Camera device and optical device

Abstract

The present invention relates to a camera device and an optical device, and comprises: a fixed part; an image sensor; a movable part including a lens arranged to face the image sensor in the optical axis direction; a tilting guide part arranged between the fixed part and the movable part; a first magnetic body arranged in the movable part; a second magnetic body which is arranged in the fixed part and generates a holding force by interaction with the first magnetic body; and a driving part which tilts the movable part on the basis of a first axis intersecting the optical axis direction or a second axis intersecting the optical axis direction and the first axis, wherein the movable part and the fixed part press the tilting guide part by the holding force, and the movable part includes a magnet and a coil which generate an electromagnetic force that moves the lens in the optical axis direction, and the holding force is 1.2 times to 25 times the electromagnetic force.

Description

Camera devices and optical instruments

[0001] The embodiment relates to a camera device and an optical device including the same.

[0002] Camera devices are devices that capture images or videos of subjects, and are installed on portable devices, drones, vehicles, etc. To improve image quality, camera devices may have image stabilization (IS) functions, such as optical image stabilizers (OIS) and autofocusing (AF), which compensate for or prevent image shaking caused by the user's movements.

[0003] The embodiment provides a camera device and an optical device capable of preventing a performance degradation of OIS operation due to tilting of an OIS moving part caused by AF driving and improving the driving force of OIS operation.

[0004] A camera device according to an embodiment includes: a fixed part; a moving part including an image sensor and a lens disposed opposite the image sensor in the direction of an optical axis; a tilting guide part disposed between the fixed part and the moving part; a first magnetic body disposed on the moving part; a second magnetic body disposed on the fixed part and generating a holding force by interaction with the first magnetic body; and a driving part tilting the moving part based on a first axis intersecting the direction of the optical axis or a second axis intersecting the direction of the optical axis and the first axis, wherein the moving part and the fixed part press the tilting guide part by the holding force, and the moving part includes a magnet and a coil generating an electromagnetic force that moves the lens in the direction of the optical axis, wherein the holding force is 1.2 times or more of the electromagnetic force and 25 times or less of the electromagnetic force.

[0005] The separation distance between the magnet and the coil may be smaller than the separation distance between the first magnetic body and the second magnetic body. The length of the magnet in the direction in which the magnet and the coil face each other may be greater than the length of the first magnetic body in the direction of the optical axis. The length of the magnet in the direction in which the magnet and the coil face each other may be greater than the length of the second magnetic body in the direction of the optical axis. The area of ​​the first surface of the magnet facing the coil may be greater than the area of ​​the first surface of the first magnetic body facing the second magnetic body. The area of ​​the first surface of the second magnetic body facing the first magnetic body may be greater than or equal to the area of ​​the first surface of the first magnetic body facing the second magnetic body. The area of ​​the first surface of the magnet facing the coil may be greater than or equal to the area of ​​the first surface of the second magnetic body facing the first magnetic body.

[0006] A camera device according to another embodiment comprises: a fixed part; a moving part including an image sensor and a lens disposed opposite the image sensor in the direction of an optical axis; a first magnet unit and a second magnet unit disposed on the moving part; a first coil for tilting the moving part about a first axis intersecting the direction of the optical axis by interaction with the first magnet unit; And a second coil that tilts the moving part based on the optical axis direction and a second axis intersecting the first axis by interacting with the second magnet unit, wherein the first coil includes a first coil unit and a second coil unit arranged to face the first magnet unit, and the second coil includes a third coil unit and a fourth coil unit arranged to face the second magnet unit, and a first driving signal is applied to the first coil unit, a second driving signal is applied to the second coil unit, a third driving signal is applied to the third coil unit, and a fourth driving signal is applied to the fourth coil unit.

[0007] The camera device may include a tilting guide portion disposed between the fixed portion and the movable portion. The camera device may include a first sensor that detects a magnetic field of the first magnet unit and outputs a first output signal; and a first control portion that receives the first output signal and generates the first driving signal and the second driving signal; a second sensor that detects a magnetic field of the second magnet unit and outputs a second output signal; and a second control portion that receives the second output signal and generates the third driving signal and the fourth driving signal.

[0008] The camera device may include a circuit board disposed on the fixing portion, and the circuit board may include first and second pads electrically connected to the first coil unit and to which the first driving signal is applied; third and fourth pads electrically connected to the second coil unit and to which the second driving signal is applied; fifth and sixth pads electrically connected to the third coil unit and to which the third driving signal is applied; and seventh and eighth pads electrically connected to the fourth coil unit and to which the fourth driving signal is applied.

[0009] The camera device may include a first sensor that detects a magnetic field of the first magnet unit and outputs a first output signal; and a first control unit that receives the first output signal, generates the first driving signal and the second driving signal, supplies the first driving signal to the first and second pads, and supplies the second driving signal to the third and fourth pads; a second sensor that detects a magnetic field of the second magnet unit and outputs a second output signal; and a second control unit that receives the second output signal, generates the third driving signal and the fourth driving signal, supplies the third driving signal to the fifth and sixth pads, and supplies the fourth driving signal to the seventh and eighth pads.

[0010] The first sensor may include a first Hall sensor that detects a magnetic field of the first magnet unit and a first driver that generates the first driving signal and the second driving signal, and the second sensor may include a second Hall sensor that detects a magnetic field of the second magnet unit and a second driver that generates the third driving signal and the fourth driving signal.

[0011] The first coil unit and the second coil unit may not be connected to each other, and the third coil unit and the fourth coil unit may not be connected to each other.

[0012] The second coil unit may be disposed between the first coil unit and the first magnet unit, and the fourth coil unit may be disposed between the third coil unit and the second magnet unit.

[0013] The first coil unit and the second coil unit may have a ring shape that overlaps each other, and the third coil unit and the fourth coil unit may have a ring shape that overlaps each other.

[0014] In the embodiment, it is possible to prevent a deterioration in the performance of OIS operation and a deterioration in the resolution of an image of a camera device due to tilting of an OIS moving part caused by AF driving.

[0015] The embodiment can increase the electromagnetic force (or Lorentz force) by the interaction between the magnet unit and the coil unit, drive a heavy, large-diameter lens module, and implement a camera device having a high resolution.

[0016] Figure 1 is a perspective view of a camera device according to an embodiment.

[0017] Figure 2a is a first exploded perspective view of the camera device of Figure 1.

[0018] Figure 2b is a second exploded perspective view of the camera device of Figure 1.

[0019] Figure 3 is a perspective view of the camera device excluding the cover member.

[0020] Fig. 4a is a cross-sectional view of the camera device in the AB direction of Fig. 3.

[0021] Fig. 4b is a cross-sectional view of the camera device in the CD direction of Fig. 3.

[0022] Fig. 4c is a cross-sectional view of the camera device in the EF direction of Fig. 3.

[0023] Fig. 4d is a cross-sectional view of the camera device in the GH direction of Fig. 3.

[0024] Figure 4e is a cross-sectional view showing a protrusion of the cover member.

[0025] Figure 5 is an exploded perspective view of the bobbin, cloud member, and magnet.

[0026] Figure 6 is an exploded perspective view of the bobbin, holder, circuit board, sensor base, and housing.

[0027] Figure 7a is a first exploded perspective view of the holder, filter, circuit board, sensor base, and magnet.

[0028] Figure 7b is a second separated perspective view of the holder, filter, circuit board, sensor base, and magnet.

[0029] Figure 7c is a perspective view of the combination of the sensor base and the circuit board.

[0030] Figure 8 is a perspective view of the holder, cloud member, coil, position sensor, circuit board, and sensor base.

[0031] Figure 9a is a front perspective view of the tilting guide part.

[0032] Figure 9b is a rear perspective view of the tilting guide part.

[0033] FIG. 9c is a front perspective view of a tilting guide part according to another embodiment.

[0034] Figure 9d is a rear perspective view of the tilting guide part of Figure 9c.

[0035] FIG. 9e is a cross-sectional view in the AB direction of FIG. 4a of a camera device including a tilting guide part according to the embodiments of FIGS. 9c and 9d.

[0036] FIG. 9f is a cross-sectional view in the CD direction of FIG. 4b of a camera device including a tilting guide part according to the embodiments of FIGS. 9c and 9d.

[0037] Figure 10a is a perspective view of the housing.

[0038] Figure 10b is an exploded perspective view of the housing, coil, magnet, position sensor, circuit board, and movement suppressor.

[0039] Figure 10c is a perspective view of the combined housing, cloud member, coil, circuit board, position sensor, magnet, and movement suppressor.

[0040] Figure 11a is a perspective view of a cover member, a sensor base, a holder, a circuit board, a magnet, a cloud member, a tilting guide member, and a reinforcing member.

[0041] Fig. 11b shows another embodiment of the reinforcing member of Fig. 11a.

[0042] Figure 12 is a perspective view of the housing, the magnet, the magnets, the movement restraint, the tilting guide, and the cloud member.

[0043] Figure 13 is a perspective view of a circuit board, a first coil, a second coil, a first control unit, and a second control unit.

[0044] Figure 14a shows the electrical connection of the first control unit, the first coil, the first sensor, and the first substrate.

[0045] Figure 14b shows the electrical connections of the second control unit, the second coil, the second sensor, and the second substrate.

[0046] Figure 15 shows the electromagnetic force between the coil and the magnet and the holding force acting between the magnetic bodies.

[0047] Figure 16a shows the separation distance between the coil and the magnet and the separation distance between the magnetic bodies.

[0048] Figure 16b shows the thickness and area of ​​the magnetic body, the thickness and area of ​​the magnet, and the thickness and area of ​​the magnetic body.

[0049] Figure 17a is a drawing for explaining the electromagnetic force and the movement of the OIS moving part according to the interaction between the magnet units and the coil units.

[0050] Figure 17b shows the movement of the OIS moving part by electromagnetic force of Figure 17a.

[0051] Fig. 18 is a perspective view of a camera device including a lens module.

[0052] Figure 19a shows the first position of the OIS moving part.

[0053] Figure 19b shows the second position of the OIS moving part.

[0054] FIG. 20 illustrates electrical connections of first to fourth coil units, a first sensor, a second sensor, and a circuit board according to another embodiment.

[0055] Figure 21a shows a perspective view of an optical device according to an embodiment.

[0056] FIG. 21b shows a perspective view of an optical device according to another embodiment.

[0057] Fig. 22 shows a schematic diagram of the optical device illustrated in Figs. 21a and 21b.

[0058] Hereinafter, embodiments of the present invention that can specifically achieve the above purpose will be described with reference to the attached drawings.

[0059] In the description of the embodiments, when it is described that each element is formed "on or under", "on or under" includes both cases where two elements are in direct contact with each other or where one or more other elements are formed by being disposed indirectly between the two elements. In addition, when it is expressed as "on or under", it can include the meaning of not only the upward direction but also the downward direction based on one element.

[0060] Additionally, relational terms such as “first” and “second,” “upper / upper / lower,” and “lower / lower / below” used hereinafter may be used only to distinguish one entity or element from another entity or element, without necessarily requiring or implying any physical or logical relationship or order between such entities or elements. In addition, the same reference numbers represent the same elements throughout the description of the drawings.

[0061] Furthermore, terms such as "include," "comprise," or "have" described above, unless specifically stated otherwise, imply that the corresponding component may be included, and thus should be interpreted to include other components rather than excluding other components. Furthermore, terms such as "corresponding" described above may include at least one of the meanings of "opposite" or "overlapping."

[0062] Hereinafter, a camera device according to an embodiment and an optical device including the same will be described with reference to the attached drawings. For convenience of explanation, the camera device according to the embodiment will be described using a Cartesian coordinate system (x, y, z), but may be described using another coordinate system, and the embodiment is not limited thereto. In each drawing, the X-axis and the Y-axis may mean a direction perpendicular to the Z-axis, which is the optical axis (OA) direction. In addition, the Z-axis direction, which is the optical axis (OA) direction, may be defined as 'any one of the first to third directions', the X-axis direction may be defined as 'another one of the first to third directions', and the Y-axis direction may be defined as 'the remaining one of the first to third directions'. For example, the optical axis direction may be a direction perpendicular to an imaging area of ​​an image sensor.

[0063] Also, the first axis can be any axis that is perpendicular to and passes through the optical axis, and the second axis can be any other axis that is perpendicular to and passes through the optical axis. The first and second axes can intersect each other. For example, the first and second axes can be perpendicular to each other. For example, the X-axis can be defined as either the first or second axis, and the Y-axis can be defined as the other of the first or second axes.

[0064] The X-axis direction can be defined as either the first-axis direction or the second-axis direction, and the Y-axis direction can be defined as the other of the first-axis direction or the second-axis direction. The optical axis direction can be the direction of the optical axis or a direction parallel to the optical axis. In addition, the optical axis can be the optical axis of a lens mounted on a lens barrel. Or, for example, the optical axis can be an axis that is perpendicular to the imaging area (or sensor surface) of the image sensor and passes through the center of the imaging area (sensor surface). In addition, the expression "terminal" hereinafter can be expressed by replacing it with a pad, an electrode, or a conductive layer.

[0065] In addition, in the embodiment, in the coupling between the protrusion and the hole for coupling two components to each other, one of the components may be a coupling protrusion (or coupling hole), and the other side may be a corresponding coupling hole (or coupling protrusion).

[0066] A camera device according to an embodiment may perform a shake correction function and an auto-focusing function. The 'shake correction function' may be a function of moving a lens in a direction perpendicular to the optical axis direction or tilting the lens with respect to the optical axis to offset vibration (or movement) caused by the user's shaking hand. In addition, the 'auto-focusing function' may be a function of automatically adjusting the focus on a subject by moving the lens in the optical axis direction according to the distance of the subject to obtain a clear image of the subject on the image sensor. Hereinafter, the "camera device" may be expressed as a "camera", an "actuator", a "camera module", a "camera", or a "photographer".

[0067] FIG. 1 is a perspective view of a camera device (200) according to an embodiment, FIG. 2a is a first exploded perspective view of the camera device (200) of FIG. 1, FIG. 2b is a second exploded perspective view of the camera device (200) of FIG. 1, FIG. 3 is a perspective view of the camera device (200) excluding the cover member (300), FIG. 4a is a cross-sectional view of the camera device (200) in the AB direction of FIG. 3, FIG. 4b is a cross-sectional view of the camera device (200) in the CD direction of FIG. 3, FIG. 4c is a cross-sectional view of the camera device (200) in the EF direction of FIG. 3, FIG. 4d is a cross-sectional view of the camera device (200) in the GH direction of FIG. 3, FIG. 4e is a cross-sectional view showing a protrusion (311) of the cover member (300), and FIG. 5 is a cross-sectional view showing a bobbin (110), a cloud member (21), and FIG. 6 is an exploded perspective view of a magnet (130), FIG. 6 is an exploded perspective view of a bobbin (110), a holder (140), a circuit board (800), a sensor base (270), and a housing (210), FIG. 7a is a first exploded perspective view of a holder (140), a filter (610), a circuit board (800), a sensor base (270), and a magnetic body (31), FIG. 7b is a second exploded perspective view of a holder (140), a filter (610), a circuit board (800), a sensor base (270), and a magnetic body (31), FIG. 7c is a combined perspective view of a sensor base (270) and a circuit board (800), FIG. 8 is a perspective view of a holder (140), a cloud member (21), a coil (120), a position sensor (170), a circuit board (800), and a sensor base (270), and FIG. 9a is a perspective view of a tilting FIG. 9 is a front perspective view of a guide part (60), FIG. 9b is a rear perspective view of a tilting guide part (60), FIG. 9c is a front perspective view of a tilting guide part (60-1) according to another embodiment, FIG. 9d is a rear perspective view of the tilting guide part (60-1) of FIG. 9c, and FIG. 9e is a cross-sectional view in the AB direction of FIG. 4a of a camera device including a tilting guide part (60-1) according to the embodiments of FIGS. 9c and 9d.FIG. 9f is a cross-sectional view in the CD direction of FIG. 4b of a camera device including a tilting guide part (60-1) according to the embodiments of FIGS. 9c and 9d. FIG. 10a is a perspective view of a housing (210), FIG. 10b is an exploded perspective view of a housing (210), a coil (230), a magnetic body (32), a position sensor (240), a circuit board (190), and a movement suppression unit (80), FIG. 10c is a combined perspective view of a housing (210), a cloud member (63), a coil (230), a circuit board (190), a position sensor (240), a magnetic body (32), and a movement suppression unit (80), FIG. 11a is a perspective view of a cover member (300), a sensor base (270), a holder (140), a circuit board (800), a magnetic body (31), a cloud member (63), a tilting guide unit (60), and a reinforcing member (70), and FIG. 12 is a perspective view of a housing (210), a magnetic body (32), a coil (230), a movement suppression unit (80), a tilting guide unit (60), and a cloud This is a perspective view of Absence (62).

[0068] Referring to FIGS. 1 to 12, the camera device (200) may include a fixed portion, an AF moving portion, an OIS moving portion (100), and a support portion. The OIS moving portion (100) may be alternatively expressed as a “moving portion,” a shaking portion, a “moving portion,” a “moving module,” or a “tilting module.”

[0069] A fixture may be a fixed element, i.e., the fixture may not move along the optical axis. Alternatively, the fixture may not move or tilt in a direction perpendicular to the optical axis. Furthermore, a component coupled to the fixture may also be a fixed element.

[0070] The fixed part may include a housing (210). The fixed part may include a cover member (300). For example, the fixed part may include a configuration that is disposed or coupled to the housing (210) or the cover member (300). For example, the fixed part may include a coil (230) disposed in the housing (210). The fixed part may include at least one of a magnetic body (32) and a movement-restraining member (80) disposed in the housing (210).

[0071] The AF moving unit can move in the direction of the optical axis with respect to the fixed unit. For example, the AF moving unit may include a bobbin (110). In another embodiment, the AF moving unit may further include a component (e.g., a magnet (130)) coupled to the bobbin (110). In another embodiment, the AF moving unit may further include a lens module (400) coupled to the bobbin (110).

[0072] The OIS moving unit (100, see FIG. 2a) can move left and right or tilt around a first axis (e.g., X-axis (e.g., Pitch)) that intersects the optical axis (or the optical axis direction) with respect to the fixed unit. In addition, the OIS moving unit can move left and right or tilt around a second axis (e.g., Y-axis (e.g., Yaw)) that intersects the optical axis (or the optical axis direction) with respect to the fixed unit. For example, the first axis can intersect the optical axis (or the optical axis direction), and the second axis can intersect the optical axis (or the optical axis direction) and the first axis. For example, the first axis can be perpendicular to the optical axis direction, and the second axis can be perpendicular to the optical axis direction and the first axis.

[0073] For example, the OIS moving unit (100) may include an AF moving unit. In addition, the OIS moving unit (100) may include an image sensor (810). The OIS moving unit (100) may include a circuit board (800) on which the image sensor (810) is placed. In addition, the OIS moving unit (100) may include a sensor base (270) on which at least a portion of the circuit board (800) is placed. In addition, the OIS moving unit (100) may include a holder (140) coupled with the sensor base (270). The OIS moving unit (100) may be expressed as a first moving unit (or first moving unit), and the AF moving unit may be expressed by replacing it with a second moving unit (or second moving unit). For example, the first moving unit may include a sensor base (270) and a circuit board (800).

[0074] For example, the OIS moving unit (100) may include a magnet (310) corresponding to, opposite to, or overlapping with the coil (230). The OIS moving unit (100) may include a configuration disposed or coupled to at least one of the holder (140), the sensor base (270), and the circuit board (800). For example, the OIS moving unit (100) may include a magnet (310) and a magnet (130) disposed on the holder (140). For example, the OIS moving unit (100) may include a magnetic body (31) disposed on the sensor base (270). For example, the OIS moving unit (100) may include at least one of an image sensor (810), a sensor (170), a coil (120), a gyro sensor (820), a circuit element (815), and a control unit (830) disposed on the circuit board (800). In another embodiment, the magnet (310) may be placed on the fixed part, and the coil (230) may be placed on the OIS moving part.

[0075] The support member can support the OIS moving member with respect to the fixed member, for example, the support member can include a tilting guide member (60). For example, the support member can include a cloud member (62, 63).

[0076] The bobbin (110) can be placed in the holder (140) to accommodate a lens or lens barrel. The bobbin (110) can also be expressed as a “lens holder”, a “lens case”, or a “lens carrier”. The bobbin (110) can move in the optical axis direction. For example, the bobbin (110) can move in a first direction (e.g., in the Z-axis direction) by the electromagnetic interaction between the coil (120) and the magnet (130). In addition, the lens module (400) can move in a first direction (e.g., in the Z-axis direction) by the electromagnetic interaction between the coil (120) and the magnet (130).

[0077] The coil (120) and magnet (130) may be an AF driving unit that moves or drives the AF moving unit. In addition, the bobbin (110) may be included in the OIS moving unit, and the bobbin (110) or lens module (400) may be tilted or rotated by a preset angle based on the first axis or the second axis.

[0078] Referring to FIG. 5, the bobbin (110) may include an opening (101) for coupling with the lens module (400). The shape of the opening (101) of the bobbin (110) may match the shape of the lens module (400) to be mounted, and may be, for example, circular, oval, or polygonal, but is not limited thereto. Although not shown in FIG. 1, the bobbin (110) may include at least one stopper disposed on at least one of the upper and lower surfaces. The stopper of the bobbin (110) may be a structure that protrudes in the first direction or the upper direction (or the lower direction) from the upper surface (or the lower surface) of the bobbin (110), and may prevent the upper surface of the bobbin (110) from directly colliding with the inner surface of the upper plate (301) of the cover member (300) (or the lower part of the holder (140). The bobbin (110) may include a seating portion (115) for seating or arranging the magnet (130). For example, the seating portion (115) may be a groove that is sunken from the outer surface of the bobbin (110).

[0079] Referring to FIG. 6, the bobbin (110) may include a plurality of side surfaces (110A to 110D) or outer surfaces. For example, the bobbin (110) may include a first side surface (110A), a second side surface (110B), a third side surface (110C), and a fourth side surface (110D). For example, the second side surface (110B) may face the first side surface (110A) or may be positioned opposite the first side surface (110A) with respect to the optical axis (OA). The third side surface (110C) and the fourth side surface (110D) may be positioned between the first side surface (110A) and the second side surface (110B). For example, the fourth side surface (110D) may face the third side surface (110C) or may be positioned opposite the third side surface (110C) with respect to the optical axis (OA). In FIG. 6, the bobbin (110) is illustrated as having four sides, but in other embodiments it may have three or five or more sides.

[0080] For example, the mounting portion (115) may be formed on the first side (110A) of the bobbin. For example, the lower portion of the mounting portion (115) may be closed without being opened to the lower surface of the bobbin (110). Additionally, the upper portion of the mounting portion (115) may be closed without being opened to the upper surface of the bobbin (110). In another embodiment, for example, the mounting portion (115) may include an opening that opens to at least one of the upper surface or lower surface of the bobbin (110).

[0081] The bobbin (110) may include a receiving portion (112) for receiving at least a portion of the cloud member (21). For example, at least a portion of the receiving portion (112) may be disposed on a first side (110A) of the bobbin (110). The receiving portion (112) may be a groove that is recessed from an outer surface of the bobbin (110) (e.g., the first side (110A)). The receiving portion (112) may also be expressed as a “receiving groove,” a “groove,” or a “guide groove.” A lubricant (e.g., grease) may be disposed within the receiving portion (112) of the bobbin (110) to reduce friction with the cloud member (21). For example, the bobbin (110) may include a first receiving portion (112A) for receiving the cloud member (21A) and a second receiving portion (112B) for receiving the cloud member (21B). For example, the mounting portion (115) may be disposed between the first receiving portion (112A) and the second receiving portion (112B). For example, the first receiving portion (112A) (or the second receiving portion (112B)) may include an opening that opens to the upper surface of the bobbin (110). In another embodiment, the upper portion of the receiving portions (112A, 112B) may be closed without opening to the upper surface of the bobbin (110). For example, the lower portion of the receiving portions (112A, 112B) may be closed without opening to the lower surface of the bobbin (110). For example, the receiving portion (112) may be formed to extend in the optical axis direction. For example, the receiving portion (112) may extend in the direction of the optical axis so as to be formed between the upper and lower surfaces of the bobbin (110). For example, when viewed from above, the shape of the receiving portion (112) may be a triangle, but is not limited thereto, and may be a polygon (e.g., a square or a pentagon, etc.). Alternatively, for example, when viewed from above, the receiving portion (112) may be a 'V' or 'U' shape.

[0082] The magnet (130) may be placed, coupled, or fixed to the bobbin (110). For example, the magnet (130) may be placed or coupled to the first side (110A) of the bobbin (110). For example, the magnet (130) may be placed within the mounting portion (115) of the bobbin (110) or coupled with the mounting portion (115). For example, the magnet (130) may be placed between the first cloud member (21A) and the second cloud member (21B). The shape of the magnet (130) may have a shape corresponding to the first side (110A) of the bobbin (110), for example, a rectangular parallelepiped shape. In another embodiment, for example, at least one of the two ends of the magnet (130) may have a tapered shape. For example, the magnet (130) may include a first side (13A) facing the coil (120) and a second side (13B) opposite the first side (13A). The first side (13A) of the magnet (130) may be exposed from the first side (110A) of the bobbin (110). In addition, the magnet (130) may be a four-pole magnet to enhance the electromagnetic force. For example, the magnet (130) may include two N poles and two S poles.

[0083] For example, the magnet (130) may include a first magnet including a north pole and a south pole, a second magnet including a south pole and a north pole, and a partition wall disposed between the first magnet and the second magnet. In this case, the partition wall may include a substantially non-magnetic portion with a section having almost no polarity, may be filled with air or made of a non-magnetic material, and may be expressed as a “neutral zone.” For example, the first magnet and the second magnet may face each other in the direction of the optical axis, and the first magnet and the second magnet may be disposed such that their polarities face each other in the direction of the optical axis. In another embodiment, the magnet (130) may be a two-pole magnet having two different polarities and a naturally formed boundary between the different polarities. For example, in another embodiment, the magnet (130) may include one north pole and one south pole.

[0084] For example, the magnet (130) may be a two-pole magnet in which the N pole and the S pole are distinguished or arranged in the direction of the optical axis. In another embodiment, the magnet (130) may be a magnet in which the N pole and the S pole are distinguished or arranged in the direction perpendicular to the optical axis. In another embodiment, the magnet (130) may be a two-pole magnet in which the N pole and the S pole are distinguished in the direction perpendicular to the optical axis.

[0085] The holder (140) may be disposed on the inside of the cover member (300). The holder (140) may include a cavity for receiving the bobbin (110). The holder (140) may include an opening (30A) corresponding to the opening (101) of the bobbin (110). For example, the opening (30A) may be a through hole or hollow for exposing at least a portion of the bobbin (110) (or the lens module (400)). In addition, for example, the opening (30A) of the holder (140) may expose an imaging area of ​​the image sensor (810). The holder (140) may also be expressed as a “housing” instead. For example, the opening (30A) may be located in the center or a central region of the holder (140). For example, the opening (30A) of the holder (140) may be a through hole or hollow that penetrates the holder (140) in the direction of the optical axis. The opening (30A) of the holder (140) may have a shape corresponding to the shape of the bobbin (110), for example, a polygon (e.g., a square or an octagon) or a circle (or an oval), but is not limited thereto and may have various shapes.

[0086] The holder (140) may include a plurality of sides (41A to 41D). The holder (140) may include a corner positioned between two adjacent sides and connecting the two adjacent sides. The holder (140) may include a first side (41A) corresponding to or opposite a first side (110A) of the bobbin (110), a second side (41B) corresponding to or opposite a second side (110B) of the bobbin (110), a third side (41C) corresponding to or opposite a third side (110C) of the bobbin (110), and a fourth side (41D) corresponding to or opposite a fourth side (110D) of the bobbin (110). The first side (41A) (or the first side or the first outer side) of the holder (140) may be positioned opposite the second side (41B) (or the second side or the second outer side) of the holder (140) with respect to the optical axis, and the third side (41C) (or the third side or the third outer side) of the holder (140) may be positioned opposite the fourth side (41D) (or the fourth side or the fourth outer side) of the holder (140) with respect to the optical axis. Each of the first to fourth side portions (41A to 41D) of the holder (140) may be arranged parallel to a corresponding one of the side plates (302) of the cover member (300).

[0087] Referring to FIGS. 7A and 7B, the holder (140) may include a mounting portion (142A) for placing the coil (120). For example, the mounting portion (142A) may be placed or formed on the first side (41A) of the holder (140). For example, the mounting portion (142A) may be a through hole penetrating the first side (41A) of the holder (140). Since the mounting portion (142A) is in the form of a through hole, a part of the holder (140) may not be interposed between the coil (120) and the magnet (130), and thus, the electromagnetic force between the magnet (130) and the coil (120) may increase. In addition, since a part of the holder (140) may not be interposed between the position sensor (170) and the magnet (130), the output of the position sensor (170) may be increased, and the sensitivity of the position sensor (170) may be improved. In another embodiment, the mounting portion (142A) may be in the form of a groove that is recessed from the outer surface (or inner surface) of the first side (41A) of the holder (140).

[0088] The holder (140) may include mounting portions (143A, 143B) for placing the magnet (310). For example, the holder (140) may include a first mounting portion (143A) for placing the first magnet unit (310A) and a second mounting portion (143B) for placing the second magnet unit (310B). For example, the first mounting portion (143A) may be placed or formed on the second side (41B) of the holder (140). For example, the first mounting portion (143A) may be a groove that is recessed from the outer surface (or inner surface) of the second side (41B) of the holder (140). For example, the second mounting portion (143B) may be placed or formed on the third side (41C) of the holder (140). For example, the second fixing portion (143B) may be a groove that is sunken from the outer surface (or outer side) of the third side (41C) of the holder (140).

[0089] In another embodiment, the first mounting portion (143A) may be a through hole penetrating the second side (41B) of the holder (140), and the second mounting portion (143B) may be a through hole penetrating the third side (41C) of the holder (140). In this case, since the mounting portions (143A, 143B) are in the form of through holes, a part of the holder (140) may not be interposed between the coil (230) and the magnet (310), and thus, the electromagnetic force between the magnet (310) and the coil (230) may increase. In addition, since a part of the holder (140) may not be interposed between the position sensor (240) and the magnet (310), the output of the position sensor (240) may be increased, and the sensitivity of the position sensor (240) may be improved.

[0090] For example, the holder (140) may include a groove (142) in which at least a portion of the circuit board (800), for example, a second substrate (802), is placed. Since at least a portion of the second substrate is placed within the groove (142) of the holder (140), the second substrate (802) and the magnetic body (82) may not protrude from the outer surface of the first side (41A) of the holder (140) or may not protrude excessively from the outer surface of the first side (41). The second substrate (802) and the magnetic body (82) may protrude less than the sum of the thicknesses of the second substrate (802) and the magnetic body (82) based on the outer surface of the first side (41A) of the holder (140). This may prevent the size of the camera device (200) from increasing in the direction perpendicular to the optical axis.

[0091] Referring to FIGS. 7A and 7B , the holder (140) may include a receiving portion (116) for arranging or receiving at least another portion of the cloud member (21). For example, at least a portion of the receiving portion (116) may be arranged on the first side (41A) of the holder (140). The receiving portion (116) may be a groove that is recessed from the inner surface of the holder (140) (e.g., the inner surface of the first side (41A)). The receiving portion (116) may also be expressed as a “receiving groove,” a “groove,” or a “guide groove.” At least a portion of the receiving portion (116) of the holder (140) may correspond to, face, or overlap with the receiving portion (112) of the bobbin (110). For example, the holder (140) may include a first receiving portion (116A) for receiving at least another portion of the first cloud member (B1, B2) and a second receiving portion (116B) for receiving at least another portion of the second cloud member (B3, B4). For example, the mounting portion (142A) of the holder (140) may be positioned between the first receiving portion (116A) and the second receiving portion (116B) of the holder (140). For example, the first receiving portion (116A) (or the second receiving portion (116B)) may include an opening that opens to the upper surface of the holder (140). In another embodiment, the upper portion of the receiving portion (116) may be closed without opening to the upper surface of the holder (140). For example, the lower portion of the receiving portion (116) may be closed without opening to the lower surface of the holder (140). For example, the receiving portion (116) may be formed to extend in the direction of the optical axis. For example, the receiving portion (116) may be formed to extend in the direction of the optical axis so as to be formed between the upper and lower surfaces of the holder (140).

[0092] For example, when viewed from above, the shape of the receiving portion (116) of the holder (140) may be a triangle, but is not limited thereto, and may be a polygon (e.g., a square or a pentagon, etc.). Or, for example, when viewed from above, the receiving portion (116) may be a 'V' or 'U' shape. For example, when viewed in the direction of the optical axis or from above, the receiving portion (116) may face or overlap with the upper plate (301) of the cover member (300). For example, at least a portion of the upper plate (301) of the cover member (300) may cover the receiving portion (116).

[0093] The camera device (200) may include a cloud member (21) disposed between the bobbin (110) and the holder (140). The cloud member (21) may be alternatively expressed as a “ball member”, a “ball”, or a “ball bearing”. At least a portion of the cloud member (21) may be in contact with the bobbin (110) and the holder (140), and may support movement of the bobbin (110) in the optical axis direction by performing a rolling motion or a rotating motion between the bobbin (110) and the holder (140). When the bobbin (110) is moved in the optical axis direction, the cloud member (21) may reduce friction between the bobbin (110) and the holder (140). For the rolling motion or rotation of the cloud member (21), the bobbin (110) may be in contact with the cloud member (21) and may slide or slide in the optical axis direction.

[0094] For example, the cloud member (21) may be made of a metal material, plastic, or resin material, but is not limited thereto. The cloud member (21) may have a circular shape and may have a diameter sufficient to support movement of the bobbin (110) in the optical axis direction. For example, the cloud member (21) may be arranged between the outer surface of the bobbin (110) and the inner surface of the holder (140). For example, the cloud member (21) may be arranged between the first side surface (110A) of the bobbin (110) and the first side portion (41A) of the holder (140). For example, the cloud member (21) may be arranged between the receiving portion (112) of the bobbin (110) and the receiving portion (116) of the holder (140). For example, at least a portion of the cloud member (21) may be in contact with the receiving portion (112) of the bobbin (110), and at least another portion of the cloud member (21) may be in contact with the receiving portion (116) of the holder (140).

[0095] The cloud member (21) may include at least one ball member. For example, the cloud member (21) may include two or more ball members (B1 to B4). For example, the cloud member (21) may include a first cloud member (21A) disposed between a first receiving portion (112A) of the bobbin (110) and a first receiving portion (116A) of the holder (140), and a second cloud member (21B) disposed between a second receiving portion (112B) of the bobbin (110) and a second receiving portion (116B) of the holder (140).

[0096] For example, the first cloud member (21A) may include at least one ball. For example, the first cloud member (21A) may include a plurality of balls (B1, B2). The second cloud member (21B) may include at least one ball. For example, the second cloud member (21B) may include a plurality of balls (B3, B4). In another embodiment, each of the first cloud member (21A) and the second cloud member (21B) may include one ball. For example, each of the first cloud member (21A) and the second cloud member (21B) may include three or more balls. For example, each of the first cloud member (21A) and the second cloud member (21B) may include a top ball located at the topmost position, a bottom ball located at the bottommost position, and at least one intermediate ball located between the top ball and the bottom ball. For example, the diameter of the top ball may be greater than the diameter of the middle ball, and the diameter of the bottom ball may be greater than the diameter of the middle ball. Furthermore, for example, the diameters of the top ball and the bottom ball may be the same. In another embodiment, the diameters of the top ball, the bottom ball, and the middle ball may be the same.

[0097] For example, each of the first cloud member (21A) and the second cloud member (21B) may include a first ball (the highest ball), a second ball (the lowest ball), and a third ball (the middle ball) arranged in the direction of the optical axis, and the diameter of the first ball may be larger than the diameter of the third ball. In addition, the diameter of the second ball may be larger than the diameter of the third ball. For example, the diameters of the first ball and the third ball may be the same. In another embodiment, the diameter of the first ball may be larger than the diameter of the second ball. In another embodiment, the diameter of the first ball may be smaller than the diameter of the second ball. In another embodiment, the diameters of the first ball, the second ball, and the third ball may be the same.

[0098] For example, the diameter of the first ball and the diameter of the second ball may each be 0.85 [mm] or more and 0.95 [mm] or less, and the diameter of the third ball may be 0.75 [mm] or more and 0.85 [mm] or less. In another embodiment, each of the first cloud member (21A) and the second cloud member (21B) may include four balls, and the diameter of the highest ball and the diameter of the lowest ball may each be 0.85 [mm] or more and 0.95 [mm] or less, and the diameter of each of the two intermediate balls may be 0.75 [mm] or more and 0.85 [mm] or less.

[0099] When viewed from above, the coil (120) and the magnet (130) can be positioned between the first cloud member (21A) and the second cloud member (21B). This is to improve the reliability of auto-focusing by stably supporting the bobbin (110) without the bobbin (110) tilting and moving when the bobbin (110) moves in the optical axis direction.

[0100] In another embodiment, each of the first ball member (21A) and the second ball member (21B) may be in the form of a shaft or a roller. Alternatively, another embodiment may include a sliding member (e.g., a shaft or a roller) instead of the ball members (21A, 21B).

[0101] The camera device (200) may include a magnetic body (82) corresponding to, opposite to, or overlapping with the coil (120) and the magnet (130). For example, the magnetic body (82) may be arranged to correspond to, opposite to, or overlap with the magnet (130) in a second direction. Also, for example, the magnetic body (82) may be arranged to correspond to, opposite to, or overlap with the coil (120) in a second direction.

[0102] An attractive force may be applied between the magnetic body (82) and the magnet (130). For example, an attractive force may be applied between the magnetic body (82) and the magnet (130) in a direction perpendicular to the optical axis (or a second direction). For example, the magnetic body (82) may be placed in the OIS moving part. The magnetic body (82) may be placed in the holder (140). The magnetic body (82) may be placed on a circuit board (800), for example, a second board (802). For example, the coil (120) may be placed on a first surface of the second board (802) facing the magnet (130), and the magnetic body (82) may be placed on a second surface of the second board (802) opposite to the first surface of the second board (802). The magnetic body (82) may be coupled, attached, or fixed to the second board (802) by an adhesive. In another embodiment, the magnet (82) may be placed in the housing (210).

[0103] The magnetic body (82) may be formed of a material that is attracted to a magnet. For example, the magnetic body (82) may be formed of a metallic material that is attracted to a magnet. Or, for example, the magnetic body (82) may be formed of a magnetic metallic material. Or, for example, the magnetic body (82) may be a magnet. The magnetic body (82) may also be expressed as a "yoke." The magnetic body (82) may also play a role in enhancing or increasing the electromagnetic force between the magnet (130) and the coil (120).

[0104] Since the magnet (130) is placed on the bobbin (110) and the magnetic body (82) is placed on the holder (140), the bobbin (110) can be pulled toward the holder (140) where the magnetic body (82) is placed by the attractive force between the magnetic body (82) and the magnet (130). By the attractive force between the magnetic body (82) and the magnet (130), the bobbin (110) and the holder (140) can press the cloud member (21), and the bobbin (110) can be stably supported.

[0105] The magnetic body (82) and the magnet (130) may be a "pressure unit" or a "pressure member." By means of this pressure unit, when the bobbin (110) moves in the optical axis direction, contact can be maintained between the bobbin (110) and the rolling member (21) and between the holder (140) and the rolling member (21). That is, by the attractive force between the magnet (130) and the magnetic body (82), the rolling member (21) can stably support the bobbin (110) with respect to the holder (140).

[0106] In another embodiment, the coil (120) may be disposed in the housing (210) rather than in the holder (140) or the substrate (802). In another embodiment, the coil (120) may be disposed on the first side (71A) of the housing (210). In another embodiment, the substrate (802) may be omitted, the circuit board (190) may further include a third substrate (not shown) disposed on the first side (e.g., 71A) of the housing (210), and the coil (120) may be disposed on the third substrate of the circuit board (190) and may be electrically connected to the circuit board (190). In this case, the yoke (82) may be disposed on the second surface of the third substrate, which is opposite to the first surface of the third substrate on which the coil (120) is disposed.

[0107] In another embodiment, the magnet (130) may be placed in the holder (140), and the coil (120) may be placed in the bobbin (110). For example, the magnetic body (82) may be placed in the holder (140) together with the magnet (130). For example, the magnet (130) may be placed between the magnetic body (82) and the coil (120). In another embodiment, the magnetic body (82) may be placed in the bobbin (110) together with the coil (120) facing the magnet (130) placed in the holder (140). In addition, the camera device (200) may further include a conductive member, for example, a conductive member, for electrically connecting the coil (120) placed in the bobbin (110) and the second substrate (802) of the circuit board (800).

[0108] Referring to FIG. 7B, the holder (140) may include a mounting portion (45A) for mounting or arranging the filter (610). The mounting portion (45A) may be disposed or formed on the lower surface of the holder (140). For example, the mounting portion (45A) may be a recessed groove from the lower surface of the holder (140). For example, the mounting portion (45A) may include a bottom surface (5A) having a step in the optical axis direction from the lower surface of the holder (140) and a side surface (5B) connecting the lower surface of the holder (140) and the bottom surface (5A) of the mounting portion (45A). For example, the opening (30A) may penetrate the bottom surface (5A) of the mounting portion (45A).

[0109] The holder (140) may include a recessed portion (45B) positioned or formed in a corner region of the inner surface of the mounting portion (45A). The recessed portion (45B) may have a structure that recesses in a direction from the optical axis toward the corner region of the inner surface of the mounting portion (45A). The recessed portion (45B) may prevent an adhesive (e.g., UV epoxy) for attaching or bonding the filter (610) to the mounting portion (45A) from overflowing out of the mounting portion (45A).

[0110] The holder (140) may include a escape groove (46) to avoid spatial interference with the circuit element (815). For example, the escape groove (46) may be arranged or formed on the lower surface of the holder (140). For example, the escape groove (46) may be recessed from the lower surface of the holder (140). The escape groove (46) may correspond to, face, or overlap with the circuit element (815) in the optical axis direction. For example, the escape groove (46) may be located between the mounting portion (45A) and an edge of the lower surface of the holder (140). For example, the escape groove (46) may include a first escape groove (46A) and a second escape groove (46B) which are located on opposite sides with respect to the mounting portion (45A) or the filter (610). In another embodiment, the escape groove (46) may include four escape grooves arranged between the four sides of the opening (30A) and the holder (140).

[0111] The holder (140) may include a groove (47) corresponding to the protrusion (216) of the sensor base (270). The protrusion (216) of the sensor base (270) and the groove (47) of the holder (140) may serve as a guide for easy assembly of the sensor base (270) and the holder (140), and may increase the bonding area to improve the bonding strength between the sensor base (270) and the holder (140).

[0112] For example, the groove (47) may be recessed from the lower surface of the holder (140). For example, the groove (47) may be positioned or formed in a corner or corner area of ​​the lower surface of the holder (140). The groove (47) of the holder (140) may have a shape corresponding to the protrusion (216) of the sensor base (270). In addition, the holder (140) may include a groove (48) or a hole corresponding to the protrusion (17) of the sensor base (270). For example, the protrusion (17) of the sensor base (270) may be inserted into the groove (48) of the holder (140) or may be coupled with the groove (48). For example, the groove (48) may be positioned or formed in the bottom surface of the groove (47) of the holder (140). For example, the groove (48) may be recessed from the bottom surface of the groove (47) of the holder (140).

[0113] In another embodiment, the holder (140) may include a protrusion protruding from the lower surface of the holder (140) instead of the groove (47), and the sensor base (270) may include a groove recessed from the upper surface of the sensor base (270) instead of the protrusion (216) and engaging with the protrusion of the holder (140). In another embodiment, the protrusion (17) may be formed on the holder (140) and the groove (48) may be formed on the sensor base (270).

[0114] The camera device (200) may include a filter (610) that is placed on the holder (140) or coupled with the holder (140). For example, the filter (610) may be placed under the holder (140). For example, the filter (610) may be coupled to the lower surface of the holder (140). For example, the filter (610) may be placed on the mounting portion (45A) of the holder (140). The filter (610) may serve to block light of a specific frequency band from passing through the lens module (400) from entering the image sensor (810). For example, the filter (610) may be an infrared cut filter. For example, the filter (610) may be placed parallel to a plane perpendicular to the optical axis (OA).

[0115] The filter (610) may be coupled to the holder (140) (or the mounting portion (45A)) by an adhesive (not shown). For example, the edge region of the filter (610) may be coupled to the bottom surface of the mounting portion (45A). For example, the adhesive may be an epoxy, a thermosetting adhesive, an ultraviolet-curable adhesive, or the like. For example, at least a portion of the filter (610) may correspond to, face, or overlap with the lens module (400) or / and the image sensor (810) in the optical axis direction.

[0116] The sensor base (270) may be placed under the holder (140). The sensor base (270) may be placed within the housing (210). The sensor base (270) may be coupled with the holder (140). The sensor base (270) may be alternatively expressed as a “holder.” Additionally, the holder (140) may be alternatively expressed as a “first housing” (or “first holder”), and the sensor base (270) may be alternatively expressed as a “second housing” (or “second holder”). Additionally, the holder (140) and the sensor base (270) may not be separately expressed, but may be alternatively expressed as a single term, for example, “housing,” “holder,” or “sensor base.” In another embodiment, the sensor base (270) and the holder (140) may be formed integrally.

[0117] For example, the sensor base (270) may include a protrusion (216) protruding from the upper surface. The protrusion (216) may also be expressed as a “pillar”. For example, the protrusion (216) may correspond to, face, or overlap with the groove (47) of the holder (140) in the optical axis direction. At least a portion of the protrusion (216) of the sensor base (270) may be inserted into the groove (47) of the holder (140). For example, at least a portion of the protrusion (216) may be coupled with the groove (47) of the holder (140). For example, at least a portion of the protrusion (216) may be coupled with the groove (47) of the holder (140) by an adhesive.

[0118] For example, the sensor base (270) may include a body (270A) and a protrusion (216) protruding from the upper surface of the body (270A). For example, the number of protrusions (216) may be plural. For example, the body (270A) may have a shape corresponding to the first substrate (801) of the circuit board (800). For example, the body (270A) may have a polyhedral shape, for example, a hexahedral shape. For example, the protrusion (216) may be arranged at a corner region of the upper surface of the body (270A). For example, the protrusion (216) may include four protrusions (216A to 216D) arranged at four corner regions of the upper surface of the body (270). Additionally, for example, the holder (140) may include four grooves (47) corresponding to four protrusions (216A to 216D). In another embodiment, the housing (210) may include at least one protrusion positioned in at least one of four corner regions of the upper surface of the body (270), and the holder (140) may include at least one groove (48) corresponding to at least one protrusion of the housing (210).

[0119] The sensor base (270) or body (270A) may include sides (51A to 51D) that correspond to, oppose, or overlap the sides (41A to 41D) of the holder (140).

[0120] The sensor base (270) may include a receiving portion (56) in which the gyro sensor (820) is placed or to avoid spatial interference with the gyro sensor (820). For example, the receiving portion (56) may penetrate the sensor base (270) in the direction of the optical axis. For example, the receiving portion (56) may penetrate the body (270A) in the direction of the optical axis. In another embodiment, the receiving portion (56) may be a groove that is recessed from the upper surface of the body (270A). The receiving portion (56) may include an opening that opens to the outer surface of the sensor base (270).

[0121] The sensor base (270) may include a receiving portion (155) in which the control portion (830) is placed or for receiving the control portion (830). The receiving portion (155) may be a groove that is sunken into the lower surface of the sensor base (270) or the lower surface of the body (270A). In another embodiment, the receiving portion (155) may be a through hole that passes through the sensor base (270) or the body (270A) in the direction of the optical axis.

[0122] The sensor base (270) may include a receiving portion (28A) for receiving a magnetic body (31). The receiving portion (28A) may be arranged or formed on the lower or bottom surface of the sensor base (270). For example, the receiving portion (28A) may be a groove that is recessed from the lower or bottom surface of the sensor base (270). For example, the receiving portion (28A) may be arranged or formed on the lower surface of the body (270A). For example, the receiving portion (28A) may have a shape corresponding to the magnetic body (31).

[0123] The sensor base (270) may include a mounting portion (25A) for accommodating at least a portion of the tilting guide portion (60) or for accommodating at least a portion of the tilting guide portion (60). For example, the mounting portion (25A) may be a groove that is recessed from the lower surface of the sensor base (270). For example, the mounting portion (25A) may have a shape corresponding to or identical with the tilting guide portion (60). For example, the mounting portion (25A) may include a bottom surface having a step in the optical axis direction from the lower surface of the sensor base (270) and a side surface connecting the bottom surface and the lower surface of the sensor base (270). For example, the bottom surface of the mounting portion (25A) may be positioned higher than the lower surface of the sensor base (270).

[0124] Referring to FIGS. 4A and 4B, since a mounting portion (25A) for inserting or placing at least a portion of the tilting guide portion (60) is formed on the lower surface of the sensor base (270), the sensor base (270) may include a partition wall (272) (or guide portion) disposed on the lower surface and arranged around the tilting guide portion (60). The tilting guide portion (60) may be spaced apart from the partition wall (272), and the partition wall (272) may be arranged to surround the tilting guide portion (60). The partition wall (272) may prevent the tilting guide portion (60) from being separated or detached from the sensor base (270).

[0125] The sensor base (270) may include a protrusion (28) (or projection) protruding from the lower or bottom surface of the sensor base (270). For example, the protrusion (28) may protrude from the bottom surface of the mounting portion (25A) of the sensor base (270). For example, the protrusion length of the protrusion (28) may be greater than the depth of the mounting portion (25A). For example, the protrusion length of the protrusion (28) may be the distance (or shortest distance) from the bottom surface of the mounting portion (25A) to the lower surface (or lowest end) of the protrusion (28). In addition, the depth of the mounting portion (25A) may be the distance (or shortest distance) from the lower surface of the sensor base (270) to the bottom surface of the mounting portion (25A).

[0126] In other embodiments, for example, the protrusion length of the protrusion (28) may be less than or equal to the depth of the mounting portion (25A). For example, the protrusion (28) may have a shape corresponding to or coinciding with the opening (60A) of the tilting guide portion (60).

[0127] For example, the protrusion (28) of the sensor base (270) may correspond to, face, or overlap with the opening (60A) of the tilting guide portion (60) in the optical axis direction. For example, at least a portion of the protrusion (28) of the sensor base (270) may be positioned within the opening (60A) of the tilting guide portion (60).

[0128] For example, the receiving portion (28A) may be positioned or formed on the protrusion (28) of the sensor base (270). For example, the receiving portion (28A) may be a groove that is recessed from the lower surface of the protrusion (28) of the sensor base (270). In another embodiment, the protrusion (28) may be omitted, and the receiving portion (28A) may be formed on the lower surface of the sensor base (270).

[0129] For example, the protrusion (28) may be positioned between the ball members (62A, 62B). For example, the protrusion (28) (or the magnetic body (31)) may overlap the ball members (62A, 62B) in a direction perpendicular to the optical axis, for example, in the second direction.

[0130] The sensor base (270) may include a groove (29) in which the cloud member (62) is disposed or for receiving the cloud member (62). The groove (29) may be formed on the lower surface of the sensor base (270). For example, the groove (29) may be recessed from the lower surface of the sensor base (270). The number of grooves (29) may be the same as the number of cloud members (62). For example, the groove (29) may include two grooves (29A, 29B) that are spaced apart from each other. For example, the two grooves (29A, 29B) may be disposed spaced apart from each other in the X-axis direction. For example, the protrusion (28) of the sensor base (270) may be disposed between the two grooves (29A, 29B) of the sensor base (270). The groove (29) may contact the cloud member (62) at at least one point. For example, the groove (29) may include a bottom surface and at least one side surface connected to the bottom surface. At least one side surface may be an inclined surface. For example, the groove (29) may include a bottom surface and a plurality of inclined surfaces. The shapes of the inclined surfaces of the groove (29) may be identical to each other. In another embodiment, at least one of the inclined surfaces of the groove (29) may have a different shape from the others.

[0131] Referring to FIG. 7C, a groove (212A) may be formed in the protrusion (216) of the sensor base (270) into which at least a portion of the first substrate (801) of the circuit board (800) is inserted or placed. For example, a corner of the first substrate (801) may be inserted into or coupled with the groove (212A) of the protrusion (216) of the sensor base (270). For example, the groove (212A) may be formed on a side of the protrusion (216) facing the corner of the circuit board (800). In addition, a groove (83) may be formed in at least one corner of the circuit board (800) to be inserted into or coupled with the groove (212A) of the protrusion (216). The groove (212A) of the protrusion (216) of the sensor base (270) can serve as a defect guide for combining the first substrate (801) and the sensor base (270), and can serve to prevent the first substrate (801) from rotating or being separated from the sensor base (270).

[0132] The circuit board (800) may be placed, coupled, or fixed to the sensor base (270). For example, the circuit board (800) may be coupled to the sensor base (270) by an adhesive or a fixing member. For example, at least a portion of the circuit board (800) may be coupled or fixed to the holder (140). The circuit board (800) may be placed, coupled, or fixed to the body (270A) of the sensor base (270).

[0133] The circuit board (800) may include at least one of a rigid printed circuit board (Rigid PCB), a flexible printed circuit board (Flexible PCB), and a rigid-flexible printed circuit board (RigidFlexible PCB). For example, the circuit board (800) may include a rigid printed circuit board and a flexible printed circuit board. The circuit board (800) may also be expressed as a “substrate portion,” a “substrate,” or a “printed circuit board.”

[0134] For example, the circuit board (800) may include a first substrate (801) (or “first region”) that is disposed, coupled, or fixed to the sensor base (270). For example, the first substrate (801) may be disposed, coupled, or fixed to the body (270A) of the sensor base (270). For example, a lower surface of the first substrate (801) may be coupled to an upper surface of the sensor base (270) or an upper surface of the body (270A). For example, a lower surface of the first substrate (801) may be coupled to an upper surface of the sensor base (270) or an upper surface of the body (270A) by an adhesive. The circuit board (800) may include a second substrate (802) (or “second region”) that is connected to the first substrate (801) and disposed on a side of the holder (140). For example, the second substrate (802) may be placed, coupled, or fixed to at least one of the sides of the holder (140) (e.g., the first side (41A)).

[0135] In FIG. 7a, the circuit board (800) includes one second substrate, but in other embodiments, the circuit board (800) may include multiple second substrates arranged on the sides of the holder (140).

[0136] For example, the second substrate (802) may be connected to the first side of the first substrate (801). For example, the second substrate (802) may be bent from the first side of the first substrate (801) toward the first side (41A) of the holder (140). For example, the second substrate (802) may extend upward from the first substrate (801). The circuit board (800) may include a third substrate (803) on which a connector (805) is arranged or provided, and a fourth substrate (804) connecting the first substrate (802) and the third substrate (803). For example, the first substrate (801) may be a rigid printed circuit board. For example, the second substrate (802) may be a flexible printed circuit board. For example, the third substrate (803) may be a rigid printed circuit board. For example, the fourth substrate (804) may be a flexible printed circuit board.

[0137] For example, a rigid printed circuit board may include a plurality of conductive layers (or circuit patterns) spaced apart from each other in the optical axis direction and an insulating layer disposed between two adjacent conductive layers among the plurality of conductive layers. For example, a flexible circuit board may include one conductive layer (or circuit pattern), a first insulating layer disposed on the conductive layer, and a second insulating layer disposed under the conductive layer. In another embodiment, the flexible circuit board may include a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first and second conductive layers, a second insulating layer disposed on the first conductive layer, and a third insulating layer disposed under the second conductive layer.

[0138] The image sensor (810) may be placed on the first substrate (801). The image sensor (810) may be placed to correspond to, face, or overlap the lens module (400) or / and the filter (610) in the optical axis direction.

[0139] The image sensor (810) may include an imaging area for detecting light. Here, the imaging area may be expressed as an effective area, a light-receiving area, a sensor surface, or an active area. For example, the imaging area may include a plurality of pixels on which an image is formed. The image sensor (810) may be conductively or electrically connected to the first substrate (801). The imaging area may correspond to, face, or overlap the lens module (400) or / and the filter (610) in the optical axis direction.

[0140] The camera device (200) may include a circuit element (815) disposed on a first substrate (801). For example, the circuit element (815) may include at least one of a passive element (e.g., a capacitor or a resistor), an active element (e.g., a sensor, a memory, a driver IC), or a circuit pattern. For example, in order to avoid spatial interference with the image sensor (810), the circuit element (815) may be disposed between the image sensor (810) and an edge (e.g., a side) of the first substrate (801).

[0141] The camera device (200) may include a control unit (830) disposed on a circuit board (800). For example, the control unit (830) may be a driver IC. For example, the control unit (830) may be disposed on a first substrate (801). For example, the control unit (830) may be disposed below the first substrate (801). For example, the control unit (830) may be disposed, coupled, or fixed to a lower surface of the first substrate (801). For example, the control unit (830) may be conductively or electrically connected to the first substrate (801). In another embodiment, the control unit (830) may be disposed on a second substrate (802).

[0142] For example, the control unit (830) may be conductively or electrically connected to the coil (120) and may supply a driving signal to the coil (120). For example, the control unit (830) may be conductively or electrically connected to the position sensor (170). For example, the position sensor (170) may be a Hall sensor and may include two input terminals and two output terminals. In this case, the control unit (830) may supply power to the two input terminals of the position sensor (170). The control unit (830) may receive an output signal of the position sensor (170) output from the two output terminals of the position sensor (170), and may control a driving signal (e.g., driving current) supplied to the coil (120) using the output signal of the position sensor (170).

[0143] In another embodiment, the control unit (830) may be omitted. The position sensor (170) may be a driver IC including a Hall sensor. When the position sensor (170) is a driver IC including a Hall sensor, the control unit (830) may be omitted. When the position sensor (170) is a driver IC including a Hall sensor, the position sensor (170) may include first to sixth terminals that are electrically or conductively connected to the circuit board (800). The first and second terminals of the position sensor (170) may be terminals for receiving a power signal, the third terminal may be a terminal for transmitting or receiving a clock signal (SCL), and the fourth terminal may be a terminal for transmitting or receiving a data signal (SDA). The fifth and sixth terminals of the position sensor (170) may be conductively or electrically connected to the coil (120) and may supply a driving signal to the first coil (120).

[0144] The camera device (200) may include a gyro sensor (820) disposed on a circuit board (800). For example, the gyro sensor (820) outputs rotational angular velocity information due to the movement of the camera device (200). For example, the gyro sensor (820) may be implemented as a two-axis or three-axis gyro sensor or an angular velocity sensor.

[0145] For example, the gyro sensor (820) may be disposed on the first substrate (801). For example, the gyro sensor (820) may be disposed below the first substrate (801). For example, the gyro sensor (820) may be disposed, coupled, or fixed to the lower surface of the first substrate (801). For example, the gyro sensor (820) may be conductively or electrically connected to the first substrate (801). For example, at least one of the gyro sensor (820) and the control unit (830) may be disposed close to the third substrate (803). For example, at least one of the gyro sensor (820) and the control unit (830) may be disposed close to the first side of the first substrate (801) that is adjacent to or connected to the third substrate (803). The gyro sensor (820) and the control unit (830) may be positioned closer to the first side of the first substrate (801) than to the second side of the first substrate (801), and the second side of the first substrate (801) may be positioned opposite the first side of the first substrate (801).

[0146] The coil (120) may be placed, coupled, or fixed to the circuit board (800) (e.g., the second substrate (802)). For example, the coil (120) may be conductively or electrically connected to the circuit board (800) (e.g., the second substrate (802)). For example, the coil (120) may be conductively or electrically connected to the circuit board (800) (e.g., the second substrate (802)) by a conductive adhesive or solder. For example, the coil (120) may be placed or coupled to the second substrate (802) and may be conductively or electrically connected to the second substrate (802). The coil (120) may move the AF moving part (e.g., the bobbin) in the optical axis direction by interaction with the magnet (130). The coil (120) may be placed in the holder (140).

[0147] The coil (120) may be arranged to correspond to, face, or overlap the magnet (130) in a direction perpendicular to the optical axis. For example, the coil (120) may be arranged in the holder (140) to correspond to, face, or overlap the magnet (130) in a second direction (e.g., X-axis direction) or in a direction from the first side (41A) of the holder (140) to the second side (41B). For example, the coil (120) may be arranged in the first side (41A) of the holder (140). The coil (120) may be arranged in the mounting portion (142A) of the holder (140).

[0148] For example, the coil (120) may include a hollow or a hole. For example, the coil (120) may have a ring shape or a closed curve shape. The coil (120) may include a ring-shaped coil body. For example, the coil (120) may have a ring shape wound around a straight line that is perpendicular to the optical axis (OA) and perpendicular to the outer surface of the first side (41A) of the holder (140). For example, the coil (120) may have a ring shape in which the length in the horizontal direction (or the third direction) is longer than the length in the vertical direction (or the optical axis direction).

[0149] A driving signal may be applied to the coil (120) to generate an electromagnetic force through electromagnetic interaction with the magnet (130). For example, the driving signal may be applied to the coil (120) from the circuit board (800) or the control unit (830). At this time, the driving signal supplied to the coil (120) may be a direct current, and may be in the form of a voltage or current. Alternatively, in another embodiment, for example, the driving signal provided to the coil (120) may include at least one of a direct current signal and an alternating current signal.

[0150] A coil (120) supplied with a driving signal can electromagnetically interact with a magnet (130) placed on a bobbin (110), and an AF moving unit can move in a first direction by an electromagnetic force resulting from the electromagnetic interaction between the coil (120) and the magnet (130). By adjusting the size and / or direction of a driving signal (e.g., driving current) by a control unit (830), the movement of the AF moving unit in the first direction can be controlled, and thereby an auto-focusing function can be performed.

[0151] For AF feedback driving, the camera device (200) may include a position sensor (170). The position sensor (170) may detect the position or displacement of the bobbin (110) in the optical axis direction. For example, the position sensor (170) may detect a magnet (130) disposed on the bobbin (110). In another embodiment, a sensing magnet opposite to the position sensor (170) may be disposed on the bobbin (110) separately from the magnet (130), and the position sensor (170) may detect the displacement of the bobbin by detecting the sensing magnet or the magnetic field of the sensing magnet.

[0152] For example, the position sensor (170) may be placed in the holder (140). For example, the position sensor (170) may be placed on the first side (41A) of the holder (140). For example, the position sensor (170) may be placed within the mounting portion (142A) of the holder (140). For example, the position sensor (170) may be placed within the hollow portion of the coil (120). In another embodiment, the position sensor (170) may be placed outside the hollow portion of the coil (120).

[0153] For example, the position sensor (170) may be disposed on the circuit board (800). The position sensor (170) may be coupled to the circuit board (800). For example, the position sensor may be coupled to the circuit board (800) by a conductive adhesive or solder. For example, the position sensor (170) may be conductively or electrically connected or coupled to the second substrate (802). For example, the position sensor (170) may be conductively or electrically connected to the second substrate (802) by a conductive adhesive or solder. For example, the position sensor (170) may be disposed, coupled, or fixed to the first surface of the second substrate (802). For example, the position sensor (170) may correspond to, face, or overlap the magnet (130) in a direction perpendicular to the optical axis or in a second direction.

[0154] The position sensor (170) can detect displacement of the bobbin (110) in the direction of the optical axis. For example, the position sensor (170) can detect the magnetic field or the strength of the magnetic field of the magnet (130) mounted on the bobbin (110) according to the movement of the bobbin (110), and output an output signal.

[0155] For example, the position sensor (170) may be a Hall sensor. In this case, the position sensor (170) may include two input terminals to which a driving signal is applied and two output terminals to which an output signal is output. The circuit board (800) may be conductively or electrically connected to the two input terminals and the two output terminals of the position sensor (170). The circuit board (800) or the control unit (830) may supply a driving signal to the two input terminals of the position sensor (170), and the output signal output from the two output terminals of the position sensor (170) may be transmitted to the circuit board (800) or the control unit (830).

[0156] In another embodiment, the position sensor (170) may be implemented in the form of a driver IC including a Hall sensor. For example, if the position sensor (170) is a driver IC including a Hall sensor, the position sensor (170) may transmit and receive data with the outside world using data communication using a protocol, for example, I2C communication.

[0157] For example, if the position sensor (170) is a driver IC including a Hall sensor, the position sensor (170) may include first and second terminals to which a power or driving signal is input, a third terminal for a clock signal, a fourth terminal for a data signal, and fifth and sixth terminals for supplying a driving signal to the coil (120). The first to sixth terminals of the position sensor (170) may be conductively or electrically connected to the circuit board (800).

[0158] The magnet (310) may be placed on the OIS moving part (100) or coupled with the OIS moving part (100). For example, the magnet (310) may be placed or coupled to the holder (140). The magnet (310) may include a first magnet unit (310A) placed on the second side (41B) of the holder (140) and a second magnet unit (310B) placed on the third side (41C) of the holder (140).

[0159] For example, the first magnet unit (310A) may be placed on the first mounting portion (143A) of the holder (140), and the second magnet unit (310B) may be placed on the second mounting portion (143B) of the holder (140). For example, the first magnet unit (310A) and the second magnet unit (310B) may be placed so as to be offset from each other in the second direction or the third direction. For example, the first magnet unit (310A) and the second magnet unit (310B) may be placed on the moving portion, for example, the holder (140), so as not to overlap each other in the second direction or the third direction. For example, the first magnet unit (310A) and the second magnet unit (310B) may be placed on two different sides of the holder (140) so as not to overlap each other in the second direction or the third direction.

[0160] In another embodiment, the magnet (310) may be placed in the housing (210), and the coil (230) may be placed in the holder (140). For example, in FIG. 3, the positions of the magnet (310) and the coil (230) may be placed opposite each other, and in this case, the camera device (200) may include a separate conductive part, such as a circuit board, a circuit member, or a conductive member, that conductively or electrically connects the second coil (230) and the circuit board (800).

[0161] Each of the first magnet unit (310A) and the second magnet unit (310B) may be a two-pole magnet including one N pole and one S pole. For example, each of the first magnet unit (310A) and the second magnet unit (310B) may be a two-pole magnet in which the N pole and the S pole are separated or arranged in the optical axis direction. For example, the N pole (or S pole) of each of the first magnet unit (310A) and the second magnet unit (310B) may be positioned above the S pole (or N pole).

[0162] In another embodiment, each of the first magnet unit (310A) and the second magnet unit (310B) may be a two-pole magnet in which the N pole and the S pole are separated or arranged in a direction perpendicular to the optical axis direction. In another embodiment, each of the first magnet unit (310A) and the second magnet unit (310B) may be a four-pole magnet including two N poles and two S poles.

[0163] Referring to FIGS. 10A and 10B , the housing (210) may include a cavity for accommodating the OIS moving unit (100). For example, the housing (210) may have a shape corresponding to the OIS moving unit (100), for example, the holder (140) or the sensor base (270), for example, a polygon (e.g., a square or an octagon) or a circle (or an oval), but is not limited thereto and may have various shapes. The housing (210) may also be expressed as a “base.”

[0164] The housing (210) may include a plurality of sides (71A to 71D) corresponding to the sides (41A to 41D) of the holder (140) or the sides (51A to 51D) of the sensor base (270). The housing (210) may include a corner positioned between two adjacent sides.

[0165] Additionally, the housing (210) may include a lower portion (42) (or lower plate) positioned below the sides (71A to 71D). The lower portion (42) may be connected to the lower sides of the sides (71A to 71D). For example, the lower portion (42) may be alternatively expressed as a “bottom portion,” a “bottom surface,” or a “body.” For example, the sides (71A to 71D) may extend or protrude upward from the lower portion (42).

[0166] Referring to FIG. 10A, the housing (210) may include a first side (71A) corresponding to, opposite to, or overlapping a first side (41A) of the holder (140), a second side (71B) corresponding to, opposite to, or overlapping a second side (41B) of the holder (140), a third side (71C) corresponding to, opposite to, or overlapping a third side (41C) of the holder (140), and a fourth side (71D) corresponding to, opposite to, or overlapping a fourth side (41D) of the holder (140). The first side (71A) (or the first side or the first outer surface) of the housing (210) may be positioned opposite the second side (71B) (or the second side or the second outer surface) of the housing (210), and the third side (71C) (or the third side or the third outer surface) of the housing (210) may be positioned opposite the fourth side (71D) (or the fourth side or the fourth outer surface) of the housing (210). For example, each of the first to fourth sides (71A to 71D) of the housing (210) may be positioned parallel to a corresponding one of the side plates (302) of the cover member (300).

[0167] The housing (210) may include a step (411) disposed on the lower portion of at least one of the sides (71A to 71D). For example, the step (411) may protrude in a direction perpendicular to the optical axis from the outer surface of the side (71A to 71D) of the housing (210). For example, the step (411) may face or overlap with the side plate (302) of the cover member (300) in the direction of the optical axis. For example, the step (411) may be coupled to the side plate (302) of the cover member (300) by an adhesive.

[0168] The housing (210) may include a mounting portion (141A, 141B) for placing or accommodating the coil (230). For example, the mounting portion (141A, 141B) may be in the form of a through hole formed in the side of the housing (210). In another embodiment, the mounting portion (141A, 141B) may be in the form of a groove recessed from the side of the housing (210).

[0169] The housing (210) may include a first mounting portion (141A) for placing the first coil (230A) and a second mounting portion (141B) for placing the second coil (310B). For example, the first mounting portion (141A) may be placed or formed on the second side (71B) of the housing (210), and the second mounting portion (141B) may be placed or formed on the third side (71C) of the housing (210). For example, the first mounting portion (141A) may penetrate the second side (71B) of the housing (210), and the second mounting portion (141B) may penetrate the third side (71C) of the housing (210). The first mounting portion (141A) may include an opening that opens to the upper surface of the second side (71B) of the housing (210), and the second mounting portion (141B) may include an opening that opens to the upper surface of the third side (71C) of the housing (210). In other embodiments, the first mounting portion (or the second mounting portion) may not include an opening that opens to the upper surface of the second side (or the third side) of the housing (210).

[0170] The housing (210) may include a receiving portion (49A) for receiving a magnetic body (32). The receiving portion (49A) may be disposed or formed in the lower portion (42) of the housing (210). The receiving portion (49A) may be disposed or formed on the upper surface of the lower portion (42) of the housing (210). For example, the receiving portion (49A) may be a groove that is recessed from the upper surface of the lower portion (42) of the housing (210). The receiving portion (49A) may have a shape corresponding to the magnetic body (32), for example, a square or a circle. For example, the receiving portion (49A) of the housing (210) may correspond to, face, or overlap with the receiving portion (28A) of the sensor base (270) in the optical axis direction.

[0171] Although not shown in FIG. 10b, the lower portion (142) of the housing (210) may have at least another portion of the tilting guide portion (60) disposed thereon or a groove formed therein to accommodate at least another portion of the tilting guide portion (60).

[0172] The housing (210) may include a groove (55) in which a cloud member (63) is arranged or for accommodating a cloud member (63). The groove (55) may be formed on an upper surface of a lower portion (42) of the housing (210). For example, the groove (55) may be recessed from an upper surface of the lower portion (42) of the housing (210). The number of grooves (55) of the housing (210) may be the same as the number of cloud members (63). For example, the groove (55) may include two grooves (55A, 55B) spaced apart from each other. For example, the two grooves (55A, 55B) may be arranged spaced apart from each other in the Y-axis direction. For example, the direction in which the two grooves (55A, 55B) of the housing (210) are spaced apart and the direction in which the two grooves (29A, 29B) of the sensor base (270) are spaced apart may be perpendicular. For example, the receiving portion (49A) may be placed between the two grooves (55A, 55B) of the housing (210).

[0173] The groove (55) of the housing (210) may contact the cloud member (63) at at least one point. For example, the groove (55) may include a bottom surface and at least one side surface connected to the bottom surface. At least one side surface of the groove (55) may be an inclined surface. For example, the groove (55) may include a bottom surface and a plurality of inclined surfaces. The shapes of the inclined surfaces of the groove (55) may be the same as each other. In other embodiments, at least one of the inclined surfaces of the groove (55) may have a different shape from the others.

[0174] The housing (210) may include a protrusion (215) that protrudes in a direction perpendicular to the optical axis. For example, the protrusion (215) may protrude from a side of the housing (210). For example, the protrusion (215) may protrude from an outer surface of a fourth side (71D) of the housing (210). For example, the protrusion (215) may be in a form in which at least a portion of the fourth side (71D) passes the optical axis and protrudes in a direction parallel to a straight line perpendicular to the optical axis. For example, the protrusion (215) may include a groove (16A) (or cavity) in which at least a portion of the fourth substrate (804) is placed or received. For example, the groove (16A) of the protrusion (215) may include an opening that opens upward.

[0175] Referring to FIG. 10b, a coupling groove (215A, 215B) may be formed in the groove (16A) of the protrusion (215) to allow the movement-inhibiting member (80) to be inserted, coupled, or fixed. For example, the coupling grooves (215A, 215B) may be formed on two inner surfaces facing each other of the groove (16A) of the protrusion (215). For example, the coupling grooves (215A, 215B) may extend in the optical axis direction. For example, the coupling grooves (215A, 215B) may include an opening that opens to the upper surface of the protrusion (215) to easily insert or couple the movement-inhibiting member (80) from above.

[0176] The maximum length of the protrusion (215) in the optical axis direction may be smaller than the maximum length of the housing (210) in the optical axis direction. By this configuration, a space for the circuit board (800) to extend outward can be easily secured, and a compact camera device can be implemented.

[0177] The coil (230) may be placed on a fixed part. For example, the coil (230) may be placed on a housing (210). The coil (230) may tilt the OIS moving part (100) or rotate it by a preset angle around a first axis (e.g., X-axis) or a second axis (e.g., Y-axis) by interaction with a magnet (310) placed on the OIS moving part (100).

[0178] The coil (230) may include a first coil (230A) corresponding to, opposite to, or overlapping with the first magnet unit (310A). The coil (230) may include a second coil (230B) corresponding to, opposite to, or overlapping with the second magnet unit (310B).

[0179] For example, the first coil (230A) may correspond to, oppose, or overlap the first magnet unit (310A) in a second direction, and the second coil (230B) may correspond to, oppose, or overlap the second magnet unit (310B) in a third direction. For example, the first coil (230A) may also oppose or overlap the coil (120) in the second direction. For example, the first coil (230A) may be disposed on the second side (71B) of the housing (210), and the second coil (230B) may be disposed on the third side (71C) of the housing (210).

[0180] The first coil (230A) may include a plurality of coil units. The second coil (230B) may include a plurality of coil units. In FIG. 13, the first coil (230A) includes two coil units (27A, 27B) and the second coil (230B) includes two coil units (27C, 27D), but in other embodiments, the number of coil units included in each of the first and second coils (230A, 230B) may be three or more.

[0181] Each of the coil units (27A to 27D) may include a hollow body or a hole. For example, each of the coil units (27A to 27D) may have a ring shape or a closed curve shape. Each of the coil units (27A to 27D) may be a ring-shaped coil body.

[0182] The second coil unit (27B) can be placed between the first coil unit (27A) and the magnet unit (310A), and the fourth coil unit (27D) can be placed between the third coil unit (27C) and the magnet unit (310B).

[0183] The coil units (27A, 27B) of the first coil (230A) may have a ring shape that overlaps each other. The coil units (27C, 27D) of the second coil (230B) may have a ring shape that overlaps each other.

[0184] Each of the coil units (27A, 27B) of the first coil (230A) may have a ring shape wound around a straight line that is perpendicular to the optical axis (OA) and perpendicular to the outer surface of the second side (71B) of the housing (210). Each of the coil units (27C, 27D) of the second coil (230B) may have a ring shape wound around a straight line that is perpendicular to the optical axis (OA) and perpendicular to the outer surface of the third side (71C) of the housing (210). Each of the coil units (27A, 27B) of the first coil (230A) may have a ring shape wound around a straight line that is perpendicular to the optical axis (OA) and parallel to the X-axis direction. Each of the coil units (27C, 27D) of the second coil (230B) may have a ring shape wound around a straight line that is perpendicular to the optical axis (OA) and parallel to the Y-axis direction. Alternatively, each of the coil units (27A, 27B) of the first coil (230A) may be in a ring shape wound around the first axis. Each of the coil units (27C, 27D) of the second coil (230B) may be in a ring shape wound around the second axis.

[0185] For example, each of the coil units (27A, 27B) of the first coil (230A) may be a ring shape in which the length in the horizontal direction (or Y-axis direction) is longer than the length in the vertical direction (or optical axis direction). For example, each of the coil units (27C, 27D) of the second coil (230B) may be a ring shape in which the length in the horizontal direction (or X-axis direction) is longer than the length in the vertical direction (or optical axis direction).

[0186] The camera device (200) may include a circuit board (190) that is placed on or coupled to the fixing member. For example, the circuit board (190) may be placed on or coupled to the housing (210). For example, the circuit board (190) may be placed on a side of the housing (210). For example, the circuit board (190) may be placed on or coupled to at least one of the side portions (71A to 71D) of the housing (210).

[0187] Referring to FIG. 10B, for example, the circuit board (190) may include a first substrate (191) disposed on a second side (71B) of the housing (210) and a second substrate (192) disposed on a third side (71C) of the housing (210). The second substrate (192) may be folded from the first substrate (191). The circuit board (190) may be electrically or conductively connected to the second coil (230). The circuit board (190) may be electrically or conductively connected to the position sensor (240).

[0188] The housing (210) may include a groove (19A, 19B) in which a circuit board (190) is placed or for receiving the circuit board (190). The groove (19A, 19B) of the housing (210) may be recessed from an outer surface of a side of the housing (210). The groove (19A, 19B) of the housing (210) may be formed in at least one of the sides (71A to 71D). For example, the housing (140) may include a first groove (19A) formed in a second side (71B) of the housing (210) and a second groove (19B) formed in a third side (71C) of the housing (210). For example, the first substrate (191) of the circuit board (190) may be placed within the first groove (19A) of the housing (210), and the second substrate (192) of the circuit board (190) may be placed within the first groove (19B) of the housing (210).

[0189] For example, the second groove (19B) may be arranged on the step (411) of the housing (210). The first groove (19A) may extend to the lower surface of the second side (71B) of the housing (210). For example, the step (411) may not be formed below the first groove (19A). For example, the first substrate (191) of the circuit board (190) may extend to the lower surface, bottom surface, or bottom surface of the second side (71B) of the housing (210). For example, at least a portion of the terminal portion (85) arranged on the lower surface of the first substrate (191) of the circuit board (190) may be arranged to overlap the step (411) of the housing (210) in a direction perpendicular to the optical axis. In addition, the terminal portion (85) may not protrude beyond the step (411) of the housing (210). This is to facilitate electrical connection, such as soldering, between the terminal portion (85) and an external device. The terminal portion (85) may include a plurality of terminals (P1 to Pn).

[0190] The housing (210) may include at least one protrusion (9A, 9B). The at least one protrusion (9A, 9B) may be disposed on a side of the housing (210). For example, the at least one protrusion (9A, 9B) may protrude from a bottom surface of a groove (19A, 19B) of the housing (210). The circuit board (190) may include at least one hole (7A, 7B) that engages with the protrusion (9A, 9B) of the housing (210). For example, the hole (7A, 7B) may be a through hole. For example, the housing (210) may include a first protrusion (9A) disposed on a second side (71B). The housing (210) may include a second protrusion (9B) disposed on a third side (71C). The first substrate (191) of the circuit board (190) may include a first hole (7A) that is coupled with a first protrusion (9A). The second substrate (192) of the circuit board (190) may include a second hole (7B) that is coupled with a second protrusion (9B).

[0191] The coil (230) may be placed on a fixed portion. The coil (230) may be placed on a housing (210). The coil (230) may be placed or coupled to a circuit board (190). For example, the first coil (230A) may be placed on a first substrate (191) of the circuit board (190), and the second coil (230B) may be placed on a second substrate (192) of the circuit board (190). For example, the first coil (230A) may be electrically connected to the first substrate (191) of the circuit board (190), and the second coil (230B) may be electrically connected to the second substrate (192) of the circuit board (190). For example, the first substrate (191) may correspond to, face, or overlap the first magnet unit (310A) in the second direction, and the second substrate (192) may correspond to, face, or overlap the second magnet unit (310B) in the third direction.

[0192] FIG. 13 is a perspective view of a circuit board (190), a first coil (230A), a second coil (230B), a first control unit (835A), and a second control unit (835B), FIG. 14a shows the electrical connection of the first control unit (835A), the first coil (230A), the first sensor (240A), and the first substrate (191), and FIG. 14b shows the electrical connection of the second control unit (835B), the second coil (230B), the second sensor (240B), and the second substrate (192).

[0193] Referring to FIGS. 13, 14A, and 14B, the first substrate (191) may include first and second pads (A1, A2) conductively or electrically connected to the coil unit (27A) of the first coil (230A). The first pad (A1) may be connected to one end of the coil unit (27A) of the first coil (230A), and the second pad (A2) may be connected to the other end of the coil unit (27A) of the first coil (230A). The first substrate (191) may include third and fourth pads (A3, A4) conductively or electrically connected to the coil unit (27B) of the first coil (230A). The third pad (A3) can be connected to one end of the coil unit (27B) of the first coil (230A), and the fourth pad (A4) can be connected to the other end of the coil unit (27B) of the first coil (230A).

[0194] The coil unit (27A) and the coil unit (27B) of the first coil (230A) may not be connected to each other. The coil unit (27A) and the coil unit (27B) of the first coil (230A) may not be conductively or electrically connected to each other.

[0195] In another embodiment, the first substrate (191) may include pads corresponding to the number of coil units included in the first coil (230A). For example, the first substrate (191) may include two pads corresponding to one coil unit.

[0196] The second substrate (192) may include fifth and sixth pads (A5, A6) conductively or electrically connected to the coil unit (27C) of the second coil (230B). The fifth pad (A5) may be connected to one end of the coil unit (27C) of the second coil (230B), and the sixth pad (A6) may be connected to the other end of the coil unit (27C) of the second coil (230B). The second substrate (192) may include seventh and eighth pads (A7, A8) conductively or electrically connected to the coil unit (27D) of the second coil (230B). The seventh pad (A7) may be connected to one end of the coil unit (27D) of the second coil (230B), and the eighth pad (A8) may be connected to the other end of the coil unit (27D) of the second coil (230B).

[0197] The coil unit (27C) and the coil unit (27D) of the second coil (230B) may not be connected to each other. The coil unit (27C) and the coil unit (27D) of the second coil (230B) may not be conductively or electrically connected to each other.

[0198] In another embodiment, the second substrate (192) may include pads corresponding to the number of coil units included in the second coil (230B). For example, the second substrate (192) may include two pads corresponding to one coil unit.

[0199] For OIS feedback driving, the camera device (200) may include a position sensor (240). The position sensor (240) may detect displacement or angular displacement of the OIS moving part according to tilting or rotation of the OIS moving part. For example, the position sensor (240) may include a first sensor (240A) and a second sensor (240B). For example, the first sensor (240A) may correspond to, oppose, or overlap with the first magnet unit (310A), and the second sensor (240B) may correspond to, oppose, or overlap with the second magnet unit (310B). For example, at least a portion of the first sensor (240A) may correspond to, oppose, or overlap with at least a portion of the first magnet unit (310A) in the second direction. For example, the center of the first sensor (240A) may overlap with the first magnet unit (310A) in the second direction. At least a portion of the second sensor (240B) may correspond to, face, or overlap with at least a portion of the second magnet unit (310B) in a third direction. For example, the center of the second sensor (240A) may overlap with the second magnet unit (310B) in a third direction.

[0200] For example, the first sensor (240A) can detect the magnetic field of the first magnet unit (310A) (or the first magnet unit (310A)). For example, the second sensor (240B) can detect the magnetic field of the second magnet unit (310B) (or the second magnet unit (310B)).

[0201] For example, the first sensor (240A) can detect the tilted position (or displacement) or tilted angle of the OIS moving unit with respect to the second axis (e.g., Y axis). The second sensor (240B) can detect the tilted position (or displacement) or tilted angle of the OIS moving unit with respect to the first axis (e.g., X axis).

[0202] In FIG. 4d, the number of each of the first sensor (240A) and the second sensor (240B) is 1, but in other embodiments, the number of each of the first sensor (240A) and the second sensor (240B) may be 2 or more. For example, two or more first sensors may be arranged spaced apart from each other in the second axis direction. For example, two or more first sensors may be arranged within the hollow of the first coil (230A). For example, two or more second sensors may be arranged spaced apart from each other in the first axis direction. For example, two or more second sensors may be arranged within the hollow of the second coil (230B).

[0203] The position sensor (240) may be disposed on the circuit board (190). The position sensor (240) may be electrically connected to the circuit board (190). For example, the first sensor (240A) may be disposed, coupled, or fixed to the first substrate (191) of the circuit board (190), and the second sensor (240B) may be disposed, coupled, or fixed to the second substrate (192) of the circuit board (190). For example, the first sensor (240A) may be conductively or electrically connected to the first substrate (191) of the circuit board (190), and the second sensor (240B) may be conductively or electrically connected to the second substrate (192) of the circuit board (190).

[0204] For example, the first sensor (240A) may be placed within the hollow (or hole) of the first coil (230A), and the second sensor (240B) may be placed within the hollow (or hole) of the second coil (230B). In another embodiment, the first sensor (240A) may be placed outside the hollow (or hole) of the first coil (230A), and the second sensor (240B) may be placed outside the hollow (or hole) of the second coil (230B).

[0205] For example, each of the first sensor (240A) and the second sensor (240B) may be a Hall sensor. For example, each of the first sensor (240A) and the second sensor (240B) may be a Hall sensor including first and second input terminals and first and second output terminals. For example, the first and second input terminals and the first and second output terminals of the first sensor (240A) may be conductively or electrically connected to the first substrate (191), and the first and second input terminals and the first and second output terminals of the second sensor (240B) may be conductively or electrically connected to the second substrate (192).

[0206] The camera device (200) may include a control unit (835) disposed on a circuit board (190). The control unit (835) may be electrically or conductively connected to the circuit board (190). For example, the control unit (835) may be a driver IC. The control unit (835) may be electrically or conductively connected to the coil (230). The control unit (835) may supply a driving signal to the coil (230). The control unit (835) may be conductively or electrically connected to the position sensor (240). The control unit (835) may supply power or a driving signal to the position sensor (240). The control unit (835) may receive an output of the position sensor (240).

[0207] The control unit (835) may include a first control unit (835A) and a second control unit (835B). In FIG. 13, each of the first control unit (835A) and the second control unit (835B) may be implemented as separate driver ICs. In another embodiment, the first control unit (835A) and the second control unit (835B) may be implemented as a single driver IC.

[0208] The first control unit (835A) can supply power or a driving signal to the first sensor (240A). The first control unit (835A) can receive an output (HV1) of the first sensor (240A). The second control unit (835B) can supply power or a driving signal to the second sensor (240B). The second control unit (835B) can receive an output (HV2) of the second sensor (240B). In an embodiment where the number of first sensors is plural and the number of second sensors is plural, a plurality of outputs of the first sensors can be received by the first control unit (835A), and a plurality of outputs of the second sensors can be received by the second control unit (835B).

[0209] For example, the first control unit (835A) may be placed on the first substrate (191) of the circuit board (190). The second control unit (835B) may be placed on the second substrate (192) of the circuit board (190). The first control unit (835A) may be placed, coupled, or fixed to the first surface of the first substrate (191). The second control unit (835B) may be placed, coupled, or fixed to the first surface of the second substrate (192). The first surface of the first substrate (191) and the first surface of the second substrate (192) may be surfaces facing the magnet unit (310A, 310B) or the OIS moving unit, for example, the lens module (400).

[0210] The first control unit (835A) may include terminals (K1 to K4) for data communication (e.g., I2C communication) with an external device or host. The external device or host may be the control unit (830) of the camera module (200) or the control unit (780) of the optical device (200A). The terminal unit (85) of the circuit board (190) may include terminals (P1 to P4) electrically connected to the terminals (K1 to K4) of the first control unit (835A).

[0211] The first control unit (835A) can perform data communication (e.g., I2C) with the host through terminals (P1 to P4) of the circuit board (190). For example, the terminal (P1) of the circuit board (190) may be for transmitting and receiving data (SDA), the terminal (P2) may be for transmitting and receiving a clock signal (SCL), and the terminals (P3, P4) may be for receiving power signals (VDD, VSS). The power signal (VSS) may be a ground signal (GND).

[0212] A power signal (VDD, VSS) or a driving signal for driving the first control unit (835A) may be supplied from the host through terminals (P1, P2) of the circuit board (190). Data (SDA) may include control signals for controlling the first control unit (835A).

[0213] The first control unit (835A) can supply a driving signal to the first coil (230A). The first control unit (835A) can supply a driving signal to each of the coil units of the first coil (230A).

[0214] For example, the first control unit (835A) can supply a first driving signal (ID1) to the first coil unit (27A) of the first coil (230A), and can supply a second driving signal (ID2) to the second coil unit (27B) of the first coil (230A). For example, the first control unit (835A) can supply a first driving signal (ID1) to the first and second pads (A1, A2) of the circuit board (190), and can supply a second driving signal (ID2) to the third and fourth pads (A3, A4) of the circuit board (190).

[0215] The first control unit (835A) may include terminals (3A, 3B) for supplying a first driving signal (ID1) to the first coil unit (27A) of the first coil (230A). The first control unit (835A) may include terminals (3C, 3D) for supplying a second driving signal (ID2) to the second coil unit (27B) of the first coil (230A). The number of terminals of the first control unit (835A) for supplying independent driving signals may correspond to the number of coil units of the first coil (230A).

[0216] The first control unit (835A) may convert the output signal (HV1) of the first sensor (240A) into analog-to-digital and generate a code value (or “digital value”), and may generate a first driving signal (ID1) for driving the first coil unit (27A) and a second driving signal (ID2) for driving the second coil unit (27B) based on a result of comparing the code value (hereinafter referred to as “first code value”) with a target value (hereinafter referred to as “first target value”). The first control unit (835A) may store an algorithm, a program, or a function for generating the driving signals (ID1, ID2) using the first code value. The first control unit (835A) may include an analog-to-digital converter for converting the output signal (HV1) of the first sensor (240A) into analog-to-digital and generating the first code value. The first control unit (835A) may include a digital processor that generates a first control signal for generating driving signals to drive the first and second coil units (27A, 27B) based on a result of comparing the first code value and the first target value. The first control unit (835A) may include a driver (or amplifier) ​​that generates a first driving signal (ID1) and a second driving signal (ID2) based on the first control signal. The first target value may be a reference code value regarding an output of the first sensor (240A) corresponding to a target tilted position or tilting angle of the OIS moving unit with respect to the second axis. In this case, the reference code value may be preset through calibration regarding a correlation between the tilted displacement (or tilted angle) of the OIS moving unit with respect to the second axis and the output of the first sensor (240A). The reference code value for the first sensor (240A) may be stored in the first control unit (835A) or in a separate memory. In an embodiment where there are multiple first sensors, the first and second drive signals may be generated using the outputs of the first sensors.

[0217] The second control unit (835B) may include terminals (M1 to M4) for data communication (e.g., I2C communication) with an external device or host. Each of the terminals (M1 to M4) of the second control unit (835B) may be electrically connected to a corresponding one of the terminals (P1 to P4) of the circuit board (190).

[0218] The second control unit (835B) can perform data communication (e.g., I2C) with the host through terminals (P1 to P4) of the circuit board (190). Power signals (VDD, VSS) or driving signals for driving the second control unit (835B) can be supplied from the host through the terminals (P1, P2) of the circuit board (190). Data (SDA) can include control signals for controlling the second control unit (835B).

[0219] Data of the first control unit (835A) and data of the second control unit (835B) can be transmitted and received in a time-division manner through terminals (P1, P2) of the circuit board (190). In data communication between the host (700) and the first and second control units (835A, 835B), the host (700) may correspond to a master, the first control unit (835A) may correspond to a first slave, and the second control unit (835B) may correspond to a second slave. Different addresses or identification codes may be assigned to the first and second control units (835A, 835B). Data can be transmitted and received in a time-division manner between each of the first and second control units (835A, 835B) and the host (700) through a line (or wiring, circuit pattern) connected to the terminal (P1).

[0220] The second control unit (835A) can supply a driving signal to the second coil (230B). The second control unit (835B) can supply a driving signal to each of the coil units of the second coil (230B).

[0221] For example, the second control unit (835B) can supply a third driving signal (ID3) to the third coil unit (27C) of the second coil (230B) and can supply a fourth driving signal (ID4) to the fourth coil unit (27D) of the second coil (230B). For example, the second control unit (835B) can supply a third driving signal (ID3) to the fifth and sixth pads (A5, A6) of the circuit board (190) and can supply a fourth driving signal (ID4) to the seventh and eighth pads (A7, A8) of the circuit board (190).

[0222] The second control unit (835B) may include terminals (4A, 4B) for supplying a third driving signal (ID3) to the third coil unit (27C) of the second coil (230B). The second control unit (835B) may include terminals (4C, 4D) for supplying a fourth driving signal (ID4) to the fourth coil unit (27D) of the second coil (230B). The number of terminals of the second control unit (835B) for supplying independent driving signals may correspond to the number of coil units of the second coil (230B).

[0223] The second control unit (835B) may convert the output signal (HV2) of the second sensor (240B) into analog-to-digital and generate a code value (or “digital value”), and may generate a third driving signal (ID3) for driving the third coil unit (27C) and a fourth driving signal (ID4) for driving the fourth coil unit (27D) based on a result of comparing the code value (hereinafter referred to as “second code value”) with a target value (hereinafter referred to as “second target value”). The second control unit (835B) may store an algorithm, a program, or a function for generating the driving signals (ID3, ID4) using the second code value. The second control unit (835B) may include an analog-to-digital converter for converting the output signal (HV2) of the second sensor (240B) into analog-to-digital and generating the second code value.

[0224] The second control unit (835A) may include a digital processor that generates a second control signal for generating driving signals to drive the third and fourth coil units (27C, 27D) based on a result of comparing the second code value and the second target value. The second control unit (835B) may include a driver (or amplifier) ​​that generates a third driving signal (ID3) and a fourth driving signal (ID4) based on the second control signal. The second target value may be a reference code value regarding an output of the second sensor (240B) corresponding to a target tilted position or tilting angle of the OIS moving unit with respect to the first axis. In this case, the reference code value may be preset through calibration regarding a correlation between the tilted position (or tilted angle) of the OIS moving unit with respect to the second axis and the output of the second sensor (240B). The reference code value for the second sensor (240B) may be stored in the second control unit (835B) or in a separate memory. In an embodiment where there are multiple second sensors, the third and fourth drive signals may be generated using the outputs of the second sensors.

[0225] The circuit board (190) may include a terminal portion (85). The terminal portion (85) may include a plurality of terminals (P1 to Pn, n being a natural number greater than 1). For example, the plurality of terminals (P1 to Pn) may be disposed on at least one of the first substrate (191) and the second substrate (192) of the circuit board (190). For example, the plurality of terminals (P1 to Pn) may be disposed on a lower portion of the first substrate (191) of the circuit board (190). For example, the plurality of terminals (P1 to Pn) may be exposed from the side plate (302) of the cover member (300). At least one of the plurality of terminals (P1 to Pn) may be conductively or electrically connected to the first control portion (835A) and the second control portion (835B).

[0226] The camera device (200) may include a separate circuit board (not shown) that is electrically or conductively connected to a plurality of terminals (P1 to Pn). For example, the separate circuit board may be disposed under the housing (210) and may include terminals that are electrically connected to the plurality of terminals (P1 to Pn) by a conductive adhesive. For example, the circuit board (800) may be represented by any one of the first to third circuit boards (e.g., a “first circuit board”), the circuit board (190) may be represented by another one of the first to third circuit boards (e.g., a “second circuit board”), and the separate circuit board may be represented by the remaining other one of the first to third circuit boards (e.g., a “third circuit board”).

[0227] The camera device (200) may include a movement restraining member (80) coupled with at least a portion of the housing (210). The movement restraining member (80) may restrain movement or motion of at least a portion of the fourth substrate (804) to prevent deformation of the shape of at least a portion of the fourth substrate (804).

[0228] Referring to FIGS. 7C, 8, and 11A, the fourth substrate (804) of the circuit board (800) may include a first portion (804A) (or “first region”) connected to the first substrate (801), a second portion (804B) connected to the first portion (804A) and bent from the first portion (804A), and a third portion (804C) connected to the second portion (804B) and bent from the second portion (804B). In other embodiments, at least one of the first portion (804A) and the second portion (804B) may be omitted.

[0229] For example, the first portion (804B) may extend in a direction parallel to the first substrate (801). For example, the second portion (804B) may be bent from the first portion (804B) and may extend upward from the first portion (804B). For example, the third portion (804C) may extend from the second portion (804B) in a direction opposite to the first portion (804A). For example, the fourth substrate (804) may include a first bend portion (804D) connecting the first portion (804A) and the second portion (804B). Additionally, the fourth substrate (804) may include a second bend portion (804E) connecting the second portion (804B) and the third portion (804C). The first bend portion (804D) and the second bend portion (804E) may be angular, but for example, the first portion (804A) and the second portion (804B) may be vertical. In other embodiments, the first bend portion (804D) and the second bend portion (804E) may be rounded. In other embodiments, the interior angle between the first portion (804A) and the second portion (804B) may be acute or obtuse.

[0230] The first bending portion (804D) and the second bending portion (804E) can prevent the length of the camera device (200) from increasing in the direction perpendicular to the optical axis. In addition, since the first bending portion (804D) and the second bending portion (804E) are positioned between the upper surface of the camera device (200) (e.g., the upper surface of the cover member (300)) and the lower surface of the camera device (200) (e.g., the lower surface of the housing (210)), the length of the camera device (200) can be prevented from increasing in the direction of the optical axis, thereby enabling miniaturization of the camera device. For example, the third portion (804C) may have a plate or flat shape perpendicular to the optical axis. For example, the third portion (804C) may include a meandering shape or a serpentine shape. For example, the third portion (804C) may include at least one bent or curved region. For example, the folded or curved region of the third portion (804C) may be folded in a second direction or a third direction perpendicular to the optical axis. Alternatively, the folded or curved region of the third portion (804C) may extend in a direction perpendicular to the optical axis. For example, when viewed from above, the third portion (804C) may include a region having a U- or V-shape. For example, the third portion (804C) may be spaced apart from the housing (210). For example, the third portion (804C) may be spaced apart from the protrusion (215) of the housing (210). In another embodiment, for example, at least a portion of the third portion (804C) may be in contact with the protrusion (215) of the housing (210). At least a portion of the second portion (804B) of the fourth substrate (804) may be disposed within the protrusion (215) of the housing (210). At least a portion of the second portion (804B) of the fourth substrate (804) may be positioned within the groove (16A) of the protrusion (215) of the housing (210). For example, at least a portion of the first portion (804A) of the fourth substrate (804) may be positioned within the groove (16A) of the protrusion (215).The third portion (804B) of the fourth substrate (804) may be positioned outside the protrusion (215) of the housing (210). For example, the third portion (804B) of the fourth substrate (804) may be positioned above the protrusion (215) of the housing (210). The lower surface of the third portion (804B) of the fourth substrate (804) may be positioned above the upper surface of the protrusion (215) of the housing (210).

[0231] The connector (805) can be coupled or connected to another connector or external device outside of the camera device (200). The connector (805) connected to another external connector may correspond to a fixed part that does not move when the OIS is driven. Since the third part (804C) of the fourth substrate (804) includes at least one bent or curved area, it can resiliently support the camera device (200) or the OIS moving part and can serve to alleviate shock from the outside. That is, the third part (804C) of the fourth substrate (804) can serve as a spring that alleviates shock. In addition, since the third part (804C) of the fourth substrate (804) can serve to resiliently support the OIS moving part, it can reduce the driving force or driving power required when the OIS is driven.

[0232] The camera device (200) may include a reinforcing member (70) disposed, coupled, or attached to at least a portion of the fourth substrate (804). The reinforcing member (70) may be disposed, coupled, or attached to at least one of the first portion (804A) and the second portion (804B) of the fourth substrate (804). For example, the reinforcing member (70) may be disposed, coupled, or attached to at least a portion of the first portion (804A) and at least a portion of the second portion (804B) of the fourth substrate (804).

[0233] Referring to FIG. 11A, for example, the reinforcing member (70) may be disposed, coupled, or attached to the lower surface of the first portion (804A) and the lower surface of the second portion (804B) of the fourth substrate (804). For example, the reinforcing member (70) may include a first region (70A) disposed, coupled, or attached to the first portion (804A) and a second region (70B) disposed, coupled, or attached to the second portion (804B). The second region (70B) may be bent upward from the first region (70A). For example, a bent portion may be formed between the first region (70A) and the second region (70B). For example, the area of ​​the second region (70B) may be larger than the area of ​​the first region (70A). In other embodiments, the two may be the same, or the area of ​​the former (70B) may be smaller than the area of ​​the latter (70A). For example, the reinforcing member (70) may be spaced apart from the third portion (804C) of the fourth substrate (804). For example, the second region (70B) of the reinforcing member (70) may be spaced apart from the third portion (804C) of the fourth substrate (804). In another embodiment, at least a portion of the second region (70B) of the reinforcing member (70) may be in contact with the third portion (804C) of the fourth substrate (804).

[0234] In another embodiment, the reinforcing member (70) may be positioned, coupled, or attached to the upper surface of the first portion (804A) and the upper surface of the second portion (804B) of the fourth substrate (804). For example, in another embodiment, the reinforcing member (70) may include a first region positioned on the upper surface of the first portion (804A) of the fourth substrate (804) and a second region positioned on the upper surface of the second portion (804B) of the fourth substrate (804). In yet another embodiment, the reinforcing member (70) may be positioned, coupled, or attached to at least a portion of the second portion (804B) and at least a portion of the third portion (804C) of the fourth substrate (804). For example, in another embodiment, the reinforcing member (70) may be positioned, coupled, or attached to the second portion (804B) and the third portion (804C) of the fourth substrate (804). For example, the reinforcing member (70) may include a first region that is disposed, coupled, or attached to a second portion (804B) of the fourth substrate (804) and a second region that is disposed, coupled, or attached to a third portion (804C), and a bending portion may be formed between the first region and the second region. The first region of the reinforcing member (70) may be disposed on a lower surface (or upper surface) of the second portion (804B), and the second region of the reinforcing member (70) may be disposed on a lower surface (or upper surface) of the third portion (804C).

[0235] The reinforcing member (70) can prevent the fourth substrate (804) from being damaged, deformed, or broken due to impact or external force. In addition, the reinforcing member (70) can serve to suppress the shape of the fourth substrate (804) from being deformed and restored due to the force applied to the fourth substrate (804) by the tilting of the OIS moving part (100). For example, the reinforcing member (70) can include at least one of a metal material or an injection-molded material. For example, the reinforcing member (70) can be disposed inside the groove (16A) of the protrusion (215) of the housing (210). For example, at least a portion of the reinforcing member (70) can be in contact with the groove (16A) of the protrusion (215) of the housing (210). For example, the reinforcing member (70) may not be coupled with the housing (210) (e.g., the protrusion (215)). In another embodiment, for example, the reinforcing member (70) may be joined to the housing (210) (e.g., the protrusion (215)) by an adhesive.

[0236] Fig. 11b shows another embodiment (70-1) of the reinforcing member of Fig. 11a.

[0237] Referring to FIG. 11B, the reinforcing member (70-1) may include an opening (73). The opening (73) of the reinforcing member (70-1) may open or expose at least a portion of the fourth substrate (804) of the circuit board (800). For example, the opening (73) may open or expose at least a portion of a first portion (804A) (or “first region”) and a second portion (804B) (or “second region”) of the fourth substrate (804). The opening (73) of the reinforcing member (70-1) may be a hole, a through hole, or a hollow. The opening (73) may be formed in at least one of the first region (70A) and the second region (70A) of the reinforcing member (70-1). For example, the opening (73) may be formed in the first region (70A) and the second region (70A) of the reinforcing member (70-1). In addition, the opening (73) may open or expose at least a portion of the first bending portion (804D). In another embodiment, the opening may be formed in only one of the first region (70A) and the second region (70A) of the reinforcing member (70-1). In addition, the opening may not expose the first bending portion (804D). The elastic modulus of the second substrate (802) of the circuit board (800) coupled to the reinforcing member (70-1) may be reduced by the opening (73), thereby facilitating movement of the OIS moving portion during OIS driving. That is, the elastic force of the circuit board (800) supporting the OIS moving portion, for example, the second substrate (802), may be reduced by the opening (73), thereby facilitating OIS driving with a small driving force and reducing power consumption. At this time, the driving force may be a force resulting from the interaction between the coil (230) and the magnet (310).

[0238] The movement restraining member (80) can be coupled with the protrusion (215) of the housing (210). For example, the movement restraining member (80) can be coupled with the engaging groove (215A, 215B) of the protrusion (215) of the housing (210). Referring to FIG. 3, at least a portion of the second portion (804B) of the fourth substrate (804) can be disposed between the movement restraining member (80) and the inner surface of the protrusion (215) of the housing (210). For example, at least a portion of the reinforcing member (80) can be disposed between the movement restraining member (80) and the inner surface of the protrusion (215) of the housing (210). The movement restraining member (80) can be spaced apart from the circuit board (800) in the second direction (X-axis direction) or the third direction (Y-axis direction). For example, the movement restraining member (80) may be spaced apart from the circuit board (800) in the direction of the optical axis or in a direction perpendicular to the optical axis. That is, the movement restraining member (800) may serve to maintain the shape of the bending member (804D, 804E) of the fourth substrate (804), which is a flexible substrate. For example, the movement restraining member (80) may be an injection-molded product made of a non-magnetic material or resin. In another embodiment, the movement restraining member (800) may be in contact with at least a portion of the fourth substrate (804) of the circuit board (800).

[0239] At least a part of the second part (804B) of the fourth substrate (804) positioned within the groove (16A) of the protrusion (215) can be restricted from moving or moving by the movement restraining member (800), and the second part (804B) can be restrained or prevented from moving out of the groove (16A) of the protrusion (215). As a result, the OIS moving part can be restrained or prevented from being affected by the restoring force of the fourth substrate (804) during OIS operation, thereby enabling accurate OIS operation and improving the reliability of OIS operation. The movement restraining member (800) can also be expressed as a “clamp”.

[0240] The cover member (300) may form a receiving space together with the housing (210), and an OIS moving part may be arranged within the receiving space. For example, the cover member (300) may have a box shape with an open bottom. For example, the cover member (300) may include a top plate (301) and a side plate (302) connected to the top plate (301). The lower end of the side plate (302) of the cover member (300) may be coupled to the housing (210). The shape of the top plate (302) of the cover member (300) may be polygonal (e.g., square or octagonal) or circular. The top plate (302) of the cover member (300) may include an opening (303) for exposing a lens (not shown) to external light. The opening (303) may be a through hole that penetrates the top plate (302) of the cover member (300) in the direction of the optical axis. For example, the cover member (300) may have multiple side plates. The material of the cover member (300) may be a non-magnetic material. In another embodiment, the cover member (300) may be a magnetic material. For example, the material of the cover member (300) may be an injection-molded material such as resin or a metal material.

[0241] The cover member (300) may include an opening (304) positioned or formed in the side plate (302) to avoid spatial interference with the protrusion (215) of the housing (210). For example, the protrusion (216) of the housing (210) may pass through the opening (304) of the cover member (300) and protrude from the side plate (302) of the cover member (300). The cover member (300) may include a protrusion (305) positioned over the opening (304) and protruding from the side plate (302). The protrusion (305) may be plate-shaped. For example, the protrusion (305) of the cover member (300) may be positioned on the protrusion (215) of the housing (210). For example, the protrusion (305) may be disposed above the groove (16A) of the protrusion (215) of the housing (210). For example, the protrusion (305) may be disposed above the movement-inhibiting portion (80). For example, the protrusion (305) may overlap the movement-inhibiting portion (80) in the optical axis direction. Also, for example, the protrusion (305) may overlap the first part (804A) of the fourth substrate (804) in the optical axis direction. The protrusion (305) may suppress or prevent the movement-inhibiting portion (80) from being detached, and may protect the movement-inhibiting portion (80) and the fourth substrate (804) from impact.

[0242] Referring to FIG. 4E, the cover member (300) may include a protrusion (311) protruding from the upper plate (301). For example, the protrusion (311) may protrude from the inner surface of the upper plate (301) of the cover member (300) toward the bobbin (110) or the cloud member (21). For example, the protrusion (311) may face or overlap with the receiving portion (116) of the bobbin (110) in the optical axis direction. At least a portion of the protrusion (311) may be inserted or disposed within the receiving portion (116) of the bobbin (110). The protrusion (311) may be disposed on the cloud member (21). For example, the cover member (300) may include a first protrusion (311A) corresponding to, opposite to, or overlapping with the first receiving portion (116A) of the first cloud member (21A) or the bobbin (110). For example, the cover member (300) may include a second protrusion (311B) corresponding to, opposite to, or overlapping with the second receiving portion (116B) of the second cloud member (21B) or the bobbin (110). For example, the protrusion (311) may include a groove that is recessed from the upper surface of the upper plate (301) of the cover member (330). In other embodiments, the protrusion (311) may not include a groove.

[0243] The cover member (300) is provided with a protrusion (311), so that the embodiment can prevent the cloud member (21) from being separated from the receiving portion (116) of the bobbin (110). In addition, the protrusion (311) can also serve as a stopper to prevent the bobbin (110) from moving any further in the upward direction within a limited range.

[0244] The following describes the support.

[0245] The support may be disposed between the fixed portion and the OIS moving portion. The support may connect the fixed portion and the OIS moving portion. The support may support the OIS moving portion with respect to the fixed portion. For example, the support may be disposed between the sensor base (270) and the housing (210), and may support the sensor base (270) with respect to the housing (210). The support may include a tilting guide portion (60) disposed between the sensor base (270) and the housing (210). In addition, the support portion may include a rolling member (62) disposed between the tilting guide portion (60) and the sensor base (270). In addition, the support portion may include a rolling member (63) disposed between the tilting guide portion (60) and the housing (210).

[0246] The tilting guide unit (60) can be placed between the fixed unit and the OIS moving unit. The tilting guide unit (60) can connect the fixed unit and the OIS moving unit. The tilting guide unit (60) can support the OIS moving unit with respect to the fixed unit. The tilting guide unit (60) can also be expressed as a moving plate, a “mover,” a “mover plate,” a “driving plate,” a “moving plate,” a “driving plate,” a “plate,” a “rotating plate,” a “tilting plate,” a “moving plate,” or a “support plate.” The tilting guide unit (60) can tilt or rotate by a preset angle based on a first axis or a second axis.

[0247] For example, a first axis may be formed between a first surface of the tilting guide portion (60) facing the OIS moving portion (e.g., sensor base (270)) and the OIS moving portion, and a second axis may be formed between a second surface of the tilting guide portion (60) facing the fixed portion (e.g., housing (210)) and the fixed portion. For example, the tilting guide portion (60) may be arranged between the lower portion (or bottom surface) of the sensor base (270) and the lower portion (42) of the housing (210). For example, at least a portion of the tilting guide portion (60) may be arranged within the mounting portion (25A) of the sensor base (270). Since the tilting guide portion (60) is arranged within the mounting portion (25A), the length or height of the camera device (200) in the optical axis direction may be reduced.

[0248] The tilting guide part (60) may include a body. The tilting guide part (60) may be in the shape of a plate. For example, the length of the tilting guide part (60) in a horizontal direction (e.g., a horizontal direction or a vertical direction) perpendicular to the optical axis may be greater than the length of the tilting guide part (60) in the optical axis direction.

[0249] Referring to FIG. 9A, the tilting guide part (60) may include a groove (65) for placing at least a portion of the cloud member (62). The groove (65) may be placed or formed on a first surface (6A) of the tilting guide part (60). The first surface (6A) may be a surface facing or opposing the sensor base (270). The groove (65) may be recessed from the first surface (6A) of the tilting guide part (60). For example, the tilting guide part (60) may include a first groove (65A) for placing at least a portion of the first ball member (62A) and a second groove (65B) for placing at least a portion of the second ball member (62B). For example, the grooves (65A, 65B) may be placed to be spaced apart from each other in a second direction (e.g., in the X-axis direction). For example, the ball members (62A, 62B) may be spaced apart from each other in a second direction (e.g., in the X-axis direction). In another embodiment, the grooves of the tilting guide member (60) for arranging the ball members (62A, 62B) may be spaced apart from each other in a third direction (e.g., in the Y-axis direction). That is, in another embodiment, the ball members of the cloud member (62) may be spaced apart from each other in the third direction. The groove (65) may contact the cloud member (62) at at least one point. For example, the groove (65) may include a bottom surface and at least one side surface connected to the bottom surface. At least one side surface of the groove (65) may be an inclined surface. For example, the groove (65) may include a bottom surface and a plurality of inclined surfaces. The shapes of the inclined surfaces of the groove (65) may be the same as each other. In another embodiment, at least one of the inclined surfaces of the groove (65) may have a different shape from the others.

[0250] Referring to FIG. 9B, the tilting guide portion (60) may include a groove (66) for arranging at least a portion of the cloud member (63). The groove (66) may be arranged or formed on a second surface (6B) of the tilting guide portion (60). The second surface (6B) may be a surface facing or opposing the housing (210). In addition, the second surface (6B) may be an opposite surface of the first surface (6A) of the tilting guide portion (60). The groove (66) may be recessed from the second surface (6B) of the tilting guide portion (60).

[0251] For example, the tilting guide part (60) may include a first groove (66A) for arranging at least a portion of the first ball member (63A) and a second groove (66B) for arranging at least a portion of the second ball member (63B). For example, the grooves (66A, 66B) may be arranged to be spaced apart in a third direction (e.g., in the Y-axis direction). For example, the ball members (63A, 63B) may be arranged to be spaced apart in the third direction (e.g., in the Y-axis direction). In another embodiment, the grooves of the tilting guide part (60) for arranging the ball members (63A, 63B) may be arranged to be spaced apart in a second direction (e.g., in the X-axis direction). That is, in another embodiment, the ball members of the cloud member (63) may be arranged to be spaced apart in the second direction. The groove (66) may contact the cloud member (63) at at least one point. For example, the groove (66) may include a bottom surface and at least one side surface connected to the bottom surface. At least one side surface of the groove (66) may be an inclined surface. For example, the groove (66) may include a bottom surface and a plurality of inclined surfaces. The shapes of the inclined surfaces of the groove (66) may be the same. In other embodiments, at least one of the inclined surfaces of the groove (66) may have a different shape from the others.

[0252] The tilting guide unit (60) may include a first escape unit (61A) to avoid spatial interference with the gyro sensor (820). In addition, the tilting guide unit (60) may include a second escape unit (61B) provided at a position corresponding to or symmetrical to the first escape unit (61A). The second escape unit (61B) balances the weight of the first escape unit (61A) to balance the tilting or rotation of the tilting guide unit (60), thereby improving the reliability of the OIS operation.

[0253] For example, the first escape portion (61A) may be a recessed groove from one area of ​​the outer surface of the tilting guide portion (60). The second escape portion (61B) may be a recessed groove from another area of ​​the outer surface of the tilting guide portion (60). For example, the tilting guide portion (60) may include four corner portions (or corner regions), the first escape portion (61A) may be formed at the first corner portion of the tilting guide portion (60), and the second escape portion (61B) may be formed at the second corner portion located opposite the first corner portion. The third corner portion and the fourth corner portion of the tilting guide portion (60) may be rounded, but in another embodiment, at least one of the first to fourth corner portions may be right-angled.

[0254] The tilting guide part (60) may include an opening (60A) corresponding to, opposite to, or overlapping with the magnetic body (31) or / and the magnetic body (32). For example, the opening (60A) may correspond to, opposite to, or overlap with the protrusion (28) of the sensor base (270). The opening (60A) may reduce the weight (or weight) of the tilting guide part (60), thereby making the camera device (200) lighter.

[0255] For example, the opening (60A) of the tilting guide part (60) may be positioned at a position corresponding to the protrusion (28) in order to avoid spatial interference with the protrusion (28) of the sensor base (270). In addition, the opening (60A) may be formed in order to avoid spatial interference with the magnetic body (31) and the protrusion (28) of the sensor base (270). For example, the opening (60A) of the tilting guide part (60) may be a through hole. For example, the opening (60A) may penetrate the tilting guide part (60) in the first direction (Z-axis direction) or the optical axis direction. For example, at least a portion of the opening (60A) of the tilting guide part (60) may have a shape corresponding to the protrusion (28) of the sensor base (270). For example, the opening (60A) may have a circular, oval, polygonal, for example, rectangular shape. For example, the horizontal length of the opening (60A) may be greater than the horizontal length of the protrusion (28) of the sensor base (270). In another embodiment, the horizontal length of the opening (60A) may be the same as the horizontal length of the protrusion (28) of the sensor base (270). The vertical length of the opening (60A) may be greater than the vertical length of the protrusion (28) of the sensor base (270). In another embodiment, the vertical length of the opening (60A) may be the same as the vertical length of the protrusion (28) of the sensor base (270).

[0256] At least a portion of the protrusion (28) of the sensor base (270) may be positioned within the opening (60A) of the tilting guide portion (60). For example, the protrusion (28) of the sensor base (270) may overlap with the opening (60A) of the tilting guide portion (60) in the optical axis direction. Also, for example, the protrusion (28) of the sensor base (270) may overlap with the tilting guide portion (60) in a direction perpendicular to the optical axis direction. This may reduce the length or height of the camera device (200) in the optical axis direction. For example, the opening (60A) may be positioned between the grooves (65A, 65B) of the tilting guide portion (60). Also, the opening (60A) may be positioned between the grooves (66A, 66B) of the tilting guide portion (60).

[0257] For example, the tilting guide part (60) may be an injection molded product. For example, the tilting guide part (60) may be made of plastic, resin, or ceramic. In another embodiment, the tilting guide part (60) may include a metal, for example, a SUS material. In addition, the tilting guide part (60) may be a non-magnetic material. In another embodiment, the tilting guide part (60) may be a magnetic material.

[0258] The cloud member (62) and the cloud member (63) may be arranged in parallel along directions that intersect or are perpendicular to each other. The OIS moving unit may be rotated, pivotally rotated, or tilted in one of the second and third directions by the cloud member (62). And the OIS moving unit may be rotated, pivotally rotated, or tilted in the other of the second and third directions by the cloud member (63).

[0259] The cloud member (62) may be disposed between the sensor base (270) and the tilting guide member (60). The cloud member (62) may include one or more ball members. In FIG. 2A, the cloud member (62) exemplifies two ball members, but in other embodiments, the cloud member (62) may include three or more ball members. A first axis may be formed by the ball members (62A, 62B) of the cloud member (62). For example, the cloud member (62) may be disposed between the lower portion (or bottom surface) of the sensor base (270) and the first surface (6A) of the tilting guide member (60). For example, the cloud member (62) may be disposed between the groove (29) of the sensor base (270) and the groove (65) of the tilting guide member (60). To reduce friction, a lubricant may be placed in at least one of the groove (29) of the sensor base (270) and the groove (65) of the tilting guide portion (60).

[0260] The cloud member (63) may be disposed between the tilting guide part (60) and the housing (210). The cloud member (63) may include one or more ball members. In FIG. 2A, the cloud member (63) exemplifies two ball members, but in other embodiments, the cloud member (63) may include three or more ball members. A second axis may be formed by the ball members (63A, 63B) of the cloud member (63). For example, the cloud member (63) may be disposed between the second surface (6B) of the tilting guide part (60) and the lower portion (42) of the housing (210). For example, the cloud member (63) may be disposed between the groove (66) of the tilting guide part (60) and the groove (55) of the housing (210). To reduce friction, a lubricant may be placed in at least one of the groove (66) of the tilting guide portion (60) and the groove (55) of the housing (210).

[0261] The cloud members (62, 63) may be members that perform rolling motion, for example, the cloud members (62, 63) may be "balls", "ball members", or "ball bearings". The number of each of the cloud members (62, 63) is exemplified as two, but may be one or three or more in other embodiments. Since the cloud members (62, 63) perform rolling motion or sliding motion, frictional force may be relatively reduced, and thus current consumption or power consumption for driving the OIS may be reduced.

[0262] Referring to FIG. 4d, the cloud member (21) may not overlap with the tilting guide member (60) in the direction of the optical axis. For example, as illustrated in FIG. 4c, the cloud member (21) may not overlap with the tilting guide member (60) in the direction perpendicular to the optical axis. For example, the separation direction of the first cloud member (21A) and the second cloud member (21B) may be perpendicular to or intersect with the separation direction of the ball member (62A) and the ball member (62B). In other embodiments, the former and the latter may be parallel. For example, the separation direction of the first cloud member (21A) and the second cloud member (21B) may be parallel to or intersect with the separation direction of the ball member (63A) and the ball member (63B). In other embodiments, the former and the latter may be perpendicular.

[0263] For example, when viewed from above, the separation distance between the ball member (63A) and the ball member (63B) may be smaller than the separation distance between the first cloud member (21A) and the second cloud member (21B). In other embodiments, the separation distance between the ball member (63A) and the ball member (63B) may be equal to or greater than the separation distance between the first cloud member (21A) and the second cloud member (21B). For example, when viewed from above, the separation distance between the ball member (62A) and the ball member (62B) may be smaller than the separation distance between the first cloud member (21A) and the second cloud member (21B). In other embodiments, the separation distance between the ball member (62A) and the ball member (62B) may be equal to or greater than the separation distance between the first cloud member (21A) and the second cloud member (21B).

[0264] Referring to FIGS. 4A to 4D, the tilting guide unit (60) may be positioned below the image sensor (810). In addition, at least a portion of the tilting guide unit (60) may overlap the image sensor (810) in the optical axis direction. At least a portion of the tilting guide unit (60) may overlap the lens module (400) (e.g., lens) in the optical axis direction. For example, at least a portion of the opening (60A) of the tilting guide unit (60) may overlap the image sensor (810) in the optical axis direction. At least a portion of the opening (60A) of the tilting guide unit (60) may overlap the lens module (400) in the optical axis direction. For example, at least a portion of the cloud members (62, 63) may overlap the image sensor (810) in the optical axis direction. At least a portion of the cloud members (62, 63) may overlap the lens module (400) in the optical axis direction.

[0265] Since the image sensor (810) is arranged on the upper side of the tilting guide unit (60), the size or arrangement of the image sensor (810) (or lens module (400)) may not be restricted by the shape or size of the tilting guide unit (60). Therefore, the embodiment enables mounting of a large-diameter lens module (400), enables mounting of an image sensor (810) having a large size, and enables implementation of an ultra-high-pixel camera device. In addition, since at least a part of the tilting guide unit (60) may overlap with the image sensor (810) in the optical axis direction, the tilting guide unit (60) can stably support the OIS moving unit when the OIS is driven, and can improve the tilting accuracy of the OIS moving unit, thereby improving the reliability of image stabilization (or shake correction).

[0266] In addition, since at least a part of the ball members (62A, 62B) or the ball members (63A, 63B) can overlap with the image sensor (810) (or lens module (400)) in the optical axis direction, when the OIS is driven, the OIS moving part can be stably tilted based on the first axis or the second axis, and the tilting accuracy of the OIS moving part can be improved and the reliability of the shake correction (or shake correction) can be improved.

[0267] The support may include a magnetic body (31) disposed on the OIS moving part and a magnetic body disposed on the fixed part. For example, the magnetic body (31) may be disposed on the sensor base (270), and the magnetic body (32) may be disposed on the housing (210). The magnetic body (31) and the magnetic body (32) may be a “magnet,” a “yoke,” or a “holding magnet.”

[0268] For example, the magnetic body (31) may be placed in the groove (28A) of the protrusion (28) of the sensor base (270) or may be coupled to the groove (28a). At least a portion of the magnetic body (31) may be placed in the opening (60A) of the tilting guide part (60). For example, the magnetic body (31) may face or overlap with the opening (60A) of the tilting guide part (60) in the optical axis direction. For example, the magnetic body (31) may not overlap with the tilting guide part (60) in the optical axis direction. Also, for example, at least a portion of the magnetic body (31) may overlap with the tilting guide part (60) in a direction perpendicular to the optical axis.

[0269] The magnetic body (31) may correspond to, face, or overlap with the magnetic body (32) in the direction of the optical axis. For example, the magnetic body (31) may be a two-pole magnet distinguished by a N pole and a S pole. For example, the magnetic body (31) may be a two-pole magnet distinguished by or arranged by a N pole and a S pole in the direction of the optical axis. In another embodiment, the magnetic body (31) may be a two-pole magnet distinguished by or arranged by a N pole and a S pole in a direction perpendicular to the optical axis. In yet another embodiment, the magnetic body (31) may be a four-pole magnet including two N poles and two S poles.

[0270] The magnetic body (32) may be placed below the magnetic body (31). The magnetic body (32) may be placed within the groove (46) of the housing (210). For example, the magnetic body (32) may be coupled to the groove (46) of the housing (210). The magnetic body (32) may overlap with the opening (60A) of the tilting guide part (60) in the direction of the optical axis. The magnetic body (32) may not overlap with the tilting guide part (60) in the direction of the optical axis. The magnetic body (32) may not overlap with the tilting guide part (60) in a direction perpendicular to the optical axis. In another embodiment, the magnetic body (32) may overlap with the tilting guide part (60) in a direction perpendicular to the optical axis.

[0271] When viewed from above, the area of ​​the opening (60A) of the tilting guide part (60) may be larger than the area of ​​the upper surface (or lower surface) of the magnetic body (31). Also, when viewed from above, the area of ​​the opening (60A) of the tilting guide part (60) may be larger than the area of ​​the upper surface (or lower surface) of the magnetic body (32).

[0272] For example, a holding force may be applied between the magnetic body (32) and the magnetic body (31). The holding force may be a force with which the fixed part and the OIS moving part press the tilting guide part (60). The holding force may be a force with which the sensor base (270) and the housing (210) press the tilting guide part (60). The holding force may be a force that maintains support of the OIS moving part with respect to the fixed part. The holding force may be a pressing force. For example, the holding force may be an attractive force applied between the magnetic body (32) and the magnetic body (31) in the optical axis direction (or the first direction). An attractive force may be applied between the magnetic body (32) and the magnetic body (31) in the optical axis direction or the first direction.

[0273] The magnetic body (32) may be formed of a material that adheres to the magnetic body (31). For example, the magnetic body (32) may be formed of a metallic material that adheres to a magnet. Or, for example, the magnetic body (32) may be formed of a magnetic metallic material. Or, for example, the magnetic body (32) may be a magnet. The magnetic body (32) may also be expressed as a “yoke.” In another embodiment, the magnetic body (31) may be a “yoke” and the magnetic body (32) may be a “magnet.” In yet another embodiment, each of the magnetic bodies (31) and the magnetic bodies (32) may be magnets.

[0274] The sensor base (270) and the housing (210) can press the tilting guide part (60) by the attractive force between the magnetic body (32) and the magnetic body (31), and the tilting guide part (60) and the cloud members (62, 63) can be in close contact with the sensor base (270) and / or the housing (210). By the attractive force between the magnetic body (32) and the magnetic body (31), the tilting guide part (60) and the cloud members (62, 63) can stably support the OIS moving part with respect to the fixed part, and a stable OIS operation can be performed.

[0275] In addition, since at least a part of the magnetic body (31) is disposed within the opening (60A) of the tilting guide part (60), the distance between the magnetic body (31) and the magnetic body (32) can be reduced, thereby increasing the attractive force between the magnetic body (31) and the magnetic body (32), and allowing the OIS moving part to be stably supported on the fixed part. In addition, since the magnetic body (31) is disposed in the central region of the lower surface of the sensor base (270), and the magnetic body (32) is disposed in the center of the lower portion (42) of the housing (210), the attractive force between the magnetic body (31) and the magnetic body (32) can be concentrated on the center of the sensor base (270) and the center of the housing (210), thereby allowing the OIS moving part to be efficiently and stably supported.

[0276] In another embodiment, the protrusion of the sensor base (270) may be omitted, the magnetic body (31) may be placed on the lower surface of the sensor base (270), the housing (210) may include a protrusion placed on the lower portion (42) of the housing (210) so as to correspond to, face, or overlap with the opening (60A) of the tilting guide portion (60), and the magnetic body (32) may be placed on the protrusion of the housing (210). At this time, the mounting portion (25A) of the sensor base (270) may be omitted, and a mounting portion corresponding to or identical to the mounting portion (25A) of the sensor base (270) may be formed on the upper surface of the lower portion (42) of the housing (210), the tilting guide portion (60) may be placed within the mounting portion of the housing (210), the protrusion may protrude from the bottom surface of the mounting portion of the housing (210), a groove may be formed in the protrusion of the housing (210) for placing a magnetic body (32), and a groove may be formed in the lower surface of the sensor base (270) for placing a magnetic body (31). In addition, in another embodiment, at least a part of the protrusion of the housing (210) may be placed within the opening (60A) of the tilting guide portion (60) and may overlap with the tilting guide portion (60) in a direction perpendicular to the optical axis. In addition, in another embodiment, a magnetic body (32) may be placed in a protrusion (or a groove of the protrusion) of the housing (210), and a magnetic body (31) may be placed in a sensor base (270) (or a groove of the sensor base (270)). In another embodiment, the magnetic body (32) may overlap with the tilting guide part (60) in a direction perpendicular to the optical axis.

[0277] In another embodiment, the holding force may be a repulsive force acting between a magnetic body placed in the fixed portion and a magnetic body placed in the moving portion. In another embodiment, a repulsive force may be applied between the magnetic body placed in the fixed portion and the magnetic body placed in the moving portion, and the sensor base and the housing may press the tilting guide unit (60) by the repulsive force, and the tilting guide unit (60) may support the OIS moving portion.

[0278] Fig. 9c is a front perspective view of a tilting guide part (60-1) according to another embodiment, and Fig. 9d is a rear perspective view of the tilting guide part (60-1) of Fig. 9c.

[0279] In the embodiments of FIGS. 9C and 9D, the cloud members (62, 63) of FIG. 2A may be omitted, and the tilting guide part (60-1) may include at least one protrusion (65-1) corresponding to the cloud member (62) of FIG. 2A and at least one protrusion (66-1) corresponding to the cloud member (63) of FIG. 2A. For example, the number of protrusions (65-1) may be plural, and the number of protrusions (66-1) may be plural. For example, the protrusion (65-1) may include two first protrusions (65A1, 65B1) spaced apart from each other, and the protrusion (66-1) may include two second protrusions (65A1, 65B1) spaced apart from each other. The first protrusions (65A1, 65B1) may protrude from the first surface (6A) of the tilting guide portion (60-1), and the second protrusions (66A1, 66B1) may protrude from the second surface (6B) of the tilting guide portion (60-1). For example, each of the first protrusions (65A1, 65B1) may have a hemispherical or dome shape, and each of the second protrusions (66A1, 66B1) may have a hemispherical, semicircular, semi-elliptical, or dome shape.

[0280] For example, the tilting guide part (60-1) may include a body and first protrusions (65A1, 65B1) and second protrusions (66A1, 66B1) protruding from the body. At this time, the body, the first protrusions (65A1, 65B1), and the second protrusions (66A1, 66B1) may be formed integrally. At least a part of the protrusion (65-1) of the tilting guide part (60-1) may be arranged in the groove (29) of the sensor base (270). At least a part of the protrusion (66-1) of the tilting guide part (60-1) may be arranged in the groove (55) of the housing (210). The protrusion (65-1) of the tilting guide part (60-1) may slide within the groove (29) of the sensor base (270), and the tilting guide part (60-1) may be formed integrally. The protrusion (66-1) can slide within the groove (55) of the housing (210). This can reduce the friction between the tilting guide part (60-1) and the sensor base (270) and / or the friction between the tilting guide part (60-1) and the housing (210), and can reduce the current consumption or power consumption for driving the OIS.

[0281] The first protrusions (65A1, 65B1) can form a first axis, and the second protrusions (66A1, 66B2) can form a second axis. The description of the arrangement of the ball members (62A, 62B) of FIG. 2A can be applied or applied similarly to the first protrusions (65A1, 65B1) of the tilting guide part (60-1), and the description of the arrangement of the ball members (63A, 63B) of FIG. 2A can be applied or applied similarly to the second protrusions (66A1, 66B1) of the tilting guide part (60-1). For example, at least some of the first protrusions (65A1, 65B1) of the tilting guide part (60-1) can overlap with the image sensor (810) in the optical axis direction. For example, at least some of the first protrusions (65A1, 65B1) of the tilting guide portion (60-1) may overlap with the lens module (400) in the optical axis direction. For example, at least some of the second protrusions (66A1, 66B2) of the tilting guide portion (60-1) may overlap with the image sensor (810) in the optical axis direction. For example, at least some of the second protrusions (66A1, 66B2) of the tilting guide portion (60-1) may overlap with the lens module (400) in the optical axis direction.

[0282] FIG. 15 shows the electromagnetic force (Fa) between the coil (120) and the magnet (130) and the holding force (FH) acting between the magnetic body (31) and the magnetic body (32), FIG. 16a shows the separation distance (d1) between the coil (120) and the magnet (130) and the separation distance between the magnetic body (31) and the magnetic body (32), and FIG. 16b shows the thickness (T1) and the area (AREA1) of the magnetic body (31), the thickness (T2) and the area (AREA2) of the magnet (130), and the thickness (T3) and the area (AREA3) of the magnetic body (32).

[0283] Referring to FIGS. 15, 16a, and 16b, the holding force (FH) acting between the magnetic body (31) and the magnetic body (32) may be greater than the electromagnetic force (Fa) between the coil (120) and the magnet (130). The holding force (FH) may be a force acting in the optical axis direction or the first direction. The holding force (FH) may be 1.2 times or more and 25 times or less of the electromagnetic force (Fa).

[0284] The holding force (FH) may be at least 5 times the weight (or weight) (W) of the OIS moving part and at most 100 times the weight (or weight) (W) of the OIS moving part (5 × W ≤ FH ≤ 100 × W). In other embodiments, 10 × W ≤ FH ≤ 50 × W may be present.

[0285] The weight (or weight) (W) of the OIS moving part may include the weight of the OIS moving part and the weight of the lens module (400). Alternatively, in another embodiment, the weight (or weight) (W) of the OIS moving part may include the tension (Ft) (or elastic force) of the circuit board (800) connecting the fixed part and the OIS moving part to each other. The elastic force (Ft) of the circuit board (800) may be the product of the elastic coefficient (K) of the circuit board (800) and the displacement (x) of the circuit board (800) during OIS operation (Ft = K × x).

[0286] If the holding force (FH) is less than 1.2 times the electromagnetic force (Fa), the holding force (FH) is too small, so that tilting of the OIS moving part due to the electromagnetic force (Fa) may be significant during AF operation, which may cause a deterioration in OIS performance and may deteriorate the resolution of the image of the camera device (200).

[0287] When the holding force (FH) exceeds 25 times the electromagnetic force (Fa), the force pressing the tilting guide part (60) is too large, so that a large driving force is required to tilt the OIS moving part when the OIS is driven, which may increase power consumption.

[0288] In another embodiment, the holding force (FH) may be at least three times and no more than twenty times the electromagnetic force (Fa). This allows for stably preventing tilting of the OIS moving unit due to the electromagnetic force (Fa) during AF operation, and for preventing an increase in power consumption required to tilt the OIS moving unit. In another embodiment, the holding force (FH) may be at least five times and no more than ten times the electromagnetic force (Fa).

[0289] In order to ensure that the holding force (FH) is 1.2 times or more and 25 times or less than the electromagnetic force (Fa), the separation distance (d1) between the coil (120) and the magnet (130) and the separation distance (d2) between the magnetic body (31) and the magnetic body (32) can be designed as follows.

[0290] The first separation distance (d1) may be smaller than the second separation distance (d2) (d1 <d2). 또는 다른 실시 예에서는 제1 이격 거리(d1)는 제2 이격 거리(d2)와 동일할 수도 있다(d1=d2). 예컨대, 제2 이격 거리(d2)는 제1 이격 거리(d1)의 1배 이상이고 제1 이격 거리(d1)의 4.5배 이하일 수 있다(d1 ≤ d2 ≤ 4.5 × d1). 다른 실시 예에서는 제2 이격 거리(d2)는 제1 이격 거리(d1)의 1.5배 이상일 수 있고 제1 이격 거리(d1)의 3배 이하일 수도 있다(1.5 × d1 ≤ d2 ≤ 3 × d1).

[0291] If the first separation distance (d1) is greater than the second separation distance (d2), the tilt compensation angle of the OIS moving part for OIS operation may be limited, and the holding force (FH) may be too large, which may increase the power consumption for OIS operation.

[0292] In addition, when the second separation distance (d2) exceeds 4.5 times the first separation distance (d1), the size of the first magnetic body (31) and the size of the second magnetic body (32) may be increased to obtain sufficient holding force (FH), so that the weight of the OIS driving unit may increase and the size of the camera device may increase.

[0293] The thickness (T2) of the magnet (130) may be greater than the thickness (T1) of the magnetic body (31) (T2 > T1). In other embodiments, T2 may be equal to T1. T1 may be the length of the magnetic body (31) in the optical axis direction or the first direction. T3 may be the length of the magnetic body (32) in the optical axis direction or the first direction. T2 may be the length of the magnet (130) in the direction in which the magnet (130) and the coil (120) face each other.

[0294] The thickness (T2) of the magnet (130) may be greater than the thickness (T1) of the magnetic body (31) (T2>T1).

[0295] For example, T2 may be at least 1.5 times T1 and at most 4 times T1 (1.5 × T1 ≤ T2 ≤ 4 × T1). In other embodiments, 2 × T1 ≤ T2 ≤ 3 × T1.

[0296] If T2 is less than 1.5 times T1, the holding force (FH) may be too large, increasing the power consumption required for OIS operation. If T2 is more than 4 times T1, the holding force (FH) may be reduced, causing the OIS moving part to tilt during AF operation.

[0297] In other embodiments, T2 may be identical to T3.

[0298] The thickness (T2) of the magnet (130) may be greater than the thickness (T3) of the magnetic body (32) (T2>T3).

[0299] For example, T2 may be at least three times T3 and at most nine times T3 (3 × T3 ≤ T2 ≤ 9 × T1). In other embodiments, 4 × T3 ≤ T2 ≤ 6 × T1.

[0300] If T2 is less than three times T3, the holding force (FH) may be too large, increasing the power consumption required for OIS operation. If T2 is more than nine times T3, the holding force (FH) may be reduced, causing the OIS moving part to tilt during AF operation.

[0301] The thickness (T1) of the magnetic body (31) may be greater than the thickness (T3) of the magnetic body (32) (T1>T3).

[0302] For example, T1 may be at least 1.5 times T3 and at most 7 times T3 (1.5 × T3 ≤ T1 ≤ 7 × T3). In other embodiments, 3 × T3 ≤ T1 ≤ 5 × T3 may be.

[0303] The area (AREA2) of the first surface (or second surface) of the magnet (130) may be larger than the area (AREA1) of the first surface (or second surface) of the magnetic body (31) (AREA2 > AREA1). Hereinafter, the area (AREA1) may be expressed as a “first area”, and the area (AREA2) may be expressed as a “second area”.

[0304] The first surface of the magnet (130) may be a surface facing the coil (120) or opposite the coil (120), and the second surface of the magnet (130) may be an opposite surface of the first surface of the magnet (130).

[0305] The first surface of the magnetic body (31) may be a surface facing the magnetic body (32) in the direction of the optical axis or facing the magnetic body (32), and the second surface of the magnetic body (31) may be an opposite surface of the first surface of the magnetic body (31).

[0306] The second area (AREA2) may be at least twice the size of the first area (AREA1) and at most ten times the size of the first area (AREA1) (2 × AREA1 ≤ AREA2 ≤ 10 × AREA1). In another embodiment, 3 × AREA1 ≤ AREA2 ≤ 8 × AREA1. In yet another embodiment, 4 × AREA1 ≤ AREA2 ≤ 6 × AREA1.

[0307] If the second area (AREA2) is less than twice the first area (AREA1), the holding force (FH) may be too large, which may increase the power consumption required for OIS operation. On the other hand, if the second area (AREA2) is more than 10 times the first area (AREA1), the holding force (FH) may decrease, which may cause the OIS moving part to tilt during AF operation.

[0308] The second area (AREA2) may be greater than or equal to the area (AREA3) of the first surface (or second surface) of the magnetic body (32) (AREA2 ≥ AREA3). Hereinafter, the area (AREA3) of the magnetic body (32) may be expressed as a “third area.” The first surface of the magnetic body (32) may be a surface facing the magnetic body (31) or opposite the magnetic body (31) in the optical axis direction, and the second surface of the magnetic body (32) may be an opposite surface of the first surface of the magnetic body (32).

[0309] The second area (AREA2) may be at least one time larger than the third area (AREA3) and at most nine times larger than the third area (AREA3) (1 × AREA3 ≤ AREA2 ≤ 9 × AREA3). In another embodiment, 2 × AREA3 ≤ AREA2 ≤ 7 × AREA3. In yet another embodiment, 3 × AREA3 ≤ AREA2 ≤ 5 × AREA3.

[0310] If the second area (AREA2) is less than 1 time the third area (AREA3), the holding force (FH) may be too large, which may increase the power consumption required for OIS operation. If the second area (AREA2) is more than 9 times the third area (AREA3), the holding force (FH) may decrease, which may cause the OIS moving part to tilt during AF operation.

[0311] The third area (AREA3) may be greater than or equal to the first area (AREA1) (AREA3 ≥ AREA1). The third area (AREA3) may be at least 1 time the first area (AREA1) and at most 15 times the first area (AREA1) (1 × AREA1 ≤ AREA3 ≤ 15 × AREA1). In another embodiment, 3 × AREA1 ≤ AREA3 ≤ 10 × AREA1 may be satisfied. In yet another embodiment, 4 × AREA1 ≤ AREA3 ≤ 8 × AREA1 may be satisfied.

[0312] FIG. 17a is a drawing for explaining the movement of the OIS moving part and the electromagnetic force (F1, F2) according to the interaction between the magnet units (310A, 310B) and the coil units (27A to 27D), and FIG. 17b shows the movement of the OIS moving part (100) by the electromagnetic force of FIG. 17a.

[0313] Referring to FIGS. 17A and 17B, the movement operation of the OIS moving unit by the OIS driving unit will be described. The "OIS driving unit" may also be expressed as a driving unit. The OIS driving unit can tilt and drive the OIS moving unit (e.g., the moving module) with respect to a fixed unit (e.g., the housing (210)). The OIS driving unit may include a coil (230) and a magnet (310). In addition, the OIS driving unit may include a position sensor (240).

[0314] A first electromagnetic force (F1) may be generated by the interaction between the first magnet unit (310A) and the first coil (230A). For example, the first electromagnetic force (F1) may be applied in the direction of the optical axis, for example, in the upward or downward direction. The first electromagnetic force (F1) may include a first-first electromagnetic force (F11) due to the interaction between the first coil unit (27A) and the first magnet unit (310A), and a first-second electromagnetic force (F12) due to the interaction between the second coil unit (27B) and the first magnet unit (310A). The number of turns of the first coil unit (27A) and the number of turns of the second coil unit (27B) may be the same. In this case, the number of turns may be the number of times the coil units (27A, 27B) are wound. The first electromagnetic force (F1) may be the sum of the first-first electromagnetic force (F11) and the first-second electromagnetic force (F12). For example, the first-first electromagnetic force (F11) and the first-second electromagnetic force (F12) may be different from each other. For example, the first-second electromagnetic force (F12) may be greater than the first-first electromagnetic force (F11).

[0315] In another embodiment, the first-second electromagnetic force (F12) may be equal to or smaller than the first-first electromagnetic force (F11). In another embodiment, the number of turns of the first coil unit (27A) and the number of turns of the second coil unit (27B) may be different from each other.

[0316] The OIS moving unit can be tilted about the second axis (e.g., Y-axis) (or ball member (63)) by the first electromagnetic force (F1). For example, the OIS moving unit can be tilted about the second axis by the first electromagnetic force (F1). Here, the second-axis (Y-axis) tilting may mean that the OIS moving unit is tilted based on the second axis (Y-axis) or that the OIS moving unit is rotated by a preset angle about the second axis (Y-axis) as the rotation axis. For example, the tilting guide unit (60) can be tilted about the second axis (e.g., Y-axis) (or ball member (63)) by the first electromagnetic force (F1). For example, the tilting guide unit (60) can be tilted about the second axis by the first electromagnetic force (F1).

[0317] A second electromagnetic force (F2) may be generated by the interaction between the second magnet unit (310B) and the second coil (230B). For example, the second electromagnetic force (F2) may act in an upward or downward direction. The second electromagnetic force (F2) may include a second-first electromagnetic force (F21) due to the interaction between the third coil unit (27C) and the second magnet unit (310B) and a second-second electromagnetic force (F22) due to the interaction between the fourth coil unit (27D) and the second magnet unit (310B). The number of turns of the third coil unit (27C) and the number of turns of the fourth coil unit (27D) may be the same. The second electromagnetic force (F2) may be a sum of the second-first electromagnetic force (F21) and the second-second electromagnetic force (F22). For example, the second-first electromagnetic force (F21) and the second-second electromagnetic force (F22) may be different from each other. For example, the second-second electromagnetic force (F22) may be greater than the second-first electromagnetic force (F21).

[0318] In another embodiment, the second-second electromagnetic force (F22) may be equal to or less than the second-first electromagnetic force (F21). In another embodiment, the number of turns of the third coil unit (27C) and the number of turns of the fourth coil unit (27D) may be different from each other.

[0319] The number of turns of the first to fourth coil units (27A to 27D) may be the same. Alternatively, in another embodiment, the number of turns of each of the first to fourth coil units (27A to 27D) may be different. In yet another embodiment, the number of turns of at least two of the first to fourth coil units (27A to 27D) may be the same.

[0320] By the second electromagnetic force (F2), the OIS moving part can be tilted about the first axis (e.g., X-axis) (or the ball member (62)). For example, by the second electromagnetic force (F2), the OIS moving part can be tilted about the first axis. Here, the first-axis (X-axis) tilting can mean that the OIS moving part is tilted based on the first axis (X-axis) or that the OIS moving part is rotated by a preset angle about the first axis (X-axis) as the rotation axis.

[0321] Although the embodiment of FIG. 17a describes an example in which each of the first coil (230A) and the second coil (230B) includes two coil units, F1 may be increased in proportion to the number of coil units included in the first coil (230A), and F2 may be increased in proportion to the number of coil units included in the second coil (230B).

[0322] In an embodiment, independent driving signals (ID1 to ID4) are supplied to separate independent coil units (27A to 27D), thereby increasing the driving force for OIS driving. In addition, in the embodiment, the coil units (27A, 27B) are arranged to overlap in a first axis direction (e.g., X-axis direction), and the coil units (27A, 27B) are arranged to overlap in a second axis direction (e.g., Y-axis direction), thereby increasing the electromagnetic force for OIS driving without increasing the size of the camera device in the optical axis direction.

[0323] In another embodiment, the first electromagnetic force resulting from the interaction between the first magnet unit and the first coil and the second electromagnetic force resulting from the interaction between the second magnet unit and the second coil may act in a direction other than the optical axis (e.g., a direction perpendicular to the optical axis, e.g., the X-axis direction or the Y-axis direction).

[0324] In an embodiment, tilting of an OIS moving unit due to AF driving can be suppressed by designing a separation distance (d1) between a coil (120) and a magnet (130), a separation distance (d2) between magnetic bodies, a thickness (T2) of the magnet (130), thicknesses (T1, T3) of the magnetic bodies, an area (AREA2) of the magnet (130), and areas (AREA1, AREA3) of the magnetic bodies. In an embodiment, a deterioration in the performance of an OIS operation and a deterioration in the resolution of an image of a camera device due to tilting of the OIS moving unit due to AF driving can be prevented.

[0325] Additionally, in the embodiment, a plurality of coil units (e.g., 27A, 27B) are arranged to overlap in the first axis direction to enhance the driving force for tilting the OIS moving part with respect to the second axis. Independent driving signals (ID1, ID2) can be supplied to the plurality of coil units (e.g., 27A, 27B).

[0326] Additionally, in the embodiment, a plurality of coil units (e.g., 27C, 27D) are arranged to overlap in the second axis direction to enhance the driving force for tilting the OIS moving part with respect to the first axis. Independent driving signals (ID3, ID4) can be supplied to the plurality of coil units (e.g., 27C, 27D).

[0327] In addition, in the embodiment, a greater number of turns can be secured for each of the first coil (230A) and the second coil (230B) without increasing the size, and the OIS driving force can be increased.

[0328] In a comparative example (hereinafter referred to as “Comparative Example 1”) in which one coil unit and one magnet unit are used to tilt the OIS moving part about the first and second axes, respectively, the driver IC supplies a driving signal to the coil unit through one channel. If the size of the image sensor increases and the weight of the lens module increases for high resolution, the electromagnetic force of Comparative Example 1 may be insufficient. In Comparative Example 1, if the sizes of the magnet and coil increase to supplement the insufficient electromagnetic force, the size of the lens driving device may increase, which may restrict the freedom of design for the arrangement of other configurations.

[0329] In a comparative example (hereinafter referred to as “second comparative example”) in which two coil units connected in series are used to tilt the OIS moving part about the first and second axes, respectively, a driving signal can be supplied to the coil units through one channel. In comparative example 2, since two coil units are connected in series, the resistance of the first coil or the second coil may increase, thereby reducing the electromagnetic force between the magnet unit and the coil.

[0330] In the embodiment, the first and second coil units (27A, 27B) of the first coil (230A) are not connected to each other, so that the resistance of the first coil (230A) (or the second coil (230B)) does not increase compared to the second comparative example. In the embodiment, the first and second coil units (27A, 27B) can be driven by two independent channels, and the third and fourth coil units (27C, 27D) can be driven by two independent channels. At this time, the meaning of a channel may mean a passage or path through which an independent driving signal is supplied.

[0331] In the embodiment, the degree of freedom in the use of the current of the driving signal and the resistance of the channel can be increased in each channel.

[0332] In the embodiment, since each magnet unit (310A, 310B) and a plurality of coil units (27A and 27B, or 27C and 27D) are arranged to overlap each other, the driving force by the interaction between the magnet unit (310A) and the coil units (27A, 27B) and the driving force (or Lorentz force) by the magnet unit (310B) and the coil units (27C, 27D) can be increased. In the embodiment, since the electromagnetic force (or Lorentz force) by the interaction between the magnet unit and the coil unit is increased, a heavy, large-diameter lens module can be driven, and a camera device having a high resolution can be implemented.

[0333] In a camera device (hereinafter referred to as "Comparative Example 3") in which the image sensor is fixed and the lens is moved in a direction perpendicular to the optical axis for image stabilization or shake correction, image distortion may occur. In addition, in a camera device (hereinafter referred to as "Comparative Example 4") in which the lens is fixed but not moved for image stabilization but the image sensor is moved or tilted, image distortion may occur at the edge or corner of the image sensor. In Comparative Examples 3 and 4, since the image sensor and the lens are separated and only one of the image sensor and the lens is moved or tilted, image distortion may occur during image stabilization, and it may be difficult to correct for high-angle shake.

[0334] In an embodiment, for image stabilization, the OIS driving unit may tilt the OIS moving unit based on the first axis or the second axis or rotate the OIS moving unit within a preset angle range. In an embodiment, since the OIS moving unit includes a lens module (400) and an image sensor (810), when the OIS is driven, the tilting direction (or rotation direction) and tilting angle (or rotation angle) of the lens module (400, e.g., lens or lens module) (or bobbin (110)) may be the same as or nearly the same as the tilting direction (or rotation direction) and tilting angle (or rotation angle) of the image sensor (810).

[0335] In an embodiment, when OIS is driven, the lens module (400) (or bobbin (110)) and the image sensor (810) can tilt or rotate together, and an image resolution of 100% can be obtained without image distortion, and high-angle shake correction or shake correction can be possible.

[0336] In addition, since the OIS moving part including the lens module (400) (or bobbin (110)) and the image sensor (810) tilts or rotates in the embodiment, high-broadband shake correction may be possible. In addition, since the embodiment mechanically enables distortion-free image correction, the load received during image processing is less compared to Comparative Examples 1 and 2, so that current consumption can be reduced.

[0337] In addition, since in the embodiment, a tilting guide part (60) is used for tilting the OIS moving part, compared to an example that uses only a ball member or a shaft member, the OIS moving part can be tilted stably, precisely, and accurately, thereby improving the reliability of OIS operation.

[0338] In addition, in the embodiment, the power consumption required for driving the OIS can be reduced by the bending portions (804D, 804E) and the third portion (804C) of the fourth substrate (804), which is a flexible substrate of the circuit board (800).

[0339] In addition, in the embodiment, the tilting guide part (60) is placed within the mounting part (25A) of the sensor base (270), and the protrusion (28) of the sensor base (270) overlaps with the opening (60A) of the tilting guide part (60), so that the height or length in the optical axis direction of the camera device (200) can be reduced.

[0340] In addition, in the embodiment, since at least a part of the magnetic body (31) is placed within the opening (60A) of the tilting guide part (60), the distance between the magnetic body (31) and the magnetic body (32) can be reduced, and thus the manpower or holding force for supporting the OIS moving part can be increased, thereby enabling stable OIS operation.

[0341] Fig. 18 is a perspective view of a camera device (200) including a lens module (400).

[0342] Referring to FIG. 18, the lens module (400) can be coupled to the bobbin (100). The lens module (400) can move together with the bobbin (110) in the optical axis direction. For example, the lens module (400) can include at least one of a lens and a lens barrel.

[0343] In an embodiment, when performing shake correction or shake compensation, the lens module (400) and the image sensor (810) can be simultaneously tilted in the same direction and at the same angle along the X-axis or the Y-axis.

[0344] Fig. 19a shows the first position of the OIS moving part (100), and Fig. 19b shows the second position of the OIS moving part (100).

[0345] Referring to FIGS. 19a and 19b, the OIS moving part (100) can be tilted by a preset angle (θ1) by a force (F1) resulting from the interaction between the first magnet unit (310A) and the first coil (230A).

[0346] That is, when the OIS moving unit (100) moves from the first position to the second position, both the image sensor (810) and the lens module (400) can be tilted simultaneously by the preset angle (θ1). In addition, when the OIS moving unit (100) moves from the first position to the second position, the tilting guide unit (60) can be tilted by the preset angle (θ1) together with the image sensor (810) and the lens module (400) based on (or as) the second axis (e.g., the Y axis).

[0347] This embodiment can achieve 100% image resolution without image distortion, and can enable wide-angle image stabilization or shake correction. The description of FIGS. 19a and 19b can also be applied or analogized to the first axis (e.g., X-axis) tilting of the OIS moving part (100).

[0348] FIG. 20 illustrates electrical connections of first to fourth coil units (27A to 27D), a first sensor (240A), a second sensor (240B), and a circuit board (190) according to another embodiment.

[0349] In FIG. 20, each of the first sensor (240A) and the second sensor (240B) may be a driver IC including a Hall sensor. The first sensor (240A) may include a first Hall sensor and a first driver. The second sensor (240b) may include a second Hall sensor and a second driver.

[0350] The first sensor (240A) can generate a first driving signal (ID1) for driving the first coil unit (27A) and a second driving signal (ID2) for driving the second coil unit (27B) using the result of detecting the magnetic field of the magnet unit (310A). The second sensor (240B) can generate a third driving signal (ID3) for driving the third coil unit (27C) and a fourth driving signal (ID4) for driving the fourth coil unit (27D) using the result of detecting the magnetic field of the magnet unit (310B).

[0351] The first Hall sensor of the first sensor (240A) can detect the magnetic field of the magnet unit (310A) and output a first output signal. The second Hall sensor of the second sensor (240B) can detect the magnetic field of the magnet unit (310B) and output a second output signal. The first driver of the first sensor (240A) generates a first driving signal for driving the first coil unit (27A) and a second driving signal (ID2) for driving the second coil unit (27B) using the output signal of the first Hall sensor. The description of how the first control unit (835A) generates the first and second driving signals (ID1, ID2) using the output signal (HV1) of the first sensor (240A) in FIG. 14A can be applied to or analogized to the first driver of the first sensor (240A) in FIG. 20. Also, the description of how the second control unit (835B) in FIG. 14b generates the third and fourth driving signals (ID3, ID4) using the output signal (HV2) of the second sensor (240A) can be applied to or analogized to the second driver of the second sensor (240B) in FIG. 20.

[0352] Using data communication using a protocol, for example, I2C communication, the first driver of the first sensor (240A) can receive a clock signal (SCL), a data signal (SDA), and power or power signals (VCC, GND) from the host (700). In addition, using data communication using a protocol, for example, I2C communication, the second driver of the second sensor (240B) can receive a clock signal (SCL), a data signal (SDA), and power or power signals (VCC, GND) from the host (700). For example, the host (700) may be the control unit (830) of the camera device (200) or the control unit (780) of the optical device (200A).

[0353] The first sensor (240A) may include terminals (K3, K4) for inputting power signals (VDD, VSS), a terminal (K1) for transmitting and receiving data, and a terminal (K2) for transmitting and receiving a clock signal (SCL). Each of the terminals (K1 to K4) of the first sensor (240A) may be electrically connected to a corresponding one of the terminals (P1 to P4) of the circuit board (190). The circuit board (190) may include first wires (or circuit patterns) that connect the terminals (K1 to K4) of the first sensor (240A) and the terminals (P1 to P4) of the circuit board (190) to each other. Additionally, the first sensor (240A) may include terminals (R1, R2) for supplying a first driving signal (ID1) to the first coil unit (27A) and terminals (R3, R4) for supplying a second driving signal (ID2) to the second coil unit (27B).

[0354] A terminal (R1) of a first sensor (240A) may be electrically connected to a first pad (A1) of a circuit board (190), and a terminal (R2) of the first sensor (240A) may be electrically connected to a second pad (A2) of the circuit board (190). A terminal (R3) of the first sensor (240A) may be electrically connected to a third pad (A3) of the circuit board (190), and a terminal (R4) of the first sensor (240A) may be electrically connected to a fourth pad (A4) of the circuit board (190). The first sensor (240A) may supply a first driving signal (ID1) to the first and second pads (A1, A2) of the circuit board (190), and may supply a second driving signal (ID2) to the third and fourth pads (A3, A4) of the circuit board (190).

[0355] The second sensor (240B) may include terminals (M1, M2) for inputting power signals (VDD, VSS), a terminal (M4) for transmitting and receiving data, and a terminal (M3) for transmitting and receiving a clock signal (SCL). Each of the terminals (M1 to M4) of the second sensor (240B) may be electrically connected to a corresponding one of the terminals (P1 to P4) of the circuit board (190). The circuit board (190) may include second wires (or circuit patterns) that connect the terminals (M1 to M4) of the second sensor (240B) and the terminals (P1 to P4) of the circuit board (190) to each other. For example, each of the second wires may be electrically or conductively connected to a corresponding one of the first wires. Additionally, the second sensor (240B) may include terminals (Q1, Q2) for supplying a third driving signal (ID3) to the third coil unit (27C) and terminals (Q3, Q4) for supplying a fourth driving signal (ID4) to the fourth coil unit (27D).

[0356] A terminal (Q1) of the second sensor (240B) may be electrically connected to a fifth pad (A5) of the circuit board (190), and a terminal (Q2) of the second sensor (240B) may be electrically connected to a sixth pad (A6) of the circuit board (190). A terminal (Q3) of the second sensor (240B) may be electrically connected to a seventh pad (A7) of the circuit board (190), and a terminal (Q4) of the second sensor (240B) may be electrically connected to an eighth pad (A8) of the circuit board (190).

[0357] The second sensor (240B) can supply a third driving signal (ID3) to the fifth and sixth pads (A5, A6) of the circuit board (190) and can supply a fourth driving signal (ID4) to the seventh and eighth pads (A7, A8) of the circuit board (190).

[0358] Each of the first sensor (240A) and the second sensor (240B) can perform data communication with the host (700) using the terminals (P1, P2, P3, P4) of the circuit board (190). Data of the first sensor (240A) and data of the second sensor (240B) can be transmitted and received in a time-division manner through the terminals (P1, P2) of the circuit board (190). In data communication between the host (700) and the first and second sensors (240A, 240B), the host (700) may correspond to a master, the first sensor (240A) may correspond to a first slave, and the second sensor (240B) may correspond to a second slave. The first and second sensors (240A, 240B) may be assigned different addresses or identification codes. Data may be transmitted and received in a time-division manner between each of the first and second sensors (240A, 240B) and the host (700) through a line (or wiring) connected to the terminal (P1).

[0359] In addition, the camera device (200) according to the embodiment may be included in an optical instrument that forms an image of an object in space by using the characteristics of light such as reflection, refraction, absorption, interference, and diffraction, and aims to increase the visual acuity of the eye, or to record and reproduce an image using a lens, or to optically measure, propagate or transmit an image, etc. For example, the optical device according to the embodiment may be a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player), a navigation system, etc., but is not limited thereto, and any device for taking a video or a photo may be used.

[0360] FIG. 21a shows a perspective view of an optical device (200A) according to an embodiment, FIG. 21b shows a perspective view of an optical device (200X) according to another embodiment, and FIG. 22 shows a configuration diagram of the optical device (200A) shown in FIGS. 21a and 21b.

[0361] For example, the embodiment of FIG. 21A may include a front camera in which the lens module (400) of the camera module (200) is positioned to face the front of the body (850), and the embodiment of FIG. 21B may include a rear camera in which the lens module (400) of the camera module (200) is positioned to face the rear of the body (850) of the optical device (200A). While FIG. 21B illustrates an example in which two rear cameras are positioned, in other embodiments, more than one rear camera may be positioned. In other embodiments, the camera module (200) may be used for both the front camera and the rear camera.

[0362] Referring to FIGS. 21A, 21B, and 22, an optical device (200A, hereinafter referred to as a portable “terminal”) may include a body (850), a wireless communication unit (710), an A / V input unit (720), a sensing unit (740), an input / output unit (750), a memory unit (760), an interface unit (770), a control unit (780), and a power supply unit (790).

[0363] The body (850) is in the form of a bar, but is not limited thereto, and may have various structures such as a slide type, folder type, swing type, or swivel type in which two or more sub-bodies are connected to enable relative movement.

[0364] The wireless communication unit (710) may be configured to include one or more modules that enable wireless communication between the terminal (200A) and a wireless communication system or between the terminal (200A) and a network in which the terminal (200A) is located. For example, the wireless communication unit (710) may be configured to include a broadcast reception module (711), a mobile communication module (712), a wireless Internet module (713), a short-range communication module (714), and a location information module (715).

[0365] The A / V (Audio / Video) input unit (720) is for inputting audio signals or video signals and may include a camera (721) and a microphone (722), etc.

[0366] The camera (721) may include a camera device (200) according to an embodiment.

[0367] The sensing unit (740) can detect the current state of the terminal (200A), such as the open / close state of the terminal (200A), the position of the terminal (200A), the presence or absence of user contact, the orientation of the terminal (200A), and the acceleration / deceleration of the terminal (200A), and generate a sensing signal to control the operation of the terminal (200A). For example, if the terminal (200A) is in the form of a slide phone, it can sense whether the slide phone is opened or closed. In addition, it is responsible for sensing functions related to whether power is supplied to the power supply unit (790), whether the interface unit (770) is connected to an external device, etc.

[0368] The input / output unit (750) is for generating input or output related to visual, auditory, or tactile senses. The input / output unit (750) can generate input data for controlling the operation of the terminal (200A) and can also display information processed in the terminal (200A).

[0369] The input / output unit (750) may include a key pad unit (730), a display module (751), an audio output module (752), and a touch screen panel (753). The key pad unit (730) may generate input data through key pad input.

[0370] The display module (751) may include a plurality of pixels whose colors change according to an electrical signal. For example, the display module (751) may include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, and a 3D display.

[0371] The audio output module (752) can output audio data received from the wireless communication unit (710) in a call signal reception mode, call mode, recording mode, voice recognition mode, or broadcast reception mode, or can output audio data stored in the memory unit (760).

[0372] The touch screen panel (753) can convert a change in electrostatic capacity caused by a user's touch on a specific area of ​​the touch screen into an electrical input signal.

[0373] The memory unit (760) may store programs for processing and controlling the control unit (780), and may temporarily store input / output data (e.g., phone book, messages, audio, still images, photographs, videos, etc.). For example, the memory unit (760) may store images captured by the camera (721), such as photographs or videos.

[0374] The interface unit (770) serves as a passage connecting to an external device connected to the terminal (200A). The interface unit (770) receives data from the external device, supplies power and transmits it to each component inside the terminal (200A), or allows data inside the terminal (200A) to be transmitted to the external device. For example, the interface unit (770) may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and an earphone port.

[0375] The control unit (controller, 780) can control the overall operation of the terminal (200A). For example, the control unit (780) can perform related control and processing for voice calls, data communications, video calls, etc.

[0376] The control unit (780) may be equipped with a multimedia module (781) for multimedia playback. The multimedia module (781) may be implemented within the control unit (780) or may be implemented separately from the control unit (780).

[0377] The control unit (780) can perform pattern recognition processing to recognize handwriting input or drawing input performed on the touch screen as characters and images, respectively.

[0378] The power supply unit (790) can supply power required for the operation of each component by receiving external power or internal power under the control of the control unit (780).

[0379] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. The features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by those skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be construed as being included within the scope of the present invention.

[0380] The embodiment can be used in a camera device and an optical device that can prevent performance degradation of OIS operation due to tilting of an OIS moving part caused by AF driving and improve driving power of OIS operation.

Claims

1. Fixed government; A moving part including an image sensor and a lens arranged opposite the image sensor in the direction of the optical axis; A tilting guide part arranged between the fixed part and the moving part; A first magnetic body arranged in the above moving part; A second magnetic body arranged on the above fixed portion and generating a holding force by interaction with the first magnetic body; and It includes a driving unit that tilts the moving unit based on a first axis intersecting the optical axis direction or a second axis intersecting the optical axis direction and the first axis, By the holding force, the moving part and the fixed part press the tilting guide part, and the moving part includes a magnet and a coil that generate an electromagnetic force to move the lens in the direction of the optical axis. A camera device wherein the holding force is 1.2 times or more of the electromagnetic force and 25 times or less of the electromagnetic force.

2. In paragraph 1, The separation distance between the magnet and the coil is smaller than the separation distance between the first magnetic body and the second magnetic body, A camera device in which the length of the magnet in the direction in which the magnet and the coil face each other is greater than the length of the first magnetic body in the direction of the optical axis.

3. In paragraph 1, The separation distance between the magnet and the coil is smaller than the separation distance between the first magnetic body and the second magnetic body, A camera device in which the length of the magnet in the direction in which the magnet and the coil face each other is greater than the length of the second magnetic body in the direction of the optical axis.

4. In paragraph 1, The separation distance between the magnet and the coil is smaller than the separation distance between the first magnetic body and the second magnetic body, A camera device in which the area of ​​the first surface of the magnet facing the coil is larger than the area of ​​the first surface of the first magnetic body facing the second magnetic body.

5. In paragraph 1, The separation distance between the magnet and the coil is smaller than the separation distance between the first magnetic body and the second magnetic body, A camera device wherein the area of ​​the first surface of the second magnetic body facing the first magnetic body is greater than or equal to the area of ​​the first surface of the first magnetic body facing the second magnetic body.

6. In paragraph 1, The separation distance between the magnet and the coil is smaller than the separation distance between the first magnetic body and the second magnetic body, A camera device in which the area of ​​the first surface of the magnet facing the coil is greater than or equal to the area of ​​the first surface of the second magnetic body facing the first magnetic body.

7. Fixed government; A moving part including an image sensor and a lens arranged opposite the image sensor in the direction of an optical axis; A first magnet unit and a second magnet unit arranged on the above moving part; A first coil that tilts the moving part about a first axis intersecting the optical axis direction by interaction with the first magnet unit; and A second coil is included that tilts the moving part based on the optical axis direction and the second axis intersecting the first axis by interacting with the second magnet unit, The first coil includes a first coil unit and a second coil unit arranged to face the first magnet unit, and the second coil includes a third coil unit and a fourth coil unit arranged to face the second magnet unit. A camera device in which a first driving signal is applied to the first coil unit, a second driving signal is applied to the second coil unit, a third driving signal is applied to the third coil unit, and a fourth driving signal is applied to the fourth coil unit.

8. In paragraph 7, A camera device including a tilting guide part disposed between the fixed part and the moving part.

9. In paragraph 7, A first sensor that detects the magnetic field of the first magnet unit and outputs a first output signal; and A first control unit that receives the first output signal and generates the first driving signal and the second driving signal; A second sensor that detects the magnetic field of the second magnet unit and outputs a second output signal; and A camera device comprising a second control unit that receives the second output signal and generates the third driving signal and the fourth driving signal.

10. In paragraph 7, Includes a circuit board arranged on the above fixed part, The above circuit board, First and second pads electrically connected to the first coil unit and to which the first driving signal is applied; Third and fourth pads electrically connected to the second coil unit and to which the second driving signal is applied; Fifth and sixth pads electrically connected to the third coil unit and to which the third driving signal is applied; and A camera device comprising seventh and eighth pads electrically connected to the fourth coil unit and to which the fourth driving signal is applied.

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