Display module and manufacturing method therefor, and display device

Abstract

Disclosed are a display module and a manufacturing method therefor, and a display device. The display module comprises: a display substrate and a cover plate which are arranged opposite each other, the display substrate comprising a display portion which comprises a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connected between the display surface and the non-display surface; a heat conduction layer, which comprises a first heat conduction portion and a second heat conduction portion, the first heat conduction portion being located on the side of the display portion facing away from the cover plate, the orthographic projection of the first heat conduction portion on the cover plate covering the orthographic projection of the display portion on the cover plate, and at least part of the second heat conduction portion being arranged opposite at least part of the side surface of the display portion; and an electromagnetic shielding layer, which is located on the side of the heat conduction layer facing away from the cover plate.

Description

Display module and its manufacturing method, display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 2024107028586, filed on May 31, 2024 with the China National Intellectual Property Administration, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to the field of display technology, specifically to a display module and its manufacturing method, and a display device. Background Technology

[0004] In OLED (Organic Light-Emitting Diode) display modules, a composite heat dissipation layer is typically provided on the backlight side of the display substrate. Currently, the heat dissipation effect at the edges of the display substrate in display modules is relatively poor. Summary of the Invention

[0005] This disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a display module and its manufacturing method, as well as a display device.

[0006] In a first aspect, this disclosure provides a display module, including:

[0007] A display substrate and a cover plate are disposed opposite to each other; the display substrate includes a display portion, the display portion including a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface;

[0008] A thermally conductive layer, comprising a first thermally conductive portion and a second thermally conductive portion, wherein the first thermally conductive portion is located on the side of the display unit opposite to the cover plate, and the orthographic projection of the first thermally conductive portion on the cover plate covers the orthographic projection of the display unit on the cover plate; at least a portion of the second thermally conductive portion is disposed opposite to at least a portion of the side surface of the display unit; and

[0009] An electromagnetic shielding layer is located on the side of the thermally conductive layer opposite to the cover plate.

[0010] In some embodiments, the orthographic projection of the electromagnetic shielding layer on the cover plate covers the orthographic projection of the first heat-conducting part on the cover plate.

[0011] In some embodiments, the orthographic projection of the second heat-conducting part on the cover plate is located outside the orthographic projection of the display part on the cover plate, and the width of the second heat-conducting part is between 50 and 100 micrometers.

[0012] In some embodiments, the cover plate includes a main body region disposed opposite to the heat-conducting layer and an edge region surrounding the main body region;

[0013] The display module also includes an edge sealing adhesive, which comprises a first part and a second part. The first part is located on the side of the electromagnetic shielding layer away from the cover plate, and the second part is located in the edge area and surrounds the display substrate, the electromagnetic shielding layer and the thermal conductive layer.

[0014] In some embodiments, the display module further includes a frame, the frame including a retaining wall portion and a supporting portion, the supporting portion being located on the side of the edge sealant away from the cover plate and bonded to the edge sealant; the retaining wall portion surrounding the edge sealant and the cover plate and bonded to the edge sealant and the cover plate.

[0015] In some embodiments, the orthographic projection of the sealing adhesive on the cover plate is annular, and the distance between its outer edge and the orthographic projection of the display substrate on the cover plate is between 0.4 and 0.6 mm.

[0016] In some embodiments, the thickness of the first portion is between 0.2 and 0.3 mm.

[0017] In some embodiments, the display substrate is a rigid display substrate, wherein at least a portion of the second heat-conducting portion is disposed opposite to all sides of the display portion.

[0018] In some embodiments, the display module further includes a back film located between the thermally conductive layer and the display portion.

[0019] In some embodiments, the display substrate is a flexible display substrate, and the display substrate further includes a driving portion and a bent portion connected between the driving portion and the display portion, the driving portion being located on the side of the electromagnetic shielding layer opposite to the cover plate.

[0020] In some embodiments, at least a portion of the second heat-conducting portion is disposed opposite to all the other sides of the display portion except for the side where the curved portion is located.

[0021] In some embodiments, the display module further includes: a back film disposed between the thermally conductive layer and the display portion, and between the electromagnetic shielding layer and the driving portion.

[0022] Secondly, this disclosure also provides a method for manufacturing a display module, including:

[0023] A display substrate and a cover plate are disposed opposite to each other. The display substrate includes a display portion, which includes a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface.

[0024] A heat-conducting layer is formed, the heat-conducting layer including a first heat-conducting part and a second heat-conducting part, the first heat-conducting part being located on the side of the display part away from the cover plate, and the orthographic projection of the first heat-conducting part on the cover plate covering the orthographic projection of the display part on the cover plate; at least a portion of the second heat-conducting part is disposed opposite to at least a portion of the side surface of the display part;

[0025] An electromagnetic shielding layer is formed on the side of the heat-conducting layer away from the cover plate, and the first heat-conducting part and the second heat-conducting part are integrally formed.

[0026] In some embodiments, both the thermally conductive layer and the electromagnetic shielding layer are formed using a printing process.

[0027] In some embodiments, the cover plate includes a main body region disposed opposite to the heat-conducting layer and an edge region surrounding the main body region; the manufacturing method further includes:

[0028] An edge sealing adhesive is formed, comprising a first part and a second part. The first part is located on the side of the electromagnetic shielding layer away from the cover plate, and the second part is located in the edge area and surrounds the display substrate, the electromagnetic shielding layer and the thermal conductive layer.

[0029] In some embodiments, the edge-sealing adhesive is formed by a printing process.

[0030] In some embodiments, the manufacturing method further includes:

[0031] A frame is provided, the frame including a retaining wall portion and a load-bearing portion;

[0032] The supporting part is disposed on the side of the edge sealant away from the cover plate, the retaining wall part is disposed around the edge sealant and the cover plate, and the supporting part is bonded to the edge sealant, and the retaining wall part is bonded to the edge sealant and the cover plate.

[0033] In some embodiments, the first part and the second part are integrally formed, and the retaining wall part and the load-bearing part are integrally formed.

[0034] Thirdly, this disclosure also provides a display device including the aforementioned display module. Attached Figure Description

[0035] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0036] Figure 1 is a schematic diagram of a display module provided in some embodiments.

[0037] Figure 2 is a schematic diagram of a display module provided in some other embodiments.

[0038] Figure 3 is a plan view of the display substrate and cover plate in a display module provided in some embodiments of this disclosure.

[0039] Figure 4 is a cross-sectional view of a display module provided in some embodiments of this disclosure.

[0040] Figure 5 is a plan view of the display substrate, cover plate and frame in a display module provided in some other embodiments of this disclosure.

[0041] Figure 6 is a cross-sectional view of a display module provided in some other embodiments of this disclosure.

[0042] Figure 7 is another cross-sectional view of the display module provided in some other embodiments of this disclosure.

[0043] Figure 8 is a cross-sectional view of a display module provided in some embodiments of this disclosure.

[0044] Figure 9 is another cross-sectional view of the display module provided in some embodiments of this disclosure.

[0045] Figure 10 is a schematic diagram of a display section provided in some embodiments of this disclosure.

[0046] Figure 11 is a schematic diagram of the manufacturing process of the display module provided in some embodiments of this disclosure. Detailed Implementation

[0047] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0049] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0050] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0051] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0052] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0053] Figure 1 is a schematic diagram of a display module provided in some embodiments, and Figure 2 is a schematic diagram of a display module provided in other embodiments. As shown in Figures 1 and 2, the display module includes a display substrate 10, a cover plate 20, a heat dissipation layer, and a frame 40. The cover plate 20 is disposed on the light-emitting side of the display substrate 10, the heat dissipation layer is disposed on the backlight side of the display substrate 10, and the frame 40 is connected to the edge of the cover plate 20 and surrounds the display substrate 10. In some embodiments, as shown in Figure 1, the heat dissipation layer includes a first adhesive layer 31, a flexible buffer layer 32, and a metal layer 33 sequentially disposed along a direction away from the display substrate 10. For example, the thickness of the first adhesive layer 31 is between 20 and 40 micrometers, for example, 30 micrometers; the thickness of the flexible buffer layer 32 is between 80 and 120 micrometers, for example, 100 micrometers; and the thickness of the metal layer 33 is between 20 and 40 micrometers, for example, 30 micrometers. In other embodiments, the heat dissipation layer includes a second adhesive layer 34 and a metal layer 33 sequentially disposed along a direction away from the display substrate 10. For example, the thickness of the second adhesive layer 34 is between 120 and 140 micrometers, such as 130 micrometers; the thickness of the metal layer 33 is between 20 and 40 micrometers, such as 30 micrometers. In Figures 1 and 2, the metal layer 33 can be made of copper. The heat dissipation layer can dissipate heat from the display substrate 10, and the metal layer 33 can be grounded, thereby providing electromagnetic shielding and reducing the influence of external static electricity on the display substrate 10.

[0054] In Figures 1 and 2, the heat dissipation layer is obtained by die-cutting a whole heat dissipation film and then bonding the die-cut heat dissipation layer to the display substrate 10. Due to tolerances in both the die-cutting and bonding processes, a certain distance d1 needs to be maintained between the edge of the heat dissipation layer and the edge of the display substrate 10 during the design process. For example, d1 is between 0.25 and 0.4 mm; the distance d2 between the edge of the display substrate 10 and the edge of the cover plate 20 is between 0.8 and 1.2 mm. This results in poor heat dissipation and electromagnetic shielding effects in the edge area of ​​the display substrate 10.

[0055] Figure 3 is a plan view of the display substrate and cover plate in a display module provided in some embodiments of this disclosure, and Figure 4 is a cross-sectional view of the display module provided in some embodiments of this disclosure. Figure 4 is a cross-sectional view of the display module shown in Figure 3 along the A-A' line of cut. As shown in Figures 3 and 4, the display module includes: a display substrate 10, a cover plate 20, a thermally conductive layer 50, and an electromagnetic shielding layer 60. The display substrate 10 includes a display portion 101 for displaying an image. The display portion 101 and the cover plate 20 are disposed opposite to each other and fixedly connected. The display portion 101 includes a display surface facing the cover plate 20, a non-display surface facing away from the cover plate 20, and a side surface connecting the display surface and the non-display surface. The display substrate 10 can be a rigid display substrate, in which case the entire display substrate 10 can serve as the display portion 101; or, the display substrate 10 can be a flexible display substrate, with a portion bent to the backlight side. In this case, the display substrate 10 includes other parts besides the display portion 101, which will be described in detail below.

[0056] The heat-conducting layer 50 includes a first heat-conducting part 51 and a second heat-conducting part 52. The first heat-conducting part 51 is located on the side of the display part away from the cover plate 20, and the orthographic projection of the first heat-conducting part 51 on the cover plate 20 covers the orthographic projection of the display part 101 on the cover plate 20. At least a portion of the second heat-conducting part 52 is disposed opposite to the side of the display part 101. In this document, "distributed opposite" means that the two components are disposed face to face and in contact with or joined together.

[0057] In this embodiment of the present disclosure, the heat generated by the display substrate 10 can be dissipated through the thermal conductive layer 50 and the electromagnetic shielding layer 60. Compared with the structure shown in FIG1 and FIG2, in the display module shown in FIG4, the first thermal conductive part 51 of the thermal conductive layer 50 covers the display part 101, thereby dissipating heat from the entire area of ​​the display part 101; and the second thermal conductive part 52 is disposed opposite to the side of the display part 101, thereby dissipating heat from the side of the display part 101, thereby improving the heat dissipation effect of the display substrate.

[0058] In some embodiments, the thermally conductive layer 50 can be made of silicone material. Specifically, the silicone material can be printed using a printing process and then cured to form the thermally conductive layer 50. This method makes it easier to control the local thickness of the thermally conductive layer 50, thereby meeting the diverse needs of the product. For example, when the display module is used in a mobile phone or tablet computer, the thickness of the thermally conductive layer 50 can be smaller at the location of the camera.

[0059] In some embodiments, the thickness of the first thermally conductive portion 51 of the thermally conductive layer 50 is between 50 and 100 micrometers, thereby ensuring thermal conductivity while preventing the display module from becoming too thick, which is beneficial for the design of thinner and lighter display products. For example, the thickness of the first thermally conductive portion 51 is 50 micrometers, or 60 micrometers, or 70 micrometers, or 80 micrometers, or 90 micrometers, or 100 micrometers.

[0060] In some embodiments, the orthographic projection of the second heat-conducting portion 52 on the cover plate 20 is outside the orthographic projection of the display portion 101 on the cover plate 20. For example, when the display substrate 10 as a whole serves as the display portion 101, the second heat-conducting portion 52 can be a ring structure surrounding the display portion 101, thereby improving the heat conduction effect of the heat-conducting layer 50. When one side of the display substrate 10 is bent to the backlight side, the second heat-conducting portion 52 can be provided on the remaining sides of the display substrate 10. As shown in FIG4, the width W of the second heat-conducting portion 52 is between 50 and 100 micrometers, thereby ensuring that the heat-conducting layer 50 can cover all areas of the display substrate 10 under the condition of process tolerance, so as to ensure the heat conduction effect of the heat-conducting layer 50 on the display substrate 10. For example, the width W of the second heat-conducting portion 52 is 50 micrometers, or 60 micrometers, or 70 micrometers, or 80 micrometers, or 90 micrometers, or 100 micrometers.

[0061] In some embodiments, the orthographic projection of the electromagnetic shielding layer 60 on the cover plate 20 overlaps with the orthographic projection of the first heat-conducting part 51 on the cover plate 20, thereby ensuring electromagnetic shielding effect over the entire area of ​​the display substrate 10. In one example, the orthographic projection of the electromagnetic shielding layer 60 on the cover plate 20 overlaps with the orthographic projection of the second heat-conducting part 52 on the cover plate 20. For example, the orthographic projections of the electromagnetic shielding layer 60 and the heat-conducting layer 50 on the cover plate 20 coincide or substantially coincide.

[0062] In one example, the electromagnetic shielding layer 60 can be made of a material with good thermal and electrical conductivity, such as silver.

[0063] In one example, the thickness of the electromagnetic shielding layer 60 is between 5 and 10 micrometers, for example, the thickness can be 5 micrometers, 7 micrometers, 9 micrometers, or 10 micrometers.

[0064] In some embodiments, as shown in FIG4, the cover plate 20 includes a main body region 21 disposed opposite to the heat-conducting layer 50 and the display substrate 10, and an edge region 22 surrounding the main body region 21. The display module also includes an edge sealing adhesive 70, which includes a first portion 71 and a second portion 72. For example, the first portion 71 and the second portion 72 are connected as an integral structure. The first portion 71 is located on the side of the electromagnetic shielding layer 60 away from the cover plate 20, wherein the edge sealing adhesive 70 on the side of the electromagnetic shielding layer 60 away from the cover plate 20 can serve as the first portion 71. The second portion 72 is located in the edge region 22 and surrounds the display substrate 10, the electromagnetic shielding layer 60, and the heat-conducting layer 50. By providing the edge sealing adhesive 70, when the display product is subjected to external impact, the pressure of the structure on the back side of the display substrate 10 on the display substrate 10 can be buffered, thus providing a protective effect; and it can also reduce the entry of external moisture into the interior of the display substrate 10, thereby improving the reliability of the display substrate 10.

[0065] In some embodiments, the thickness D of the first portion 71 of the sealing adhesive 70 is between 0.2 and 0.3 mm, thereby ensuring the protective effect of the sealing adhesive 70 on the display substrate 10 while preventing the display module from becoming too thick, which is beneficial for the thinner and lighter design of the display product. For example, the thickness of the first portion 71 can be 0.2 mm, 0.25 mm, or 0.3 mm. The surface of the first portion 71 facing away from the cover plate 20 can be non-planar, and the thickness of the first portion 71 refers to the maximum thickness of the first portion 71.

[0066] In some embodiments, the orthographic projection of the sealing adhesive 70 on the cover plate 20 is annular, and the distance d between the outer edge of the orthographic projection of the sealing adhesive 70 and the orthographic projection of the display substrate 10 on the cover plate 20 is between 0.4 and 0.6 mm, thereby improving the sealing and protection effect on the display substrate 10. For example, d can be 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, or 0.6 mm.

[0067] In some examples, the edge banding adhesive 70 can be an acrylic material.

[0068] Figure 5 is a plan view of the display substrate, cover plate, and frame in a display module provided in some other embodiments of this disclosure. Figure 6 is a cross-sectional view of the display module provided in some other embodiments of this disclosure. Figure 7 is another cross-sectional view of the display module provided in some other embodiments of this disclosure. Figure 6 is a cross-sectional view of the display module shown in Figure 5 along the B-B' section line. Figure 7 is a cross-sectional view of the display module shown in Figure 5 along the C-C' section line. As shown in Figures 5 to 7, the display module may further include a frame 40, which is connected to the cover plate 20 and the edge sealing adhesive 70. The frame 40 may include a retaining wall portion 42 and a supporting portion 41. For example, the retaining wall portion 42 and the supporting portion 41 are connected as an integral structure. The supporting portion 41 is located on the side of the edge sealing adhesive 70 away from the cover plate 20 and is bonded to the edge sealing adhesive 70. The retaining wall portion 42 is disposed around the edge sealing adhesive 70 and the cover plate 20 and is bonded to the edge sealing adhesive 70 and the cover plate 20. For example, as shown in Figures 6 and 7, adhesive 83 is provided between the bearing part 41 and the edge sealant 70, between the retaining wall part 42 and the edge sealant 70, and between the retaining wall part 42 and the side of the cover plate 20.

[0069] When the display module is used in a product with a narrow bezel 40, if the edge sealing adhesive 70 is not provided in the display module (as shown in Figures 1 and 2), the distance between the bezel 40 and the display substrate 10 will be reduced, and the support part 41 may even squeeze the display substrate 10. However, in the embodiments of this disclosure, after the edge sealing adhesive 70 is provided between the display substrate 10 and the bezel 40, the pressure on the bezel 40 will not act on the display substrate 10 due to the spacing and buffering effect of the edge sealing adhesive 70, which is beneficial to the realization of the narrow bezel 40. In addition, in Figures 1 and 2, the bezel 40 is bonded to the side of the cover plate 20 and the surface of the cover plate 20 facing the display substrate 10. However, in the display modules shown in Figures 6 and 7, the bezel 40 is bonded to the side of the cover plate 20, the side of the edge sealing adhesive 70, and the surface of the edge sealing adhesive 70 away from the cover plate 20. Compared with Figures 1 and 2, the bonding area of ​​the bezel 40 in Figures 6 and 7 is longer, which can extend the path for external moisture to enter the display module and improve the sealing performance of the display module.

[0070] In some embodiments, the edge sealing adhesive 70 includes a first surface facing the retaining wall portion 42 and a second surface facing the supporting portion 41. At least one of the first and second surfaces is a curved surface, thereby further extending the path for external moisture to enter the display module and further improving the sealing performance of the display module. The curved surface can be a convex surface, a concave surface, a free-form surface, or a wavy surface with multiple protrusions and / or multiple recesses. For example, at least one of the first and second surfaces has multiple protrusions and / or multiple recesses, thereby improving the connection stability between the edge sealing adhesive 70 and the frame 40 while simultaneously improving the sealing performance of the display module.

[0071] As shown in Figure 7, in some embodiments, the display substrate 10 is a flexible display substrate, which, in addition to the display section 101, also includes a driving section 103 and a bent section 102 connecting the driving section 103 and the display section 101. The display section 101 includes a substrate and structures such as a driving circuit layer and a light-emitting structure layer disposed on the substrate. The bent section 102 includes a substrate and connecting lines disposed on the substrate. The driving section 103 is located on the side of the electromagnetic shielding layer 60 away from the cover plate 20, and the driving section 103 includes a substrate and pads disposed on the substrate. The pads are used to connect the flexible circuit board, thereby providing driving signals to the display section 101 for image display. By bending the driving section 103 to the backlight side of the display section 101, it is beneficial to reduce the bezel 40 of the display module. A protective layer 91 can also be provided on the bent section 102 to protect the traces on the bent section 102. When the display substrate 10 includes a driving portion 103 and a bending portion 102, the thermally conductive layer 50 can cover the three sides of the display portion 101, while the second portion 72 of the sealing adhesive 70 can still surround the display substrate 10, the thermally conductive layer 50, and the electromagnetic shielding layer 60. For example, a portion of the second portion 72 is located inside the bending portion 102, and a portion is located outside the bending portion 102.

[0072] Figure 8 is a cross-sectional view of a display module provided in some embodiments of the present disclosure, and Figure 9 is another cross-sectional view of a display module provided in some embodiments of the present disclosure. Figure 8 is a cross-sectional view of the display module shown in Figure 5 along the B-B' section line, and Figure 9 is a cross-sectional view of the display module shown in Figure 5 along the C-C' section line. The display modules shown in Figures 8 and 9 are similar to those in Figures 6 and 7, except that in Figures 8 and 9, the display module also includes a back film 90. The back film 90 is provided between the thermally conductive adhesive and the display part 101, and between the electromagnetic shielding layer 60 and the driving part 103, thereby supporting the display substrate 10.

[0073] Figure 10 is a schematic diagram of a display unit provided in some embodiments of this disclosure. As shown in Figure 10, the display substrate 10 can be an OLED display substrate, and the display unit 101 includes a driving circuit layer 12 disposed on a substrate 11, a light-emitting structure layer 13 disposed on the driving circuit layer 12, and an encapsulation layer 14 disposed on the light-emitting structure layer 13. In some possible implementations, the display substrate 10 may include other film layers, which are not limited herein.

[0074] In an exemplary embodiment, the substrate 11 may be a flexible substrate or a rigid substrate. The flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together. The materials of the first and second flexible material layers may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film, etc. The materials of the first and second inorganic material layers may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen. The material of the semiconductor layer may be amorphous silicon (a-Si).

[0075] In an exemplary embodiment, the driving circuit layer 12 may include transistors and storage capacitors constituting pixel circuits. FIG10 shows only one transistor and one storage capacitor in each pixel circuit. The transistor includes an active layer 122, a gate electrode 121, a source electrode 123, and a drain electrode 124. In some possible implementations, the driving circuit layer 12 of each sub-pixel may include: a buffer layer BFL disposed on a substrate 11, an active layer 122 disposed on the buffer layer BFL, a first gate insulating layer GI1 covering the active layer 122, a gate electrode 121 and a first capacitor electrode 125 disposed on the first gate insulating layer GI1, a second gate insulating layer GI2 covering the gate electrode 121 and the first capacitor electrode 125, a second capacitor electrode 126 disposed on the second gate insulating layer GI2, and an interlayer insulating layer ILD covering the second capacitor electrode 126. A via is formed in the interlayer insulating layer ILD, and the via exposes the active layer 122. Source electrode 123 and drain electrode 124 are disposed on the interlayer insulating layer (ILD), and are connected to the active layer 122 via vias. A planarization layer (PLN) is located on the side of the source electrode 123 and drain electrode 124 away from the substrate 11. A first capacitor electrode 125 and a second capacitor electrode 126 form a storage capacitor. In some possible implementations, the buffer layer (BFL), the first gate insulating layer (GI1), the second gate insulating layer (GI2), and the interlayer insulating layer (ILD) can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, multiple layers, or a composite layer. The gate electrode 121, source electrode 123, drain electrode 124, first capacitor electrode 125, and second capacitor electrode 126 can be made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). They can be single-layer structures or multi-layer composite structures, such as Ti / Al / Ti. The active layer 122 can be made of amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, or polythiophene, etc. That is, this disclosure applies to transistors manufactured based on oxide technology, silicon technology, or organic technology. The active layer 122 based on oxide technology can be an oxide containing indium and tin, an oxide containing tungsten and indium, an oxide containing tungsten, indium and zinc, an oxide containing titanium and indium, an oxide containing titanium, indium and tin, an oxide containing indium and zinc, an oxide containing silicon, indium and tin, an oxide containing indium, gallium and zinc, etc.

[0076] In an exemplary embodiment, the light-emitting structure layer 13 may include an anode 131, a pixel definition layer PDL, an organic light-emitting layer 133, and a cathode 132. The anode 131 is disposed on a planarization layer PLN and is connected to a drain electrode 124 through a via formed in the planarization layer PLN. The pixel definition layer PDL is disposed on the anode 131 and the planarization layer PLN, and has a pixel opening that exposes the anode 131. The organic light-emitting layer 133 is disposed within the pixel opening, and the cathode 132 is disposed on the organic light-emitting layer 133. The organic light-emitting layer 133 emits light of a corresponding color under the action of a voltage applied to the anode 131 and the cathode 132.

[0077] In an exemplary embodiment, the organic light-emitting layer 133 may include at least a stacked hole injection layer (HIL), hole transport layer (HTL), emission layer (EML), electron transport layer (ETL), and electron injection layer (EIL). The hole injection layer and hole transport layer may be collectively referred to as the hole layer, and the electron transport layer and electron injection layer may be collectively referred to as the electron layer.

[0078] In an exemplary embodiment, the encapsulation layer 14 may include a first encapsulation layer 141, a second encapsulation layer 142, and a third encapsulation layer 143 stacked together. The first encapsulation layer 141 and the third encapsulation layer 143 may be made of inorganic materials, while the second encapsulation layer 142 may be made of organic materials. The second encapsulation layer 142 is disposed between the first encapsulation layer 141 and the third encapsulation layer 143, which can ensure that external moisture cannot enter the light-emitting structure layer 13.

[0079] This disclosure also provides a method for manufacturing a display module, including:

[0080] Step S10: The display substrate and the cover plate are arranged opposite to each other. The display substrate includes a display part, which includes a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface.

[0081] Step S20: Form a heat-conducting layer. The heat-conducting layer includes a first heat-conducting part and a second heat-conducting part. The first heat-conducting part is located on the side of the display part away from the cover plate, and the orthographic projection of the first heat-conducting part on the cover plate covers the orthographic projection of the display part on the cover plate. At least a portion of the second heat-conducting part is disposed opposite to at least a portion of the side surface of the display part.

[0082] Step S30: An electromagnetic shielding layer is formed on the side of the heat-conducting layer away from the cover plate.

[0083] Figure 11 is a schematic diagram of the manufacturing process of the display module provided in some embodiments of this disclosure. The manufacturing process of the display module will be described in detail below with reference to Figure 11.

[0084] In step S10, the display substrate 10 and the cover plate 20 are arranged opposite to each other. The display substrate 10 includes a display portion 101 for image display, a display surface facing the cover plate 20, a non-display surface facing away from the cover plate 20, and a side surface connecting the display surface and the non-display surface. The cover plate 20 includes a main body region arranged opposite to the heat-conducting layer 50 and an edge region surrounding the main body region.

[0085] In step S20, a thermally conductive layer 50 is formed.

[0086] In some examples, the thermally conductive layer 50 is formed using a printing process, such as electrohydrodynamic inkjet (EHD) printing. Taking the thermally conductive layer 50 as an example using silicone material, step S20 includes: printing a thermally conductive silicone layer on the display substrate 10 using a printing process. The viscosity of the silicone layer can be between 5000 and 10000 cps, and the thickness can be between 50 and 100 micrometers. A portion of the silicone layer is located on the side of the display portion 101 facing away from the cover plate 20, and another portion is located around the display portion 101. Then, the silicone layer is cured to form the thermally conductive layer 50. Curing can be performed by heating, with a curing temperature between 50 and 65°C and a curing time between 0.5 and 1 hour. The cured silicone layer on the side of the display portion 101 facing away from the cover plate 20 serves as the first thermally conductive portion 51, and the cured silicone layer around the display portion 101 serves as the second thermally conductive portion 52.

[0087] In step S30, an electromagnetic shielding layer 60 is formed on the side of the heat-conducting layer 50 away from the cover plate 20.

[0088] In one example, the electromagnetic shielding layer 60 is formed using a printing process, such as electrohydrodynamic inkjet printing. For instance, step S30 specifically includes printing a conductive layer with a thickness of 5–10 μm onto the surface of the thermally conductive silicone layer. This conductive layer uses a nano-silver paste material with a viscosity between 10,000 and 20,000 cps. The conductive layer is then cured to form the electromagnetic shielding layer 60. Curing can be performed by heating at a temperature between 50 and 65°C for a time between 0.5 and 1 hour.

[0089] In addition, the manufacturing process of the display module also includes steps S40 to S50.

[0090] In step S40, edge sealing adhesive 70 is formed. Edge sealing adhesive 70 includes a first part 71 and a second part 72. The first part 71 is located on the side of the electromagnetic shielding layer 60 away from the cover plate 20, and the second part 72 is located in the edge area and surrounds the electromagnetic shielding layer 60 and the thermal conductive layer 50.

[0091] The edge-sealing adhesive 70 can be formed using a printing process. In one example, step S40 includes: printing the edge-sealing adhesive 70 material, which is, for example, an acrylic material with a viscosity between 10,000 and 15,000 cps; and then curing the edge-sealing adhesive 70 material to form the final desired edge-sealing adhesive 70. The edge-sealing adhesive 70 material can be photocured using ultraviolet light, with the wavelength of the curing light between 355 and 375 nm, for example, 365 nm, and the curing energy between 4000 and 6000 mJ / cm². 2 between.

[0092] In step S50, a frame 40 including a retaining wall portion 42 and a supporting portion 41 is provided. The supporting portion 41 is disposed on the side of the edge sealant 70 away from the cover plate 20. The retaining wall portion 42 of the frame 40 is disposed around the edge sealant 70 and the cover plate 20. The supporting portion 41 is bonded to the edge sealant 70, and the retaining wall portion 42 is bonded to the edge sealant 70 and the cover plate 20. For example, adhesive 83 is first applied to one of the frame 40 and the edge sealant 70, and then the frame 40 is bonded to the edge sealant 70.

[0093] Although this article only uses a quadrilateral display substrate as an example, this application is not limited to this. Those skilled in the art should understand that the technical solution of this application is applicable to display substrates of various shapes, such as irregularly shaped display substrates, such as circular, polygonal and other irregularly shaped display substrates.

[0094] This disclosure also provides a display device, including the display module described in the above embodiments. The display device can include any device or product with display functionality. For example, the display device can be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), etc.

[0095] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display module, characterized in that, include: A display substrate and a cover plate are disposed opposite to each other; the display substrate includes a display portion, the display portion including a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface; A heat-conducting layer, the heat-conducting layer including a first heat-conducting part and a second heat-conducting part, the first heat-conducting part being located on the side of the display part away from the cover plate, and the orthogonal projection of the first heat-conducting part on the cover plate covering the orthogonal projection of the display part on the cover plate. At least a portion of the second heat-conducting portion is disposed opposite to at least a portion of the side surface of the display portion; as well as An electromagnetic shielding layer is located on the side of the thermally conductive layer opposite to the cover plate.

2. The display module according to claim 1, characterized in that, The orthographic projection of the electromagnetic shielding layer on the cover plate covers the orthographic projection of the first heat-conducting part on the cover plate.

3. The display module according to claim 1, characterized in that, The orthographic projection of the second heat-conducting part on the cover plate is located outside the orthographic projection of the display part on the cover plate, and the width of the second heat-conducting part is between 50 and 100 micrometers.

4. The display module according to any one of claims 1 to 3, characterized in that, The cover plate includes a main body area disposed opposite to the heat-conducting layer and an edge area surrounding the main body area; The display module also includes an edge sealing adhesive, which comprises a first part and a second part. The first part is located on the side of the electromagnetic shielding layer away from the cover plate, and the second part is located in the edge area and surrounds the display substrate, the electromagnetic shielding layer and the thermal conductive layer.

5. The display module according to claim 4, characterized in that, The display module further includes a frame, which includes a retaining wall portion and a supporting portion. The supporting portion is located on the side of the edge sealant away from the cover plate and is bonded to the edge sealant. The retaining wall portion surrounds the edge sealant and the cover plate and is bonded to the edge sealant and the cover plate.

6. The display module according to claim 4, characterized in that, The orthographic projection of the sealing adhesive on the cover plate is annular, and the distance between its outer edge and the orthographic projection of the display substrate on the cover plate is between 0.4 and 0.6 mm.

7. The display module according to claim 4, characterized in that, The thickness of the first part is between 0.2 and 0.3 mm.

8. The display module according to any one of claims 1-7, characterized in that, The display substrate is a rigid display substrate, wherein at least a portion of the second heat-conducting portion is disposed opposite to all sides of the display portion.

9. The display module according to any one of claims 1-8, characterized in that, The display module further includes a back film located between the thermally conductive layer and the display unit.

10. The display module according to any one of claims 1 to 7, characterized in that, The display substrate is a flexible display substrate, and the display substrate further includes a driving part and a curved part connected between the driving part and the display part. The driving part is located on the side of the electromagnetic shielding layer away from the cover plate.

11. The display module according to claim 10, characterized in that, At least a portion of the second heat-conducting portion is disposed opposite to all the other sides of the display portion except for the side where the curved portion is located.

12. The display module according to claim 10 or 11, characterized in that, The display module further includes a back film, which is disposed between the heat-conducting layer and the display unit, and between the electromagnetic shielding layer and the driving unit.

13. A method for manufacturing a display module, characterized in that, include: A display substrate and a cover plate are disposed opposite to each other. The display substrate includes a display portion, which includes a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface. A heat-conducting layer is formed, the heat-conducting layer including a first heat-conducting part and a second heat-conducting part, the first heat-conducting part being located on the side of the display part away from the cover plate, and the orthogonal projection of the first heat-conducting part on the cover plate covering the orthogonal projection of the display part on the cover plate. At least a portion of the second heat-conducting portion is disposed opposite to at least a portion of the side surface of the display portion; An electromagnetic shielding layer is formed on the side of the thermally conductive layer opposite to the cover plate.

14. The manufacturing method according to claim 13, characterized in that, Both the thermally conductive layer and the electromagnetic shielding layer are formed using a printing process, and the first thermally conductive part and the second thermally conductive part are integrally formed.

15. The manufacturing method according to claim 13, characterized in that, The cover plate includes a main body region disposed opposite to the heat-conducting layer and an edge region surrounding the main body region; the manufacturing method further includes: An edge sealing adhesive is formed, comprising a first part and a second part. The first part is located on the side of the electromagnetic shielding layer away from the cover plate, and the second part is located in the edge area and surrounds the display substrate, the electromagnetic shielding layer and the thermal conductive layer.

16. The manufacturing method according to claim 15, characterized in that, The edge-sealing adhesive is formed through a printing process.

17. The manufacturing method according to claim 15, characterized in that, The manufacturing method further includes: A frame is provided, the frame including a retaining wall portion and a load-bearing portion; The supporting part is disposed on the side of the edge sealant away from the cover plate, the retaining wall part is disposed around the edge sealant and the cover plate, and the supporting part is bonded to the edge sealant, and the retaining wall part is bonded to the edge sealant and the cover plate.

18. The manufacturing method according to claim 17, characterized in that, The first part and the second part are integrally formed, and the retaining wall part and the load-bearing part are integrally formed.

19. A display device, characterized in that, The display module includes any one of claims 1 to 12.

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