Display module and display screen

Abstract

A display module and a display screen, relating to the technical field of display devices. The display module comprises a plurality of display assemblies and a printed circuit board (10); the red display assembly (11) comprises a plurality of red flip chips (R) connected in series; the green display assembly (12) comprises a green flip chip (G); the blue display assembly (13) comprises a blue flip chip (B); and the light-emitting areas of the green flip chip (G) and the blue flip chip (B) are larger than those of the red flip chips (R). A plurality of red flip chips (R) connected in series, a green flip chip (G), and a blue flip chip (B) are arranged in the display module, so that the display module is adapted to voltage driving of a common driving power supply and is matched with the current electronic design, avoiding display color cast. The light-emitting areas of the green flip chip (G) and the blue flip chip (B) are larger than those of the red flip chips (R), so that the use of large-size red flip chips (R) having high costs is avoided while a normal display effect is ensured, thereby reducing the costs and meeting the outdoor or semi-outdoor display requirements.

Description

A display module and display screen

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 2024208888392, filed on April 23, 2024, entitled “A Display Module and Display Screen”, which is incorporated herein by reference in its entirety. Technical Field

[0003] This application relates to the field of display device technology, and in particular to a display module and display screen. Background Technology

[0004] Currently, most Micro LED in Package (MiP) display modules or Chip-On-Board (COB) display modules are used indoors due to their brightness and cost considerations, and are rarely used outdoors or semi-outdoors.

[0005] To address the high brightness requirements of outdoor and semi-outdoor displays, there are two main approaches: using a custom-developed large-size flip-chip (1R1G1B) and using a custom-developed 2R2G2B flip-chip. Both methods can achieve sufficient brightness for outdoor or semi-outdoor displays. However, the large-size flip-chip using the 1R1G1B is more expensive, while the 2R2G2B flip-chip suffers from poor compatibility with electronic designs, resulting in suboptimal display quality.

[0006] Given the above problems, how to solve the high cost and poor display effect of flip chips currently used for outdoor or semi-outdoor displays is an urgent problem for technicians in this field. Summary of the Invention

[0007] The purpose of this application is to provide a display module and display screen to solve the problems of high cost and poor display effect of current flip-chip displays used for outdoor or semi-outdoor displays.

[0008] To address the aforementioned technical problems, this application provides a display module, comprising: multiple display components and a PCB board; the display components specifically include a red display component, a green display component, and a blue display component;

[0009] Each of the aforementioned display components is electrically connected to the PCB board;

[0010] The red display component includes multiple red flip chips connected in series, the green display component includes one green flip chip, and the blue display component includes one blue flip chip; the light-emitting area of ​​the green flip chip and the light-emitting area of ​​the blue flip chip are both larger than the light-emitting area of ​​the red flip chip.

[0011] In some embodiments, the number of red flip chips in the red display component is two, and they are arranged side by side in the same plane.

[0012] In some embodiments, one side of the PCB board has a plurality of display modules consisting of a red display component, a green display component, and a blue display component;

[0013] The display components in the display module are arranged in parallel.

[0014] In some embodiments, the display modules are arranged in a matrix on one side of the PCB board.

[0015] In some embodiments, the display module further includes: a plurality of driving devices;

[0016] Each of the driving devices corresponds to each of the display components and is electrically connected to the corresponding display component.

[0017] In some embodiments, each of the driving devices is disposed on another surface of the PCB board opposite to each of the display modules.

[0018] In some embodiments, the display module further includes: a plurality of white display components;

[0019] Each of the white display components is respectively disposed in each of the display modules and arranged in parallel with the other display components in the display module.

[0020] In some embodiments, the light-emitting area of ​​the red flip chip ranges from 3mil×5mil to 4mil×8mil.

[0021] In some embodiments, the red display component, the green display component, and the blue display component have the same length in the direction in which each of the red flip chips is connected in series.

[0022] To address the aforementioned technical problems, this application also provides a display screen, including the aforementioned display module.

[0023] This application provides a display module comprising multiple display components and a PCB board. The display components specifically include a red display component, a green display component, and a blue display component. Each display component is electrically connected to the PCB board. The red display component contains multiple red flip-chips connected in series, the green display component contains one green flip-chip, and the blue display component contains one blue flip-chip. The light-emitting areas of both the green and blue flip-chips are larger than those of the red flip-chip. Therefore, this solution is based on the principle that, under the same driving current, the driving voltage of the red flip-chip is lower than that of the green and blue flip-chips. By incorporating multiple red flip-chips, one green flip-chip, and one blue flip-chip in series within the display module, it can adapt to the voltage driving of commonly used power supplies, ensuring compatibility with current electronic designs and avoiding color distortion. Furthermore, since the light-emitting areas of both the green and blue flip-chips are larger than those of the red flip-chip, the use of a large, costly red flip-chip is avoided while maintaining normal display performance, thus reducing costs and meeting the display requirements for outdoor or semi-outdoor applications.

[0024] In addition, this application also provides a display screen, including the above-mentioned display module, with the same effect. Attached Figure Description

[0025] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 is a schematic diagram of a display module provided in an embodiment of this application;

[0027] Figure 2 is a schematic diagram of an outdoor or semi-outdoor display screen based on MiP provided in an embodiment of this application;

[0028] Figure 3 is a schematic diagram of an outdoor or semi-outdoor display screen based on COB provided in an embodiment of this application; and

[0029] Figure 4 is a schematic diagram of another display module provided in an embodiment of this application.

[0030] Reference numerals: 10: PCB board; 11: Red display component; 12: Green display component; 13: Blue display component; 14: MiP device; 15: White display component. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0032] The core of this application is to provide a display module and display screen to solve the problems of high cost and poor display effect of current flip-chip displays used for outdoor or semi-outdoor displays.

[0033] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] Currently, to meet the high brightness requirements of outdoor and semi-outdoor displays, there are two main types of displays: those using custom-developed large-size flip-chip chips (1R1G1B) and those using custom-developed flip-chip chips (2R2G2B). Both types can provide sufficient brightness for outdoor or semi-outdoor applications. However, the large-size flip-chip chip using the custom-developed 1R1G1B requires customized development, resulting in limited usage and higher costs. While the custom-developed 2R2G2B flip-chip reduces costs, it suffers from poor compatibility with electronic designs, leading to suboptimal display quality.

[0035] For example, the commonly used driving power supply voltage for LED displays is between 3.8V and 5.0V. The operating voltage of electronic components such as bus transceivers, horizontal output transistors, and driver ICs is at most 5.0V. However, the driving voltage for a 2R2G2B series combination requires approximately 5.5V, with the driving voltage for the green and blue flip chips even exceeding 6V. Therefore, the voltage of the 2R2G2B series combination is mismatched with the power supply voltage, resulting in insufficient green and blue voltage and a tendency for color distortion in the display.

[0036] In view of the above problems, this application provides a display module. Figure 1 is a schematic diagram of a display module provided in an embodiment of this application. As shown in Figure 1, the display module includes: multiple display components and a printed circuit board (PCB), i.e., PCB board 10; the display components specifically include a red display component 11, a green display component 12, and a blue display component 13;

[0037] Each display component is electrically connected to the PCB board 10;

[0038] Among them, the red display component 11 contains multiple red flip chips connected in series, the green display component 12 contains one green flip chip, and the blue display component 13 contains one blue flip chip; the light-emitting area of ​​the green flip chip and the light-emitting area of ​​the blue flip chip are both larger than the light-emitting area of ​​the red flip chip.

[0039] Specifically, the display module provided in this application consists of multiple display components and a PCB board 10, with each display component electrically connected to the PCB board 10. The display components specifically include a red display component 11, a green display component 12, and a blue display component 13, with each component forming a single-pixel structure. Furthermore, as shown in Figure 1, the red display component 11 contains a red flip chip (R), the green display component 12 contains a green flip chip (G), and the blue display component 13 contains a blue flip chip (B).

[0040] Table 1. Voltage diagram of a dual-crystal MiP / COB under a 3mA driving current.

[0041] As shown in Table 1, under the premise of a constant driving current, among the red, green, and blue flip-chip chips, the red flip-chip has the lowest forward driving voltage. Meanwhile, considering that the red flip-chip has the highest cost among the three types of flip-chips of the same size, in this application, the red display component 11 specifically includes multiple red flip-chips connected in series, the green display component 12 specifically includes one green flip-chip, and the blue display component 13 specifically includes one blue flip-chip. This arrangement allows the display module to adapt to the voltage drive of commonly used power supplies, ensuring compatibility with current electronic designs and avoiding color distortion.

[0042] Furthermore, to meet the requirements of outdoor or semi-outdoor displays, in this application, the light-emitting areas of both the green and blue flip-chips are larger than that of the red flip-chip; that is, the sizes of the green and blue flip-chips are both larger than the size of the red flip-chip. This ensures that the luminous brightness of multiple red flip-chips is the same as that of one green and one blue flip-chip, thus meeting the requirements of outdoor or semi-outdoor displays and avoiding color distortion.

[0043] It should be noted that this embodiment does not limit the specific number of red flip chips, but it is necessary to ensure that the driving voltage of multiple series-connected red flip chips is compatible with the voltage of commonly used driving power supplies; the specific size of the three types of chips, namely red flip chips, green flip chips and blue flip chips, is also not limited, but it is necessary to ensure that the size of the red flip chips does not require customized development, thereby reducing chip costs, depending on the specific implementation.

[0044] In this embodiment, based on the principle that the driving voltage of the red flip chip is lower than that of the green and blue flip chips under the same driving current, multiple red flip chips, one green flip chip, and one blue flip chip are connected in series in the display module. This allows for voltage driving by commonly used power supplies, ensuring compatibility with current electronic designs and avoiding color distortion. Furthermore, the light-emitting areas of the green and blue flip chips are both larger than those of the red flip chip. This avoids the use of expensive, large-size red flip chips while maintaining normal display performance, thus reducing costs and meeting the display requirements for outdoor or semi-outdoor applications.

[0045] Based on the above embodiments, in some embodiments, the number of red flip chips in the red display component 11 is two, and they are arranged side by side in the same plane.

[0046] Table 2. Schematic diagram of voltage values ​​of a display module under 3mA and 5mA drive currents.

[0047] Table 2 shows the driving voltage of the three display components under two different driving currents of 3mA and 5mA when there are two red flip chips. As shown in Table 2, the driving voltage of the three flip chips is below 5V under both driving currents, which is consistent with the voltage drive of commonly used power supplies. At the same time, since only two red flip chips are set in the red display component 11, the chip cost is greatly reduced.

[0048] Based on the above embodiments, in some embodiments, one side of the PCB board 10 has multiple display modules consisting of a red display component 11, a green display component 12 and a blue display component 13;

[0049] The display components in the display module are arranged in parallel.

[0050] To improve display quality, in this embodiment, one side of the PCB board 10 contains multiple display modules, each consisting of a red display component 11, a green display component 12, and a blue display component 13. Each display module has a single-pixel structure. The display components within the modules are arranged in parallel, resulting in a balanced display effect. Furthermore, in specific implementations, the red, green, and blue display components of the modules can be configured to have the same length in the direction in which the red flip-chips are connected in series, thereby avoiding monochromatic light overflow caused by inconsistent lengths of the light-emitting elements.

[0051] Furthermore, to ensure the display effect of the screen, the display modules are arranged in a matrix on one side of the PCB board 10. Since each display module is a pixel, and the multiple display components in each display module display different colors, the brightness adjustment between multiple display components can enable a display module to display richer colors, thereby enabling the screen composed of multiple display modules to display complex images.

[0052] To drive the display components in each display module, the display module also includes multiple driving devices. Each driving device corresponds to a display component and is electrically connected to its corresponding display component, thereby driving its respective display component. Furthermore, to better position the driving devices and prevent them from interfering with the display module's display, each driving device is specifically positioned on the opposite surface of the PCB board 10 from the display module, thus avoiding any impact on the display module's display. The following is a process for manufacturing an outdoor display screen based on the above embodiments:

[0053] Figure 2 is a schematic diagram of an outdoor or semi-outdoor display screen based on MiP provided in an embodiment of this application. To obtain the outdoor or semi-outdoor MiP display screen shown in Figure 2, the first step is to design and fabricate the carrier circuit. The carrier can be glass or Bismalleimide Triazine (BT) resin board, with a thickness typically between 0.1 mm and 0.2 mm. Next, die bonding is performed on the carrier. Based on the above embodiment, each pixel consists of two red flip chips, one green flip chip, and one blue flip chip. Then, molding and encapsulation are performed to protect the chips on the carrier. The encapsulation thickness is typically between 0.12 mm and 0.25 mm, thus obtaining a complete MiP board. The complete MiP board is cut into multiple MIP devices 14, and each MiP device 14 is tested, sorted, and packaged. Further, PCB driver mounting is performed on the LED board 10, where driver electronic components are fabricated and processed. Simultaneously, PCB LED surface MiP mounting is performed, attaching each MiP device 14 to the PCB board 10. After surface mounting, the LED PCB is molded, typically with an encapsulation thickness of 0.25mm to 0.5mm. The PCB is then cut to obtain the display modules, which are then coated with a nano-coating to provide UV resistance, moisture resistance, and a matte finish. Finally, multiple display modules are assembled into a cabinet, and these cabinets are joined together to form a display screen, resulting in a MiP display for outdoor or semi-outdoor applications.

[0054] Figure 3 is a schematic diagram of an outdoor or semi-outdoor COB-based display screen provided in an embodiment of this application. To obtain the outdoor or semi-outdoor COB display screen shown in Figure 3, the design and fabrication of the LED PCB circuit are first required. Further, the LED PCB driver is mounted, and the LED PCB surface is die-bonded. Based on the above embodiment, each pixel consists of two red flip chips, one green flip chip, and one blue flip chip. Then, molding and encapsulation are performed to protect the chips on the substrate; the encapsulation thickness is generally 0.15mm to 0.35mm. Next, the LED PCB process edge is cut to output the COB display modules, and a nano-coating process is applied to the surface of the COB display modules for UV resistance, moisture resistance, and a matte finish. Finally, multiple COB display modules are assembled into a cabinet, and multiple cabinets are spliced ​​together to form a display screen, resulting in an outdoor or semi-outdoor COB display screen.

[0055] Figure 4 is a schematic diagram of another display module provided in an embodiment of this application. In order to improve the display brightness of the display module, based on the above embodiments, in some embodiments, as shown in Figure 4, the display module further includes: a plurality of white display components 15.

[0056] Each white display component 15 is respectively disposed in each display module and arranged parallel to the other display components in the display module. Thus, each display module contains a red display component 11, a green display component 12, a blue display component 13 and a white display component 15. By adding the white display component 15, the display brightness of the display module can be effectively improved, so as to adapt to display scenarios in strong outdoor or semi-outdoor light conditions.

[0057] Based on the above embodiments, in some embodiments, the light-emitting area of ​​the red flip chip ranges from 3mil×5mil to 4mil×8mil. It is understood that 3mil×5mil to 4mil×8mil is the mainstream size of flip chips in the industry. By using the industry-standard red flip chip in this application, the high costs associated with customized chip development can be avoided.

[0058] Meanwhile, in this embodiment, the light-emitting areas of both the green and blue flip-chip chips are greater than 4mil × 8mil. In other words, the green and blue flip-chip chips used in this application are not mainstream flip-chip chips used in the industry; instead, they are custom-developed large-size flip-chip chips. Since the cost of custom-developing large-size green and blue flip-chip chips is lower than that of custom-developing red flip-chip chips, using these non-mainstream large-size green and blue flip-chip chips not only controls chip costs but also achieves excellent display effects, meeting the outdoor or semi-outdoor display requirements.

[0059] Finally, this application also provides a display screen, including the display module in the above embodiments. Specifically, based on the principle that the driving voltage of the red flip chip is less than that of the green and blue flip chips under the same driving current, by setting multiple red flip chips, one green flip chip, and one blue flip chip in series in the display module, it can adapt to the voltage drive of commonly used driving power supplies, match and be compatible with current electronic designs, and avoid color deviation in display. In addition, the light-emitting areas of the green and blue flip chips are both larger than those of the red flip chip. While ensuring normal display effect, it avoids the use of large-size red flip chips with higher costs, which not only reduces costs but also meets the display requirements for outdoor or semi-outdoor applications.

[0060] The foregoing has provided a detailed description of a display module and display screen provided in this application. The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

[0061] It should also be noted that relational terms such as "first" and "second" in the specification are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A display module, comprising: Multiple display components and printed circuit board (PCB) boards, Specifically, the display components include a red display component, a green display component, and a blue display component, each of which is electrically connected to the PCB board. The red display component includes multiple red flip chips connected in series, the green display component includes one green flip chip, and the blue display component includes one blue flip chip; the light-emitting area of ​​the green flip chip and the light-emitting area of ​​the blue flip chip are both larger than the light-emitting area of ​​the red flip chip.

2. The display module according to claim 1, wherein, The red display component contains two red flip chips, which are arranged side by side in the same plane.

3. The display module according to claim 1 or 2, wherein, One side of the PCB board has multiple display modules consisting of one red display component, one green display component, and one blue display component; The display components in the display module are arranged in parallel.

4. The display module according to claim 3, wherein, The display modules are arranged in a matrix on one side of the PCB board.

5. The display module according to claim 4, further comprising: Multiple drive units, Each of the driving devices corresponds to each of the display components and is electrically connected to the corresponding display component.

6. The display module according to claim 5, wherein, Each of the driving devices is disposed on the other surface of the PCB board opposite to each of the display modules.

7. The display module according to any one of claims 3 to 6, further comprising: Multiple white display components, Each of the white display components is respectively disposed in each of the display modules and arranged in parallel with the other display components in the display module.

8. The display module according to any one of claims 1 to 7, wherein, The light-emitting area of ​​the red flip chip ranges from 3mil×5mil to 4mil×8mil.

9. The display module according to any one of claims 3 to 8, wherein, The red display component, the green display component, and the blue display component have the same length in the direction in which each of the red flip chips is connected in series.

10. The display module according to any one of claims 7 to 9, wherein, The display module has a single-pixel structure.

11. The display module according to any one of claims 8 to 10, wherein, The light-emitting area of ​​both the green flip chip and the blue flip chip is greater than 4mil × 8mil.

12. The display module according to any one of claims 8 to 11, wherein, The driving voltage of the red flip chip is lower than that of the green flip chip and the blue flip chip.

13. A display screen comprising the display module according to any one of claims 1 to 12.

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