Compression resin sealing and molding device

Abstract

This compression resin sealing and molding device is for molding a sealing resin layer so as to partially cover a first surface (10a) of a substrate (10) while sealing a component (13) disposed on the first surface (10a) of the substrate (10) having the first surface (10a) and a second surface (10b) that constitute the front and back of the substrate. The compression resin sealing and molding device comprises: a lower mold that faces the first surface (10a); an upper mold (5) that abuts the second surface (10b); and a pressure sensor (8). The lower mold comprises: a lower mold center part (32) having a lower mold center upper surface corresponding to the lower surface of the sealing resin layer; a stripper part (33) arranged so as to surround the lower mold center part (32); and a passage closing member (35). A notch is provided in a part of the inner periphery of the stripper part (33), and the passage closing member (35) is disposed inside the notch. A cavity for melting and molding a resin material is formed by an inner peripheral side surface of the stripper part (33), a side surface of the passage closing member (35) on the side opposite from the stripper part (33), and the lower mold center upper surface. The stripper part (33) has, on the outside of the cavity, a pocket section that is a recess for accommodating the resin material flowing out from the cavity. The passage closing member (35) can assume, by being lowered, a first state in which outflow of the resin material from the cavity to the pocket section is allowed and, by being lifted, a second state in which outflow of the resin material from the cavity to the pocket section is hindered. The passage closing member (35) has a contact surface facing upward at a constant height. The pressure sensor (8) is disposed on at least one of an upper mold (5) and the lower mold so that the internal pressure of the cavity can be measured.

Description

Compression resin sealing molding machine

[0001] The present invention relates to a compression resin sealing molding apparatus.

[0002] Methods and devices for compression resin molding are described in Japanese Patent Application Laid-Open No. 2014-212251 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2014-207302 (Patent Document 2). The method and device described in Patent Document 1 are said to be able to evenly supply and fill the entire lower mold cavity with resin material by flattening a required amount of resin to provide the required shape retention and using a sheet-shaped resin molded to correspond to the shape of the lower mold cavity. Furthermore, since a fixed, standardized sheet-shaped resin can be used without considering the amount of excess resin, it is said that the work of measuring and adjusting the amount of resin supplied to the lower mold cavity can be omitted.

[0003] The method and apparatus described in Patent Document 2 are said to be able to eliminate the need to measure and adjust the amount of resin supplied into the lower mold cavity, and to be able to mold the package to a specified thickness.

[0004] In the device described in Patent Document 3, a stepped surface is provided around the outer periphery of the upper surface of the lower mold cavity piece, and multiple overflow cavities are provided on this stepped surface. Furthermore, multiple through holes are provided in this stepped surface, and float pieces are inserted into each of the through holes so that they can be raised and lowered. The float piece is biased upward by a coil spring, and compression molding is performed while the float piece is inserted into the lower mold cavity recess through the stepped surface. Patent Document 3 states that this absorbs the difference between the volume of the lower mold cavity and the amount of mold resin supplied.

[0005] JP 2014-212251 A JP 2014-207302 A JP 2019-136944 A

[0006] In the methods and devices described in Patent Documents 1 and 2, a storage section is provided around the lower mold cavity, and excess resin flows into the storage section. However, with the methods and devices described in Patent Documents 1 and 2, the excess resin that flows into the storage section solidifies in contact with the surface of the substrate, resulting in the problem that the excess resin remains attached to the outer edge of the resulting substrate.

[0007] In the structure described in Patent Document 3, only the thickness of the resin portion can be adjusted. In order to adjust for variations in the thickness of the object, a separate adjustment mechanism is provided in the upper mold, resulting in a complex structure.

[0008] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a compression resin sealing molding apparatus that can perform appropriate resin sealing.

[0009] To achieve the above object, a compression resin encapsulation molding apparatus according to the present invention is a compression resin encapsulation molding apparatus for encapsulating components arranged on a first surface of a substrate, the first surface being opposite to the first surface of the substrate, while molding an encapsulating resin layer so as to partially cover the first surface of the substrate. The apparatus includes a lower mold facing the first surface, an upper mold abutting the second surface, and a pressure sensor. The lower mold includes a lower mold center portion having a central upper surface corresponding to the lower surface of the encapsulating resin layer, a stripper portion arranged to surround the lower mold center portion, and a passage closure member. A notch is provided in a portion of the inner periphery of the stripper portion, and the passage closure member is arranged within the notch. A cavity for melting and encapsulating a resin material is formed by the inner peripheral side surface of the stripper portion, the side surface of the passage closure member opposite the stripper portion, and the central upper surface of the lower mold. The stripper portion has a pocket portion, which is a recessed portion, outside the cavity and which accommodates the resin material flowing out of the cavity. The passage closing member can be in a first state, by descending, that allows the resin material to flow from the cavity to the pocket, and in a second state, by ascending, that prevents the resin material from flowing from the cavity to the pocket. The passage closing member has an abutment surface that faces upward at a certain height. The pressure sensor is disposed in at least one of the upper mold and the lower mold so as to be able to measure the internal pressure of the cavity.

[0010] According to the present invention, in the first state, resin overflowing from the cavity can be released into the pocket portion, and by switching to the second state thereafter, the outflow of resin can be prevented, thereby achieving appropriate resin sealing. Furthermore, since a pressure sensor capable of measuring the internal pressure of the cavity is provided, the timing for switching from the first state to the second state can be appropriately determined by detecting the internal pressure with this pressure sensor.

[0011] FIG. 1 is a conceptual diagram of a compression resin sealing molding apparatus in a first embodiment based on the present invention. FIG. 2 is a perspective view of a lower mold included in the compression resin sealing molding apparatus in the first embodiment based on the present invention. FIG. 3 is a plan view of the lower mold included in the compression resin sealing molding apparatus in the first embodiment based on the present invention. FIG. 4 is a perspective view of a passage closure member included in the compression resin sealing molding apparatus in the first embodiment based on the present invention. FIG. 5 is a first partial cross-sectional view of the compression resin sealing molding apparatus in a lowered state according to the present invention. FIG. 6 is a second partial cross-sectional view of the compression resin sealing molding apparatus in a lowered state according to the present invention. FIG. 7 is a first partial cross-sectional view of the compression resin sealing molding apparatus in a raised state according to the present invention. FIG. 8 is a second partial cross-sectional view of the compression resin sealing molding apparatus in a raised state according to the present invention. FIG. 9 is a first explanatory view of a compression resin sealing molding apparatus in a second embodiment based on the present invention. FIG. 10 is an explanatory view of a positional relationship of a plurality of stroke amount regulating member pieces included in the compression resin sealing molding apparatus in the second embodiment based on the present invention. FIG. 1 is an explanatory diagram of the positional relationship of a plurality of stroke amount regulating member pieces included in a first modified example of the compression resin sealing molding apparatus in embodiment 2 based on the present invention. FIG. 2 is an explanatory diagram of the positional relationship of a plurality of stroke amount regulating member pieces included in a second modified example of the compression resin sealing molding apparatus in embodiment 2 based on the present invention. FIG. 3 is a conceptual diagram of the compression resin sealing molding apparatus in embodiment 3 based on the present invention. FIG. 4 is a conceptual diagram of a modified example of the compression resin sealing molding apparatus in embodiment 3 based on the present invention. FIG. 5 is a first explanatory diagram of the operation of the compression resin sealing molding apparatus in embodiment 3 based on the present invention. FIG. 6 is a second explanatory diagram of the operation of the compression resin sealing molding apparatus in embodiment 3 based on the present invention. FIG. 7 is a fourth explanatory diagram of the operation of the compression resin sealing molding apparatus in embodiment 3 based on the present invention. FIG. 8 is a cross-sectional view of a product obtained as a result of the operation of the compression resin sealing molding apparatus in embodiment 3 based on the present invention. FIG. 9 is a graph illustrating the use of a pressure sensor to identify the timing of operation of a passage closing member.FIG. 1 is a first explanatory diagram of a compression resin encapsulation molding apparatus according to a fourth embodiment of the present invention. FIG. 2 is a perspective view of a lower mold included in the compression resin encapsulation molding apparatus according to the fourth embodiment of the present invention. FIG. 3 is a perspective view of a passage closure member included in the compression resin encapsulation molding apparatus according to the fourth embodiment of the present invention. FIG. 4 is an explanatory diagram of the operation of the passage closure member included in the compression resin encapsulation molding apparatus according to the fourth embodiment of the present invention. FIG. 5 is a second explanatory diagram of the compression resin encapsulation molding apparatus according to the fourth embodiment of the present invention. FIG. 6 is a cross-sectional view of a state in which a substrate and a powdered resin material are placed in the compression resin encapsulation molding apparatus according to the fifth embodiment of the present invention. FIG. 7 is a plan view of a state in which only the outer frame and the inner frame have been removed from the compression resin encapsulation molding apparatus according to the fifth embodiment of the present invention. FIG. 8 is a cross-sectional view of a compression resin encapsulation molding apparatus according to the fifth embodiment of the present invention, in which the lower mold is relatively close to the upper mold. FIG. 9 is a cross-sectional view of a compression resin encapsulation molding apparatus according to the fifth embodiment of the present invention, in which the inner frame has been lowered. FIG. 10 is a plan view of a molded product obtained by the compression resin encapsulation molding apparatus according to the fifth embodiment of the present invention. FIG. 11 is a cross-sectional view of a molded product obtained by the compression resin encapsulation molding apparatus according to the fifth embodiment of the present invention. Fig. 10 is an explanatory view of a state in which work is started with a substrate held in an upper mold in a compression resin encapsulation molding apparatus in a fifth embodiment according to the present invention. Fig. 11 is a plan view of a state in which only an outer frame and an inner frame are removed from a modified example of the compression resin encapsulation molding apparatus in the fifth embodiment according to the present invention. Fig. 12 is a conceptual diagram of a compression resin encapsulation molding apparatus in a sixth embodiment according to the present invention. Fig. 13 is a conceptual diagram of a modified example of the compression resin encapsulation molding apparatus in the sixth embodiment according to the present invention.

[0012] The dimensional ratios shown in the drawings do not necessarily represent the actual ratios, and may be exaggerated for the sake of convenience. In the following description, when the concepts of up and down are mentioned, they do not necessarily mean absolute up and down, but may mean relative up and down in the illustrated position.

[0013] In the following, when we say that member A and member B are in contact with each other, it does not only include the case where member A and member B are in direct contact with each other without any intervening means, but also the case where member A and member B are in contact with each other via some kind of thin sheet. In other words, even if some kind of thin sheet is interposed between member A and member B, it may be expressed as member A and member B being in contact with each other. Note that the intervening thin sheet is not limited to one sheet, and may be multiple sheets.

[0014] 1 to 8, a compression resin encapsulation molding apparatus according to a first embodiment of the present invention will be described. An outline of the compression resin encapsulation molding apparatus according to the present embodiment is shown in FIG.

[0015] The compression resin encapsulation molding apparatus 101 is a compression resin encapsulation molding apparatus for encapsulating components arranged on the first surface 10a of a substrate 10 having a first surface 10a and a second surface 10b that are opposite each other, while molding an encapsulation resin layer so as to partially cover the first surface 10a of the substrate 10. In Fig. 1, the components arranged on the first surface 10a of the substrate 10 are not shown.

[0016] The compression resin encapsulation molding device 101 includes a lower mold 3 facing the first surface 10a, an upper mold 5 abutting the second surface 10b, and a pressure sensor 8. Figure 2 shows the lower mold 3 removed. Figure 3 shows a plan view of the lower mold 3. The lower mold 3 includes a lower mold center portion 32, a stripper portion 33, and a passage closing member 35. The lower mold center portion 32 has a lower mold center upper surface 32a that corresponds to the lower surface of the encapsulating resin layer. The stripper portion 33 is disposed to surround the lower mold center portion 32. In the example shown here, the stripper portion 33 abuts against the first surface 10a. The pressure sensor 8 is installed in the lower mold 3. The upper end of the pressure sensor 8 is exposed at the lower mold center upper surface 32a.

[0017] As shown in FIG. 1 , the upper mold 5 includes an upper mold base portion 51 and an upper mold block 52. The upper mold block 52 is fixed to the underside of the upper mold base portion 51. The upper mold block 52 has a contact surface 52a facing downward. The lower mold 3 includes a lower mold base portion 31, a stroke amount limiting member 34, and an elastic body 37. The stripper portion 33 has a through hole 7. The stroke amount limiting member 34 is inserted into the through hole 7. The stroke amount limiting member 34 will be described in detail later.

[0018] As shown in Figures 2 and 3, a notch is provided in part of the inner periphery of the stripper portion 33. The passage closure member 35 is disposed inside the notch. The cavity 2 is formed by the inner peripheral side surface 33b of the stripper portion 33, the side surface of the passage closure member 35 opposite the stripper portion 33, and the central upper surface 32a of the lower mold. The cavity 2 is a space for melting and molding the resin material. The stripper portion 33 has a pocket portion 36, which is a recessed portion, outside the cavity 2 and which accommodates the resin material that flows out of the cavity 2.

[0019] The passage closure member 35 can be in a first state, in which it allows the resin material to flow from the cavity 2 to the pocket portion 36, by descending, or in a second state, in which it prevents the resin material from flowing from the cavity 2 to the pocket portion 36, by ascending. Figure 4 shows the passage closure member 35 alone. The passage closure member 35 has an abutment surface 35a that faces upward at a certain height. The passage closure member 35 further has surfaces 35b, 35c, and 35d. Surface 35b faces upward at a position lower than abutment surface 35a. Surface 35c is a side surface that comes into contact with the stripper portion 33. Surface 35d is the upper surface of the portion that protrudes to the left and right.

[0020] A cross section of the passage closure member 35 and its vicinity is shown in Figure 5. A view in the direction of arrow 91 in Figure 5 is shown in Figure 6. An elastic body 38 is interposed between the passage closure member 35 and the stripper portion 33. In the example shown here, the elastic body 38 is installed on the surface 35d of the protruding portion. The elastic body 38 may be, for example, a spring. The passage closure member 35 is urged downward by the elastic body 38. A push-up pin 39 is arranged below the passage closure member 35. In the state shown in Figure 6, i.e., when the push-up pin 39 is not pushing up the passage closure member 35, the passage closure member 35 is in a lowered state due to the action of the elastic body 38.

[0021] 5 and 6 show a state in which the passage closing member 35 is lowered, which corresponds to the "first state" described above. In Fig. 5, the passage 6 is open. Resin material overflowing from the cavity 2 can flow through the passage 6 toward the pocket portion 36, as indicated by arrow 92.

[0022] On the other hand, the aforementioned "second state," i.e., the state in which the passage closure member 35 is raised, is shown in FIGS. 7 and 8. In FIG. 7, the abutment surface 35a of the passage closure member 35 abuts against the substrate 10. In this state, the passage 6 is blocked. In this state, the surface 35b forms part of the bottom surface of the pocket portion 36. As shown in FIG. 8, the push-up pin 39 pushes up the passage closure member 35 in the direction of arrow 93. At this time, the push-up pin 39 pushes up the passage closure member 35 against the downward bias of the elastic body 38 against the passage closure member 35. As a result, as shown in FIG. 8, the abutment surface 35a of the passage closure member 35 and the upper surface 33a of the stripper portion 33 are located on the same plane.

[0023] As shown here, the contact surface 35a of the passage closure member 35 may contact the substrate 10, but other configurations are also possible. For example, a configuration may be adopted in which the outer shape of the substrate 10 is smaller than the size of the cavity 2 when viewed in a plan view, and the contact surface 35a of the passage closure member 35 directly contacts the contact surface 52a of the upper mold 5. In this case, the substrate 10 is not clamped by the upper surface 33a of the stripper portion 33, the contact surface 35a of the passage closure member 35, and the contact surface 52a of the upper mold 5. In this case, the size of the formed sealing resin layer when viewed in a plan view is larger than the size of the substrate 10 when viewed in a plan view.

[0024] When viewed from a direction perpendicular to the lower mold central upper surface 32a, the end of the abutting surface 35a closer to the cavity 2 is closer to the cavity 2 than the outer edge of the first surface 10a, and the end of the abutting surface 35a farther from the cavity 2 is farther from the cavity 2 than the outer edge of the first surface 10a. This means that when viewed from a direction perpendicular to the first surface 10a, the abutting surface 35a is positioned astride the outer edge of the first surface 10a. That is, in the second state, as shown in FIG. 7 , a portion of the abutting surface 35a is in surface contact with a portion of the first surface 10a.

[0025] The pressure sensor 8 is disposed in at least one of the upper mold 5 and the lower mold 3 so as to measure the internal pressure of the cavity 2. The pressure sensor 8 may be disposed anywhere as long as it can detect the pressure of the resin. In the example shown here, the pressure sensor 8 is disposed near a long side of the central upper surface 32a of the lower mold, but other positions are also acceptable. The pressure sensor 8 may be disposed, for example, in the center of the central upper surface 32a of the lower mold, or near an end of the central upper surface 32a of the lower mold. In the example shown here, one pressure sensor 8 is disposed for one cavity 2, but multiple pressure sensors 8 may be disposed for one cavity 2.

[0026] In this embodiment, in the first state, resin overflowing from the cavity 2 can be released into the pocket portion 36, and then switching to the second state can prevent the resin from flowing out. This allows a clear distinction between the resin that should be solidified in the cavity 2 and the unnecessary overflowing resin. In the second state, as shown in FIG. 7 , the contact surface 35 a of the passage closing member 35 contacts the first surface 10 a of the substrate 10, preventing the resin overflowing from the cavity 2 from adhering to the outer edge surface of the substrate. This embodiment also prevents the overflow of resin more than necessary. As described above, this embodiment enables appropriate resin sealing. It is preferable that the contact surface 35 a contacts the first surface 10 a of the substrate 10 at a so-called ear portion outside the first surface 10 a, rather than at the area where the sealing resin is formed.

[0027] Note that information obtained from the pressure sensor 8 can be used to determine the timing for switching between the first state and the second state. This allows switching from the first state to the second state at an appropriate timing. This will be described in detail later with reference to FIG. 21.

[0028] 4 shows a perspective view of the passage closing member 35, but the shape shown in Fig. 4 is merely an example. The passage closing member 35 only needs to have the function of allowing the resin material to escape to the pocket portion 36 in the first state and preventing the outflow of the resin material in the second state, and the shape of the passage closing member 35 is not limited to that shown in Fig. 4.

[0029] In this embodiment, as shown in FIG. 3 as an example, the passage closure member 35 is, more precisely, an assembly of multiple passage closure member pieces. In the example shown here, the passage closure member 35 includes four passage closure member pieces. As shown in this embodiment, the passage closure member 35 includes multiple passage closure member pieces, which are preferably symmetrically arranged along the first and second opposing sides of the cavity 2. By adopting this configuration, resin overflowing from the cavity 2 can be discharged from multiple locations in parallel, thereby achieving efficient discharge. In FIG. 3, the cavity 2 is shown as a horizontally elongated rectangular recess, but the left side of this rectangle is the first side and the right side is the second side. The first and second sides may be assigned in reverse. In either case, both the first and second sides are short sides. As shown in this embodiment, the cavity 2 has two parallel long sides and two parallel short sides, and it is preferable that both the first and second sides are short sides. By adopting this configuration, a passage for discharging resin is provided on each of the two farthest short sides of the shape of the cavity 2, so that resin overflowing from the cavity 2 can be efficiently discharged.

[0030] Furthermore, the shape of the cavity 2 when viewed from above may be square. In this case, the passage for discharging the resin may be provided on any side, but it is preferable to provide the passage on two opposing sides.

[0031] (Second Objective) The methods and devices described in Patent Documents 1 and 2 are believed to be able to achieve a desired resin layer thickness in the resulting product. However, there is generally variation in the thickness of the substrate. Since the thickness of the resulting product is the sum of the thickness of the substrate and the thickness of the resin layer, even if the thickness of the resin layer can be accurately achieved, the variation in the product thickness includes components derived from the variation in the thickness of the substrate, and therefore the variation cannot be sufficiently suppressed.

[0032] Therefore, in the following, the second objective is to provide a compression resin sealing molding device that can reduce the variation in thickness of the resulting product even if there is variation in the thickness of the substrate, and this will be considered.

[0033] Second Embodiment A compression resin sealing molding apparatus according to a second embodiment of the present invention will be described with reference to FIGS.

[0034] FIG. 9 shows the state in which the encapsulating resin material 11 is placed in the cavity 2 of the compression resin encapsulating molding apparatus of this embodiment and the lower mold 3 is moved relatively close to the upper mold 5. Here, as an example, the lower mold 3 is raised as indicated by arrow 94. The upper surface 33a of the stripper portion 33 is already in contact with the first surface 10a of the substrate 10. The second surface 10b of the substrate 10 is in contact with the contact surface 52a of the upper mold block 52. A stroke amount limiting member 34 is fixed to the upper surface of the lower mold base portion 31. The stroke amount limiting member 34 is a rod-shaped member having a certain length. The upper portion of the stroke amount limiting member 34 is inserted into the through-hole 7 provided in the stripper portion 33.

[0035] An elastic body 37 is interposed between the stripper portion 33 and the lower mold base portion 31. The elastic body 37 may be, for example, a spring. As shown in FIG. 9 , the lower mold base portion 31 continues to rise even after the stripper portion 33 contacts the substrate 10. The lower mold base portion 31 continues to rise while compressing the elastic body 37. Because the lower mold center portion 32 is fixed to the upper side of the lower mold base portion 31, the lower mold center portion 32 also rises together with the lower mold base portion 31. When the lower mold base portion 31 has risen to a certain extent, as shown in FIG. 10 , the upper end of the stroke amount limiting member 34 protrudes from the through hole 7 and abuts against the abutment surface 52 a of the upper mold block 52. Because the stroke amount limiting member 34 is a member having a certain length and sufficient rigidity, the lower mold base portion 31 cannot rise any further. Since the height difference between the upper end of the stroke amount limiting member 34 and the central upper surface 32 a of the lower mold is maintained constant, the central upper surface 32 a of the lower mold stops at a position a certain distance from the abutment surface 52 a of the upper mold block 52 .

[0036] The compression resin encapsulation molding apparatus of this embodiment can be described as follows. This compression resin encapsulation molding apparatus is a compression resin encapsulation molding apparatus for encapsulating components arranged on a first surface 10a of a substrate 10 having a first surface and a second surface that are opposite each other, while molding an encapsulating resin layer so as to partially cover the first surface 10a of the substrate 10. This compression resin encapsulation molding apparatus includes a lower mold 3 facing the first surface 10a, an upper mold 5 abutting the second surface 10b, and a pressure sensor 8. The lower mold 3 includes a lower mold base portion 31, a lower mold center portion 32 having a lower mold central upper surface 32a corresponding to the lower surface of the encapsulating resin layer, a stripper portion 33 disposed to surround the lower mold center portion 32, and a stroke amount limiting member 34 fixed to the lower mold base portion 31 so as to protrude from the lower mold base portion 31. A cavity 2 for melting and molding a resin material is formed by an inner peripheral side surface 33b of the stripper portion 33 and the lower mold central upper surface 32a. The stripper portion 33 is supported by the lower mold base portion 31 via an elastic body 37. The stroke amount restricting member 34 abuts against the upper mold 5, thereby restricting the distance between a contact surface 52 a, which is a surface that abuts against the second surface 10 b of the upper mold 5, and the central upper surface 32 a of the lower mold so that it does not become smaller than a certain value.

[0037] It should be noted that the stroke amount restriction member 34 is not limited to a single member. In the example shown here, the stroke amount restriction member 34 includes multiple stroke amount restriction member pieces. The multiple stroke amount restriction member pieces are arranged as shown in the plan view of FIG. 11. That is, the multiple stroke amount restriction member pieces are arranged so as to surround the cavity 2. In this example, the lower mold 3 is rectangular in plan view, and four stroke amount restriction member pieces are arranged at equal intervals along each of the two long sides. That is, a total of eight stroke amount restriction member pieces are arranged. The number and arrangement are not limited to this. For example, the number and arrangement may be as shown in FIGS. 12 and 13.

[0038] The pressure sensor 8 is disposed in at least one of the upper mold 5 and the lower mold 3 so as to be able to measure the internal pressure of the cavity 2 .

[0039] In this embodiment, the stroke amount limiting member 34 restricts the distance between the contact surface 52a of the upper mold 5 and the central upper surface 32a of the lower mold so that it does not become smaller than a certain value, so that the thickness of the entire product, which is the sum of the thickness of the substrate 10 and the thickness of the sealing resin, can be made constant. In this embodiment, even if the thickness of the substrate 10 varies, the thickness of the sealing resin is naturally adjusted, and as a result, the thickness of the entire product obtained can be made constant.

[0040] The stripper unit 3 and the stroke amount limiting member 34 can be displaced separately. If the thickness of the desired product is changed, this can be accommodated by replacing the stroke amount limiting member 34 with one of a different length.

[0041] As shown in this embodiment, the stroke amount limiting member 34 preferably includes a plurality of stroke amount limiting member pieces, which are arranged so as to surround the cavity 2. By employing this configuration, the positional relationship between the lower die base portion 31 and the lower die central portion 32 and the stripper portion 33 can be stably controlled.

[0042] The configuration described in the second embodiment may be applied to the compression resin sealing molding apparatus in the first embodiment.

[0043] That is, in the compression resin sealing molding apparatus of the first embodiment, the lower mold 3 includes a lower mold base portion 31 and a stroke amount limiting member 34 fixed to the lower mold base portion 31 so as to protrude from the lower mold base portion 31, the stripper portion 33 is supported by the lower mold base portion 31 via an elastic body 37, and the stroke amount limiting member 34 preferably abuts against the upper mold 5 to restrict the distance between the surface of the upper mold 5 abutting against the second surface 10b and the lower mold central upper surface 32a so as not to be smaller than a certain value. By adopting this configuration, it is possible to obtain both the effects described in the first and second embodiments.

[0044] In this embodiment, the passage closure member 35 may also be provided, and the contact surface 35a of the passage closure member 35 may contact the substrate 10, but other configurations are also possible. For example, a configuration may be adopted in which the outer shape of the substrate 10 is smaller than the size of the cavity 2 in a plan view, and the contact surface 35a of the passage closure member 35 directly contacts the contact surface 52a of the upper mold 5. In this case, the substrate 10 is not clamped by the combination of the upper surface 33a of the stripper portion 33 and the contact surface 35a of the passage closure member 35, and the contact surface 52a of the upper mold 5. In this case, the size of the formed sealing resin layer in a plan view is larger than the size of the substrate 10 in a plan view.

[0045] Furthermore, in this compression resin sealing molding apparatus, it is preferable that the stroke amount limiting member 34 includes a plurality of stroke amount limiting member pieces, which are arranged so as to surround the cavity 2. By employing this configuration, it is possible to stably control the positional relationship between the lower die base portion 31 and the lower die center portion 32 and the stripper portion 33.

[0046] (Embodiment 3) A compression resin encapsulation molding apparatus according to a third embodiment of the present invention will be described with reference to Fig. 14. An outline of a compression resin encapsulation molding apparatus 102 according to this embodiment is shown in Fig. 14. The basic configuration of the compression resin encapsulation molding apparatus 102 is the same as that described in the first embodiment.

[0047] In the compression resin sealing molding apparatus 102, the surface of the upper die 5 facing the cavity 2 is covered with a release sheet 62. That is, the contact surface 52a of the upper die 5 is covered with the release sheet 62.

[0048] This embodiment also provides the same effects as those described in the first embodiment. Furthermore, in this embodiment, the resin material overflowing from the cavity 2 comes into contact with the release sheet 62 without directly contacting the contact surface 52a of the upper mold 5. The resin material that comes into contact with the release sheet 62 can be easily separated from the release sheet 62. This prevents the overflowing resin material from adhering to and remaining on the upper mold 5.

[0049] 15 may also be employed. In the compression resin encapsulation molding apparatus 103, the surface of the upper mold 5 facing the cavity 2, i.e., the contact surface 52a, is covered with a release sheet 62, and the surface of the lower mold 3 facing the upper mold 5, i.e., the upper surface 33a, and the inner surface of the cavity 2 are covered with a release sheet 61. By employing this configuration, it is possible to prevent the overflowing resin material from adhering to and remaining on not only the upper mold 5 but also the lower mold 3.

[0050] (Operation) The operation of the compression resin sealing molding device 103 will be described with reference to Figures 16 to 20. In Figures 16 to 19, the shape of the passage closing member 35 is shown in a simplified form. In reality, the passage closing member 35 may have the shape described in embodiment 1. Also, although the pocket portion 36 is not shown, a pocket portion 36 having the structure described in embodiment 1 may be provided immediately outside the passage 6.

[0051] First, as shown in Fig. 16 , the substrate 10 is sandwiched between the upper mold 5 and the stripper portion 33. In Fig. 16 , the cross section passing through the passage 6 is shown, so the passage 6 is visible, but the upper surface 33a of the stripper portion 33 abutting against the first surface 10a of the substrate 10 is not visible. However, in reality, in the portion of the outer edge of the substrate 10 that does not overlap with the passage 6, the upper surface 33a of the stripper portion 33 abuts against the lower surface of the substrate 10. In other words, the substrate 10 is sandwiched between the abutment surface 52a of the upper mold 5 and the upper surface 33a of the stripper portion 33.

[0052] To be precise, since the release sheets 61 and 62 are interposed, the contact surface 52a of the upper mold 5 and the upper surface 33a of the stripper portion 33 do not come into direct contact with the substrate 10, but when discussing which parts are in contact with the substrate 10, the existence of the release sheets 61 and 62 will be ignored.

[0053] A component 13 is mounted on the underside of the substrate 10. The component 13 may be an electronic component. A sealing resin material 11 is disposed in the cavity 2. At this point, the sealing resin material 11 does not need to be melted. At this point, the passage 6 is open. The component 13 is in contact with the sealing resin material 11.

[0054] As shown in Figure 17, the passage closing member 35 is raised to close the passage 6. In this state, pressure and heat are applied. The sealing resin material 11 melts and becomes resin 11e. The lower mold base portion 31 is raised. As the lower mold base portion 31 rises, the lower mold center portion 32 also rises. The resin 11e enters the gaps between the components 13. The resin 11e comes into contact with the first surface 10a of the substrate 10.

[0055] Next, as shown in Fig. 18 , the passage closing member 35 is lowered. This opens the passage 6, and the molten resin 11e flows through the passage 6 to the outside of the cavity 2. Although the pocket portion 36 is not shown in Fig. 18 , the molten resin 11e may flow into the pocket portion 36.

[0056] 19, the passage closing member 35 is raised to close the passage 6. In this way, the resin 11e that has been confined to seal the components 13 on the first surface 10a of the substrate 10 is separated from the excess resin 11e that has spilled out of the substrate 10.

[0057] Next, the upper mold 5 and the lower mold 3 are separated. In this way, a product such as that shown in FIG. 20 can be removed. This product includes a substrate 10, a component 13, and a sealing resin 14. The sealing resin 14 is attached to the first surface 10a of the substrate 10. The component 13 is sealed with the sealing resin 14. In FIG. 19, there is excess resin 11e that has spilled out onto the outside of the substrate 10, but thanks to the action of the release sheets 61 and 62, the excess resin 11e does not adhere to the upper mold 5 and the lower mold 3 and can be easily removed.

[0058] (Use of Pressure Sensor) In the first to third embodiments, the compression resin sealing molding apparatus is equipped with a pressure sensor 8. The role of this pressure sensor 8 will be described with reference to Fig. 21. The horizontal axis of Fig. 21 represents the progress of time.

[0059] For example, when resin sealing is performed using the compression resin sealing molding apparatus in the first embodiment, first, the passage closing member 35 is set to the second state, and the lower mold 3 and the upper mold 5 are brought relatively close to each other. By doing so, the pressure of the resin in the cavity 2 (also referred to as "internal pressure") increases.

[0060] In Figure 21, line 401 represents the load applied between the lower mold 3 and the upper mold 5. A constant load is applied during the resin sealing operation. Line 402a represents the internal pressure. Figure 21 also shows that line 402a initially rises. Line 403a represents the displacement of the passage closure member 35. When line 403a is in a high position, it means that the passage closure member 35 is in the second state, i.e., the passage 6 is in a closed state, and when line 403a is in a low position, it means that the passage closure member 35 is in the first state, i.e., the passage 6 is in an open state.

[0061] The increased internal pressure reaches a constant value at point P1. When the increased internal pressure reaches a constant value, or after a predetermined time has elapsed since the increased internal pressure reached a constant value, the passage closing member 35 is switched to the first state. That is, the passage 6 is opened. In fact, in FIG. 21 , at point P2, when a predetermined time has elapsed since the internal pressure reached a constant value, the passage closing member 35 begins to switch to the first state as shown at point A1. Up to this point, the desired internal pressure can be applied to the resin material for the desired time. In FIG. 21 , the desired internal pressure is applied to the resin material for the period D.

[0062] When the passage closing member 35 is switched to the first state, the resin material begins to leak out of the cavity 2 through the passage 6. As the resin material leaks out of the cavity 2, the internal pressure decreases. When the decreased internal pressure reaches a predetermined value, or when a predetermined time has elapsed since the decreased internal pressure reached the predetermined value, the passage closing member 35 is switched to the second state. In other words, the passage 6 is closed. In Figure 21, at point P3 when the internal pressure has decreased to a certain value, the passage closing member 35 begins to switch to the second state, as shown at point A2.

[0063] The pressure sensor 8 can be used to determine the timing of points P1, P2, and P3. Although the pressure sensor 8 does not necessarily match the actual internal pressure in real time, it can serve as a guide for determining the internal pressure. There may be a discrepancy due to error between the actual internal pressure of the cavity 2 and the value detected by the pressure sensor 8. There may also be a time lag before the change in the actual internal pressure of the cavity 2 is reflected in the value detected by the pressure sensor 8. In such cases, the error or time lag can be taken into consideration. The timing of points P1, P2, and P3 can be appropriately identified using the value detected by the pressure sensor 8.

[0064] The viscosity of the resin material can vary due to various factors. For example, the viscosity of the resin material varies depending on the length of the vacuuming time. The viscosity of the resin material also varies because the amount of heat received by the resin material differs depending on the length of period D. The viscosity of the resin material also varies because the physical properties of the resin material, such as the gel time, differ depending on the variation between resin material lots.

[0065] If the passage 6 were to be opened for a uniformly fixed period of time, variations in the viscosity of the resin material could result in the passage 6 being closed before sufficient resin material has leaked out, or the passage 6 remaining open even after sufficient resin material has already leaked out. If the passage 6 is closed before sufficient resin material has leaked out, an excessive amount of resin material will remain in the cavity, resulting in a molded product with a thickness greater than expected. Conversely, if the passage 6 remains open even after sufficient resin material has already leaked out, there is a risk that the resin will not be sufficiently filled in the gap between the component and the board.

[0066] However, these problems can be avoided if the timings of points P1, P2, and P3 can be appropriately identified using the detection values ​​of pressure sensor 8. The timing for operating passage closing member 35 can be determined so as to correspond to the identified timings of points P1, P2, and P3.

[0067] For example, if the viscosity of the resin material is low, leakage of the resin material progresses rapidly after the passage closure member 35 begins to switch to the first state at point A2. In this case, the internal pressure drops rapidly after point P2, as indicated by line 402b. In this case, the timing to begin switching the passage closure member 35 to the second state can be set earlier than point A2. If line 402b drops and reaches a certain value early, the timing to begin switching the passage closure member 35 to the second state can be advanced to match that timing. In other words, the passage closure member 35 can be operated as indicated by line 403b.

[0068] Conversely, if the viscosity of the resin material is high, after the passage closure member 35 starts to switch to the first state at point A2, the internal pressure drops slowly as shown by line 402c. In this case, the timing to start switching the passage closure member 35 to the second state can be set later than point A2. In other words, the passage closure member 35 can be operated as shown by line 403c.

[0069] The explanation regarding the use of the pressure sensor 8 described above is not limited to the first to third embodiments, but also applies to the embodiments described below.

[0070] (Configuration in which pressure sensor is arranged in upper mold) In the first to third embodiments, an example has been described in which the cavity 2 is located on the lower mold 3 side and the pressure sensor 8 is arranged on the lower mold 3, but this is not limiting and the configuration may also be such that the cavity is located on the upper mold 5 side. When the cavity is located on the upper mold 5 side, the pressure sensor 8 may be arranged on the upper mold 5. This is true not only for the first to third embodiments but also for the embodiments described below.

[0071] Fourth Embodiment A compression resin sealing molding apparatus according to a fourth embodiment of the present invention will be described with reference to FIGS.

[0072] As shown in FIG. 22 , the compression resin sealing molding apparatus of this embodiment includes a lower mold 4050 and an upper mold 4060. The lower mold 4050 includes a lower mold body 4051 and a plate material 4052. A stripper section 4033 is arranged to surround the outer periphery of the plate material 4052. The stripper section 4033 is connected to the lower mold body 4051 via a spring 4037. The stripper section 4033 can be displaced in the height direction by elastic deformation of the spring 4037. The stripper section 4033 has several through holes 4007. The stroke amount limiting member 4034 is inserted into the through holes 4007. The pressure sensor 8 is installed in the lower mold 4050. The upper end of the pressure sensor 8 is exposed to the plate material 4052.

[0073] Several notches are provided in part of the inner periphery of the stripper portion 4033. The passage closure member 4035 is disposed inside these notches. The cavity 2 is formed by the inner periphery side surface of the stripper portion 4033, the side surface of the passage closure member 4035 opposite the stripper portion 4033, and the upper surface of the plate material 4052. The stripper portion 4033 has a pocket portion, which is a recessed portion, outside the cavity 2 to accommodate the resin material that has flowed out of the cavity 2. The pocket portion is not shown in FIG. 22 .

[0074] The resin material 4006r placed inside the cavity 2 is supplied in a predetermined amount to a jig or the like, and then transferred onto the plate material 4052 by a handler or the like. At this point, the resin material 4006r is, for example, in the form of granules.

[0075] FIG. 23 shows the lower mold 4050 alone. In this example, two pockets 4036 are provided near the cavity 2, and a total of four passage closure members 4035 are arranged around the cavity 2. FIG. 24 shows the passage closure member 4035 alone. The passage closure member 4035 has two upper surfaces 4035a and 4035b with different heights. The passage closure member 4035 can be displaced up and down. The passage closure member 4035 can be in at least two positions: a raised state and a lowered state. In FIGS. 22 and 23, the passage closure member 4035 is in the raised state. As shown in FIG. 23, the cavity 2 and the pockets 4036 are separated by the passage closure member 4035.

[0076] A cross section of the passage closure member 4035 and its vicinity is shown in Figure 25. In Figure 25, the passage closure member 4035 is in a lowered state. In Figure 25, the passage 6 is opened due to the passage closure member 4035 being lowered. The resin material is reduced in viscosity by being heated. The reduced-viscosity resin material 4006e overflows from the cavity 2 and can flow through the passage 6 toward the pocket portion 4036 as indicated by arrow 92.

[0077] 26 results from the passage closure member 4035 being lowered and the resin material 4006e spilling out of the cavity 2. In this state, the passage closure member 4035 may be raised again. By raising the passage closure member 4035 until the upper surface of the passage closure member 4035 abuts against the lower surface of the substrate 10d, the passage 6 is closed again and further outflow of the resin material 4006e from the cavity 10 can be prevented. In this state, the resin material is cured.

[0078] In this embodiment as well, the timing for operating the passage closing member 4035 is determined based on information obtained from the pressure sensor 8. In this way, it is possible to avoid a situation in which the passage 6 is closed too early or too late.

[0079] After the resin material has hardened, the lower mold 4050 and the upper mold 4060 are moved relatively far apart, and the upper part of the lower sheet 4011 is removed, thereby obtaining a product in which the component 10e is covered with sealing resin.

[0080] Fifth Embodiment A compression resin sealing molding apparatus according to a fifth embodiment of the present invention will be described with reference to FIGS.

[0081] 27 shows a cross-sectional view of the compression resin encapsulation molding apparatus 131 according to the present embodiment. Although the substrate 10, release sheets 6002 and 6003, and powdered resin material 6040 are not part of the compression resin encapsulation molding apparatus 131, for the sake of convenience, they are also shown in the cross-sectional view of the compression resin encapsulation molding apparatus 131. This also applies to the following figures.

[0082] The compression resin encapsulation molding apparatus 131 in this embodiment is a compression resin encapsulation molding apparatus for molding an encapsulating resin layer to cover at least a portion of a substrate body 10d having a first surface 10a and a second surface 10b, respectively, while encapsulating a component 10e arranged on the first surface 10a of the substrate body 10d. The substrate 10 includes the substrate body 10d and the component 10e. The compression resin encapsulation molding apparatus 131 includes a lower mold 6051 facing the first surface 10a, an upper mold 6052 abutting the second surface 10b, and a pressure sensor 8. The lower mold 6051 is movable relative to the upper mold 6052. The lower mold 6051 includes an outer frame 6012 and an inner frame 6011, at least a portion of which is vertically displaceable relative to the outer frame 6012. In other words, the entire inner frame 6011 may be configured to be displaceable in the vertical direction relative to the outer frame 6012, or a portion of the inner frame 6011 may be configured to be displaceable in the vertical direction relative to the outer frame 6012.

[0083] In order to show the positional relationship between the outer frame 6012 and the inner frame 6011, a plan view of only the outer frame 6012 and the inner frame 6011 is shown in FIG. 28 . The outer frame 6012 and the inner frame 6011 are each annular. The outer frame 6012 is disposed so as to surround the inner frame 6011. Here, an example is shown in which the outer frame 6012 is annular in shape and continuous around the entire circumference, but the outer frame 6012 is not limited to being a complete annular shape like this. For example, the outer frame 6012 may be divided into multiple sections and disposed in an intermittent annular shape. Alternatively, the outer frame 6012 may be disposed so that multiple blocks are interspersed.

[0084] The outer frame 6012 can abut against the upper mold 6052 outside the substrate main body 10d. The inner frame 6011 can be in a first state in which the resin material that is the material for the sealing resin layer is confined and pressurized within the inner region of the inner frame 6011, and a second state in which a portion of the resin material is held within the inner region of the inner frame 6011 while another portion of the resin material leaks out from the inner frame 6011. The "resin material" referred to here is a powdered resin material 6040 in FIG. 27. The resin material later melts and becomes a resin material 6041 in FIGS. 29 and 30.

[0085] 27 shows a state in which a powder resin material 6040 has been placed in the compression resin sealing molding apparatus 131. A release sheet 6002 is placed on the lower mold 6051, and the powder resin material 6040 is placed in the central cavity. The substrate 10 is placed on the release sheet 6002. The substrate 10 is placed with the first surface 10a of the substrate main body 10d facing downward. A component 10e is mounted on the first surface 10a of the substrate main body 10d.

[0086] Before placing the substrate 10 in this position, it is preferable to subject it to treatments such as Ar plasma cleaning, O2 radical plasma cleaning, and UV light cleaning. These treatments are performed on the substrate 10 to clean and modify its surface. These treatments are performed on the substrate 10 already equipped with components. These cleaning and surface modification treatments can be any method that improves adhesion between the encapsulation resin and the substrate, and between the encapsulation resin and the components. For example, plasma cleaning can be performed using either the DP method or the RIE method. The gas used during the treatment can be any of Ar, N2, O2, CF4, etc., or a mixture of two or more of these. When optical cleaning is used, the light source can be any type of light source, such as a low-pressure mercury lamp or an excimer lamp.

[0087] The outer edge of the substrate 10 is placed on an inner frame 6011 via a release sheet 6002. However, the substrate 10 does not completely cover the upper surface of the inner frame 6011, but rather covers part of the upper surface of the inner frame 6011. A release sheet 6003 is placed on the substrate 10.

[0088] The lower mold 6051 includes a member 6026, a member 6027, an inner frame drive shaft 6016, and a base drive shaft 6017. The outer frame 6012 is supported by the member 6027. The inner frame 6011 is supported by the member 6026 via a spring 6013. The inner frame drive shaft 6016 extends from the member 6026. The base drive shaft 6017 extends from the member 6027. The member 6026 can move up and down relative to the member 6027. The vertical position of the inner frame 6011 can be determined by moving the inner frame drive shaft 6016 up and down. The vertical position of the outer frame 6012 can be determined by moving the base drive shaft 6017 up and down.

[0089] FIG. 29 shows a state in which the lower mold 6051 approaches the upper mold 6052 relatively to the state shown in FIG. 27 . In this state, the substrate 10 sandwiched between the release sheets 6002 and 6003 is sandwiched and fixed between the inner frame 6011 of the lower mold 6051 and the upper mold 6052. The resin material melts in the cavity and becomes the resin material 6041. The resin material 6041 is confined inside the inner frame 6011. The resin material 6041 covers a portion of the first surface 10a of the substrate 10. The state shown in FIG. 29 is the first state. In this first state, pressure can be applied to the resin material 6041 at any desired value. This allows the resin material 6041 to sufficiently fill the gap between the component 10e and the substrate 1 (hereinafter referred to as the "sub-component space"). Furthermore, applying sufficient pressure to the entire resin material 6041 also makes it possible to prevent voids from occurring. In the first state, pressure may be applied to the resin material 6041 without leaking any of the resin material 6041, or air or the resin material 6041 may be leaked to the extent that a desired internal pressure can be ensured.

[0090] In the first state shown in Fig. 29 , compared to the state shown in Fig. 27 , elastic deformation of the spring 6013 causes the inner frame 6011 to descend so as to sink into the member 6027. At this time, the volume that can accommodate the resin material 6041 inside the inner frame 6011 becomes smaller as the inner frame 6011 descends, and the resin material 6041 is pressurized. In other words, the inner frame 6011 is supported via the spring 6013 as an elastic body, and in the first state, the elastic body of the inner frame 6011 elastically deforms, thereby pressurizing the resin material 6041 confined in the inner region of the inner frame 6011. In the example shown here, the spring 6013 is installed below the inner frame 6011 to descend the inner frame 6011, but some other elastic body other than the spring 6013, or an air cylinder or the like, may be installed below the inner frame 6011.

[0091] In other words, any structure is acceptable as long as the lower mold 6051 approaches the upper mold 6052 relatively, the inner frame 6011 comes into contact with the upper mold 6052, and then the inner frame 6011 descends relatively to the member 6027, causing the resin material 6041 to be pressed against the member 6027 and applying pressure.

[0092] 30 shows a state in which the lower mold 6051 has been moved even closer relative to the upper mold 6052 and the inner frame 6011 has been lowered from the state shown in Fig. 29. The movement to lower the inner frame 6011 can be achieved, for example, by lowering the inner frame drive shaft 6016. In addition to being achieved by lowering the inner frame drive shaft 6016, the movement to lower the inner frame 6011 may also be achieved by, for example, installing an air cylinder or the like below the inner frame 6011 and using the air cylinder.

[0093] The structure of the portion related to the inner frame 6011 is not limited to the above-mentioned example. Any mechanism or method may be employed for the structure of the portion related to the inner frame 6011, as long as it is possible for the inner frame 6011 to descend from the state shown in Fig. 27 to follow when the lower mold 6051 approaches relatively to the upper mold 6052, thereby reaching the state shown in Fig. 29, and the inner frame 6011 can further descend relatively to the member 6027 to reach the state shown in Fig. 30.

[0094] 30, a gap has occurred between the first surface 10a, which is the underside of the substrate main body 10d, and the upper surface of the inner frame 6011, causing the resin material 6041 to leak out. However, the resin material 6041 that has leaked out of the inner frame 6011 in this way remains in an area more inward than the outer frame 6012. The state shown in FIG. 30 is the second state.

[0095] When the lower mold 6051 and the upper mold 6052 are closest to each other, the distance between the upper mold 6052 and the portion of the lower mold 6051 other than the outer frame 6012 is determined by the outer frame 6012 abutting against the upper mold 6052. That is, in the state shown in Fig. 30 , the outer frame 6012 acts as a stopper to set the distance between the portion of the lower mold 6051 other than the outer frame 6012 and the upper mold 6052 to a desired distance. The height of the outer frame 6012 accurately determines the distance between the upper surface of the member 6027 of the lower mold 6051 and the lower surface of the upper mold 6052.

[0096] Although the outer frame 6012 is illustrated as a frame-shaped member here, it is not necessarily frame-shaped and may be a plurality of divided blocks. The portion corresponding to the outer frame 6012 may have any structure as long as it acts as a stopper for setting the distance between the portion of the lower mold 6051 other than the outer frame 6012 and the upper mold 6052 to a desired distance.

[0097] When the lower mold 6051 and the upper mold 6052 are clamped together, that is, when the lower mold 6051 is pressed further upward from the state shown in FIG. 29 , the inner frame 6011 sinks slightly due to the elastic deformation of the spring 6013. Because the inner frame 6011 is biased upward by the force of the spring 6013, downward displacement of the inner frame 6011 does not cause the resin material 6041 to immediately leak out. However, in the state shown in FIG. 30 that is subsequently achieved, the inner frame drive shaft 6016 is lowered to intentionally cause the resin material 6041 to leak out. At this time, the downward displacement of the inner frame 6011 is sufficiently large, allowing the resin material 6041 to leak out from the gap.

[0098] As shown in this embodiment, the inner frame 6011 may be configured to abut against the substrate 10, but the inner frame 6011 may be configured to abut against the upper mold 6052 without abutting against the substrate 10. In this case, the size of the sealing resin layer to be formed in plan view will be larger than the size of the substrate 10 in plan view.

[0099] In this embodiment as well, the timing for operating the inner frame drive shaft 6016 is determined by information obtained from the pressure sensor 8. This makes it possible to avoid a situation in which the gap that leaks the resin material 6041 is closed too early or too late.

[0100] The resin material 6041 hardens with some of it leaking outside the inner frame 6011, and the resulting molded product is shown in a plan view in Figure 31. The top surface of the substrate 10 is exposed, and the leaked resin material 6041 hardens and adheres to the outer periphery in an amorphous form. A cross-sectional view of this state is shown in Figure 32. The protruding portion 6041e of the resin material 6041 is connected to both ends. As shown in Figure 33, the portion 6041e is cut off. The portion 6041e may also be removed by breaking it. An encapsulating resin layer 6042 is formed to encapsulate the component 10e. Furthermore, if this state corresponds to an assembly of multiple products, it is cut into the size of each individual product.

[0101] 30, the resin material 6041 may be cured with the inner frame 6011 lowered, or the inner frame 6011 may be raised before the resin material 6041 is cured, and then the resin material 6041 may be cured. By curing the resin material 6041 after raising the inner frame 6011, the resin material 6041 in the region overlapping the upper surface of the inner frame 6011 becomes even thinner than that shown in FIG. 32, which makes it easier to divide and remove the protruding portion 6041e.

[0102] In this embodiment, the thickness of the product including the substrate 10 and the encapsulating resin layer 6042 can be easily and accurately controlled by using the outer frame to set the desired distance between the lower mold 6051 and the upper mold 6052 while allowing a portion of the resin material 6041 to leak out. Even if there is variation in the thickness of the substrate 10 or if there are areas in the product where no components are mounted, this can be accommodated by naturally changing the amount of leaked resin material 6041, and as a result, the product thickness can be set to the desired value with high accuracy. As described above, according to this embodiment, a compression resin encapsulating molding device can be realized that can easily control the thickness of the resin formed in the target product.

[0103] In this embodiment, the operation is started with the substrate 10 placed on the lower mold 6051. However, as shown in FIG. 34, the operation may also be started with the substrate 10 held by the upper mold 6052. In FIG. 34, a release sheet 6003 is held on the lower surface of the upper mold 6052, and the substrate 10 is held on the lower surface of the release sheet 6003. In order to hold the release sheet 6003 on the lower surface of the upper mold 6052, the upper surface of the release sheet 6003 may be made adhesive, and the release sheet 6003 may be attached to the lower surface of the upper mold 6052. Even when the operation is started from the state shown in FIG. 34, when the lower mold 6051 and the upper mold 6052 are brought closer to each other, the state shown in FIG. 29 is reached. Thereafter, the operation proceeds to the state shown in FIG. 30.

[0104] As shown in this embodiment, it is preferable that the inner frame 6011 abuts against the first surface 10 a in the first state. By adopting this configuration, the inner frame 6011 can be used to clamp the substrate 10.

[0105] The compression resin sealing molding apparatus may include an inner frame 6011 and an outer frame 6012 having a structure as shown in a plan view in FIG. 35 . The inner frame 6011 includes an inner frame first portion 6011a and an inner frame second portion 6011b. The inner frame 6011 is annular, with the inner frame second portion 6011b being arranged to occupy a portion of the inner frame. The inner frame 6011 is annular due to the combination of the inner frame first portion 6011a and the inner frame second portion 6011b.

[0106] In this case, in the second state, a part of the inner frame 6011 is displaced in a direction away from the upper mold 6052, thereby causing the resin material 6041 to leak out of the inner frame 6011. Such a configuration can also be adopted.

[0107] Sixth Embodiment A compression resin sealing molding apparatus according to a sixth embodiment of the present invention will be described with reference to Fig. 36. A compression resin sealing molding apparatus 141 according to the sixth embodiment is shown in Fig. 36. Compression resin sealing molding apparatus 141 has a configuration similar to that of compression resin sealing molding apparatus 101 described in the first embodiment, and further has a chamber structure for evacuation outside thereof.

[0108] The compression resin sealing molding device 141 includes a lower mold 3 and an upper mold 5. The lower mold 3 includes a lower mold body 7051 and a plate material 7052 below a lower mold base portion 31. The plate material 7052 is made of, for example, a cemented carbide alloy.

[0109] A member 7015 is connected to the upper mold base portion 51 via a spring 7017. The member 7015 is a frame-shaped member. Elastic deformation of the spring 7017 allows the member 7015 to be displaced in the vertical direction relative to the upper mold base portion 51. A member 7016 is connected to the upper mold 5. The member 7016 is a frame-shaped member. A seal ring 7014 is disposed between the members 7015 and 7016. A seal ring 7013 is disposed at the lower end of the member 7015. The compression resin sealing molding device 141 is configured so that when the upper mold 5 and the lower mold 3 are brought close to each other, a space that can be evacuated is formed by being surrounded by the upper mold 5, the lower mold 3, the member 7015, the member 7016, etc.

[0110] By bringing the lower mold 3 and the upper mold 5 close to each other to a certain extent, the seal ring 7013 comes into contact with the lower mold body 7051. The resin material is heated to reduce its viscosity. Heating of the resin material can be performed through the lower mold 3.

[0111] In this embodiment, as described in the first embodiment, the passage closure member 35 may be provided, and the contact surface 35a of the passage closure member 35 may contact the substrate 10. However, other configurations are also possible. For example, the outer shape of the substrate 10 may be smaller than the size of the cavity 2 in a plan view, and the contact surface 35a of the passage closure member 35 may directly contact the contact surface 52a of the upper mold 5. In this case, the substrate 10 is not clamped by the combination of the upper surface 33a of the stripper portion 33 and the contact surface 35a of the passage closure member 35, and the contact surface 52a of the upper mold 5. In this case, the size of the formed encapsulating resin layer in a plan view is larger than the size of the substrate 10 in a plan view. This configuration is shown in FIG. 37 as a modified example of a compression resin encapsulating molding apparatus according to this embodiment. FIG. 37 shows a compression resin encapsulating molding apparatus 142.

[0112] In this embodiment, the configuration disposed inside the chamber structure has been described as being the same as the configuration of the compression resin encapsulation molding apparatus 101 described in embodiment 1, but the configuration disposed inside the chamber structure may be other than this. For example, the configuration disposed inside the chamber structure may be the same as the configuration of the compression resin encapsulation molding apparatus described in embodiment 4.

[0113] It should be noted that a plurality of the above-described embodiments may be appropriately combined and employed. The above-described embodiments disclosed herein are illustrative in all respects and are not limiting. The scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims.

[0114] 2 Cavity, 3 Lower die, 5 Upper die, 6 Passage, 7 Through hole, 8 Pressure sensor, 10 Substrate, 10a First surface, 10b Second surface, 10d Substrate body, 10e Component, 11 Sealing resin material, 11e Resin, 13 Component, 14 Sealing resin, 21 Lower die, 22 Upper die, 31 Lower die base portion, 32 Lower die center portion, 32a Lower die center upper surface, 33 Stripper portion, 33a (Stripper portion) Upper surface, 33b (Stripper portion) Inner peripheral side surface, 34 Stroke amount limiting member, 35 Passage closing member, 35a (Passage closing member) Contact surface, 35b, 35c, 35d Surface, 36 Pocket portion, 37, 38 Elastic body, 39 Push-up pin, 51 Upper die base portion, 52 Upper die block, 52a Contact surface (of upper die), 61, 62 Release sheet, 91, 92, 93, 94 Arrows, 101, 102, 103, 131, 141, 142 Compression resin sealing molding device, 401, 402a, 402b, 402c, 403a, 402b, 403c Line, 4006e (low-viscosity) resin material, 4006r (granular) resin material, 4007 Through hole, 4011 Lower sheet, 4033 Stripper portion, 4034 Stroke amount regulating member, 4035 Passage closing member, 4035a, 4035b Upper surface, 4037 Elastic body, 4050 Lower die, 4051, 7051 Lower die body, 4052, 7052 Plate material, 4060 Upper mold, 6002, 6003 release sheets, 6011 inner frame, 6011a inner frame first portion, 6011b inner frame second portion, 6012 outer frame, 6013 spring, 6015 base, 6016 inner frame drive shaft, 6017 base drive shaft, 6026, 6027 members, 6040 powdered resin material, 6041 resin material, 6041e (protruding) portion, 6042 sealing resin layer, 6051 lower mold, 6052 upper mold, 7013, 7014 seal rings, 7015, 7016 members, 7017 spring.

Claims

1. A compression resin encapsulation molding device for molding an encapsulating resin layer so as to partially cover the first surface of a substrate, the substrate having a first surface and a second surface that are opposite each other, while encapsulating components arranged on the first surface of the substrate, the device comprising: a lower mold facing the first surface; an upper mold abutting the second surface; and a pressure sensor; the lower mold comprising: a lower mold central portion having a lower mold central upper surface corresponding to the lower surface of the encapsulating resin layer; a stripper portion arranged to surround the lower mold central portion; and a passage closing member; a notch is provided in part of the inner circumference of the stripper portion, the passage closing member is arranged inside the notch; a cavity for melting and molten resin material is formed by the inner peripheral side surface of the stripper portion, the side surface of the passage closing member opposite the stripper portion, and the central upper surface of the lower mold; and the stripper portion has a pocket portion outside the cavity that is a recess for accommodating the resin material that has flowed out of the cavity. a compression resin sealing molding apparatus, wherein the passage closing member can be in a first state by descending to allow the resin material to flow out from the cavity to the pocket portion, and in a second state by ascending to prevent the resin material from flowing out from the cavity to the pocket portion, the passage closing member has an abutment surface facing upward at a certain height, and the pressure sensor is arranged in at least one of the upper mold and the lower mold so as to measure the internal pressure of the cavity.

2. The compression resin sealing molding device according to claim 1, wherein the passage closure member includes a plurality of passage closure member pieces, and the plurality of passage closure member pieces are symmetrically arranged along opposing first and second sides of the cavity.

3. The compression resin sealing molding device according to claim 2, wherein the cavity has two long sides parallel to each other and two short sides parallel to each other, and the first side and the second side are both short sides.

4. A compression resin sealing molding device as described in claim 1 or 2, wherein the lower mold comprises a lower mold base portion and a stroke amount control member fixed to the lower mold base portion so as to protrude from the lower mold base portion, the stripper portion is supported by the lower mold base portion via an elastic body, and the stroke amount control member abuts against the upper mold, thereby restricting the distance between the surface abutting against the second surface of the upper mold and the central upper surface of the lower mold so as not to be smaller than a certain value.

5. A compression resin sealing molding device as described in claim 4, wherein the stroke amount regulating member includes a plurality of stroke amount regulating member pieces, the plurality of stroke amount regulating member pieces being arranged to surround the cavity.

6. A compression resin encapsulation molding device for molding an encapsulating resin layer so as to partially cover the first surface of a substrate having first and second surfaces that are opposite each other, while encapsulating components arranged on the first surface of the substrate, the device comprising: a lower mold facing the first surface; an upper mold abutting the second surface; and a pressure sensor; the lower mold comprising: a lower mold base portion; a lower mold central portion having a lower mold central upper surface corresponding to the lower surface of the encapsulating resin layer; a stripper portion arranged to surround the lower mold central portion; and a stroke amount control member fixed to the lower mold base portion so as to protrude from the lower mold base portion; a cavity for melting and molding a resin material is formed by the inner peripheral side surface of the stripper portion and the lower mold central upper surface; the stripper portion is supported by the lower mold base portion via an elastic body; and the stroke amount control member abuts against the upper mold, thereby restricting the distance between the surface of the upper mold abutting the second surface and the lower mold central upper surface so as not to be smaller than a certain value; The compression resin sealing molding apparatus, wherein the pressure sensor is disposed in at least one of the upper mold and the lower mold so as to be able to measure the internal pressure of the cavity.

7. A compression resin sealing molding device according to claim 6, wherein the stroke amount regulating member includes a plurality of stroke amount regulating member pieces, the plurality of stroke amount regulating member pieces being arranged to surround the cavity.

8. The compression resin sealing molding apparatus according to claim 1 or 2, wherein the surface of the upper mold facing the cavity is covered with a release sheet.

9. A compression resin encapsulation molding device for molding an encapsulating resin layer to cover at least a part of the first surface of a substrate body having a first surface and a second surface opposite each other while encapsulating components arranged on the first surface of the substrate body, the device comprising: a lower mold facing the first surface; an upper mold abutting the second surface; and a pressure sensor; the lower mold including an outer frame and an inner frame, at least a part of which is displaceable in the vertical direction relative to the outer frame; the outer frame being able to abut against the upper mold outside the substrate body; the inner frame being able to take a first state in which a resin material that is a material for the encapsulating resin layer is confined and pressurized within the inner region of the inner frame, and a second state in which a part of the resin material is held within the inner region of the inner frame while another part of the resin material leaks out from the inner frame; the pressure sensor being arranged on at least one of the upper mold and the lower mold so as to be able to measure the internal pressure within the inner region of the inner frame; A compression resin sealing molding device in which, when the lower mold and the upper mold are closest to each other, the distance between the part of the lower mold other than the outer frame and the upper mold is determined by the outer frame abutting against the upper mold.

10. The compression resin sealing molding device according to claim 9, wherein the inner frame abuts against the first surface in the first state.

11. A compression resin sealing molding device as described in claim 9 or 10, wherein in the second state, a portion of the inner frame is displaced away from the upper mold, thereby causing the resin material to leak outward from the inner frame.

12. A compression resin sealing molding device as described in claim 9 or 10, wherein the inner frame is supported via an elastic body, and in the first state, the elastic body elastically deforms, thereby pressurizing the resin material confined in the inner region of the inner frame.

Images