Optical package, optical package production method, and electronic device

Abstract

The present invention provides an optical package that makes it possible to maintain a hollow structure even if the thickness of a cover glass is small, while also increasing measurement precision in light section applications and maintaining high reliability. The optical package comprises a package substrate, an optical chip, a cover glass, and an attachment part. The optical chip is electrically connected to the package substrate. The cover glass is positioned along the optical axis direction of the optical chip and has a first surface which faces the optical chip and a second surface which is on the opposite side from the first surface. The attachment part is provided to the package substrate, and the cover glass is attached to the attachment part so as to form a space between the optical chip and the first surface of the cover glass. The cover glass has a first thickness from the first surface to the second surface and has, in a region directly above light reception in the optical axis direction of the optical chip, a second thickness which is less than the first thickness.

Description

Optical package, optical package manufacturing method and electronic device

[0001] The present disclosure relates to an optical package, a method for manufacturing the optical package, and an electronic device equipped with the optical package.

[0002] In recent years, optical devices have been developed that incorporate optical elements such as image pickup elements such as CCDs (Charged-Coupled Devices) and CMOSs ​​(Complementary Metal-Oxide Semiconductors), light-receiving elements such as PDs (Photo Diodes), MEMS (Micro Electro Mechanical Systems) elements such as optical switches and mirror devices, and light-emitting elements such as laser diodes (LDs; Laser Diodes), LEDs (Light Emitting Diodes), and vertical cavity surface emitting lasers (VCSELs). A well-known example of such an optical device is an optical package in which optical elements are mounted and packaged on a single substrate.

[0003] The optical package is made up of a package substrate on which an optical element is mounted, a package frame provided on the package substrate and housing the optical element therein, and a cover glass as a light-transmitting member that closes the opening of the package frame. The package frame is made of either resin or metal.

[0004] In such optical packages, in order to prevent dust from adhering to the optical element, for example, optical packages with a hollow structure have been proposed in which a space is formed between a cover glass and the optical element, and the cover glass hermetically seals the optical element within a package frame. Patent Document 1 discloses a semiconductor device package in which the opening of a recess in a substrate having a recess for accommodating a semiconductor element is sealed with a cap made of glass or the like. Patent Document 2 discloses a semiconductor device in which a solid-state imaging element is mounted within the package and the opening of the package is sealed with a glass lid. Furthermore, Patent Document 3 discloses a package for accommodating a light-emitting element in which a light-emitting element is sealed with a first light-transmitting member and a second light-transmitting member.

[0005] Japanese Patent Laid-Open No. 5-47953 Japanese Patent Laid-Open No. 2006-245359 Japanese Patent Laid-Open No. 2007-12792

[0006] Recently, light-section distance measuring sensors that use obliquely incident light have become known. When an optical package is used in a distance measuring sensor, there is a growing need to reduce the thickness of the cover glass in order to improve measurement accuracy.

[0007] However, in conventional optical packages, the thermal expansion coefficients of the package substrate, optical element, package frame, and cover glass are different, which poses a problem that when the cover glass is thin, cracking, peeling, or warping of the cover glass and warping of the optical element become more pronounced.

[0008] If the cover glass cracks or peels off, for example, the hollow structure is damaged, allowing dust to enter, or the package becomes exposed to the same environment as outside the package, for example, high humidity, increasing the risk of loss of reliability. Furthermore, if the cover glass warps significantly, for example, when a CMOS image sensor is used as the optical element, the resolution will deteriorate and the effective pixel area will become narrower.

[0009] None of the above Patent Documents 1 to 3 disclose any ideas for making the cover glass thinner or for using a thin cover glass that is butted against the housing. While it is conceivable to add a metal frame to the thin cover glass to prevent it from hitting the housing, this would increase the cost and package size due to the increased number of components.

[0010] The present disclosure has been made in consideration of the above circumstances, and aims to provide an optical package, a manufacturing method for an optical package, and an electronic device that can maintain a hollow structure even when the cover glass thickness is thin, improve measurement accuracy in light-cutting applications, and maintain high reliability.

[0011] One aspect of the present disclosure is an optical package comprising: a package substrate; an optical chip electrically connected to the package substrate; a cover glass located in the optical axis direction of the optical chip and having a first surface facing the optical chip and a second surface opposite the first surface; and an attachment portion provided on the package substrate for attaching the cover glass so as to form a space between the optical chip and the first surface of the cover glass, wherein the cover glass has a first thickness from the first surface to the second surface and a second thickness thinner than the first thickness in a region directly above the light-receiving portion in the optical axis direction of the optical chip.

[0012] Another aspect of the present disclosure is an optical package comprising: a package substrate; an optical chip electrically connected to the package substrate; a cover glass located on the optical axis of the optical chip and having a first surface facing the optical chip and a second surface opposite the first surface; and an attachment portion provided on the package substrate for attaching the cover glass so as to form a space between the optical chip and the first surface of the cover glass, wherein the cover glass is provided with a reinforcing material that reinforces the cover glass in an area other than the light-receiving area directly above the optical axis direction of the optical chip.

[0013] Another aspect of the present disclosure is a method for manufacturing an optical package, comprising the steps of: preparing a mounting portion in a frame that houses an optical chip, the mounting portion having an opening in the optical axis direction of the optical chip; attaching a cover glass having a first surface facing the optical chip and a second surface opposite the first surface to the inside of the opening of the mounting portion facing the optical chip; forming a through hole in the mounting portion to which the cover glass is attached, in a direction parallel to the optical axis direction of the optical chip or a direction perpendicular to the optical axis direction of the optical chip, the through hole reducing internal pressure when process temperature rises; attaching the mounting portion with the through hole formed therein to a package substrate on which the optical chip is mounted; and sealing the through hole in the mounting portion attached to the package substrate, wherein the cover glass has a first thickness from the first surface to the second surface and a second thickness thinner than the first thickness in a region directly above the light receiving region in the optical axis direction of the optical chip.

[0014] Another aspect of the present disclosure is an electronic device comprising the optical package described in claim 1, a housing that houses the optical package, and a lens optical system that is positioned in the optical axis direction of the optical chip of the optical package and attached to the housing.

[0015] Furthermore, another aspect of the present disclosure is an electronic device comprising the optical package described in claim 9, a housing that houses the optical package, and a lens optical system that is positioned in the optical axis direction of the optical chip of the optical package and attached to the housing.

[0016] FIG. 1 is a cross-sectional view schematically showing an example configuration of an optical package according to a first embodiment of the present disclosure. FIG. 2 is a plan view schematically showing an example configuration of an optical package according to the first embodiment of the present disclosure. FIG. 3 is a cross-sectional view (part 1) showing a process procedure of a method for manufacturing an optical package according to the first embodiment of the present disclosure. FIG. 4 is a cross-sectional view (part 5) showing a process procedure of a method for manufacturing an optical package according to the first embodiment of the present disclosure. FIG. 5 is a cross-sectional view schematically showing an example configuration of an optical package according to a second embodiment of the present disclosure. FIG. 6 is a plan view schematically showing an example configuration of an optical package according to a second embodiment of the present disclosure. FIG. 7 is a cross-sectional view (part 1) showing a process procedure of a method for manufacturing an optical package according to the second embodiment of the present disclosure. FIG. 8 is a cross-sectional view (part 2) showing a process procedure of a method for manufacturing an optical package according to the second embodiment of the present disclosure. FIG. 9 is a cross-sectional view (part 3) showing a process procedure of a method for manufacturing an optical package according to the second embodiment of the present disclosure. 10 is a cross-sectional view (part 4) showing a process procedure of a manufacturing method for an optical package according to a second embodiment of the present disclosure. FIG. 11 is a partial cross-sectional view showing a schematic configuration of an example of an imaging device according to a third embodiment of the present disclosure. FIG. 12 is a cross-sectional view of a plan view of the optical package shown in FIG. 8 as seen from dashed dotted line A1-A2. FIG. 13 is a cross-sectional view of a plan view of the optical package shown in FIG. 8 as seen from dashed dotted line B1-B2. FIG. 14 is a cross-sectional view (part 1) showing a process procedure of a manufacturing method for an optical package according to a fourth embodiment of the present disclosure. FIG. 15 is a cross-sectional view (part 2) showing a process procedure of a manufacturing method for an optical package according to a fourth embodiment of the present disclosure. FIG. 16 is a cross-sectional view (part 3) showing a process procedure of a manufacturing method for an optical package according to a fourth embodiment of the present disclosure. FIG. 17 is a cross-sectional view (part 4) showing a process procedure of a manufacturing method for an optical package according to a fourth embodiment of the present disclosure. FIG. 18 is a cross-sectional view (part 5) showing a process procedure of a manufacturing method for an optical package according to a fourth embodiment of the present disclosure.FIG. 10 is a cross-sectional view (part 6) showing a process procedure of a method for manufacturing an optical package according to a fourth embodiment of the present disclosure. FIG. 11 is a cross-sectional view (part 7) showing a process procedure of a method for manufacturing an optical package according to a fourth embodiment of the present disclosure. FIG. 12 is a cross-sectional view (part 8) showing a process procedure of a method for manufacturing an optical package according to a fourth embodiment of the present disclosure. FIG. 13 is a cross-sectional view (part 1) showing a process procedure of a method for manufacturing an optical package according to a sixth embodiment of the present disclosure. FIG. 14 is a cross-sectional view (part 2) showing a process procedure of a method for manufacturing a cover glass according to a sixth embodiment of the present disclosure. FIG. 15 is a cross-sectional view (part 3) showing a process procedure of a method for manufacturing a cover glass according to a sixth embodiment of the present disclosure. FIG. 16 is a cross-sectional view (part 4) showing a process procedure of a method for manufacturing a cover glass according to a sixth embodiment of the present disclosure. FIG. 17 is a cross-sectional view (part 5) showing a process procedure of a method for manufacturing a cover glass according to a seventh embodiment of the present disclosure. FIG. 18 is a cross-sectional view (part 1) showing a process procedure of a method for manufacturing an optical package according to an eighth embodiment of the present disclosure. Fig. 20 is a cross-sectional view schematically showing an example configuration of a cover glass according to a ninth embodiment of the present disclosure. Fig. 21 is a block diagram showing another example configuration of an electronic device. Fig. 22 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the present technology is applied. Fig. 23 is a block diagram showing an example of a functional configuration of a camera head and a CCU shown in Fig. 18. Fig. 24 is a block diagram showing an example of a schematic configuration of a vehicle control system to which the present technology is applied. Fig. 25 is an explanatory diagram showing an example of installation positions of an outside-vehicle information detection unit and an imaging unit shown in Fig. 20.

[0017] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings referred to in the following description, identical or similar parts will be designated by identical or similar reference numerals, and redundant description will be omitted. However, it should be noted that the drawings are schematic, and the relationship between thickness and planar dimensions, the thickness ratio of each device and each component, etc., may differ from the actual ones. Therefore, specific thicknesses and dimensions should be determined with reference to the following description. Furthermore, it goes without saying that the drawings may include parts with different dimensional relationships and ratios.

[0018] Furthermore, the definitions of directions such as up and down in the following explanation are merely for the convenience of explanation and do not limit the technical idea of ​​the present disclosure. For example, if an object is rotated 90 degrees and observed, up and down are converted to left and right and read as such, and if an object is rotated 180 degrees and observed, up and down are obviously read as reversed.

[0019] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0020] First Embodiment (Configuration Example of Optical Package) Fig. 1 is a cross-sectional view schematically showing a configuration example of an optical package 1A according to a first embodiment of the present disclosure. Fig. 2 is a plan view schematically showing a configuration example of the optical package 1A according to the first embodiment of the present disclosure. Fig. 2 shows the optical package 1A shown in Fig. 1 as viewed from above. In this disclosure, a plane parallel to the surface of the cover glass of the optical package 1A is referred to as the XY plane, and a direction perpendicular to the XY plane is referred to as the Z direction or depth direction.

[0021] The optical package 1A according to the first embodiment includes a package substrate 11, an optical chip 12 mounted on the package substrate 11, a cover glass 13, and a package frame 14 (an example of a mounting portion). As shown in Fig. 2, the package frame 14 is attached to the package substrate 11 so as to surround the side of the optical chip 12. The cover glass 13 is positioned in the optical axis direction of the optical chip 12 and is attached to the package frame 14 so as to form a hollow (an example of a space) between the cover glass 13 and the optical chip 12.

[0022] An organic substrate or a ceramic substrate is used for the package substrate 11. Several electrode pads 15 are formed around the periphery of the optical chip 12. Bonding wires 16 are formed on the electrode pads 15. That is, the optical chip 12 is electrically connected to the package substrate 11 via the electrode pads 15 and the bonding wires 16. Other components (not shown) may be mounted on the package substrate 11. A plurality of pins 17 are arranged on the underside of the package substrate 11 as external terminals. One end of each of the pins 17 is fixed to the underside of the package substrate 11, and the other end protrudes downward from the underside of the package substrate 11. Each pin 17 is electrically connected to wiring on the package substrate 11.

[0023] The optical chip 12 is a chip including a pixel array in which a plurality of light receiving elements 12a (photoelectric conversion elements) constituting pixels that receive incident light are arranged in an array. The optical chip 12 may be configured such that the light receiving elements 12a convert visible light (RGB light) into an electrical signal, or may be configured such that the light receiving elements 12a convert invisible light (e.g., infrared light) into an electrical signal.

[0024] The package frame 14 is bonded to the package substrate 11 in an area where the optical chip 12, bonding wires 16, and other mounted components are not present. Alternatively, the package frame 14 may be bonded to the package substrate 11 using an adhesive or the like. As shown in Fig. 2, the package frame 14 is a frame that houses the optical chip 12 inside (the area indicated by the dotted line in Fig. 2), and a cover glass 13 is bonded to cover the top surface, thereby completing the optical package 1A having a hollow structure.

[0025] The cover glass 13 has a desired optical transparency and has a first surface S1 facing the optical chip 12 and a second surface S2 opposite the first surface S1. The cover glass 13 and the package frame 14 may be bonded together using an adhesive or the like. In this case, an insulating resin material such as glass epoxy resin is used for the package frame 14. An insulating resin material such as epoxy resin is used as the adhesive.

[0026] <Comparative Example of First Embodiment> As a comparative example, up until now, optical packages have mostly been designed to have a cover glass thickness that does not cause problems as a structure, specifically between 0.5 mm and 1.2 mm. The selection of the cover glass thickness has been such that 0.5 mm is used for small packages around 1-inch, 0.7 mm is used for packages as large as Advanced Photo System type-C or 35 mm, and 1.2 mm is used for even larger medium-sized packages, thereby providing the necessary rigidity for the cover glass and enabling the package to function as a structure.

[0027] It is preferable that the cover glass be as thin as possible, because the light emitted by or received by the optical element has not only a component perpendicular to the optical element but also an oblique component.

[0028] When light is emitted or incident at an angle to the vertical component of the cover glass, the difference in refractive index between the air and the glass causes a refraction phenomenon based on Snell's law.To minimize this, there is a demand for the cover glass to be as thin as possible while still allowing the package to maintain its hollow structure.

[0029] However, in recent years, with the emergence of light-section type distance measuring sensors that use oblique incident light in order to improve measurement accuracy, there has been a growing need to reduce the cover glass thickness, specifically to design the structure to between 0.1 mm and 0.3 mm.

[0030] <Solution According to First Embodiment> In the first embodiment of the present disclosure, the cover glass 13 is configured to have two thicknesses. That is, the thickness in the thickness direction (the direction indicated by the arrow Z in FIG. 1 ) from the first surface S1 to the second surface S2 of the cover glass 13 is configured to be a thin thickness t1 (e.g., 0.1 mm to 0.3 mm) in a region directly above the light receiving region in the optical axis direction of the optical chip 12 (hereinafter referred to as the thin region 13a), and a thickness t2 (e.g., 0.5 mm to 1.2 mm) thicker than the thickness t1 in a region other than the thin region 13a (hereinafter referred to as the thick region 13b).

[0031] 3A to 3E are cross-sectional views showing the steps of a method for manufacturing the optical package 1A according to the first embodiment of the present disclosure. The optical package 1A is manufactured using various types of equipment, such as a film-forming apparatus (including a CVD (Chemical Vapor Deposition) apparatus and a sputtering apparatus), an ion implantation apparatus, a heat treatment apparatus, an etching apparatus, a CMP (Chemical Mechanical Polishing) apparatus, and a bonding apparatus. Hereinafter, these apparatuses will be collectively referred to as manufacturing apparatuses.

[0032] In Fig. 3A, one glass plate 18 is prepared, and the manufacturing apparatus forms multiple regions 18a with a thin thickness t1 on the second surface S2 of the glass plate 18 (glass countersinking) as shown in Fig. 3B. Next, the manufacturing apparatus forms an anti-reflection (AR) coating 19 on the regions 18a with a thin thickness t1 as shown in Fig. 3C. Then, the manufacturing apparatus cuts the glass to form a cover glass 13 as shown in Fig. 3D. Thereafter, the manufacturing apparatus attaches the cover glass 13 to the top surface of the package frame 14 as shown in Fig. 3E, thereby producing the optical package 1A.

[0033] <Effects of the first embodiment> As described above, according to the first embodiment, by making the thickness of the cover glass 13 thinner in the area directly above the light receiving area in the optical axis direction of the optical chip 12 and thicker in areas other than the area directly above the light receiving area, the strength of the cover glass 13 can be increased without using a material to protect the cover glass 13, thereby preventing cracking, peeling, warping, etc. of the cover glass 13.

[0034] Furthermore, according to the first embodiment, the thickness of the cover glass 13 can be set to the minimum thickness that allows the optical package 1A to maintain its hollow structure, thereby suppressing, for example, the refraction phenomenon caused by obliquely incident light and improving the measurement accuracy of the optical package 1A, thereby making it possible to provide an optical package 1A that can further improve reliability.

[0035] Furthermore, according to the first embodiment, by making the thickness of the cover glass 13 thicker in areas other than the area directly above the light receiving area, even if the housing that houses the optical package 1A comes into contact with the cover glass 13, no glass cracks will occur and high reliability can be maintained.

[0036] Second Embodiment Fig. 4 is a cross-sectional view schematically showing an example of the configuration of an optical package 1B according to a second embodiment of the present disclosure. Fig. 5 is a plan view schematically showing an example of the configuration of an optical package 1B according to a second embodiment of the present disclosure. In Fig. 4, the same parts as those in Fig. 1 above are designated by the same reference numerals, and detailed description thereof will be omitted.

[0037] In the second embodiment of the present disclosure, a thin cover glass 21 having a thickness t1 (e.g., 0.1 mm to 0.3 mm) is bonded to the upper surface of the package frame 14. A first surface S1 of the cover glass 21 is bonded to the upper surface of the package frame 14 with an adhesive or the like. A reinforcing material 22 that reinforces the cover glass 21 is bonded to the second surface S2 side of the cover glass 21 in an area 21b other than the light-receiving area 21a directly above the optical axis direction of the optical chip 12.

[0038] 5, the reinforcing material 22 has, for example, a square shape when viewed from above, and is made of, for example, ceramic having a thermal expansion coefficient equal to or less than that of the package frame 14. The package frame 14 is made of, for example, an insulating resin material such as glass epoxy resin, which makes the cover glass 21 less likely to break.

[0039] 6A to 6D are cross-sectional views showing the steps of a method for manufacturing an optical package 1B according to a second embodiment of the present disclosure. The optical package 1B is manufactured using the same manufacturing apparatus as that of the first embodiment.

[0040] In Fig. 6A, one glass plate 23 is prepared, and the manufacturing device cuts the glass plate 23 to form the cover glass 21 as shown in Fig. 6B. Next, the manufacturing device bonds a reinforcing material 22 to the second surface S2 of the cover glass 21 as shown in Fig. 6C. Thereafter, the manufacturing device attaches the cover glass 21 with the bonded reinforcing material 22 to the top surface of the package frame 14 as shown in Fig. 6D, thereby producing the optical package 1B.

[0041] <Effects of the second embodiment> As described above, according to the second embodiment, by adhering a reinforcing material 22 that reinforces the cover glass 21 to an area 21b other than the light-receiving area 21a of the thin cover glass 21 directly above the optical axis direction of the optical chip 12, even when a thin cover glass 21 is used, the strength of the cover glass 21 can be increased without processing the cover glass 21, thereby preventing cracking, peeling, warping, etc. of the cover glass 21.

[0042] Furthermore, according to the second embodiment, the thickness of the cover glass 21 can be set to the minimum thickness that allows the optical package 1B to maintain its hollow structure, thereby suppressing the refraction phenomenon caused by, for example, obliquely incident light, and improving the measurement accuracy of the optical package 1B.

[0043] Furthermore, according to the second embodiment, by using an appropriate reinforcing material 22 so that the thermal expansion coefficient of the reinforcing material 22 is equal to or less than the thermal expansion coefficient of the package frame 14, the cover glass 21 can be made less likely to break.

[0044] Third Embodiment (Example of Electronic Device) The optical package 1A according to the first embodiment and the optical package 1B according to the second embodiment are applicable to an imaging device 100A as an electronic device. An example of the imaging device 100A to which the optical package 1A is applied will be described below.

[0045] 7 is a partial cross-sectional view showing a schematic configuration of an example of an imaging device 100A according to a third embodiment of the present disclosure. As shown in Fig. 7, the imaging device 100A of this example is configured to include a housing 31 that houses an optical package 1A therein, and a lens optical system 32. The lens optical system 32 is positioned in the optical axis direction of the optical chip 12 with respect to the optical package 1A (the direction indicated by arrow Z in Fig. 7), and is attached to the housing 31 so as to cover an opening 31a of the housing 31.

[0046] The pins 17 of the optical package 1A are electrically connected to sockets 331 of the camera board 33. The camera board 33 includes, for example, a pixel control circuit that controls the operation of each light receiving element 12a, and a signal processing circuit that processes the electrical signals converted by the optical chip 12. In addition, a heat sink 34 that cools the optical chip 12 is provided on the lower surface of the package substrate 11 of the optical package 1A.

[0047] With this configuration, although the housing 31 may come into contact with the cover glass 13, the contact point is the thick region 13b of the cover glass 13, so glass cracks do not occur, and high reliability is maintained. Furthermore, by forming the cover glass 13 such that the second surface S2 of the thick region 13b and the second surface S2 of the thin region 13a have a predetermined difference in thickness (the direction indicated by arrow Z in FIG. 7 ) between them, and the first surface S1 of the thick region 13b and the first surface S1 of the thin region 13a are flat (no difference), the housing 31 housing the optical package 1A does not come into contact with the thin region 13a of the cover glass 13 even when it comes into contact with the thick region 13b of the cover glass 13. This prevents glass cracks from occurring, and high reliability is maintained. Furthermore, when the housing 31 houses the optical package 1B, the contact point is the reinforcing member 22 bonded to the cover glass 13, so glass cracks do not occur, and high reliability is maintained.

[0048] Fourth Embodiment The cover glass 13 according to the first embodiment can be applied to an optical package 1C. An example of an optical package 1C to which the cover glass 13 is applied will be described below.

[0049] Fig. 8 is a cross-sectional view schematically showing an example configuration of an optical package 1C according to a fourth embodiment of the present disclosure. Fig. 9A is a cross-sectional view of the optical package 1C shown in Fig. 8 when viewed from the dashed dotted line A1-A2. Fig. 9B is a cross-sectional view of the optical package 1C shown in Fig. 8 when viewed from the dashed dotted line B1-B2. In Fig. 8, the same parts as those in Fig. 1 above are designated by the same reference numerals, and detailed description thereof will be omitted.

[0050] In the fourth embodiment of the present disclosure, a package frame 41 that houses an optical chip 12 inside is attached to a package substrate 11. The package frame 41 has an opening 41a in the optical axis direction of the optical chip 12 (the direction indicated by arrow Z in FIG. 8 ). The cover glass 13 is attached to the inside of the opening 41a of the package frame 41, facing the optical chip 12. As a result, the package frame 41 exposes a thin region 13a and a part of a thick region 13b of the cover glass 13 from the opening 41a, as shown in FIG. 9A .

[0051] Air vent holes 42 (an example of through holes) are formed in the package frame 41. The air vent holes 42 penetrate in a direction parallel to the optical axis direction of the optical chip (the direction indicated by arrow Z in FIGS. 8 and 9B ) and reduce the pressure inside the hollow when the process temperature rises. The air vent holes 42 may also be formed to penetrate in a direction perpendicular to the optical axis direction of the optical chip (the direction indicated by arrow X or Y in FIG. 8 ). Furthermore, the air vent holes 42 may be formed to penetrate the package substrate 11. The air vent holes 42 are sealed by a sealing portion 43.

[0052] 10A to 10H are cross-sectional views showing the steps of a method for manufacturing an optical package 1C according to the fourth embodiment of the present disclosure. The optical package 1C is manufactured using the same manufacturing apparatus as that of the first embodiment.

[0053] 10A, one glass plate 18 is prepared, and the manufacturing device forms multiple regions 18a with a thin thickness t1 on the second surface S2 of the glass plate 18 (glass countersinking) as shown in FIG. 10B. Next, the manufacturing device forms an AR coating 19 on the regions 18a with a thin thickness t1 as shown in FIG. 10C. Then, the manufacturing device cuts the glass to form a cover glass 13 as shown in FIG. 10D.

[0054] 10E, a package frame 41 having an opening 41a and air vent holes 42 is prepared, and the manufacturing equipment applies adhesive resin 44 to the attachment portion of opening 41a where cover glass 13 is to be attached. Next, as shown in FIG. 10F, the manufacturing equipment attaches cover glass 13 to package frame 41 from the attachment portion 41b side of package substrate 11 so as to close opening 41a.

[0055] Next, as shown in Fig. 10G, the manufacturing equipment inverts the package frame 41 to which the cover glass 13 has been attached, and attaches the package frame 41 to the package substrate 11. Thereafter, as shown in Fig. 10H, the manufacturing equipment seals the air vent holes 42 with sealing portions 43, thereby producing the optical package 1C.

[0056] <Effects of the fourth embodiment> As described above, according to the fourth embodiment, the package frame 41 houses the optical chip 12 inside and has an opening 41a in the optical axis direction of the optical chip 12. By bonding the cover glass 13 to the inside of the opening 41a of the package frame 41, the housing that houses the optical package 1C does not come into contact with the cover glass 13, thereby preventing the cover glass 13 from cracking, peeling, warping, etc.

[0057] According to the fourth embodiment, the package frame 41 is provided with air vent holes 42 for reducing the pressure inside the hollow space when the process temperature rises. This allows the air vent holes 42 to relieve the stress applied to the cover glass 13 due to the increase in internal pressure inside the hollow space of the package caused by the increase in process temperature when the package frame 41 is mounted on the package substrate 11 during a reflow process or the like, thereby preventing the occurrence of glass cracks. Furthermore, according to the fourth embodiment, the air vent holes 42 can be sealed with the sealing portion 43 after the package frame 41 is mounted on the package substrate 11, thereby preventing dust from entering the optical package 1C from the outside.

[0058] Fifth Embodiment (An Example of Electronic Apparatus) The optical package 1C according to the fourth embodiment is applicable to an image pickup device 100B as an electronic apparatus. An example of the image pickup device 100B to which the optical package 1C is applied will be described below.

[0059] 11 is a partial cross-sectional view showing a schematic configuration of an example of an imaging device 100B according to a fifth embodiment of the present disclosure. In Fig. 11, the same parts as those in Fig. 7 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0060] 11, the imaging device 100B of this example is configured to include a housing 31 that houses the optical package 1C therein, and a lens optical system 32. With this configuration, the housing 31 comes into contact with the top surface of the package frame 41, and the housing 31 does not come into contact with the cover glass 13 at all, so that glass cracks do not occur and high reliability can be maintained.

[0061] Sixth Embodiment A sixth embodiment of the present disclosure relates to a cover glass. Fig. 12 is a cross-sectional view schematically illustrating an example configuration of a cover glass 51 according to a sixth embodiment of the present disclosure. The cover glass 51 can be attached to a package frame 14, 41.

[0062] The cover glass 51 according to the sixth embodiment of the present disclosure has a desired optical transparency and includes a first surface S1 facing the optical chip 12 and a second surface S2 opposite the first surface S1. The cover glass 51 also includes a thin region 51a having a thickness t1 and a thick region 51b having a thickness t2 greater than the thickness t1. A difference t3 in the thickness direction (the direction indicated by arrow Z in FIG. 12 ) between the first surface S1 of the thin region 51a and the first surface S1 of the thick region 51b is equal to a difference t4 in the thickness direction between the second surface S2 of the thin region 51a and the second surface S2 of the thick region 51b.

[0063] 13A to 13E are cross-sectional views showing the steps of a method for manufacturing a cover glass 51 according to the sixth embodiment of the present disclosure. The cover glass 51 is manufactured using the same manufacturing apparatus as that of the first embodiment.

[0064] 13A, one glass plate 52 is prepared, and the manufacturing device forms a plurality of thin regions 52a on the second surface S2 of the glass plate 52 (single-sided glass countersinking) as shown in Fig. 13B. Next, the manufacturing device forms a plurality of thin regions 52b on the first surface S1 of the glass plate 52 in the same locations as the thin regions 52a as shown in Fig. 13C.

[0065] Next, as shown in Fig. 13D, the manufacturing equipment forms an AR coating 53a on the thin region 52a of the glass plate 52, and forms an AR coating 53b on the thin region 52b. Thereafter, as shown in Fig. 13E, the manufacturing equipment performs glass cutting to form a cover glass 51.

[0066] <Effects of the Sixth Embodiment> As described above, according to the sixth embodiment, the cover glass 51 is formed so that the difference t3 in the thickness direction between the first surface S1 of the thin region 51 a and the first surface S1 of the thick region 51 b and the difference t4 in the thickness direction between the second surface S2 of the thin region 51 a and the second surface S2 of the thick region 51 b have the same shape. This prevents the housing from coming into contact with the thin region 51 a of the cover glass 51, thereby preventing glass cracks and maintaining high reliability.

[0067] Seventh Embodiment A seventh embodiment of the present disclosure relates to a modified cover glass. Fig. 14 is a cross-sectional view schematically illustrating an example of the configuration of a cover glass 61 according to a seventh embodiment of the present disclosure. The cover glass 61 can be attached to a package frame 14, 41.

[0068] The cover glass 61 according to the seventh embodiment of the present disclosure has a desired optical transparency and includes a first surface S1 facing the optical chip 12 and a second surface S2 opposite the first surface S1. The cover glass 61 also includes a thin region 61a having a thickness t1 and a thick region 61b having a thickness t2 greater than the thickness t1. A difference t3 in the thickness direction (the direction indicated by arrow Z in FIG. 14 ) between the first surface S1 of the thin region 61a and the first surface S1 of the thick region 61b is equal to a difference t4 in the thickness direction between the second surface S2 of the thin region 61a and the second surface S2 of the thick region 61b.

[0069] The cover glass 61 has a 45-degree portion 61c1 (an example of a sloped shape) at the boundary corner between the thin region 61a and the thick region 61b, where the thickness gradually changes from the first surface S1 of the thin region 61a to the first surface S1 of the thick region 61b. Furthermore, the cover glass 61 has a 45-degree portion 61c2 (an example of a sloped shape) at the boundary corner between the thin region 61a and the thick region 61b, where the thickness gradually changes from the second surface S2 of the thin region 61a to the second surface S2 of the thick region 61b. The 45-degree portions 61c1 and 61c2 are formed by end milling or wet etching during the glass countersinking process.

[0070] <Effects of Seventh Embodiment> As described above, according to the seventh embodiment, cover glass 61 is shaped to have, at the boundary corner between thin region 61 a and thick region 61 b, 45-degree portion 61 c 1 whose thickness gradually changes from first surface S1 of thin region 61 a to first surface S1 of thick region 61 b, and 45-degree portion 61 c 2 whose thickness gradually changes from second surface S2 of thin region 61 a to second surface S2 of thick region 61 b, thereby making it possible to further improve the occurrence of glass cracks.

[0071] Eighth Embodiment An eighth embodiment of the present disclosure relates to a modified cover glass. Fig. 15 is a cross-sectional view schematically illustrating an example configuration of a cover glass 71 according to an eighth embodiment of the present disclosure. The cover glass 71 can be attached to a package frame 14, 41.

[0072] The cover glass 71 of the eighth embodiment of the present disclosure has a desired optical transparency and includes a first surface S1 facing the optical chip 12 and a second surface S2 opposite the first surface S1. The cover glass 71 also includes a thin region 71a having a thickness t1 and a thick region 71b having a thickness t2 that is greater than the thickness t1.

[0073] The cover glass 71 has a first surface S1 of the thin region 71a and a first surface S1 of the thick region 71b that are flat (no difference in thickness), and a second surface S2 of the thin region 71a and a second surface S2 of the thick region 71b that have a predetermined difference in thickness in the thickness direction (the direction indicated by arrow Z in FIG. 15 ). Furthermore, the cover glass 71 has a 45-degree portion 71c (an example of a sloped shape) at the boundary corner between the thin region 71a and the thick region 71b. The 45-degree portion 71c is formed by end milling or wet etching during the glass countersinking process.

[0074] <Effects of Eighth Embodiment> As described above, the eighth embodiment also provides the same effects as the seventh embodiment.

[0075] Ninth Embodiment A ninth embodiment of the present disclosure relates to a modified cover glass. Fig. 16 is a cross-sectional view schematically illustrating an example configuration of a cover glass 81 according to a ninth embodiment of the present disclosure. The cover glass 81 can be attached to a package frame 14, 41.

[0076] The cover glass 81 of the ninth embodiment of the present disclosure has a desired optical transparency and includes a first surface S1 facing the optical chip 12 and a second surface S2 opposite to the first surface S1. The cover glass 81 also includes a thin region 81a having a thickness t1 and a thick region 81b having a thickness t2 that is thicker than the thickness t1.

[0077] The cover glass 81 has a rounded corner 81c at the boundary between the thin region 81a and the thick region 81b. The rounded corner 81c is formed by using an end mill or wet etching in the above-mentioned glass countersinking process.

[0078] <Operational Effects of Ninth Embodiment> As described above, the ninth embodiment also provides the same operational effects as the eighth embodiment.

[0079] <Other Embodiments> As described above, the present technology has been described using the first to ninth embodiments. However, the descriptions and drawings that form part of this disclosure should not be understood to limit the present technology. Upon understanding the gist of the technical content disclosed in the first to ninth embodiments, it will be apparent to those skilled in the art that various alternative embodiments, examples, and operational techniques may be included in the present technology. Furthermore, the configurations disclosed in the first to ninth embodiments may be appropriately combined within a range that does not cause contradictions. For example, configurations disclosed in multiple different embodiments may be combined, or configurations disclosed in multiple different modified examples of the same embodiment may be combined.

[0080] <Application Example to Electronic Devices> The optical package described above can be applied to various electronic devices, such as imaging devices such as digital still cameras and digital video cameras, mobile phones with imaging functions, and other devices with imaging functions. An example of an imaging system to which the optical package is applied will be described below.

[0081] Fig. 17 is a block diagram showing an example of the configuration of an imaging system. As shown in Fig. 17, the imaging system 1010 includes an optical system 1020, a photodetector 1030, and a DSP (Digital Signal Processor) 1040. The DSP 1040, a display device 1050, an operation system 1060, a memory 1080, a recording device 1090, and a power supply system 1100 are connected via a bus 1070, and the imaging system 1010 is capable of capturing still images and moving images.

[0082] The optical system 1020 is configured to have one or more lenses, and guides image light (incident light) from a subject to the photodetector 1030 , forming an image on the light-receiving surface (sensor portion) of the photodetector 1030 .

[0083] Any of the photodetector devices having the above-described configuration examples is applied as the photodetector 1030. Electrons are accumulated in the photodetector 1030 for a certain period of time in accordance with an image formed on the light-receiving surface via the optical system 1020. A signal corresponding to the electrons accumulated in the photodetector 1030 is then supplied to the DSP 1040.

[0084] The DSP 1040 performs various signal processing on the signal from the photodetector 1030 to acquire an image, and temporarily stores the image data in the memory 1080. The image data stored in the memory 1080 is recorded in the recording device 1090 or supplied to the display device 1050 to display the image. In addition, the operation system 1060 accepts various operations by the user and supplies operation signals to each block of the imaging system 1010, and the power supply system 1100 supplies power necessary to drive each block of the imaging system 1010.

[0085] <Application Example to Endoscopic Surgery System> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0086] Fig. 18 is a diagram showing an example of the schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied. Fig. 18 shows a state in which an operator (doctor) 11131 is performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0087] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the example shown, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible scope having a flexible lens barrel.

[0088] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens toward an object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0089] An optical system and an image sensor are provided inside the camera head 11102, and light reflected from the object of observation (observation light) is collected by the optical system onto the image sensor. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. The image signal is sent to a camera control unit (CCU) 11201 as RAW data.

[0090] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives image signals from the camera head 11102 and performs various image processing on the image signals, such as development processing (demosaic processing), to display images based on the image signals. Under the control of the CCU 11201, the display device 11202 displays images based on the image signals that have been subjected to image processing by the CCU 11201.

[0091] The light source device 11203 is composed of a light source such as an LED (Light Emitting Diode) and supplies illumination light to the endoscope 11100 when photographing the surgical site, etc. The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of illumination light, magnification, focal length, etc.) of the endoscope 11100.

[0092] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 inflates the body cavity of the patient 11132 through the insufflation tube 11111 in order to ensure a clear field of view for the endoscope 11100 and a working space for the surgeon. The recorder 11207 is a device capable of recording various types of information related to the surgery. The printer 11208 is a device capable of printing various types of information related to the surgery in various formats such as text, images, or graphs.

[0093] The light source device 11203, which supplies illumination light to the endoscope 11100 when photographing the surgical site, can be configured from a white light source, such as an LED, a laser light source, or a combination of these. When the white light source is configured from a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, allowing the light source device 11203 to adjust the white balance of the captured image. In this case, it is also possible to time-share images corresponding to each RGB by irradiating the object of observation with laser light from each RGB laser light source and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, color images can be obtained without providing a color filter to the image sensor.

[0094] Furthermore, the light source device 11203 may be controlled to change the intensity of light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and combining the images, it is possible to generate an image with a high dynamic range that is free from so-called blocked-up shadows and blown-out highlights.

[0095] The light source device 11203 may also be configured to supply light in a predetermined wavelength band corresponding to special light observation. Special light observation, for example, utilizes the wavelength dependence of light absorption in body tissues to irradiate light in a narrower band than the light irradiated during normal observation (i.e., white light) to capture high-contrast images of specific tissues, such as blood vessels on the surface of mucous membranes, in what is known as narrow band imaging. Alternatively, special light observation may involve fluorescence observation, in which images are obtained using fluorescence generated by irradiating excitation light. Fluorescence observation may involve irradiating excitation light onto body tissues and observing the fluorescence from the tissues (autofluorescence observation), or may involve locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the tissues with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow band light and / or excitation light corresponding to such special light observation.

[0096] Fig. 19 is a block diagram showing an example of the functional configuration of the camera head 11102 and CCU 11201 shown in Fig. 18. The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so as to be able to communicate with each other.

[0097] The lens unit 11401 is an optical system provided at the connection portion with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses including a zoom lens and a focus lens.

[0098] The imaging unit 11402 is composed of an imaging element. The imaging element constituting the imaging unit 11402 may be a single (so-called single-chip type) or multiple (so-called multi-chip type). When the imaging unit 11402 is composed of a multi-chip type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining these signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to 3D (dimensional) display. The 3D display allows the surgeon 11131 to more accurately grasp the depth of the biological tissue at the surgical site. Note that when the imaging unit 11402 is composed of a multi-chip type, multiple lens units 11401 may be provided corresponding to each imaging element.

[0099] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately behind the objective lens. The driving unit 11403 is composed of an actuator, and moves the zoom lens and focus lens of the lens unit 11401 a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted as appropriate.

[0100] The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0101] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of imaging, and / or information specifying the magnification and focus of the captured image.

[0102] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with a so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0103] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404. The communication unit 11411 is configured by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0104] The communication unit 11411 also transmits to the camera head 11102 a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, etc. The image processing unit 11412 performs various types of image processing on the image signal, which is RAW data transmitted from the camera head 11102.

[0105] The control unit 11413 performs various controls related to the imaging of the surgical site, etc. by the endoscope 11100 and the display of the captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0106] Furthermore, the control unit 11413 displays the captured image showing the surgical site, etc., on the display device 11202 based on the image signal subjected to image processing by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical tools such as forceps, specific biological parts, bleeding, mist generated when using the energy treatment tool 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When displaying the captured image on the display device 11202, the control unit 11413 may use the recognition results to superimpose various surgical support information on the image of the surgical site. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0107] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for electrical signal communication, an optical fiber for optical communication, or a composite cable of these. In the illustrated example, communication is performed by wire using the transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0108] The above describes an example of an endoscopic surgery system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to, for example, the endoscope 11100, the imaging unit 11402 of the camera head 11102, the image processing unit 11412 of the CCU 11201, and the like, among the above-described configurations. Specifically, the optical package 1A of FIG. 1 , the optical package 1B of FIG. 4 , the imaging device 100A of FIG. 7 , the optical package 1C of FIG. 8 , and the imaging device 100B of FIG. 11 can be applied to the imaging unit 10402. Note that, although the endoscopic surgery system has been described as an example here, the technology according to the present disclosure may also be applied to other systems, such as a microsurgical system.

[0109] <Application to a Mobile Body> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0110] Fig. 20 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied. The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 20, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 also includes a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0111] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0112] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0113] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0114] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0115] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0116] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc.

[0117] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0118] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0119] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In the example of Fig. 21, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0120] Fig. 21 is a diagram showing an example of the installation position of the image capturing unit 12031. In Fig. 21, a vehicle 12100 has image capturing units 12101, 12102, 12103, 12104, and 12105 as the image capturing unit 12031.

[0121] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The forward images acquired by the imaging units 12101 and 12105 are mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0122] 21 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0123] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0124] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which runs autonomously without relying on driver operation.

[0125] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0126] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0127] The above describes an example of a vehicle control system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to, for example, the imaging unit 12031 of the above-described configuration. Specifically, the technology can be applied to the optical package 1A in FIG. 1, the optical package 1B in FIG. 4, the imaging device 100A in FIG. 7, the optical package 1C in FIG. 8, and the imaging device 100B in FIG. 11.

[0128] The present disclosure may also be configured as follows: (1) An optical package comprising: a package substrate; an optical chip electrically connected to the package substrate; a cover glass located in the optical axis direction of the optical chip and having a first surface facing the optical chip and a second surface opposite the first surface; and an attachment portion provided on the package substrate and attaching the cover glass so as to form a space between the optical chip and the first surface of the cover glass, wherein the cover glass has a first thickness from the first surface to the second surface and a second thickness thinner than the first thickness in a region directly above the light receiving portion in the optical axis direction of the optical chip. (2) The optical package described in (1) above, wherein the attachment portion is a frame body that houses the optical chip inside and has an opening in the optical axis direction of the optical chip, and the cover glass is attached to the inside of the opening of the frame body facing the optical chip. (3) The optical package described in (2) above, wherein the package substrate or the attachment portion has a through-hole that reduces internal pressure when process temperature increases. (4) The optical package according to (3) above, wherein the through hole penetrates the mounting portion in a direction parallel to the optical axis direction of the optical chip or in a direction perpendicular to the optical axis direction of the optical chip. (5) The optical package according to (1) above, wherein the cover glass has a predetermined difference in thickness between the second surface of the first thickness region and the second surface of the second thickness region. (6) The optical package according to (1) above, wherein the first difference in thickness between the first surface of the first thickness region and the first surface of the second thickness region and the second difference in thickness between the second surface of the first thickness region and the second surface of the second thickness region are the same. (7) The optical package according to (5) or (6) above, wherein the cover glass has a third thickness at a boundary corner between the first thickness region and the second thickness region, the third thickness gradually changing from the first thickness to the second thickness.(8) The optical package according to (7), wherein the shape of the third thickness of the cover glass is a shape that slopes from the region of the first thickness to the region of the second thickness, or a shape in which the boundary corners are rounded. (9) An optical package comprising: a package substrate; an optical chip electrically connected to the package substrate; a cover glass located on the optical axis of the optical chip and having a first surface facing the optical chip and a second surface opposite the first surface; and an attachment portion provided on the package substrate for attaching the cover glass so as to form a space between the optical chip and the first surface of the cover glass, wherein the cover glass is provided with a reinforcing material that reinforces the cover glass in an area other than a region directly above the light receiving area in the optical axis direction of the optical chip. (10) The optical package according to (9), wherein the thermal expansion coefficient of the reinforcing material is equal to or less than the thermal expansion coefficient of the attachment portion. (11) The optical package according to (9), wherein the reinforcing material is provided on the second surface of the cover glass, and the attachment portion attaches the first surface of the cover glass. (12) The optical package according to (9) above, wherein the reinforcing material is made of ceramic. (13) The optical package according to (9) above, wherein the mounting portion is made of an insulating resin material. (14) The optical package according to (9) above, wherein the mounting portion is a frame that houses the optical chip inside and has an opening in the optical axis direction of the optical chip, and the cover glass is attached to the inside of the frame opening facing the optical chip. (15) The optical package according to (14) above, wherein the package substrate or the mounting portion has a through hole that reduces internal pressure in the space when the process temperature rises. (16) The optical package according to (15) above, wherein the through hole penetrates the mounting portion in a direction parallel to the optical axis direction of the optical chip or in a direction perpendicular to the optical axis direction of the optical chip.(17) A method for manufacturing an optical package, comprising: preparing a mounting section in a frame that houses an optical chip inside, the mounting section having an opening in the optical axis direction of the optical chip; attaching a cover glass having a first surface facing the optical chip and a second surface opposite the first surface to the inside of the opening of the mounting section facing the optical chip; forming a through hole in the mounting section to which the cover glass is attached, in a direction parallel to the optical axis direction of the optical chip or a direction perpendicular to the optical axis direction of the optical chip, to reduce internal pressure when process temperature rises; attaching the mounting section with the through hole formed therein to a package substrate on which the optical chip is mounted; and sealing the through hole in the mounting section attached to the package substrate, wherein the cover glass has a first thickness from the first surface to the second surface, and a second thickness thinner than the first thickness in a region directly above the light receiving region in the optical axis direction of the optical chip. (18) An electronic device comprising: the optical package according to (1) above; a housing for accommodating the optical package; and a lens optical system located in the optical axis direction of the optical chip of the optical package and attached to the housing. (19) An electronic device comprising: the optical package according to (9) above; a housing for accommodating the optical package; and a lens optical system located in the optical axis direction of the optical chip of the optical package and attached to the housing.

[0129] 1A, 1B, 1C Optical package 11 Package substrate 12 Optical chip 12a Light receiving element 13, 21, 51, 61, 71, 81 Cover glass 13a, 51a, 61a, 71a, 81a Thin region 13b, 51b, 61b, 71b, 81b Thick region 14, 41 Package frame 15 Electrode pad 16 Bonding wire 17 Pin 18, 23, 52 Glass plate 18a Thin region 19, 53a, 53b AR coating 21a Light receiving region 21b Region 22 Reinforcement material 31 Housing 31a Opening 32 Lens optical system 33 Camera board 34 Heat sink 41a Opening 41b Mounting portion 42 Air vent hole 43 Sealing portion 44 Adhesive resin 52a Region 52b Region 61c1, 61c2 45 deg section 81c R section 100A, 100B Imaging device 100B Imaging device 331 Socket 1010 Imaging system 1020 Optical system 1030 Light detection device 1050 Display device 1060 Operation system 1070 Bus 1080 Memory 1090 Recording device 1100 Power supply system 10402 Imaging section 11000 Endoscopic surgery system 11100 Endoscope 11101 Optical tube 11102 Camera head 11110 Surgical tool 11111 Insufflation tube 11112 Energy treatment tool 11120 Support arm device 11131 Surgeon (doctor) 11132 Patient 11133 Patient bed 11200 Cart 11201 Camera control unit (CCU) 11202 Display device 11203 Light source device 11204 Input device 11205 Treatment tool control device 11206 Insufflation device 11207 Recorder 11208 Printer 11400 Transmission cable 11401 Lens unit 11402, 12031 Imaging unit 11403 Driving unit 11404,11411 Communication unit 11405 Camera head control unit 11412 Image processing unit 11413 Control unit 12000 Vehicle control system 12001 Communication network 12010 Drive system control unit 12020 Body system control unit 12030 Outside vehicle information detection unit 12040 Inside vehicle information detection unit 12041 Driver state detection unit 12050 Integrated control unit 12051 Microcomputer 12052 Audio and image output unit 12061 Audio speaker 12062 Display unit 12063 Instrument panel 12100 Vehicle 12101, 12102, 12103, 12104, 12105 Imaging unit 12111, 12112, 12113, 12114 Imaging range,

Claims

1. An optical package comprising: a package substrate; an optical chip electrically connected to the package substrate; a cover glass located in the optical axis direction of the optical chip and having a first surface facing the optical chip and a second surface opposite the first surface; and an attachment portion provided on the package substrate for attaching the cover glass so as to form a space between the optical chip and the first surface of the cover glass, wherein the cover glass has a first thickness from the first surface to the second surface, and a second thickness thinner than the first thickness in a region directly above the light-receiving portion in the optical axis direction of the optical chip.

2. The optical package according to claim 1, wherein the mounting portion is a frame that houses the optical chip inside and has an opening in the optical axis direction of the optical chip, and the cover glass is attached to the inside of the opening of the frame facing the optical chip.

3. The optical package according to claim 2, wherein the package substrate or the mounting portion has a through-hole that reduces pressure within the space when the process temperature rises.

4. The optical package according to claim 3, wherein the through hole penetrates the mounting portion in a direction parallel to the optical axis direction of the optical chip or in a direction perpendicular to the optical axis direction of the optical chip.

5. The optical package according to claim 1, wherein the cover glass has a predetermined difference in thickness between the second surface of the first thickness region and the second surface of the second thickness region.

6. The optical package of claim 1, wherein the cover glass has a first difference in thickness between the first surface of the first thickness region and the first surface of the second thickness region, and a second difference in thickness between the second surface of the first thickness region and the second surface of the second thickness region, which is the same.

7. An optical package according to claim 5 or 6, wherein the cover glass has a third thickness at the boundary corner between the first thickness region and the second thickness region, the third thickness gradually changing from the first thickness to the second thickness.

8. The optical package according to claim 7, wherein the shape of the third thickness of the cover glass is a shape having a slope from the region of the first thickness to the region of the second thickness, or a shape in which the boundary corner portion is rounded.

9. An optical package comprising: a package substrate; an optical chip electrically connected to the package substrate; a cover glass located on the optical axis of the optical chip and having a first surface facing the optical chip and a second surface opposite the first surface; and an attachment portion provided on the package substrate for attaching the cover glass so as to form a space between the optical chip and the first surface of the cover glass, wherein a reinforcing material for reinforcing the cover glass is provided on the cover glass in an area other than the area directly above the light-receiving area in the direction of the optical axis of the optical chip.

10. The optical package according to claim 9, wherein the coefficient of thermal expansion of said stiffener is equal to or less than the coefficient of thermal expansion of said mounting portion.

11. The optical package according to claim 9, wherein the reinforcing material is provided on the second surface of the cover glass, and the mounting portion mounts the first surface of the cover glass.

12. The optical package according to claim 9, wherein the reinforcing material is made of ceramic.

13. The optical package according to claim 9, wherein the mounting portion is made of an insulating resin material.

14. The optical package according to claim 9, wherein the mounting portion is a frame that houses the optical chip inside and has an opening in the optical axis direction of the optical chip, and the cover glass is attached to the inside of the opening of the frame facing the optical chip.

15. The optical package according to claim 14, wherein the package substrate or the mounting portion has a through-hole that reduces pressure within the space when the process temperature rises.

16. The optical package according to claim 15, wherein the through hole penetrates the mounting portion in a direction parallel to the optical axis direction of the optical chip or in a direction perpendicular to the optical axis direction of the optical chip.

17. A method for manufacturing an optical package, comprising: preparing a mounting section in a frame that houses an optical chip, the mounting section having an opening in the optical axis direction of the optical chip; attaching a cover glass having a first surface facing the optical chip and a second surface opposite the first surface to the inside of the opening of the mounting section facing the optical chip; forming a through hole in the mounting section to which the cover glass is attached, in a direction parallel to the optical axis direction of the optical chip or a direction perpendicular to the optical axis direction of the optical chip, to reduce internal pressure when process temperature rises; attaching the mounting section with the through hole formed therein to a package substrate on which the optical chip is mounted; and sealing the through hole in the mounting section attached to the package substrate, wherein the cover glass has a first thickness from the first surface to the second surface, and a second thickness thinner than the first thickness in a region directly above the light receiving region in the optical axis direction of the optical chip.

18. An electronic device comprising: the optical package according to claim 1; a housing for accommodating said optical package; and a lens optical system located in the optical axis direction of the optical chip of said optical package and attached to said housing.

19. An electronic device comprising: the optical package according to claim 9; a housing for accommodating said optical package; and a lens optical system positioned in the optical axis direction of the optical chip of said optical package and attached to said housing.

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