Smart card module and manufacturing method therefor

Abstract

Disclosed in the present invention are a smart card module and a manufacturing method therefor. The smart card module comprises a carrier tape and functional modules; the carrier tape and the plurality of functional modules are separately manufactured; the carrier tape comprises a plurality of first hollow regions; a bonding region is arranged around each first hollow region; each functional module is an assembly module comprising a chip and a single-layer or multi-layer PCB or FPC; at a corresponding first hollow region, each functional module is bonded to a corresponding bonding region; there is no electrical conduction between each functional module and the carrier tape; and an effective region of each assembly module comprising a chip and a single-layer or multi-layer PCB or FPC is completely aligned with a first hollow region. The smart card module of the present invention can achieve a 100% pass rate at shipment.

Description

Smart card module and manufacturing method thereof TECHNICAL FIELD

[0001] The present application relates to the technical field of smart cards, and in particular to a smart card module and a manufacturing method thereof. BACKGROUND

[0002] With the progress of science and technology, the application field of smart cards is more and more, such as bank cards, identity cards, access control cards, etc. In order to meet the demand of multi-function, the existing roll-to-roll (Roll to Roll, RtR) production mode (Flip chip, wire Bonding) cannot realize the demand of simultaneous production of multi-chip and assembly. And the traditional assembly cannot realize the requirement of roll-to-roll conveying of smart cards. The existing manufacturing method of smart cards usually includes: installing chips on a strip in a roll-to-roll (Roll to Roll, RtR) manner, then realizing the electrical connection between the chip and the strip by wire bonding or flip chip, then encapsulating by epoxy resin, and finally testing and shipping. Since the chips are installed on the strip in a roll-to-roll manner, the problem of chip failure is inevitable, which further leads to the decrease of the qualified rate of the finished products. SUMMARY

[0003] Therefore, the present application aims to provide a smart card module and a manufacturing method thereof to improve the qualified rate of the smart card module.

[0004] In one aspect, the present application provides a smart card module, comprising a carrier tape and a functional module, the carrier tape and the functional module are manufactured separately, the carrier tape comprises a plurality of first hollow areas, each first hollow area is surrounded by an adhesive area, the functional module is an assembly module of a chip and a single-layer or multi-layer PCB or FPC, the functional module is adhered to the corresponding adhesive area corresponding to the corresponding first hollow area, wherein the functional module and the carrier tape are not conductive, and the effective area of each chip and single-layer or multi-layer PCB or FPC assembly module is completely opposite to a first hollow area.

[0005] In another aspect, the present application provides a manufacturing method of a smart card module, comprising the following steps: S1: providing a carrier tape, the carrier tape comprising a plurality of first hollowed areas, each first hollowed area being surrounded by an adhesive area; S2: providing a plurality of functional modules in the form of a strip, the functional module being an assembled module of a chip and a single-layer or multi-layer PCB or FPC, wherein the step S1 and the step S2 are independent of each other and have no order; S3: bonding the functional module to the corresponding adhesive area of the corresponding first hollowed area of the carrier tape, so as to obtain the smart card module, wherein the functional module and the carrier tape are not electrically connected, and the effective area of each chip and the single-layer or multi-layer PCB or FPC assembled module is completely opposite to a first hollowed area.

[0006] Compared with the prior art, the smart card module of the present application is manufactured by separately manufacturing a carrier tape and a functional module (containing a chip), and then only needs to bond the functional module to the carrier tape, without the need of electrically connecting the carrier tape and the functional module, and without the need of packaging. In particular, the functional module is bonded to the carrier tape only after passing the detection, so that the qualified rate of the smart card module can reach 100%. BRIEF DESCRIPTION OF DRAWINGS

[0007] Fig. 1 is a schematic view of a smart card module according to an embodiment of the present application.

[0008] Fig. 2 is a schematic view of a carrier tape of the smart card module shown in Fig. 1.

[0009] Fig. 3 is an A-A sectional view of the carrier tape shown in Fig. 2.

[0010] Fig. 4 is a flowchart of a manufacturing method of a smart card module according to an embodiment of the present application. Embodiments of the present application

[0011] The present application will be described in detail below with reference to the accompanying drawings and specific embodiments, so that the technical solutions of the present application and the beneficial effects thereof are more clear and understandable. It can be understood that the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present application, and the sizes shown in the accompanying drawings are only for clear description, and do not limit the proportional relationship.

[0012] Referring to FIG. 1, the smart card module 100 of an embodiment of the present application comprises a carrier tape 10 and a plurality of functional modules 20. The carrier tape 10 and the plurality of functional modules 20 are manufactured separately from each other in production. As shown in FIG. 2, the carrier tape 10 comprises a plurality of first hollow regions 11 and a plurality of adhesive regions 12, and each first hollow region 11 is provided with a corresponding adhesive region 12. As shown in FIGS. 1 and 2, each functional module 20 is adhered to a corresponding adhesive region 12 corresponding to a corresponding first hollow region 11. In particular, the functional module 20 and the carrier tape 10 are not electrically connected to each other after being adhered.

[0013] Compared with the prior art, the smart card module 100 of the embodiment is manufactured separately from the carrier tape 10 and the functional module 20 (containing a chip), and then only needs to be adhered to the carrier tape 10, without the need for electrical connection between the carrier tape 10 and the functional module 20, and without the need for packaging. In particular, the functional module 20 is adhered to the carrier tape 10 only after passing the detection, so that the delivery qualification rate of the smart card module 100 can reach 100%.

[0014] As shown in FIG. 2, in the embodiment, the carrier tape 10 comprises two columns of first hollow regions 11 arranged along the width direction of the carrier tape 10. Each column of first hollow regions 11 comprises a plurality of first hollow regions 11 arranged along the length direction of the carrier tape 10. As an example, each first hollow region 11 is substantially rectangular in the embodiment. It can be understood that in other embodiments, the carrier tape 10 can also comprise a plurality of first hollow regions 11 arranged in other manners, for example, can comprise only one column of first hollow regions 11, or can comprise three columns or even more columns of first hollow regions 11. The shape of each first hollow region 11 is not limited to a rectangle, but can be changed according to actual needs.

[0015] In the embodiment, the carrier tape 10 comprises a plurality of adhesive regions 12 arranged along the length direction of the carrier tape 10. Each adhesive region 12 surrounds two first hollow regions 11 arranged along the width direction of the carrier tape 10. In other words, in the embodiment, two first hollow regions 11 arranged along the width direction of the carrier tape 10 correspond to the same adhesive region 12.

[0016] As shown in FIG. 2, in the embodiment, the outer contour of each adhesive area 12 is substantially rectangular, including two short sides 120 arranged oppositely along the width direction of the carrier tape 10, two long sides 121 arranged oppositely along the length direction of the carrier tape 10, and a middle side 122 connecting the substantially middle positions of the two long sides 121. Two first hollow areas 11 arranged along the width direction of the carrier tape 10 are distributed on both sides of the middle side 122, and each first hollow area 11 is surrounded by a corresponding short side 120, a part of the corresponding two long sides 121 (substantially half of each long side 121), and a corresponding middle side 122.

[0017] It can be understood that in other embodiments, the carrier tape 10 can also include a plurality of adhesive areas 12 arranged in other manners, for example, each first hollow area 11 can be surrounded by an adhesive area 12, the adhesive areas 12 surrounding every two adjacent first hollow areas 11 can be connected or separated from each other, or the adhesive areas 12 surrounding every several adjacent first hollow areas 11 can be connected. In addition, the shape of each adhesive area 12 is not limited to a rectangle, and can be changed according to actual needs.

[0018] Preferably, as shown in FIGS. 1 and 2, the carrier tape 10 further includes a plurality of second hollow areas 13 adjacent to the side edges of the carrier tape 10 extending along the length direction thereof, which serve as stamp holes for positioning and / or fixing the carrier tape 10. As shown in FIGS. 1 and 2, in the embodiment, the carrier tape 10 includes two columns of second hollow areas 13 distributed on both sides of the plurality of first hollow areas 11 (also on both sides of the plurality of adhesive areas 12) along the width direction of the carrier tape 10, and each column of second hollow areas 13 includes a plurality of second hollow areas 13 arranged in sequence and spaced apart along the length direction of the carrier tape 10. Each second hollow area 13 is rectangular.

[0019] As shown in FIG. 2, in the embodiment, each first hollow area 11 substantially corresponds to three second hollow areas 13. It can be understood that in other embodiments, the carrier tape 10 can also include a plurality of second hollow areas 13 arranged in other manners, for example, the plurality of second hollow areas 13 can be arranged only on one edge of the carrier tape 10, or the arrangement density of the plurality of second hollow areas 13 can be greater or smaller, or the second hollow areas 13 can be in other shapes, such as a circular shape, etc.

[0020] Referring to FIGS. 2 and 3, in the present embodiment, the carrier tape 10 comprises, from bottom to top, a substrate layer 14, an adhesive layer 15, and a protective film layer 16. The substrate layer 14 is made of one or more of FR4 (glass fiber epoxy resin), PI (polyimide), and PET (polyethylene terephthalate). The thickness of the substrate layer 14 is preferably in the range of 50-200 μm, most preferably 150 μm. The adhesive layer 15 is made of one or more of PSA (pressure sensitive adhesive), TSA (thermal sensitive adhesive), and glue. The thickness of the adhesive layer 15 is preferably in the range of 25-150 μm, most preferably 50 μm. The protective film layer 16 is a release material, such as a release paper. The thickness of the protective film layer 16 is preferably less than or equal to 100 μm.

[0021] In producing the carrier tape 10, to form the plurality of first hollow regions 11, the substrate layer 14, the adhesive layer 15, and the protective film layer 16 of the carrier tape 10 corresponding to the plurality of first hollow regions 11 are all removed, for example, by full cutting (i.e., the cutting tool completely penetrates the carrier tape 10 in the thickness direction of the carrier tape 10). In other words, each first hollow region 11 penetrates the carrier tape 10 in the thickness direction of the carrier tape 10. Similarly, the substrate layer 14, the adhesive layer 15, and the protective film layer 16 of the carrier tape 10 corresponding to the plurality of second hollow regions 13 can also be removed by full cutting to form the plurality of second hollow regions 13.

[0022] To form the plurality of adhesive regions 12, the protective film layer 16 of the carrier tape 10 corresponding to the adhesive regions 12 is removed to expose the corresponding adhesive layer 15, for example, by half cutting (i.e., the cutting tool cuts in the thickness direction of the carrier tape 10 but does not completely penetrate the carrier tape 10). In other words, the carrier tape 10 corresponding to the adhesive regions 12 comprises the adhesive layer 15 and the substrate layer 14. Thus, in the carrier tape 10 of the present embodiment, in addition to the plurality of first hollow regions 11, the plurality of second hollow regions 13, and the plurality of adhesive regions 12, the remaining part of the carrier tape 10 also comprises the substrate layer 14, the adhesive layer 15, and the protective film layer 16.

[0023] As shown in FIG. 1, in the present embodiment, the smart card module 100 comprises a plurality of functional modules 20 arranged along the length direction of the carrier tape 10. The functional module 20 is an assembled module of a chip and a single-layer PCB (printed circuit board) or FPC (flexible circuit board). The functional module 20 is made in the form of a sheet, and is bonded to the carrier tape 10 only after passing the electrical performance test. In other embodiments, the functional module 20 can also comprise a multi-layer PCB (printed circuit board) or FPC (flexible circuit board). In other embodiments, the functional module 20 can also be in the form of a long strip extending along the length direction of the carrier tape 10, and the functional module 20 is an assembled module of one to multiple chips and PCBs or FPCs arranged in the transverse direction and multiple chips and PCBs or FPCs arranged in the longitudinal direction.

[0024] As shown in FIG. 1 and FIG. 2, in the present embodiment, when bonding the functional module 20 to the carrier tape 10, each functional module 20 is bonded to the corresponding bonding area 12 through two first hollow areas 11 arranged along the width direction of the carrier tape 10. It can be understood that in other embodiments, the smart card module 100 can also comprise multiple or one functional module 20 arranged in other ways, for example, one functional module 20 can correspond to each first hollow area 11, or one functional module 20 can correspond to multiple or all first hollow areas 11 arranged in the longitudinal direction.

[0025] When the functional module 20 is bonded to the carrier tape 10, the manufacturing of the smart card module 100 is completed, and then the smart card module 100 is preferably formed into a roll for subsequent transportation. For example, the smart card module 100 can be transported to the client in the form of a roll for card manufacturing. Preferably, the width of the carrier tape 10 is 35 mm. Such a size design allows the client to directly use the existing equipment to punch the functional module 20 for card manufacturing when using the smart card module 100 of the present embodiment. As an example, the smart card module 100 of the present embodiment can be a multi-functional smart card module, which can provide contact, non-contact, digitization and identification functions, and the functional module 20 can be used to manufacture bank cards, identity cards, access control cards and other smart cards.

[0026] Preferably, when the functional module 20 is bonded to the bonding area 12, the effective area of each chip and PCB or FPC of the functional module 20, i.e. the part of each chip and PCB or FPC that is finally punched down and installed on the smart card, is completely opposite to the corresponding first hollow area 11 and does not contact the bonding area 12, so that the bottom surface of the effective area of each chip and PCB or FPC punched from the first hollow area 11 does not contain adhesive.

[0027] Referring to FIG. 4, the manufacturing method of the smart card module 100 of an embodiment of the present application comprises the following steps:

[0028] S1: providing a carrier tape 10 of the smart card module 100 according to any of the preceding embodiments;

[0029] Specifically, in the present embodiment, the step S1 comprises the following sub-steps:

[0030] S1.1: providing a substrate, attaching a layer of adhesive to one side of the substrate, and attaching a layer of protective film to the side of the adhesive facing away from the substrate;

[0031] S1.21: full cutting the partial area of the substrate attached with the adhesive and the protective film and removing the corresponding substrate, adhesive and protective film materials, thereby obtaining the plurality of first hollow areas 11; preferably, simultaneously with the sub-step S1.21, the sub-step S1.22 is also performed: full cutting the partial area of the substrate attached with the adhesive and the protective film and removing the corresponding substrate, adhesive and protective film materials, thereby obtaining the plurality of second hollow areas 13; of course, in other embodiments, the sub-step S1.22 can also occur after or before the sub-step S1.21;

[0032] S1.3: half cutting the partial area of the substrate attached with the adhesive and the protective film and removing the corresponding protective film material to expose the corresponding adhesive, thereby obtaining the plurality of adhesive areas 12.

[0033] S2: providing one or more functional modules 20 in the form of a strip, wherein the functional module 20 is an assembled module of a chip and a single-layer or multi-layer PCB (printed circuit board) or FPC (flexible circuit board), and has passed an electrical performance test.

[0034] S3: corresponding the effective area of the chip and the PCB or FPC of the functional module 20 to the corresponding first hollow area 11 of the carrier tape 10 and adhering the periphery of the effective area of the chip and the PCB or FPC to the corresponding adhesive area 12, thereby obtaining the smart card module 100, wherein the functional module 20 and the carrier tape 10 are not electrically conductive.

[0035] It is worth noting that the aforementioned step S1 and step S2 are independent of each other and do not have a specific order, and can be performed in sequence or simultaneously.

[0036] Preferably, the manufacturing method further comprises a step S4: forming the smart card module 100 obtained in step S3 into a roll, so as to facilitate subsequent transportation, for example, to a customer end, and subsequent processing on the equipment at the customer end.

[0037] Compared with the prior art of mounting the chip on the strip in a roll-to-roll manner and electrically connecting and packaging the chip and the strip, the smart card module 100 manufactured by using the manufacturing method of the embodiment is manufactured by separately manufacturing the carrier tape 10 and the functional module 20 (containing the chip), and then only needs to bond the functional module 20 to the carrier tape 10, without the need of electrically connecting the carrier tape 10 and the functional module 20, and without the need of packaging. In particular, the functional module 20 is bonded to the carrier tape 10 / 210 after passing the detection, so that the delivery qualified rate of the smart card module 100 / 200 can reach 100%.

[0038] The above description is merely preferred specific embodiments of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments. Any simple change or equivalent replacement of the technical solutions within the technical scope disclosed by the present application can be obtained by any person skilled in the art, and falls within the protection scope of the present application.

Claims

1. A smart card module, characterized by The carrier tape and the functional modules are manufactured separately, the carrier tape comprises a plurality of first hollowed-out regions, each first hollowed-out region is surrounded by an adhesive region, the functional module is an assembly module of a chip and a single-layer or multi-layer PCB or FPC, the functional module is adhered to the corresponding adhesive region corresponding to the corresponding first hollowed-out region, and there is no electric conduction between the functional module and the carrier tape, and the effective region of each chip and single-layer or multi-layer PCB or FPC assembly module is completely opposite to a first hollowed-out region.

2. The smart card module of claim 1, wherein, The carrier tape comprises a substrate, an adhesive attached to one side of the substrate, and a protective film attached to the side of the adhesive away from the substrate, the substrate, the adhesive and the protective film corresponding to the first hollowed-out region are all removed, and the protective film corresponding to the adhesive region is removed to expose the corresponding adhesive for adhering the functional module.

3. The smart card module of claim 2, wherein, The material of the substrate is selected from one or more of FR4, PI and PET.

4. The smart card module of claim 2, wherein, The material of the adhesive is selected from one or more of PSA, TSA and glue.

5. The smart card module of claim 1, wherein, The periphery of each first hollowed-out region is surrounded by an adhesive region, the adhesive regions around two adjacent first hollowed-out regions are connected to each other or the adhesive regions around several adjacent first hollowed-out regions are connected to each other.

6. The smart card module of claim 1, wherein, The carrier tape further comprises a plurality of second hollowed-out regions arranged adjacent to the edges of the carrier tape, the second hollowed-out regions serve as stamp holes for positioning and / or fixing the carrier tape.

7. The smart card module of claim 1, wherein, The functional modules are manufactured in the form of sheets, and are adhered to the carrier tape only after passing the electrical performance test.

8. The smart card module of claim 1, wherein, The smart card module is suitable for being conveyed in a roll.

9. A manufacturing method of a smart card module, comprising the following steps: S1: providing a carrier tape, the carrier tape comprising a plurality of first hollowed-out regions, each first hollowed-out region being surrounded by an adhesive region; S2: providing functional modules in the form of sheets, the functional module being an assembly module of a chip and a single-layer or multi-layer PCB or FPC, wherein the steps S1 and S2 are independent of each other and have no sequence; S3: adhering the functional modules corresponding to the respective first hollowed-out regions of the carrier tape to the respective adhesive regions to obtain the smart card module, wherein there is no electric conduction between the functional module and the carrier tape, and the effective region of each chip and single-layer or multi-layer PCB or FPC assembly module is completely opposite to a first hollowed-out region.

10. The method of claim 9, wherein the method further comprises: The step S1 comprises the following sub-steps: S1.1: providing a substrate, attaching an adhesive layer to one side of the substrate, and attaching a protective film layer to the side of the adhesive layer away from the substrate; S1.21: fully cutting and removing the corresponding substrate, adhesive and protective film materials of the partial region of the substrate attached with the adhesive and the protective film to obtain the plurality of first hollowed-out regions; S1.3: half-cutting and removing the corresponding protective film material of the partial region of the substrate attached with the adhesive and the protective film to expose the corresponding adhesive to obtain the adhesive region.

11. The method of manufacturing a smart card module according to claim 10, wherein, The step S1 further comprises the following sub-steps: S1.22: full cutting is performed on the partial area of the substrate to which the adhesive and the protective film are attached, and the corresponding substrate, adhesive and protective film materials are removed, thereby obtaining a plurality of second hollow areas distributed on both sides of the plurality of first hollow areas as stamp holes, wherein the sub-step S1.22 occurs before, after or simultaneously with the sub-step S1.

21.

12. The method of claim 9, wherein the method further comprises: In the step S2, the functional module is tested for electrical performance.

13. The method of claim 9, wherein the method further comprises: Further comprising the following steps: S4: the smart card module prepared in step S3 is formed into a roll to facilitate subsequent transportation.

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