Display panel and manufacturing method therefor, and display apparatus

Abstract

The present application relates to the technical field of display, and discloses a display panel and a manufacturing method therefor, and a display apparatus. Second openings are formed in a pixel defining layer comprised in the display panel, effectively improving the adhesion between upper and lower film layer materials. Additionally, by reducing the area of the continuously arranged pixel defining layer, mutual constraints between the materials are reduced, avoiding stress accumulation, and improving the stress resistance of the display panel. Therefore, the pixel defining layer can be prevented from being fractured when the display panel is subjected to external impact, thereby avoiding device failure caused by intrusion of water and oxygen from the fracture position, and improving the reliability of the display panel.

Description

Display panel and its manufacturing method, display device

[0001] This disclosure claims priority to Chinese Patent Application No. 202410671577.9, filed on May 28, 2024, entitled "A display panel and its preparation method, display device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0003] Currently, to achieve high-resolution display manufacturing, advanced patterning (AP) technology is typically used to fabricate pixel units, employing maskless deposition and photolithography to form pixels. However, considering product reliability, display panels manufactured using this technology usually have a thicker pixel boundary layer. This pixel boundary layer is susceptible to stress and breakage, leading to cracks and reduced display panel reliability. Summary of the Invention

[0004] The purpose of this application is to provide a display panel, a method for manufacturing the same, and a display device. The technical solution adopted in this application is as follows:

[0005] A first aspect of this application provides a display panel, the display panel comprising:

[0006] Substrate;

[0007] A pixel defining layer disposed on a substrate, the pixel defining layer including a plurality of first openings and second openings penetrating the pixel defining layer, the first openings defining the light-emitting areas of each sub-pixel unit of the display panel, and the second openings disposed between two adjacent first openings;

[0008] Additionally, an isolation pillar is disposed on the pixel defining layer, the orthogonal projection of the isolation pillar on the substrate surrounding the orthogonal projection of the light-emitting region on the substrate.

[0009] In this embodiment, a second opening is added to the pixel delimiting layer, which effectively improves the adhesion of the upper and lower film materials. By reducing the area of ​​the continuously set pixel delimiting layer, the mutual constraint between materials is reduced, stress accumulation is avoided, the stress resistance of the display panel is improved, and the pixel delimiting layer is prevented from breaking when the display panel is subjected to external impact. Water and oxygen can then enter along the break and cause device failure, thus improving the reliability of the display panel.

[0010] In one possible implementation, the display panel further includes:

[0011] An organic material layer covering the pixel defining layer and the isolation pillars;

[0012] A cathode disposed on the organic material layer;

[0013] And, an encapsulation layer covering the cathode.

[0014] In one possible implementation, the orthographic projections of the organic material layers corresponding to two adjacent sub-pixels on the substrate partially overlap.

[0015] The orthographic projections of the cathodes corresponding to two adjacent sub-pixels on the substrate partially overlap.

[0016] The orthographic projections of the encapsulation layers corresponding to two adjacent sub-pixels on the substrate partially overlap.

[0017] This implementation method, by setting a first opening and a second opening in the pixel defining layer, effectively improves the adhesion of the upper and lower film materials by adding the second opening, reduces the area of ​​the continuously set pixel defining layer, thereby reducing the mutual constraints between materials, avoiding stress accumulation, increasing the flexibility of the display panel, improving the stress resistance of the display panel, preventing the pixel defining layer from breaking when the display panel is subjected to external impact, bending or rolling, and preventing water and oxygen intrusion that could cause device failure, thus improving the reliability of the display panel. At the same time, it also helps the flexible display panel to return to a flat state when unfolded, avoiding creases.

[0018] In one possible implementation, the display panel further includes a third opening penetrating the organic material layer, the cathode, and the encapsulation layer, wherein the orthographic projection of the third opening on the substrate overlaps the orthographic projection of the second opening on the substrate.

[0019] This implementation connects the organic material layer, cathode, and encapsulation layer between at least two light-emitting areas, with the organic material layer and cathode spaced apart. This breaks the path for water and oxygen intrusion, further enhancing the reliability of the display device. Furthermore, by disconnecting part of the encapsulation layer between adjacent light-emitting areas, the stress resistance of the display panel is further enhanced, preventing defects such as breakage of the pixel defining layer, cathode, organic material layer, and encapsulation layer covering the cathode when the display panel is bent, rolled, or subjected to external impact. This further improves the service life of the display panel.

[0020] In one possible implementation, the isolation pillar includes a fourth opening whose orthographic projection on the substrate overlaps the orthographic projection of the second opening on the substrate.

[0021] This implementation method further improves the stress resistance of the display panel by forming a fourth opening on the isolation pillar, while also increasing the adhesion of the encapsulation layer.

[0022] In one possible implementation, the isolation pillar includes a first metal layer and a second metal layer stacked sequentially on the pixel defining layer.

[0023] In one possible implementation, the sidewalls of the isolation column are formed with an undercut structure.

[0024] In one possible implementation, the display panel further includes an anode and an auxiliary electrode disposed in the same layer as the anode and insulated therefrom, wherein the orthographic projection of the auxiliary electrode on the substrate at least partially surrounds the orthographic projection of the anode on the substrate;

[0025] The cathode is electrically connected to the first metal layer of the isolation pillar, and the first metal layer of the isolation pillar is electrically connected to the auxiliary electrode through a through-hole to the auxiliary electrode.

[0026] This implementation method sets up an auxiliary electrode, and the cathode is electrically connected to the auxiliary electrode through an isolation column to form a composite cathode. This effectively reduces the resistance of the cathode and enhances its conductivity, thereby reducing the resistance voltage drop of the display panel. Furthermore, in this implementation method, the auxiliary electrode and the anode are set in the same layer, which can be obtained through the same manufacturing process, simplifying the manufacturing process while reducing the resistance voltage drop of the display panel.

[0027] In one possible implementation, the display panel further includes a driving circuit layer and an auxiliary electrode disposed on the substrate, wherein the auxiliary electrode is disposed in the same layer as any metal film layer of the driving circuit layer.

[0028] The cathode is electrically connected to the first metal layer of the isolation pillar, and the first metal layer of the isolation pillar is electrically connected to the auxiliary electrode through a through-hole to the auxiliary electrode.

[0029] In one possible implementation, the auxiliary electrode includes a first auxiliary electrode and a second auxiliary electrode that are insulated from each other.

[0030] The sub-pixel unit includes a first color sub-pixel unit, a second color sub-pixel unit, and a third color sub-pixel unit;

[0031] The first auxiliary electrode is electrically connected to the cathodes of two of the first color sub-pixel unit, the second color sub-pixel unit, and the third color sub-pixel unit, and the second auxiliary electrode is electrically connected to the cathode of the other of the first color sub-pixel unit, the second color sub-pixel unit, and the third color sub-pixel unit.

[0032] In one possible implementation, the auxiliary electrode includes a third auxiliary electrode, a fourth auxiliary electrode, and a fifth auxiliary electrode that are mutually insulated from each other;

[0033] The sub-pixel unit includes a first color sub-pixel unit, a second color sub-pixel unit, and a third color sub-pixel unit;

[0034] The third, fourth, and fifth auxiliary electrodes are electrically connected to the cathodes corresponding to the first, second, and third color sub-pixel units, respectively.

[0035] In one possible implementation, the display panel further includes an inter-pixel connection structure disposed on the same layer as the auxiliary electrode;

[0036] The sub-pixel unit includes a first color sub-pixel unit, a second color sub-pixel unit, and a third color sub-pixel unit;

[0037] The isolation pillars surrounding the first color sub-pixel unit, the isolation pillars surrounding the second color sub-pixel unit, and the isolation pillars surrounding the third color sub-pixel unit are electrically connected through the inter-pixel connection structure, wherein the first metal layer of at least one isolation pillar is electrically connected to its corresponding auxiliary electrode via a via extending to the auxiliary electrode.

[0038] In one possible implementation, the display panel further includes an inter-pixel connection structure disposed on the same layer as the auxiliary electrode;

[0039] Two of the isolation pillars surrounding the first color sub-pixel unit, the isolation pillars surrounding the second color sub-pixel unit, and the isolation pillars surrounding the third color sub-pixel unit are electrically connected through the inter-pixel connection structure. The first metal layer of at least one of the electrically connected isolation pillars is electrically connected to its corresponding auxiliary electrode via a via extending to the auxiliary electrode.

[0040] In one possible implementation, the display panel further includes an inter-pixel connection structure disposed on the same layer as the auxiliary electrode;

[0041] The isolation pillars surrounding sub-pixels of the same color are electrically connected through the inter-pixel connection structure.

[0042] A second aspect of this application provides a method for manufacturing a display panel based on the first aspect of this invention, comprising:

[0043] Provide a substrate;

[0044] A pixel defining layer is formed by depositing pixel defining layer material on one side of a substrate and etching to form a plurality of first openings and second openings, thereby obtaining the pixel defining layer. The first opening defines the light-emitting area of ​​each sub-pixel unit, and the second opening is disposed between two adjacent first openings.

[0045] An isolation pillar is formed, wherein the isolation pillar is disposed on the side of the pixel defining layer away from the substrate, and the orthogonal projection of the isolation pillar on the substrate surrounds the orthogonal projection of the light-emitting region on the substrate.

[0046] In one possible implementation, the preparation method further includes:

[0047] An organic material layer is formed covering the anode, the pixel defining layer, and the isolation pillars;

[0048] A cathode is formed on the organic material layer;

[0049] Forming an encapsulation layer covering the cathode;

[0050] A third opening is formed that penetrates the organic material layer, the cathode, and the encapsulation layer, and the orthographic projection of the third opening onto the substrate covers the second opening.

[0051] In one possible implementation, forming the isolation pillar includes:

[0052] An isolation pillar material is deposited on the side of the pixel defining layer away from the substrate. The isolation pillar material located in the first opening is etched away to form a fourth opening that penetrates the isolation pillar material, thus forming an isolation pillar. The orthogonal projection of the fourth opening on the substrate covers the second opening.

[0053] In one possible implementation, the process includes the following before forming the pixel-bound layer:

[0054] An anode and an auxiliary electrode disposed in the same layer as the anode are formed on the substrate.

[0055] In one possible implementation, the process includes the following before forming the pixel-bound layer:

[0056] A driving circuit layer and an auxiliary electrode disposed in the same layer as any metal film layer of the driving circuit layer are formed on the substrate.

[0057] Anode is formed.

[0058] A third aspect of this application provides a display device, including the display panel provided in the first aspect of this application.

[0059] The beneficial effects of this application are as follows:

[0060] The display panel provided in this embodiment adds a second opening to the pixel delimiting layer, which can effectively improve the adhesion of the upper and lower film materials. Furthermore, by reducing the area of ​​the continuously arranged pixel delimiting layer, the mutual constraint between materials is reduced, stress accumulation is avoided, and the stress resistance of the display panel is improved. This prevents the pixel delimiting layer from breaking when the display panel is subjected to external impact, thereby preventing water and oxygen from entering along the fracture and causing device failure, and improving the reliability of the display panel. Attached Figure Description

[0061] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0062] Figure 1 shows a cross-sectional structural diagram of a display panel provided in one embodiment of this application.

[0063] Figure 2 shows a schematic diagram of the planar structure of a display panel provided in one embodiment of this application.

[0064] Figure 3 shows a cross-sectional structural diagram of a display panel provided in one embodiment of this application.

[0065] Figure 4 shows a top view of a display panel provided in Figure 3 of this application.

[0066] Figure 5 shows a top view of a display panel provided in one embodiment of this application.

[0067] Figure 6 shows a schematic cross-sectional view of the display panel provided in Figure 5 of this application along section line A-A'.

[0068] Figure 7 shows a cross-sectional structural diagram of a display panel provided in one embodiment of this application.

[0069] Figure 8 shows a cross-sectional structural diagram of a display panel provided in one embodiment of this application.

[0070] Figure 9 shows a cross-sectional structural diagram of a display panel provided in one embodiment of this application.

[0071] Figure 10 shows a top view of a display panel provided in one embodiment of this application.

[0072] Figure 11 shows a top view of a display panel provided in one embodiment of this application.

[0073] Figure 12 shows a top view of a display panel provided in one embodiment of this application.

[0074] Figure 13 shows a cross-sectional structural diagram of a display panel provided in one embodiment of this application.

[0075] Figure 14 shows a cross-sectional structural diagram of a display panel provided in one embodiment of this application.

[0076] Figure 15 shows a cross-sectional structural schematic diagram of a display panel provided in one embodiment of this application. Detailed Implementation

[0077] The terms “on…”, “formed on…”, and “set on…” used in this application can indicate that one layer is directly formed or set on another layer, or that one layer is indirectly formed or set on another layer, meaning that there are other layers between the two layers.

[0078] It should be noted that although the terms "first," "second," etc., may be used herein to describe various components, members, elements, regions, layers, and / or parts, these components, members, elements, regions, layers, and / or parts should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer, and / or part from another. Thus, for example, the first component, first member, first element, first region, first layer, and / or first part discussed below may be referred to as a second component, second member, second element, second region, second layer, and / or second part without departing from the teachings of this application.

[0079] In this application, unless otherwise stated, the term "co-layer arrangement" means that two layers, components, members, elements, or portions can be formed by the same manufacturing process (e.g., patterning process), and that these two layers, components, members, elements, or portions are generally formed of the same material. For example, co-layer arrangement of two or more functional layers means that these co-layer functional layers can be formed using the same material layer and the same manufacturing process, thereby simplifying the manufacturing process of the display panel.

[0080] In this application, unless otherwise stated, the term "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, and photoresist stripping. The term "one-step patterning process" refers to a process that uses a photomask to form patterned layers, components, or parts.

[0081] To improve the aperture ratio of high-resolution displays, AP (Aperture Performance) technology is used to fabricate pixel units. This method employs a partitioned etching approach for the organic light-emitting layer (OLED), overcoming the limitation on aperture ratio caused by metal masks in OLED etching. AP technology places great emphasis on the reliability of the light-emitting units. Therefore, the pixel delimiting layer is made of inorganic materials. While this improves the reliability of the light-emitting units, it reduces the flexibility of the pixel delimiting layer. Furthermore, because inorganic materials have weaker stress resistance, the display panel is prone to cracking under external impacts, bending, or rolling.

[0082] Furthermore, in order to improve reliability, the inorganic pixel boundary layer is relatively thicker than the organic pixel boundary layer. Large-area continuous inorganic pixel boundary layers are more prone to cracking when bent, rolled or impacted. External water and oxygen can erode the light-emitting material through the cracks, reducing the reliability of the display.

[0083] Based on the above considerations, this application provides a display panel, as shown in FIG1, the display panel including:

[0084] Substrate 201;

[0085] A pixel defining layer 202 is disposed on one side of the substrate 201. The pixel defining layer includes a plurality of first openings 2021 and second openings 2022 passing through it. The first openings 2021 define the light-emitting area of ​​each sub-pixel unit of the display panel, and the second openings 2022 are disposed between two adjacent first openings 2021.

[0086] An isolation pillar 204 is disposed on the pixel defining layer. The orthogonal projection of the isolation pillar 204 on the substrate surrounds the orthogonal projection of the light-emitting area on the substrate. The orthogonal projection of the isolation pillar 204 on the substrate 201 covers the orthogonal projection of the second opening 2022 on the substrate 201.

[0087] Because this embodiment adds a second opening to the pixel delimiting layer, the adhesion of the upper and lower film layers can be effectively improved. Furthermore, by reducing the area of ​​the continuously arranged pixel delimiting layer, the mutual constraint between materials can be reduced, stress accumulation can be avoided, and the stress resistance of the display panel can be improved. Consequently, it prevents the pixel delimiting layer from breaking when the display panel is subjected to external impact, thus preventing water and oxygen from entering along the fracture and causing device failure, thereby improving the reliability of the display panel.

[0088] Optionally, during the formation of the display panel, a plurality of anodes 203 arranged in an array are formed on the substrate, followed by deposition of a pixel defining layer material and patterning of a first opening 2021 to expose at least a portion of the anodes 203. Furthermore, at least one second opening 2022 is patterned to prevent defects such as cracks in the weakly resistant pixel defining layer. The second opening 2022 is located between two adjacent first openings 2021, creating a gap between the pixel defining structures surrounding the two pixels adjacent to the second opening 2022, thereby reducing stress in the area where the second opening 2022 is formed when subjected to external impact or bending.

[0089] In one possible implementation, the display panel is a flexible display panel, as shown in Figure 2, including a bending region 10B and a first non-bending region 10A and a second non-bending region 10C located at both ends of the bending region along a first direction. The display panel includes:

[0090] Flexible substrate;

[0091] The pixel defining layer 202, located on one side of the flexible substrate, requires each film layer to withstand complex stresses when the display panel is folded. Considering the above, the pixel defining layer includes a first opening 2021 and a second opening 2022. The first opening 2021 defines multiple light-emitting areas of the sub-pixel unit, and the second opening 2022 is located between two adjacent first openings 2021 to enhance the bending resistance of the display panel.

[0092] The isolation pillar 204 is located on the side of the pixel defining layer away from the flexible substrate, and the orthographic projection of the isolation pillar 204 on the flexible substrate surrounds the orthographic projection of the first opening 2021 on the flexible substrate.

[0093] This implementation incorporates a first opening 2021 and a second opening 2022 in the pixel defining layer. By adding the second opening 2022, the adhesion of the upper and lower film layers is effectively improved, and the area of ​​the continuously arranged pixel defining layer is reduced. This reduces the mutual constraints between materials, avoids stress accumulation, increases the flexibility of the display panel, and improves its stress resistance. Consequently, it prevents the pixel defining layer from breaking when the display panel is subjected to external impacts, bending, or rolling, thus preventing water and oxygen intrusion that could cause device failure and improving the reliability of the display panel. Simultaneously, it also facilitates the flexible display panel's return to a flat state upon unfolding, preventing creases.

[0094] Considering the impact of adding an opening to the pixel defining layer on the sub-pixel density, and considering that the main stress area of ​​the folded display panel is concentrated in the bending region 10B, in one possible implementation, the second opening 2022 can be located in the bending region 10B of the flexible display panel, but not in the non-bending region. Optionally, the orthographic projection of the second opening 2022 onto the flexible substrate is within the orthographic projection range of the bending region 10B onto the flexible substrate, and the orthographic projections of the second opening 2022 onto the flexible substrate and the orthographic projections of the non-bending region onto the flexible substrate do not overlap.

[0095] This implementation only sets a second opening in the bending area, improving the stress resistance of the display panel's bending region and preventing the pixel boundary layer from breaking when the display panel is bent or rolled, thus extending the lifespan of the display panel. Simultaneously, it increases the upper limit of the display panel's pixel density while reducing process difficulty and manufacturing costs.

[0096] In one possible implementation, as shown in Figures 1 and 3, the display panel further includes:

[0097] An organic material layer 205 covering the anode 203, the pixel defining layer 102, and the isolation pillars 204;

[0098] Cathode 206 covered with organic material layer 205;

[0099] Encapsulation layer 207 covering cathode 206.

[0100] For example, the organic material layer 205 is an organic light-emitting material layer. As shown in FIG3, the organic material layer 205 includes a first portion 2051 and a second portion 2052. The orthographic projection of the first portion 2051 on the substrate 201 covers the orthographic projection of the first opening 2021 on the substrate 201. The first portion 2051 is electrically connected to the anode 203 and the cathode 206, respectively, and emits light by current injection. The second portion 2052 is separated from the first portion 2051 at the boundary of the isolation pillar 204. The second portion 2052 does not have a light-emitting function, and the orthographic projection of the second portion 2052 on the substrate is within the range of the orthographic projection of the pixel defining layer 202 on the substrate.

[0101] In one possible implementation, the isolation pillar 204 is used to separate the cathode 206 and the organic material layer 205 of adjacent sub-pixels. The isolation pillar 204 can be an isolation pillar with a passivation layer or a metal isolation pillar.

[0102] In one possible implementation, the sidewall of the isolation pillar has an undercut structure, and the connection between the sidewall of the isolation pillar near the light-emitting area and the pixel defining layer is recessed.

[0103] For example, as shown in FIG3, the isolation pillar 204 is a metal isolation pillar, including a first metal layer 2041 and a second metal layer 2042 stacked sequentially. The material of the first metal layer 2041 is, for example, aluminum, and the material of the second metal layer 2042 is, for example, titanium. This application does not limit the specific material of the metal isolation pillar. The etching rate of the first metal layer material is greater than the etching rate of the second metal layer material, so that the first metal layer can be recessed relative to the second metal layer during the etching process.

[0104] In the fabrication of the metal isolation pillar, the first metal layer material and the second metal layer material are laid in sequence, and an opening is etched to expose the first opening area.

[0105] For example, the isolation pillar 204 is an isolation pillar with a passivation layer, including a first metal layer, a second metal layer and a passivation layer stacked in sequence. The passivation layer can be a black or transparent organic material.

[0106] Due to differences in material properties, an undercut structure is formed when the isolation pillar material is patterned. Taking aluminum as the first metal layer material and titanium as the second metal layer material as an example, if the isolation pillar material is treated with an etching solution, since the reaction rate of titanium is slower than that of aluminum during the etching process, as shown in Figure 3, the isolation pillar 204 forms an undercut structure, and the boundary of its second metal layer 2042 extends beyond the boundary of the first metal layer 2041.

[0107] This implementation features an isolation pillar on the side of the pixel delimiting layer away from the substrate. The isolation pillar has an undercut structure, and the organic material layers of adjacent sub-pixels break at the side of the isolation pillar, separating the organic material layers of different sub-pixels. Furthermore, the breakage of the organic material layer at the side of the isolation pillar cuts off the path for water and oxygen to erode into the organic material used to achieve the light-emitting function, further improving the reliability of the display.

[0108] In one possible implementation, as shown in Figure 1,

[0109] The orthographic projections of the organic material layers 205 corresponding to two adjacent sub-pixels on the substrate 201 partially overlap.

[0110] The orthographic projections of the cathodes 206 corresponding to two adjacent sub-pixels on the substrate 201 partially overlap.

[0111] The orthographic projections of the encapsulation layers 207 corresponding to two adjacent sub-pixels on the substrate 201 partially overlap.

[0112] This implementation method creates an overlap between the organic material layer, cathode, and encapsulation layer corresponding to two adjacent sub-pixels, thus increasing the path for water and oxygen intrusion, increasing the contact area between the film layer and the upper film layer, thereby increasing the adhesion and further enhancing the reliability of the display device.

[0113] In one possible implementation, as shown in Figure 3, the display panel further includes a third opening 2071 that penetrates the organic material layer 205, the cathode 206, and the encapsulation layer 207. The orthographic projection of the third opening 2071 on the substrate covers the orthographic projection of the second opening 2022 on the substrate 201, as shown in Figure 4.

[0114] This implementation design uses a third opening 2071 to connect the organic material layer, cathode, and encapsulation layer between at least two light-emitting areas. This allows the organic material layer and cathode to be spaced apart, thus blocking the path for water and oxygen intrusion and further enhancing the reliability of the display device. Furthermore, the third opening 2071 partially disconnects the encapsulation layer between adjacent light-emitting areas, further enhancing the stress resistance of the display panel. This prevents defects such as breakage of the pixel defining layer, cathode, organic material layer, and encapsulation layer covering the cathode when the display panel is bent, rolled, or subjected to external impact, thereby further improving the lifespan of the display panel.

[0115] In one possible implementation, as shown in FIG6, the isolation pillar 204 includes a fourth opening 2043, the orthographic projection of the fourth opening 2043 on the substrate 201 covering the orthographic projection of the second opening 2022 on the substrate 201.

[0116] As shown in Figure 5, this implementation method etches away the isolation pillar material in unnecessary areas, while retaining the isolation pillar material surrounding each sub-pixel unit.

[0117] This implementation further improves the stress resistance of the display panel by forming a fourth opening on the isolation pillar, and also increases the adhesion of the encapsulation layer.

[0118] In one possible implementation, the display panel further includes a fifth opening, wherein the fifth opening penetrates the encapsulation layer 207, the cathode 206, the organic material layer 205 and the isolation pillar 204, and the orthographic projection of the fifth opening on the substrate covers the first opening 2021.

[0119] This implementation method forms a fifth opening, disconnecting part of the encapsulation layer, cathode, organic material layer, and isolation pillar, thus connecting the organic material layer, cathode, encapsulation layer, and isolation pillar between at least two light-emitting areas. This breaks the path for water and oxygen intrusion, further enhancing the reliability of the display device. Furthermore, disconnecting the encapsulation layer covering adjacent light-emitting areas further enhances the stress resistance of the display panel, preventing defects such as breakage of the pixel defining layer, cathode, organic material layer, and encapsulation layer covering the cathode when the display panel is bent, rolled, or subjected to external impact, thereby further improving the service life of the display panel.

[0120] In one possible implementation, the cathode 206 is a semi-transparent metal layer that easily reflects light; even though it is a semi-transparent metal, it still has a certain amount of reflection.

[0121] This implementation patternes the cathode, improving the contrast of the display panel while reducing its reflectivity.

[0122] In one possible implementation, as shown in FIG6, the display panel further includes a second encapsulation layer 208, which covers the encapsulation layer 207, and the material of the second encapsulation layer extends to the fifth opening and the first opening 2021 and contacts the substrate.

[0123] Taking the fabrication of the display panel shown in Figure 6 as an example, the fabrication steps include:

[0124] A substrate is provided, for example, a flexible substrate;

[0125] An anode 203 is formed on the substrate;

[0126] Optionally, the anode metal material may be a metal oxide such as ITO (indium tin oxide) or IZO (indium zinc oxide), or a metal or alloy of Ag (silver), Al (aluminum), or Mo (molybdenum).

[0127] Lay out pixel boundary layer material and pattern it to form pixel boundary layer;

[0128] For example, a first opening 2021 for defining a light-emitting area and a second opening 2022 located outside the light-emitting area are formed by a mask plate, the second opening 2022 being located, for example, between two adjacent first openings 2021.

[0129] Among them, the pixel defining layer 202 is made of inorganic material to prevent impurities such as water and oxygen from entering the light-emitting device, thereby improving the reliability of the display panel;

[0130] The thickness of the pixel defining layer 202 is greater than or equal to 3000 angstroms and less than or equal to 5000 angstroms to further improve the reliability of the display panel;

[0131] Isolation pillar material is deposited and patterned on the side of pixel defining layer 202 away from substrate 201 to form isolation pillar 204;

[0132] For example, a layer of aluminum and titanium is deposited, and a fourth opening is formed by etching with a mask and photoresist to obtain an isolation pillar 204 located on the side of the pixel boundary layer away from the substrate between adjacent sub-pixel units;

[0133] A first-color organic light-emitting material, a cathode, an encapsulation layer material, and two sacrificial layer materials are sequentially deposited on the pixel defining layer 202, the isolation pillar 204, and the anode 203. The first-color organic light-emitting material, the cathode material, and the encapsulation layer material located in the light-emitting area near the first-color sub-pixel unit on the isolation pillars on both sides of the first-color sub-pixel region are patterned and retained.

[0134] Among them, the sacrificial layer material is used to compensate for the loss of the encapsulation layer material in the red sub-pixel region during the subsequent dry etching of green and blue sub-pixels;

[0135] For example, a dry etching process is used to pattern the first color organic light-emitting material, cathode, encapsulation layer material and two sacrificial layer materials, retaining the first color organic light-emitting material, cathode material, encapsulation layer material and two sacrificial layer materials located in the light-emitting area of ​​the first color sub-pixel unit 301 and on the isolation pillars on both sides of it, close to the light-emitting area of ​​the first color sub-pixel unit 301.

[0136] On one side of the formed product, a second color organic light-emitting layer material, a cathode material, an encapsulation layer material and a sacrificial layer material are deposited sequentially, and the second color organic light-emitting layer material, cathode material, encapsulation layer material and sacrificial layer material located in the light-emitting area of ​​the second color sub-pixel unit 302 and the light-emitting area near the light-emitting area of ​​the second color sub-pixel unit 302 on the isolation pillars on both sides are patterned and retained.

[0137] A sacrificial layer material is used to compensate for the loss during the subsequent etching of the third color sub-pixel unit;

[0138] For example, a dry etching process is used to pattern the second color organic light-emitting material, the cathode, the encapsulation layer material, and a sacrificial layer material;

[0139] On one side of the formed product, a third color organic light-emitting layer material, a cathode material, and an encapsulation layer material are sequentially deposited, and the third color organic light-emitting layer material, cathode material, and encapsulation layer material located on the light-emitting area of ​​the third color sub-pixel unit 303 and the isolation pillars on both sides of it are patterned and retained.

[0140] To achieve better display effects, the transparency of the cathode needs to be guaranteed, therefore the thickness of the cathode film layer needs to be controlled within a certain range. Typically, the cathode is relatively thin, but a thin cathode results in high resistance, leading to a voltage drop and affecting the display panel's performance. Furthermore, the aforementioned implementations involve segmenting the cathode, dividing the entire cathode surface into multiple parts. This increases the resistance of each segmented cathode, exacerbating the voltage drop phenomenon. Therefore, this embodiment adds an auxiliary electrode electrically connected to the cathode, forming a composite structure with the cathode.

[0141] In one possible implementation, as shown in FIG7, the sub-pixel unit includes a first color sub-pixel unit 301, a second color sub-pixel unit 302, and a third color sub-pixel unit 303.

[0142] The display panel also includes an auxiliary electrode 401 disposed in the same layer as the anode 203 and insulated therefrom, the orthogonal projection of the auxiliary electrode 401 on the substrate at least partially surrounds the orthogonal projection of the anode 203 on the substrate;

[0143] The cathode 206 is electrically connected to the first metal layer 2041 of the isolation pillar 204, and the first metal layer 2041 of the isolation pillar 204 is electrically connected to the auxiliary electrode 401 through a through hole to the auxiliary electrode 401.

[0144] This implementation method uses an auxiliary electrode arranged in the same layer as the anode, and the cathode is electrically connected to the auxiliary electrode through an isolation pillar to form a composite cathode. This effectively reduces the cathode's resistance and enhances its conductivity, thereby reducing the IR drop of the display panel. Furthermore, the co-layer arrangement of the auxiliary electrode and anode in this implementation method allows for fabrication using the same process, simplifying the fabrication process while reducing the IR drop of the display panel.

[0145] It should be noted that the via through to the auxiliary electrode includes a second opening 2022. For a display panel whose orthogonal projection on the substrate 201 covers the orthogonal projection of the second opening 2022 on the substrate 201, the first metal layer 2041 of its isolation pillar 204 can also be electrically connected to the auxiliary electrode 401 through the second opening 2022.

[0146] The manufacturing process of the aforementioned display panel includes:

[0147] Anode metal material is deposited on one side of the substrate, and patterned to form anode 203 and auxiliary electrode 401;

[0148] Specifically, the anode metal material is, for example, metal oxides such as ITO and IZO, or metals such as Ag, Al, and Mo, or their alloys;

[0149] Lay out pixel boundary layer material and pattern it to form pixel boundary layer 202;

[0150] For example, a first opening 2021 for defining a light-emitting area and a second opening 2022 located outside the light-emitting area are formed by a mask.

[0151] For example, as shown in Figures 7 and 8, the second opening 2022 is located between two adjacent first openings 2021 to expose the auxiliary electrode 401;

[0152] For example, as shown in FIG9, the second opening 2022 is located between two adjacent auxiliary electrodes 401, and the pixel defining layer also forms a through hole 402 to expose at least a portion of the auxiliary electrodes 401.

[0153] Among them, the pixel defining layer 202 is made of inorganic material to prevent impurities such as water and oxygen from entering the light-emitting device, thereby improving the reliability of the display panel;

[0154] On the side of the pixel defining layer 202 away from the substrate, an isolation pillar material is deposited and patterned to form an isolation pillar 204 and an inter-pixel connection structure 403;

[0155] For example, the cathode 206 is electrically connected to the auxiliary electrode 401 through the first metal layer 2041 of the isolation pillar 204, and the first metal layer 2041 of the isolation pillar 204 is electrically connected to the auxiliary electrode 401 through the through hole 402 or the second opening 2022.

[0156] An organic material layer 205, a cathode 206, and an encapsulation layer 207 are formed above the pixel defining layer, the isolation pillar 204, and the anode 203.

[0157] A second encapsulation layer 208 is formed to cover the encapsulation layer 207.

[0158] In one possible implementation, the display panel further includes a driving circuit layer and an auxiliary electrode 401 disposed on the side of the substrate 201 near the pixel defining layer 202, wherein the auxiliary electrode 401 is disposed in the same layer as any metal film layer of the driving circuit layer.

[0159] The cathode is electrically connected to the first metal layer of the isolation pillar, and the first metal layer of the isolation pillar is electrically connected to the auxiliary electrode through a through-hole to the auxiliary electrode.

[0160] For example, any metal film layer of the driving circuit layer may be a source, drain, gate, or metal light-shielding layer.

[0161] This implementation method uses an auxiliary electrode disposed on the same layer as any metal film layer of the driving circuit layer. The cathode is electrically connected to the auxiliary electrode through an isolation pillar, forming a composite cathode. This effectively reduces the cathode resistance and enhances its conductivity, thereby reducing the IR drop of the display panel. Furthermore, the co-location of the auxiliary electrode and any metal film layer of the driving circuit layer in this implementation method can be achieved through the same fabrication process, simplifying the fabrication process while reducing the IR drop of the display panel.

[0162] In one possible implementation, the auxiliary electrode 401 is a metal or alloy material with excellent conductivity, and the thickness of the auxiliary electrode 401 is negatively correlated with the resistance, and the area of ​​the auxiliary electrode 401 is negatively correlated with the resistance.

[0163] In this implementation, the larger the area of ​​the auxiliary electrode, the smaller its resistance, and the smaller the resistance of the composite structure formed by its corresponding cathode electrical connection. This can reduce the resistance voltage drop to a greater extent. The electrical connection of auxiliary electrodes at the same potential further increases the area of ​​the auxiliary electrode and reduces the resistance voltage drop of the display panel.

[0164] Optionally, the area of ​​the cathode 206 is negatively correlated with its resistance value. To further reduce the voltage drop, the cathodes 206 corresponding to the auxiliary electrodes 401 at the same potential are electrically connected. Optionally, they can be electrically connected through the metal portion of the isolation pillar 204, or adjacent cathodes 206 can be in direct contact. When patterning the cathodes 206, only openings are formed between the cathodes 206 corresponding to the auxiliary electrodes 401 at different potentials, while retaining the metal material of the cathodes 206 at other locations.

[0165] This implementation further reduces the resistance of the composite structure formed by the electrical connection between the auxiliary electrode and the corresponding cathode by pattern design, thereby further reducing the resistance voltage drop of the display panel.

[0166] In one possible implementation, the auxiliary electrode 401 is electrically connected to the corresponding cathode 206 to provide it with the corresponding potential.

[0167] In one possible implementation, the sub-pixel unit includes a first color sub-pixel unit 301, a second color sub-pixel unit 302, and a third color sub-pixel unit 303.

[0168] The cathode 206 is electrically connected to the first metal layer 2041 of the isolation pillar 204. The first metal layer 2041 of the isolation pillar 204 is electrically connected to the auxiliary electrode 401 through a through hole. The auxiliary electrode 401 is disposed in the same layer as the anode 203 or any metal film layer of the driving circuit layer.

[0169] In this implementation, by adding an auxiliary electrode 401 and electrically connecting it to the cathode 206, the resistance of the cathode 206 is reduced, thereby lowering the IR drop of the device.

[0170] In one possible implementation, the sub-pixel unit includes a first color sub-pixel unit 301, a second color sub-pixel unit 302, and a third color sub-pixel unit 303.

[0171] The cathode 206 is electrically connected to the first metal layer 2041 of the isolation pillar 204, and the first metal layer 2041 is electrically connected to the auxiliary electrode 401 through a via 402.

[0172] As shown in Figure 10, the isolation pillars 204 surrounding the first color sub-pixel unit 301, the second color sub-pixel unit 302, and the third color sub-pixel unit 303 are electrically connected via an inter-pixel connection structure 403. At least one of the isolation pillars 204 or the inter-pixel connection structure 403 is electrically connected via a via to the corresponding auxiliary electrode 401.

[0173] In this implementation, by adding an auxiliary electrode and electrically connecting it to the cathode, the resistance of the cathode is reduced, thus lowering the IR drop of the device. Furthermore, by setting an inter-pixel connection structure, the isolation pillars surrounding each sub-pixel unit are electrically connected. At least one of the isolation pillars is electrically connected via a via that extends to the corresponding auxiliary electrode, simplifying circuit wiring, reducing manufacturing costs, and avoiding electromagnetic interference caused by excessive vias.

[0174] Considering that different colors of light-emitting materials have different excitation voltages in the display field, the traditional driving method applies the same cathode potential to each sub-pixel, which cannot fully utilize the performance of each sub-pixel and causes a waste of some power. Therefore, this application proposes to set up multiple auxiliary electrodes, connect each auxiliary electrode to a different potential, and apply a suitable potential according to the characteristics of the light-emitting material, so as to improve the display effect while achieving low power.

[0175] In one possible implementation, as shown in FIG11, the auxiliary electrode 401 includes a first auxiliary electrode 4011 and a second auxiliary electrode 4012 that are insulated from each other.

[0176] The first auxiliary electrode 4011 is electrically connected to the cathodes of two of the first color sub-pixel units 301, the second color sub-pixel unit 302, and the third color sub-pixel unit 303. The second auxiliary electrode 4012 is electrically connected to the cathode of the other one of the first color sub-pixel units 301, the second color sub-pixel unit 302, and the third color sub-pixel unit 303.

[0177] For example, the first color sub-pixel unit 301 is a blue sub-pixel unit, the second color sub-pixel unit 302 is a red sub-pixel unit, and the third color sub-pixel unit 303 is a green sub-pixel unit.

[0178] It should be noted that, in this implementation, the cathode 206 connected to the first auxiliary electrode 4011 and the cathode 206 connected to the second auxiliary electrode 4012 are insulated from each other in the same layer. The first auxiliary electrode 4011 includes a plurality of interconnected first auxiliary sub-electrodes arranged in the same layer; the second auxiliary electrode 4012 includes a plurality of interconnected second auxiliary sub-electrodes arranged in the same layer.

[0179] Specifically, the excitation voltage of the blue light-emitting material is higher than that of the red and green light-emitting materials. The first auxiliary electrode 4011 is electrically connected to the cathode 206 of the green sub-pixel unit and the red sub-pixel unit, and the second auxiliary electrode 4012 is electrically connected to the cathode 206 of the blue sub-pixel unit. The potential connected to the first auxiliary electrode 4011 is lower than that connected to the second auxiliary electrode 4012.

[0180] This implementation improves the flexibility of the display panel by using patterned pixel defining layers and other film layers, preventing the display panel from breaking when subjected to external stress. At the same time, by designing a first auxiliary electrode and a second auxiliary electrode that are mutually insulated, each sub-pixel is electrically connected to its corresponding auxiliary electrode, thereby achieving a difference in the cathode potential of each sub-pixel, which reduces the power consumption of the display panel and reduces the resistance voltage drop of the display panel.

[0181] In one possible implementation, as shown in FIG11, the display panel further includes an inter-pixel connection structure 403 disposed on the same layer as the isolation pillar 204;

[0182] The auxiliary electrode 401 includes a first auxiliary electrode 4011 and a second auxiliary electrode 4012 that are insulated from each other.

[0183] The first auxiliary electrode 4011 is electrically connected to the cathodes of two of the first color sub-pixel units 301, the second color sub-pixel unit 302, and the third color sub-pixel unit 303. The second auxiliary electrode 4012 is electrically connected to the cathode of the other one of the first color sub-pixel units 301, the second color sub-pixel unit 302, and the third color sub-pixel unit 303.

[0184] Two types of the isolation pillars surrounding the first color sub-pixel unit, the second color sub-pixel unit, and the third color sub-pixel unit are electrically connected via an inter-pixel connection structure 403. At least one of the two connected isolation pillars is electrically connected to an auxiliary electrode via a via 402 extending to the corresponding auxiliary electrode. Alternatively, the inter-pixel connection structure connecting two types of the isolation pillars surrounding the first color sub-pixel unit, the second color sub-pixel unit, and the third color sub-pixel unit is electrically connected to the auxiliary electrode via a via extending to the corresponding auxiliary electrode.

[0185] For example, the isolation pillars surrounding the first color sub-pixel unit, the second color sub-pixel unit, and the third color sub-pixel unit are electrically connected to each other via an inter-pixel connection structure. At least one of them is electrically connected to its corresponding auxiliary electrode via a via extending to the corresponding auxiliary electrode. Alternatively, the inter-pixel connection structure connecting the isolation pillars of the other type is electrically connected to them via a via extending to the corresponding auxiliary electrode.

[0186] Optionally, the first color sub-pixel unit is a blue sub-pixel unit, the second color sub-pixel unit is a red sub-pixel unit, and the third color sub-pixel unit is a green sub-pixel unit.

[0187] For example, the first auxiliary electrode 4011 is electrically connected to the cathodes of the blue sub-pixel unit and the red sub-pixel unit, and the second auxiliary electrode 4012 has the same cathode potential as the green sub-pixel unit.

[0188] For example, an isolation pillar surrounding a blue sub-pixel unit and an isolation pillar surrounding a red sub-pixel unit are electrically connected via an inter-pixel connection structure 403. The first metal layer of at least one of the electrically connected isolation pillars extends downward through the pixel delimiting layer and is electrically connected to the first auxiliary electrode 4011. Alternatively, a portion of the inter-pixel connection structure connecting the isolation pillars surrounding the blue sub-pixel and the isolation pillars surrounding the red sub-pixel extends downward through the pixel delimiting layer and is electrically connected to the first auxiliary electrode 4011, so that the cathode potentials of the blue sub-pixel unit and the red sub-pixel unit are the same as the potential of the first auxiliary electrode 4011.

[0189] For example, the isolation pillars surrounding each green sub-pixel are electrically connected via an inter-pixel connection structure 403. The first metal layer of at least one of the electrically connected isolation pillars surrounding the green sub-pixel is electrically connected to the second auxiliary electrode 4012 via a via extending to the second auxiliary electrode 4012. Alternatively, the inter-pixel connection structure connecting the isolation pillars surrounding each green pixel is electrically connected to the second auxiliary electrode 4012 via a via extending to the second auxiliary electrode 4012, so that the cathode potential corresponding to the green sub-pixel unit is the same as the potential of the second auxiliary electrode 4012.

[0190] It should be noted that in this implementation, the cathode electrically connected to the first auxiliary electrode 4011 and the cathode electrically connected to the second auxiliary electrode 4012 are insulated from each other.

[0191] In one possible implementation, isolation pillars surrounding sub-pixels of the same color are electrically connected via an inter-pixel connection structure 403, and the first metal layer of at least one of the connected isolation pillars is electrically connected to its corresponding auxiliary electrode via a via extending to its corresponding auxiliary electrode.

[0192] For example, the isolation pillar surrounding the blue sub-pixel unit is electrically connected to the first auxiliary electrode 4011, the isolation pillar surrounding the green sub-pixel unit is electrically connected to the second auxiliary electrode 4012, and the isolation pillar surrounding the red sub-pixel unit is electrically connected to the second auxiliary electrode 4012.

[0193] This implementation improves the flexibility of the display panel by using patterned pixel defining layers and other film layers, preventing breakage during bending. Simultaneously, by designing different color sub-pixels and their corresponding auxiliary electrodes, it achieves cathode potential differentiation, thereby reducing power consumption and resistance voltage drop. Furthermore, by connecting two types of isolation pillars surrounding the first, second, and third color sub-pixel units, with at least one of these connected isolation pillars electrically connected via a through-hole to the corresponding auxiliary electrode, it achieves cathode potential differentiation and reduces resistance voltage drop while simplifying circuit wiring, lowering manufacturing costs, and avoiding electromagnetic interference caused by excessive vias.

[0194] In one possible implementation, as shown in FIG12, the auxiliary electrode 401 includes a third auxiliary electrode 4013, a fourth auxiliary electrode 4014 and a fifth auxiliary electrode 4015 that are mutually insulated from each other.

[0195] The third auxiliary electrode 4013, the fourth auxiliary electrode 4014, and the fifth auxiliary electrode 4015 are electrically connected to the cathodes 206 of the first color sub-pixel unit 301, the second color sub-pixel unit 302, and the third color sub-pixel unit 303, respectively.

[0196] Isolation pillars surrounding sub-pixels of the same color are electrically connected through inter-pixel connection structure 403. The cathode corresponding to each sub-pixel is electrically connected to the first metal layer 2041 surrounding the isolation pillar. The first metal layer 2041 of the connected isolation pillars is electrically connected to its corresponding auxiliary electrode through a via to its corresponding auxiliary electrode. Alternatively, the first metal layers of the connected isolation pillars are electrically connected through inter-pixel connection structure. Any inter-pixel connection structure is electrically connected to its corresponding auxiliary electrode through a via to its corresponding auxiliary electrode.

[0197] This implementation uses a third, fourth, and fifth auxiliary electrode that are mutually insulated, allowing different color sub-pixel units to be electrically connected to their corresponding auxiliary electrodes, thus achieving a differentiated cathode potential design.

[0198] One embodiment of this application provides a method for manufacturing a display panel, as shown in FIG13, including:

[0199] Provide a substrate 201;

[0200] Anode 203 is formed;

[0201] A pixel defining layer is formed by depositing pixel defining layer material on one side of the substrate and etching to form a plurality of first openings 2021 and second openings 2022 to obtain a pixel defining layer. The first opening 2021 defines the light-emitting area of ​​each sub-pixel unit, and the second opening 2022 is disposed between two adjacent first openings 2021.

[0202] An isolation pillar is formed, which is located on the side of the pixel defining layer away from the substrate. The orthogonal projection of the isolation pillar on the substrate surrounds the orthogonal projection of the light-emitting area on the substrate.

[0203] In one possible implementation, forming the isolation pillars includes: sequentially depositing a first metal layer 2041 and a second metal layer 2042, and forming openings by wet etching to expose the anode 203 of each sub-pixel unit.

[0204] In one possible implementation, the preparation method further includes:

[0205] An organic material layer 205 is formed, which covers the anode 203, the pixel defining layer 202, and the isolation pillars 204.

[0206] A cathode 206 is formed, and the cathode 206 is disposed on the organic material layer 205;

[0207] An encapsulation layer 207 is formed, which covers the cathode 206;

[0208] A third opening 2071 is formed that penetrates the organic material layer 205, the cathode 206 and the encapsulation layer 207, and the orthogonal projection of the third opening on the substrate covers the second opening 2022.

[0209] In one possible implementation, as shown in Figure 14, the preparation method includes:

[0210] Provide a substrate 201;

[0211] Anode 203 is formed;

[0212] A pixel defining layer is formed by depositing pixel defining layer material on one side of the substrate and etching to form a plurality of first openings 2021 and second openings 2022 to obtain a pixel defining layer. The first opening 2021 defines the light-emitting area of ​​each sub-pixel unit, and the second opening 2022 is disposed between two adjacent first openings 2021.

[0213] Isolation pillar 204 is formed. Isolation pillar material is deposited on the side of the pixel defining layer away from the substrate. Isolation pillar material located in the first opening 2021 is etched away to form a fourth opening 2043 that penetrates the isolation pillar material. Isolation pillar 204 is formed. The orthogonal projection of the fourth opening 2043 on the substrate 201 covers the second opening 2022.

[0214] An organic material layer 205 is formed, which covers the anode 203, the pixel defining layer 202, and the isolation pillars 204.

[0215] A cathode 206 is formed, and the cathode 206 is covered with an organic material layer 205;

[0216] An encapsulation layer 207 is formed, which covers the cathode 206;

[0217] A third opening is formed that penetrates the organic material layer 205, the cathode 206 and the encapsulation layer 207, and the orthogonal projection of the third opening on the substrate covers the second opening 2022.

[0218] In one possible implementation, as shown in Figure 15, the preparation method includes:

[0219] Provide a substrate 201;

[0220] Anode 203 and auxiliary electrode 401 are formed;

[0221] For example, the auxiliary electrode 401 includes a first auxiliary electrode 4011 and a second auxiliary electrode 4012;

[0222] A pixel defining layer is formed by depositing pixel defining layer material on one side of the substrate and etching to form a plurality of first openings 2021, second openings 2022 and vias 402 to obtain pixel defining layer 202. The first openings 2021 define the light-emitting area of ​​each sub-pixel unit, and the second openings 2022 are disposed between two adjacent first openings 2021.

[0223] An isolation pillar 204 and a pixel connection structure disposed in the same layer as the isolation pillar 204 are formed. An isolation pillar material is laid on the side of the pixel defining layer away from the substrate to form a fourth opening 2043 that penetrates the isolation pillar material. The orthogonal projection of the fourth opening 2043 on the substrate 201 covers the second opening 2022.

[0224] A first-color organic light-emitting material, a cathode, an encapsulation layer material, and two sacrificial layer materials are sequentially deposited on the pixel defining layer, the isolation pillar 204, the inter-pixel connection structure, and the anode 203. The first-color organic light-emitting material, the cathode material, and the encapsulation layer material located in the light-emitting area near the first-color sub-pixel unit on the isolation pillars on both sides of the first-color sub-pixel region are patterned and retained.

[0225] Among them, the sacrificial layer material is used to compensate for the loss of the encapsulation layer material in the red sub-pixel region during the subsequent dry etching of green and blue sub-pixels;

[0226] For example, a dry etching process is used to pattern the first color organic light-emitting material, cathode, encapsulation layer material and two sacrificial layer materials, retaining the first color organic light-emitting material, cathode material, encapsulation layer material and two sacrificial layer materials located in the light-emitting area of ​​the first color sub-pixel unit 301 and on the isolation pillars on both sides of it, close to the light-emitting area of ​​the first color sub-pixel unit 301.

[0227] On one side of the formed product, a second color organic light-emitting layer material, a cathode material, an encapsulation layer material and a sacrificial layer material are deposited sequentially, and the second color organic light-emitting layer material, cathode material, encapsulation layer material and sacrificial layer material located in the light-emitting area of ​​the second color sub-pixel unit 302 and the light-emitting area near the light-emitting area of ​​the second color sub-pixel unit 302 on the isolation pillars on both sides are patterned and retained.

[0228] A sacrificial layer material is used to compensate for the loss during the subsequent etching of the third color sub-pixel unit;

[0229] For example, a dry etching process is used to pattern the second color organic light-emitting material, the cathode, the encapsulation layer material, and a sacrificial layer material;

[0230] On one side of the formed product, a third color organic light-emitting layer material, a cathode material, and an encapsulation layer material are sequentially deposited, and the third color organic light-emitting layer material, cathode material, and encapsulation layer material located on the light-emitting area of ​​the third color sub-pixel unit 303 and the isolation pillars on both sides of it are patterned and retained.

[0231] For example, as shown in FIG15, the cathode corresponding to each sub-pixel light-emitting unit is electrically connected to the first metal layer 2041 of the isolation pillar surrounding it. The first metal layer surrounding the isolation pillar of the first color sub-pixel unit 301 and the first metal layer surrounding the isolation pillar of the second color sub-pixel unit 302 are electrically connected to the first auxiliary electrode 4011 through a through-hole to the first auxiliary electrode 4011. The first metal layer surrounding the isolation pillar of the third color sub-pixel unit 303 is electrically connected to the second auxiliary electrode 4012 through a through-hole to the second auxiliary electrode 4012.

[0232] In one possible implementation, the formation of the isolation pillar 204 also includes the formation of an inter-pixel connection structure 403 disposed on the same layer as the isolation pillar 204.

[0233] For example, isolation pillar materials are sequentially isolated on the pixel defining layer to form isolation pillars 204 and pixel connection structures 403 disposed on the same layer as the isolation pillars 204.

[0234] In one possible implementation, the process includes the following before forming the pixel-bound layer:

[0235] A driving circuit layer and an auxiliary electrode 401 disposed on the same layer as any metal film layer of the driving circuit layer are formed on the substrate 201.

[0236] An anode 203 is formed on the driving circuit layer.

[0237] Another embodiment of this application provides a display device, including the above-described display panel and a controller connected to the display panel.

[0238] The display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. This embodiment does not limit this.

[0239] Obviously, the above embodiments of this application are merely examples for clearly illustrating this application, and are not intended to limit the implementation of this application. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all implementation methods here. Any obvious variations or modifications derived from the technical solutions of this application are still within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes: Substrate; A pixel defining layer disposed on a substrate, the pixel defining layer including a plurality of first openings and second openings penetrating the pixel defining layer, the first openings defining the light-emitting areas of each sub-pixel unit of the display panel, and the second openings disposed between two adjacent first openings; Additionally, an isolation pillar is disposed on the pixel defining layer, the orthogonal projection of the isolation pillar on the substrate surrounding the orthogonal projection of the light-emitting region on the substrate.

2. The display panel according to claim 1, characterized in that, The display panel also includes: An organic material layer covering the pixel defining layer and the isolation pillars; A cathode disposed on the organic material layer; And, an encapsulation layer covering the cathode.

3. The display panel according to claim 2, characterized in that, The orthographic projections of the organic material layers corresponding to two adjacent sub-pixels on the substrate partially overlap. The orthographic projections of the cathodes corresponding to two adjacent sub-pixels on the substrate partially overlap. The orthographic projections of the encapsulation layers corresponding to two adjacent sub-pixels on the substrate partially overlap.

4. The display panel according to claim 2, characterized in that, The display panel further includes a third opening penetrating the organic material layer, the cathode, and the encapsulation layer, wherein the orthographic projection of the third opening on the substrate overlaps the orthographic projection of the second opening on the substrate.

5. The display panel according to claim 1, characterized in that, The isolation pillar includes a fourth opening, the orthographic projection of which overlaps the orthographic projection of the second opening on the substrate.

6. The display panel according to claim 1, characterized in that, The isolation column comprises a first metal layer and a second metal layer stacked sequentially.

7. The display panel according to claim 6, characterized in that, The sidewalls of the isolation column have an undercut structure.

8. The display panel according to claim 6, characterized in that, The display panel further includes an anode and an auxiliary electrode disposed in the same layer as the anode and insulated therefrom, wherein the orthographic projection of the auxiliary electrode on the substrate at least partially surrounds the orthographic projection of the anode on the substrate; The cathode is electrically connected to the first metal layer of the isolation pillar, and the first metal layer of the isolation pillar is electrically connected to the auxiliary electrode through a through-hole to the auxiliary electrode.

9. The display panel according to claim 6, characterized in that, The display panel further includes a driving circuit layer and an auxiliary electrode disposed on the side of the substrate near the pixel defining layer, wherein the auxiliary electrode is disposed in the same layer as any metal film layer of the driving circuit layer. The cathode is electrically connected to the first metal layer of the isolation pillar, and the first metal layer of the isolation pillar is electrically connected to the auxiliary electrode through a through-hole to the auxiliary electrode.

10. The display panel according to claim 8 or 9, characterized in that, The auxiliary electrode includes a first auxiliary electrode and a second auxiliary electrode that are insulated from each other. The sub-pixel unit includes a first color sub-pixel unit, a second color sub-pixel unit, and a third color sub-pixel unit; The first auxiliary electrode is electrically connected to the cathodes of two of the first color sub-pixel unit, the second color sub-pixel unit, and the third color sub-pixel unit, and the second auxiliary electrode is electrically connected to the cathode of the other of the first color sub-pixel unit, the second color sub-pixel unit, and the third color sub-pixel unit.

11. The display panel according to claim 8 or 9, characterized in that, The auxiliary electrode includes a third auxiliary electrode, a fourth auxiliary electrode, and a fifth auxiliary electrode that are insulated from each other; The sub-pixel unit includes a first color sub-pixel unit, a second color sub-pixel unit, and a third color sub-pixel unit; The third, fourth, and fifth auxiliary electrodes are electrically connected to the cathodes corresponding to the first, second, and third color sub-pixel units, respectively.

12. The display panel according to claim 8 or 9, characterized in that, The display panel also includes an inter-pixel connection structure disposed on the same layer as the auxiliary electrode; The sub-pixel unit includes a first color sub-pixel unit, a second color sub-pixel unit, and a third color sub-pixel unit; The isolation pillars surrounding the first color sub-pixel unit, the isolation pillars surrounding the second color sub-pixel unit, and the isolation pillars surrounding the third color sub-pixel unit are electrically connected through the inter-pixel connection structure, wherein the first metal layer of at least one isolation pillar is electrically connected to its corresponding auxiliary electrode via a via extending to the auxiliary electrode.

13. The display panel according to claim 10, characterized in that, The display panel also includes an inter-pixel connection structure disposed on the same layer as the auxiliary electrode; Two of the isolation pillars surrounding the first color sub-pixel unit, the isolation pillars surrounding the second color sub-pixel unit, and the isolation pillars surrounding the third color sub-pixel unit are electrically connected through the inter-pixel connection structure. The first metal layer of at least one of the electrically connected isolation pillars is electrically connected to its corresponding auxiliary electrode via a via extending to the auxiliary electrode.

14. The display panel according to claim 11, characterized in that, The display panel also includes an inter-pixel connection structure disposed on the same layer as the auxiliary electrode; The isolation pillars surrounding sub-pixels of the same color are electrically connected through the inter-pixel connection structure.

15. A display device, characterized in that, The display device includes the display panel according to any one of claims 1-14.

16. A method for manufacturing a display panel according to any one of claims 1-14, characterized in that, include: Provide a substrate; A pixel defining layer is formed by depositing pixel defining layer material on one side of a substrate and etching to form a plurality of first openings and second openings, thereby obtaining the pixel defining layer. The first opening defines the light-emitting area of ​​each sub-pixel unit, and the second opening is disposed between two adjacent first openings. An isolation pillar is formed, wherein the isolation pillar is disposed on the side of the pixel defining layer away from the substrate, and the orthogonal projection of the isolation pillar on the substrate surrounds the orthogonal projection of the light-emitting region on the substrate.

17. The preparation method according to claim 16, characterized in that, The preparation method further includes: An organic material layer is formed covering the anode, the pixel defining layer, and the isolation pillars; A cathode is formed on the organic material layer; Forming an encapsulation layer covering the cathode; A third opening is formed that penetrates the organic material layer, the cathode, and the encapsulation layer, and the orthographic projection of the third opening onto the substrate covers the second opening.

18. The preparation method according to claim 16, characterized in that, The formation of the isolation column includes: An isolation pillar material is deposited on the side of the pixel defining layer away from the substrate. The isolation pillar material located in the first opening is etched away to form a fourth opening that penetrates the isolation pillar material, thus forming an isolation pillar. The orthogonal projection of the fourth opening on the substrate covers the second opening.

19. The preparation method according to claim 16, characterized in that, The process before forming the pixel-bound layer also includes: An anode and an auxiliary electrode disposed in the same layer as the anode are formed on the substrate.

20. The preparation method according to claim 16, characterized in that, The process before forming the pixel-bound layer also includes: A driving circuit layer and an auxiliary electrode disposed in the same layer as any metal film layer of the driving circuit layer are formed on the substrate. An anode is formed on the drive circuit layer.

Images