Electrochemical reactor and manufacturing method therefor

Abstract

Provided in the present application are an electrochemical reactor and a manufacturing method therefor. The electrochemical reactor is characterized in that one of two electrically conductive layers is arranged on one side of a dielectric layer, and the other electrically conductive layer is arranged on the other side of the dielectric layer, so as to form each sub-reactor, the dielectric layer and the electrically conductive layers are all of a porous structure, and pores of the porous structures can allow a fluid to pass therethrough; and by using blocking and supporting structures, a plurality of sub-reactors are connected in parallel, spread out, supported and sealed to form a plurality of fluid channels, such that the electrochemical reactor is formed; the fluid flows in through inlet channels, laterally flows through the porous structures of the sub-reactors, and then flows out through outlet channels adjacent to the inlet channels; the inlet channels and the outlet channels are adjacent to each other in an alternating manner; and the two electrically conductive layers are further connected to a positive electrode and a negative electrode of a power supply.

Description

Electrochemical reactor and manufacturing method thereof

[0001] Related applications

[0002] This application claims priority to the Chinese invention patent application with application number 202410358224.3 filed on March 27, 2024, and cites the entire disclosure of the above patent application as part of this application. Technical Field

[0003] The present application relates to the field of electrocatalysis technology, and in particular to an electrochemical reactor and a method for manufacturing the same. Background Art

[0004] Existing exhaust purifiers for internal combustion engines must perform both filtering and combustion catalysis functions. The most commonly used soot filter on the market uses micron-sized pores on the inner wall of a wall-flow honeycomb ceramic to capture soot from the exhaust gas. This capture efficiency can reach over 95%, making it easy to produce and low-cost. However, in the later stages of capture, soot often accumulates and cannot be cleaned, increasing exhaust pressure drop and fuel consumption. This requires additional purification components or regular cleaning, leading to increased costs. Current soot cleaning solutions include off-line ultrasonic cleaning and on-line resistance heating combustion and chemical catalytic combustion. Each of these existing solutions has its own drawbacks. Specifically, off-line cleaning solutions cannot operate continuously and require dismantling and cleaning with specialized equipment, resulting in a significant waste of resources. Resistance heating combustion uses resistance heating to achieve the required combustion temperature, which can reach over 400 to 500 degrees Celsius. This requires a large amount of electrical energy, resulting in a significant waste of resources. In addition, the current chemical catalytic cleaning method requires an ignition point of 250 to 300 degrees Celsius, while the conventional temperature of diesel internal combustion engine exhaust is 150 to 250 degrees Celsius. Therefore, without adding other treatment methods, there is a clogging problem when the chemical catalytic method is used to treat diesel internal combustion engine exhaust.

[0005] A common problem with current discharge reactors is that the position of electrons cannot be controlled in high-voltage electronegative fluids, the discharge path is uncontrollable, the current path is random and bifurcated, and a diffuse discharge covering the surface cannot be formed. When the reaction fluid passes through a non-discharged position, the reaction efficiency is reduced; the way to improve efficiency is to increase the series thickness or increase the voltage, which wastes volume and electrical energy.

[0006] How to reduce the space occupied by electrochemical reactors while reducing usage costs and improving reaction efficiency is an urgent problem to be solved in the existing technology. Summary of the Invention

[0007] To address the issues identified in the aforementioned background technology, embodiments of the present application provide an electrochemical reactor and a method for manufacturing the same. Through structural and parameter design, this application utilizes electrons within the micrometer-sized pores of a dielectric layer for electrostatically enhanced filtration and electrochemical catalysis, reducing costs and compacting volume. Furthermore, a damping structure for micro-discharge is constructed, allowing plasma to diffuse within the membrane, controlling the discharge scale and range and improving efficiency. The discharge damping structure encompasses various aspects of the reactor's materials, including shape, position, pore size, thickness, and tortuosity.

[0008] According to one aspect of an embodiment of the present application, there is provided an electrochemical reactor, comprising: two conductive layers and a dielectric layer;

[0009] One of the two conductive layers is placed on one side of the dielectric layer, and the other of the two conductive layers is placed on the other side of the dielectric layer to form a sub-reactor, wherein the dielectric layer and each of the conductive layers are porous structures, and the porous structures include pores through which fluid can pass; and

[0010] A plurality of the sub-reactors are laid out in parallel to form a plurality of channels for fluid to pass through, thereby constituting the electrochemical reactor. The fluid flows into the inlet channel in the channel, passes through the porous structure of the sub-reactor laterally, and flows out from the outlet channel adjacent to the inlet channel. The inlet channels and the outlet channels are alternately adjacent to each other.

[0011] The two conductive layers are also used to connect to the positive and negative electrodes of a power source.

[0012] According to another aspect of an embodiment of the present application, a method for manufacturing an electrochemical reactor is provided, comprising: loading a catalyst into a plurality of pores included in a dielectric layer by impregnation and high-temperature drying;

[0013] Ultrasonic stirring of a mixture of conductive nanorods, nano-silica sol, polyvinyl alcohol and deionized water to obtain a conductive layer gel;

[0014] The two conductive layers are coated on both sides of the dielectric layer and dried to obtain a sub-reactor; the conductive layer gel is coated on both sides of the dielectric layer and dried at high temperature to form two conductive layers to obtain a sub-reactor.

[0015] Based on the conductive layer gel and electrode sheet, the conductive layer on both sides of the sub-reactor is connected to the positive and negative electrodes of the power supply respectively and then dried; and

[0016] A plurality of the sub-reactors are laid out in parallel to form a plurality of channels for fluid to pass through, thereby constituting the electrochemical reactor.

[0017] According to one embodiment of the present application, it further includes:

[0018] Manufacturing of plugging support structures based on sintering, welding, folding, fixing and gel filling; and

[0019] After coating the conductive layer gel on both sides of the dielectric layer and drying at high temperature to form two conductive layers to obtain a sub-reactor, and before connecting the conductive layers on both sides of the sub-reactor to the positive and negative electrodes of a power supply based on the conductive gel and the electrode sheet and drying the resulting layers, the method further includes:

[0020] Based on the gel bonding sintering or folding, inserting and fitting methods, the sub-reactor is arranged to fit closely with the blocking support structure.

[0021] The embodiments of the present application design an electrochemical structure with membrane layer spreading and internal discharge, rather than using the currently commonly used reactor structure. The specific beneficial effects are at least as follows: two conductive layers and a dielectric layer based on a porous structure constitute a sub-reactor, allowing the fluid to pass through the conductive layer and react in the large electron-rich area of ​​the dielectric layer, thereby promoting electrostatic enhanced filtration and electrocatalytic reaction based on the process of passing through. Furthermore, the series structure reactor is stacked in series across the thickness of the dielectric layer to achieve the purpose of increasing the effect; the present application takes uniform discharge as the technical effect, and the sub-reactors can be spread in parallel to diffusely release electrons in the micropores of the dielectric layer, thereby improving efficiency and compressing the volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:

[0023] FIG1 is a schematic diagram of an exemplary circuit including an electrochemical reactor according to an embodiment of the present application;

[0024] FIG2A is a simplified schematic diagram of an example of an electrochemical reactor according to an embodiment of the present application;

[0025] FIG2B is a schematic cross-sectional view of an example of an electrochemical reactor according to an embodiment of the present application;

[0026] FIG2C is a simplified side view of an example of an electrochemical reactor according to an embodiment of the present application;

[0027] FIG2D is a simplified side view of an example of another electrochemical reactor according to an embodiment of the present application;

[0028] FIG2E is a main schematic diagram of an example of an electrochemical reactor according to an embodiment of the present application;

[0029] FIG3A is a main schematic diagram of an example of an electrochemical reactor according to another embodiment of the present application;

[0030] FIG3B is a schematic front view of an example of an electrochemical reactor according to another embodiment of the present application;

[0031] FIG4A is a main schematic diagram of an example of an electrochemical reactor according to another embodiment of the present application;

[0032] FIG4B is a schematic cross-sectional view of an example of a sub-reactor according to another embodiment of the present application;

[0033] FIG4C is a schematic cross-sectional view of another electrochemical reactor according to another embodiment of the present application;

[0034] FIG5A is a schematic cross-sectional view of an example of an electrochemical reactor according to another embodiment of the present application;

[0035] FIG5B is a simplified side view of an example of an electrochemical reactor according to another embodiment of the present application;

[0036] FIG6 is a schematic diagram of an example of a method for manufacturing an electrochemical reactor according to an embodiment of the present application;

[0037] FIG7 is a schematic diagram of an example of a method for manufacturing an electrochemical reactor according to another embodiment of the present application. DETAILED DESCRIPTION

[0038] The above and other features of the present application will become apparent through the following description with reference to the accompanying drawings. In the description and the accompanying drawings, specific embodiments of the present application are disclosed in detail, which show some embodiments in which the principles of the present application can be adopted. It should be understood that the present application is not limited to the described embodiments. On the contrary, the present application includes all modifications, variations and equivalents that fall within the scope of the appended claims.

[0039] In the embodiments of the present application, the terms "first", "second", etc. are used to distinguish different elements in terms of name, but do not indicate the spatial arrangement or temporal order of these elements, and these elements should not be limited by these terms. The term "and / or" includes any one and all combinations of one or more of the associated listed terms. The terms "comprising", "including", "having", etc. refer to the presence of the stated features, elements, components or components, but do not exclude the presence or addition of one or more other features, elements, components or components.

[0040] In the embodiments of the present application, the singular forms "a", "the", etc. may include plural forms and should be broadly understood as "a" or "a type" rather than being limited to the meaning of "one"; in addition, the term "said" should be understood to include both singular and plural forms, unless the context clearly indicates otherwise; in addition, the term "according to" should be understood as "at least in part according to...", and the term "based on" should be understood as "at least in part based on...", unless the context clearly indicates otherwise; in addition, the term "plurality" means two or more, unless otherwise specified.

[0041] The following describes the implementation of the embodiments of the present application with reference to the accompanying drawings.

[0042] Figure 1 is a circuit diagram of an example of an electrochemical reactor according to an embodiment of the present application; Figure 2A is a simplified schematic diagram of an example of an electrochemical reactor according to an embodiment of the present application; Figure 2B is a cross-sectional schematic diagram of an example of an electrochemical reactor according to an embodiment of the present application; Figure 2C is a simplified side schematic diagram of an example of an electrochemical reactor according to an embodiment of the present application; Figure 2D is a simplified side schematic diagram of an example of another electrochemical reactor according to an embodiment of the present application; and Figure 2E is a main schematic diagram of an example of an electrochemical reactor according to an embodiment of the present application.

[0043] It should be noted that Figure 1 illustrates the specific structure and circuitry of the sub-reactor, while Figures 2A-5B illustrate the different shapes and structures of the non-circuitry components of the electrochemical reactor. Figures 2A-5B do not illustrate the circuitry, but the circuitry in Figures 2A-5B is consistent with that in Figure 1, with a power supply connecting the two conductive layers on either side of the dielectric layer. Figures 2A-2D and 3A-5B are cross-sectional views for ease of explanation, while the complete main diagram is shown in Figure 2E (each layer has two left and right blocking support structures).

[0044] As shown in Figure 1, the application scenario of the electrochemical reactor of the present application is mostly to apply the electrochemical reactor in the circuit of the electrochemical reactor. The circuit of the electrochemical reactor may include, for example, a power supply 5 and a sub-reactor 4. It should be noted that the circuit including the electrochemical reactor may also include, for example, a current buffer element 6. The current buffer element may be, for example, an electronic damping element such as a capacitor, resistor, reactance or inductor for buffering the current in the circuit. The inclusion of the current buffer element in the circuit greatly improves the discharge uniformity of the electrochemical reactor and increases the spacing range and voltage range of uniform discharge. Specifically, the current buffer element is provided to smooth the discharge current by increasing the electronic capacity, etc., so that the uniform discharge spacing range is more than doubled. The power supply 5 includes a positive electrode and a negative electrode. The power supply 5 may be, for example, a high-voltage AC power supply or a high-voltage pulse power supply, which can power the electrochemical reactor. This specification does not limit this. In addition, a fluid with a certain flow rate has the function of dispersing discharge electrons and uniform discharge. The discharge medium of the reactor is actually a longitudinal airflow and a porous medium at a certain flow rate.

[0045] As shown in Figure 1 , the electrochemical reactor includes a sub-reactor 4, which includes two conductive layers (the two conductive layers can be specifically seen as an inner conductive layer 1 and an outer conductive layer 3 in Figure 1 ), and a dielectric layer 2. The two conductive layers are respectively connected to the positive and negative electrodes of a power source 5. It should be noted that the structure of the electrochemical reactor in all figures of this application is merely an illustrative example to more clearly illustrate this application and is not intended to limit this application. Furthermore, the dimensions (such as length and thickness) of each structure included in the electrochemical reactor in all figures, as well as the ratios between the dimensions of different structures, are merely illustrative examples to more clearly illustrate this application and are not related to actual dimensions.

[0046] According to another embodiment of the present specification, the inner conductive layer 1 of the two conductive layers is placed on one side of the dielectric layer 2, and the outer conductive layer 3 of the two conductive layers is placed on the other side of the dielectric layer 2, forming a sub-reactor 4. The dielectric layer 2 and each conductive layer are porous structures, and the porous structure includes pores that can allow fluid to pass through. In actual operation of the reactor shown in Figure 1, after the fluid contacts the conductive layer, it can pass through the electrochemical reactor, for example, based on direction 8 (from top to bottom), or it can pass through the electrochemical reactor in the opposite direction of direction 8 (from bottom to top). The angle between direction 8 and the conductive layer and the dielectric layer is approximately 90 degrees. The angle of approximately 90 degrees here indicates that the fluid passes through the electrochemical reactor nearly perpendicularly, but does not limit the direction of the fluid before reaching the contact position with the conductive layer. For example, the fluid can flow obliquely to the surface of the conductive layer and then pass through the electrochemical reactor in a direction nearly perpendicular to the conductive layer and the dielectric layer. When the angle is 90 degrees, the energy consumption is minimized.

[0047] According to another embodiment of the present specification, the electrochemical reactor further comprises a blocking support structure 7, which is placed at the opposite end of the fluid inflow direction of the inlet channel and the opposite end of the fluid outflow direction of the outlet channel, upstream of the sub-reactor in the fluid direction or downstream of the fluid direction, to support and protect the upper adjacent sub-reactor and prevent the fluid from directly flowing out of the electrochemical reactor. As a result, the fluid enters the dielectric layer for reaction, thereby further improving the efficiency of the electrochemical reaction. When the dielectric layer is a flexible material, in addition to the above blocking and supporting functions, the blocking support structure also protects the sub-reactor adjacent upstream in the fluid direction. It should be noted that upstream in the fluid direction refers to the corresponding position of the fluid source in the local position of the sub-reactor, and downstream in the fluid direction refers to the corresponding position of the fluid flow away in the local position of the sub-reactor.

[0048] When a multi-layer plasma reactor without a blocking structure and a discharge cavity spacing of 0.8 mm is used, the soot removal efficiency can reach 93% at 150°C-230°C, and the strong oxidizing property of the plasma is used to burn the soot, which has certain practical value. However, this reactor can only achieve high efficiency with high power consumption. At lower fluid flow rates and speeds, the soot purification efficiency is 89% at 25.2W and 93% at 43.4W, but even with high efficiency, it cannot meet the current national emission standards; and the filtration efficiency will decrease as the exhaust volume of the internal combustion engine increases. Because there is no blocking support structure, there is no space and time for the fluid to stop, and the fluid on its inner wall surface is runoff. When the horsepower of the internal combustion engine increases, the higher the exhaust, the faster the runoff, and the efficiency decreases linearly. Therefore, the electrochemical reactor used in this application can be used for the integrated purification of carbon material filtration and soot combustion in the exhaust gas of internal combustion engines, combining the performance of high-efficiency filtration and low-temperature combustion. As a result, the fluid velocity is reduced, which brings more sufficient reaction time, and at the same time has the advantages of being compact and efficient. Specifically, under the protection of the sealing support structure, the sub-reactor can achieve a filtration efficiency of more than 99%, and carbon soot can undergo plasma catalytic combustion at a low temperature of 150°C.

[0049] Furthermore, in order to improve the reaction efficiency of the electrochemical reactor, multiple sub-reactors are arranged in parallel to form multiple channels for fluid to pass through, thereby forming an electrochemical reactor. The fluid flows into the inlet channel in the channel and laterally passes through the porous structure of the sub-reactor, and flows out from the outlet channel adjacent to the inlet channel. The inlet channels are alternately adjacent to the outlet channels. For details, see Figures 2A to 5B. It should be noted that the parallel connection of the electrochemical reactor and the sub-reactor can produce different structures and shapes, such as a stacked shape (as shown in Figure 4C), a Swiss roll shape (scroll shape, as shown in Figure 4A), and a wall-flow honeycomb shape (as shown in Figure 3A).

[0050] The electrochemical reactor structure shown in Figures 2B-2E and Figures 4A-5B includes a blocking support structure 7 and sub-reactors 4 that are spread out in parallel. The sub-reactors 4 show a single-layer structure of a conductive layer and a dielectric layer after connection, without showing the specific structure and circuit structure. Specifically: the two conductive layers and the dielectric layer of the plurality of sub-reactors 4 are connected as one body so that they are at the same potential when the power is turned on, and form sub-reactors 4 that are connected in parallel; the sub-reactors 4 that are bent in parallel form a plurality of U-shapes with openings facing each other (as shown in Figures 2B-2E and Figures 4A-5B), and the two relatively connected U-shapes are similar to elongated S-shapes, and the S-shapes contain an adjacent inlet channel and an outlet channel, and the inlet channels and the outlet channels are alternately adjacent; the blocking support structure 7 can be placed on both the inner and outer sides of the U-shape, and the figures only show its arrangement in the downstream direction of the fluid. It should be noted that gel and a blocking support structure are used to strengthen the upper and lower adjacent parts of the conductive layer at the opposite end of the fluid inflow direction to achieve fluid sealing, so that all the fluid enters the dielectric layer for reaction, and the gel is part of the blocking support structure 7.

[0051] The electrochemical reactor shown in Figures 2A and 3A-3B includes multiple sub-reactors spread out in parallel, specifically including a dielectric layer 2, an inner conductive layer 1 and an outer conductive layer 3; the dielectric layer 3 also serves as a blocking support structure 7 due to its supporting strength; the inner conductive layer 1 and the outer conductive layer 3 are respectively connected to the positive and negative poles of the power supply. The other parts of the circuit are not shown in the figure, but the circuit part is consistent with that shown in Figure 1. The reactor structure shown in FIG2A specifically includes: the two conductive layers and the dielectric layer of the plurality of sub-reactors are connected to form an integral whole so that they are at the same potential when the power supply is turned on; the dielectric layer after connection is made into a right angle (as shown in FIG2A), and the two conductive layers are also made into a right angle, forming a plurality of relatively connected right-angled U-shapes, and the two relatively connected right-angled U-shapes are similar to the elongated right-angled S-shape, and the S-shape includes an adjacent outlet channel and an inlet channel, and the inlet channel and the outlet channel are alternately adjacent; after obtaining the electrochemical reactor shown in FIG2A, the fluid can flow into and out of the electrochemical reactor from the fluid direction shown in direction 8. In FIG2A, the second channel from the top to the bottom is the inlet channel, and the first and third are the outlet channels. It should be noted that for the sake of intuitiveness, FIG2A uses oblique arrows to pass through the sub-reactors, but in actual passage, it can flow obliquely to the position of contact with the inner conductive layer 1, and then pass through the electrochemical reactor vertically or nearly vertically in an energy-saving manner and flow out from the outlet channel.

[0052] According to another embodiment of the present specification, the blocking support structure is also placed on both sides parallel to the inlet channel and the outlet channel to support and protect the upper adjacent sub-reactor and prevent the fluid from flowing directly out of the electrochemical reactor, such as the first longitudinal cylinder from right to left in Figure 2B. Figure 2B is a cross-sectional view after being cut from the middle of a complete electrochemical reactor (which may be a centrally symmetrical position or not), thereby showing only one side of the blocking support structure parallel to the inlet channel, without cutting. It should be noted that the blocking support structures in Figures 2B-2E are mostly exemplified by cylindrical structures, and this description does not limit the structural shape of the blocking support structure. Furthermore, the conductive layer that is bonded to the blocking support structure perpendicular to the two parallel blocking support structures, the dielectric layer that is bonded to the conductive layer, and the conductive layer that is bonded to the dielectric layer can all be removed to save materials, but when they are not removed, it can be convenient for processing.

[0053] According to another embodiment of the present specification, to simplify the structure, when the dielectric layer is made of a first supporting material with strong support, the material of the blocking support structure is the same as the first supporting material of the dielectric layer. Furthermore, to further save costs, when the blocking support structure and the dielectric layer are made of the same material and both have support properties, the dielectric layer can also serve as the blocking support structure, eliminating the need for a blocking support structure. For example, in Figure 2A , dielectric layer 2 (made of the first supporting material) and blocking support structure 7 (made of the same material as the first supporting material) are shown.

[0054] The location of the blocking support structure is set at the opposite end of the inlet channel in the direction of fluid inflow and the opposite end of the outlet channel in the direction of fluid outflow, which can also be a dielectric layer between two conductive layers (as shown in Figure 2D, this figure is a more obvious protrusion of the blocking support structure, and does not represent the width of the blocking support structure after being integrally formed with the dielectric layer. This specification and the accompanying drawings do not limit the width and shape of the dielectric layer and the blocking support structure after integrally formed). Therefore, it is not necessary to set it at the bottom of the U-shaped bend as shown in Figures 2B-2C, thereby saving space. The specific implementation method can be to integrally form the blocking support structure with supporting strength with the dielectric layer without supporting strength.

[0055] According to another embodiment of the present specification, the first supporting material includes a wall-flow honeycomb ceramic (as shown in FIG. 2A , FIG. 3A , and FIG. 3B ).

[0056] According to another embodiment of the present specification, when the material of the dielectric layer is a flexible material, the material of the blocking support structure is a second supporting material with supporting strength. It should be noted that the flexible material is a material without supporting strength. Further, the second supporting material includes a metal woven mesh, a metal sintered porous membrane and a ceramic porous membrane. The flexible material is, for example, a material that does not have a supporting and blocking function, such as glass fiber filter paper. Specifically, the blocking support structure plays a role in protecting, supporting and shaping the flexible dielectric layer. After flexible materials such as 0.42 mm glass fiber filter paper and 0.3 mm thick silicon oxide electrospinning membrane are coated with conductive powder, they are placed on a stainless steel dense mesh with an aperture of 40 microns, and 0.5 mm thick mica paper is laid on the edge to reduce tip discharge. An AC power supply with a resistor-capacitor coupling is connected with a conductive gel, and discharge is performed at voltages of 3500V and 2500V respectively. The UV value of the oscilloscope shows uniform discharge.

[0057] FIG3A is a main schematic diagram of an example of an electrochemical reactor according to another embodiment of the present application; FIG3B is a front schematic diagram of an example of an electrochemical reactor according to another embodiment of the present application.

[0058] According to another embodiment of the present specification, the structure of the electrochemical reactor can be as shown in Figures 3A-3B, and the parallel spreading of multiple sub-reactors can be specifically as follows: multiple sub-reactors are spliced ​​at right angles to each other, thereby obtaining an electrochemical reactor with a tic-tac-toe structure. It should be noted that in this structure, the blocking support structure (for example, the blocking support structure 7 shown in Figure 2A) can still be set as described above. Inlet channel Outlet channel The inlet channel is shown in Figure 3A, and the fluid flows into the electrochemical reactor from the inlet channel in the direction 8, passes through the inner conductive layer 1, the dielectric layer 2, and the outer conductive layer 3 in sequence, and then flows out of the electrochemical reactor from the outlet channel. The above embodiment is a channel directly spliced ​​to form a rectangle. Different splicing methods will form channels of different shapes, such as hexagons. This specification does not limit this, but reactors of different shapes do not deviate from the sub-reactor structure shown in Figure 1, and are all orderly spreading of sub-reactors.

[0059] The cross-sectional side of the electrochemical reactor can be shown in Figure 3B. Specifically, the channels with grids inside the small squares have blocking support structures 7 in the observation direction, and the channels without grids inside the small squares have no blocking support structures in the observation direction, thereby more intuitively representing the setting position of the blocking support structure in the electrochemical reactor.

[0060] Figure 4A is a main schematic diagram of an example of an electrochemical reactor according to another embodiment of the present application; Figure 4B is a cross-sectional schematic diagram of an example of a sub-reactor according to another embodiment of the present application; Figure 4C is a cross-sectional schematic diagram of an example of another electrochemical reactor according to another embodiment of the present application.

[0061] According to another embodiment of the present disclosure, a complete electrochemical reactor is shown in FIG4A , in which different conductive layers are connected to different power electrodes. To more clearly illustrate the structure of the electrochemical reactor of this embodiment, a cross-section of an unwound sub-reactor of the electrochemical reactor is taken, resulting in the schematic diagram shown in FIG4B . Specifically, the electrochemical reactor composed of multiple sub-reactors spread in parallel and a blocking support structure includes: the reactor is bent into a U shape after the multiple sub-reactors 4 are spread in parallel; the blocking support structure 7 is bent into a U shape and is arranged on the inner side of the reactor, and the outer side of the blocking support structure 7 is completely fitted and connected to the inner side of the reactor; another blocking support structure 7 is arranged on the opposite side of the reactor, and the outer side of the blocking support structure 7 is completely fitted and connected to one outer side of the reactor, that is, the U-shaped bottom of the other blocking support structure 7 is arranged opposite to the U-shaped bottom of the reactor and the blocking support structure 7; when the other blocking support structure 7 is arranged on the lower side of the opposite side of the reactor (as shown in Figure 4B), the reactor and the blocking support structure 7 are cross-wound clockwise, so that the other blocking support structure 7 is completely fitted and connected to the other outer side of the reactor when winding; when the other blocking support structure 7 is arranged on the upper side of the opposite side of the reactor (not shown in the figure), the reactor and the blocking support structure 7 are cross-wound counterclockwise, so that the other blocking support structure 7 is completely fitted and connected to the other outer side of the reactor when winding. In addition, the blocking support structure in the present application can achieve a one-way blocking function, such as preventing fluid from flowing from a first direction to a second direction and allowing fluid to flow from the second direction to the first direction.

[0062] It should be noted that the sub-reactor obtained by the cross-section of the sub-reactor as shown in FIG4B can also be obtained without winding to obtain an electrochemical reactor, and an electrochemical reactor sub-reactor can also be realized by stacking. Specifically, as shown in FIG4C, the electrochemical reactor composed of multiple sub-reactors spread in parallel and a blocking support structure includes: bending the sub-reactor 4 and the blocking support structure 7 so that the sub-reactor 4 and the blocking support structure 7 are both U-shaped; one blocking support structure 7 is arranged on the inner side of the sub-reactor 4, and the outer side of the blocking support structure 7 is completely fitted and connected to the inner side of the sub-reactor 4; another blocking support structure 7 is arranged on the opposite side of the sub-reactor 4, and the outer side of the blocking support structure 7 is completely fitted and connected to one outer side of the sub-reactor 4, that is, the U-shaped bottom of the other blocking support structure 7 is arranged relative to the U-shaped bottom of the reactor and the blocking support structure 7 to obtain a reactor sub-reactor; multiple sub-reactors are stacked along the longitudinal direction of the horizontal U shape to obtain an electrochemical reactor (as shown in FIG4C). It should be noted that the relative vertical relationship between the other blocking support structure 7 of each sub-reactor and the sub-reactor 4 is the same, that is, the other blocking support structure 7 of all sub-reactors is located on the upper or lower side of the opposite side of the sub-reactor. Therefore, when stacked together, the other blocking support structure 7 of each sub-reactor will be connected to the sub-reactor 4 of another sub-reactor. In addition, Figure 4C only shows the electrochemical reactor after two sub-reactors are stacked together. The number of sub-reactors used for stacking is not limited in this specification.

[0063] In addition, in this structure (as shown in FIG. 4A-4C ), the blocking support structure 7 can still be provided in the same manner as described above, and this specification will not elaborate on this.

[0064] FIG5A is a schematic cross-sectional view of an example of an electrochemical reactor according to another embodiment of the present application; FIG5B is a simplified side view of an example of an electrochemical reactor according to another embodiment of the present application.

[0065] Specifically, the structure of the electrochemical reactor can be as shown in Figures 5A-5B. The electrochemical reactor, comprising multiple sub-reactors arranged in parallel and a blocking support structure, specifically includes: the reactor, after the multiple sub-reactors 4 are arranged in parallel, is bent to form a plurality of relatively connected U-shapes, and the blocking support structure 7 is U-shaped and located inside the relatively connected U-shapes. It should be noted that in this structure, the blocking support structure 7 can still be provided in the same manner as described above, and this specification does not elaborate on this.

[0066] Current reactors also include other reactors that use discontinuous cavity structures for discharge. Because they do not have a membrane layer structure, they often increase the reactor efficiency by increasing the thickness in parallel, so they have a larger volume; and because they have not been finely designed for the structure, the discharge morphology is randomly bifurcated, and the fluid will pass through the discharge area and the non-discharge area at the same time, while the non-discharge area does not have the synergistic effect of electrical and chemical catalysis, showing local inefficiency. According to another embodiment of the present specification, each of the two conductive layers is a membrane structure, and the two conductive layers of the membrane structure are respectively attached to both sides of the dielectric layer in a coating manner to form a sub-reactor. When the conductive layers are attached separately in a coating manner to form a thin film electrochemical reactor, a large area of ​​uniform discharge is generated with a compact integrated discharge structure, combining wall flow filtration, electrostatic filtration, and electrocatalysis into one, with the advantages of compact structure, high efficiency and energy saving, and easy manufacturing.

[0067] According to another embodiment of this specification, the dielectric layer has a thickness of 0 mm to 10 mm. Under cavity conditions, the theoretical spacing for glow discharge in air at atmospheric pressure can reach 5 mm. With appropriate current buffering elements in the circuit, this spacing can theoretically be extended to 10 mm. Therefore, with appropriate current buffering elements, and provided the dielectric layer has a porosity greater than 0% and less than 100%, setting the dielectric layer thickness to 0 mm to 10 mm can achieve uniform discharge.

[0068] According to another embodiment of the present specification, the thickness of the dielectric layer is less than or equal to 0.5 mm.

[0069] Since the power of an electrochemical reactor is directly proportional to the voltage U and current I, under constant current conditions, reducing energy consumption is primarily achieved by lowering the voltage. Under certain conditions, the relationship between voltage and the discharge gap is described by the Paschen law: U = pd, where U is the discharge voltage, p is the fluid pressure, and d is the discharge gap. A uniform dielectric layer thickness ensures consistent discharge voltage at every point within the layer, resulting in uniform discharge within the dielectric layer. The discharge gap is negatively correlated with voltage and discharge uniformity. In plate-on-plate single-layer dielectric barrier experiments, the smaller the discharge gap, the more uniform the discharge. Under atmospheric conditions, a gap of 1 mm to 3 mm can maintain a certain degree of uniformity. When the gap exceeds 4 mm, the discharge gradually loses uniformity. Therefore, to ensure uniform discharge, the dielectric layer thickness can be less than 3 mm. Furthermore, to reduce reactor volume and power consumption, the dielectric layer thickness can be less than 0.5 mm.

[0070] According to another embodiment of the present specification, the material of the dielectric layer includes titanium dioxide having a relative dielectric constant greater than or equal to a preset first value, and the preset first value includes 50. It should be noted that the preset first value can be any value close to 50, for example, 48.

[0071] According to another embodiment of the present specification, in order to ensure the uniform thickness of the dielectric layer, after the multiple sub-reactors are spread in parallel, the thickness deviation of the multiple dielectric layers of the multiple sub-reactors is less than 20%. For example, if the maximum thickness of the dielectric layer after spreading in parallel is δ1 and the minimum thickness of the dielectric layer after spreading in parallel is δ2, then δ1 and δ2 satisfy: δ1-δ2<0.2×(δ1+δ2) / 2.

[0072] The thickness of the dielectric layer is the discharge distance d between the two conductive layers. The electric field strength between the two conductive layers is E = U / d. When the thickness of the dielectric layer is uneven and the deviation is large, the electric field strength of the sub-reactor will vary greatly, resulting in discharge differences. Because it is impossible to require absolute uniformity in thickness, the dielectric layer thickness deviation of multiple dielectric layers in multiple sub-reactors is set to less than 20%.

[0073] According to another embodiment of the present specification, the material of the dielectric layer includes a material having electron storage and release capabilities, including zirconium oxide, a material with a high relative dielectric constant.

[0074] To meet both the resistivity and relative permittivity requirements, low-temperature zirconium oxide was selected. The relative permittivity of the dielectric layer affects the location of electron storage and generation. A high relative permittivity favors ionization on the dielectric layer surface and electron absorption and release within the porous structure, but is detrimental to ionization within the pores. A high relative permittivity facilitates the flow of electron clusters from the dielectric surface into the pores. Electron storage and absorption facilitate the formation of secondary electrons, reducing the discharge voltage and improving discharge uniformity. Research has shown that for uniform discharge, the relative permittivity and pore size of the porous material must be matched: when the relative permittivity is greater than or equal to 1000, the pore size is less than 100 microns; when the relative permittivity is greater than or equal to 200, the pore size is less than 50 microns; when the relative permittivity is greater than or equal to 150, the pore size is less than 30 microns; and when the relative permittivity is greater than or equal to 50, the pore size is less than 10 microns.

[0075] According to another embodiment of the present specification, the average pore size of the conductive layer on both sides of the inlet channel is greater than or equal to the average pore size of the dielectric layer, and the average pore size of the dielectric layer is greater than or equal to the average pore size of the conductive layer on both sides of the outlet channel.

[0076] The gradient pore size reduces fluid resistance, making the electrochemical reactor less prone to clogging and facilitating electrocatalytic reactions. Taking soot filtration experiments as an example, different pore sizes were formed on the inner and outer coatings using fibers of different diameters. The inlet and outlet of the electrochemical reactor were then reversed, and filtration and oxidation experiments were conducted. The results showed that pore size sorting resulted in different soot accumulation locations and oxidation effects. The larger pore sizes of the inner coating (the conductive layer on both sides of the inlet channel) and the dielectric layer allowed soot to preferentially deposit between the dielectric layer and the outer coating (the conductive layer on both sides of the outlet channel), providing a favorable location for soot filtration and plasma oxidation, reducing the probability of micropore clogging and improving durability.

[0077] According to another embodiment of the present specification, the dielectric layer includes a plurality of pores, a maximum pore size of the plurality of pores is less than or equal to 100 micrometers, and an average pore size of the plurality of pores is less than or equal to 20 micrometers.

[0078] The maximum and average pore diameters of the dielectric layer are less than or equal to the reduced spark breakdown diameter of the reactive fluid, such that the maximum pore diameter is less than or equal to 100 microns and the average pore diameter is less than or equal to 100 microns. The pore diameter of the dielectric layer decreases with thickness. Under high pressure or electronegative fluids, such as in standard atmospheric conditions, the dielectric layer has a high breakdown voltage and is preferably less than 0.5 mm thick, with an average pore diameter of less than or equal to 20 microns.

[0079] According to another embodiment of the present specification, the dielectric layer has a porous structure including a plurality of pores, wherein none of the pores are through-holes. For example, the dielectric layer thickness may be greater than twice the maximum pore diameter, where the maximum pore diameter is the maximum value among the pore diameters corresponding to each pore.

[0080] Specifically, electrochemical reactors operate by allowing fluid to pass unidirectionally through the pores. The discharge pattern in porous media is related to the dielectric layer thickness, pore tortuosity, pore diameter, and porosity. Pore tortuosity is positively correlated with uniform discharge; higher tortuosity indicates better discharge uniformity. For a given dielectric layer thickness, larger pore diameters and lower tortuosity result in pores that resemble straight-through pores, reducing plasma blockage and confinement within the pores. The discharge ultimately progresses to spark breakdown or even arcing. Therefore, when none of the pores are straight-through pores, increasing the tortuosity improves discharge uniformity. For a given dielectric layer thickness, smaller pore diameters increase the tortuosity. Charge accumulates on the inner walls of the pores, and the curved pores provide multiple accumulated electric fields. Pore diameter is negatively correlated with uniform discharge; smaller pore diameters indicate better discharge uniformity. Under standard atmospheric conditions, dielectric barrier discharge was tested on porous ceramic membranes with varying pore diameters and a dielectric layer thickness of 6 mm, observed from both the front and side. When the average pore size is 1 micron, discharge occurs on the surface and edges of the ceramic membrane. No microdischarge occurs within the membrane's micropores after increasing the voltage. When the average pore size is 10, 20, 30, and 80 microns, discharge occurs first on the membrane's surface and edges, and then, with increasing voltage, within the membrane's pores. The uniformity of this discharge changes with increasing pore size. When the average pore size is 120 microns, spark breakdown occurs within the membrane's large pores, resulting in bright spots. When the dielectric layer's pore size is less than 10 microns, surface and edge discharges dominate. As the pore size increases to tens of microns, microdischarges within the pores gradually become dominant, exhibiting a certain degree of local uniformity. When the pore size increases to 120 microns (the lower limit of spark breakdown at atmospheric pressure is close to 100 microns), the discharged electron clusters develop unimpeded into larger sparks or even arcs. Energy is concentrated in the discharge sparks, resulting in a bright, point-like phenomenon. However, too small an pore size can also increase fluid resistance. Because the pore sizes in the dielectric layer exhibit a naturally normal distribution, the presence of a few large pores hinders uniform discharge. Discharge energy is dissipated in these localized large pores, resulting in no barrier or restriction, leading to energy loss. When the discharge in the reactor is maintained at surface discharge or microdischarge, the reactor achieves higher filtration and catalytic efficiencies. To balance these factors, the maximum and average pore sizes are ≤100 microns, with pore size parameters decreasing with decreasing thickness. Under atmospheric conditions, the dielectric layer thickness is less than 0.5 mm, and the average pore size is less than 20 microns.

[0081] According to another embodiment of the present specification, the material of the conductive layer includes antimony tin oxide-modified titanium oxide nanorods and a fibrous material.

[0082] The reactor power is proportional to the voltage and current. The conductive fiber itself has a tip effect, and the tip field strength can reach more than 107V / M, which makes it easy to emit electrons, resulting in lower discharge voltage and power consumption. Because the electrochemical reactor will be in a high temperature, weak acid, and strong oxidation working environment, after conducting relevant experiments using modified conductive potassium titanate whiskers, silicon carbide whiskers, fluorine-modified tin oxide nanopowders, tin-antimony-modified titanium oxide nanorods, and stainless steel micron fiber powder, it was found that the fiber coating brought lower fluid resistance due to its higher porosity. After comprehensively considering the experimental results and cost factors, tin oxide antimony-modified titanium oxide nanorods and stainless steel micron fiber powder are more preferred, among which nanorod-type inorganics are resistant to high-temperature oxidation, and stainless steel micron fibers have lower resistance.

[0083] According to another embodiment of the present disclosure, the catalyst is loaded into the pores of the plurality of pores in the dielectric layer by an impregnation method, thereby allowing more fluid entering the dielectric layer to react for a longer period of time, thereby improving reaction efficiency.

[0084] According to another embodiment of the present invention, a low-resistance layer is provided on the side of the conductive layer that is not in contact with the dielectric layer. The material of the low-resistance layer includes metal fibers or metal particles. This helps to even out the current in the electrochemical reactor. According to another embodiment of the present invention, the resistivity of the conductive layer is lower than the resistivity of the dielectric layer by a predetermined multiple, and the resistivity of the dielectric layer is lower than the resistivity of the fluid. The predetermined multiple includes 100. This prevents short circuits in the electrochemical reactor and increases the number of electrons in the dielectric layer, further improving reaction efficiency.

[0085] According to another embodiment of the present disclosure, when the conductive layer is made of a conductor, the dielectric layer is made of a semiconductor or an insulator; and when the conductive layer is made of a semiconductor, the dielectric layer is made of an insulator. This prevents short circuits in the electrochemical reactor and uniformly distributes electrons in the dielectric layer, thereby increasing reaction efficiency.

[0086] The present application orderly spreads and connects sub-reactors for fluid to pass through for filtration, and uses a blocking support structure to protect and seal them, thereby forming a reactor with a compact structure. This reactor has the characteristics of a thin reaction area with a large area and fluid flowing inside, requiring electrons to uniformly cover the surface of the dielectric layer. In response to this characteristic and requirement, the present application adaptively designs the shape, thickness, pore size, pore tortuosity, electrical properties and manufacturing process of the material to form an electronic damping structure, so that the reactor has both a compact structure and extremely high efficiency.

[0087] FIG6 is a schematic diagram of an example of a method for manufacturing an electrochemical reactor according to an embodiment of the present application. The manufacturing process of the electrochemical reactor is described in this figure, but more or fewer operating steps may be included based on conventional or non-creative labor. The order of steps listed in the embodiment is only one way of executing the order of many steps and does not represent the only execution order. When the system or device product is actually executed, it can be executed in sequence or in parallel according to the method shown in the embodiment or the accompanying drawings. Specifically, as shown in FIG6, the method may include:

[0088] S610, loading the catalyst into the plurality of pores included in the dielectric layer by means of impregnation and high-temperature drying;

[0089] S620, ultrasonically stirring the mixture of the conductive nanorods, nano-silica sol, polyvinyl alcohol, and deionized water to obtain a conductive layer gel;

[0090] S630, coating the two surfaces of the dielectric layer with a conductive layer gel and drying at high temperature to form two conductive layers to obtain a sub-reactor;

[0091] S640, based on the conductive gel and electrode sheet, the conductive layers on both sides of the sub-reactor are connected to the positive and negative electrodes of the power supply respectively and then dried;

[0092] S650: Multiple sub-reactors are connected in parallel to form multiple channels for fluid to pass through, thereby forming an electrochemical reactor.

[0093] According to another embodiment of this specification, the materials for the dielectric layer and the conductive layer gel (i.e., the conductive layer described above) can be the same or similar as those in the embodiment of the electrochemical reactor, and are not further described in this embodiment. Methods such as impregnation, high-temperature drying, and ultrasonic stirring and drying can all be referred to in the prior art and are not further described in this specification.

[0094] It should be noted that, when the materials used to make the dielectric layer and the conductive layer have a certain supporting strength, the dielectric layer and the conductive layer can be realized in the form of coating, as shown in Figures 3A and 2A. Therefore, when the two conductive layers are coated and dried on the dielectric layer, the coating and drying can be performed according to the structural description of each electrochemical reactor above to obtain the corresponding sub-reactor.

[0095] When multiple sub-reactors are deployed in parallel, the parallel deployment methods described above for Figures 2A-2E, 3A-3B, 4A-4C and 5A-5B can be referred to for parallel deployment to obtain corresponding electrochemical reactors.

[0096] FIG7 is a schematic diagram of an example of a method for manufacturing an electrochemical reactor according to another embodiment of the present application. This figure describes another manufacturing process of an electrochemical reactor, but may include more or fewer operating steps based on conventional or non-creative labor. The order of steps listed in the embodiment is only one way of executing the order of many steps and does not represent the only execution order. When the system or device product is actually executed, it can be executed in sequence or in parallel according to the method shown in the embodiment or the accompanying drawings. Specifically, as shown in FIG7 , the method may include:

[0097] S710, manufacturing a plugging support structure based on sintering, welding, folding, fixing and gel filling;

[0098] S720, coating the two surfaces of the dielectric layer with a conductive layer gel and drying at high temperature to form two conductive layers to obtain a sub-reactor;

[0099] S730, by gel bonding and sintering or folding, inserting and laminating, the sub-reactor is placed in close proximity with the plugging support structure;

[0100] S740, using the conductive gel and electrode sheet, the conductive layers on both sides of the sub-reactor are connected to the positive and negative electrodes of the power supply respectively and then dried;

[0101] S750 , multiple sub-reactors are laid out in parallel to form multiple channels for fluid to pass through, thereby constituting an electrochemical reactor.

[0102] According to another embodiment of the present specification, methods such as sintering, welding, folding, fixing, gel filling, coating, drying, bonding and sintering, folding, inserting, and laminating can all be referred to in the prior art, and this specification will not elaborate on them.

[0103] Based on gel bonding sintering or folding, insertion and bonding, the sub-reactor and the blocking support structure are set up with zero distance. The specific method can refer to the setting method of the blocking support structure described above with reference to Figures 2A-2E, so as to obtain the corresponding electrochemical reactor with a blocking support structure.

[0104] The present application has been described above in conjunction with specific embodiments. However, those skilled in the art should understand that these descriptions are merely illustrative and are not intended to limit the scope of protection of the present application. Those skilled in the art may make various modifications and variations to the present application based on the spirit and principles of the present application, and such modifications and variations are also within the scope of the present application.

[0105] The preferred embodiments of the present application have been described above with reference to the accompanying drawings. Many features and advantages of these embodiments are apparent from this detailed description, and it is intended that the appended claims cover all such features and advantages of these embodiments that fall within their true spirit and scope. Furthermore, since numerous modifications and changes will readily occur to those skilled in the art, the embodiments of the present application are not intended to be limited to the precise construction and operation illustrated and described, but are intended to cover all suitable modifications and equivalents that fall within the scope thereof.

Claims

1. An electrochemical reactor, characterized in that include: two conductive layers and a dielectric layer; One of the two conductive layers is placed on one side of the dielectric layer, and the other of the two conductive layers is placed on the other side of the dielectric layer to form a sub-reactor, wherein the dielectric layer and each of the conductive layers are porous structures, and the porous structures include pores through which fluid can pass; as well as A plurality of the sub-reactors are laid out in parallel to form a plurality of channels for the fluid to pass through, thereby constituting the electrochemical reactor. The fluid flows into the inlet channel in the channel, passes through the porous structure of the sub-reactor laterally, and flows out from the outlet channel adjacent to the inlet channel. The inlet channel and the outlet channel are alternately adjacent. The two conductive layers are also used to connect to the positive and negative electrodes of a power source.

2. The electrochemical reactor according to claim 1, characterized in that The electrochemical reactor further comprises a plugging support structure, The blocking support structure is placed at the opposite end of the inlet channel to the fluid inflow direction and the opposite end of the outlet channel to the fluid outflow direction to support and protect the upper adjacent sub-reactor and prevent the fluid from directly flowing out of the electrochemical reactor.

3. The electrochemical reactor according to claim 2, characterized in that The blocking support structure is also placed parallel to both sides of the inlet channel and both sides of the outlet channel to support and protect the adjacent sub-reactors and prevent the fluid from directly flowing out of the electrochemical reactor.

4. The electrochemical reactor according to claim 2, characterized in that When the material of the dielectric layer is a first supporting material with supporting strength, the material of the blocking supporting structure is the same as the first supporting material of the dielectric layer.

5. The electrochemical reactor according to claim 4, characterized in that The first supporting material includes wall-flow honeycomb ceramic.

6. The electrochemical reactor according to claim 2 or 3, characterized in that When the material of the dielectric layer is a flexible material, the material of the blocking support structure is a second support material with supporting strength, and the second support material includes a metal woven mesh, a metal sintered porous membrane and a ceramic porous membrane.

7. The electrochemical reactor according to claim 1, characterized in that Each of the two conductive layers is a film structure, and the two conductive layers of the film structure are respectively attached to the two surfaces of the dielectric layer in a coating manner to form the sub-reactor.

8. The electrochemical reactor according to claim 7, characterized in that The thickness of the dielectric layer is 0 mm-10 mm.

9. The electrochemical reactor according to claim 7, characterized in that The thickness of the dielectric layer is less than or equal to 0.5 mm.

10. The electrochemical reactor according to claim 8, characterized in that After the multiple sub-reactors are laid out in parallel, the thickness deviation of the multiple dielectric layers of the multiple sub-reactors is less than 20%.

11. The electrochemical reactor according to claim 8, characterized in that The material of the dielectric layer includes titanium dioxide having a relative dielectric constant greater than or equal to a preset first value, and the preset first value includes 50.

12. The electrochemical reactor according to claim 1, characterized in that The average pore size of the conductive layer on both sides of the inlet channel is greater than or equal to the average pore size of the dielectric layer, and the average pore size of the dielectric layer is greater than or equal to the average pore size of the conductive layer on both sides of the outlet channel.

13. The electrochemical reactor according to claim 7, characterized in that The dielectric layer includes a plurality of pores, wherein a maximum pore size of the plurality of pores is less than or equal to 100 micrometers, and an average pore size of the plurality of pores is less than or equal to 20 micrometers.

14. The electrochemical reactor according to claim 7, characterized in that The porous structure of the dielectric layer includes a plurality of holes, and none of the holes are through holes.

15. The electrochemical reactor according to claim 7, characterized in that The conductive layer comprises antimony-tin oxide-modified titanium oxide nanorods and fiber-shaped materials.

16. The electrochemical reactor according to claim 1, characterized in that The catalyst is loaded into the plurality of pores included in the medium layer by an impregnation method.

17. The electrochemical reactor according to claim 1, characterized in that The circuit formed by the electrochemical reactor and the power supply further includes a current buffer element.

18. The electrochemical reactor according to claim 1, characterized in that A low-resistance layer is provided on the side of the conductive layer that is not bonded to the dielectric layer. The material of the low-resistance layer includes metal fibers or metal particles.

19. The electrochemical reactor according to claim 1, characterized in that The resistivity of the conductive layer at a preset multiple is smaller than the resistivity of the dielectric layer, and the resistivity of the dielectric layer is smaller than the resistivity of the fluid. The preset multiple includes 100.

20. The electrochemical reactor according to claim 1, characterized in that When the conductive layer is made of a conductor, the dielectric layer is made of a semiconductor or an insulator; and when the conductive layer is made of a semiconductor, the dielectric layer is made of an insulator.

21. A method for manufacturing an electrochemical reactor, characterized in that: include: The catalyst is loaded into the pores of the plurality of pores included in the medium layer by means of impregnation and high-temperature drying; Ultrasonic stirring of a mixture of conductive nanorods, nano-silica sol, polyvinyl alcohol and deionized water to obtain a conductive layer gel; The sub-reactor uses the conductive layer gel to coat both sides of the dielectric layer and then dry it at high temperature to form two conductive layers to obtain a sub-reactor; based on the conductive layer gel and the electrode sheet, the conductive layers on both sides of the sub-reactor are connected to the positive and negative electrodes of the power supply respectively; and A plurality of the sub-reactors are laid out in parallel to form a plurality of channels for fluid to pass through, thereby constituting the electrochemical reactor as described in any one of claims 1, 7-20.

22. The method for manufacturing an electrochemical reactor according to claim 21, wherein: Also includes: Manufacturing of plugging support structures based on sintering, welding, folding, fixing and gel filling; as well as After coating the conductive layer gel on both sides of the dielectric layer and drying at high temperature to form two conductive layers to obtain a sub-reactor, and before connecting the two conductive layers of the sub-reactor to the positive and negative electrodes of a power supply respectively based on the conductive layer gel and the electrode sheet, the method further includes: Based on the gel drying bonding or folding, inserting and laminating method, the sub-reactor and the blocking support structure are arranged in zero distance to form the electrochemical reactor as described in any one of claims 2-6.

Images