Display panel and display device

Abstract

The present application discloses a display panel and a display device, wherein a touch function layer comprises a first insulating layer and a first conductive layer that are stacked in sequence; the first conductive layer comprises a first sub-layer and a second sub-layer that are stacked; the second sub-layer is in direct contact with the surface of the side of the first insulating layer away from a display function layer, the first sub-layer is arranged on the side of the second sub-layer away from the first insulating layer, and the etching rate of the material of the second sub-layer is greater than the etching rate of the material of the first sub-layer.

Description

Display panel and display device TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] Organic Light-Emitting Diode (OLED) devices have attracted great attention from academia and industry due to their great potential for development in the direction of solid-state lighting and flat panel display. OLED devices can be made lighter and thinner, so flexible display technology will be the future development trend. The commonly used substrate is a flexible substrate such as PI (polyimide), and a thin film transistor controls the signal on the flexible substrate to realize the light-emitting regulation of the OLED device. An inorganic-organic overlapping encapsulation layer is coated to realize water and oxygen protection, and a touch film layer is covered on the encapsulation layer to realize touch function.

[0003] At present, the metal layer is etched to obtain a patterned touch electrode and a trace, but the metal layer is prone to etching residue during etching, resulting in stress concentration between adjacent film layers and causing the adjacent film layers to break. SUMMARY

[0004] The embodiments of the present application provide a display panel and a display device, which reduce etching residue in a touch function layer, reduce stress concentration, and improve the yield of the display panel.

[0005] The embodiments of the present application provide a display panel, which comprises:

[0006] a display function layer;

[0007] a touch function layer disposed on one side of the display function layer and comprising: a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer which are sequentially stacked;

[0008] The first conductive layer comprises a first sub-layer and a second sub-layer which are stacked, the second sub-layer is in direct contact with the side surface of the first insulating layer away from the display function layer, the first sub-layer is disposed on the side of the second sub-layer away from the first insulating layer, and the etching rate of the material of the second sub-layer is greater than the etching rate of the material of the first sub-layer.

[0009] In order to achieve the above-mentioned purposes, the embodiments of the present application further provide a display panel, which comprises a plurality of light-emitting areas and a non-light-emitting area adjacent to the light-emitting areas, and further comprises:

[0010] a display function layer comprising a light-emitting part disposed in the light-emitting area.

[0011] a touch function layer disposed on one side of the display function layer, the touch function layer comprising a first insulating layer, a first conductive layer, a second insulating layer and a second conductive layer which are sequentially stacked;

[0012] The touch function layer further comprises a light collecting structure corresponding to the light emitting area, the light collecting structure comprising the first insulating layer and the second insulating layer which are stacked and located in the light emitting area, the first conductive layer comprising a first sub-layer and a second sub-layer which are stacked, the second sub-layer directly contacting a side surface of the first insulating layer away from the display function layer, the first sub-layer being disposed on a side of the second sub-layer away from the first insulating layer, and the etching rate of the material of the second sub-layer being greater than the etching rate of the material of the first sub-layer.

[0013] According to the above purpose of the present application, the embodiments of the present application further provide a display device, the display device comprising a display panel, the display panel comprising:

[0014] a display function layer;

[0015] a touch function layer disposed on one side of the display function layer, the touch function layer comprising a first insulating layer, a first conductive layer, a second insulating layer and a second conductive layer which are sequentially stacked;

[0016] The first conductive layer comprises a first sub-layer and a second sub-layer which are stacked, the second sub-layer directly contacting a side surface of the first insulating layer away from the display function layer, the first sub-layer being disposed on a side of the second sub-layer away from the first insulating layer, and the etching rate of the material of the second sub-layer being greater than the etching rate of the material of the first sub-layer.

[0017] Alternatively, the display panel comprises a plurality of light emitting areas and non-light emitting areas adjacent to the light emitting areas, and the display panel further comprises:

[0018] a display function layer comprising a light emitting part corresponding to the light emitting area;

[0019] a touch function layer disposed on one side of the display function layer, the touch function layer comprising a first insulating layer, a first conductive layer, a second insulating layer and a second conductive layer which are sequentially stacked;

[0020] The light-emitting area is provided with a light condensing structure, the light condensing structure comprises the first insulating layer and the second insulating layer which are arranged in layers in the light-emitting area, the first conductive layer comprises a first sub-layer and a second sub-layer arranged in layers, the second sub-layer is in direct contact with the side surface of the first insulating layer away from the display function layer, the first sub-layer is arranged on the side of the second sub-layer away from the first insulating layer, and the etching rate of the material of the second sub-layer is greater than the etching rate of the material of the first sub-layer. BRIEF DESCRIPTION OF DRAWINGS

[0021] The technical solutions and other advantages of the present application will be apparent from the following detailed description of the embodiments of the present application, taken in conjunction with the accompanying drawings.

[0022] FIGS. 1 to 3 are schematic diagrams of etching process structures provided in the related art;

[0023] FIG. 4 is a schematic diagram of a structure of a display panel provided in an embodiment of the present application;

[0024] FIGS. 5 to 7 are schematic diagrams of etching process structures of a touch function layer provided in an embodiment of the present application;

[0025] FIG. 8 is a schematic diagram of another structure of a display panel provided in an embodiment of the present application;

[0026] FIG. 9 is a schematic diagram of another structure of a display panel provided in an embodiment of the present application;

[0027] FIG. 10 is a schematic diagram of another structure of a display panel provided in an embodiment of the present application. Embodiments of the present application

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0029] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and arrangements of the specific examples are described in the following. Of course, they are only examples and are not intended to limit the present application. Moreover, the present application can repeatedly refer to reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0030] In the related art, a metal stack is often used as a touch layer, such as a Ti / Al / Ti stack. The display panel includes a substrate layer 1 and a touch layer disposed on the substrate layer 1. The touch layer includes a first metal layer 2 disposed on the substrate layer 1, a second metal layer 3 disposed on a side of the first metal layer 2 away from the substrate layer 1, and a third metal layer 4 disposed on a side of the second metal layer 3 away from the first metal layer 2. During etching of the touch layer, a patterned photoresist layer 5 is formed on a side of the third metal layer 4 away from the second metal layer 3, and the touch layer is etched, such as by dry etching. The second metal layer 3 in the middle of the stack often needs to have a small resistance to effectively transmit signals. The first metal layer 2 and the third metal layer 4 on the upper and lower layers protect the second metal layer 3 and are more difficult to etch than the second metal layer 3. Therefore, after the touch layer is etched, etching residues 6, such as metal residues, are easily formed on the substrate layer 1. When an insulating layer 7 is formed on the touch layer, stress concentration occurs at the etching residues 6, causing the insulating layer 7 and / or the substrate layer 1 to break, thereby reducing the reliability of the display panel.

[0031] Referring to FIG. 4, an embodiment of the present application provides a display panel including a display functional layer 10 and a touch functional layer 20.

[0032] The touch functional layer 20 is disposed on a side of the display functional layer 10 and includes a first insulating layer 24, a first conductive layer 21, a second insulating layer 25, and a second conductive layer 22 disposed in sequence.

[0033] Further, the first conductive layer 21 includes a first sub-layer 211 and a second sub-layer 212 disposed in sequence. The second sub-layer 212 directly contacts a side surface of the first insulating layer 24 away from the display functional layer 10. The first sub-layer 211 is disposed on a side of the second sub-layer 212 away from the first insulating layer 24. The etching rate of the material of the second sub-layer 212 is greater than the etching rate of the material of the first sub-layer 211.

[0034] In the implementation and application, the second sub-layer 212 on the surface of the first insulating layer 24 in the first conductive layer 21 is prepared using a material with a large etching rate, to reduce etching residues of the first conductive layer 21, reduce stress concentration between adjacent film layers of the first conductive layer 21, reduce the probability of breakage of the adjacent film layers of the first conductive layer 21, and improve the yield of the display panel.

[0035] In an embodiment of the present application, the second conductive layer comprises a third sub-layer and a fourth sub-layer which are stacked, and the third sub-layer is located between the second insulating layer and the fourth sub-layer, and the etching rate of the material of the third sub-layer is greater than the etching rate of the material of the fourth sub-layer.

[0036] In an embodiment of the present application, the third sub-layer is in direct contact with the second insulating layer away from the side surface of the display functional layer.

[0037] In an embodiment of the present application, the second conductive layer further comprises a fifth sub-layer which is arranged between the third sub-layer and the second insulating layer, the etching rate of the material of the fifth sub-layer is less than the etching rate of the material of the third sub-layer, and the fifth sub-layer is in direct contact with the second insulating layer away from the side surface of the display functional layer.

[0038] In an embodiment of the present application, the first insulating layer comprises a first surface away from the display functional layer, the second insulating layer comprises a second surface away from the display functional layer, and the roughness of the first surface is less than the roughness of the second surface.

[0039] In an embodiment of the present application, the thickness of the second sub-layer is less than or equal to the thickness of the third sub-layer.

[0040] In an embodiment of the present application, the display panel comprises a plurality of light emitting areas and non-light emitting areas adjacent to the light emitting areas.

[0041] The display functional layer comprises light emitting parts arranged corresponding to the light emitting areas.

[0042] The touch functional layer further comprises light collecting structures arranged corresponding to the light emitting areas.

[0043] The touch functional layer is provided with a groove surrounding the light emitting areas, the groove at least penetrates the first insulating layer and the second insulating layer, and the first insulating layer and the second insulating layer which are located in the light emitting areas and are stacked form the light collecting structures.

[0044] In an embodiment of the present application, the touch functional layer further comprises an organic layer which is covered on the side of the second insulating layer away from the first insulating layer and filled in the groove, and the refractive index of the organic layer is less than the refractive index of the first insulating layer and the refractive index of the second insulating layer.

[0045] In an embodiment of the present application, the first insulating layer comprises a first surface away from the display functional layer, and the roughness of the first surface is less than the roughness of the inner wall of the groove.

[0046] Specifically, please continue to refer to Figure 4, in an embodiment of the present application, the display panel provided by the embodiment of the present application comprises a substrate 30, a display function layer 10 arranged on the substrate 30, and a touch function layer 20 arranged on a side of the display function layer 10 away from the substrate 30.

[0047] The display function layer 10 comprises a thin film transistor array layer arranged on the substrate 30 and a light emitting device layer arranged on a side of the thin film transistor array layer away from the substrate 30, wherein the thin film transistor array layer is provided with thin film transistors as signal switches, the light emitting device layer comprises a plurality of light emitting parts 11, and the light emitting parts 11 are electrically connected with the thin film transistors to realize signal transmission and light emission of the light emitting parts 11; and the light emitting parts 11 can comprise an anode, an organic light emitting layer and a cathode arranged in a stack.

[0048] It should be noted that the display function layer 10 can further comprise an encapsulation layer covering the light emitting device layer to provide the light emitting device layer with water vapor blocking and stress buffering effects.

[0049] In an embodiment, the touch function layer 20 comprises a first insulating layer 24, a second insulating layer 25 and an organic layer 26 arranged in a stack, the first insulating layer 24 is located on a side of the display function layer 10 away from the substrate 30, the second insulating layer 25 is located on a side of the first insulating layer 24 away from the display function layer 10, and the organic layer 26 is located on a side of the second insulating layer 25 away from the first insulating layer 24.

[0050] In an embodiment, the materials of the first insulating layer 24 and the second insulating layer 25 can comprise inorganic insulating materials such as silicon oxide or silicon nitride materials, and the material of the organic layer 26 can comprise organic resin materials.

[0051] Further, the touch function layer 20 further comprises touch devices encapsulated in the first insulating layer 24, the second insulating layer 25 and the organic layer 26; specifically, the touch function layer 20 comprises a first conductive layer 21 and a second conductive layer 22; it should be noted that the first conductive layer 21 can be one of a bridge trace and a touch electrode, the second conductive layer 22 can be the other of the bridge trace and the touch electrode, and the first conductive layer 21 is connected with the second conductive layer 22.

[0052] In an embodiment, the first conductive layer 21 is located between the second conductive layer 22 and the display function layer 10, the first conductive layer 21 is arranged on a side of the first insulating layer 24 away from the display function layer 10, the second insulating layer 25 covers the first conductive layer 21, the second conductive layer 22 is arranged on a side of the second insulating layer 25 away from the first insulating layer 24, and the organic layer 26 covers the second conductive layer 22.

[0053] The first conductive layer 21 is arranged on a first surface 240 of the first insulating layer 24 away from the display function layer 10, the second conductive layer 22 is arranged on a second surface 250 of the second insulating layer 25 away from the first insulating layer 24, and the organic layer 26 covers the second conductive layer 22.

[0054] In other embodiments of the present application, the second conductive layer 22 can also be located between the first conductive layer 21 and the display function layer 10, and the first conductive layer 21 is located between the second conductive layer 22 and the display function layer 10 in the embodiments of the present application.

[0055] In the embodiments of the present application, the first conductive layer 21 includes a first sub-layer 211 and a second sub-layer 212 arranged in layers, the second sub-layer 212 is located between the first sub-layer 211 and the first insulating layer 24, and the second sub-layer 212 is located on the first surface 240, that is, the second sub-layer 212 directly contacts the side surface of the first insulating layer 24 away from the display function layer 10.

[0056] The etching rate of the material of the second sub-layer 212 is greater than the etching rate of the material of the first sub-layer 211, thereby effectively reducing the etching residue of the second sub-layer 212, avoiding the formation of etching residues on the first surface 240 of the first insulating layer 24, and thereby reducing the probability of rupture of the first insulating layer 24 and / or the second insulating layer 25 due to stress concentration.

[0057] In an embodiment, the material of the first sub-layer 211 can include titanium metal, and the material of the second sub-layer 212 can include aluminum metal or silver, etc.

[0058] Further, the second conductive layer 22 includes a third sub-layer 221, a fourth sub-layer 222, and a fifth sub-layer 223 arranged in layers, the third sub-layer 221 is located between the fourth sub-layer 222 and the fifth sub-layer 223, the fifth sub-layer 223 is located between the third sub-layer 221 and the second insulating layer 25, and the fourth sub-layer 222 is located on the side of the third sub-layer 221 away from the fifth sub-layer 223; the fifth sub-layer 223 is located on the second surface 250 of the second insulating layer 25, that is, the fifth sub-layer 223 directly contacts the side surface of the second insulating layer 25 away from the display function layer 10; and the etching rate of the third sub-layer 221 is greater than the etching rate of the fourth sub-layer 222, and the etching rate of the third sub-layer 221 is greater than the etching rate of the fifth sub-layer 223.

[0059] In an embodiment, the material of the third sub-layer 221 can include metal aluminum or silver, and the material of the fourth sub-layer 222 and the fifth sub-layer 223 can include metal titanium. In the embodiment, the fourth sub-layer 222 and the fifth sub-layer 223 are formed on both sides of the third sub-layer 221, which can provide effective protection for the third sub-layer 221 while ensuring signal transmission efficiency.

[0060] In an embodiment, the first conductive layer 21 is a bridge trace, the second conductive layer 22 is a touch electrode, and the thickness of the second sub-layer 212 is less than or equal to the thickness of the third sub-layer 221. Preferably, the thickness of the second sub-layer 212 is less than the thickness of the third sub-layer 221. On the one hand, the thickness of the metal layer formed by the second sub-layer 212 can be reduced, the etching difficulty can be reduced, and the etching residue can be further improved. On the other hand, the third sub-layer 221 belongs to the second conductive layer 22, and increasing the thickness of the third sub-layer 221 can ensure that the resistance of the second conductive layer 22 is small, and the touch precision and accuracy can be improved.

[0061] In the embodiment, the sub-layers in the first conductive layer 21 and the sub-layers in the second conductive layer 22 are prone to oxidation reaction and generate oxides during the process. Therefore, the material of the first sub-layer 211 can include a metal element or a metal element and a metal oxide corresponding to the metal element, such as metal titanium and titanium oxide. The material of the second sub-layer 212 can include a metal element or a metal element and a metal oxide corresponding to the metal element, such as metal aluminum and aluminum oxide. Similarly, the material of the third sub-layer 221, the fourth sub-layer 222, and the fifth sub-layer 223 can each include a metal element or a metal element and a metal oxide corresponding to the metal element.

[0062] It should be noted that when the second conductive layer 22 is a touch electrode and the first conductive layer 21 is a bridge trace, the second conductive layer 22 can include a mutual-capacitive touch electrode or a self-capacitive touch electrode. When the second conductive layer 22 is a mutual-capacitive touch electrode, the first conductive layer 21 is connected between two spaced apart sensing electrodes or transmitting electrodes. When the second conductive layer 22 is a self-capacitive touch electrode, the first conductive layer 21 is connected to each electrode. Since the second conductive layer 22 and the first conductive layer 21 are both formed by etching an entire layer of metal material, the second conductive layer 22 has a larger area and thus less metal material is removed by etching, while the first conductive layer 21 has a smaller area and thus more metal material is removed by etching. Therefore, the first conductive layer 21 has a greater etching load during the etching process and is more likely to have etching residues. Therefore, as shown in FIGS. 4, 5, 6, and 7, the second sub-layer 212 of the first conductive layer 21 on the first surface 240 of the first insulating layer 24 is made of a material with a greater etching rate, so as to reduce the probability of etching residues of the first conductive layer 21 during the forming process, reduce the probability of stress concentration between the first insulating layer 24 and the second insulating layer 25, and improve the stability and yield of the display panel.

[0063] In the embodiment of the present application, the touch function layer 20 further includes a jumper wire 23, and the jumper wire 23 passes through the second insulating layer 25. One end of the jumper wire 23 is connected to the second conductive layer 22, and the other end of the jumper wire 23 is connected to the first conductive layer 21. The material of the jumper wire 23 can be the same as that of the second conductive layer 22, the same as that of the first conductive layer 21, or other conductive materials, which are not limited herein.

[0064] Since the film layer structure of the first conductive layer 21 is improved in the embodiment, the etching residues of the first surface 240 of the first insulating layer 24 are reduced, and the roughness of the first surface 240 is less than that of the second surface 250 of the second insulating layer 25.

[0065] As described above, the second sub-layer 212 of the first conductive layer 21 on the first surface 240 of the first insulating layer 24 is made of a material with a greater etching rate, so as to reduce the etching residues of the first conductive layer 21, reduce the stress concentration between the adjacent film layers of the first conductive layer 21, reduce the probability of rupture of the adjacent film layers of the first conductive layer 21, and improve the yield of the display panel.

[0066] In another embodiment of the present application, referring to FIG. 8, the difference between the embodiment shown in FIG. 8 and the embodiment shown in FIG. 4 is that the second conductive layer 22 comprises a third sub-layer 221 and a fourth sub-layer 222 which are stacked, and the third sub-layer 221 is between the fourth sub-layer 222 and the second insulating layer 25, and the third sub-layer 221 is on the second surface 250 of the second insulating layer 25, i.e. the third sub-layer 221 directly contacts the side surface of the second insulating layer 25 which is away from the display functional layer 10.

[0067] As described above, in the present application, the second sub-layer 212 of the first conductive layer 21 on the first surface 240 of the first insulating layer 24 is prepared by using a material with a large etching rate, and the third sub-layer 221 of the second conductive layer 22 on the second surface 250 of the second insulating layer 25 is prepared by using a material with a large etching rate, so as to reduce the etching residues of the first conductive layer 21 and the second conductive layer 22, reduce the stress concentration phenomenon between the adjacent film layers of the first conductive layer 21 and the second conductive layer 22, reduce the probability of rupture of the adjacent film layers of the first conductive layer 21 and the adjacent film layers of the second conductive layer 22, and improve the yield of the display panel.

[0068] In another embodiment of the present application, referring to FIG. 9, in the present embodiment, the touch functional layer 20 comprises a plurality of light emitting areas 101 and non-light emitting areas 102 adjacent to the light emitting areas 101, and a plurality of light emitting parts 11 are arranged corresponding to the plurality of light emitting areas 101, for example, one light emitting part 11 can be arranged corresponding to one light emitting area 101.

[0069] The second conductive layer 22 and the first conductive layer 21 can be arranged in the non-light emitting areas 102, so as to avoid the influence of the second conductive layer 22 and the first conductive layer 21 on the light emitting of the light emitting areas 101.

[0070] In the present embodiment, the touch functional layer 20 further comprises a light collecting structure 27, and the light collecting structure 27 is in the light emitting area 101. Specifically, a groove surrounding the light emitting area 101 is formed in the touch functional layer 20, the groove at least penetrates the first insulating layer 24 and the second insulating layer 25, and the first insulating layer 24 and the second insulating layer 25 which are stacked and located in the light emitting area 101 constitute the light collecting structure 27.

[0071] In an embodiment, the touch functional layer 20 further comprises an organic layer 26, the organic layer 26 covers the side of the second insulating layer 25 which is away from the first insulating layer 24, and fills in the groove, and the refractive index of the organic layer 26 is less than the refractive index of the first insulating layer 24 and the refractive index of the second insulating layer 25, so as to play a light collecting role on the light emitting part 11 corresponding to the light collecting structure 27, and improve the light emitting efficiency of the display panel.

[0072] In the embodiment, the first conductive layer 21 includes a first sub-layer 211 and a second sub-layer 212 which are stacked, and the second sub-layer 212 is located on the first surface 240 of the first insulating layer 24, and the first sub-layer 211 is located on a side of the second sub-layer 212 away from the first surface 240; the second conductive layer 22 includes a third sub-layer 221, a fourth sub-layer 222 and a fifth sub-layer 223 which are stacked, the fifth sub-layer 223 is located on the second surface 250 of the second insulating layer 25, the third sub-layer 221 is located on a side of the fifth sub-layer 223 away from the second insulating layer 25, and the fourth sub-layer 222 is located on a side of the third sub-layer 221 away from the fifth sub-layer 223.

[0073] In the embodiment, the etching rate of the material of the second sub-layer 212 is greater than the etching rate of the material of the first sub-layer 211, the etching rate of the material of the third sub-layer 221 is greater than the etching rate of the material of the fourth sub-layer 222, and the etching rate of the material of the third sub-layer 221 is greater than the etching rate of the material of the fifth sub-layer 223; therefore, the etching residue on the first surface 240 of the first insulating layer 24 can be reduced in the embodiment, and the roughness of the first surface 240 is less than the roughness of the second surface 250 of the second insulating layer 25.

[0074] In addition, the light collecting structure 27 is formed by the first insulating layer 24 and the second insulating layer 25 which are stacked, and the first surface 240 is located between the first insulating layer 24 and the second insulating layer 25. Since the etching residue on the first surface 240 can be reduced in the embodiment, the roughness of the first surface 240 is reduced, and the first surface 240 is smoother, so that the light emitted by the light emitting part 11 is not affected by the etching residue when passing through the light collecting structure 27, and the light emitting uniformity of the display panel is improved.

[0075] In an embodiment, one light collecting structure 27 corresponds to one light emitting area 101, that is, one light collecting structure 27 corresponds to one light emitting part 11; the orthographic projection of the light emitting part 11 on the substrate 30 is located in the orthographic projection of the light collecting structure 27 on the substrate 30, so that the light emitted by the light emitting part 11 can be better collected.

[0076] In an embodiment, the width of the light collecting structure 27 near the side of the light emitting part 11 is greater than the width of the light collecting structure 27 away from the side of the light emitting part 11, and the light collecting structure 27 has a structure of being narrow at the top and wide at the bottom.

[0077] It should be noted that in the embodiment of the present application, the groove formed around the light condensing structure 27 can be formed in the same mask as the via through which the adapter wire 23 passes, so as to save the process procedure; that is, after the second insulating layer 25 is formed to cover the first conductive layer 21, the second insulating layer 25 is subjected to a patterning process to form the groove and the via; then, a metal layer is formed on the second surface 250 of the second insulating layer 25, and the metal layer passes through the via and is connected to the first conductive layer 21 and covers the second surface 250 and the inner wall of the groove; then, the metal layer is etched to form the second conductive layer 22 on the second surface 250 and the adapter wire 23 passing through the via. Since the structure of the first conductive layer 21 is improved in the embodiment, the etching residue can be reduced, and the structure of the second conductive layer 22 is not improved, so that the etching residue generated in the etching process of the second conductive layer 22 is more than that generated in the etching process of the first conductive layer 21, and the roughness of the first surface 240 of the first insulating layer 24 is smaller than that of the inner wall of the groove.

[0078] As mentioned above, in the embodiment of the present application, the second sub-layer 212 of the first conductive layer 21 on the first surface 240 of the first insulating layer 24 is prepared by using a material with a large etching rate, so as to reduce the etching residue of the first conductive layer 21, reduce the stress concentration phenomenon between the film layers adjacent to the first conductive layer 21, reduce the probability of rupture of the film layers adjacent to the first conductive layer 21, and improve the yield of the display panel; in the embodiment of the present application, the light condensing structure 27 is formed on the light emitting side of the light emitting part 11, so as to improve the light emitting efficiency of the display panel, the light condensing structure 27 is formed in the touch function layer 20, so as to improve the integration of the display panel, reduce the process procedure of the display panel, and reduce the process cost; since the roughness of the first surface 240 is reduced in the embodiment of the present application, the uniformity of the light emitted by the light emitting part 11 when passing through the light condensing structure 27 can be improved, and the light emitting uniformity of the display panel is improved.

[0079] In another embodiment of the present application, please refer to FIG. 10, the difference between the embodiment and the embodiment shown in FIG. 9 is that the second conductive layer 22 comprises a third sub-layer 221 and a fourth sub-layer 222 which are stacked, the third sub-layer 221 is between the fourth sub-layer 222 and the second insulating layer 25, and the third sub-layer 221 is on the second surface 250 of the second insulating layer 25, that is, the third sub-layer 221 directly contacts the side surface of the second insulating layer 25 away from the display function layer 10.

[0080] In the above, in the embodiment of the present application, the second sub-layer 212 of the first conductive layer 21 on the first surface 240 of the first insulating layer 24 is prepared by using a material with a large etching rate, and the third sub-layer 221 of the second conductive layer 22 on the second surface 250 of the second insulating layer 25 is prepared by using a material with a large etching rate, so as to reduce the etching residue of the first conductive layer 21 and the second conductive layer 22, reduce the stress concentration phenomenon between the film layers adjacent to the first conductive layer 21 and the second conductive layer 22, reduce the probability of rupture of the film layers adjacent to the first conductive layer 21 and the film layers adjacent to the second conductive layer 22, and improve the yield of the display panel. In the embodiment of the present application, the light condensing structure 27 is formed on the light emitting side of the light emitting part 11, so as to improve the light emitting efficiency of the display panel. The light condensing structure 27 is formed in the touch function layer 20, so as to improve the integration of the display panel, reduce the process procedures of the display panel, and reduce the process cost. Since the roughness of the first surface 240 is reduced in the embodiment of the present application, the uniformity of the light emitted by the light emitting part 11 when passing through the light condensing structure 27 can be improved, and the light emitting uniformity of the display panel is improved.

[0081] In addition, please continue to refer to FIG. 9, the embodiment of the present application also provides a display panel, the display panel comprises a plurality of light emitting areas 101 and non-light emitting areas 102 adjacent to the light emitting areas 101.

[0082] The display panel further comprises a display function layer 10 and a touch function layer 20. The display function layer 10 comprises a light emitting part 11 arranged corresponding to the light emitting area 101. The touch function layer 20 is arranged on one side of the display function layer 10. The touch function layer 20 comprises a first insulating layer 24, a first conductive layer 21, a second insulating layer 25 and a second conductive layer 22 arranged in sequence.

[0083] The touch function layer 20 further comprises a light condensing structure 27 arranged corresponding to the light emitting area 101. The light condensing structure 27 comprises the first insulating layer 24 and the second insulating layer 25 arranged in sequence in the light emitting area 101. The first conductive layer 21 comprises a first sub-layer 211 and a second sub-layer 212 arranged in sequence. The second sub-layer 212 directly contacts the side surface of the second insulating layer 25 away from the display function layer 10. The first sub-layer 211 is arranged on the side of the second sub-layer 212 away from the first insulating layer 24. The etching rate of the material of the second sub-layer 212 is greater than the etching rate of the material of the first sub-layer 211.

[0084] In the application process, the second sub-layer 212 on the first surface 240 of the first insulating layer 24 in the first conductive layer 21 is prepared by using a material with a large etching rate, so as to reduce the etching residue of the first conductive layer 21, reduce the stress concentration phenomenon between the film layers adjacent to the first conductive layer 21, reduce the probability of rupture of the film layers adjacent to the first conductive layer 21, and improve the yield of the display panel. In the application, the light condensing structure 27 is formed on the light emitting side of the light emitting part 11, so as to improve the light emitting efficiency of the display panel. The light condensing structure 27 is formed in the touch function layer 20, so as to improve the integration of the display panel, reduce the process procedure of the display panel, and reduce the process cost. Since the roughness of the first surface 240 is reduced, the uniformity of the light emitted by the light emitting part 11 when passing through the light condensing structure 27 is improved, and the light emitting uniformity of the display panel is improved.

[0085] It should be noted that other film layer structures in the display panel provided by the present embodiment can be set according to the above embodiments, and will not be described here.

[0086] In an embodiment of the present application, please refer to FIG. 9, the first conductive layer 21 includes a first sub-layer 211 and a second sub-layer 212 which are stacked, and the second sub-layer 212 is located on the first surface 240 of the first insulating layer 24, that is, the second sub-layer 212 directly contacts the side surface of the first insulating layer 24 away from the display function layer 10, and the first sub-layer 211 is located on the side of the second sub-layer 212 away from the first surface 240. The second conductive layer 22 includes a third sub-layer 221, a fourth sub-layer 222 and a fifth sub-layer 223 which are stacked, and the fifth sub-layer 223 is located on the second surface 250 of the second insulating layer 25, that is, the fifth sub-layer 223 directly contacts the side surface of the second insulating layer 25 away from the display function layer 10, the third sub-layer 221 is located on the side of the fifth sub-layer 223 away from the second insulating layer 25, and the fourth sub-layer 222 is located on the side of the third sub-layer 221 away from the fifth sub-layer 223.

[0087] In the present embodiment, the etching rate of the material of the second sub-layer 212 is greater than the etching rate of the material of the first sub-layer 211, the etching rate of the material of the third sub-layer 221 is greater than the etching rate of the material of the fourth sub-layer 222, and the etching rate of the material of the third sub-layer 221 is greater than the etching rate of the material of the fifth sub-layer 223. Therefore, the etching residue on the first surface 240 of the first insulating layer 24 can be reduced in the present embodiment, and the roughness of the first surface 240 is less than the roughness of the second surface 250 of the second insulating layer 25.

[0088] Further, the touch function layer 20 is provided with a groove around the light emitting area 101, the groove at least penetrates the first insulating layer 24 and the second insulating layer 25, and the first insulating layer 24 and the second insulating layer 25 within the light emitting area 101 form a light collecting structure 27.

[0089] In an embodiment, the touch function layer 20 further comprises an organic layer 26, the organic layer 26 covers the side of the second insulating layer 25 away from the first insulating layer 24 and fills in the groove, and the refractive index of the organic layer 26 is less than the refractive index of the first insulating layer 24 and the refractive index of the second insulating layer 25, so that the light collecting structure 27 can play a light collecting role on the light emitting part 11 corresponding to the light collecting structure 27, so as to improve the light emitting efficiency of the display panel.

[0090] It should be noted that in the embodiment of the present application, the groove provided around the light collecting structure 27 can be formed in the same mask as the via through which the transfer line 23 passes, so as to save the process procedure; that is, after the second insulating layer 25 covers the first conductive layer 21, the second insulating layer 25 is subjected to a patterning process to form the groove and the via; then, a metal layer is formed on the second surface 250 of the second insulating layer 25, and the metal layer passes through the via and is connected to the first conductive layer 21 and covers the second surface 250 and the inner wall of the groove; then, the metal layer is etched to form the second conductive layer 22 on the second surface 250 and the transfer line 23 passing through the via. Since the structure of the first conductive layer 21 is improved in the embodiment, the etching residue is reduced, and the structure of the second conductive layer 22 is not improved, so the etching residue generated in the etching process of the second conductive layer 22 is more than the etching residue generated in the etching process of the first conductive layer 21, and the roughness of the first surface 240 of the first insulating layer 24 is also less than the roughness of the inner wall of the groove.

[0091] In an embodiment, the material of the first sub-layer 211 can include metal titanium, the material of the second sub-layer 212 can include metal aluminum or silver, etc. The material of the third sub-layer 221 can include metal aluminum or silver, etc., and the material of the fourth sub-layer 222 and the fifth sub-layer 223 can include metal titanium. In the embodiment of the present application, the fourth sub-layer 222 and the fifth sub-layer 223 are formed on the upper and lower sides of the third sub-layer 221, which can provide effective protection for the third sub-layer 221 on the basis of ensuring the signal transmission efficiency.

[0092] In another embodiment of the present application, please refer to FIG. 10, the second conductive layer 22 comprises the third sub-layer 221 and the fourth sub-layer 222 which are stacked, and the third sub-layer 221 is located between the fourth sub-layer 222 and the second insulating layer 25, and the third sub-layer 221 is located on the second surface 250 of the second insulating layer 25, and the third sub-layer 221 directly contacts the side surface of the second insulating layer 25 away from the display function layer 10.

[0093] As described above, in the embodiments of the present application, the second sub-layer 212 of the first conductive layer 21 on the first surface 240 of the first insulating layer 24 is made of a material with a large etching rate, and the third sub-layer 221 of the second conductive layer 22 on the second surface 250 of the second insulating layer 25 is made of a material with a large etching rate, so as to reduce the etching residue of the first conductive layer 21 and the second conductive layer 22, reduce the stress concentration phenomenon between the film layers adjacent to the first conductive layer 21 and the second conductive layer 22, reduce the probability of rupture of the film layers adjacent to the first conductive layer 21 and the film layers adjacent to the second conductive layer 22, and improve the yield of the display panel. In the embodiments of the present application, the light condensing structure 27 is formed on the light emitting side of the light emitting part 11, so as to improve the light emitting efficiency of the display panel. The light condensing structure 27 is formed in the touch function layer 20, so as to improve the integration of the display panel, reduce the process procedures of the display panel, and reduce the process cost. Since the roughness of the first surface 240 is reduced, the uniformity of the light emitted by the light emitting part 11 when passing through the light condensing structure 27 is improved, and the light emitting uniformity of the display panel is improved.

[0094] In addition, the present application also provides a display device, which comprises the display panel as described in the above embodiments.

[0095] It can be understood that the display device has the same display panel as the above embodiments, and has the same beneficial effects as the display panel described in the above embodiments, which will not be described here.

[0096] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0097] The display panel and the display device provided by the embodiments of the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the technical solutions and the core ideas of the present application; those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel comprising: Display function layer; A touch function layer is provided on one side of the display function layer and includes: a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer stacked in sequence; Among them, the first conductive layer includes: a first sublayer and a second sublayer arranged in a stacked manner, the second sublayer is in direct contact with the surface of the first insulating layer on a side away from the display function layer, the first sublayer is arranged on a side of the second sublayer away from the first insulating layer, and the etching rate of the material of the second sublayer is greater than the etching rate of the material of the first sublayer.

2. The display panel according to claim 1, wherein: The second conductive layer includes a third sublayer and a fourth sublayer stacked together, wherein the third sublayer is located between the second insulating layer and the fourth sublayer, and an etching rate of a material of the third sublayer is greater than an etching rate of a material of the fourth sublayer.

3. The display panel according to claim 2, wherein: The third sublayer is in direct contact with a surface of the second insulating layer on a side away from the display function layer.

4. The display panel according to claim 2, wherein: The second conductive layer also includes a fifth sublayer arranged between the third sublayer and the second insulating layer, the etching rate of the material of the fifth sublayer is lower than the etching rate of the material of the third sublayer, and the fifth sublayer is in direct contact with the surface of the second insulating layer on one side away from the display function layer.

5. The display panel according to claim 4, wherein: The first insulating layer includes a first surface away from the display function layer, the second insulating layer includes a second surface away from the display function layer, and the roughness of the first surface is smaller than the roughness of the second surface. The display panel according to claim 2 , wherein: The thickness of the second sub-layer is less than or equal to the thickness of the third sub-layer.

7. The display panel according to claim 1, wherein: The display panel includes a plurality of light-emitting areas and non-light-emitting areas adjacent to the light-emitting areas; The display function layer includes a light-emitting portion arranged corresponding to the light-emitting area; The touch function layer further includes a light-collecting structure arranged corresponding to the light-emitting area; A groove surrounding the light-emitting area is formed in the touch function layer, and the groove at least passes through the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer stacked in the light-emitting area constitute the light-concentrating structure.

8. The display panel according to claim 7, wherein: The touch function layer further includes an organic layer, which covers a side of the second insulating layer away from the first insulating layer and fills the groove, and has a refractive index smaller than that of the first insulating layer and the second insulating layer.

9. The display panel according to claim 7, wherein: The first insulating layer includes a first surface away from the display function layer, and the roughness of the first surface is smaller than the roughness of the inner wall of the groove.

10. A display panel comprising a plurality of light-emitting areas and non-light-emitting areas adjacent to the light-emitting areas, the display panel further comprising: The display function layer includes a light-emitting portion arranged corresponding to the light-emitting area; A touch function layer is provided on one side of the display function layer, wherein the touch function layer includes a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer stacked in sequence; In which, the touch function layer also includes a focusing structure arranged corresponding to the light-emitting area, and the focusing structure includes the first insulating layer and the second insulating layer located in the light-emitting area and stacked, the first conductive layer includes a first sublayer and a second sublayer stacked, the second sublayer is in direct contact with the surface of the first insulating layer on the side away from the display function layer, the first sublayer is arranged on the side of the second sublayer away from the first insulating layer, and the etching rate of the material of the second sublayer is greater than the etching rate of the material of the first sublayer.

11. The display panel according to claim 10, wherein: The second conductive layer includes: A third sublayer and a fourth sublayer are stacked, and the third sublayer is located between the second insulating layer and the fourth sublayer. An etching rate of a material of the third sublayer is greater than an etching rate of a material of the fourth sublayer.

12. The display panel according to claim 11, wherein: The third sublayer is in direct contact with a surface of the second insulating layer on a side away from the display function layer.

13. The display panel according to claim 11, wherein: The second conductive layer also includes a fifth sublayer arranged between the third sublayer and the second insulating layer, the etching rate of the material of the fifth sublayer is lower than the etching rate of the material of the third sublayer, and the fifth sublayer is in direct contact with the surface of the second insulating layer on one side away from the display function layer.

14. The display panel according to claim 13, wherein: The first insulating layer includes a first surface away from the display function layer, the second insulating layer includes a second surface away from the display function layer, and the roughness of the first surface is smaller than the roughness of the second surface.

15. The display panel according to claim 11, wherein The thickness of the second sub-layer is less than or equal to the thickness of the third sub-layer.

16. The display panel according to claim 10, wherein: A groove surrounding the light-emitting area is formed in the touch function layer, and the groove at least passes through the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer stacked in the light-emitting area constitute the light-concentrating structure.

17. The display panel according to claim 16, wherein: The display panel further includes an organic layer covering a side of the second insulating layer away from the first insulating layer and filling the groove, and a refractive index of the organic layer is smaller than that of the first insulating layer and the second insulating layer.

18. The display panel according to claim 16, wherein: The first insulating layer includes a first surface away from the display function layer, and the roughness of the first surface is smaller than the roughness of the inner wall of the groove.

19. A display device, comprising a display panel, wherein the display panel comprises: Display function layer; A touch function layer is provided on one side of the display function layer and includes: a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer stacked in sequence; The first conductive layer includes: a first sublayer and a second sublayer stacked together, the second sublayer being in direct contact with a surface of the first insulating layer away from the display function layer, the first sublayer being arranged on a side of the second sublayer away from the first insulating layer, and the etching rate of the material of the second sublayer being greater than the etching rate of the material of the first sublayer; Alternatively, the display panel includes a plurality of light-emitting areas and non-light-emitting areas adjacent to the light-emitting areas, and the display panel further includes: The display function layer includes a light-emitting portion arranged corresponding to the light-emitting area; A touch function layer is provided on one side of the display function layer, wherein the touch function layer includes a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer stacked in sequence; In which, the touch function layer also includes a focusing structure arranged corresponding to the light-emitting area, and the focusing structure includes the first insulating layer and the second insulating layer located in the light-emitting area and stacked, the first conductive layer includes a first sublayer and a second sublayer stacked, the second sublayer is in direct contact with the surface of the first insulating layer on the side away from the display function layer, the first sublayer is arranged on the side of the second sublayer away from the first insulating layer, and the etching rate of the material of the second sublayer is greater than the etching rate of the material of the first sublayer.

20. The display device according to claim 19, wherein The second conductive layer includes a third sublayer and a fourth sublayer stacked together, wherein the third sublayer is located between the second insulating layer and the fourth sublayer, and an etching rate of a material of the third sublayer is greater than an etching rate of a material of the fourth sublayer.

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