example, the first electronic device 48 may include a central processing unit 42, etc. The second electronic device 49 may include a memory. For example, the second electronic device 49 may include a random access memory 43 (DDR) or other memory with high-speed signals. By introducing the connecting plate 6 in the circuit board assembly, no stubs are generated in the first signal hole 411, and the second electronic device 49 can be placed close to the first electronic device 48, which can improve the quality of the random access memory signal and the performance of the random access memory 43, so that the rate of the random access memory 43 can be increased to the maximum rate supported by the electronic device 100, ensuring that the performance of the random access memory 43 is better utilized, thereby improving the performance of the circuit board assembly.

[0128] Therefore, when the first electronic device 48 is a central processing unit 42 and the second electronic device 49 is a random access memory 43, the present application can effectively solve technical problems such as the core area 44 of the circuit board 4 being too large and the random access memory 43 being far away from the central processing unit 42 caused by the backdrilling process.

[0129] It should be noted that, in addition to the memory, the second electronic device 49 may also include other electronic devices within the electronic device 100. For example, the second electronic device 49 may also include a connector. The connector is configured to connect to the display screen 12. This allows the display screen 12 to be electrically connected to the first electronic device 48 via the connector, thereby improving the signal quality of the second electronic device and enhancing the connection performance between the circuit board assembly and the display screen 12.

[0130] The structure of the circuit board assembly of the present application is further described below by taking the first electronic device 48 as the central processing unit 42 and the second electronic device 49 as the random access memory 43 as an example.

[0131] The circuit board assembly of the present application is arranged in the housing of the electronic device to realize the assembly of the circuit board assembly in the electronic device while improving the performance of the circuit board assembly and reducing the production cost of the circuit board assembly. Specifically, the circuit board assembly can be arranged in the base 21 of the body 2.

[0132] Continuing with FIG9 , the circuit board assembly includes a circuit board 4. The circuit board 4 includes a circuit board body 41 and a first electronic device 48. The first electronic device 48 is located on the circuit board body 41. The circuit board body 41 has signal holes. The signal holes include a first signal hole 411. The circuit board assembly also includes a connecting board 6. The connecting board 6 is located on the side of the circuit board body 41 opposite the first electronic device 48 and is electrically connected to the first electronic device 48 through the first signal hole 411, thereby enabling the transmission of the second electronic device signal between the first electronic device 48 and the connecting board 6 through the first signal hole 411.

[0133] The circuit board assembly also includes a second electronic device 49. The second electronic device 49 is electrically connected to the connecting board 6. Since the connecting board 6 is electrically connected to the first electronic device 48, when the second electronic device 49 is electrically connected to the connecting board 6, the first electronic device 48 and the second electronic device 49 are electrically connected via the connecting board 6 and the first signal hole 411, enabling transmission of the second electronic device signal between the first electronic device 48 and the second electronic device 49.

[0134] Since the connecting plate 6 is located on the side of the circuit board body 41 opposite to the first electronic device 48, the signal of the second electronic device 49 is transmitted within the circuit board body 41 and can completely pass through the first signal hole 411 when passing through the first signal hole 411, thereby achieving full utilization (100% utilization) of the first signal and no residual piles will be generated in the first signal hole 411, thereby avoiding the quality of the second electronic device signal from being deteriorated due to the residual piles, thereby improving the quality of the second electronic device signal.

[0135] Due to the introduction of the connecting plate 6, the first signal hole 411 will not produce residual piles. The circuit board assembly of the present application does not require a backdrilling process, nor does it need to increase the distance between the first signal hole 411 and the peripheral working layer 413 in the circuit board body 41. Therefore, the circuit board assembly of the circuit board 4 of the present application does not have the problem of the circuit board 4 being too large in the core area 44 and the increase in the design area required for the second electronic device 49.

[0136] Compared with the first circuit board 4, the second circuit board 4, the first circuit board assembly and the second circuit board assembly mentioned above, the circuit board assembly of the present application makes the second electronic device 49 closer to the first electronic device 48, which can reduce the insertion loss of the second electronic device signal and improve the quality of the random access memory signal.

[0137] Therefore, the circuit board assembly of the present application can ensure that the performance of the second electronic device 49 is better utilized, thereby improving the performance of the second electronic device 49 and the circuit board assembly.

[0138] Continuing with Figure 9 , the circuit board body 41 has a first surface and a second surface in the thickness direction. That is, the first surface and the second surface are two opposing surfaces of the circuit board body 41 in the thickness direction. The thickness direction of the circuit board body 41 can be referred to as the Z direction, which is perpendicular to the Y direction mentioned above. The second surface faces the keyboard 22 of the electronic device 100. Since the first surface and the second surface are two opposing surfaces on the circuit board body 41, the second surface is away from the keyboard 22. In this case, the second surface faces the D surface of the electronic device 100.

[0139] The first electronic device 48 is disposed on the first surface, and the connecting plate 6 is disposed on the second surface, such that the connecting plate 6 is located on the side of the circuit board body 41 opposite the first electronic device 48, thereby ensuring that the connecting plate 6 can be electrically connected to the first electronic device 48 through the first signal hole 411. Furthermore, because the first electronic device 48 is disposed on the first surface, the circuit board assembly of the present application does not change the location of the first electronic device 48 on the circuit board body 41, thereby facilitating heat dissipation from the first electronic device 48 while ensuring a good user experience of the electronic device 100.

[0140] Continuing to refer to Figure 9, the connecting board 6 is a high-density interconnector (HDI) board. A first signal path 61 is provided in the connecting board 6. The first end of the first signal path 61 is connected to the first electronic device 48 through the first signal hole 411, and the second end of the first signal path 61 is connected to the second electronic device 49. When the second electronic device signal is transmitted in the first signal path 61, the connecting board 6 does not generate any stubs at the first signal path 61. In this way, the connecting board 6 realizes the conduction between the first electronic device 48 and the second electronic device 49 through the first signal path 61, so as to ensure that the first electronic device 48 and the second electronic device 49 are electrically connected, and at the same time, the first signal hole 411 and the first signal path 61 can be fully utilized to transmit the second electronic device signal, and no stubs will be generated in the first signal hole 411 and the first signal path 61, so as to further improve the quality of the second electronic device signal.

[0141] To prevent the second electronic device signal from generating stubs within first signal hole 411, a high-density interconnect board could be used for circuit board body 41. However, this would result in excessively high production costs for the circuit board assembly. Compared to using a high-density interconnect board for circuit board body 41, the connection board 6 is smaller, being merely a small board disposed on circuit board body 41. Therefore, the provision of the connection board 6 in this application reduces the production costs of the circuit board assembly by eliminating the need for a high-density interconnect board for the entire circuit board body 41, while preventing the second electronic device signal from generating stubs within first signal hole 411.

[0142] Continuing with FIG9 , a first conductive portion 414 is provided between the first electronic device 48 and the circuit board body 41. The first electronic device 48 is connected to the first end of the first signal hole 411 via the first conductive portion 414. A second conductive portion 415 is provided between the connecting plate 6 and the circuit board body 41. The second end of the first signal hole 411 is connected to the first end of the first signal path 61 via the second conductive portion 415. The first conductive portion 414 and the second conductive portion 415 enable electrical connection between the first electronic device 48 and the first end of the first signal path 61. When the second end of the first signal path 61 is electrically connected to the second electronic device 49, electrical connection between the first electronic device 48 and the second electronic device 49 is achieved, thereby enabling transmission of the second electronic device signal between the first electronic device 48 and the second electronic device 49.

[0143] Without the connection plate 6, the first signal hole 411 corresponding to the outer first conductive portion 414 would need to be moved along the Y direction to the outside of the first electronic device 48 to reserve sufficient routing channels between the inner first conductive portion 414 and the corresponding first signal hole 411. This would result in a larger signal fan-out area S0 of the first electronic device 48, causing the second electronic device 49 to move away from the first electronic device 49 along the Y direction, resulting in a greater distance between the second electronic device 49 and the first electronic device 48, and greater signal insertion loss in the second electronic device.

[0144] The first electronic device 48 has a first projection area on the circuit board body 41. The signal fan-out area S0 of the first electronic device 48 can be understood as the area of ​​the first signal hole 411 on the circuit board body 41 that exceeds the first projection area.

[0145] Thanks to the introduction of the connecting plate 6, the first conductive portion 414 can be directly connected to the first end of the first signal hole 411. The connecting plate 6 can be directly connected to the second end of the first signal hole 411 on the back side of the circuit board body 41. The circuit board 4 is used to route the second electronic device signal between the first electronic device 48 and the second electronic device 49, eliminating the need to move part of the first signal hole 411 outside the first electronic device 48. This reduces the signal fan-out area S0 of the first electronic device 48, further shortens the distance between the first electronic device 48 and the second electronic device 49, and brings the second electronic device 49 closer to the first electronic device 48, further reducing the insertion loss of the signal between the first electronic device 48 and the second electronic device 49, thereby improving the quality of the second electronic device signal.

[0146] It should be noted that the first electronic device 48 is connected to the first signal hole 411 via the first conductive portion 414. The structure of the first conductive portion 414 will be described below and will not be repeated here.

[0147] There are multiple welding parts between the first electronic device 48 and the circuit board body 41. The welding parts may include solder balls or solder pads. For ease of description, the welding parts between the first electronic device 48 and the circuit board body 41 are referred to as second welding parts. Multiple first welding parts can be evenly arranged between the first electronic device 48 and the circuit board body 41. The first welding parts may include solder balls or solder pads. Some of the multiple first welding parts are connected to the connecting plate 6, and the other parts can be connected to other electronic devices on the circuit board 4. The first welding part connected to the connecting plate 6 forms a first conductive part 414, so that the first electronic device 48 and the first end of the first signal hole 411 can be connected using the first welding part.

[0148] Multiple soldering portions are provided between the connecting plate 6 and the circuit board body 41. For ease of description, these soldering portions are referred to as second soldering portions. These multiple second soldering portions can be evenly distributed between the connecting plate 6 and the circuit board body 41. Similarly, the second soldering portions connected to the connecting plate 6 form a second conductive portion 415, thereby connecting the second end of the first signal hole 411 to the first end of the first signal path 61.

[0149] Continuing with Figure 9 , the first electronic device 48 has a first projection area on the circuit board body 41. The projection of the connecting plate 6 on the circuit board body 41 overlaps the first projection area with a first overlap area S1. The first signal hole 411 can be located in the first overlap area S1, making the signal fan-out area S0 of the first electronic device 48 zero, thereby minimizing the insertion loss of the second electronic device signal and improving the signal quality of the second electronic device.

[0150] It should be noted that, while reducing the signal insertion loss of the second electronic device, the first signal hole 411 may also be partially located outside the first projection area.

[0151] Since the first signal hole 411 is located within the first conductive portion 414, the process for forming the first signal hole 411 is relatively complex. Therefore, the first signal hole 411 of the present application can be located to the side of the first conductive portion 414 and directly connected to the first signal hole 411. This can achieve the connection between the first conductive portion 414 and the first signal, simplify the process for forming the first signal hole 411, and reduce the production cost of the circuit board assembly.

[0152] There are multiple first conductive portions 414. Each first conductive portion 414 is provided with a first signal hole 411 and a second conductive portion 415. The connecting board 6 is provided with a first signal path 61 at each second conductive portion 415. At this point, multiple transmission paths are formed between the first electronic device 48 and the second electronic device 49. Each transmission path includes a first conductive portion 414, a first signal hole 411, a second conductive portion 415, and a first signal path 61. Each transmission path transmits a second electronic device signal, which improves the signal transmission rate while preventing mutual interference between the second electronic device signals.

[0153] The structure of the circuit board assembly is further explained below using a transmission path as an example.

[0154] Figure 10 illustrates a schematic structural diagram of a connection board 6. As shown in Figure 10 , the connection board 6 includes multiple stacked conductive circuit layers 62. The conductive circuit layers 62 may be conductive metal layers. For example, the conductive circuit layers 62 may be copper layers. The multiple conductive circuit layers 62 are stacked, and adjacent conductive circuit layers 62 are insulated from each other. The number of conductive circuit layers 62 in the high-density interconnect board is at least four. Specifically, the connection board 6 also includes an insulating layer 63. Insulating layers 63 may be provided between adjacent conductive circuit layers 62 to insulate the adjacent conductive circuit layers 62 from each other.

[0155] Continuing with FIG. 10 , at least two conductive circuit layers 62 located in the middle of the connecting plate 6 form a core plate unit 64 of the connecting plate 6 . The connecting plate 6 also includes a conductive portion 65 . The conductive portion 65 can be made of a conductive metal. For example, the conductive portion 65 can be made of copper or the like. Adjacent conductive circuit layers 62 located to the sides of the chip 422 unit are interconnected via the conductive portions 65 , thereby achieving interconnection between adjacent conductive circuit layers 62 .

[0156] When making the connection board 6, the conductive circuit layers 62 in the core board unit 64 can be pre-pressed, and then conductive vias are set in the pressed core board unit 64. This allows signals to be interconnected through the conductive vias between adjacent conductive circuit layers 62 in the core board unit 64, while also allowing signals to be transmitted through the conductive vias within each conductive circuit layer 62 in the core board unit 64. The conductive vias in the core board unit 64 form signal buried vias 66 in the connection board 6.

[0157] Figure 11 shows a schematic structural diagram of another connecting plate 6. When there are at least two layers of conductive circuit layers 62 on any side of the core plate unit 64, the multiple conductive circuit layers 62 on any side of the core plate unit 64 can be pressed layer by layer on the side of the core plate unit 64. Specifically, the core plate unit 64 has a first side 641 and a second side 642 in the thickness direction. The core plate unit 64 can be parallel to the Z direction in the thickness direction. The first side 641 of the core plate unit 64 is set toward the top of the connecting plate 6, and the second side 642 of the core plate unit 64 is set toward the bottom of the connecting plate 6. The conductive circuit layer 62 located on the first side 641 of the core plate unit 64 can form the top area of ​​the connecting plate 6. The conductive circuit layer 62 located on the second side 642 of the core plate unit 64 can form the bottom area of ​​the connecting plate 6.

[0158] Laser holes (not shown) are provided in adjacent conductive circuit layers 62 connected by the conductive portion 65. The material forming the conductive portion 65 can be filled in the laser holes of the adjacent conductive circuit layers 62 by a process such as electroplating to form the conductive portion 65.

[0159] The connecting plate 6 has a plurality of conductive parts 65. According to the positions of the conductive parts 65, for the convenience of description, the conductive parts 65 are defined as a first conductive part 651, a second conductive part 652, a third conductive part 653, a fourth conductive layer and a fifth conductive part 655.

[0160] A first conductive portion 651 is provided between adjacent conductive circuit layers 62 in the top region to interconnect adjacent conductive circuit layers 62 in the top region via the first conductive portion 651. A conductive circuit layer 62 adjacent to the core panel unit 64 in the top region is interconnected with the conductive circuit layer 62 on the surface of the core panel unit 64 via the second conductive portion 652, thereby interconnecting the conductive circuit layer 62 in the top region with the first side 641 of the core panel unit 64.

[0161] A third conductive portion 653 is provided between adjacent conductive circuit layers 62 in the bottom region to interconnect adjacent conductive circuit layers 62 in the bottom region through the third conductive portion 653. A conductive circuit layer 62 adjacent to the core panel unit 64 in the bottom region is interconnected with the conductive circuit layer 62 located on the surface of the core panel unit 64 via the fourth conductive portion 654, thereby interconnecting the conductive circuit layer 62 in the bottom region with the second side 642 of the core panel unit 64.

[0162] The manufacturing process of the high-density interconnection board can be found in the relevant description in the prior art, and will not be further described here.

[0163] The number of conductive circuit layers 62 in the core panel unit 64 is N. N is an even number, greater than or equal to 2. The number of conductive circuit layers 62 in the top region and the bottom region is a. a is greater than or equal to 1. The number of conductive circuit layers 62 in the bottom region is the same as the number of conductive circuit layers 62 in the top region.

[0164] The model number of the connecting board 6 can typically be represented by a+N+a. a can also represent the lateral compression of the core board unit 64, and can also be understood as the order of the connecting board 6. The total number of conductive circuit layers 62 in the connecting board 6 is the sum of N and 2a. In the electronic device 100, the connecting board 6 typically utilizes a high-density interconnect board with eight or ten layers of conductive circuit layers 62.

[0165] The structure of the connection board 6 is further described below by taking a ten-layer high-density interconnect board as an example.

[0166] When the model number of the connection board 6 is 1+8+1, it means that the connection board 6 is a 10-layer, 1-stage high-density interconnection board. When the model number of the connection board 6 is 2+6+2, it means that the connection board 6 is a 10-layer, 2-stage high-density interconnection board. When the model number of the connection board 6 is 3+4+3, it means that the connection board 6 is a 10-layer, 3-stage high-density interconnection board. When the model number of the connection board 6 is 4+3+4, it means that the connection board 6 is a 10-layer, 4-stage high-density interconnection board.

[0167] When the connection board 6 is a 10-layer, 1-stage high-density interconnect board (as shown in FIG10 ), the number of conductive circuit layers 62 in the core board unit 64 is large, and the length of the signal buried vias 66 in the connection board 6 is long.

[0168] The connection board 6 in Figure 11 is a 10-layer 2-stage high-density interconnection board. As shown in Figure 11 , compared with a 10-layer 1-stage high-density interconnection board, when the connection board 6 is a 10-layer 2-stage high-density interconnection board, the length of the signal buried via 66 is reduced.

[0169] FIG12 shows a schematic diagram of the structure of another connecting board 6. The connecting board 6 in FIG12 is a 10-layer 4-stage high-density interconnection board. Referring to FIG12 , in the 10-layer 4-stage high-density interconnection board, the signal buried vias 66 of the core board unit 64 extend into the conductive circuit layer 62 adjacent to the core board unit 64 in the top area and the bottom area. At this time, a layer of conductive circuit layer 62 adjacent to the core board unit 64 in the top area and the bottom area can also be regarded as part of the core board unit 64. Referring to FIG12 , compared with the 10-layer 2-stage high-density interconnection board, when the connecting board 6 is a 10-layer 4-stage high-density interconnection board, the length of the signal buried vias 66 is reduced.

[0170] Figure 13 is a schematic diagram illustrating the structure of another type of connecting board 6. The connecting board 6 in Figure 13 is a 10-layer arbitrary-order high-density interconnect board. Referring to Figure 13 , when the connecting board 6 is an arbitrary-order high-density interconnect board, adjacent conductive circuit layers 62 within a core board unit 64 are interconnected via conductive portions 65. For example, adjacent conductive circuit layers 62 within a core board unit 64 are interconnected via fifth conductive portions 655. Within an arbitrary-order high-density interconnect board, any number of conductive circuit layers 62 can be interconnected.

[0171] It can be seen that, under a certain adjustment of the total number of conductive circuit layers 62 , when the order of the connection board 6 is smaller, it is easier for residual stubs to be generated when the second electronic device signal is transmitted in the connection board 6 .

[0172] Figure 14 illustrates a schematic diagram of signal routing within a low-order high-density interconnect board. The high-density interconnect board in Figure 14 is a 10-layer, 2-order high-density interconnect board. As shown in Figure 14 , along the Z direction, the 10 conductive circuit layers 62 within the high-density interconnect board can be represented sequentially by L1, L2, L3, L4, L5, L6, L7, L8, L9, and L10. When the routing layer of the second electronic device signal within the high-density interconnect board is the L4 conductive circuit layer 62, due to the low order of the high-density interconnect board, the second electronic device signal, after passing through the conductive portions 65 between the L1 conductive circuit layer 62 and the L2 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, must then pass through the signal buried vias 66 to reach the L4 conductive circuit layer 62, resulting in residual stubs at the signal buried vias 66.

[0173] Therefore, the circuit board body 41 of the present application can include a through-hole circuit board that is pressed together in one step. Alternatively, the circuit board body 41 of the present application can also include a low-order high-density interconnect board in which signals generate stubs within the buried signal vias 66. For example, the circuit board body 41 can be a 1st-order or 2nd-order high-density interconnect board. In other words, the circuit board assembly of the present application can not only solve the stub problem of through-hole circuit boards, but also solve the stub problem of stubs in low-order high-density interconnect boards.

[0174] When the circuit board body 41 is a through-hole circuit board that is pressed together in one step, the signal hole can be a signal via in the circuit board body 41. When the circuit board body 41 is a low-order high-density interconnect board, the signal hole can be a signal buried via 66 in the circuit board body 41. Therefore, the provision of the connecting plate 6 in the present application can not only solve the problem of stubs generated by the signal via in the circuit board body 41, but also solve the problem of stubs generated by the signal buried via 66 in the circuit board body 41.

[0175] It should be noted that since the signal hole is a buried signal hole 66, the signal hole is not exposed on the surface of the circuit board body 41. At this time, when the connecting board 6 is connected to the first electronic device 48 and the second electronic device 49 through the signal hole, it also needs to rely on the conductive part 65 in the circuit board body 41.

[0176] The following describes the connection between the connecting board 6 and the first electronic device 48. When the connecting board 6 and the first electronic device 48 are in electrical contact, the first end of the first signal hole 411 of the first conductive portion 414 must be connected to the first soldering portion via the conductive portion 65 within the circuit board body 41. Similarly, the second end of the second signal hole 412 must be connected to the second conductive portion 415 via the conductive portion 65 within the circuit board body 41.

[0177] The structure of the circuit board assembly of the present application is further described below by taking the circuit board body 41 as a through-hole circuit board (the signal hole is a signal via) as an example.

[0178] FIG15 illustrates a schematic structural diagram of the second circuit board assembly of the present application. Referring to FIG15 , the first signal path 61 of the connecting board 6 of the present application is formed at least within the conductive portion 65 on the side of the core unit 64 of the connecting board 6 facing the circuit board body 41. This allows the conductive portions 65 interconnected between adjacent conductive circuit layers 62 to form the first signal path 61. This allows the second electronic device signal to be transmitted within the first signal path 61 while preventing the second electronic device signal from passing through useless conductive circuit layers 62 when passing through the first signal path 61, thereby preventing the generation of residual stubs.

[0179] The number of conductive portions 65 in the first signal path 61 depends not only on the position of the second electronic device 49 relative to the connection board 6, but also on the number of conductive circuit layers 62 occupied by the second electronic device signal when routing within the connection board 6. This will be further explained below with reference to specific embodiments.

[0180] Continuing with FIG. 15 , a third conductive portion 416 is provided between the second electronic device 49 and the connecting board 6 . For example, the third conductive portion 416 may be a soldering portion. The third conductive portion 416 is connected between the second end of the first signal path 61 and the second electronic device 49 . This third conductive portion 416 establishes electrical connection between the second electronic device 49 and the connecting board 6 , allowing the second electronic device signal to be transmitted between the first electronic device 48 and the second electronic device 49 .

[0181] The number of third conductive portions 416 is equal to the number of first signal pathways 61, and they correspond one to one. This allows each first signal pathway 61 of the connection board 6 to be electrically connected to the second electronic device 49 via a third conductive portion 416, thereby enabling transmission of the second electronic device signal within each transmission path. In this case, the transmission path of the second electronic device signal also includes the third conductive portion 416, following the first signal pathway 61.

[0182] 15 , the second electronic device 49 may be located on the side of the connecting plate 6 facing the first electronic device 48. The first end of the first signal path 61 and the second end of the first signal path 61 may both be formed on the side of the connecting plate 6 facing the circuit board body 41 to ensure that the first signal path 61 is electrically connected to the first electronic device 48 and the second electronic device 49.

[0183] When the second electronic device 49 is located on the side of the connecting plate 6 facing the first electronic device 48, the second electronic device 49 can be connected to the side of the circuit board body 41 where the first electronic device 48 is provided to ensure that the first electronic device 48 and the second electronic device 49 are conductive, thereby avoiding the generation of residual stubs when the second electronic device signal is transmitted in the first signal hole 411, and improving the quality of the second electronic device signal while enabling the first electronic device 48 and the second electronic device 49 to be arranged on the same surface of the circuit board body 41.

[0184] Moreover, when the first electronic device 48 and the second electronic device 49 are on the same surface of the circuit board body 41, the device height of the first electronic device 48 on the circuit board body 41 can also be utilized to achieve the setting of the second electronic device 49 on the circuit board 4 while avoiding the setting of the second electronic device 49 affecting the thickness of the circuit board assembly, thereby ensuring that the electronic device 100 has a smaller thickness.

[0185] Since the first electronic device 48 and the second electronic device 49 are on the same surface of the circuit board body 41, to facilitate electrical communication between the connecting board 6 and the second electronic device 49, the signal holes may also include a second signal hole 412. The second signal hole 412 has the same structure as the first signal hole 411. For details, please refer to the description of the first signal hole 411 above. The circuit board body 41 has a second signal hole 412 corresponding to the third conductive portion 416. In other words, the number of second signal holes 412 and third conductive portion 416 is equal, and they correspond one-to-one. The second signal hole 412 is located to the side of the third conductive portion 416 and is directly connected to the third conductive portion 416.

[0186] The first end of the second signal hole 412 is connected to the second electronic device 49, and the second end of the second signal hole 412 is connected to the third conductive portion 416. The connection between the second signal hole 412, the second electronic device 49, and the third conductive portion 416 enables electrical connection between the second electronic device 49 and the connecting board 6 while achieving full utilization (100% utilization) of the second signal hole 412. This prevents the generation of residual stubs when the second electronic device signal is transmitted within the second signal hole 412, further improving the quality of the second electronic device signal.

[0187] Continuing with FIG. 15 , a fourth conductive portion 417 is provided between the second electronic device 49 and the circuit board body 41. For example, the fourth conductive portion 417 may be a soldering portion. The second electronic device 49 can be connected to the first end of the second signal hole 412 via the fourth conductive portion 417, thereby establishing a connection between the second electronic device 49 and the first end of the second signal hole 412 and thereby achieving electrical communication between the second electronic device 49 and the connecting board 6. Following the third conductive portion 416, the transmission path for the second electronic device signal also includes the second signal hole 412 and the fourth conductive portion 417.

[0188] The number of fourth conductive portions 417 is equal to that of second signal holes 412, and they correspond one to one, so that each second signal hole 412 is connected to a corresponding fourth conductive portion 417. The second signal hole 412 is located beside the fourth conductive portion 417 and is directly connected to the fourth conductive portion 417.

[0189] The second electronic device 49 has a second projection area on the circuit board body 41. The projection of the connecting board 6 on the circuit board body 41 and the second projection area have a second overlapping area S2. The second signal hole 412 is located in the second overlapping area S2. This allows the second electronic device 49 to be electrically connected to the connecting board 6 through the second signal hole 412 while being positioned close to the first electronic device 48, thereby improving the signal quality of the second electronic device.

[0190] Referring again to FIG. 9 , when the intervals between the fourth conductive portions 417 are large, the second electronic device 49 may be directly connected to the first end of the second signal hole 412 through the fourth conductive portion 417 .

[0191] Figure 16 shows a schematic structural diagram of a third circuit board assembly of the present application. As shown in Figure 16 , when the spacing between the fourth conductive portions 417 is small, preventing the circuit board body 41 from providing the second signal hole 412 between adjacent fourth conductive portions 417, the circuit board assembly may further include an adapter plate 7. The second electronic device 49 may be connected to the first end of the second signal hole 412 via the adapter plate 7. This ensures that the second electronic device 49 is electrically connected to the circuit board body 41 through the adapter plate 7 while also ensuring that the second signal hole 412 is provided on the circuit board body 41.

[0192] To avoid generating stubs when the second electronic device signal is transmitted within the adapter board 7, the adapter board 7 can be an arbitrary-order high-density interconnect board. For example, the adapter board 7 can be a 4-layer arbitrary-order high-density interconnect board, a 6-layer arbitrary-order high-density interconnect board, an 8-layer arbitrary-order high-density interconnect board, a 10-layer arbitrary-order high-density interconnect board, and so on. Because adjacent conductive circuit layers 62 in an arbitrary-order high-density interconnect board are interconnected via the conductive portion 65, any number of conductive circuit layers 62 can be interconnected via the conductive portion 65. Thus, when the second electronic device signal is transmitted to the adapter board 7, the desired number of conductive circuit layers 62 can be selected within the adapter board 7 for routing according to the desired routing requirements, without generating stubs.

[0193] The second electronic device 49 can be connected to the first end of the second signal path 71 in the adapter board 7 via the fourth conductive portion 417. The second end of the second signal path 71 can be electrically connected to the first end of the second signal hole 412 via the fifth conductive portion 418. At this point, following the fourth conductive portion 417, the transmission path of the second electronic device signal also includes the second signal path 71 and the fifth conductive portion 418.

[0194] It should be noted that the conductive portion 65 through which the second electronic device signal passes in the adapter board 7 forms a second signal path 71 .

[0195] Figure 17 shows a schematic diagram of the structure of a fourth circuit board assembly. As shown in Figure 17 , when the first electronic device 48 and the second electronic device 49 are coplanar with the circuit board body 41, the second electronic device 49 can be located within the circuit board body 41. In this case, the second electronic device 49 can still be directly connected to the second end of the first signal path 61 via the third conductive portion 416, thereby achieving electrical connection between the second electronic device 49 and the second electronic device 49. This allows the second electronic device 49 to be concealed within the circuit board body 41, preventing the excessive thickness of the circuit board assembly from affecting the thickness of the electronic device 100's body 2. The thickness of the body 2 is oriented in the same direction as the thickness of the circuit board body 41, which can be seen as the Z direction.

[0196] The circuit board body 41 has a mounting hole in it, and the second electronic device 49 can be located in the mounting hole to achieve the arrangement of the second electronic device 49 in the circuit board body 41. In this case, the circuit board body 41 does not need to have a second signal hole 412.

[0197] Since the adapter board 7 is an arbitrary-order high-density interconnection board, when the second electronic device 49 can be connected to the first end of the second signal hole 412 via the adapter board 7, the adapter board 7 can be used as the connecting board 6, and the stub in the first signal hole 411 can also be eliminated without the need for an additional connecting board 6.

[0198] Continuing with FIG. 17 , the circuit board assembly may further include an isolator 9. The isolator 9 covers at least one side of the second electronic device 49 to shield the second electronic device 49 through the isolator 9, thereby preventing the second electronic device 49 from affecting other signals of the electronic device 100. For example, when the second electronic device 49 is a random access memory (DDR) 43, the isolator 9 can shield the noise generated by the second electronic device 49 during operation from affecting the wireless network communication (WiFi) signal of the electronic device 100.

[0199] The isolation member 9 may include an isolation cover or an isolation plate. For example, the isolation cover may be a metal isolation cover, and the isolation plate may be copper foil, aluminum foil, or a smaller high-density interconnect board. When the isolation plate is a high-density interconnect board, the wiring space of the circuit board assembly can be increased. The isolation cover can shield multiple sides of the second electronic device 49. The isolation plate can shield the side of the second electronic device 49 away from the connecting plate 6. When the isolation cover or the isolation plate are made of the same material and have the same thickness, the isolation cover has a better isolation effect on the second electronic device 49 than the isolation plate.

[0200] By setting the isolation cover or isolation plate of the isolation member 9, the second electronic device 49 can be shielded while the structure of the isolation member 9 can be made more diversified to adapt to the design requirements of the circuit board assembly for the isolation member 9 in different scenarios.

[0201] For example, when the second electronic device 49 protrudes from the side of the circuit board body 41 facing the first electronic device 48, an isolation cover can be used to cover the outer side of the second electronic device 49. The isolation cover can be connected to the connecting plate 6 or the circuit board body 41 by welding or other means to achieve the assembly and fixation of the isolation cover in the circuit board assembly.

[0202] For example, when the second electronic component 49 does not protrude from the side of the circuit board body 41 facing the first electronic component 48, an isolation plate can be used to block the side of the second electronic component 49 away from the connecting plate 6. The isolation plate can be connected to the circuit board body 41 by welding or other means to achieve assembly and fixation of the isolation plate in the circuit board assembly.

[0203] When the first electronic device 48 and the second electronic device 49 are arranged on the same surface of the circuit board body 41, in order to achieve electrical connection between the first electronic device 48 and the second electronic device 49 through the connecting board 6, and when the second electronic device signal is transmitted in the first signal path 61 in the connecting board 6 without generating residual stubs, the adjacent conductive circuit layers 62 in the core board unit 64 of the connecting board 6 are interconnected through the conductive portion 65. In other words, the connecting board 6 can adopt any order of high-density interconnection board. Therefore, the second electronic device signal can be routed in the required number of conductive circuit layers 62 in the adapter board 7 according to its own routing requirements in the connecting board 6, so that the connecting board 6 can transmit the second electronic device signal without generating residual stubs. The conductive portion 65 through which the second electronic device signal passes in the connecting board 6 forms the first signal path 61.

[0204] The following takes the example of the second electronic device 49 occupying three conductive circuit layers 62 in the connection board 6 at any level of 10 layers when routing in the connection board 6 to further illustrate a transmission path of the second electronic device signal.

[0205] Figure 18 illustrates a first schematic diagram of the routing of the second electronic device signal within the connecting board 6, when the first electronic device 48 and the second electronic device 49 are arranged on the same surface of the connecting board 6. Figure 18 shows two conductive groups 67. Each conductive group 67 includes multiple conductive portions 65 connecting various conductive circuit layers 62 within the same region of the connecting board 6. For a 10-layer connecting board 6 of any order, each conductive group 67 includes nine conductive portions 65 arranged sequentially along the Z direction.

[0206] As shown in FIG18 , along the Z direction, the ten conductive circuit layers 62 within the connection board 6 are represented by L1, L2, L3, L4, L5, L6, L7, L8, L9, and L10, respectively. Assume that the second electronic device signal requires routing on three conductive circuit layers 62 within the connection board 6 , and that these three conductive circuit layers 62 are located on layers L3, L5, and L7 within the connection board 6 , respectively.

[0207] Continuing to refer to Figure 18, when the second electronic device signal is routed in the L3 conductive circuit layer 62, the second electronic device signal can pass through the conductive group 67 on the left in the conductive parts 65 between the L1 conductive circuit layer 62 and the L2 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, and then routed in the L3 conductive circuit layer 62, and then pass through the conductive group 67 on the right in the conductive parts 65 between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L1 conductive circuit layer, and then be transmitted to the second electronic device 49.

[0208] First signal path 61 is formed at conductive portion 65, through which the second electronic device signal passes within connecting board 6. In addition to conductive portion 65, first signal path 61 also includes a trace for the second electronic device signal on conductive circuit layer 62, layer L3. The second electronic device signal can also be transmitted along first signal path 61 to first electronic device 48.

[0209] FIG19 illustrates a second schematic diagram of the routing of the second electronic device signal within the connecting board 6 when the first electronic device 48 and the second electronic device 49 are disposed on the same surface of the connecting board 6. Referring to FIG19 , when the second electronic device signal is routed on the L5 conductive circuit layer 62, the difference from the routing of the second electronic device signal on the L3 conductive circuit layer 62 is that, after passing through the conductive portion 65 between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, the second electronic device signal continues to sequentially pass through the conductive portions 65 between the L3 conductive circuit layer 62 and the L4 conductive circuit layer 62, and between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62, and then, after routing on the L5 conductive circuit layer 62, the second electronic device signal sequentially passes through the four conductive portions 65 of the right conductive group 67 along the transmission direction shown in FIG19 before being transmitted to the second electronic device 49. At this time, in addition to the conductive portion 65 , the first signal path 61 also includes the routing of the second electronic device signal on the conductive circuit layer 62 of the L5 layer.

[0210] FIG20 illustrates a third schematic diagram of the routing of the second electronic device signal within the connecting board 6 when the first electronic device 48 and the second electronic device 49 are disposed on the same surface of the connecting board 6. Referring to FIG20 , when the second electronic device signal is routed on the L7 conductive circuit layer 62, the difference from the routing of the second electronic device signal on the L5 conductive circuit layer 62 is that, after passing through the conductive portion 65 between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62, the second electronic device signal continues to sequentially pass through the conductive portions 65 between the L5 conductive circuit layer 62 and the L6 conductive circuit layer 62, and between the L6 conductive circuit layer 62 and the L7 conductive circuit layer 62, in the conductive group 67 on the left. After routing on the L7 conductive circuit layer 62, the second electronic device signal then sequentially passes through the six conductive portions 65 in the conductive group 67 on the right along the transmission direction shown in FIG20 before being transmitted to the second electronic device 49. At this time, in addition to the conductive portion 65 , the first signal path 61 also includes the routing of the second electronic device signal on the L7 conductive circuit layer 62 .

[0211] From the above, it can be seen that no stubs are generated when the second electronic device signal passes through the first signal path 61 of the connecting board 6 .

[0212] It should be noted that when the routing of the second electronic device signal within adapter board 7 is relatively simple, a low-order high-density interconnect board can be used for connection board 6, and similarly, no stubs will be generated. For example, when the routing of the second electronic device signal within adapter board 7 exists only on the surface conductive circuit layer 62, a first-order high-density interconnect board can be used for connection board 6.

[0213] FIG21 illustrates a schematic structural diagram of the fifth circuit board assembly of the present application. Referring to FIG21 , in some embodiments, the second electronic device 49 may also be located on a side of the connecting plate 6 away from the first electronic device 48, so that the second electronic device 49 and the first electronic device 48 are arranged on different sides of the circuit board body 41. In this case, the first end of the first signal path 61 is formed on the side of the connecting plate 6 facing the circuit board body 41, and the second end of the first signal path 61 is formed on the side of the connecting plate 6 facing the second electronic device 49, so that the second electronic device 49 and the first electronic device 48 are connected through the first signal path 61, allowing the second electronic device signal to be transmitted between the first electronic device 48 and the second electronic device 49.

[0214] Continuing to refer to FIG. 21 , the second electronic device 49 can be connected to the second end of the signal path of the connecting board 6 through the third conductive portion 416 , so as to achieve conductive connection between the second electronic device 49 and the first electronic device 48 .

[0215] FIG22 illustrates a schematic structural diagram of the sixth circuit board assembly of the present application. Referring to FIG22 , if the height of the circuit board assembly toward the C-surface of the electronic device 100 permits, when the second electronic device 49 is connected to the circuit board body 41 via the adapter board 7, and when the adapter board 7 is a high-density interconnect board of any order, the adapter board 7 can also serve as the connecting board 6, thus eliminating the stub in the first signal hole 411 and eliminating the need for an additional connecting board 6, thereby simplifying the structure of the circuit board assembly.

[0216] When the second electronic device 49 can also be located on the side of the connecting plate 6 away from the first electronic device 48, the isolation member 9 can be an isolation cover. When the isolation cover is arranged on the outside of the second electronic device 49, it can be connected to the connecting plate 6 or the circuit board body 41 by welding or other means to realize the assembly and fixation of the isolation member 9 in the circuit board assembly.

[0217] While the second electronic device 49 can also be located on the side of the connecting board 6 away from the first electronic device 48, the connecting board 6 can be a high-density interconnect board of any order. This allows the second electronic device signal to be routed through the desired number of conductive circuit layers 62 within the adapter board 7, based on its routing requirements within the connecting board 6. This allows the connecting board 6 to transmit the second electronic device signal without generating any residual stubs.

[0218] The following also takes the connection board 6 as an example of a 10-layer arbitrary-order high-density interconnection board to further illustrate a transmission path of the second electronic device signal.

[0219] Figure 23 illustrates a first schematic diagram of routing of the second electronic device signal within the connecting board 6 when the first electronic device 48 and the second electronic device 49 are disposed on different sides of the connecting board 6. It is also assumed that the second electronic device signal needs to occupy three conductive circuit layers 62 within the connecting board 6 for routing, and that the three conductive circuit layers 62 occupied by the second electronic device signal are located on layers L3, L5, and L7 within the connecting board 6, respectively.

[0220] Continuing to refer to Figure 23, when the second electronic device signal is routed in the L3 conductive circuit layer 62, the second electronic device signal can pass through the conductive group 67 on the left in sequence through the conductive parts 65 between the L1 conductive circuit layer 62 and the L2 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, and then routed in the L3 conductive circuit layer 62, and then pass through the 7 conductive parts 65 in the conductive group 67 on the right in sequence to reach the L10 conductive circuit layer 62, and be transmitted to the second electronic device 49.

[0221] First signal path 61 is formed at conductive portion 65, through which the second electronic device signal passes within connecting board 6. In addition to conductive portion 65, first signal path 61 also includes a trace for the second electronic device signal on conductive circuit layer 62, layer L3. The second electronic device signal can also be transmitted along first signal path 61 to first electronic device 48.

[0222] FIG24 illustrates a second schematic diagram of the routing of the second electronic device signal within the connecting board 6 when the first electronic device 48 and the second electronic device 49 are disposed on different surfaces of the connecting board 6. Referring to FIG24 , when the second electronic device signal is routed on the L5 conductive circuit layer 62, the routing is different from the routing of the second electronic device signal on the L3 conductive circuit layer 62 in that, after passing through the conductive portion 65 between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, the second electronic device signal continues to pass through the conductive portions 65 between the L3 conductive circuit layer 62 and the L4 conductive circuit layer 62, and between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62, and then, after routing on the L5 conductive circuit layer 62, the second electronic device signal sequentially passes through the five conductive portions 65 in the right conductive group 67 before reaching the L10 conductive circuit layer 62 and transmitting to the second electronic device 49. In addition to the conductive portion 65 , the first signal path 61 also includes a routing of the second electronic device signal on the conductive circuit layer 62 of the L5 layer.

[0223] FIG25 illustrates a third schematic diagram of routing the second electronic device signal within the connecting board 6 when the first electronic device 48 and the second electronic device 49 are disposed on different surfaces of the connecting board 6. Referring to FIG25 , when the second electronic device signal is routed on the L7 conductive circuit layer 62, the difference from routing the second electronic device signal on the L5 conductive circuit layer 62 is that, after passing through the conductive portion 65 between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62, the second electronic device signal continues to pass through the conductive portions 65 between the L5 conductive circuit layer 62 and the L6 conductive circuit layer 62, and between the L6 conductive circuit layer 62 and the L7 conductive circuit layer 62, and then, after routing on the L7 conductive circuit layer 62, it sequentially passes through the three conductive portions 65 in the right conductive group 67 before reaching the L10 conductive circuit layer 62 and transmitting to the second electronic device 49. In addition to the conductive portion 65 , the first signal path 61 also includes a routing of the second electronic device signal on the L7 conductive circuit layer 62 .

[0224] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0225] In the description of this application, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, display structure, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or are inherent to these processes, methods, products or apparatuses.

[0226] The term "and / or" as used herein is simply a description of an association between related objects, indicating that three possible relationships exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, or B exists alone. Additionally, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0227] Unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this application based on specific circumstances.

[0228] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board having a circuit board body and a first electronic device, wherein the first electronic device is located on the circuit board body; the circuit board body has a signal hole, wherein the signal hole includes a first signal hole; a connecting board, located on a side of the circuit board body opposite to the first electronic device and electrically connected to the first electronic device through the first signal hole; A second electronic component is electrically connected to the connection board.

2. The circuit board assembly according to claim 1, wherein: The connection board is a high-density interconnection board, and has a first signal path in the connection board. A first end of the first signal path is connected to the first electronic device through the first signal hole, and a second end of the first signal path is connected to the second electronic device. When the signal between the second electronic device and the first electronic device is transmitted in the first signal path, the connection board does not generate a stub at the first signal path.

3. The circuit board assembly according to claim 2, wherein: A first conductive portion is provided between the first electronic component and the circuit board body, and the first electronic component is connected to the first end of the first signal hole through the first conductive portion; a second conductive portion is provided between the connecting plate and the circuit board body, and the second end of the first signal hole is connected to the first end of the first signal path through the second conductive portion.

4. The circuit board assembly according to claim 3, wherein: The first signal hole is located on a side of the first conductive portion.

5. The circuit board assembly according to claim 3, wherein: There are a plurality of first conductive portions, and each first conductive portion is correspondingly provided with the first signal hole and the second conductive portion; The connecting board is provided with the first signal path correspondingly at each of the second conducting portions.

6. The circuit board assembly according to claim 2, wherein: A third conductive portion is provided between the second electronic component and the connecting board, and the third conductive portion is connected between the second end of the first signal path and the second electronic component.

7. The circuit board assembly according to claim 6, wherein: The second electronic device is located on a side of the connecting board facing the first electronic device; the first end of the first signal path and the second end of the first signal path are both formed on a side of the connecting board facing the circuit board body.

8. The circuit board assembly according to claim 7, wherein: The second electronic component is connected to a side of the circuit board body where the first electronic component is provided.

9. The circuit board assembly according to claim 8, wherein: The signal hole further includes a second signal hole, and the circuit board body has the second signal hole at a position corresponding to the third conductive portion; A first end of the second signal hole is connected to the second electronic device, and a second end of the second signal hole is connected to the third conductive portion.

10. The circuit board assembly according to claim 9, wherein: A fourth conductive portion is provided between the second electronic component and the circuit board body, and the second electronic component is connected to the first end of the second signal hole through the fourth conductive portion.

11. The circuit board assembly according to claim 9, wherein: It also includes an adapter board, and the second electronic device is connected to the first end of the second signal hole through the adapter board.

12. The circuit board assembly according to claim 9, wherein: The second electronic component has a second projection area on the circuit board body; The projection of the connecting plate on the circuit board body and the second projection area have a second overlapping area; the second signal hole is located in the second overlapping area.

13. The circuit board assembly according to claim 7, wherein: The second electronic component is located in the circuit board body.

14. The circuit board assembly according to claim 6, wherein: The second electronic device is located on a side of the connecting board away from the first electronic device; The first end of the first signal path is formed on a side of the connecting plate facing the circuit board body, and the second end of the first signal path is formed on a side of the connecting plate facing the second electronic device.

15. The circuit board assembly according to claim 6, wherein: The number of the third conducting portions is equal to the number of the first signal paths and corresponds one to one.

16. The circuit board assembly according to any one of claims 2 to 15, characterized in that: The connecting plate includes a conductive portion and a plurality of stacked conductive circuit layers, wherein adjacent conductive circuit layers are insulated from each other; At least two conductive circuit layers located in the middle layer of the connecting plate form a core plate unit of the connecting plate, and adjacent conductive circuit layers located on the sides of the core plate unit are interconnected through the conductive parts; The first signal path is formed at least at the conductive portion of the core board unit on a side facing the circuit board body.

17. The circuit board assembly according to claim 16, wherein: Adjacent conductive circuit layers in the core plate unit are interconnected through the conductive parts.

18. The circuit board assembly according to any one of claims 1 to 15, characterized in that: The signal hole includes a signal via hole or a signal buried hole on the circuit board body.

19. The circuit board assembly according to any one of claims 1 to 15, characterized in that: The first electronic component has a first projection area on the circuit board body; The projection of the connecting plate on the circuit board body and the first projection area have a first overlapping area; the first signal hole is located in the first overlapping area.

20. The circuit board assembly according to any one of claims 1 to 15, wherein: The circuit board body has a first surface and a second surface in the thickness direction, and the second surface faces the keyboard of the electronic device; The first electronic component is arranged on the first surface, and the connecting board is arranged on the second surface.

21. The circuit board assembly according to any one of claims 1 to 15, characterized in that: It also includes an isolation member, which blocks at least one side of the second electronic device.

22. The circuit board assembly according to claim 21, wherein: The isolation member includes an isolation cover or an isolation plate.

23. The circuit board assembly according to any one of claims 1 to 15, characterized in that: The first electronic device includes a processor, and the second electronic device includes a memory.

24. An electronic device, characterized in that: The invention comprises a housing and a circuit board assembly according to any one of claims 1 to 23, wherein the circuit board assembly is located in the housing.

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