Adjustable and electrically conductive headband for mechanically supporting and electrically coupling opposing earphones

Abstract

An adjustable headband assembly for use with headphones physically and electrically couples opposing earphones. The headband that is lengthwise-adjustable and electrically conductive, and conducts an audio signal (analog or digital) from one earphone to the other. At least a portion (and in some embodiments a majority) of the headband, lengthwise, can be partially exposed (e.g., non-insulated).

Description

IN THE UNITED STATES RECEIVING OFFICEPatent Application For:ADJUSTABLE AND ELECTRICALLY CONDUCTIVE HEADBAND FOR MECHANICALLY SUPPORTING AND ELECTRICALLY COUPLING OPPOSING EARPHONESPRIORITY CLAIM

[0001] The present application claims priority to United States provisional patent application Serial No. 63 / 556,442, filed February 22, 2024, which is incorporated herein by reference it its entirety.BACKGROUND

[0002] Wireless headphones offer the freedom of movement, ideal for those who dislike being tethered to their devices, while wired headphones ensure a reliable connection and often deliver superior sound quality. Wired earphones receive audio signals through a physical connection, such as a 3.5mm headphone jack or a USB port. The audio signal is transmitted as an analog or digital signal through the wire directly from the source device (such as a smartphone, computer, or audio player) to the earphones. For analog audio signals (common with traditional 3.5mm jacks), the audio is transmitted as an electrical signal through the wire. The earphones have small drivers that convert this electrical signal into sound waves for the user to head. If the connection is digital (such as with USB or Lightning connectors), the audio signal remains digital until it reaches a digital-to-analog converter (DAC) inside the earphones or the source device. The DAC converts the digital signal into an analog signal, which is then converted into sound waves by the earphones’ drivers.

[0003] Wireless earphones receive audio signals through wireless technologies like Bluetooth. The source device (e.g., smartphone, tablet, or computer) encodes the audio signal into a digital format and transmits it wirelessly to the headphones, which has a built-in receiver that captures and decode the transmitted, digital signal. Oncethe signal is decoded, it goes through a digital-to-analog converter (DAC) within the earphones. The DAC converts the digital signal into an analog signal that is sent to the earphones’ drivers, which convert it into sound waves for the user to hear.

[0004] There are also different styles of headphones. In-ear headphones are compact and portable, fitting snugly inside the user’s ear canal, making them perfect for on-the-go use. On-ear headphones rest on the user’s ears, providing a balance between comfort and sound isolation. And over-ear headphones fully encompass the user’s ears, delivering immersive sound with excellent noise isolation, ideal for longer listening sessions.SUMMARY

[0005] In one general aspect, the present invention is directed to headphones comprising first and second earphones, and a headband assembly connecting the first and second earphones. The headband assembly comprises a headband that is lengthwise-adjustable and electrically conductive, and conducts an audio signal (analog or digital) from the first earphone to the second earphone. The headband could also conduct other signals besides audio, such as a wake up signal (digital or analog) from one earphone to the other. In various implementations, at least a portion (and in some embodiments a majority) of the headband, lengthwise, is partially exposed (e.g., non-insulated).

[0006] In various implementations, the headband assembly comprises a first support connected to the first earphone and a second support connected to the second earphone. The headband can comprise: a first conductive, adjustable-length, band pair to provide a first electrical pathway between the first support and the second support; and a second conductive, adjustable-length, band pair to provide a second electrical pathway between the first support and the second support. Each of the band pairs, in some embodiments, can be at least partially (e.g., a majority thereof), lengthwise, exposed, e.g., non-insulated.

[0007] The headphones can be wired or wireless. In wireless embodiments, just one of the earphones can comprise a radio circuit for receiving the audio and theheadband conducts the audio signal (in additional to other possible signals) to the other earphone. In a wired embodiment, just one of the earphones can comprise a wired connection to the audio source, and again the headband conducts the audio signal to the other earphones.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Various aspects described herein, together with advantages thereof, may be understood in accordance with the following description taken in conjunction with the accompanying drawings as follows.

[0009] FIG. 1 is a perspective view of a headband assembly for use with headphones or a headset, wherein the headband assembly comprises an adjustable headband including two, spaced apart conductive band pairs and two support components at each end of the adjustable headband;

[0010] FIG. 2 is an elevational view of the headband assembly of FIG. 1 , wherein the housing mounts comprise a first housing mount within which each conductive band pair is positioned;

[0011] FIG. 3 is an elevational view of the headband assembly of FIG. 1 , wherein the headband assembly further comprises a second housing mount within which each conductive band pair is positioned;

[0012] FIG. 4 is a cross-sectional view of the headband assembly of FIG. 1 taken along line 4-4 in FIG. 2 showing primarily a first conductive band pair of the two conductive band pairs, wherein the first conductive band pair comprises a first band mounted to a first support component of the two support components and mounted to the second housing mount, and wherein the first conductive band pair comprises a second band mounted to a second support component of the two support components and mounted to the first housing mount;

[0013] FIG. 5 is a detailed view of the second housing mount shown in the cross- sectional view of FIG. 4, wherein the second housing mount comprises an outer portion and an inner portion, and wherein the inner portion comprises mounting posts for fixing an end of the first band of the first conductive band pair to the secondhousing mount;

[0014] FIG. 6 is a detailed view of the first housing mount shown in the cross- sectional view of FIG. 4, wherein the first housing mount comprises an outer portion and an inner portion, and wherein the outer portion comprises mounting posts for fixing an end of the second band of the first conductive band pair to the first housing mount;

[0015] FIG. 7 is a partial perspective view of the headband assembly of FIG. 1 , wherein the outer portion of the first housing mount comprises a central rib with apertures for receiving mounting posts of the inner portion of the first housing mount;

[0016] FIG. 8 is a partial perspective view of the headband assembly of FIG. 1 , wherein the outer portion of the first housing mount further comprises mounting posts for fixing the end of the second band of the first conductive band pair to the first housing mount and an end of a second band of a second conductive band pair of the two conductive band pairs to the first housing mount;

[0017] FIG. 9 is a partial perspective view of the headband assembly of FIG. 1 , wherein the outer portion of the second housing mount comprises a central rib with apertures for receiving mounting posts of the inner portion of the second housing mount, and wherein the end of the first band of the first conductive band pair comprises an aperture for receiving a mounting post of the inner portion of the second housing mount, and wherein an end of a first band of the second conductive band pair comprises an aperture for receiving another mounting post of the inner portion of the second housing mount;

[0018] FIG. 10 is a partial perspective view of the headband assembly of FIG. 1 , wherein the inner portion of the second housing mount comprises mounting posts extending therefrom configured to be received within the central rib of the outer portion of the second housing mount; and

[0019] FIG. 11 is a perspective view of the first conductive band pair and the second conductive band pair of the headband assembly of FIG. 1 .

[0020] FIG. 12 is a side view of headphones with the headband assembly according to various embodiments of the present invention.

[0021] FIG. 13 is a side perspective view of headphones with the headband assembly according to various embodiments of the present invention.

[0022] FIG. 14 is a front view of headphones with the headband assembly according to various embodiments of the present invention.

[0023] FIG. 15 is a top view of headphones with the headband assembly according to various embodiments of the present invention.

[0024] FIG. 16 is a block diagram of an earphone of the headphones according to various embodiments of the present invention.

[0025] Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate various aspects of the present disclosure, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.DETAILED DESCRIPTION

[0026] Before explaining various aspects of testing apparatus, systems, and methods for testing containers to be filled in a filling line, it should be noted that the illustrative examples are not limited in application or use to the details of construction and arrangement of parts illustrated in the accompanying drawings and description. The illustrative examples may be implemented or incorporated in other aspects, variations and modifications, and may be practiced or carried out in various ways. Further, unless otherwise indicated, the terms and expressions employed herein have been chosen for the purpose of describing the illustrative examples for the convenience of the reader and are not for the purpose of limitation thereof. Also, it will be appreciated that one or more of the following-described aspects, expressions of aspects, and / or examples, can be combined with any one or more of the other following-described aspects, expressions of aspects and / or examples.

[0027] Headphones generally include a pair of drivers, or speakers, for each ear of a user. The drivers are transducers that convert electrical energy into acoustic energy to drive air to create pressure waves. Many headphone types include headband, or support piece, for mounting each driver to opposite ends thereof. Theheadband generally sits on top of a user’s head and supports each driver near the user’s ears. In many instances, headphones generally include an electrical wire for receiving a current, in the form of an audio signal, to each driver. In one instance, the electrical wire comprises a ground wire, a first wire for a left-ear driver, and a second wire for a right-ear driver. In another instance, the electrical wiring further comprises a third wire for transmitting audio captured with a microphone. At any rate, the electrical wires may be connected to the headphones using a couple of different methods.

[0028] In one instance, the electrical wires, including the ground wire, the first wire, and the second wire, terminates at a plug, or jack, end with a tip / ring / sleeve configuration, for example, and, at some location between the headphones and the plug, is split so that the first wire can be connected directly to a first driver of a first earphone housing and the second wire can be connected directly to a second driver of a second earphone housing. In such an instance, the headband of such headphones need not be constructed so as to transmit an electrical signal from the first earphone housing to the second earphone housing.

[0029] In another instance, the electrical wire, including the ground wire, the first wire, and the second wire, is not split for each earphone housing but, rather, is received in one of two earphone housings where the first wire is terminated to the first driver and the audio signal carried by the second wire must be transmitted to the opposing, or second, driver of the second earphone housing in some other fashion. In one instance, a cord is used and mounted to a headband support to carry the audio signal of the second wire and the ground wire path to the second earphone housing. However, such an arrangement can limit the ability to adjust the headband and, if the headband is adjustable, the cord can experience repeated stress causing the cord to fail in time. In another instance, wireless transmission of the audio signal carried by the second wire can be transmitted to the second driver of the second earphone housing. However, in some instances, this may increase cost and / or complexity of the headphones by requiring additional circuitry in the second earphone housing. The additional circuity adds additional potential failure points.Additionally, wireless transmission of audio may not be as reliable as physical contact transmission.

[0030] Disclosed herein is an adjustable headband assembly for use with headphones and / or headsets, for example, for physically supporting opposing earphones and electrically coupling the opposing earphones. The headband assembly is adjustable lengthwise in two opposing locations along its length and is configured to provide separate conductive paths between opposing earphone housings. In at least one instance, the conductive paths are partially or fully exposed. In other words, the conductive paths are not insulated. In another instance, the conductive paths are partially or fully insulated.

[0031] FIGS. 1 -11 depict a headband assembly 100 for use with headphones and / or headsets, for example. FIGS. 12-15 depict headphones 400 with the headband assembly 100 connected with left and right earphones 402a, 402b, each with a driver, or speaker. The drivers / speakers of the earphones 402a, b produce sound and a user of the headphones 400 can where the headphones 400 such that the earphones 402a, b are adjacent to respective ears of the user and so that the headband assembly 100 goes over the top of the user’s head, for example.

[0032] Refemng particularly to FIGS. 1-11 , the headband assembly 100 comprises a first support component 110, a second support component 115, and an adjustable headband 120 for physically supporting and electrically coupling opposing earphones. In at least one instance, the support components 110, 115 comprise earphone housings where circuitry and drivers are positioned. In another instance, the support components 110, 115 are a fixed portion of the earphone housing to which the adjustable headband 120 can be mounted. In such an instance, the electrical paths provided by the headband are carried from the support components 110, 115 to a main portion of an earphone housing where circuity and / or drivers are positioned in any suitable fashion, such as the earphones 402a, b shown in the embodiments of FIGS. 12-15. In at least one instance, the electrical paths are carried by way of wires. In another instance, the conductive paths provided by the headband are mounted directly to a PCB within the support component whereelectrical traces of the PCB can be used to transmit the paths to the circuitry and / or drivers, for example.

[0033] The headband 120 comprises a first (e.g., front) conductive band pair 130 and a second (e.g., back) conductive band pair 160 spaced apart by way of a gap 121. The conductive band pair 130 comprises a first (e.g., right) band 140 and a second (e.g., left) band 150. The conductive band pair 160 comprises a first (e.g., right) band 170 and a second (e.g., left) band 180. The conductive band pairs 130, 160 are expandable and retractable lengthwise (e.g., between the support components 110, 115) so as to change the size / length of the headband 120 to accommodate different size heads and to also make storage easier by making the headband 120 more compact. As discussed above, the conductive band pairs 130, 160 are conductive. In at least one instance, one of the conductive band pairs 130, 160 transmits an audio signal and / or other (non-audio) signals, and the other of the conductive band pairs 130, 160 transmits a ground path. Additional conductive band pairs are contemplated. In at least one instance, another conductive band pair is employed to carry a microphone audio signal. In at least one instance, one or more additional conductive band pairs are used to carry balanced audio signals across the headband 120.

[0034] The headband 120 further comprises, in various embodiments, a first housing mount 200 and a second housing mount 300. Discussed in greater detail below, the housing mounts 200, 300 provide a location for terminating ends of individual bands of each conductive band pair 130, 160 and also channels, or cavities, through which individual bands of each conductive band pair can slide relative thereto. The housing mounts 200, 300 allow a user to adjust the headband 120 while maintaining electrical conductivity between the bands of each conductive band pair 130, 160.

[0035] The first conductive band pair 130 comprises a first band 140 and a second band 150. The bands 140, 150 are slidable lengthwise relative to each other by way of the first housing mount 200 and the second housing mount 300.

[0036] The first band 140 comprises a lower end 141 for mounting within thesupport component 110. The lower end 141 comprises mounting apertures 142 and is mounted to the support component 110 by any suitable means such as, for example, by rivets, pins, and / or fasteners. The lower end 141 further comprises an electrical lead mounted thereto to carry the electrical path to a desired location such as, for example, another driver and / or circuitry. In at least one instance, the electrical lead is directly soldered to the lower end 141 ; however, any suitable electrical connection means can be used. The first band 140 extends through, and is movable relative to, the first housing mount 200 and further comprises an upper end 143 fixedly mounted to the second housing mount 300.

[0037] The second band 150 comprises a lower end 151 for mounting within the support component 115. The lower end 151 comprises mounting apertures 152 and is mounted to the support component 115 by any suitable means such as, for example, by rivets, pins, and / or fasteners. The lower end 151 further comprises an electrical lead mounted thereto to carry the electrical path to a desired location such as, for example, another driver and / or circuitry. In at least one instance, the electrical lead is directly soldered to the lower end 151 ; however, any suitable electrical connection means can be used. The second band 150 extends through, and is movable relative to, the second housing mount 300 and further comprises an upper end 153 fixedly mounted to the first housing mount 200.

[0038] The second conductive band pair 160 comprises a first band 170 and a second band 180. The bands 170, 180 are slidable lengthwise relative to each other by way of the first housing mount 200 and the second housing mount 300.

[0039] The first band 170 comprises a lower end 171 for mounting within the support component 110. The lower end 171 comprises mounting apertures 172 and is mounted to the support component 110 by any suitable means such as, for example, by rivets, pins, and / or fasteners. The lower end 171 further comprises an electrical lead mounted thereto to carry the electrical path to a desired location such as, for example, another driver and / or circuitry. In at least one instance, the electrical lead is directly soldered to the lower end 171 ; however, any suitable electrical connection means can be used. The first band 170 extends through, andis movable relative to, the first housing mount 200 and further comprises an upper end 173 fixedly mounted to the second housing mount 300.

[0040] The second band 180 comprises a lower end 181 for mounting within the support component 115. The lower end 181 comprises mounting apertures 182 and is mounted to the support component 115 by any suitable means such as, for example, by rivets, pins, and / or fasteners. The lower end 181 further comprises an electrical lead mounted thereto to carry the electrical path to a desired location such as, for example, another driver and / or circuitry. In at least one instance, the electrical lead is directly soldered to the lower end 181 ; however, any suitable electrical connection means can be used. The second band 180 extends through, and is movable relative to, the second housing mount 300 and further comprises an upper end 183 fixedly mounted to the first housing mount 200.

[0041] As can be seen in FIGS. 2 and 3, the first conductive band pair 130 and the second conductive band pair 160 are spaced apart from each other (see gap, or space, 121 ) so as to prevent shorting the circuit within which the conductive band pairs 130, 160 are positioned. In at least one instance, the housing mounts 200, 300 further function as a spacer to positively space the band pairs 130, 160 apart from each other. In at least one instance, one or more additional spacers, such as plastic inserts, for example can be employed at one or more locations along the length of the band pairs 130, 160 to ensure the band pairs 130, 160 do not contact each other. In at least one instance, the housing mounts 200, 300 are positioned such that, from the fully expanded configuration to the fully collapsed, or retracted, configuration, the band pairs 130, 160 will not contact each other.

[0042] Referring now primarily to FIGS. 4-10, the housing mounts 200, 300 are configured to provide the headband 120 with independent locations of adjustability while maintaining electrical contact between cooperative conductive bands within each band pair. Referring to FIGS. 5, 9, and 10, the second housing mount 300 comprises an outer portion 310 and an inner portion 320. The outer portion 310 comprises a central rib 311 extending between the band pairs 130, 160 to positively space the band pairs 130, 160 apart. The central rib 311 comprises apertures 312defined therein for receiving mounting posts, or projections, 321 of the inner portion 320. The mounting posts may be fixed within the apertures 312 utilizing adhesive or any mechanical means such as, for example, snap fit, press fit, and / or threaded, for example. The second bands 150, 180 are slidably supported within the second housing mount 300. The ends 143, 173 of the first bands 140, 170 are fixedly mounted to the second housing mount 300 by way of projections 360 extending from the inner portion 320 and into apertures 144, 174 defined in the ends 143, 173 of the first bands 140, 170, respectively. The projections 360 can include any suitable holding mechanism such as, for example, press fit, adhesive, and / or a rivet configuration so as to hold the ends 143, 173 to the second housing mount 300.

[0043] Referring still to FIGS. 5 and 9, the ends 143, 173 further comprise flared, or bent, tips 145, 175 bent into contact with and for engaging the second bands 150, 180. Such tips 145, 175 can provide a snug fit while still permitting relative movement and electrical conductivity between the first bands 140, 170 and the second bands 150, 180. In at least one instance, the ends 143, 173 do not comprise flared, or bent, tips but rather are uniform along their length. In addition to, or in lieu of, the flared tips 145, 175, the ends 143, 173, or any portion of the bands 140, 170, may comprise dimples and / or brushes, for example. Any suitable electrical contact aid can be employed between the bands of each band pair 130, 160 to ensure electrical conductivity. The lower portion 320 further comprises a ledge, or ridge, 325 against which the tips 145, 175 abut. In at least one instance, the ledge 325 prevents the tips 145, 175 from blowing out of the second housing mount 300 and further assists in holding the ends 143, 173 in the second housing mount 300. In at least one instance, the tips 145, 175 gradually decrease in width toward their terminal ends so as to reduce the amount of contact area between the tips 145, 175 and the opposing bands 150, 180. Such an arrangement may reduce adjustment resistance while still maintaining electrical conductivity.

[0044] As can be seen in FIG. 9, the apertures 144, 174 and corresponding projections 360 are at least substantially round. In at least one instance, the apertures 144, 174 and / or projections 360 comprise a polygonal shape and / or anirregular shape.

[0045] Referring to FIGS. 6, 7, and 8, the first housing mount 200 comprises an outer portion 210 and an inner portion 220. The outer portion 210 comprises a central rib 211 extending between the band pairs 130, 160 to positively space the band pairs 130, 160 apart. The central rib 211 comprises apertures 212 defined therein for receiving mounting posts, or projections, of the inner portion 220. The mounting posts may be fixed within the apertures 212 utilizing adhesive or any mechanical means such as, for example, snap fit, press fit, and / or threaded, for example. The first bands 140, 170 are slidably supported within the first housing mount 200. The ends 153, 183 of the second bands 150, 180 are fixedly mounted to the first housing mount 200 by way of projections 260 extending from the outer portion 210 and into apertures 154, 184 defined in the ends 153, 183 of the second bands 150, 180, respectively. The projections 260 can include any suitable holding mechanism such as, for example, press fit, adhesive, and / or a rivet configuration so as to hold the ends 153, 183 to the first housing mount 200.

[0046] In at least one instance, in addition to, or in lieu of, the mounting posts of each housing mount 200, 300, the housing mounts 200, 300 comprise one or more other means of joining to hold the opposing inner and outer portions together such as, for example, mechanical joining, welding, and / or adhesive. Any suitable type of fastener or combinations thereof can be used such as, for example, screws, rivets, bolts, nails, clips, pins, magnets, etc. Any suitable type of fastening means or combinations thereof can be used such as, for example, welding, sonic welding, press fitting, adhesive, hook and loop, gluing, soldering, taping, crimping, etc. In at least one instance, hinges can be employed between the upper and lower portions of the housing mounts 200, 300 and can provide access to the conductive textile, for example, to allow easy replacement of the conductive textile, for example. In at least one instance, the means for joining the upper and lower portions comprise a permanent connection, semi-permanent connection, and / or non-permanent connection.

[0047] Referring still to FIGS. 6 and 8, the ends 153, 183 further comprise flared, orbent, tips 155, 185, bent into contact with and for engaging the first bands 140, 170. Such tips 155, 185 can provide a snug fit while still permitting relative movement and electrical conductivity between the first bands 140, 170 and the second bands 150, 180. In at least one instance, the ends 153, 183 do not comprise flared, or bent, tips but rather are uniform along their length. In addition to, or in lieu of, the flared tips 155, 185, the ends 153, 183, or any portion of the bands 150, 180, may comprise dimples and / or brushes, for example. Any suitable electrical contact aid can be employed between the bands of each band pair 130, 160 to ensure electrical conductivity. In at least one instance, each conductive band pair 130, 160 comprises multiple different types of electrical contact aids. In at least one instance, one or both conductive band pairs 130, 160 employ one or more conductive textiles to bolster the electrical connection between the bands of each band pair 130, 160. In at least one instance, the conductive textile comprises a conductive fabric. In at least one instance, the conductive fabric is non-woven, woven, sewn, knit, cut, and / or braided, for example. In at least one instance, the conductive textile is constructed of conductive fibers or a combination of conductive fibers and non- conductive fibers. In at least one instance, the conductive textile is employed in one or both of the band pairs 130, 160. In at least one instance, the conductive textile is employed in one or both of the housing mounts 200, 300. In at least one instance, a conductive textile is utilized at one or both sliding contact points of each band pair 130, 160. In at least one instance, the conductive textile comprises a c-shaped cross-sectional profile where the conductive textile is in planar contact with the top surface of a first band and the bottom surface of a second band in sliding contact with the first band. In at least one instance, the conductive textile is continuous and extends completely around two contacting bands. In at least one instance, an electrically-insulating material and / or structure is utilized between neighboring conductive textiles within each housing mount 200, 300 to reduce the likelihood of shorting the opposing band pairs 130, 160 within the housing mounts 200, 300.

[0048] The outer portion 220 further comprises a ledge, or ridge, 235 against which the tips 155, 185 abut. In at least one instance, the ledge 235 prevents the tips 155,185 from blowing out of the first housing mount 200 and further assists in holding the ends 153, 183 in the first housing mount 200. In at least one instance, the tips 155, 185 gradually decrease in width toward their terminal ends so as to reduce the amount of contact area between the tips 155, 185 and the opposing bands 140, 170. Such an arrangement may reduce adjustment resistance while still maintaining electrical conductivity.

[0049] As can be seen in FIG. 8, the apertures 154, 184 and corresponding projections 260 are at least substantially round. In at least one instance, the apertures 154, 184 and / or projections 260 comprise a polygonal shape and / or an irregular shape.

[0050] Any suitable electrically conductive material can be used for the conductive bands 140, 150, 170, and 180. In at least one instance, the conductive bands 140, 150, 170, and 180 all comprise the same material. In at least one instance, the conductive bands 140, 150, 170, and 180 comprise one or more different materials. In at least one instance, the conductive bands 140, 150, 170, and 180 are comprised of a conductive material such as, for example, steel, copper, gold, silver, brass, zinc, etc. In at least one instance, the conductive bands 140, 150, 170, and 180 are finished using any suitable finish such as for example, polished, brushed, nonpolished, etc. In at least one instance, the bands 140, 150, 170, 180 are comprised of a spring-tempered stainless steel. In at least one instance, the flared ends of the headband assembly 100 are biased toward opposing bands via a spring force to maintain electrical contact with the opposing bands.

[0051] The conductive bands 140, 150, 170, and 180 may comprise any suitable width. In at least one instance, the width of one or more of the band 140, 150, 170, and 180 or band pairs 130, 160 varies along its length and in other embodiments the width of the bands is uniform. In at least one instance, one or more of the conductive bands 140, 150, 170, and 180 comprise a round cross-sectional profile instead of a rectangular cross-sectional profile as shown in the figures. In at least one instance, one of the pairs 130, 160 comprises a round profile and the other of the pairs 130, 160 comprises a rectangular cross-sectional profile. In at least oneinstance, the first bands 140, 170 comprise round profiles and the second bands 150, 180 comprise rectangular profiles or vise versa. Similar selections can be made for other properties such as material, width, height, etc. For example, the first bands 140, 170 comprise a first width and the second bands 150, 180 comprise a second width different than the first width.

[0052] In at least one instance, the headband assembly 100 is wireless; that is, source content is transmitted to the headphone assembly 100 wirelessly. In such an embodiment, one of the earphone housings 402a (or 402b) can comprise a radio circuit (e.g., Bluetooth, Wi-Fi, etc.) to receive the source content to be played by the headphone assembly 100 for the user. In such an embodiment, the headband 120 can carry the audio signal to the driver in the other earphone housing 402b (or 402a) (see FIGS. 12-15). In other embodiments, the headband assembly 100 is used with wired headphones where the source content wire extends to only one earphone housing (e.g., one of the earphones 402a, b in FIGS. 12-15) and the headband 120 is used to carry the audio and / or non-audio signals to the other earphone housing, as discussed herein.

[0053] In at least one instance, the conductive band pairs 130, 160, lengthwise, are entirely, or at least substantially (e.g., a majority) exposed, or not insulated. In at least one instance, the conductive band pairs 130, 160 are not wrapped in an insulation and are only protected in areas where the housing mounts are and / or where the band pairs 130, 60 extend into the support components, for example.

[0054] In at least one instance, the band pairs 130, 160 comprise telescoping connectors in addition to, or in lieu of, flared tips. In at least one instance, the band pairs comprise circular, or round, cross-sectional profiles where one of the first band 140 and the second band 170 is hollow and the other of the first band 140 and the second band 170 is positioned within the hollow band. Such a configuration may provide a telescoping arrangement for adjusting the headband assembly 100. In such an instance, electrical transmission can occur around the bands 140, 170 entire circumference.

[0055] As mentioned above, one of the earphones 402a, b can comprise a radiocircuit for receiving (and transmitting) wireless signals, and the headband 120 can carry the signal to the other earphone 402b, a. Figure 16 is a block diagram of an earphone 402a, b with such a radio circuit. For sake of explanation, Figure 16 assumes that the earphone 402a has the radio circuit and that the other earphone 402b does not.

[0056] In the illustrated embodiment, the earphone 402a comprises a transceiver circuit 410 and related peripheral components. The peripheral components of the earphone 402a may comprise a power source 422, a microphone 424, one or more acoustic transducers 426 (e.g., drivers or speakers), and an antenna 428. The transceiver circuit 410 and the peripheral components may be housed within the housing of the earphone 402a.

[0057] In various embodiments, the transceiver circuit 100 may be implemented as a single integrated circuit (IC), such as a system-on-chip (SoC), which is conducive to miniaturizing the components of the earphone 402a, which is advantageous if the earphone 402a is to be relatively small in size, such as an in-ear earphone. In alternative embodiments, however, the components of the transceiver circuit 410 could be realized with two or more discrete ICs or other components, such as separate ICs for the processors, memory, and RF (e.g., Wi-Fi) module, for example.

[0058] The power source 422 may comprise, for example, a rechargeable or non- rechargeable battery (or batteries). In embodiments where the power source422 comprises a rechargeable battery cell, the battery cell may be charged for use, for example, when the earphone 402a is connected to a power source via a USB port 425. The power source 422 may be coupled to a power source control module423 of transceiver circuit 410 that controls and monitors the power source 422.

[0059] The acoustic transducer(s) 426 may be the speaker element(s) for conveying the sound to the user of the headphones 400. The other earphone 402b also comprises a transducer(s). According to various embodiments, the earphones 402a, b may comprise one or more acoustic transducers 426. For embodiments having more than one transducer, one transducer may be larger than the other transducer, and a crossover circuit (not shown) may transmit the higher frequenciesto the smaller transducer and may transmit the lower frequencies to the larger transducer.

[0060] The antenna 428 may receive and transmit wireless signals via a wireless network or link, such as Bluetooth link. A RF (e.g., Bluetooth) module 430 of the transceiver circuit 410 in communication with the antenna 428 may, among other things, modulate and demodulate the signals transmitted from and received by the antenna 428. The RF module 430 communicates with a baseband processor 432, which performs other functions necessary for the earphone 402a to communicate using the Bluetooth (or other wireless communication) protocol.

[0061] The baseband processor 432 may be in communication with a processor unit 434, which may comprise a microprocessor 436 and a digital signal processor (DSP) 438. The microprocessor 436 may control the various components of the transceiver circuit 410. The DSP 438 may, for example, perform various sound quality enhancements to the digital audio received by the baseband processor 432, including noise cancellation and sound equalization. The processor unit 434 may be in communication with a volatile memory unit 440 and a non-volatile memory unit 442. A memory management unit 444 may control the processor unit’s access to the memory units 420, 422. The volatile memory 440 may comprise, for example, a random access memory (RAM) circuit. The non-volatile memory unit 442 may comprise a read only memory (ROM) and / or flash memory circuits. The memory units 420, 422 may store firmware that is executed by the processor unit 434.

[0062] A digital-to-analog converter (DAC) 445 may convert the digital audio from the processor unit 434 to analog form for coupling the audio signal to the acoustic transducer(s) 426. Also, the DAC 445 could be coupled to the headband 120 to conduct the audio signal to the transducer(s) in the other earphone 402b. In another embodiment, the headband 120 could conduct a digital audio signal to the other earphone 402b, in which case the other earphone 402b can comprise a DAC for converting the digital audio signal to analog to be played by the transducer / driver of the other earphone 402b.

[0063] Referring back to FIG. 16, an I2S interface 446 or other suitable serial orparallel bus interface may provide the interface between the processor unit 434 and the DAC 445. An analog-to-digital converter (ADC) 448, which also communicates with the l2S interface 446, may convert analog audio signals picked up by the microphone 424 for processing by the processor unit 434.

[0064] As shown in FIG.16, the earphone 402a may comprise a “TWS” (true wireless) circuit 451 , which can be connected to a power on / ff user control (not shown) of the earphone 402a by which a user of the headphones 400 can power on or off the headphones 400. When the user activates the power on / off user control, the TWS circuit 451 can send a signal (digital or analog) to a corresponding a TWS circuit (not shown) in the other earphone 402b via the headband 120, to correspondingly wake up (or power down if already on) the other earphone 402b. In such an embodiment, only one earphone 402a might have the power on / off user control, thereby eliminating the need to put user power controls on each earphone. The power on / off user control could be implemented with a physical push button, a mechanical slide switch, a capacitive touch sensor, a proximity (e.g., IR) sensor, or a rotary control, for example. The earphone 402a (and correspondingly the earphone 402b via the TWS circuit communications) could also be powered on and off via voice commands that are picked by the microphone 424 and processed by the processor 434.

[0065] As shown in FIGS. 12-15, frames 460a, b can mechanically connect the supports 110, 115 to the earphones 402a, b. The frames 460a, b can be made of plastic, for example. Each frame 460a, b can include wiring (not shown) to electrically connect the earphones 402a, b to the headband 120. The headphones 400 may also include, adjacent to the mounts 110, 115, foam cushions 470a, b for cushioning the user’s head when the headphones 400 are worn.

[0066] The earphones 402a, b depicted in FIGS. 12-15 are on-ear earphones. Other embodiments of the headphones 400 may utilize in-ear or over-ear earphones.

[0067] In one general aspect, therefore, the present invention is directed to headphones comprising first and second earphones, and a headband assembly connecting the first and second earphones. The headband assembly comprises aheadband that is adjustable and electrically conductive. The headband comprises a first conductive band pair to provide a first electrical pathway between the first earphone and the second earphone, where the first conductive band pair comprises: a first band mounted to a first support that is connected to the first earphone; and a second band mounted to a second support that is connected to the second earphone, where the first band and the second band are movable relative to each other while maintaining electrical conductivity. The headband also comprises a second conductive band pair to provide a second electrical pathway between the first support and the second support, where the second conductive band pair comprises: a first band mounted to the first support; and a second band mounted to the second support, where the first band and the second band of the second conductive band pair are movable relative to each other while maintaining electrical conductivity.

[0068] In various implementations, at least a portion of the first conductive band pair, lengthwise, is non-insulated; and at least a portion of the second conductive band pair, lengthwise, is non-insulated. Preferably, a majority of the first conductive band pair, lengthwise, is non-insulated, and a majority of the second conductive band pair, lengthwise, is non-insulated.

[0001] In various implementations, the headband assembly further comprises a first support connected to the first earphone, and a second support connected to the second earphone.

[0002] In various implementations, the headband further comprises a first housing mount and a second housing mount, where: the first band of the first conductive band pair comprises a lower end mounted to the first support; the first band of the first conductive band pair comprises an upper end mounted to the first housing mount; the second band of the first conductive band pair comprises a lower end mounted to the first support; the second band of the first conductive band pair comprises an upper end mounted to the second housing mount; the first band of the second conductive band pair comprises a lower end mounted to the first support; the first band of the second conductive band pair comprises an upper end mounted to the first housing mount; the second band of the second conductive band paircomprises a lower end mounted to the first support; and the second band of the second conductive band pair comprises an upper end mounted to the second housing mount.

[0003] In various implementations, the first housing mount comprises a first adjustable clip and the second housing mount comprises a second adjustable clip.

[0004] In various implementations, the first housing mount comprises mounting posts extending into apertures defined in the upper ends of each first band and the second housing mount comprises mounting posts extending into apertures defined in the upper ends of each second band.

[0005] 8. In various implementations, the upper ends of each first band and each second band comprise a spring-biased tip to maintain electrical contact within between the bands of each conductive band pair.

[0006] In various implementations, one of the first band and the second band of each conductive band pair comprises a dimple extending from the one of the first band and the second band to the other of the first band and the second band.

[0007] In various implementations, the first housing mount comprises an upper portion and a lower portion snap fit to each other by way of pins extending from one of the upper portion and the lower portion and corresponding apertures defined in the other of the upper portion and the lower portion.

[0008] In various implementations, the second housing mount comprises an upper portion and a lower portion snap fit to each other by way of pins extending from one of the upper portion and the lower portion and corresponding apertures defined in the other of the upper portion and the lower portion.

[0009] In various implementations, the first housing mount comprises a central rib providing a positive spacer between each conductive band pair.

[0010] In various implementations, the second housing mount comprises a central rib providing a positive spacer between each conductive band pair.

[0011] In various implementations, the first earphone is for receiving an audio signal to be played by the first earphone, and the headband conducts an audio signal to the second earphone to be played by the second earphone. In various implementations,the first earphone comprises a radio circuit for receiving the audio signal wirelessly and the second earphone does not comprise a radio circuit. In various implementations, the radio circuit comprises a Bluetooth circuit. In various implementations, the first earphone comprises a wired connection for receiving the audio signal.

[0012] In various implementations, a majority of the headband, lengthwise, is noninsulated.

[0013] In another general aspect, the present invention is directed to headphones that comprise first and second earphones, and a headband assembly connecting the first and second earphones, where the headband assembly comprises a headband that is lengthwise-adjustable and electrically conductive, and where the headband is for conducting an audio signal from the first earphone to the second earphone. In various implementations, a majority of the headband, lengthwise, is non-insulated.

[0014] While several forms have been illustrated and described, it is not the intention of the applicant to restrict or limit the scope of the appended claims to such detail. Numerous modifications, variations, changes, substitutions, combinations, and equivalents to those forms may be implemented and will occur to those skilled in the art without departing from the scope of the present disclosure. Moreover, the structure of each element associated with the described forms can be alternatively described as a means for providing the function performed by the element. Also, where materials are disclosed for certain components, other materials may be used. It is therefore to be understood that the foregoing description and the appended claims are intended to cover all such modifications, combinations, and variations as falling within the scope of the disclosed forms. The appended claims are intended to cover all such modifications, variations, changes, substitutions, modifications, and equivalents.

[0015] In summary, numerous benefits have been described which result from employing the concepts described herein. The foregoing description of the one or more forms has been presented for purposes of illustration and description. It is not intended to be exhaustive or limiting to the precise form disclosed. Modifications orvariations are possible in light of the above teachings. The one or more forms were chosen and described in order to illustrate principles and practical application to thereby enable one of ordinary skill in the art to utilize the various forms and with various modifications as are suited to the particular use contemplated. It is intended that the claims submitted herewith define the overall scope.

Claims

CLAIMSWhat is claimed is:

1. Headphones comprising: first and second earphones; and a headband assembly connecting the first and second earphones, wherein the headband assembly comprises a headband that is adjustable and electrically conductive, and wherein the headband comprises: a first conductive band pair to provide a first electrical pathway between the first earphone and the second earphone, wherein the first conductive band pair comprises: a first band mounted to a first support that is connected to the first earphone; and a second band mounted to a second support that is connected to the second earphone, wherein the first band and the second band are movable relative to each other while maintaining electrical conductivity; a second conductive band pair to provide a second electrical pathway between the first support and the second support, wherein the second conductive band pair comprises: a first band mounted to the first support; and a second band mounted to the second support, wherein the first band and the second band of the second conductive band pair are movable relative to each other while maintaining electrical conductivity.

2. The headphones of claim 1 , wherein: at least a portion of the first conductive band pair, lengthwise, is non-insulated; and at least a portion of the second conductive band pair, lengthwise, is non-insulated.

3. The headphones of claim 2, wherein: a majority of the first conductive band pair, lengthwise, is non-insulated; and a majority of the second conductive band pair, lengthwise, is non-insulated.

4. The headphones of claim 1 , wherein the headband assembly further comprises: a first support connected to the first earphone; and a second support connected to the second earphone.

5. The headphones of claim 1 , wherein the headband further comprises a first housing mount and a second housing mount, wherein the first band of the first conductive band pair comprises a lower end mounted to the first support, wherein the first band of the first conductive band pair comprises an upper end mounted to the first housing mount, wherein the second band of the first conductive band pair comprises a lower end mounted to the first support, wherein the second band of the first conductive band pair comprises an upper end mounted to the second housing mount, wherein the first band of the second conductive band pair comprises a lower end mounted to the first support, wherein the first band of the second conductive band pair comprises an upper end mounted to the first housing mount, wherein the second band of the second conductive band pair comprises a lower end mounted to the first support, and wherein the second band of the second conductive band pair comprises an upper end mounted to the second housing mount.

6. The headphones of claim 5, wherein the first housing mount comprises a first adjustable clip and the second housing mount comprises a second adjustable clip.

7. The headphones of claim 5, wherein the first housing mount comprises mounting posts extending into apertures defined in the upper ends of each first band and the second housing mount comprises mounting posts extending into aperturesdefined in the upper ends of each second band.

8. The headphones of claim 7, wherein the upper ends of each first band and each second band comprise a spring-biased tip to maintain electrical contact within between the bands of each conductive band pair.

9. The headphones of claim 7, wherein one of the first band and the second band of each conductive band pair comprises a dimple extending from the one of the first band and the second band to the other of the first band and the second band.

10. The headphones of claim 5, wherein the first housing mount comprises an upper portion and a lower portion snap fit to each other by way of pins extending from one of the upper portion and the lower portion and corresponding apertures defined in the other of the upper portion and the lower portion.11 . The headphones of claim 5, wherein the second housing mount comprises an upper portion and a lower portion snap fit to each other by way of pins extending from one of the upper portion and the lower portion and corresponding apertures defined in the other of the upper portion and the lower portion.

12. The headphones of claim 10, wherein the first housing mount comprises a central rib providing a positive spacer between each conductive band pair.

13. The headphones of claim 11 , wherein the second housing mount comprises a central rib providing a positive spacer between each conductive band pair.

14. The headphones of claim 13, wherein: the first earphone is for receiving an audio signal to be played by the first earphone; andthe headband conducts an audio signal to the second earphone to be played by the second earphone.

15. The headphones of claim 14, wherein first earphone comprises a radio circuit for receiving the audio signal wirelessly and the second earphone does not comprise a radio circuit.

16. The headphones of claim 15, wherein the radio circuit comprises a Bluetooth circuit.

17. The headphones of claim 14, wherein first earphone comprises a wired connection for receiving the audio signal.

18. The headphones of claim 1 , wherein: the first earphone is for receiving an audio signal to be played by the first earphone; and the headband conducts an audio signal to the second earphone to be played by the second earphone.

19. The headphones of claim 18, wherein first earphone comprises a radio circuit for receiving the audio signal wirelessly and the second earphone does not comprise a radio circuit.

20. The headphones of claim 19, wherein the radio circuit comprises a Bluetooth circuit.21 . The headphones of claim 18, wherein first earphone comprises a wired connection for receiving the audio signal.

22. The headphones of claim 18, wherein a majority of the headband, lengthwise, is non-insulated.

23. The headphones of claim 15, wherein the headband additionally conducts non-audio signals.

24. The headphones of claim 23, wherein the first earphone comprises a power on / off user control and the second earphone does not comprise a power on / off user control.

25. Headphones comprising: first and second earphones; and a headband assembly connecting the first and second earphones, wherein the headband assembly comprises a headband that is lengthwise-adjustable and electrically conductive, wherein the headband is for conducting an audio signal from the first earphone to the second earphone.

26. The headphones of claim 25, wherein a majority of the headband, lengthwise, is non-insulated.

27. The headphones of claim 26, wherein: the first earphone is for receiving an audio signal to be played by the first earphone; and the headband conducts an audio signal to the second earphone to be played by the second earphone.

28. The headphones of claim 27, wherein first earphone comprises a radio circuit for receiving the audio signal wirelessly and the second earphone does not comprise a radio circuit.

29. The headphones of claim 28, wherein the headband additionally conducts non-audio signals.

30. The headphones of claim 29, wherein the first earphone comprises a power on / off user control and the second earphone does not comprise a power on / off user control.31 . The headphones of claim 27, wherein first earphone comprises a wired connection for receiving the audio signal.

32. The headphones of claim 25, wherein: the headband assembly comprises: a first support connected to the first earphone; and a second support connected to the second earphone; and the headband comprises: a first conductive, adjustable-length, band pair to provide a first electrical pathway between the first support and the second support; and a second conductive, adjustable-length, band pair to provide a second electrical pathway between the first support and the second support.

33. The headphones of claim 32, wherein: a majority of the first conductive band pair, lengthwise, is non-insulated; and a majority of the second conductive band pair, lengthwise, is non-insulated.

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