Display substrate and display device

Abstract

At least one embodiment of the present disclosure provides a display substrate and a display device. The display substrate comprises: a base substrate; a pixel defining layer comprising a plurality of pixel openings and pixel spacing parts; a plurality of sub-pixels having one-to-one correspondence with the plurality of pixel openings, each sub-pixel comprising a light-emitting element, the light-emitting element comprising a light-emitting functional layer, a second electrode and a first electrode, and the first electrode being located between the light-emitting functional layer and the base substrate; and partition structures located between adjacent sub-pixels and located on the side of the pixel spacing parts away from the base substrate. Each light-emitting functional layer comprises a first organic light-emitting functional layer, a first charge generation layer, a second organic light-emitting functional layer, a second charge generation layer, and a third organic light-emitting functional layer which are at least partially stacked on the pixel spacing parts on a main surface perpendicular to the base substrate, and the distance from the surface, farthest from the pixel defining layer, of the portion of the second charge generation layer located on the pixel spacing parts to the pixel defining layer is less than the height of the partition structures.

Description

Display substrate and display device Technical Field

[0001] Embodiments of the present disclosure relate to a display substrate and a display device. Background Art

[0002] With the continuous development of display technology, organic light-emitting diode display devices (OLED) have become a research hotspot and technology development direction for major manufacturers due to their advantages such as wide color gamut, high contrast, thin and light design, self-luminescence, and wide viewing angle.

[0003] Currently, organic light-emitting diode (OLED) displays are widely used in a variety of electronic products, ranging from small devices like smart bracelets, smart watches, smartphones, and tablets to large devices like laptops, desktop computers, and televisions. Consequently, market demand for active-matrix organic light-emitting diode (OLED) displays is also growing rapidly.

[0004] Summary of the Invention

[0005] At least one embodiment of the present disclosure provides a display substrate and a display device, in which the light-emitting functional layer includes a first organic light-emitting functional layer, a first charge generating layer, a second organic light-emitting functional layer, a second charge generating layer and a third organic light-emitting functional layer at least partially stacked on a pixel spacing portion on a main surface perpendicular to the base substrate, and the distance between the surface of the portion of the second charge generating layer located on the pixel spacing portion farthest from the pixel defining layer and the pixel defining layer is smaller than the height of the partition structure in a direction perpendicular to the main surface of the base substrate, so that the partition structure can at least separate the first charge generating layer and the second charge generating layer corresponding to different sub-pixels to prevent lateral drift of charges between adjacent sub-pixels, thereby avoiding crosstalk between adjacent sub-pixels caused by the charge generating layer with higher conductivity, and further improving the display problem of crosstalk between pixels that is prone to occur in the stacked display substrate.

[0006] At least one embodiment of the present disclosure provides a display substrate, which includes: a base substrate; a pixel defining layer located on the base substrate and including a plurality of pixel openings and a pixel spacer; a plurality of sub-pixels located on the base substrate and corresponding one-to-one to the plurality of pixel openings, each sub-pixel including a light-emitting element, the light-emitting element including a light-emitting functional layer and a second electrode and a first electrode located on both sides of the light-emitting functional layer in a direction perpendicular to the main surface of the base substrate, the first electrode being located between the light-emitting functional layer and the base substrate; and a partition structure located between adjacent sub-pixels and on a side of the pixel spacer away from the base substrate, wherein the light-emitting functional layer includes a first organic light-emitting functional layer, a first charge generation layer, a second organic light-emitting functional layer, a second charge generation layer and a third organic light-emitting functional layer at least partially stacked on the pixel spacer on the main surface perpendicular to the base substrate, and a distance between a surface of a portion of the second charge generation layer located on the pixel spacer farthest from the pixel defining layer and the pixel defining layer is less than a height of the partition structure in a direction perpendicular to the main surface of the base substrate.

[0007] For example, in the display substrate provided in at least one embodiment of the present disclosure, the second charge generating layer includes a second electron generating sublayer and a second hole generating sublayer arranged in a stacked manner, and the distance between the surface of the portion of the second hole generating sublayer located on the pixel spacing portion farthest from the pixel defining layer and the pixel defining layer is smaller than the height of the partition structure in a direction perpendicular to the main surface of the base substrate.

[0008] For example, in the display substrate provided in at least one embodiment of the present disclosure, the distance between the surface of the portion of the second hole generating sublayer located on the pixel spacer farthest from the pixel defining layer and the pixel defining layer is L1, and the height of the partition structure in the direction perpendicular to the main surface of the base substrate is L2, L1 is greater than or equal to 0.12 μm and less than or equal to 0.14 μm, and L2 is greater than or equal to 0.42 μm and less than or equal to 1.45 μm.

[0009] For example, in the display substrate provided in at least one embodiment of the present disclosure, the first organic light-emitting functional layer includes a stacked hole injection layer, a first hole transport layer, a first electron blocking layer, a first organic light-emitting layer, a first hole blocking layer and a first electron transport layer; the first charge generation layer includes a stacked first electron generating sublayer and a first hole generating sublayer; the second organic light-emitting functional layer includes a second hole transport layer, a second electron blocking layer, a second organic light-emitting layer, a second hole blocking layer and a second electron transport layer; the third organic light-emitting functional layer includes a stacked third hole transport layer, a third electron blocking layer, a third organic light-emitting layer, a third hole blocking layer and a third electron transport layer. blocking layer and a third electron transport layer; the hole injection layer, the first hole transport layer and the first electron blocking layer constitute a first organic functional layer; the first hole blocking layer, the first electron transport layer, the first electron generating sublayer, the first hole generating sublayer, the second hole transport layer and the second electron blocking layer constitute a second organic functional layer; the second hole blocking layer, the second electron transport layer, the second electron generating sublayer, the second hole generating sublayer, the third electron blocking layer and the third electron transport layer constitute a third organic functional layer; the third hole blocking layer and the third electron transport layer constitute a fourth organic functional layer.

[0010] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness L3 of the second organic functional layer and the thickness L4 of the first organic functional layer have a relationship of: L3>L4.

[0011] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness L5 of the third organic functional layer and the thickness L6 of the fourth organic functional layer have a relationship of: L5>L6.

[0012] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness L3 of the second organic functional layer is less than or equal to the thickness L5 of the third organic functional layer.

[0013] For example, in the display substrate provided in at least one embodiment of the present disclosure, the sub-pixel is a red sub-pixel, and the thicknesses of the first organic light-emitting layer, the second organic light-emitting layer and the third organic light-emitting layer in the red sub-pixel are all greater than the thickness of the thickest sub-layer in the first organic functional layer, and are all greater than the thickness of the thickest sub-layer in the third organic functional layer.

[0014] For example, in the display substrate provided in at least one embodiment of the present disclosure, the sub-pixel is a blue sub-pixel, and the thicknesses of the first organic light-emitting layer, the second organic light-emitting layer and the third organic light-emitting layer in the blue sub-pixel are all smaller than the thickness of the thickest sub-layer in the first organic functional layer, and are also smaller than the thickness of the thickest sub-layer in the third organic functional layer.

[0015] For example, in the display substrate provided in at least one embodiment of the present disclosure, the plurality of pixel openings respectively define effective light-emitting areas of the corresponding plurality of sub-pixels, and the pixel openings are configured to expose the first electrode.

[0016] At least one embodiment of the present disclosure further provides a display device, which includes the display substrate described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0018] FIG1 is a schematic cross-sectional view of a display substrate according to at least one embodiment of the present disclosure;

[0019] FIG2 is a schematic cross-sectional view of a partial layer structure of the light-emitting functional layer, the pixel defining layer, and the partition structure in FIG1 ;

[0020] FIG3 is a schematic cross-sectional view of another display substrate provided by at least one embodiment of the present disclosure;

[0021] FIG4 is a schematic cross-sectional view of a partial layer structure of the light-emitting functional layer, the pixel defining layer, and the partition structure in FIG3 ;

[0022] FIG5 is a schematic cross-sectional view of another display substrate provided by at least one embodiment of the present disclosure;

[0023] FIG6 is a schematic cross-sectional view of a partial layer structure of the light-emitting functional layer, the pixel defining layer, and the partition structure in FIG5 ;

[0024] FIG7 is a schematic cross-sectional view of various layer structures of a display substrate provided by at least one embodiment of the present disclosure; and

[0025] FIG8 is a schematic diagram of a display device provided by at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0027] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0028] Unless otherwise defined, the features such as "parallel", "perpendicular" and "same" used in the embodiments of the present invention include the situations of "parallel", "perpendicular", "same" in a strict sense, as well as the situations of "approximately parallel", "approximately perpendicular", "approximately the same" and the like that contain a certain error. For example, the above-mentioned "approximately" may mean that the difference between the compared objects is 10% of the average value of the compared objects, or within 5%. When the number of a component or element is not specifically indicated below in the embodiments of the present invention, it means that the component or element may be one or more, or may be understood as at least one. "At least one" refers to one or more, and "multiple" refers to at least two. The "same-layer setting" in the embodiments of the present invention refers to the relationship between multiple film layers formed by the same material after the same step (for example, a one-step patterning process). The "same layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same.

[0029] Currently, mass-produced stacked organic light-emitting diode (OLED) displays have a structure with two stacked light-emitting layers. However, to further improve the display efficiency and extend the life of OLED displays, the inventors of the present disclosure have noted that the structure with two stacked light-emitting layers can be replaced with a structure with three stacked light-emitting layers, with each light-emitting layer separated by an organic layer. This can achieve ultra-high display efficiency and an ultra-long life of the OLED display. The inventors of the present disclosure have also noted that by limiting the thickness relationship between the various layers of the OLED display structure, the light extraction efficiency of the microcavity structure can be enhanced. Furthermore, the inventors of the present disclosure have also noted that the three stacked light-emitting layers are separated by two groups of charge generation layers, each group of charge generation layers comprising a hole charge generation layer and an electron charge generation layer. This can easily lead to lateral drift between adjacent pixels, making the stacked OLED display prone to crosstalk between pixels, which can cause display problems. A partition structure is provided on the pixel definition layer of an organic light-emitting diode display device, and the height of the partition structure and the distance relationship between the portion of the second charge generation layer located on the pixel spacing portion and the surface farthest from the pixel definition layer are defined. The second charge generation layers corresponding to different sub-pixels are separated by the partition structure, thereby preventing the lateral drift of charges between different sub-pixels, thereby improving the display problem caused by crosstalk between pixels that is prone to occur in stacked organic light-emitting diode display devices.

[0030] At least one embodiment of the present disclosure provides a display substrate, which includes: a base substrate; a pixel defining layer is provided on the base substrate, and the pixel defining layer includes a plurality of pixel openings and a pixel spacer; a plurality of sub-pixels are provided on the base substrate, and the plurality of sub-pixels correspond one-to-one to the plurality of pixel openings, and each sub-pixel includes a light-emitting element, and the light-emitting element includes a light-emitting functional layer and a second electrode and a first electrode located on both sides of the light-emitting functional layer in a direction perpendicular to the main surface of the base substrate, and the first electrode is located between the light-emitting functional layer and the base substrate; the display substrate also includes a partition structure located between adjacent sub-pixels, and the partition structure is located on the side of the pixel spacer away from the base substrate, and the light-emitting functional layer includes a first organic light-emitting functional layer, a first charge generation layer, a second organic light-emitting functional layer, a second charge generation layer and a third organic light-emitting functional layer at least partially stacked on the pixel spacer on the main surface perpendicular to the base substrate, and the distance between the surface of the portion of the second charge generation layer located on the pixel spacer farthest from the pixel defining layer and the pixel defining layer is less than the height of the partition structure in the direction perpendicular to the main surface of the base substrate.

[0031] For example, in the display substrate provided in the embodiment of the present disclosure, the light-emitting functional layer includes a first organic light-emitting functional layer, a first charge generating layer, a second organic light-emitting functional layer, a second charge generating layer and a third organic light-emitting functional layer at least partially stacked on the pixel spacing portion on the main surface perpendicular to the base substrate, and the distance between the surface of the part of the second charge generating layer located on the pixel spacing portion farthest from the pixel defining layer and the pixel defining layer is smaller than the height of the partition structure in the direction perpendicular to the main surface of the base substrate, so that the partition structure can at least separate the first charge generating layer and the second charge generating layer corresponding to different sub-pixels to prevent the lateral drift of charges between adjacent sub-pixels, thereby avoiding the crosstalk between adjacent sub-pixels caused by the charge generating layer with higher conductivity, and further improving the display problem of crosstalk between pixels that is prone to occur in the stacked display substrate.

[0032] The display substrate provided by the embodiment of the present disclosure includes three stacked light-emitting layers, and the adjacent light-emitting layers are separated by organic layers. The display substrate provided by the embodiment of the present disclosure can achieve ultra-high efficiency of the organic light-emitting display device and ultra-long service life of the organic light-emitting display device. The display substrate provided by the embodiment of the present disclosure also enhances the light extraction efficiency of the microcavity structure by limiting the thickness relationship between the various layer structures in the display substrate. Moreover, the display substrate provided by the embodiment of the present disclosure also makes the distance between the surface of the portion of the second charge generation layer located on the pixel spacing portion farthest from the pixel defining layer and the pixel defining layer less than the height of the partition structure in the direction perpendicular to the main surface of the base substrate, so that the partition structure at least separates the first charge generation layer and the second charge generation layer corresponding to different sub-pixels to prevent the lateral drift of charges between adjacent sub-pixels, thereby further avoiding the crosstalk between adjacent sub-pixels caused by the charge generation layer with higher conductivity, so as to improve the display problem of crosstalk between pixels that is prone to occur in the stacked display substrate.

[0033] For example, FIG1 is a schematic cross-sectional view of a display substrate provided in at least one embodiment of the present disclosure. As shown in FIG1 , the display substrate 100 includes: a base substrate 101; a pixel defining layer 102 disposed on the base substrate 101, wherein the pixel defining layer 102 includes a plurality of pixel openings 103 and a pixel spacer 104. A plurality of sub-pixels 105 are disposed on the base substrate 101, each corresponding one-to-one to the plurality of pixel openings 103. Each sub-pixel 105 includes a light-emitting element 106, which includes a light-emitting functional layer 1061 and a second electrode 1063 and a first electrode 1062 located on either side of the light-emitting functional layer 1061 in a direction perpendicular to the main surface of the base substrate 101. The first electrode 1062 is located between the light-emitting functional layer 1061 and the base substrate 101. For example, the display substrate 100 is an organic light-emitting diode display substrate. When the organic light-emitting diode display substrate is used in a display panel, adjacent sub-pixels 105 display different colors.

[0034] For example, in one embodiment, the first electrode 1062 is an anode and the second electrode 1063 is a cathode. The cathode can be formed of a material with high conductivity and low work function, for example, the cathode can be made of a metal material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0035] For example, as shown in FIG1 , the display substrate 100 further includes a partition structure 107 located between adjacent sub-pixels 105. The partition structure 107 is located on a side of the pixel spacer 104 that is away from the base substrate 101. For example, in the structure shown in FIG1 , the surface of the partition structure 107 that is farthest from the base substrate 101 is higher than the surface of the second electrode 1063 that is farthest from the base substrate 101, so that the partition structure 107 can completely separate the light-emitting structures corresponding to different sub-pixels.

[0036] For example, since the display substrate 100 can avoid crosstalk between adjacent sub-pixels through the partition structure 107, the display substrate can improve pixel density while adopting a double-layer light-emitting design, thereby making the display substrate have the advantages of long life, low power consumption, high brightness and high resolution.

[0037] For example, as shown in FIG1 , a first cross-section of the partition structure 107, taken along a plane perpendicular to the substrate 101 and along the arrangement direction of adjacent sub-pixels 105, has an inverted trapezoidal shape, i.e., the length of the base of the trapezoid away from the substrate 101 is greater than the length of the base of the trapezoid closer to the substrate 101. For example, the angle between the side of the inverted trapezoid and the base of the inverted trapezoid closer to the substrate 101 is no less than 95 degrees. For example, the angle between the side of the inverted trapezoid and the base of the inverted trapezoid away from the substrate 101 is no more than 85 degrees. This angle design can make the angle between the side of the partition structure 107 and the base of the inverted trapezoid away from the substrate 101 acute, thereby facilitating the subsequent formation of the light-emitting functional layer, such that the light-emitting functional layer is disconnected at the edge of the partition structure 107. Of course, the cross-sectional shape of the partition structure 107 in the display substrate provided in the embodiments of the present disclosure is not limited to the above-mentioned inverted trapezoid, and can also be a rectangle, a regular trapezoid, etc., and the embodiments of the present disclosure are not limited thereto.

[0038] For example, Figure 2 is a schematic diagram of the cross-sectional structure of the partial layer structure, pixel defining layer and partition structure of the light-emitting functional layer in Figure 1. For example, in combination with Figures 1 and 2, the light-emitting functional layer 1061 includes a first organic light-emitting functional layer 201, a first charge generating layer 202, a second organic light-emitting functional layer 203, a second charge generating layer 204 and a third organic light-emitting functional layer 205, which are at least partially stacked on the pixel spacing portion 104 on the main surface perpendicular to the base substrate 101, and the distance between the surface of the part of the second charge generating layer 204 located on the pixel spacing portion 104 farthest away from the pixel defining layer 102 and the pixel defining layer 102 is less than the height of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101. For example, in the structure shown in Figure 2, the distance between the surface of the part of the second charge generating layer 204 located on the pixel spacing portion 104 that is farthest from the pixel defining layer 102 and the pixel defining layer 102 is L1, and the height of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is L2, and L1 is less than L2, so that the partition structure 107 can at least separate the first charge generating layer 202 and the second charge generating layer 204 corresponding to different sub-pixels to prevent lateral drift of charges between adjacent sub-pixels, thereby further avoiding crosstalk between adjacent sub-pixels caused by the first charge generating layer and the second charge generating layer with higher conductivity, so as to improve the display problem of inter-pixel crosstalk that is prone to occur in the stacked display substrate.

[0039] For example, in the structure shown in FIG2 , the first charge generation layer 202 includes a first electron generation sublayer 2021 and a first hole generation sublayer 2022 arranged in a stacked manner, wherein the first electron generation sublayer 2021 is configured to generate electrons and the first hole generation sublayer 2022 is configured to generate holes. The second charge generation layer 204 includes a second electron generation sublayer 2041 and a second hole generation sublayer 2042 arranged in a stacked manner, wherein the second electron generation sublayer 2041 is configured to generate electrons and the second hole generation sublayer 2042 is configured to generate holes. In the structure shown in FIG2 , the distance between the surface of the portion of the second hole generation sublayer 2042 located on the pixel spacer 104 that is farthest from the pixel defining layer 104 and the pixel defining layer 104 is less than the height of the partition structure 107 in a direction perpendicular to the main surface of the base substrate 101.

[0040] For example, in the structure shown in FIG2 , the distance between the surface of the portion of the second hole-generating sublayer 2042 located on the pixel spacer 104 that is farthest from the pixel-defining layer 104 and the pixel-defining layer 104 is L1, and the height of the partition structure 107 in a direction perpendicular to the main surface of the base substrate 101 is L2. L1 is greater than or equal to 0.12 μm and less than or equal to 0.14 μm, and L2 is greater than or equal to 0.42 μm and less than or equal to 1.45 μm. For example, L2 can be 1 to 10 times greater than L1.

[0041] For example, in one example, the height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 1.45 μm, and the distance L1 between the surface of the portion of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.14 μm.

[0042] For example, in one example, the height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 1.05 μm, and the distance L1 between the surface of the portion of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 μm.

[0043] For example, in one example, the height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.85 μm, and the distance L1 between the surface of the portion of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 μm.

[0044] For example, in one example, the height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.71 μm, and the distance L1 between the surface of the portion of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 μm.

[0045] For example, in one example, the height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.42 μm, and the distance L1 between the surface of the portion of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 μm.

[0046] For example, in one example, the height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.42 μm, and the distance L1 between the surface of the portion of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.12 μm.

[0047] For example, in the structures shown in Figures 1 and 2 , the plurality of sub-pixels 105 may be arranged in an array along a first direction and a second direction intersecting each other. For the partition structure 107 between two adjacent sub-pixels 105 in the first direction, both edges of the partition structure 107 protrude relative to corresponding edges of the pixel spacer 104.

[0048] For example, Figure 1 shows that a partition structure 107 is set between two adjacent sub-pixels 105, but the embodiments of the present disclosure are not limited to this. Two or more partition structures can also be set between two adjacent sub-pixels 105. By setting the number of partition structures, it is beneficial to achieve a better disconnection effect on the second charge generation layer 204.

[0049] For example, in the structures shown in FIG. 1 and FIG. 2 , the material of the partition structure 107 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride.

[0050] For example, the conductivity of the first charge generation layer 202 and the conductivity of the second charge generation layer 204 are both greater than the conductivity of the first organic light-emitting layer 304 and the conductivity of the second organic light-emitting layer 309 , and less than the conductivity of the second electrode 1063 .

[0051] For example, Figure 3 is a schematic diagram of the cross-sectional structure of another display substrate provided in at least one embodiment of the present disclosure. The difference between the structure shown in Figure 3 and Figure 1 is that in the structure shown in Figure 3, the second electrode 1063 is located above the partition structure 107, and the surface of the light-emitting functional layer 1061 away from the base substrate 101 is flush with the surface of the partition structure 107 away from the base substrate 101, that is, the light-emitting functional layer 1061 is disconnected at the partition structure 107, while the second electrode 1063 remains continuous and not interrupted, thereby preventing crosstalk between adjacent sub-pixels. At the same time, the fact that the second electrode is not interrupted ensures the uniformity of display when the display substrate is used in a display panel for display.

[0052] For example, FIG4 is a schematic cross-sectional view of the partial layer structure of the light-emitting functional layer, the pixel defining layer, and the partition structure in FIG3 . In conjunction with FIG3 and FIG4 , the light-emitting functional layer 1061 includes a first organic light-emitting functional layer 201, a first charge generation layer 202, a second organic light-emitting functional layer 203, a second charge generation layer 204, and a third organic light-emitting functional layer 205, which are at least partially stacked on the pixel spacer 104 on a major surface perpendicular to the base substrate 101. Furthermore, the distance between the surface of the portion of the second charge generation layer 204 located on the pixel spacer 104, which is farthest from the pixel defining layer 102, and the pixel defining layer 102 is less than the height of the partition structure 107 in a direction perpendicular to the major surface of the base substrate 101. For example, the surface of the partition structure 107 away from the base substrate 101 is flush with the surface of the third organic light-emitting functional layer 205 away from the base substrate 101, and the second electrode 1063 is disposed on the partition structure 107. For example, in the structure shown in Figures 3 and 4, the distance between the surface of the part of the second charge generating layer 204 located on the pixel spacing portion 104 that is farthest from the pixel defining layer 102 and the pixel defining layer 102 is L1, and the height of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is L2, and L1 is less than L2, so that the partition structure 107 can at least separate the first charge generating layer 202 and the second charge generating layer 204 corresponding to different sub-pixels to prevent lateral drift of charges between adjacent sub-pixels, thereby further avoiding crosstalk between adjacent sub-pixels caused by the first charge generating layer and the second charge generating layer with higher conductivity, so as to improve the display problem of inter-pixel crosstalk that is prone to occur in the stacked display substrate.

[0053] For example, Figure 5 is a schematic diagram of the cross-sectional structure of another display substrate provided by at least one embodiment of the present disclosure, and Figure 6 is a schematic diagram of the cross-sectional structure of the partial layer structure of the light-emitting functional layer, the pixel defining layer and the partition structure in Figure 5. Combined with Figures 5 and 6, the difference between the structures shown in Figure 5 and Figure 1 is that, in the structure shown in Figure 5, the second electrode 1063 and the third organic light-emitting functional layer 205 are both located above the partition structure 107, and the surface of the second hole generating sublayer 2042 away from the base substrate 101 is flush with the surface of the partition structure 107 away from the base substrate 101, that is, the distance between the surface of the part of the second charge generating layer 204 located on the pixel spacing portion 104 farthest from the pixel defining layer 102 and the pixel defining layer 102 is equal to the height of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101. That is, the second charge generation layer 204 and the layer structure below in the light-emitting functional layer 1061 are disconnected at the partition structure 107, while the second electrode 1063 remains continuous and uninterrupted, thereby preventing crosstalk between adjacent sub-pixels. At the same time, the fact that the second electrode is not isolated ensures the uniformity of display when the display substrate is used in a display panel for display.

[0054] For example, as shown in Figures 5 and 6, the light-emitting functional layer 1061 includes a first organic light-emitting functional layer 201, a first charge generation layer 202, a second organic light-emitting functional layer 203, a second charge generation layer 204, and a third organic light-emitting functional layer 205, which are at least partially stacked on the pixel spacer 104 on the main surface perpendicular to the base substrate 101, and the distance between the surface of the portion of the second charge generation layer 204 located on the pixel spacer 104 farthest from the pixel defining layer 102 and the pixel defining layer 102 is equal to the height of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101. That is, the second electrode 1063 and the third organic light-emitting functional layer 205 are provided on the partition structure 107. For example, in the structures shown in Figures 5 and 6, the distance between the surface of the part of the second charge generating layer 204 located on the pixel spacing portion 104 that is farthest from the pixel defining layer 102 and the pixel defining layer 102 is L1, and the height of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is L2, and L1 is equal to L2, so that the partition structure 107 can at least separate the first charge generating layer 202 and the second charge generating layer 204 corresponding to different sub-pixels to prevent lateral drift of charges between adjacent sub-pixels, thereby further avoiding crosstalk between adjacent sub-pixels caused by the first charge generating layer and the second charge generating layer with higher conductivity, so as to improve the display problem of inter-pixel crosstalk that is prone to occur in the stacked display substrate.

[0055] For example, FIG7 is a schematic cross-sectional view of the various layer structures of a display substrate provided in at least one embodiment of the present disclosure. In conjunction with FIG2, FIG4, FIG6, and FIG7, the first organic light-emitting functional layer 201 includes a stacked hole injection layer 301, a first hole transport layer 302, a first electron blocking layer 303, a first organic light-emitting layer 304, a first hole blocking layer 305, and a first electron transport layer 306. The first charge generation layer 202 includes a stacked first electron generation sublayer 2021 and a first hole generation sublayer 2022. The second organic light-emitting functional layer 203 includes a second hole transport layer 307, a second electron blocking layer 308, a second organic light-emitting layer 309, a second hole blocking layer 310, and a second electron transport layer 311. The second charge generation layer 204 includes a stacked second electron generation sublayer 2041 and a second hole generation sublayer 2042. The third organic light-emitting functional layer 205 includes a third hole transport layer 312 , a third electron blocking layer 313 , a third organic light-emitting layer 314 , a third hole blocking layer 315 and a third electron transport layer 316 , which are stacked.

[0056] For example, in the structure shown in FIG7 , the hole injection layer 301, the first hole transport layer 302, and the first electron blocking layer 303 constitute the first organic functional layer 401. The first hole blocking layer 305, the first electron transport layer 306, the first electron generating sublayer 2021, the first hole generating sublayer 2022, the second hole transport layer 307, and the second electron blocking layer 308 constitute the second organic functional layer 402. The second hole blocking layer 310, the second electron transport layer 311, the second electron generating sublayer 2041, the second hole generating sublayer 2042, the third electron blocking layer 313, and the third electron transport layer 316 constitute the third organic functional layer 403. The third hole blocking layer 315 and the third electron transport layer 316 constitute the fourth organic functional layer 404.

[0057] For example, as shown in FIG7 , the thickness L3 of the second organic functional layer 402 and the thickness L4 of the first organic functional layer 401 have a magnitude relationship of: L3 > L4 .

[0058] For example, in the display substrate provided by at least one embodiment of the present disclosure, the thickness L5 of the third organic functional layer 403 and the thickness L6 of the fourth organic functional layer 404 have a relationship of: L5>L6.

[0059] For example, in the display substrate provided in at least one embodiment of the present disclosure, the thickness L3 of the second organic functional layer 402 is less than or equal to the thickness L5 of the third organic functional layer 403, that is, when the thickness L3 of the second organic functional layer 402 is less than the thickness L5 of the third organic functional layer 403, the thickness L4 of the first organic functional layer 401, the thickness L3 of the second organic functional layer 402 and the thickness L5 of the third organic functional layer 403 become larger in sequence.

[0060] For example, the thickness design of each layer structure can further prevent the lateral drift of charges between adjacent sub-pixels, thereby avoiding the crosstalk between adjacent sub-pixels caused by the charge generation layer with higher conductivity, thereby improving the display problem of inter-pixel crosstalk that is prone to occur in the stacked display substrate.

[0061] For example, in conjunction with Figure 7, in the display substrate provided in at least one embodiment of the present disclosure, at least one sub-pixel is a red sub-pixel, and the thicknesses of the first organic light-emitting layer 304, the second organic light-emitting layer 309 and the third organic light-emitting layer 314 in the red sub-pixel are all greater than the thickness of the thickest sub-layer in the first organic functional layer 401, and are all greater than the thickness of the thickest sub-layer in the third organic functional layer 403. In this way, when the display substrate is used in a display panel for display, the color purity of the emitted red light can be improved.

[0062] For example, in conjunction with Figure 7, in the display substrate provided in at least one embodiment of the present disclosure, at least one sub-pixel is a blue sub-pixel, and the thicknesses of the first organic light-emitting layer 304, the second organic light-emitting layer 309 and the third organic light-emitting layer 314 in the blue sub-pixel are all less than the thickness of the thickest sub-layer in the first organic functional layer 401, and are all less than the thickness of the thickest sub-layer in the third organic functional layer 403. Therefore, when the display substrate is used in a display panel for display, the color purity of the emitted blue light can be improved.

[0063] For example, the materials of the first organic light-emitting layer 304 and the second organic light-emitting layer 309 may be selected from pyrene derivatives, anthracene derivatives, fluorene derivatives, perylene derivatives, styrylamine derivatives, metal complexes, and the like.

[0064] For example, the material of the hole injection layer 301 may include oxides, such as molybdenum oxide, titanium oxide, vanadium oxide, rhenium oxide, ruthenium oxide, chromium oxide, zirconium oxide, hafnium oxide, tantalum oxide, silver oxide, tungsten oxide, and manganese oxide.

[0065] For example, the material of the hole injection layer may also include organic materials, such as hexacyanohexaazatriphenylene, 2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinodimethane (F4TCNQ), and 1,2,3-tris[(cyano)(4-cyano-2,3,5,6-tetrafluorophenyl)methylene]cyclopropane.

[0066] For example, the materials of the first hole transport layer 302, the second hole transport layer 307 and the third hole transport layer 312 may include aromatic amines and dimethylfluorene or carbazole materials having hole transport properties, such as: 4,4'-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (NPB), N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1'-biphenyl]-4,4'-diamine (TPD), 4-phenyl-4'-(9-phenylfluorene-9-yl)triphenylamine (BAFLP), 4,4'-bis[N-(9,9-dimethylfluorene-2-yl)-N-phenylamino]biphenyl (DFLDPBi), 4,4'-di(9-carbazolyl)biphenyl (CBP), 9-phenyl-3-[4-(10-phenyl-9-anthracenyl)phenyl]-9H-carbazole (PCzPA).

[0067] For example, the materials of the first electron transport layer 306 , the second electron transport layer 311 , and the third electron transport layer 316 may include aromatic heterocyclic compounds, such as benzimidazole derivatives, imidazole derivatives, pyrimidine derivatives, oxazine derivatives, quinoline derivatives, isoquinoline derivatives, phenanthroline derivatives, etc.

[0068] For example, although not shown in Figure 7, in combination with Figures 2, 4 and 6, the light-emitting functional layer 1061 also includes an electron injection layer, which is between the third organic light-emitting functional layer 205 and the second electrode 1063. The material of the electron injection layer can be an alkali metal or a metal and its compounds, such as: lithium fluoride (LiF), ytterbium (Yb), magnesium (Mg), and calcium (Ca).

[0069] For example, in combination with Figures 1, 3 and 5, the first electrode 1062 can be made of a metal material, for example, any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy material of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single-layer structure, or a multi-layer composite structure, such as Ti / Al / Ti, etc., or a stack structure formed by a metal and a transparent conductive material, such as reflective materials such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0070] For example, in some examples, the second electrode 1063 can be made of any one or more of magnesium (Mg), silver (Ag), aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of metal and transparent conductive material.

[0071] For example, in some examples, the first charge generation layer 202 and the second charge generation layer 204 are each configured to generate carriers, transport carriers, and inject carriers. For example, the materials of the first charge generation layer 202 and the second charge generation layer 204 may include an n-type doped organic layer / inorganic metal oxide, such as Alq3:Mg / WO3, Bphen:Li / MoO3, BCP:Li / V2O5, and BCP:Cs / V2O5; or an n-type doped organic layer / organic layer, such as Alq3:Li / HAT-CN; or an n-type doped organic layer / p-type doped organic layer, such as BPhen:Cs / NPB:F4-TCNQ, Alq3:Li / NPB:FeCl3, TPBi:Li / NPB:FeCl3, and Alq3:Mg / m-MTDATA:F4-TCNQ; or an undoped type, such as F16CuPc / CuPc and Al / WO3 / Au.

[0072] For example, in some examples, the material of the base substrate 101 can be made of one or more materials selected from the group consisting of glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and embodiments of the present disclosure include but are not limited to the foregoing.

[0073] For example, in some examples, the base substrate may be a rigid substrate or a flexible substrate; when the base substrate is a flexible substrate, the base substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked in sequence. The first flexible material layer and the second flexible material layer are made of polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The first inorganic material layer and the second inorganic material layer are made of silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the water and oxygen resistance of the base substrate. The first inorganic material layer and the second inorganic material layer are also referred to as barrier layers. The semiconductor layer is made of amorphous silicon (a-Si).

[0074] For example, taking the base substrate as a stacked structure PI1 / Barrier1 / a-si / PI2 / Barrier2 as an example, the preparation process of the base substrate includes: first coating a layer of polyimide on a glass carrier, and forming a first flexible (PI1) layer after solidification; then depositing a barrier film on the first flexible layer to form a first barrier (Barrier1) layer covering the first flexible layer; then depositing a layer of amorphous silicon film on the first barrier layer to form an amorphous silicon (a-si) layer covering the first barrier layer; then coating the amorphous silicon layer with another layer of polyimide, and forming a second flexible (PI2) layer after solidification; then depositing a barrier film on the second flexible layer to form a second barrier (Barrier2) layer covering the second flexible layer, and finally completing the preparation of the base substrate.

[0075] For example, in combination with Figures 1, 3 and 5, the multiple pixel openings respectively define the effective light-emitting areas of the corresponding multiple sub-pixels, and the multiple pixel openings are configured to expose the first electrode 1062 so that the first electrode 1062 is in contact with the subsequently formed light-emitting functional layer.

[0076] For example, the manufacturing method of the display substrate provided by the embodiment of the present disclosure may include: cleaning the glass carrier, and preparing the base substrate 101 on the glass carrier. For example, the base substrate 110 may be a flexible base substrate. For example, forming the base substrate 101 may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked on the glass carrier. The materials of the first flexible material layer and the second flexible material layer are polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The materials of the first inorganic material layer and the second inorganic material layer are silicon nitride (SiNx) or silicon oxide (SiOx), etc., which are used to improve the water and oxygen resistance of the base substrate. The first inorganic material layer and the second inorganic material layer are also referred to as barrier layers.

[0077] For example, before forming the first electrode and the pixel defining layer 102, a driving structure layer of the pixel circuit can be formed on the base substrate 101. The driving structure layer includes a plurality of pixel circuits, each pixel circuit includes a plurality of transistors and at least one storage capacitor. For example, the pixel circuit can adopt a 2T1C, 3T1C, or 7T1C design. For example, forming the driving structure layer can include sequentially depositing a first insulating film and an active layer film on the base substrate 101, patterning the active layer film through a patterning process to form a first insulating layer covering the entire base substrate 101, and an active layer pattern provided on the first insulating layer, the active layer pattern including at least an active layer. For example, sequentially depositing a second insulating film and a first metal film, patterning the first metal film through a patterning process to form a second insulating layer covering the active layer pattern, and a first gate metal layer pattern provided on the second insulating layer, the first gate metal layer pattern including at least a gate electrode and a first capacitor electrode. For example, a third insulating film and a second metal film are sequentially deposited, and the second metal film is patterned through a composition process to form a third insulating layer covering the first gate metal layer, and a second gate metal layer pattern disposed on the third insulating layer, wherein the second gate metal layer pattern includes at least a second capacitor electrode, and the position of the second capacitor electrode corresponds to the position of the first capacitor electrode. Subsequently, a fourth insulating film is deposited and patterned through a composition process to form a fourth insulating layer covering the second gate metal layer, wherein at least two first vias are formed on the fourth insulating layer, and the fourth insulating layer, the third insulating layer, and the second insulating layer within the two first vias are etched away to expose the surface of the active layer of the active layer pattern. Subsequently, a third metal film is deposited and patterned through a composition process to form a source-drain metal layer pattern on the fourth insulating layer, wherein the source-drain metal layer pattern includes at least a source electrode and a drain electrode located in the display area. The source electrode and the drain electrode can be connected to the active layer in the active layer pattern through the first vias, respectively.

[0078] For example, the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer can be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, a multilayer or a composite layer. The first insulating layer can be a buffer layer for improving the water and oxygen resistance of the substrate 110; the second insulating layer and the third insulating layer can be gate insulating (GI) layers; and the fourth insulating layer can be an interlayer insulating (ILD) layer. The first metal film, the second metal film and the third metal film are made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single layer structure or a multilayer composite structure, such as Ti / Al / Ti. The active layer thin film adopts one or more materials such as amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene, polythiophene, etc., that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology and organic technology.

[0079] For example, in one embodiment, after forming the driving structure layer, a planarization layer and a first electrode are formed. For example, the first electrode is connected to the drain electrode of the transistor through a via structure in the planarization layer.

[0080] For example, the first electrode can be formed of a metal material, which includes any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy material of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb). The first electrode can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, or a sandwich structure formed by metal and transparent conductive material, such as reflective materials such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0081] For example, after forming the first electrode, a pixel defining layer can be formed. For example, a pixel defining film is coated on the substrate having the aforementioned pattern formed thereon, and the pixel defining layer is formed through masking, exposure, and development processes. For example, the pixel defining layer in the display area includes a plurality of pixel spacers, with pixel openings formed between adjacent pixel spacers. The pixel defining film within the pixel openings is developed away, and the pixel openings expose at least a portion of the surface of the first electrodes of the plurality of sub-pixels.

[0082] For example, after forming the pixel defining layer, an inorganic insulating material is applied on the pixel spacer to form an inorganic insulating layer, and the inorganic insulating layer is patterned to form a partition structure. The patterning process can refer to the above-mentioned method for forming the pixel defining layer.

[0083] For example, after forming the pixel defining layer and the partition structure, spacers can be formed on the pixel spacers located at the edge of the base substrate where the partition structure is not provided. For example, a thin film of organic material is coated on the base substrate on which the aforementioned pattern is formed, and the spacers are formed through masking, exposure, and development processes. The spacers can serve as a support layer, configured to support the FMM (high-precision mask) during the evaporation process.

[0084] For example, after forming the spacer, the light-emitting functional layer and the second electrode are formed in sequence. For example, the second electrode can be a transparent cathode. The light-emitting functional layer can emit light from the side away from the substrate through the transparent cathode to achieve top emission. For example, the second electrode can be formed using any one or more metal materials selected from magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material such as indium tin oxide (ITO), or a multilayer composite structure formed by a metal and a transparent conductive material.

[0085] For example, with reference to FIG7 , forming the light-emitting functional layer may include: sequentially evaporating a hole injection layer 301, a first hole transport layer 302, and a first electron blocking layer 303 using an open mask, and then sequentially evaporating a first organic light-emitting layer 304 emitting light of different colors, such as a blue light-emitting layer, a green light-emitting layer, and a red light-emitting layer using a FMM; sequentially evaporating a first hole blocking layer 305, a first electron transport layer 306, a first charge generation layer 202, a second hole transport layer 307, and a second electron blocking layer 308 using an open mask. Sequentially evaporating a second organic light-emitting layer 309 emitting light of different colors, such as a blue light-emitting layer, a green light-emitting layer, and a red light-emitting layer using an FMM; and sequentially evaporating a second hole blocking layer 310, a second electron transport layer 311, a second charge generation layer 204, a third hole transport layer 312, and a third electron blocking layer 313 using an open mask. The third organic light-emitting layer 314 emitting light of different colors, such as a blue light-emitting layer, a green light-emitting layer and a red light-emitting layer, is sequentially formed by evaporation using FMM; the third hole blocking layer 315 and the third electron transport layer 316 are sequentially formed by evaporation using an open mask.

[0086] For example, in the structure shown in Figure 7, the hole injection layer 301, the first hole transport layer 302, the first electron blocking layer 303, the first hole blocking layer 305, the first electron transport layer 306, the first charge generation layer 202, the second hole transport layer 307, the second electron blocking layer 308, the second hole blocking layer 310, the second electron transport layer 311, the second charge generation layer 204, the third hole transport layer 312, the third electron blocking layer 313, the third hole blocking layer 315, the third electron transport layer 316 and the second electrode 1063 are all common layers of multiple sub-pixels.

[0087] For example, the formed light-emitting functional layer will be disconnected at a position of the partition structure away from the base substrate, so that a portion of the light-emitting functional layer located in the pixel opening of the pixel defining layer is located on the pixel spacing portion, and the other portion is located in the pixel opening.

[0088] For example, in one embodiment, after forming the second electrode, the method for manufacturing the display substrate further includes forming an encapsulation layer. The encapsulation layer may include a stacked first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. The first encapsulation layer is made of an inorganic material and covers the second electrode in the display area. The second encapsulation layer is made of an organic material. The third encapsulation layer is made of an inorganic material and covers the first and second encapsulation layers. However, this embodiment is not limited to this. For example, the encapsulation layer may also adopt a five-layer structure of inorganic / organic / inorganic / organic / inorganic.

[0089] For example, compared with a display substrate without a partition structure, the display substrate with a partition structure provided by the embodiment of the present disclosure only requires one additional mask process, which has a relatively low impact on production costs.

[0090] For example, referring to Comparative Example 1, the display performance of the display substrate provided by the embodiments of the present disclosure when used in a display panel can be studied based on the following Examples 1 to 6.

[0091] Example 1:

[0092] The height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 1.45 microns, the distance L1 between the surface of the part of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.14 microns, the thickness of the hole injection layer 301 is 100 microns, the thickness of the first hole transport layer 302 is 180 microns, the thickness of the first electron blocking layer 303 corresponding to the blue sub-pixel is 50 microns, the thickness of the first electron blocking layer 303 corresponding to the green sub-pixel is 70 microns, and the thickness of the first electron blocking layer 303 corresponding to the red sub-pixel is 200 microns. The thickness of the first organic light-emitting layer 304 corresponding to the blue sub-pixel is 170 microns, the thickness of the first organic light-emitting layer 304 corresponding to the green sub-pixel is 350 microns, and the thickness of the first organic light-emitting layer 304 corresponding to the red sub-pixel is 450 microns. The thickness of the first hole-blocking layer 305 is 50 microns, and the thickness of the first electron-transporting layer 306 is 150 microns. The thickness of the first electron-generating sub-layer 2021 is 120 microns, and the thickness of the first hole-generating sub-layer 2022 is 90 microns. The second hole transport layer 307 has a thickness of 250 microns. The second electron blocking layer 308 corresponding to the blue sub-pixel has a thickness of 50 microns, the second electron blocking layer 308 corresponding to the green sub-pixel has a thickness of 70 microns, and the second electron blocking layer 308 corresponding to the red sub-pixel has a thickness of 200 microns. The second organic light-emitting layer 309 corresponding to the blue sub-pixel has a thickness of 170 microns, the second organic light-emitting layer 309 corresponding to the green sub-pixel has a thickness of 350 microns, and the second organic light-emitting layer 309 corresponding to the red sub-pixel has a thickness of 450 microns. The second hole blocking layer 310 has a thickness of 50 microns, and the second electron transport layer 311 has a thickness of 160 microns. The second electron generating sub-layer 2041 has a thickness of 120 microns, and the second hole generating sub-layer 2042 has a thickness of 90 microns. The third hole transport layer 312 has a thickness of 250 microns. The third electron blocking layer 313 corresponding to the blue sub-pixel has a thickness of 50 microns, the third electron blocking layer 313 corresponding to the green sub-pixel has a thickness of 70 microns, and the third electron blocking layer 313 corresponding to the red sub-pixel has a thickness of 200 microns. The third organic light-emitting layer 314 corresponding to the blue sub-pixel has a thickness of 170 microns, the third organic light-emitting layer 314 corresponding to the green sub-pixel has a thickness of 350 microns, and the third organic light-emitting layer 314 corresponding to the red sub-pixel has a thickness of 450 microns. The third hole blocking layer 315 has a thickness of 50 microns, and the third electron transport layer 316 has a thickness of 150 microns.

[0093] Example 2:

[0094] The height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 1.05 microns, the distance L1 between the surface of the part of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 microns, the thickness of the hole injection layer 301 is 90 microns, the thickness of the first hole transport layer 302 is 200 microns, the thickness of the first electron blocking layer 303 corresponding to the blue sub-pixel is 80 microns, the thickness of the first electron blocking layer 303 corresponding to the green sub-pixel is 100 microns, and the thickness of the first electron blocking layer 303 corresponding to the red sub-pixel is 300 microns. The thickness of the first organic light-emitting layer 304 corresponding to the blue sub-pixel is 160 microns, the thickness of the first organic light-emitting layer 304 corresponding to the green sub-pixel is 330 microns, and the thickness of the first organic light-emitting layer 304 corresponding to the red sub-pixel is 420 microns. The thickness of the first hole-blocking layer 305 is 50 microns, and the thickness of the first electron-transporting layer 306 is 120 microns. The thickness of the first electron-generating sub-layer 2021 is 110 microns, and the thickness of the first hole-generating sub-layer 2022 is 90 microns. The second hole transport layer 307 has a thickness of 240 microns. The second electron blocking layer 308 corresponding to the blue sub-pixel has a thickness of 80 microns, the second electron blocking layer 308 corresponding to the green sub-pixel has a thickness of 100 microns, and the second electron blocking layer 308 corresponding to the red sub-pixel has a thickness of 300 microns. The second organic light-emitting layer 309 corresponding to the blue sub-pixel has a thickness of 160 microns, the second organic light-emitting layer 309 corresponding to the green sub-pixel has a thickness of 330 microns, and the second organic light-emitting layer 309 corresponding to the red sub-pixel has a thickness of 420 microns. The second hole blocking layer 310 has a thickness of 50 microns, and the second electron transport layer 311 has a thickness of 120 microns. The second electron generating sub-layer 2041 has a thickness of 120 microns, and the second hole generating sub-layer 2042 has a thickness of 90 microns. The third hole transport layer 312 has a thickness of 240 microns. The third electron blocking layer 313 corresponding to the blue sub-pixel has a thickness of 80 microns, the third electron blocking layer 313 corresponding to the green sub-pixel has a thickness of 100 microns, and the third electron blocking layer 313 corresponding to the red sub-pixel has a thickness of 300 microns. The third organic light-emitting layer 314 corresponding to the blue sub-pixel has a thickness of 160 microns, the third organic light-emitting layer 314 corresponding to the green sub-pixel has a thickness of 330 microns, and the third organic light-emitting layer 314 corresponding to the red sub-pixel has a thickness of 420 microns. The third hole blocking layer 315 has a thickness of 50 microns, and the third electron transport layer 316 has a thickness of 120 microns.

[0095] Example 3:

[0096] The height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.85 microns, the distance L1 between the surface of the part of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 microns, the thickness of the hole injection layer 301 is 100 microns, the thickness of the first hole transport layer 302 is 150 microns, the thickness of the first electron blocking layer 303 corresponding to the blue sub-pixel is 60 microns, the thickness of the first electron blocking layer 303 corresponding to the green sub-pixel is 75 microns, and the thickness of the first electron blocking layer 303 corresponding to the red sub-pixel is 290 microns. The thickness of the first organic light-emitting layer 304 corresponding to the blue sub-pixel is 200 microns, the thickness of the first organic light-emitting layer 304 corresponding to the green sub-pixel is 360 microns, and the thickness of the first organic light-emitting layer 304 corresponding to the red sub-pixel is 440 microns. The thickness of the first hole-blocking layer 305 is 60 microns, and the thickness of the first electron-transporting layer 306 is 130 microns. The thickness of the first electron-generating sub-layer 2021 is 110 microns, and the thickness of the first hole-generating sub-layer 2022 is 100 microns. The second hole transport layer 307 has a thickness of 230 microns. The second electron blocking layer 308 corresponding to the blue sub-pixel has a thickness of 60 microns, the second electron blocking layer 308 corresponding to the green sub-pixel has a thickness of 75 microns, and the second electron blocking layer 308 corresponding to the red sub-pixel has a thickness of 290 microns. The second organic light-emitting layer 309 corresponding to the blue sub-pixel has a thickness of 200 microns, the second organic light-emitting layer 309 corresponding to the green sub-pixel has a thickness of 360 microns, and the second organic light-emitting layer 309 corresponding to the red sub-pixel has a thickness of 440 microns. The second hole blocking layer 310 has a thickness of 60 microns, and the second electron transport layer 311 has a thickness of 130 microns. The second electron generating sub-layer 2041 has a thickness of 110 microns, and the second hole generating sub-layer 2042 has a thickness of 100 microns. The thickness of the third hole transport layer 312 is 230 microns. The thickness of the third electron blocking layer 313 corresponding to the blue sub-pixel is 60 microns, the thickness of the third electron blocking layer 313 corresponding to the green sub-pixel is 75 microns, and the thickness of the third electron blocking layer 313 corresponding to the red sub-pixel is 290 microns. The thickness of the third organic light-emitting layer 314 corresponding to the blue sub-pixel is 200 microns, the thickness of the third organic light-emitting layer 314 corresponding to the green sub-pixel is 360 microns, and the thickness of the third organic light-emitting layer 314 corresponding to the red sub-pixel is 440 microns. The thickness of the third hole blocking layer 315 is 60 microns, and the thickness of the third electron transport layer 316 is 130 microns.

[0097] Example 4:

[0098] The height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.71 microns, the distance L1 between the surface of the part of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 microns, the thickness of the hole injection layer 301 is 110 microns, the thickness of the first hole transport layer 302 is 160 microns, the thickness of the first electron blocking layer 303 corresponding to the blue sub-pixel is 50 microns, the thickness of the first electron blocking layer 303 corresponding to the green sub-pixel is 60 microns, and the thickness of the first electron blocking layer 303 corresponding to the red sub-pixel is 280 microns. The thickness of the first organic light-emitting layer 304 corresponding to the blue sub-pixel is 180 microns, the thickness of the first organic light-emitting layer 304 corresponding to the green sub-pixel is 340 microns, and the thickness of the first organic light-emitting layer 304 corresponding to the red sub-pixel is 420 microns. The thickness of the first hole-blocking layer 305 is 55 microns, and the thickness of the first electron-transporting layer 306 is 125 microns. The thickness of the first electron-generating sub-layer 2021 is 130 microns, and the thickness of the first hole-generating sub-layer 2022 is 80 microns. The second hole transport layer 307 has a thickness of 220 microns. The second electron blocking layer 308 corresponding to the blue sub-pixel has a thickness of 50 microns, the second electron blocking layer 308 corresponding to the green sub-pixel has a thickness of 60 microns, and the second electron blocking layer 308 corresponding to the red sub-pixel has a thickness of 280 microns. The second organic light-emitting layer 309 corresponding to the blue sub-pixel has a thickness of 180 microns, the second organic light-emitting layer 309 corresponding to the green sub-pixel has a thickness of 340 microns, and the second organic light-emitting layer 309 corresponding to the red sub-pixel has a thickness of 420 microns. The second hole blocking layer 310 has a thickness of 55 microns, and the second electron transport layer 311 has a thickness of 130 microns. The second electron generating sub-layer 2041 has a thickness of 130 microns, and the second hole generating sub-layer 2042 has a thickness of 80 microns. The thickness of the third hole transport layer 312 is 220 microns. The thickness of the third electron blocking layer 313 corresponding to the blue sub-pixel is 50 microns, the thickness of the third electron blocking layer 313 corresponding to the green sub-pixel is 60 microns, and the thickness of the third electron blocking layer 313 corresponding to the red sub-pixel is 280 microns. The thickness of the third organic light-emitting layer 314 corresponding to the blue sub-pixel is 180 microns, the thickness of the third organic light-emitting layer 314 corresponding to the green sub-pixel is 340 microns, and the thickness of the third organic light-emitting layer 314 corresponding to the red sub-pixel is 420 microns. The thickness of the third hole blocking layer 315 is 55 microns, and the thickness of the third electron transport layer 316 is 125 microns.

[0099] Embodiment 5:

[0100] The height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.42 microns, the distance L1 between the surface of the part of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.12 microns, the thickness of the hole injection layer 301 is 100 microns, the thickness of the first hole transport layer 302 is 170 microns, the thickness of the first electron blocking layer 303 corresponding to the blue sub-pixel is 45 microns, the thickness of the first electron blocking layer 303 corresponding to the green sub-pixel is 70 microns, and the thickness of the first electron blocking layer 303 corresponding to the red sub-pixel is 260 microns. The thickness of the first organic light-emitting layer 304 corresponding to the blue sub-pixel is 190 microns, the thickness of the first organic light-emitting layer 304 corresponding to the green sub-pixel is 320 microns, and the thickness of the first organic light-emitting layer 304 corresponding to the red sub-pixel is 410 microns. The thickness of the first hole-blocking layer 305 is 50 microns, and the thickness of the first electron-transporting layer 306 is 130 microns. The thickness of the first electron-generating sub-layer 2021 is 100 microns, and the thickness of the first hole-generating sub-layer 2022 is 90 microns. The second hole transport layer 307 has a thickness of 240 microns. The second electron blocking layer 308 corresponding to the blue sub-pixel has a thickness of 45 microns, the second electron blocking layer 308 corresponding to the green sub-pixel has a thickness of 70 microns, and the second electron blocking layer 308 corresponding to the red sub-pixel has a thickness of 260 microns. The second organic light-emitting layer 309 corresponding to the blue sub-pixel has a thickness of 190 microns, the second organic light-emitting layer 309 corresponding to the green sub-pixel has a thickness of 320 microns, and the second organic light-emitting layer 309 corresponding to the red sub-pixel has a thickness of 410 microns. The second hole blocking layer 310 has a thickness of 50 microns, and the second electron transport layer 311 has a thickness of 130 microns. The second electron generating sub-layer 2041 has a thickness of 110 microns, and the second hole generating sub-layer 2042 has a thickness of 90 microns. The thickness of the third hole transport layer 312 is 240 microns. The thickness of the third electron blocking layer 313 corresponding to the blue sub-pixel is 45 microns, the thickness of the third electron blocking layer 313 corresponding to the green sub-pixel is 70 microns, and the thickness of the third electron blocking layer 313 corresponding to the red sub-pixel is 260 microns. The thickness of the third organic light-emitting layer 314 corresponding to the blue sub-pixel is 190 microns, the thickness of the third organic light-emitting layer 314 corresponding to the green sub-pixel is 320 microns, and the thickness of the third organic light-emitting layer 314 corresponding to the red sub-pixel is 410 microns. The thickness of the third hole blocking layer 315 is 50 microns, and the thickness of the third electron transport layer 316 is 130 microns.

[0101] Example 6:

[0102] The height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.42 microns, the distance L1 between the surface of the part of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.13 microns, the thickness of the hole injection layer 301 is 90 microns, the thickness of the first hole transport layer 302 is 160 microns, the thickness of the first electron blocking layer 303 corresponding to the blue sub-pixel is 50 microns, the thickness of the first electron blocking layer 303 corresponding to the green sub-pixel is 80 microns, and the thickness of the first electron blocking layer 303 corresponding to the red sub-pixel is 250 microns. The thickness of the first organic light-emitting layer 304 corresponding to the blue sub-pixel is 160 microns, the thickness of the first organic light-emitting layer 304 corresponding to the green sub-pixel is 300 microns, and the thickness of the first organic light-emitting layer 304 corresponding to the red sub-pixel is 390 microns. The thickness of the first hole-blocking layer 305 is 50 microns, and the thickness of the first electron-transporting layer 306 is 140 microns. The thickness of the first electron-generating sub-layer 2021 is 110 microns, and the thickness of the first hole-generating sub-layer 2022 is 100 microns. The second hole transport layer 307 has a thickness of 260 microns. The second electron blocking layer 308 corresponding to the blue sub-pixel has a thickness of 50 microns, the second electron blocking layer 308 corresponding to the green sub-pixel has a thickness of 80 microns, and the second electron blocking layer 308 corresponding to the red sub-pixel has a thickness of 250 microns. The second organic light-emitting layer 309 corresponding to the blue sub-pixel has a thickness of 160 microns, the second organic light-emitting layer 309 corresponding to the green sub-pixel has a thickness of 300 microns, and the second organic light-emitting layer 309 corresponding to the red sub-pixel has a thickness of 390 microns. The second hole blocking layer 310 has a thickness of 50 microns, and the second electron transport layer 311 has a thickness of 140 microns. The second electron generating sub-layer 2041 has a thickness of 120 microns, and the second hole generating sub-layer 2042 has a thickness of 105 microns. The third hole transport layer 312 has a thickness of 260 microns. The third electron blocking layer 313 corresponding to the blue sub-pixel has a thickness of 50 microns, the third electron blocking layer 313 corresponding to the green sub-pixel has a thickness of 80 microns, and the third electron blocking layer 313 corresponding to the red sub-pixel has a thickness of 250 microns. The third organic light-emitting layer 314 corresponding to the blue sub-pixel has a thickness of 160 microns, the third organic light-emitting layer 314 corresponding to the green sub-pixel has a thickness of 300 microns, and the third organic light-emitting layer 314 corresponding to the red sub-pixel has a thickness of 390 microns. The third hole blocking layer 315 has a thickness of 50 microns, and the third electron transport layer 316 has a thickness of 140 microns.

[0103] Comparative Example 1:

[0104] The height L2 of the partition structure 107 in the direction perpendicular to the main surface of the base substrate 101 is 0.13 microns, the distance L1 between the surface of the part of the second hole generating sublayer 2042 located on the pixel spacing portion 104 farthest from the pixel defining layer 104 and the pixel defining layer 104 is 0.14 microns, the thickness of the hole injection layer 301 is 100 microns, the thickness of the first hole transport layer 302 is 450 microns, the thickness of the first electron blocking layer 303 corresponding to the blue sub-pixel is 50 microns, the thickness of the first electron blocking layer 303 corresponding to the green sub-pixel is 60 microns, and the thickness of the first electron blocking layer 303 corresponding to the red sub-pixel is 120 microns. The thickness of the first organic light-emitting layer 304 corresponding to the blue sub-pixel is 150 microns, the thickness of the first organic light-emitting layer 304 corresponding to the green sub-pixel is 300 microns, and the thickness of the first organic light-emitting layer 304 corresponding to the red sub-pixel is 400 microns. The thickness of the first hole-blocking layer 305 is 50 microns, and the thickness of the first electron-transporting layer 306 is 100 microns. The thickness of the first electron-generating sub-layer 2021 is 110 microns, and the thickness of the first hole-generating sub-layer 2022 is 80 microns. The second hole transport layer 307 has a thickness of 200 microns. The second electron blocking layer 308 corresponding to the blue sub-pixel has a thickness of 50 microns, the second electron blocking layer 308 corresponding to the green sub-pixel has a thickness of 60 microns, and the second electron blocking layer 308 corresponding to the red sub-pixel has a thickness of 120 microns. The second organic light-emitting layer 309 corresponding to the blue sub-pixel has a thickness of 150 microns, the second organic light-emitting layer 309 corresponding to the green sub-pixel has a thickness of 300 microns, and the second organic light-emitting layer 309 corresponding to the red sub-pixel has a thickness of 400 microns. The second hole blocking layer 310 has a thickness of 50 microns, and the second electron transport layer 311 has a thickness of 90 microns. The second electron generating sub-layer 2041 has a thickness of 105 microns, and the second hole generating sub-layer 2042 has a thickness of 80 microns. The third hole transport layer 312 has a thickness of 200 microns. The third electron blocking layer 313 corresponding to the blue sub-pixel has a thickness of 50 microns, the third electron blocking layer 313 corresponding to the green sub-pixel has a thickness of 60 microns, and the third electron blocking layer 313 corresponding to the red sub-pixel has a thickness of 120 microns. The third organic light-emitting layer 314 corresponding to the blue sub-pixel has a thickness of 150 microns, the third organic light-emitting layer 314 corresponding to the green sub-pixel has a thickness of 300 microns, and the third organic light-emitting layer 314 corresponding to the red sub-pixel has a thickness of 400 microns. The third hole blocking layer 315 has a thickness of 50 microns, and the third electron transport layer 316 has a thickness of 100 microns.

[0105] The display effects of the display panels formed by the display substrates in the above-mentioned embodiments 1 to 6 and comparative example 1 were tested, and the results were shown in Table 1 below.

[0106] Table 1: Display effects of display panels formed by the display substrates in Examples 1 to 6 and Comparative Example 1.

[0107] As can be seen from Table 1 above, the lifespan of display panels formed using the display substrates of Examples 1 to 6 of the present disclosure is significantly longer than that of the display panel formed using the display substrate of Comparative Example 1, and the power consumption of display panels formed using the display substrates of Examples 1 to 6 of the present disclosure is significantly lower than that of the display panel formed using the display substrate of Comparative Example 1. Furthermore, the red EL accompanying intensity of display panels formed using the display substrates of Examples 1 to 6 of the present disclosure is significantly lower than that of the display panel formed using the display substrate of Comparative Example 1.

[0108] At least one embodiment of the present disclosure further provides a display device, which includes a display substrate as described in any one of the above items. Figure 8 is a schematic diagram of a display device provided by one embodiment of the present disclosure. As shown in Figure 8, the display device 200 includes a display substrate 100. The display substrate provides a partition structure between adjacent sub-pixels, and disconnects the charge generation layer in the light-emitting functional layer at the location of the partition structure, thereby avoiding crosstalk between adjacent sub-pixels caused by the charge generation layer with higher conductivity. Therefore, the display device including the display substrate can also avoid crosstalk between adjacent sub-pixels, and thus has a higher product yield and higher display quality.

[0109] Since the display substrate provided by the embodiments of the present disclosure adopts a double-layer light-emitting design while improving pixel density, a display device including the display substrate also has advantages such as long life, low power consumption, high brightness, and high resolution.

[0110] For example, the display device can be a display device such as an organic light emitting diode display device, as well as any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, etc. that includes the display device, but this embodiment is not limited to this.

[0111] There are a few points to note:

[0112] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0113] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale.

[0114] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0115] The above description is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A display substrate, comprising: substrate; A pixel defining layer, located on the base substrate, and comprising a plurality of pixel openings and pixel spacers; a plurality of sub-pixels located on the base substrate and corresponding one-to-one to the plurality of pixel openings, each of the sub-pixels comprising a light-emitting element, the light-emitting element comprising a light-emitting functional layer and a second electrode and a first electrode located on both sides of the light-emitting functional layer in a direction perpendicular to the main surface of the base substrate, the first electrode being located between the light-emitting functional layer and the base substrate; as well as A partition structure is located between adjacent sub-pixels and on a side of the pixel spacing portion away from the base substrate. In which, the light-emitting functional layer includes a first organic light-emitting functional layer, a first charge generating layer, a second organic light-emitting functional layer, a second charge generating layer and a third organic light-emitting functional layer which are at least partially stacked on the pixel spacer on the main surface perpendicular to the base substrate, and the distance between the surface of the part of the second charge generating layer located on the pixel spacer farthest from the pixel defining layer and the pixel defining layer is less than the height of the partition structure in the direction perpendicular to the main surface of the base substrate.

2. The display substrate according to claim 1, wherein The second charge generating layer includes a second electron generating sublayer and a second hole generating sublayer arranged in a stacked manner, and the distance between the surface of the part of the second hole generating sublayer located on the pixel spacing portion farthest away from the pixel defining layer and the pixel defining layer is smaller than the height of the partition structure in the direction perpendicular to the main surface of the base substrate.

3. The display substrate according to claim 2, wherein: The distance between the surface of the portion of the second hole generating sublayer located on the pixel spacing portion farthest from the pixel defining layer and the pixel defining layer is L1, and the height of the partition structure in the direction perpendicular to the main surface of the base substrate is L2, L1 is greater than or equal to 0.12μm and less than or equal to 0.14μm, and L2 is greater than or equal to 0.42μm and less than or equal to 1.45μm.

4. The display substrate according to claim 2, wherein: The first organic light-emitting functional layer includes a hole injection layer, a first hole transport layer, a first electron blocking layer, a first organic light-emitting layer, a first hole blocking layer and a first electron transport layer arranged in a stacked manner; The first charge generation layer includes a first electron generation sublayer and a first hole generation sublayer stacked; The second organic light-emitting functional layer includes a second hole transport layer, a second electron blocking layer, a second organic light-emitting layer, a second hole blocking layer and a second electron transport layer; The third organic light-emitting functional layer includes a third hole transport layer, a third electron blocking layer, a third organic light-emitting layer, a third hole blocking layer and a third electron transport layer which are stacked; The hole injection layer, the first hole transport layer and the first electron blocking layer constitute a first organic functional layer; The first hole blocking layer, the first electron transport layer, the first electron generating sublayer, the first hole generating sublayer, the second hole transport layer and the second electron blocking layer constitute a second organic functional layer; The second hole blocking layer, the second electron transport layer, the second electron generating sublayer, the second hole generating sublayer, the third electron blocking layer and the third electron transport layer constitute a third organic functional layer; The third hole blocking layer and the third electron transport layer constitute a fourth organic functional layer.

5. The display substrate according to claim 4, wherein: The thickness L3 of the second organic functional layer and the thickness L4 of the first organic functional layer have a relationship of L3>L4.

6. The display substrate according to claim 5, wherein: The thickness L5 of the third organic functional layer and the thickness L6 of the fourth organic functional layer have a relationship of: L5>L6.

7. The display substrate according to claim 6, wherein: The thickness L3 of the second organic functional layer is less than or equal to the thickness L5 of the third organic functional layer.

8. The display substrate according to any one of claims 1 to 7, wherein The sub-pixel is a red sub-pixel, and the thicknesses of the first organic light-emitting layer, the second organic light-emitting layer and the third organic light-emitting layer in the red sub-pixel are all greater than the thickness of the thickest sub-layer in the first organic functional layer, and are all greater than the thickness of the thickest sub-layer in the third organic functional layer.

9. The display substrate according to any one of claims 1 to 7, wherein The sub-pixel is a blue sub-pixel, and the thicknesses of the first organic light-emitting layer, the second organic light-emitting layer and the third organic light-emitting layer in the blue sub-pixel are all smaller than the thickness of the thickest sub-layer in the first organic functional layer, and are all smaller than the thickness of the thickest sub-layer in the third organic functional layer.

10. The display substrate according to any one of claims 1 to 9, wherein The plurality of pixel openings respectively define effective light emitting areas of the corresponding plurality of sub-pixels, and the pixel openings are configured to expose the first electrode.

11. A display device comprising the display substrate according to any one of claims 1 to 10.

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