Display apparatus and test method therefor

Abstract

A display apparatus and a test method therefor. The display apparatus comprises a display substrate (11), and an integrated circuit (12) and a flexible circuit board (13) separately bound and connected to the display substrate (11). The display substrate (11) comprises multiple first substrate pads (111A) and multiple second substrate pads (111B). The integrated circuit comprises a test signal end and multiple first connection pads (121). The display substrate (11) or the integrated circuit (12) comprises a first switch unit (S1) and a second switch unit (S2). At least two first connection pads (121) are electrically connected to the test signal end by means of the first switch unit (S1), and at least two second substrate pads (111B) are electrically connected to the test signal end by means of the second switch unit (S2). The integrated circuit (12) detects the status of the binding connection between the integrated circuit (12) and the display substrate (11), or between the flexible circuit board (13) and the display substrate (11), by means of controlling the connection and disconnection of the first switch unit (S1) and the second switch unit (S2), respectively, such that an impedance test signal of the test signal end passes through test pathways in which the first switch unit (S1) and the second switch unit (S2) are located.

Description

Display device and test method thereof

[0001] The present application claims priority from the Chinese patent application No. 202410693121.2 filed on May 30, 2024 and entitled "Display device and test method thereof", the contents of which should be understood as incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to, but is not limited to, the technical field of display, and in particular to a display device and a test method thereof. BACKGROUND

[0003] Organic light emitting diode (OLED) is an active light emitting display device, which has the advantages of self-emission, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, display devices using OLED as light emitting elements and controlled by thin film transistors (TFT) have become the mainstream products in the current display field.

[0004] SUMMARY

[0005] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0006] In a first aspect, the embodiments of the present disclosure provide a display device, comprising a display substrate, the display substrate comprising a display area and a non-display area surrounding the display area; a plurality of sub-pixels located in the display area; a plurality of data lines located in the display area and extending to the non-display area, the plurality of sub-pixels and the plurality of data lines being electrically connected; a plurality of first substrate pads and a plurality of second substrate pads located in the non-display area, the plurality of second substrate pads being located on a side of the plurality of first substrate pads away from the display area, the plurality of data lines being electrically connected to a part of the plurality of first substrate pads; an integrated circuit located in the non-display area, the integrated circuit comprising a plurality of integrated circuit pads, the plurality of integrated circuit pads being bonded to the plurality of first substrate pads; a flexible circuit board located in the non-display area, the flexible circuit board comprising a plurality of second connection pads, the plurality of second connection pads being bonded to the plurality of second substrate pads; the integrated circuit comprising a test signal terminal, the display substrate or the integrated circuit comprising a first switch unit and a second switch unit; wherein the plurality of integrated circuit pads comprise a plurality of first connection pads, the plurality of first connection pads being bonded to another part of the first substrate pads on the display substrate, at least two of the plurality of first connection pads being electrically connected to the test signal terminal through the first switch unit, at least two of the plurality of second substrate pads being electrically connected to the test signal terminal through the second switch unit, the integrated circuit being configured to pass the impedance test signal of the test signal terminal through a detection path in which the first switch unit and the second switch unit are located by controlling the on-off of the first switch unit and the second switch unit, and thereby detecting the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate, respectively.

[0007] In an example embodiment, the first switch unit and the second switch unit are located in the non-display area of the display substrate; wherein the plurality of integrated circuit pads further comprise a first control pad, a second control pad and a plurality of test pads, the first control pad, the second control pad and the plurality of test pads being bonded to another part of the first substrate pads on the display substrate, the first control pad being electrically connected to a gate electrode of the first switch unit and configured to control the on-off of the first switch unit, the second control pad being electrically connected to a gate electrode of the second switch unit and configured to control the on-off of the second switch unit, and the plurality of test pads being connected to the test signal terminal and configured to receive the impedance test signal.

[0008] In an example embodiment, the at least two of the first connection pads are electrically connected to the test signal terminal through the first switch unit, including that the at least two of the first connection pads are electrically connected to at least two of the test pads through the first switch unit; the at least two of the second substrate pads are electrically connected to the test signal terminal through the second switch unit, including that the at least two of the second substrate pads are electrically connected to the at least two of the test pads through the second switch unit; the integrated circuit is configured to detect the binding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate by controlling the on-off of the first switch unit and the second switch unit and transmitting the impedance test signal through the at least two of the test pads.

[0009] In an example embodiment, the first switch unit and the second switch unit are located in the integrated circuit, and the integrated circuit further includes a first code control terminal and a second code control terminal; the first code control terminal is electrically connected to the gate electrode of the first switch unit and is configured to control the on-off of the first switch unit; the second code control terminal is electrically connected to the gate electrode of the second switch unit and is configured to control the on-off of the second switch unit.

[0010] In an example embodiment, the display substrate further includes a third connection part, and the at least two of the first connection pads are connected through the third connection part.

[0011] In an example embodiment, the first switch unit includes a first sub-switch and a second sub-switch; the gate electrode of the first sub-switch is connected to the first code control terminal, the first pole of the first sub-switch is connected to the first test signal terminal, and the second pole of the first sub-switch is connected to the corresponding first connection pad; the gate electrode of the second sub-switch is connected to the first code control terminal, the first pole of the second sub-switch is connected to the first test signal terminal, and the second pole of the second sub-switch is connected to the corresponding first connection pad.

[0012] In an example embodiment, the display substrate further includes a pair of fourth connection parts, and the fourth connection parts are configured to connect the first substrate pad and the corresponding second substrate pad.

[0013] In an example embodiment, the flexible circuit board further includes a second connection part, and the second substrate pad connected to the same pair of fourth connection parts is connected through the second connection part.

[0014] In an example embodiment, the second switch unit includes a third sub-switch and a fourth sub-switch, a gate electrode of the third sub-switch is connected with the second code control end, a first pole of the third sub-switch is connected with the first test signal end, and a second pole of the third sub-switch is connected with the corresponding first connection pad; a gate electrode of the fourth sub-switch is connected with the second code control end, a first pole of the fourth sub-switch is connected with the first test signal end, and a second pole of the fourth sub-switch is connected with the corresponding first connection pad.

[0015] In an example embodiment, the plurality of integrated circuit pads further include a plurality of test pads, the plurality of test pads are correspondingly bound and connected with another part of the first substrate pads on the display substrate; the display substrate further includes a crack detection line, the crack detection line partially surrounds the display area; the crack detection line is electrically connected with the test pad; the integrated circuit further includes a third code control end and a third switch unit, the third control pad is electrically connected with a gate electrode of the third switch unit and is configured to control on-off of the third switch unit; the crack detection line is configured to detect whether the display substrate has cracks by transmitting the impedance test signal.

[0016] In an example embodiment, the third switch unit includes a fifth sub-switch and a sixth sub-switch, a gate electrode of the fifth sub-switch is connected with the third code control end, a first pole of the fifth sub-switch is connected with the first test signal end, a second pole of the fifth sub-switch is connected with the corresponding test pad, a gate electrode of the sixth sub-switch is connected with the third code control end, a first pole of the sixth sub-switch is connected with the first test signal end, and a second pole of the sixth sub-switch is connected with the corresponding test pad.

[0017] In a second aspect, the display device testing method is provided. The method is applied to the display device described above, and includes: transmitting, by the integrated circuit, a first control signal to the first switch unit to control the first switch unit to open; transmitting, by the integrated circuit, a second control signal to the second switch unit to control the second switch unit to close; transmitting, by the test signal terminal of the integrated circuit, an impedance test signal, and the impedance test signal passes through a detection path where the first switch unit is located to test a binding connection between the integrated circuit and the display substrate; or transmitting, by the integrated circuit, the second control signal to the first switch unit to control the first switch unit to close; transmitting, by the integrated circuit, the first control signal to the second switch unit to control the second switch unit to open; transmitting, by the test signal terminal of the integrated circuit, the impedance test signal, and the impedance test signal passes through a detection path where the second switch unit is located to test a binding connection between the flexible circuit board and the display substrate; or transmitting, by the integrated circuit, the second control signal to the first switch unit to control the first switch unit to close; transmitting, by the integrated circuit, the second control signal to the second switch unit to control the second switch unit to close. In an exemplary embodiment, the first switch unit and the second switch unit are located in the integrated circuit, and the method includes: transmitting, by the first code control terminal of the integrated circuit, the first control signal to control the first switch unit to open; transmitting, by the second code control terminal of the integrated circuit, the second control signal to control the second switch unit to close; transmitting, by the test signal terminal of the integrated circuit, the impedance test signal, and the impedance test signal passes through a detection path where the first switch unit is located to test a binding connection between the integrated circuit and the display substrate; or transmitting, by the first code control terminal of the integrated circuit, the second control signal to control the first switch unit to close; transmitting, by the second code control terminal of the integrated circuit, the first control signal to control the second switch unit to open; transmitting, by the test signal terminal of the integrated circuit, the impedance test signal, and the impedance test signal passes through a detection path where the second switch unit is located to test a binding connection between the flexible circuit board and the display substrate; or transmitting, by the first code control terminal of the integrated circuit, the second control signal to control the first switch unit to close; transmitting, by the second code control terminal of the integrated circuit, the second control signal to control the second switch unit to close.

[0018] In an exemplary embodiment, when the first switch unit or the second switch unit is in an open state, the method further includes: transmitting, by the third code control terminal of the integrated circuit, the second control signal to the third switch unit to control the third switch unit to close.

[0019] In the exemplary embodiments, when the first switch unit and the second switch unit are in the closed state, the method further comprises: the third code control end of the integrated circuit transmits the first control signal to the third switch unit to control the third switch unit to open, and the integrated circuit transmits an impedance test signal to the crack detection line through the test pad to perform crack detection on the display substrate.

[0020] In the exemplary embodiments, the first control signal and the second control signal are voltage signals.

[0021] Other aspects can become apparent from the following detailed description, when considered in conjunction with the accompanying drawings and detailed description, and interrelated drawings disclose the principles of the disclosure.

[0022] SUMMARY

[0023] The accompanying drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and serve to explain the principles of the disclosure, and do not limit the disclosure.

[0024] FIG. 1 is a structural schematic diagram of a display device in some technologies;

[0025] FIG. 2 is a side view of the display device shown in FIG. 1;

[0026] FIG. 3 is a schematic diagram of a binding connection of an integrated circuit, a flexible circuit board, and a display substrate;

[0027] FIG. 4 is a structural schematic diagram of a display device in an exemplary embodiment of the disclosure;

[0028] FIG. 5 is a structural schematic diagram of a display substrate in FIG. 4 in an exemplary embodiment;

[0029] FIG. 6 is a structural schematic diagram of an integrated circuit in FIG. 4 in an exemplary embodiment;

[0030] FIG. 7 is a sectional view of a display substrate at a first sub-switch in an exemplary embodiment;

[0031] FIG. 8 is a structural schematic diagram of a display device in another exemplary embodiment;

[0032] FIG. 9 is a structural schematic diagram of a display substrate in FIG. 8 in an exemplary embodiment;

[0033] FIG. 10 is a structural schematic diagram of an integrated circuit in FIG. 8 in an exemplary embodiment;

[0034] FIG. 11 is a schematic diagram of a first selection circuit in an exemplary embodiment.

[0035] DETAILED DESCRIPTION

[0036] The present disclosure describes a number of embodiments, but this description is illustrative rather than limiting and many additions, deletions, and modifications can be made to the described embodiments by those skilled in the art without departing from the scope of the described embodiments. Although many possible combinations of features are shown in the drawings and discussed in the specific embodiments, many other combinations of the disclosed features are possible. Unless specifically intended otherwise, any feature or element of any embodiment can be used in combination with any other feature or element of any other embodiment, or in combination with any other feature or element of the same embodiment.

[0037] The present disclosure includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The presently disclosed embodiments, features and elements can also be combined with any conventional feature or element to form a unique application defined by the claims. Any feature or element of any embodiment can also be combined with features or elements from other application to form another unique application defined by the claims. Therefore, it should be understood that any of the features shown and / or discussed in the present disclosure can be implemented alone or in any suitable combination. Embodiments are, therefore, not to be limited by other than in accordance with the limitations provided in the appended claims and their equivalents. Further, various modifications and changes can be made within the scope of the claims.

[0038] Further, in describing representative embodiments, the specification can have presented the method and / or process as a particular sequence of steps. However, to the extent that the method or process depends on more than one step, the method or process should not be limited to the particular sequence of steps described. Other sequences of steps can be possible, and are within the scope of the present disclosure. Therefore, the particular order in which the steps are presented is not limiting. Further, the specification can present the steps of the method and / or process in a particular order. However, the order of the steps can be changed, and still be within the scope of the present disclosure. The application is not limited to the order of steps described if such steps can be performed in other sequences and still achieve the desired process.

[0039] In the drawings, the size, the thickness or the region of one or plural constituent elements shown in the drawings can be exaggerated for clarity in some cases. Further, the drawings show schematic examples, and the shape, the numerical value, and the like shown in the drawings are not limited to the examples shown in the drawings.

[0040] The ordinal numbers "first", "second", "third", and the like used in the present specification intend to distinguish between similar features for distinction rather than in quantity.

[0041] In this specification, terms of "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicating the positional or directional relationship of components are used to describe the positional relationship of components with reference to the drawings for the convenience of explanation and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting on the present disclosure. The positional relationship of the components is changed as appropriate according to the direction of the components described. Therefore, it is not limited to the words described in the specification, and can be appropriately changed according to the situation.

[0042] In this specification, unless explicitly defined and limited otherwise, the terms "mount", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate, or communication between two elements inside. For those skilled in the art, the meaning of the above terms in this disclosure can be understood according to the situation.

[0043] In this specification, a transistor refers to an element including at least a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between the drain electrode (drain electrode terminal, drain region, or drain) and the source electrode (source electrode terminal, source region, or source), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to a region through which current mainly flows.

[0044] In this specification, the first electrode can be a drain electrode, and the second electrode can be a source electrode, or the first electrode can be a source electrode, and the second electrode can be a drain electrode. In the case of using a transistor with opposite polarity or in the case of changing the direction of current in the circuit operation, the functions of "source electrode" and "drain electrode" are sometimes exchanged with each other. Therefore, in this specification, "source electrode" and "drain electrode" can be exchanged with each other, and "source terminal" and "drain terminal" can be exchanged with each other.

[0045] In this specification, "electrically connected" includes the case where components are connected together through an element having some electrical effect. The element having some electrical effect is not particularly limited as long as it can transmit an electrical signal between the connected components. Examples of the element having some electrical effect include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, other elements having various functions, and the like.

[0046] In the present specification, "parallel" refers to a state in which the angle formed by two straight lines is -10° or more and 10° or less, and thus also includes a state in which the angle is -5° or more and 5° or less. In addition, "perpendicular" refers to a state in which the angle formed by two straight lines is 80° or more and 100° or less, and thus also includes a state in which the angle is 85° or more and 95° or less.

[0047] Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0048] FIG. 1 is a structural schematic diagram of a display device in some technologies. FIG. 2 is a side view of the display device shown in FIG. 1, illustrating a state after the binding area is bent. As shown in FIG. 1 and FIG. 2, the display device provided in the present embodiment includes a display substrate 11, and an integrated circuit (IC) 12 and a flexible printed circuit (FPC) 13 which are bound to the display substrate 11. The display substrate 11 includes a display area 100 and a non-display area 200 which surrounds the periphery of the display area 100. The non-display area 200 includes a binding area 300 located on the side of the display area 100 along a second direction Y. The display area 100 includes at least a plurality of pixel units arranged in a regular manner, for example, the plurality of pixel units can be arranged in an array along a first direction X and a second direction Y, and the first direction X and the second direction Y intersect. The plurality of pixel units are configured to display dynamic pictures or still images, and the display area 100 can be referred to as an active area (AA). In an exemplary embodiment, the display device can be deformable, for example, rolled, bent, folded or rolled up.

[0049] In an exemplary embodiment, the shape of the display area 100 can be a quadrilateral, a circle, an ellipse, a polygon of other shapes or an irregular shape, etc., and the corner shape of the display area 100 can be a rounded corner, which is not limited in the present disclosure.

[0050] In an example embodiment, the binding area 300 can include, in sequence along a direction away from the display area 100, a fan-out area 400, a driving chip area 600, and a binding pin area 700. The fan-out area 400 is connected to the display area 100 and can include at least a plurality of parallel data fan-out lines. The signal lines such as power lines and data lines of the display area 100 can pass through the fan-out area 400 in a fan-out manner and be connected to corresponding signal providing ends. The driving chip area 600 can include at least a plurality of bonding pads. The integrated circuit 12 can be connected to the display substrate 11 through the plurality of bonding pads of the driving chip area 600. The integrated circuit 12 is configured to be connected to the plurality of data fan-out lines. The integrated circuit 12 can be a driving integrated circuit (DIC). The binding pin area 700 can include at least a plurality of bonding pads. The flexible circuit board 13 can be connected to the display substrate 11 through the plurality of bonding pads of the binding pin area 700.

[0051] In an example embodiment, the binding area 400 can further include a bending area 500. The bending area 500 can be located between the fan-out area 400 and the driving chip area 600. The bending area 500 is connected to the fan-out area 400 and can include a composite insulating layer provided with a groove and configured to bend the binding area 300 to the back of the display area 100. After the binding area 300 is bent, the integrated circuit 12 and the flexible circuit board 13 are bent to the back of the display area 100.

[0052] In an example embodiment, as shown in FIG. 1, two crack detection lines 201 are provided in the non-display area 200. The two crack detection lines 201 are wrapped around the outside of the display area 100. The two ends of the crack detection lines 201 are connected to the integrated circuit 12. The integrated circuit 12 can provide a crack detection signal to the crack detection lines 201, so as to detect the crack condition of the display substrate 11 around the display area 100. The number and distribution of the crack detection lines 201 can be set as needed, and the present disclosure does not limit this.

[0053] In an example embodiment, after the integrated circuit 12 and the flexible circuit board 13 are connected to the display substrate 11, the binding effect needs to be detected. For example, the binding between the flexible circuit board 13 and the display substrate 11 can be judged by detecting the impedance between the flexible circuit board 13 and the display substrate 11. The binding between the integrated circuit 12 and the display substrate 11 can be judged by detecting the impedance between the integrated circuit 12 and the display substrate 11.

[0054] FIG. 3 is a schematic diagram of the binding connection of the integrated circuit, the flexible circuit board and the display substrate, which simplifies the structure of the display substrate. In FIG. 3, the structures such as the pads, alignment marks, test points and connection lines provided on the display device can be symmetrically arranged, which is not limited by the present disclosure. As shown in FIG. 3, a plurality of first substrate pads 111A, a plurality of second substrate pads 111B, a plurality of first connection lines 112 and a plurality of second connection lines 113 are provided in the binding area of the display substrate 11, the plurality of first substrate pads 111A are configured to be bindingly connected with the integrated circuit 12, the plurality of second substrate pads 111B are configured to be bindingly connected with the flexible circuit board 13, the plurality of first substrate pads 111A can be arranged in sequence along the first direction X, the plurality of second substrate pads 111B can be arranged in sequence along the first direction X, and the plurality of second substrate pads 111B can be located on one side of the plurality of first substrate pads 111A along the second direction Y. The integrated circuit 12 includes a plurality of integrated circuit pads, the plurality of integrated circuit pads include a plurality of first connection pads 121 and a plurality of test pads 123, the plurality of first connection pads 121 can be located at both ends of the integrated circuit 12 along the second direction Y, the plurality of test pads 123 can be located at both ends of the integrated circuit 12 along the first direction X, the first connection pad 121 is configured to be bindingly connected with the display substrate 11 through the corresponding first substrate pad 111A, and the test pad 123 is configured to be connected with the crack detection line 201 to provide a crack detection signal to the crack detection line 201, and the integrated circuit 12 further includes a plurality of third connection lines 122, the third connection line 122 is configured to connect the corresponding two first connection pads 121, which can be two pads adjacent in the first direction X. The flexible circuit board 13 includes a plurality of second connection pads 131, a plurality of alignment marks 132, a plurality of test points 133, a plurality of fourth connection lines 134 and a plurality of second test pads 135, the plurality of test points 133 include a pair of first point A and second point B, and a pair of third point C and fourth point D, the plurality of fourth connection lines 134 are used to connect the first point A and the second point B with the corresponding second connection pad 131, and connect the third point C and the fourth point D with the corresponding second test pad 135. The plurality of second connection pads 131 are configured to be bindingly connected with the display substrate 11 through the corresponding second substrate pad 111B, and connected with the first point A and the second point B through the fourth connection line 134, and the second connection pad 131 can be connected with each other through the first connection line 112 on the display substrate 11 after being connected with the second substrate pad 111B, as shown in FIG. 3, the first connection line 112 can connect two second substrate pads 111B adjacent in the first direction X, thereby forming a test path between the first point A and the second point B, and subsequently the impedance test can be performed at the first point A and the second point B by using the probe, thereby determining the binding connection effect between the display substrate 11 and the flexible circuit board 13.The first substrate pad 111A connected with the first connection pad 121 can be connected to the second test pad 135 of the flexible circuit board 13 through the second connection line 113 and the second substrate pad 111B arranged on the display substrate 11 in correspondence, and the second test pad 135 can be connected with the third point C and the fourth point D through the corresponding fourth connection line 134. Under the communication of the third connection line 122, a test path is formed between the third point C and the fourth point D, and subsequently, impedance testing can be performed at the third point C and the fourth point D by using a probe, so as to determine the binding connection effect between the display substrate 11 and the integrated circuit 12. By arranging the second test pad 135 and the related structure on the flexible circuit board 13, the connection between the first connection pad 121 and the first substrate pad 111A can be detected at the test point 133 of the flexible circuit board 13, which facilitates the detection of the binding connection of the display substrate 11, the integrated circuit 12 and the flexible circuit board 13.

[0055] In the example embodiment, the alignment mark 132 is arranged near the test point 133. For example, the alignment mark 132 can be arranged on one side of the test point 133 in the first direction X, so that the probe can accurately find the corresponding test point when testing.

[0056] As shown in FIG. 3, when performing impedance testing, the alignment mark 132 can be quickly positioned to the test point 133, and the probe of the impedance testing equipment can accurately find the corresponding test point 133 and perform impedance detection on the test path, so as to determine whether the binding connection is abnormal. In the probe impedance detection mode, as shown in FIG. 3, the alignment mark 132, the test point 133, the fourth connection line 134 and the second test pad 135 and the like need to be arranged on the flexible circuit board 13 in advance, and the size of the alignment mark 132 and the test point 133 cannot be reduced due to the limitation of the detection equipment and the probe size, which makes the structure of the flexible circuit board 13 complex, the space utilization rate is low, the thickness and weight are large, which is not conducive to the realization of the lightness and thinness of the display device, and is also not conducive to the realization of the narrow frame. Moreover, the probe impedance detection mode needs to use special detection equipment, the production cost is high, the contact type test mode takes a long time, the time cost is large, and the production capacity of the display device cannot be improved.

[0057] The display device provided by the embodiments of the present disclosure comprises a display substrate, the display substrate comprises a display area and a non-display area surrounding the display area; a plurality of sub-pixels are located in the display area; a plurality of data lines are located in the display area and extend to the non-display area, the plurality of sub-pixels and the plurality of data lines are electrically connected; a plurality of first substrate pads and a plurality of second substrate pads are located in the non-display area, the plurality of second substrate pads are located on the side of the plurality of first substrate pads away from the display area, the plurality of data lines are electrically connected with a part of the plurality of first substrate pads; an integrated circuit is located in the non-display area, the integrated circuit comprises a plurality of integrated circuit pads, the plurality of integrated circuit pads are bonded with the plurality of first substrate pads; a flexible circuit board is located in the non-display area, the flexible circuit board comprises a plurality of second connection pads, the plurality of second connection pads are bonded with the plurality of second substrate pads; the integrated circuit comprises a test signal end, the display substrate or the integrated circuit comprises a first switch unit and a second switch unit; wherein the plurality of integrated circuit pads comprise a plurality of first connection pads, the plurality of first connection pads are bonded with another part of the first substrate pads on the display substrate in correspondence, at least two of the plurality of first connection pads are electrically connected with the test signal end through the first switch unit, at least two of the plurality of second substrate pads are electrically connected with the test signal end through the second switch unit, the integrated circuit is configured to make the impedance test signal of the test signal end pass through the detection path where the first switch unit and the second switch unit are located by controlling the on-off of the first switch unit and the second switch unit, and then detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate, respectively.

[0058] The display device provided by the embodiments of the present disclosure can detect the bonding connection effect between the integrated circuit and the display substrate by forming a detection path at the bonding connection between the integrated circuit and the display substrate and transmitting an impedance test signal to the detection path by the integrated circuit. The display device can detect the bonding connection effect between the flexible circuit board and the display substrate by forming a detection path at the bonding connection between the flexible circuit board and the display substrate and transmitting an impedance test signal to the detection path by the integrated circuit. The display device provided by the embodiments of the present disclosure can detect the bonding effect between the display substrate, the integrated circuit and the flexible circuit board, without using a probe detection method or setting redundant structures such as alignment marks and test points on the flexible circuit board, thereby greatly saving the space and layout of the flexible circuit board, reducing the thickness and weight of the flexible circuit board and the display device, and achieving the lightness, thinness and narrow frame of the display device.

[0059] In an example embodiment, the first switch unit and the second switch unit are located in the non-display area of the display substrate; wherein the plurality of integrated circuit pads further comprise a first control pad, a second control pad, and a plurality of test pads, the first control pad, the second control pad, and the plurality of test pads are correspondingly bound and connected with another part of the first substrate pads on the display substrate, the first control pad is electrically connected with the gate electrode of the first switch unit and is configured to control the on-off of the first switch unit; the second control pad is electrically connected with the gate electrode of the second switch unit and is configured to control the on-off of the second switch unit; the plurality of test pads are connected with the test signal end and are configured to receive the impedance test signal.

[0060] In an example embodiment, at least two of the plurality of first connection pads are electrically connected with the test signal end through the first switch unit, comprising: at least two of the plurality of first connection pads are electrically connected with at least two of the plurality of test pads through the first switch unit; at least two of the plurality of second substrate pads are electrically connected with the test signal end through the second switch unit, comprising: at least two of the plurality of second substrate pads are electrically connected with the at least two test pads through the second switch unit; the integrated circuit is configured to control the on-off of the first switch unit and the second switch unit, and transmit the impedance test signal through the at least two test pads, so as to detect the binding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate, respectively.

[0061] In an example embodiment, the "another part" of the first substrate pads refers to a part of the remaining first substrate pads except the first substrate pads connected with the data lines, and the first control pad, the second control pad, the first connection pad, and the test pad are respectively connected with different first substrate pads.

[0062] In an example embodiment, the first switch unit and the second switch unit are located in the integrated circuit, and the integrated circuit further comprises a first code control end and a second code control end; the first code control end is electrically connected with the gate electrode of the first switch unit and is configured to control the on-off of the first switch unit; the second code control end is electrically connected with the gate electrode of the second switch unit and is configured to control the on-off of the second switch unit.

[0063] FIG. 4 is a structural schematic diagram of a display device in an exemplary embodiment of the present disclosure, in which some components such as bonding pads and traces are shown in enlarged view, and other structures and areas are omitted, the arc shape in FIG. 4 indicates that the traces cross but are not connected, and FIG. 4 illustrates the structure of the display device as an example in which the structure is distributed symmetrically along a first direction, and the present disclosure is not limited in this regard. As shown in FIG. 4, the display device includes a display substrate 11, an integrated circuit 12, and a flexible circuit board 13. The display substrate 11 includes a display area 100 and a non-display area 200 surrounding the display area 100, the non-display area 200 includes a bonding area 300 on one side of the display area 100, and the integrated circuit 12 and the flexible circuit board 13 are bonded and connected in the bonding area 300. The integrated circuit 12 is located on one side of the display area 100 along a second direction Y, and the flexible circuit board 13 is located on one side of the integrated circuit 12 along the second direction Y. The display area 100 includes a plurality of sub-pixels P, and the plurality of sub-pixels P can be arranged in an array, a column of sub-pixels P arranged along the second direction Y can be connected to the same data line 101, and a plurality of data lines 101 can be connected to the integrated circuit 12. The integrated circuit 12 provides a data signal to the corresponding sub-pixel through the data line 101 to drive the sub-pixel to display.

[0064] Fig. 5 is a structural schematic diagram of the display substrate of Fig. 4 in an exemplary embodiment, Fig. 6 is a structural schematic diagram of the integrated circuit of Fig. 4 in an exemplary embodiment, and Figs. 5 and 6 illustrate the arrangement of structures such as the bonding pads on the display substrate and the integrated circuit. As shown in Figs. 4 to 6, the display substrate 11 of the non-display area 200 includes the first switch unit S1, the second switch unit S2, a plurality of first substrate pads 111A, and a plurality of second substrate pads 111B. The plurality of first substrate pads 111A are located in the integrated circuit area 600 and are configured to be bonded to the integrated circuit 12. The plurality of second substrate pads 111B are located in the bonding pin area 700 and are configured to be bonded to the flexible circuit board 13. The integrated circuit 12 includes a test signal terminal, a first control pad 124A, a second control pad 124B, a plurality of test pads 123, and a plurality of first connection pads 121. The test signal terminal can include a first test signal terminal P1 and a second test signal terminal P2. The first test signal terminal P1 and the second test signal terminal P2 can be connected to corresponding test pads 123, respectively. The plurality of first connection pads 121 are distributed along the second direction Y at both ends of the integrated circuit 12. The integrated circuit 12 covers the integrated circuit area 600. The plurality of first connection pads 121 located at one end close to the display area 100 are bonded to a portion of the first substrate pads 111A and are connected to corresponding data lines 101. The plurality of first connection pads 121 located at one end away from the display area 100 are bonded to corresponding first substrate pads 111A. At least two first connection pads 121 of the plurality of first connection pads 121 located at one end away from the display area 100 are electrically connected to at least two test pads 123 through the first switch unit S1, forming a detection path between the display substrate 11 and the integrated circuit 12 for facilitating transmission of impedance test signals. The first control pad 124A is electrically connected to the gate electrode of the first switch unit S1 and is configured to control the on-off state of the first switch unit. The first control pad 124A, the second control pad 124B, the plurality of test pads 123, and a portion of the remaining first substrate pads 111A are bonded to each other. The flexible circuit board 13 covers the bonding pin area 700 and includes a plurality of second connection pads 131. The second connection pads 131 are bonded to corresponding second substrate pads 111B. At least two second substrate pads 111B of the plurality of second substrate pads 111B are electrically connected to at least two test pads 123 through the second switch unit S2, forming a detection path between the display substrate 11 and the flexible circuit board 13. The second control pad 124B is electrically connected to the gate electrode of the second switch unit S2 and is configured to control the on-off state of the second switch unit S2. The integrated circuit 12 is configured to control the on-off state of the first switch unit S1 and the second switch unit S2, transmit impedance test signals through the at least two test pads 123, and detect the bonding connection between the integrated circuit 12 and the display substrate 11 or between the flexible circuit board 13 and the display substrate 11, respectively.

[0065] In an example embodiment, as shown in FIG. 5, the plurality of second substrate pads 111B can be distributed at opposite ends of the binding pin region 700 along the first direction D1. As shown in FIG. 6, the plurality of first control pads 124A, the plurality of second control pads 124B and the plurality of test pads 123 can be distributed at two ends of the integrated circuit 12 along the first direction D1. The present disclosure does not limit this.

[0066] In an example embodiment, the binding region 300 can further include a bending region, which is located between the display region 100 and the integrated circuit 12, the position of the bending region can be referred to as shown in FIG. 1, the bending region is configured to bend the binding region 300 to the back of the display region 100, after bending, the integrated circuit 12 and the flexible circuit board 13 can be bent to the back of the display region 100, which can achieve narrow frame.

[0067] In an example embodiment, the plurality of pads on the integrated circuit 12 can be connected one-to-one with the plurality of first substrate pads 111A on the display substrate 11, and the crack detection line 201, the switch unit and other structures can be electrically connected to the pads on the integrated circuit 12 through the corresponding first substrate pads 111A.

[0068] In an example embodiment, the first switch unit S1, the second switch unit S2 and the third switch unit S3 can be transistors, and the gate electrodes of the transistors can be connected to the corresponding control pads.

[0069] In an example embodiment, as shown in FIG. 4, the integrated circuit 12 can include a first connection part 126, the first connection part 126 can be connected to two first connection pads 121, the two first connection pads 121 are respectively connected to two test pads 123, the first switch unit can include a first sub-switch K1 and a second sub-switch K2, one pair of first connection pads 121 and test pads 123 are provided with the first sub-switch K1, and the other pair of first connection pads 121 and test pads 123 are provided with the second sub-switch K2, and the gate electrodes of the first sub-switch K1 and the second sub-switch K2 are connected to the first control pad 124A. By providing the first connection part 126 inside the integrated circuit 12, the integrated circuit 12 itself has the condition to form a detection path, and the wiring on the display substrate 11 only needs to connect the corresponding pads to form a detection path, which helps to save the wiring space of the display substrate 11 and facilitates the wiring layout. In other embodiments, the first connection part 126 can be connected to a larger number of first connection pads 121, and the first switch unit can include a larger number of sub-switches, which are not limited by the present disclosure.

[0070] In an example embodiment, as shown in FIG. 4, the gate electrode of the first sub-switch K1 can be connected with the corresponding first control pad 124A through the first trace L1, the first electrode of the first sub-switch K1 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the second trace L2, so as to realize the connection between the first electrode and the corresponding first connection pad 121, and the second electrode of the first sub-switch K1 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the second trace L2, so as to realize the connection between the second electrode and the corresponding test pad 123. The gate electrode of the second sub-switch K2 can be connected with the corresponding first control pad 124A through the fourth trace L4, and the fourth trace L4 and the first trace L1 can be connected with each other. The first electrode of the second sub-switch K2 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the fifth trace L5, so as to realize the connection between the first electrode and the corresponding first connection pad 121, and the second electrode of the second sub-switch K2 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the sixth trace L6, so as to realize the connection between the second electrode and the corresponding test pad 123.

[0071] In an example embodiment, as shown in FIG. 4, the flexible circuit board 13 can include a second connection part 136, the second connection part 136 can be connected with two second connection pads 131, the two second connection pads 131 are respectively connected with two test pads 123 of the integrated circuit 12, and the second switch unit can include a third sub-switch K3 and a fourth sub-switch K4, one pair of the second connection pad 131 and the test pad 123 is provided with the third sub-switch K3, and the other pair of the second connection pad 131 and the test pad 123 is provided with the fourth sub-switch K4, and the gate electrodes of the third sub-switch K3 and the fourth sub-switch K4 are connected with the second control pad 124B. By arranging the second connection part 136 inside the flexible circuit board 13, the flexible circuit board 13 itself has the condition of forming a detection path, and the traces on the display substrate 11 only need to be connected with the corresponding pads to form the detection path, which helps to save the trace space of the display substrate 11 and facilitates the layout of the traces. In other embodiments, the second connection part 136 can be connected with a larger number of second connection pads 131, and the second switch unit can include a larger number of sub-switches, which is not limited in the present disclosure.

[0072] In an example embodiment, as shown in FIG. 4, the gate electrode of the third sub-switch K3 can be connected with the corresponding second control pad 124B through the seventh wire L7, the first pole of the third sub-switch K3 can be connected with the corresponding second substrate pad 111B on the display substrate 11 through the eighth wire L8, so as to realize the connection between the first pole and the corresponding second connection pad 131, the second pole of the third sub-switch K3 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the ninth wire L9, so as to realize the connection between the second pole and the corresponding test pad 123, and the ninth wire L9 can be connected with the sixth wire L6. The gate electrode of the fourth sub-switch K4 can be connected with the corresponding second control pad 124B through the tenth wire L10, and the tenth wire L10 can be connected with the seventh wire L7. The first pole of the fourth sub-switch K4 can be connected with the corresponding second substrate pad 111B on the display substrate 11 through the eleventh wire L11, so as to realize the connection between the first pole and the corresponding second connection pad 131, and the second pole of the fourth sub-switch K4 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the twelfth wire L12, so as to realize the connection between the second pole and the corresponding test pad 123, and the twelfth wire L12 can be connected with the third wire L3.

[0073] In the example embodiment, the display substrate 11 comprises a crack detection line 201 which partially surrounds the display area 100 of the display substrate 11; the display substrate 11 further comprises a third switch unit S3, and the integrated circuit 12 further comprises a third control pad 124C; the crack detection line 201 can be connected to the two test pads 123 through the third switch unit S3, and the third control pad 124C is electrically connected to the gate electrode of the third switch unit S3 and is configured to control the on-off of the third switch unit S3. In this embodiment, by configuring the crack detection line 201 to be electrically connected to the two test pads 123, the integrated circuit 12 can use the crack detection signal to detect the crack condition of the display substrate 11. In the example embodiment, the first switch unit S1 and the second switch unit S2 can be controlled to be closed and the third switch unit S3 can be controlled to be opened, so as to detect the crack of the display substrate 11; then, the first switch unit S1 can be controlled to be opened and the second switch unit S2 and the third switch unit S3 can be controlled to be closed, so as to test the binding connection between the display substrate 11 and the integrated circuit 12; finally, the first switch unit S1 and the third switch unit S3 can be controlled to be closed and the second switch unit S2 can be controlled to be opened, so as to detect the binding connection between the display substrate 11 and the flexible circuit board 13. This detection method of the binding connection is fast and accurate, does not need to use a specific probe detection device, and does not need to increase a new production process, which not only helps to realize the thinning of the display device, but also improves the production efficiency of the display device. In other embodiments, at least two of the first switch unit S1, the second switch unit S2 and the third switch unit S3 can be controlled to be opened at a time, so as to realize the integrated detection of at least two detection items. For example, the first switch unit S1 and the second switch unit S2 can be controlled to be opened and the third switch unit S3 can be controlled to be closed, so as to synchronously test the binding connection between the display substrate 11 and the integrated circuit 12 and the binding connection between the display substrate 11 and the integrated circuit 12; or the first switch unit S1 and the third switch unit S3 can be controlled to be opened and the second switch unit S2 can be controlled to be closed, so as to synchronously detect the binding connection between the display substrate 11 and the integrated circuit 12 and the crack of the display substrate 11; or the second switch unit S2 and the third switch unit S3 can be controlled to be opened and the first switch unit S1 can be controlled to be closed, so as to synchronously detect the binding connection between the display substrate 11 and the integrated circuit 12 and the crack of the display substrate 11; or the first switch unit S1, the second switch unit S2 and the third switch unit S3 can all be controlled to be opened, so as to synchronously detect the binding connection between the display substrate 11 and the integrated circuit 12, the binding connection between the display substrate 11 and the integrated circuit 12 and the crack of the display substrate 11, and the present disclosure does not limit this.

[0074] In the example embodiment, as shown in FIG. 4, the two ends of the crack detection line 201 are connected with the two test pads 123 respectively, the third switch unit can include a fifth sub-switch K5 and a sixth sub-switch K6, the fifth sub-switch K5 is arranged between one end of the crack detection line 201 and the test pad 123, the sixth sub-switch K6 is arranged between the other end of the crack detection line 201 and the test pad 123, and the gate electrodes of the fifth sub-switch K5 and the sixth sub-switch K6 are connected with the third control pad 124C.

[0075] In the example embodiment, as shown in FIG. 4, the gate electrode of the fifth sub-switch K5 can be connected with the corresponding third control pad 124C through the thirteenth wire L13, the first pole of the fifth sub-switch K5 can be connected with one end of the crack detection line 201, the second pole of the fifth sub-switch K5 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the fourteenth wire L14, so as to realize the connection between the second pole and the corresponding test pad 123, and the fourteenth wire L14 can be connected with the ninth wire L9. The gate electrode of the sixth sub-switch K6 can be connected with the corresponding third control pad 124C through the fifteenth wire L15, and the fifteenth wire L15 can be connected with the thirteenth wire L13. The first pole of the sixth sub-switch K6 can be connected with the other end of the crack detection line 201, and the second pole of the sixth sub-switch K6 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the sixteenth wire L16, so as to realize the connection between the second pole and the corresponding test pad 123, and the sixteenth wire L16 can be connected with the twelfth wire L12.

[0076] FIG. 7 is a sectional view of a display substrate at a first sub-switch in an example embodiment, and the sectional view of the display substrate at the rest of the sub-switches can refer to FIG. 7. As shown in FIG. 7, the first sub-switch K1 is a transistor, which includes a semiconductor layer 303, a gate electrode 305, a first electrode 311, and a second electrode 312. In a direction perpendicular to the display substrate, the display substrate can include a base 301, a buffer layer 302, the semiconductor layer 303, a first insulating layer 304, the gate electrode 305, a second insulating layer 306, a third trace L3, a third insulating layer 308, a source-drain metal layer, and a planar layer 309, and the source-drain metal layer can include the first electrode 311, the second electrode 312, and a first trace L1. The gate electrode 305 can be connected to a corresponding first control pad 124A through the first trace L1, and the first trace L1 and the gate electrode 305 can be connected through a via. The first trace L1 and the gate electrode 305 can be overlapped with each other in a projection of the first trace L1 on the base 301 and a projection of the gate electrode 305 on the base 301. The first electrode 311 can be connected to a corresponding first substrate pad 111A on the display substrate 11 through a second trace L2, so as to realize the connection between the first electrode 311 and a corresponding first connection pad 121. The first electrode 311 and the second trace L2 can be connected to each other or be an integral structure. The second electrode 312 can be connected to a corresponding first substrate pad 111A on the display substrate 11 through a third trace L3, so as to realize the connection between the second electrode and a corresponding test pad 123. The third trace L3 and the second electrode 312 can be connected through a via. The third trace L3 and the gate electrode 305 are not overlapped with each other in a projection of the third trace L3 on the base 301 and a projection of the gate electrode 305 on the base 301. The base 301 can be a flexible base, which is convenient for bending. The first insulating layer 304 and the second insulating layer 306 can be referred to as gate insulating layers, the third insulating layer 308 can be referred to as an interlayer insulating layer, and the planar layer 309 can be in the same layer as a pixel definition layer of a display area, but the present disclosure is not limited thereto.

[0077] FIG. 8 is a structural schematic diagram of a display device in another example embodiment, and part of the structure and area is omitted. FIG. 8 takes an example of the structure of the display device being left-right symmetrical in a first direction, but the present disclosure is not limited thereto. The difference between FIG. 8 and FIG. 4 is that the integrated circuit includes a test signal terminal and a selection circuit, and the first switch unit, the second switch unit, the third switch unit, and the related traces are located in the selection circuit of the integrated circuit. The rest of the structure can refer to the foregoing description of FIG. 4, and will not be described here again.

[0078] FIG. 9 is a structural schematic diagram of the display substrate of FIG. 8 in an example embodiment, and FIG. 10 is a structural schematic diagram of the integrated circuit of FIG. 8 in an example embodiment. As shown in FIGS. 8-10, the integrated circuit 12 can include a first selection circuit 125A, a second selection circuit 125B, a first test signal terminal P1, and a second test signal terminal P2. The first selection circuit 125A is connected to the first test signal terminal P1, and the first test signal terminal P1 can send an impedance test signal. The impedance test signal can enter at least one of the detection path between the integrated circuit 12 and the display substrate 11 and the detection path between the flexible circuit board 13 and the display substrate 11 after passing through the first selection circuit 125A, so as to detect the bonding connection between the integrated circuit 12 and the display substrate 11 or between the flexible circuit board 13 and the display substrate 11. The second selection circuit 125B is connected to the second test signal terminal P2, and the second test signal terminal P2 can send an impedance test signal. The impedance test signal can enter at least one of the detection path between the integrated circuit 12 and the display substrate 11 and the detection path between the flexible circuit board 13 and the display substrate 11 after passing through the second selection circuit 125B, so as to detect the bonding connection between the integrated circuit 12 and the display substrate 11 or between the flexible circuit board 13 and the display substrate 11. As shown in FIGS. 8-10, the first selection circuit 125A and the second selection circuit 125B can be symmetrically distributed along the first direction X, the first test signal terminal P1 and the second test signal terminal P2 can be symmetrically distributed along the first direction X, the integrated circuit 12 and the display substrate 11 can include two detection paths, which can be symmetrically distributed along the first direction X, the flexible circuit board 13 and the display substrate 11 can include two detection paths, which can be symmetrically distributed along the first direction X, and the first selection circuit 125A and the second selection circuit 125B can detect the detection paths on the same side of the first direction X as themselves. The number and distribution of test signal terminals and selection circuits are not limited in the present disclosure.

[0079] In example embodiments, as shown in FIGS. 8-10, the display substrate 11 can include a third connecting portion 114, which can connect two adjacent first substrate pads 111A. The two adjacent first substrate pads 111A can be bonded to corresponding first connecting pads 121, and the two adjacent first substrate pads 111A can be connected to the first selection circuit 125A or the second selection circuit 125B. By providing the third connecting portion 114, a detection path can be formed between the integrated circuit 12 and the display substrate 11, so as to detect the bonding connection between the integrated circuit 12 and the display substrate 11 using the impedance test signal from the first selection circuit 125A or the second selection circuit 125B. In other embodiments, the two adjacent first substrate pads 111A can also be connected by the first connecting portion 126, which is not limited in the present disclosure.

[0080] In the example embodiment, as shown in FIGS. 8-10, the display substrate 11 can include a pair of fourth connecting portions 115, which can connect the first substrate pad 111A and the corresponding second substrate pad 111B, and the pair of fourth connecting portions 115 can be connected with two adjacent second substrate pads 111B, the second substrate pads 111B connected with the same pair of fourth connecting portions 115 can be connected through the second connecting portions 136, and the first substrate pad 111A connected with the same pair of fourth connecting portions 115 can be connected with the first selection circuit 125A or the second selection circuit 125B, so that a detection path can be formed between the flexible circuit board 13 and the display substrate 11, to facilitate detection of the binding connection between the flexible circuit board 13 and the display substrate 11 by using the impedance test signal from the first selection circuit 125A or the second selection circuit 125B.

[0081] In the exemplary embodiments, in the first direction X, the display substrate 11 includes two crack detection lines 201 respectively located at the left and right sides of the display area 100. The first selection circuit 125A can also be electrically connected with the crack detection line 201 at the left side, and the impedance test signal can also enter the crack detection line 201 at the left side after passing through the first selection circuit 125A, so as to detect the crack condition at the left side of the display panel. As shown in FIGS. 8 to 10, the first selection circuit 125A can be connected with the test pad 123 at the left side of the integrated circuit 12 in the first direction X, and since the test pad 123 at the left side of the integrated circuit 12 is connected with the crack detection line 201 at the left side through the corresponding first substrate pad 111A, the electrical connection between the first selection circuit 125A and the crack detection line 201 at the left side is achieved. The second selection circuit 125B can also be connected with the crack detection line 201 at the right side, and the impedance test signal can also enter the crack detection line 201 at the right side after passing through the second selection circuit 125B, so as to detect the crack condition at the right side of the display panel. The second selection circuit 125B can be connected with the test pad 123 at the right side of the integrated circuit 12 in the first direction X, and since the test pad 123 at the right side of the integrated circuit 12 is connected with the crack detection line 201 at the right side through the corresponding first substrate pad 111A, the electrical connection between the second selection circuit 125B and the crack detection line 201 at the right side is achieved. FIG. 11 is a schematic diagram of the principle of the first selection circuit in an exemplary embodiment. In FIG. 11, the arc shape represents the crossing but not connecting of the wires. As shown in FIG. 11, the first selection circuit 125A includes a first code control end F1, a second code control end F2, a first switch unit S1 and a second switch unit S2, one end of the first switch unit S1 is connected with the first test signal end P1, the other end of the first switch unit S1 is connected with the corresponding first connection pad 121, and the first switch unit S1 can be turned on or turned off under the control of the first code control end F1, so that the impedance test signal from the first test signal end P1 can enter or not enter the detection path between the integrated circuit 12 and the display substrate 11. One end of the second switch unit S2 is connected with the first test signal end P1, the other end of the second switch unit S2 is connected with the corresponding first connection pad 121, and the second switch unit S2 can be turned on or turned off under the control of the second code control end F2, so that the impedance test signal from the first test signal end P1 can enter or not enter the detection path between the flexible circuit board 13 and the display substrate 11.

[0082] In the example embodiment, the first switch unit S1 can include a first sub-switch K1 and a second sub-switch K2, and the impedance test signal is output to the detection path between the integrated circuit 12 and the display substrate 11, i.e. OUT1 in FIG. 11, through the first sub-switch K1 and the second sub-switch K2. The gate electrode of the first sub-switch K1 is connected with the first code control end F1, the first pole of the first sub-switch K1 is connected with the first test signal end P1, and the second pole of the first sub-switch K1 is connected with the corresponding first connection pad 121. The gate electrode of the second sub-switch K2 is connected with the first code control end F1, the first pole of the second sub-switch K2 is connected with the first test signal end P1, and the second pole of the second sub-switch K2 is connected with the corresponding first connection pad 121. The second switch unit S2 can include a third sub-switch K3 and a fourth sub-switch K4, and the impedance test signal is output to the detection path between the flexible circuit board 13 and the display substrate 11, i.e. OUT2 in FIG. 11, through the third sub-switch K3 and the fourth sub-switch K4. The gate electrode of the third sub-switch K3 is connected with the second code control end F2, the first pole of the third sub-switch K3 is connected with the first test signal end P1, and the second pole of the third sub-switch K3 is connected with the corresponding first connection pad 121. The gate electrode of the fourth sub-switch K4 is connected with the second code control end F2, the first pole of the fourth sub-switch K4 is connected with the first test signal end P1, and the second pole of the fourth sub-switch K4 is connected with the corresponding first connection pad 121.

[0083] In the example embodiment, the first selection circuit 125A further includes a third code control end F3 and a third switch unit S3, one end of the third switch unit S3 is connected with the first test signal end P1, and the other end of the third switch unit S3 is connected with the corresponding test pad 123. The third switch unit S3 can be turned on or off under the control of the third code control end F3, so that the impedance test signal from the first test signal end P1 can enter or not enter the crack detection line 201.

[0084] In the example embodiment, the third switch unit S3 can include a fifth sub-switch K5 and a sixth sub-switch K6, and the impedance test signal is output to the crack detection line 201, i.e. OUT3 in FIG. 11, through the fifth sub-switch K5 and the sixth sub-switch K6. The gate electrode of the fifth sub-switch K5 is connected with the third code control end F3, the first pole of the fifth sub-switch K5 is connected with the first test signal end P1, and the second pole of the fifth sub-switch K5 is connected with the corresponding test pad 123. The gate electrode of the sixth sub-switch K6 is connected with the third code control end F3, the first pole of the sixth sub-switch K6 is connected with the first test signal end P1, and the second pole of the sixth sub-switch K6 is connected with the corresponding test pad 123.

[0085] In the example embodiment, the first code control terminal F1, the second code control terminal F2 and the third code control terminal F3 can be configured to output code instructions of the integrated circuit 12, which can be voltage signals. For example, the first code control terminal F1, the second code control terminal F2 or the third code control terminal F3 can output a first control signal to control the corresponding sub-switch to open, and the first code control terminal F1, the second code control terminal F2 or the third code control terminal F3 can output a second control signal to control the corresponding sub-switch to close. The first control signal can be a low voltage signal, for example, -7 volts, and the second control signal can be a high voltage signal, for example, +7 volts. The present disclosure is not limited in this regard.

[0086] In the example embodiment, the second selection circuit 125B has the same principle as the first selection circuit 125A. For details, refer to the foregoing description of FIG. 11, which will not be repeated here.

[0087] The present disclosure also provides a test method of a display device, which includes:

[0088] The integrated circuit transmits a first control signal to the first switch unit to control the first switch unit to open; the integrated circuit transmits a second control signal to the second switch unit to control the second switch unit to close; the test signal terminal of the integrated circuit sends an impedance test signal, which passes through the detection path where the first switch unit is located, to test the binding connection between the integrated circuit and the display substrate; or,

[0089] The integrated circuit transmits the second control signal to the first switch unit to control the first switch unit to close; the integrated circuit transmits the first control signal to the second switch unit to control the second switch unit to open; the test signal terminal of the integrated circuit sends the impedance test signal, which passes through the detection path where the second switch unit is located, to test the binding connection between the flexible circuit board and the display substrate; or,

[0090] The integrated circuit transmits the second control signal to the first switch unit to control the first switch unit to close; the integrated circuit transmits the second control signal to the second switch unit to control the second switch unit to close.

[0091] In an example embodiment, the first switch unit and the second switch unit are located on the display substrate, and the method comprises: the integrated circuit transmits a first control signal to the first switch unit through a first control pad to control the first switch unit to open; the integrated circuit transmits a second control signal to the second switch unit through a second control pad to control the second switch unit to close; the integrated circuit transmits an impedance test signal to the first connection pad through the test pad to test the binding connection between the integrated circuit and the display substrate; or,

[0092] the integrated circuit transmits a second control signal to the first switch unit through a first control pad to control the first switch unit to close; the integrated circuit transmits a first control signal to the second switch unit through a second control pad to control the second switch unit to open; the integrated circuit transmits an impedance test signal to the second connection pad through the test pad to test the binding connection between the flexible circuit board and the display substrate; or,

[0093] the integrated circuit transmits a second control signal to the first switch unit through a first control pad to control the first switch unit to close; the integrated circuit transmits a second control signal to the second switch unit through a second control pad to control the second switch unit to close.

[0094] In an example embodiment, when the first switch unit or the second switch unit is in an open state, the method further comprises: the integrated circuit transmits a second control signal to the third switch unit through a third control pad to control the third switch unit to close.

[0095] In an example embodiment, when the first switch unit and the second switch unit are in a closed state, the method further comprises: the integrated circuit transmits a first control signal to the third switch unit through a third control pad to control the third switch unit to open, and the integrated circuit transmits an impedance test signal to the first connection pad through the test pad to perform crack detection on the display substrate.

[0096] In the example embodiment, as shown in FIG. 4, when testing the binding connection between the integrated circuit 12 and the display substrate 11, the integrated circuit 12 can issue a code instruction to open the first sub-switch K1 and the second sub-switch K2 through the first control signal, and close the third sub-switch K3 to the sixth sub-switch K6 through the second control signal. The integrated circuit 12 can transmit an impedance test signal to the detection path between the integrated circuit 12 and the display substrate 11 through the test pad 123, detect the impedance in the detection path, and determine whether the binding connection between the integrated circuit 12 and the display substrate 11 has a problem according to the detection result. When testing the binding connection between the flexible circuit board 13 and the display substrate 11, the integrated circuit 12 can issue a code instruction to open the third sub-switch K3 and the fourth sub-switch K4 through the first control signal, and close the first sub-switch K1, the second sub-switch K2, the fifth sub-switch K5, and the sixth sub-switch K6 through the second control signal. The integrated circuit 12 can transmit an impedance test signal to the detection path between the flexible circuit board 13 and the display substrate 11 through the test pad 123, detect the impedance in the detection path, and determine whether the binding connection between the flexible circuit board 13 and the display substrate 11 has a problem according to the detection result. When testing the crack of the display substrate 11, the integrated circuit 12 can issue a code instruction to open the fifth sub-switch K5 and the sixth sub-switch K6 through the first control signal, and close the first sub-switch K1 to the fourth sub-switch K4 through the second control signal. The integrated circuit 12 can transmit an impedance test signal to the crack detection line 201 through the test pad 123, detect the impedance of the crack detection line 201, and determine whether the display substrate 11 has a crack according to the detection result. In other embodiments, at least two detection items can be integrated and detected at a time by controlling the on-off of the switch unit, which will not be described herein.

[0097] In the example embodiment, one of the two test pads 123 can be used to issue an impedance test signal, which reaches the other test pad 123 after passing through the detection path. The connection between the binding pads can be detected by the transmission of the impedance test signal in the detection path, and whether the display substrate has a crack can be detected by the transmission of the impedance test signal in the crack detection line 201. The detection principle and method of the present disclosure are not limited.

[0098] In an example embodiment, the first control signal and the second control signal can be voltage signals. In an example embodiment, the first control signal can be a low voltage signal, for example, can be -7 volts, and the second control signal can be a high voltage signal, for example, can be +7 volts. In other embodiments, the first control signal can be a high voltage signal, and the second control signal can be a low voltage signal. The low voltage signal and the high voltage signal can be relative concepts, and the type of transistor of the switching unit and the conduction signal can be set as needed, and the present disclosure does not limit this.

[0099] In an example embodiment, the first switching unit and the second switching unit are located in the integrated circuit, and the method comprises: the first code control end of the integrated circuit sends the first control signal to control the first switching unit to open; the second code control end of the integrated circuit sends the second control signal to control the second switching unit to close; the test signal end of the integrated circuit sends the impedance test signal, and the impedance test signal passes through the detection path where the first switching unit is located to test the binding connection between the integrated circuit and the display substrate; or,

[0100] the first code control end of the integrated circuit sends the second control signal to control the first switching unit to close; the second code control end of the integrated circuit sends the first control signal to control the second switching unit to open; the test signal end of the integrated circuit sends the impedance test signal, and the impedance test signal passes through the detection path where the second switching unit is located to test the binding connection between the flexible circuit board and the display substrate; or,

[0101] the first code control end of the integrated circuit sends the second control signal to control the first switching unit to close; the second code control end of the integrated circuit sends the second control signal to control the second switching unit to close.

[0102] In an example embodiment, when the first switching unit or the second switching unit is in an open state, the method further comprises: the third code control end of the integrated circuit transmits the second control signal to the third switching unit to control the third switching unit to close.

[0103] In an example embodiment, when the first switching unit and the second switching unit are in a closed state, the method further comprises: the third code control end of the integrated circuit transmits the first control signal to the third switching unit to control the third switching unit to open, and the integrated circuit transmits an impedance test signal to the crack detection line through the test pad to perform crack detection on the display substrate.

[0104] The display device provided by the embodiments of the present disclosure can be an OLED display, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or any product or component having a display function, and the embodiments of the present disclosure are not limited thereto.

[0105] Although the embodiments of the present disclosure are described above, the content described is only the embodiments adopted for the purpose of facilitating the understanding of the present disclosure, and is not intended to limit the present disclosure. Any person skilled in the art of the present disclosure can make any modification and change in the form and details without departing from the spirit and scope of the present disclosure, but the patent protection scope of the present disclosure shall be subject to the scope defined by the appended claims.

Claims

1. A display device comprising: A display substrate includes a display area and a non-display area surrounding the display area; a plurality of sub-pixels in the display area; a plurality of data lines in the display area and extending to the non-display area, the plurality of sub-pixels and the plurality of data lines being electrically connected; a plurality of first substrate pads and a plurality of second substrate pads in the non-display area, the plurality of second substrate pads being on a side of the plurality of first substrate pads away from the display area, the plurality of data lines being electrically connected to a part of the plurality of first substrate pads; an integrated circuit in the non-display area, the integrated circuit including a plurality of integrated circuit pads, the plurality of integrated circuit pads being bonded to the plurality of first substrate pads; a flexible circuit board in the non-display area, the flexible circuit board including a plurality of second connection pads, the plurality of second connection pads being bonded to the plurality of second substrate pads; the integrated circuit includes a test signal terminal, and the display substrate or the integrated circuit includes a first switch unit and a second switch unit; wherein the plurality of integrated circuit pads include a plurality of first connection pads, the plurality of first connection pads being bonded to another part of the first substrate pads on the display substrate, at least two of the plurality of first connection pads being electrically connected to the test signal terminal through the first switch unit, and at least two of the plurality of second substrate pads being electrically connected to the test signal terminal through the second switch unit, the integrated circuit being configured to pass an impedance test signal of the test signal terminal through a detection path in which the first switch unit and the second switch unit are located by controlling on-off states of the first switch unit and the second switch unit, and thereby detect bonding connection conditions between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate, respectively.

2. The display device according to claim 1, wherein The first switch unit and the second switch unit are located in the non-display area of the display substrate. wherein the plurality of integrated circuit pads further include a first control pad, a second control pad, and a plurality of test pads, the first control pad, the second control pad, and the plurality of test pads being bonded to another part of the first substrate pads on the display substrate, the first control pad being electrically connected to a gate electrode of the first switch unit and configured to control an on-off state of the first switch unit, the second control pad being electrically connected to a gate electrode of the second switch unit and configured to control an on-off state of the second switch unit, and the plurality of test pads being connected to the test signal terminal and configured to receive the impedance test signal. At least two of the plurality of first connection pads being electrically connected to the test signal terminal through the first switch unit includes that at least two of the plurality of first connection pads are electrically connected to at least two of the plurality of test pads through the first switch unit.

3. The display device of claim 2, wherein, ​ At least two of the plurality of second substrate pads are electrically connected to the test signal terminal through the second switch unit, including that at least two of the plurality of second substrate pads are electrically connected to the at least two test pads through the second switch unit; The integrated circuit is configured to control the on-off of the first switch unit and the second switch unit, and transmit the impedance test signal through the at least two test pads, so as to detect the binding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate, respectively.

4. The display device according to claim 1, wherein The first switch unit and the second switch unit are located in the integrated circuit, and the integrated circuit further comprises a first code control terminal and a second code control terminal; the first code control terminal is electrically connected to the gate electrode of the first switch unit and is configured to control the on-off of the first switch unit; the second code control terminal is electrically connected to the gate electrode of the second switch unit and is configured to control the on-off of the second switch unit.

5. The display device of claim 4, wherein, The display substrate further comprises a third connecting part, and at least two of the plurality of first connecting pads are connected through the third connecting part.

6. The display device of claim 5, wherein, The first switch unit comprises a first sub-switch and a second sub-switch; the gate electrode of the first sub-switch is connected to the first code control terminal, the first pole of the first sub-switch is connected to the first test signal terminal, and the second pole of the first sub-switch is connected to the corresponding first connecting pad; the gate electrode of the second sub-switch is connected to the first code control terminal, the first pole of the second sub-switch is connected to the first test signal terminal, and the second pole of the second sub-switch is connected to the corresponding first connecting pad.

7. The display device according to claim 4, wherein The display substrate further comprises a pair of fourth connecting parts, and the fourth connecting parts are configured to connect the first substrate pad and the corresponding second substrate pad.

8. The display device of claim 7, wherein, The flexible circuit board further comprises a second connecting part, and the second substrate pad connected to the same pair of fourth connecting parts is connected through the second connecting part.

9. The display device of claim 8, wherein, The second switch unit comprises a third sub-switch and a fourth sub-switch, the gate electrode of the third sub-switch is connected to the second code control terminal, the first pole of the third sub-switch is connected to the first test signal terminal, and the second pole of the third sub-switch is connected to the corresponding first connecting pad; the gate electrode of the fourth sub-switch is connected to the second code control terminal, the first pole of the fourth sub-switch is connected to the first test signal terminal, and the second pole of the fourth sub-switch is connected to the corresponding first connecting pad.

10. The display device according to claim 4, wherein The plurality of integrated circuit pads further comprise a plurality of test pads, and the plurality of test pads are correspondingly bound to another part of the first substrate pads on the display substrate; the display substrate further comprises a crack detection line, and the crack detection line partially surrounds the display area; the crack detection line is electrically connected to the test pad; The integrated circuit further comprises a third code control terminal and a third switch unit, the third control terminal is electrically connected with the gate electrode of the third switch unit, and is configured to control the on-off of the third switch unit; the crack detection line is configured to detect whether the display substrate has cracks by transmitting the impedance test signal.

11. The display device of claim 10, wherein, The third switch unit comprises a fifth sub-switch and a sixth sub-switch, the gate electrode of the fifth sub-switch is connected with the third code control terminal, the first pole of the fifth sub-switch is connected with the first test signal terminal, the second pole of the fifth sub-switch is connected with the corresponding test terminal, the gate electrode of the sixth sub-switch is connected with the third code control terminal, the first pole of the sixth sub-switch is connected with the first test signal terminal, and the second pole of the sixth sub-switch is connected with the corresponding test terminal.

12. A test method of a display device, applied to the display device according to any one of claims 1 to 11, the method comprising: the integrated circuit transmits a first control signal to the first switch unit to control the first switch unit to open; the integrated circuit transmits a second control signal to the second switch unit to control the second switch unit to close; the test signal terminal of the integrated circuit sends an impedance test signal, and the impedance test signal passes through the detection path where the first switch unit is located, so as to test the binding connection between the integrated circuit and the display substrate; or, the integrated circuit transmits the second control signal to the first switch unit to control the first switch unit to close; the integrated circuit transmits the first control signal to the second switch unit to control the second switch unit to open; the test signal terminal of the integrated circuit sends the impedance test signal, and the impedance test signal passes through the detection path where the second switch unit is located, so as to test the binding connection between the flexible circuit board and the display substrate; or, the integrated circuit transmits the second control signal to the first switch unit to control the first switch unit to close; the integrated circuit transmits the second control signal to the second switch unit to control the second switch unit to close. The first switch unit and the second switch unit are located in the integrated circuit, and the method comprises: the first code control terminal of the integrated circuit sends the first control signal to control the first switch unit to open; the second code control terminal of the integrated circuit sends the second control signal to control the second switch unit to close; the test signal terminal of the integrated circuit sends the impedance test signal, and the impedance test signal passes through the detection path where the first switch unit is located, so as to test the binding connection between the integrated circuit and the display substrate; or, 13. The test method of claim 12, wherein, the integrated circuit transmits the second control signal to the first switch unit to control the first switch unit to close; the integrated circuit transmits the second control signal to the second switch unit to control the second switch unit to close. The first code control terminal of the integrated circuit sends the second control signal to control the first switch unit to be closed; the second code control terminal of the integrated circuit sends the first control signal to control the second switch unit to be opened; the test signal terminal of the integrated circuit sends the impedance test signal, and the impedance test signal passes through the detection path where the second switch unit is located to test the binding connection between the flexible circuit board and the display substrate; or, The first code control terminal of the integrated circuit sends the second control signal to control the first switch unit to be closed; the second code control terminal of the integrated circuit sends the second control signal to control the second switch unit to be closed.

14. The test method of claim 13, wherein, When the first switch unit or the second switch unit is in an open state, the method further comprises: the third code control terminal of the integrated circuit transmits the second control signal to the third switch unit to control the third switch unit to be closed.

15. The test method of claim 13, wherein, When the first switch unit and the second switch unit are in a closed state, the method further comprises: the third code control terminal of the integrated circuit transmits the first control signal to the third switch unit to control the third switch unit to be opened, and the integrated circuit transmits an impedance test signal to the crack detection line through the test pad to perform crack detection on the display substrate.

16. The test method of claim 12, wherein, The first control signal and the second control signal are voltage signals.

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