Chuck, prober having same, and wafer test system

Abstract

The present invention addresses the problem of providing a chuck that can achieve a more uniform temperature distribution on an upper surface thereof. This problem is solved by a chuck, wherein a cooling layer includes a heat exchange layer, an introduction layer, and a discharge layer. The heat exchange layer has therein a first space expanding in a horizontal direction, the introduction layer has therein a second space expanding in the horizontal direction, and the discharge layer has therein a third space expanding in the horizontal direction. The chuck also comprises a flow channel α that connects the second space and the first space and can move a refrigerant introduced into the second space to the inside of the first space, and a flow channel β that connects the first space and the third space and can move the refrigerant inside the first space to the inside of the third space. The refrigerant is introduced into the second space of the introduction layer from the outside, passes through the flow channel α, and moves to the inside of the first space of the heat exchange layer, after which the refrigerant moves to the inside of the third space of the discharge layer, and is then discharged to the outside.

Description

Chuck, prober and wafer test system having the same

[0001] The present invention relates to a chuck, a prober and a wafer test system having the same.

[0002] For example, in the semiconductor manufacturing process, various processes are performed on a semiconductor wafer to form multiple chip-shaped semiconductor devices. Each semiconductor device on the wafer is inspected for electrical characteristics, and then separated using a dicer to remove any defective semiconductor chips.

[0003] The electrical characteristics are tested using a wafer test system consisting of a prober and a tester. The prober has a chuck for holding a wafer on which multiple semiconductor chips are formed, and a probe card holder for holding a probe card with multiple probes that contact the electrode pads of the semiconductor chips and connect the electrode pads to terminals of the tester. When the probes are brought into contact with the electrode pads of the semiconductor chip, the terminals of the tester are connected to the electrode pads of the semiconductor chip. The tester supplies power and signals to the semiconductor chip to operate it, and the tester detects the output from the semiconductor chip to perform an operational test.

[0004] Depending on the specifications, semiconductor devices may be required to operate not only at room temperature but also at high or low temperatures, so the chuck has a heating mechanism (such as a heater) and a cooling mechanism, which keep the chuck at a predetermined temperature while inspecting the wafer held on the chuck.

[0005] Here, it is preferable that the temperature distribution on the top surface of the chuck that comes into contact with the wafer be as uniform as possible, since non-uniform temperature distribution on the top surface of the chuck may result in a deterioration in inspection quality.

[0006] An object of the present invention is to provide a chuck that can achieve a more uniform temperature distribution on its upper surface, and a prober and wafer test system that include the same.

[0007] The present inventors have conducted extensive research to solve the above problems and have completed the present invention, which comprises the following (1) to (10). (1) A chuck having a structure in which an upper heating layer and a lower cooling layer are stacked, and capable of maintaining a wafer held on the upper surface at a predetermined temperature, the cooling layer including a heat exchange layer, an introduction layer, and a discharge layer, the heat exchange layer having a first space therein extending horizontally, the introduction layer being located below the heat exchange layer, having a second space therein extending horizontally, and having an introduction flow path or an introduction hole for introducing a coolant into the second space from the outside, the discharge layer having a third space therein extending horizontally, and having a discharge flow path or a discharge hole for discharging the coolant in the third space to the outside, and further comprising: a flow path α connecting the second space and the first space, and capable of moving the coolant introduced into the second space into the first space; and a flow path β connecting the first space and the third space, and capable of moving the coolant in the first space into the third space. (2) The chuck according to (1) above, wherein the cooling layer includes the heat exchange layer, the introduction layer, and the exhaust layer stacked in this order in the cooling layer. (3) The chuck according to (1) above, wherein the introduction layer is located directly below the heat exchange layer, the second space of the introduction layer is not connected to any flow paths other than the introduction flow path and the flow path α, and does not have any holes other than the introduction hole, a hole serving as the flow path α is formed in the upper surface of the second space, or the flow path α is formed passing through the upper surface of the second space, and when the second space is filled with the refrigerant introduced from the outside, the refrigerant that has passed through the flow path α moves into the first space.(4) The chuck according to any one of (1) to (3) above, wherein the discharge layer is present directly below the introduction layer, the introduction layer has pillars extending from its lower surface to its upper surface inside the second space, and through-holes are formed in the pillars, forming at least a part of the flow path β. (5) The chuck according to any one of (1) to (4) above, wherein a groove connecting the outlet of the flow path α and the inlet of the flow path β is formed inside the heat exchange layer, the groove constituting a part of the inner surface forming the first space, and the refrigerant that has flowed into the heat exchange layer from the flow path α flows to the flow path β via the groove. (6) The chuck according to any one of (1) to (5) above, wherein the third space of the discharge layer is not connected to any flow paths other than the discharge flow path and the flow path β, and does not have any holes other than the discharge hole. (7) The chuck according to any one of (1) to (6) above, further comprising a pipe having one end located outside the introduction layer, extending into the second space of the introduction layer, and having a plurality of nozzle holes on its outer surface, wherein the coolant introduced from the one end of the pipe travels through the pipe, is discharged from the nozzle holes of the pipe into the second space of the introduction layer, and is stored inside the second space. (8) A chuck having a structure in which an upper heating layer and a lower cooling layer are stacked, and capable of maintaining a wafer held on an upper surface at a predetermined temperature, wherein the cooling layer has an internal space extending horizontally, and comprises a pipe having one end located outside the cooling layer, extending into the space of the cooling layer, and having a plurality of nozzle holes on its outer surface, wherein the coolant introduced from the one end of the pipe travels through the pipe, is discharged from the nozzle holes of the pipe into the space of the cooling layer, and is stored inside the space. (9) A prober having the chuck according to any one of (1) to (8) above. (10) A wafer test system having the prober according to (9) above.

[0008] According to the present invention, it is possible to provide a chuck that can make the temperature distribution on the upper surface more uniform, and a prober and wafer test system that have the same.

[0009] FIG. 1 is a schematic perspective view of a first chuck of the present invention. FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1. FIG. 3 shows an exploded view of the first chuck of the present invention, illustrating the top surfaces of each layer (each component). FIG. 4 shows an exploded view of the first chuck of the present invention, illustrating the bottom surfaces of each layer (each component). FIG. 5 is a schematic perspective view showing pipes present inside the cooling layer (particularly the introduction layer). FIG. 6 is a schematic partial cross-sectional view illustrating the flow of refrigerant in the first chuck of the present invention. FIG. 7 is a schematic cross-sectional view of a second chuck of the present invention cut along the vertical direction.

[0010] The present invention will be described. The present invention includes two aspects of a chuck. The first chuck of the present invention is a chuck having a structure in which an upper heating layer and a lower cooling layer are stacked, and capable of maintaining a wafer held on the upper surface at a predetermined temperature, the cooling layer including a heat exchange layer, an introduction layer, and a discharge layer, the heat exchange layer having a first space therein extending horizontally, the introduction layer being located below the heat exchange layer and having a second space therein extending horizontally, and having an introduction flow path or an introduction hole for introducing a coolant from the outside into the second space, and the discharge layer having a third space therein extending horizontally, and having an exhaust flow path or an exhaust hole for exhausting the coolant from the third space to the outside. The chuck further includes a flow path α that connects the second space and the first space and that can move the refrigerant introduced into the second space into the first space, and a flow path β that connects the first space and the third space and that can move the refrigerant in the first space into the third space, wherein the refrigerant is introduced from the outside into the second space of the introduction layer, passes through the flow path α, moves into the first space of the heat exchange layer, and cools the wafer and / or the heating layer, and then moves into the third space of the discharge layer and is discharged to the outside.

[0011] The second chuck of the present invention is a chuck having a structure in which an upper heating layer and a lower cooling layer are stacked, and is capable of maintaining a wafer held on its upper surface at a predetermined temperature, wherein the cooling layer has a space therein that extends horizontally, one end of which is located outside the cooling layer, and a pipe that extends into the space held by the cooling layer and has a plurality of nozzles on its outer surface, and the refrigerant introduced from the one end of the pipe travels within the pipe and is released from the nozzles of the pipe into the space held by the cooling layer and is stored within the space.

[0012] The first chuck of the present invention will be described with reference to the drawings. Fig. 1 is a schematic perspective view of the first chuck of the present invention, and Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1. Figs. 3 and 4 show the first chuck of the present invention in an exploded state, with Fig. 3 showing the top surface of each layer (each member) and Fig. 4 showing the bottom surface of each layer (each member). Fig. 5 is a schematic perspective view showing pipes present inside the cooling layer (particularly the introduction layer). Fig. 6 is a schematic partial cross-sectional view illustrating the flow of refrigerant in the first chuck of the present invention.

[0013] 1 to 6 show preferred embodiments of the first chuck of the present invention, and the first chuck of the present invention is not limited to the embodiments shown in the figures. Similarly, FIG. 7 shows a preferred embodiment of the second chuck of the present invention, and the second chuck of the present invention is not limited to the embodiment shown in FIG. 7. For example, although an example in which the upper surface (3s) of the heating layer 3 is horizontal is given below, the upper surface (3s) of the heating layer 3 can also be used so that it is not horizontal (for example, vertical). Furthermore, in the first chuck and the second chuck of the present invention described below, the pipe (pipe 50) is two pipes that form concentric circles and are connected in the radial direction by two linear pipes, but the pipe in the first chuck and the second chuck of the present invention is not limited to this embodiment.

[0014] 1 to 6, the first chuck 1 of the present invention has a structure in which an upper heating layer 3 and a lower cooling layer 4 are stacked. A wafer can be held on the upper surface 3s. The holding means is not particularly limited and may be, for example, a conventionally known means. Specifically, for example, suction holes are provided on the upper surface 3s of the heating layer 3, and the suction holes are connected to suction means such as a vacuum, and the wafer can be held on the upper surface 3s by suction using this means. Means such as suction holes are not shown in FIGS. 1 to 7.

[0015] The heating layer 3 is not particularly limited as long as it includes a means capable of heating the wafer held on its upper surface 3s, and the means may be, for example, a conventionally known means. Specifically, for example, it may include a planar heater.

[0016] The first chuck 1 of the present invention can maintain a wafer held on the upper surface 3s of the heating layer 3 at a predetermined temperature by heating with the heating layer 3 and cooling with the cooling layer 4. Semiconductor devices are required to operate not only at room temperature but also at high temperatures (e.g., about 200°C) or low temperatures (e.g., about −60°C) according to their specifications. The first chuck 1 of the present invention can adjust the temperature of the held wafer to a desired temperature within a range of, for example, 200 to −60°C.

[0017] As the refrigerant, for example, brine, which is a secondary refrigerant used in the indirect refrigeration method, or a conventionally known inert fluorine-based inert liquid (such as Fluorinert) can be used.

[0018] The cooling layer 4 includes a heat exchange layer 21, an introduction layer 23, and a discharge layer 25. These are stacked in this order. During use, the layers are arranged in the order of discharge layer 25, introduction layer 23, and heat exchange layer 21 from bottom to top in the vertical direction, with the top surface 3s horizontal. In the first chuck of the present invention, the cooling layer includes a heat exchange layer, an introduction layer, and a discharge layer, and it is preferable that these are stacked in this order. However, they do not have to be stacked in this order. For example, the cooling layer may be stacked in the order of heat exchange layer, discharge layer, and introduction layer.

[0019] The first zipper 1 of the present invention shown in FIGS. 1 to 6 includes an upper lid 11, a heat exchange section 13, an inlet section 15, a discharge section 17, and a lower lid 19, which are stacked together. The upper lid 11 and the heat exchange section 13 are stacked together to form a heat exchange layer 21 having a first space 211 extending horizontally therein. The inlet section 15 and the discharge section 17 are stacked together to form an inlet layer 23 having a second space 231 extending horizontally therein, surrounded by the upper surface of the discharge section 17 and the inner surface of the inlet section 15. The discharge section 17 and the lower lid 19 are stacked together to form a discharge layer 25 having a third space 251 extending horizontally therein, surrounded by the upper surface of the lower lid 19 and the inner surface of the discharge section 17. It is preferable that the first space 211, the second space 231, and the third space 251 all extend horizontally during use. That is, the first zipper 1 of the present invention is preferably arranged such that the first space 211, the second space 231, and the third space 251 are spread out in the horizontal direction when in use.

[0020] The introduction layer 23 will now be described. As described above, the introduction layer 23 is located below the heat exchange layer 21. In the first chuck 1 of the present invention shown in FIGS. 1 to 6, the introduction layer 23 is located directly below the heat exchange layer 21, and the introduction layer 23 and the heat exchange layer 21 are adjacent to each other. The introduction layer 23 also has a second space 231 therein that extends horizontally.

[0021] The chuck has a pipe 50 as an introduction flow path for introducing a coolant from the outside into the second space 231. In a mode in which the first chuck of the present invention does not have an introduction flow path such as a pipe, the coolant may be introduced from the outside into the second space 231 through an introduction hole connecting the outside and the inside of the second space 231 instead of through an introduction flow path.

[0022] As shown in FIGS. 1 to 4 , one end 51 of the pipe 50 is located outside the introduction layer 23 and extends into the second space 231 of the introduction layer 23. It is preferable that the pipe 50 has a small portion that contacts the wall surface that defines the second space 231 within the second space 231. In this case, the temperature distribution on the upper surface of the heating layer 3 becomes more uniform. In the first chuck 1 of the present invention shown in FIGS. 3 to 5 , the pipe 50 is configured as two concentric pipes connected in the radial direction by two linear pipes. As shown in FIG. 5 , the refrigerant introduced into the pipe 50 from one end 51 flows through the pipe 50 in the direction of the arrow. The refrigerant is then released into the second space 231 of the introduction layer 23 from multiple ejection holes 53 formed on the outer surface of the pipe 50. At least a portion of the refrigerant is then stored within the second space 231. As shown in FIG. 5 , the pipe 50 preferably has a circular portion. It is also preferable that the ejection holes 53 are formed approximately evenly around the circumference of the circle. In this case, the first chuck 1 of the present invention can be cooled more evenly in the horizontal direction. Furthermore, it is also preferable that the ejection holes 53 are formed at an end of the pipe 50 that is distant from the one end 51. In this case, the coolant is directly supplied to the end that is distant from the one end 51, so that the first chuck 1 of the present invention can be cooled more evenly in the horizontal direction.

[0023] The first chuck 1 of the present invention has a flow path α connecting the second space 231 and a first space 211 of the heat exchange layer 21, which will be described later. As shown in FIGS. 2 to 4 , the first chuck 1 of the present invention has a hole 153 formed therethrough from the upper surface of the introduction portion 15 to the second space 231. A slit-shaped hole 133 is also formed in the heat exchange portion 13, which will be described later, and penetrates through the thickness direction. These holes (hole 153, hole 133) are connected to each other, forming the flow path α. The second space 231 of the introduction layer 23 of the first chuck 1 of the present invention is connected only to the ejection hole 53 and the flow path α of the pipe 50, which serves as the introduction flow path described above, and is not connected to any other flow paths. Therefore, when a refrigerant is supplied from the ejection hole 53 to the second space 231 via the pipe 50, and the second space 231 is filled with the refrigerant, the refrigerant passes through the flow path α and moves to the first space 211.

[0024] 1 to 6, the first chuck 1 of the present invention has a hole 153 formed therethrough from the upper surface of the introduction portion 15 to the second space 231, but instead of a hole, a flow path may be formed that penetrates from the upper surface of the introduction portion 15 to the second space 231. Also, a flow path that does not pass through the upper surface of the introduction portion 15 but connects the second space 231 and a first space 211 of the heat exchange layer 21 (described later) may be formed, for example, on the side surface of the first chuck 1 of the present invention.

[0025] 1 to 6, the introduction layer 23 of the first chuck 1 of the present invention has support columns 159 extending from the lower surface to the upper surface inside the second space 231. Through holes are formed in the support columns 159, which form at least a part of a flow path β, which will be described later.

[0026] The heat exchange layer 21 will now be described. The heat exchange layer 21 has a first space therein that extends horizontally. As shown in FIG. 3 , the heat exchange section 13 of the first chuck 1 of the present invention has a plurality of grooves 135 formed on its upper surface. When the heat exchange section 13 and the top cover 11 are brought into close contact with each other, the grooves 135 form a space between them. In the first chuck 1 of the present invention shown as a preferred example in FIGS. 1 to 6 , the space formed by the grooves 135 corresponds to the first space 211. Note that in the embodiment shown in the figures, the surface of the heat exchange section 13 on which the grooves 135 are formed is brought into close contact with the top cover 11. However, the surface of the heat exchange section 13 on which the grooves 135 are formed may also be brought into close contact with the upper surface of the introduction section 15 (i.e., the heat exchange section 13 may be turned upside down). In this case, the grooves 135 are present between the introduction section 15 and the heat exchange section 13, and the space formed by these grooves corresponds to the first space.

[0027] The groove 135 connects the hole 133, which is the outlet of the flow path α, to the inlet of the flow path β, which will be described later.

[0028] The ejection layer 25 will now be described. The ejection layer 25 is preferably present below the introduction layer 23. In the first chuck 1 of the present invention shown in FIGS. 1 to 5, the ejection layer 25 is present directly below the introduction layer 23, and the ejection layer 25 and the introduction layer 23 are adjacent to each other. The ejection layer 25 also has a third space 251 therein that extends horizontally.

[0029] The third space 251 has a discharge flow path or a discharge hole for discharging the coolant from the inside of the third space 251 to the outside. The discharge layer 25 of the first chuck 1 of the present invention shown in Figures 1 to 5 has a straight pipe 60 as a discharge flow path.

[0030] Furthermore, the third space 251 of the discharge layer 25 is connected to the flow path β. The flow path β connects the third space 251 with the first space 211 and allows the refrigerant in the first space 211 to move into the third space 251. As described above, in the first chuck 1 of the present invention, a hole 153 is formed penetrating from the upper surface of the introduction portion 15 to the second space 231. In addition, the heat exchange portion 13 is formed with a hole 137 similar to the slit-shaped hole 133 penetrating in its thickness direction. Furthermore, a through-hole 157 is formed in a support 159 formed inside the second space 231 of the introduction layer 23. These holes (hole 153, hole 137) and the through-hole 157 are connected to form the flow path β.

[0031] In the case of the first chuck 1 of the present invention, the third space 251 of the discharge layer 25 is connected only to the discharge flow path such as the pipe 60 and the flow path β, and is not connected to any other flow paths.

[0032] The ejection layer 25 preferably has a support 257 inside the third space 251 .

[0033] The flow of the coolant in the first chuck 1 of the present invention will be described with reference to FIG. 6 . FIG. 6 is an enlarged view of a portion of FIG. 2 and is a schematic partial cross-sectional view for explaining the flow of the coolant in the first chuck of the present invention. The coolant is introduced from the outside into the second space 231 of the introduction layer 23. When the second space 231 of the introduction layer 23 is filled, the coolant passes through a flow path α formed by the hole 153 formed in the upper surface of the introduction portion 15 and the hole 133 formed in the heat exchange portion 13, and moves into the first space 211 of the heat exchange layer 21. In other words, the groove 135 formed in the upper surface of the heat exchange portion 13 is connected to the outlet of the flow path α. Here, the groove 135 corresponds to the first space 211. The coolant mainly cools the wafer and / or the heating layer 3 while remaining in the first space 211. The refrigerant then flows into flow path β, which is formed by connecting hole 153 formed in the upper surface of introduction portion 15, hole 137 formed in heat exchange unit 13, and through-hole 157 formed in support 159. In other words, groove 135 formed in the upper surface of heat exchange unit 13 is connected to the inlet of flow path β. The refrigerant that has flowed into heat exchange layer 21 from flow path α flows into flow path β via groove 135. The refrigerant then moves into third space 251 of discharge layer 25 and is discharged to the outside.

[0034] The first chuck of the present invention has been described above with reference to FIGS.

[0035] Here, the first chuck of the present invention may be an embodiment obtained by removing the pipe 50 from the first chuck of the present invention shown in FIGS.

[0036] Furthermore, the second chuck of the present invention may be an embodiment in which the heat exchange layer, the introduction layer, the discharge layer, the flow path α, and the flow path β are removed from the first chuck of the present invention shown in Figures 1 to 6. For example, as shown in Figure 7, a chuck 10 may be provided having a structure in which an upper heating layer 3 and a lower cooling layer 4 are stacked, and capable of maintaining a wafer held on an upper surface 3s at a predetermined temperature, in which the cooling layer 4 has a space 41 extending horizontally therein, one end 51 of which is located outside the cooling layer 4, a pipe 50 extending into the space 41 of the cooling layer 4, and having a plurality of ejection holes 53 on its outer surface, and the refrigerant introduced from one end 51 of the pipe 50 travels through the pipe 50, is released from the ejection holes 53 of the pipe 50 into the space 41 of the cooling layer 4, and is stored inside the space 41. Note that elements assigned the same reference numerals in Figures 1 to 6 and Figure 7 may be similar.

[0037] 1 to 7, the materials of the heating layer 3, upper lid 11, heat exchanger 13, inlet 15, outlet 17, and lower lid 19 are not particularly limited and may be made of, for example, a conventionally known material. Specifically, they may be made of metals such as aluminum, stainless steel, and copper.

[0038] Moreover, it is preferable that the upper lid 11, the heat exchange section 13, the inlet section 15, the outlet section 17, and the lower lid 19 are bonded together by, for example, diffusion bonding.

[0039] <Prober> The prober of the present invention is a prober having the first chuck of the present invention or the second chuck of the present invention. In the prober of the present invention, the parts other than the chuck are not particularly limited and may be, for example, conventionally known parts. The prober of the present invention may be in an embodiment having the first chuck of the present invention or the second chuck of the present invention and a conventionally known probe card holder that holds a probe card having a plurality of probes that contact electrode pads of a semiconductor chip and connect the electrode pads to terminals of a tester.

[0040] <Wafer Test System> The wafer test system of the present invention is a wafer test system having the prober of the present invention. The wafer test system of the present invention is not particularly limited as long as it includes the prober of the present invention. The other components may be, for example, a conventionally known tester. The tester supplies power and various test signals from terminals connected to the probes, and analyzes the signals output to the electrodes of the chip to confirm normal operation. When the probes are brought into contact with the electrode pads of the semiconductor chip, the terminals of the tester are connected to the electrode pads of the semiconductor chip, and the tester supplies power and signals to the semiconductor chip to operate it, and the tester detects the output from the semiconductor chip to perform an operation test.

[0041] This application claims priority based on Japanese Patent Application No. 2024-24229, filed February 21, 2024, the disclosure of which is incorporated herein in its entirety by reference.

[0042] DESCRIPTION OF SYMBOLS 1 First chuck of the present invention 3 Heating layer 4 Cooling layer 3s Upper surface 10 Second chuck of the present invention 11 Upper lid 13 Heat exchange section 133 Hole 137 Hole 15 Introduction section 153 Hole 157 Through hole 159 Support 17 Discharge section 19 Lower lid 21 Heat exchange layer 211 First space 23 Introduction layer 231 Second space 25 Discharge layer 251 Third space 257 Support 41 Space 50 Pipe 51 One end of pipe 53 Spout hole 60 Pipe

Claims

1. A chuck having a structure in which an upper heating layer and a lower cooling layer are stacked, and capable of maintaining a wafer held on the upper surface at a predetermined temperature, the cooling layer including a heat exchange layer, an introduction layer, and a discharge layer, the heat exchange layer having a first space therein that extends horizontally, the introduction layer being located below the heat exchange layer and having a second space therein that extends horizontally, and having an introduction flow path or introduction hole for introducing a refrigerant into the second space from the outside, the discharge layer having a third space therein that extends horizontally, and having a discharge flow path or discharge hole for discharging the refrigerant in the third space to the outside, and further comprising: a flow path α connecting the second space and the first space, and capable of moving the refrigerant introduced into the second space into the first space, and a flow path β connecting the first space and the third space, and capable of moving the refrigerant in the first space into the third space, The refrigerant is introduced from the outside into the second space of the introduction layer, passes through the flow path α, moves into the first space of the heat exchange layer to cool the wafer and / or the heating layer, and then moves into the third space of the discharge layer and is discharged to the outside.

2. The chuck according to claim 1, wherein the cooling layer comprises the heat exchange layer, the introduction layer, and the discharge layer stacked in this order.

3. The chuck according to claim 1 or 2, wherein the introduction layer is located directly below the heat exchange layer, the second space of the introduction layer is not connected to any flow paths other than the introduction flow path and the flow path α, and does not have any holes other than the introduction hole, a hole serving as the flow path α is formed in the upper surface of the second space, or the flow path α is formed passing through the upper surface of the second space, and when the second space is filled with the refrigerant introduced from the outside, the refrigerant that has passed through the flow path α moves into the interior of the first space.

4. The chuck according to any one of claims 1 to 3, wherein the discharge layer is located directly below the introduction layer, the introduction layer has a support extending from its lower surface to its upper surface inside the second space, and a through hole is formed in the support, forming at least a part of the flow path β.

5. A chuck as described in any one of claims 1 to 4, wherein a groove connecting the outlet of the flow path α and the inlet of the flow path β is formed inside the heat exchange layer, the groove constituting a part of the inner surface forming the first space, and the refrigerant that flows from the flow path α into the heat exchange layer flows to the flow path β via the groove.

6. A chuck according to any one of claims 1 to 5, wherein the third space of the discharge layer is not connected to any flow paths other than the discharge flow path and the flow path β, and does not have any holes other than the discharge hole.

7. A chuck according to any one of claims 1 to 6, further comprising a pipe having one end located outside the introduction layer, extending into the second space of the introduction layer, and having a plurality of nozzle holes on its outer surface, wherein the refrigerant introduced from the one end of the pipe travels inside the pipe, is discharged from the nozzle holes of the pipe into the second space of the introduction layer, and is stored inside the second space.

8. A prober having a chuck according to any one of claims 1 to 7.

9. A wafer test system having the prober according to claim 8.

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