Cooling sleeve for processing tool valve

Abstract

One example provides a processing tool comprising a point-of-use valve manifold (PVM) configured to deliver processing chemicals to a processing chamber of the processing tool. The PVM comprises a valve, and a valve actuator and sensor assembly. The valve actuator and sensor assembly comprises a valve actuator configured to actuate the valve of the PVM, the valve having an open state and a closed state. The valve actuator and sensor assembly further comprises a sensor configured to sense the open state and the closed state of the valve. The processing tool further comprises a cooling sleeve surrounding an exterior surface of the valve actuator and sensor assembly, the cooling sleeve defining one or more fluid flow paths configured to hold a flow of a cooling fluid to remove heat from the exterior surface of the valve actuator and sensor assembly.

Description

COOLING SLEEVE FOR PROCESSING TOOL VALVEBACKGROUND

[0001] Electronic device fabrication processes can involve many steps of material deposition, patterning, and removal to form integrated circuits on substrates. Various methods can be used to deposit films of materials onto a substrate. As one example, chemical vapor deposition (CVD) can be used to deposit a film by exposing a substrate to a flow of gas phase precursors. The precursors undergo chemical reactions to form a film on the substrate. Plasma-enhanced CVD (PECVD) utilizes a plasma to provide energy for the chemical conversion of the precursors to the film.

[0002] As another example, atomic layer deposition (ALD) deposits a film in a layer-by-layer manner. Each film layer is formed by first exposing a substrate in a processing chamber to a gas phase film precursor that adsorbs to the substrate, and then chemically converting the adsorbed precursor to a film layer. The chemical conversion can be performed, for example, by exposing the adsorbed precursor to a gas phase reactant.

[0003] Etching processes are used to remove material from a substrate. Etching processes can involve exposing a substrate to gas phase reactants that react with a substrate material to form volatile products, thereby removing substrate material.

[0004] These processes, as well as other electronic device fabrication processes, are typically performed in processing chambers. A network of conduits, valves, mass flow controllers, and other hardware can be used to deliver processing chemicals, such as precursors, reactants, inert gases, and cleaning gases, to a processing chamber.SUMMARY

[0005] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that solve any or all disadvantages noted in any part of this disclosure.

[0006] Examples are disclosed that relate to a point-of-use valve manifold (PVM) valve comprising a valve actuator and sensor assembly cooled using a coolingsleeve. One example provides a processing tool comprising a point-of-use valve manifold (PVM) configured to deliver processing chemicals to a processing chamber of the processing tool. The PVM comprises a valve, and a valve actuator and sensor assembly. The valve actuator and sensor assembly comprises a valve actuator configured to actuate the valve of the PVM, the valve having an open state and a closed state. The valve actuator and sensor assembly further comprises a sensor configured to sense the open state and the closed state of the valve. The processing tool further comprises a cooling sleeve surrounding an exterior surface of the valve actuator and sensor assembly, the cooling sleeve defining one or more fluid flow paths configured to hold a flow of a cooling fluid to remove heat from the exterior surface of the valve actuator and sensor assembly.

[0007] In some such examples, the cooling sleeve comprises an inlet, and a nozzle that splits the cooling fluid received by the inlet into at least two separate fluid flow paths of the one or more fluid flow paths.

[0008] Alternatively or additionally, in some such examples, the cooling sleeve comprises a layered structure.

[0009] Alternatively or additionally, in some such examples, the sensor is an inductive proximity sensor.

[0010] Alternatively or additionally, in some such examples, a fluid flow path of the one or more fluid flow paths includes a semi-circular cross-section.

[0011] Alternatively or additionally, in some such examples, the one or more fluid flow paths are configured to expose the cooling fluid to the exterior surface of the valve actuator and sensor assembly.

[0012] Alternatively or additionally, in some such examples, a fluid flow path of the one or more fluid flow paths comprises a serpentine path.

[0013] Alternatively or additionally, in some such examples, the cooling sleeve is configured to lower a temperature of the valve actuator and sensor assembly relative to an operating environment temperature of the PVM.

[0014] Another example provides a cooling sleeve for a valve actuator and sensor assembly. The cooling sleeve comprises a body configured to surround an exterior surface of a valve actuator and sensor assembly of a point-of-use valve manifold (PVM) valve of a semiconductor processing tool, and a fluid flow path formed in the body and configured to expose a cooling fluid to an exterior surface of the valve actuator and sensor assembly.

[0015] In some such examples, the fluid flow path comprises an inlet, and a nozzle configured to direct the cooling fluid received at the inlet to a first fluid flow path and a second fluid flow path.

[0016] Alternatively or additionally, in some such examples, the cooling sleeve has a layered structure formed by additive manufacturing.

[0017] Alternatively or additionally, in some such examples, the cooling sleeve further comprises an integral fastener.

[0018] Alternatively or additionally, in some such examples, the fluid flow path includes a semi-circular cross-section.

[0019] Alternatively or additionally, in some such examples, the cooling sleeve is configured for clean dry air (CD A) as a cooling fluid, and wherein the fluid flow path comprises an open end configured to vent cooling fluid into a surrounding environment.

[0020] Alternatively or additionally, in some such examples, the fluid flow path comprises a serpentine path.

[0021] Another example provides a method of operating a valve actuator and sensor assembly of a heated point-of-use valve manifold (PVM) valve of a processing tool. The method comprises flowing a cooling fluid through a fluid flow path formed in a cooling sleeve and arranged between the cooling sleeve and an exterior surface of the valve actuator and sensor assembly to remove heat from the exterior surface of the valve actuator and sensor assembly.

[0022] In some such examples, the cooling fluid comprises air from a source of clean dry air (CDA), wherein the CDA is received into the fluid flow path at an inlet, and wherein a nozzle splits the CDA received at the inlet into at least two separate fluid flow paths.

[0023] Alternatively or additionally, in some such examples, the method further comprises sealably securing the cooling sleeve to the exterior surface of the valve actuator and sensor assembly using a fastener.

[0024] Alternatively or additionally, in some such examples, the fastener is integral with the cooling sleeve.

[0025] Alternatively or additionally, in some such examples, the method further comprises during operation of the PVM and flowing the cooling fluid through the fluid flow path formed in the cooling sleeve, detecting the open and closed states of the valve of the valve actuator and sensor assembly using the sensor.BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG. 1 shows a functional block diagram of an example semiconductor processing tool with a point-of-use valve manifold (PVM) comprising cooling sleeves for valves of the PVM.

[0027] FIG. 2 is a partial perspective view of an example of a PVM valve with a cooling sleeve.

[0028] FIG. 3 shows a layout of example fluid flow segments formed in a cooling sleeve.

[0029] FIG. 4 shows a sectional view of a portion of the cooling sleeve of FIG. 3.

[0030] FIG. 5 shows an exploded end view of an example cooling sleeve.

[0031] FIG. 6 shows a sectional view of an example clamp closure integrally formed in a cooling sleeve.

[0032] FIG. 7 shows an example valve actuator and sensor assembly.

[0033] FIG. 8 shows a flow diagram depicting an example method of cooling a valve actuator and sensor assembly of a point-of-use valve manifold (PVM).DETAILED DESCRIPTION

[0034] The term “additive manufacturing” generally represents the process of creating an object or forming the object layer-by-layer. This is in contrast with subtractive manufacturing processes, such as machining or cutting material away. The term “3D printing” generally represents a process of making a physical object from a three-dimensional (3D) digital model. 3D printing typically involves laying down successive layers of material to build the object. The resulting object has a layered structure arising from the additive manufacturing process.

[0035] The terms “approximately” and “substantially” as used herein generally represent a numeric value that is within a range of plus or minus ten percent (10%) of a numeric value stated.

[0036] The term “atomic layer deposition” (ALD) generally represents a process in which a solid phase film is deposited in a layer-by-layer manner. Each film layer is formed by first exposing a substrate in a processing chamber to a gas phase film precursor that adsorbs to the substrate, and then chemically converting the adsorbed precursor to a film layer.

[0037] The term “chemical vapor deposition” (CVD) generally represents a process in which a solid phase film is formed on a substrate by directing a continuous flow of one or more precursor gases over the substrate surface under conditions configured to cause the chemical conversion of the one or more precursor gases to the film. The term “plasma-enhanced chemical-vapor deposition” (PECVD) generally represents a CVD process in which a plasma is used to facilitate the chemical conversion of one or more precursor gases to a solid phase film on a substrate.

[0038] The term “clamping closure” generally represents a mechanism to close a first object around a second object, or first and second portions of a same object, by using one or more fasteners. A fastener can be separate from the objects or object portions being fastened, or can be integral with the object or the object portions being fastened.

[0039] The term “clean dry air” (“CD A”) generally represents air that has been dehumidified and filtered to remove water vapor and particulate matter.

[0040] The term “cooling fluid flow path” generally represents a channel within which a cooling fluid such as a gas or a liquid can flow to remove heat.

[0041] The term “cooling sleeve” generally represents a device having one or more cooling fluid flow paths that fits over or around an object to be cooled.

[0042] The term “electrode” generally represents an electrical conductor used to make contact with a nonmetallic part of a circuit.

[0043] The term “etching tool” generally represents a machine configured to remove material from a substrate using chemical and / or physical processes.

[0044] The term “flow control hardware” generally represents components configured to place one or more chemical sources in fluid connection with a processing chamber. Flow control hardware may comprise one or more mass flow controllers, conduits, and valves, for example.

[0045] The term “nozzle” generally represents a device to control a flow of a fluid.

[0046] The term “PECVD tool” generally represents a machine comprising a processing chamber and other hardware configured to perform PECVD processing.

[0047] The term “plasma” generally represents a gas comprising cations and free electrons.

[0048] The term “process gases” generally represents reactant and inert gases that are supplied to a processing chamber to perform processes, such as deposition and etching processes, on a substrate.

[0049] The term “processing tool” generally represents a machine including a processing chamber and other hardware configured to enable processes to be carried out in the processing chamber.

[0050] The term “processing chamber” generally represents an enclosure in which processing is performed on substrates. The pressure, temperature, atmospheric composition, and other conditions within a processing chamber are controllable to perform substrate processing.

[0051] The term “point-of-use valve manifold” (“PVM”) generally represents a component used to heat and deliver process gases to a showerhead in a processing chamber of a processing tool.

[0052] The term “radio frequency” (“RF”) generally represents the oscillation rate of electromagnetic radiation within a range of frequencies between 10 kilohertz (kHz) and 1 terahertz (THz).

[0053] The term “semi-circular” generally represents a shape of a portion (e.g. half) of a circle.

[0054] The term “sensor” generally represents a device which detects or measures a physical property and records, indicates, or otherwise responds to it. The term “proximity sensor” generally represents a non-contact sensor that detects the presence of an object. The term “inductive proximity sensor” generally represents a proximity sensor that uses the principle of electromagnetic induction to detect a metallic object.

[0055] The term “serpentine path” generally represents a curved, wandering path.

[0056] The term “showerhead” generally represents a processing chemical outlet comprising a plurality of holes distributed across an area.

[0057] The term “substrate” generally represents any object that can be processed in a processing tool.

[0058] The term “valve actuator” generally represents a device that responds to an input by causing a corresponding valve to open or close. The term “valve” generally represents a device for selectively turning on or off a flow of fluid.

[0059] As mentioned above, processing chemicals can be delivered to a processing chamber of a processing tool using flow control hardware. The flow control hardware can include items such as conduits, valves, and flow controllers to control the flows of processing chemicals. Some valves can be part of a so-called point-of-use valve manifold (PVM). The PVM comprises a set of valves controllable to selectively deliver processing chemicals to a corresponding processing station. A PVM can be used, for example, in a PECVD tool to control the delivery of chemically reactive precursors through a showerhead in an alternating manner, such that the precursors do not substantially mix until reaching an interior of the processing chamber in proximity to the substrate. A processing tool with multiple processing stations in a processing chamber can have a PVM for each showerhead.

[0060] In some processes, two or more highly reactive processing chemicals can be provided to a processing chamber using a same showerhead to form a film on a substrate. In some such processes, the two or more processing chemicals can be delivered in an alternating (or sequential, for more than two) manner using a PVM to control the flows. Careful flow control is needed for successful film deposition. For example, if the processing chemicals mix too early, the processing chemicals can react in the flow path between the PVM and the processing chamber. This can form deposits and / or cause degradation to components (e.g. a showerhead) of the processing tool. If the processing chemicals mix too late, the desired reaction can occur outside of the intended target reaction zone, thereby impacting device fabrication. As another possible problem, if conduits used to supply various process gases in the PVM subsystem are inadvertently incorrectly connected, an intended flow of process gases can fail to occur. Likewise, if a valve actuator fails to operate correctly, the intended flow of process gases can fail to occur.

[0061] As such, it is desirable to monitor operation of the valves and corresponding valve actuators of the PVM to ensure that a process is being performed correctly. Various methods can be used for monitoring operation of valve actuators. Examples include the use of a proximity sensor to determine an open / closed state of a valve, and use of flow sensors to determine whether operation of the valve results in a desired fluid flow.

[0062] Regarding flow meters, mass flow meters (MFMs), clamp-on ultrasonic gas flow meters, flow totalizers, and / or other types of flow sensors can be used. However, MFMs can be expensive. Further, measuring fluid flow to determine changesin the open and closed state of each valve depends on location of the MFM’s and can require additional fluid flow conduits for each of the MFMs. Also, MFMs and clampon ultrasonic gas flow meters, for example, are indirect measurement devices that do not directly measure or sense a position of the valve.

[0063] Proximity sensors can be used to sense the open, closed, or transitioning position of the valve. As a more specific example, inductive proximity sensors can be used to detect the position of the metal or metallic material comprising the valve. Inductive proximity sensors can be less expensive than other types of proximity sensors (e.g. optical encoders) and MFMs. As such, inductive proximity sensors can be integrated with a valve, such as in the form of a valve actuator and sensor assembly.

[0064] Inductive proximity sensors that are used in valve actuator and sensor assemblies can have an operating temperature range, outside of which sensing may be less accurate. As a more specific example, some inductive proximity sensors used in valve actuator and sensor assemblies can have an operating temperature range of up to 70 degrees Celsius.

[0065] Some processing chemicals can be volatilized liquids. In a processing tool configured to use volatilized liquids as processing chemicals, a PVM can be heated valves to prevent condensation of such volatilized liquids during delivery to the processing chamber. A heated PVM also can be used to pre-heat gas-phase processing chemicals before introduction into a processing chamber. In such PVMs, the temperature of the PVM valves can exceed the operating temperature range of an inductive proximity sensor. Example operating temperatures of a PVM can be, for example, 150 degrees Celsius internally to the PVM during operation, and 75 degrees Celsius externally to the PVM (but within an interior of the processing tool enclosure in which the PVM is located). Consequently, in such a processing tool, the signals from inductive proximity sensors used to sense PVM valve states may not be accurate. As such, a system controller of the processing tool is not able to receive sensor signals to determine whether a PVM valve is opened and closed at the correct times during processing of the substrate.

[0066] Accordingly, examples are disclosed that relate to a processing tool that includes a PVM with one or more PVM valves each having a cooling sleeve surrounding a valve actuator and sensor assembly of the PVM valve. The cooling sleeve includes a fluid flow path configured to hold a flow of a cooling fluid, such as from a source of clean dry air (CDA), to remove heat from the exterior surface of the valveactuator and sensor assembly. During operation of the processing tool, air flows through the cooling sleeve to lower the temperature of the valve actuator and sensor assembly so that the temperature of an inductive proximity sensor is within the operating temperature range. The system controller of the processing tool can then monitor the open and closed state of each of the valves in each of the PVM’s during operation of the processing tool. In some examples, a cooling sleeve according to the present disclosure can have a layered construction formed using an additive manufacturing process. This provides for a convenient method to produce cooling sleeves of potentially complex shapes.

[0067] FIG. 1 shows a functional block diagram of an example semiconductor processing tool. Processing tool 100 comprises a processing chamber 101 with four processing stations 102-1, 102-2, 102-3, 102-4. In other example, a processing chamber can have either fewer or more processing stations. Referring to processing station 102-1, each processing station 102-1, 102-2, 102-3, 102-4 comprises a pedestal 104 for supporting a substrate 106, such as a silicon wafer. Each processing station 102-1, 102-2, 102-3, 102-4 further comprises a showerhead 108 arranged above the pedestal 104. Details of processing stations 102-2, 102-3 and 102-4 are omitted for clarity.

[0068] Processing stations 102-1, 102-2, 102-3, 102-4 receive processing chemicals from processing chemical sources 114 through corresponding point-of-use valve manifolds (PVM) 110-1, 110-2, 110-3, 110-4. Processing stations 102-1, 102-2, 102-3, 102-4 each distribute the processing gases across the substrate surface using showerhead 108 for the processing station. Processing chemical sources 114 can include any processing chemicals supplied to PVM subsystem 110. Examples include film precursors, inert gases, and cleaning gases.

[0069] Each PVM comprises a plurality of valves. PVM 110-1 is shown in detail. Details of PVM 110-2, PVM 110-3, and PVM 110-4 are omitted for clarity, but can be the same or similar to PVM 110-1.

[0070] PVM 110-1 comprises a plurality of valves. In the depicted example, PVM 110-1 comprises four valves 112-1, 112-2, 112-3, 112-4. In other examples, a PVM can have another number of valves. Each valve 112-1, 112-2, 112-3, 112-4 comprises a valve actuator and sensor assembly 126, and a cooling sleeve 128 arranged around valve actuator and sensor assembly 126. Valve actuator and sensor assembly 126 and cooling sleeve 128 are numbered only for PVM valve 112-1, but PVM valves112-2, 112-3, 112-4 also comprise corresponding valve actuators and sensor assemblies, and corresponding cooling sleeves.

[0071] As mentioned above, one or more of PVMs 110-1, 110-2, 110-3, 110-4 can heated to help prevent volatilized processing chemicals, such as film precursors, from condensing within each PVM. Thus, PVM 110-1 comprises a heater 113. Heating also can be used to heat gas-phase processing chemicals prior to introduction into the processing chamber. System controller 130 controls the valve actuator of the valve actuator and sensor assembly 126 of each PVM valve 112-1, 112-2, 112-3, 112-4 to controllably place selected processing chemical source(s) in fluid communication with the showerhead 108 of the corresponding processing station 102-1, 102-2, 102-3, 102- 4.

[0072] Cooling sleeve 128 surrounds an exterior surface of valve actuator and sensor assembly 126 of the PVM 112. A fluid flow path is formed in the cooling sleeve 128. Example fluid flow paths are described in more detail below. The fluid flow path is defined between the cooling sleeve 128 and the exterior surface of the valve actuator and sensor assembly 124. The fluid flow path permits a cooling fluid from a coolant source 132 to be introduced into the fluid flow path and contact the exterior surface of the valve actuator and sensor assembly 126. The cooling fluid removes heat from the exterior surface of the valve actuator and sensor assembly 126. Any suitable cooling fluid can be used. In some examples, clean dry air (CD A) can be used. The use of CDA permits the cooling fluid to be exhausted into the surrounding environment. In such an example, coolant source 132 and cooling sleeve 128 form an open system. In other examples, coolant source 132 and cooling sleeve 128 form a closed system in which the cooling fluid (air, another gas, or a liquid) flows through the fluid flow path to remove heat from the valve actuator and sensor assembly, and then exhausts via a cooling fluid recovery line (not shown). Further, in other examples, a fluid flow path can be fully enclosed in a cooling sleeve, rather than partially open to expose the cooling fluid to a valve actuator and sensor assembly.

[0073] Valve actuator and sensor assembly 126 includes a valve actuator and an inductive proximity sensor. The valve actuator of valve actuator and sensor assembly 126 is configured to open and close PVM valve 112. In one example, the valve actuator is a pneumatic valve actuator responsive to a pneumatic input. The pneumatic input can be a source of gas (e.g., air) supplied to the PVM subsystem 110 and controlled by system controller 130. For example, each valve actuator of the PVM valves 112-1, 112-2, 112-3, 112-4 can be interconnected with a source of air and flow control hardware arranged so that system controller 130 can controllably and selectably supply air or other pneumatic input to each valve actuator.

[0074] Showerhead 108 and pedestal 104 can be electrodes used to form a plasma by energizing one electrode with respect to the other. In the example shown in FIG. 1, showerhead 108 is grounded, and pedestal 104 is energized. A radiofrequency (RF) power source 134 is electrically connected to pedestal 104 for forming a plasma. A matching network 136 is included between showerhead 108 and RF power source 134 for impedance matching of the RF power source 134. In other examples, a showerhead can be energized and a pedestal can be grounded.

[0075] Processing tool 100 further comprises an exhaust system 138. Exhaust system 138 is configured to receive gas outflowing from processing chamber 101. In some examples, exhaust system 138 is configured to actively remove gas from processing chamber 101 and / or apply a partial vacuum. Exhaust system 138 can comprise any suitable hardware, such as roughing pump, a high vacuum pump, and suitable conduits and valves.

[0076] System controller 130 is operatively coupled to controllable components of processing tool 100. For example, system controller 130 is operatively coupled to coolant source 132. System controller 130 also is operatively coupled to processing chemical sources 11. System controller 130 further is operatively coupled to each of PVM 110-1, 110-2, 110-3, 110-4 and flow control hardware therein, including each valve actuator and sensor assembly 126 for each of the PVM valves. System controller 130 also is operatively coupled to the RF power source 134 and matching network 136. System controller 130 is configured to control various functions of processing tool 100. Examples include operating PVMs 110-1, 110-2, 110-3, 110-4 and the PVM valves and other flow control hardware therein, operating coolant source 132, operating actuators and sensors for each of the PVM valves 112-1, 112-2, 112-3, 112-4 within each PVM 110-1, 110-2, 110-3, 110-4, operating exhaust system 120, and / or operating the RF power source 134 and matching network 136 for generating a plasma at each processing station 102-1, 102-2, 102-3, 102-4 in the processing chamber 101.

[0077] Generally, the system controller 130 may be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in theform of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system.

[0078] The system controller 130, in some implementations, may be a part of or coupled to a computer that is integrated with, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the system controller 130 may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the substrate processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g. a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the system controller 130 may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0079] Without limitation, example systems for which a PVM according to the present disclosure can be used may include a plasma etch chamber or module, a deposition chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapordeposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0080] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

[0081] FIG. 2 is a partial perspective view 200 of an example of a point-of-use valve manifold (PVM) 202. PVM comprises a valve actuator and sensor assembly 204 surrounded by a cooling sleeve 208. PVM 202 is shown having a cuboid or hexahedral shape, and only a portion of PVM 202 is shown in FIG. 2. However, a PVM can comprise any suitable shape. Similarly, cooling sleeve 208 is illustrated having a substantially cylindrical shape, but can have any other suitable shape.

[0082] Cooling sleeve 208 comprises a body 207 that surrounds an exterior surface of valve actuator and sensor assembly 204. In other examples, cooling sleeve 208 can be of another shape. Cooling sleeve 208 includes an inlet 210 for receiving a cooling fluid into a fluid flow path. The fluid flow path is configured to direct a flow of the cooling fluid such that the cooling fluid removes heat from the exterior surface of valve actuator and sensor assembly 204.

[0083] Valve actuator and sensor assembly 204 includes a sensor 209. The sensor 209 can be, for example, an inductive proximity sensor. The inducive proximity sensor is arranged and configured to sense at least an open state and a closed state of a valve of PVM 202. Wires 212 for powering and communicating with sensor 209 can extend from an outward face of valve actuator and sensor assembly 204. Pneumatic input line 214 can connect to valve actuator and sensor assembly 204, through which a valve of PVM 202 corresponding to valve actuator and sensor assembly 204 can be selectably opened or closed.

[0084] Cooling sleeve 208 is configured to be easily and simply installed by sliding the cooling sleeve over valve and sensor assembly 204 and securing the cooling sleeve to the exterior surface of the valve actuator and sensor assembly to seal the fluid flow path of cooling sleeve 208 against the valve actuator and sensor assembly 204.Cooling sleeve 208 can be secured using a fastener, such as a bolt / nut, an integrally formed clamping closure, or other suitable fastener. An example integrally formed clamping closure is described below. Once secured, installation can be completed by connecting a source of cooling fluid to the inlet 210, connecting pneumatic input line 214 to the valve actuator, and connecting sensor 209 via wires 212.

[0085] FIG. 3 shows a flattened, schematic view of a cylindrically shaped cooling sleeve 300. Cooling sleeve 300 is an example implementation of cooling sleeve 208 illustrated in FIG. 2. Cooling sleeve 300 also is an example of cooling sleeve 128 of FIG. 1. Cooling sleeve 300 includes an inlet 302 comprising a nozzle 304 that splits the fluid flow path into two separate flow paths. The two separate flow paths comprise a first fluid flow path 306 and a second fluid flow path 308. Nozzle 304 can comprise a fluid flow splitter, whereby the volume entering nozzle 304 is divided into the first and second fluid flow paths. In some such examples, approximately one half of the volume is directed by the nozzle to flow through the first fluid flow path, and approximately one half of the volume is directed by the nozzle to flow through the second fluid flow path. In other examples, nozzle 304 can split the cooling fluid into other flow proportions than substantially equal halves. In further examples, nozzle 304 can be omitted so that the cooling sleeve includes a single fluid flow path for flowing cooling fluid across exterior surfaces of the valve actuator and sensor assembly. In yet further examples, a flow of cooling fluid can split into three or more fluid flow paths.

[0086] Cooling sleeve 300 can be formed using an additive manufacturing process, such as a 3D printing process, thereby forming a layered construction. This can provide a convenient way to form nozzle 304, first fluid flow path 306, and second fluid flow path 308, which may be difficult to form using other processes, such as injection molding, casting, or machining. The cooling sleeve 300 can comprise a plastic, a metal, or any other suitable material. Nozzle 304 can be integrally formed along with the fluid flow paths. Alternatively, nozzle 304 can be a separate component. For example, nozzle 304 can be a formed part that is inserted into or placed within the cooling sleeve 300 before, during, or after formation of portions of the cooling sleeve comprising the fluid flow paths. In other examples, cooling sleeve 300 can be formed using techniques such as injection or rotational molding, in which case nozzle 304 can be insert molded. In other examples, cooling sleeve 300 can be made using any other suitable process, such as machining.

[0087] The first fluid flow path 306 has a serpentine path with a plurality of linear segments separated by curves. The linear segments extend in a circumferential direction around the exterior surface of the underlying (surrounded) valve actuator and sensor assembly. In the depicted example, the first fluid flow path 306 comprises a first linear segment 310, a second linear segment 312, a third linear segment 314, and a fourth linear segment 316 connected sequentially by curved segments. The second fluid flow path 308 has a similar serpentine path configuration.

[0088] First fluid flow path 306 terminates at an open end 318. Open end 318 exhausts into the environment exterior to the cooling sleeve. Second fluid flow path 308 similarly terminates at open end 320.

[0089] Accordingly, cooling fluid flows into inlet 302 and split into first fluid flow path 306 and second fluid flow path 308. The cooling fluid in first fluid flow path 306 travels a serpentine path across the exterior surface of the valve actuator and sensor assembly to exhaust from open end 318. The cooling fluid in second fluid flow path 308 travels a serpentine path across the exterior surface of the valve actuator and sensor assembly to exhaust from open end 320. As previously mentioned, in other examples, open end ends 318 and open end 320 can be configured to connect to cooling fluid recovery lines (not shown). This can permit use of a liquid cooling fluid. Alternatively or additionally, this can permit conserving of cooling fluid.

[0090] Cooling sleeve 300 comprises edge 322 and edge 324. Edge 322 and edge 324 meet when cooling sleeve 300 is arranged around a valve actuator and sensor assembly of a PVM valve. Thus, a dimension between edge 322 and edge 324 defines an inner circumference of cooling sleeve 300. A dimension between an edge 326 and edge 328 defines a length of the cooling sleeve 300.

[0091] Cooling sleeve 300 comprises a first clamping tab 330 and a second clamping tab 332. First clamping tab 330 and second clamping tab 332 are configured to be joined together to clamp cooling sleeve 300 around a valve actuator and sensor assembly of a PVM valve. First clamping tab 330 and second clamping tab 332 can be clamped to one another by tightening a fastener through first connecting hole 334 and second connecting hole 336. In another example, as discussed in further detail with respect to FIG. 6, instead of first connecting hole 334 and second connecting hole 336, first clamping tab 330 and second clamping tab 332 each can include a complementary portion of an integrated fastener, such as a clamp closure, integrally formed withcooling sleeve 300. In further examples, first clamping tab 330 and second clamping tab 332 can be configured to be connected in any other suitable manner.

[0092] FIG. 4 is a sectional view 400 of a portion of a cooling sleeve 300, taken along line 4-4 of FIG. 3. Sectional view 400 shows fluid flow path segments 312, 314, and 316 as having semi-circular cross-sections. The radii of the fluid flow path segments 312, 314, and 316 are the vertical distances respectively between 402-404, 402-406, and 402-408. Fluid flow path segments 312, 314, and 316, as well as other fluid flow path segments of cooling sleeve 300, can have any suitable radii. In some examples, the radii are within a range of 0.05 - 0.15 inches. In other examples, the fluid flow path segments can have different radii. In some examples, the radii of the fluid flow path segments have uniform radii. In other examples, different fluid flow paths, or different segments of a fluid flow path, can have different radii.

[0093] In some examples, fluid flow path segments 312, 316, and 318, as well as other adjacent fluid flow path segments of cooling sleeve 300, can be separated by a distance 410 within a range of 0.025 - 0.05 inches. In other examples, fluid flow path segments of cooling sleeve 300 can be separated by distances outside of this range.

[0094] The thickness of cooling sleeve 300 is a distance between an interior surface 402 and an exterior surface 412. Cooling sleeve 300 can have any suitable thickness. Examples include thicknesses within a range of 0.10 - 0.30 in. In other examples, cooling sleeve 300 can have thicknesses outside of this range.

[0095] In FIG. 4, the fluid flow path segments 312, 314, 316 have semi-circular cross-sections. The use of a semi-circular cross-sectional shape can provide more surface area for heat transfer per unit volume cooling fluid compared to a square-shaped channel having the same height (depth) and same cross-sectional area of surface contact with an actuator and sensor assembly of a PVM valve. In other examples, a cooling sleeve can include fluid flow paths having a cross-sectional shape that is different than semi-circular. Further, in some examples, a cooling sleeve can include a fluid flow path having different cross-sectional shapes for different portions of the fluid flow path.

[0096] FIG. 5 shows an exploded end view of another example cooling sleeve 500. Cooling sleeve 500 is an example of cooling sleeves 128, 208 and 300. Cooling sleeve 500 includes an inlet 502. Inlet 500 includes an inlet protrusion 502 extending radially outward from the cooling sleeve body 504. Inlet protrusion 502 can be integral with cooling sleeve body 504. A threaded insert 506 and inlet fitting 508 can be insertedinto the opening 509 of inlet 502 for connection of a source of cooling fluid (e.g., source of CDA 130). In other examples, another suitable coupling can be used.

[0097] Inlet 502 is arranged to receive the cooling fluid. Cooling fluid received at inlet 502 passes through a nozzle 510. Nozzle 510 splits the fluid flow path of the cooling sleeve, as shown in FIG. 3, into two separate fluid flow paths. A depth 512 (e.g. a radius of a semicircular fluid flow path) of the fluid flow paths is shown in FIG. 5 in dashed line. The fluid flow paths extend circumferentially about the cooling sleeve body 504, which surrounds an interior space 514 within which a cylindrically shaped valve actuator and sensor assembly can be positioned. Cooling fluid can be directed through the fluid flow paths in the cooling sleeve body 504 from inlet 502, across exterior surfaces of the valve actuator and sensor assembly, and exhausted at open ends, one of which is shown as open end 516. In other examples, one or more open ends can be positioned at a different location than shown.

[0098] Cooling sleeve 500 further comprises a first clamping tab 518 and a second clamping tab 520. First clamping tab 518 has a first connecting hole 522, and second clamping tab 520 has a second connecting hole 524. A fastener can be used to sealably secure the cooling sleeve to the exterior surface of the valve actuator and sensor assembly. The fastener can be of any type and comprise one or more fastening components for clamping the first clamping tab 518 and the second clamping tab 520 together. For example, as shown in FIG. 5, a nut 526 can be used with a bolt 528 to clamp together first clamping tab 518 and second clamping tab 520. Bolt 528 can be inserted through first connecting hole 522 and second connecting hole 524, then tightened with nut 526. This can seal and secure cooling sleeve 500 to the exterior surface of the valve actuator and sensor assembly.

[0099] FIG. 6 is a sectional view of an example clamp closure 600 integrally formed in a cooling sleeve 602. Clamp closure 600 comprises a first clamping tab 604. First clamping tab 604 comprises a resilient clip 606 having tooth 608 and tooth 610. Clamp closure 600 further comprises a second clamping tab 612. Second clamping tab 612 has an opening configured to receive a lower end 614 of resilient clip 606. Second clamping tab 612 further includes an undercut protrusion 616 configured to engage between tooth 608 and tooth 610. Clamp closure can be engaged simply by pressing first clamping tab 604 and second clamping tab 612 together. A sloped surface of tooth 610 pushes undercut protrusion 616 of resilient clip 606 outward as the first clamping tab 604 and second clamping tab 612 are pushed together. Once undercut protrusion616 passes tooth 610, undercut protrusion 616 snaps into place between tooth 606 and tooth 608. This secures first clamping tab 604 and second clamping tab 606. In other examples, an integral clamp closure 600 for a cooling sleeve for a PVM valve actuator and sensor assembly can have a different configuration.

[0100] FIG. 7 schematically illustrates an example valve actuator and sensor assembly 700. Valve actuator and sensor assembly 700 includes a substantially cylindrical body 702 having a diameter 706-708 and a cylinder height (or length) 704- 706. An actuator plunger 714 extends axially from the body 702 to actuate (i.e., open or close) a valve in the PVM into which the valve actuator and sensor assembly 700 is installed. A pneumatic input 710 can be positioned on a face of the body 702 opposite the actuator plunger 714. Also extending axially from the face of body 702 opposite the actuator plunger 710 is the rear portion of sensor 712 and sensor wires 716.

[0101] FIG. 8 shows a flow diagram depicting an example method of cooling a valve actuator and sensor assembly of a point-of-use valve manifold (PVM) according to the present disclosure. As mentioned, an example cooling sleeve can be installed by (a) sliding the cooling sleeve over the valve and sensor assembly, (b) sealably securing the cooling sleeve to the exterior surface of the valve actuator and sensor assembly using a fastener (e.g. a separate or integral fastener), (c) connecting a source of cooling fluid to an inlet of the cooling sleeve, (d) connecting a pneumatic input line to an input port of the valve actuator, and (e) electrically connecting the sensor with the system controller and / or other subsystem controller of the processing tool. The illustrated steps can be performed in any suitable order, including but not limited to that shown in FIG. 8.

[0102] Method 800 can be used for operating a valve actuator and sensor assembly of a heated PVM valve of a processing tool. At step 802, method 800 includes flowing a cooling fluid through a fluid flow path formed in a cooling sleeve and arranged between the cooling sleeve and an exterior surface of the valve actuator and sensor assembly to remove heat from the exterior surface of the valve actuator and sensor assembly. The PVM valve is connected to a heated PVM configured to deliver process chemicals to a processing chamber of the processing tool. The valve actuator and sensor assembly includes a valve actuator and a sensor. The valve actuator is configured to actuate a valve of the PVM, wherein the valve has an open state and a closed state. The sensor is configured to sense the open state and the closed state of thevalve. The cooling sleeve surrounds the exterior surface of the valve actuator and sensor assembly.

[0103] In some examples, the cooling fluid comprises air from a source of clean dry air (CD A). In some such examples, as indicated at 804, the cooling fluid is received into the fluid flow path at an inlet. A nozzle that splits the air received by the inlet into at least two separate fluid flow paths. In other examples, a cooling sleeve can have a different inlet configuration.

[0104] At 808, method 800 includes, by flowing the cooling fluid through the fluid flow path formed in the cooling sleeve, lowering a temperature of the valve actuator and sensor assembly relative to an operating environment temperature of the PVM.

[0105] Further, at 810, method 800 includes, during operation of the PVM and flowing the cooling fluid through the fluid flow path formed in the cooling sleeve, monitoring the valve and detecting the open and closed states of the valve of the valve actuator and sensor assembly via a valve state monitoring function of the sensor.

[0106] Thus, the disclosed example cooling sleeves allow for convenient cooling of PVM valve actuator and sensor assemblies. This allows valve operation to be directly sensed, and thereby can help ensure that a process runs correctly. Using sensor signals from a PVM valve inductive proximity sensor, problems such as incorrect valve actuation timing, incorrect process gas connections to a PVM valve, and PVM valve failures can be sensed. Further, the use of additive manufacturing to fabricate a cooling sleeve according to the disclosed examples allows for convenient manufacturing of potentially complex shaped sleeves, including the fabrication of flow channels and nozzles.

[0107] This disclosure is presented by way of example and with reference to the associated drawing figures. Components, process steps, and other elements that may be substantially the same in one or more of the figures are identified coordinately and are described with minimal repetition. It will be noted, however, that elements identified coordinately may also differ to some degree. It will be further noted that some figures may be schematic and not drawn to scale. The various drawing scales, aspect ratios, and numbers of components shown in the figures may be purposely distorted to make certain features or relationships easier to see.

[0108] “And / or” as used herein is defined as the inclusive or V, as specified by the following truth table:

[0109] The terminology “one or more of A or B” as used herein comprises A, B, or a combination of A and B. The terminology “one or more of A, B, or C” is equivalent to A, B, and / or C. As such, “one or more of A, B, or C” as used herein comprises A individually, B individually, C individually, a combination of A and B, a combination of A and C, a combination of B and C, or a combination of A, B and C.

[0110] It will be understood that the configurations and / or approaches described herein are exemplary in nature, and that these specific embodiments or examples are not to be considered in a limiting sense, because numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of strategies. As such, various acts illustrated and / or described may be performed in the sequence illustrated and / or described, in other sequences, in parallel, or omitted. Likewise, the order of the above-described processes may be changed.[OHl] The subject matter of the present disclosure includes all novel and non- obvious combinations and sub-combinations of the various processes, systems and configurations, and other features, functions, acts, and / or properties disclosed herein, as well as any and all equivalents thereof.

Claims

CLAIMS:

1. A processing tool comprising: a point-of-use valve manifold (PVM) configured to deliver processing chemicals to a processing chamber of the processing tool, the PVM comprising a valve and a valve actuator and sensor assembly, the valve actuator and sensor assembly comprising: a valve actuator configured to actuate the valve of the PVM, the valve having an open state and a closed state, and a sensor configured to sense the open state and the closed state of the valve; and a cooling sleeve surrounding an exterior surface of the valve actuator and sensor assembly, the cooling sleeve defining one or more fluid flow paths configured to hold a flow of a cooling fluid to remove heat from the exterior surface of the valve actuator and sensor assembly.

2. The processing tool of claim 1, wherein the cooling sleeve comprises an inlet, and a nozzle that splits the cooling fluid received by the inlet into at least two separate fluid flow paths of the one or more fluid flow paths.

3. The processing tool of claim 1, wherein the cooling sleeve comprises a layered structure.

4. The processing tool of claim 1, wherein the sensor is an inductive proximity sensor.

5. The processing tool of claim 1, wherein a fluid flow path of the one or more fluid flow paths includes a semi-circular cross-section.

6. The processing tool of claim 1, wherein the one or more fluid flow paths are configured to expose the cooling fluid to the exterior surface of the valve actuator and sensor assembly.

7. The processing tool of claim 6, wherein a fluid flow path of the one or more fluid flow paths comprises a serpentine path.

8. The processing tool of claim 1, wherein the cooling sleeve is configured to lower a temperature of the valve actuator and sensor assembly relative to an operating environment temperature of the PVM.

9. A cooling sleeve for a valve actuator and sensor assembly, comprising: a body configured to surround an exterior surface of a valve actuator and sensor assembly of a -point-of-use valve manifold (PVM) valve of a semiconductor processing tool; and a fluid flow path formed in the body and configured to expose a cooling fluid to an exterior surface of the valve actuator and sensor assembly.

10. The cooling sleeve of claim 9, wherein the fluid flow path comprises an inlet, and a nozzle configured to direct the cooling fluid received at the inlet to a first fluid flow path and a second fluid flow path.

11. The cooling sleeve of claim 9, wherein the cooling sleeve has a layered structure formed by additive manufacturing.

12. The cooling sleeve of claim 9, wherein the cooling sleeve further comprises an integral fastener.

13. The cooling sleeve of claim 9, wherein the fluid flow path includes a semicircular cross-section.

14. The cooling sleeve of claim 9, wherein the cooling sleeve is configured for clean dry air (CD A) as the cooling fluid, and wherein the fluid flow path comprises an open end configured to exhaust cooling fluid into a surrounding environment.

15. The cooling sleeve of claim 14, wherein the fluid flow path comprises a serpentine path.

16. A method of operating a valve actuator and sensor assembly of a heated point- of-use valve manifold (PVM) valve of a processing tool, the method comprising:flowing a cooling fluid through a fluid flow path formed in a cooling sleeve and arranged between the cooling sleeve and an exterior surface of the valve actuator and sensor assembly to remove heat from the exterior surface of the valve actuator and sensor assembly.

17. The method of claim 16, wherein the cooling fluid comprises air from a source of clean dry air (CD A), wherein the CDA is received into the fluid flow path at an inlet, and wherein a nozzle splits the CDA received at the inlet into at least two separate fluid flow paths.

18. The method of claim 16, further comprising: sealably securing the cooling sleeve to the exterior surface of the valve actuator and sensor assembly using a fastener.

19. The method of claim 18, further comprising: wherein the fastener is integral with the cooling sleeve.

20. The method of claim 19, further comprising: during operation of the PVM valve and when flowing the cooling fluid through the fluid flow path formed in the cooling sleeve, detecting open and closed states of the valve of the valve actuator and sensor assembly using a sensor of the valve actuator and sensor assembly.

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