Display panel and display device

Abstract

The present disclosure relates to the technical field of display, and provides a display panel and a display device. The display panel of the present disclosure comprises a display area, a first transition area, a second transition area and a hole area. The display panel comprises a base substrate, and a planarizing layer, a light-emitting layer and at least one isolation column that are arranged on the base substrate; the light-emitting layer extends from the display area to the second transition area, and is disconnected at each isolation column; the isolation column surrounding the hole area and closest to the display area is a first isolation column, and a first recess formed in the base substrate is defined between the first isolation column and the planarizing layer; the planarizing layer comprises a planarizing area and an inclined area, and the planarizing layer comprises a first surface facing away from the base substrate; and a dihedral angle formed between a tangent plane of any point on the first surface in the inclined area and the second surface of the base substrate close to the planarizing layer is α; and the width of the first recess meets the following formula: W=α*k, wherein W represents the width of the first recess, k represents a coefficient, and k belongs to [0.48, 0.65].

Description

A display panel and display device Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display panel and a display device. Background Technology

[0002] In related organic light-emitting diode (OLED) display panels, holes are often made in the screen to accommodate devices such as cameras and sensors. However, making holes in the screen can easily expose the OLED film layer. Isolation pillars are required to block the water and oxygen intrusion channels formed by the electro-luminescence (EL) layer, so as to avoid defects such as growing dark spots (GDS) in the active area (AA).

[0003] However, as user requirements for AA Hole boundary specifications become increasingly stringent, the space left for AA Hole isolation pillar encapsulation is also shrinking. With fluctuations in the exposure and development processes of the pixel-limiting layer, residual adhesive can easily remain within the undercut structure of the isolation pillar, leading to EL material breakage failure, creating new water and oxygen intrusion paths, and ultimately resulting in defects such as GDS. Summary of the Invention

[0004] This disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a display panel and a display device.

[0005] In a first aspect, the technical solution adopted to solve the technical problem of this disclosure is a display panel having a display area, a first transition area, a second transition area, and an aperture area; the second transition area surrounds the aperture area and is located between the first transition area and the aperture area, and the first transition area surrounds the second transition area and is located between the display area and the first transition area; the display panel includes a substrate, a planarization layer disposed on the substrate, a light-emitting layer disposed on the side of the planarization layer opposite to the substrate, and at least one isolation pillar disposed on the substrate; the planarization layer extends from the display area to the first transition area; the light-emitting layer extends from the display area to the second transition area and is interrupted at the location of each isolation pillar; at least one isolation pillar is located in the second transition area;

[0006] The isolation pillar surrounding the opening area and closest to the display area is the first isolation pillar, and the first isolation pillar and the planarization layer define a first groove disposed on the substrate.

[0007] The planarization layer has a planar region and an inclined region. The planarization layer includes a first surface facing away from the substrate. The dihedral angle formed by the cross-section of any point on the first surface of the inclined region and the second surface of the substrate near the planarization layer is α. The width of the first groove satisfies the following formula: W = α × k; where W represents the width of the first groove, k represents a coefficient, and k ∈ [0.48, 0.65].

[0008] In some embodiments, the planarization layer includes a first sub-planarization layer, a second sub-planarization layer, and a third sub-planarization layer disposed sequentially along a direction away from the substrate.

[0009] The second sub-planar layer at least covers the boundary portion of the first sub-planar layer near the first isolation post, and the third sub-planar layer at least covers the boundary portion of the second sub-planar layer near the first isolation post.

[0010] In some embodiments, the dihedral angle α formed by the cross-section and the second surface is between 30° and 40°.

[0011] In some embodiments, the planarization layer includes a first sub-planarization layer, a second sub-planarization layer, and a third sub-planarization layer disposed sequentially along a direction away from the substrate.

[0012] In the second sub-planarization layer, the portion of the surface located in the inclined region and not covered by the third sub-planarization layer in the surface away from the substrate is continuous with the portion of the third sub-planarization layer located in the inclined region, and together with the surface of the third sub-planarization layer located in the planar region, forms the first surface.

[0013] In some embodiments, the outline edge of the orthographic projection of the third sub-planarization layer on the substrate is further away from the second transition region than the outline edge of the orthographic projection of the first sub-planarization layer on the substrate.

[0014] In some embodiments, the dihedral angle α formed by the cut surface and the second surface is between 22° and 30°.

[0015] In some embodiments, the planarization layer includes a first sub-planarization layer, a second sub-planarization layer, and a third sub-planarization layer disposed sequentially along a direction away from the substrate.

[0016] The second sub-planarization layer covers a portion of the surface of the first sub-planarization layer located in the inclined region; the third sub-planarization layer covers a portion of the surface of the second sub-planarization layer located in the inclined region;

[0017] In the first sub-planarization layer, the portion of the surface located in the inclined region and not covered by the second sub-planarization layer in the surface away from the substrate is continuous with the portion of the second sub-planarization layer located in the inclined region; in the second sub-planarization layer, the portion of the surface located in the inclined region and not covered by the third sub-planarization layer in the surface away from the substrate is continuous with the portion of the third sub-planarization layer located in the inclined region, and together with the surface of the third sub-planarization layer located in the planar region, forms the first surface.

[0018] In some embodiments, the dihedral angle α formed by the cut surface and the second surface is between 18° and 22°.

[0019] In some embodiments, the display panel further includes metal traces disposed on the side of the planarization layer near the substrate.

[0020] The orthographic projection of the metal trace on the substrate covers the orthographic projection of the isolation pillar on the substrate.

[0021] In some embodiments, the display panel further includes an interlayer insulating layer disposed between the isolation pillar and the metal trace, the interlayer insulating layer including a flat portion and a protrusion disposed opposite to the metal trace;

[0022] The isolation pillar is disposed on the surface of the protrusion facing away from the substrate.

[0023] In some embodiments, the isolation pillar includes a first conductive portion, a second conductive portion, and a third conductive portion arranged sequentially along a direction away from the substrate; the first conductive portion and the third conductive portion both protrude beyond the second conductive portion.

[0024] In some embodiments, the difference between the width of the protrusion and the width of the first conductive portion is greater than 2.9 μm.

[0025] In some embodiments, the ratio of the width of the first conductive portion to the width of the metal trace is between 0.4 and 0.6.

[0026] In some embodiments, the display panel includes a first insulating layer, a first gate line, a second insulating layer, a second gate line, an interlayer insulating layer, a first signal line, a first sub-planarization layer, a second signal line, a second sub-planarization layer, a third signal line, and a third sub-planarization layer, which are sequentially disposed along a direction away from the substrate.

[0027] The metal trace includes a first metal trace and a second metal trace; wherein the first metal trace is disposed on the same layer as the first gate line, and the second metal trace is disposed on the same layer as the second gate line.

[0028] The first isolation post is disposed on the same layer as one of the first signal line, the second signal line, and the third signal line.

[0029] In some embodiments, the second metal trace includes a third surface facing away from the substrate; the difference between the width of the third surface and the width of the first conductive portion is greater than 2.9 μm.

[0030] Secondly, embodiments of this disclosure also provide a display device, including a display panel as described in any one of the first aspects. Attached Figure Description

[0031] Figure 1 is a schematic diagram of the undercut structure filled with residual adhesive in the related technology;

[0032] Figure 2 is a schematic diagram of the water and oxygen intrusion path caused by the structure in Figure 1;

[0033] Figure 3 is a top view of the display panel provided in an embodiment of this disclosure;

[0034] Figure 4 is a cross-sectional view of the structure shown in Figure 3 along the A-A' direction;

[0035] Figure 5 is another cross-sectional view of the structure shown in Figure 3 along the A-A' direction;

[0036] Figure 6 is another cross-sectional view of the structure shown in Figure 3 along the A-A' direction;

[0037] Figure 7 is a schematic diagram of the collapse of the undercut structure in related technologies;

[0038] Figure 8 is an enlarged view of the isolation column provided in an embodiment of this disclosure. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. The components of the embodiments of this disclosure described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0040] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0041] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0042] Figure 1 is a schematic diagram of filling residual adhesive in the undercut structure in the related art; Figure 2 is a schematic diagram of the water and oxygen intrusion path caused by the structure in Figure 1; Figure 3 is a top view of the display panel provided in the embodiment of this disclosure; Figure 4 is a cross-sectional view of the structure shown in Figure 3 along the A-A' direction.

[0043] As shown in Figures 3 and 4, the display panel 100 provided in this embodiment of the present disclosure has a display area AA, a first transition area BB1, a second transition area BB2, and an opening area CC. The second transition area BB2 surrounds the opening area CC and is located between the first transition area BB1 and the opening area CC; the first transition area BB1 surrounds the second transition area BB2 and is located between the display area AA and the first transition area BB1. The opening area CC has an opening for mounting devices such as cameras and sensors. The display area AA has multiple light-emitting devices. The light-emitting layer EL of the light-emitting devices is usually formed as a single surface in the display area AA. Therefore, when using the encapsulation layer 6 for encapsulation, the area near the opening is often difficult to encapsulate, or even if it is encapsulated, the encapsulation effect in that area is difficult to guarantee. Therefore, an isolation pillar is provided in the second transition area BB2 to prevent impurities such as water and oxygen from entering the display area AA from the opening area CC along the single-surface light-emitting layer EL, causing defects such as GDS.

[0044] As shown in Figures 3 and 4, the display panel 100 includes a substrate 1, an intermediate structural layer 2 disposed on the substrate 1, a planarization layer PLN disposed on the side of the intermediate structural layer 2 opposite to the substrate 1, a pixel defining layer PDL and an emissive layer EL disposed on the side of the planarization layer PLN opposite to the substrate 1, and at least one isolation pillar disposed on the substrate 1.

[0045] The intermediate structural layer 2 includes pixel driving circuits, first electrodes for various light-emitting devices, and signal traces for various components (such as cameras and sensors located in the aperture area). The planarization layer PLN extends from the display area AA to the first transition area BB1, used to planarize the underlying package structure. The pixel defining layer PDL has pixel openings, and a portion of the light-emitting layer EL is located within these openings. The light-emitting layer EL extends from the display area AA to the second transition area BB2, and is interrupted at the location of each isolation pillar. At least one isolation pillar is located in the second transition area BB2.

[0046] As shown in Figure 4, the isolation pillar surrounding the opening area CC and closest to the display area AA is the first isolation pillar 3. The first isolation pillar 3 and the planarization layer PLN define a first groove 5 disposed on the substrate 1.

[0047] However, due to fluctuations in the exposure and development processes of the pixel-defining layer (PDL), residual adhesive 01 may form in the second groove 02, as shown in Figure 1, and subsequently fill the undercut structure 4 of the first isolation pillar 3. After the residual adhesive 01 fills the undercut structure 4 of the first isolation pillar 3, on the one hand, the water and oxygen intrusion path formed by the luminescent layer (EL) material cannot be cut off by the isolation pillar; on the other hand, new water and oxygen intrusion paths may also form, damaging the encapsulation structure, as shown in Figure 2. The narrower the second groove 02, the more difficult the washing process becomes after residual adhesive 01 forms within it; conversely, the wider the second groove 02, the easier the washing process becomes with residual adhesive 01 within it.

[0048] In response, this disclosure optimizes the second groove 02 to form a first groove 5, as shown in Figure 4. The first groove 5 is defined by the first isolation pillar 3 and the planarization layer PLN. Therefore, the planarization layer PLN can be optimized to form the first groove 5. For example, the area of ​​the planarization layer PLN can be limited in the direction from the second transition region BB2 to the display region AA, so that the edge of the planarization layer PLN is further away from the second transition region BB2, thereby increasing the width W1 of the first groove 5. The width W1 of the first groove 5 can be understood as the shortest distance from the outline boundary of the orthographic projection of the planarization layer PLN on the substrate 1 to the outline boundary of the orthographic projection of the first isolation pillar 3 on the substrate 1. Alternatively, the thickness of the planarization layer PLN can be reduced so that the slope of the planarization layer PLN located in the inclined region EE is gentler, thereby increasing the opening width W2 of the first groove 5. The opening width W2 of the first groove 5 can be understood as the shortest distance from the edge of the first isolation pillar 3 away from the surface of the substrate 1 and close to the display region AA, extending horizontally to contact the planarization layer PLN. The opening width W2 of the first groove 5 away from the substrate 1 is related to the height of the first isolation pillar 3 and the slope of the planarization layer PLN in the inclined region EE. With a fixed height of the first isolation pillar 3, the larger the value of α, the steeper the slope of the planarization layer PLN in the inclined region EE, and the narrower the opening of the first groove 5. During the fabrication process, it is more difficult to clean the residual adhesive 01 in the first groove 5. Conversely, the smaller the value of α, the gentler the slope of the planarization layer PLN in the inclined region EE, the wider the opening of the first groove 5, and the easier it is to clean the residual adhesive 01 in the first groove 5. However, regardless of which method of optimizing the planarization layer PLN is used, the formed planarization layer PLN has a planar region DD and an inclined region EE, and the planarization layer includes a first surface S1 away from the substrate. The dihedral angle formed by the cross-section of any point on the first surface S1 in the inclined region EE and the second surface of the substrate 1 near the planarization layer PLN is α (for ease of description, α in Figure 4 is marked as the acute angle between the cross-section and the reference plane parallel to the second surface). The width W1 of the first groove 5 satisfies the formula: W=α×k, where W represents the width W1 of the first groove 5. k represents a coefficient, k∈[0.48,0.65].

[0049] This embodiment optimizes the structure of the planarization layer PLN, increasing the width W1 of the first groove 5 and / or increasing the opening width W2 of the first groove 5. This facilitates the cleaning of residual adhesive 01 within the first groove 5 during the fabrication process, eliminating the phenomenon of residual adhesive 01 filling the undercut structure 4 due to exposure process fluctuations in the pixel-defining layer PDL. This ensures that the first isolation pillar 3 can completely cut off the light-emitting layer EL, thereby blocking the water and oxygen intrusion path and preventing defects such as GDS. In this embodiment, the light-emitting layer EL is disconnected at the location of each isolation pillar.

[0050] It should be noted that the value of k is limited by the magnitude of α. The value of α and the value of k are negatively correlated; that is, the larger α is, the smaller the value of k; conversely, the larger α is, the larger the value of k. This ensures that the width W1 of the first groove 5 is not too large and affects the layout of the second isolation pillars (the remaining isolation pillars other than the first isolation pillar 3 among the multiple isolation pillars) in the second transition zone BB2. Therefore, the value of k in this disclosure, provided that k∈[0.48,0.65], can be set empirically according to the actual application.

[0051] In some embodiments, in addition to the optimized planarization layer PLN described above, the width W1 of the first groove 5 can also be increased by shortening the width of the first isolation pillar 3 so that the edge of the first isolation pillar 3 near the display area AA is further away from the display area AA.

[0052] In some embodiments, as shown in FIG4, the width W1 of the first groove 5 can be greater than 13um.

[0053] The above analysis shows that optimizing the structure of the planarization layer PLN, increasing the opening width W2 and the width W1 of the first groove 5, can improve the probability of cleaning the residual adhesive O1 in the first groove 5, ensuring that the isolation pillar can completely cut off the light-emitting layer EL. The following provides a detailed description of various embodiments of the optimized planarization layer PLN.

[0054] In some embodiments, as shown in FIG4, the planarization layer PLN includes a first sub-planarization layer PLN1, a second sub-planarization layer PLN2, and a third sub-planarization layer PLN3 sequentially disposed along the direction away from the substrate 1. Optionally, the second sub-planarization layer PLN2 at least covers the boundary portion of the first sub-planarization layer PLN1 near the first isolation pillar 3, for example, the second sub-planarization layer PLN2 at least covers the surface of the first sub-planarization layer PLN1 located in the inclined region EE; the third sub-planarization layer PLN3 at least covers the boundary portion of the second sub-planarization layer PLN2 near the first isolation pillar 3, for example, the third sub-planarization layer PLN2 at least covers the surface of the second sub-planarization layer PLN1 located in the inclined region EE. The end faces of the first sub-planarization layer PLN1, the second sub-planarization layer PLN2, and the third sub-planarization layer PLN3 are all in direct contact with the surface of the intermediate structural layer 2 away from the substrate 1. The first surface S1 of the planarization layer PLN is also the surface of the third sub-planarization layer PLN3 away from the second sub-planarization layer PLN2.

[0055] For example, the orthographic projection of the third sub-planarization layer PLN3 onto the substrate 1 completely covers the orthographic projection of the second sub-planarization layer PLN2 onto the substrate 1. The orthographic projection of the second sub-planarization layer PLN2 onto the substrate 1 completely covers the orthographic projection of the first sub-planarization layer PLN1 onto the substrate 1.

[0056] In this embodiment, the planarization layer PLN includes three layers arranged in sequence: a first sub-planarization layer PLN1, a second sub-planarization layer PLN2, and a third sub-planarization layer PLN3. These layers sequentially wrap around the boundary portion near the first isolation pillar 3, which is beneficial for protecting the lower intermediate structural layer 2, improving planarity, and thus facilitating the fabrication of the light-emitting layer EL.

[0057] It should be noted that the planarization layer PLN involved in this disclosure includes, but is not limited to, the first sub-planarization layer PLN1, the second sub-planarization layer PLN2, and the third sub-planarization layer PLN3 stacked together, and may also be any one or a combination thereof. Each embodiment of this disclosure is illustrated using the example of the planarization layer PLN including the first sub-planarization layer PLN1, the second sub-planarization layer PLN2, and the third sub-planarization layer PLN3.

[0058] For example, the materials of the first sub-planarization layer PLN1, the second sub-planarization layer PLN2, and the third sub-planarization layer PLN3 can be organic materials. The thickness of organic material films is thicker than that of inorganic layers such as passivation layers PVX, which is beneficial for achieving planarization.

[0059] In some embodiments, considering the actual structural influence of the product, such as the thickness and size range of the planarization layer PLN, the thickness and / or size of the planarization layer PLN are adjusted, and the value of α is finally determined to be between 30° and 40°. As shown in the three-layer sub-planarization layer PLN structure in Figure 4, the dihedral angle α formed by the cross-section of any point on the first surface S1 of the inclined region EE on the third sub-planarization layer PLN3 and the second surface is between 30° and 40°. In this regard, the width W of the first groove 5 is α × k ∈ [14.4 μm, 26 μm].

[0060] For example, as shown in Figure 4, when the value of α is large, a smaller value of k can be selected, such as k being 0.48, so that the width W1 of the first groove 5 is set between 14.4um and 19.2um.

[0061] For example, the sum of the thicknesses of the first sub-planarization layer PLN1, the second sub-planarization layer PLN2, and the third sub-planarization layer PLN3 is between 5µm and 6µm.

[0062] In some embodiments, as shown in FIG5, another optimized structure of the first groove is illustrated. Specifically, the planarization layer PLN includes a first sub-planarization layer PLN1, a second sub-planarization layer PLN2, and a third sub-planarization layer PLN3 sequentially disposed along the direction away from the substrate 1. Optionally, the second sub-planarization layer PLN2 at least covers the boundary portion of the first sub-planarization layer PLN1 near the first isolation pillar 3, for example, the second sub-planarization layer PLN2 at least covers the surface of the first sub-planarization layer PLN1 located in the inclined region EE; the third sub-planarization layer PLN3 covers a portion of the surface of the second sub-planarization layer PLN2 located in the inclined region EE. The portion of the surface of the second sub-planarization layer PLN2 away from the substrate 1 located in the inclined region EE and not covered by the third sub-planarization layer PLN3 is continuous with the portion of the third sub-planarization layer PLN3 located in the inclined region EE, and together with the surface of the third sub-planarization layer PLN3 located in the planar region DD, forms the first surface S1.

[0063] The difference between the third sub-planarization layer PLN3 shown in Figure 5 and the third sub-planarization layer PLN3 shown in Figure 4 is that the boundary of the third sub-planarization layer PLN3 shown in Figure 5 is further away from the second transition region BB2. That is, the boundary of the third sub-planarization layer PLN3 retreats to the surface of the second sub-planarization layer PLN2 away from the first sub-planarization layer PLN1. Compared with the structure shown in Figure 4, the opening width W2 of the first groove 5 is wider. At the same time, the retreat of the boundary of the third sub-planarization layer PLN3 also further increases the width W1 of the first groove 5, which is conducive to cleaning the residual adhesive O1 located in the first groove 5, ensuring that the first isolation pillar 3 can completely cut off the light-emitting layer EL, thereby blocking the water and oxygen intrusion path and avoiding defects such as GDS.

[0064] For example, the orthographic projection of the second sub-planarization layer PLN2 on the substrate 1 completely covers the orthographic projection of the first sub-planarization layer PLN1 on the substrate 1. The orthographic projection of the third sub-planarization layer PLN3 on the substrate 1 partially covers the orthographic projection of the second sub-planarization layer PLN2 on the substrate 1.

[0065] In some embodiments, as shown in FIG5, the outline edge of the orthographic projection of the third sub-planarization layer PLN3 on the substrate 1 is further away from the second transition region BB2 than the outline edge of the orthographic projection of the first sub-planarization layer PLN1 on the substrate 1, ensuring an increase in the opening width W2 of the first groove 5. In this case, the opening width W2 of the first groove 5 can be understood as: the shortest distance by which the first isolation pillar 3 extends horizontally from the edge of the first isolation pillar 3 away from the surface of the substrate 1 near the display area AA to contact the second sub-planarization layer PLN2.

[0066] In some embodiments, as shown in FIG5, considering the influence of the actual product structure, based on the edge retraction of the third sub-planar layer PLN3, the value of α is ultimately determined to be between 22° and 30° by adjusting the distance of the edge retraction of the third sub-planar layer PLN3 and / or the thickness of the third sub-planar layer PLN3. As shown in FIG5, the three-layer sub-planar layer PLN structure comprises the first surface S1 of the planar layer PLN, i.e., the surface of the third sub-planar layer PLN3 located in the inclined region EE and in contact with the light-emitting layer EL, and the surface of the second sub-planar layer PLN2 located in the inclined region EE and in contact with the light-emitting layer EL. The dihedral angle α formed by the tangent at any point on the first surface S1 and the second surface is between 22° and 30°. Therefore, the width W of the first groove 5 is α × k ∈ [10.56 μm, 19.5 μm].

[0067] For example, as shown in Figure 5, when the α value is small, in order to ensure that the width W1 of the first groove 5 is not too narrow, a larger k value can be selected, for example, k is selected as 0.565, so that the width W1 of the first groove 5 is set between 11.3um and 16.95um.

[0068] For example, as shown in FIG5, the distance between the orthographic projection of the edge of the third sub-planarization layer PLN3 on the substrate 1 and the orthographic projection of the edge of the first sub-planarization layer PLN1 on the substrate 1 is between 5µm and 10µm.

[0069] For example, as shown in Figure 5, the thickness of the third sub-planarization layer PLN3 is between 1.5 μm and 2.5 μm.

[0070] In some embodiments, as shown in FIG6, a structure optimized for another first groove is illustrated. Specifically, the planarization layer PLN includes a first sub-planarization layer PLN1, a second sub-planarization layer PLN2, and a third sub-planarization layer PLN3 sequentially disposed along a direction away from the substrate 1. Optionally, the second sub-planarization layer PLN2 covers a portion of the surface of the first sub-planarization layer PLN1 located in the inclined region EE; the third sub-planarization layer PLN3 covers a portion of the surface of the second sub-planarization layer PLN2 located in the inclined region EE. The portion of the surface of the first sub-planarization layer PLN2 away from the substrate 1, located in the inclined region EE and not covered by the second sub-planarization layer PLN2, is continuous with the portion of the second sub-planarization layer PLN2 located in the inclined region EE; the portion of the surface of the second sub-planarization layer PLN2 away from the substrate 1, located in the inclined region EE and not covered by the third sub-planarization layer PLN3, is continuous with the portion of the third sub-planarization layer PLN3 located in the inclined region EE, and together with the surface of the third sub-planarization layer PLN3 located in the planar region DD, forms the first surface S1.

[0071] The difference between the structure shown in Figure 6 and that in Figure 5 is that the boundaries of the second sub-planarization layer PLN2 and the third sub-planarization layer PLN3 in Figure 6 are further away from the second transition region BB2. In other words, the boundary of the second sub-planarization layer PLN2 recedes back to the surface of the first sub-planarization layer PLN1 away from the passivation layer PVX. Compared to the structure shown in Figure 5, the opening width W2 of the first groove 5 is wider. Simultaneously, the receding boundary of the second sub-planarization layer PLN2 further increases the width W1 of the first groove 5, which is beneficial for cleaning the residual adhesive O1 located in the first groove 5, ensuring that the first isolation pillar 3 can completely cut off the light-emitting layer EL, thereby blocking the water and oxygen intrusion path and avoiding defects such as GDS.

[0072] For example, the orthographic projection of the second sub-planarization layer PLN2 on the substrate 1 partially covers the orthographic projection of the first sub-planarization layer PLN1 on the substrate 1. The orthographic projection of the third sub-planarization layer PLN3 on the substrate 1 partially covers the orthographic projection of the second sub-planarization layer PLN2 on the substrate 1.

[0073] In some embodiments, as shown in FIG6, considering the influence of the actual product structure, based on the fact that the edges of the second sub-planar layer PLN2 and the third sub-planar layer PLN3 are both retracted, the distance of the retraction of the edges of the second sub-planar layer PLN2 and the third sub-planar layer PLN3, and / or the thickness of the second sub-planar layer PLN2 and the third sub-planar layer PLN3, are adjusted to finally determine α so that it satisfies the value range of 18° to 22°. As shown in FIG6, the three-layer sub-planar layer structure, the first surface S1 of the planar layer PLN, that is, the surface of the third sub-planar layer PLN3 located in the inclined region EE and in contact with the light-emitting layer EL, the surface of the second sub-planar layer PLN2 located in the inclined region EE and in contact with the light-emitting layer EL, and the surface of the first sub-planar layer PLN1 located in the inclined region EE and in contact with the light-emitting layer EL, together constitute the surface. The dihedral angle α formed by the tangent of any point on the first surface S1 and the second surface is between 18° and 22°. In this regard, the width W of the first groove 5 is α×k∈[8.64um,14.3um].

[0074] For example, as shown in Figure 6, when the α value is small, in order to ensure that the width W1 of the first groove 5 is not too narrow, a larger k value can be selected, for example, k is selected as 0.65, so that the width W1 of the first groove 5 is set between 11.7um and 14.3um.

[0075] For example, as shown in FIG6, the distance between the orthographic projection of the edge of the second sub-planarization layer PLN2 on the substrate 1 and the orthographic projection of the edge of the first sub-planarization layer PLN1 on the substrate 1 is between 5µm and 10µm.

[0076] For example, as shown in FIG6, the distance between the orthographic projection of the edge of the third sub-planarization layer PLN3 on the substrate 1 and the orthographic projection of the edge of the second sub-planarization layer PLN2 on the substrate 1 is between 5µm and 10µm.

[0077] For example, as shown in Figure 6, the thickness of the second sub-planarization layer PLN2 is between 1.5 μm and 2.5 μm. The thickness of the third sub-planarization layer PLN3 is between 1.5 μm and 2.5 μm. Optionally, the thickness of the second sub-planarization layer PLN2 is 2 μm; the thickness of the third sub-planarization layer PLN3 is 2 μm.

[0078] For example, as shown in Figure 6, the thickness of the first sub-planarization layer PLN1 is between 1.5 μm and 2.5 μm. Optionally, the thickness of the first sub-planarization layer PLN1 is 2.5 μm.

[0079] In some embodiments, the width W1 of the first groove 5 is between 13µm and 17µm.

[0080] In some embodiments, as shown in Figures 4 to 6, the display panel 100 further includes metal traces (e.g., a first metal trace M1 and / or a second metal trace M2) disposed on the side of the planarization layer PLN near the substrate 1, the orthographic projection of the metal traces on the substrate 1 covering the orthographic projection of the isolation pillars on the substrate 1.

[0081] In this embodiment, the isolation pillars are positioned directly above the metal traces (M1 and / or M2) to elevate them, thereby facilitating the cutting of the light-emitting layer (EL). Here, the isolation pillars can be a first isolation pillar 3 and / or a second isolation pillar. For ease of understanding, this disclosure uses the first isolation pillar 3 as an example.

[0082] For example, the metal trace is part of the intermediate structural layer 2, and may be a gate line, a capacitor plate, or the gate electrode of a thin-film transistor, etc.

[0083] For example, the metal trace is a single-layer structure, while the first isolation pillar 3 is a multi-layer structure of metal isolation pillars.

[0084] Besides the risk of residual adhesive 01, the structural stability of the first isolation pillar 3 itself is also directly related to the product encapsulation effect. When process fluctuations cause the position of the first isolation pillar 3 to shift, if the boundary of the first isolation pillar 3 is not in the flat region DD, the undercut structure 4 will collapse, as shown in Figure 7. The undercut structure 4 of the first isolation pillar 3 near the display area AA collapses. If the undercut structure 4 of the first isolation pillar 3 near the via area is also unable to cut the light-emitting layer EL due to external factors (although this is a low-probability event, it may still occur), then the encapsulation will fail.

[0085] In some embodiments, the display panel 100 further includes an interlayer insulating layer (ILD) disposed between the isolation pillar and the metal trace. As shown in Figures 4-6, the ILD is disposed between the isolation pillar and the second metal trace M2. The ILD includes a flat portion ILD1 and a protruding portion ILD2 disposed opposite to the second metal trace M2. The isolation pillar is disposed on the surface of the protruding portion ILD2 away from the substrate 1, ensuring that while the isolation pillar is raised, it rests on the flat surface, reducing the possibility of the light-emitting layer EL failing to be cut due to the collapse of the undercut structure 4, thereby reducing the probability of encapsulation failure. The isolation pillar here can be any isolation pillar in the display panel 100, such as the first isolation pillar 3 and / or the second isolation pillar. This disclosure uses the first isolation pillar 3 as an example for description.

[0086] In some embodiments, FIG8 is an enlarged view of the isolation pillar provided in the present disclosure, specifically an enlarged view of the first isolation pillar 3 in FIG4-6. As shown in FIG8, the isolation pillar includes a first conductive portion 31, a second conductive portion 32 and a third conductive portion 33 arranged sequentially along the direction away from the substrate 1; the first conductive portion 31 and the third conductive portion 33 both protrude from the second conductive portion 32, that is, the cross-sections of the first conductive portion 31, the second conductive portion 32 and the third conductive portion 33 are in the shape of "I", so as to form an undercut structure 4 for cutting off the light-emitting layer EL.

[0087] In some embodiments, as shown in FIG8, the difference between the width of the protrusion ILD2 and the width of the first conductive portion 31 is greater than 2.9 μm. This embodiment shortens the width of the first conductive portion 31 so that the difference between the width of the protrusion ILD2 and the width of the first conductive portion 31 is greater than 2.9 μm, thereby ensuring that the isolation pillar remains on the flat surface where the protrusion ILD2 is located under fluctuations in the manufacturing process, and avoiding collapse.

[0088] For example, as shown in FIG8, the shortest distance between the edge of the protrusion ILD2 and the edge of the first conductive part 31 is greater than 1.45um.

[0089] In some embodiments, as shown in FIG8, the ratio of the width of the first conductive portion 31 to the width of the metal trace is between 0.4 and 0.6.

[0090] For example, the metal traces include a first metal trace M1 and a second metal trace M2, with the second metal trace M2 being closer to the first isolation pillar 3 than the first metal trace M1. For instance, the second metal trace M2 is positioned directly opposite the first isolation pillar 3. The ratio of the width of the first conductive portion 31 to the width of the second metal trace M2 is between 0.4 and 0.6. The width of the second metal trace M2 can be understood as the width of the second metal trace M2 away from the surface of the substrate, or it can be the average width of the two surfaces of the second metal trace M2 that are positioned opposite each other in its thickness direction. For another example, the first metal trace M1 is positioned directly opposite the first isolation pillar 3. The ratio of the width of the first conductive portion 31 to the width of the first metal trace M2 is between 0.4 and 0.6. The width of the first metal trace M1 can be understood as the width of the first metal trace M1 away from the surface of the substrate, or it can be the average width of the two surfaces of the first metal trace M1 that are positioned opposite each other in its thickness direction.

[0091] In this embodiment, the ratio of the width of the first conductive part 31 to the width of the metal trace is set between 0.4 and 0.6 to ensure that the isolation pillar still falls on a flat surface in the event of process fluctuations.

[0092] In some embodiments, the width of the first conductive portion 31 is between 3.8 μm and 4.2 μm. The width of the second metal trace M2 away from the third surface S3 of the substrate is between 0.76 μm and 0.84 μm.

[0093] In some embodiments, as shown in Figures 4-6, the display panel includes a first insulating layer 21, a first gate line (not shown in the figure, but can be understood as the gate trace of a thin-film transistor located in the display area), a second insulating layer 22, a second gate line (not shown in the figure, but can be understood as the gate trace of a thin-film transistor located in the display area AA), an interlayer insulating layer ILD, a first signal line SD1 (located in the first transition region BB1, which may be a signal transmission line of a sensor within a via), a first sub-planarization layer PLN1, a second signal line (not shown in the figure, which may be the source / drain electrode trace of a thin-film transistor located in the display area AA), a second sub-planarization layer PLN2, a third signal line SD3 (located in the second transition region BB2), and a third sub-planarization layer PLN3, arranged sequentially along the direction away from the substrate 1. The metal traces include a first metal trace M1 and a second metal trace M2; wherein the first metal trace M1 is disposed on the same layer as the first gate line, and the second metal trace M2 is disposed on the same layer as the second gate line; the first isolation pillar 3 is disposed on the same layer as one of the first signal line SD1, the second signal line, and the third signal line SD3.

[0094] For example, the first isolation pillar 3 and the third signal line SD3 are arranged on the same layer.

[0095] For example, as shown in Figures 4-6, the third signal line SD3 is multiplexed as the first isolation post 3.

[0096] In some embodiments, as shown in Figures 4-6, the first isolation pillar 3 is disposed directly opposite the second metal trace M2. The second metal trace M2 includes a third surface S3 facing away from the substrate, and the difference between the width of the third surface S3 and the width of the first conductive portion 31 is greater than 2.9 μm. This embodiment ensures that the isolation pillar remains on the flat surface where the protrusion ILD2 is located, even under fluctuations in the isolation pillar fabrication process, by increasing the width of the second metal trace M2 or shortening the width of the first conductive portion 31, thus preventing collapse.

[0097] In some embodiments, as shown in Figures 4-6, the display panel 100 further includes an encapsulation layer 6 disposed on the side of the light-emitting layer EL facing away from the planarization layer PLN, for sealing the light-emitting device, thereby reducing or preventing degradation of the light-emitting device caused by moisture and / or oxygen in the environment. The encapsulation layer 6 can be a single-layer structure or a multi-layer structure, including a structure of stacked inorganic and organic layers. Exemplarily, the encapsulation layer 6 includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer sequentially disposed along the direction facing away from the substrate 1. The encapsulation layer 6 extends from the display area AA to the second transition area BB2, thereby covering the isolation pillars.

[0098] For example, the material of the encapsulation layer 6 may include insulating materials such as silicon oxynitride (SiON), silicon oxide (SiOx), silicon nitride (SiNx), and polymer resin. Inorganic materials such as silicon oxynitride (SiON), silicon oxide (SiOx), and silicon nitride (SiNx) have high density and can prevent the intrusion of water, oxygen, etc.; the material of the organic encapsulation layer may be a polymer material containing a desiccant or a polymer material that can block moisture, such as polymer resin, to planarize the surface of the display panel 100 and relieve the stress of the first inorganic encapsulation layer and the second inorganic encapsulation layer. It may also include water-absorbing materials such as desiccants to absorb water, oxygen, and other substances that have intruded into the interior.

[0099] In some embodiments, as shown in Figures 4 to 6, the display panel further includes a passivation layer PVX disposed on the side of the planarization layer PLN near the substrate 1, and a signal line disposed on the side of the passivation layer PVX near the substrate 1; the passivation layer PVX surrounds a third metal trace M3, and the planarization layer PLN surrounds the passivation layer PVX. Here, the third metal trace M3 can be a multilayer metal structure, such as a titanium-aluminum-titanium (Ti / Al / Ti) structure. The third metal trace M3 can be, for example, the source or drain of a thin-film transistor, or a transmission signal line of a device in an opening region.

[0100] In some embodiments, the display panel 100 further includes a touch functional layer disposed on the encapsulation layer 6. The touch functional layer includes a touch buffer layer, a first touch metal layer (TMA), a touch insulator layer (TLD), a second touch metal layer (TMB), and a touch protection layer (TOC) sequentially disposed along a direction away from the substrate 1. Specifically, the first and second touch metal layers are not present at the edge of the display area AA near the second transition area BB2, but a touch insulator layer is present. The touch insulator layer and the touch protection layer extend from the display area AA to the second transition area BB2.

[0101] In some embodiments, the display panel 100 is an OLED display panel 100.

[0102] In addition, this disclosure also provides a display device, which includes the display panel described in any of the above embodiments. This display device can be, for example, any product with a display function such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or in-vehicle device. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure.

[0103] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display panel having a display area, a first transition area, a second transition area, and an aperture area; the second transition area surrounds the aperture area and is located between the first transition area and the aperture area, the first transition area surrounds the second transition area and is located between the display area and the first transition area; the display panel includes a substrate, a planarization layer disposed on the substrate, a light-emitting layer disposed on a side of the planarization layer opposite to the substrate, and at least one isolation pillar disposed on the substrate; The planarization layer extends from the display area to the first transition area; the light-emitting layer extends from the display area to the second transition area and is interrupted at the location of each of the isolation pillars; at least one of the isolation pillars is located in the second transition area; The isolation pillar surrounding the opening area and closest to the display area is the first isolation pillar, and the first isolation pillar and the planarization layer define a first groove disposed on the substrate. The planarization layer has a planar region and an inclined region. The planarization layer includes a first surface facing away from the substrate. The dihedral angle formed by the cross-section of any point on the first surface of the inclined region and the second surface of the substrate near the planarization layer is α. The width of the first groove satisfies the following formula: W = α × k; where W represents the width of the first groove, k represents a coefficient, and k ∈ [0.48, 0.65].

2. The display panel according to claim 1, wherein, The planarization layer includes a first sub-planarization layer, a second sub-planarization layer, and a third sub-planarization layer disposed sequentially along a direction away from the substrate. The second sub-planar layer at least covers the boundary portion of the first sub-planar layer near the first isolation post, and the third sub-planar layer at least covers the boundary portion of the second sub-planar layer near the first isolation post.

3. The display panel according to claim 2, wherein, The dihedral angle α formed by the cut surface and the second surface is between 30° and 40°.

4. The display panel according to claim 1, wherein, The planarization layer includes a first sub-planarization layer, a second sub-planarization layer, and a third sub-planarization layer disposed sequentially along a direction away from the substrate. The second sub-planar layer at least covers the boundary portion of the first sub-planar layer near the first isolation post; the third sub-planar layer covers the portion of the second sub-planar layer located in the inclined region; In the second sub-planarization layer, the portion of the surface located in the inclined region and not covered by the third sub-planarization layer in the surface away from the substrate is continuous with the portion of the third sub-planarization layer located in the inclined region, and together with the surface of the third sub-planarization layer located in the planar region, forms the first surface.

5. The display panel according to claim 4, wherein, The outline edge of the orthographic projection of the third sub-planarization layer on the substrate is further away from the second transition region than the outline edge of the orthographic projection of the first sub-planarization layer on the substrate.

6. The display panel according to claim 4 or 5, wherein, The dihedral angle α formed by the cut surface and the second surface is between 22° and 30°.

7. The display panel according to claim 1, wherein, The planarization layer includes a first sub-planarization layer, a second sub-planarization layer, and a third sub-planarization layer disposed sequentially along a direction away from the substrate. The second sub-planarization layer covers a portion of the surface of the first sub-planarization layer located in the inclined region; the third sub-planarization layer covers a portion of the surface of the second sub-planarization layer located in the inclined region; In the first sub-planarization layer, the portion of the surface located in the inclined region and not covered by the second sub-planarization layer in the surface away from the substrate is continuous with the portion of the second sub-planarization layer located in the inclined region; in the second sub-planarization layer, the portion of the surface located in the inclined region and not covered by the third sub-planarization layer in the surface away from the substrate is continuous with the portion of the third sub-planarization layer located in the inclined region, and together with the surface of the third sub-planarization layer located in the planar region, forms the first surface.

8. The display panel according to claim 7, wherein, The dihedral angle α formed by the cut surface and the second surface is between 18° and 22°.

9. The display panel according to claim 1, wherein, The display panel also includes metal traces disposed on the side of the planarization layer near the substrate. The orthographic projection of the metal trace on the substrate covers the orthographic projection of the isolation pillar on the substrate.

10. The display panel according to claim 9, wherein, The display panel further includes an interlayer insulating layer disposed between the isolation pillar and the metal trace, the interlayer insulating layer including a flat portion and a protrusion disposed opposite to the metal trace; The isolation pillar is disposed on the surface of the protrusion facing away from the substrate.

11. The display panel according to claim 9 or 10, wherein, The isolation pillar includes a first conductive portion, a second conductive portion, and a third conductive portion arranged sequentially along a direction away from the substrate; the first conductive portion and the third conductive portion both protrude from the second conductive portion.

12. The display panel according to claim 11, wherein, The difference between the width of the protrusion and the width of the first conductive part is greater than 2.9 μm.

13. The display panel according to claim 11, wherein, The ratio of the width of the first conductive part to the width of the metal trace is between 0.4 and 0.

6.

14. The display panel according to claim 11, wherein, The display panel includes a first insulating layer, a first gate line, a second insulating layer, a second gate line, an interlayer insulating layer, a first signal line, a first sub-planarization layer, a second signal line, a second sub-planarization layer, a third signal line, and a third sub-planarization layer, which are sequentially disposed along a direction away from the substrate. The metal trace includes a first metal trace and a second metal trace; wherein the first metal trace is disposed on the same layer as the first gate line, and the second metal trace is disposed on the same layer as the second gate line. The first isolation post is disposed on the same layer as one of the first signal line, the second signal line, and the third signal line.

15. The display panel according to claim 14, wherein, The second metal trace includes a third surface facing away from the substrate; the difference between the width of the third surface and the width of the first conductive portion is greater than 2.9 μm.

16. A display device, wherein, Includes the display panel as described in any one of claims 1 to 15.

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