Storage apparatus

Abstract

Disclosed in the present invention is a storage apparatus. The storage apparatus comprises a storage circuit board, at least one capacity-expansion circuit board and an auxiliary circuit board, wherein the storage circuit board is provided with at least one first capacity-expansion interface; the capacity expansion circuit board is provided with a second capacity-expansion interface; the first capacity expansion interface of the storage circuit board is connected to the second capacity expansion interface of the capacity expansion circuit board by means of a connector, such that a storage space of the storage circuit board is supplemented by storage particles provided on the capacity-expansion circuit board; and the storage circuit board is connected to the auxiliary circuit board, and an original non-storage electronic device of the storage circuit board is provided in the auxiliary circuit board, such that a placement space of the storage circuit board is expanded for accommodating the storage particles. Therefore, a plurality of circuit boards can be effectively assembled, thereby improving the storage capacity of the storage apparatus.

Description

A storage device

[0001]

Cross-reference

[0002] This application claims priority to Chinese patent application No. CN202410385146.6 filed on March 28, 2024, the entire contents of which are incorporated herein by reference.

Technical field

[0003] The present invention relates to the field of storage, and in particular to a storage device. [Background Technology]

[0004] In the storage field, with the continuous development of technology, computing density continues to grow, and the demand for memory capacity is increasing.

[0005] When the space on the circuit board in the storage device has been utilized as much as possible, in order to further improve the performance of the server, people usually consider expanding the capacity of the storage particles themselves. However, the process level for expanding the storage particles themselves is high and complex, and the internal space of the storage device is not expanded. That is, the space of the circuit board cannot be expanded within the same space. How to assemble multi-layer circuit boards to increase the memory capacity of the storage device is a technical problem that technicians in this field currently need to solve.

[0006] [Summary of the invention]

[0007] According to various embodiments of the present application, a storage device is provided.

[0008] The present application provides a storage device, which includes a storage circuit board, at least one expansion circuit board and an auxiliary circuit board; at least one first expansion interface is provided on the storage circuit board; the expansion circuit board is provided with a second expansion interface; wherein the first expansion interface of the storage circuit board is connected to the second expansion interface of the expansion circuit board via a connector to supplement the storage particles provided on the expansion circuit board to form the storage space of the storage circuit board; and the storage circuit board is connected to the auxiliary circuit board, and the auxiliary circuit board is provided with the original non-storage electronic components of the storage circuit board to expand the placement space of the storage circuit board to place the storage particles.

[0009] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will become apparent from the description, drawings, and claims.

Brief Description of the Drawings

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. Among them:

[0011] FIG1 is a schematic structural diagram of a first embodiment of a storage device in the present application;

[0012] FIG2 is a schematic structural diagram of a first embodiment of a storage circuit board in the present application;

[0013] FIG3 is a schematic structural diagram of an embodiment of a capacity expansion circuit board in the present application;

[0014] FIG4 is a schematic structural diagram of an embodiment of a connector in the present application;

[0015] FIG5 is a schematic structural diagram of an auxiliary circuit board according to an embodiment of the present application;

[0016] FIG6 is a schematic diagram of the connection structure of a storage circuit board and an auxiliary circuit board according to an embodiment of the present application;

[0017] FIG7 is a schematic structural diagram of a second embodiment of a storage device in the present application.

[0018] In the accompanying drawings, there are a storage device 10, a storage circuit board 100, a first circuit board material 110, a first connecting line 111, a main control 120, a first storage module 130, an external communication interface 140, a first expansion interface 150, a first contact 151, an expansion circuit board 200, a second circuit board material 210, a second storage module 220, a second connecting line 211, a second expansion interface 230, a second contact 231, an auxiliary circuit board 300, a third circuit board material 310, a non-storage electronic device 320, a first interface 330, a connector 400, a connector body 410, a first connection point array 420, a first connection point 421, a second connection point array 430, a second connection point 431, a flexible circuit board 500, and a shell 600. [Specific implementation method]

[0019] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] To expand storage capacity within limited space, especially when the circuit board space is already fully utilized, people often choose to expand the storage chip capacity. Within the same circuit board space, when the storage capacity of a single storage chip increases, the overall storage capacity of the storage device also increases.

[0021] However, expanding the capacity of memory chips is a highly challenging technical challenge, involving multiple levels of complexity and technical requirements. First, the structure and properties of the memory chips themselves are extremely sophisticated, and their internal circuit design and material selection are rigorously scientifically calculated and experimentally verified. Therefore, when expanding their capacity, it is imperative to ensure that the new memory cells seamlessly integrate with the existing structure, without any conflicts or interference. Second, the expansion process requires precise control of various physical and chemical parameters, such as temperature, pressure, and electric fields, to ensure the stable operation of the newly added memory cells. Even slight changes in these parameters can significantly affect the performance of the memory chips, requiring technicians to possess extremely high operational precision and extensive experience. Moreover, capacity expansion research is not a one-time effort; it requires long-term dedication.

[0022] In summary, research on storage capacity expansion requires not only deep technical expertise and a deep understanding of storage technology, but also the ability to skillfully apply this expertise, extensive practical experience, and a relentless spirit of innovation, capable of continuous innovation and experimentation throughout the long research process. Only by overcoming these challenges can the appropriate expansion solution be found during the experimental process, ultimately increasing storage capacity.

[0023] Considering the difficulty and time required to implement the aforementioned expansion solutions, in order to more quickly and easily expand the storage device, this application opts for increasing the space available for circuit boards. Adding circuit boards offers greater flexibility and scalability. As a core component of storage devices, circuit boards can be customized and expanded as needed. When increasing storage capacity, adding additional circuit boards or expanding them is simpler, more convenient, and easier to implement than performing complex expansion operations on the storage granules themselves. Furthermore, compared to expanding storage granules, adding circuit boards offers better performance and stability. Because expanding storage granules may involve controlling more physical and chemical parameters, changes in these parameters can have unexpected effects. As part of the overall system, circuit boards can better collaborate with other components, providing a more reliable data storage and access experience. Furthermore, adding circuit boards also means better compatibility and standardization. Circuit boards typically utilize standardized interfaces and protocols, making integration and connection of additional circuit boards easier during expansion, reducing the potential for compatibility issues.

[0024] However, the circuit board in the storage device is almost the same size as the bottom plate of the storage device casing, and there is no extra space for expansion. Therefore, this application chooses to utilize the longitudinal space and add an expansion circuit board in a direction perpendicular to the circuit board to achieve the expansion of the storage device, and further increase the storage space of the storage circuit board by placing the original non-storage electronic components on the storage circuit board on an auxiliary circuit board.

[0025] Please refer to FIG1 , which is a schematic structural diagram of a first embodiment of a storage device in the present application.

[0026] As shown in FIG. 1 , the storage device 10 includes a storage circuit board 100 , at least one expansion circuit board 200 , and an auxiliary circuit board 300 .

[0027] At least one first expansion interface is provided on the storage circuit board 100, and a second expansion interface is provided on the expansion circuit board 200; the first expansion interface of the storage circuit board 100 is connected to the second expansion interface of the expansion circuit board 200 through a connector to supplement the storage particles provided on the expansion circuit board 200 to the storage space of the storage circuit board 100; and the storage circuit board 100 is also connected to the auxiliary circuit board 300, in which the original non-storage electronic components of the storage circuit board 100 are provided, so as to expand the placement space of the storage circuit board to place the storage particles, thereby further expanding the storage space of the storage circuit board 100.

[0028] Those skilled in the art will understand that the circuit board described in this application may be a storage-type circuit board or other types of circuit boards; this embodiment is illustrated by taking the storage circuit board and the expansion circuit board as storage-type circuit boards, and the auxiliary circuit board as other types of circuit boards as examples, so as to use the expansion circuit board as the storage space for expanding the storage circuit board, and preliminarily expand the storage space of the storage circuit board, while the auxiliary circuit board is used to place non-storage electronic devices in the storage circuit board to expand the placement space of the storage circuit board, thereby allowing the storage circuit board to place more storage particles, further expanding the storage space of the storage circuit board.

[0029] The expansion interfaces described in this application are all standardized connection interfaces with expansion capabilities. Users can connect the expansion circuit board through the expansion interface to use the storage particles in the expansion circuit board as the storage space of the storage circuit board. It will be understood by those skilled in the art that the expansion interface described in this application is a standardized connection interface, which is specifically used to realize the connection between the storage circuit board and the matching expansion capacitor board, thereby expanding the storage module in the expansion circuit board into the storage space in the storage circuit board. The storage circuit board will not be connected to other types of circuit boards through the first expansion interface. For example, the storage circuit board can only be connected to the second expansion interface of the expansion circuit board that matches it and contains storage particles through the first expansion interface, and cannot be connected to the auxiliary circuit board through the first expansion interface.

[0030] In this embodiment, a first expansion interface is provided on the storage circuit board, enabling the storage circuit board to be connected to a second expansion interface on the expansion circuit board via the first expansion interface, thereby achieving connection between the storage circuit board and the expansion circuit board, thereby expanding the storage space of the storage circuit board. Furthermore, the storage circuit board can be connected to an auxiliary circuit board, and the non-storage electronic components originally on the storage circuit board can be placed on the auxiliary circuit board to further expand the storage space of the storage circuit board. This eliminates the need for process improvements to the storage components on the storage circuit board, resulting in a simple and convenient implementation. Furthermore, the manufacturing process requirements for the circuit board are not high, and the circuit board to be manufactured can still use the current manufacturing process. The various components installed thereon can also use the current manufacturing process or communication standards, without the need for major process improvements. Therefore, by adding circuit boards, the storage space of the storage circuit board can be expanded quickly and conveniently.

[0031] Please refer to FIG2 , which is a schematic structural diagram of the first embodiment of the storage circuit board in this application.

[0032] As shown in FIG. 2 , the storage circuit board 100 includes: a first circuit board plate 110 , a main control 120 , a first storage module 130 , an external communication interface 140 and at least one first expansion interface 150 .

[0033] The main control 120, the first storage module 130, the external communication interface 140 and the first expansion interface 150 are all arranged on the first circuit board plate 110, wherein the first storage module 130 is connected to the main control 120, the first expansion interface 150 is located between the main control 120 and the first storage module 130, the external communication interface 140 is arranged at one side edge of the first circuit board plate 110, the main control 120 is connected to the external communication interface 140, and the main control 120 is configured to communicate with the external host through the external communication interface 140.

[0034] When the storage circuit board 100 is expanded, at least one first expansion interface 150 is configured to connect to a matching second expansion interface of at least one expansion circuit board 200 to supplement the storage space of the storage circuit board 100 with the second storage module provided in the expansion circuit board 200 .

[0035] Continuing to refer to Figure 2, a first connection line array is provided in the first circuit board plate 110, and the first connection line array includes multiple first connection lines 111. Each first connection line 111 is respectively connected between a corresponding functional pin of the main control 120 and the first storage module 130, thereby realizing the connection between the main control 120 and the first storage module 130.

[0036] The first expansion interface 150 includes a first contact array including a plurality of first contacts 151 . The number of the first contacts 151 matches the number of the first connection lines 111 , and each first contact 151 is connected to a corresponding first connection line 111 .

[0037] In some embodiments, the first expansion interface 150 can be set at a suitable position of the first circuit board plate 110, and each first contact 151 in the first contact array of the first expansion interface 150 is connected to a corresponding first connection line 111 in the first connection line array through a corresponding connection line.

[0038] In other embodiments, the first contact array is disposed on the path where the first connection line array is located, and each first contact 151 is respectively disposed on the path where a corresponding first connection line 111 is located. It is understandable that the first expansion interface 150 in the present application may also adopt other methods, as long as it can achieve that each first contact 151 in the first expansion interface 150 is respectively connected to a corresponding first connection line 111. Preferably, the first contact array of the first expansion interface 150 of the present application is disposed on the path where the first connection line array is located, that is, each first contact 151 of the first contact array is respectively disposed on the path where a corresponding first connection line 111 is located.

[0039] When the storage circuit board 100 is expanded and at least one first expansion interface 150 on the storage circuit board 100 is configured to connect to a matching second expansion interface of at least one expansion circuit board, the storage circuit board 100 and the expansion circuit board can be stacked in parallel.

[0040] Since the space in the storage device in the direction perpendicular to the storage circuit board is limited, the expansion circuit board is stacked in parallel with the storage circuit board 100 to reduce the space required in the vertical direction.

[0041] The external communication interface 140 includes a PCIe interface that complies with the open interconnection standard CXL (Compute Express Link).

[0042] The storage circuit board 100 of the present application is based on the design of the existing storage circuit board. Furthermore, a dedicated, standardized first expansion interface 150 is further provided in the area where the first connection line array between the main control 120 and the first storage module 130 is located. The first expansion interface 150 is not a traditional external interface (used to connect the storage circuit board 100 to other external devices). Instead, the first expansion interface 150 is used to expand the existing internal signaling between the main control 120 and the first storage module 130 of the storage circuit board 100 itself, allowing the second storage module of the matching expansion circuit board to directly serve as an extension of the storage space of the storage circuit board 100 itself, thereby increasing the storage space of the storage circuit board 100.

[0043] Therefore, the technical solution of the present application can simply and conveniently implement the setting of the first expansion interface without making major improvements to the existing storage circuit board design, such as the original connecting lines, thereby helping the storage circuit board 100 to increase the storage space.

[0044] Please refer to FIG3 , which is a schematic structural diagram of an embodiment of a capacity expansion circuit board in the present application.

[0045] As shown in FIG. 3 , the expansion circuit board 200 includes a second circuit board plate 210 , a second storage module 220 , and a second expansion interface 230 .

[0046] The second storage module 220 and the second expansion interface 230 are both disposed on the second circuit board 210 , and the second expansion interface 230 is connected to the second storage module 220 . The second expansion interface 230 can be disposed at a suitable position on the second circuit board 210 .

[0047] When the expansion circuit board 200 is configured on the storage circuit board 100 to expand the storage circuit board 100, the second expansion interface 230 is configured to connect to a corresponding expansion interface of at least one first expansion interface 150 in the storage circuit board 100 to supplement the second storage module 220 set in the expansion circuit board 200 as the storage space of the storage circuit board.

[0048] All the expanded circuit boards and storage circuit boards can be stacked in parallel.

[0049] The second expansion interface described in this embodiment is identical to the first expansion interface, both being standardized expansion-capable connection interfaces. This expansion interface allows users to connect the storage circuit board to the expansion circuit board, allowing the storage modules on the expansion circuit board to function as storage space on the storage circuit board. The second expansion interface is designed to the same standards as the first expansion interface, enabling connection between the first and second expansion interfaces.

[0050] Continuing to refer to Figure 3, the second expansion interface 230 includes a second contact array, and the second contact array includes multiple second contacts 231. The number of second contacts 231 matches the number of first contacts of the first contact array of the first expansion interface of the storage circuit board 100, and each second contact 231 is used to connect to a corresponding first contact.

[0051] The second circuit board 210 is provided with a second connection line array, including a plurality of second connection lines 211. Each second connection line 211 is connected between a corresponding second contact 231 of the second contact array and the second storage module 220, thereby connecting the second expansion interface 230 to the second storage module 220. In this application, the second expansion interface 230 may also be implemented in other ways, as long as each second contact 231 in the second expansion interface 230 can be connected to a corresponding second connection line 211.

[0052] In some embodiments, the first storage module and the second storage module both include multiple storage units, and each storage unit includes multiple storage particles.

[0053] The specifications of the memory chips in the storage units of the expansion circuit board are the same as those of the storage units of the storage circuit board, and the number of memory chips is also the same. For example, the storage units on the storage circuit board may include 8*5 memory chips, that is, a total of 40 memory chips, arranged in 5 rows, with 8 memory chips distributed in each row; similarly, the storage units on the expansion circuit board may also include 8*5 memory chips, so that 80 memory chips can be arranged on the storage circuit board; correspondingly, the storage units of the expansion circuit board may also each include 8*5 memory chips, for a total of 80 memory chips; therefore, after the storage circuit board is expanded using the expansion circuit board, its storage space is doubled.

[0054] It will be understood by those skilled in the art that by setting the specifications and quantity of the storage particles on the expansion circuit board to be consistent with the specifications and quantity of the storage particles on the storage circuit board, the main control of the storage circuit board does not need to change the communication protocol between the storage particles and the main control of the storage circuit board, and does not need to make major improvements to the sending of control signals. The storage particles on the expansion circuit board can be controlled directly according to the control method of the storage particles on the storage circuit board or with reference to the control method of the storage particles on the storage circuit board.

[0055] When the expansion circuit board 200 is configured on the storage circuit board 100 to expand the storage circuit board 100, the second expansion interface 230 is configured to connect to the first expansion interface 150 of the storage circuit board 100 to perform data transmission. The maximum data transmission rate between the second expansion interface 230 and the first expansion interface 150 can reach the same order of magnitude as the maximum data transmission rate with the first connection line of the first connection line array of the storage circuit board 100. For example, if the maximum data transmission rate of the first connection line is 2 Gbps, the maximum data transmission rate between the first expansion interface and the second expansion interface can also reach 2 Gbps.

[0056] In the present application, preferably, when the first expansion interface is connected to the second expansion interface 230 of the expansion circuit board to perform data transmission, the data transmission rate between the first expansion interface and the second expansion interface 230 can be designed to be greater than or equal to 2 Gbps.

[0057] The same or similar configurations on the expansion circuit board 200 may refer to the description in the storage circuit board embodiment and will not be repeated here.

[0058] Please refer to FIG4 , which is a schematic structural diagram of an embodiment of a connector in the present application.

[0059] As shown in FIG. 4 , the storage device further includes a connector 400 . The connector 400 includes a connector body 410 , a first connection point array 420 , and a second connection point array 430 .

[0060] The first connection point array 420 is provided on the first surface of the connector body 400 and includes a plurality of first connection points 421 , each of the first connection points 421 being configured to connect to a corresponding first contact of the first expansion interface of the storage circuit board 100 .

[0061] The second connection point array 430 is arranged on the second side of the connector body 400, including a plurality of second connection points 431, each second connection point 431 is configured to be connected to a corresponding second contact in the second expansion interface of the expansion circuit board 200, wherein the first side and the second side of the connector body 400 are opposite to each other.

[0062] The connector body 400 is further provided with a plurality of third connection lines 440 . Each first connection point 421 in the first connection point array 420 is connected to a corresponding second connection point 431 in the second connection point array 430 via a corresponding third connection line 440 .

[0063] In some embodiments, the first connection point 421 and the second connection point 431 protrude from the first side and the second side of the connector body 410 , and the first connection point 421 and the second connection point 431 are elastically compressible connection points, respectively.

[0064] Elastic compressibility is a special design that allows for excellent elasticity and compression performance. These connectors are typically used in applications requiring a stable and reliable electrical connection, particularly those that must withstand compression, vibration, or shock. Their design and material selection ensure that the connector maintains stable contact with the contacts even when subjected to external forces, ensuring stable data transmission between the first and second expansion ports.

[0065] In one embodiment, the first connection point may be a connection point that does not protrude from the first surface of the connector body, and the second connection point may be a connection point that does not protrude from the second surface of the connector body. The contact connection between the first connection point and the first contact, and the contact connection between the second connection point and the second contact, are achieved by a structure such as a locking or pressing fit between the circuit boards to achieve stable connection contact.

[0066] Refer to Figures 5 and 6. Figure 5 is a structural diagram of an auxiliary circuit board in an embodiment of the present application; Figure 6 is a schematic diagram of the connection structure of a storage circuit board and an auxiliary circuit board in an embodiment of the present application.

[0067] As shown in FIG. 5 , the auxiliary circuit board 300 includes a third circuit board material 310 , a non-storage electronic component 320 and a first interface 330 .

[0068] The non-storage electronic device 320 and the first interface 330 are both arranged on the third circuit board material 310, and the first interface 330 is connected to the non-storage electronic device 320; the first interface 330 is configured to connect to the second interface (not marked in the figure) in the storage circuit board that matches the first interface 330 through a flexible circuit board, so that the third circuit board material 310 can place the original non-storage electronic device of the storage circuit board, thereby expanding the placement space of the storage circuit board to place storage particles, and further expanding the storage space of the storage circuit board.

[0069] The first interface 330 and the second interface are common communication interfaces for connecting circuit boards. The maximum data transmission rate between the first interface 330 and the second interface is lower than the maximum data transmission rate between the first expansion interface and the second expansion interface.

[0070] The flexible circuit board 500 is provided with a plurality of connecting lines. The flexible circuit board 500 is made of polyimide or polyester film as a substrate and is a highly reliable and flexible printed circuit board. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability.

[0071] As shown in Figure 6, one end surface of the flexible circuit board 500 is fixedly connected to one end surface of the auxiliary circuit board 300, so that the auxiliary circuit board 300 is connected to one end of each connecting line of the flexible circuit board 500; and the other end surface on the opposite side of the flexible circuit board 500 is fixedly connected to one end surface of the storage circuit board 100, so that the storage circuit board 100 is connected to the other end of each connecting line of the flexible circuit board 500; that is, the storage circuit board 100 is connected to the auxiliary circuit board 300 through the flexible circuit board 500.

[0072] In some embodiments, the storage circuit board 100 and the auxiliary circuit board 300 are stacked by bending the flexible circuit board 500; that is, the setting of the flexible circuit board 500 can realize the connection between the storage circuit board 100 and the auxiliary circuit board 300 while making the storage circuit board 100 and the auxiliary circuit board 300 stacked, thereby reducing the horizontal occupied space of the storage device and facilitating the miniaturization of the storage device.

[0073] In some embodiments, the flexible circuit board 500 is provided with connection terminals on both ends. The connection terminals on one end of the flexible circuit board 500 are connected to the first interface 330 of the auxiliary circuit board, and the connection terminals on the other end of the flexible circuit board 500 are connected to the second interface of the storage circuit board. In another embodiment, the two end surfaces of the flexible circuit board 500 are soldered to the first interface of the auxiliary circuit board 300 and the second interface of the storage circuit board 100, respectively. It is understood that it is sufficient to connect the storage circuit board 100 to the auxiliary circuit board via the flexible circuit board 500.

[0074] In this embodiment, the storage circuit board is connected to the auxiliary circuit board through a flexible circuit board, and the non-storage electronic components originally designed for the storage circuit board are placed on the auxiliary circuit board, so that the original placement space on the storage circuit board is enlarged. Therefore, more storage particles can be placed on the storage circuit board, further expanding the storage space of the storage circuit board.

[0075] Please refer to FIG. 7 , which is a schematic structural diagram of a second embodiment of a storage device in this application.

[0076] As shown in FIG. 7 , the storage device 10 further includes a housing 600 , wherein a receiving cavity is provided inside the housing 600 , and the storage circuit board 100 , at least one expansion circuit board 200 and the auxiliary circuit board 300 are accommodated in the receiving cavity of the housing.

[0077] In some embodiments, the storage circuit board 100, at least one expansion circuit board 200 and the auxiliary circuit board 300 are stacked together to reduce the volume occupied by the circuit board in the accommodating cavity, which facilitates the accommodation of multiple circuit boards in the accommodating cavity inside the shell while keeping the internal space of the shell unchanged.

[0078] In some embodiments, the shell 600 includes a lower shell and an upper shell. The stacked circuit boards can be fixed on the lower shell so that the stacked circuit boards have a stable structure inside the shell. This can effectively avoid instability of the circuit boards caused by tilting or impact of the shell, thereby ensuring the stability of contact between the circuit boards. The upper shell and the lower shell are correspondingly arranged to form corresponding accommodating cavities.

[0079] In one embodiment, the specification of the housing complies with one of the E3.S specification, E3.S2T specification, E3.L specification, and E3.L 2T specification of the network storage.

[0080] The specifications of E3.S are Height 76mm, Length 112.75mm, and Thickness 7.5mm.

[0081] The specifications of E3.S2T are 76mm in height, 112.75mm in length and 16.8mm in thickness.

[0082] The specifications of E3.L are height 76mm, length 142.2mm and thickness 7.5mm.

[0083] The specifications of E3.L 2T are height 76mm, length 142.2mm and thickness 16.8mm.

[0084] To sum up, the present application sets at least one first expansion interface on the storage circuit board and sets a second expansion interface on the expansion circuit board, so that the first expansion interface of the storage circuit board is connected to the second expansion interface of the expansion circuit board through a connector to supplement the storage particles set on the expansion circuit board to the storage space of the storage circuit board, thereby realizing the first expansion of the storage space of the storage circuit board; further, the storage circuit board is also connected to the auxiliary circuit board through a flexible circuit board, and the original non-storage electronic devices of the storage circuit board are placed on the auxiliary circuit board to expand the placement space of the storage circuit board, so that the storage circuit board can place more storage particles, thereby realizing further expansion of the storage space of the storage circuit board; there is no need to make process improvements to the storage particles on the circuit board, and the manufacturing process requirements of the circuit board are not high. The circuit board to be manufactured can still use the current manufacturing process, and the various devices set thereon can also use the current manufacturing process or communication standard, without the need for major process improvements. Therefore, by adding circuit boards, the storage space of the storage circuit board can be expanded conveniently and quickly in a short time.

[0085] The above description is only an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A storage device, characterized in that: include: A storage circuit board, wherein at least one first expansion interface is provided on the storage circuit board; At least one expansion circuit board, wherein a second expansion interface is provided on the expansion circuit board; Auxiliary circuit board; Among them, the first expansion interface of the storage circuit board is connected to the second expansion interface of the expansion circuit board through a connector to supplement the storage particles set on the expansion circuit board as the storage space of the storage circuit board; and the storage circuit board is connected to the auxiliary circuit board, and the auxiliary circuit board is provided with the original non-storage electronic devices of the storage circuit board to expand the placement space of the storage circuit board to place the storage particles.

2. The storage device according to claim 1, wherein The storage circuit board is connected to the auxiliary circuit board via a flexible circuit board; The maximum data transmission rate between the first expansion interface and the second expansion interface is greater than the maximum data transmission rate of the flexible printed circuit board.

3. The storage device according to claim 1, wherein The storage circuit board includes: a first circuit board material; A main control unit is provided on the first circuit board; A first storage module is provided on the first circuit board, and the first storage module is connected to the main controller; An external communication interface is provided at one side edge of the first circuit board, the main control is connected to the external communication interface, and is configured to communicate with an external host through the external communication interface; In which, the first expansion interface is set on the first circuit board and is located between the main control and the first storage module. When the storage circuit board is expanded, at least one of the first expansion interfaces is configured to connect to a matching second expansion interface of at least one expansion circuit board to supplement the second storage module set in the expansion circuit board as the storage space of the storage circuit board.

4. The storage device according to claim 3, wherein: A first connection line array is provided in the first circuit board plate, the first connection line array including a plurality of first connection lines, each of the first connection lines being connected between a corresponding functional pin of the main controller and the first storage module to achieve connection between the main controller and the first storage module; The first expansion interface includes a first contact array including a plurality of first contacts. The number of the first contacts matches the number of the first connection lines, and each of the first contacts is connected to a corresponding first connection line.

5. The storage device according to claim 1, wherein The expansion circuit board includes: a second circuit board sheet; A second storage module is provided on the second circuit board; A second expansion interface is provided on the second circuit board and is connected to the second storage module; wherein, when the expansion circuit board is configured on the storage circuit board to expand the storage circuit board, the second expansion interface is configured to connect to a corresponding expansion interface of at least one first expansion interface in the storage circuit board to supplement the second storage module provided in the expansion circuit board as the storage space of the storage circuit board. The storage device according to claim 5 , wherein: The second expansion interface includes a second contact array including a plurality of second contacts, the number of the second contacts matching the number of first contacts of the first contact array of the first expansion interface of the storage circuit board, and each second contact is used to connect to a corresponding first contact; A second connecting line array is provided in the second circuit board plate, including multiple second connecting lines, each of which is connected between a corresponding second contact in the second contact array and the second storage module, thereby realizing the connection between the second expansion interface and the second storage module.

7. The storage device according to claim 2, wherein: The auxiliary circuit board includes: Third circuit board material; A non-storage electronic device is provided on the third circuit board; A first interface is provided on the third circuit board and is connected to the non-storage electronic device; the first interface is configured to connect to a second interface on the storage circuit board that matches the first interface through the flexible circuit board, so that the third circuit board can accommodate the original non-storage electronic device of the storage circuit board, thereby expanding the placement space of the storage circuit board to accommodate storage chips; The maximum data transmission rate between the first interface and the second interface is lower than the maximum data transmission rate between the first expansion interface and the second expansion interface.

8. The storage device according to claim 1, wherein: The connector comprises: Connector body; a first connection point array, the first connection point array being disposed on the first side of the connector body and comprising a plurality of first connection points, each of the first connection points being configured to connect to a corresponding first contact of the first expansion interface of the storage circuit board; a second connection point array, the second connection point array being disposed on a second side of the connector body and comprising a plurality of second connection points, the first side and the second side being opposite to each other, each second connection point being configured to connect to a corresponding second contact of a second expansion interface of the expansion circuit board; Wherein, a plurality of third connection lines are further provided in the connector body, and each of the first connection points in the first connection point array is connected to a corresponding second connection point in the second connection point array via a corresponding third connection line.

9. The storage device according to claim 8, wherein: The first connection point and the second connection point protrude from the first surface and the second surface of the connector body, and the first connection point and the second connection point are elastically compressible connection points respectively.

10. The storage device according to claim 1, wherein: Also includes: A housing, wherein a receiving cavity is provided inside the housing; The storage circuit board, at least one capacity expansion circuit board and the auxiliary circuit board are accommodated in the accommodating cavity of the housing.

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