Electronic device comprising speaker and sensor

Abstract

Disclosed is a sensor-speaker module, which has improved waterproofing reliability and efficiently utilizes the internal space of an electronic device, or an electronic device comprising the sensor-speaker module. The electronic device may comprise the sensor-speaker module positioned inside a device housing. The sensor-speaker module may comprise: a module housing including a partition wall dividing a first internal space and a second internal space; a sensor disposed in the first internal space; and a speaker disposed in the second internal space. The device housing includes an opening forming a path through which sound generated by the speaker is output to the outside, and the sensor can communicate with the opening of the device housing.

Description

Electronic devices including speakers and sensors

[0001] The present disclosure relates to electronic devices, and more particularly, to electronic devices including speakers and sensors.

[0002] Electronic devices may include speakers for outputting sound. The speakers may provide notification signals to the user or provide voice call functionality. Electronic devices may also include sensors for detecting external signals (e.g., acoustic signals) and the external environment. The external environment detected by the sensors may include, for example, illuminance, atmospheric pressure, and / or atmospheric components.

[0003] An electronic device may include a housing that protects internal components of the electronic device and defines boundaries between the interior and exterior of the electronic device. The housing may include an opening. The opening in the housing may be formed to allow signals (e.g., acoustic signals) to be output from the interior of the electronic device, or to allow a sensor within the electronic device to access the external environment being measured.

[0004] Moisture and / or foreign matter can enter through openings in the housing of an electronic device. This can cause the electronic device to malfunction and / or fail. To prevent this, the openings in the housing can be waterproofed.

[0005] When an electronic device includes multiple sensors and / or speakers, a plurality of openings may be formed in the housing of the electronic device. Each of the multiple openings may require individual waterproofing treatment. However, as the number of individually waterproofed openings increases, the risk of at least one of the openings being damaged due to poor waterproofing or external factors increases. Furthermore, when forming multiple openings in the housing, arranging sensors and / or speakers adjacent to each opening, and individually waterproofing each opening, the internal space of the electronic device may be used inefficiently, which may hinder miniaturization and weight reduction of the electronic device.

[0006] According to various embodiments of the present disclosure, a sensor-speaker module and an electronic device including the same can be provided, which improve the reliability of waterproofing and efficiently utilize the internal space of the electronic device.

[0007] An electronic device according to various embodiments of the present disclosure may include a device housing. The electronic device may include a sensor-speaker module positioned inside the device housing. The sensor-speaker module may include a module housing including a partition wall dividing a first internal space and a second internal space. The sensor-speaker module may include a sensor positioned inside the first internal space and a speaker positioned inside the second internal space. The device housing may include an opening that forms a path through which sound generated by the speaker is output to the outside, and the sensor may be in communication with the opening of the device housing.

[0008] According to various embodiments of the present disclosure, a module may be a sensor-speaker module of an electronic device including a device housing and an opening formed in the device housing. The sensor-speaker module may include a module housing including a partition wall dividing a first internal space and a second internal space. The sensor-speaker module may include a sensor disposed within the first internal space and a speaker disposed within the second internal space. The sensor-speaker module may include a partition wall positioned between the first internal space and the second internal space.

[0009] According to various embodiments of the present disclosure, an electronic device includes a sensor-speaker module including an external environmental sensor and a speaker, wherein the sensor-speaker module is positioned so as to be accessible from the outside through an opening formed in a housing, thereby improving the reliability of waterproofing and enabling efficient use of the internal space of the electronic device. In addition, a partition wall is formed within the housing to separate the speaker and the sensor, thereby enhancing the efficiency of waterproofing and moisture removal within the module.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0011] FIGS. 2A and 2B are perspective views of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIGS. 4A and 4B are drawings showing a display unit, a housing, and a rear plate according to one embodiment of the present disclosure.

[0014] FIG. 4c is a perspective view illustrating a printed circuit board and a sensor-speaker module according to one embodiment of the present disclosure.

[0015] FIG. 5A is a perspective view illustrating a sensor-speaker module of an electronic device according to various embodiments.

[0016] FIG. 5b is a front view illustrating a sensor-speaker module of an electronic device according to various embodiments.

[0017] FIG. 5c is a cross-sectional view showing a sensor-speaker module of an electronic device according to various embodiments.

[0018] Figure 6a is a schematic diagram showing the moisture removal operation of an electronic device according to a comparative example.

[0019] FIG. 6b is a schematic diagram showing a moisture removal operation of an electronic device according to various embodiments of the present disclosure.

[0020] FIG. 7A is a cross-sectional view of an electronic device according to various embodiments of the present disclosure.

[0021] FIG. 7b is a cross-sectional view of an electronic device according to various embodiments of the present disclosure.

[0022] FIGS. 8A and 8B are front views of a sensor-speaker module according to various embodiments.

[0023] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), a smartwatch (e.g., the electronic device (200) of FIGS. 2A and 2B), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0024] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0025] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0026] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0027] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0028] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0029] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0030] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0031] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0032] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0033] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0034] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0035] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0036] FIG. 2a is a perspective view of the front of an electronic device (200) according to one embodiment. FIG. 2b is a perspective view of the rear of an electronic device (200) according to one embodiment.

[0037] The electronic device (200) of FIGS. 2A and 2B may refer to the electronic device (100) of FIG. 1 or may include at least some of the components of the electronic device (100) of FIG. 1.

[0038] Referring to FIGS. 2A and 2B, an electronic device (200) according to one embodiment may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B), and a fastening member (250, 260) connected to at least a portion of the housing (210) and configured to detachably fasten the electronic device (200) to a part of a user's body (e.g., a wrist or ankle). The fastening member (250, 260) may be, for example, a strap that wraps around a user's wrist to secure the electronic device (200). In one embodiment (not shown), the housing may refer to a structure forming a portion of the first surface (210A), the second surface (210B), and the side surface (210C) of FIG. 2A. According to one embodiment, the first surface (210A) may be formed by a front plate (201) that is at least partially substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second surface (210B) may be formed by a back plate (207). The back plate (207) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (206) that is coupled to the front plate (201) and the back plate (207) and includes a metal and / or a polymer. In some embodiments, the back plate (207) and the side bezel structure (206) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum). The fastening members (250, 260) may be formed of various materials and shapes.The unitary and multiple unit links can be formed to be fluidly connected to each other by a woven material, leather, rubber, synthetic resin, metal, ceramic, or a combination of at least two of the above materials.

[0039] According to one embodiment, the electronic device (200) may include at least one of a display (310, see FIG. 3), an audio module (205, 208), a sensor module (211), a key input device (203, 204), and a connector hole (209). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (203, 204), the connector hole (209), or the sensor module (211)) or may additionally include other components.

[0040] The display (310, see FIG. 3) may be visually exposed, for example, through a significant portion of the front plate (201). The shape of the display (310) may correspond to the shape of the front plate (201), and may be circular, oval, or polygonal. The display (310) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0041] The audio module (205, 208) may include a microphone hole (205) and a speaker hole (208). The microphone hole (205) may have a microphone disposed therein for acquiring external sounds, and in some embodiments, multiple microphones may be disposed therein to detect the direction of sounds. The speaker hole (208) may be used as an external speaker and a receiver for calls. In some embodiments, the speaker hole (208) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (208) (e.g., a piezo speaker).

[0042] The sensor module (211) can generate an electric signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (211) can include, for example, a biometric sensor module (e.g., an HRM sensor, an oxygen saturation sensor, and / or a blood glucose sensor) arranged toward the second surface (210B) of the housing (210). The electronic device (200) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The key input device (203, 204) may include a side key button (203, 204) disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (203, 204), and the key input devices (203, 204) that are not included may be implemented in the form of soft keys or touch keys on the display (220). The key input device (203, 204) according to one embodiment may also include a wheel key (not shown) disposed on a first surface (210A) of the housing (210) and rotatable in at least one direction.

[0044] The connector hole (209) may include another connector hole (not shown) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and may include a connector for transmitting and receiving audio signals with the external electronic device. The electronic device (200) may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole (209) and blocks the inflow of external foreign substances into the connector hole (209).

[0045] The fastening member (250, 260) can be detachably fastened to at least a portion of the housing (210) using a locking member (251, 261). The fastening member (250, 260) can include one or more of a fixing member (252), a fixing member fastening hole (253), a band guide member (254), and a band fastening ring (255).

[0046] The fixing member (252) can be configured to fix the housing (210) and the fastening members (250, 260) to a part of the user's body (e.g., wrist, ankle). The fastening member fastening hole (253) can fix the housing (210) and the fastening members (250, 260) to a part of the user's body in response to the fastening member (252). The band guide member (254) can be configured to limit the range of motion of the fastening member (252) when the fastening member (252) is fastened to the fastening member fastening hole (253), thereby allowing the fastening members (250, 260) to be fastened in close contact with a part of the user's body. The band fixing ring (255) can limit the range of motion of the fastening members (250, 260) when the fastening member (252) and the fastening member fastening hole (253) are fastened.

[0047] FIG. 3 is an exploded perspective view of an electronic device (300) according to one embodiment of the present disclosure.

[0048] In describing an electronic device (300) according to one embodiment of the present disclosure (e.g., the electronic device (100) of FIG. 1, the electronic device (200) of FIGS. 2A to 2B), the width direction of the electronic device (300) may mean the X-axis direction, and the length direction of the electronic device (300) may mean the Y-axis direction. The height direction of the electronic device (300) may mean the Z-axis direction.

[0049] An electronic device (300) according to one embodiment of the present disclosure may include a display unit (310), a device housing (320) (e.g., housing (210) of FIG. 2A), a support member (340), a battery (350), a sensor unit (355), a driving unit (357), a printed circuit board (360), and / or a back plate (370).

[0050] The electronic device (300) of FIG. 3 may refer to the electronic device (100) of FIG. 1 or may include at least some of the components of the electronic device (100) of FIG. 1.

[0051] The electronic device (300) of FIG. 3 may refer to the electronic device (200) of FIGS. 2A and 2B, or may include at least some of the components of the electronic device (200) of FIGS. 2A and 2B. For example, the electronic device (300) according to one embodiment may include the fastening members (250, 260) illustrated in FIGS. 2A and 2B.

[0052] At least one of the components of the electronic device (300) of FIG. 3 may be substantially identical to at least one of the components of the electronic device (200) of FIGS. 2A and 2B, and any overlapping description of components that are substantially identical to the components of the electronic device (200) of FIGS. 2A and 2B may be omitted.

[0053] In one embodiment, the display unit (310) can visually provide information to the outside of the electronic device (300). In FIG. 3, the display unit (310) is illustrated as having a circular shape, but the shape of the display unit (310) is not limited thereto and may also have an oval or polygonal shape. The display unit (310) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor, and / or a fingerprint sensor.

[0054] In one embodiment, the device housing (320) may be substantially the same component as the housing (210) of FIGS. 2A and 2B. The device housing (320) may be a component that forms the exterior of the electronic device (300).

[0055] In one embodiment, the device housing (320) may be arranged to surround the periphery of the display unit (310). For example, if the display unit (310) is formed in a circular shape, the device housing (320) may extend in a corresponding circular periphery shape and be arranged to surround the periphery of the display unit (310).

[0056] In various embodiments, the device housing (320) may include an opening (323). For example, the opening (323) may be formed by penetrating a portion of the housing (320). The opening (323) may be a passage through which components inside the electronic device (300) can be accessed from the outside and a passage through which internal components are exposed to the outside.

[0057] In one embodiment, the support member (340) provides a space in which other components of the electronic device (300) (e.g., a battery (350)) are placed, and may serve to support the other components. In one embodiment, the support member (340) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material.

[0058] In one embodiment, the support member (340) may include a plate member (341) and / or a mounting member (342). The display unit (310) may be placed on the plate member (341). A battery (350) may be placed in a space formed inside the mounting member (342).

[0059] In one embodiment, the battery (350) may be a device for supplying power to at least one component of the electronic device (300). For example, the battery (350) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (350) may be integrally disposed within the electronic device (300), or may be detachably disposed with the electronic device (300).

[0060] In one embodiment, the actuator (357) may convert an electrical signal into a user-perceived stimulus. For example, the actuator (357) may include a motor capable of converting an electrical signal into a mechanical stimulus.

[0061] In one embodiment, the printed circuit board (360) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor, a sensor processor, or a communication processor.

[0062] In one embodiment, the integrated sensor-speaker module (401) may be a module including a speaker (e.g., speaker (420)), which is a device for outputting sound of an electronic device, and a sensor (e.g., sensor (430)) that measures an external environmental signal, such as at least one of an atmospheric pressure sensor, an acoustic sensor (e.g., microphone), an air temperature sensor, and an odor sensor (e.g., e-nose). In various embodiments, the sensor-speaker module (401) may be positioned so as to be accessible from the outside through an opening (323) within the device housing (320). In one embodiment, the sensor-speaker module (401) may be electrically connected to a substrate.

[0063] In one embodiment, the back plate (370) may be substantially the same component as the back plate (207) of FIG. 2B. Other components of the electronic device (300), such as a printed circuit board (360), a battery (370), may be positioned within the space defined by the display portion (310), the device housing (320), and the back plate (370).

[0064] FIGS. 4A and 4B are drawings showing a display unit (310), a device housing (320), and a rear plate (370) according to one embodiment of the present disclosure.

[0065] FIG. 4c is a perspective view showing a printed circuit board (360) and a sensor-speaker module (401) according to one embodiment of the present disclosure.

[0066] Referring to FIGS. 4A and 4B, the display unit (310) may be at least partially surrounded by the device housing (320).

[0067] In one embodiment, the device housing (320) may extend along the perimeter of the display portion (310). For example, if the display portion (310) extends in a circular perimeter shape, the device housing (320) may extend in a circular perimeter shape around the perimeter of the display portion (310).

[0068] In one embodiment, the device housing (320) may be positioned on at least a portion of the periphery of the display portion (310). For example, referring to FIG. 4A, the device housing (320) may be positioned on one side of the display portion (310) (e.g., the positive X-axis direction side of the display portion (310)) and the other side (e.g., the negative X-axis direction side of the display portion (310)).

[0069] In one embodiment, the device housing (320) may be positioned on at least a portion of the perimeter of the back plate (370). For example, referring to FIG. 4B, the device housing (320) may be positioned on one side of the back plate (370) (e.g., the positive X-axis direction side of the back plate (370)) and the other side (e.g., the negative X-axis direction side of the back plate (370)).

[0070] Referring to FIG. 4C, in various embodiments, the sensor-speaker module (401) may include a flexible printed circuit board (402) electrically connected to the sensors and speakers included in the sensor-speaker module (401) (e.g., the sensor (430) and the speaker (420) described below). A connector (403) may be disposed at one end of the flexible printed circuit board (402) configured to operatively connect the sensor (430) and the speaker (420) to another component of the electronic device (e.g., the printed circuit board (360) of FIG. 3). The printed circuit board (360) may include a contact (361) arranged to be in electrical contact with the connector (403).

[0071] FIG. 5A is a perspective view showing a sensor-speaker module (401) of an electronic device according to various embodiments.

[0072] FIG. 5b is a front view showing a sensor-speaker module (401) of an electronic device according to various embodiments.

[0073] FIG. 5c is a cross-sectional view showing a sensor-speaker module (401) of an electronic device according to various embodiments.

[0074] Figure 5c is a cross-section along the BB direction of Figure 5b.

[0075] Referring to FIGS. 5A to 5C, the sensor-speaker module (401) may include a module housing (410), a sensor (430), a speaker (420), and a partition wall (440). The module housing (410) may be a member that surrounds at least a portion of the sensor-speaker module (401). The module housing (410) may include a metal (e.g., aluminum) and / or a polymer material. In various embodiments, the module housing (410) may include a seal mount (419) described below.

[0076] The module housing (410) may include an internal space. For example, the module housing (410) may be a boundary that separates the internal space from the exterior of the module housing (410). Referring to FIG. 5c, the internal space may include a first internal space (411a) in which a sensor (430) is placed and a second internal space (411b) in which a speaker (420) is placed.

[0077] The module housing (410) may include a module opening (412). The interior space of the module housing (410) may be accessible from the outside through the module opening (412).

[0078] The partition wall (440) can divide the internal space of the module housing (410) into a first internal space (411a) and a second internal space (411b). In various embodiments, the partition wall (440) can be located between the first internal space (411a) and the second internal space (411b). The partition wall (440) can reduce or block the influence of interference, vibration, and sound pressure of the speaker (420) located in the second internal space (411b) on the sensor (430) (e.g., the atmospheric pressure sensor (430a)) located in the first internal space (411a). The partition wall (440) can include a sound-absorbing material to reduce the influence of the speaker (420) described above. In addition, the partition wall (440) can have a sound-blocking structure to reduce the influence of the speaker (420) described above. The bulkhead (440) can divide the module opening (412) into a first opening (412a) leading to a first internal space (411a) and a second opening (412b) leading to a second internal space (411b).

[0079] The sensor (430) may be a sensor that measures an external environmental signal (e.g., atmospheric pressure, sound, temperature, and / or chemical signal (odor)) of the electronic device. For example, the sensor (430) may include a gel-filled atmospheric pressure sensor (430a) that measures atmospheric pressure, a microphone (471) that measures sound, a temperature sensor that measures temperature, and / or an odor sensor (e.g., e-nose) that measures chemical signals. In various embodiments, the sensor (430) may be a atmospheric pressure sensor that includes a substrate (432) on which a pressure-sensitive element (431) (e.g., a piezoelectric element) is disposed.

[0080] In various embodiments, the sensor (430) may be a gel-filled atmospheric pressure sensor (430a). The gel-filled atmospheric pressure sensor (430a) may include a body portion (434) that forms a cavity (433) that is open in one direction on one side of a substrate (432) on which a pressure-sensitive element (431) is disposed. The cavity (433) may be an area surrounded by the body portion (434) and the substrate (432). The pressure-sensitive element (431) may be positioned inside the cavity (433). The cavity (433) may be filled with a gel (435). The gel (435) may transmit a pressure applied by an external environment, such as the atmosphere, to the pressure-sensitive element (431) and protect the pressure-sensitive element (431) from moisture, foreign substances, and / or other harmful elements introduced from the outside. For example, the gel (435) may provide waterproofing to the pressure sensitive element (431) located inside the cavity (433) by including a non-conductive and water-insoluble material (e.g., oil, grease, gel silicone, gel polymer) to prevent and / or reduce moisture penetration into the cavity (433).

[0081] In various embodiments, the sensor-speaker module (401) may include an O-ring (436) positioned in the first internal space (411a). The O-ring (436) may be a sealing member that seals between the inner surface of the first internal space (411a) (the inner surface of the module housing (410) and the surface of the partition wall (440)) and the sensor (430). Since the sensor (430) may be waterproof, for example, as a gel-filled atmospheric pressure sensor (430a), the O-ring (436) may seal between the main body (434) of the sensor (430) and the first internal space (411a), thereby preventing and / or reducing moisture flowing into the first internal space (411a) from passing through the first internal space (411a) and flowing into other parts of the electronic device.

[0082] In various embodiments, the sensor-speaker module (401) may include a mesh (421). The mesh (421) may be positioned to completely or partially close the second opening (412b). The mesh (421) may be a waterproof mesh (421) comprising interwoven fibers of a hydrophobic material, such as PTFE, PE, nylon, or PVC. The mesh (421) may allow sound from the speaker (420) to pass through and be emitted outside the module housing (410) (ultimately outside the electronic device) while blocking moisture from the outside from entering the second opening (412b).

[0083] Referring to FIG. 5C, in various embodiments, the sensor-speaker module (401) may include a flexible printed circuit board (402) on which a sensor (430) and a speaker (420) are disposed. A connector (403) may be disposed at one end of the flexible printed circuit board (402) for operatively connecting the sensor (430) and the speaker (420) to other components of the electronic device (e.g., the printed circuit board (360) of FIG. 3).

[0084] Figure 6a is a schematic diagram showing the moisture removal operation of an electronic device according to a comparative example.

[0085] FIG. 6b is a schematic diagram showing a moisture removal operation of an electronic device according to various embodiments of the present disclosure.

[0086] The speaker (420) may be configured to perform a moisture removal operation to remove moisture that has entered the opening (323) of the electronic device (e.g., the opening (323) formed in the device housing (320)). The moisture that has entered the electronic device may be located on the module opening (412) of the sensor-speaker (420) module. For example, the moisture may adhere to the module opening (412) of the sensor-speaker (420) module due to wetness or viscosity. Moisture located on the second opening (412b) may block the sound outlet of the speaker (420), thereby causing a reduction in the volume and a deterioration in the sound quality of the speaker (420). The moisture removal operation may be, for example, an operation in which the vibration (V) generated by the speaker (420) by reproducing sound of one or more frequency bands with the speaker (420) removes moisture.

[0087] Referring to Fig. 6a, in the comparative example, when the speaker (42) performs a moisture removal operation, it may be difficult to remove moisture (W) attached to a location far from the speaker (42) (e.g., a location adjacent to the pressure sensor (43)) due to the vibration of the speaker (42) having a strong effect. Therefore, it may be difficult to remove the moisture (W) attached to the second opening (41b) due to interaction (e.g., surface tension) with the moisture (W) attached to the first opening (41a).

[0088] Referring to FIG. 6b, the sensor-speaker module (401) of various embodiments of the present disclosure can be relatively easily removed without or with minimal influence of moisture (W1) located on the first opening (412a) when moisture (W2) on the second opening (412b) is removed by the moisture removal operation of the speaker (420) due to the partition wall (440) dividing the first opening (412a) and the second opening (412b). In addition, even if moisture is located on the first opening (412a), if it does not affect the normal operation of the sensor (430) (e.g., gel-filled atmospheric pressure sensor (430a)), there is no need to remove the moisture (W1) on the first opening (412a), so only the moisture (W2) on the second opening (412b) that affects the speaker (420) can be removed with relatively little energy consumption.

[0089] FIG. 7A is a cross-sectional view of an electronic device according to various embodiments of the present disclosure.

[0090] FIG. 7b is a cross-sectional view of an electronic device according to various embodiments of the present disclosure.

[0091] Fig. 7a is a cross-sectional view taken along the AA direction of Fig. 4a.

[0092] Fig. 7b is a cross-sectional view along the CC direction of Fig. 7a.

[0093] Referring to FIGS. 7A and 7B , in various embodiments, the sensor-speaker module (401) may be oriented so that the module opening (412) faces the opening (323) of the device housing (320) of the electronic device within the electronic device. The module opening (412) may face the direction in which the opening (323) of the device housing (320) of the electronic device opens. In various embodiments, the sensor-speaker module (401) may include a waterproof member (450) that seals between the device housing (320) of the electronic device and the module housing (410). The waterproof member (450) may include, for example, a seal, a bond seal, and / or packing. In various embodiments, the waterproof member (450) may be positioned along the outer perimeter of the module opening (412) of the sensor-speaker module (401). In various embodiments, the module housing (410) of the sensor-speaker module (401) includes a seal mount (419) positioned along the outer perimeter, and a waterproof member (450) may be positioned on the seal mount (419).

[0094] In the case where the electronic device has openings for the sensor (430) and the speaker (420), since each opening must be individually waterproofed, a plurality of waterproofing members (e.g., seals, O-rings) may individually seal each opening. In this case, if at least one of the plurality of waterproofing members is damaged, moisture will flow into the electronic device. That is, since each of the plurality of waterproofing members acts as a point of failure, the risk of waterproofing failure is relatively high. In contrast, according to the present disclosure, by waterproofing the openings for the sensor (430) and the speaker (420) with a waterproofing member (450) of one of the device housings (320), the waterproofing between the sensor-speaker module (401) and the device housing (320) can be performed. That is, since a single waterproof member (450) arranged along the outer perimeter of the module opening (412) of the sensor-speaker module (401) in which the sensor (430) and the speaker (420) are arranged as described above provides a waterproof function for both the sensor (430) and the speaker (420), the number of points of failure in the waterproof treatment can be reduced. Accordingly, the risk of moisture entering the interior of the electronic device due to waterproof damage can be reduced.

[0095] FIGS. 8A and 8B are front views of a sensor-speaker module (401) according to various embodiments.

[0096] Referring to FIGS. 8A and 8B, the sensor-speaker module (401) may include a sensor (430), a speaker (420), and a second sensor (470) (e.g., a microphone (471)). The sensor-speaker module (401) may include a second partition (441) for dividing an area of ​​the internal space where the second sensor (470) is located.

[0097] A sensing element, such as a second sensor (470), which is arranged to be accessible to the outside within the electronic device, for example a microphone (471), is integrated into the sensor-speaker module (401), so that the partition wall (440) and the second partition wall (441) may include sound-absorbing materials and / or sound-insulating structures to prevent malfunction (e.g., howling) due to interaction between the speaker (420) and the microphone (471). Referring to FIG. 8B, the sensor (430) may be positioned between the microphone (471) and the speaker (420) such that the microphone (471) and the speaker (420) are spaced apart from each other.

[0098] An electronic device according to various embodiments of the present disclosure may include a device housing (320). The electronic device may include a sensor-speaker module (401) positioned inside the device housing (320).

[0099] The above sensor-speaker module (401) may include a module housing (410) including a partition wall (440) defining a first internal space (411a) and a second internal space (411b).

[0100] The above sensor-speaker module (401) may include a sensor (430) placed within the first internal space (411a) and a speaker (420) placed within the second internal space (411b).

[0101] The above device housing (320) includes an opening (323) that forms a path through which sound generated from the speaker (420) is output to the outside, and the sensor can be communicated with the opening (323) of the device housing (320).

[0102] In various embodiments, the sensor (430) may be a sensor for measuring atmospheric pressure. The air inlet passage formed between the opening (323) and the sensor (430) may at least partially overlap with the sound output passage formed between the opening (323) and the speaker.

[0103] In various embodiments, the speaker (420) may be configured to generate vibrations when moisture is present in the opening (323) to remove the moisture from the opening (323). The sensor (430) may detect the atmospheric pressure through the opening (323) from which the moisture has been removed.

[0104] An electronic device according to various embodiments of the present disclosure may have a device housing (320) including an opening (323). The electronic device may include a sensor-speaker module (401) positioned within the device housing (320) to be accessible from the outside of the device housing (320) through the opening (323). The sensor-speaker module (401) may include a module housing (410) including a first internal space (411a) and a second internal space (411b). The sensor-speaker module (401) may include a sensor (430) disposed within the first internal space (411a). The sensor-speaker module (401) may include a speaker (420) disposed within the second internal space (411b). The above sensor-speaker module (401) may include a partition (440) positioned between the first internal space (411a) and the second internal space (411b).

[0105] In various embodiments, the module housing (410) may include a module opening (412) that opens toward the opening (323) of the device housing (320). The module housing (410) may include a waterproof member (450) positioned along the outer periphery of the module opening (412). The waterproof member (450) may be in close contact with the inner surface of the device housing (320).

[0106] In various embodiments, the module opening (412) may include a first module opening (412a) connected to the first internal space (411a) and a second module opening (412b) connected to the second internal space (411b). The partition wall (440) may form a boundary between the first module opening (412a) and the second module opening (412b).

[0107] In various embodiments, the sensor-speaker module (401) may further include a waterproof mesh (421) that closes the second opening (412b).

[0108] In various embodiments, the sensor (430) may include a gel-filled atmospheric pressure sensor.

[0109] In various embodiments, the sensor-speaker module (401) may further include an O-ring that seals between the inner surface of the device housing (320) and the partition wall (440) and the sensor (430) in the second internal space (411b).

[0110] In various embodiments, the sensor-speaker module (401) may further include a flexible printed circuit board (402) on which the sensor (430) and the speaker (420) are arranged.

[0111] In various embodiments, the flexible printed circuit board (402) may further include a connector (403) electrically connected to the sensor (430) and the speaker (420).

[0112] In various embodiments, the module housing (410) may further include a third internal space, and the sensor-speaker module (401) may further include a microphone (471) positioned in the third internal space.

[0113] In various embodiments, the bulkhead (440) may further include a sound-absorbing material.

[0114] A sensor-speaker module according to various embodiments of the present disclosure may be a sensor-speaker module (401) of an electronic device including a device housing (320) and an opening (323) formed in the device housing (320). The sensor-speaker module (401) may include a module housing (410) including a partition wall (440) defining a first internal space (411a) and a second internal space (411b). The sensor-speaker module (401) may include a sensor (430) disposed within the first internal space (411a) and a speaker (420) disposed within the second internal space (411b). The sensor-speaker module (401) may include a partition wall (440) positioned between the first internal space (411a) and the second internal space (411b).

[0115] In various embodiments, the sensor (430) may be a sensor for measuring atmospheric pressure. The air inlet passage formed between the opening (323) and the sensor (430) may at least partially overlap with the sound output passage formed between the opening (323) and the speaker.

[0116] In various embodiments, the speaker (420) may be configured to generate vibrations when moisture is present in the opening (323) to remove the moisture from the opening (323). The sensor (430) may detect the atmospheric pressure through the opening (323) from which the moisture has been removed.

[0117] A sensor-speaker module (401) according to various embodiments of the present disclosure may be a sensor-speaker module (401) of an electronic device including a device housing (320) and an opening (323) formed in the device housing (320). The sensor-speaker module (401) may include a module housing (410) including a first internal space (411a) and a second internal space (411b). The sensor-speaker module (401) may include a sensor (430) disposed within the first internal space (411a). The sensor-speaker module (401) may include a speaker (420) disposed within the second internal space (411b). The above sensor-speaker module (401) may include a partition (440) positioned between the first internal space (411a) and the second internal space (411b).

[0118] In various embodiments, the module housing (410) may include a module opening (412) that opens toward the opening (323) of the device housing (320). The module housing (410) may include a waterproof member (450) positioned along the outer periphery of the module opening (412). The waterproof member (450) may be in close contact with the inner surface of the device housing (320).

[0119] In various embodiments, the module opening (412) may include a first module opening (412a) connected to the first internal space (411a) and a second module opening (412b) connected to the second internal space (411b). The partition wall (440) may form a boundary between the first module opening (412a) and the second module opening (412b).

[0120] In various embodiments, the module housing (410) may include a module opening (412) that opens toward the opening (323) of the device housing (320). The module housing (410) may include a waterproof member (450) positioned along the outer periphery of the module opening (412). The waterproof member (450) may be in close contact with the inner surface of the device housing (320).

[0121] In various embodiments, the module opening (412) may include a first module opening (412a) connected to the first internal space (411a) and a second module opening (412b) connected to the second internal space (411b). The partition wall (440) may form a boundary between the first module opening (412a) and the second module opening (412b).

[0122] In various embodiments, the sensor-speaker module (401) may further include a waterproof mesh (421) that closes the second opening (412b).

[0123] In various embodiments, the pressure sensor (430) may include a gel-filled atmospheric pressure sensor (430a).

[0124] In various embodiments, the sensor-speaker module (401) may further include an O-ring that seals between the inner surface of the device housing (320) and the partition wall (440) and the sensor (430) in the second internal space (411b).

[0125] In various embodiments, the sensor-speaker module (401) may further include a flexible printed circuit board (402) on which the sensor (430) and the speaker (420) are arranged.

[0126] In various embodiments, the flexible printed circuit board (402) may further include a connector (403) electrically connected to the sensor (430) and the speaker (420).

[0127] In various embodiments, the module housing (410) may further include a third internal space, and the sensor-speaker module (401) may further include a microphone (471) positioned in the third internal space.

[0128] In various embodiments, the bulkhead (440) may further include a sound-absorbing material.

[0129] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In a sensor-speaker module (401) of an electronic device including a device housing (320) and an opening (323) formed in the device housing (320), A module housing (410) including a partition wall (440) dividing a first internal space (411a) and a second internal space (411b); A sensor (430) placed within the first internal space (411a); A speaker (420) placed within the second internal space (411b); and A sensor-speaker module (401) including a partition wall (440) positioned between the first internal space (411a) and the second internal space (411b).

2. In paragraph 1, The above sensor (430) is a sensor that measures atmospheric pressure, A sensor-speaker module (401) in which the air inlet passage formed between the opening (323) and the sensor (430) overlaps at least partially with the sound output passage formed between the opening (323) and the speaker.

3. In paragraph 2, The above speaker (420) is configured to generate vibration when moisture exists in the opening (323) to remove the moisture in the opening (323). The above sensor (430) is a sensor-speaker module (401) that detects the atmospheric pressure through the opening (323) from which the moisture has been removed.

4. In paragraph 1, The above module housing (410) is A module opening (412) opened toward the opening (323) of the device housing (320); and It includes a waterproof member (450) positioned along the outer perimeter of the above module opening (412), The above waterproof member (450) is a sensor-speaker module (401) that is in close contact with the inner surface of the device housing (320).

5. In paragraph 4, The above module opening (412) includes a first module opening (412a) connected to the first internal space (411a) and a second module opening (412b) connected to the second internal space (411b). The above bulkhead (440) is a sensor-speaker module (401) that forms a boundary between the first module opening (412a) and the second module opening (412b).

6. In paragraph 5, The sensor-speaker module (401) further includes a waterproof mesh (421) that closes the second module opening (412b).

7. In paragraph 5, The above sensor (430) is a sensor-speaker module (401) including a gel-filled atmospheric pressure sensor (430).

8. In paragraph 7, The sensor-speaker module (401) further includes an O-ring that seals between the inner surface of the device housing (320) and the partition wall (440) and the sensor (430) in the second internal space (411b).

9. In paragraph 1, The sensor-speaker module (401) further includes a flexible printed circuit board (402) on which the sensor (430) and the speaker (420) are arranged.

10. In paragraph 9, The flexible printed circuit board (402) further includes a sensor-speaker module (401) electrically connected to the sensor (430) and the speaker (420).

11. In an electronic device including a sensor-speaker module according to paragraph 1, Device housing (320); Including the sensor-speaker module (401) located inside the device housing (320), The above device housing (320) includes an opening (323) that forms a path through which sound generated from the speaker (420) is output to the outside, and the sensor is an electronic device that communicates with the opening (323) of the device housing (320).

12. In paragraph 11, The above sensor (430) is a sensor that measures atmospheric pressure, An electronic device in which the air inlet passage formed between the opening (323) and the sensor (430) overlaps at least partially with the sound output passage formed between the opening (323) and the speaker.

13. In paragraph 12, The above speaker (420) is configured to generate vibration when moisture exists in the opening (323) to remove the moisture in the opening (323). The above sensor (430) is an electronic device that detects the atmospheric pressure through the opening (323) from which the moisture has been removed.

14. In paragraph 11, The above module housing (410) is A module opening (412) corresponding to the opening (323) of the device housing (320); and An electronic device comprising a waterproof member (450) positioned between the outer perimeter of the module opening (412) and the inner surface of the device housing (320) including the opening (323).

15. In paragraph 14, The above module opening (412) includes a first module opening (412a) connected to the first internal space (411a) and a second module opening (412b) connected to the second internal space (411b). The above bulkhead (440) is an electronic device that forms a boundary between the first module opening (412a) and the second module opening (412b).

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