Biomedical monitoring headset

Abstract

A modular sensor assembly includes a flexible circuit board, and a strap that overlays the flexible circuit board in a normal direction, defines a first set of cutouts, and defines a second set of cutouts, where the flexible circuit board forms a loop extended through the second set of cutouts. The modular sensor assembly also includes a sensor inserted through the first set of cutouts in the normal direction, where the sensor engages the strap and is communicatively coupled to the flexible circuit board.

Description

BIOMEDICAL MONITORING HEADSETCROSS REFERENCE TO RELATED APPLICATIONS

[0001] The application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 561,930, filed on March 6, 2024, entitled ‘“Biomedical Monitoring Headset”, which we incorporate by reference in its entirety.BACKGROUND

[0002] Aspects described herein relate to a wearable biomedical device and, more particularly, a headset for capturing transcranial neural electrical activity.

[0003] A neural electrical activity headset, such as an EEG (electroencephalogram) headset, is an apparatus for noninvasively recording and measuring electrical impulses generated by a brain. The headset includes a head-wearable structure with sensors positioned across the scalp to record transcranial brainwave patterns. Captured electrical signals are amplified, processed, and converted into meaningful data, providing insights into brain activity for clinical diagnoses, therapy, and neurological research.

[0004] There are several types of conventional electroencephalogram (EEG) headsets: free electrodes attached with glue or paste, electrode caps that require a gel or solution, and dry wired or wireless headsets. Free electrodes and most electrode caps are time-consuming and messy to apply and remove. Free electrodes, electrode caps, and wired headsets are subject to artifacts due to movement or cable sway and electromagnetic interference. Wireless headsets typically include a power supply (e.g., battery) and electronic circuits including amplifiers, processors, and wireless transceivers, which introduce weight, cost, and electromagnetic noise emissions that may potentially interfere with brain functions and degrade signal quality. In some instances, active sensors are utilized instead of passive sensors. Active sensors make electrical contact and actively amplify and process signals. Active sensors reduce sensitivity to ambient noise and cable sway but are more susceptible to pulse artifacts including cardio- ballistic and piezo-induced artifacts. Generally, sensors need to be maintained and replaced periodically. Existing headsets may require return to the factory for most repair or replacement, incurring a cost and delay in usage.SUMMARY

[0005] According to one aspect, a biomedical monitoring apparatus is disclosed including sensors, flexible circuit boards, straps, and housings. The sensors may be configured to detectneural electrical brain activity. The flexible circuit boards are communicatively coupled with sensors and, among other things, enable aggregation and transmission of sensor data for further processing. Straps couple sensors to a flexible circuit board and facilitate sensor positioning on the head of a subject. A strap may include apertures configured to allow a flexible circuit board to be inserted and positioned. Further, the strap and the flexible circuit board may include sensor apertures for inserting and connecting sensors. Manually removable sensor fasteners may be employed to hold the sensors in place relative to the strap and flexible circuit board sensor apertures. The apparatus may also include two housings for positioning around an ear on the sides of a head. Each housing may include connectors that enable communicative connection with the flexible circuit boards. Further, each housing may include a fastener component that allows a strap including fasteners at each end to be removably attached to each housing. At least one of the two housings may also include a connector or port that enables output of data from all sensors to external processing devices or equipment.

[0006] According to another aspect, a modular sensor assembly included in a biomedical monitoring apparatus includes a flexible circuit board, and a strap that overlays the flexible circuit board in a normal direction, defines a first set of cutouts, and defines a second set of cutouts, where the flexible circuit board forms a loop extended through the second set of cutouts. The modular sensor assembly also includes a sensor inserted through the first set of cutouts in the normal direction, where the sensor engages the strap and is communicatively coupled to the flexible circuit board.

[0007] Other aspects provide methods associated with the aforementioned apparatus; non- transitory, computer-readable media including instructions that, when executed by a processor of a processing system, cause the processing system to perform the methods; and a computer program product embodied on a computer-readable storage medium including code for performing the aforementioned methods as well as those further described herein.

[0008] Aspects described herein provide apparatuses, methods, processing systems, and computer-readable mediums associated with a neural electrical activity headset, an apparatus for noninvasive recording and measuring electrical impulses generated by a brain.

[0009] Aspects described herein provide a technical solution to at least the aforementioned technical problems described above. The subject headset may be modular with easily replaceable active sensors, allowing components to be removed or replaced in the field. In one instance, the headset may be easily upgraded or downgraded by adding or removing a variety of sensors from bands or straps with a removable fastener device. Benefits include ease of use,field modification and field repair without return to the factory due to a modular design, and washability.

[0010] Further, the subject headset foregoes extensive on-head electronic devices. Rather, active shielding and amplification / impedance matching are provided on the head, while other electronic functions such as digitization, filtering, encoding, and transmission are performed on external devices. The headset need not include any electromagnetically emitting circuits, thereby reducing noise emissions that may interfere with brain function and degrade signal quality. An additional benefit is weight reduction. In one particular embodiment, flexible circuit boards may be employed, which further reduce weight and improve space efficiency, reliability, durability, and signal integrity', among other things.

[0011] Furthermore, the headset may support a choice of dry, moist, or wet gel usage without modifications. Therefore, the benefits of a moist or wet connection may be achieved in combination with an active sensor. The headset is also configured to support integration of near infrared hemoencephalography (nIR HEG), passive infrared hemoencephalograph (pIR HEG), photobiomodulation (PBM), and pulsed electromagnetic field (pEMF) therapy, or other neuromonitoring or neuromodulation capabilities.

[0012] The following description and the related drawings set forth in detail certain illustrative features of one or more aspects of this disclosure.DESCRIPTION OF THE DRAWINGS

[0013] The appended figures depict certain aspects and are, therefore, not to be considered limiting of the scope of this disclosure.

[0014] FIG. 1 is a left perspective view of an example headset.

[0015] FIG. 2 is a front perspective view of the headset of FIG. 1.

[0016] FIG. 3A depicts side views of a first housing portion and a second housing portion included in the headset of FIG. 1.

[0017] FIG. 3B is a side view of a printed circuit board included in the headset of FIG. 1.

[0018] FIG. 4A depicts a left perspective view of the first housing portion.

[0019] FIG. 4B depicts a right perspective view of the first housing portion.

[0020] FIG. 4C depicts a partial, enlarged, top perspective view' of the first housing portion.

[0021] FIG. 4D depicts a partial, enlarged, bottom perspective view' of the first housing portion.

[0022] FIG. 5A is a partial, enlarged, top left perspective view of a strap and a strap fastener included in the headset of FIG. 1.

[0023] FIG. 5B is a top right perspective view of the strap fastener.

[0024] FIG. 5C is a bottom right perspective view of the strap fastener.

[0025] FIG. 5D is a partial, enlarged left view of the headset including the first housing portion.

[0026] FIG. 6A is a front right perspective view of the strap fastener.

[0027] FIG. 6B is a back right perspective view of the strap fastener.

[0028] FIG. 7A is a front view of straps included in the headset of FIG. 1.

[0029] FIG. 7B is a front view of the straps, retainers, sensor fasteners, and strap fasteners included in the headset of FIG. 1.

[0030] FIG. 8 A is a front view of a flexible circuit board included in the headset of FIG. 1 .

[0031] FIG. 8B is a back view of the flexible circuit board.

[0032] FIG. 8C is a front view of the strap and the strap fasteners, according to another aspect.

[0033] FIG. 8D is a front view of the flexible circuit board looped through the strap of FIG. 8C.

[0034] FIG. 8E is a top right view of the flexible circuit board looped through the strap.

[0035] FIG. 9A is a bottom right view of one of the sensor fasteners.

[0036] FIG. 9B is a bottom right view of a sensor.

[0037] FIG. 9C is a bottom view of one of the sensor fasteners.

[0038] FIG. 9D is a right view of one of the sensor fasteners.

[0039] FIG. 10A is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.

[0040] FIG. 10B is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.

[0041] FIG. 10C is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.

[0042] FIG. 10D is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.

[0043] FIG. 11 A is a bottom left perspective view of one of the retainers.

[0044] FIG. 1 IB is a bottom front perspective view of one of the retainers.

[0045] FIG. 11C is a top left perspective view of one of the retainers.

[0046] FIG. 1 ID is a top perspective view of one of the retainers.

[0047] FIG. 12 is a flow chart diagram of an example headset assembly method.

[0048] FIG. 13 is a block diagram of an operating environment within which aspects of the subject disclosure may be performed.

[0049] FIG. 14A is a left perspective view of the first housing portion, according to another aspect.

[0050] FIG. 14B is a right perspective view of the first housing portion in FIG. 14A.

[0051] FIG. 15A is a left view of the first housing portion in FIG. 14A.

[0052] FIG. 15B is a right view of the first housing portion in FIG. 14A.

[0053] FIG. 15C is a bottom perspective view of the first housing portion in FIG. 14A.

[0054] FIG. 15D is a top perspective view of the first housing portion in FIG. 14A.

[0055] FIG. 15E is a back perspective view of the first housing portion in FIG. 14A.

[0056] FIG. 15F is a front perspective view of the first housing portion in FIG. 14A.

[0057] FIG. 16A is a back right perspective view of the first housing portion, according to another aspect.

[0058] FIG. 16B is a back left perspective view of the first housing portion in FIG. 16A.

[0059] FIG. 17 is an exploded back right perspective view of the first housing portion in FIG.16 A.

[0060] FIG. 18 is an exploded back left perspective view of the first housing portion in FIG.16 A.

[0061] FIG. 19A is a top perspective view of a strap according to another aspect.

[0062] FIG. 19B is a top view of the strap in FIG. 19A.

[0063] FIG. 19C is a side view of the strap in FIG. 19A.

[0064] FIG. 20A is a top perspective view of a strap according to another aspect.

[0065] FIG. 20B is a top view of the strap in FIG. 20A.

[0066] FIG. 20C is a side view of the strap in FIG. 20 A.

[0067] FIG. 21 A is a bottom perspective view of the sensor.

[0068] FIG. 21B is a top perspective view of the sensor.

[0069] FIG. 21C is a top perspective view of a snap fastener included in one of the sensor fasteners.

[0070] FIG. 21 D is a bottom perspective view of a snap fastener included in one of the sensor fasteners.

[0071] FIG. 21E is a top perspective view of one of the sensors, according to another aspect.

[0072] FIG. 21F is a bottom perspective view of the sensor in FIG. 21E.

[0073] FIG. 22A is a top perspective view of one of the sensor fasteners.

[0074] FIG. 22B is a bottom perspective view of one of the sensor fasteners.

[0075] FIG. 22C is a side view of one of the sensor fasteners.

[0076] FIG. 23A is a top perspective view of one of the retainers.

[0077] FIG. 23B is a bottom perspective view of one of the retainers.

[0078] FIG. 23C is a cross-section side view of one of the retainers.

[0079] FIG. 24 is an exploded top perspective view of a modular sensor assembly included in the headset.

[0080] FIG. 25 is an exploded botom perspective view of the modular sensor assembly.

[0081] FIG. 26A is a top perspective view of the modular sensor assembly.

[0082] FIG. 26B is a bottom perspective view of the modular sensor assembly.

[0083] FIG. 27A is a top perspective view of the modular sensor assembly, articulated in an arc.

[0084] FIG. 27B is a botom perspective view of the modular sensor assembly, articulated in an arc.

[0085] FIG. 28A is a cross-sectional side view of the modular sensor assembly.

[0086] FIG. 28B is an exploded cross-sectional side view of the modular sensor assembly.

[0087] FIG. 29A is a left view of the headset secured on a head of a user.

[0088] FIG. 29B is a top front perspective view of the headset.

[0089] FIG. 30A is a right view diagram of an electrode placement system for performing electroencephalography (EEG).

[0090] FIG. 30B is a top view diagram of the electrode placement system for performing EEG.

[0091] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements common to the drawings. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.DETAILED DESCRIPTION

[0092] It should, of course, be understood that the description and drawings herein are merely illustrative and that various modifications and changes may be made in the structures disclosed without departing from spirit and scope of the present disclosure. Referring now to the drawings, wherein like numerals refer to like parts throughout the several views, FIG. 1 depicts a high-level overview of an example headset 100. The headset 100 includes a housing 102, straps 104, sensor fasteners 110, flexible circuit boards 112, retainers 114, and a harness 120.

[0093] The straps 104 include strap fasteners 122 that each respectively fix an end of one of the straps to the housing 102. The strap fasteners 122 each respectively include a tag 124 that is a pull loop extended from an interface 130 between the strap 104 and the strap fastener 122. The tags 124 are grip features that may be pulled by a user removing the strap fasteners 122 from the housing 102. With this construction, the strap fasteners 122 are configured for toolless removal from the housing 102. Also, the tags 124 are fixed with the strap fasteners 122 at locations spaced from where the strap fasteners 122 are fixed with the housing 102. As such,the tags 124 avoid interfering with each other, adjacent strap fasteners 122, and other components fixed with adjacent straps 104 at the housing 102. While, as depicted, the tags 124 are loops of fabric fixed to the strap fasteners 122 at the interfaces 130 between the strap fasteners 122 and the straps 104, the tags 124 may additionally or alternatively include various grip features such as, for example, tabs, latches, or straps extended from various portions of the strap fasteners 122 without departing from the scope of the present disclosure.

[0094] The housing 102 provides physical connection and support of the straps 104 on the headset 100. As described in further detail below, the housing 102 may include a pair of housing portions respectively provided on a right side of a head 132 of a user 134, and a left side of the head 132, providing connection points for the straps 104. In an embodiment, the housing 102 is rigid as compared to the straps 104, the flexible circuit boards 112, and the harness 120. In such an embodiment, the housing 102 may be formed from a plastic, foam, or rubber material that flexes around and accommodates contours of the head 132 at the left and right sides, such as, for example, acrylonitrile butadiene styrene, polycarbonate, nylon, polypropylene, polyurethane, polybutylene terephthalate, viscoelastic polyurethane foam, ethylene vinyl acetate foam, neoprene foam, silicone rubber, thermoplastic elastomers, ethylene propylene diene monomer, or nitrile rubber. Alternatively, the housing 102 may be formed from relatively rigid metal or carbon fiber materials, such as, for example, aluminum, steel, titanium, or carbon fiber composites.

[0095] The strap fasteners 122 removably couple the straps 104 and the flexible circuit boards 112 to the housing 102. In an embodiment, the strap fasteners 122 define apertures 140 for insertion of screws 142 that respectively fix the straps 104 and the flexible circuit boards 112 to the housing 102. In this regard, the apertures 140 respectively receive the screws 142, where the screws 142 engage the housing 102 and fix the strap fasteners 122 to the housing 102. While, as depicted, the strap fasteners 122 are fixed to the housing 102 by the screws 142, the strap fasteners 122 may be additionally or alternatively be removably fixed to the housing 102 by various fasteners including bolts, threaded inserts, clips, pins, latches, cam locks, hook and loop mechanisms, or magnets without departing from the scope of the present disclosure.

[0096] In further embodiments discussed in greater detail below, the strap fasteners 122 may additionally or alternatively include a locking pin that engages a post on the housing 102 and may be released by pulling a tab, pressing a button, or other disengagement action. For example, the tags 124 may be gripped and pulled by a user to release the strap fasteners 122. Alternatively, the strap fasteners 122 may each include a button, and the tags 124 may facilitate positioning the strap fasteners 122 into engagement with the button.

[0097] FIG. 2 depicts the headset 100 on the user 134 from a different angle, providing a front perspective view. As shown in FIG. 2, each of the straps 104 may define a first set of cutouts 144 that are apertures which receive sensors 150, where each sensor 150 is respectively connected with one of the sensor fasteners 110. The straps 104 also each define a second set of cutouts 152 that are slit apertures which receive one of the flexible circuit boards 112.

[0098] Data generated by the sensors 150 may be communicated from the sensors 150 through the flexible circuit boards 112. As such, in addition to providing physical connections and support to the straps 104 in the headset 100, the housing 102 enables electronic communication of sensor data through the flexible circuit boards 112 through connectors, interfaces, or ports at the ends and undersides of the straps 104. The data from all of the sensors 150 may be communicated externally through such connectors, interfaces, or ports, as described in greater detail below. In this manner, electronic functions, including digitization, filtering, encoding, and transmission, may be performed on external devices, reducing the weight of the example headset 100 and electromagnetic noise emission that degrades the signal quality'.

[0099] The example headset 100 has a modular design with respect to the housing 102, the straps 104. the flexible circuit boards 112. and the sensors 150. With this construction, the headset 100 may be assembled, disassembled, and re-assembled in a field environment. In embodiments, such assembly, disassembly, and re-assembly of the headset 100 may be performed by hand, without additional tools. Further, the headset 100 may be customized by adding, removing, or changing the sensors 150 on each or any of the straps 104. The headset 100 may be further customized by increasing or reducing a number of the straps 104 and flexible circuit boards 112 fixed to the housing 102. As described further herein, the sensor fasteners 110 may be utilized to allow the sensors 150 to be removed easily and attached or reattached quickly and securely.

[0100] Refernng back to FIG. 1, the harness 120 is a chin strap that connects to the bottom of the housing 102, and is positioned underneath and across a chin 154 of the user 134 to limit movement of the sensors. In an embodiment, the harness 120 includes a neck strap (not shoyvn) connected around a back side 160 of the head 132 and a neck 162 to further secure the headset 100 to the user 134. limiting movement of the sensors 150 relative to the head 132. Furthermore, in one embodiment, the headset 100 may include signal amplifiers for impedance matching, an integrated active ground shield for noise immunity, and an external power supply such that the headset 100 does not include electromagnetically emitting circuits.

[0101] The headset 100 includes multiple modular sensor assemblies 164 of the straps 104, the flexible circuit boards 112, the sensors 150, the sensor fasteners 110, and the retainers 114connected to the housing 102. In an embodiment, the sensors 150 may be dry active electrodes, for example, made of silicon. The sensors 150 are affixed through apertures in a flexible circuit board 112 and strap 104. Further, the sensors 150 are removably connected to the flexible circuit board 112 and strap 104 with the sensor fastener 110.

[0102] FIG. 2 depicts one of the modular sensor assemblies 164 extended over a top portion of the head 132, between portions of the housing 102. As shown in FIG. 2, the flexible circuit board 112 is threaded through one or more apertures in the strap 104 and held in place by retainers 1 14. The additional length of flexible circuit board allows adjustment for different size heads. Furthermore, the additional length may house additional circuitry7. In one instance, the additional length may include lights to facilitate brain stimulation. Additionally or alternatively, separate stimulating devices may be mounted on one or more of the multiple strap 104, including but not limited to pulsed electro-magnetic field (pEMF) coils and light emitting diodes (LEDs).

[0103] An example first housing portion 300 and an example second housing portion 302 of the housing 102 are detailed in FIGS. 3A-B, 4, and 5B. As depicted, the first housing portion 300 and the second housing portions 302 structurally minor each other as a pair in the headset 100, the first housing portion 300 and the second housing portion 302 being respectively shaped for accommodating contours at the left side and the right side of the head 132, around ears of the user 134. The headset 100 may be made of material safe for prolonged skin contact (e.g., printed nylon, silicon urethane). Further, the first housing portion 300 and the second housing portion 302 respectively define right and left housing portions including front, back, and side portions (e.g., top, bottom, left, and right) mirrored from each other in a left-right direction of the user 134.

[0104] FIG 3A illustrates the first housing portion 300 and the second housing portion 302 (e.g., right and left). Each of the first housing portion 300 and the second housing portion 302 includes input connectors 304 that are ports which receive input from the sensors 150 at the straps 104, for example, through the flexible circuit board 112. In an embodiment, the input connectors 304 are five-to-twelve-pin connectors that engage complementary outlets of the flexible circuit boards 112. In this manner, each modular sensor assembly 164 is independently connected to the housing 102, where each modular sensor assembly 164 transmits data generated at the sensors 150 to the housing 102 via the flexible circuit boards 112 and the input connectors 304.

[0105] The first housing portion 300 or the second housing portion 302 may also include an output connector 310 or port to provide output to one or more external devices or computersfor further processing. In an embodiment, the output connector 310 may engage to a thirty - four-pin connector that connects to a ribbon cable.

[0106] Both the first housing portion 300 and the second housing portion 302 may also include first fastener components 312 complementary to the strap fasteners 122 for removably fixing the straps 104 to the housing 102. While, as depicted, the first fastener components 312 are discorectangle shaped posts extended from outer surfaces of the first housing portion 300 and the second housing portion 302 in the left-right direction, the first fastener components 312 may additionally or alternatively include a variety of extruded portions, complementary to the strap fasteners 122 for removably fixing the straps 104 to the housing 102. Furthermore, the first housing portion 300 and the second housing portion 302 may additionally or alternatively define recesses or apertures complementary to the strap fasteners 122 for removably fixing the straps 104 to the housing 102.

[0107] The input connectors 304 are angled and offset from each other in an arc pattern on the first housing portion 300, where the input connectors 304 each receive sensor data from one of the modular sensor assemblies 164. The first fastener components 312 are angled and offset from each other in the arc pattern with the input connectors 304. The first fastener components 312 respectively correspond, and are aligned with the input connectors 304 in a radial direction perpendicular to the arc pattern, where the first fastener components 312 removably fix the modular sensor assemblies 164 to the housing 102.

[0108] The strap fasteners 122 each respectively form a perimeter of the modular sensor assemblies 164 that is angled or rounded from the aperture 500 toward the strap 104 at an outer edge of the housing 102 in the front-back direction. With this construction, the first housing portion 300 may independently accommodate a relatively large number of the modular sensor assemblies 164 in the arc pattern, on the headset 100, with minimal increase in an overall size or surface area of the first housing portion 300, and while maintaining a required structural integrity of the strap fasteners 122 and the straps 104.

[0109] The first housing portion 300 and the second housing portion 302 each include an ear sensor 314. The ear sensors 314 may respectively detect positioning of the first housing portion 300 and the second housing portion 302 with respect to the ears of the user 134. In an embodiment, the ear sensors 314 are made of metal and function as a ground for electronic components in the headset 100.

[0110] FIG. 3B illustrates an example circuit board 320 associated with the housing 102. In particular, the circuit board 320 is associated with the first housing portion 300. corresponding to the right side of the head 132 of the user 134. As depicted, the circuit board 320 supports theinput connectors 304 and the output connector 310 in the first housing portion 300. The circuit board 320 may be enclosed within the housing 102, as shown in FIG. 3 A.

[0111] FIGS. 4A and 4B respectively depict front and back perspective views of the first housing portion 300. With reference to FIG. 4B, a back side 400 of the first housing portion 300 includes a first sensor 402 and a second sensor 404 respectively disposed at a top portion 410 and a bottom portion 412 of the first housing portion 300. FIGS. 4C and 4D respectively depict perspective views of the first sensor 402 at the top portion 410 and the second sensor 404 at the bottom portion 412.

[0112] In accordance with an embodiment, the first sensor 402 and the second sensor 404 are dry active electrodes made of silicon. While, as depicted, the first housing portion 300 includes two dry active electrode sensors as the first sensor 402 and the second sensor 404, the first housing portion 300 may additionally or alternatively include other types of sensors, more or fewer sensors, and various positioning arrangements of the sensors about the top portion 410 and the bottom portion 412 without departing from the scope of the present disclosure.

[0113] Referring back to FIG. 1, the housing 102 may include an additional fastener component 414 that fixes the harness 120 to the housing 102. As depicted in FIG. 1, the fastener component 414 is a peg integrally formed with an extended outw ard in the left-right direction from the bottom portion 412 of the first housing portion 300. The harness 120 defines an aperture 420 that receives and engages the fastener component 414, fixing the harness 120 under the chin 154 of the user 134. The harness 120 may extend behind the head 132, around the back side 160, further securing the headset 100 to the head 132, improving stability of the headset 100 on the head 132, reducing movement of the sensors 150, the ear sensors 314, the first sensor 402, and the second sensor 404 relative to the head 132. In an embodiment where the harness 120 includes a separate strap around the back side 160 of the head 132, such a separate strap may be fixed with the harness 120 so as to not need additional apertures or components for fixing the harness 120 to the user 134.

[0114] FIG. 5A depicts an example strap 104, including the strap fastener 122. FIG. 5B depicts a top perspective view of the strap fastener 122, FIG. 5C depicts a bottom perspective view- of the strap fastener 122, and FIG. 5D depicts an example configuration of the straps 104 and the housing 102. With reference to FIGS. 5A-5C, the strap fastener 122 defines an aperture 500 at an end of the strap 104. FIG. 5D illustrates attachment of the straps 104 to the housing 102 in a hub and spoke distribution shape.

[0115] With continued reference to FIG. 5D, the aperture 500 defined in each strap fastener 122 accepts one of the first fastener components 312 of the housing 102. In accordance withone embodiment, the aperture 500 may be wider at one end to accept one of the first fastener components 312 and narrower at another end to lock the first fastener component 312 into the aperture 500.

[0116] In this manner, the aperture 500 is a second fastener component complementary with one of the first fastener components 312 of the housing 102 in a manner that removably fixes the modular sensor assemblies 164 to the housing 102. While, as depicted, the aperture 500 is an opening that receives and engages the first fastener components 312, the aperture 500 may be a variety of mechanical attachment mechanisms complementary to the first fastener components 312 for removably fixing the strap fastener 122 to the housing 102, such as, for example, pins, clips, rods, or screws without departing from the scope of the present disclosure.

[0117] The strap fasteners 122 each include an elastic strap 502 extended from a side of the aperture 500 opposite the strap 104. A user may grip and pull the elastic strap 502 by hand, where a tensile force exerted by the elastic strap 502 may hold the strap fastener 122 in place on the first fastener component 312. In an embodiment, the first fastener component 312 on the housing 102 is a post, and the aperture 500 defined by the strap fastener 122 is an eyelet such that the straps 104 engage the housing 102 in snap fit assembly. While, as depicted, the aperture 500 is an eyelet that snap fits the first fastener component 312, various fastener mechanisms may be utilized between the strap fastener 122 and the housing 102 without departing from the scope of the present disclosure. By way of example, and not limitation, the strap fastener 122 may additionally or alternatively include a locking pin that engages with an aperture defined in the housing 102, where the locking pin may be released by pulling a tab, pressing a button, or other disengagement action.

[0118] FIGS. 6 A and 6B respectively depict a front perspective view and a back perspective view of the strap fastener 122 in accordance an embodiment. As shown in FIG. 6A, the strap fastener 122 includes an aperture 600 that accepts a screw 602. The screw 602 may be inserted through the aperture 600 and engage with threads associated with one of the first fastener components 312 on a housing 102, removably fixing the strap fastener 122 with the housing 102. In this manner, the strap fastener 122 may be attached by the screw 602 to the housing 102.

[0119] As shown in FIG. 6B, the aperture 600 is a through hole that extends to a back side of the strap fastener 122. The back side of the strap fastener 122 also defines a first recess 604 and a second recess 610. The first recess 604 and the second recess 610 may include threads that respectively engage a first screw 612 and a second screw 614. The end of one of the straps 104 may be inserted into the strap fastener 122 and secured with the first screw 612 and thesecond screw 614 through the first recess 604 and the second recess 610. The strap fastener 122 also includes a socket 620 that accepts a portion of a connector of one of the flexible circuit boards 112 to facilitate positioning with respect to engagement with an input connector 304 on the housing 102.

[0120] FIG. 7A depicts a top view of the straps 104 in accordance with an embodiment. Four of the straps 104 are shown of varying size. In an embodiment, the straps 104 are constructed of an elastic material that is easy to connect to the housing 102. supports the flexible circuit boards 112, and is washable and reusable. With this construction, the straps 104 may be elastic, offering many benefits including stretchability to accommodate different head sizes and shapes, comfort, security in that the tension holds items in place, durability', and resistance to deformation, among other things. Head sizes may vary’ significantly from an infant to an adult. Accordingly, different-size straps may be employed as the straps 104.

[0121] The straps 104 each include a set of apertures 700 at opposite ends 702 of the strap 104. The apertures 700 respectively receive the first screw 612 and the second screw 614 in the socket 620, fixing the strap 104 with one of the strap fasteners 122. The straps 104 also each define the first set of cutouts 144 as additional circular openings along a length of the straps 104 between the sets of apertures 700. The first set of cutouts 144 receive and engage the sensors 150, fixing the sensors 150 in the straps 104. Further, the second set of cutouts 152 are also present along the length of the straps 104 for positioning and holding the flexible circuit boards 112 in place along the straps 104.

[0122] FIG. 7B illustrates example straps 104 including additional components. Similar to FIG. 7A, straps of various sizes are depicted. With continued reference to FIG. 7B, each strap 104 includes two of the strap fasteners 122 attached through the sets of apertures 700 at the opposite ends 702. The sensors 150 are inserted through the first set of cutouts 144 and secured in the first set of cutouts 144, on the straps 104, by the sensor fasteners 1 10. Lengths of the flexible circuit boards 112 are inserted through the second set of cutouts 152. In embodiments, the flexible circuit board 112 is threaded up and back down through the cutouts 152, forming a loop that provides an extra length of the flexible circuit board 112 that may accommodate stretching of the strap 104. additional room for circuitry, or both.

[0123] The flexible circuit board 112 may be held in place by retainers 114. In this regard, the retainers 114 overlay the second set of cutouts 152, where the retainers 114 frictionally engage loops of the flexible circuit boards 112 extended through the second set of cutouts 152. In this manner, the retainers 114 inhibit movement of the flexible circuit boards 112 through the second set of cutouts 152, retaining the loops of the flexible circuit boards 112 at the secondset of cutouts 152. In an embodiment, the retainers 114 squeeze the loops of the flexible circuit boards 112, generating a predetermined amount of frictional force. With this construction, the loops in the flexible circuit boards 112 provide added length along the straps 104 when the straps 104 are deformed by a force exceeding the frictional force generated by the retainers 114.

[0124] The first set of cutouts 144 and the second set of cutouts 152 are defined in an alternating pattern along the straps 104. With this construction, the flexible circuit board 112 may provide slack from loops at the second set of cutouts 152 between any two of the sensors 150 along the strap 104.

[0125] FIGS. 8A and 8B illustrate one of the flexible circuit boards 112, and FIG. 8C illustrates one of the straps 104 with which the flexible circuit board 112 may be used. As shown in FIGS. 8A and 8B, the flexible circuit board 112 may define a third set of cutouts 800 that are apertures which receive and engage the sensors 150. On the back, the flexible circuit board 112 includes connectors 802 at each end. While, as depicted, the first set of cutouts 144, the second set of cutouts 152, and the third set of cutouts 800 are apertures or holes respectively defined and fully enclosed by the strap 104 and the flexible circuit board 112, each of the first set of cutouts 144, the second set of cutouts 152, and the third set of cutouts 800 may additionally or alternatively be formed from a tear or cut into a side of the strap 104, where the tear or cut engages one of the sensors 150 without departing from the scope of the present disclosure.

[0126] The connectors 802 engage connection points of the housing 102 for power and data communication, among other things. The flexible circuit board 112 may be utilized with respect to the strap 104. More particularly, the flexible circuit board 112 may be threaded through pairs 804 of the second set of cutouts 152 such that the third set of cutouts 800 of the flexible circuit board 112 align with the first set of cutouts 144 in the strap 104. The third set of cutouts 800 in the flexible circuit board 112 may be smaller than the first set of cutouts 144 in the strap 104. With this construction, the flexible circuit board 112 contacts and communicates with the sensors 150 through the strap 104.

[0127] FIGS. 8D and 8E depict integration of the flexible circuit board 112 with the strap 104. As shown, the flexible circuit board 112 extends underneath the strap 104, along the strap 104, between the opposite ends 702 of the strap 104. Further, the flexible circuit board 112 is threaded up through a first one of the second set of cutouts 152 and dow n through a second one of the second set of cutouts 152 of one of the pairs 804 of the second set of cutouts 152. As a result, an additional length of flexible circuit board 112 may extend beyond the strap 104 and form a loop 810.

[0128] The third set of cutouts 800 of the flexible circuit board 112 are also lined up with the first set of cutouts 144 of the strap 104. More specifically, the third set of cutouts 800 of the flexible circuit board 1 12 are coaxial with the first set of cutouts 144 of the strap 104. With this construction, the flexible circuit board 112 and the strap 104 receive the sensors 150 through the first set of cutouts 144 and the third set of cutouts 800. The strap 104 overlays the flexible circuit board 112 in a direction normal to an exterior surface of the head 132, hereinafter referred to as the normal direction.

[0129] With this construction, the sensors 150 may be inserted through the first set of cutouts 144 and the third set of cutouts 800 in the normal direction. In this manner, the sensors 150 are accessible from a side of the strap 104 opposite the flexible circuit board 112 and the head 132 in the normal direction, and may be retained against the head 132 in the normal direction through the first set of cutouts 144 and the third set of cutouts 800 by the sensor fastener 110.

[0130] Threading the flexible circuit board 112 with the strap 104, and subsequently fastening the loops 810 and the sensors 150 may removably attach the flexible circuit board 112 to the strap 104. This is beneficial for swapping out flexible circuit boards 112 and straps 104 as well as preserving the elasticity or stretchability of the straps 104 in embodiments where the straps 104 are elastic. Further, connection by the connectors 802 to the housing 102 through the strap fasteners 122 provides a modular design that may be assembled, disassembled, and reassembled in the field without specialized tools, improving ease of use as compared to a configuration of the headset 100 where the flexible circuit board 112 is permanently affixed to the strap 104.

[0131] FIGS. 9A-D illustrate an example of the sensor fastener 110 and the sensor 150 in accordance with an embodiment of the headset 100. As shown in FIGS. 9A, 9C, and 9D, the sensor fastener 110 includes a first end portion 900 and a second end portion 902 extended in a direction opposite the first end portion 900. The first end portion 900 and the second end portion 902 are curved, forming hooks in the sensor fastener 110. In this manner, the first end portion 900 and the second end portion 902 extend around opposite edges of the straps 104 and the flexible circuit board 112 in the normal direction. With this construction, the first end portion 900 and the second end portion 902 accept and aid positioning and attachment to the straps 104 and the flexible circuit board 112 by fastening or engaging the opposite sides.

[0132] The sensor fastener 110 includes a snap fastener 904 that is integrally formed with, interposed between, and separates the first end portion 900 and the second end portion 902 in a front-back direction perpendicular to the normal direction and the left-right direction. The snap fastener 904 is occupies a middle position along the sensor fastener 110 that is equidistantfrom the first end portion 900 and the second end portion 902 in the front-back direction.

[0133] In the subject example, the snap fastener 904 may correspond to a dome or female portion of a snap fastener pair. In this regard, as shown in FIG. 9B, a stud portion 910 of the sensor 150 is extended in the normal direction and may be snapped into the snap fastener 904, removably connecting the sensor fastener 110 to the sensor 150. The stud portion 910 of the sensor 150 may also be inserted through the third set of cutouts 800 in the flexible circuit board 112 and the first set of cutouts 144 in the strap 104. In this manner, the sensor 150 is connected to the flexible circuit board 112 and strap 104 by way of the sensor fastener 1 10.

[0134] FIGS. 10A-D depict an example of the sensor 150 and various other sensor attachment embodiments. FIG. 10A depicts the sensor 150. The sensor 150 corresponds to an EEG electrode that detects neural electrical activity. In accordance with an embodiment, the sensor 150 may be an active dry EEG electrode. A dry electrode is a type of electrode that does not require a conductive gel or paste to operate. A dry electrode increases user comfort, reduces setup time, enhances reusability or durability, and requires less maintenance. A dry electrode, such as the sensor 150 depicted in FIG. 10A, may have multiple contact points 1000 (e.g., spikes) that improve signal quality and reduce noise from the sensor 150 to the housing 102.

[0135] An active electrode incorporates signal amplification. For example, the flexible circuit board may connect with an electrode and boost weak signals, reducing the impact of electrical noise and movement artifacts and providing more reliable data. Of course, the subject disclosure is not limited to active dry EEG electrodes. The electrodes may be passive, dry, or both. For example, the benefits of a moist or wet connection may be achieved in combination with an active sensor. Furthermore, the sensor may differ to support various neuro monitoring or neuromodulation capabilities including, but not limited to, near infrared hemoencephalography (nIR HEG), passive infrared hemoencephalograph (pIR HEG), photobiomodulation (PBM), and pulsed electromagnetic field (pEMF) therapy, or other neuromonitoring or neuromodulation capabilities. Still further yet, although the sensor 150, as depicted, may correspond to a tall sensor ty pe, the sensor 150 may correspond to any sensor type including flat, short, and tall sensor ty pes.

[0136] FIG. 10A also illustrates an example of the sensor fastener 110 and a combination of the sensor fastener 110 and the sensor 150. In this embodiment, the sensor fastener 110 may be manually operated by applying opposing forces at fingers 1002 that are rotatably connected portions which selectively engage the sensor 150. The fingers 1002 portions may engage with an extended portion of the sensor 150 to hold the sensor. FIG. 10B depicts an embodiment of the sensor fastener 110 that operates similar to the sensor fastener 110 of FIG. 10A. FIG. 10Cand FIG. 10D depict different embodiments of the sensor fastener 110 that provide a rotational connection in which an extended portion of the sensor 150 is inserted, and the sensor fastener 110 is rotated or twisted to lock the sensor 150 in place. Of course, this disclosure is not meant to limit the fasteners to those depicted, as other fasteners are possible and contemplated for use with the disclosed straps and headset.

[0137] FIGS. 11A-11D illustrate an example of the retainer 114 in accordance with an embodiment. The retainer 114 is a clip that frictionally engages and operates with respect to the strap 104 and the flexible circuit board 1 12. More specifically, as shown in FIG. 2, the retainer 114 may be inserted in the strap 104, with the middle portion 1104 extended through one of the second set of cutouts 152, where the retainer 114 secures an extended length of the flexible circuit board 112 to the strap 104, as shown in FIG. 2. Moreover, the retainer 114 is designed to allow adjustment of the flexible circuit board 112 to adapt to different size heads, including the head 132, for example.

[0138] With reference to FIGS. 11 A-l ID, the example retainer 114 includes a bottom portion 1102, a middle portion 1104, and a top portion 1110. The bottom portion 1102 is a U-shaped piece that is smaller than the middle portion 1104 and the top portion 11 10 in the left-right direction and the front-back direction. In operation depicted in FIG. 2, the bottom portion 1102 may be positioned on a back side 1112 of one of the straps 104, the back side 1112 being closest to the head 132 in the normal direction as compared to a front side 1114. Further, the top portion 1110 may be positioned on the front side 1114 of the strap 104, obstructing movement of the retainer 114 in the normal direction relative to the strap 104. The first set of cutouts 144 and the second set of cutouts 152 are apertures that extend through the strap 104, each aperture being a discrete hole fully enclosed by the strap 104 at the front side 1114 and the opposing back side 1112 of the strap 104.

[0139] Refernng back to FIGS. 11 A-l ID, the middle portion 1104 is also U-shaped, and smaller in size than the bottom portion 1102 and top portion 1110 in the front-back direction and the left-right direction. In this regard, the bottom portion 1102 and the top portion 1110 extend farther in the front-back direction and the left-right direction than the middle portion 1104. More specifically, the middle portion 1104 has a smaller footprint than the bottom portion 1 102 and the top portion 1110, and is entirely overlapped by the bottom portion 1102 and the top portion 1110 in the normal direction.

[0140] The middle portion 1104 may be positioned in one of the second set of cutouts 152 defined by the strap 104, where the retainer 114 receives the flexible circuit board 112. Further, the middle portion 1 104 includes a divider 1120 that divides at least a portion of the middleportion 1104 into two parts that receive the flexible circuit board 112 threaded therethrough, as shown in FIG. 2. With this construction, the loop 810 is obstructed from receding entirely underneath the strap 104, at the back side 1 112, and is prevented from separating from the strap 104 at the second set of cutouts 152. The top portion 1110 is also U-shaped and is larger than the bottom portion 1102 and middle portion 1104. In operation, the top portion 1110 may be positioned on the front side 1114 of a strap 104 away from the head 132, as depicted in FIG. 2. The front side 1114 of the strap 104 is located opposite the back side 1112, across the strap 104 in the normal direction.

[0141] FIG. 12 is a flow chart diagram depicting an example headset assembly method 1200. The method 1200 may be employed to assemble the headset 100 in accordance with aspects of this disclosure. Further, the method 1200 may be substantially reversed to disassemble the headset 100. Furthermore, the modular design permits easy replacement of individual components of the headset 100, including whole modular sensor assemblies 164 or individual components thereof, in some embodiments without tools.

[0142] The method 1200 starts at block 1210, where the flexible circuit board 112 is fed through the strap 104. The strap 104 may be elastic, include multiple pairs of the second set of cutouts 152, and include the first set of cutouts 144. The flexible circuit board 112 may be fed up and down through the pairs 804 of the second set of cutouts 152. Further, the flexible circuit board 112 may be positioned such that the third set of cutouts 800 in the flexible circuit board 112 align with the first set of cutouts 144 in the strap 104. In an embodiment, a retainer 114 may be positioned through a single one of the second set of cutouts 152, and the flexible circuit board 112 may be fed up and dow n through the retainer 114, forming the loop 810.

[0143] The method 1200 proceeds to block 1220, where the sensors 150 are inserted through the first set of cutouts 144 in the strap 104 and the third set of cutouts 800 in the flexible circuit board 112. The third set of cutouts 800 defined in the flexible circuit board 112 may be smaller than the first set of cutouts 144 in the strap 104. In this manner, the sensors 150 may contact a portion of the flexible circuit board 112, enabling communication of data from the sensor 150 to the flexible circuit board 112.

[0144] The method 1200 continues to block 1230. where the sensors 150 are attached with the sensor fasteners 110. In an embodiment, the sensors 150 may each include a stud portion 910 that extends through the strap 104 and the flexible circuit board 112. The sensor fasteners 110 may interact with the stud portions 910 to hold the sensors 150 in place with respect to the straps 104 and the flexible circuit boards 112. For example, the sensors 150 may be snapped into the sensor fasteners 110 at the snap fasteners 904, as shown in FIG. 2 and FIG. 9.

[0145] The method 1200 proceeds to block 1240, plugging the flexible circuit board 112 into one of the input connectors 304. One end of the flexible circuit board 112 may have one of the connectors 802 that is operable to connect with one of the input connectors 304. The input connectors 304 may be formed in the first housing portion 300, the second housing portion 302, or both.

[0146] Next, the method 1200 continues to block 1250. where the strap 104 is attached to the first housing portion 300. The strap 104 may include the strap fastener 122 at an end associated with the connector 802 of the flexible circuit board 1 12. Further, the strap fastener 122 may interact with a first fastener component 312 on the first housing portion 300 to removably attach one end of the strap 104 to the housing 102. For example, the strap fastener 122 may include an aperture 600 that receives a post on the housing 102, connecting the strap 104 to the housing 102. In one embodiment, the post may be threaded, and the screw 602 may be inserted to removably affix the strap 104 to the housing 102.

[0147] The method 1200 proceeds to block 1260, where the flexible circuit board 112 is plugged into another one of the input connectors 304. The flexible circuit board 112 may have the connector 802. which is operable to connect with the input connector 304.

[0148] The method 1200 continues to block 1270, where the strap is attached to the second housing portion 302. The strap 104 may include the strap fastener 122 at the end associated with the connector 802. The strap fastener 122 may interact with one of the first fastener components 312 on the second housing portion 302 to removably attach one end of the strap 104 to the housing 102. For instance, the strap fastener 122 may define the aperture 600 positioned through a post on the housing 102 to connect the strap 104 to the housing 102.

[0149] Next, the method 1200 proceeds to block 1280, where a decision is made as to whether all straps are connected and attached to the housings. If there are additional straps that have not been connected and attached to the housings (“NO”), the method 1200 loops back to block 1240. If all straps have been connected and attached (“YES”),” the method 1200 continues to block 1290.

[0150] At block 1290. at least one of the first housing portion 300 and the second housing portion 302 is connected to an external processing device. For example, the right housing may include the output connector 310 that may be connected to a computing device or other processor-based device through a cable. The computing device may then perform operations to interpret and analyze the data from the headset sensors.

[0151] Note that FIG. 12 is just one example of a method, and other methods including fewer, additional, or alternative steps are possible consistent with this disclosure.

[0152] FIG. 13 depicts an example processing system 1300 configured to perform various aspects described herein, including, for example, external processing of sensor data.

[0153] Processing system 1300 is generally an example of an electronic device configured to execute computer-executable instructions, such as those derived from compiled or interpreted computer code, including without limitation personal computers, tablet computers, servers, smart phones, smart devices, wearable devices, augmented or virtual reality devices, and others.

[0154] In the depicted example, processing system 1300 includes one or more processors 1302, one or more input / output devices 1304, one or more display devices 1306, and one or more network interfaces 1308 through which processing system 1300 is connected to one or more networks (e.g.. a local network, an intranet, the Internet, or any other group of processing systems communicatively connected to each other), and computer-readable medium 1312.

[0155] In the depicted example, the aforementioned components are coupled by a bus 1310, which may generally be configured for data or power exchange amongst the components. Bus 1310 may be representative of multiple buses, while only one is depicted for simplicity.

[0156] Processor(s) 1302 are generally configured to retrieve and execute instructions stored in one or more memories, including local memories like the computer-readable medium 1312, as well as remote memories and data stores. Similarly, processor(s) 1302 are configured to retrieve and store application data residing in local memories like the computer-readable medium 1312. as well as remote memories and data stores. More generally, bus 1310 is configured to transmit programming instructions and application data among the processor(s) 1302, display device(s) 1306, network interface(s) 1308, and computer-readable medium 1312. In certain embodiments, processor(s) 1302 are included to be representative of one or more central processing units (CPUs), graphics processing units (GPUs), tensor processing units (TPUs), accelerators, and other processing devices.

[0157] Input / output device(s) 1304 may include any device, mechanism, system, interactive display, or various other hardware components for communicating information between processing system 1300 and a user of processing system 1300. For example, input / output device(s) 1304 may include input hardware, such as a keyboard, touch screen, button, microphone, or other device for receiving inputs from the user. Input / output device(s) 1304 may further include display hardware, such as, for example, a monitor, a video card, or other device for sending or presenting visual data to the user. In certain embodiments, input / output device(s) 1304 is or includes a graphical user interface.

[0158] Display device(s) 1306 may generally include any device configured to display data, information, graphics, user interface elements, and the like to a user. For example, display device(s) 1306 may include internal and external displays, such as an internal display of atablet computer or an external display for a sen’ er computer or a projector. Display device(s) 1306 may further include displays for devices, such as augmented, virtual, or extended reality devices.

[0159] Network interface(s) 1308 provide processing system 1300 access to external networks and processing systems. Network interface(s) 1308 may generally be any device capable of transmitting or receiving data through a wired or wireless network connection. Accordingly, network interface(s) 1308 may include a transceiver for sending or receiving wired or wireless communication. For example, Network interface(s) 1308 may include an antenna, a modem, a LAN port, a Wi-Fi card, a WiMAX card, cellular communications hardware, near-field communication (NFC) hardware, satellite communication hardware, or any wired or wireless hardware for communicating with other networks or devices / systems. In certain embodiments, network interface(s) 1308 includes hardware configured to operate in accordance with the Bluetooth® wireless communication protocol.

[0160] Computer-readable medium 1312 may be a volatile memory, such as a random access memory (RAM), or anon-volatile memory', such as non-volatile random access memory, phase change random access memory', or the like. In this example, computer-readable medium 1312 includes sensor data analysis logic 1314. The sensor data analysis logic 1314 may be performed by the flexible circuit board or external processing device.

[0161] Note that FIG. 13 is just one example of a processing system consistent with aspects described herein, and other processing systems having additional, alternative, or fewer components are possible consistent with this disclosure.

[0162] FIGS. 14A-15F depict various perspective views of the first housing portion 300, which corresponds to a right housing portion that is secured to a right side of the head 132 of the user 134. As shown in FIGS. 14B and 15A, the first housing portion 300 includes input connectors 1400 that are sockets with receive and operatively connect the first sensor 402 and the second sensor 404 to the first housing portion. With this construction, the first sensor 402 and the second sensor 404 are interchangeable with similar or various sensors, enhancing a customizable aspect of the headset 100. The second housing portion 302 includes similar features and functions in a similar manner as the first housing portion 300, further description of which is omitted for the sake of brevity.

[0163] FIGS. 16A and 16B depict the first housing portion 300 fixed with a bracket 1600 included in the harness 120. The bracket 1600 receives a strap that extends under the chin 154 and secures the headset 100 to the head 132 of the user 134, as shown in FIG. 2.

[0164] FIGS. 17 and 18 depicts exploded views of the first housing portion 300 assembled with the first sensor 402, the second sensor 404, and the bracket 1600. As depicted, the first sensor 402, the second sensor 404, and the bracket 1600 are respectively fixed to the first housing portion by fasteners 1700. The fasteners 1700 also fix the first housing portion 300 to encase the printed circuit board 320. While, as depicted, the fasteners 1700 are screws, the fasteners may additionally or alternatively include pins, bolts, clips, rivets, studs, anchors, threaded press-fit inserts, and various other removable mechanical fasteners without departing from the scope of the present disclosure.

[0165] FIGS. 19A-20C depict various views and embodiments of one of the straps 104. In this regard, the straps 104 may have various lengths between the opposite ends 702, and define the first set of cutouts 144 and the second set of cutouts 152 with various spacing and numerosity without departing from the scope of the present disclosure.

[0166] FIGS. 21A and 21B depict one of the sensors 150 in an embodiment including the contact points 1000. As depicted, the stud portion 910 extends in the normal direction, opposite the spikes forming the contact points 1000. As such, the stud portion 910 extends through the strap 104 and the flexible circuit board 112 in the normal direction while the contact points 1000 are directed toward and contacts the head 132 of the user 134.

[0167] FIGS. 21 C and 21D depict one of the snap fasteners 904 included in one of the sensor fasteners 110. The depicted snap fastener 904 forms a recess 2100 complementary to the sensors 150, including the stud portion 910, for removably fixing the sensor fastener 110 and the sensor 150 in a snap fit connection on one of the straps 104.

[0168] FIGS. 21E and 21F depict one of the sensors 150 in an alternative embodiment including a contact surface 2102. The contact surface 2102 functions in a similar manner as the contact points 1000 with respect to generating biomedical monitoring data. As depicted, the stud portion 910 extends in the normal direction from the contact surface 2102. As such, the stud portion 910 extends through the strap 104 and the flexible circuit board 112 in the normal direction while the contact surface 2102 is directed toward and contacts the head 132 of the user 134.

[0169] FIGS. 22A-22C depict various views of one of the sensor fasteners 110, including the first end portion 900. the second end portion 902, and the snap fastener 904. The snap fastener 904 is positioned at a middle portion of the sensor fastener 110 between the first end portion900 and the second end portion 902 in the front-back direction. In an embodiment, the snap fastener 904 may be integrally formed with the first end portion 900 and the second end portion 902. The first end portion 900 and the second end portion 902 extend in opposite directions from the snap fastener 904, in the front-back direction. The first end portion 900 and the second end portion 902 center the snap fastener on the strap 104 in the front-back direction, aligning the snap fastener 904 with one of the first set of cutouts 144 and one of the third set of cutouts 800, through which the sensor 150, including the stud portion 910 is inserted and received by the snap fastener 904.

[0170] FIGS. 23A-23C depicts various views of the retainer 114, including the bottom portion 1102, the middle portion 1104, the top portion 1110, and the divider 1120. As shown in FIG. 23C, the divider 1120 extends partially through the retainer 114 in the front-back direction. More specifically, the divider 1120 extends from a first retainer end 2300 toward a second retainer end 2302, beyond a midpoint between the first retainer end 2300 and the second retainer end 2302 in the front-back direction. With this construction, a loop 810 formed at the divider 1120 is retained by the divider 1120 when the strap 104 is articulated or stretched, but may be removed by a user without removing the flexible circuit board 112 from the strap 104. Also, the retainer 1 14 may be directly removed from the strap 104 and the flexible circuit board 112 without further disassembling any other components of the headset 100.

[0171] FIGS. 24-27B depict various views of one of the modular sensor assemblies 164 in a flat configuration. As depicted, the loops 810 are interposed between and separate consecutive cutouts in the third set of cutouts 800, along the flexible circuit board 112 in the left-right direction. With this construction, the flexible circuit board 112 includes slack material between consecutive cutouts in the third set of cutouts 800, and may individually accommodate variable spacing among the third set of cutouts 800, avoiding becoming taut in the headset 100, along the length of the strap 104 between the opposite ends 702. This includes circumstances where the strap 104 flexes and articulates during assembly and use, including the flexing shown in FIGS. 27A and 27B.

[0172] FIGS. 28A and 28B depicts cross sectional views of one of the modular sensor assemblies 164. As depicted, the stud portion 910 is smaller in size than the cutout in the third set of cutouts 800 in the front-back direction and the left-right direction. Also, the contact surface 2102 of the sensor 150 is larger in size than the cutout in the third set of cutouts 800 in the front-back direction and the left-right direction. With this construction, the contact surface 2102 of the sensor 150 obstructs the sensor 150 from further motion through the flexible circuit board 112 when the stud portion 910 is inserted through the flexible circuit board 112 in thenormal direction, maintaining the contact surface 2102 as an exterior surface of the modular sensor assembly 164 that engages the head 132 of the user 134.

[0173] FIGS. 29A and 29B depicts the headset 100 in a worn configuration, wear the headset 100 may articulate around and engage the head 132 of the user 134, generating associated sensor data at the modular sensor assemblies 164. FIGS. 30A and 30B depict example node positions 3000 on the head 132 of the user 134. The modular sensor assemblies 164 may be sized, shaped, and equipped with various configurations of the sensors 150 as described above to engage the head 132 of the user 134 at the node positions 3000, generating targeted sensor data.

[0174] The preceding description is provided to enable any person skilled in the art to practice the various embodiments described herein. The examples discussed herein are not limiting of the scope, applicability, or embodiments set forth in the claims. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments. For example, changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as appropriate. For instance, the methods described may be performed in an order different from those described, and various steps may be added, omitted, or combined. Also, features described with respect to some examples may be combined in some other examples. For example, an apparatus may be implemented, or a method may be practiced using any number of the aspects set forth herein. In addition, the scope of the disclosure is intended to cover such an apparatus or method practiced using other structure, functionality, or structure and functionality in addition to, or other than, the various aspects of the disclosure set forth herein. It should be understood that any aspect of the disclosure disclosed herein may be embodied by one or more elements of a claim.

[0175] As used herein, a phrase referring to “at least one of’ a list of items refers to any combination of those items, including single members. As an example, “at least one of: a, b, or c” is intended to cover a, b, c. a-b, a-c, b-c, and a-b-c. as well as any combination with multiples of the same element (e.g., a-a, a-a-a. a-a-b, a-a-c, a-b-b. a-c-c, b-b, b-b-b. b-b-c, c-c, and c-c-c or any other ordering of a, b, and c).

[0176] As used herein, the term “determining” encompasses a wide variety of actions. For example, “determining” may include calculating, computing, processing, deriving, investigating, looking up (e.g., looking up in a table, a database, or another data structure), ascertaining, and the like. Also, “determining” may include receiving (e.g., receivinginformation), accessing (e.g., accessing data in a memory ), and the like. Also, “determining” may include resolving, selecting, choosing, establishing, and the like.

[0177] As used in this application, "or" is intended to mean an inclusive "or" rather than an exclusive "or". Further, an inclusive “or” may include any combination thereof (e.g., A, B, or any combination thereof). In addition, "a" and "an" as used in this application are generally construed to mean "one or more" unless specified otherw ise or clear from context to be directed to a singular form. Additionally, at least one of A and B and / or the like generally means A or B or both A and B. Further, to the extent that "includes", "having", "has", "with", or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term "comprising”.

[0178] Further, unless specified otherwise, “first”, “second”, or the like are not intended to imply a temporal aspect, a spatial aspect, an ordering, etc. Rather, such terms are merely used as identifiers, names, etc. for features, elements, items, etc. For example, a first channel and a second channel generally correspond to channel A and channel B or two different or two identical channels or the same channel. Additionally, “comprising”, “comprises”, “including”, “includes”, or the like generally means comprising or including, but not limited thereto.

[0179] The methods disclosed herein include one or more steps or actions for achieving the methods. The method steps or actions may be interchanged with one another without departing from the scope of the claims. In other words, unless a specific order of steps or actions is specified, the order or use of specific steps or actions may be modified without departing from the scope of the claims. Further, the various operations of methods described above may be performed by any suitable means capable of performing the corresponding functions. The means may include various hardware or software component(s) or module(s), including, but not limited to a circuit, an application specific integrated circuit (ASIC), or processor. Generally, where operations are illustrated in figures, those operations may have corresponding counterpart means-plus-function components with similar numbering.

[0180] The following claims are not intended to be limited to the embodiments shown herein, but are to be accorded the full scope consistent with the language of the claims. Within a claim, reference to an element in the singular is not intended to mean “one and only one” unless specifically so stated, but rather “one or more.” Unless specifically stated otherwise, the term “some” refers to one or more. No claim element is to be construed under the provisions of 35 U.S.C. §112(f) unless the element is expressly recited using the phrase “means for” or, in the case of a method claim, the element is recited using the phrase “step for.” All structural and functional equivalents to the elements of the various aspects described throughout thisdisclosure that are known or later become known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public, regardless of whether such disclosure is explicitly recited in the claims.

Claims

CLAIMSWhat is claimed is:

1. A modular sensor assembly comprising: a flexible circuit board; a strap that overlays the flexible circuit board in a normal direction, defines a first set of cutouts, and defines a second set of cutouts, wherein the flexible circuit board forms a loop extended through the second set of cutouts; and a sensor inserted through the first set of cutouts in the normal direction, wherein the sensor engages the strap and is communicatively coupled to the flexible circuit board.

2. The modular sensor assembly of claim 1. wherein the first set of cutouts includes an aperture defined in the strap, the second set of cutouts includes a slit that frictionally engages the loop, and the strap defines the first set of cutouts and the second set of cutouts in an alternating pattern extended in a direction between opposite ends of the strap, perpendicular to the normal direction.

3. The modular sensor assembly of claim 1, further comprising a sensor fastener fixed with the strap at a side of the strap opposite the flexible circuit board in the normal direction, wherein the sensor fastener retains the sensor at the first set of cutouts.

4. The modular sensor assembly of claim 3, wherein the strap includes edges extended in a left-right direction perpendicular to the normal direction, the sensor fastener is a clip having a first end portion and a second end portion extended from the first end portion in a front-back direction perpendicular to the normal direction and the left-right direction, and the first end portion and the second end portion are hooks curved around the edges of the strap in the normal direction.

5. The modular sensor assembly of claim 3, wherein the sensor includes a stud portion inserted through the strap from a back side of the strap, and the sensor fastener engages the stud portion in a snap fit assembly at a front side of the strap opposite the back side in the normal direction.

6. The modular sensor assembly of claim 1, further comprising a retainer fixed to the strap at the second set of cutouts, wherein the second set of cutouts frictionally engages the loop through the retainer, inhibiting movement of the flexible circuit board through the second set of apertures.

7. The modular sensor assembly of claim 6, wherein the retainer includes a bottom portion, a middle portion, and a top portion that are U-shaped, the bottom portion extends along a back side of the strap, the middle portion is disposed in the second set of cutouts, and the top portion extends along a front side of the strap, and the middle portion is smaller than the bottom portion or the top portion in a left-right direction or a front-back direction perpendicular to the normal direction.

8. The modular sensor assembly of claim 1, wherein the flexible circuit board defines a third set of cutouts that overlap the first set of cutouts in the normal direction, and receive the sensor in the normal direction, wherein the flexible circuit board contacts the sensor at the third set of cutouts.

9. The modular sensor assembly of claim 1, further comprising a housing fixed with an end of the strap, and communicatively coupled with the sensor through the flexible circuit board.

10. The modular sensor assembly of claim 9, further comprising a strap fastener that removably fixes an end of the flexible circuit board and the end of the strap to the housing, and communicatively couples the sensor and the flexible circuit board to the housing.

11. The modular sensor assembly of claim 10, wherein the housing includes an input connector that receives sensor data from the flexible circuit board, and includes a first fastener component off's et from the input connector, the strap fastener includes a second fastener component complementary with the first fastener component in a manner that removably fixes the strap fastener to the housing, and includes a tag extended from an interface between the strap fastener and the strap, at a side of the strap fastener opposite the second fastener component.

12. A headset including the modular sensor assembly of claim 1 , further comprising a first housing portion and a second housing portion fixed with opposite ends of the strap and the flexible circuit board, wherein the first housing portion and the second housing portion engage a left side and a right side of a head of a user.

13. The headset of claim 12, wherein the first housing portion or the second housing portion includes an ear sensor that is electrically conductive as compared to the first housing portion or the second housing portion, directly contacts an ear of a user, and functions as a ground for electronic components in the headset.

14. The headset of claim 12, further comprising a harness that connects the first housing portion to the second housing portion underneath a chin of the user, securing the first housing portion and the second housing portion to the head of the user.

15. A biomedical monitoring apparatus comprising a plurality of modular sensor assemblies, each modular sensor assembly configured as recited in claim 1, the biomedical monitoring apparatus further comprising a housing communicatively coupled each of the modular sensor assemblies, wherein each of the modular sensor assemblies are individually removably fixed with the housing.

16. The biomedical monitoring apparatus of claim 15, wherein the housing includes input connectors angled and offset from each other in an arc pattern, and the input connectors each receive sensor data from one of the modular sensor assemblies.

17. The biomedical monitoring apparatus of claim 16, wherein the housing includes first fastener components angled and offset from each other in the arc pattern, aligned with the input connectors in a radial direction perpendicular to the arc pattern, wherein the first fastener components removably fix the modular sensor assemblies to the housing.

18. The biomedical monitoring apparatus of claim 17, wherein the modular sensor assemblies each include a second fastener component complementary with one of the first fastener components in a manner that removably fixes the modular sensor assemblies to the housing, and the modular sensor assemblies each respectively form a perimeter angled or rounded from the second fastener component toward the strap at an outer edge of the housing.

19. The modular sensor assembly of claim 1, wherein the sensor is a dry active sensor that detects neural electrical activity of a brain as an electroencephalogram (EEG) electrode.

20. The modular sensor assembly of claim 1 , wherein the first set of cutouts and the second set of cutouts are apertures that extend through the strap, each aperture being a discrete hole fully enclosed by the strap at a front side and an opposing back side of the strap.

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