Display substrate and manufacturing method therefor, and display device

Abstract

Provided is a display substrate, comprising a hole region, a buffer region located at the periphery of the hole region, a display region located at the periphery of the buffer region, and a peripheral region located at the periphery of the display region. The display substrate comprises: a base substrate; a light-emitting device layer located on the base substrate, wherein at least part of the light-emitting device layer is located in the display region, and the light-emitting device layer comprises a first electrode layer located on the base substrate, a light-emitting functional layer located on the side of the first electrode layer away from the base substrate, and a second electrode layer located on the side of the light-emitting functional layer away from the base substrate; a first retaining wall located on the base substrate, wherein the first retaining wall is located in the buffer region and disposed around the hole region; and an encapsulation layer located on the side of the light-emitting device layer and the first retaining wall away from the base substrate, wherein the distance between the edge of the light-emitting functional layer close to the hole region and the hole region is greater than or equal to one half of the distance between the edge of the first retaining wall close to the hole region and the hole region.

Description

Display substrate, its preparation method, and display device Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display substrate, a method for preparing the substrate, and a display device. Background Technology

[0002] As people relentlessly pursue the ultimate screen-to-body ratio, the form factor of the screen itself and the placement of the camera are rapidly being optimized. From the initial half-screen-to-body ratio to the notch layout and now to waterdrop screens and punch-hole screens, new display technologies are constantly emerging. Among them, the punch-hole screen design has greatly improved the screen-to-body ratio, satisfying consumers' ultimate pursuit of large-screen displays. However, how to solve the problem of encapsulation failure in the punch-hole area is one of the issues that display product developers are concerned about.

[0003] The information disclosed in this section is only for understanding the background of the inventive concept of this disclosure, and therefore may include information that does not constitute prior art. Summary of the Invention

[0004] In one aspect, a display substrate is provided, the display substrate including a punch-hole region, a buffer region surrounding the punch-hole region, a display region surrounding the buffer region, and a peripheral region surrounding the display region, the display substrate comprising:

[0005] Substrate;

[0006] A light-emitting device layer is located on the substrate, at least a portion of which is located in the display area. The light-emitting device layer includes a first electrode layer on the substrate, a light-emitting functional layer on the side of the first electrode layer away from the substrate, and a second electrode layer on the side of the light-emitting functional layer away from the substrate.

[0007] A first barrier wall is located on the substrate, the first barrier wall is located in the buffer region and is disposed around the perforation region; and

[0008] The encapsulation layer is located on the side of the light-emitting device layer and the first barrier away from the substrate.

[0009] Wherein, the distance between the edge of the light-emitting functional layer near the hole area and the hole area is greater than or equal to half the distance between the edge of the first retaining wall near the hole area and the hole area.

[0010] According to some exemplary embodiments, the edge of the light-emitting functional layer near the perforated area is located on the side of the first retaining wall away from the perforated area.

[0011] According to some exemplary embodiments, the display substrate further includes an isolation pillar layer located on the substrate, the isolation pillar layer including a plurality of first isolation pillars located in the display area, the light-emitting functional layer including a plurality of light-emitting functional parts, and at least one isolation pillar between two adjacent light-emitting functional parts.

[0012] According to some exemplary embodiments, the display substrate further includes a pixel defining layer located between the first electrode layer and the light-emitting functional layer, the pixel defining layer having a plurality of pixel openings; and the first isolation pillars located on the side of the pixel defining layer away from the substrate, the plurality of first isolation pillars being interconnected to form a grid-like isolation structure, the grid-like isolation structure having a plurality of isolation openings, wherein the orthographic projections of the plurality of pixel openings on the substrate are respectively located within the orthographic projections of the plurality of isolation openings on the substrate.

[0013] According to some exemplary embodiments, the plurality of light-emitting functional parts are respectively located within the plurality of isolation openings; and / or, the first electrode layer includes a plurality of first electrode portions, the plurality of first electrode portions being respectively located within the plurality of isolation openings.

[0014] According to some exemplary embodiments, the isolation pillar layer further includes a plurality of second isolation pillars located in the buffer region, and at least a portion of the encapsulation layer is located on the side of the plurality of second isolation pillars away from the substrate.

[0015] According to some exemplary embodiments, at least a portion of the encapsulation layer is directly connected to at least one of the second isolation pillars.

[0016] According to some exemplary embodiments, the distribution density of the plurality of second isolation columns is greater than the distribution density of the plurality of first isolation columns.

[0017] According to some exemplary embodiments, the encapsulation layer includes a first inorganic encapsulation layer, the first inorganic encapsulation layer including a first portion located in the display area and a second portion located in the buffer area, the thickness of the second portion being less than the thickness of the first portion.

[0018] According to some exemplary embodiments, at least one groove is provided on the side wall of the first retaining wall near the excavation area; and / or at least one groove is provided on the side wall of the first retaining wall away from the excavation area.

[0019] According to some exemplary embodiments, the at least one groove includes at least one annular groove that extends continuously along the circumferential direction of the sidewall of the first retaining wall.

[0020] According to some exemplary embodiments, the at least one groove includes a first groove and a second groove, wherein the first groove is located on the side of the second groove away from the substrate.

[0021] The first groove extends intermittently along the circumferential direction of the sidewall of the first retaining wall, and the first groove includes at least one first break; the second groove extends intermittently along the circumferential direction of the sidewall of the first retaining wall, and the second groove includes at least one second break; and

[0022] The at least one first fracture and the at least one second fracture are alternately arranged along the circumferential direction of the sidewall of the first retaining wall.

[0023] According to some exemplary embodiments, the at least one groove includes a plurality of dot-shaped grooves arranged in an array on the sidewall of the first retaining wall.

[0024] According to some exemplary embodiments, the display substrate further includes a second barrier wall located on the substrate, the second barrier wall being located in the peripheral region and surrounding the display area;

[0025] Wherein, at least one groove is provided on the side wall of the second barrier wall on the side closer to the display area; and / or at least one groove is provided on the side wall of the first barrier wall on the side away from the display area.

[0026] In another aspect, a method for fabricating a display substrate is provided. The display substrate includes a perforated area, a buffer area surrounding the perforated area, a display area surrounding the buffer area, and a peripheral area surrounding the display area. The fabrication method includes the following steps:

[0027] Provide a substrate;

[0028] A light-emitting device layer is formed on the substrate, at least a portion of the light-emitting device layer is located in the display area, and the light-emitting device layer includes a first electrode layer located on the substrate, a light-emitting functional layer located on the side of the first electrode layer away from the substrate, and a second electrode layer located on the side of the light-emitting functional layer away from the substrate.

[0029] A first barrier is formed on the substrate, the first barrier being located in the buffer region and surrounding the perforated region, wherein the distance between the edge of the light-emitting functional layer near the perforated region and the perforated region is greater than or equal to half the distance between the edge of the first barrier near the perforated region and the perforated region; and

[0030] An encapsulation layer is formed on the side of the light-emitting device layer and the first barrier away from the substrate.

[0031] In another aspect, a display substrate is provided, the display substrate including a punched-out area, a buffer area surrounding the punched-out area, a display area surrounding the buffer area, and a peripheral area surrounding the display area, the display substrate comprising:

[0032] Substrate;

[0033] A light-emitting device layer, located on the substrate, comprising a plurality of light-emitting devices arranged in an array within the display area; and

[0034] A first barrier wall is located on the substrate, and the first barrier wall is located in the buffer area and surrounds the hole area;

[0035] Wherein, at least one groove is provided on the side wall of the first retaining wall near the excavation area; and / or at least one groove is provided on the side wall of the first retaining wall away from the excavation area.

[0036] In another aspect, a display device is provided, the display device comprising the display substrate described above. Attached Figure Description

[0037] Other objects and advantages of this disclosure will become apparent from the following description of the disclosure with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the disclosure.

[0038] Figure 1 schematically shows a plan view of a display substrate according to an embodiment of the present disclosure.

[0039] Figure 2A schematically shows a cross-sectional view taken along AA' in Figure 1.

[0040] Figure 2B schematically shows an enlarged view of region C in Figure 2A.

[0041] Figure 2C schematically shows another cross-sectional view taken along AA' in Figure 1.

[0042] Figure 2D schematically shows a plan view of the pixel defining layer and the first isolation pillar in a display substrate according to an embodiment of the present disclosure.

[0043] Figure 3 schematically shows another cross-sectional view taken along AA' in Figure 1.

[0044] Figure 4 schematically shows a plan view of a first barrier sidewall in a display substrate according to some embodiments of the present disclosure.

[0045] Figure 5 schematically shows a plan view of the first barrier sidewall in a display substrate according to other embodiments of the present disclosure.

[0046] Figure 6 schematically shows a plan view of the first barrier sidewall in a display substrate according to some embodiments of the present disclosure.

[0047] Figure 7 schematically shows a cross-sectional view taken along BB' in Figure 1.

[0048] Figure 8 schematically illustrates a flowchart of a method for fabricating a display substrate according to an embodiment of the present disclosure.

[0049] Figures 9A-9H schematically illustrate the formation process of a display substrate according to some embodiments of the present disclosure.

[0050] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the accompanying drawings used to describe embodiments of this disclosure may be enlarged or reduced; that is, these drawings are not drawn to actual scale. Detailed Implementation

[0051] In the following description, numerous specific details are set forth for illustrative purposes to provide a comprehensive understanding of various exemplary embodiments. However, it will be apparent that various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but not necessarily exclusive. For example, specific shapes, configurations, and characteristics of exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0052] In the accompanying drawings, the dimensions and relative dimensions of the elements may be enlarged for clarity and / or descriptive purposes. Thus, the dimensions and relative dimensions of the individual elements are not necessarily limited to those shown in the drawings. When exemplary embodiments can be implemented differently, the specific process sequence may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of description. Furthermore, the same reference numerals denote the same elements.

[0053] When an element is described as being "on" another element, "connected to" another element, or "attached to" another element, the element may be directly on, directly connected to, or directly attached to the other element, or there may be intermediate elements present. However, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly attached to" another element, there are no intermediate elements. Other terms and / or expressions used to describe relationships between elements should be interpreted in a similar manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," or "on" versus "directly on," etc. Furthermore, the term "connection" can refer to a physical connection, an electrical connection, a communication connection, and / or a fluid connection. Additionally, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term “and / or” includes any and all combinations of one or more of the listed related items.

[0054] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be named a second element, and similarly, a second element may be named a first element.

[0055] Figure 1 schematically shows a plan view of a display substrate according to an embodiment of the present disclosure. Figure 1 schematically shows the substrate, the first barrier wall, and the second barrier wall in the display substrate. Figure 2A schematically shows a cross-sectional view taken along AA' in Figure 1.

[0056] Referring to Figure 1, the display substrate includes a punched-out area HA, a buffer area BA surrounding the punched-out area HA, a display area AA surrounding the buffer area BA, and a peripheral area NA surrounding the display area AA. In the punched-out area HA, the display substrate has a through-hole 100a formed along the edge of the punched-out area HA. ​​This through-hole 100a is used to house sensors such as a front-facing camera, satisfying the front-facing camera function while maintaining a high screen-to-body ratio. The buffer area BA can be annular, located between the display area AA and the punched-out area HA. ​​By setting this buffer area BA, it can buffer the process of forming the through-hole 100a, preventing damage to related structures within the display area AA. Simultaneously, the buffer area BA also has a corresponding encapsulation structure to prevent water and oxygen from eroding the light-emitting device (EM) within the display area AA from the edge of the through-hole 100a.

[0057] For example, as shown in Figure 1, the cut-out region HA is located on the side of the peripheral region NA in the second direction Y, and the center of the cut-out region HA is approximately equidistant from the two sides of the peripheral region NA in the first direction X. Alternatively, the cut-out region HA can be located even closer to the peripheral region NA in the first direction X.

[0058] Referring to Figures 1 and 2A, the display substrate includes a substrate 100, a light-emitting device layer 200 on the substrate 100, a first barrier Dam1 and a second barrier Dam2, and an encapsulation layer 400 on the side of the light-emitting device layer 200, the first barrier Dam1, and the second barrier Dam2 away from the substrate 100. The display substrate has a through-hole 100a, the edge of which is the edge of the hole area HA. ​​At least a portion of the light-emitting device layer 200 is located in the display area AA. The light-emitting device layer 200 includes a first electrode layer 210 on the substrate 100, a light-emitting functional layer 220 on the side of the first electrode layer 210 away from the substrate 100, and a second electrode layer 230 on the side of the light-emitting functional layer 220 away from the substrate 100. The light-emitting device layer 200 includes a plurality of light-emitting devices EM arranged in an array on the substrate 100. Each light-emitting device EM includes a first electrode portion 211, a light-emitting functional portion 221, and a second electrode portion 231. The first electrode portion 211 is located on the first electrode layer 210, the light-emitting functional portion 221 is located on the light-emitting functional layer 220, and the second electrode portion 231 is located on the second electrode layer 230. A first barrier wall Dam1 is located in the buffer area BA, and Dam1 can be ring-shaped and surround the perforated area HA. ​​A second barrier wall Dam2 is located in the peripheral area NA, and Dam2 can be ring-shaped and surround the display area AA. The encapsulation layer 400, the first barrier wall Dam1, and the second barrier wall Dam2 combine to encapsulate multiple light-emitting devices EM.

[0059] Referring again to Figure 2A, the distance D1 between the edge of the light-emitting functional layer 220 near the hole area HA and the hole area HA is greater than or equal to half the distance D2 between the edge of the first barrier wall Dam1 near the hole area HA and the hole area HA. ​​That is, the edge of the light-emitting functional layer 220 does not extend to the edge of the through-hole 100a of the display substrate. This avoids the edge of the light-emitting functional layer 220 being too close to the edge of the through-hole 100a of the display substrate or being directly exposed to the edge of the through-hole 100a of the display substrate, thus effectively preventing external water and oxygen from invading the light-emitting device EM in the display area AA along the light-emitting functional layer 220. On the other hand, the inventors also discovered through research that the adhesion of the light-emitting functional layer 220 is poor. If a large area of ​​the light-emitting functional layer 220 exists in the buffer area BA, it can easily lead to film peeling between the encapsulation layer 400 on the side of the light-emitting functional layer 220 away from the substrate 100 and other film layers on the side of the light-emitting functional layer 220 close to the substrate 100. Therefore, the edge of the light-emitting functional layer 220 is spaced a certain distance from the edge of the through hole 100a of the display substrate. That is, at least a portion of the buffer region BA is not provided in the area close to the hole area HA. ​​In this area, the encapsulation layer 400 can directly contact other film layers formed in the substrate 100, thereby improving the adhesion between the encapsulation layer 400 and the lower film layer. This can effectively avoid the problem of encapsulation failure caused by peeling of the encapsulation layer 400 during the use of the display substrate, and ultimately make the display substrate of the present invention have better reliability and trustworthiness.

[0060] Figure 2C schematically shows another cross-sectional view taken along AA' in Figure 1.

[0061] According to some exemplary embodiments, referring to FIG2A, the edge of the light-emitting functional layer 220 near the hole area HA is located on the side of the first barrier wall Dam1 away from the hole area HA. ​​For example, as shown in FIG2C, the edge of the light-emitting functional layer 220 near the hole area HA is spaced apart from the sidewall of the first barrier wall Dam1 away from the hole area HA, or as shown in FIG2A, the edge of the light-emitting functional layer 220 near the hole area HA is in contact with the sidewall of the first barrier wall Dam1 away from the hole area HA. ​​By stopping the edge of the light-emitting functional layer 220 at the inner side of the first barrier wall Dam1 away from the hole area HA, the problem of external water and oxygen intruding into the light-emitting device EM in the display area AA along the light-emitting functional layer 220 can be basically avoided. At the same time, in the area located on the side of the first barrier wall Dam1 near the hole area HA, there is no light-emitting functional layer 220, and the encapsulation layer 400 can directly contact other film layers formed in the substrate 100, which greatly improves the adhesion between the encapsulation layer 400 and the lower film layer.

[0062] According to some exemplary embodiments, the inventors have discovered that the edge of the light-emitting functional layer 220 near the hole area HA can also be located on the side of the first barrier wall Dam1 near the hole area HA, but it is necessary to control that the edge of the light-emitting functional layer 220 near the hole area HA extends beyond the range of the first barrier wall Dam1. To ensure better packaging reliability, when the edge of the light-emitting functional layer 220 near the hole area HA is located on the side of the first barrier wall Dam1 near the hole area HA, the distance D1 between the edge of the light-emitting functional layer 220 near the hole area HA and the hole area HA must be greater than or equal to half of the distance D2 between the edge of the first barrier wall Dam1 near the hole area HA and the hole area HA.

[0063] For example, referring to Figure 1, the plurality of light-emitting devices (EMs) include a plurality of first light-emitting devices (EM1), a plurality of second light-emitting devices (EM2), and a plurality of third light-emitting devices (EM3). The first light-emitting devices (EM1) emit red light, the second light-emitting devices (EM2) emit green light, and the third light-emitting devices (EM3) emit blue light. The first light-emitting device (EM1) includes a first electrode portion 211, a first light-emitting functional portion 2211, and a second electrode portion 231. The second light-emitting device (EM2) includes a first electrode portion 211, a second light-emitting functional portion 2212, and a second electrode portion 231. The third light-emitting device (EM3) includes a first electrode portion 211, a third light-emitting functional portion 2213, and a second electrode portion 231.

[0064] For example, the light-emitting device EM can specifically be an organic light-emitting diode (OLED). For example, the light-emitting device EM can be a top-emitting OLED. For example, the light-emitting element is a micro OLED. The embodiments of this disclosure do not limit the specific structure of the light-emitting element. For example, the first electrode portion of the light-emitting device EM is the anode of the OLED, and the second electrode portion is the cathode of the OLED.

[0065] For example, the light-emitting functional layer may include one or more of the following: hole injection layer, hole transport layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc. It may also include other functional film layers in addition to the above layers. The layers may include organic materials or inorganic materials such as quantum dots.

[0066] For example, a pixel delimiting layer (PDL) is further disposed between the first electrode layer 210 and the light-emitting functional layer 220. The pixel delimiting layer includes a plurality of pixel openings KK, which expose at least a portion of a plurality of first electrode portions 211. The plurality of openings include a plurality of first pixel openings KK1, a plurality of second pixel openings KK2, and a plurality of third pixel openings KK3. The first light-emitting functional portion 2211 overlaps with the first electrode portion 211 through the first pixel opening KK1, the second light-emitting functional portion 2212 overlaps with the first electrode portion 211 through the second pixel opening KK2, and the third light-emitting functional portion 2213 overlaps with the first electrode portion 211 through the third pixel opening KK3.

[0067] For example, referring to Figures 1 and 2A, the encapsulation layer 400 includes a first inorganic encapsulation layer 410, an organic encapsulation layer 420 located on the side of the first inorganic encapsulation layer away from the substrate 100, and a second inorganic encapsulation layer 430 located on the side of the organic encapsulation layer 420 away from the substrate 100. The material of the first inorganic encapsulation layer 410 may include at least one of silicon nitride and silicon oxide, the material of the second inorganic encapsulation layer 430 may include at least one of silicon nitride and silicon oxide, and the material of the organic encapsulation layer 420 may include an organic polymer material. The edge of the first inorganic encapsulation layer 410 near the hole area HA is located on the side of the first retaining wall Dam1 near the hole area HA, and the edge of the second inorganic encapsulation layer 430 near the hole area HA is located on the side of the first retaining wall Dam1 near the hole area HA. ​​The edge of the organic encapsulation layer 420 near the hole area HA is located on the side of the first retaining wall Dam1 away from the hole area HA.

[0068] For example, the surrounding area NA is provided with at least one second barrier wall Dam2, which can improve the blocking effect on printing ink in the inkjet printing process of forming organic encapsulation layer 420. Depending on the specific process requirements, two or more second barrier walls Dam2 can be provided.

[0069] For example, the buffer area BA can be set with only one first barrier Dam1 to ensure that the buffer area BA has a narrow width, thereby reducing the area of ​​the hole-shaped area located in the display area AA that is not used for display.

[0070] According to some exemplary embodiments, referring to FIG2A, the first inorganic encapsulation layer 410 includes a first portion 411 located in the display region AA and a second portion 412 located in the buffer region BA, wherein the thickness of the second portion 412 is less than the thickness of the first portion 411. In the display substrate provided in the embodiments of this disclosure, the first portion 411 of the first inorganic encapsulation layer 410 located in the display region AA includes at least two sub-parts formed by two film deposition processes, and the second portion 412 of the first inorganic encapsulation layer 400 located in the buffer region BA is formed by a single film deposition process. Therefore, the thickness of the second portion 412 is less than the thickness of the first portion 411. The specific formation process is detailed in the embodiments described later. For example, the first part 411 includes a first encapsulation sub-part 4111 located on the side of the second electrode part 231 away from the substrate 100 and a second encapsulation sub-part 4112 located on the side of the first sub-part 4111 away from the substrate 100. The second part 412 and the second encapsulation sub-part 4112 in the first part 411 are formed by the same film deposition process. The thickness of the second part 412 is approximately equal to the thickness of the second encapsulation sub-part 4112 in the first part 411. Therefore, the thickness of the second part 412 is less than the thickness of the first part 411.

[0071] According to some exemplary embodiments, referring to FIG2A, the display substrate further includes an isolation pillar layer 300 located on the substrate 100. The isolation pillar layer 300 includes a plurality of first isolation pillars 310 located in the display area AA. The first isolation pillars 310 are located on the side of the pixel defining layer PDL away from the substrate 100. At least one first isolation pillar 310 is provided between two adjacent light-emitting functional parts 221, and at least one first isolation pillar 310 is provided between two adjacent second electrode parts 231. At least a portion of the light-emitting functional layer 220 is separated into a plurality of light-emitting functional parts 221 by the plurality of first isolation pillars 310, and at least a portion of the second electrode layer 230 is separated into a plurality of second electrode parts 231 by the plurality of first isolation pillars 310. At least a portion of the first isolation pillar 310 is conductive. By controlling the formation process of the second electrode layer 230, each second electrode portion 231 is electrically connected to its adjacent first isolation pillar 310, thereby making two adjacent second electrode portions 231 electrically connected through the first isolation pillar 310. That is, multiple second electrode portions 231 are electrically connected into a whole through multiple first isolation pillars 310. For example, the second electrode layer 230 is formed by a vapor deposition process, and the second electrode portion 231 can overlap with the adjacent first isolation pillar 310 by controlling the vapor deposition angle during the vapor deposition process.

[0072] Figure 2D schematically illustrates a plan view of a pixel defining layer and a first isolation pillar in a display substrate according to an embodiment of the present disclosure. Figure 2D only schematically shows the structure where the pixel defining layer and the first isolation pillar are located within a portion of the display area. Although the shape of the first isolation pillar is not filled in in the cross-sectional view of the display substrate such as Figure 2A, Figure 2D fills in the first isolation pillar with diagonal lines to clearly show its placement range.

[0073] According to some exemplary embodiments, referring to Figures 2A and 2D, a plurality of first isolation pillars 310 are interconnected to form a grid-like isolation structure 310M. The grid-like isolation structure 310M has a plurality of isolation openings GK. The orthographic projections of the plurality of pixel openings KK on the substrate 100 are respectively located within the orthographic projections of the plurality of isolation openings GK on the substrate 100. That is, the grid-like isolation structure 310M is continuously arranged around the plurality of pixel openings KK.

[0074] According to some exemplary embodiments, referring to Figures 2A and 2D, the light-emitting functional layer 220 is divided into multiple light-emitting functional parts 221 by a grid-like isolation structure 310M. The multiple light-emitting functional parts 221 are respectively located within multiple isolation openings GK, that is, the grid-like isolation structure 310M is continuously disposed around the periphery of the light-emitting functional parts 221. By providing the grid-like isolation structure 310M, when forming the light-emitting functional layer 220 by vapor deposition, only an open mask is needed to block the surrounding area to form multiple spaced-apart light-emitting functional parts 221, eliminating the need for a fine metal mask (FMM).

[0075] According to some exemplary embodiments, referring to Figures 2A and 2D, the first electrode layer 230 is divided into a plurality of first electrode portions 231 by a grid-like isolation structure 310M. The plurality of first electrode portions 231 are respectively located within a plurality of isolation openings GK, that is, the grid-like isolation structure 310M is continuously disposed around the periphery of the first electrode portions 231. By providing the grid-like isolation structure 310M, when the first electrode layer 230 is formed by vapor deposition, only an open mask is needed to cover the surrounding area to form a plurality of spaced first electrode portions 231, without the need to use a fine metal mask (FMM). For example, the isolation pillar layer 300 includes a first sublayer 300a, a second sublayer 300b located on the side of the first sublayer 300a away from the substrate 100, and a third sublayer 300c located on the side of the second sublayer 300b away from the substrate 100. The first isolation pillar 310 includes a first sub-part 310a located in the first sub-layer 300a, a second sub-part 310b located in the second sub-layer 300b, and a third sub-part 310c located in the third sub-layer 300c. The orthographic projection of the second sub-part 310b onto the substrate 100 lies within the orthographic projection of the third sub-part 310c onto the substrate 100, and the orthographic projection of the second sub-part 310b onto the substrate 100 lies within the orthographic projection of the first sub-part 310a onto the substrate 100. That is, the edge of the second sub-part 310b is recessed compared to the edge of the third sub-part 310c, and the second sub-part 310b and the third sub-part 310c form an undercut structure to achieve a better isolation effect.

[0076] For example, the materials of the first sublayer 300a and the third sublayer 300c include titanium, and the material of the second sublayer 300b includes aluminum. The etching process for forming the first isolation pillar 310 can be a wet etching process. In this wet etching process, the reaction rate of the etching solution with aluminum is significantly greater than the etching rate with titanium. Therefore, the portion of the second sublayer 300b that is etched away is more than the portion of the third sublayer 300c that is etched away. As a result, in the first isolation pillar 310 formed by etching, the edge of the second sublayer 310b is more recessed than the edge of the third sublayer 310c.

[0077] Figure 2B schematically shows an enlarged view of region C in Figure 2A.

[0078] According to some exemplary embodiments, referring to Figures 2A and 2B, no light-emitting device is disposed in the area between the first isolation pillar 310 closest to the first barrier wall Dam1 and the first barrier wall Dam1. This area may include a stacked film layer T, which includes a first sub-layer T1 located on the substrate 100, a second sub-layer T2 located on the side of the first sub-layer T1 away from the substrate 100, and a third sub-layer T3 located on the side of the second sub-layer T2 away from the substrate 100. The first sublayer T1 can be located on the same layer as the first light-emitting functional part 2211, the second sublayer T2 can be located on the same layer as the second electrode part 231 located on the side of the first light-emitting functional part 2211 away from the substrate 100, and the third sublayer T3 can be located on the same layer as the first encapsulation sub-part 4111 located on the side of the first light-emitting device EM1 away from the substrate 100. That is, when etching to form the first light-emitting functional part 2211, the second electrode part 231, and the first encapsulation sub-part 4111 of the first light-emitting device EM1, the stacked film layer T in the area between the first isolation pillar 310 closest to the first barrier wall Dam1 and the first barrier wall Dam1 is retained. With this configuration, the edge of the first sublayer T1 near the hole area HA is the edge of the light-emitting functional layer 220 near the hole area HA, and the edge of the first sublayer T1 near the hole area HA is in contact with the sidewall of the first barrier wall Dam1 away from the hole area HA.

[0079] According to some exemplary embodiments, the first sublayer T1 may be located on the same layer as the second light-emitting functional part 2212, the second sublayer T2 may be located on the same layer as the second electrode part 231 located on the side of the second light-emitting functional part 2212 away from the substrate 100, and the third sublayer T3 may be located on the same layer as the first encapsulation sub-part 4111 located on the side of the second light-emitting device EM2 away from the substrate 100. That is, when etching to form the second light-emitting functional part 2212, the second electrode part 231, and the first encapsulation sub-part 4111 of the second light-emitting device EM2, the stacked film layer T located in the area between the first isolation pillar 310 closest to the first barrier Dam1 and the first barrier Dam1 is retained.

[0080] According to some exemplary embodiments, the first sublayer T1 may be located on the same layer as the third light-emitting functional part 2213, the second sublayer T2 may be located on the same layer as the second electrode part 231 located on the side of the third light-emitting functional part 2213 away from the substrate 100, and the third sublayer T3 may be located on the same layer as the first encapsulation sub-part 4111 located on the side of the third light-emitting device EM3 away from the substrate 100. That is, when etching to form the third light-emitting functional part 2213, the second electrode part 231, and the first encapsulation sub-part 4111 of the third light-emitting device EM3, the stacked film layer T located in the area between the first isolation pillar 310 closest to the first barrier Dam1 and the first barrier Dam1 is retained.

[0081] According to some exemplary embodiments, the stacked film layer located in the region between the first isolation pillar 310 closest to the first barrier wall Dam1 and the first barrier wall Dam1 may include a first stacked film layer formed simultaneously with the first light-emitting functional part 2211, the second electrode part 231, and the first encapsulation part 4111 of the first light-emitting device EM1; a second stacked film layer formed simultaneously with the second light-emitting functional part 2212, the second electrode part 231, and the first encapsulation part 4111 of the second light-emitting device EM2; and a third stacked film layer formed simultaneously with the first encapsulation part 4111 located on the side of the third light-emitting device EM3 away from the substrate 100.

[0082] According to some exemplary embodiments, referring to FIG2C, when etching to form the first light-emitting functional portion 2211, the second electrode portion 231, and the first encapsulation portion 4111 of the first light-emitting device EM1, the stacked film layer located in the region between the first isolation pillar 310 and the first barrier wall Dam1, which is closest to the first barrier wall Dam1, is also etched away; when etching to form the second light-emitting functional portion 2212, the second electrode portion 231, and the first encapsulation portion 4111 of the second light-emitting device EM2, the stacked film layer located in the region between the first isolation pillar 310 and the first barrier wall Dam1, which is closest to the first barrier wall Dam1, is also etched away; when etching to form the third light-emitting functional portion 2213, the second electrode portion 231, and the first encapsulation portion 4111 of the third light-emitting device EM3, the stacked film layer located in the region between the first isolation pillar 310 and the first barrier wall Dam1, which is closest to the first barrier wall Dam1, is also etched away. With this configuration, the edge of the light-emitting functional layer 220 near the cutout area HA is the edge of the light-emitting functional part 221 of the light-emitting device EM closest to the first retaining wall Dam1 near the cutout area HA. ​​The edge of the light-emitting functional layer 220 near the cutout area HA ends at the side of the first isolation post 310 closest to the first retaining wall Dam1 away from the cutout area HA. ​​That is, the edge of the light-emitting functional layer 220 near the cutout area HA is located on the side of the first retaining wall Dam1 away from the cutout area HA and is spaced apart from the first retaining wall Dam1.

[0083] According to some exemplary embodiments, referring to FIG2A, the second electrode layer 230 and the light-emitting functional layer 220 are formed by sequentially depositing corresponding material films and then forming them by the same patterning process. The edge of the second electrode layer 230 near the hole area HA basically coincides with the edge of the light-emitting functional layer 220 near the hole area HA.

[0084] According to some exemplary embodiments, referring to FIG2A, the isolation pillar layer 300 further includes a plurality of second isolation pillars 320 located in the buffer region BA. The plurality of second isolation pillars 320 are located on the side of the first barrier wall Dam1 away from the display region AA, and at least a portion of the encapsulation layer 400 is located on the side of the plurality of second isolation pillars 320 away from the substrate 100. The portion of the encapsulation layer 400 located on the plurality of second isolation pillars 320 has an uneven morphology. On the one hand, this can increase the contact area between this portion of the encapsulation layer 400 and the underlying film layer, thereby increasing the adhesion between the encapsulation layer 400 and the underlying film layer. On the other hand, even if the encapsulation layer 400 partially peels off from the underlying film layer, the path for water and oxygen to erode from the via sidewalls of the display substrate into the display region AA is extended, which can effectively reduce the difficulty of water and oxygen intrusion.

[0085] For example, the second isolation pillar 320 includes a first sub-part 320a located in the first sub-layer 300a, a second sub-part 320b located in the second sub-layer 300b, and a third sub-part 320c located in the third sub-layer 300c. The orthographic projection of the second sub-part 320b on the substrate 100 is within the orthographic projection of the third sub-part 320c on the substrate 100, and the orthographic projection of the second sub-part 320b on the substrate 100 is within the orthographic projection of the first sub-part 320a on the substrate 100.

[0086] According to some exemplary embodiments, referring to FIG2A, the distribution density of the plurality of second isolation pillars 320 is greater than the distribution density of the plurality of first isolation pillars 310, that is, the spacing between two adjacent second isolation pillars 320 is smaller than the spacing between two adjacent first isolation pillars 310. By making the second isolation pillars 320 slightly denser, the adhesion between the encapsulation layer 400 and the underlying film layer can be further increased, while the potential water and oxygen erosion path from the via sidewall of the display substrate to the display area AA can be further extended.

[0087] Figure 3 schematically shows another cross-sectional view taken along AA' in Figure 1.

[0088] According to some exemplary embodiments, referring to FIG3, there is a raised portion 510 below the second isolation pillar 320, which increases the height of the second isolation pillar 320, thereby enhancing the degree of unevenness of the encapsulation layer 400 located on the plurality of second isolation pillars 320. With this setting, the adhesion between the encapsulation layer 400 and the lower film layer can be further increased, and the water and oxygen erosion path that may exist from the sidewall of the through hole 100a of the display substrate to the display area AA can be further extended.

[0089] According to some exemplary embodiments, the display substrate further includes a driving circuit layer located between the substrate 100 and the light-emitting device (EM) layer 200. The driving circuit layer includes a plurality of driving circuit units, each of which is electrically connected to a plurality of light-emitting devices (EMs). The driving circuit layer includes multiple metal layers, and the raised portion may be located in at least one of the multiple metal layers. For example, the driving circuit layer includes a first gate metal layer, a second gate metal layer, and source / drain metal layers, with the raised portion located in the first gate metal layer and the second gate metal layer.

[0090] According to some exemplary embodiments, referring to FIG2A or FIG3, at least a portion of the encapsulation layer 400 is directly connected to at least one second isolation pillar 320. For example, the edge of the light-emitting functional layer 220 near the cutout area HA is located on the side of the first barrier wall Dam1 near the display area AA, and the portion of the encapsulation layer 400 on the side of the first barrier wall Dam1 away from the display area AA is directly connected to each of the second isolation pillars 320. The edge of the second sub-part 320b of the second isolation pillar 320 is concave compared to the edge of the first sub-part 320a and the edge of the third sub-part 320c. The direct connection of the encapsulation layer 400 to this second isolation pillar 320 with a concave sidewall structure can significantly improve the adhesion of the encapsulation layer 400, thereby greatly reducing the risk of encapsulation failure due to peeling of the encapsulation layer 400.

[0091] According to some exemplary embodiments, referring to FIG2A, at least one of the sidewalls of the first retaining wall Dam1 on the side near the excavation area HA and the sidewalls away from the excavation area HA is provided with at least one groove G1. For example, at least one groove G1 is provided on the sidewall of the first retaining wall Dam1 on the side near the excavation area HA, and at least one groove G1 is provided on the sidewall of the first retaining wall Dam1 on the side away from the excavation area HA. In the fabrication process of the display substrate provided in this embodiment, the formation process of the light-emitting functional layer 220 includes a vapor deposition process and an etching process. In the vapor deposition process, the light-emitting functional material film layer formed by vapor deposition is broken at the groove G1 on the sidewall of the first barrier wall Dam1, so that the portion of the light-emitting functional material film layer formed by vapor deposition located on the side of the first barrier wall Dam1 near the hole area HA is at least partially separated from the portion located on the side of the first barrier wall Dam1 near the display area AA. This allows the portion of the light-emitting functional material film layer located on the side of the first barrier wall Dam1 near the hole area HA to transmit moisture to the portion located on the side of the first barrier wall Dam1 near the display area AA during the etching process. For details of the formation process, please refer to the embodiments described later.

[0092] According to some exemplary embodiments, at least a portion of the first barrier Dam1 may be located in the driving circuit layer, that is, at least a portion of the first barrier Dam1 may be formed together with the driving circuit layer. For example, the driving circuit layer includes at least one planarization layer, and at least a portion of the first barrier Dam1 may be located in at least one planarization layer.

[0093] According to some exemplary embodiments, at least a portion of the first barrier Dam1 may be located in the pixel definition layer PDL, that is, at least a portion of the first barrier Dam1 is formed together when the pixel definition layer PDL is formed.

[0094] Figure 4 schematically shows a plan view of a first barrier sidewall in a display substrate according to some embodiments of the present disclosure.

[0095] According to some exemplary embodiments, referring to FIG4, at least one groove G1 includes at least one annular groove G11. Referring to FIG2A, the annular groove G11 is continuously extended along the circumferential direction of the sidewall of the first barrier wall Dam1, thereby completely separating the portion of the luminescent functional material film layer formed by vapor deposition located on the side of the first barrier wall Dam1 near the perforated area HA from the portion located on the side of the first barrier wall Dam1 near the display area AA.

[0096] Figure 5 schematically shows a plan view of the first barrier sidewall in a display substrate according to other embodiments of the present disclosure.

[0097] According to some exemplary embodiments, referring to FIG5, at least one groove G1 includes a first groove G12 and a second groove G13. Referring to FIG2A, the first groove G12 is located on the side of the second groove G13 away from the substrate 100. The first groove G12 extends intermittently along the circumferential direction of the sidewall of the first barrier wall Dam1, and the first groove G12 includes at least one first break G121; the second groove G13 extends intermittently along the circumferential direction of the sidewall of the first barrier wall Dam1, and the second groove G13 includes at least one second break G131. At least one first break G121 and at least one second break G131 are alternately arranged along the circumferential direction of the sidewall of the first barrier wall Dam1. That is, at least two discontinuous annular grooves are provided on the side wall of the first barrier wall Dam1, and the positions of the two adjacent grooves G1 are staggered, so as to effectively extend the path of water vapor transmission from the part of the luminescent material film layer formed by vapor deposition to the part of the first barrier wall Dam1 near the hole area HA to the part of the first barrier wall Dam1 near the display area AA.

[0098] Figure 6 schematically shows a plan view of the first barrier sidewall in a display substrate according to some embodiments of the present disclosure.

[0099] According to some exemplary embodiments, referring to FIG6, at least one groove G1 includes a plurality of dot-shaped grooves G14, which are arranged in an array on the sidewall of the first barrier wall Dam1. At each dot-shaped groove G14, the vapor-deposited luminescent material film can form a dot-shaped perforated structure, thereby greatly and effectively improving the path for moisture transmission from the portion of the vapor-deposited luminescent material film located on the side of the first barrier wall Dam1 near the perforated area HA to the portion located on the side of the first barrier wall Dam1 near the display area AA.

[0100] Figure 7 schematically shows a cross-sectional view taken along BB' in Figure 1. According to some exemplary embodiments, referring to both Figure 1 and Figure 7, at least one of the sidewalls of the second barrier wall Dam2 near the display area AA and away from the display area AA is provided with at least one groove G2. For example, at least one groove G2 is provided on the sidewall of the second barrier wall Dam2 near the display area AA, and at least one groove G2 is provided on the sidewall of the second barrier wall Dam2 away from the display area AA. The groove G2 on the sidewall of the second barrier wall Dam2 functions similarly to the groove G2 on the sidewall of the first barrier wall Dam1; the groove G2 on the sidewall of the second barrier wall Dam2 can prevent the portion of the luminescent material film layer located on the side of the second barrier wall Dam2 away from the display area AA from transmitting moisture to the portion of the second barrier wall Dam2 near the display area AA. The specific structure of the groove G2 on the sidewall of the second barrier wall Dam2 can be set with reference to the groove G1 on the sidewall of the first barrier wall Dam1, and will not be described again here.

[0101] Figure 8 schematically illustrates a flowchart of a method for fabricating a display substrate according to an embodiment of the present disclosure.

[0102] Referring to Figure 8, the method for preparing the display substrate includes the following steps S10 to S30.

[0103] In step S10, a substrate is provided.

[0104] In step S20, a light-emitting device layer is formed on a substrate. At least a portion of the light-emitting device layer is located in the display area. The light-emitting device layer includes a first electrode layer on the substrate, a light-emitting functional layer on the side of the first electrode layer away from the substrate, and a second electrode layer on the side of the light-emitting functional layer away from the substrate.

[0105] In step S30, a first barrier is formed on the substrate. The first barrier is located in the buffer region and surrounds the hole area. The distance between the edge of the light-emitting functional layer near the hole area and the hole area is greater than or equal to half the distance between the edge of the first barrier near the hole area and the hole area.

[0106] In step S40, an encapsulation layer is formed on the side of the light-emitting device layer and the first barrier away from the substrate.

[0107] Figures 9A-9H schematically illustrate the formation process of a display substrate according to some embodiments of the present disclosure.

[0108] Referring to FIG9A, a substrate 100 is provided, on which a first electrode layer 210 is formed. The first electrode layer 210 includes a plurality of first electrode portions 211 formed in the display area AA.

[0109] A pixel defining layer PDL is formed on the side of the first electrode layer 210 away from the substrate 100. The pixel defining layer PDL includes a plurality of pixel openings KK, which expose at least a portion of a plurality of first electrode portions 211. The plurality of pixel openings KK includes a plurality of first pixel openings KK1, a plurality of second pixel openings KK2, and a plurality of third pixel openings KK3.

[0110] A first barrier wall Dam1 is formed on the side of the plurality of first electrode portions 211 near the perforated area HA, and the first barrier wall Dam1 is formed in the buffer area BA. At least one groove G1 is provided on at least one of the side wall of the first barrier wall Dam1 near the display area AA and the side wall of the first barrier wall Dam1 away from the display area AA. For example, at least one groove G1 is provided on the side wall of the first barrier wall Dam1 near the display area AA and at least one groove G1 is provided on the side wall of the first barrier wall Dam1 away from the display area AA.

[0111] An isolation pillar layer 300 is formed on the side of the pixel defining layer (PDL) away from the substrate 100. The isolation pillar layer 300 includes a plurality of first isolation pillars 310 located on the side of the first barrier wall (Dam1) near the display area (AA) and a plurality of second isolation pillars 320 located on the side of the first barrier wall (Dam1) near the hole area (HA). The isolation pillar layer 300 includes a first sublayer 300a, a second sublayer 300b located on the side of the first sublayer 300a away from the substrate 100100, and a third sublayer 300c located on the side of the second sublayer 300b away from the substrate 100100. The first isolation pillars 310 include a first sub-part 310a located in the first sublayer 300a, a second sub-part 310b located in the second sublayer 300b, and a third sub-part 310c located in the third sublayer 300c. The orthographic projection of the second sub-part 310b on the substrate 100100 lies within the orthographic projection of the third sub-part 310c on the substrate 100100, and the orthographic projection of the second sub-part 310b on the substrate 100100 lies within the orthographic projection of the first sub-part 310a on the substrate 100100. The second isolation pillar 320 includes a first sub-part 320a located in the first sub-layer 300a, a second sub-part 320b located in the second sub-layer 300b, and a third sub-part 320c located in the third sub-layer 300c. The orthographic projection of the second sub-part 320b on the substrate 100100 lies within the orthographic projection of the third sub-part 320c on the substrate 100100, and the orthographic projection of the second sub-part 320b on the substrate 100100 lies within the orthographic projection of the first sub-part 320a on the substrate 100100.

[0112] Referring to Figure 9B, a first light-emitting functional material film layer 2211a and a second electrode material film layer 231a are sequentially formed on the side of the isolation pillar layer 300 away from the substrate 100. For example, the first light-emitting functional material film layer 2211a and the second electrode material film layer 231a are formed sequentially by a vapor deposition process. Since a groove G1 is provided on the sidewall of the first barrier wall Dam1, the formed first light-emitting functional material film layer 2211a and second electrode material film layer 231a will form a break at the groove G1.

[0113] Referring to FIG9C, an inorganic encapsulation material film layer 4111a is formed on the side of the second electrode material film layer 231a away from the substrate 100.

[0114] Referring to Figures 9C and 9D, a patterning process is performed on the first light-emitting functional material film layer 2211a, the second electrode material film layer 231a, and the inorganic encapsulation material film layer 4111a. Only the film layer in the region between adjacent first isolation pillars 310 at the first pixel opening KK1 is retained, forming the first light-emitting functional part 2211, the second electrode part 231 located on the side of the first light-emitting functional part 2211 away from the substrate 100, and the first encapsulation sub-part 4111 located on the side of the second electrode part 231 away from the substrate 100. The formed first electrode part 211, first light-emitting functional part 2211, and second electrode part 231 constitute at least a part of the first light-emitting device EM1. The film layer in the region between the first isolation pillar 310 and the first barrier wall Dam1 closest to Dam1 can be retained or etched away. For example, Figure 9D schematically shows the case where the film layer in the region between the first isolation pillar 310 and the first barrier wall Dam1 closest to Dam1 is retained.

[0115] Due to the first luminescent functional material film layer 2211 a With the second electrode material film layer 231 a A break will be formed at the groove G1, which will effectively prevent the first light-emitting functional material film 2211a and the second electrode material film 231a from intersecting when etching away the portion of the first barrier Dam1 near the hole area HA. a The portion of the first retaining wall Dam1 located near the excavation area HA transmits water vapor to the portion of the first retaining wall Dam1 located near the display area AA.

[0116] Referring to FIG9E, and following the process of forming the first light-emitting functional portion 2211, the second electrode portion 231, and the first encapsulation portion 4111, a second light-emitting functional portion 2212, a second electrode portion 231 located on the side of the second light-emitting functional portion 2212 away from the substrate 100, and a first encapsulation portion 4111 located on the side of the second electrode portion 231 away from the substrate 100 are formed in the region between adjacent first isolation pillars 310 at the second pixel opening KK2. The formed first electrode portion 211, second light-emitting functional portion 2212, and second electrode portion 231 constitute at least a portion of the second light-emitting device EM2. During this process, the film layer in the region between the first isolation pillar 310 closest to the first barrier wall Dam1 and the first barrier wall Dam1 can be retained or etched away. For example, FIG9E schematically shows the case where the film layer in the region between the first isolation pillar 310 closest to the first barrier wall Dam1 and the first barrier wall Dam1 is etched away.

[0117] A third light-emitting functional portion 2213, a second electrode portion 231 located on the side of the third light-emitting functional portion 2213 away from the substrate 100, and a first encapsulation portion 4111 located on the side of the second electrode portion 231 away from the substrate 100 are formed in the region between adjacent first isolation pillars 310 at the third pixel opening KK3. The formed first electrode portion 211, third light-emitting functional portion 2213, and second electrode portion 231 constitute at least a part of the third light-emitting device EM3. During this process, the film layer in the region between the first isolation pillar 310 closest to the first barrier wall Dam1 and the first barrier wall Dam1 can be retained or etched away. For example, FIG9E schematically shows the case where the film layer in the region between the first isolation pillar 310 closest to the first barrier wall Dam1 and the first barrier wall Dam1 is etched away.

[0118] Referring to FIG9F, a second encapsulation sublayer 410b is formed on the side of the plurality of first encapsulation sub-parts 4111 that is away from the substrate 100. The second encapsulation sublayer 410b covers the display area AA, the buffer area BA and the hole area HA. ​​That is, the second encapsulation sublayer 410b covers at least the plurality of light-emitting devices located in the display area AA, the first barrier Dam1 and the plurality of second isolation pillars located in the buffer area BA. The second encapsulation sublayer 410b and the plurality of first encapsulation sub-parts 4111 can together serve as the first inorganic encapsulation layer 410.

[0119] Referring to FIG9G, an organic encapsulation layer 420 is formed on the side of the second encapsulation sublayer 410b away from the substrate 100, and a second inorganic encapsulation layer 430 is formed on the side of the organic encapsulation layer 420 away from the substrate 100. For example, the edge of the organic encapsulation layer 420 near the hole area HA is located on the side of the first barrier Dam1 near the display area AA, and the second inorganic encapsulation layer 430 covers the display area AA, the buffer area BA, and the hole area HA.

[0120] Referring to FIG9H, the substrate 100 located in the perforation area HA is cut along the edge of the perforation area HA, and the various film layers formed on the substrate 100 are removed, thus forming the through hole 100 of the display substrate. a For example, the cutting process for forming the through hole 100a can be a laser cutting process.

[0121] At least some embodiments of this disclosure also provide a display device comprising the display substrate described above. The display device may include any device or product with display functionality. For example, the display device may be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.

[0122] It should be understood that the display device according to some exemplary embodiments of this disclosure has all the features and advantages of the display substrate described above, which can be referred to in the above description of the display substrate and will not be repeated here.

[0123] As used herein, the terms “substantially,” “approximately,” “about,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “approximately” or “about” as used herein includes the stated value and indicates that the particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0124] While some embodiments based on the general inventive concept of this disclosure have been illustrated and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of this disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display substrate, wherein, The display substrate comprises a cutout region, a buffer region located at the periphery of the cutout region, a display region located at the periphery of the buffer region, and a peripheral region located at the periphery of the display region, and the display substrate comprises: a substrate substrate; a light emitting device layer located on the substrate substrate, at least a part of the light emitting device layer is located in the display region, the light emitting device layer comprises a first electrode layer located on the substrate substrate, a light emitting functional layer located on the side of the first electrode layer away from the substrate substrate, and a second electrode layer located on the side of the light emitting functional layer away from the substrate substrate; a first barrier wall located on the substrate substrate, the first barrier wall is located in the buffer region and surrounds the cutout region; and an encapsulation layer located on the side of the light emitting device layer and the first barrier wall away from the substrate substrate; wherein the distance between the edge of the light emitting functional layer close to the cutout region and the cutout region is greater than or equal to half of the distance between the edge of the first barrier wall close to the cutout region and the cutout region. 2.The display substrate of claim 1, wherein, The edge of the light emitting functional layer close to one side of the cutout region is located on the side of the first barrier wall away from the cutout region. 3.The display substrate according to claim 1 or 2, wherein, The display substrate further comprises an isolation column layer located on the substrate substrate, the isolation column layer comprises a plurality of first isolation columns located in the display region, the light emitting functional layer comprises a plurality of light emitting functional parts, and at least one first isolation column is provided between two adjacent light emitting functional parts. 4.The display substrate of claim 3, wherein, The display substrate further comprises a pixel defining layer located between the first electrode layer and the light emitting functional layer, and the pixel defining layer has a plurality of pixel openings; and The first isolation columns are located on the side of the pixel defining layer away from the substrate substrate, the plurality of first isolation columns are connected to each other to form a grid-shaped isolation structure, and the grid-shaped isolation structure has a plurality of isolation openings. The plurality of pixel openings are respectively located in the plurality of isolation openings. 5.The display substrate of claim 4, wherein, The plurality of light emitting functional parts are respectively located in the plurality of isolation openings; and / or The first electrode layer comprises a plurality of first electrode parts, and the plurality of first electrode parts are respectively located in the plurality of isolation openings. 6.The display substrate of any one of claims 3-5, wherein, The isolation column layer further comprises a plurality of second isolation columns located in the buffer region, and at least a part of the encapsulation layer is located on the side of the plurality of second isolation columns away from the substrate substrate. 7.The display substrate of claim 6, wherein, At least a part of the encapsulation layer is directly connected to at least one second isolation column. 8.The display substrate according to claim 6 or 7, wherein The distribution density of the plurality of second isolation columns is greater than the distribution density of the plurality of first isolation columns. 9.The display substrate of any one of claims 1-8, wherein, The encapsulation layer comprises a first inorganic encapsulation layer, and the first inorganic encapsulation layer comprises a first part located in the display region and a second part located in the buffer region, and the thickness of the second part is less than the thickness of the first part. 10.The display substrate of any one of claims 1-9, wherein, The first barrier wall has at least one groove on the side wall close to the cutout region; and / or the first barrier wall has at least one groove on the side wall away from the cutout region. 11.The display substrate of claim 10, wherein, The at least one groove comprises at least one annular groove which is continuously arranged along a circumferential direction of the sidewall of the first barrier wall. 12.The display substrate of claim 10, wherein, The at least one groove comprises a first groove and a second groove, the first groove is located away from the substrate base plate from the side of the second groove; The first groove is discontinuously arranged along a circumferential direction of the sidewall of the first barrier wall, and the first groove comprises at least one first discontinuity; The second groove is discontinuously arranged along a circumferential direction of the sidewall of the first barrier wall, and the second groove comprises at least one second discontinuity; and The at least one first discontinuity and the at least one second discontinuity are alternately arranged along the circumferential direction of the sidewall of the first barrier wall. 13.The display substrate of claim 10, wherein, The at least one groove comprises a plurality of point-like grooves which are arranged in an array on the sidewall of the first barrier wall. 14.The display substrate of any one of claims 1-13, wherein, The display substrate further comprises a second barrier wall on the substrate base plate, the second barrier wall is located in the peripheral region and is arranged around the display region; The sidewall of the second barrier wall on the side close to the display region is provided with at least one groove; and / or the sidewall of the first barrier wall on the side away from the display region is provided with at least one groove.

15. A method for manufacturing a display substrate, wherein The display substrate comprises a cutout region, a buffer region located around the cutout region, a display region located around the buffer region, and a peripheral region located around the display region, and the preparation method comprises the following steps: Providing a substrate base plate; Forming a light-emitting device layer on the substrate base plate, at least a part of the light-emitting device layer is located in the display region, and the light-emitting device layer comprises a first electrode layer on the substrate base plate, a light-emitting functional layer on the side of the first electrode layer away from the substrate base plate, and a second electrode layer on the side of the light-emitting functional layer away from the substrate base plate; Forming a first barrier wall on the substrate base plate, the first barrier wall is located in the buffer region and is arranged around the cutout region, and the distance between the edge of the light-emitting functional layer close to the cutout region and the cutout region is greater than or equal to one half of the distance between the edge of the first barrier wall close to the cutout region and the cutout region; and Forming an encapsulation layer on the side of the light-emitting device layer and the first barrier wall away from the substrate base plate. The display substrate comprises a cutout region, a buffer region located around the cutout region, a display region located around the buffer region, and a peripheral region located around the display region, and the display substrate comprises:

16. A display substrate, wherein, A substrate base plate; A light-emitting device layer on the substrate base plate, the light-emitting device layer comprises a plurality of light-emitting devices arranged in an array in the display region; and A first barrier wall on the substrate base plate, the first barrier wall is located in the buffer region and is arranged around the cutout region; The sidewall of the first barrier wall on the side close to the cutout region is provided with at least one groove; and / or the sidewall of the first barrier wall on the side away from the cutout region is provided with at least one groove. The display device comprises the display substrate according to any one of claims 1-14 or claim 16.

17. A display device, wherein, ​

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