Driving backplane, light-emitting substrate and preparation method, display device and transfer substrate

Abstract

Provided are a driving backplane (10), a light-emitting substrate (100) and a preparation method, a display device (1000), and a transfer substrate (700). The driving backplane (10) comprises a first base (11), a plurality of pad sets (12), and a plurality of first adhesive members (13). The plurality of pad sets (12) are arranged on one side of the first base (11) and are connected to the first base (11), one pad set (12) being configured to connect to one light-emitting device (20). The plurality of first adhesive members (13) are arranged on the side of the first base (11) that is close to the plurality of pad sets (12), and are connected to the first base (11); the distance between the first base (11) and the surface of each first adhesive member (13) that is away from the first base (11) is greater than that between the first base (11) and the surface of the pad set (12) that is away from the first base (11), and each first adhesive member (13) is configured, when a light-emitting device (20) abuts against the pad set (12), to adhere to the light-emitting device (20).

Description

Driving backplane, light-emitting substrate and preparation method, display device and transfer substrate Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a driving backplane, a light-emitting substrate and a preparation method thereof, a display device and a transfer substrate. Background Art

[0002] Micro LEDs (Micro Light Emitting Diodes) or sub-millimeter LEDs (Mini LEDs) are gaining increasing attention due to their advantages, including high resolution, low power consumption, high brightness, high color saturation, fast response, thinness, long lifespan, and splicing capabilities.

[0003] Summary of the Invention

[0004] In one aspect, a driving backplane is provided. The driving backplane includes a first substrate, multiple solder pad groups, and multiple first adhesives. The multiple solder pad groups are disposed on one side of the first substrate and connected to the first substrate; each solder pad group is configured to be connected to a light-emitting device. The multiple first adhesives are disposed on a side of the first substrate proximate to the multiple solder pad groups and connected to the first substrate; the distance between the surface of the first adhesive away from the first substrate and the first substrate is greater than the distance between the surface of the solder pad group away from the first substrate and the first substrate; the first adhesive is configured to adhere to the light-emitting device when the light-emitting device and the solder pads abut.

[0005] In some embodiments, the distance between the surface of the first adhesive away from the first substrate and the first substrate is 3 μm to 5 μm, and the distance between the surface of the pad group away from the first substrate and the first substrate is 2 μm to 3 μm.

[0006] In some embodiments, the pad group includes a plurality of pads, and the first adhesive is disposed between two adjacent pads among the plurality of pads included in one pad group; and / or the first adhesive is disposed on the peripheral side of one pad group.

[0007] In some embodiments, the material of the first adhesive member includes polyurethane and / or acrylic resin.

[0008] In some embodiments, the driving backplane further includes a light blocking member. The light blocking member is disposed on a side of the first substrate adjacent to the plurality of pad groups and connected to the first substrate; the light blocking member is disposed between two adjacent pad groups; and the light blocking member is configured to block light emitted by the light-emitting device.

[0009] In some embodiments, the plurality of pad groups are arranged into multiple rows and columns, each row including at least two pad groups arranged along a first direction, and each column including at least two pad groups arranged along a second direction; wherein the first direction and the second direction intersect; and the light-blocking member includes: a plurality of first light-blocking bars and / or a plurality of second light-blocking bars. The first light-blocking bars extend along the first direction, with at least one first light-blocking bar disposed between two adjacent rows of pad groups; and / or the second light-blocking bars extend along the second direction, with at least one second light-blocking bar disposed between two adjacent columns of pad groups.

[0010] In some embodiments, the driving backplane further comprises a light reflecting layer, wherein the light reflecting layer is disposed on a side of the first substrate close to the light blocking member and on a sidewall of the light blocking member.

[0011] In some embodiments, the material of the light reflecting layer includes at least one of metal, white oil and white paint.

[0012] In another aspect, a light-emitting substrate is provided. The light-emitting substrate includes a driving backplane as described in any of the above embodiments and a plurality of light-emitting devices. The plurality of light-emitting devices are disposed on the driving backplane; the light-emitting devices are connected to pads of the driving backplane and bonded to a first adhesive member of the driving backplane.

[0013] In some embodiments, the light-emitting device includes a connected light-emitting body and a pin, and the light-emitting body is located on the side of the pin away from the first substrate; the driving backplane includes a light-blocking member, and the distance between the surface of the light-blocking member away from the first substrate and the first substrate is greater than the distance between the surface of the light-emitting body close to the first substrate and the first substrate.

[0014] In some embodiments, the ratio of the distance between the surface of the light blocking member away from the first substrate and the surface of the light emitting body close to the first substrate to the thickness of the light emitting body along the third direction is greater than or equal to 0.5; wherein, the third direction is perpendicular to the first substrate.

[0015] In some embodiments, the orthographic projection of the first adhesive on the first substrate is symmetrical about the geometric center of the orthographic projection of the light-emitting device on the first substrate.

[0016] In another aspect, a display device is provided. The display device includes the light-emitting substrate according to any one of the above embodiments.

[0017] In another aspect, a transfer substrate is provided. The transfer substrate includes a second substrate, a plurality of second adhesive members, and a plurality of light-emitting devices. The plurality of second adhesive members are disposed on one side of the second substrate and connected to the second substrate; the initial adhesion of the second adhesive members is greater than the adhesion of the second adhesive members after being irradiated with light within a first preset range of wavelengths; the plurality of light-emitting devices are disposed on a side of the plurality of second adhesive members away from the second substrate, with each light-emitting device bonded to each second adhesive member.

[0018] In some embodiments, the wavelength of light emitted by the light emitting device is within the first preset range.

[0019] On the other hand, a method for preparing a light-emitting substrate is provided. The preparation method includes providing a transfer substrate and a driving backplane; the transfer substrate includes a transfer substrate and a plurality of light-emitting devices, the plurality of light-emitting devices are arranged on the transfer substrate, the transfer substrate includes a second substrate and a second adhesive, the second adhesive is arranged on one side of the second substrate and connected to the second substrate, and the plurality of light-emitting devices are arranged on a side of the second adhesive away from the second substrate and bonded to the second adhesive; the driving backplane includes a first substrate, a plurality of pad groups and a first adhesive, the plurality of pad groups are arranged on one side of the first substrate and connected to the first substrate; the plurality of first adhesives are arranged on a side of the first substrate close to the plurality of pad groups and connected to the first substrate. The driving backplane and the transfer substrate are aligned and pressed together, and a lighting test is performed on the plurality of light-emitting devices; the pad group and the light-emitting device are in contact, and the first adhesive is bonded to the light-emitting device; when there is a light-emitting device that is not lit among the plurality of light-emitting devices, the light-emitting device that is not lit is replaced until all the light-emitting devices are lit. When all of the plurality of light-emitting devices are lit, the pad group and the light-emitting devices are bonded.

[0020] In some embodiments, replacing the unlit light-emitting device includes removing the transfer substrate and separating the unlit light-emitting device from the first adhesive. Aligning and pressing the driver backplane with the transfer substrate removed and the repair substrate together; the repair substrate includes the transfer substrate and at least one light-emitting device, the light-emitting device being disposed on the transfer substrate and bonded to a target adhesive; the target adhesive is the first adhesive of the plurality of first adhesives corresponding to the unlit light-emitting device.

[0021] In some embodiments, the initial adhesion of the second adhesive component is greater than the adhesion of the first adhesive component, and the adhesion of the second adhesive component after being irradiated by the light emitted by the light-emitting device is less than the adhesion of the first adhesive component.

[0022] In some embodiments, the driver backplane further comprises a light shielding member, the light shielding member being disposed on a side of the first substrate adjacent to the plurality of pad groups and connected to the first substrate; the light shielding member being disposed between two adjacent pad groups. During the steps of aligning and pressing the driver backplane and the transfer substrate and performing a lighting test on the plurality of light-emitting devices, the surface of the light shielding member away from the first substrate is higher than the surface of the second adhesive member away from the first substrate, or the surface of the light shielding member away from the first substrate is flush with the surface of the second adhesive member away from the first substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0024] FIG1 is a structural diagram of a display device according to some embodiments;

[0025] FIG2 is another structural diagram of a display device according to some embodiments;

[0026] FIG3 is a cross-sectional view along section line AA in FIG1 ;

[0027] FIG4 is another cross-sectional view along section line AA in FIG1 ;

[0028] FIG5 is a structural diagram of a light-emitting substrate according to some embodiments;

[0029] FIG6 is a structural diagram of a driving backplane according to some embodiments;

[0030] FIG7 is another structural diagram of a driving backplane according to some embodiments;

[0031] FIG8 is another structural diagram of a driving backplane according to some embodiments;

[0032] FIG9 is another structural diagram of a driving backplane according to some embodiments;

[0033] FIG10 is another structural diagram of a driving backplane according to some embodiments;

[0034] FIG11 is a structural diagram of a transfer substrate according to some embodiments;

[0035] FIG12 is a structural diagram showing the alignment and pressing of a driving backplane and a transfer substrate according to some embodiments;

[0036] FIG13 is another structural diagram of a driving backplane according to some embodiments;

[0037] FIG14 is another structural diagram of a driving backplane according to some embodiments;

[0038] FIG15 is another structural diagram of a driving backplane according to some embodiments;

[0039] FIG16 is another structural diagram of a light-emitting substrate according to some embodiments;

[0040] 17 to 26 are flow charts and step diagrams of a method for preparing a light-emitting substrate according to some embodiments. DETAILED DESCRIPTION

[0041] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0042] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0043] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0044] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0045] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0046] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0047] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0048] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0049] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0050] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0051] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0052] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0053] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0054] As shown in FIG. 1 and FIG. 2 , some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays either moving (eg, video) or fixed (eg, still image) content and either text or images.

[0055] Exemplarily, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a vehicle display, or an aircraft display.

[0056] In some examples, as shown in FIG1 , the display device 1000 may be a portable display product. For example, the display device 1000 may be the mobile phone shown in FIG1 .

[0057] In some other examples, as shown in FIG2 , the display device 1000 may be a wearable device. For example, the display device 1000 may be a watch as shown in FIG2 .

[0058] In some embodiments, as shown in FIG. 3 and FIG. 4 , the display device 1000 includes a light emitting substrate 100 , a driving circuit board 200 , a housing 300 , and a cover plate 400 .

[0059] The cover plate 400 is disposed on the light-emitting side of the light-emitting substrate 100. The driving circuit board 200 is disposed on the non-light-emitting side of the light-emitting substrate 100 and is connected to the light-emitting substrate 100 to provide a light-emitting signal to the light-emitting substrate 100.

[0060] Among them, the light-emitting substrate 100 has a relative light-emitting side 100A and a non-light-emitting side 100B, the light-emitting side 100A refers to the side of the light-emitting substrate 100 that can emit light (the upper side of the light-emitting substrate 100 in Figures 3 and 4), and the non-light-emitting side 100B refers to the other side opposite to the light-emitting side 100A (the lower side of the light-emitting substrate 100 in Figures 3 and 4).

[0061] In addition, the shell 300 can be a box-shaped structure with an opening, the light-emitting substrate 100 and the driving circuit board 200 can be arranged in the shell 300, and the cover plate 400 is arranged on the light-emitting side of the light-emitting substrate 100 and is located at the opening of the shell 300.

[0062] It is understandable that the display device 1000 may be a liquid crystal display (LCD) or a mini / micro light emitting display (MLED), which is not specifically limited in the embodiments of the present disclosure.

[0063] In some embodiments, as shown in FIG3 , the display device 1000 may be a liquid crystal display device. The liquid crystal display device further includes a display panel 500 . The display panel 500 is disposed on the light-emitting side 100A of the light-emitting substrate 100 . The display panel 500 is capable of adjusting the intensity (grayscale) of light passing through it, thereby displaying an image. In this case, the light-emitting substrate 100 serves as a backlight source in the liquid crystal display device, providing backlight for the display panel 500 .

[0064] As shown in Figure 3, the display device 1000 further includes a plurality of optical films 600. The plurality of optical films 600 are disposed between the display panel 500 and the light emitting substrate 100. The plurality of optical films 600 are configured to perform uniformization and / or color conversion processing on the light emitted by the light emitting substrate 100.

[0065] For example, the light emitting substrate 100 can directly emit white light, and the white light is emitted toward the display panel 500 after being uniformed by the multiple optical films 600 .

[0066] Alternatively, illustratively, the light emitting substrate 100 may also emit light of other colors (eg, blue light), which is then emitted toward the display panel 500 after undergoing color conversion and light homogenization processing by the multiple optical films 600 .

[0067] In other embodiments, as shown in FIG4 , the display device 1000 may be a micro-luminescent display device. In this case, the light-emitting substrate 100 may serve as the display panel of the micro-luminescent display device and directly display the image. The light-emitting substrate 100 may emit multiple colors of light (e.g., red, blue, and green) to achieve full-color display.

[0068] The following uses the display device 1000 as a micro-luminescent display device as an example to exemplify some embodiments of the present disclosure, but the implementation of the present disclosure is not limited thereto, and any other display device can also be considered as long as the same technical concept is applied.

[0069] In some embodiments, as shown in FIG. 4 , the light emitting substrate 100 includes a driving backplane 10 and a plurality of light emitting devices 20 .

[0070] As shown in FIG. 5 , the driving backplane 10 includes a first substrate 11 and a plurality of pad groups 12 .

[0071] The first substrate 11 may be a flexible first substrate 11 or a rigid first substrate 11. The material used for the first substrate 11 may include a polymer resin or glass. For example, the first substrate 11 may be flexible, and the material used for the first substrate 11 includes a polymer resin, such as one of polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate two formal acid glycol ester (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP). Illustratively, the first substrate 11 may be rigid, including a glass material containing SiO 2 as a main component.

[0072] As shown in FIG5 , a plurality of pad groups 12 are disposed on one side of the first substrate 11 and connected to the first substrate 11. Exemplarily, as shown in FIG6 , the plurality of pad groups 12 are arranged into multiple rows and columns, with each row including at least two pad groups 12 arranged along a first direction X. Each column includes at least two pad groups 12 arranged along a second direction Y. The first direction X and the second direction Y intersect. As shown in FIG5 , the pad group 12 includes a plurality of pads 121. Exemplarily, one pad group 12 includes two, three, four, or six pads 121.

[0073] For example, the material of the pad 121 may include metal. For example, the material of the pad 121 includes copper or silver. In this case, the pad 121 has good conductivity and low resistance.

[0074] Illustratively, the thickness of the pad 121 is 2 μm to 5 μm along the third direction Z. For example, the thickness of the pad 121 is 2 μm, 3 μm, 4 μm, or 5 μm. The third direction Z is perpendicular to the first substrate 11 .

[0075] As shown in FIG5 , a plurality of light emitting devices 20 are disposed on a side of the plurality of pad groups 12 away from the first substrate 11 , and one light emitting device 20 is connected to one pad group 12 .

[0076] In some examples, the light emitting devices 20 emit the same color. In this case, the light emitting substrate 100 emits light of only one color. In this case, the light emitting substrate 100 serves as a backlight source in a liquid crystal display device to provide backlight for the display panel 500 .

[0077] In other examples, the plurality of light-emitting devices 20 include a plurality of red light-emitting devices, a plurality of blue light-emitting devices, and a plurality of green light-emitting devices. The red light-emitting devices emit red, the blue light-emitting devices emit blue, and the green light-emitting devices emit green. In this way, the light-emitting substrate 100 can emit light of multiple colors to achieve full-color display.

[0078] In the related art, a method for preparing a light-emitting substrate includes the following steps: first, bonding a driver backplane to the light-emitting devices, then performing a lighting test on all the light-emitting devices, and when any of the light-emitting devices fail to light up, replacing the failed light-emitting devices until all the light-emitting devices are lit. Prior to replacing the failed light-emitting devices, the failed light-emitting devices that have already been bonded together need to be separated from the driver backplane. The process of separating the bonded light-emitting devices from the driver backplane is relatively complex and time-consuming, resulting in a long preparation time for the light-emitting substrate and low preparation efficiency. When any of the light-emitting devices fail to light up, the driver backplane and the light-emitting devices need to be bonded together multiple times during the preparation process of the light-emitting substrate, resulting in a large number of preparation steps for the light-emitting substrate, a long preparation time for the light-emitting substrate, and low preparation efficiency.

[0079] In order to solve the above technical problems, some embodiments of the present disclosure provide a driving backplane 10. As shown in FIG7 , the driving backplane 10 further includes a plurality of first adhesive members 13. The plurality of first adhesive members 13 are arranged on one side of the first substrate 11 close to the plurality of pad groups 12 and are connected to the first substrate 11. The distance between the surface of the first adhesive member 13 away from the first substrate 11 and the first substrate 11 is greater than the distance between the surface of the pad group 12 away from the first substrate 11 and the first substrate 11. That is, the surface of the first adhesive member 13 away from the first substrate 11 is higher than the surface of the pad group 12 away from the first substrate 11. The first adhesive member 13 is configured to adhere to the light-emitting device 20 when the light-emitting device 20 and the pad group 12 are in contact.

[0080] Arranged in this manner, before the light-emitting device 20 and the pad group 12 are bonded together, the first adhesive 13 can fix the light-emitting device 20 to the driving backplane 10 to prevent the light-emitting device 20 from moving relative to the driving backplane 10, so as to facilitate the lighting test of the light-emitting device 20. Therefore, the lighting test step in the preparation method of the light-emitting substrate 100 can be performed before the bonding step.

[0081] In this way, during the step of replacing the unlit light-emitting device 20, the first adhesive 13 can secure the light-emitting device 20 to the driver backplane 10. Therefore, it is no longer necessary to bond the driver backplane to the unlit light-emitting device 20. This eliminates the bonding step in the step of replacing the unlit light-emitting device 20 in the related art, reduces the number of bonding steps included in the method for preparing the light-emitting substrate 100, simplifies the preparation process of the light-emitting substrate 100, shortens the preparation time of the light-emitting substrate 100, and improves the preparation efficiency of the light-emitting substrate 100. Before replacing the unlit light-emitting device 20, the unlit light-emitting device 20 is in contact with the solder pad group 12, and the first adhesive 13 is bonded to the light-emitting device 20. That is, the unlit light-emitting device 20 is not bonded to the solder pad group 12, and the unlit light-emitting device 20 is easily separated from the driver backplane 10. This reduces the time required to separate the unlit light-emitting device 20 from the driver backplane 10, shortens the preparation time of the light-emitting substrate 100, and improves the preparation efficiency of the light-emitting substrate 100.

[0082] In some embodiments, the material of the first adhesive member 13 includes polyurethane and / or acrylic resin.

[0083] In some embodiments, the distance between the surface of the first adhesive 13 away from the first substrate 11 and the first substrate 11 is 3 μm to 5 μm.

[0084] For example, the distance between the surface of the first adhesive 13 away from the first substrate 11 and the first substrate 11 is at least one of 3 μm, 3.2 μm, 3.6 μm, 3.7 μm, 4 μm, 4.1 μm, 4.3 μm, 4.7 μm, and 5 μm.

[0085] The distance between the surface of the pad group 12 away from the first substrate 11 and the first substrate 11 is 2 μm to 3 μm.

[0086] For example, the distance between the surface of the pad group 12 away from the first substrate 11 and the first substrate 11 is at least one of 2 μm, 2.1 μm, 2.4 μm, 2.6 μm, 2.7 μm, and 3 μm.

[0087] 5 , the light emitting device 20 includes a light emitting body 21 and pins 22 connected to each other. When the light emitting device 20 is connected to the driver backplane 10, the pins 22 are located on a side of the light emitting body 21 close to the driver backplane 10 and connected to the driver backplane 10.

[0088] In some embodiments, a distance d1 between a surface of the first adhesive 13 away from the first substrate 11 and a surface of the pad group 12 away from the first substrate 11 is greater than or equal to a first preset value. The first preset value is equal to the thickness of the lead 22 along the third direction Z. In this manner, the light-emitting body 21 and the first adhesive 13 can be bonded together.

[0089] In some examples, the distance d1 between the first adhesive 13 and the surface of the first substrate 11 and the pad group 12 and the surface of the first substrate 11 is greater than a first preset value. In this way, the risk of inconsistent thickness of the pin 22 along the third direction Z causing part of the first adhesive 13 to fail to bond with the light-emitting body 21 can be reduced.

[0090] On this basis, the first adhesive member 13 has elasticity. In this way, the first adhesive member 13 can generate elastic deformation to move the first adhesive member 13 toward the first substrate 11 , thereby making the light emitting device 20 abut against the pad group 12 .

[0091] Exemplarily, the difference between the distance d1 between the first adhesive member 13 and the surface of the first substrate 11 and the surface of the pad group and the first substrate 11 and the first preset value is 1 μm to 2 μm. For example, the difference between the distance between the surface of the first adhesive member 13 and the surface of the pad group and the first preset value and the first preset value is any one of 1 μm, 1.2 μm, 1.7 μm, 1.9 μm, and 2 μm.

[0092] In this way, the deformation of the first adhesive 13 is small and the elastic force generated is small, which can reduce the elastic force of the first adhesive 13 on the light-emitting device 20, thereby increasing the service life of the light-emitting device 20 and the service life of the light-emitting substrate 100.

[0093] In other embodiments, the first adhesive 13 is away from the surface of the first substrate 11, and the distance between the first adhesive 13 and the surface of the pad group 12 away from the first substrate 11 is equal to a first preset value. In this way, the deformation of the first adhesive 13 is substantially zero, and the elastic force of the first adhesive 13 on the light-emitting device 20 is also substantially zero, thereby improving the service life of the light-emitting device 20 and the service life of the light-emitting substrate 100.

[0094] In some embodiments, as shown in FIG. 5 , the orthographic projection of the first adhesive 13 on the first substrate 11 is symmetrical about the geometric center of the orthographic projection of the light emitting device 20 on the first substrate 11 .

[0095] When arranged in this manner, the light-emitting device 20 is subjected to a more uniform force, which can make the height consistency of the light-emitting device 20 better, thereby reducing the deviation in the direction of the light emitted by the light-emitting device 20, making the display brightness of the light-emitting substrate 100 more uniform, improving the problems of color separation and color deviation produced by the light-emitting substrate 100, and improving the display effect.

[0096] On this basis, as shown in FIG6 , the first adhesive member 13 is disposed between two adjacent pads 121 among the plurality of pads 121 included in one pad group 12 .

[0097] In other embodiments, as shown in FIG. 8 and FIG. 9 , the first adhesive member 13 is disposed on the peripheral side of the pad group 12 .

[0098] 8 , the first adhesive member 13 is disposed around the pad group 12 . Alternatively, the first adhesive member 13 is disposed on both sides of the pad group 12 , as shown in FIG9 .

[0099] In some other embodiments, as shown in FIG10 , the first adhesive member 13 includes a first sub-portion 131 and a second sub-portion 132. The first sub-portion 131 is disposed between two adjacent pads 121 of a plurality of pads 121 included in a pad group 12, and the second sub-portion 132 is disposed around the pad group 12. Exemplarily, the first sub-portion 131 and the second sub-portion 132 are connected.

[0100] Some embodiments of the present disclosure further provide a transfer substrate 700, as shown in FIG11 , which includes a transfer substrate 701 and a plurality of light-emitting devices 20. The transfer substrate 701 is used to transfer the light-emitting devices 20 to the driving backplane 10 so as to connect the light-emitting devices 20 to the driving backplane 10.

[0101] As shown in Figure 11, the transfer substrate 701 includes a second substrate 7011 and a plurality of second adhesive members 7012. The material of the second substrate 7011 can be the same as the material of the first substrate 11 described above. The plurality of second adhesive members 7012 are disposed on one side of the second substrate 7011 and connected to the second substrate 7011. The initial adhesive force of the second adhesive members 7012 is greater than the adhesive force after the second adhesive members 7012 are irradiated with light having a wavelength within a first preset range. The initial adhesive force of the second adhesive members 7012 is the adhesive force before irradiation with light having a wavelength within the first preset range.

[0102] Illustratively, the material of the second adhesive 7012 includes acrylic glue.

[0103] Exemplarily, the thickness of the second adhesive 7012 is 2μm to 10μm, for example, the thickness of the second adhesive 7012 is 2μm, 2.4μm, 2.8μm, 3μm, 3.5μm, 4μm, 4.6μm, 5μm, 5.4μm, 6μm, 6.9μm, 7.4μm, 8μm, 8.6μm, 9μm, 9.6μm, or 10μm.

[0104] It can be understood that the light with a wavelength in the first preset range can be visible light or invisible light.

[0105] Under the condition that the second adhesive member 7012 has not been irradiated with light of a wavelength within the first preset range, the second adhesive member 7012 is bonded to the light-emitting device 20. The second adhesive member 7012 has a relatively strong initial adhesion, so that the first adhesive member 13 and the light-emitting device 20 are firmly bonded and not easily separated. This reduces the risk of the light-emitting device 20 falling off the second adhesive member 7012 during the transfer process.

[0106] Illustratively, when the second adhesive member 7012 is not irradiated with light having a wavelength within the first predetermined range, the initial adhesion of the second adhesive member 7012 is greater than 1500 gf / mm. For example, the initial adhesion of the second adhesive member 7012 is 1500 gf / mm, 1550 gf / mm, 1600 gf / mm, 1640 gf / mm, 1750 gf / mm, 1800 gf / mm, 1900 gf / mm, 1950 gf / mm, or 2000 gf / mm.

[0107] The light emitting device 20 is separated from the transfer substrate when the second adhesive 7012 is irradiated with light having a wavelength within the first preset range. The second adhesive 7012 has a weaker adhesive force after being irradiated with light having a wavelength within the first preset range, so that the light emitting device 20 is not firmly bonded to the first adhesive 13, making it easier to separate.

[0108] Illustratively, the adhesion of the second adhesive 7012 after being irradiated with light of a wavelength within the first preset range is less than 10 gf / mm. For example, the adhesion of the second adhesive 7012 after being irradiated with light of a wavelength within the first preset range is 10 gf / mm, 9.1 gf / mm, 8 gf / mm, 7.2 gf / mm, 6 gf / mm, 5.5 gf / mm, 5 gf / mm, 4.6 gf / mm, or 3 gf / mm.

[0109] In summary, when the second adhesive 7012 is not exposed to light with a wavelength within the first preset range, the second adhesive 7012 is bonded to the light-emitting device 20. The second adhesive 7012 has a relatively high initial adhesion force, resulting in a relatively strong bond between the second adhesive 7012 and the light-emitting device 20 and making separation difficult. When the second adhesive 7012 is exposed to light with a wavelength within the first preset range, the second adhesive 7012 has a relatively low adhesion force. In other words, the bonding force between the second adhesive 7012 and the light-emitting device 20 is relatively low, allowing the transfer substrate 701 to be removed directly.

[0110] On this basis, the wavelength of the light emitted by the light emitting device 20 is within the first preset range.

[0111] With this arrangement, during the lighting test, light emitted by the light-emitting device 20 impinges on the second adhesive member 7012. At this point, the second adhesive member 7012 has a relatively low adhesive force. Specifically, the adhesive force between the second adhesive member 7012 and the already lit light-emitting device 20 is relatively low, and the adhesive force between the second adhesive member 7012 and the already lit light-emitting device 20 is also lower than the adhesive force between the first adhesive member 13 and the already lit light-emitting device 20. After the lighting test, the transfer substrate 701 can be removed directly. In other words, the lighting test and the separation of the already lit light-emitting device 20 from the transfer substrate 701 occur almost simultaneously, reducing the number of steps required to prepare the light-emitting substrate 100, thereby shortening the preparation time and improving the efficiency of preparing the light-emitting substrate 100.

[0112] It is understood that if any light-emitting device 20 is unlit, the second adhesive 7012 bonded to the unlit light-emitting device 20 has a greater adhesive force. That is, the adhesive force between the second adhesive 7012 and the unlit light-emitting device 20 is greater, and the adhesive force between the second adhesive 7012 and the unlit light-emitting device 20 is greater than the adhesive force between the first adhesive 13 and the unlit light-emitting device 20. During the separation of the lit light-emitting device 20 from the transfer substrate 701, the transfer substrate 701 will carry the unlit light-emitting device 20 with it. In other words, the separation of the lit light-emitting device 20 from the transfer substrate 701 occurs simultaneously with the separation of the unlit light-emitting device 20 from the first adhesive 13. This reduces the number of steps in the preparation of the light-emitting substrate 100, thereby shortening the preparation time and improving the preparation efficiency of the light-emitting substrate 100.

[0113] In some embodiments, as shown in FIG12 , the transfer substrate 701 further includes a plurality of transfer blocks 7013 . The plurality of transfer blocks 7013 are disposed between the plurality of second adhesive members 7012 and the second substrate 7011 . One second adhesive member 7012 is connected to one transfer block 7013 .

[0114] In some embodiments, based on the wavelength of light emitted by the light-emitting device 20 being within a first preset range, as shown in FIG12 , the driver backplane 10 further includes a light blocking member 14. The light blocking member 14 is disposed on a side of the first substrate 11 near the plurality of pad groups 12 and is connected to the first substrate 11. The light blocking member 14 is disposed between two adjacent pad groups 12. The light blocking member 14 is configured to block light emitted by the light-emitting device 20.

[0115] Arranged in this way, during the lighting test, the light blocking member 14 can block the light emitted from the lit light-emitting device 20 to the second adhesive member 7012 bonded to the unlit light-emitting device 20, thereby reducing the risk of decreased adhesion of the second adhesive member 7012 bonded to the unlit light-emitting device 20 and improving the reliability of the bonding between the second adhesive member 7012 and the unlit light-emitting device 20.

[0116] For example, as shown in FIG12 , a distance d2 between the surface of the light blocking member 14 away from the first substrate 11 and the first substrate 11 is greater than a distance d3 between the surface of the light emitting body 21 close to the first substrate 11 and the first substrate 11. That is, the surface of the light blocking member 14 away from the first substrate 11 is higher than the surface of the light emitting body 21 close to the first substrate 11.

[0117] In this way, the light blocking member 14 can block the light emitted by the light emitting device 20. That is, the light blocking member 14 can block the light emitted by the light emitting device 20 that is already lit and directed toward the second adhesive member 7012 that is bonded to the unlit light emitting device 20.

[0118] On this basis, as shown in Figure 12, the ratio of the distance between the surface of the light blocking member 14 away from the first substrate 11 and the surface of the light emitting body 21 close to the first substrate 11 to the thickness of the light emitting body 21 along the third direction Z is greater than or equal to 0.5.

[0119] In this way, the light blocking member 14 can block most of the light emitted by the light emitting device 20. That is, the light blocking member 14 can block most of the light emitted by the light emitting device 20 to the second adhesive member 7012 bonded to the unlit light emitting device 20.

[0120] It can be understood that the thickness of the light emitting body 21 along the third direction Z refers to the distance between the surface of the light emitting body 21 away from the pins 22 and the pins 22 .

[0121] Exemplarily, the ratio of the distance between the light blocking member 14 away from the surface of the first substrate 11 and the surface of the light emitting body 21 close to the first substrate 11 to the thickness of the light emitting body 21 along the third direction is 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1 or 1.2.

[0122] For example, the distance between the surface of the light blocking member 14 away from the first substrate 11 and the surface of the light emitting body 21 close to the first substrate 11 is in a ratio of 1 to the thickness of the light emitting body 21 along the third direction, that is, the surface of the light blocking member 14 away from the first substrate 11 is flush with the surface of the light emitting body 21 away from the first substrate 11.

[0123] In some embodiments, as shown in Figures 13, 14, and 15, multiple pad groups 12 are arranged into multiple rows and columns, each row includes at least two pad groups 12 arranged along a first direction, and each column includes at least two pad groups 12 arranged along a second direction. The light blocking member 14 includes a plurality of first light blocking bars 141 and / or a plurality of second light blocking bars 142.

[0124] In some examples, as shown in FIG13 , the light blocking member 14 includes a plurality of first light blocking bars 141. The first light blocking bars 141 extend along the first direction X, and at least one first light blocking bar 141 is disposed between two adjacent rows of pad groups 12. For example, one, two, three, or four first light blocking bars 141 are disposed between two adjacent rows of pad groups 12.

[0125] In other examples, as shown in FIG14 , the light blocking member 14 includes a plurality of second light blocking bars 142. The second light blocking bars 142 extend along the second direction Y, and at least one second light blocking bar 142 is disposed between two adjacent columns of pad groups 12. For example, one, two, three, or four second light blocking bars 142 are disposed between two adjacent columns of pad groups 12.

[0126] In some other examples, as shown in FIG15 , the light shielding member 14 includes a plurality of first light shielding bars 141 and a plurality of second light shielding bars 142. The first light shielding bars 141 extend along a first direction X, and at least one first light shielding bar 141 is disposed between two adjacent rows of pad groups 12. The second light shielding bars 142 extend along a second direction Y, and at least one second light shielding bar 142 is disposed between two adjacent columns of pad groups 12.

[0127] It is understood that the first light-blocking strip 141 can be a continuous structure or a discontinuous structure. The second light-blocking strip 142 can also be a continuous structure or a discontinuous structure. The discontinuous structure refers to a structure in which the light-blocking strip is interrupted in the middle along the direction in which the light-blocking strip extends. For example, along the direction in which the light-blocking strip extends, the light-blocking strip includes at least two light-blocking segments, with a gap between the two light-blocking segments.

[0128] As shown in FIG15 , the first light shielding bar 141 and the second light shielding bar 142 are both continuous structures. The first light shielding bar 141 and the second light shielding bar 142 intersect with each other. The intersecting portion belongs to both the first light shielding bar 141 and the second light shielding bar 142 .

[0129] In some embodiments, as shown in FIG16 , the driving backplane 10 further includes a light reflecting layer 15 . The light reflecting layer 15 is disposed on a side of the first substrate 11 close to the light blocking member 14 and on a sidewall of the light blocking member 14 .

[0130] In this manner, the reflective layer 15 can reflect part of the light emitted by the light emitting device 20 onto the reflective layer to above the light emitting device 20 so as to be emitted out of the light emitting substrate 100 , thereby improving the light extraction efficiency of the light emitting substrate 100 .

[0131] The embodiment of the present disclosure further provides a method for preparing a light-emitting substrate. As shown in FIG17 , the method includes steps S100 to S500 .

[0132] As shown in FIG. 18 , S100 : providing a transfer substrate 700 and a driving backplane 10 .

[0133] In the above steps, the transfer substrate 700 includes a transfer substrate 701 and a plurality of light-emitting devices 20, which are disposed on the transfer substrate 701. The driving backplane 10 includes a first substrate 11, a plurality of solder pad groups 12, and a first adhesive 13. The plurality of solder pad groups 12 are disposed on one side of the first substrate 11 and connected to the first substrate 11. The plurality of first adhesives 13 are disposed on a side of the first substrate 11 near the plurality of solder pad groups 12 and connected to the first substrate 11.

[0134] Illustratively, the transfer substrate 701 includes a second substrate 7011 and a plurality of second adhesive members 7012. The second adhesive members 7012 are disposed on one side of the second substrate 7011 and connected to the second substrate 7011. A plurality of light-emitting devices 20 are disposed on a side of the second adhesive member 7012 away from the second substrate 7011, with each light-emitting device 20 bonded to one second adhesive member 7012. In this case, the second adhesive members 7012 have a strong adhesive force, and the second adhesive members 7012 and the light-emitting devices 20 are bonded more firmly, thereby reducing the risk of the light-emitting devices 20 falling off the second adhesive member 7012 during the transfer process.

[0135] Exemplarily, as shown in FIG. 19 , providing the transfer substrate includes S110 to S130 .

[0136] As shown in FIG. 20 , S110 : providing a transfer substrate 701 and a donor substrate 800 .

[0137] In the above steps, the donor substrate 800 includes a third substrate 801, a dissociation layer 802, an adhesive layer 803, and a plurality of light-emitting devices 20. The material of the third substrate 801 can be the same as that of the second substrate 7011. The dissociation layer 802 is disposed on one side of the third substrate 801 and is connected to the third substrate 801. The adhesive layer 803 is disposed on a side of the dissociation layer 802 away from the third substrate 801 and is connected to the dissociation layer 802. The plurality of light-emitting devices 20 are disposed on a side of the adhesive layer 803 away from the third substrate 801 and are bonded to the adhesive layer 803.

[0138] For example, the material of the dissociation layer 802 includes at least one of polyimide, acrylic acid, and epoxy resins, and the material of the bonding layer 803 includes at least one of ether resins, epoxy resins, acrylic resins, polyisoprene, and polyisobutylene resins.

[0139] The transfer substrate 701 includes a second substrate 7011 and a second adhesive member 7012 . The second adhesive member 7012 is disposed on one side of the second substrate 7011 and connected to the second substrate 7011 .

[0140] As shown in FIG. 21 , S120 : aligning and pressing the donor substrate 800 and the transfer substrate 701 .

[0141] In the above steps, the donor substrate 800 and the transfer substrate 701 are arranged opposite to each other, and one light emitting device 20 and one second adhesive member 7012 are bonded together.

[0142] As shown in FIG. 22 , S130 : peeling off the third substrate 801 and the dissociation layer 802 .

[0143] In the above steps, the dissociation layer 802 may be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding and mechanical debonding.

[0144] Illustratively, the dissociation layer 802 can be debonded by laser, and the dissociation layer 802 absorbs light of a second preset wavelength, thereby causing the interface between the dissociation layer 802 and the bonding layer 803 to be eroded, thereby removing the dissociation layer 802 and the third substrate 801 .

[0145] For example, the second preset wavelength may be at least one of 255 nm, 256 nm, 308 nm, and 355 nm.

[0146] As shown in FIG. 23 , S200 : aligning and pressing the driving backplane 10 and the transfer substrate, and performing a lighting test on the plurality of light-emitting devices 20 .

[0147] In the above steps, the pad group 12 and the light emitting device 20 are in contact, and the first adhesive 13 and the light emitting device 20 are bonded. For the light emitting device 20 that has been lit, the bonding force between the light emitting device 20 and the first adhesive 13 is greater than the bonding force between the light emitting device 20 and the second adhesive 7012.

[0148] S300: Determine whether there is an unlit light emitting device 20 among the plurality of light emitting devices 20 .

[0149] As shown in FIG. 24A and FIG. 24B , S400 : when there is an unlit light emitting device 20 among the plurality of light emitting devices 20 , the unlit light emitting device 20 is replaced until all the plurality of light emitting devices 20 are lit.

[0150] In the above steps, during the process of replacing the unlit light-emitting device 20, the unlit light-emitting device 20 is in contact with the pad group 12, and the first adhesive 13 is bonded, that is, the unlit light-emitting device 20 is not bonded to the pad group 12. Therefore, the unlit light-emitting device 20 is easily separated from the driving backplane 10, thereby reducing the time for separating the unlit light-emitting device 20 from the driving backplane 10, reducing the preparation time of the light-emitting substrate 100, and improving the preparation efficiency of the light-emitting substrate 100.

[0151] As shown in FIG. 25 , S500 : when all the light-emitting devices 20 are lit, the bonding pad group 12 and the light-emitting devices 20 are connected.

[0152] In some embodiments, as shown in FIG. 26 , replacing the unlit light emitting device 20 includes S410 and S420 .

[0153] As shown in FIG. 24A , S410 : removing the transfer substrate 701 , and separating the unlit light-emitting device 20 from the first adhesive 13 .

[0154] As shown in FIG. 24B , S420 : aligning and pressing the driving backplane 10 and the repair substrate 900 after the transfer substrate 701 is removed.

[0155] In the above steps, the repair substrate 900 includes a transfer substrate 701 and at least one light emitting device 20. The light emitting device 20 is disposed on the transfer substrate 701 and bonded to the target adhesive 133.

[0156] The target adhesive 133 is the first adhesive 13 corresponding to the unlit light emitting device 20 among the plurality of first adhesives 13. The first adhesive 13 corresponding to the unlit light emitting device 20 is the first adhesive 13 that is separated after being bonded to the unlit light emitting device 20.

[0157] In some embodiments, the initial adhesion of the second adhesive 7012 is greater than the adhesion of the first adhesive 13 , and the adhesion of the second adhesive 7012 after being irradiated by light emitted by the light emitting device 20 is less than the adhesion of the first adhesive 13 .

[0158] With this arrangement, during the lighting test, light emitted by the lit light-emitting device 20 illuminates the second adhesive member 7012. At this point, the adhesion of the second adhesive member 7012 to the lit light-emitting device 20 is weaker than the adhesion of the first adhesive member 13. In other words, the adhesion between the second adhesive member 7012 and the light-emitting device 20 is weaker than the adhesion between the light-emitting device 20 and the first adhesive member 13. After the lighting test, the transfer substrate 701 can be removed directly. In other words, the lighting test and the separation of the lit light-emitting device 20 from the transfer substrate 701 occur almost simultaneously, reducing the number of steps in the preparation of the light-emitting substrate 100, thereby shortening the preparation time and improving the efficiency of the preparation of the light-emitting substrate 100.

[0159] The bonding force between the unlit light-emitting device 20 and the second adhesive 7012 is greater than the bonding force between the first adhesive 13 and the unlit light-emitting device 20. Therefore, during the separation process of the lit light-emitting device 20 from the transfer substrate 701, the transfer substrate 701 will carry away the unlit light-emitting device 20. In other words, the separation process of the lit light-emitting device 20 from the transfer substrate 701 and the separation process of the unlit light-emitting device 20 from the first adhesive 13 are carried out simultaneously, which can reduce the number of steps in the preparation of the light-emitting substrate 100, thereby shortening the preparation time of the light-emitting substrate 100 and improving the preparation efficiency of the light-emitting substrate 100.

[0160] In some embodiments, the driving backplane 10 further includes a light blocking member 14 , which is disposed on a side of the first substrate 11 close to the plurality of pad groups 12 and connected to the first substrate 11 ; the light blocking member 14 is disposed between two adjacent pad groups 12 .

[0161] As shown in Figure 23, in step S200, the surface of the light blocking member 14 away from the first substrate 11 is higher than the surface of the second adhesive member 7012 away from the first substrate 11 or the surface of the light blocking member 14 away from the first substrate 11 is flush with the surface of the second adhesive member 7012 away from the first substrate 11.

[0162] Arranged in this manner, the light blocking member 14 can block the light from the lit light-emitting device 20 to the second adhesive member 7012 bonded to the unlit light-emitting device 20, thereby reducing the risk of decreased adhesion of the second adhesive member 7012 bonded to the unlit light-emitting device 20, thereby improving the reliability of the bonding between the second adhesive member 7012 and the unlit light-emitting device 20.

[0163] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0164] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A driving backplane, comprising: a first substrate; a plurality of pad groups, disposed on one side of the first substrate and connected to the first substrate; One of the pad groups is configured to be connected to one light emitting device; a plurality of first adhesive members, disposed on a side of the first substrate close to the plurality of pad groups and connected to the first substrate; The distance between the surface of the first adhesive away from the first substrate and the first substrate is greater than the distance between the surface of the pad group away from the first substrate and the first substrate, and the first adhesive is configured to adhere to the light-emitting device when the light-emitting device and the pad are in contact.

2. The driving backplane according to claim 1, wherein: The distance between the surface of the first adhesive away from the first substrate and the first substrate is 3 μm to 5 μm, and the distance between the surface of the pad group away from the first substrate and the first substrate is 2 μm to 3 μm.

3. The driving backplane according to claim 1 or 2, wherein: The pad group includes a plurality of pads, and the first adhesive is disposed between two adjacent pads among the plurality of pads included in one pad group; and / or the first adhesive is disposed on a peripheral side of one pad group. 4 . The driving back plate according to claim 1 , wherein the material of the first adhesive comprises polyurethane and / or acrylic resin.

5. The driving backplane according to any one of claims 1 to 4, further comprising: a light blocking member, disposed on a side of the first substrate close to the plurality of pad groups and connected to the first substrate; The light blocking member is disposed between two adjacent pad groups; the light blocking member is configured to block light emitted by the light emitting device.

6. The driving backplane according to claim 5, wherein: The plurality of pad groups are arranged into a plurality of rows and a plurality of columns, each row including at least two pad groups arranged along a first direction, and each column including at least two pad groups arranged along a second direction; wherein the first direction and the second direction intersect; The light blocking member comprises: a plurality of first light-blocking strips, wherein the first light-blocking strips extend along the first direction, and at least one first light-blocking strip is provided between two adjacent rows of pad groups; and / or, A plurality of second light-blocking strips are provided, wherein the second light-blocking strips extend along the second direction, and at least one second light-blocking strip is provided between two adjacent columns of pad groups.

7. The driving backplane according to claim 5 or 6, further comprising: The light reflecting layer is arranged on a side of the first substrate close to the light blocking member and on a side wall of the light blocking member.

8. The driving backplane according to claim 7, wherein: The material of the reflective layer includes at least one of metal, white oil and white paint.

9. A light-emitting substrate, comprising: The driving backplane according to any one of claims 1 to 8; A plurality of light-emitting devices are arranged on the driving backplane; The light emitting device is connected to the pad of the driving backplane and is bonded to the first bonding member of the driving backplane.

10. The light emitting substrate according to claim 9, wherein The light-emitting device includes a connected light-emitting body and a pin, and the light-emitting body is located on the side of the pin away from the first substrate; the driving backplane includes a light-blocking member, and the distance between the surface of the light-blocking member away from the first substrate and the first substrate is greater than the distance between the surface of the light-emitting body close to the first substrate and the first substrate. The light-emitting substrate according to claim 10 , wherein: The ratio of the distance between the surface of the light blocking member away from the first substrate and the surface of the light emitting body close to the first substrate to the thickness of the light emitting body along the third direction is greater than or equal to 0.5; wherein, the third direction is perpendicular to the first substrate.

12. The light emitting substrate according to any one of claims 9 to 11, wherein The orthographic projection of the first adhesive member on the first substrate is symmetrical about the geometric center of the orthographic projection of the light-emitting device on the first substrate.

13. A display device comprising the light-emitting substrate according to any one of claims 9 to 12.

14. A transfer substrate, comprising: a second substrate; a plurality of second adhesive members, disposed on one side of the second substrate and connected to the second substrate; The initial adhesive force of the second adhesive component is greater than the adhesive force of the second adhesive component after being irradiated with light of a wavelength within a first preset range; A plurality of light emitting devices are arranged on a side of the plurality of second adhesive members away from the second substrate, and one of the light emitting devices is bonded to one of the second adhesive members.

15. The transfer substrate according to claim 14, wherein: The wavelength of light emitted by the light emitting device is within the first preset range.

16. A method for preparing a light-emitting substrate, comprising: Provide transfer substrate and drive backplane; The transfer substrate includes a transfer substrate and a plurality of light-emitting devices, wherein the plurality of light-emitting devices are arranged on the transfer substrate, the transfer substrate includes a second substrate and a second adhesive, the second adhesive is arranged on one side of the second substrate and connected to the second substrate, and the plurality of light-emitting devices are arranged on a side of the second adhesive away from the second substrate and bonded to the second adhesive; the driving backplane includes a first substrate, a plurality of pad groups and a first adhesive, the plurality of pad groups are arranged on one side of the first substrate and connected to the first substrate; the plurality of first adhesives are arranged on a side of the first substrate close to the plurality of pad groups and connected to the first substrate; The driving backplane and the transfer substrate are aligned and pressed together, and the plurality of light-emitting devices are subjected to a lighting test; the pad group and the light-emitting devices are abutted, and the first adhesive member and the light-emitting devices are bonded; When there is an unlit light emitting device among the plurality of light emitting devices, replacing the unlit light emitting device until all of the plurality of light emitting devices are lit; When all of the plurality of light-emitting devices are lit, the pad group and the light-emitting devices are bonded.

17. The preparation method according to claim 16, wherein The replacing of the unlit light emitting device comprises: removing the transfer substrate and separating the unlit light-emitting device from the first adhesive member; The driving backplane and the repair substrate after removing the transfer substrate are aligned and pressed together; the repair substrate includes a transfer substrate and at least one light-emitting device, the light-emitting device is arranged on the transfer substrate and is bonded to the target adhesive; the target adhesive is the first adhesive corresponding to the unlit light-emitting device among the multiple first adhesives.

18. The preparation method according to claim 16 or 17, wherein The initial adhesive force of the second adhesive component is greater than the adhesive force of the first adhesive component, and the adhesive force of the second adhesive component after being irradiated by the light emitted by the light emitting device is less than the adhesive force of the first adhesive component.

19. The preparation method according to claim 18, wherein The driving backplane further includes a light blocking member, which is disposed on a side of the first substrate close to the plurality of pad groups and connected to the first substrate; the light blocking member is disposed between two adjacent pad groups; In the steps of aligning and pressing the driving backplane and the transfer substrate and performing lighting tests on the multiple light-emitting devices, the surface of the light blocking member away from the first substrate is higher than the surface of the second adhesive member away from the first substrate or the surface of the light blocking member away from the first substrate is flush with the surface of the second adhesive member away from the first substrate.

Images