Photosensitive resin composition, photosensitive element, cured product, method for manufacturing cured product pattern, and method for manufacturing conductor pattern

Abstract

A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer includes a polymer a having a styrene compound as a monomer unit, the photopolymerizable compound includes a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a bisphenol-A skeleton and a ditrimethylolpropane skeleton, and the polyfunctional monomer content is 92 mass% or more based on the total amount of the photopolymerizable compound.

Description

Photosensitive resin composition, photosensitive element, cured product, method for producing a cured product pattern, and method for producing a conductive pattern

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive element, a cured product, a method for producing a cured product pattern, a method for producing a conductor pattern, and the like.

[0002] In the manufacture of wiring boards and the like, a cured product pattern is formed as a resist pattern to obtain a desired conductor pattern (e.g., a wiring pattern). For example, the cured product pattern can be formed by forming a photosensitive layer (photosensitive resin layer) on a substrate using a photosensitive resin composition, and then exposing and developing the photosensitive layer. Various compositions have been investigated as photosensitive resin compositions. For example, Patent Document 1 below describes a photosensitive resin composition containing an anthracene derivative.

[0003] International Publication No. 2007 / 004619

[0004] When obtaining a cured product pattern, post-exposure baking (PEB) may be performed after exposure and before development from the viewpoint of improving the adhesion of the cured product pattern to the substrate, etc. However, with conventional photosensitive resin compositions, the effect of improving the adhesion of the cured product pattern when post-exposure baking is performed may not be sufficient compared to when post-exposure baking is not performed.

[0005] An object of one aspect of the present disclosure is to provide a photosensitive resin composition that can enhance the effect of improving the adhesion of a cured product pattern when post-exposure heating is performed, compared to when post-exposure heating is not performed. Another object of the present disclosure is to provide a photosensitive element using such a photosensitive resin composition. Another object of the present disclosure is to provide a cured product of the above-mentioned photosensitive resin composition. Another object of the present disclosure is to provide a method for producing a cured product pattern using the above-mentioned photosensitive resin composition. Another object of the present disclosure is to provide a method for producing a conductor pattern using such a method for producing a cured product pattern.

[0006] The present disclosure relates to the following items [1] to

[13] , etc. [1] A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer comprises a polymer a having a styrene compound as a monomer unit, the photopolymerizable compound comprises a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a bisphenol A skeleton and a ditrimethylolpropane skeleton, and the content of the polyfunctional monomer is 92 mass% or more based on the total amount of the photopolymerizable compound. [2] The photosensitive resin composition according to [1], wherein the molecular weight of the polyfunctional monomer is 600 to 1200. [3] The photosensitive resin composition according to [1] or [2], wherein the polyfunctional monomer further has 8 to 16 oxyethylene groups. [4] The photosensitive resin composition according to any one of [1] to [3], wherein the content of the photopolymerizable compound is 43.5 parts by mass or more relative to 100 parts by mass of the total of the binder polymer and the photopolymerizable compound. [5] The photosensitive resin composition according to any one of [1] to [4], wherein the polymer a further contains an aryl (meth)acrylate as a monomer unit. [6] The photosensitive resin composition according to any one of [1] to [5], wherein the polymer a further contains a hydroxyalkyl (meth)acrylate as a monomer unit. [7] The photosensitive resin composition according to any one of [1] to [6], wherein the polymer a is substantially free of an N-substituted maleimide compound as a monomer unit. [8] The photosensitive resin composition according to any one of [1] to [7], further containing a sensitizer. [9] The photosensitive resin composition according to [8], wherein the sensitizer includes an anthracene compound.

[10] A photosensitive element comprising a support and a photosensitive layer disposed on the support, the photosensitive layer containing the photosensitive resin composition according to any one of [1] to [9].

[11] A cured product of the photosensitive resin composition according to any one of [1] to [9].

[12] A method for producing a cured product pattern, comprising: a step of forming a photosensitive layer on a substrate using the photosensitive resin composition according to any one of [1] to [9]; an exposure step of photocuring a portion of the photosensitive layer; a heating step of heating the photosensitive layer after the exposure step; and a step of removing at least a portion of the uncured portion of the photosensitive layer after the heating step to form a cured product pattern.

[13] A method for producing a conductor pattern, comprising: a step of forming a conductor pattern using the cured product pattern obtained by the method for producing a cured product pattern according to

[12] as a mask.

[0007] According to one aspect of the present disclosure, it is possible to provide a photosensitive resin composition that can enhance the effect of improving the adhesion of a cured product pattern when heating after exposure is performed, compared to when heating after exposure is not performed. According to another aspect of the present disclosure, it is possible to provide a photosensitive element using such a photosensitive resin composition. According to another aspect of the present disclosure, it is possible to provide a cured product of the above-mentioned photosensitive resin composition. According to another aspect of the present disclosure, it is possible to provide a method for producing a cured product pattern using the above-mentioned photosensitive resin composition. According to another aspect of the present disclosure, it is possible to provide a method for producing a conductor pattern using such a method for producing a cured product pattern.

[0008] 1A and 1B are schematic cross-sectional views showing an example of a photosensitive element and an example of a method for manufacturing a conductor pattern.

[0009] Hereinafter, embodiments of the present disclosure will be described in detail, but the present disclosure is not limited to the following embodiments.

[0010] In this specification, numerical ranges indicated using "to" indicate a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. A numerical range "A or greater" means a range exceeding A and A. A numerical range "A or less" means a range less than A and A. In numerical ranges described in stages in this specification, the upper or lower limit of a numerical range in a certain stage can be arbitrarily combined with the upper or lower limit of a numerical range in another stage. In numerical ranges described in this specification, the upper or lower limit of the numerical range may be replaced with a value shown in the examples. "A or B" may include either A or B, or may include both. Unless otherwise specified, the materials exemplified in this specification can be used alone or in combination of two or more. When multiple substances corresponding to each component are present in the composition, the content of each component in the composition refers to the total amount of the multiple substances present in the composition, unless otherwise specified. The term "layer" encompasses structures that are formed over the entire surface as well as structures that are formed only partially when observed in a plan view. The term "process" includes not only independent processes but also processes that cannot be clearly distinguished from other processes, as long as the process achieves its intended function. "(Meth)acrylate" refers to at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acrylic." The content of (meth)acrylic acid monomer units refers to the total amount of acrylic acid monomer units and methacrylic acid monomer units. The same applies to other similar contents, such as the content of alkyl (meth)acrylate monomer units. Unless otherwise specified, "alkyl groups" may be linear, branched, or cyclic. "Hydroxy groups" do not include OH groups contained in carboxy groups. The solid content of a photosensitive resin composition refers to the non-volatile content excluding volatile components (water, organic solvents, etc.) that can volatilize. In other words, the solid content refers to the components that remain without volatilization during drying of the photosensitive resin composition, including components that are liquid, syrup-like, waxy, etc. at room temperature (25°C). "EO-modified" means a compound having a (poly)oxyethylene group."(Poly)oxyethylene group" means an oxyethylene group or a polyoxyethylene group in which two or more ethylene groups are linked by ether bonds. "PO-modified" means a compound having a (poly)oxypropylene group. "(Poly)oxypropylene group" means an oxypropylene group or a polyoxypropylene group in which two or more propylene groups are linked by ether bonds.

[0011] The photosensitive resin composition according to the present embodiment contains (A) a binder polymer (hereinafter sometimes referred to as "component (A)"), (B) a photopolymerizable compound (hereinafter sometimes referred to as "component (B)"), and (C) a photopolymerization initiator (hereinafter sometimes referred to as "component (C)"). In the photosensitive resin composition according to the present embodiment, the component (A) contains a polymer a (hereinafter sometimes referred to as "component (a)") having a styrene compound as a monomer unit, and the component (B) contains a polyfunctional monomer (hereinafter sometimes referred to as "component (b)") having two or more radical reactive groups and at least one selected from the group consisting of a bisphenol A skeleton and a ditrimethylolpropane skeleton, and the content of the component (b) is 92 mass% or more based on the total amount of the component (B).

[0012] The photosensitive resin composition according to this embodiment can enhance the effect of improving the adhesion of the cured product pattern when post-exposure heating is performed, compared to when post-exposure heating is not performed. According to the photosensitive resin composition according to this embodiment, in the adhesion evaluation described in the Examples below, the minimum line width can be reduced by more than 1.0 μm (preferably 1.5 μm or more, 2.0 μm or more) when post-exposure heating is performed, compared to when post-exposure heating is not performed. The photosensitive resin composition according to this embodiment only needs to have the property of enhancing the effect of improving the adhesion of the cured product pattern as described above, and may be used in an embodiment in which post-exposure heating is performed, or in an embodiment in which post-exposure heating is not performed.

[0013] The factors behind the enhanced effect of improving the adhesion of the cured product pattern are not entirely clear, but are presumed to be as follows. However, the factors are not limited to the following. By exposing a photosensitive layer obtained using a photosensitive resin composition containing components (A) to (C), component (B) forms a coarse network structure in the presence of active species (radicals, etc.) generated from component (C). Then, when component (A) contains component (a), component (B) contains component (b), and the content of component (b) is within the above range, heating after exposure facilitates diffusion of active species (residual active species, etc.), and therefore, reaction proceeds easily throughout the exposed portion of the photosensitive layer, resulting in a cured product pattern with high adhesion.

[0014] A cured product can be obtained by photocuring the photosensitive resin composition according to this embodiment. The cured product according to this embodiment is a cured product of the photosensitive resin composition according to this embodiment. One aspect of the photosensitive resin composition according to this embodiment can be used as a negative photosensitive resin composition. One aspect of the photosensitive resin composition according to this embodiment can be used to produce a cured product pattern, a resist pattern, a conductor pattern, or a wiring board.

[0015] The photosensitive resin composition according to this embodiment contains a binder polymer as component (A). Component (A) can have a polymerizable monomer as a monomer unit (structural unit), and can be obtained, for example, by radical polymerization of the polymerizable monomer.

[0016] The component (A) includes, as the component (a), a polymer a having a styrene compound as a monomer unit. Examples of the styrene compound include styrene and styrene derivatives. Examples of the styrene derivatives include vinyl toluene and α-methyl styrene. The component (a) may have styrene as a monomer unit from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern (easier to enhance the effect of improving the adhesion of the cured product pattern when heating after exposure is performed compared to when heating after exposure is not performed; the same applies hereinafter).

[0017] From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, the content of the monomer unit of the styrene compound may be in the following ranges based on the total amount of the monomer units constituting component (a). The content of the monomer unit of the styrene compound may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 45% by mass or more, 48% by mass or more, or 50% by mass or more. The content of the monomer unit of the styrene compound may be 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, less than 65% by mass, 60% by mass or less, 55% by mass or less, 53% by mass or less, less than 53% by mass, 52% by mass or less, less than 52% by mass, 51% by mass or less, or 50% by mass or less. From these viewpoints, the content of the monomer unit of the styrene compound may be 10 to 80 mass%, 10 to 70 mass%, 10 to 60 mass%, 20 to 80 mass%, 20 to 70 mass%, 20 to 60 mass%, 40 to 80 mass%, 40 to 70 mass%, or 40 to 60 mass%.

[0018] In the photosensitive resin composition according to this embodiment, the content of the polymer having a styrene compound monomer unit content (based on the total amount of monomer units constituting the polymer having a styrene compound as a monomer unit) of 52% by mass or more may be 3% by mass or less, less than 3% by mass, 2% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less, based on the total solid content of the photosensitive resin composition, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern. In other words, the photosensitive resin composition according to this embodiment does not need to contain a polymer having a styrene compound monomer unit content (based on the total amount of monomer units constituting the polymer having a styrene compound as a monomer unit) of 52% by mass or more.

[0019] The component (a) may contain (meth)acrylic acid as a monomer unit, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern.

[0020] From the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern, the content of the (meth)acrylic acid monomer unit may be in the following ranges based on the total amount of monomer units constituting component (a). The content of the (meth)acrylic acid monomer unit may be 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, 23% by mass or more, 25% by mass or more, more than 25% by mass, 26% by mass or more, or 27% by mass or more. The content of the (meth)acrylic acid monomer unit may be 50% by mass or less, 45% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less. From these viewpoints, the content of the (meth)acrylic acid monomer unit may be 5 to 50 mass%, 5 to 40 mass%, 5 to 30 mass%, 10 to 50 mass%, 10 to 40 mass%, 10 to 30 mass%, 20 to 50 mass%, 20 to 40 mass%, or 20 to 30 mass%.

[0021] From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, component (a) may have an alkyl (meth)acrylate as a monomer unit. Examples of the alkyl group of the alkyl (meth)acrylate include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, a undecyl group, and a dodecyl group. The alkyl group may be various structural isomers.

[0022] The alkyl (meth)acrylate may have an unsubstituted alkyl group or an alkyl group containing a substituent, such as a hydroxy group, a carboxy group, a carboxylate group, an aldehyde group, an alkoxy group, an ester group, a substituted or unsubstituted amino group, an amide group (excluding a hydroxyamide group), a hydroxyamide group, a nitro group, a cyano group, a mercapto group, or a halogeno group (such as a fluoro group, a chloro group, a bromo group, or an iodo group).

[0023] The number of carbon atoms in the alkyl group of the alkyl (meth)acrylate (including the number of carbon atoms in the substituent) may be 1 to 4, 1 to 3, or 1 to 2, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern.

[0024] From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, component (a) may have a hydroxyalkyl (meth)acrylate as a monomer unit. Examples of the hydroxyalkyl (meth)acrylate include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, and hydroxyhexyl (meth)acrylate.

[0025] From the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern, the content of the alkyl (meth)acrylate monomer unit or the hydroxyalkyl (meth)acrylate monomer unit may be in the following range based on the total amount of monomer units constituting component (a): The content of the alkyl (meth)acrylate monomer unit or the hydroxyalkyl (meth)acrylate monomer unit may be 0.5% by mass or more, 1.0% by mass or more, 1.5% by mass or more, 2.0% by mass or more, 2.5% by mass or more, or 3.0% by mass or more. The content of the alkyl (meth)acrylate monomer unit or the hydroxyalkyl (meth)acrylate monomer unit may be 20% by mass or less, 15% by mass or less, 10% by mass or less, less than 10% by mass, 8.0% by mass or less, 6.0% by mass or less, 5.0% by mass or less, less than 5.0% by mass, 4.5% by mass or less, 4.0% by mass or less, 3.5% by mass or less, or 3.0% by mass or less. From these viewpoints, the content of the alkyl (meth)acrylate monomer unit or the hydroxyalkyl (meth)acrylate monomer unit may be 0.5 to 20% by mass, 0.5 to 10% by mass, 0.5 to 5.0% by mass, 1.0 to 20% by mass, 1.0 to 10% by mass, 1.0 to 5.0% by mass, 2.0 to 20% by mass, 2.0 to 10% by mass, or 2.0 to 5.0% by mass.

[0026] Component (a) may have aryl (meth)acrylate as a monomer unit, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern. Examples of aryl (meth)acrylate include benzyl (meth)acrylate, phenyl (meth)acrylate, and naphthyl (meth)acrylate. Component (a) may have benzyl (meth)acrylate as a monomer unit, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern.

[0027] From the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern, the content of the aryl (meth)acrylate monomer unit may be in the following ranges based on the total amount of monomer units constituting component (a). The content of the aryl (meth)acrylate monomer unit may be 5% by mass or more, more than 5% by mass, 8% by mass or more, 10% by mass or more, more than 10% by mass, 12% by mass or more, 15% by mass or more, 16% by mass or more, 17% by mass or more, 18% by mass or more, 19% by mass or more, or 20% by mass or more. The content of the aryl (meth)acrylate monomer unit may be 50% by mass or less, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, 25% by mass or less, or 20% by mass or less. From these viewpoints, the content of the aryl (meth)acrylate monomer unit may be 5 to 50 mass%, 5 to 35 mass%, 5 to 25 mass%, 10 to 50 mass%, 10 to 35 mass%, 10 to 25 mass%, 15 to 50 mass%, 15 to 35 mass%, or 15 to 25 mass%.

[0028] From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, component (a) may have at least one selected from the group consisting of a styrene compound, (meth)acrylic acid, an alkyl (meth)acrylate, and an aryl (meth)acrylate as a monomer unit, may have a styrene compound and an aryl (meth)acrylate as a monomer unit, may have a styrene compound, an alkyl (meth)acrylate, and an aryl (meth)acrylate as a monomer unit, or may have a styrene compound, a hydroxyalkyl (meth)acrylate, and an aryl (meth)acrylate as a monomer unit. In these cases, the content of at least one selected from the group consisting of a styrene compound monomer unit, a (meth)acrylic acid monomer unit, a alkyl (meth)acrylate monomer unit, and a aryl (meth)acrylate monomer unit may be within the above-mentioned ranges.

[0029] Component (a) may contain, as a monomer unit, other monomers in addition to the above-mentioned monomers. Examples of other monomers include vinyl alcohol ethers (e.g., vinyl n-butyl ether), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (e.g., monomethyl maleate, monoethyl maleate, monoisopropyl maleate), fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, and propiolic acid.

[0030] Component (a) may have an N-substituted maleimide compound as a monomer unit, or may be substantially free of an N-substituted maleimide compound as a monomer unit. The content of the N-substituted maleimide compound monomer unit may be 0.01% by mass or less, less than 0.01% by mass, 0.001% by mass or less, less than 0.001% by mass, 0.0001% by mass or less, or less than 0.0001% by mass, or may be substantially 0% by mass, based on the total amount of monomer units constituting component (a).

[0031] From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, the acid value of component (a) may be in the following ranges. The acid value of component (a) may be 100 mgKOH / g or more, 120 mgKOH / g or more, 140 mgKOH / g or more, 150 mgKOH / g or more, 160 mgKOH / g or more, 163 mgKOH / g or more, 164 mgKOH / g or more, 165 mgKOH / g or more, 170 mgKOH / g or more, or 175 mgKOH / g or more. The acid value of component (a) may be 250 mgKOH / g or less, 240 mgKOH / g or less, 230 mgKOH / g or less, 200 mgKOH / g or less, 190 mgKOH / g or less, or 180 mgKOH / g or less. From these viewpoints, the acid value of component (a) may be 100 to 250 mgKOH / g, 100 to 200 mgKOH / g, 100 to 180 mgKOH / g, 150 to 250 mgKOH / g, 150 to 200 mgKOH / g, 150 to 180 mgKOH / g, 170 to 250 mgKOH / g, 170 to 200 mgKOH / g, or 170 to 180 mgKOH / g. The acid value of component (a) can be adjusted by the content of monomer units (e.g., monomer units of (meth)acrylic acid) constituting component (a). The acid value can be measured by the method described in the Examples below.

[0032] From the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern, the weight average molecular weight (Mw) of component (a) may be in the following ranges. The weight average molecular weight of component (a) may be 10,000 or more, 15,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, or 35,000 or more. The weight average molecular weight of component (a) may be 100,000 or less, 80,000 or less, 70,000 or less, 60,000 or less, 55,000 or less, 50,000 or less, 45,000 or less, 42,000 or less, 41,000 or less, less than 41,000, 40,000 or less, less than 40,000, 38,000 or less, less than 38,000, or 35,000 or less. From these viewpoints, the weight average molecular weight of component (a) may be 10,000 to 100,000, 10,000 to 80,000, 10,000 to 50,000, 20,000 to 100,000, 20,000 to 80,000, 20,000 to 50,000, 30,000 to 100,000, 30,000 to 80,000, or 30,000 to 50,000.

[0033] From the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern, the number average molecular weight (Mn) of component (a) may be within the following ranges: The number average molecular weight of component (a) may be 5,000 or more, 10,000 or more, 12,000 or more, 15,000 or more, or 16,000 or more. The number average molecular weight of component (a) may be 50,000 or less, 45,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 22,000 or less, 21,000 or less, 20,000 or less, 18,000 or less, or 16,000 or less. From these viewpoints, the number average molecular weight of component (a) may be 5,000 to 50,000, 5,000 to 40,000, 5,000 to 30,000, 10,000 to 50,000, 10,000 to 40,000, 10,000 to 30,000, 15,000 to 50,000, 15,000 to 40,000, or 15,000 to 30,000.

[0034] The polydispersity (Mw / Mn) of component (a) may be within the following ranges, from the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern. The polydispersity of component (a) may be 1.0 or more, 1.5 or more, 2.0 or more, or 2.1 or more. The polydispersity of component (a) may be 3.0 or less, 2.8 or less, 2.6 or less, 2.5 or less, 2.4 or less, 2.3 or less, or 2.2 or less. From these viewpoints, the polydispersity of component (a) may be 1.0 to 3.0, 1.0 to 2.8, 1.0 to 2.5, 1.5 to 3.0, 1.5 to 2.8, 1.5 to 2.5, 2.0 to 3.0, 2.0 to 2.8, or 2.0 to 2.5.

[0035] The weight average molecular weight (Mw), number average molecular weight (Mn) and dispersity (Mw / Mn) can be measured by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene, and can be measured by the method described in the Examples below. For compounds with low molecular weights, if it is difficult to measure them using such a measurement method, the molecular weight may be measured by another method and the average may be calculated.

[0036] The (A) component may contain a binder polymer other than the (a) component. From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, the content of the (a) component may be 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 90% by mass or more, 95% by mass or more, 97% by mass or more, 98% by mass or more, or 99% by mass or more, based on the total amount of the (A) component. The content of the (a) component may be 100% by mass or less, based on the total amount of the (A) component.

[0037] The content of component (A) or component (a) may be in the following ranges based on the total solid content of the photosensitive resin composition: From the viewpoint of excellent film formability or of easily enhancing the effect of improving the adhesion of the cured product pattern, the content of component (A) or component (a) may be 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 45% by mass or more, 48% by mass or more, 50% by mass or more, 51% by mass or more, or 52% by mass or more. The content of the (A) component or (a) component may be 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 56% by mass or less, 55% by mass or less, 54% by mass or less, 53% by mass or less, or 52% by mass or less, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, or from the viewpoint of easily obtaining a cured product pattern having excellent resolution when heating after exposure. From these viewpoints, the content of the (A) component or (a) component may be 20 to 90% by mass, 20 to 70% by mass, 20 to 60% by mass, 30 to 90% by mass, 30 to 70% by mass, 30 to 60% by mass, 40 to 90% by mass, 40 to 70% by mass, or 40 to 60% by mass.

[0038] The content of the (A) component or the (a) component may be within the following ranges relative to 100 parts by mass of the total of the (A) component and the (B) component, 100 parts by mass of the total of the (a) component and the (B) component, 100 parts by mass of the total of the (A) component and the (b) component, or 100 parts by mass of the total of the (a) component and the (b) component. From the viewpoint of excellent film formability or easily enhancing the effect of improving the adhesion of the cured product pattern, the content of the (A) component or the (a) component may be 20.0 parts by mass or more, 25.0 parts by mass or more, 30.0 parts by mass or more, 35.0 parts by mass or more, 40.0 parts by mass or more, 42.0 parts by mass or more, 44.0 parts by mass or more, 45.0 parts by mass or more, 50.0 parts by mass or more, 52.0 parts by mass or more, 53.0 parts by mass or more, 55.0 parts by mass or more, 56.0 parts by mass or more, 56.5 parts by mass or more, or 57.0 parts by mass or more. From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, or from the viewpoint of easily obtaining a cured product pattern with excellent resolution when heating after exposure, the content of the component (A) or component (a) may be 90.0 parts by mass or less, 85.0 parts by mass or less, 80.0 parts by mass or less, 75.0 parts by mass or less, 70.0 parts by mass or less, 65.0 parts by mass or less, 62.0 parts by mass or less, 60.0 parts by mass or less, 59.0 parts by mass or less, 58.0 parts by mass or less, 57.0 parts by mass or less, 56.5 parts by mass or less, or 56.0 parts by mass or less. From these viewpoints, the content of the (A) component or the (a) component may be 20.0 to 90.0 parts by mass, 20.0 to 70.0 parts by mass, 20.0 to 60.0 parts by mass, 30.0 to 90.0 parts by mass, 30.0 to 70.0 parts by mass, 30.0 to 60.0 parts by mass, 40.0 to 90.0 parts by mass, 40.0 to 70.0 parts by mass, or 40.0 to 60.0 parts by mass.

[0039] The photosensitive resin composition according to the present embodiment contains a photopolymerizable compound as component (B). From the viewpoint of enhancing the effect of improving the adhesion of a cured product pattern, component (B) contains, as component (b), a polyfunctional monomer having two or more radical reactive groups and at least one skeleton selected from the group consisting of a bisphenol A skeleton and a ditrimethylolpropane skeleton.

[0040] Component (b) has two or more radical reactive groups. The radical reactive group may be a group having an ethylenically unsaturated bond, such as a (meth)acryloyl group. In component (b), the number of radical reactive groups or the number of (meth)acryloyl groups (total of acryloyl groups and methacryloyl groups) may be 2 to 6, 2 to 5, 2 to 4, or 2 to 3, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern.

[0041] From the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern, the component (b) may have the following number of oxyethylene groups (the total number of oxyethylene groups in the component (b)). The number of oxyethylene groups may be 8 or more, or 10 or more. The number of oxyethylene groups may be 16 or less, 14 or less, 12 or less, or 10 or less. From these viewpoints, the number of oxyethylene groups may be 8 to 16, 8 to 14, 8 to 12, 8 to 10, 10 to 16, 10 to 14, or 10 to 12. From the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern, the component (b) does not need to have oxypropylene groups.

[0042] The molecular weight of component (b) may be within the following ranges from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern. The molecular weight of component (b) may be 600 or more, 650 or more, 700 or more, 750 or more, 800 or more, 850 or more, 900 or more, 950 or more, 1000 or more, or 1050 or more. The molecular weight of component (b) may be 1200 or less, 1150 or less, 1100 or less, 1050 or less, 1000 or less, 950 or less, 900 or less, or 850 or less. From these viewpoints, the molecular weight of component (b) may be 600 to 1200, 600 to 1000, 600 to 900, 700 to 1200, 700 to 1000, 700 to 900, 800 to 1200, 800 to 1000, or 800 to 900.

[0043] From the viewpoint of enhancing the effect of improving the adhesion of the cured product pattern, component (b) has at least one skeleton selected from the group consisting of a bisphenol A skeleton and a ditrimethylolpropane skeleton. Component (b) may contain a (meth)acrylic acid compound having a bisphenol A skeleton as a polyfunctional monomer having a bisphenol A skeleton. Examples of (meth)acrylic acid compounds having a bisphenol A skeleton include EO-modified bisphenol A di(meth)acrylate (EO groups: 8 to 16). Component (b) may contain a (meth)acrylic acid compound having a ditrimethylolpropane skeleton as a polyfunctional monomer having a ditrimethylolpropane skeleton. Examples of (meth)acrylic acid compounds having a ditrimethylolpropane skeleton include EO-modified ditrimethylolpropane tetra(meth)acrylate (EO groups: 8 to 16). From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern, the component (b) may contain at least one compound selected from the group consisting of (meth)acrylic acid compounds having a bisphenol A skeleton and (meth)acrylic acid compounds having a ditrimethylolpropane skeleton.

[0044] The content of the (b) component is 92% by mass or more based on the total amount of the (B) component, from the viewpoint of enhancing the effect of improving the adhesion of the cured product pattern. The content of the (b) component may be 93% by mass or more, 94% by mass or more, 95% by mass or more, 96% by mass or more, 97% by mass or more, 98% by mass or more, or 99% by mass or more based on the total amount of the (B) component, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern. The content of the (b) component may be 100% by mass or less based on the total amount of the (B) component. The (B) component does not need to contain a monofunctional monomer, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern.

[0045] In the photosensitive resin composition according to this embodiment, the content of the compound having three or more ethylenically unsaturated double bonds may be 3% by mass or less, less than 3% by mass, 2% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less, based on the total solid content of the photosensitive resin composition, from the viewpoint of easily enhancing the effect of improving the adhesion of a cured product pattern. That is, the photosensitive resin composition according to this embodiment does not need to contain a compound having three or more ethylenically unsaturated double bonds.

[0046] The component (B) may contain a photopolymerizable compound other than the component (b). Examples of such a photopolymerizable compound include a monofunctional monomer and a polyfunctional monomer having neither a bisphenol A skeleton nor a ditrimethylolpropane skeleton. The content of the photopolymerizable compound other than the component (b) may be 0% by mass or more, and may be 4% by mass or less, 3% by mass or less, 2% by mass or less, or 1% by mass or less, based on the total amount of the component (B).

[0047] The content of the component (B) or the component (b) may be within the following ranges based on the total solid content of the photosensitive resin composition: From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern or easily obtaining a cured product pattern with excellent resolution when heating is performed after exposure, the content of the component (B) or the component (b) may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 29% by mass or more, 30% by mass or more, 35% by mass or more, 37% by mass or more, 38% by mass or more, 39% by mass or more, or 40% by mass or more. The content of the (B) component or (b) component may be 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 53% by mass or less, 51% by mass or less, 50% by mass or less, 48% by mass or less, 45% by mass or less, 43% by mass or less, 42% by mass or less, 41% by mass or less, or 40% by mass or less, from the viewpoint of excellent film formability or from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern. From these viewpoints, the content of the (B) component or (b) component may be 10 to 80% by mass, 10 to 60% by mass, 10 to 50% by mass, 20 to 80% by mass, 20 to 60% by mass, 20 to 50% by mass, 30 to 80% by mass, 30 to 60% by mass, or 30 to 50% by mass.

[0048] The content of the (B) component or the (b) component may be within the following ranges relative to 100 parts by mass of the total of the (A) component and the (B) component, 100 parts by mass of the total of the (a) component and the (B) component, 100 parts by mass of the total of the (A) component and the (b) component, or 100 parts by mass of the total of the (a) component and the (b) component. From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern or easily obtaining a cured product pattern with excellent resolution when heating after exposure, the content of the (B) component or the (b) component may be 10.0 parts by mass or more, 15.0 parts by mass or more, 20.0 parts by mass or more, 25.0 parts by mass or more, 30.0 parts by mass or more, 35.0 parts by mass or more, 38.0 parts by mass or more, 40.0 parts by mass or more, 41.0 parts by mass or more, 42.0 parts by mass or more, 43.0 parts by mass or more, 43.5 parts by mass or more, or 44.0 parts by mass or more. From the viewpoint of excellent film formability or easily enhancing the effect of improving the adhesion of the cured product pattern, the content of the (B) component or the (b) component may be 80.0 parts by mass or less, 75.0 parts by mass or less, 70.0 parts by mass or less, 65.0 parts by mass or less, 60.0 parts by mass or less, 58.0 parts by mass or less, 56.0 parts by mass or less, 55.0 parts by mass or less, 50.0 parts by mass or less, 48.0 parts by mass or less, 47.0 parts by mass or less, 45.0 parts by mass or less, 44.0 parts by mass or less, 43.5 parts by mass or less, or 43.0 parts by mass or less. From these viewpoints, the content of the (B) component or the (b) component may be 10.0 to 80.0 parts by mass, 10.0 to 70.0 parts by mass, 10.0 to 60.0 parts by mass, 30.0 to 80.0 parts by mass, 30.0 to 70.0 parts by mass, 30.0 to 60.0 parts by mass, 40.0 to 80.0 parts by mass, 40.0 to 70.0 parts by mass, or 40.0 to 60.0 parts by mass.

[0049] The photosensitive resin composition according to this embodiment contains a photopolymerization initiator as component (C). As component (C), a photopolymerization initiator capable of polymerizing component (B) can be used.

[0050] Examples of the component (C) include hexaarylbiimidazole compounds; aromatic ketones such as benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propanone-1; alkyl aryl ketones such as benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone ... quinones such as trichloroquinone; benzoin ether compounds such as benzoin alkyl ether; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as benzyl dimethyl ketal; and phosphine oxide compounds such as bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, and (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide.

[0051] The component (C) may contain a hexaarylbiimidazole compound from the viewpoint of easily obtaining excellent sensitivity, easily improving the effect of improving the adhesion of the cured product pattern, or easily obtaining a cured product pattern with excellent resolution. The aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like. The hydrogen atom bonded to the aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (e.g., a chlorine atom).

[0052] The hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer. Examples of the 2,4,5-triarylimidazole dimer include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m-methoxyphenyl)imidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer. The hexaarylbiimidazole compound may contain 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer or 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole from the viewpoint of easily obtaining excellent sensitivity, easily enhancing the effect of improving the adhesion of the cured product pattern, or easily obtaining a cured product pattern with excellent resolution.

[0053] The content of the hexaarylbiimidazole compound may be 90% by mass or more, 92% by mass or more, 93% by mass or more, 95% by mass or more, 97% by mass or more, or 99% by mass or more, based on the total amount of component (C), from the viewpoint of easily obtaining excellent sensitivity, easily enhancing the effect of improving the adhesion of the cured product pattern, or easily obtaining a cured product pattern with excellent resolution. The content of the hexaarylbiimidazole compound may be 100% by mass or less, based on the total amount of component (C).

[0054] From the viewpoint of easily improving both sensitivity and resolution in a balanced manner or easily enhancing the effect of improving the adhesion of a cured product pattern, the content of the component (C) may be within the following ranges based on the total solid content of the photosensitive resin composition. The content of the component (C) may be 0.1 mass% or more, 0.5 mass% or more, 1.0 mass% or more, 2.0 mass% or more, 3.0 mass% or more, 3.5 mass% or more, 4.0 mass% or more, 4.5 mass% or more, 5.0 mass% or more, 5.1 mass% or more, 5.3 mass% or more, 5.5 mass% or more, or 6.0 mass% or more. The content of the component (C) may be 20 mass% or less, 15 mass% or less, 10 mass% or less, 8.0 mass% or less, 7.0 mass% or less, 6.8 mass% or less, or 6.5 mass% or less. From these viewpoints, the content of the component (C) may be 0.1 to 20 mass%, 0.1 to 10 mass%, 0.1 to 8.0 mass%, 1.0 to 20 mass%, 1.0 to 10 mass%, 1.0 to 8.0 mass%, 3.0 to 20 mass%, 3.0 to 10 mass%, or 3.0 to 8.0 mass%.

[0055] From the viewpoint of easily achieving a balanced improvement in both sensitivity and resolution or easily enhancing the effect of improving the adhesion of a cured product pattern, the content of the component (C) may be within the following ranges relative to 100 parts by mass of the total of the components (A) and (B), 100 parts by mass of the total of the components (a) and (B), 100 parts by mass of the total of the components (A) and (b), or 100 parts by mass of the total of the components (a) and (b): The content of the component (C) may be 0.1 parts by mass or more, 0.5 parts by mass or more, 1.0 parts by mass or more, 2.0 parts by mass or more, 3.0 parts by mass or more, 4.0 parts by mass or more, 4.5 parts by mass or more, 5.0 parts by mass or more, 5.4 parts by mass or more, 5.5 parts by mass or more, 5.8 parts by mass or more, or 6.0 parts by mass or more. The content of the (C) component may be 20 parts by mass or less, 15 parts by mass or less, 10 parts by mass or less, 8.0 parts by mass or less, 7.5 parts by mass or less, or 7.0 parts by mass or less. From these viewpoints, the content of the (C) component may be 0.1 to 20 parts by mass, 0.1 to 10 parts by mass, 0.1 to 8.0 parts by mass, 1.0 to 20 parts by mass, 1.0 to 10 parts by mass, 1.0 to 8.0 parts by mass, 3.0 to 20 parts by mass, 3.0 to 10 parts by mass, or 3.0 to 8.0 parts by mass.

[0056] The photosensitive resin composition according to this embodiment may contain a sensitizer as component (D), which makes it easier to effectively utilize the absorption wavelength of actinic rays used for exposure.

[0057] Examples of the component (D) include dialkylaminobenzophenone compounds, pyrazoline compounds, coumarin compounds, anthracene compounds, xanthone compounds, thioxanthone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

[0058] Examples of the dialkylaminobenzophenone compound include 4,4'-bis(diethylamino)benzophenone and 4-methoxy-4'-dimethylaminobenzophenone.

[0059] Examples of the pyrazoline compound include 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)pyrazoline, 1-phenyl-3-(4-tert-butylstyryl)-5-(4-tert-butylphenyl)pyrazoline, and 1-phenyl-3-biphenyl-5-(4-tert-butylphenyl)pyrazoline.

[0060] Examples of coumarin compounds include 3-benzoyl-7-diethylaminocoumarin, 7-diethylamino-4-methylcoumarin, 3,3'-carbonylbis(7-diethylaminocoumarin), 2,3,6,7-tetrahydro-9-methyl-1H,5H,11H-[1]benzopyrano[6,7,8-ij]quillodin-11-one, and the like.

[0061] Examples of the anthracene compound include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, and 9,10-dipentoxyanthracene.

[0062] From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern or easily obtaining a cured product pattern with excellent resolution, the component (D) may include an anthracene compound, and may include at least one selected from the group consisting of 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, and 9,10-dibutoxyanthracene, or may include at least one selected from the group consisting of 9,10-diethoxyanthracene and 9,10-dipropoxyanthracene.

[0063] The content of the (D) component may be within the following ranges based on the total solid content of the photosensitive resin composition, from the viewpoint of easily obtaining excellent sensitivity, easily improving the effect of improving the adhesion of the cured product pattern, or easily obtaining a cured product pattern with excellent resolution. The content of the (D) component may be 0.001% by mass or more, 0.005% by mass or more, 0.01% by mass or more, 0.05% by mass or more, 0.1% by mass or more, 0.2% by mass or more, 0.3% by mass or more, 0.4% by mass or more, 0.5% by mass or more, or 0.6% by mass or more. The content of the (D) component may be 5.0% by mass or less, 4.0% by mass or less, 3.0% by mass or less, 2.0% by mass or less, 1.0% by mass or less, 0.9% by mass or less, 0.8% by mass or less, or 0.7% by mass or less. From these viewpoints, the content of the component (D) may be 0.001 to 5.0 mass%, 0.001 to 3.0 mass%, 0.001 to 1.0 mass%, 0.01 to 5.0 mass%, 0.01 to 3.0 mass%, 0.01 to 1.0 mass%, 0.1 to 5.0 mass%, 0.1 to 3.0 mass%, or 0.1 to 1.0 mass%.

[0064] From the viewpoint of easily obtaining excellent sensitivity, easily improving the effect of improving the adhesion of a cured product pattern, or easily obtaining a cured product pattern with excellent resolution, the content of the component (D) may be in the following ranges relative to 100 parts by mass of the total of the components (A) and (B), 100 parts by mass of the total of the components (a) and (B), 100 parts by mass of the total of the components (A) and (b), or 100 parts by mass of the total of the components (a) and (b): The content of the component (D) may be 0.001 parts by mass or more, 0.005 parts by mass or more, 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass or more, or 0.6 parts by mass or more. The content of the (D) component may be 5.0 parts by mass or less, 4.0 parts by mass or less, 3.0 parts by mass or less, 2.0 parts by mass or less, 1.0 parts by mass or less, 0.9 parts by mass or less, 0.8 parts by mass or less, or 0.7 parts by mass or less. From these viewpoints, the content of the (D) component may be 0.001 to 5.0 parts by mass, 0.001 to 3.0 parts by mass, 0.001 to 1.0 parts by mass, 0.01 to 5.0 parts by mass, 0.01 to 3.0 parts by mass, 0.01 to 1.0 parts by mass, 0.1 to 5.0 parts by mass, 0.1 to 3.0 parts by mass, or 0.1 to 1.0 parts by mass.

[0065] The photosensitive resin composition according to this embodiment may contain a polymerization inhibitor as component (E) from the viewpoint of easily improving the effect of improving the adhesion of the cured product pattern or easily obtaining a cured product pattern with excellent resolution. Examples of component (E) include 4-tert-butylcatechol, 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl, p-methoxyphenol, diphenyl-p-benzoquinone, benzoquinone, hydroquinone, pyrogallol, phenothiazine, resorcinol, ortho-dinitrobenzene, para-dinitrobenzene, meta-dinitrobenzene, phenanthraquinone, N-phenyl-2-naphthylamine, cupferron, 2,5-toluquinone, tannic acid, parabenzylaminophenol, tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid, and nitrosamines. From the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern or from the viewpoint of easily obtaining a cured product pattern with excellent resolution, the component (E) may include at least one selected from the group consisting of 4-tert-butylcatechol and 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl, and may include 4-tert-butylcatechol and 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl.

[0066] The content of the (E) component may be in the following range based on the total solid content of the photosensitive resin composition. From the viewpoint of easily obtaining excellent sensitivity or easily obtaining a cured product pattern with excellent resolution, the content of the (E) component may be 0.001% by mass or more, 0.005% by mass or more, 0.01% by mass or more, 0.02% by mass or more, 0.03% by mass or more, or 0.04% by mass or more. From the viewpoint of easily obtaining excellent sensitivity or easily enhancing the effect of improving the adhesion of the cured product pattern, the content of the (E) component may be 3.0% by mass or less, 2.0% by mass or less, 1.0% by mass or less, 0.5% by mass or less, 0.3% by mass or less, 0.2% by mass or less, 0.1% by mass or less, 0.09% by mass or less, 0.08% by mass or less, less than 0.08% by mass, 0.07% by mass or less, 0.06% by mass or less, or 0.05% by mass or less. From these viewpoints, the content of the component (E) may be 0.001 to 3.0 mass%, 0.001 to 1.0 mass%, 0.001 to 0.1 mass%, 0.01 to 3.0 mass%, 0.01 to 1.0 mass%, 0.01 to 0.1 mass%, 0.02 to 3.0 mass%, 0.02 to 1.0 mass%, or 0.02 to 0.1 mass%.

[0067] The content of the component (E) may be within the following ranges relative to 100 parts by mass of the total of the components (A) and (B), 100 parts by mass of the total of the components (a) and (B), 100 parts by mass of the total of the components (A) and (b), or 100 parts by mass of the total of the components (a) and (b): From the viewpoint of easily obtaining excellent sensitivity or easily obtaining a cured product pattern with excellent resolution, the content of the component (E) may be 0.001 parts by mass or more, 0.005 parts by mass or more, 0.01 parts by mass or more, 0.02 parts by mass or more, 0.03 parts by mass or more, 0.04 parts by mass or more, or 0.05 parts by mass or more. From the viewpoint of easily obtaining excellent sensitivity or easily enhancing the effect of improving the adhesion of the cured product pattern, the content of the component (E) may be 3.0 parts by mass or less, 2.0 parts by mass or less, 1.0 parts by mass or less, 0.5 parts by mass or less, 0.3 parts by mass or less, 0.2 parts by mass or less, 0.1 parts by mass or less, 0.09 parts by mass or less, 0.08 parts by mass or less, less than 0.08 parts by mass, 0.07 parts by mass or less, 0.06 parts by mass or less, or 0.05 parts by mass or less. From these viewpoints, the content of the (E) component may be 0.001 to 3.0 parts by mass, 0.001 to 1.0 parts by mass, 0.001 to 0.1 parts by mass, 0.01 to 3.0 parts by mass, 0.01 to 1.0 parts by mass, 0.01 to 0.1 parts by mass, 0.02 to 3.0 parts by mass, 0.02 to 1.0 parts by mass, or 0.02 to 0.1 parts by mass.

[0068] The photosensitive resin composition according to this embodiment may contain an organic solvent, such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, propylene glycol monomethyl ether, or cyclopentanone, in order to facilitate viscosity adjustment.

[0069] The photosensitive resin composition according to this embodiment may contain components other than those described above. Examples of other components include hydrogen donors (such as bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, N-phenylglycine, and leucocrystal violet), dyes (such as malachite green), tribromophenyl sulfone, photocoloring agents, thermal color-developing inhibitors, plasticizers (such as p-toluenesulfonamide), pigments, fillers, antifoaming agents, flame retardants, stabilizers, a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol, a leveling agent, a release promoter, an antioxidant, a fragrance, an imaging agent, and a thermal crosslinking agent. The content of each of these components may be 0.001 parts by mass or more, 0.005 parts by mass or more, or 0.01 parts by mass or more, and may be 20 parts by mass or less, 10 parts by mass or less, 5 parts by mass or less, 1 part by mass or less, or 0.5 parts by mass or less, relative to 100 parts by mass of the total of the (A) component and the (B) component, 100 parts by mass of the total of the (a) component and the (B) component, 100 parts by mass of the total of the (A) component and the (b) component, or 100 parts by mass of the total of the (a) component and the (b) component.

[0070] The photosensitive resin composition according to this embodiment may be in an embodiment other than "a photosensitive resin composition comprising (X1) an alkali-soluble polymer, (X2) a compound having an ethylenically unsaturated bond, and (X3) a photopolymerization initiator, wherein the component (X1) has at least structural units (monomer units) derived from (x1) methacrylic acid and / or acrylic acid, (x2) an N-substituted maleimide compound, and (x3) a compound having an aromatic structure or an alicyclic structure (excluding compounds corresponding to component (x2)), and the mass proportion of the structural units (monomer units) derived from component (x2) in component (X1) is 0.01 to 5.0 mass%."

[0071] The photosensitive resin composition according to this embodiment may be in the form of a film. The thickness of the film-like photosensitive resin composition may be 1 μm or more, 5 μm or more, 10 μm or more, 12 μm or more, 14 μm or more, or 15 μm or more, from the viewpoint of easily improving productivity. The thickness of the film-like photosensitive resin composition may be 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, or 15 μm or less, from the viewpoint of easily enhancing the effect of improving the adhesion of the cured product pattern or easily obtaining a cured product pattern with excellent resolution. From these viewpoints, the thickness of the film-like photosensitive resin composition may be 1 to 100 μm, 1 to 60 μm, 1 to 30 μm, 5 to 100 μm, 5 to 60 μm, 5 to 30 μm, 10 to 100 μm, 10 to 60 μm, or 10 to 30 μm.

[0072] The photosensitive element according to this embodiment includes a support and a photosensitive layer (photosensitive resin layer) disposed on the support, and the photosensitive layer contains the photosensitive resin composition according to this embodiment. The photosensitive element according to this embodiment may include a protective layer disposed on the photosensitive layer. FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element. The photosensitive element 10 in FIG. 1 includes a support 12, a photosensitive layer 14 disposed on the support 12, and a protective layer 16 disposed on the photosensitive layer 14. The protective layer 16 is disposed on the opposite side of the photosensitive layer 14 from the support 12.

[0073] The support may be a polymer film having heat resistance and solvent resistance, such as a polyester film such as a polyethylene terephthalate (PET) film, a polybutylene terephthalate (PBT) film, or a polyethylene-2,6-naphthalate (PEN) film; or a polyolefin film such as a polyethylene film or a polypropylene film.

[0074] The thickness of the support may be 1 μm or more, 5 μm or more, 10 μm or more, or 15 μm or more, from the viewpoint of easily preventing damage to the support when peeling the support from the photosensitive layer. The thickness of the support may be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less, from the viewpoint of easily and suitably exposing when exposing through the support. From these viewpoints, the thickness of the support may be 1 to 100 μm.

[0075] The photosensitive layer may include the photosensitive resin composition according to the present embodiment, and may be made of the photosensitive resin composition according to the present embodiment. The thickness of the photosensitive layer (the thickness after volatilizing the organic solvent in the case where the photosensitive resin composition contains an organic solvent) may be within the ranges described above for the thickness of the film-like photosensitive resin composition.

[0076] The protective layer may be a polymer film having heat resistance and solvent resistance, such as a polyester film such as a polyethylene terephthalate (PET) film, a polybutylene terephthalate (PBT) film, or a polyethylene-2,6-naphthalate (PEN) film; or a polyolefin film such as a polyethylene film or a polypropylene film.

[0077] The thickness of the protective layer may be 1 μm or more, 5 μm or more, 10 μm or more, 15 μm or more, 20 μm or more, or 25 μm or more, from the viewpoint of easily suppressing damage to the protective layer when laminating the photosensitive layer and the support onto the substrate while peeling off the protective layer. The thickness of the protective layer may be 100 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less, from the viewpoint of easily improving productivity. From these viewpoints, the thickness of the protective layer may be 1 to 100 μm.

[0078] The photosensitive element according to this embodiment may include a cushion layer, an adhesive layer, a light absorbing layer, a gas barrier layer, and the like.

[0079] The method for producing a cured product pattern according to this embodiment (e.g., a method for producing a resist pattern) includes the steps of forming a photosensitive layer on a substrate using the photosensitive resin composition according to this embodiment (photosensitive layer formation step), photocuring a portion of the photosensitive layer, heating the photosensitive layer (PEB) after the exposure step, and developing the photosensitive layer after the heating step by removing at least a portion (partial or all) of the uncured portion of the photosensitive layer to form a cured product pattern (e.g., a resist pattern). The resist pattern may be referred to as a photocured product pattern, a relief pattern, or the like of the photosensitive resin composition. The photosensitive resin composition according to this embodiment may be the photosensitive resin composition used in the method for producing a cured product pattern according to this embodiment. The photosensitive resin composition according to this embodiment may have the properties to enhance the effect of improving the adhesion of the cured product pattern as described above, and may be used in an embodiment in which the heating step is not performed in the method for producing a cured product pattern described above.

[0080] The substrate may include a conductor layer, or may include an insulating layer and a conductor layer disposed on the insulating layer. Examples of the substrate include, but are not limited to, a circuit-forming substrate including an insulating layer and a conductor layer disposed on the insulating layer; a die pad (substrate for lead frame) such as an alloy substrate; and the like.

[0081] In the photosensitive layer forming step, a photosensitive layer is formed on a substrate using the photosensitive resin composition according to this embodiment. In the photosensitive layer forming step, a photosensitive layer (film-like photosensitive resin composition) may be formed on a substrate by laminating a film-like photosensitive resin composition on a substrate, or a photosensitive layer may be formed on a substrate by laminating a photosensitive layer in a photosensitive element according to this embodiment on a substrate. In the photosensitive layer forming step, the photosensitive layer and the support may be formed on a substrate by laminating the photosensitive layer of the photosensitive element and the support on a substrate in a state where the photosensitive layer of the photosensitive element according to this embodiment is located closer to the substrate than the support. When the photosensitive element according to this embodiment has a protective layer, the protective layer may be removed from the photosensitive element and then the photosensitive layer may be laminated on the substrate. When the photosensitive layer of the photosensitive element according to this embodiment is laminated on a substrate, the photosensitive layer may be pressed against the substrate while being heated. The heating temperature during compression bonding may be 70 to 130°C, and the pressure during compression bonding may be 0.1 to 1.0 MPa (1 to 10 kgf / cm ２ These conditions can be appropriately selected as necessary. The photosensitive layer forming step may be carried out under reduced pressure.

[0082] In the exposure step, a portion of the photosensitive layer is photocured. In the exposure step, the photosensitive layer may be exposed to actinic rays to photocure a portion of the photosensitive layer, or the photosensitive layer may be exposed to actinic rays through a support. In the exposure step, the exposed portion irradiated with actinic rays may be photocured to form a photocured portion (latent image).

[0083] As the exposure method, known exposure methods can be applied, including a method of irradiating an actinic ray in an imagewise manner through a negative or positive mask pattern called artwork (mask exposure method), an LDI (Laser Direct Imaging) exposure method, and a method of irradiating an actinic ray in an imagewise manner through a lens using an actinic ray projected from an image of a photomask (projection exposure method). Among these, the LDI exposure method or the projection exposure method can be used from the viewpoint of easily obtaining excellent resolution. The projection exposure method can also be said to be an exposure method using actinic ray with attenuated energy.

[0084] The light source of actinic rays is not particularly limited as long as it is a commonly used known light source, and a light source that effectively emits ultraviolet rays can be used. Examples of light sources that effectively emit ultraviolet rays include carbon arc lamps, mercury vapor arc lamps, ultra-high pressure mercury lamps, high-pressure mercury lamps, xenon lamps, gas lasers (argon lasers, etc.), solid-state lasers (YAG lasers, etc.), and semiconductor lasers (gallium nitride blue-violet lasers, etc.). Among these, from the viewpoint of easily improving the resolution and alignment in a well-balanced manner, a light source that can emit i-line monochromatic light with an exposure wavelength of 365 nm, a light source that can emit h-line monochromatic light with an exposure wavelength of 405 nm, or a light source that can emit actinic rays with an exposure wavelength of i, h, and g crosstalk can be used, and a light source that can emit i-line monochromatic light with an exposure wavelength of 365 nm or h-line monochromatic light with an exposure wavelength of 405 nm can be used. Examples of light sources that can emit i-line monochromatic light with an exposure wavelength of 365 nm include ultra-high pressure mercury lamps. A light source capable of emitting monochromatic h-line light with an exposure wavelength of 405 nm includes a blue-violet laser diode with an exposure wavelength of 405 nm.

[0085] In the heating step, the photosensitive layer after exposure is heated. Examples of the heating device that may be used include a hot plate, a box-type dryer, a heating roll, and a conveyor-type heating furnace. The heating temperature in the heating step (for example, the heating temperature when using a box-type dryer) may be within the following ranges. The heating temperature may be 50°C or higher, 60°C or higher, 70°C or higher, or 80°C or higher. The heating temperature may be 100°C or lower, 90°C or lower, or 80°C or lower. From these perspectives, the heating temperature may be 50 to 100°C, 60 to 90°C, or 70 to 90°C. The heating time may be 10 seconds or longer, 20 seconds or longer, or 30 seconds or longer. The heating time may be 60 seconds or shorter, 50 seconds or shorter, 40 seconds or shorter, or 30 seconds or shorter. From these perspectives, the heating time may be 10 to 60 seconds, 20 to 50 seconds, or 30 to 40 seconds. The temperature of the photosensitive layer immediately after the heating step may be 30° C. or higher, 40° C. or higher, 50° C. or higher, 60° C. or higher, or 70° C. or higher. The temperature of the photosensitive layer immediately after the heating step may be 100° C. or lower, 90° C. or lower, 80° C. or lower, or 70° C. or lower. From these viewpoints, the temperature of the photosensitive layer immediately after the heating step may be 30 to 100° C., 40 to 90° C., 50 to 80° C., or 50 to 70° C.

[0086] In the development step, at least a portion of the uncured portion of the photosensitive layer is removed to form a cured product pattern (photocured portion of the photosensitive layer). If a support is placed on the photosensitive layer in the exposure step or heating step, the support may be peeled off before the development step. The development method may be wet development or dry development.

[0087] In the case of wet development, development can be performed by a known wet development method using a developer suitable for the photosensitive resin composition. Examples of wet development methods include a dipping method, a paddle method, a high-pressure spray method, brushing, scrubbing, and a rocking immersion method. One type of wet development method may be used alone, or two or more types may be used in combination.

[0088] The developer can be appropriately selected depending on the composition of the photosensitive resin composition, and examples of the developer include an alkaline aqueous solution and an organic solvent developer.

[0089] From the viewpoints of safety, stability, and ease of use, an alkaline aqueous solution may be used as the developer. Examples of the base of the alkaline aqueous solution include alkali hydroxides such as lithium, sodium, or potassium hydroxide; alkali carbonates such as carbonates or bicarbonates of lithium, sodium, potassium, or ammonium; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; sodium borate; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; 2-amino-2-hydroxymethyl-1,3-propanediol; 1,3-diamino-2-propanol; and morpholine.

[0090] Examples of alkaline aqueous solutions include a dilute solution of 0.1 to 5% by mass sodium carbonate, a dilute solution of 0.1 to 5% by mass potassium carbonate, a dilute solution of 0.1 to 5% by mass sodium hydroxide, and a dilute solution of 0.1 to 5% by mass sodium tetraborate. The pH of the alkaline aqueous solution used for development may be in the range of 9 to 11. The temperature of the alkaline aqueous solution can be adjusted according to the developability of the photosensitive layer. The alkaline aqueous solution may contain a surfactant, an antifoaming agent, a small amount of an organic solvent to promote development, and the like.

[0091] Examples of organic solvents used in the alkaline aqueous solution include 3-acetone alcohol, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether.

[0092] Examples of organic solvents used in the organic solvent developer include 1,1,1-trichloroethane, N-methyl-2-pyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, γ-butyrolactone, etc. From the viewpoint of preventing ignition, the content of the organic solvent may be adjusted to the range of 1 to 20 mass % by adding water to the organic solvent developer.

[0093] In the method for producing a cured product pattern according to this embodiment, after removing at least a portion of the uncured portion in the development step, heating at 60 to 250°C or 0.2 to 10 J / cm ２ The cured product pattern may be further cured by performing exposure in an amount of 1000 ppm or more.

[0094] The method for producing a conductor pattern according to this embodiment includes a step of forming a conductor pattern using, as a mask, a cured product pattern (resist pattern) obtained by the method for producing a cured product pattern according to this embodiment. In the method for producing a conductor pattern according to this embodiment, the conductor pattern may be formed by plating or etching using, as a mask, the cured product pattern (resist pattern) obtained by the method for producing a cured product pattern according to this embodiment. Alternatively, the conductor pattern may be formed by plating or etching a substrate on which a cured product pattern obtained by the method for producing a cured product pattern according to this embodiment has been formed. Examples of materials constituting the conductor pattern include copper, solder, nickel, and gold.

[0095] In the method for producing a conductor pattern according to the first embodiment, a conductor pattern is formed by plating at least a portion (partial or all) of a portion of a substrate where a cured product pattern is not formed, using the cured product pattern obtained by the method for producing a cured product pattern according to the present embodiment as a mask. In the method for producing a conductor pattern according to the first embodiment, the substrate may include a conductor layer, and with the cured product pattern obtained by the method for producing a cured product pattern according to the present embodiment formed on the conductor layer, the conductor pattern may be formed by plating at least a portion (partial or all) of a portion of the conductor layer of the substrate where the cured product pattern is not formed, using the cured product pattern as a mask. The materials of the conductor layer of the substrate and the plating layer (conductor layer) formed by the plating process may be the same or different. When the conductor layer of the substrate and the plating layer (conductor layer) formed by the plating process are the same material, the conductor layer and the plating layer may be integrated. The plating process may be electrolytic plating or electroless plating. Examples of plating processes include copper plating, solder plating, nickel plating, and gold plating.

[0096] In the method for producing a conductor pattern according to the second embodiment, a substrate is provided with a conductor layer, and in a state in which a cured product pattern obtained by the method for producing a cured product pattern according to the present embodiment is formed on the conductor layer, the cured product pattern (resist pattern) is used as a mask to etch away at least a portion (partial or all) of the conductor layer that is not covered by the cured product pattern, thereby forming a conductor pattern covered by the cured product pattern. The etching method is appropriately selected depending on the conductor layer to be removed.

[0097] The method for producing a conductive pattern according to this embodiment may include a step of removing the cured pattern from the substrate after the plating or etching process described above. The cured pattern can be removed, for example, with an aqueous solution that is more alkaline than the aqueous solution used in the developing process.

[0098] In the method for producing a conductive pattern according to the first embodiment, when the substrate has a conductive layer, after removing the cured product pattern, the portion of the conductive layer of the substrate that was covered with the cured product pattern may be removed by etching (e.g., flash etching). The etching method is appropriately selected depending on the conductive layer to be removed.

[0099] One aspect of the method for producing a conductor pattern according to this embodiment is a method for producing a wiring board (e.g., a method for producing a printed wiring board), which includes a step of forming a wiring pattern (e.g., a circuit) as a conductor pattern using, as a mask, a cured product pattern obtained by the method for producing a cured product pattern according to this embodiment. The wiring board according to this embodiment can be obtained by the method for producing a wiring board according to this embodiment. The wiring board according to this embodiment may be a single-layer printed wiring board, a multilayer printed wiring board, or a printed wiring board having small-diameter through holes.

[0100] FIG. 2 is a schematic cross-sectional view showing an example of a method for producing a conductor pattern (semi-additive process). In FIG. 2(a), a substrate 20 is prepared. The substrate 20 includes an insulating layer 22 and a conductor layer 24 disposed on the insulating layer 22. The conductor layer 24 is, for example, a copper layer. In FIG. 2(b), the protective layer 16 of the photosensitive element 10 in FIG. 1 is peeled off, and then the photosensitive layer 14 of the photosensitive element 10 and the support 12 are laminated on the substrate 20 (photosensitive layer formation step). In FIG. 2(c), the photosensitive layer 14 is irradiated through the support 12 with actinic light L projected from a photomask image (projection exposure method exposure step), and then the photosensitive layer 14 is heated. In FIG. 2(d), portions of the photosensitive layer 14 other than the photocured portion are removed from the substrate 20, thereby forming a cured product pattern 14a (photocured portion of the photosensitive layer 14) on the substrate 20 (development step). In (e) of Fig. 2, a plating process is performed using the cured product pattern 14a as a mask to form a plating layer 30 on the conductor layer 24 that is not covered by the cured product pattern 14a in the substrate 20. In (f) of Fig. 2, the cured product pattern 14a is removed, and then the portion of the conductor layer 24 that was covered by the cured product pattern 14a is removed to form a conductor layer 24a. This forms a conductor pattern 40 composed of the conductor layer 24a and the plating layer 30.

[0101] The present disclosure will be explained in more detail below using examples, but the present disclosure is not limited to these examples.

[0102] <Preparation of Binder Polymer> Solution (a) was prepared by mixing 27 parts by mass of methacrylic acid, 50 parts by mass of styrene, 20 parts by mass of benzyl methacrylate, 3 parts by mass of 2-hydroxyethyl methacrylate, and 0.9 parts by mass of azobisisobutyronitrile. Solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixed solution (x) of 30 parts by mass of 1-methoxy-2-propanol and 20 parts by mass of toluene.

[0103] 500 parts by mass of a mixed solution (x1) containing 300 parts by mass of 1-methoxy-2-propanol and 200 parts by mass of toluene was placed in a flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel, and nitrogen gas inlet tube. Then, nitrogen gas was blown into the flask while stirring the mixed solution (x1). The mixed solution (x1) was heated to 80°C. Next, the above-described solution (a) was added dropwise to the mixed solution (x1) at a constant dropwise rate over 4 hours to obtain a mixed solution (x2), and the mixed solution (x2) was stirred at 80°C for 2 hours. Next, the above-described solution (b) was added dropwise to the mixed solution (x2) at a constant dropwise rate over 10 minutes to obtain a mixed solution (x3). The mixed solution (x3) was then stirred at 80°C for 3 hours. Next, while stirring the mixed solution (x3), the mixed solution (x3) was heated to 95°C over 30 minutes, and then the mixed solution (x3) was kept at 95°C for 2 hours. After stopping the stirring, the mixed solution (x3) was cooled to room temperature (25°C) to obtain a binder polymer solution. The non-volatile content (solid content) of the binder polymer solution was 49 mass%. The binder polymer had a weight average molecular weight (Mw) of 35,000, a number average molecular weight (Mn) of 16,000, and an acid value of 176 mgKOH / g.

[0104] The weight-average molecular weight and number-average molecular weight were measured by gel permeation chromatography (GPC) under the following conditions and calculated using a calibration curve of standard polystyrene. Pump: Hitachi L-6000 type (trade name, manufactured by Hitachi, Ltd.) Column: Gelpack GL-R420, Gelpack GL-R430, Gelpack GL-R440 (all trade names, manufactured by Resonac Corporation) Eluent: tetrahydrofuran Measurement temperature: 40°C Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI (trade name, manufactured by Hitachi, Ltd.)

[0105] The acid value was measured using the following procedure. First, 1 g of the binder polymer to be measured for acid value was precisely weighed. Next, 30 g of acetone was added to this binder polymer to uniformly dissolve the binder polymer, thereby obtaining a solution. Next, an appropriate amount of phenolphthalein as an indicator was added to this solution, and then titration was performed using a 0.1 N aqueous potassium hydroxide (KOH) solution. The acid value was determined by calculating the mass (unit: mg) of potassium hydroxide required to neutralize the acetone solution of the binder polymer.

[0106] <Preparation of Photosensitive Resin Composition> The above-described binder polymer, the photopolymerizable compound shown in Table 1, 6.5 parts by mass of a photopolymerization initiator (BCIM: 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, manufactured by Hampford Chemical Industry Co.), 0.02 parts by mass of a sensitizer shown in Table 1, 4-tert-butylcatechol (polymerization inhibitor, manufactured by DIC Corporation, trade name "DIC-TBC"), and 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl (polymerization inhibitor) were mixed together. A photosensitive resin composition was prepared by mixing 0.03 parts by mass of a photosensitizer (manufactured by Adeka Corporation, trade name "LA-7RD"), 0.4 parts by mass of leuco crystal violet (manufactured by Yamada Chemical Co., Ltd.), 0.02 parts by mass of malachite green (manufactured by Osaka Organic Chemical Industry Ltd.), and 0.5 parts by mass of an additive (a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol, manufactured by Sanwa Chemical Co., Ltd., trade name "SF-808H"). The blending amount of each component is the mass of nonvolatile content (solid content). Table 1 shows the blending amounts of the binder polymer, photopolymerizable compound, and sensitizer (mass of nonvolatile content (solid content), unit: parts by mass).

[0107] As the photopolymerizable compounds and sensitizers in Table 1, the following components were used.

[0108] (Photopolymerizable compounds) B1: EO-modified bisphenol A dimethacrylate (EO groups: 10 (total), molecular weight: 804, manufactured by Resonac Co., Ltd., trade name "FA-321M") B2: EO-modified ditrimethylolpropane tetramethacrylate (EO groups: 12 (total), molecular weight: 1050, manufactured by Toho Chemical Industry Co., Ltd.) B3: 2,2-bis(4-(methacryloxypolyethoxy)phenyl)propane (EO groups: 2.6 (total), manufactured by Kyoeisha Chemical Co., Ltd., trade name "BP-2EM") B4: (PO)(EO)(PO)-modified dimethacrylate (EO groups: 6 (total), PO groups: 12 (total), molecular weight: 1114, manufactured by Resonac Co., Ltd., trade name "FA-024M")

[0109] (Sensitizers) D1: 9,10-dibutoxyanthracene (manufactured by Air Water Performance Chemicals Inc., trade name "UVS-1331") D2: 9,10-diethoxyanthracene (manufactured by Air Water Performance Chemicals Inc., trade name "UVS-1101") D3: 9,10-dipropoxyanthracene (manufactured by Air Water Performance Chemicals Inc., trade name "UVS-1221")

[0110] <Preparation of Photosensitive Element> A polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name "FS-31", thickness: 16 μm) was prepared as a support. The above-described photosensitive resin composition was applied to the support so as to have a uniform thickness, and then dried sequentially in a hot air convection dryer at 80°C and 120°C to form a photosensitive layer (film-like photosensitive resin composition, thickness after drying: 15 μm). A polyethylene film (manufactured by Tamapoly Co., Ltd., trade name "NF-15A", thickness: 28 μm) was laminated to this photosensitive layer as a protective layer, thereby obtaining a photosensitive element having a support, a photosensitive layer, and a protective layer in that order.

[0111] <Preparation of Laminate A> A copper-clad laminate (manufactured by Resonac Corporation, product name "MCL-E67") having copper foil (thickness: 35 μm) arranged on both sides of a glass epoxy material was pickled, washed with water, and then dried with an air flow. Next, the copper-clad laminate was heated to 80°C, and the protective layer was peeled off, and the above-mentioned photosensitive element was laminated so that the photosensitive layer was in contact with the copper foil of the copper-clad laminate, thereby obtaining Laminate A having, in that order, the copper-clad laminate, the photosensitive layer, and the support. Lamination was performed using a heat roll at 110°C, at a compression pressure of 0.4 MPa and a roll speed of 1.0 m / min.

[0112] <Evaluation> (Minimum Development Time) The above-mentioned laminate A was cut into a square (5 cm x 5 cm) and then the support was peeled off to obtain a test piece. Next, the unexposed photosensitive layer of the test piece was spray-developed at a pressure of 0.18 MPa using a 1% by mass aqueous sodium carbonate solution at 30°C, and the shortest time required for visual confirmation of removal of the unexposed photosensitive layer was determined as the minimum development time. A full cone type nozzle was used. The distance between the above-mentioned test piece and the tip of the nozzle was 12 cm, and the test piece was positioned so that the center of the test piece coincided with the center of the nozzle.

[0113] (Adhesion) A 41-step step tablet (manufactured by Resonac Co., Ltd.) was placed on the support of the above-mentioned laminate A, and then the photosensitive layer was exposed through the support using a direct imaging exposure machine (manufactured by Oak Manufacturing Co., Ltd., product name: FDi-MP) with a blue-violet laser diode having a wavelength of 405 nm as a light source, using a drawing pattern with line width (L) / space width (S) of x / 3x (x=3.0 to 10.0 μm, 0.5 μm intervals) at an exposure amount (irradiation energy amount) such that the number of remaining steps after development of the 41-step step tablet was 15, thereby obtaining a laminate B1.

[0114] Two minutes after the exposure, the laminate B1 was placed in a box dryer (manufactured by Etac Engineering Co., Ltd., trade name "HT220S") at 80°C and heated for 30 seconds to obtain a laminate B2.

[0115] The support was peeled off from each of laminates B1 and B2 to expose the photosensitive layer, and the unexposed portions were removed by spraying a 1.0% by mass aqueous sodium carbonate solution at 30°C for twice the minimum development time described above. After development, the space portions (unexposed portions) were removed without residue, and the line portions (exposed portions) were formed without meandering or chipping. The minimum line width (unit: μm) of the resist pattern was determined. Cases where the reduction in the minimum line width after post-exposure baking (PEB) exceeded 1.0 μm compared to cases without post-exposure baking (PEB) were evaluated as "A," and cases where the reduction in the minimum line width was 1.0 μm or less were evaluated as "B." The results are shown in Table 1.

[0116] (Resolution) A 41-step tablet (manufactured by Resonac Co., Ltd.) was placed on the support of the above-mentioned laminate A (excluding the laminate A of Comparative Example), and then the photosensitive layer was exposed through the support using a direct imaging exposure machine (manufactured by Oak Manufacturing Co., Ltd., product name: FDi-MP) with a blue-violet laser diode having a wavelength of 405 nm as a light source, using a drawing pattern with a line width (L) / space width (S) of 3x / x (x=3.0 to 10.0 μm, 0.5 μm intervals) at an exposure amount (irradiation energy amount) such that the number of remaining steps after development of the 41-step tablet was 15, thereby obtaining a laminate C1.

[0117] Two minutes after the exposure, the laminate C1 was placed in a box dryer (manufactured by Etac Engineering Co., Ltd., trade name "HT220S") heated to 80°C and heated for 30 seconds to obtain a laminate C2.

[0118] The supports were peeled off from each of the laminates C1 and C2 to expose the photosensitive layer, and the unexposed portions were removed by spraying a 1.0% by mass aqueous solution of sodium carbonate at 30°C for twice the minimum development time mentioned above. After development, the space portions (unexposed portions) were removed without residue, and the minimum space width (unit: μm) in the resist pattern was obtained, in which the line portions (exposed portions) were formed without meandering or chipping. The results are shown in Table 1.

[0119]

[0120] 10...photosensitive element, 12...support, 14...photosensitive layer, 14a...cured product pattern, 16...protective layer, 20...substrate, 22...insulating layer, 24, 24a...conductor layer, 30...plating layer, 40...conductor pattern, L...actinic light.

Claims

1. A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer comprises polymer a having a styrene compound as a monomer unit, the photopolymerizable compound comprises a polyfunctional monomer having two or more radical reactive groups and at least one skeleton selected from the group consisting of a bisphenol A skeleton and a ditrimethylolpropane skeleton, and the content of the polyfunctional monomer is 92 mass% or more based on the total amount of the photopolymerizable compound.

2. The photosensitive resin composition according to claim 1, wherein the molecular weight of the polyfunctional monomer is 600 to 1,200.

3. The photosensitive resin composition according to claim 1, wherein the polyfunctional monomer further has 8 to 16 oxyethylene groups.

4. The photosensitive resin composition according to claim 1, wherein the content of the photopolymerizable compound is 43.5 parts by mass or more per 100 parts by mass of the binder polymer and the photopolymerizable compound combined.

5. The photosensitive resin composition according to claim 1, wherein the polymer a further contains an aryl (meth)acrylate as a monomer unit.

6. The photosensitive resin composition according to claim 1, wherein the polymer a further contains a hydroxyalkyl (meth)acrylate as a monomer unit.

7. The photosensitive resin composition according to claim 1, wherein the polymer a is substantially free of N-substituted maleimide compounds as monomer units.

8. The photosensitive resin composition according to claim 1, further comprising a sensitizer.

9. The photosensitive resin composition according to claim 8, wherein the sensitizer comprises an anthracene compound.

10. A photosensitive element comprising a support and a photosensitive layer disposed on the support, wherein the photosensitive layer comprises the photosensitive resin composition according to any one of claims 1 to 9.

11. A cured product of the photosensitive resin composition according to any one of claims 1 to 9.

12. A method for producing a cured product pattern, comprising: a step of forming a photosensitive layer on a substrate using the photosensitive resin composition according to any one of claims 1 to 9; an exposure step of photo-curing a portion of the photosensitive layer; a heating step of heating the photosensitive layer after the exposure step; and a step of removing at least a portion of the uncured portion of the photosensitive layer after the heating step to form a cured product pattern.

13. A method for producing a conductor pattern, comprising the step of forming a conductor pattern using the cured product pattern obtained by the method for producing a cured product pattern according to claim 12 as a mask.

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