Upper mold, resin molding device, and method for producing resin molded article

Abstract

An upper mold according to the present invention is used together with a lower mold having a cavity to perform resin sealing of a substrate, and is provided with a fixing part to which the substrate is fixed, a film-pressing part that is disposed outside the fixing part in plan view and has a frame-like pressing surface for pressing a release film disposed in the lower mold outside of the cavity, and at least one clamper for clamping the substrate. Each clamper is provided with a support part that is disposed between the fixing part and the film-pressing part and supports the peripheral edge of the substrate, a movable part that is disposed outside the film-pressing part and can be pushed in from below, and an operation mechanism that operates the support part. The support part can move between a support position for supporting the peripheral edge of the substrate and a release position farther from the peripheral edge of the substrate than the support position on the film-pressing part side. The operation mechanism moves the support part from the support position to the release position when the movable part is pressed.

Description

Upper mold, resin molding device, and method for manufacturing resin molded product

[0001] The present invention relates to an upper mold, a resin molding device, and a method for manufacturing a resin molded product.

[0002] Patent Document 1 discloses a resin molding apparatus for producing a resin molded product by encapsulating a semiconductor substrate with a resin material. In this resin molding apparatus, a plurality of clampers for clamping the substrate are provided around a fixing portion that sucks the substrate in an upper mold. In addition, a film pressing portion for pressing a release film between the upper mold and the lower mold is provided outside the area surrounded by the plurality of clampers in a plan view.

[0003] The clamper is capable of swinging between a support position where it supports the periphery of the substrate sucked onto the fixing portion, and a release position where it disengages from the substrate sucked onto the fixing portion. The clamper is initially held in the support position by an E-ring. To secure the substrate to the fixing portion, the loader that transports the substrate presses the clamper to move it to the release position. This allows the substrate to be secured to the fixing portion.

[0004] Japanese Patent Application Laid-Open No. 2020-32687

[0005] However, in the resin molding device described in Patent Document 1, the film holding part is located outside the clamper, so the release film needs to be placed on the lower mold up to a position corresponding to the film holding part, which poses a problem of the release film becoming large.

[0006] The present invention has been made to solve this problem, and aims to provide a resin molding apparatus, a resin molded product manufacturing apparatus, and a resin molded product manufacturing method that can reduce the size of the release film.

[0007] The upper mold of the present invention is an upper mold used together with a lower mold having a cavity to perform resin sealing on a substrate, and comprises: a fixed portion to which the substrate is fixed; a film holding portion that is arranged outside the fixed portion in a planar view and has a frame-shaped pressing surface that presses on a portion of a release film arranged on the lower mold outside the cavity; and at least one clamper configured to clamp the substrate, wherein each clamper comprises: a support portion that is arranged between the fixed portion and the film holding portion and configured to support the peripheral portion of the substrate; a movable portion that is arranged outside the film holding portion and configured to be able to be pressed from below; and an operating mechanism that operates the support portion, wherein the support portion is configured to be movable between a support position that supports the peripheral portion of the substrate and a release position that is closer to the film holding portion than the support position and away from the peripheral portion of the substrate, and the operating mechanism is configured to move the support portion from the support position to the release position when the movable portion is pressed.

[0008] The resin molding apparatus according to the present invention includes the above-described upper mold and a lower mold having a cavity and configured to seal the substrate with resin between the upper mold and the lower mold.

[0009] The method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the above-mentioned resin molding apparatus, and includes the steps of supplying the release film and the resin material placed on the resin material to the cavity of the lower mold, fixing the substrate to a fixing portion of the upper mold, and clamping the upper mold and the lower mold to manufacture a resin molded product in which the substrate is sealed with the resin material.

[0010] According to the present invention, the release film can be made smaller.

[0011] 1 is a schematic diagram showing an example of a resin molding system; FIG. 2 is a cross-sectional view of a resin molding apparatus; FIG. 3 is a plan view of an upper mold as viewed from below; FIG. 4 is an enlarged view of FIG. 2 showing a clamper; FIG. 5 is a perspective view of the clamper as viewed from below; FIG. 6 is a cross-sectional view showing the operation of a clamper; FIG. 7 is a cross-sectional view showing the operation of a resin molding apparatus; FIG. 8 is a cross-sectional view showing the operation of a resin molding apparatus; FIG. 9 is a cross-sectional view showing the operation of a resin molding apparatus; FIG. 10 is a cross-sectional view showing the operation of a resin molding apparatus; FIG. 11 is a cross-sectional view showing the operation of a resin molding apparatus; FIG. 12 is a cross-sectional view showing the operation of a resin molding apparatus; FIG. 13 is a cross-sectional view showing the operation of a resin molding apparatus; FIG. 14 is a cross-sectional view showing a comparison with other examples of a clamper;

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings.

[0013] In the following, first, an overview of a resin molding system 100 including the resin molding device 10 will be described, and then the operation of the resin molding device 10 and the resin molding system 100 will be described.

[0014] <1. Resin Molding System> FIG. 1 is a schematic diagram showing an example of a resin molding system. The following explanation may be made according to the directions (X, Y) shown in FIG. 1. The X and Y arrows in FIG. 1 indicate "+" and "-" in the opposite direction. As shown in FIG. 1, this resin molding system 100 includes a substrate supply / storage module 71, three molding modules 72A-72C, and a material supply module 73. A substrate transport mechanism 713 transports pre-molded substrates 5 between the substrate supply / storage module 71 and the three molding modules 72A-72C. The substrate transport mechanism 713 is equipped with a transport device 8, which will be described later. A material transport mechanism 734 transports release films 6 and resin materials 9 between the material supply module 73 and the three molding modules 72A-72C.

[0015] The substrate supply / storage module 71 has a pre-molded substrate supply section 711 in which pre-molded substrates 5 are stored, a substrate placement section 712 on which pre-molded substrates 5 are placed, and a post-molded substrate storage section 714 in which post-molded substrates (resin molded products) are stored.

[0016] Each of the molding modules 72A to 72C is provided with a resin molding device 10, which will be described later. Each of the resin molding devices 10 is provided with an upper mold 1 and a lower mold 2.

[0017] The material supply module 73 has an XY table 731, a resin material supply mechanism 732, a resin material containing frame 733, and a film supply mechanism 736. The resin material containing frame 733 is arranged on the XY table 731, and the resin material 90 is supplied from the resin material supply mechanism 732 to the resin material containing frame 733. In addition, the film supply mechanism 736 contains a release film 6.

[0018] The resin material 90 may be a powdered or granular resin, or may be, for example, a sheet-like resin, a liquid resin tablet-like resin, a semi-solid fluid resin, etc. The release film 6 is made of a resin material having properties such as heat resistance, releasability, flexibility, and extensibility, and examples of such materials include PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride.

[0019] The operation of each of the modules 71, 72A to 72C, and 73 will be described later.

[0020] 2. Resin Molding Apparatus Fig. 2 is a cross-sectional view of a resin molding apparatus according to this embodiment. This resin molding apparatus 10 is configured to manufacture a resin molded product by using a so-called compression molding method.

[0021] 2, this resin molding apparatus 10 has an upper mold 1, a lower mold 2, and a control unit 3. The upper mold 1 is configured to hold a substrate 5. The substrate 5, upper mold 1, lower mold 2, and control unit 3 will be described in detail below.

[0022] 2-1. Substrate As shown in FIG. 2, the configuration of the substrate 5 before molding is not particularly limited, but for example, a plurality of electronic components 51 configured with semiconductor chips such as semiconductor integrated circuits and light-emitting elements such as LEDs are arranged on the substrate 5. The shape of the substrate 5 is not particularly limited, but for example, it is rectangular or circular in plan view. Furthermore, the substrate 5 is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, or a printed wiring board, and may include a carrier of a plate-like member used in FO-WLP (Fan Out Wafer Level Package) or FO-PLP (Fan Out Panel Level Package). In this embodiment, the substrate 5 is rectangular in plan view.

[0023] 2, the lower mold 2 has a base 21 that is rectangular in plan view, a bottom member 22 that is rectangular in plan view and fixed to the upper surface of the base 21, and a side member 23 that is formed in a frame shape so as to surround the periphery of the bottom member 22. The upper surface of the side member 23 is located higher than the upper surface of the bottom member 22. As a result, the upper surface of the bottom member 22 forms the bottom surface of the cavity 24 of the lower mold 2, and the inner wall surfaces of the side member 23 form the side surfaces of the cavity 24. In addition, a heater (not shown) is built into the lower mold 2 or a holder (not shown) that holds the lower mold 2.

[0024] The side member 23 is fixed to the base 21 via an elastic member 25 such as a spring. Therefore, as will be described later, when the upper mold 1 is clamped, the side member 23 can move downward. In addition, recesses 231, 232 are formed in the upper surface of the side member 23 along the circumferential direction, and each recess 231, 232 is connected to a suction flow path (not shown), which is connected to a vacuum pump (not shown). Therefore, as will be described later, the release film 6 arranged on the upper surface of the side member 23 is held on the upper surface of the side member 23 by suction by the vacuum pump.

[0025] A small gap is formed between the bottom member 22 and the side member 23, and this gap is connected to a suction passage (not shown) formed inside the bottom member 22 and the base 21. This suction passage is also connected to the vacuum pump described above. When suction is performed by the vacuum pump, the release film 6 placed in the cavity 24 is sucked in and adheres to the bottom and side surfaces of the cavity 24.

[0026] An outer edge member 26 formed in a frame shape is arranged outside the side surface member 23 with a gap therebetween so as to surround the side surface member 23. The outer edge member 26 is arranged on the base 21 via an elastically deformable gasket 27.

[0027] A clamping mechanism (not shown) is provided below the lower mold 2. The clamping mechanism is a mechanism for raising and lowering the lower mold 2 relative to the upper mold 1 in order to clamp and open the molds using the upper mold 1 and lower mold 2. The clamping mechanism is not particularly limited, and can be realized by a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, or the like.

[0028] <2-3. Upper Mold> Next, the upper mold 1 will be described with reference to Fig. 3. Fig. 3 is a plan view of the upper mold as seen from below.

[0029] 2 and 3, the upper mold 1 has a base 11 that is rectangular in plan view, a fixing portion 12 that is rectangular in plan view and provided on the underside of the base 11, a film holding portion 13 that is formed in a frame shape so as to surround the outside of the fixing portion 12 in plan view, and an outer edge member 14 that is also formed in a frame shape so as to surround the film holding portion 13. The upper mold 1 also has a plurality of clampers 4 (four in this embodiment) for clamping the substrate 5.

[0030] A plurality of air intake ports (not shown) are formed on the underside of the fixing part 12, and these suction ports are connected to a vacuum pump (not shown). As a result, the substrate 5 is sucked and fixed to the underside of the fixing part 12. In addition, a heater (not shown) is built into the upper mold 1 or a holder (not shown) that holds the upper mold 1.

[0031] Film holding portion 13 is disposed with a gap from the periphery of fixed portion 12. The lower surface (pressing surface) of film holding portion 13 faces side member 23 of lower mold 2, and is configured so that when upper mold 1 and lower mold 2 are clamped together, the lower surface of film holding portion 13 comes into contact with the upper surface of side member 23 via release film 6. In other words, release film 6 is sandwiched between film holding portion 13 and side member 23 (see FIG. 12 ).

[0032] The film retaining portion 13 is fixed to the base portion 11 via an elastic member 15 such as a spring. Therefore, when the film retaining portion 13 is pressed by the lower mold 2 during mold clamping as described below, it can move upward.

[0033] The outer edge member 14 is disposed on the base 11 via an elastically deformable gasket 17, and a gap is provided between the outer edge member 14 and the film holding portion 13. In addition, an elastically deformable gasket 16 is attached to the lower surface of the outer edge member 14. The lower surface of the outer edge member 14 faces the outer edge member 26 of the lower mold 2, and is configured so that when the molds are clamped, the lower surface of the outer edge member 14 comes into contact with the upper surface of the outer edge member 26 of the lower mold 2 via the gasket 16. As a result, a sealed space is formed by the outer edge member 14 and the outer edge member 26, and the upper mold 1 and the lower mold 2 are disposed within this sealed space.

[0034] <2-4. Clamp> Next, the clamper 4 will be described with reference to Figures 4 and 5. Figure 4 is an enlarged view of Figure 2 showing the clamper, and Figure 5 is a perspective view of the clamper as seen from below.

[0035] 3, four notches 131 are formed on the outer edge of the film retaining portion 13, and a portion of the clamper 4 is housed in these notches 131. In addition, the elastic member 15 that supports the film retaining portion 13 is provided in a position that does not overlap with the clamper 4.

[0036] 4 and 5, the clamper 4 has a support portion 41 that supports the periphery of the substrate 5 and a movable portion 42 that is movable in the vertical direction, which are connected by a link mechanism. Note that Fig. 4 shows an enlarged view of one clamper 4 in the left half of the resin molding apparatus 1 in Fig. 2. One clamper 4 will be described in detail below.

[0037] A first bracket 18 is provided on the outer edge of the fixed portion 12. The first bracket 18 is disposed between the fixed portion 12 and the elastic member 15, and supports the support portion 41. The support portion 41 has a hanging portion 411 extending in the vertical direction, a claw portion 412 extending from the lower end of the hanging portion 411 toward the fixed portion 12, and a first extending portion 413 extending from the upper end of the hanging portion 411 toward the outer edge member 14. The hanging portion 411 extends in the vertical direction in the gap between the film holding portion 13 and the fixed portion 12. A first rotation shaft 414 is provided on the first extending portion 413 near the connection portion with the hanging portion 411, and the support portion 41 and the first bracket 18 are fixed via this first rotation shaft 414. This allows the support portion 41 to swing around the rotation shaft 414. 5, for ease of explanation, part of the first bracket 18 is omitted, but in reality, the first bracket 18 supports both ends of the first rotating shaft 414. Meanwhile, a second rotating shaft 415 is provided at the end of the first extending portion 413 on the outer edge member 14 side.

[0038] A second bracket 19 is provided between the elastic member 15 and the outer edge member 14, and a movable portion 42 is attached to the second bracket 19 via an elastic member 191. The movable portion 42 has a main body portion 421 attached to the elastic member and a second extension portion 422 extending from near the upper end of the main body portion 421 toward the fixed portion 12. The main body portion 421 is configured to be exposed downward from the notch portion 131 of the film holding portion 13 described above. This allows the main body portion 421 to be pushed in from below by the conveying device 8 (see FIG. 8 ), as will be described later. When pushed in, the elastic member 191 contracts, allowing the main body portion 421 to move upward. A horizontally extending elongated hole 423 is formed in the second extension portion 422, and the second rotation shaft 415 of the support portion 41 fits into this elongated hole 423. In this way, the support part 41 and the movable part 42 constitute a link mechanism by having the first rotation shaft 414, the second rotation shaft 415, and the long hole 423. The second extension part 422 supports both ends of the second rotation shaft 415.

[0039] Next, the operation of the clamper 4 will be described with reference to Fig. 6. First, in the state shown in Fig. 5, the claws 412 of the support parts 41 are positioned so as to cover the vicinity of the outer edge of the fixed part 12, so that the outer edge of the substrate 5 sucked onto the fixed part 12 can be supported from below. Therefore, even if the suction by the vacuum pump is stopped, the substrate 5 is prevented from falling from the fixed part 12. Hereinafter, the position of the support parts 41 shown in Fig. 5 will be referred to as the support position.

[0040] When the movable part 42 is pressed from below in the state shown in FIG. 5 , the movable part 42 is pushed upward as shown in FIG. 6 . Accordingly, the second extension part 422 pushes the second rotation shaft 415 of the support part 41 upward. As a result, the support part 41 swings around the first rotation shaft 414, and the claw part 412 moves outward from the outer edge of the fixed part 12. At this time, because the second rotation shaft 415 of the support part 41 is fitted into the elongated hole 423 of the movable part 42, the second rotation shaft 415 moves within the elongated hole 423 in response to the upward movement of the movable part 42, thereby allowing the support part 41 to swing smoothly. Through the above operation, the contact between the support part 41 and the substrate 5 is released, and the substrate 5 can be removed from the fixed part 12. Hereinafter, the position of the support part 41 shown in FIG. 6 will be referred to as the release position.

[0041] <2-5. Control Unit> The control unit 3 is configured to control the entire resin molding system 100. The control unit 3 controls the operation of each part in each module 71, 72A to 72C, and 73, the operation of the transport mechanisms 713 and 734 between the modules, etc. The control unit 3 includes a hardware processor such as a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory), and is configured to execute information processing based on programs and various data. The control unit 3 may be located anywhere within the resin molding system 100, and may be configured, for example, by multiple computers, each separated for each module.

[0042] 3. Operation of the Resin Molding System The operation of the resin molding system will be described below with reference to Fig. 1. First, in the substrate supply / storage module 71, the pre-molded substrate 5 is sent from the pre-molded substrate supply section 711 to the substrate placement section 712. Next, the substrate transport mechanism 713 is moved in the -Y direction from the predetermined position S1 to receive the pre-molded substrate 5 from the substrate placement section 712. Thereafter, the substrate transport mechanism 713 is returned to the predetermined position S1.

[0043] Next, of molding modules 72A to 72C, for example, substrate transport mechanism 713 holding pre-molded substrate 5 is moved in the +X direction to predetermined position P1 in molding module 72B. Subsequently, in molding module 42B, substrate transport mechanism 713 is moved in the -Y direction to fix pre-molded substrate 5 to upper mold 1 of resin molding device 10. Thereafter, substrate transport mechanism 713 is returned to predetermined position S1 in substrate supply / storage module 71.

[0044] Next, a release film 6 is supplied from the film supply mechanism 736 to the XY table 731, and the XY table 731 is moved in the -Y direction from predetermined position T1, and a resin material containing frame 733 is placed on the XY table 731. Subsequently, the XY table 731 on which the release film 6 and resin material containing frame 733 are placed is moved in the +X direction to be positioned below the resin material supply mechanism 732, and the XY table 731 is further moved in the X and Y directions, thereby supplying a predetermined amount of resin material 90 from the resin material supply mechanism 732 into the resin material containing frame 733. Thereafter, the XY table 731 on which the release film 6 and resin material containing frame 733 are placed is returned to predetermined position T1.

[0045] Next, the material conveying mechanism 734 is moved in the -Y direction from the predetermined position M1 to receive the release film 6 and resin material containing frame 733 placed on the XY table 731, and is returned to the predetermined position M1. Next, the material conveying mechanism 734 is moved in the -X direction to a predetermined position P1 in the molding module 72B. Next, in the molding module 72B, the material conveying mechanism 734 is moved in the -Y direction and stopped at a predetermined position C1 above the lower mold 2. Following this, the material conveying mechanism 734 is lowered, and the release film 6 and the resin material 90 thereon are supplied to the lower mold 2. After the supply is completed, the material conveying mechanism 734 is returned to the predetermined position M1 together with the resin material containing frame 733. After that, the resin material containing frame 733 is cleaned and returned to its original position.

[0046] 4. Operation of the Resin Molding Apparatus Next, the operation of the resin molding apparatus will be described with reference to Figures 7 to 13. First, as shown in Figure 7, the substrate 5 is transported below the upper mold 1 by the transport device 8. The transport device 8 includes a plate-shaped base 81, a support table 82 arranged on the upper surface of the base 81, and a pressing unit 83 arranged on the upper surface of the base 81. The substrate 5 is supported on the upper surface of the support table 82. The pressing unit 83 is arranged at a position corresponding to the movable unit 42 of the clamper 4, and presses the main body 421 of the movable unit 42 from below.

[0047] 8, when the conveying device 8 is moved upward from the position shown in FIG. 7 and the pressing portion 83 pushes up the movable portion 42, the support portion 41 moves to the release position. This allows the substrate 5 to be attracted to the fixing portion 12 of the upper mold 1.

[0048] Next, as shown in Fig. 9, the conveying device 8 is retracted from below the upper mold 1. At the same time, as shown in Fig. 10, the release film 6 on which the resin material 90 is placed is adsorbed onto the side member 23 of the lower mold 2.

[0049] 11 , the release film 6 is sucked into the cavity 24. As a result, the release film 6 is adsorbed onto the side surfaces (side surfaces of the side members) and bottom surface (top surface of the bottom member) of the cavity 24. The resin material 90 is also placed in the cavity 24 together with the release film 6. As a result, the resin material 90 is heated by the heater and becomes a molten resin 91.

[0050] Subsequently, as shown in Fig. 12, the lower mold 2 is moved toward the upper mold 1, and the molds are clamped. At this time, the upper mold 1 and the lower mold 2 are heated by heaters, so that the molten resin 91 hardens and the substrate 5 is sealed with the resin. Next, the lower mold 2 is separated from the upper mold 1 to open the molds, and as shown in Fig. 13, a resin molded product 50 is completed in which the substrate 5 is sealed with the resin 9. Thereafter, the conveying device 8 pushes up the movable part 42, and the resin molded product 50 is placed on the conveying device 8 and conveyed. By repeating the above process, the resin molded products 50 are mass-produced. Note that the side member 23 of the lower mold 2 has a recess (recess) formed therein to accommodate the claws 412 of the clamper 4.

[0051] 5. Features According to the resin molding device of this embodiment, the following effects can be obtained.

[0052] (1) In the clamper 4, the support portion 41 that supports the substrate 5 is disposed near the fixed portion 12, and the movable portion 42 that moves the support portion 41 is disposed outside the film holding portion 13. This allows the film holding portion 13 to be disposed closer to the fixed portion 12 than in the conventional example, so that the position where the film holding portion 13 holds the release film 6 between itself and the lower mold 2 can be located near the cavity 24. This allows the width of the release film 6 (for example, the length in the left-right direction in FIG. 13 ) to be reduced.

[0053] (2) The application of a link mechanism to the clamper 4 allows the stroke of the movable part 42 to be reduced. For example, as shown in FIG. 14B, if a mechanism is adopted in which the first extension part 413 of the support part 41 is directly pushed up by the main body part 421 of the movable part 42 without using a link mechanism, the second rotation shaft 415 needs to be pushed up to L1 to move the support part 41 to the release position. L1 is higher than the position L2 of the second rotation shaft 415 when a link mechanism is used as in this embodiment 10A. Therefore, the upper mold 1 needs a space large enough to accommodate the end of the support part 41 on the side of the second rotation shaft 415.

[0054] To push the second rotation shaft 415 up to L1, it is necessary to push the main body 421 of the movable part 42 up to L3. That is, it is necessary to push the movable part 42 up to a position higher than the pushed-up position L4 of the movable part 42 in this embodiment 10A. Therefore, by using a link mechanism as in this embodiment 10A, it is possible to reduce the stroke of the movable part 42 for moving the support part 41 to the release position.

[0055] (3) For example, if the movable part 42 is oscillated by the pressing part 83 of the conveying device 8 as in the conventional example, the pressing part 83 of the conveying device 8 contacts the movable part 42 at an angle, which is likely to cause wear. In contrast, in this embodiment, a link mechanism is applied to the clamper 4, so that the support part 41 can be moved to the release position by pressing the movable part 42 vertically upward. Therefore, wear can be reduced compared to the conventional example.

[0056] (4) Both ends of the first and second rotary shafts 414, 415 of the clamper 4 are supported, so there is no need to use small parts such as E-rings that are used in conventional examples and that may fall off.

[0057] 6. Modifications Although one embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. Furthermore, the gist of the following modifications can be combined as appropriate.

[0058] (1) In the clamper 4 of the above embodiment, the support portion 41 and the movable portion 42 are connected by a link mechanism, but this is not limited to this, and any operating mechanism may be used as long as the support portion 41 is configured to move from the support position to the release position when the movable portion 42 is pushed up by the transport device 8. For example, although the clamper shown in 10B of Figure 14 has the above-mentioned problems, it has the advantage of being able to position the film holding portion 13 near the cavity 24, and therefore such a mechanism may be used.

[0059] In the above embodiment, the notch 131 is formed on the outer edge of the film holding portion 13 and the movable portion 42 of the clamper 4 is housed in this notch 131, but this is not limiting. For example, the movable portion 42 can be disposed on the outside of the film holding portion 13 without forming a notch.

[0060] (2) The configuration of the upper mold 1 can be changed as needed with respect to the base 11, the outer edge member 14, and the configuration for sucking the substrate 5. In addition, the position where the clamper 4 is provided and the number of clampers 4 can be changed as needed.

[0061] (3) The configuration of the lower mold 2 is not particularly limited and can be changed as appropriate. That is, it is sufficient if at least a member corresponding to the side member 23 for sandwiching the peripheral edge of the release film 6 between the cavity 24 and the film pressing portion 13 is provided. Therefore, for example, the configuration for sucking the release film 6 can be changed as appropriate.

[0062] (Supplementary Note 1) An upper mold used together with a lower mold having a cavity to resin seal a substrate, comprising: a fixing portion to which the substrate is fixed; a film holding portion that is arranged outside the fixing portion in a plan view and has a frame-shaped pressing surface that presses a portion of a release film arranged on the lower mold outside the cavity; and at least one clamper configured to clamp the substrate, wherein each of the clampers comprises: a support portion that is arranged between the fixing portion and the film holding portion and configured to support a peripheral portion of the substrate; a movable portion that is arranged outside the film holding portion and configured to be able to be pressed from below; and an operating mechanism that operates the support portion, wherein the support portion is configured to be movable between a support position that supports the peripheral portion of the substrate and a release position that is closer to the film holding portion than the support position and away from the peripheral portion of the substrate, and the operating mechanism is configured to move the support portion from the support position to the release position when the movable portion is pressed.

[0063] According to this configuration, the clamper has a support portion that supports the substrate and a movable portion that can be pressed, and further has an operating mechanism that moves the support portion when the movable portion is pressed. The movable portion is located outside the film holding portion. That is, in the present invention, the support portion and the movable portion are located separately, sandwiched between them by the film holding portion. Therefore, compared to conventional examples in which the support portion and the movable portion are integrally formed, for example, the film holding portion can be located closer to the fixed portion by the amount of the movable portion, and the position where the film holding portion holds the release film can be located closer to the cavity of the lower mold. This allows the width of the release film to be reduced.

[0064] (Supplementary Note 2) The upper mold according to Supplementary Note 1, wherein the support portion has a rotation axis and is configured to be positioned at either the support position or the release position by swinging around the rotation axis.

[0065] According to this configuration, the support portion can be placed in either the support position or the release position with a simple configuration.

[0066] (Appendix 3) The upper mold described in Appendix 2, wherein the operating mechanism is configured by a link mechanism having a first extension portion extending from the support portion, and a second extension portion extending from the movable portion and swingably connected to the first extension portion.

[0067] With this configuration, the clamper operating mechanism has a link mechanism that includes the swinging of the support part described above, so the pushing motion of the movable part can be converted into swinging of the support part without increasing the operating range of the support part and the movable part. Therefore, for example, the pushing stroke of the movable part can be reduced, which prevents the space for the clamper formed in the upper mold from becoming too large.

[0068] (Supplementary Note 4) The upper mold according to any one of Supplementary Notes 1 to 3, wherein a plurality of notches are formed in an outer edge of the film holding portion, and the movable portion is housed in the notches.

[0069] With this configuration, the movable part is accommodated in the notch formed in the outer edge of the film holding part, so that the movable part is not positioned outside the film holding part in a plan view, which allows the size of the upper mold to be small in a plan view.

[0070] (Supplementary Note 5) The upper mold according to any one of Supplementary Notes 1 to 4, wherein the movable part is configured to be biased downward by an elastic member in an initial state and to be pushed from the initial state against the elastic force of the elastic member.

[0071] With this configuration, when no pushing force is applied to the movable part, the movable part is biased downward by the elastic member, so that the movable part can be maintained in its initial state. Therefore, when the movable part is pushed in with the pushing member, the positioning of the pushing member can be easily determined.

[0072] (Supplementary Note 6) A resin molding device comprising: an upper mold according to any one of Supplementary Notes 1 to 5; and a lower mold having a cavity, for resin-sealing the substrate between the upper mold and the lower mold.

[0073] According to this resin molding device, the upper mold can be made smaller, and the lower mold placed relative to the upper mold can also be made smaller, which results in a smaller width of the release film used, as described above.

[0074] (Appendix 7) A method for manufacturing a resin molded product using the resin molding apparatus described in Appendix 6, comprising the steps of: supplying the release film and the resin material placed on the release film to the cavity of the lower mold; fixing the substrate to a fixing portion of the upper mold; and clamping the upper mold and the lower mold to manufacture a resin molded product in which the substrate is sealed with the resin material.

[0075] According to this method for producing a resin molded product, as described above, the width of the release film used can be reduced.

[0076] REFERENCE SIGNS 1: Upper mold 2: Lower mold 4: Clamp 5: Substrate 6: Release film 9: Resin material 10: Resin molding device 11: Base 12: Fixed portion 13: Film holding portion 21: Base 24: Cavity 41: Support portion 42: Movable portion 50: Resin molded product 81: Base 90: Resin material 311: Base 413: First extension portion 414: Rotation axis 422: Second extension portion

Claims

1. An upper mold used together with a lower mold having a cavity to resin seal a substrate, comprising: a fixing portion to which the substrate is fixed; a film holding portion that is arranged outside the fixing portion in a planar view and has a frame-shaped pressing surface that presses against a portion of a release film arranged on the lower mold outside the cavity; and at least one clamper configured to clamp the substrate, wherein each of the clampers comprises: a support portion that is arranged between the fixing portion and the film holding portion and configured to support the peripheral portion of the substrate; a movable portion that is arranged outside the film holding portion and configured to be able to be pressed from below; and an operating mechanism that operates the support portion, wherein the support portion is configured to be movable between a support position that supports the peripheral portion of the substrate and a release position that is closer to the film holding portion than the support position and away from the peripheral portion of the substrate, and the operating mechanism is configured to move the support portion from the support position to the release position when the movable portion is pressed.

2. The upper mold according to claim 1, wherein the support part has a rotation axis and is configured to be positioned at either the support position or the release position by swinging around the rotation axis.

3. The upper mold according to claim 2, wherein the operating mechanism is constituted by a link mechanism having a first extension portion extending from the support portion, and a second extension portion extending from the movable portion and connected to the first extension portion so as to be swingable relative to the first extension portion.

4. An upper mold according to any one of claims 1 to 3, wherein a plurality of notches are formed on the outer edge of the film holding portion, and the movable portion is housed in the notches.

5. An upper mold according to any one of claims 1 to 4, wherein the movable part is configured to be biased downward by an elastic member in an initial state and to be pushed in from the initial state against the elastic force of the elastic member.

6. A resin molding device comprising: an upper mold according to any one of claims 1 to 5; and a lower mold having a cavity and for sealing the substrate with resin between the upper mold and the lower mold.

7. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 6, comprising the steps of: supplying the release film and the resin material placed on the release film to the cavity of the lower mold; fixing the substrate to a fixing portion of the upper mold; and clamping the upper mold and the lower mold to manufacture a resin molded product in which the substrate is sealed with the resin material.

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