Radio frequency front-end module and electronic device including same

Abstract

In embodiments of the present disclosure, an electronic device is provided. The electronic device may comprise: a processor including a processing circuit; a radio frequency (RF) transceiver; a first power supply circuit configured to provide a first supply voltage based on average power tracking (APT); a second power supply circuit configured to provide a second supply voltage based on APT; a switching circuit for selectively connecting one of the first power supply circuit and the second power supply circuit to a power path; a first radio frequency front-end (RFFE) module including a first power amplifier connected to the power path; a second RFFE module including a second power amplifier connected to the power path; a third RFFE module including a third power amplifier connected to the second power supply circuit; a first capacitor connected to the first RFFE module; a second capacitor connected to the second RFFE module; and a third capacitor connected to the third RFFE module.

Description

Radio frequency front-end module and electronic device including the same

[0001] The following descriptions relate to a radio frequency front-end module and an electronic device including the radio frequency front-end module.

[0002] An electronic device may include radio frequency front end (RFFE) modules for transmitting or receiving signals. For example, an RFFE module may include a power amplifier (PA) for transmitting power of a signal to be transmitted via an antenna connected to the RFFE module.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a processor including one or more processing circuits, a radio frequency (RF) transceiver, a first power supply circuit, a second power supply circuit configured to provide a supply voltage based on average power tracking (APT), a switching circuit for selectively electrically connecting one of the first power supply circuit and the second power supply circuit to a power path, a first radio frequency front end (RFFE) module including a first power amplifier connected to the power path, a second RFFE module including a second power amplifier connected to the power path, a third RFFE module including a third power amplifier connected to the second power supply circuit, and at least one capacitor connected to the second power supply circuit, and at least one capacitor connected to the power path. The switching circuit may be configured to connect the power path and the second power supply circuit while the power amplifiers, including the first power amplifier and the second power amplifier, connected to the power path are deactivated and signals are transmitted through a third power amplifier connected to the second power supply circuit, under the control of the processor or the RF transceiver.

[0005] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a processor including one or more processing circuits, a radio frequency (RF) transceiver, a plurality of power supply circuits including a power supply circuit configured to provide a supply voltage based on average power tracking (APT), a first radio frequency front end (RFFE) module including a switching circuit for selectively electrically connecting one of the plurality of power supply circuits to a power path, at least one second RFFE module connected to the power path, a third RFFE module connected to a path from the power supply circuit, at least one capacitor connected to the power supply circuit, and at least one capacitor connected to the power path. The switching circuit may be configured to connect the power path and the power supply circuit while power amplifiers included in the first RFFE module and the at least one second RFFE module are deactivated and signals are transmitted through a power amplifier of the third RFFE module under the control of the processor or the RF transceiver.

[0006] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a processor including a processing circuit, a radio frequency (RF) transceiver, a first power supply circuit configured to provide a first supply voltage based on average power tracking (APT), a second power supply circuit configured to provide a second supply voltage based on APT, a switching circuit for selectively connecting one of the first power supply circuit and the second power supply circuit to a power path, a first radio frequency front end (RFFE) module including a first power amplifier connected to the power path, a second RFFE module including a second power amplifier connected to the power path, a third RFFE module including a third power amplifier connected to the second power supply circuit, a first capacitor connected to the first RFFE module, a second capacitor connected to the second RFFE module, and a third capacitor connected to the third RFFE module. The switching circuit may be configured to connect the power path and the second power supply circuit while the power amplifiers, including the first power amplifier and the second power amplifier, connected to the power path are deactivated and a third power amplifier connected to the second power supply circuit is activated to transmit RF signals on a frequency band supported by the third RFFE module, under the control of the processor or the RF transceiver. The first capacitor, the second capacitor, and the third capacitor may be used for the second supply voltage based on the APT while the power supply path and the second power supply circuit are connected.The transmission power for the frequency band supported by the third RFFE module may be higher than the transmission power for the frequency band supported by the first RFFE module and may be higher than the transmission power for the frequency band supported by the second RFFE module.

[0007] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a processor including a processing circuit, a radio frequency (RF) transceiver, a voltage supply circuit configured to provide a supply voltage based on average power tracking (APT), a switching circuit, a first radio frequency front end (RFFE) module including a first power amplifier, a second RFFE module including a second power amplifier, a third RFFE module including a third power amplifier, a first path provided between the power supply circuit and the switching circuit, a second path provided to each of the power amplifiers, including the switching circuit and the first power amplifier and the second power amplifier, a third path provided between a node on the first path and the third power amplifier, a first capacitor connected to the first path, a second capacitor connected to the second path, and a third capacitor connected to the third path. When the first power amplifier is activated, the second power amplifier is deactivated, and the third power amplifier is deactivated, the switching circuit may be controlled to connect the first power amplifier to receive a supply voltage from the power supply circuit via the first path and the second path to amplify first RF signals from the RF transceiver and transmit the amplified first RF signals at a first transmit power on a first frequency band. When the first power amplifier is deactivated, the second power amplifier is activated, and the third power amplifier is deactivated, the switching circuit may be controlled to connect the second power amplifier to receive a supply voltage from the power supply circuit via the first path and the second path to amplify second RF signals from the RF transceiver and transmit the amplified second RF signals at a second transmit power on a second frequency band.When the first power amplifier is deactivated, the second power amplifier is deactivated, and the third power amplifier is activated, the switching circuit may be controlled to connect the first capacitor, the second capacitor, and the third capacitor by connecting the first path and the second path while the third power amplifier is connected to receive a supply voltage from the power supply circuit through the third path, so as to amplify third RF signals from the RF transceiver and transmit the amplified third RF signals at a third transmit power on a third frequency band. A third transmit power of the amplified third RF signals on the third frequency band may be higher than a first transmit power of the amplified first RF signals on the first frequency band and may be higher than a second transmit power of the amplified second RF signals on the second frequency band.

[0008] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a processor including a processing circuit, a radio frequency (RF) transceiver, a voltage supply circuit configured to provide a supply voltage based on average power tracking (APT), a switching circuit, a first radio frequency front end (RFFE) module including a first power amplifier, a second RFFE module including a second power amplifier, a third RFFE module including a third power amplifier, a first path provided between the power supply circuit and the switching circuit, a second path provided to each of the power amplifiers, including the switching circuit and the first power amplifier and the second power amplifier, a third path provided between a node on the first path and the third power amplifier, a first capacitor connected to the first path, a second capacitor connected to the second path, and a third capacitor connected to the third path. When the first power amplifier is deactivated, the second power amplifier is deactivated, and the third power amplifier is activated to amplify first RF signals from the RF transceiver to be transmitted on a first frequency band supported by the third RFFE module via an antenna, the switching circuit may be configured to operate in a state where the first path and the second path are not connected. When the first power amplifier is deactivated, the second power amplifier is deactivated, and the third power amplifier is activated to amplify second RF signals from the RF transceiver to be transmitted on a second frequency band supported by the third RFFE module via an antenna, the switching circuit may be configured to connect the first path and the second path to utilize the first capacitor, the second capacitor, and the third capacitor while the supply voltage based on the APT is provided to the third power amplifier.

[0009] Figure 1 is a block diagram of an electronic device within a network environment.

[0010] Figure 2 illustrates an example of an electronic device including a power supply module and a radio frequency front end (RFFE) modules.

[0011] Figure 3 shows an example of the operation of a switching circuit within an RFFE module for signal transmission in a specified frequency band.

[0012] Figure 4 shows an example of the operation of a switching circuit within a power supply module for signal transmission in a specified frequency band.

[0013] Figures 5a and 5b illustrate examples of the operation of a switching circuit within an RFFE module for signal transmission in a specified frequency band.

[0014] Figure 6 shows the operation flow of an electronic device for transmitting a signal in a specified frequency band.

[0015] Figure 7 shows the operation flow of an electronic device for transmitting a signal in a specified frequency band.

[0016] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0017] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0018] Terms referring to parts of electronic devices used in the following description (e.g., communication module, wireless communication module, substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to RF-related parts (FEM (front end module0), PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), LPAMid (low noise amplifier PAM including duplexer), RFFE (radio frequency front end)), RFIC (radio frequency integrated circuit)), terms referring to the shape of parts (e.g., structure, structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, signal path, RF path, RF Modules, RF circuits, splitters, dividers, couplers, combiners, etc. are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... object', '... body', etc. used below may mean at least one shape structure or a unit that processes a function.

[0019] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}.

[0020] Figure 1 is a block diagram of an electronic device within a network environment.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] FIG. 2 illustrates an example of an electronic device (e.g., the electronic device (101) of FIG. 1) including a power supply module and RFFE (radio frequency front end) modules.

[0044] Referring to FIG. 2, the electronic device (101) may include a processor (210), an RF transceiver (220), RFFE modules (240), a power supply circuit (250), and antennas (280). The electronic device (101) may include the processor (210). The processor (210) may include, for example, at least one of an application processor (AP) (e.g., the main processor (121) of FIG. 1)) or a communication processor (CP) (e.g., the auxiliary processor (123) of FIG. 1). For example, the processor (210) may include an AP and a CP. For example, the processor may include an AP. For example, the processor (210) may include a CP. The processor (210) may control the RF transceiver (220) via a control interface. The processor (210) can control the RF transceiver (220) to transmit a signal via an antenna (e.g., at least one of the antennas (280)). The processor (210) can control the RF transceiver (220) to receive a signal.

[0045] The electronic device (101) may include an RF transceiver (220). For example, the RF transceiver (220) may be implemented as a single chip (e.g., an RFIC chip) or as part of a single package. The RF transceiver (220) may include a digital to analog converter (DAC) for converting a digital signal to an analog signal. The RF transceiver (220) may include a mixer and an oscillator (e.g., a local oscillator (LO)) for up-conversion. The RF transceiver (220) may convert a baseband signal generated by the processor (210) into an RF signal. The RF transceiver (220) may provide the RF signal to an RFFE module (e.g., at least one of the RFFE modules (240)). The RF transceiver (220) may include an analog to digital converter (ADC) for converting an analog signal to a digital signal. The RF transceiver (220) may include a mixer and an oscillator for down-conversion. The RF transceiver (220) may convert an RF signal received from an antenna (e.g., at least one of the antennas (280)) into a baseband signal so that the RF signal can be processed by the processor (210). The RF transceiver (220) may include one or more transmit ports. The RF transceiver (220) may include one or more receive ports. According to one embodiment, the RF transceiver (220) may control at least a portion of the RFFE modules (240) and / or the power supply circuit (250) (e.g., the first power supply circuit (251), the second power supply circuit (252)) via a mobile industry processor interface (MIPI) interface.

[0046] The electronic device (101) may include RFFE modules (240) (or RFFE circuits) to support various frequency bands. For example, the electronic device (101) may include a first RFFE module (241), a second RFFE module (242), a third RFFE module (243), and / or a fourth RFFE module (244). Each RFFE module may include a power amplifier (PA). For example, the first RFFE module (241) may include a first PA (261). The second RFFE module (242) may include a second PA (262). The third RFFE module (243) may include a third PA (263). The fourth RFFE module (244) may include a fourth PA (264). Each RFFE module may be connected to an antenna for transmitting a signal. For example, a first RFFE module (241) may be connected to a first antenna (281). A second RFFE module (242) may be connected to a second antenna (282). A third RFFE module (243) may be connected to a third antenna (283). A fourth RFFE module (244) may be connected to a fourth antenna (284). Although an RFFE module including a power amplifier for a transmission path is illustrated in FIG. 2 , embodiments of the present disclosure are not limited thereto. For example, in addition to the PAMid including the transmission path, the RFFE module may also be used as an example of an RFFE module, such as an LPAMid further including a component for the reception path (e.g., a low noise amplifier (LNA)). A module including a power amplifier that receives a supply voltage from a power supply circuit (250) (e.g., a first power supply circuit (251), a second power supply circuit (252)) may be understood as an RFFE module of the electronic device (101) according to an embodiment of the present disclosure.As a non-limiting example, in terms of being implemented as a single module such as a chip, the RFFE module may be referred to as a wireless communication chip, an RF chip, a wireless transceiver chip, a wireless chip, a communication chip, and / or equivalent technical terms. Furthermore, for example, the RFFE module may be understood as a communication circuit including a power amplifier and an FEMid, as well as a single module, depending on the implementation example.

[0047] The electronic device (101) may include a power supply circuit (250). The power supply circuit (250) may be controlled by the processor (120) and / or the RF transceiver (220). The power supply circuit (250) may be configured to supply power to a plurality of RFFE modules (e.g., RFFE modules (240)). The power supply circuit (250) may supply a plurality of power supplies for the plurality of RFFE modules. The power supply circuit (250) may supply power to each RFFE module of the plurality of RFFE modules. For example, the power supply circuit (250) may be in the form of a plurality of modulators implemented as a single module (or IC). The power supply circuit (250) may be a power supply module including a plurality of cores. For example, the power supply module may include a first power supply circuit (251) and a second power supply circuit (252). For another example, the power supply circuit (250) may include a first power supply circuit (251) and a second power supply circuit (252) implemented as separate modules. Supplying power to the RFFE module may indicate that a supply voltage is applied for the PA of the RFFE module. The power supply circuit (250) may output a plurality of supply voltages for the plurality of RFFE modules. For example, the power supply circuit (250) may output a first supply voltage (253) (V) from the first power supply circuit (251). CC1 ) and a second supply voltage (254) (V) from the second power supply circuit (252).cc2 ) can be output. For example, the first supply voltage (253) can be provided to the first RFFE module (241), the second RFFE module (242), and / or the fourth RFFE module (244). For example, the second supply voltage (254) can be provided to the first RFFE module (241), the second RFFE module (242), and / or the third RFFE module (243).

[0048] The first RFFE module (241) may include a switching circuit (289) for selecting one of a first supply voltage (253) and a second supply voltage (254). A first path (291) (or wiring) electrically connected to the first power supply circuit (251) and a second path (292) (or wiring) electrically connected to the second power supply circuit (252) may be connected to the switching circuit (289). The switching circuit (289) may be connected to a power path (299). The power path (299) represents an electrical path (or wiring) that is connected to the switching circuit (289) and provides a supply voltage provided through a power supply circuit (e.g., the first power supply circuit (251) or the second power supply circuit (252)) to the power amplifier(s). The power path (299) is provided with power supply (V) from a power supply circuit (e.g., a first power supply circuit (251) or a second power supply circuit (252)) that is electrically connected through a switching circuit (289). cc ) can be provided to one of the power amplifiers (e.g., the first PA (261), the second PA (262)) of the RFFE modules connected to the power path (299). One branch of the power path (299) (e.g., the first branch (299a)) can be configured to provide a supply voltage to the first PA (261), and the other branch of the power path (299) (e.g., the second branch (299b)) can be configured to provide an output voltage to the outside of the first RFFE module (241). For example, the other branch of the power path (299) can be configured to provide an output voltage to the output voltage port (V) of the first RFFE module (241).out ) can be connected to the outside of the first RFFE module (241). A part of the power path (299) may include wiring that is arranged outside the first RFFE module (241) and is connected to another RFFE module (e.g., the second RFFE module (242)). The electronic device (101) may receive power (V) through the wiring of the power path (299). cc ) can be provided to the second PA (262) of the second RFFE module (242). In FIG. 2, a circuit structure in which two RFFE modules are connected to a power path (299) is illustrated, but embodiments of the present disclosure are not limited thereto. Three or more RFFE modules may be connected through the power path (299).

[0049] The first RFFE module (241) can obtain a first transmission signal (221) from the RF transceiver (220). The first RFFE module (241) can amplify the first transmission signal (221) through the first PA (261). For the operation of the first PA (261), either a first supply voltage (253) or a second supply voltage (254) can be applied to the first PA (261). A switching circuit (289) within the first RFFE module (241) can provide either the first supply voltage (253) or the second supply voltage (254) to the first PA (261) through a power path (299) (e.g., the first branch (299a)) connected to the first PA (261). The first transmission signal (221) amplified through the first PA (261) can be transmitted through the first antenna (281). Components of the first RFFE module (241) may operate under the control of the first controller (271). The first controller (271) may be configured to receive a control signal from the processor (210) and / or the RF transceiver (220). For example, the first controller (271) may control components (e.g., the first PA (261), the switching circuit (289)) within the first RFFE module (241) according to the first MIPI signal (231) from the RF transceiver (220).

[0050] The second RFFE module (242) can obtain a second transmission signal (222) from the RF transceiver (220). The second RFFE module (242) can amplify the second transmission signal (222) through the second PA (262). For the operation of the second PA (262), either a first supply voltage (253) or a second supply voltage (254) can be applied to the second PA (262). A switching circuit (289) within the second RFFE module (242) can provide either the first supply voltage (253) or the second supply voltage (254) to the first PA (261) through a power path (299) (e.g., the second branch (299b)) connected to the second PA (262). The second transmission signal (222) amplified through the second PA (262) can be transmitted through the second antenna (282). Components of the second RFFE module (242) may operate under the control of the second controller (272). The second controller (272) may be configured to receive control signals from the processor (210) and / or the RF transceiver (220). For example, the second controller (272) may control components (e.g., the second PA (262)) within the second RFFE module (242) according to a first MIPI signal (231) from the RF transceiver (220). While signals are transmitted through the first PA (261), the second PA (262) connected to the same power path (299) may be required to be deactivated. Similarly, while signals are transmitted through the second PA (262), the first PA (261) connected to the same power path (299) may be required to be deactivated. For this control, the same MIPI signal (e.g., the first MIPI signal (231)) is exemplified, but the embodiments of the present disclosure are not limited thereto. Different control signals may be used to individually control the first RFFE module (241) and the second RFFE module (242).Hereinafter, in the present disclosure, deactivating a power amplifier means that the power amplifier is not operated so that signals are not amplified through the power amplifier. Activating the power amplifier means that the power amplifier is operated so that signals are amplified through the power amplifier. Activating or deactivating the power amplifier may be performed by a controller of an RFFE module including the power amplifier, and the controller may operate according to a control (e.g., MIPI) signal of a processor (210) or an RF transceiver (220). In order to describe the state of the power amplifier, not only disable, but also deactivate, shut-off, turn-off, inactive, idle, non-operating mode, sleep mode, inactive state, and / or equivalent technical terms may be used.

[0051] The third RFFE module (243) can obtain a third transmission signal (223) from the RF transceiver (220). The third RFFE module (243) can amplify the third transmission signal (223) through the third PA (263). For the operation of the third PA (263), a second supply voltage (254) from the second power supply circuit (252) can be applied to the third PA (263). The third transmission signal (223) amplified through the third PA (263) can be transmitted through the third antenna (283). The components of the third RFFE module (243) can operate under the control of the third controller (273). The third controller (273) can be configured to receive a control signal from the processor (210) and / or the RF transceiver (220). For example, the third controller (273) can control components (e.g., the third PA (263)) within the third RFFE module (243) according to the second MIPI signal (233) from the RF transceiver (220).

[0052] The fourth RFFE module (244) can obtain a fourth transmission signal (224) from the RF transceiver (220). The fourth RFFE module (244) can amplify the fourth transmission signal (224) through the fourth PA (264). For the operation of the fourth PA (264), a first supply voltage (253) from the second power supply circuit (251) can be applied to the fourth PA (264). The fourth transmission signal (224) amplified through the fourth PA (264) can be transmitted through the fourth antenna (284). The components of the fourth RFFE module (244) can operate under the control of the fourth controller (274). The fourth controller (274) can be configured to receive a control signal from the processor (210) and / or the RF transceiver (220). For example, the fourth controller (274) can control components (e.g., the fourth PA (264)) within the fourth RFFE module (244) according to a third MIPI signal (234) from the RF transceiver (220).

[0053] The current consumed by a power amplifier in an electronic device (101) can have a significant impact on the battery life of a user. With the advancement of communication technology, average power tracking (APT) technology can be used to provide a supply voltage of an appropriate magnitude. APT is a technology for providing a DC voltage of a magnitude according to a communication channel status to a power amplifier. For the supply voltage according to APT, a power supply circuit (250) can be configured to provide power to the power amplifier of a specified magnitude through a DC-DC converter. In addition to APT, terms such as APT mode, APT state, APT operation, APT method, variable DC voltage mode, variable DC power mode, and / or terms having equivalent technical / functional meanings can be used for APT. The power supply circuit (250) can be configured to provide a supply voltage based on APT. For example, a first power supply circuit (251) can be configured to provide a first supply voltage (253) based on APT. For example, the second power supply circuit (252) may be configured to provide a second supply voltage (254) based on the APT. To generate the supply voltage according to the APT, each power supply circuit may include an APT switch (not shown) and a buck converter circuit (not shown). The APT switch may be configured to electrically connect a capacitor to the buck converter circuit. The supply voltage according to the APT may be influenced by the capacitor. A DC voltage is generated through the buck converter circuit, and the capacitor may be used to maintain a constant voltage. For example, the first power supply circuit (251) may be electrically connected to a first APT capacitor (259a) to maintain a first supply voltage (253) according to the APT at a constant level. For example, the second power supply circuit (252) may be electrically connected to a second APT capacitor (259b) to maintain a second supply voltage (254) according to the APT at a constant level.

[0054] The higher the output required from a power amplifier, the greater the current consumption, which may require a high-capacity capacitor. For example, to amplify signals in a frequency band that supports a specific wireless access technology (e.g., global system for mobile communications (GSM)), a relatively large-capacity capacitor may be connected to the power supply circuit. To support a large capacitance within a limited mounting area, a multilayer ceramic capacitor (MLCC) may be considered. However, as the voltage across the MLCC capacitor changes, the capacitor may be physically deformed, and the PCB on which the MLCC capacitor is placed may vibrate. This physical deformation and vibration may cause audible noise. To reduce the resulting electric field while providing equal capacitance, a method of arranging multiple capacitors in parallel instead of a single large capacitor may be considered, but this may be disadvantageous in terms of cost and space. The multiple capacitors may be connected in parallel.

[0055] To alleviate the above-described problems, the present disclosure describes a circuit structure including capacitors connected to a power supply circuit (e.g., a first APT capacitor (259a), a second APT capacitor (259b)) and capacitors for other purposes (e.g., a decoupling capacitor connected to an RFFE module). Through a switching circuit (289) and capacitors electrically arranged in parallel in the circuit structure, a supply voltage according to an APT (e.g., a second supply voltage (254) from a second power supply circuit (252)) can be provided to a power amplifier for a high-output signal (e.g., a third PA (263) of a third RFFE module (243). While the supply voltage (254) according to an APT is provided to the third RFFE module (243) from the second power supply circuit (252), a plurality of capacitors can be electrically arranged in parallel through the operation of the switching circuit (289). Hereinafter, the present disclosure describes an example in which a supply voltage (e.g., a second supply voltage (254)) according to APT is provided to the third RFFE module (243) from the second power supply circuit (252), but the embodiments of the present disclosure are not limited thereto. The first power supply circuit (251) can also provide a supply voltage (253) according to APT, and the embodiments of the present disclosure described below can also be applied to high-output operation of the fourth RFFE module (244).

[0056] FIG. 3 illustrates an example of the operation of a switching circuit (e.g., a switching circuit (289)) within an RFFE module (e.g., a first RFFE module (241)) for signal transmission in a designated frequency band. In FIG. 3, a circuit structure including capacitors electrically arranged in parallel according to the operation of the switching circuit (289) is described. The same reference numbers may be used for the same description.

[0057] Referring to FIG. 3, the electronic device (101) may include a first power supply circuit (251) and a second power supply circuit (252). For example, the first power supply circuit (251) may provide a first supply voltage (253) based on an APT. The electronic device (101) may include a first APT capacitor (361) and a first inductor (371). The buck converter circuit of the first power supply circuit (251) may be configured to output the first supply voltage (253) through the first inductor (371). In order to stably provide the first supply voltage (253) according to the APT, the first APT capacitor (361) may be connected to a path through which the first supply voltage (253) is output. For example, the second power supply circuit (252) may provide a second supply voltage (254) based on the APT. The electronic device (101) may include a second APT capacitor (362) and a second inductor (372). The buck converter circuit of the second power supply circuit (252) may be configured to output a second supply voltage (254) through the second inductor (372). In order to stably provide the second supply voltage (254) according to the APT, the second APT capacitor (362) may be connected to a path through which the second supply voltage (254) is output.

[0058] The electronic device (101) may include RFFE modules. For example, the electronic device (101) may include a first RFFE module (241), a second RFFE module (242), a third RFFE module (243), and / or a fourth RFFE module (244). The first RFFE module (241) may include a first PA (261). The second RFFE module (242) may include a second PA (262). The third RFFE module (243) may include a third PA (263). The fourth RFFE module (244) may include a fourth PA (264).

[0059] The electronic device (101) may supply a first supply voltage (253) or a second supply voltage (254) to the first PA (261) of the first RFFE module (241) to drive the first PA (261). The electronic device (101) may provide the first supply voltage (253) or the second supply voltage (254) to the first PA (261) through a switching circuit (289) and a power path (299). As a non-limiting example, the first RFFE module (241) may be configured to process signals in a frequency band of a first frequency range. As an example, the first frequency range may include a frequency band of a high frequency band (e.g., an ultra-high band (UHB) of about 3.4 GHz or higher).

[0060] The electronic device (101) may supply the first supply voltage (253) or the second supply voltage (254) to the second PA (262) of the second RFFE module (242) to drive the second PA (262). The electronic device (101) may provide the first supply voltage (253) or the second supply voltage (254) to the second PA (262) through the switching circuit (289) and the power path (299). As a non-limiting example, the second RFFE module (242) may be configured to process signals in a frequency band of a first frequency range. As an example, the first frequency range may include a high band (e.g., UHB of about 3.4 GHz or higher).

[0061] The electronic device (101) may supply a second supply voltage (254) to the third PA (263) of the third RFFE module (243) for driving the third PA (263). As a non-limiting example, the third RFFE module (243) may be configured to process signals in a frequency band of a second frequency range. As an example, the second frequency range may include a low band (e.g., a low-band (LB) of less than about 1 GHz, a GSM frequency band).

[0062] The electronic device (101) may supply the first supply voltage (253) to the fourth PA (264) of the fourth RFFE module (244) for driving the fourth PA (264). As a non-limiting example, the fourth RFFE module (244) may be configured to process signals in a frequency band between the first frequency range and the second frequency range. As an example, the frequency band may include a mid-band (e.g., a frequency band of about 1 GHz or more and less than about 2.3 GHz) and a high-band (e.g., a frequency band of about 2.3 GHz or more).

[0063] The electronic device (101) can control the switching circuit (289) to selectively connect the first path (291) or the second path (292) to the power path (299). For example, the switching circuit (289) can provide a first supply voltage (253) from the first power supply circuit (251) to one of the power amplifiers (e.g., the first PA (261), the second PA (262)) connected to the power path (299) under the control of the processor (210) or the RF transceiver (220). For example, the switching circuit (289) can provide a second supply voltage (254) from the second power supply circuit (252) to one of the power amplifiers (e.g., the first PA (261), the second PA (262)) connected to the power path (299) under the control of the processor (210) or the RF transceiver (220). For example, the switching circuit (289) may not electrically connect the power path (299) to both the first path (291) and the second path (292) under the control of the processor (210) or the RF transceiver (220). A state in which the power path (299) is not connected to any path may be referred to as an isolated state, a neutral state, a parked state, and / or equivalent technical terms.

[0064] According to embodiments of the present disclosure, the switching circuit (289) may be configured to electrically connect the second path (292) and the power path (299) even if the second supply voltage (254) is not provided to any of the power amplifiers (e.g., the first PA (261), the second PA (262)) connected to the power path (299). The switching circuit (289) may be configured to electrically connect the second path (292) and the power path (299) while the power amplifiers (e.g., the first PA (261), the second PA (262)) connected to the power path (299) are deactivated and signals (e.g., the third transmission signal (233)) are amplified via the third PA (263). Even if the power path (299) is connected to the second path (292), since all power amplifiers connected to the power path (299) are deactivated, it can be understood that the second supply voltage (254) is not applied to each power amplifier through the power path (299). With respect to the path from the second power supply circuit (252) to the third RFFE module (243), the first capacitor (351), the second capacitor (352), the third capacitor (353) and the second APT capacitor (362) described below can be arranged in parallel.

[0065] Signals amplified through the third PA (262) may be transmitted in a designated frequency band (e.g., a GSM frequency band, a frequency band for satellite communication, a frequency band with power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band with PC 2 among LTE frequency bands or NR frequency bands, etc.). For example, the designated frequency band may refer to a frequency band that requires a transmission power higher than a certain standard. As a non-limiting example, when the third PA (262) is amplified to transmit a signal of another frequency band supported by the third RFFE module (243) (e.g., a low band of LTE, NR), the electronic device (101) may control the switching circuit (289) to operate in an isolated state or to be connected to the first power supply circuit (251). Since the transmission power required in the other frequency band is lower than the transmission power in the designated frequency band, a relatively small capacitance may be required for the supply voltage according to the APT. In other words, since the transmission power required in the above-mentioned frequency band is higher than the transmission power required in the other frequency bands, a relatively large capacitance may be required.

[0066] The electronic device (101) may include at least one capacitor. The electronic device (101) may include a first APT capacitor (361) and a second APT capacitor (362) for providing a supply voltage according to an APT. The electronic device (101) may include decoupling capacitors for the RFFE module. For example, the electronic device (101) may include a first capacitor (351), a second capacitor (352), a third capacitor (353), a fourth capacitor (354), and a fifth capacitor (355). The first capacitor (351) may be connected to a path (e.g., a second path (292)) from the second power supply circuit (252) to the first RFFE module (241) to remove noise from a DC signal to be supplied from the second power supply circuit (252) to the first PA (261). The first capacitor (351) may be referred to as a bypass capacitor or a decoupling capacitor. The second capacitor (352) is connected to the output voltage port (V) of the first RFFE module (241) to remove noise from the DC signal to be supplied to the second PA (262) of the second RFFE module (242). out) may be connected to a path (e.g., power path (299)) from the first power supply circuit (251) to the second RFFE module (242). The second capacitor (352) may be referred to as a bypass capacitor or a decoupling capacitor. The third capacitor (353) may be connected to a path to the third RFFE module (243) to remove noise from a DC signal to be supplied to the third PA (263) of the third RFFE module (243). The third capacitor (353) may be referred to as a bypass capacitor or a decoupling capacitor. The fourth capacitor (354) may be connected to a path (e.g., the first path (291)) from the first power supply circuit (251) to the first RFFE module (241) to remove noise from a DC signal to be supplied to the first PA (261) of the first RFFE module (241). The fourth capacitor (354) may be referred to as a bypass capacitor or a decoupling capacitor. The fifth capacitor (355) may be connected to the path to the fourth RFFE module (244) to remove noise from the DC signal to be supplied to the fourth PA (264) of the fourth RFFE module (244). The fifth capacitor (355) may be referred to as a bypass capacitor or a decoupling capacitor.

[0067] According to embodiments of the present disclosure, when the electronic device (101) transmits a signal of a designated frequency band (e.g., a GSM frequency band, a frequency band for satellite communication, a frequency band of power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band of PC 2 among LTE frequency bands or NR frequency bands, etc.) through the third RFFE module (243), the switching circuit (289) may be controlled so that a plurality of capacitors are arranged in parallel on a path from the second power supply circuit (252) to the third RFFE module (243). In order to provide a supply voltage according to the APT, a capacitor may be required to stably maintain the supply voltage. Since signals of higher output consume more current, a large capacitance may be required. In the present disclosure, the above-described requirements may be satisfied through the composite capacitance of capacitors arranged in parallel. When the electronic device (101) intends to transmit a signal of the specified frequency band through the third RFFE module (243), the electronic device (101) can control the switching circuit (289) so that the power path (299) and the second path (292) are electrically connected. When the electronic device (101) intends to transmit a signal of the specified frequency band through the third RFFE module (243), the electronic device (101) can deactivate all of the power amplifiers (e.g., the first PA (261) and the second PA (262)) connected to the power path (299). For example, the electronic device (101) can deactivate the first PA (261) and the second PA (262) through the first MIPI signal (231) of FIG. 2. As each power amplifier is deactivated, it can be understood that no supply voltage is applied to each power amplifier through the power path (299).Therefore, for the path from the second power supply circuit (252) to the third RFFE module (243), the first capacitor (351), the second capacitor (352), the third capacitor (353) and the second APT capacitor (362) can be electrically arranged in parallel.

[0068] The second supply voltage (254) based on the APT from the second power supply circuit (252) provided to the third RFFE module (243) may be affected by the composite capacitance of the first capacitor (351), the second capacitor (352), the third capacitor (353), and the second APT capacitor (362). For example, if it is assumed that only the second APT capacitor (362) is connected to the path to the third RFFE module (243) when the supply voltage according to the APT is provided for the third PA (263) of the third RFFE module (243), the second APT capacitor (362) may be required to have a capacitance greater than a certain size (e.g., about 4.7 uF). However, the capacitors arranged for the RFFE modules may be electrically connected in parallel through the connection of the switching circuit (289) and the deactivation of the power amplifiers. Through this, even if the second APT capacitor (362) has a capacity smaller than 4.7 uF, the second supply voltage (254) according to the APT can be stably provided to the third RFFE module (243). The composite capacitance of the first capacitor (351), the second capacitor (352), the third capacitor (353), and the second APT capacitor (362) can have a capacity greater than a certain size to maintain the second supply voltage (254) according to the APT. The electronic device (101) according to embodiments of the present disclosure can control the switching circuit (289) so that the power path (299) and the second power supply circuit (252) are electrically connected while signals of the specified frequency band are transmitted through the third RFFE module (243) and all power amplifiers connected to the power path (299) are deactivated. As the power path (299) and the second power supply circuit (252) are connected, the synthetic capacitance can be provided in the path from the second power supply circuit (252) to the third RFFE module (243).

[0069] The third RFFE module (243) can support multiple frequency bands. Among the multiple frequency bands, a frequency band requiring high power (e.g., a GSM frequency band, a frequency band for satellite communication, a frequency band with power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band with PC 2 among LTE frequency bands or NR frequency bands, etc.) may consume a lot of current, and thus, a large capacitance may be required. According to one embodiment, a frequency band other than the frequency band requiring high power supported by the third RFFE module (243) may be used for dual connection. Since the third RFFE module (243) receives power from the second power supply circuit (252) through a separate path other than the power path (299), the power amplifiers of other RFFE modules (e.g., the first RFFE module (241), the second RFFE module (242)) connected to the power path (299) may be activated. A power amplifier of another RFFE module connected to the power path (299) (e.g., an activated one of the connected power amplifiers) can receive a supply voltage through the first power supply circuit (251). Accordingly, a frequency band supported by the first RFFE module (241), a frequency band supported by the second RFFE module (242), or a frequency band supported by the fourth RFFE module (244) (e.g., in that case, the switching circuit (289) is in an isolated state), and the other frequency band supported by the third RFFE module (243) can be used for DC.

[0070] Although examples of capacitors being connected to wiring to each RFFE module are described in FIG. 3, the circuit structure illustrated in FIG. 3 is merely exemplary and should not be construed as limiting the embodiments of the present disclosure. For example, the first capacitor (351) for the first RFFE module (241) is illustrated as one capacitor, but in reality, multiple capacitors are arranged, and can be understood as an equivalent circuit for the multiple capacitors. For example, the second capacitor (352) for the second RFFE module (242) is illustrated as one capacitor, but in reality, multiple capacitors are arranged, and can be understood as an equivalent circuit for the multiple capacitors. For example, the third capacitor (353) for the third RFFE module (243) is illustrated as one capacitor, but in reality, multiple capacitors are arranged, and can be understood as an equivalent circuit for the multiple capacitors.

[0071] In other words, the circuit structure illustrated through FIG. 3 or the drawings below referring to FIG. 3 is merely an example to explain that at least one capacitor connected to the power path (299) is electrically connected to the second path (292) and the power path (299) connected through the switching circuit (289) with a capacitor connected to the second path (292) or a node on the second path (292) and a path on the third RFFE module (243). Therefore, the number of capacitors illustrated in each drawing or the positions of the capacitors are not to be construed as limiting the embodiments of the present disclosure. Each capacitor may be divided into multiple capacitors, or at least some of the illustrated capacitors may be implemented as one capacitor.

[0072] FIG. 4 illustrates an example of the operation of a switching circuit within a power supply module for signal transmission in a specified frequency band. In FIG. 4, a circuit structure is described in which power supply circuits (e.g., a first power supply circuit (251), a second power supply circuit (252)) are included in one power supply module. Depending on the operation of the power supply module, a first supply voltage (253) and / or a second supply voltage (254) may be provided to RFFE modules (e.g., a first RFFE module (241), a second RFFE module (242), a third RFFE module (243), and / or a fourth RFFE module (244)). The same reference numerals may be used for the same description. The descriptions for FIG. 3 may be used for FIG. 4.

[0073] Referring to FIG. 4, the electronic device (101) may include a power supply module (450). The power supply module (450) may include a first power supply circuit (251) and a second power supply circuit (252). The electronic device (101) may include a first APT capacitor (361), a second APT capacitor (362), a third APT capacitor (436), a first inductor (371), and a second inductor (372). For example, the first power supply circuit (251) may provide a first supply voltage (253) based on an APT. A buck converter circuit of the first power supply circuit (251) may be configured to output the first supply voltage (253) through the first inductor (371). The first power supply circuit (251) may include a first APT switching circuit (481). The first APT switching circuit (481) may operate according to the control (e.g., MIPI signal) of the processor (210) and / or the RF transceiver (220) of the electronic device (101). In order to provide the first supply voltage (253) based on the APT, the first APT switching circuit (481) may be configured to connect the first APT capacitor (361) and the third APT capacitor (436). In order to stably provide the first supply voltage (253) according to the APT, the first APT capacitor (361) and the third APT capacitor (436) may be used. For example, the second power supply circuit (252) may provide the second supply voltage (254) based on the APT. The buck converter circuit of the second power supply circuit (252) may be configured to output the second supply voltage (254) through the second inductor (372). The second power supply circuit (252) may include a second APT switching circuit (482). The second APT switching circuit (482) may operate under control (e.g., MIPI signal) of the processor (210) and / or the RF transceiver (220) of the electronic device (101).In order to provide a second supply voltage (254) based on APT, the second APT switching circuit (482) may be configured to connect a second APT capacitor (362) and a third APT capacitor (436). In order to stably provide a second supply voltage (254) according to APT, the second APT capacitor (362) and the third APT capacitor (436) may be used.

[0074] The electronic device (101) may include RFFE modules. For example, the electronic device (101) may include a first RFFE module (241), a second RFFE module (242), a third RFFE module (243), and / or a fourth RFFE module (244). The first RFFE module (241) may include a first PA (261). The second RFFE module (242) may include a second PA (262). The third RFFE module (243) may include a third PA (263). The fourth RFFE module (244) may include a fourth PA (264). For each PA, reference may be made to the descriptions of the first PA (261), the second PA (262), the third PA (263), and the fourth PA (264) of FIG. 3.

[0075] The electronic device (101) may include at least one capacitor. The electronic device (101) may include a first APT capacitor (361), a second APT capacitor (362), and a third APT capacitor (436) for providing a supply voltage according to an APT. The electronic device (101) may include decoupling capacitors for an RFFE module. For example, the electronic device (101) may include a first capacitor (351), a second capacitor (352), a third capacitor (353), a fourth capacitor (354), and a fifth capacitor (355). For each capacitor, reference may be made to the description of the capacitors in FIG. 3.

[0076] The electronic device (101) may use capacitors arranged in parallel to provide a supply voltage according to the APT to a high-power power amplifier. This is because high-power signals consume more current, and thus may require a large capacitance. The electronic device (101) may control the switching circuit (289) so that the power path (299) and the second power supply circuit (252) are electrically connected while signals of a designated frequency band (e.g., GSM band) are transmitted through the third RFFE module (243) and all power amplifiers connected to the power path (299) are deactivated. The switching circuit (289) may operate according to the control (e.g., the first MIPI signal (231)) of the processor (210) and / or the RF transceiver (220) of the electronic device (101). As the power path (299) and the second power supply circuit (252) are connected, the synthetic capacitance can be provided in the path from the second power supply circuit (252) to the third RFFE module (243).

[0077] The electronic device (101) can control the power supply module (450) to generate a supply voltage (e.g., a second supply voltage (254)) based on the APT through the second power supply circuit (252) as well as the switching circuit (289). For example, the electronic device (101) can control the first APT switching circuit (481) and the second APT switching circuit (482) according to the control (e.g., MIPI signal) of the processor (210) and / or the RF transceiver (220). According to one embodiment, while a signal of a designated frequency band (e.g., a GSM frequency band, a frequency band for satellite communication, a frequency band having power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band having PC 2 among LTE frequency bands or NR frequency bands) is transmitted through the electronic third RFFE module (243), the first APT switching circuit (481) may be opened, and the second APT switching circuit (482) may connect the output path of the third APT capacitor (436) and the second power supply circuit (252). According to one embodiment, while signals of a designated frequency band (e.g., a GSM band, a frequency band for satellite communication, a frequency band with power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band with PC 2 among LTE frequency bands or NR frequency bands) are transmitted through the third RFFE module (243), and all power amplifiers connected to the power path (299) are deactivated, the first APT switching circuit (481) may be opened, and the second APT switching circuit (482) may connect the third APT capacitor (436) and the output path of the second power supply circuit (252).In one embodiment, while the third PA (263) is activated and all power amplifiers connected to the power path (299) are deactivated, the switching circuit (289) electrically connects the second path (292) and the power path (299), the first APT switching circuit (481) is opened, and the second APT switching circuit (482) can connect the third APT capacitor (436) and the output path of the second power supply circuit (252).

[0078] FIGS. 5A and 5B illustrate examples of the operation of a switching circuit (e.g., switching circuit (289)) within an RFFE module for signal transmission in a designated frequency band. In FIGS. 5A and 5B, a circuit structure is described in which additional RFFE modules are electrically connected to a power path (e.g., power path (299)), compared to FIG. 3. For a supply voltage according to APT, a synthetic capacitance may be provided through capacitors for the added RFFE modules, depending on the operation of the switching circuit (289). The same reference numbers may be used for the same description.

[0079] Referring to FIG. 5A, the electronic device (101) may include a first power supply circuit (251) and a second power supply circuit (252). For example, the first power supply circuit (251) may provide a first supply voltage (253) based on an APT. The second power supply circuit (252) may provide a second supply voltage (254) based on an APT. For the APT capacitors (the first APT capacitor (361), the second APT capacitor (362)), the inductors (the first inductor (371), the second inductor (372)), and the power supply circuits (e.g., the first power supply circuit (251) and the second power supply circuit (252)), the descriptions of FIG. 3 may be referred to.

[0080] The electronic device (101) may include RFFE modules. For example, the electronic device (101) may include a first RFFE module (241), a second RFFE module (242), a third RFFE module (243), a fourth RFFE module (244), and a fifth RFFE module (545). The first RFFE module (241) may include a first PA (261). The second RFFE module (242) may include a second PA (262). The third RFFE module (243) may include a third PA (263). The fourth RFFE module (244) may include a fourth PA (264). For each PA, reference may be made to the descriptions of the first PA (261), the second PA (262), the third PA (263), and the fourth PA (264) of FIG. 3. The fifth RFFE module (545) may include a fifth PA (565). The electronic device (101) may supply a first supply voltage (253) or a second supply voltage (254) to the fifth PA (565) of the fifth RFFE module (545) to drive the fifth PA (565). The electronic device (101) may provide the first supply voltage (253) or the second supply voltage (254) to the fifth PA (565) through a switching circuit (289) and a power path (299). As a non-limiting example, the fifth RFFE module (545) may be configured to process signals in a frequency band for EN (EUTRA-NR)-DC (dual connectivity).

[0081] As described above, the electronic device (101) according to embodiments of the present disclosure can control the switching circuit (289) to selectively connect the first path (291) or the second path (292) to the power path (299). For example, the switching circuit (289) can provide the first supply voltage (253) from the first power supply circuit (251) to one of the power amplifiers (e.g., the first PA (261), the second PA (262), and the fifth PA (565)) connected to the power path (299) under the control of the processor (210) or the RF transceiver (220). For another example, the switching circuit (289) may, under the control of the processor (210) or the RF transceiver (220), provide the second supply voltage (254) from the second power supply circuit (252) to one of the power amplifiers (e.g., the first PA (261), the second PA (262), the fifth PA (565)) connected to the power path (299). For another example, the switching circuit (289) may not electrically connect the power path (299) to both the first path (291) and the second path (292) under the control of the processor (210) or the RF transceiver (220).

[0082] According to embodiments of the present disclosure, the switching circuit (289) may be configured to electrically connect the second path (292) and the power path (299) even if the second supply voltage (254) is not provided to any of the power amplifiers (e.g., the first PA (261), the second PA (262), and the fifth PA (565)) connected to the power path (299). The switching circuit (289) may be configured to electrically connect the second path (292) and the power path (299) while the power amplifiers (e.g., the first PA (261), the second PA (262), and the fifth PA (565)) connected to the power path (299) are deactivated and signals (e.g., the third transmission signal (233)) are amplified via the third PA (263). The electronic device (101) may include at least one capacitor. The electronic device (101) may include decoupling capacitors for the RFFE module. For example, the electronic device (101) may include a first capacitor (351), a second capacitor (352), a third capacitor (353), a fourth capacitor (354), a fifth capacitor (355), and a sixth capacitor (555). The sixth capacitor (555) is connected to an output voltage port (V) of the first RFFE module (241) to remove noise from a DC signal to be supplied to a fifth PA (565) of the fifth RFFE module (545). out ) may be connected to a path (e.g., power path (299)) from the fifth RFFE module (545). The sixth capacitor (555) may be referred to as a bypass capacitor or a decoupling capacitor.

[0083] According to embodiments of the present disclosure, when the electronic device (101) transmits a signal of a designated frequency band (e.g., a GSM frequency band, a frequency band for satellite communication, a frequency band of power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band of PC 2 among LTE frequency bands or NR frequency bands, etc.) through the third RFFE module (243), the electronic device (101) may control the switching circuit (289) so that a plurality of capacitors are arranged in parallel on the path from the second power supply circuit (252) to the third RFFE module (243). When the electronic device (101) intends to transmit a signal of the designated frequency band through the third RFFE module (243), the electronic device (101) may deactivate all of the first PA (261), the second PA (262), and the fifth PA (565) connected to the power path (299). For example, the electronic device (101) can control the first RFFE module (241), the second RFFE module (242), and the fifth RFFE module (545) through the same MIPI signal. The PA of each RFFE module can be deactivated through the MIPI signal. Therefore, for the path from the second power supply circuit (252) to the third RFFE module (243), the first capacitor (351), the second capacitor (352), the third capacitor (353), and the sixth capacitor (555) can be electrically arranged in parallel. By arranging not only the three capacitors but also the sixth capacitor (555) for the fifth RFFE module (545) in parallel, a larger capacitance for the APT can be secured.

[0084] Referring to FIG. 5B, the electronic device (101) may include a first power supply circuit (251) and a second power supply circuit (252). For example, the first power supply circuit (251) may provide a first supply voltage (253) based on an APT. The second power supply circuit (252) may provide a second supply voltage (254) based on an APT. For the APT capacitors (the first APT capacitor (361) and the second APT capacitor (362)), the inductors (the first inductor (371) and the second inductor (372)), and the power supply circuits (e.g., the first power supply circuit (251) and the second power supply circuit (252)), the descriptions of FIG. 3 may be referred to.

[0085] The electronic device (101) may include RFFE modules. For example, the electronic device (101) may include a first RFFE module (241), a second RFFE module (242), a third RFFE module (243), a fourth RFFE module (244), a fifth RFFE module (545), and a sixth RFFE module (546). The first RFFE module (241) may include a first PA (261). The second RFFE module (242) may include a second PA (262). The third RFFE module (243) may include a third PA (263). The fourth RFFE module (244) may include a fourth PA (264). The fifth RFFE module (545) may include a fifth PA (565). The sixth RFFE module (546) may include a sixth PA (566). For each PA, reference may be made to the descriptions of the first PA (261), the second PA (262), the third PA (263), and the fourth PA (264) of FIG. 3 and the descriptions of the fifth PA (565) of FIG. 5A. The electronic device (101) may supply the first supply voltage (253) or the second supply voltage (254) to the sixth PA (566) of the sixth RFFE module (546) to drive the sixth PA (566). The electronic device (101) may provide the first supply voltage (253) or the second supply voltage (254) to the sixth PA (566) via the switching circuit (289) and the power path (299). As a non-limiting example, the sixth RFFE module (546) may be configured to process signals in a low frequency band (e.g., a frequency band less than about 1 GHz) among the frequency bands for EN-DC.

[0086] As described above, the electronic device (101) according to embodiments of the present disclosure can control the switching circuit (289) to selectively connect the first path (291) or the second path (292) to the power path (299). For example, the switching circuit (289) can provide the first supply voltage (253) from the first power supply circuit (251) to one of the power amplifiers (e.g., the first PA (261), the second PA (262), the fifth PA (565), and the sixth PA (566)) connected to the power path (299) under the control of the processor (210) or the RF transceiver (220). For another example, the switching circuit (289) may, under the control of the processor (210) or the RF transceiver (220), provide the second supply voltage (254) from the second power supply circuit (252) to one of the power amplifiers (e.g., the first PA (261), the second PA (262), the fifth PA (565), and the sixth PA (566)) connected to the power path (299). For another example, the switching circuit (289) may not electrically connect the power path (299) to both the first path (291) and the second path (292) under the control of the processor (210) or the RF transceiver (220).

[0087] According to embodiments of the present disclosure, the switching circuit (289) may be configured to electrically connect the second path (292) and the power path (299) even if the second supply voltage (254) is not provided to any of the power amplifiers (e.g., the first PA (261), the second PA (262), the fifth PA (565), and the sixth PA (566)) connected to the power path (299). The switching circuit (289) may be configured to electrically connect the second path (292) and the power path (299) while the power amplifiers (e.g., the first PA (261), the second PA (262), the fifth PA (565), and the sixth PA (566)) connected to the power path (299) are deactivated and signals (e.g., the third transmission signal (233)) are amplified via the third PA (263). The electronic device (101) may include at least one capacitor. The electronic device (101) may include decoupling capacitors for the RFFE module. For example, the electronic device (101) may include a first capacitor (351), a second capacitor (352), a third capacitor (353), a fourth capacitor (354), a fifth capacitor (355), a sixth capacitor (555), and a seventh capacitor (556). The seventh capacitor (557) is connected to the output voltage port (V) of the first RFFE module (241) to remove noise from a DC signal to be supplied to the sixth PA (566) of the sixth RFFE module (546). out ) may be connected to a path (e.g., power path (299)) from the sixth RFFE module (546). The seventh capacitor (556) may be referred to as a bypass capacitor or a decoupling capacitor.

[0088] According to embodiments of the present disclosure, when the electronic device (101) transmits a signal of a designated frequency band (e.g., a GSM frequency band, a frequency band for satellite communication, a frequency band of power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band of PC 2 among LTE frequency bands or NR frequency bands, etc.) through the third RFFE module (243), the electronic device (101) may control the switching circuit (289) so that a plurality of capacitors are arranged in parallel on the path from the second power supply circuit (252) to the third RFFE module (243). When the electronic device (101) intends to transmit a signal of the designated frequency band through the third RFFE module (243), the first PA (261), the second PA (262), the fifth PA (565), and the sixth PA (566) connected to the power path (299) may all be deactivated. For example, the electronic device (101) can control the first RFFE module (241), the second RFFE module (242), the fifth RFFE module (545), and the sixth RFFE module (546) through the same MIPI signal. The PA of each RFFE module can be deactivated through the MIPI signal. Therefore, for the path from the second power supply circuit (252) to the third RFFE module (243), the first capacitor (351), the second capacitor (352), the third capacitor (353), the sixth capacitor (555), and the seventh capacitor (557) can be electrically arranged in parallel. Since all of the capacitors connected to the power path (e.g., the second capacitor (352), the sixth capacitor (555), and the seventh capacitor (557)) are arranged in parallel, a larger capacitance for the supply voltage according to the APT can be secured.

[0089] Although individual power supply circuits are described in FIGS. 5A and 5B , embodiments of the present disclosure are not limited thereto. Instead of the first power supply circuit (251) and the second power supply circuit (252) individually arranged in FIGS. 5A and 5B , a power supply module (450) including the first power supply circuit (251) and the second power supply circuit (252) may be arranged. In this case, in the circuit structure of FIGS. 5A and 5B , the operations of the electronic device (101) for controlling the power supply module (450) described in FIG. 4 may be additionally performed. For example, while the third PA (263) for a designated frequency band (e.g., a GSM band, a frequency band for satellite communication, a frequency band with power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band with PC 2 among LTE frequency bands or NR frequency bands, etc.) is activated and all power amplifiers connected to the power path (299) are deactivated, the electronic device (101) may control the switching circuit (289) to electrically connect the second path (292) and the power path (299), control the first APT switching circuit (481) to open the first APT switching circuit (481), and control the second APT switching circuit (482) to connect the third APT capacitor (436) and the output path of the second power supply circuit (252). For example, a frequency band (e.g., PC (power class) 1 among GSM bands, frequency bands for satellite communication, LTE frequency bands, or NR frequency bands) specified through the third RFFE module (243).While signals of the 5-band frequency band, LTE frequency bands, or NR frequency bands (such as the PC 2-band frequency band) are transmitted and all power amplifiers connected to the power path (299) are deactivated, the electronic device (101) can control the switching circuit (289) to electrically connect the second path (292) and the power path (299), control the first APT switching circuit (481) to open the first APT switching circuit (481), and control the second APT switching circuit (482) to connect the third APT capacitor (436) and the output path of the second power supply circuit (252).

[0090] In FIGS. 5A and 5B , the third RFFE module (243) may support multiple frequency bands. Among the multiple frequency bands, a frequency band requiring high power (e.g., a GSM frequency band, a frequency band for satellite communication, a frequency band with power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band with PC 2 among LTE frequency bands or NR frequency bands, etc.) may consume a lot of current, and thus, a large capacitance may be required. According to one embodiment, a frequency band other than the frequency band requiring high power supported by the third RFFE module (243) may be used for dual connectivity. Since the third RFFE module (243) receives power from the second power supply circuit (252) through a separate path other than the power path (299), the power amplifiers of other RFFE modules (e.g., the first RFFE module (241), the second RFFE module (242), the fifth RFFE module (545), and the sixth RFFE module (546)) connected to the power path (299) can be activated. The power amplifiers of other RFFE modules connected to the power path (299) (e.g., an activated one of the connected power amplifiers) can receive the supply voltage through the first power supply circuit (251). Accordingly, the frequency band supported by the first RFFE module (241), the frequency band supported by the second RFFE module (242), the frequency band supported by the fifth RFFE module (545), the frequency band supported by the sixth RFFE module (546), or the frequency band supported by the fourth RFFE module (244) (e.g., in that case, the switching circuit (289) is in an isolated state) and the other frequency band supported by the third RFFE module (243) can be used for DC.

[0091] Although examples of connecting capacitors to wiring to each RFFE module are described in FIGS. 5A and 5B, the circuit structures shown are merely exemplary and are not to be construed as limiting embodiments of the present disclosure. For example, the sixth capacitor (555) for mitigating noise components from entering the fifth RFFE module (545) and the seventh capacitor (556) for mitigating noise components from entering the sixth RFFE module (546) are shown as being connected to the power path (299). However, at least one of the capacitors connected to the power path (299) (e.g., the second capacitor (352), the sixth capacitor (555), and the seventh capacitor (556)) may be implemented as a single capacitor, and the single capacitor may be arranged closer to the first RFFE module (241) than to each of the second RFFE module (242), the fifth RFFE module (545), and the sixth RFFE module (546).

[0092] In other words, the circuit structure illustrated through FIGS. 3 to 5b is merely an example to explain that at least one capacitor connected to the power path (299) is electrically synthesized with a capacitor connected to the second path (292) or a node on the second path (292) and a path on the third RFFE module (243) through the second path (292) and the power path (299) connected through the switching circuit (289), and the number of capacitors or the positions of the capacitors are not construed as limiting the embodiments of the present disclosure. Each capacitor may be divided into multiple capacitors, or at least some of the illustrated capacitors may be implemented as one capacitor.

[0093] Fig. 6 illustrates an operational flow of an electronic device (e.g., electronic device (101)) for transmitting a signal in a designated frequency band. The designated frequency band may be a frequency band that requires a relatively higher output (e.g., about 10 dB or more) than frequency bands in other RFFE modules. As an example, the designated frequency band may be a GSM frequency band. In the structure exemplified through Figs. 3 to 5b, it is assumed that the third RFFE module (243) is configured to process signals in the designated frequency band.

[0094] Referring to FIG. 6, in operation (601), the electronic device (101) can deactivate PAs (e.g., the first PA (261), the second PA (262) of FIG. 3) connected to a power path (e.g., the power path (299)) and activate a designated PA (e.g., the third PA (263)) connected to a second power supply circuit (e.g., the second power supply circuit (252)). The power path can be connected to a switching circuit (e.g., the switching circuit (289)) of an RFFE module (e.g., the first RFFE module (241)) of the electronic device (101). Branches of the power path can be used to transmit a supply voltage to the PAs (e.g., the first PA (261), the second PA (262) of FIG. 3). A supply voltage of a first power supply circuit (e.g., the first power supply circuit (251)) or a second power supply circuit (e.g., the second power supply circuit (252)) may be provided to one of the PAs. When one of the PAs is activated, the remaining PA(s) may be deactivated. When the electronic device (101) wants to transmit a signal through the designated PA, it may deactivate all PAs connected to the power path. The designated PA may be configured to amplify signals of a designated frequency band (e.g., a GSM band, a frequency band for satellite communication, a frequency band of power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band of PC 2 among LTE frequency bands or NR frequency bands, etc.). The designated PA may be a PA that is connected to the second power supply circuit and not connected to the power path. The second power supply circuit may be configured to provide a supply voltage according to an APT. This is to prevent the supply voltage (e.g., the second supply voltage (254)) by the second power supply circuit from being provided to any of the PAs connected to the power path, even if the power path is electrically connected to the second power supply circuit for the parallel arrangement of capacitors described below.

[0095] In operation (603), the electronic device (101) may control a switching circuit (e.g., a switching circuit (289)) to connect a second power supply circuit (e.g., a second power supply circuit (252)) to the power path while the PAs (e.g., the first PA (261) and the second PA (262) of FIG. 3) connected to the power path (e.g., the power path (299)) are deactivated and a designated PA (e.g., the third PA (263)) is activated. The switching circuit may be configured to electrically connect the first power supply circuit and the second power supply circuit to one of a plurality of PAs connected to the power path. For example, the electronic device (101) may provide a first supply voltage (253) from the first power supply circuit (251) or a second supply voltage (254) from the second power supply circuit (252) to one of the plurality of PAs via the power path (299). When one of the above PAs is activated, a first supply voltage (253) or a second supply voltage (254) may be provided to the activated PA. According to one embodiment, the electronic device (101) may connect the power path (299) and the second path (292) through the switching circuit (289) even if a plurality of PAs connected to the power path (299) are deactivated. The electronic device (101) may include decoupling capacitors for RFFE modules connected to the power path. The electronic device (101) may utilize the decoupling capacitor for the RFFE module of the inactivated PA as a part of the APT capacitor. The power path may be electrically connected to the second power supply circuit through the switching circuit (289). At this time, as the PAs of the RFFE modules connected to the power path are deactivated, the capacitors arranged for the RFFE modules may be electrically arranged in parallel.

[0096] In operation (605), the electronic device (101) may transmit a signal through a designated PA (e.g., a third PA (263)). The electronic device (101) may provide a supply voltage (e.g., a second supply voltage (254)) according to an APT to the designated PA. The supply voltage may be affected by the capacitance of capacitors connected on an electrical path from the second power supply circuit to the designated PA. A higher output signal may require a higher capacitance to maintain a stable voltage. As the PAs connected to the power path are deactivated and the power path is electrically connected to the second power supply circuit, the capacitors arranged in parallel may be electrically combined. As the capacitors are electrically combined, a high capacitance may be provided.

[0097] Fig. 7 illustrates an operational flow of an electronic device (e.g., electronic device (101)) for transmitting a signal in a designated frequency band. The designated frequency band may be a frequency band that requires a relatively higher output (e.g., about 10 dB or more) than the frequency bands of other RFFE modules. As an example, the designated frequency band may be a GSM frequency band. In the structure exemplified through Fig. 4, it is assumed that the third RFFE module (243) is configured to process signals in the designated frequency band.

[0098] Referring to FIG. 7, in operation (601), the electronic device (101) can deactivate PAs (e.g., the first PA (261) and the second PA (262) of FIG. 3) connected to a power path (e.g., the power path (299)) and activate a designated PA connected to a second power supply circuit (e.g., the second power supply circuit (252)). The electronic device (101) may include a power supply module (e.g., the power supply module (450) of FIG. 4). The power supply module (450) may include a plurality of power supply circuits. A supply voltage from one of the plurality of power supply circuits may be provided to one of the PAs. The designated PA may be connected to the second power supply circuit among the plurality of power supply circuits. When the electronic device (101) intends to transmit a signal through the designated PA, it may deactivate all PAs connected to the power path. The above-mentioned designated PA may be configured to amplify signals of a designated frequency band (e.g., a GSM band, a frequency band for satellite communication, a frequency band of power class (PC) 1.5 among LTE frequency bands or NR frequency bands, a frequency band of PC 2 among LTE frequency bands or NR frequency bands, etc.). The above-mentioned designated PA may be a PA that is connected to the second power supply circuit and is not connected to the power path. The second power supply circuit may be configured to provide a supply voltage according to the APT. This is to prevent a supply voltage (e.g., a second supply voltage (254)) by the second power supply circuit from being provided to any of the PAs connected to the power path, even if the power path is electrically connected to the second power supply circuit for the parallel arrangement of capacitors described below.

[0099] In operation (703), the electronic device (101) may control a power supply module (e.g., a power supply module (450)) so that a supply voltage (e.g., a second supply voltage (254)) is provided through a second power supply circuit (e.g., a second power supply circuit (252)) among a plurality of power supply circuits. When the electronic device (101) intends to transmit a signal through the designated PA, the electronic device (101) may control the power supply module so that a supply voltage according to the APT is provided through the second power supply circuit. The power supply module may include an APT switching circuit. The APT switching circuit may be configured to electrically connect an APT capacitor to an output path of a buck converter circuit in order to stably maintain a supply voltage according to the APT when operating in the APT mode. According to one embodiment, the electronic device (101) may operate the APT switching circuit so that a supply voltage according to the APT is provided through the second power supply circuit. For example, the power supply module (450) may include a first APT switching circuit (481) for the first power supply circuit (251) and a second APT switching circuit (482) for the second power supply circuit (252). The electronic device (101) may control the second APT switching circuit (482) to open the first APT switching circuit (481) and connect an APT capacitor (e.g., a third APT capacitor (436)) to the output path of the second power supply circuit (252).

[0100] In operation (703), the electronic device (101) may control a switching circuit (e.g., switching circuit (289)) to connect a second power supply circuit (e.g., second power supply circuit (252)) to the power path while PAs (e.g., first PA (261), second PA (262) of FIG. 3) connected to the power path (e.g., power path (299)) are deactivated and a designated PA is activated. For operation (705), reference may be made to the descriptions of operation (603) of FIG. 6.

[0101] In operation (707), the electronic device (101) may transmit a signal through a designated PA. The electronic device (101) may provide a supply voltage (e.g., a second supply voltage (254)) according to the APT to the designated PA. The supply voltage may be affected by the capacitance of capacitors connected on the electrical path from the second power supply circuit to the designated PA. For operation (707), reference may be made to the descriptions of operation (605) of FIG. 6.

[0102] Although the present disclosure has been described as a typical example in which the switching circuit (289) is illustrated within the first RFFE module (241), embodiments of the present disclosure are not limited thereto. It may also be understood as an embodiment of the present disclosure that the switching circuit (289) is located outside the first RFFE module (241), and RFFE modules (e.g., the first RFFE module (241), the second RFFE module (242), the fifth RFFE module (545), and the sixth RFFE module (546)) are connected to a power path (299) connected to one end of the switching circuit (289).

[0103] An electronic device (e.g., electronic device (101)) according to embodiments of the present disclosure can control a switching circuit (e.g., switching circuit (289)) so that capacitors of RFFE modules are arranged in parallel to provide a supply voltage according to an APT mode for transmitting a high-output signal in a designated frequency band, and can deactivate PAs connected to a power path (e.g., power path (299)). Through this, capacitors can be utilized without mounting or arranging additional capacitors. In addition, since a high-capacity capacitor (e.g., MLCC capacitor) is not required to supply voltage based on APT, audible noise can be eliminated.

[0104] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0105] In embodiments, an electronic device (101) is provided. The electronic device (101) comprises a processor (210) including one or more processing circuits, an RF (radio frequency) transceiver (220), a first power supply circuit (251), a second power supply circuit (252) configured to provide a supply voltage based on average power tracking (APT), a switching circuit (289) for electrically selectively connecting one of the first power supply circuit (251) and the second power supply circuit (252) to a power path (299), a first RFFE (radio frequency front end) module including a first power amplifier (261) connected to the power path (299), a second RFFE module (242) including a second power amplifier (262) connected to the power path (299), a third RFFE module (243) including a third power amplifier (263) connected to the second power supply circuit (252), and at least one capacitor connected to the second power supply circuit (252), and the power It may include at least one capacitor connected to the path (299). The switching circuit (289) may be configured to connect the power path (299) and the second power supply circuit (252) while the power amplifiers, including the first power amplifier (261) and the second power amplifier (262), connected to the power path (299) are deactivated and signals are transmitted through the third power amplifier (263) connected to the second power supply circuit (252), according to the control of the processor (210) or the RF transceiver (220).

[0106] For example, the first power supply circuit (251) and the second power supply circuit (252) may be included in a power supply module (450). The power supply module (450) may be configured to connect a capacitor for the APT to the second power supply circuit (252) while the power amplifiers connected to the power path (299) are deactivated and signals are transmitted through the third power amplifier (263) connected to the second power supply circuit (252) under the control of the processor (210) or the RF transceiver (220).

[0107] For example, the power supply module (450) may include a first APT switching circuit (481) for connecting the capacitor and the first buck converter circuit of the first power supply circuit (251) and a second APT switching circuit (482) for connecting the capacitor and the second buck converter circuit of the second power supply circuit (252). While the power amplifiers connected to the power path (299) are deactivated and signals are transmitted through the third power amplifier (263) connected to the second power supply circuit (252), the first APT switching circuit (481) may be opened and the second APT switching circuit (482) may be configured to connect the capacitor and the second buck converter circuit of the second power supply circuit (252).

[0108] For example, at least one capacitor connected to the second power supply circuit (252) may include a first capacitor connected to a path between the second power supply circuit (252) and the first RFFE module, and a third capacitor connected to a path between the second power supply circuit (252) and the third RFFE module (243). The at least one capacitor connected to the power path (299) may include a second capacitor. The first capacitor, the second capacitor, and the third capacitor may be used to provide the supply voltage from the second power supply circuit (252) to the third RFFE module (243) based on the APT.

[0109] For example, the first capacitor may be used for decoupling for the first RFFE module. The second capacitor may be used for decoupling for the second RFFE module (242). The third capacitor may be used for decoupling for the third RFFE module (243).

[0110] For example, the at least one capacitor connected to the second power supply circuit (252) and the at least one capacitor connected to the power path (299) may be arranged in parallel with respect to the electrical path between the second power supply circuit (252) and the third RFFE module (243) while the power amplifiers connected to the power path (299) are deactivated and signals are transmitted through the third power amplifier (263) connected to the second power supply circuit (252).

[0111] For example, the power path (299) may be configured to provide a supply voltage from the first power supply circuit (251) or the second power supply circuit (252) to one of the power amplifiers connected to the power path (299). A portion of the power path (299) may be disposed external to the first RFFE module and connected to the second RFFE module (242) via a voltage output port of the first RFFE module.

[0112] For example, the switching circuit (289) may be configured to connect the power path (299) and the second power supply circuit (252) while signals are transmitted through one of the power amplifiers connected to the power path (299) under the control of the processor (210) or the RF transceiver (220) and at least another power amplifier among the power amplifiers and the third power amplifier (263) are inactive. The switching circuit may be configured to connect the power path (299) and the first power supply circuit (251) or operate in isolation while the power amplifiers connected to the power path (299) and the third power amplifier (263) are inactive.

[0113] For example, the maximum power that can be output through the third power amplifier (263) may be higher than the maximum power that can be output through the first power amplifier (261) and may be higher than the maximum power that can be output through the second power amplifier (262).

[0114] For example, the third RFFE module (243) can be used to process the signals of the GSM (global system for mobile communications) band.

[0115] For example, the electronic device (101) may include a fourth RFFE module (244) including a fourth power amplifier connected to the first power supply circuit (251). The switching circuit (289) may be configured to connect the power path (299) and the first power supply circuit (251) while the fourth power amplifier is deactivated and signals are transmitted through one of the power amplifiers connected to the power path (299) under the control of the processor (210) or the RF transceiver (220).

[0116] For example, the electronic device (101) may include a fifth RFFE module including a fifth power amplifier connected to the power path (299), and a sixth RFFE module including a sixth power amplifier connected to the power path (299). The power amplifiers that are deactivated while the signals are transmitted through the third power amplifiers (263) may include the first power amplifier (261), the second power amplifier (262), the fifth power amplifier, and the sixth power amplifier.

[0117] For example, the third RFFE module (243) may be configured to process signals in a frequency band of a first frequency range. Each of the first RFFE module and the second RFFE module (242) may be configured to process signals in a frequency band of a second frequency range higher than the first frequency range. The fourth RFFE module (244) may be configured to process signals in a frequency band between the first frequency range and the second frequency range. Each of the fifth RFFE module and the sixth RFFE module may be configured to process signals in a frequency band for EN(EUTRA-NR)-DC(dual connectivity).

[0118] For example, the at least one capacitor connected to the second power supply circuit (252) may include a multilayer ceramic capacitor (MLCC).

[0119] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a processor (210) including one or more processing circuits, a radio frequency (RF) transceiver (220), a plurality of power supply circuits including a power supply circuit configured to provide a supply voltage based on average power tracking (APT), a first radio frequency front end (RFFE) module including a switching circuit (289) for electrically connecting one of the plurality of power supply circuits selectively to a power path (299), at least one second RFFE module (242) connected to the power path (299), a third RFFE module (243) connected to a path from the power supply circuit, at least one capacitor connected to the power supply circuit, and at least one capacitor connected to the power path (299). The switching circuit (289) may be configured to connect the power path (299) and the power supply circuit while the power amplifiers included in the first RFFE module and the at least one second RFFE module (242) are deactivated and signals are transmitted through the power amplifier of the third RFFE module (243) under the control of the processor (210) or the RF transceiver (220).

[0120] For example, the plurality of power supply circuits may be included in a power supply module (450). The power supply module (450) may be configured to connect a capacitor for the APT to the power supply circuit while the power amplifiers included in the first RFFE module and the at least one second RFFE module (242) are deactivated and signals are transmitted through the power amplifier of the third RFFE module (243) under the control of the processor (210) or the RF transceiver (220).

[0121] For example, at least one capacitor connected to the power supply circuit may include a first capacitor connected to a path between the power supply circuit and the first RFFE module and a third capacitor connected to a path between the power supply circuit and the third RFFE module (243). The at least one capacitor connected to the power path (299) may include a second capacitor. The first capacitor, the second capacitor, and the third capacitor may be used to provide the supply voltage from the power supply circuit to the third RFFE module (243) based on the APT.

[0122] For example, the at least one capacitor connected to the power supply circuit and the at least one capacitor connected to the power path (299) may be arranged in parallel with respect to the electrical path between the power supply circuit and the third RFFE module (243) while the power amplifiers connected to the power path (299) are deactivated and signals are transmitted through the third power amplifier (263) connected to the power supply circuit.

[0123] For example, the maximum power that can be output through the third power amplifier (263) may be higher than the maximum power that can be output through the first power amplifier (261) and may be higher than the maximum power that can be output through the second power amplifier (262).

[0124] For example, the third RFFE module (243) can be used to process the signals of the GSM (global system for mobile communications) band.

[0125] In embodiments, an electronic device (101) is provided. The electronic device (101) comprises a processor (210) including a processing circuit, an RF (radio frequency) transceiver (220), a first power supply circuit (251) configured to provide a first supply voltage based on APT (average power tracking), a second power supply circuit (252) configured to provide a second supply voltage based on APT, a switching circuit (289) for selectively connecting one of the first power supply circuit (251) and the second power supply circuit (252) to a power path (299), a first RFFE (radio frequency front end) module (241) including a first power amplifier (261) connected to the power path (299), a second RFFE module (242) including a second power amplifier (262) connected to the power path (299), a third RFFE module (243) including a third power amplifier (263) connected to the second power supply circuit (252), and the first RFFE It may include a first capacitor (351) connected to the module (241), a second capacitor (352) connected to the second RFFE module (242), and a third capacitor (353) connected to the third RFFE module (243). The switching circuit (289) may be configured to connect the power path (299) and the second power supply circuit (252) while the power amplifiers, including the first power amplifier (261) and the second power amplifier (262), connected to the power path (299) are deactivated and the third power amplifier (263) connected to the second power supply circuit (252) is activated to transmit RF signals on a frequency band supported by the third RFFE module (243), according to the control of the processor (210) or the RF transceiver (220).The first capacitor (351), the second capacitor (352), and the third capacitor (353) may be used for the second supply voltage based on the APT while the power supply path and the second power supply circuit (252) are connected. The transmission power for the frequency band supported by the third RFFE module (243) may be higher than the transmission power for the frequency band supported by the first RFFE module (241) and may be higher than the transmission power for the frequency band supported by the second RFFE module (242).

[0126] For example, the switching circuit (289) may be configured to connect the power supply path and the second power supply circuit (252) while one of the power amplifiers connected to the power path (299) is activated and at least one other of the power amplifiers and the third power amplifier (263) are deactivated, under the control of the processor (210) or the RF transceiver (220). The switching circuit (289) may be configured to operate in an isolated state or to connect the power path (299) and the first power supply circuit (251) while the power amplifiers connected to the power path (299) and the third power amplifier (263) are deactivated.

[0127] For example, the second supply voltage based on the APT may be provided to the third power amplifier (263) through a path between the third RFFE module (243) and the second power supply circuit (252). While the power path (299) and the second power supply circuit (252) are connected, in order to maintain the second supply voltage based on the APT, the first capacitor (351), the second capacitor (352), and the third capacitor (353) may be electrically connected to the path between the third RFFE module (243) and the second power supply circuit (252).

[0128] For example, the switching circuit (289) may be included in the first RFFE module (241).

[0129] For example, the first power supply circuit (251) and the second power supply circuit (252) may be included in a power supply module. The power supply module may be configured to deactivate the power amplifiers connected to the power path (299) under the control of the processor (210) or the RF transceiver (220). While the third power amplifier (263) is activated, the fourth capacitor may be configured to be connected to the second power supply circuit (252).

[0130] For example, the power supply module may include a first APT switching circuit (289) for connecting the capacitor and the first buck converter circuit of the first power supply circuit (251) and a second APT switching circuit (289) for connecting the capacitor and the second buck converter circuit of the second power supply circuit (252). The power amplifiers connected to the power path (299) may be deactivated. While the third power amplifier (263) connected to the second power supply circuit (252) is activated, the first APT switching circuit (289) may be opened. The second APT switching circuit (289) may be configured to connect the capacitor and the second buck converter circuit of the second power supply circuit (252).

[0131] For example, through the power path (299) connected to the second power supply circuit (252), the first capacitor (351), the second capacitor (352), and the third capacitor (353) can be coupled in parallel for the electrical path between the second power supply circuit (252) and the third RFFE module (243).

[0132] For example, the power path (299) may be configured to provide a supply voltage from the first power supply circuit (251) or the second power supply circuit (252) to one of the power amplifiers connected to the power path (299). A portion of the power path (299) may be disposed external to the first RFFE module (241) and connected to the second RFFE module (242) via a voltage output port of the first RFFE module (241).

[0133] For example, the maximum output power for the third power amplifier (263) may be higher than the maximum output power for the first power amplifier (261) and higher than the maximum output power for the second power amplifier (262).

[0134] For example, when the third power amplifier (263) is activated to transmit RF signals on a frequency band supported by the third RFFE module (243), the switching circuit (289) may be controlled to connect the power path (299) and the second power supply circuit (252). When the third power amplifier (263) is activated to transmit RF signals on another frequency band supported by the third RFFE module (243), the switching circuit (289) may be controlled to operate in an isolated state or to connect the power path (299) and the first power supply circuit (251).

[0135] For example, the frequency band supported by the third RFFE module (243) may include a GSM (global system for mobile communications) band. Other frequency bands supported by the third RFFE module (243) may be able to utilize dual connectivity (DC) with the frequency band supported by the first RFFE module (241) or the frequency band supported by the second RFFE module (242).

[0136] For example, the electronic device (101) may include a fourth RFFE module (244) including a fourth power amplifier connected to the first power supply circuit (251), a fifth RFFE module (545) including a fifth power amplifier connected to the power path (299), and a sixth RFFE module (546) including a sixth power amplifier connected to the power path (299). The deactivated power amplifiers may include the fifth power amplifier and the sixth power amplifier. The third RFFE module (243) may be configured to process signals in a frequency band of a first frequency range. Each of the first RFFE module (241) and the second RFFE module (242) may be configured to process signals in a frequency band of a second frequency range higher than the first frequency range. The fourth RFFE module (244) may be configured to process signals in a frequency band between the first frequency range and the second frequency range. Each of the fifth RFFE module (545) and the sixth RFFE module (546) may be configured to process signals of a frequency band for EN (EUTRA-NR)-DC (dual connectivity).

[0137] For example, the first capacitor (351) may be connected to a first node connecting the first RFFE module (241) and the second power supply circuit (252). The second capacitor (352) may be connected to a second node connecting the second RFFE module (242) and the switching circuit (289). The third capacitor (353) may be connected to a third node connecting the third RFFE module (243) and the second power supply circuit (252).

[0138] For example, the electronic device (101) may include a multilayer ceramic capacitor (MLCC) connected to the second power supply circuit (252).

[0139] In embodiments, an electronic device (101) is provided. The electronic device (101) comprises a processor (210) including a processing circuit, an RF (radio frequency) transceiver (220), a voltage supply circuit configured to provide a supply voltage based on average power tracking (APT), a switching circuit (289), a first RFFE (radio frequency front end) module (241) including a first power amplifier (261), a second RFFE module (242) including a second power amplifier (262), a third RFFE module (243) including a third power amplifier (263), a first path (292) provided between the power supply circuit and the switching circuit (289), a second path (299) provided to each of the power amplifiers, including the switching circuit (289) and the first power amplifier (261) and the second power amplifier (262), a third path provided between a node on the first path (292) and the third power amplifier (263), and a first path connected to the first path (292). It may include a capacitor (351), a second capacitor (352) connected to the second path (299), and a third capacitor (353) connected to the third path. When the first power amplifier (261) is activated, the second power amplifier (262) is deactivated, and the third power amplifier (263) is deactivated, the switching circuit (289) may be controlled to connect the first power amplifier (261) to receive a supply voltage from the power supply circuit through the first path (292) and the second path (299) to amplify first RF signals from the RF transceiver (220) and transmit the amplified first RF signals on a first frequency band at a first transmission power.When the first power amplifier (261) is deactivated, the second power amplifier (262) is activated, and the third power amplifier (263) is deactivated, the switching circuit (289) can be controlled to connect the second power amplifier (262) to receive a supply voltage from the power supply circuit through the first path (292) and the second path (299) in order to amplify second RF signals from the RF transceiver (220) and transmit the amplified second RF signals on a second frequency band with a second transmission power. When the first power amplifier (261) is deactivated, the second power amplifier (262) is deactivated, and the third power amplifier (263) is activated, the switching circuit (289) may be controlled to connect the first path (292) and the second path (299) while the third power amplifier (263) is connected to receive a supply voltage from the power supply circuit through the third path in order to amplify third RF signals from the RF transceiver (220) and transmit the amplified third RF signals at a third transmission power on a third frequency band. While the first path (292) and the second path (299) are connected, the first capacitor (351), the second capacitor (352), and the third capacitor (353) may be coupled in parallel. The third transmission power of the amplified third RF signals on the third frequency band may be higher than the first transmission power of the amplified first RF signals on the first frequency band and may be higher than the second transmission power of the amplified second RF signals on the second frequency band.

[0140] For example, when the third power amplifier (263) is activated to transmit the third RF signals on the third frequency band supported by the third RFFE module (243), while providing the supply voltage based on the APT to the third power amplifier (263), the switching circuit (289) may be configured to connect the first path (292) and the second path (299) to utilize the first capacitor (351), the second capacitor (352), and the third capacitor (353) coupled in parallel. In order not to use the second capacitor (352) while providing the supply voltage based on the APT to the third power amplifier (263) when the fourth power amplifier is activated to transmit fourth RF signals on a fourth frequency band, which is different from the third frequency band supported by the third RFFE module (243), the switching circuit (289) may be configured to operate in a state in which the first path (292) and the second path (299) are not connected. While the switching circuit (289) is configured to operate in a state in which the first path (292) and the second path (299) are not connected, among the first capacitor (351), the second capacitor (352), and the third capacitor (353), the first capacitor (351) and the third capacitor (353) may be coupled in parallel.

[0141] For example, the third frequency band supported by the third RFFE module (243) may include a GSM (global system for mobile communications) band. The fourth frequency band supported by the third RFFE module (243) may utilize dual connectivity (DC) with the first frequency band supported by the first RFFE module (241) or the second frequency band supported by the second RFFE module (242).

[0142] For example, the first capacitor (351) may be connected to a first node of the first path (292). The first node may connect the first RFFE module (241) with the node connecting the power supply circuit, the switching circuit (289), and the third RFFE module (243). The second capacitor (352) may be connected to a second node of the second path (299). The second node may connect the switching circuit (289) and the second RFFE module (242). The third capacitor (353) may be connected to a third node of the third path. The third node may connect the third RFFE module (243) with the node connecting the power supply circuit, the switching circuit (289), and the third RFFE module (243).

[0143] For example, the switching circuit (289) may be included in the first RFFE module (241).

[0144] For example, the electronic device (101) may include another power supply circuit configured to supply voltage based on APT or envelope tracking (ET), which is included in the power supply module. The power supply circuit may be included in the power supply module. The power supply module may be configured to deactivate the power amplifiers connected to the second path (299) under the control of the processor (210) or the RF transceiver (220). The fourth capacitor may be configured to be connected to the first path (292) while the third power amplifier (263) is activated to transmit the third RF signals on the third frequency band supported by the third RFFE module (243).

[0145] In embodiments, an electronic device (101) is provided. The electronic device (101) comprises a processor including a processing circuit, a radio frequency (RF) transceiver, a voltage supply circuit (252) configured to provide a supply voltage based on average power tracking (APT), a switching circuit (289), a first RFFE (radio frequency front end) module (241) including a first power amplifier (261), a second RFFE module (242) including a second power amplifier (262), a third RFFE module (243) including a third power amplifier (263), a first path (292) provided between the power supply circuit and the switching circuit (289), a second path (299) provided to each of the power amplifiers, including the switching circuit (289) and the first power amplifier (261) and the second power amplifier (262), a third path provided between a node on the first path (292) and the third power amplifier (263), and a first path connected to the first path (292). It may include a capacitor (351), a second capacitor (352) connected to the second path (299), and a third capacitor (353) connected to the third path. When the first power amplifier (261) is deactivated, the second power amplifier (262) is deactivated, and the third power amplifier (263) is activated to amplify first RF signals from the RF transceiver to be transmitted on a first frequency band supported by the third RFFE module (243) via an antenna, the switching circuit (289) may be configured to operate in a state where the first path (292) and the second path (299) are not connected.When the first power amplifier (261) is deactivated, the second power amplifier (262) is deactivated, and the third power amplifier (263) is activated to amplify second RF signals from the RF transceiver to be transmitted on a second frequency band supported by the third RFFE module (243) via an antenna, the switching circuit (289) may be configured to connect the first path (292) and the second path (299) to utilize the first capacitor (351), the second capacitor (352), and the third capacitor (353) while the supply voltage based on the APT is provided to the third power amplifier (263).

[0146] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0147] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0148] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0149] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0150] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0151] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A processor comprising a processing circuit; RF(radio frequency) transmitter and receiver; A first power supply circuit configured to provide a first supply voltage based on APT (average power tracking); A second power supply circuit configured to provide a second supply voltage based on APT; A switching circuit for selectively connecting one of the first power supply circuit and the second power supply circuit to a power path; A first radio frequency front end (RFFE) module including a first power amplifier connected to the power path; A second RFFE module comprising a second power amplifier connected to the power path; A third RFFE module comprising a third power amplifier connected to the second power supply circuit; A first capacitor connected to the first RFFE module; a second capacitor connected to the second RFFE module; and including a third capacitor connected to the third RFFE module; The above switching circuit, under the control of the processor or the RF transceiver, The power amplifiers, including the first power amplifier and the second power amplifier, connected to the power path are deactivated, and the third power amplifier connected to the second power supply circuit is activated to transmit RF signals on a frequency band supported by the third RFFE module, while the power path and the second power supply circuit are configured to be connected, The first capacitor, the second capacitor, and the third capacitor are used for the second supply voltage based on the APT while the power supply path and the second power supply circuit are connected, The transmission power for the frequency band supported by the third RFFE module is higher than the transmission power for the frequency band supported by the first RFFE module and is higher than the transmission power for the frequency band supported by the second RFFE module. Electronic devices.

2. In claim 1, The above switching circuit, under the control of the processor or the RF transceiver, Connecting the power supply path and the second power supply circuit while one of the power amplifiers connected to the power path is activated and at least one other of the power amplifiers and the third power amplifier are deactivated; While the power amplifiers and the third power amplifier connected to the power path are inactive, the power amplifiers are configured to operate in an isolated state or to connect the power path and the first power supply circuit. Electronic devices.

3. In claim 1, The second supply voltage based on the APT is provided to the third power amplifier through a path between the third RFFE module and the second power supply circuit, While the power path and the second power supply circuit are connected, to maintain the second supply voltage based on the APT, the first capacitor, the second capacitor, and the third capacitor are electrically connected to the path between the third RFFE module and the second power supply circuit. Electronic devices.

4. In claim 1, the switching circuit is included in the first RFFE module. Electronic devices.

5. In claim 1, The first power supply circuit and the second power supply circuit are included in a power supply module, The power supply module, under the control of the processor or the RF transceiver, The power amplifiers connected to the power path are deactivated, and the third power amplifier is activated, while the fourth capacitor is connected to the second power supply circuit. Electronic devices.

6. In claim 5, The power supply module includes a first APT switching circuit for connecting the capacitor and the first buck converter circuit of the first power supply circuit, and a second APT switching circuit for connecting the capacitor and the second buck converter circuit of the second power supply circuit, The first APT switching circuit is opened while the power amplifiers connected to the power path are deactivated and the third power amplifier connected to the second power supply circuit is activated, and the second APT switching circuit is configured to connect the capacitor and the second buck converter circuit of the second power supply circuit. Electronic devices.

7. In claim 1, Through the power path connected to the second power supply circuit, the first capacitor, the second capacitor, and the third capacitor are coupled in parallel with respect to the electrical path between the second power supply circuit and the third RFFE module. Electronic devices.

8. In claim 1, The power path is configured to provide a supply voltage from the first power supply circuit or the second power supply circuit to one of the power amplifiers connected to the power path, A portion of the power path is disposed externally of the first RFFE module and connected to the second RFFE module via a voltage output port of the first RFFE module. Electronic devices.

9. In claim 1, The maximum output power for the third power amplifier is higher than the maximum output power for the first power amplifier and higher than the maximum output power for the second power amplifier. Electronic devices.

10. In claim 1, When the third power amplifier is activated to transmit RF signals on a frequency band supported by the third RFFE module, the switching circuit is controlled to connect the power path and the second power supply circuit, When the third power amplifier is activated to transmit RF signals on other frequency bands supported by the third RFFE module, the switching circuit is controlled to operate in an isolated state or to connect the power path and the first power supply circuit. Electronic devices.

11. In claim 10, The frequency bands supported by the third RFFE module include the GSM (global system for mobile communications) band, Other frequency bands supported by the third RFFE module can utilize dual connectivity (DC) with the frequency bands supported by the first RFFE module or the frequency bands supported by the second RFFE module. Electronic devices.

12. In claim 1, A fourth RFFE module comprising a fourth power amplifier connected to the first power supply circuit; a fifth RFFE module including a fifth power amplifier connected to the power path; and A sixth RFFE module comprising a sixth power amplifier connected to the power path, The power amplifiers to be deactivated include the fifth power amplifier and the sixth power amplifier, The third RFFE module is configured to process signals in a frequency band of the first frequency range, Each of the first RFFE module and the second RFFE module is configured to process signals in a frequency band of a second frequency range higher than the first frequency range, The fourth RFFE module is configured to process signals in a frequency band between the first frequency range and the second frequency range, Each of the fifth RFFE module and the sixth RFFE module is configured to process signals of a frequency band for EN (EUTRA-NR)-DC (dual connectivity). Electronic devices.

13. In claim 1, The first capacitor is connected to a first node connecting the first RFFE module and the second power supply circuit, The second capacitor is connected to a second node connecting the second RFFE module and the switching circuit, The third capacitor is connected to a third node connecting the third RFFE module and the second power supply circuit. Electronic devices.

14. In claim 1, Further comprising an MLCC (multilayer ceramic capacitor) connected to the second power supply circuit, Electronic devices.

15. In electronic devices, A processor comprising a processing circuit; RF(radio frequency) transmitter and receiver; A voltage supply circuit configured to provide a supply voltage based on APT (average power tracking); switching circuit; A first radio frequency front end (RFFE) module including a first power amplifier; A second RFFE module comprising a second power amplifier; A third RFFE module including a third power amplifier; A first path provided between the power supply circuit and the switching circuit; A second path provided to each of the power amplifiers, including the switching circuit and the first power amplifier and the second power amplifier; A third path provided between a node on the first path and the third power amplifier; A first capacitor connected to the first path; a second capacitor connected to the second path; and including a third capacitor connected to the third path, When the first power amplifier is activated, the second power amplifier is deactivated, and the third power amplifier is deactivated, the switching circuit is controlled to connect the first power amplifier to receive a supply voltage from the power supply circuit through the first path and the second path to amplify first RF signals from the RF transceiver and transmit the amplified first RF signals on a first frequency band at a first transmission power. When the first power amplifier is deactivated, the second power amplifier is activated, and the third power amplifier is deactivated, the switching circuit is controlled to connect the second power amplifier to receive a supply voltage from the power supply circuit through the first path and the second path to amplify second RF signals from the RF transceiver and transmit the amplified second RF signals on a second frequency band at a second transmission power. When the first power amplifier is deactivated, the second power amplifier is deactivated, and the third power amplifier is activated, the switching circuit is controlled to connect the first path and the second path while the third power amplifier is connected to receive a supply voltage from the power supply circuit through the third path to amplify third RF signals from the RF transceiver and transmit the amplified third RF signals on a third frequency band at a third transmission power. While the first path and the second path are connected, the first capacitor, the second capacitor, and the third capacitor are connected in parallel, The third transmission power of the amplified third RF signals on the third frequency band is higher than the first transmission power of the amplified first RF signals on the first frequency band and is higher than the second transmission power of the amplified second RF signals on the second frequency band. Electronic devices.

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