Communication terminal

Abstract

The present application provides a communication terminal. An antenna system of the communication terminal comprises at least three radiators and at least two isolation reconstruction circuits. Each isolation reconstruction circuit is arranged between two adjacent radiators, and comprises at least two working states. In different working states, the isolation between radiators at two ends of each isolation degree reconstruction circuit is different. The at least three radiators include a first radiator, a second radiator and a third radiator which are sequentially and adjacently arranged, and the at least two isolation reconstruction circuits include a first isolation reconstruction circuit and a second isolation reconstruction circuit. The first isolation reconstruction circuit is arranged between the first radiator and the second radiator and used for adjusting the isolation between the first radiator and the second radiator, and the second isolation reconstruction circuit is arranged between the second radiator and the third radiator and used for adjusting the isolation between the second radiator and the third radiator. The communication terminal in the present application has a strong communication capability.

Description

A communication terminal

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410532454.7, filed on April 26, 2024, with the State Intellectual Property Office of the People's Republic of China, entitled "A Communication Terminal," the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of communication technology, and in particular to a communication terminal. Background Technology

[0004] With the rapid development of communication technology and the widespread adoption of smartphones, people's demands for mobile terminals are increasing, especially regarding their communication capabilities. Since mobile terminals achieve their communication capabilities through antenna systems, improving the performance of these systems is a crucial development direction in this field.

[0005] Currently, mobile terminal antenna systems typically include multiple radiators, which may operate simultaneously or asynchronously. Isolation between multiple simultaneously operating radiators is a significant challenge for antennas. Existing technologies improve the isolation between adjacent radiators by adding modules to enhance isolation. However, this approach sacrifices antenna system performance in certain application scenarios, such as when adjacent radiators do not operate simultaneously. Furthermore, this solution can only improve isolation within a single frequency band, ultimately limiting the communication performance of the mobile terminal. Summary of the Invention

[0006] The communication terminal provided in this application includes an antenna system, and the communication capability of the communication terminal is enhanced by improving the isolation adjustment capability of the antenna system.

[0007] This application provides a communication terminal. The communication terminal includes an antenna system for implementing the communication function of the terminal. The antenna system includes at least three radiators and at least two isolation reconstruction circuits. Each isolation reconstruction circuit is disposed between two adjacent radiators, and each isolation reconstruction circuit includes at least two operating states. The isolation between the radiators at both ends of the isolation reconstruction circuit differs in different operating states. Therefore, in this application, the isolation between the radiators located at both ends of the isolation reconstruction circuit can be adjusted by adjusting the operating state of the isolation reconstruction circuit.

[0008] Specifically, the aforementioned at least three radiators include a first radiator, a second radiator, and a third radiator arranged sequentially adjacent to each other, and the at least two isolation degree reconstruction circuits include a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit. The first isolation degree reconstruction circuit is disposed between the first radiator and the second radiator and is used to adjust the isolation degree between the first radiator and the second radiator. The second isolation degree reconstruction circuit is disposed between the second radiator and the third radiator and is used to adjust the isolation degree between the second radiator and the third radiator.

[0009] In this application, each isolation reconfiguration circuit includes at least two operating states. The isolation between the radiators at both ends of the isolation reconfiguration circuit differs depending on the operating state. Therefore, the operating state of the isolation reconfiguration circuit can be adjusted according to actual needs, allowing the isolation between the radiators at both ends to be adjusted as required, thereby regulating the communication performance of the antenna system. For example, this solution can improve the communication performance of the radiators in different operating modes within the antenna system; improve the isolation at different operating frequency bands; and enhance the communication capabilities of the communication terminal.

[0010] In the specific technical solution, each isolation reconstruction circuit has different capacitance and / or inductance values ​​in different operating states, resulting in different isolation between the radiators at both ends of the isolation reconstruction circuit.

[0011] In specific implementations, each isolation reconfiguration circuit includes a variable capacitor; and / or, the isolation reconfiguration circuit includes a switch and an inductor; and / or, the isolation reconfiguration circuit includes a switch and a capacitor. For ease of description, the isolation reconfiguration circuit is considered to include an adjustable component capable of adjusting the capacitance or inductance value between the radiators connected to both ends of the isolation reconfiguration circuit. The adjustable component can be a variable capacitor, a combination of a switch and an inductor, a combination of a switch and a capacitor, or a device. In some embodiments, the isolation reconfiguration circuit includes one adjustable component, or it may also include a combination of at least two adjustable components.

[0012] The aforementioned communication terminal includes a main chip and an RF chip connected together. Each radiator and each isolation reconfiguration circuit are connected to the RF chip. The main chip controls the RF chip to switch the operating state of the isolation reconfiguration circuit. Specifically, the main chip can be a system-on-a-chip (SoC), and the RF chip can be part of an antenna system. Each radiator is connected to the RF chip, and different radiators function as different antennas.

[0013] The aforementioned main chip controls the RF chip to adjust the operating state of each isolation reconstruction circuit based on whether the individual radiators of the antenna system are operational. For example, it adjusts the operating state of the isolation reconstruction circuit by considering various combinations of radiators operating, some not operating, or all operating. Essentially, the adjustment of the operating state of each isolation reconstruction module is based on the operational status of the radiators at both ends of that module. This results in different combinations of radiators operating in the antenna system, adjusting the operating state of each isolation reconstruction circuit to ensure the antenna system performs well under various conditions, thus improving the communication capabilities of the communication terminal.

[0014] Furthermore, the aforementioned main chip is also used to control the RF chip to adjust the operating state of each isolation reconstruction circuit according to the operating frequency band of each radiator in the antenna system. In some technical solutions, the operating frequency bands of adjacent radiators in the antenna system can also change. This application can also adjust the operating state of the isolation reconstruction module according to the change in the operating frequency band of the radiators in the antenna system. It is understood that the adjustment of the operating state of each isolation reconstruction module is mainly based on the change in the operating frequency band of the radiators at both ends of the isolation reconstruction module. This enables the antenna system to have good working performance in various operating frequency bands, improving the communication capability of the communication terminal.

[0015] In the specific technical solution, the aforementioned radio frequency (RF) chip includes a first RF chip, a second RF chip, and a third RF chip. The feed point of the first radiator is connected to the first RF chip, the feed point of the second radiator is connected to the second RF chip, and the feed point of the third radiator is connected to the third RF chip. It is evident that the first, second, and third radiators are all connected to the chip and can operate independently.

[0016] In one optional technical solution, the first RF chip, the second RF chip, and the third RF chip are the same RF chip, making the first radiator, the second radiator, and the third radiator part of the same communication system.

[0017] Alternatively, in one optional technical solution, the first RF chip and the third RF chip are the same RF chip and are in the same communication system; or the first RF chip and the second RF chip are different RF chips and are in different communication systems, and the third radiator and the second radiator are also connected to different RF chips and are in different communication systems.

[0018] Alternatively, in an alternative technical solution, the first radio frequency chip, the second radio frequency chip, and the third radio frequency chip are three different radio frequency chips, and the first radiator, the second radiator, and the third radiator are located in different communication systems.

[0019] In summary, the technical solution provided in this application can be adopted in various situations, enabling the communication terminal to adjust the working state of the isolation reconfiguration circuit according to requirements under various conditions, thereby giving the communication terminal better communication capabilities.

[0020] In one technical solution, a first switch is provided between the feed point of the second radiator and the second RF chip, or a second switch is provided between the ground point of the second radiator and the ground. Thus, the second radiator can operate or not operate as needed. For example, in one case, when the first, second, and third radiators are all operating, the first isolation reconstruction circuit is in a first operating state, and the second isolation reconstruction circuit is in a second operating state. In another case, when the first and third radiators are both operating, and the second radiator is not operating, the first isolation reconstruction circuit is in a third operating state, and the second isolation reconstruction circuit is in a fourth operating state. The isolation between the first and second radiators in the first operating state is greater than the isolation between the first and second radiators in the third operating state. The isolation between the second and third radiators in the second operating state is greater than the isolation between the second and third radiators in the fourth operating state. This application adjusts the isolation of the antenna system by regulating the operating state of the isolation reconstruction circuit, thereby adapting the isolation to different states of the antenna system. This ensures that the antenna system has good radiation efficiency in different states, and optimizes and balances the antenna performance in different states, thus improving the communication capability of the communication terminal.

[0021] Specifically, the aforementioned first switch is reused as the switch for the first isolation degree reconstruction circuit. This reduces the size of the antenna system, decreases the space occupied by the antenna system, and improves the integration of the communication terminal.

[0022] In one technical solution, a third switch is provided between the feed point of the third radiator and the third RF chip, or a fourth switch is provided between the ground point of the third radiator and the ground. Thus, the third radiator can operate or not operate as needed. For example, in one case, when the first, second, and third radiators are all operating, the second isolation reconstruction circuit is in its fifth operating state. In another case, when the first and second radiators are both operating, but the third radiator is not operating, the second isolation reconstruction circuit is in its sixth operating state. The isolation between the second and third radiators in the fifth operating state is greater than the isolation between the second and third radiators in the sixth operating state. This technical solution can also adjust the isolation of the antenna system according to different states by adjusting the operating state of the isolation reconstruction circuit, so that the antenna system can have good radiation efficiency in different states, and the antenna performance of the antenna system in different states can be optimized and balanced, improving the communication capability of the communication terminal.

[0023] The aforementioned third switch can also be reused as a switch for the second isolation degree reconfiguration circuit, thereby reducing the size of the antenna system, reducing the space occupied by the antenna system, and improving the integration of the communication terminal.

[0024] Each isolation reconstruction circuit includes at least three operating states. This allows for multiple reconstruction schemes of the isolation between the radiators on both sides of the isolation reconstruction circuit, enabling the antenna system to perform well in a wide range of operating scenarios.

[0025] When the radiators at both ends of the isolation reconstruction circuit operate in the same or adjacent frequency bands, the circuit performs better. For example, when the first radiator and the second radiator operate simultaneously, the first radiator operates in the first frequency band, and the second radiator operates in the second frequency band. Specifically, the first and second frequency bands at least partially overlap; or, the lowest frequency of the first frequency band is greater than the highest frequency of the second frequency band, and the difference between the lowest frequency of the first frequency band and the highest frequency of the second frequency band is less than or equal to twice the highest frequency of the second frequency band; or, the highest frequency of the first frequency band is less than the lowest frequency of the second frequency band, and the difference between the highest frequency of the first frequency band and the lowest frequency of the second frequency band is less than or equal to twice the highest frequency of the first frequency band.

[0026] When the second and third radiators operate simultaneously, the second radiator operates in the third frequency band, and the third radiator operates in the fourth frequency band. Specifically, the third and fourth frequency bands at least partially overlap; or, the lowest frequency of the third frequency band is greater than the highest frequency of the fourth frequency band, and the difference between the lowest frequency of the third frequency band and the highest frequency of the fourth frequency band is less than or equal to twice the highest frequency of the fourth frequency band; or, the highest frequency of the third frequency band is less than the lowest frequency of the fourth frequency band, and the difference between the highest frequency of the third frequency band and the lowest frequency of the fourth frequency band is less than or equal to twice the highest frequency of the third frequency band.

[0027] The connection point between the first isolation degree reconstruction circuit and the first radiator is located at the end of the first radiator facing the second radiator, and the connection point between the first isolation degree reconstruction circuit and the second radiator is located at the end of the second radiator facing the first radiator. Similarly, the connection point between the second isolation degree reconstruction circuit and the second radiator is located at the end of the second radiator facing the third radiator, and the connection point between the second isolation degree reconstruction circuit and the third radiator is located at the end of the third radiator facing the second radiator. The isolation degree reconstruction circuit is connected to the ends of the radiators facing the isolation degree reconstruction circuit at both ends to minimize the length of the connection line between the isolation degree reconstruction circuit and the radiators.

[0028] The isolation reconstruction circuit in this application has relatively close connection line lengths between itself and the radiators at both ends, which facilitates the formation of a symmetrical structure and improves the communication performance of the antenna system. Specifically, the first isolation reconstruction circuit is connected to the first radiator via a first connection line, and to the second radiator via a second connection line. The lengths L1 and L2 of the first and second connection lines satisfy |L1-L2|≤10%*L1. The second isolation reconstruction circuit is connected to the second radiator via a third connection line, and to the third radiator via a fourth connection line. The lengths L3 and L4 of the third and fourth connection lines satisfy |L3-L4|≤10%*L3.

[0029] The specific type of radiator in this application can be selected in various ways. For example, one of the multiple radiators may be a type I radiator, a type II radiator, a type III radiator, a type IV radiator, or a type V radiator. The first type of radiator has an electrical length of 1 / 2 the dielectric wavelength, and both ends of the first type of radiator are open terminals; the second type of radiator has an electrical length of 1 / 2 the dielectric wavelength, both ends of the second type of radiator are open terminals, and the middle of the second type of radiator is grounded; the third type of radiator has an electrical length of 1 / 4 the dielectric wavelength, and one end of the third type of radiator is grounded, while the other end is open; the fourth type of radiator includes a first sub-radiator and a second sub-radiator, with a first gap between the first and second sub-radiators, the end of the first sub-radiator furthest from the first gap being grounded, and the end of the second sub-radiator furthest from the first gap being grounded; the fifth type of radiator includes a third, fourth, and fifth sub-radiator arranged sequentially, with a second gap between the third and fourth sub-radiators, and a third gap between the fourth and fifth sub-radiators; the dielectric wavelength is the dielectric wavelength corresponding to the frequency of the radiator within its operating frequency band. Different radiators can be of the same type or different types of radiators, and this application does not impose any restrictions on this. Attached Figure Description

[0030] Figure 1 is a schematic diagram of a communication terminal in an embodiment of this application;

[0031] Figure 2 is a schematic diagram of the antenna system of the communication terminal in an embodiment of this application;

[0032] Figure 3 is a control schematic diagram of an antenna system in an embodiment of this application;

[0033] Figure 4 is a partial structural diagram of a communication terminal in an embodiment of this application;

[0034] Figure 5 is a framework design diagram of the first radiator, the second radiator, and the first isolation degree reconstruction circuit in an embodiment of this application.

[0035] Figure 6 is a framework design diagram of the first radiator, the second radiator, and the first isolation degree reconstruction circuit in an embodiment of this application.

[0036] Figure 7 is a schematic diagram of the return loss of an antenna of a first radiator without a first isolation degree reconstruction circuit in an embodiment of this application.

[0037] Figure 8 is a schematic diagram of the return loss of an antenna of a third radiator without a second isolation degree reconstruction circuit in an embodiment of this application;

[0038] Figure 9 is a schematic diagram of antenna return loss in an antenna system with a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit in an embodiment of this application;

[0039] Figure 10 is a schematic diagram of antenna return loss in an antenna system with a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit in an embodiment of this application.

[0040] Figure 11 is a schematic diagram of antenna return loss in an antenna system with a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit in an embodiment of this application;

[0041] Figure 12 is a schematic diagram of antenna return loss in an antenna system with a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit in an embodiment of this application;

[0042] Figure 13 is a schematic diagram of the antenna return loss of a third radiator without the first isolation degree reconstruction circuit and the second isolation degree reconstruction circuit in an embodiment of this application.

[0043] Figure 14 is a schematic diagram of antenna return loss in an antenna system with a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit in an embodiment of this application.

[0044] Figure 15 is a schematic diagram of antenna return loss in an antenna system with a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit in an embodiment of this application.

[0045] Figure 16 is a schematic diagram of two radiators and an isolation reconfiguration circuit of the antenna system in an embodiment of this application;

[0046] Figure 17 is a schematic diagram of the structure of a radiator of the antenna system in an embodiment of this application;

[0047] Figure 18 is a schematic diagram of the structure of a radiator of the antenna system in an embodiment of this application;

[0048] Figure 19 is a schematic diagram of the structure of a radiator of the antenna system in an embodiment of this application;

[0049] Figure 20 is a schematic diagram of the structure of a radiator of the antenna system in an embodiment of this application;

[0050] Figure 21 is a schematic diagram of the structure of a radiator of the antenna system in an embodiment of this application.

[0051] Reference numerals: 100-Cover plate; 200-Display / module; 300-Printed circuit board; 400-Middle frame; 500-Back cover; 600-Bezel; 3-Radiator; 31-First radiator; 32-Second radiator; 33-Third radiator; 34-Type I radiator; 35-Type II radiator; 36-Type III radiator; 37-Type IV radiator; 371-First sub-radiator; 372-Second sub-radiator; 373-First gap; 38-Type V radiator; 381-Third sub-radiator; 382-Fourth sub-radiator; 383-Fifth sub-radiator; 384-Second gap; 4-Isolation reconfiguration circuit; 41-First isolation reconfiguration circuit; 411-First capacitor; 412-First switch; 413-Inductor; 414-Second switch; 415 - Second capacitor; 416 - Third switch; 417 - First variable capacitor; 42 - Second isolation reconfiguration circuit; 421 - Second variable capacitor; 422 - Fourth switch; 423 - Wire; 424 - Fifth switch; 43 - Adjustable component;5-RF chip; 51-First RF chip; 52-Second RF chip; 53-Third RF chip; 6-Feed point. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0053] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0054] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0055] The following explains the terminology that may appear in the embodiments of this application.

[0056] Radiator: In an antenna, this is the device used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a specific polarization and radiated in the desired direction. The receiving radiator converts the electromagnetic wave energy of a specific polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0057] The radio frequency (RF) chip is the combination of all components of an antenna used for receiving and transmitting radio frequency waves. In the case of a receiving antenna, the RF chip can be considered as the antenna section from the first amplifier to the front-end transmitter. In a transmitting antenna, the RF chip can be seen as the section after the last power amplifier. In some cases, the RF chip can also be understood as the feed unit. The RF chip has the function of converting radio waves into electrical signals and sending them to the receiver components. Generally, it is considered as part of the antenna system 3, used for converting radio waves into electrical signals and vice versa. Maximum power transfer capability and efficiency should be considered when designing an antenna. For this purpose, the antenna feed impedance must be matched with the load resistance. The antenna feed impedance is a combination of resistance, capacitance, and inductance. To ensure maximum power transfer conditions, the two impedances (load resistance and feed impedance) should be matched. Matching can be achieved by considering frequency requirements and antenna design parameters (e.g., gain, directivity, and radiation efficiency).

[0058] Feed line: Also called a transmission line, it refers to the connection line between the antenna's radio frequency chip and the radiator. Depending on the frequency and form, the transmission line can directly transmit current waves or electromagnetic waves. The connection point on the radiator where it connects to the transmission line is usually called the feed point. Transmission lines include conductive transmission lines, coaxial transmission lines, waveguides, or microstrip lines, etc. Depending on the implementation, transmission lines can include bracket antenna bodies or glass antenna bodies, etc. Depending on the carrier, transmission lines can be implemented using LCP (Liquid Crystal Polymer), FPC (Flexible Printed Circuit), or PCB (Printed Circuit Board), etc.

[0059] Communication / Operating Frequency Band: Regardless of the type of antenna, it always operates within a certain frequency range (bandwidth). For example, an antenna supporting the B40 band operates within the frequency range of 2300MHz to 2400MHz, or in other words, its operating frequency band includes the B40 band. The frequency range that meets the specifications can be considered the antenna's operating frequency band. The width of the operating frequency band is called the operating bandwidth. The operating bandwidth of an omnidirectional antenna may reach 3-5% of the center frequency. The operating bandwidth of a directional antenna may reach 5-10% of the center frequency. Bandwidth can be considered as a frequency range on both sides of the center frequency (e.g., the resonant frequency of a dipole), where the antenna characteristics are within the acceptable range of the center frequency.

[0060] The resonant frequency band and the operating frequency band can be the same or different, or their frequency ranges can partially overlap. In one embodiment, the resonant frequency band of the antenna can cover multiple operating frequency bands of the antenna.

[0061] Medium wavelength: refers to the wavelength of electromagnetic waves propagating in a medium at the operating frequency band. For example, if the operating frequency band is [f1, f2], the corresponding medium wavelength is also the range [w1, w2]. Alternatively, to simplify calculations, the above-mentioned medium wavelength can also refer to the wavelength of electromagnetic waves propagating in the medium at the center frequency f0 of the operating frequency band. In this case, the medium wavelength is a specific value w0.

[0062] Antenna return loss: This can be understood as the ratio of the signal power reflected back to the antenna port after passing through the antenna circuit to the transmit power at the antenna port. The smaller the reflected signal, the larger the signal radiated into space through the antenna, and the higher the antenna's radiation efficiency. Conversely, the larger the reflected signal, the smaller the signal radiated into space through the antenna, and the lower the antenna's radiation efficiency.

[0063] Antenna return loss can be represented by the S11 parameter, which is one of the S-parameters. S11 represents the reflection coefficient, and this parameter characterizes the antenna's transmission efficiency.

[0064] In one embodiment, the S11 diagram can be understood as a schematic diagram representing the resonance generated by the antenna. In one embodiment, the resonance shown in the S11 diagram within the range of -6dB can be understood as the resonant frequency / frequency range / operating frequency band generated by the antenna. The S11 parameter is usually negative. The smaller the S11 parameter, the smaller the antenna return loss, the less energy reflected back by the antenna itself, which means more energy actually enters the antenna, and the higher the antenna radiation efficiency; the larger the S11 parameter, the greater the antenna return loss, and the lower the antenna radiation efficiency.

[0065] It should be noted that in engineering, an S11 value of -6dB is generally used as the standard. When the S11 value of an antenna is less than -6dB, the antenna can be considered to be working normally, or the antenna can be considered to have good transmission efficiency.

[0066] Radiation efficiency refers to the ratio of the power radiated by an antenna into space (i.e., the power effectively converted into electromagnetic waves) to the active power input to the antenna. The active power input to the antenna equals the antenna's input power minus the power loss. Power loss mainly includes return loss power, ohmic loss power of the metal, and / or dielectric loss power. Both metal loss and dielectric loss are factors affecting radiation efficiency.

[0067] Those skilled in the art will understand that radiation efficiency is generally expressed as a percentage, and there is a corresponding conversion relationship between it and dB. The closer the radiation efficiency is to 0 dB, the better the radiation efficiency of the antenna.

[0068] dB: This stands for decibel, a logarithmic concept with base 10. Decibels are used to evaluate the proportional relationship between two physical quantities; they themselves have no physical dimensions. For every 10-fold increase in the ratio between two quantities, their difference can be expressed as 10 decibels. For example: A = 100, B = 10, C = 5, D = 1, then A / D = 20 dB; B / D = 10 dB; C / D = 7 dB; B / C = 3 dB. In other words, a 10-decibel difference between two quantities is a 10-fold difference, a 20-decibel difference is a 100-fold difference, and so on. A 3-decibel difference is a 2-fold difference between the two quantities.

[0069] The term "end" in the context of the main radiator's first / second / third / fourth / grounded / open ends should not be narrowly interpreted as a point or end physically disconnected from other radiators. It can also refer to a segment of the main radiator including the first endpoint, which is the endpoint of the main radiator at the gap. For example, the first end of the main radiator can be considered a segment of the main radiator within a range of one-eighth of a first wavelength from the first endpoint. The first wavelength can be the wavelength corresponding to the operating frequency band of the main radiator, the wavelength corresponding to the center frequency of the operating frequency band, or the wavelength corresponding to the resonant point. In one embodiment, "end / point" can include a connection / coupling region on the radiator that is coupled to other conductive structures. For example, a feed end / feed point can be a coupling region on the antenna radiator that is coupled to a feed structure (e.g., a region facing a part of the feed structure). Similarly, a ground end / grounding point can be a connection / coupling region on the antenna radiator that is coupled to a ground structure.

[0070] Open and Closed Terminals: In some embodiments, open and closed terminals are defined relative to whether or not they are grounded; the closed terminal is grounded, and the open terminal is not grounded. In one embodiment, the open terminal may also be referred to as a floating terminal, a free terminal, an open terminal, or an open-circuit terminal. In one embodiment, the closed terminal may also be referred to as a grounded terminal or a short-circuit terminal. It should be understood that in some embodiments, other conductors can be coupled through the open terminal to transfer coupled energy (which can be understood as transferring current).

[0071] In some embodiments, the open end and the closed end are, for example, relative to other conductors, with the closed end electrically connected to other conductors and the open end not electrically connected to other conductors.

[0072] To put it simply, the "open end" of a radiator can be defined as one end of the radiator that is spaced apart from the floor or coupled to the floor through a capacitive device.

[0073] To put it simply, the "grounding terminal" of a radiator can be understood as: if one end of the radiator is directly connected to the floor or coupled to the floor through an inductive device, it can be regarded as the grounding terminal of the radiator.

[0074] In some embodiments, the understanding of "closed end" can also be from the perspective of current distribution. A closed end or ground end can be understood as a point of high current or low electric field on a radiator. In one embodiment, coupling electronic devices (e.g., inductive devices) through a closed end can maintain the current distribution characteristics of the point of high current / low electric field. In one embodiment, opening a slit at or near the closed end (e.g., filling the slit with insulating material) can maintain the current distribution characteristics of the point of high current / low electric field.

[0075] In some embodiments, the understanding of "open terminal" can also be from the perspective of current distribution. An open terminal or a floating terminal can be understood as a point with a small current or a point with a large electric field on the radiator. In one embodiment, coupling electronic devices (e.g., capacitive devices) through an open terminal can maintain the current distribution characteristics of the point with a small current or a large electric field.

[0076] It should be understood that when an electronic device (e.g., capacitor, inductor, etc.) is coupled at the radiator end of a gap (which, from the perspective of the radiator's structure, resembles a radiator at the opening of an open or suspended end), the radiator end can be a point with a large current / small electric field. In this case, it should be understood that the radiator end at the gap is actually a closed end or a grounded end, etc.

[0077] Capacitance: can be understood as lumped capacitance and / or distributed capacitance. Lumped capacitance includes capacitive components, such as capacitor elements; distributed capacitance (or distributed capacitance) includes the equivalent capacitance formed by two conductive components separated by a certain gap.

[0078] Electrical length: Electrical length can be expressed as the ratio of physical length (i.e., mechanical length or geometric length) multiplied by the time it takes for an electrical or electromagnetic signal to travel in a medium to the time required for that signal to travel a distance in free space equal to the physical length of the medium. Electrical length can be expressed by the following formula:

[0079] Where L is the physical length, a is the transmission time of the electrical or electromagnetic signal in the medium, and b is the transmission time in free space.

[0080] Alternatively, electrical length can also refer to the ratio of physical length (i.e., mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave, and electrical length can satisfy the following formula:

[0081] Where L is the physical length and λ is the wavelength of the electromagnetic wave.

[0082] In some embodiments of this application, the physical length of the radiator can be understood as within ±20% of the electrical length of the radiator, for example, within ±10% or within ±5%.

[0083] In the embodiments of this application, the wavelength in a certain wavelength mode of the antenna (such as half-wavelength mode, etc.) can refer to the wavelength of the signal radiated by the antenna. It should be understood that the wavelength of the radiated signal in air can be calculated as follows: wavelength = speed of light / frequency, where the frequency is the frequency of the radiated signal. The wavelength of the radiated signal in a medium can be calculated as follows: wavelength = (speed of light / √ε) / frequency, where ε is the relative permittivity of the medium, and the frequency is the frequency of the radiated signal.

[0084] To facilitate understanding of the communication terminal provided in this application embodiment, its application scenario is first introduced below. The communication terminal in this application embodiment refers to a terminal with communication functions. Specifically, it can refer to a communication terminal employing one or more of the following communication technologies: Bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, Wireless Fidelity (WiFi) communication technology, Global System for Mobile Communications (GSM) communication technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5G communication technology, and other future communication technologies. The communication terminal in this application embodiment can include a fixed terminal or a mobile terminal. For example, a mobile terminal can be a mobile phone, tablet computer, laptop computer, smart bracelet, smartwatch, smart helmet, and smart glasses; a fixed terminal can be a router, smart TV, smart home device, smart speaker, and desktop computer. In addition, the aforementioned communication terminal may also be a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, a communication terminal in a 5G network, or a communication terminal in a future evolved public land mobile network (PLMN), etc., and the embodiments of this application are not limited to this.

[0085] Figure 1 exemplarily illustrates a communication terminal provided in an embodiment of this application, using a mobile phone as an example. As shown in Figure 1, in one embodiment, the communication terminal includes a cover 100, a display / module 200, a printed circuit board (PCB) 300, a middle frame 400, and a rear cover 500. It should be understood that in some embodiments, the cover 100 may be a glass cover, or it may be replaced with a cover made of other materials, such as an ultra-thin glass cover, a PET (Polyethylene terephthalate) cover, etc. In one embodiment, the cover 100, the middle frame 400, and the rear cover 500 can all be considered as part of the housing.

[0086] The cover plate 100 can be set close to the display screen 200, and can be mainly used to protect the display screen 200 from dust.

[0087] In one embodiment, the display screen 200 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., and this application does not limit it.

[0088] The mid-frame 400 primarily serves to support the entire device. Figure 1 shows the PCB 300 positioned between the mid-frame 400 and the back cover 500. It should be understood that in one embodiment, the PCB 300 may also be positioned between the mid-frame 400 and the display screen 200; this application does not impose any limitations on this. The printed circuit board PCB 300 can be made of flame-retardant material (FR-4), Rogers dielectric material, or a hybrid of Rogers and FR-4 dielectric materials, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric material is a high-frequency board. Electronic components, such as radio frequency chips, are mounted on the PCB 300.

[0089] In one embodiment, a metal layer may be disposed on the printed circuit board 300. This metal layer can be used to ground electronic components carried on the PCB 300, or to ground other components such as bracket antennas, frame antennas, etc. This metal layer can be referred to as a ground plane, grounding plate, or grounding layer. In one embodiment, this metal layer can be formed by etching metal onto the surface of any dielectric substrate in the PCB 300. In one embodiment, the grounding metal layer can be disposed on the side of the PCB 300 near the middle frame 400. In one embodiment, the edge of the PCB 300 can be considered as the edge of its grounding layer. In one embodiment, the metal middle frame 400 can also be used for grounding the aforementioned components. The communication terminal may also have other ground planes / grounding plates, as previously described, and will not be repeated here.

[0090] The communication terminal may also include a battery (not shown in the figure). The battery may be disposed between the middle frame 400 and the back cover 500, or between the middle frame 400 and the display screen 200; this application does not impose any limitations on this. In some embodiments, the PCB 300 is divided into a motherboard and a daughterboard, and the battery may be disposed between the motherboard and the daughterboard. Specifically, the motherboard may be disposed between the middle frame 400 and the upper edge of the battery, and the daughterboard may be disposed between the middle frame 400 and the lower edge of the battery.

[0091] The communication terminal may also include a frame 600, which may be formed of a conductive material such as metal. The frame 600 may be disposed between the display screen 200 and the back cover 500 and extend circumferentially around the periphery of the communication terminal. The frame 600 may have four sides surrounding the display screen 200 to help secure the display screen 200. In one implementation, the frame 600 made of metal can be directly used as the metal frame of the communication terminal, forming a metal frame appearance, suitable for industrial design (ID). In another implementation, the outer surface of the frame 600 may also be made of a non-metallic material, such as a plastic frame, forming a non-metallic frame appearance, suitable for non-metallic ID.

[0092] The middle frame 400 may include a border 600. The middle frame 400, including the border 600, is a single unit that supports the electronic components in the device. The cover plate 100 and the rear cover 500 respectively cover the upper and lower edges of the border to form the outer shell or housing of the communication terminal. Alternatively, the border 600 may not be considered part of the middle frame 400. In one embodiment, the border 600 may be connected to the middle frame 400 and integrally formed. In another embodiment, the border 600 may include an inwardly extending protrusion to connect with the middle frame 400, for example, by means of spring clips, screws, welding, etc. In one embodiment, the cover plate 100, the rear cover 500, the border 600, and the middle frame 400 may be collectively referred to as the outer shell or housing of the communication terminal. It should be understood that "outer shell or housing" can be used to refer to part or all of any one of the cover plate 100, rear cover 500, frame 600 or middle frame 400, or to part or all of any combination of the cover plate 100, rear cover 500, frame 600 or middle frame 400.

[0093] The back cover 500 can be made of metal; it can also be made of non-conductive materials, such as glass or plastic; or it can be made of both conductive and non-conductive materials.

[0094] In one embodiment, the frame 600 can at least partially function as a radiator to receive / transmit radio frequency signals. This portion of the frame acting as the radiator may have gaps between itself and other parts of the middle frame 400, or between itself and the middle frame 400, thereby ensuring a good radiation environment for the radiator. In one embodiment, an aperture may be provided near this portion of the frame acting as the radiator. In one embodiment, the aperture may include an aperture located inside the communication terminal, for example, an aperture not visible from the exterior of the communication terminal. In one embodiment, the internal aperture may be formed by any one or more of the middle frame, battery, circuit board, back cover, display screen, and other internal conductive components; for example, the internal aperture may be formed by a structural component of the middle frame. In one embodiment, the aperture may also include a slot / slit / opening on the frame 600. In one embodiment, the slot / slit / opening on the frame 600 may be a slit formed on the frame, dividing the frame 600 into two parts without a direct connection at the slit. In one embodiment, the aperture may also include a slot / slit / opening on the back cover 500 or the display screen 200. In one embodiment, the back cover 500 includes a conductive material, and the apertures provided in the conductive material can communicate with the slots or breaks in the frame to form a continuous aperture on the surface of the communication terminal.

[0095] In one embodiment, the radiator of the communication terminal may also be disposed within the frame 600. The frame 600 comprises a non-conductive material, and the radiator of the antenna may be located within the communication terminal and disposed along the frame 600, or the radiator may be at least partially embedded within the non-conductive material of the frame. In one embodiment, the radiator is disposed close to the non-conductive material of the frame 600 to minimize the volume occupied by the radiator and to be closer to the outside of the communication terminal, thereby achieving better signal transmission performance. It should be noted that "disposed close to the frame 600" means that the radiator can be disposed tightly against the frame 600, or it can be disposed close to the frame 600, for example, there may be a small gap between the radiator and the frame 600.

[0096] In one embodiment, the radiator of the communication terminal may also be disposed within the housing, such as a bracket antenna (not shown in Figure 1). A gap may exist between the radiator disposed within the housing and other conductive components inside the housing, thereby ensuring a good radiation environment for the radiator. In one embodiment, an aperture may be disposed near the radiator. In one embodiment, the aperture may include an aperture disposed inside the communication terminal, for example, an aperture not visible from the exterior of the communication terminal. In one embodiment, the internal aperture may be formed by any one or more of the frame, mid-frame, battery, circuit board, back cover, display screen, and other internal conductive components; for example, the internal aperture may be formed by a structural component of the mid-frame. In one embodiment, the aperture may also include a slot / slit / opening on the frame 600. In one embodiment, the slot / slit / opening on the frame 600 may be a slit formed on the frame, at which the frame 600 is divided into two parts without a direct connection. In one embodiment, the aperture may also include a slot / slit / opening on the back cover 500 or the display screen 200. In one embodiment, the back cover 500 includes a conductive material, and the apertures formed in the conductive material can communicate with the slots or breaks in the frame to form continuous apertures on the surface of the communication terminal. In one embodiment, the apertures on the back cover 500 or the display screen can also be used to house other devices, such as cameras, and / or sensors, and / or microphones, and / or speakers, etc.

[0097] In one embodiment, the antenna can be based on a flexible printed circuit (FPC), a laser-direct structuring (LDS) antenna, or a microstrip disk antenna (MDA). In another embodiment, the antenna can be a transparent or semi-transparent structure embedded inside the screen of the communication terminal, making it a transparent antenna element embedded inside the screen of the communication terminal.

[0098] Figure 1 only schematically shows some of the components included in the communication terminal; the actual shape, size, and construction of these components are not limited to those in Figure 1.

[0099] Furthermore, Figure 1 shows only one possible form of the communication terminal. In other embodiments, the communication terminal may also be a foldable mobile terminal.

[0100] Figure 2 is a schematic diagram of an antenna system for a communication terminal in an embodiment of this application. As shown in Figure 2, the communication terminal includes an antenna system to realize its communication function. The antenna system in this embodiment includes at least three radiators 3 and at least two isolation reconstruction circuits 4, with the isolation reconstruction circuits 4 disposed between two adjacent radiators 3. The isolation reconstruction circuits 4 have at least two operating states, and the isolation between the radiators 3 at both ends of the isolation reconstruction circuit 4 is different in different operating states, thereby improving the radiation efficiency of the radiators 3 at both ends of the isolation reconstruction circuit 4.

[0101] In one embodiment, the antenna system further includes a radio frequency (RF) chip 5, which is connected to the radiator 3 for feeding the radiator 3; the RF chip 5 is also connected to the isolation degree reconstruction circuit 4 for controlling the switching of the isolation degree reconstruction circuit 4.

[0102] As shown in Figure 2, in one embodiment, the antenna system of the communication terminal includes at least three radiators 3, namely a first radiator 31, a second radiator 32, and a third radiator 33 arranged sequentially adjacent to each other, and at least two isolation reconstruction circuits 4, including a first isolation reconstruction circuit 41 and a second isolation reconstruction circuit 42. The first isolation reconstruction circuit 41 is disposed between the first radiator 31 and the second radiator 32. By adjusting the operating state of the first isolation reconstruction circuit 41, the isolation between the first radiator 31 and the second radiator 32 is adjusted, ensuring that the isolation between the first radiator 31 and the second radiator 32 exists in at least two states. The second isolation reconstruction circuit 42 is disposed between the second radiator 32 and the third radiator 33. By adjusting the operating state of the second isolation reconstruction circuit 42, the isolation between the second radiator 32 and the third radiator 33 is adjusted, ensuring that the isolation between the second radiator 32 and the third radiator 33 exists in at least two states.

[0103] In this embodiment, the isolation reconstruction circuit 4 includes at least two operating states. The isolation between the radiators 3 at both ends of the isolation reconstruction circuit 4 differs depending on the operating state. Therefore, the operating state of the isolation reconstruction circuit 4 can be adjusted according to actual needs, allowing the isolation between the radiators 3 at both ends to be adjusted as required, thereby regulating the communication performance of the antenna system. For example, this solution can improve the communication performance of the radiators 3 in different operating modes within the antenna system; improve the isolation at different operating frequency bands; and enhance the communication capability of the communication terminal.

[0104] In one embodiment, each isolation reconfiguration circuit 4 has different capacitance and / or inductance values ​​in different operating states. It is understood that, depending specifically on the composition or structure of the isolation reconfiguration circuit 4, the isolation reconfiguration circuit may have different capacitance values, different inductance values, or both different capacitance and inductance values ​​in different operating states.

[0105] In one embodiment of the isolation reconstruction circuit 4, the isolation reconstruction circuit 4 may include a variable capacitor. By adjusting the variable capacitor, the capacitance value within the circuit between the radiators 3 connected to both ends of the isolation reconstruction circuit 4 can be adjusted. In another embodiment, the isolation reconstruction circuit 4 includes a switch and an inductor, where the inductor refers to an inductive device. In this embodiment, the switch allows selection of the capacitance value within the circuit between the radiators 3 connected to both ends of the isolation reconstruction circuit 4. In yet another embodiment, the isolation reconstruction circuit 4 may further include a switch and a capacitor, where the capacitor refers to a capacitor. In this embodiment, the switch allows selection of the capacitance value within the circuit between the radiators 3 connected to both ends of the isolation reconstruction circuit 4.

[0106] For ease of description, the isolation reconfiguration circuit 4 is considered to include an adjustable component 43, which is capable of adjusting the capacitance or inductance between the radiators 3 connected to both ends of the isolation reconfiguration circuit 4. The adjustable component 43 can be a variable capacitor, a combination of a switch and an inductor, a combination of a switch and a capacitor, or a device. In some embodiments, the isolation reconfiguration circuit 4 includes one adjustable component 43, or it may include a combination of at least two adjustable components 43.

[0107] In this embodiment, the multiple radiators 3 of the antenna system may or may not be part of the same communication system. Specifically, the communication terminal in this embodiment includes an RF chip 5, which comprises a first RF chip 51, a second RF chip 52, and a third RF chip 53. The feed point of the first radiator 31 is connected to the first RF chip 51, the feed point of the second radiator 32 is connected to the second RF chip 52, and the feed point of the third radiator 33 is connected to the third RF chip 53. Each radiator 3 is connected to the RF chip 5, making different radiators 3 different antennas that can operate independently. Specifically, in this embodiment, the radiators 3 located at both ends of an isolation reconfiguration circuit 4 belong to different antennas.

[0108] In one embodiment, the first radio frequency chip 51, the second radio frequency chip 52, and the third radio frequency chip 53 are the same radio frequency chip 5. This allows the first radiator 31, the second radiator 32, and the third radiator 33 to be in the same communication system. For example, the first radiator 31, the second radiator 32, and the third radiator 33 can all be in one of three systems: a cellular system, a Wi-Fi system, or a satellite system. For example, the first radiator 31, the second radiator 32, and the third radiator 33 can all be in a cellular system, but they can operate in different frequency bands, and the operation of each radiator can be controlled separately. For example, the first radiator 31 and the third radiator 33 can operate in a 2MIMO state of a cellular system, while the second radiator 32 can not operate; or the first radiator 31, the second radiator 32, and the third radiator 33 can all operate in a 4MIMO state of a cellular system. MIMO refers to multiple-input multiple-output, which means that multiple channels are used simultaneously at the transmitting and receiving ends, thereby increasing the capacity and spectrum utilization of the communication system many times over without increasing the bandwidth.

[0109] Alternatively, in one embodiment, the first RF chip 51 and the third RF chip 53 are the same RF chip 5, while the second RF chip 52 is a different RF chip 5 from the first RF chip 51. The first radiator 31 and the third radiator 33 are connected to the same RF chip 5 and are in the same communication system; or the first radiator 31 and the second radiator 32 are connected to different RF chips 5 and are in different communication systems, and the third radiator 33 and the second radiator 32 are connected to different RF chips 5 and are in different communication systems. For example, the first radiator 31 and the third radiator 33 can be in a cellular system, and the second radiator 32 can be in a WIFI system; or the first radiator 31 and the third radiator 33 can be in a cellular system, and the second radiator 32 can be in a satellite system; or the first radiator 31 and the third radiator 33 can be in a satellite system, and the second radiator 32 can be in a WIFI system, etc., etc., which will not be listed here.

[0110] Alternatively, in one embodiment, the first radio frequency chip 51, the second radio frequency chip 52, and the third radio frequency chip 53 are three different radio frequency chips 5. The first radiator 31, the second radiator 32, and the third radiator 33 are located in different communication systems. For example, the first radiator 31, the second radiator 32, and the third radiator 33 are located in one of the following systems: a cellular system, a Wi-Fi system, and a satellite system. For example, the first radiator 31 is in a cellular system, the second radiator 32 is in a Wi-Fi system, and the third radiator 33 is in a satellite system; or, the first radiator 31 is in a cellular system, the second radiator 32 is in a satellite system, and the third radiator 33 is in a Wi-Fi system, etc., etc., which will not be listed here.

[0111] In this embodiment, the communication terminal further includes a main chip and an RF chip 5. The main chip can also be a system-on-a-chip (SoC). To implement the adjustment function of the isolation reconstruction circuit 4, each isolation reconstruction circuit 4 can be connected to the RF chip 5, which is used to switch the operating state of the isolation reconstruction circuit 4. Specifically, the main chip can determine the required state of the isolation reconstruction circuit 4 based on the current operating state of the antenna system or the operating frequency band of the radiator 3, thereby controlling the RF chip 5 to adjust the operating state of the isolation reconstruction circuit 4. This allows for targeted improvement of the communication terminal's communication capabilities based on various situations.

[0112] In one embodiment, the reconfigurable module is configured with a reconfigurable module configuration table, which has various configuration items. Specifically, the reconfigurable module configuration table can be pre-designed, and the configuration items can correspond to the operating states of the isolation reconfiguration circuit. The RF chip 5 selects the operating state of the isolation reconfiguration circuit 4 by selecting the configuration items in the reconfigurable module configuration table according to the control of the main chip. This embodiment can simplify the control process of the reconfigurable module.

[0113] Figure 3 is a control schematic diagram of an antenna system in an embodiment of this application. As shown in Figure 3, in one embodiment, the main chip controls the operation of each radiator 3 of the antenna system to adjust the working state of each isolation reconfiguration circuit 4 using the RF chip 5. Specifically, the main chip monitors the RF chip 5 and determines whether each radiator 3 is working based on the parameters of the RF chip 5, thereby obtaining the state of the antenna system. The radiators 3 working in the antenna system differ depending on the state of the antenna system. When the antenna system is in one state, both radiators 3 at both ends of a certain isolation reconfiguration module 3 are working, and the main chip controls the RF chip 5 to select the first configuration item in the reconfigurable module configuration table. When the RF chip 5 is in another state, one radiator 3 at both ends of the isolation reconfiguration module 3 is working, while the other radiator 3 is not working, and the main chip controls the RF chip 5 to select the second configuration item in the reconfigurable module configuration table. The first and second configuration items are different.

[0114] Similarly, in another embodiment, the main chip is also used to control the RF chip 5 to adjust the operating state of each isolation reconfiguration circuit 4 according to the operating frequency band of each radiator 3 of the antenna system. Specifically, when the radiators 3 at both ends of a certain isolation reconfiguration circuit 4 of the antenna system are under one operating frequency band combination, the main chip controls the RF chip 5 to select the third configuration item in the isolation reconfiguration circuit 4 configuration table; when the radiators 3 at both ends of a certain isolation reconfiguration circuit 4 of the antenna system are under another operating frequency band combination, the main chip controls the RF chip 5 to select the fourth configuration item in the reconfigurable module configuration table, wherein the third and fourth configuration items are different.

[0115] Understandably, taking an antenna system comprising a first radiator 31, a second radiator 32, and a third radiator 33 as an example, this application can adjust the operating state of the isolation reconfiguration circuit 4 according to the state of the antenna system. In a specific embodiment, a first switch is provided between the feed point of the second radiator 32 and the second RF chip, and the operation of the second radiator 32 can be controlled by controlling the opening and closing of the first switch; alternatively, a second switch is provided between the ground point of the second radiator and the ground plane, and the operation of the second radiator 32 can also be controlled by controlling the opening and closing of the second switch.

[0116] In one embodiment, the first switch can also be reused as a switch of the first isolation degree reconstruction circuit 41, used to select the capacitance and / or inductance between the radiators 3 at both ends of the first isolation degree reconstruction circuit 41, thereby reducing the size of the antenna system, reducing the space occupied by the antenna system, and improving the integration of the communication terminal.

[0117] Specifically, the antenna system includes a first state and a second state. In the first state, the first radiator 31, the second radiator 32, and the third radiator 33 are all operational, the first isolation reconstruction circuit 41 is in a first operating state, and the second isolation reconstruction circuit 42 is in a second operating state. In the second state, both the first radiator 31 and the third radiator 33 are operational, the second radiator 32 is not operational, the first isolation reconstruction circuit 41 is in a third operating state, and the second isolation reconstruction circuit 42 is in a fourth operating state. It is understood that the states of the antenna system in this embodiment refer to whether the various radiators of the antenna system are operational; the combination of operational radiators differs in different states.

[0118] The isolation between the first radiator 31 and the second radiator 32 when the first isolation reconstruction circuit 41 is in its first operating state is greater than the isolation between the first radiator 31 and the second radiator 32 when the first isolation reconstruction circuit 41 is in its third operating state. The isolation between the second radiator 32 and the third radiator 33 when the second isolation reconstruction circuit 42 is in its second operating state is greater than the isolation between the second radiator 32 and the third radiator 33 when the second isolation reconstruction circuit 42 is in its fourth operating state.

[0119] When the first radiator 31, the second radiator 32, and the third radiator 33 are all operating, the first isolation reconstruction circuit 41 increases the isolation between the first radiator 31 and the second radiator 32, and the second isolation reconstruction circuit 42 increases the isolation between the second radiator 32 and the third radiator 33. In this state, increasing the isolation between the first radiator 31 and the second radiator 32, and increasing the isolation between the second radiator 32 and the third radiator 33, ensures that all three radiators operate at a high efficiency level, resulting in better communication capabilities for the antenna system. When both the first radiator 31 and the third radiator 33 are operating, and the second radiator 32 is not operating, the first isolation reconstruction circuit 41 is used to reduce the isolation between the first radiator 31 and the second radiator 32, thereby reducing the impact of the first isolation reconstruction circuit 41 on the performance of the first radiator 31 and improving the radiation efficiency of the first radiator 31. Similarly, the second isolation reconstruction circuit 42 is used to reduce the isolation between the second radiator 32 and the third radiator 33, thereby reducing the impact of the second isolation reconstruction circuit 42 on the performance of the third radiator 33 and improving the radiation efficiency of the third radiator 33. Therefore, the efficiency of the first radiator 31 and the third radiator 33 in their operating states can be optimized. In summary, by adjusting the operating state of the isolation reconstruction circuit 4, this application can adapt and adjust the isolation for different states of the antenna system, enabling the antenna system to have good radiation efficiency in different states. The antenna performance of the antenna system in different states can be optimized and balanced, improving the communication capability of the communication terminal.

[0120] It is worth noting that "adjusting up" and "adjusting down" in the above embodiments are adjustment methods relative to another state. When the antenna system is in the second state, the first isolation reconstruction circuit 41 can be in the off state and not participate in the operation, and the second isolation reconstruction circuit 42 can also be in the off state and not participate in the operation.

[0121] In some embodiments, a third switch is provided between the feed point of the third radiator 33 and the third radio frequency chip, and the operation of the third radiator 33 can be controlled by controlling the opening and closing of the third switch; or, a fourth switch is provided between the ground point of the third radiator and the ground, and the operation of the third radiator 33 can also be controlled by controlling the opening and closing of the fourth switch.

[0122] In one embodiment, the third switch can also be reused as a switch for the second isolation degree reconstruction circuit 42, used to select the capacitance and / or inductance between the radiators 3 at both ends of the second isolation degree reconstruction circuit 42, thereby reducing the size of the antenna system, reducing the space occupied by the antenna system, and improving the integration of the communication terminal.

[0123] Specifically, the antenna system includes a third state and a fourth state. In the third state, the first radiator 31, the second radiator 32, and the third radiator 33 are all operational, and the second isolation reconstruction circuit 42 is in the fifth operational state. In the fourth state, the first radiator 31 and the second radiator 32 are both operational, the third radiator 33 is not operational, and the second isolation reconstruction circuit 42 is in the sixth operational state.

[0124] The isolation between the second radiator 32 and the third radiator 33 when the second isolation reconstruction circuit 42 is in its fifth operating state is greater than the isolation between the second radiator 32 and the third radiator 33 when the second isolation reconstruction circuit 42 is in its sixth operating state.

[0125] When all three radiators—first radiator 31, second radiator 32, and third radiator 33—are operational, the second isolation reconstruction circuit 42 increases the isolation between the second radiator 32 and the third radiator 33. In this state, increasing the isolation between the second radiator 32 and the third radiator 33 ensures that all three radiators operate at high radiation efficiency, resulting in better communication capabilities for the antenna system. When both the first radiator 31 and the second radiator 32 are operational, but the third radiator 33 is not, the second isolation reconstruction circuit 42 decreases the isolation between the second radiator 32 and the third radiator 33. This reduces the impact of the second isolation reconstruction circuit 42 on the performance of the second radiator 32, improving its radiation efficiency. Therefore, the efficiency of the first radiator 31 and the second radiator 32 in their operational states can be optimized. In summary, by adjusting the operating state of the isolation reconfiguration circuit 4, this application can adapt and adjust the isolation of the antenna system for different states, so that the antenna system can have good radiation efficiency in different states, and the antenna performance of the antenna system in different states can be optimized and balanced, thereby improving the communication capability of the communication terminal.

[0126] As the operating frequency bands of the two radiators 3 change, the required isolation also varies. In one embodiment of this application, the isolation reconstruction circuit 4 includes at least three operating states. The capacitance or inductance values ​​connected to the circuit differ in each operating state, thus providing multiple functional options for the isolation between the radiators 3 at both ends of the isolation reconstruction circuit 4. Therefore, the isolation reconstruction circuit 4 in this embodiment can also be used to adjust the isolation according to the operating frequency bands of the radiators 3 connected at both ends, adapting to changes in the operating frequency bands of the radiators 3, specifically adjusting the isolation between the two radiators 3, improving the isolation of the antenna system in different operating frequency bands, and enhancing the communication capability of the communication terminal.

[0127] When two adjacent radiators 3 operate at the same frequency or in adjacent frequency bands, the requirement for isolation is significant. In one embodiment, when the first radiator 31 and the second radiator 32 operate simultaneously, the operating frequency band of the first radiator 31 is the first frequency band, and the operating frequency band of the second radiator 32 is the second frequency band. The first and second frequency bands at least partially overlap, in which case the first radiator 31 and the second radiator 32 can be considered to be operating at the same frequency. Alternatively, the first radiator 31 and the second radiator 32 can also operate in adjacent frequency bands. For example, in one embodiment, the lowest frequency of the first frequency band is greater than the highest frequency of the second frequency band, and the difference between the lowest frequency of the first frequency band and the highest frequency of the second frequency band is less than or equal to twice the highest frequency of the second frequency band. It is understood that the first radiator 31 and the second radiator 32 operate in adjacent frequency bands, with the first radiator 31 operating at a higher operating frequency band and the second radiator 32 operating at a lower operating frequency band. Further, the difference between the lowest frequency of the first frequency band and the highest frequency of the second frequency band is less than or equal to twice the highest frequency of the second frequency band. In one embodiment, the highest frequency of the first frequency band is lower than the lowest frequency of the second frequency band, and the difference between the highest frequency of the first frequency band and the lowest frequency of the second frequency band is less than or equal to twice the highest frequency of the first frequency band. It is understood that the first radiator 31 and the second radiator 32 operate in adjacent frequency bands, with the second radiator 32 operating at a higher frequency and the first radiator 31 operating at a lower frequency. Further, the highest frequency of the first frequency band is lower than the lowest frequency of the second frequency band, and the difference between the highest frequency of the first frequency band and the lowest frequency of the second frequency band is less than or equal to twice the highest frequency of the first frequency band. Since the first and second frequency bands are relatively close, a high degree of isolation is required; therefore, the first isolation reconstruction circuit 41 in this embodiment is beneficial for obtaining greater benefits.

[0128] The above embodiments are illustrated using the first radiator 31 and the second radiator 32 as examples. In practical applications, the above relationship can exist in the operating frequency bands of any two adjacent radiators 3, or in other words, the above relationship can exist in any radiator 3 connected to both ends of the same isolation reconfiguration circuit 4.

[0129] For example, when the second radiator 32 and the third radiator 33 operate simultaneously, the operating frequency band of the second radiator 32 is the third frequency band, and the operating frequency band of the third radiator 33 is the fourth frequency band. The third and fourth frequency bands at least partially overlap. In this case, the second radiator 32 and the third radiator 33 can be considered to be operating at the same frequency. Alternatively, the lowest frequency of the third frequency band is greater than the highest frequency of the fourth frequency band, and the difference between the lowest frequency of the third frequency band and the highest frequency of the fourth frequency band is less than or equal to twice the highest frequency of the fourth frequency band. Or, the highest frequency of the third frequency band is less than the lowest frequency of the fourth frequency band, and the difference between the highest frequency of the third frequency band and the lowest frequency of the fourth frequency band is less than or equal to twice the highest frequency of the third frequency band. Since the third and fourth frequency bands are relatively close, a high degree of isolation is required. Therefore, the second isolation reconstruction circuit 42 in this embodiment of the application is beneficial for obtaining greater benefits.

[0130] The following are some specific embodiments. Figure 4 is a partial structural schematic diagram of a communication terminal in an embodiment of this application. As shown in Figure 4, in one embodiment, the antenna system of the communication terminal includes a first radiator 31, a second radiator 32 and a third radiator 33 arranged sequentially and adjacently. All three radiators 3 operate in a cellular system.

[0131] Figure 5 is a framework design diagram of the first radiator 31, the second radiator 32, and the first isolation reconstruction circuit 41 in an embodiment of this application. Referring to Figures 4 and 5, in this embodiment, the first isolation reconstruction circuit 41 includes a first capacitor 411 and a first switch 412 connected in series, an inductor 413 and a second switch 414 connected in series, a second capacitor 415 and a third switch 416 connected in series, and a first variable capacitor 417. In this embodiment, the second radiator 32 is connected to a switching module, and the first switch 412, the second switch 414, and the third switch 416 all belong to the aforementioned switching module. Specifically, the switching module is connected between the second radiator 32 and the RF chip 5 and is used to control the operating state of the second radiator 32. The aforementioned switch module is reused as a switch in the first isolation degree reconstruction circuit 41. Other components included in the switch module can also serve as components in the isolation degree reconstruction circuit 41 for adjusting isolation. For example, the first capacitor 411, the second capacitor 415, and the first variable capacitor 417 in the figure can all be components included in the switch module and can also serve as components in the first isolation degree reconstruction circuit 41. This solution helps reduce the cost of the communication terminal and can reduce the space occupied by the antenna system, thereby improving the integration of the communication terminal. It is understood that the aforementioned switch module can also be reused as a switch in the second isolation degree reconstruction circuit 42, which will not be elaborated here.

[0132] Figure 6 is a framework design diagram of the first radiator 31, the second radiator 32 and the first isolation degree reconstruction circuit 41 in an embodiment of this application. Referring to Figures 4 and 6, in this embodiment of the application, the second isolation degree reconstruction circuit 42 includes a second variable capacitor 421 and a fourth switch 422, as well as a wire 423 and a fifth switch 424. The second isolation degree reconstruction circuit 42 is connected in parallel in the circuit between the second radiator 32 and the third radiator 33.

[0133] Figure 7 is a schematic diagram of the return loss of an antenna without the first radiator 31 in an embodiment of this application. Figure 8 is a schematic diagram of the return loss of an antenna without the second isolation reconstruction circuit 42 in an embodiment of this application. As shown in Figures 7 and 8, the isolation is poor when the isolation reconstruction circuit 4 is not set in the above antenna architecture, and the radiation efficiency of the first radiator 31 and the third radiator 33 of the antenna system is low.

[0134] In this embodiment, when the antenna system is in the first state, the first radiator 31 and the third radiator 33 operate in the 2MIMO state of the B3 band, and the second radiator 32 is not used for signal transmission. At this time, the second radiator 32 can be disconnected from the RF chip 5. However, the passive path of the second radiator 32 itself will have a load, which will also affect the operation of the first radiator 31. With the first isolation reconstruction circuit 41 configured with a series capacitance of 9pF and the second isolation reconstruction circuit 42 configured with 0 ohms, the return loss of the first radiator 31 and the third radiator 33 of the antenna system at this time is shown in Figure 9. It can be seen that the isolation between the first radiator 31 and the second radiator 32 is high, and the isolation between the third radiator 33 and the second radiator 32 is also high.

[0135] Table 1 compares the parameters of the first radiator 31 operating at 1.78 GHz with and without the first isolation reconfiguration circuit 41. As shown in Table 1, the isolation of the first radiator 31 is improved, and both the radiation efficiency and system efficiency are also improved. Specifically, the radiation efficiency and system efficiency of the first radiator 31 are both improved by about 1 dB.

[0136] Table 1

[0137] For the third radiator 33, the parameters operating at 1.78 GHz are compared with and without the second isolation reconfiguration circuit 42, as shown in Table 2. Table 2 shows that the isolation of the third radiator 33 is improved, and both its radiation efficiency and system efficiency are also improved. Specifically, the radiation efficiency and system efficiency of the third radiator 33 are both improved by approximately 2 dB.

[0138] Table 2

[0139] When the antenna system is in the second state, with the first radiator 31, the second radiator 32, and the third radiator 33 operating in 4MIMO mode in the B3 band, and the first isolation reconstruction circuit 41 configured with a series capacitance of 0.75 pF and an inductance of 26 nH, and the second isolation reconstruction circuit 42 configured with a parallel capacitance of 9 pF, the return loss of the antenna system at this time is shown in Figure 10. It can be seen that the isolation between the first radiator 31 and the second radiator 32 is relatively high, as is the isolation between the third radiator 33 and the second radiator 32.

[0140] When the antenna system is in the third state, the first radiator 31 and the third radiator 33 operate in 2MIMO mode in the B3 band, the second radiator 32 is not used for signal transmission, the first isolation reconstruction circuit 41 is configured with a series capacitance of 7pF, and the second isolation reconstruction circuit 42 is configured with 0 ohms. The return loss of the antenna system at this time is shown in Figure 11. It can be seen that the isolation between the first radiator 31 and the second radiator 32 is relatively high, and the isolation between the third radiator 33 and the second radiator 32 is also relatively high.

[0141] When the antenna system is in its fourth state, with the first radiator 31, the second radiator 32, and the third radiator 33 operating in 4MIMO mode in the B1 band, and the first isolation reconstruction circuit 41 configured with a 1pF capacitance and a 26nH inductance in series, and the second isolation reconstruction circuit 42 configured with a 7.2pF capacitance in parallel, the return loss of the antenna system at this time is shown in Figure 12. It can be seen that the isolation between the first radiator 31 and the second radiator 32 is relatively high, as is the isolation between the third radiator 33 and the second radiator 32.

[0142] By reasonably adjusting the first isolation reconstruction circuit 41 and the second isolation reconstruction circuit 42, the antenna system can maintain good isolation in various frequency bands under different operating states, thereby improving the communication capability of the antenna system. In this embodiment, the isolation state between each pair of radiators 3 can be switched by identifying different operating states of the antenna system, thereby optimizing the antenna performance. The state of the isolation reconstruction circuit 4 between two radiators 3 can also be switched, allowing the isolation to be reconstructed between different operating frequency bands, optimizing the isolation performance of different operating frequency bands. Furthermore, when the antenna system operates in different states, by changing the matching value of the isolation reconstruction circuit 4, the antenna performance can be optimized when one radiator 3 is not working or when only one radiator 3 is working.

[0143] In another specific embodiment, the first radiator 31 and the third radiator 33 operate in a cellular communication system, and the second radiator 32 operates in a WIFI communication system. Figure 13 is a schematic diagram of antenna return loss in an antenna system without the isolation reconstruction circuit 4 of this application. As shown in Figure 13, the isolation between any two adjacent radiators 3 is poor. By setting the first isolation reconstruction circuit 41 between the first radiator 31 and the second radiator 32, the isolation between the first radiator 31 and the second radiator 32 is adjusted; by setting the second isolation reconstruction circuit 42 between the second radiator 32 and the third radiator 33, the isolation between the second radiator 32 and the third radiator 33 is adjusted.

[0144] When the antenna system operates in a cellular system, the first radiator 31 and the third radiator 33 are active, while the second radiator 32 is not used for signal transmission. At this time, adjusting the isolation of the first isolation reconstruction circuit 41 and the second isolation reconstruction circuit 42, as shown in Figure 14, increases the isolation between the first radiator 31 and the second radiator 32, and also increases the isolation between the second radiator 32 and the third radiator 33. This improves the efficiency of the first radiator 31 and the third radiator 33, thereby enhancing the overall system efficiency of the antenna system.

[0145] When the antenna system operates as a Wi-Fi system, the first radiator 31 and the third radiator 33 are active, while the second radiator 32 is not used for signal transmission. At this time, the isolation of the first isolation reconstruction circuit 41 and the second isolation reconstruction circuit 42 is adjusted, as shown in Figure 15, to increase the isolation between the first radiator 31 and the second radiator 32, and also to increase the isolation between the second radiator 32 and the third radiator 33. This improves the efficiency of the second radiator 32, thereby enhancing the overall system efficiency of the antenna system.

[0146] Figure 16 is a schematic diagram of two radiators 3 and an isolation reconfiguration circuit 4 of the antenna system in an embodiment of this application. As shown in Figure 16, an adjustable component 43 or at least two adjustable components 43 can be provided between the two radiators 3. When an adjustable component 43 is provided between the two radiators 3, the adjustable component 43 can be connected in series in the circuit between the two radiators 3, or it can be connected in parallel in the circuit between the two radiators 3. When at least two adjustable components 43 are provided between the two radiators 3, the two adjustable components 43 can be connected in series, in parallel, or in a series-parallel configuration.

[0147] Referring to Figure 16, in one embodiment, the isolation reconstruction circuit 4 is located between the two radiators 3 and connected to the ends of the two radiators 3 facing the isolation reconstruction circuit 4, in order to minimize the length of the connection line between the isolation reconstruction circuit 4 and the radiators 3. Furthermore, the lengths of the connection lines between the isolation reconstruction circuit 4 and the radiators 3 at both ends can be made equal or as close as possible. Specifically, the connection point between the first isolation reconstruction circuit 41 and the first radiator 31 is located at the end of the first radiator 31 facing the second radiator 32, and the connection point between the first isolation reconstruction circuit 41 and the second radiator 32 is located at the end of the second radiator 32 facing the first radiator 31. The connection point between the second isolation reconstruction circuit 42 and the second radiator 32 is located at the end of the second radiator 32 facing the third radiator 33, and the connection point between the second isolation reconstruction circuit 42 and the third radiator 33 is located at the end of the third radiator 33 facing the second radiator 32.

[0148] Please continue to refer to Figure 16. In this embodiment of the application, both radiators 3 are connected to the isolation degree reconstruction circuit 4 at the end closer to the feed point 6, or both radiators 3 are connected to the isolation degree reconstruction circuit 4 at the end farther away from the feed point 6.

[0149] The first isolation reconstruction circuit 41 is connected to the first radiator 31 via a first connecting line, and to the second radiator 32 via a second connecting line. The lengths L1 and L2 of the first and second connecting lines satisfy |L1-L2|≤10%*L1. Further, |L1-L2|≤5%*L1 or L1=L2. The second isolation reconstruction circuit 42 is connected to the second radiator 32 via a third connecting line, and to the third radiator 33 via a fourth connecting line. The lengths L3 and L4 of the third and fourth connecting lines satisfy |L3-L4|≤10%*L3. Further, |L3-L4|≤5%*L3 or L3=L4. In this application, the lengths of the connecting lines between the isolation reconstruction circuit 4 and the radiators 3 at both ends are relatively close, which is beneficial for forming a symmetrical structure and improving the communication effect of the antenna system.

[0150] In this embodiment, the isolation degree reconstruction circuit 4 can form a filter circuit by reasonably arranging the lines of various devices. Furthermore, the state of the filter circuit can be adjusted by adjusting the capacitance or inductance of the isolation degree reconstruction circuit 4, thereby further improving the communication performance of the antenna system.

[0151] In this application, the specific type of radiator 3 is not limited. For example, radiator 3 can be a main feed radiator or a parasitic radiator. A main feed radiator refers to a radiator with branches connected to feed wires, generating current through branch feeding; a parasitic radiator generates parasitic current through coupling. Furthermore, a radiator can be one of the following: a first type radiator 34, a second type radiator 35, a third type radiator 36, a fourth type radiator 37, or a fifth type radiator 38. Different radiators in the antenna system can be of the same type or different types; this application does not impose any restrictions on this.

[0152] Figure 17 is a schematic diagram of a first type of radiator in an embodiment of this application. As shown in Figure 17, the electrical length of the first type of radiator 34 is 1 / 2 the dielectric wavelength, which is the dielectric wavelength corresponding to the frequency of the first type of radiator 34 in the operating frequency band. Both ends of the first type of radiator 34 are open terminals. Figure 18 is a schematic diagram of a second type of radiator in an embodiment of this application. As shown in Figure 18, the electrical length of the second type of radiator 35 is 1 / 2 the dielectric wavelength, which is the dielectric wavelength corresponding to the frequency of the second type of radiator 35 in the operating frequency band. Both ends of the second type of radiator 35 are open terminals, and the middle of the second type of radiator 35 is grounded. Figure 19 is a schematic diagram of a third type of radiator in an embodiment of this application. As shown in Figure 19, the electrical length of the third type of radiator 36 is 1 / 4 the dielectric wavelength, which is the dielectric wavelength corresponding to the frequency of the third type of radiator 36 in the operating frequency band. The third type of radiator 36 has one end grounded and the other end open. Figure 20 is a schematic diagram of a fourth type of radiator in an embodiment of this application. As shown in Figure 20, the fourth type of radiator 37 includes a first sub-radiator 371 and a second sub-radiator 372. A first gap 373 exists between the first sub-radiator 371 and the second sub-radiator 372. The end of the first sub-radiator 371 away from the first gap 373 is grounded, and the end of the second sub-radiator 372 away from the first gap 373 is also grounded. Figure 21 is a schematic diagram of a fifth type of radiator in an embodiment of this application. As shown in Figure 21, the fifth type of radiator... The radiator 38 includes a third sub-radiator 381, a fourth sub-radiator 382, ​​and a fifth sub-radiator 383 arranged in sequence. A second gap 384 is between the third sub-radiator 381 and the fourth sub-radiator 382, ​​and a third gap 385 is between the fourth sub-radiator 382 and the fifth sub-radiator 383. The end of the third sub-radiator 381 away from the second gap 384 is a grounding terminal, and the end of the fifth sub-radiator 383 away from the third gap 385 is a grounding terminal. The figure shows the fifth sub-radiator 383 as an example of being fed. In practical applications, the feeding can be performed at any suitable position of each sub-radiator.

[0153] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A communication terminal, characterized in that, The antenna system includes at least three radiators and at least two isolation reconfiguration circuits, wherein each isolation reconfiguration circuit includes at least two operating states. The at least three radiators include a first radiator, a second radiator, and a third radiator arranged sequentially adjacent to each other, and the at least two isolation degree reconstruction circuits include a first isolation degree reconstruction circuit and a second isolation degree reconstruction circuit. The first isolation degree reconstruction circuit is disposed between the first radiator and the second radiator, and is used to adjust the isolation degree between the first radiator and the second radiator. The second isolation degree reconstruction circuit is disposed between the second radiator and the third radiator, and is used to adjust the isolation degree between the second radiator and the third radiator.

2. The communication terminal as described in claim 1, characterized in that, Each of the isolation reconfiguration circuits has different capacitance and / or inductance values ​​in different operating states.

3. The communication terminal as described in claim 2, characterized in that, Each of the isolation reconfiguration circuits includes a variable capacitor; And / or, the isolation reconfiguration circuit includes a switch and an inductor; And / or, the isolation reconfiguration circuit includes switches and capacitors.

4. The communication terminal as described in any one of claims 1 to 3, characterized in that, The communication terminal includes a main chip and a radio frequency chip connected to each other. Each radiator and each isolation degree reconstruction circuit are respectively connected to the radio frequency chip. The main chip controls the radio frequency chip to switch the working state of the isolation degree reconstruction circuit.

5. The communication terminal as described in claim 4, characterized in that, The main chip is used to control the radio frequency chip to adjust the working state of each isolation reconstruction circuit according to whether each of the radiators of the antenna system is working.

6. The communication terminal as described in claim 4 or 5, characterized in that, The main chip is also used to control the radio frequency chip to adjust the working state of each isolation reconstruction circuit according to the operating frequency band of each radiator of the antenna system.

7. The communication terminal as described in any one of claims 4 to 6, characterized in that, The radio frequency chip includes a first radio frequency chip, a second radio frequency chip, and a third radio frequency chip. The feed point of the first radiator is connected to the first radio frequency chip, the feed point of the second radiator is connected to the second radio frequency chip, and the feed point of the third radiator is connected to the third radio frequency chip.

8. The communication terminal as described in claim 7, characterized in that, The first RF chip, the second RF chip, and the third RF chip are the same RF chip.

9. The communication terminal as described in claim 7, characterized in that, The first RF chip and the third RF chip are the same RF chip, while the first RF chip and the second RF chip are different RF chips.

10. The communication terminal as described in claim 7, characterized in that, The first radio frequency chip, the second radio frequency chip, and the third radio frequency chip are three different radio frequency chips.

11. The communication terminal as described in any one of claims 7 to 10, characterized in that, A first switch is provided between the feed point of the second radiator and the second radio frequency chip, or a second switch is provided between the ground point of the second radiator and the ground. When the first radiator, the second radiator, and the third radiator are all working, the first isolation reconstruction circuit is in a first working state, and the second isolation reconstruction circuit is in a second working state; when the first radiator and the third radiator are all working, but the second radiator is not working, the first isolation reconstruction circuit is in a third working state, and the second isolation reconstruction circuit is in a fourth working state.

12. The communication terminal as described in claim 11, characterized in that, The first switch is reused as the switch of the first isolation degree reconstruction circuit.

13. The communication terminal as described in any one of claims 7 to 10, characterized in that, A third switch is provided between the feed point of the third radiator and the third radio frequency chip, or a fourth switch is provided between the ground point of the third radiator and the ground. When the first radiator, the second radiator, and the third radiator are all working, the second isolation degree reconstruction circuit is in the fifth working state; when the first radiator and the second radiator are all working, but the third radiator is not working, the second isolation degree reconstruction circuit is in the sixth working state.

14. The communication terminal as described in claim 13, characterized in that, The third switch is reused as a switch for the second isolation degree reconstruction circuit.

15. The communication terminal as described in any one of claims 1 to 14, characterized in that, Each of the isolation reconfiguration circuits includes at least three operating states.

16. The communication terminal according to any one of claims 1 to 15, characterized in that, When the first radiator and the second radiator operate simultaneously, the first radiator operates in the first frequency band, and the second radiator operates in the second frequency band. The first frequency band and the second frequency band at least partially overlap; Alternatively, the lowest frequency of the first frequency band is greater than the highest frequency of the second frequency band, and the difference between the lowest frequency of the first frequency band and the highest frequency of the second frequency band is less than or equal to twice the highest frequency of the second frequency band. Alternatively, the highest frequency of the first frequency band is less than the lowest frequency of the second frequency band, and the difference between the highest frequency of the first frequency band and the lowest frequency of the second frequency band is less than or equal to twice the highest frequency of the first frequency band.

17. The communication terminal as described in any one of claims 1 to 16, characterized in that, When the second radiator and the third radiator operate simultaneously, the second radiator operates in the third frequency band, and the third radiator operates in the fourth frequency band. The third frequency band and the fourth frequency band at least partially overlap; Alternatively, the lowest frequency of the third frequency band is greater than the highest frequency of the fourth frequency band, and the difference between the lowest frequency of the third frequency band and the highest frequency of the fourth frequency band is less than or equal to twice the highest frequency of the fourth frequency band. Alternatively, the highest frequency of the third frequency band is lower than the lowest frequency of the fourth frequency band, and the difference between the highest frequency of the third frequency band and the lowest frequency of the fourth frequency band is less than or equal to twice the highest frequency of the third frequency band.

18. The communication terminal as described in any one of claims 1 to 17, characterized in that, The connection point between the first isolation reconstruction circuit and the first radiator is located at the end of the first radiator facing the second radiator, and the connection point between the first isolation reconstruction circuit and the second radiator is located at the end of the second radiator facing the first radiator. The connection point between the second isolation reconstruction circuit and the second radiator is located at the end of the second radiator facing the third radiator, and the connection point between the second isolation reconstruction circuit and the third radiator is located at the end of the third radiator facing the second radiator.

19. The communication terminal as described in claim 18, characterized in that, The first isolation degree reconstruction circuit is connected to the first radiator through a first connecting line, and the first isolation degree reconstruction circuit is connected to the second radiator through a second connecting line. The length L1 of the first connecting line and the length L2 of the second connecting line satisfy: |L1-L2|≤10%*L1; The second isolation degree reconstruction circuit is connected to the second radiator through a third connection line, and the second isolation degree reconstruction circuit is connected to the third radiator through a fourth connection line. The length L3 of the third connection line and the length L4 of the fourth connection line satisfy |L3-L4|≤10%*L3.

20. The communication terminal according to any one of claims 1 to 19, characterized in that, One of the radiators is a Class I radiator, a Class II radiator, a Class III radiator, a Class IV radiator, or a Class V radiator, wherein: The electric length of the first type of radiator is 1 / 2 of the dielectric wavelength, and both ends of the first type of radiator are open ends; The electrical length of the second type of radiator is 1 / 2 of the dielectric wavelength, both ends of the second type of radiator are open, and the middle part of the second type of radiator is grounded; The electrical length of the third type of radiator is 1 / 4 of the dielectric wavelength, and one end of the third type of radiator is a grounded end, while the other end is an open end; The fourth type of radiator includes a first sub-radiator and a second sub-radiator, with a first gap between the first sub-radiator and the second sub-radiator. The end of the first sub-radiator away from the first gap is a grounding end, and the end of the second sub-radiator away from the first gap is also a grounding end. The fifth type of radiator includes a third sub-radiator, a fourth sub-radiator, and a fifth sub-radiator arranged in sequence, with a second gap between the third sub-radiator and the fourth sub-radiator, and a third gap between the fourth sub-radiator and the fifth sub-radiator; The medium wavelength is the medium wavelength corresponding to the frequency of the radiator within the operating frequency band.

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