Probe assembly, body temperature measurer, and body temperature measurement system

Abstract

Provided in the embodiments of the present application are a probe assembly, a body temperature measurer, and a body temperature measurement system. The probe assembly is applied to the body temperature measurer. The probe assembly comprises a first sensor, which is used for measuring a first temperature of an object under test; a second sensor, which is used for measuring a second temperature around the probe assembly; and a thermal insulation element, which is located between the first sensor and the second sensor, wherein the first sensor and the second sensor are used for electrical signal communication with a main unit in the body temperature measurer; and the main unit determines a thermal insulation coefficient of the thermal insulation element on the basis of the difference between the first temperature and the second temperature, and corrects the first temperature on the basis of the thermal insulation coefficient to obtain a body temperature measurement value. The solution provided in the embodiments of the present application can maximally avoid the impact of ambient temperature on body temperature, and the accuracy of a body temperature measurement value is high.

Description

Probe assembly, body temperature detector and body temperature detection system

[0001] Cross-reference to related applications

[0002] This application is based on Chinese Patent Application No. 202420738137.6 entitled "Probe assembly, body temperature detector and body temperature detection system" filed on April 10, 2024, which is incorporated by reference in its entirety into this application. TECHNICAL FIELD

[0003] The present application relates to the technical field of body temperature detection, and in particular to a probe assembly, a body temperature detector and a body temperature detection system. BACKGROUND

[0004] Currently, devices commonly used to measure body temperature include mercury thermometers, forehead thermometers and ear thermometers. The measurement sites of forehead thermometers and ear thermometers are not covered by clothing for heat preservation, and are easily affected by ambient temperature during measurement, resulting in inaccurate body temperature measurement values. Mercury thermometers have a long measurement time, and medical staff have a large amount of basic work, which can only obtain discrete data. The measurement and operation process is prone to breakage of mercury thermometers, causing injury to personnel and mercury pollution.

[0005] SUMMARY

[0006] In view of the above problems, the present application is proposed to provide a probe assembly, a body temperature detector, a body temperature detection system and a body temperature detection method with small environmental temperature influence and high accuracy of measured body temperature.

[0007] To achieve this purpose, the present application adopts the following technical solutions:

[0008] A probe assembly is applied to a body temperature detector, and the probe assembly comprises:

[0009] a first sensor for measuring a first temperature of a measured object;

[0010] a second sensor for measuring a second temperature around the probe assembly;

[0011] a heat insulation element located between the first sensor and the second sensor;

[0012] The first sensor and the second sensor are used to communicate with a host computer signal in the body temperature detector, the heat insulation coefficient of the heat insulation element is determined according to the temperature difference between the first temperature and the second temperature by the host computer, and the first temperature is corrected based on the heat insulation coefficient to obtain a body temperature measurement value.

[0013] As preferred, the probe assembly has two opposite sides, the first sensor is located at one side of the two sides, and the second sensor is located at the other side of the two sides.

[0014] As preferred, the heat insulation element is in a flat plate shape, and the first sensor and the second sensor are respectively located at two sides of the flat plate shaped heat insulation element; or

[0015] The heat insulation element has two opposite grooves, and the first sensor and the second sensor are respectively located in the corresponding side grooves; or

[0016] The probe assembly includes two heat insulation elements, and the heat insulation elements have grooves; the two heat insulation elements are stacked and the grooves are opposite, and the first sensor and the second sensor are respectively located in the corresponding side grooves.

[0017] As preferred, a circuit board is further included; the first sensor and the second sensor are electrically connected with the circuit board, and the circuit board is used for electrical connection with a host computer;

[0018] In the case that the probe assembly includes two heat insulation elements, the two heat insulation elements are stacked and located between the first sensor and the second sensor; the circuit board is located between the two heat insulation elements.

[0019] As preferred, a temperature measuring contact piece is further included;

[0020] One side of the temperature measuring contact piece is exposed and used for contacting a measured object, and the other side is in contact with the first sensor; the temperature measuring contact piece conducts the temperature of the measured object to the first sensor.

[0021] As preferred, a housing is further included;

[0022] The housing has a containing space, one side of the containing space is an open opening, and a flange is arranged on the opening in a direction away from the containing space;

[0023] The temperature measuring contact piece is located at the opening of the containing space and connected with the housing, so that the first sensor, the heat insulation element and the second sensor are contained in the closed containing space.

[0024] As preferred, an injection molded body produced by an injection molding process is further included;

[0025] The injection molded body has a detection part, a main body part and an intermediate part connecting the detection part and the main body part;

[0026] The probe assembly is embedded in the detection part, and the temperature measuring contact piece is exposed and protrudes outward to contact the measured object;

[0027] The intermediate portion is injection molded with a wire;

[0028] The main body portion is configured to mount the host device; the host device is electrically connected to the first sensor and the second sensor through the wire.

[0029] The first sensor and the second sensor are electrically connected to a circuit board, and the circuit board is configured to be electrically connected to the host device.

[0030] The circuit board and the host device are mounted on the main body portion.

[0031] A body temperature detector comprises:

[0032] The probe assembly described above;

[0033] A host device in signal communication with the first sensor and the second sensor of the probe assembly, configured to determine a thermal insulation coefficient of a thermal insulation element in the probe assembly according to a temperature difference between a first temperature detected by the first sensor and a second temperature detected by the second sensor, and correct the first temperature based on the thermal insulation coefficient to obtain a body temperature measurement value.

[0034] A body temperature detection system comprises:

[0035] The body temperature detector described above;

[0036] A monitoring device or a mobile device in communication connection with the body temperature detector, configured to receive a body temperature measurement value output by the body temperature detector and play and / or display the body temperature measurement value.

[0037] A body temperature detection method suitable for a host device of a body temperature detector, the body temperature detector comprising a probe assembly, the probe assembly comprising a first sensor, a second sensor, and a thermal insulation element between the first sensor and the second sensor; specifically, the method comprises:

[0038] Obtaining a first temperature of a measured object detected by the first sensor;

[0039] Obtaining a second temperature around the probe assembly detected by the second sensor;

[0040] Determining a thermal insulation coefficient of the thermal insulation element according to a temperature difference between the first temperature and the second temperature;

[0041] Correcting the first temperature based on the thermal insulation coefficient to obtain a body temperature measurement value.

[0042] The technical scheme provided in the embodiments of the present application can obtain the first temperature of the measured object and the second temperature of the periphery of the probe assembly by arranging the first sensor and the second sensor on the probe assembly; the heat insulation element is arranged between the first sensor and the second sensor to insulate the temperatures of the areas where the two sensors are located and avoid mutual influence; the host can determine the heat insulation coefficient of the heat insulation element according to the temperature difference between the first temperature detected by the first sensor and the second temperature detected by the second sensor, correct the first temperature based on the heat insulation coefficient to obtain the body temperature measurement value, and can maximize the influence of the ambient temperature on the body temperature, and the accuracy of the body temperature measurement value is high. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0044] Fig. 1 is a schematic diagram of an implementation structure of a probe assembly provided by an embodiment of the present application;

[0045] Fig. 2 is a schematic diagram of another implementation structure of a probe assembly provided by an embodiment of the present application;

[0046] Fig. 3 is a schematic diagram of another implementation structure of a probe assembly provided by an embodiment of the present application;

[0047] Fig. 4 is a structural schematic diagram of a main body of a probe assembly provided by an embodiment of the present application;

[0048] Fig. 5 is a schematic diagram of an implementation structure of a body temperature detector provided by an embodiment of the present application;

[0049] Fig. 6 is a schematic diagram of a body temperature detection system provided by an embodiment of the present application. DETAILED DESCRIPTION

[0050] The present inventor dissects the heat conduction principle of a temperature sensor, and finds through a large number of experiments that: a temperature sensor (such as a thermal sensor) is a three-dimensional surface, and when a temperature sensor is completely immersed in a measured object, the temperature sensor can accurately measure the temperature of the object, such as air, liquid, etc. However, when the temperature sensor is not completely immersed in the object, especially when the temperature sensor is used to measure the surface temperature of the object, since the temperature sensor is a three-dimensional surface, the opposite three-dimensional surface in contact with the object will be affected by the ambient temperature or other temperatures, resulting in a certain deviation between the measured temperature of the temperature sensor and the measured object, thereby affecting the accuracy of temperature measurement.

[0051] Therefore, the inventors consider adding a heat insulation element on one side of the temperature sensor to block the influence of the ambient temperature on the temperature sensor. In this case, the heat insulation coefficient of the heat insulation element needs to be very high, the area of the heat insulation element needs to be large enough, and the thickness of the heat insulation element also needs to meet certain requirements. For example, the inventors find through a large number of experiments that the higher the temperature of the measured object, the higher the requirements for the heat insulation coefficient, area and thickness of the heat insulation element. Therefore, in many space-limited scenarios, this solution has certain limitations. A large area and thickness of the heat insulation element will result in a large size of the body temperature detector, which is inconvenient to use. More users expect the body temperature detector to be small, light and accurate in temperature measurement.

[0052] Therefore, the inventors design the scheme of each embodiment provided in the present application, design two sensors, the first sensor is used to measure the first temperature of the measured object, and the second sensor is used to measure the second temperature around the probe assembly; a heat insulation element is arranged between the two sensors; the heat insulation coefficient of the heat insulation element can be obtained through the temperature difference between the two temperature sensors on both sides of the heat insulation element, and then the first temperature is corrected according to the heat insulation coefficient to obtain the body temperature measurement value. In this way, there is no need to have too high requirements for the heat insulation coefficient, area and thickness of the heat insulation element, and a heat insulation element with small area and thickness can also ensure high measurement accuracy. It can be seen that by using the scheme provided in each embodiment of the present application, the probe assembly and the body temperature detector containing the probe assembly can be small, light and low in cost, and also have high measurement accuracy.

[0053] The present application will be further described in detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, but not all the structures.

[0054] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature. In the description of the present embodiment, the terms "up", "down", "right", etc. orientation or position relationship is based on the orientation or position relationship shown in the drawing, which is only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0055] Fig. 1, Fig. 2 and Fig. 3 show the structural schematic diagram of the probe assembly 10 provided by an embodiment of the present application. As shown in Fig. 1, the probe assembly 10 comprises a first sensor 11, a second sensor 12 and a heat insulation element 14. The first sensor 11 is used to measure the first temperature of the measured object. The second sensor 12 is used to measure the second temperature around the probe assembly 10. The heat insulation element 14 is located between the first sensor 11 and the second sensor 12. The first sensor 11 and the second sensor 12 are used to communicate with the host signal in the body temperature detector. The host determines the heat insulation coefficient of the heat insulation element according to the temperature difference between the first temperature and the second temperature, and corrects the first temperature based on the heat insulation coefficient to obtain the body temperature measurement value.

[0056] It needs to be supplemented here that the structure shown in Fig. 1 is an exploded schematic diagram of the internal structure of the probe assembly and is not an assembly diagram.

[0057] As shown in the examples of FIGS. 2 and 3, the probe assembly 10 has two opposite sides, such as a first side 101 and a second side 102, the first sensor 11 can be located at the first side of the two sides, and the second sensor 12 is located at the second side 102 of the two sides. The first side 101 and the second side 102 can be two opposite inner walls of the probe assembly housing, and the first sensor and the second sensor are arranged on the two opposite inner walls respectively to shorten the distance between the sensor and the measured object, so as to obtain more accurate sensing values. The first sensor 11 and the second sensor 12 can have a certain distance, such as distance A, from the heat insulation element 14, A can be greater than or equal to 0.5 mm and less than or equal to 1 mm. The distance A can attenuate the temperature through the air during the process of transmitting the temperature from the sensor (the first sensor 11 or the second sensor 12) to the heat insulation element 14, not only can reduce the risk of penetrating the heat insulation element 14 due to too high temperature, but also can accommodate installation errors in the assembly process, and facilitate assembly.

[0058] In some embodiments of the present application, the thickness B of the heat insulation element 14 can be 1.5 mm≤B≤2 mm, so as to insulate the temperature conduction between the first sensor 11 and the second sensor 12 as much as possible under the premise of meeting the size of the probe assembly 10. The heat insulation element 14 can be foam, which not only has good temperature insulation effect, but also has low cost.

[0059] The probe assembly provided by the embodiments of the present application can be applied to various types of surface temperature measuring instruments, such as body temperature detectors. The heat insulation element in the embodiments of the present application can be a flat plate shape, such as a circular flat plate. Taking the body temperature detector as an example, since the surface temperature of the measured human body is generally between 30-40℃, it is found through research and a large number of test data that the diameter of the circular flat plate shaped heat insulation element is not less than 10 mm and not greater than 25 mm. The thickness of the heat insulation element is not greater than 15 mm and not less than 5 mm.

[0060] The following tables show the test data corresponding to the selection of heat insulation elements of different sizes in each test scenario.

[0061] Table 1 shows the detection results of the probe assembly with heat insulation elements of the same diameter but different thicknesses in the black body furnace

[0062] Wherein, T1 is the temperature detected by the first sensor, and T2 is the temperature detected by the second sensor. It can be seen that when the diameter of the heat insulation element is φ20 mm and the thickness is 10 mm, the measurement result of T1 is more accurate and the same as the set temperature of the black body furnace. Therefore, the heat insulation element of this size has good heat insulation effect, and the first sensor is least affected by the external temperature.

[0063] Table 2: Test results of probe assembly with different diameter but same thickness of thermal insulation element in black body furnace

[0064] As shown in Table 2 above, the diameter of the thermal insulation element is changed, and the measurement values of the first sensor are not much different.

[0065] Table 3: Data list of ear temperature patch (different thickness of thermal insulation element) using the probe assembly of the present embodiment in human test scenario

[0066] In the human test scenario, five volunteers participated in the test. The ear temperature patch using the probe assembly of the present embodiment was adhered to the ear. A mercury thermometer was used as a reference in the test. As shown in Table 3 above, the higher the body temperature of the measured human body, the greater the temperature difference between the first temperature T1 measured by the first sensor and the second temperature T2 measured by the second sensor. In the test corresponding to Table 3 above, three sizes of thermal insulation elements were used, such as φ20mm*5mm, φ20mm*7mm and φ20mm*10mm. Among them, φ20mm is the diameter of the thermal insulation element, and 5mm, 7mm and 10mm are the three thicknesses of the thermal insulation element. As shown in the value of "thermometer-T1" in the table above, the thicker the thermal insulation element, the smaller the difference between the first temperature T1 measured by the first sensor and the value measured by the mercury thermometer. Therefore, the thicker the thermal insulation element, the less the first sensor is affected by the outside world, and the higher the accuracy of the measurement.

[0067] Table 4: Data list of ear temperature patch (different diameter but same thickness of thermal insulation element) using the probe assembly of the present embodiment in human test scenario

[0068] In the test corresponding to Table 4 above, three thermal insulation elements with different diameters but the same thickness were used. As shown above, the higher the body temperature of the measured human body, the greater the temperature difference between the first temperature T1 measured by the first sensor and the second temperature T2 measured by the second sensor. As shown in the value of "thermometer-T1" in the table above, when the thickness of the thermal insulation element is constant, the larger the diameter of the thermal insulation element, the smaller the degree of influence of the outside world on the first sensor.

[0069] Fig. 1, Fig. 2 and Fig. 3 respectively show three different implementation structures of the present application. As shown in the first embodiment of Fig. 1, the thermal insulation element 14 can be in the shape of a flat plate, such as a circular flat plate, a square flat plate, an oval flat plate, a polygonal flat plate, etc., which can be determined according to the product appearance design requirements, and the present embodiment does not make specific limitations. The first sensor 11 and the second sensor 12 are respectively located on the two sides of the flat plate-shaped thermal insulation element 14.

[0070] Figure 2 shows a second embodiment, the probe assembly 10 includes two heat insulation elements 14, which have grooves. As shown in the cross-sectional view of Figure 2, the cross-sectional structure of the heat insulation element is U-shaped. The two heat insulation elements 14 are stacked and the grooves are opposite, and the first sensor 11 and the second sensor 12 are respectively located in the corresponding side grooves.

[0071] Figure 3 shows a third embodiment, the heat insulation element 14 has two opposite grooves, and the first sensor 11 and the second sensor 12 are respectively located in the corresponding side grooves. As shown in the cross-sectional view of Figure 2, the cross-sectional structure of the heat insulation element 14 is H-shaped.

[0072] In the schemes shown in Figures 2 and 3, the first sensor 11 is located in the groove on the corresponding side of the heat insulation element 14, that is, except for the side in contact with the first side surface 101, the other sides of the first sensor 11 are surrounded by the heat insulation element 14. The heat insulation element 14 is a kind of heat preservation element. As the contact time of the probe assembly with the measured object becomes longer, the side of the first sensor 11 corresponding to the first side surface 101 senses the temperature of the measured object, and the other sides are surrounded by the heat insulation element 14, and the temperature in the space where the first sensor 11 is located is close to the temperature of the measured object as time goes on; it is equivalent to that the first sensor is immersed in a space with uniform temperature, which solves the problem that the temperature measurement of the temperature sensor on the surface is affected by the ambient temperature or other temperature and is not accurate. Similarly, the second sensor 12 is located in the groove, and the side corresponding to the second side surface 102 senses the second temperature around the probe assembly, and the other sides of the second sensor 12 are surrounded by the heat insulation element 14, which can effectively improve the measurement accuracy of the second sensor 12.

[0073] Further, the probe assembly 10 can also include a circuit board 15. As shown in Figures 1, 2 and 3, the first sensor 11 and the second sensor 12 are electrically connected with the circuit board 15, and the circuit board 15 is used for electrical connection with the host. In specific implementation, the first sensor 11, the second sensor 12 and the circuit board can be electrically connected by welding.

[0074] As shown in the embodiment of Figure 3, in the case that the probe assembly 10 includes two heat insulation elements 14, the two heat insulation elements 14 are stacked and located between the first sensor 11 and the second sensor 12; and the circuit board 15 is located between the two heat insulation elements 14. The circuit board 15 has a certain spacing C with the heat insulation elements on both sides, and the two spacings can be equal or not equal. In addition, the value of C is not limited in this embodiment.

[0075] In the embodiment shown in Figures 1 and 2, the first sensor 11, the second sensor 12 and the thermal insulation element 14 can be regarded as a sensor assembly; the circuit board 15 can be arranged on the outside of the sensor assembly, and the first sensor 11 and the second sensor 12 have lead wires that are electrically connected to the circuit board 15 through the wires.

[0076] In order to speed up the temperature measurement speed and avoid the loss of heat during the conduction process, in some embodiments of the present application, as shown in Figure 2 or Figure 3, a structure that can be implemented for the probe assembly 10 is that the probe assembly 10 also includes a temperature measuring contact 16. One side of the temperature measuring contact 16 is exposed for contact with the object to be measured, and the other side is connected to the first sensor 11. The temperature measuring contact 16 conducts the temperature of the object to be measured to the first sensor 11. When the probe assembly 10 measures the first temperature of the object to be measured, the temperature measuring contact 16 is in contact with the object to be measured, and the temperature measuring contact 16 can conduct temperature so that the temperature of the object to be measured can be quickly conducted to the first sensor 11 through the temperature measuring contact 16. The temperature measuring contact 16 can be made of a metal material with good thermal conductivity, or it can be made of a non-metallic material with good thermal conductivity. As long as good thermal conductivity is guaranteed, the embodiments of the present application do not make specific limitations.

[0077] As shown in Figure 1, the probe assembly of this embodiment further includes a housing 17. The housing 17 defines a receiving space with an open opening on one side. A flange 170 is provided around the opening, extending away from the receiving space. The housing 17 thus has a cross-sectional shape. A temperature sensing contact 16 is located at the opening of the receiving space and connected to the housing 17, thereby enclosing the first sensor 11, the thermal insulation element 14, and the second sensor 12 within the enclosed receiving space. In a specific embodiment, the housing 17 can be formed using a plastic injection molding process. The temperature sensing contact 16 abuts against the walls of the receiving space along its circumference. The temperature sensing contact 16 can be in the form of a sheet having a diameter equal to that of the opening. Alternatively, the temperature sensing contact 16 can have a U-shaped cross-section, with the sidewalls of the temperature sensing contact 16 positioned within the receiving space, the top of the sidewalls abutting against the bottom wall of the receiving space, and the position of the sidewalls is limited by the height of the temperature sensing contact 16.

[0078] The flange 170 can be used for fixing when assembled. As shown in the embodiment of Fig. 4, the probe assembly further comprises a main body 20; the main body comprises a probe part 21, a main body part 22 and an intermediate part 23 connecting the probe part 21 and the main body part 22. The probe part 21 is provided with an embedding hole, and the sensor assembly including at least the first sensor 11, the second sensor 12 and the heat insulation assembly is embedded in the embedding hole. The flange 170 on the shell 17 is clamped into the hole wall groove of the embedding hole. The probe assembly is embedded in the probe part 21, and the temperature measuring contact 16 is exposed and protrudes outward to contact the measured object; the intermediate part 23 is injection molded with wires. The main body part 22 is used for mounting the main machine; the main machine is electrically connected with the first sensor 11 and the second sensor 12 through the wires.

[0079] In a more specific embodiment, the main body can be injection molded by an injection molding process. For example, the main body can be generated by a silica gel injection molding process, which can be referred to as an injection molded body. The injection molded body has a probe part 21, a main body part 22 and an intermediate part 23 connecting the probe part 21 and the main body part 22.

[0080] In a specific implementation, the main body part 22 is provided with a mounting groove, and the main machine is detachably mounted in the mounting groove of the main body part 22; or the main machine is wrapped in the main body part 22 and cannot be detached. The main machine is detachable, so that the probe assembly can be a consumable. For example, in a hospital, after a patient uses it, the medical staff can detach the main machine, without the need to disinfect the probe assembly, and the patient can discard or keep it for next use. When the next patient needs to use it, a new probe assembly is taken, the main machine is mounted at the main body part 22 of the probe assembly, and temperature measurement can be performed. The main machine 30 is not detachable, which is suitable for use in a family, an individual or a situation where temperature measurement is not frequent. It can be understood that, as a family or individual use, family members will not be sick frequently, so the number of times of using the temperature tester is not high, and there is sufficient time to disinfect the temperature tester for next use. Or when an individual is in a sick state and needs to measure temperature frequently, the temperature tester is a personal exclusive tool and will not be shared with others, so even if it is not disinfected, it will not cause cross infection. In this case, the cost will be lower because the probe assembly 10 does not need to be purchased frequently.

[0081] The probe assembly provided by the embodiment can be part of a body temperature detector, and the probe assembly can be attached to a measurement position of a measured object to obtain the body temperature of the measured object. The measurement position of the measured object is not limited to the armpit, wrist, forehead, etc. Body temperature measurement is very important. Body temperature, blood pressure, pulse, respiration, and pain together constitute the five vital signs of life. Maintaining constant body temperature is a necessary condition for guaranteeing the metabolism and normal life activities of the body, and abnormal body temperature can cause metabolic disorders and even endanger life. The normal core body temperature of a human body is 36.5-37.5℃, and the body surface temperature is about 33℃. The core body temperature refers to the temperature of important organs in the deep part of the body, corresponding to the body surface temperature, and the temperature gradient between the two is about 2-4℃. The phenomenon that the core body temperature of the body is lower than 36℃ due to various reasons during the perioperative period is called perioperative hypothermia, also known as accidental perioperative hypothermia (which is different from controlled hypothermia for medical purposes). The incidence of accidental perioperative hypothermia is relatively high, and it is necessary to continuously detect the body temperature of the measured object to implement perioperative temperature management.

[0082] Therefore, the application further provides a body temperature detector comprising the probe assembly. The body temperature detector provided by the embodiment comprises the probe assembly 10 and the host 30 provided by the above embodiment. The specific implementation of the probe assembly 10 can be referred to the above content, which will not be described herein. The host 30 is in electrical signal communication with the first sensor 11 and the second sensor 12 in the probe assembly 10, and is configured to determine the heat insulation coefficient of the heat insulation element in the probe assembly 10 according to the temperature difference between the first temperature detected by the first sensor 11 and the second temperature detected by the second sensor 12, and correct the first temperature based on the heat insulation coefficient to obtain a body temperature measurement value.

[0083] The body temperature detector provided by the embodiment can not only continuously detect the body temperature, but also has high temperature measurement accuracy. The body temperature detector can have the appearance structure as shown in FIG. 2, and correspondingly, the circuit board in the probe assembly is the mainboard of the host. In specific implementation, the body temperature detector can be an ear temperature sticker, etc. The first sensor 11 and the second sensor 12 in the probe assembly are directly electrically connected to the mainboard. As shown in FIG. 2, an adhesive member 13 can be arranged on the probe assembly, and the adhesive member 13 is located on the side of the probe assembly 10 away from the second sensor 12. The adhesive member 13 can be adhered to the measured object to fix the probe assembly 10 on the temperature measurement position of the measured object, so that the probe assembly 10 will not fall off from the temperature measurement position of the measured object when measuring the body temperature (such as the armpit temperature), thereby improving the comfort of the measured object during measurement.

[0084] Further, as shown in FIG. 2, in some embodiments of the present application, the adhesive 13 is flush with the side of the temperature sensing contact 16 that is opposite to the first sensor 11, and when the temperature sensing contact 16 abuts the measurement site of the measured object, the adhesive 13 can be just able to adhere to the measurement site of the measured object, thereby ensuring that the temperature sensing contact 16 or the probe assembly 10 does not come off the measurement site during temperature measurement. An achievable positional relationship between the adhesive 13 and the temperature sensing contact 16 is that the adhesive 13 surrounds the temperature sensing contact 16 in the circumferential direction, so that the temperature sensing contact 16 is located at the center of the adhesive 13, and after the adhesive 13 adheres to the measurement site of the measured object, the temperature sensing contact 16 can abut the measurement site of the measured object. In addition, the adhesive 13 can isolate the circumferential direction of the temperature sensing contact 16 from the outside, thereby avoiding the influence of the temperature of the outside on the temperature sensing contact 16 through the circumferential direction of the temperature sensing contact 16, and ensuring the accuracy of the first temperature measurement.

[0085] In order to ensure that the body temperature of the measured object can be fully measured by the first sensor 11 through the temperature sensing contact 16, in some embodiments of the present application, the single-side width of the adhesive 13 is less than 1 / 4 of the single-side width of the temperature sensing contact 16, which not only ensures the stable adhesion of the adhesive 13 to the measured object, but also enables the temperature sensing contact 16 to have sufficient area to abut the measurement site of the measured object, so as to facilitate the conduction of the body temperature of the measured object to the temperature sensing contact 16.

[0086] Further, in order to prevent the temperature sensing contact 16 from being affected by the temperature of the adhesive 13, in some embodiments of the present application, there is a gap D between the adhesive 13 and the temperature sensing contact 16, 0.5mm≤D≤1.5mm. The adhesive 13 surrounds the temperature sensing contact 16 in a relatively sealed space, and the gap left therebetween does not transmit the temperature of the adhesive 13 to the temperature sensing contact 16, thereby ensuring the accuracy of the measured first temperature.

[0087] Alternatively, in use, medical adhesive tape or the like can be used to paste the probe assembly on the measurement site (such as the ear, armpit, etc.) of the measured object on the side (i.e., the second side 102) of the probe assembly that is away from the first sensor 11.

[0088] Table 5 lists the data of the ear temperature patch (with the same size of the heat insulation element) of the probe assembly of the present embodiment in the human test scenario

[0089] The same size (diameter and thickness) of the heat insulation element is used in the test corresponding to Table 5 above, but two different sticking methods are used in the test. The inner sticking method refers to that the probe assembly is provided with an adhesive member on the outer side of the temperature measuring touch piece 16 corresponding to the side of the first sensor 11 (i.e. the first side 101 mentioned above), and the probe assembly is stuck to the detection position of the human body to be measured by using the adhesive member. The outer sticking method refers to that the probe assembly is stuck to the detection position of the human body to be measured by using adhesive tape or the like on the side of the probe assembly away from the first sensor 11 (i.e. the second side 102 mentioned above). As can be seen from the value of "thermometer-T1" in the above table, the inner sticking method and the outer sticking method have little effect on the detection accuracy of the first sensor.

[0090] Alternatively, the body temperature detector can have an appearance structure as shown in FIG. 5, and the host 30 and the probe assembly 10 are detachably connected; or the host 30 and the probe assembly are not detachably connected. The body temperature detector shown in FIG. 5 is similar to the armpit thermometer, but also has some differences. The probe assembly extends out and can be clamped under the armpit of the patient, and the corresponding part of the host 30 can be exposed outside.

[0091] The host can obtain the first temperature and the second temperature measured by the probe assembly 10, and the host 30 has a pre-stored calculation program, and the host runs the calculation program to determine the heat insulation coefficient of the heat insulation element based on the temperature difference between the first temperature and the second temperature; and then corrects the first temperature based on the heat insulation coefficient. Wherein, how to determine the heat insulation coefficient based on the temperature difference, and how to correct the first temperature based on the heat insulation coefficient, are not specifically limited in the embodiment.

[0092] The host 30 can include but is not limited to a processor capable of acquiring signals and a battery providing electric energy. The processor can be electrically connected to the probe assembly 10 through the conductive wire in the main body 20 to obtain the first temperature and the second temperature, determine the heat insulation coefficient based on the temperature difference between the first temperature and the second temperature, and correct the first temperature based on the heat insulation coefficient. The battery can provide electric energy for the processor, the first sensor and the second sensor. As an optional solution, all the sensors can be NTC thermistors (negative temperature coefficient thermistors), which have the advantages of small size, high sensitivity to temperature, fast response and low cost, so that the sensor occupies small space, the probe assembly 10 has small volume, the body temperature detector has short measurement time, and the probe assembly 10 has low cost.

[0093] With the body temperature detector as an armpit temperature detector as an example, when the armpit is taken as a measurement site to perform first temperature measurement, most cases will adopt the way of clamping the body temperature detector with the arm to perform body temperature measurement. However, when the user needs to detect continuous body temperature in a special period, clamping the temperature measuring instrument with the arm all the time not only makes the user tired but also is easy to forget, and the implementation possibility is low; or the user is inconvenient to clamp with the arm, for example, in the case of measuring the armpit temperature of a baby. If the body temperature detector falls off, the result of the body temperature measurement is definitely inaccurate. Therefore, before the step of determining the heat insulation coefficient of the heat insulation element according to the temperature difference between the first temperature and the second temperature, the host computer of the embodiment of the present application further includes:

[0094] If the change range of the second temperature within the set time length is less than the set value, the step of determining the heat insulation coefficient of the heat insulation element according to the temperature difference between the first temperature and the second temperature is triggered;

[0095] If the change range of the second temperature within the set time length is greater than or equal to the set value, the probe assembly abnormal information is output.

[0096] The output probe assembly abnormal information can include at least one of the following:

[0097] Triggering the speaker to output abnormal alarm audio; wherein the speaker is arranged on the host computer 30;

[0098] Sending the probe assembly abnormal information to a monitoring device or a mobile device to play and / or display on the monitoring device or the mobile device; wherein the monitoring device or the mobile device is in wireless communication connection with the host computer.

[0099] In specific implementation, the monitoring device can be a monitoring terminal at a hospital nurse station or a monitoring center; the mobile device can be a user's mobile phone, tablet computer, notebook computer, etc., and the embodiment does not make specific limitation thereto.

[0100] Further, referring to FIG. 6, the embodiment of the present application further provides a body temperature detection system. The body temperature detection system includes the body temperature detector 40 provided by the above embodiment, and a monitoring device 41 or a mobile device 42. Wherein, the monitoring device 41 or the mobile device 42 is in communication connection with the body temperature detector 40, for receiving the body temperature measurement value output by the body temperature detector 40, and playing and / or displaying.

[0101] In specific implementation, the monitoring device 41 can include but is not limited to a monitor, a computer at a nurse station or a monitoring center, etc. The mobile device 42 can include but is not limited to a mobile phone, a tablet computer, a notebook computer, a smart wearable device (such as a watch, etc.).

[0102] Further, the application also provides a body temperature detection method for the above-mentioned hardware devices and systems. The body temperature detection method is suitable for a host of a body temperature detector, the body temperature detector comprising a probe assembly, the probe assembly comprising a first sensor, a second sensor and a heat insulation element between the first sensor and the second sensor. Specifically, the method can include but is not limited to:

[0103] 101. obtaining a first temperature of a measured object detected by the first sensor;

[0104] 102. obtaining a second temperature around the probe assembly detected by the second sensor;

[0105] 103. determining a heat insulation coefficient of the heat insulation element according to a temperature difference between the first temperature and the second temperature;

[0106] 104. correcting the first temperature based on the heat insulation coefficient to obtain a body temperature measurement value.

[0107] Before the step 103, the method can further include the following step:

[0108] if a variation range of the second temperature within a set time period is less than a set value, triggering the step of determining the heat insulation coefficient of the heat insulation element according to the temperature difference between the first temperature and the second temperature;

[0109] if the variation range of the second temperature within the set time period is greater than or equal to the set value, outputting probe assembly abnormal information.

[0110] The outputting of the probe assembly abnormal information can include at least one of the following:

[0111] triggering a speaker to output an abnormal alarm audio; wherein the speaker is arranged on the host;

[0112] sending the probe assembly abnormal information to a monitoring device or a mobile device for playing and / or displaying on the monitoring device or the mobile device; wherein the monitoring device or the mobile device is wirelessly connected to the host.

[0113] It should be noted that the set value is not specifically limited in the embodiment, and can be artificially set.

[0114] The above embodiments are only used to illustrate the technical solutions of the application, but not to limit the same; although the application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and such modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments.

Claims

1. A probe assembly, characterized in that: Applied to a body temperature detector, the probe assembly includes: A first sensor, for measuring a first temperature of an object; a second sensor for measuring a second temperature around the probe assembly; a heat-insulating element, located between the first sensor and the second sensor, wherein both the first sensor and the second sensor are at a certain distance from the heat-insulating element; Among them, the first sensor and the second sensor are used to communicate with the host electrical signal in the body temperature detector, and the host determines the thermal insulation coefficient of the thermal insulation element according to the temperature difference between the first temperature and the second temperature, and corrects the first temperature based on the thermal insulation coefficient to obtain the body temperature measurement value.

2. The probe assembly according to claim 1, wherein: The probe assembly has two side surfaces that are opposite to each other. The first sensor is located at one of the two side surfaces, and the second sensor is located at the other of the two side surfaces.

3. The probe assembly according to claim 1, wherein: The heat-insulating element is in the shape of a flat plate, and the first sensor and the second sensor are respectively located on both sides of the heat-insulating element in the shape of a flat plate; or The heat insulation element has two opposite grooves, and the first sensor and the second sensor are respectively located in the corresponding side grooves; or The probe assembly includes two thermal insulation elements, each having a groove; the two thermal insulation elements are stacked with the grooves facing each other, and the first sensor and the second sensor are respectively located in corresponding side grooves.

4. The probe assembly according to any one of claims 1 to 3, characterized in that Also includes a circuit board; the first sensor and the second sensor are electrically connected to the circuit board, and the circuit board is used to be electrically connected to the host; In the case where the probe assembly includes two thermal insulation elements, the two thermal insulation elements are stacked and located between the first sensor and the second sensor; and the circuit board is located between the two thermal insulation elements.

5. The probe assembly according to any one of claims 1 to 3, characterized in that: Also includes temperature measuring contacts; One side of the temperature measuring contact piece is exposed for contacting the object to be measured, and the other side is in contact with the first sensor. The temperature measuring contact piece conducts the temperature of the object to be measured to the first sensor.

6. The probe assembly according to claim 5, characterized in that Also includes the outer shell; The housing has an accommodating space, one side of the accommodating space is an open opening, and a flange is provided around the opening in a direction away from the accommodating space; The temperature measuring contact piece is located at the opening of the accommodating space and is connected to the housing, so that the first sensor, the heat insulation element and the second sensor are contained in the closed accommodating space.

7. The probe assembly according to claim 6, characterized in that Also included are injection molded bodies produced by injection molding; The injection molded body comprises a detection portion, a main body portion, and a middle portion connecting the detection portion and the main body portion; The probe assembly is embedded in the detection part, and the temperature measuring contact piece is exposed and protrudes outward so as to contact the object to be measured; A conductive wire is injection-molded in the middle portion; The main body is used to install the host; the host is electrically connected to the first sensor and the second sensor through the wire.

8. The probe assembly according to claim 7, wherein: Also includes a circuit board; the first sensor and the second sensor are electrically connected to the circuit board, and the circuit board is used to be electrically connected to the host; The circuit board and the host are both installed on the main body.

9. A body temperature detector, characterized in that: include: The probe assembly according to any one of claims 1 to 8; A host, wherein the host is in electrical signal communication with the first sensor and the second sensor in the probe assembly, and is used to determine the thermal insulation coefficient of the thermal insulation element in the probe assembly based on the temperature difference between the first temperature detected by the first sensor and the second temperature detected by the second sensor, and to correct the first temperature based on the thermal insulation coefficient to obtain a body temperature measurement value.

10. A body temperature detection system, characterized in that: include: The body temperature detector according to claim 9; The monitoring device or mobile device is communicatively connected to the body temperature detector, and is used to receive the body temperature measurement value output by the body temperature detector and play and / or display it.

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