Resin molding device and method for manufacturing resin molded article

Abstract

The present invention efficiently stores a release film used in a plurality of molding dies in a storage box, and comprises: a plurality of film support bodies 3a-3c that support both side parts of a used release film F; a film conveyance mechanism 20 that conveys the used release film F from a plurality of molding dies 14a-14c to the plurality of film support bodies 3a-3c; a film dropping mechanism 4 that presses downward between both side parts of the used release film F supported by the plurality of film support bodies 3a-3c to cause the used release film F to drop from the film support bodies 3a-3c; and a storage box 5 that is disposed below the plurality of film support bodies 3a-3c and stores the used release film F dropped by the film dropping mechanism 4.

Description

Resin molding device and method for manufacturing resin molded product

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

[0002] As disclosed in Patent Document 1, a conventional resin sealing apparatus is considered to be provided with a recovery mechanism that stores the release film used in resin sealing in a recovery container.

[0003] This recovery mechanism has a plate portion capable of adsorbing the used release film, an arm portion supporting the plate portion, and a drive portion connected to the arm portion and capable of driving the arm portion and the entire plate portion up and down. The plate portion of the recovery mechanism is configured to receive the used release film from the substrate transport portion that holds the used release film, and then invert the plate portion up and down to store it in a recovery container.

[0004] Japanese Patent Application Laid-Open No. 2008-302610

[0005] However, some resin molding devices have multiple molds arranged one above the other, and in these resin molding devices, a release film is placed on each mold. In a resin molding device configured to include the above-mentioned recovery mechanism, it is difficult to efficiently recover used release films from each mold.

[0006] Therefore, the present invention has been made to solve the above problems, and its main object is to efficiently store release films used in multiple molding dies in a storage box.

[0007] That is, the resin molding apparatus of the present invention is a resin molding apparatus having a plurality of molding dies arranged above and below, and which places a release film on the plurality of molding dies to perform resin molding, and is characterized by comprising a plurality of film support bodies arranged above and below and which support both side portions of the used release film, a film transport mechanism which transports the used release film from the plurality of molding dies to the plurality of film support bodies, a film detachment mechanism which pushes downward the portion between the both side portions of the used release film supported by the plurality of film support bodies, thereby causing the used release film to fall off from the film support bodies, and a storage box which is arranged below the plurality of film support bodies and which stores the used release film that has fallen off by the film detachment mechanism.

[0008] According to the present invention configured in this manner, release films used in a plurality of molding dies can be efficiently stored in the storage box.

[0009] FIG. 1 is a schematic diagram showing the configuration of a resin molding apparatus according to an embodiment of the present invention. FIG. 1 is a schematic diagram showing (a) a front view and (b) a side view of a resin molding module according to the embodiment. FIG. 2 is a schematic diagram showing the configuration of a film recovery section of a resin material transport mechanism (film transport mechanism) according to the embodiment. FIG. 3 is a schematic diagram showing the configuration of a film support, a film dropping mechanism, and a storage box according to the embodiment. FIG. 4 is a schematic diagram showing (a) a plan view, (b) a front view, (c) a side view, and (d) an X-X line cross-sectional view of the configuration of a film support according to the embodiment. FIG. 5 is a schematic diagram showing the configuration of a distance changing mechanism according to the embodiment. FIG. 6 is a schematic diagram showing a state in which the distance changing mechanism according to the embodiment switches between a first state and a second state. FIG. 7 is a schematic diagram showing (a) a flat-plate-shaped push-down portion and (b) a rod-shaped push-down portion of a push-down member of a film dropping mechanism according to the embodiment. FIG. 8 is a schematic diagram showing (a) a state before a release film is placed and (b) a state after a release film is placed in film transport to a film support according to the embodiment. 1C is a schematic diagram showing a first state of the film support supporting the release film, and FIG. 1D is a schematic diagram showing a second state of the film support supporting the release film, and FIG. 1E is a schematic diagram showing a state in which the pressing member of the film dropping mechanism has rotated to the pressing position, and FIG. 1F is a schematic diagram showing a state in which the film has been stored in the storage box by the pressing member, in the same embodiment.

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] A resin molding apparatus according to a first aspect of the present invention has a plurality of molding dies arranged vertically, and a resin molding apparatus in which a release film is placed on the plurality of molding dies to perform resin molding, the apparatus comprising: a plurality of film support members arranged vertically and supporting both side portions of a used release film; a film transport mechanism that transports the used release film from the plurality of molding dies to the plurality of film support members; a film detachment mechanism that pushes downward a portion between the both side portions of the used release film supported by the plurality of film support members to drop the used release film from the film support members; and a storage box that is arranged below the plurality of film support members and stores the used release film that has been dropped by the film detachment mechanism. With this resin molding apparatus, after resin molding, the used release film is transported to the plurality of film support members by the film transport mechanism, and the used release film supported by the plurality of film support members is dropped by the film detachment mechanism and stored in the storage box, so that the release film used in the plurality of molding dies can be efficiently stored in the storage box.

[0012] In addition to the configuration of the first technology described above, the resin molding apparatus of the second technology according to the present invention further includes a spacing change mechanism that narrows the spacing between the multiple film support members while the multiple film support members are supporting the used release film, and the film dropping mechanism preferably drops the used release film from the film support members after the spacing change mechanism narrows the spacing between the multiple film support members. With this configuration, the used release film is dropped after the spacing between the multiple film support members is narrowed, so that the release film supported by each of the multiple film support members can be reliably stored in the storage box. Furthermore, by narrowing the spacing between the multiple film support members, the range of the dropping operation by the film dropping mechanism can be made compact, allowing the film dropping mechanism to be made smaller.

[0013] In addition to the configuration of the above-described technology 2, the resin molding device of technology 3 according to the present invention is preferably configured such that the interval change mechanism narrows the intervals between the plurality of film support bodies and moves the plurality of film support bodies closer to the storage box. With this configuration, the plurality of film support bodies with narrowed intervals move closer to the storage box, so that the used release film dropped by the film dropping mechanism can be reliably stored in the storage box.

[0014] In addition to the configuration of the above-described technology 2 or 3, the resin molding device of technology 4 according to the present invention preferably includes an upper and lower guide unit that guides the upper and lower movement of the plurality of film supports, a support drive unit that moves the uppermost film support of the plurality of film supports up and down, and a connecting unit that connects two vertically adjacent film supports so that the distance between the vertically adjacent film supports can be changed as the uppermost film support moves up and down. With this configuration, the configuration can be simpler than a configuration in which the plurality of film supports are moved separately, and the distance changing mechanism can be made smaller.

[0015] A resin molding apparatus according to a fifth aspect of the present invention has the configuration of any one of the above-described second to fourth aspects, and further preferably, the spacing change mechanism changes the spacing between the plurality of film support members between a first state corresponding to the spacing between the plurality of molding dies and a second state in which the spacing is narrower than the spacing in the first state and the used release film is dropped by the film dropping mechanism. With this configuration, by setting the spacing between the plurality of film support members to the first state by the spacing change mechanism, the film transport mechanism can transport the used release film to the plurality of film support members while it is removed from the plurality of molding dies.

[0016] As a specific embodiment of the film support, the resin molding device of Technology 6 according to the present invention, in addition to the configuration of any one of Technologies 1 to 5 above, desirably has a first support portion and a second support portion that support both sides of the release film, and a passage portion formed between the first support portion and the second support portion and through which the film detachment mechanism passes from top to bottom.

[0017] As a specific embodiment of the film dropping mechanism, the resin molding apparatus of Technology 7 according to the present invention preferably includes, in addition to the configuration of any one of Technologies 1 to 6 above, a press-down member that presses downward the used release film supported by the film support, and a press-down member drive unit that moves the press-down member up and down relative to the film support. In this configuration, the press-down member presses downward between both sides of the release film supported by the film support while passing through the passage portion of the film support, thereby dropping the used release film from the film support. Furthermore, as the press-down member presses downward between both sides of the release film, the release film experiences air resistance and moves to the storage box while remaining in contact with the press-down member.

[0018] In addition to the configuration of the above-described technology 7, the resin molding device of technology 8 according to the present invention is preferably configured such that the press-down member is rotatable with respect to the press-down member drive unit between a press-down position where the press-down member presses down the used release film supported by the film support, and a retracted position where the press-down member is retracted from the press-down position and assumes a posture aligned with the vertical direction. With this configuration, the press-down member can be moved from the press-down position to the retracted position where the press-down member is aligned with the vertical direction, thereby not interfering with the conveyance of the used release film to the film support by the film conveyance mechanism.

[0019] In addition to the configuration of Technology 7 or 8, the resin molding device of Technology 9 according to the present invention preferably has two rod-shaped press-down portions that press down the portion between the both side portions of the used release film, and the positions of each of the two press-down portions are changeable. In the resin molding device, when the size of the object to be molded is changed by changing the molding mold, the size of the release film also changes. In the resin molding device of Technology 9, the positions of each of the two press-down portions are changeable, so that the positions of the two press-down portions can be changed to appropriate positions corresponding to the size of the release film.

[0020] A resin molding apparatus according to a tenth aspect of the present invention has, in addition to the configuration of any one of the above seventh to ninth aspects, a notch through which the pressing member that moves up and down passes is formed in a side wall of the storage box, and it is desirable that the pressing member stores the used release film in the storage box while entering the notch. With this configuration, the release film can be moved into the storage box while being pressed downward by the pressing member, so that the release film can be reliably stored in the storage box.

[0021] In addition to the configuration of any one of the above-described technologies 1 to 10, the resin molding apparatus of technology 11 according to the present invention preferably has a plurality of suction holding units that suction and hold the used release films from the plurality of molding dies. With this configuration, the used release films can be received from each of the plurality of molding dies at once and the multiple used release films can be transported to multiple film supports at once. As a result, the used release films can be efficiently collected.

[0022] In addition to the configuration of the above-described technology 11, the resin molding apparatus of technology 12 according to the present invention preferably has a film releasing section in which the plurality of film support bodies contact the used release film held by the suction holding section and release the used release film from the suction holding section. With this configuration, the used release film can be reliably released from the suction holding section and supported by the film support bodies.

[0023] The resin molding apparatus of Technology 13 according to the present invention preferably includes, in addition to the configuration of Technology 11 or 12, a static eliminator that removes static electricity from the used release film held by the suction holding part. With this configuration, it is possible to prevent the release film from sticking to the suction holding part due to static electricity, and the release film can be reliably released and supported on the film support.

[0024] Furthermore, the manufacturing method of a resin molded product according to Technique 14 of the present invention is a manufacturing method of a resin molded product in which resin is molded onto a molding object using a resin molding device of any one of Techniques 1 to 13 described above, and is characterized by comprising a resin molding process in which release films are placed on a plurality of molding dies and resin is molded onto the molding object, a film conveying process in which, after resin molding, the used release films are conveyed to the plurality of film support bodies by the film conveying mechanism, and a film storage process in which the used release films supported on the plurality of film support bodies are dropped off by the film dropping mechanism and stored in the storage box.

[0025] <One embodiment of the present invention> Hereinafter, one embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, parts are appropriately omitted or exaggerated for clarity. Identical components are given the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0026] <Overall Configuration of Resin Molding Apparatus> The resin molding apparatus 100 of this embodiment resin-seals a substrate W, which is a molding object having electronic components Wx fixed to one surface, by resin molding using a resin material J to manufacture a resin-molded product P. Note that, hereinafter, the molding object (substrate W) before resin molding is referred to as a "pre-molding substrate W," and the molding object (substrate W) after resin molding is referred to as a "molded substrate W" or a "resin-molded product P."

[0027] Here, the substrate W is rectangular in plan view, and examples thereof include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. Alternatively, the substrate W may be a carrier without wiring.

[0028] Examples of the resin material J include powdered or granular resin (including granular resin), liquid resin, etc. Examples of the electronic component Wx include electronic elements such as semiconductor chips, resistor elements, and capacitor elements, or electronic components in which at least one of these electronic elements is sealed with resin.

[0029] 1, the resin molding apparatus 100 includes, as its components, a substrate supply and storage module A, two resin molding modules B, and a resin material supply module C. Each component (each of modules A to C) is detachable and replaceable with respect to the other components.

[0030] The substrate supply / storage module A has a substrate receiving section 10a that receives pre-molded substrates W from the outside, a substrate storage section 10b that stores molded substrates W (resin molded products P), a substrate transport mechanism 11 that transports the pre-molded substrates W and the resin molded products P, and a transfer mechanism 12, such as a transport robot, that transports, i.e., transfers, the pre-molded substrates W and the resin molded products P to the substrate transport mechanism 11.

[0031] The substrate transport mechanism 11 transports the pre-molding substrate W from the substrate supply and storage module A to the resin molding module B, and supplies the pre-molding substrate W to the molding dies 14a to 14c in the resin molding module B. After the pre-molding substrate W has been resin molded, the substrate transport mechanism 11 receives a resin molded product P, which is the molded substrate W after resin molding, from the molding dies 14a to 14c in the resin molding module B, and transports it to the substrate supply and storage module A. The transfer mechanism 12 also transfers the pre-molding substrate W from the substrate receiving unit 10a to the substrate transport mechanism 11, and transfers the resin molded product P from the substrate transport mechanism 11 to the substrate storage unit 10b.

[0032] 1, the substrate transport mechanism 11 has a substrate supply unit 111 that supplies substrates W to the upper mold 141, and a substrate receiving unit 112 that receives resin molded products P from the upper mold 141. The substrate supply unit 111 and the substrate receiving unit 112 are provided corresponding to the upper molds 141 of the multiple molding dies 14a to 14c described below, and are provided side by side in the left-right direction. The substrate transport mechanism 11 successively performs a receiving operation of the substrate receiving unit 112 and a supply operation of the substrate supply unit 111 with respect to the upper mold 141.

[0033] 2, each resin molding module B has a plurality of molding dies 14a to 14c arranged vertically, and a mold clamping mechanism 15 that clamps the plurality of molding dies 14a to 14c. Each resin molding module B in this embodiment is configured to have three molding dies 14a to 14c, using two intermediate plates 16c, 16d arranged between a fixed platen 16a and a movable platen 16b that is raised and lowered by the mold clamping mechanism 15. The intermediate plates 16c, 16d are slidably supported by a pair of sidewall members 16e, 16f that support the fixed platen 16a, via an elevation slide mechanism (not shown) consisting of a linear rail and a slider.

[0034] Each of the molding dies 14a to 14c is composed of an upper die 141 that adsorbs and holds the substrate W, and a lower die 142 in which a cavity 142c is formed. In the top-tier molding die 14a, the upper die 141 is provided on the lower surface of the fixed platen 16a, and the lower die 142 is provided on the upper surface of the upper intermediate plate 16c. In the second-tier molding die 14b, the upper die 141 is provided on the lower surface of the upper intermediate plate 16c, and the lower die 142 is provided on the upper surface of the lower intermediate plate 16d. In the third-tier molding die 14c, the upper die 141 is provided on the lower surface of the lower intermediate plate 16d, and the lower die 142 is provided on the upper surface of the movable platen 16b.

[0035] Furthermore, the upper mold 141 and the lower mold 142 of each of the molding dies 14a to 14c are configured to be slidable in a direction intersecting the mold clamping direction (specifically, the front-to-rear direction) by a movement mechanism (not shown). Specifically, the upper mold 141 and the lower mold 142 slide between a mold clamping position where they are clamped by the mold clamping mechanism 15 and an ejection position located outside the mold clamping mechanism 15 in the sliding direction. Here, the substrate W and the resin molded product P are transported by the substrate transport mechanism 11 to the upper mold 141 in the ejection position. Furthermore, the resin material J and the release film F are transported by the resin material transport mechanism 20 (described later) to the lower mold 142 in the ejection position.

[0036] The mold clamping mechanism 15 of this embodiment is of a linear motion type that raises and lowers the movable platen using a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement. Note that the mold clamping mechanism 15 may also be of a link type that transmits a power source such as a servo motor to the movable platen using a link mechanism such as a toggle link.

[0037] Furthermore, the mold clamping mechanism 15 clamps the multiple molding dies 14a to 14c by linking the elevation of the intermediate plates 16c and 16d with the elevation of the movable platen 16b. By clamping the multiple molding dies 14a to 14c with the mold clamping mechanism 15, resin molding is performed on the pre-molding substrate W in the multiple molding dies 14a to 14c. Specifically, the mold clamping mechanism 15 has a pantograph mechanism 151 that expands and contracts as the movable platen 16b rises and falls. One end 151b of this pantograph mechanism 151 is fixed to the fixed platen 16a, and the other end 151c is fixed to the movable platen 16b. Furthermore, the two cross link portions 151a of the pantograph mechanism 151 are connected to the intermediate plates 16c and 16d, respectively.

[0038] 1, the resin material supply module C has a moving table 17, a resin material accommodation unit 18 placed on the moving table 17, a resin material supply mechanism 19 that measures and supplies resin material J to the resin material accommodation unit 18, and a resin material transport mechanism 20 that transports the resin material accommodation unit 18 and supplies resin material J to the cavity 142C of the lower mold 142. Here, the resin material accommodation unit 18 is configured using a holding frame that holds a release film F, and the resin material J is supplied by the resin material supply mechanism 19 onto the release film F held in the holding frame.

[0039] Within the resin material supply module C, the moving table 17 moves between a resin charging position using the resin material charging mechanism 19 and a transfer position for handing over the resin material accommodation unit 18 to the resin material transfer mechanism 20. The resin material transfer mechanism 20 also transfers the resin material accommodation unit 18 containing the resin material J from the resin material supply module C to the resin molding module B, where it supplies a release film F and the resin material J to the lower mold 142 of the multiple molding dies 14a to 14c. The resin material transfer mechanism 20 then transfers the resin material accommodation unit 18, after being supplied with the resin material J, from the resin molding module B to the resin material supply module C. The release film F prevents the resin material J from adhering to the lower mold 142.

[0040] As shown in FIG. 1 , the resin material conveying mechanism 20 includes a resin material supplying section 201 that supplies resin material J and unused release film F to the lower mold 142, and a film collecting section 202 that collects used release film F from the lower mold 142. In other words, the resin material conveying mechanism 20 also functions as a film conveying mechanism that conveys used release film F. The resin material supplying section 201 and the film collecting section 202 are provided corresponding to the lower molds 142 of the multiple molding dies 14a to 14c arranged in the vertical direction. The resin material supplying section 201 and the film collecting section 202 are provided side by side in the horizontal direction. The resin material conveying mechanism 20 continuously performs the collecting operation of the film collecting section 202 and the supply operation of the resin material supplying section 201 with respect to the lower mold 142. The resin material conveying mechanism 20 conveys the used release film F collected by the film collecting section 202 to the film supporters 3a to 3c, which will be described later.

[0041] Specifically, the film recovery unit 202 is a suction holding unit that sucks and holds used release film F from the multiple molding dies 14a to 14c. As shown in FIG. 3, the multiple film recovery units 202 are provided corresponding to the spacing between the lower dies 142 of the multiple opened molding dies 14a to 14c. Each film recovery unit 202 sucks and holds the peripheral edge of the used release film F (the portion located outside the cavity 142C). Each film recovery unit 202 has multiple suction pads 202a that suck and hold the release film F, and a suction source (not shown) is connected to the multiple suction pads 202a.

[0042] <Specific configuration for collecting used release film F> The resin molding apparatus 100 of this embodiment has the function of collecting used release film F from each of the multiple molding dies 14a to 14c, storing it in a storage box 5, and disposing of it.

[0043] Specifically, as shown in Figures 1 and 4, the resin material supply module C includes a plurality of film supporters 3a to 3c arranged vertically and supporting used release films F, a film detachment mechanism 4 that causes the used release films F supported by the plurality of film supporters 3a to 3c to detach from the film supporters 3a to 3c, and a storage box 5 arranged below the plurality of film supporters 3a to 3c.

[0044] <Film Supports 3a-3c> The multiple film supporters 3a-3c are arranged in the vertical direction and support both sides of a used release film F. Specifically, as shown in FIG. 5, each of the film supporters 3a-3c has a first support portion 31a and a second support portion 31b that support a first end portion and a second end portion of the release film F, respectively, and a passing portion 32. The first end portion and the second end portion of the release film F face each other, and the first end portion and the second end portion correspond to both sides of the release film F. The first support portion 31a and the second support portion 31b support both sides of the release film F. The passing portion 32 is a space formed between the first support portion 31a and the second support portion 31b. The film dropping mechanism 4 passes through the passing portion 32 from top to bottom.

[0045] The release film F of this embodiment has a rectangular shape in a plan view. In this case, the first end of the release film F is one end in the longitudinal direction of the release film F, and the second end is the other end in the longitudinal direction of the release film F. Therefore, the first support portion 31a and the second support portion 31b support the opposing sides of the release film F, respectively. Therefore, the release film F is placed so as to span the first support portion 31a and the second support portion 31b.

[0046] Furthermore, the passage section 32 formed between the first support section 31a and the second support section 31b is, for example, a rectangular space in a plan view. A press-down member 41, which will be described later, passes through the passage section 32 without coming into contact with the passage section 32. Furthermore, a return section 33 is formed at the front end of each of the film supporters 3a to 3c to prevent the release film F placed on the first support section 31a and the second support section 31b from leaking out. This return section 33 protrudes upward from the first support section 31a and the second support section 31b to an extent that it does not interfere with the conveyance of the release film F from the front by the resin material conveyance mechanism 20 (film conveyance mechanism) (see FIG. 5(c)).

[0047] Here, each of the multiple film supporters 3a to 3c has multiple film releasing sections 34 that come into contact with the release film F held by the film recovery section 202 (suction holding section) and release it from the film recovery section 202. As shown in FIGS. 5(b) and 5(c), each film releasing section 34 is provided facing the upper side of the first support section 31a and the second support section 31b of the film supporters 3a to 3c. Furthermore, the film releasing section 34 is provided at a position on the side of the suction pad 202a of the film recovery section 202 where it can come into contact with the release film F. Each suction pad 202a passes between the two film releasing sections 34. There are cases where the release film F does not separate from the suction pad 202a even when the suction of the suction pad 202a is released. In this case, when the suction pad 202a is moved upward, the suction pad 202a passes between the two film releasing sections 34, while the release film F attached to the suction pad 202a comes into contact with the film releasing section 34. As a result, the release film F is released from the suction pad 202a.

[0048] <Gap Change Mechanism> As shown in FIGS. 4, 6 and 7, the plurality of film supporters 3a to 3c of this embodiment are configured so that the vertical gaps therebetween can be changed by a gap change mechanism 6.

[0049] The gap change mechanism 6 narrows the gap between the top and bottom of the plurality of film support bodies 3a to 3c while the plurality of film support bodies 3a to 3c are supporting the release film F. The gap change mechanism 6 also narrows the gap between the top and bottom of the plurality of film support bodies 3a to 3c, and moves the plurality of film support bodies 3a to 3c downward to move them closer to the storage box 5.

[0050] The spacing change mechanism 6 of this embodiment changes the vertical spacing of the multiple film supporters 3a to 3c between a first state (see (first state) in FIGS. 5 and 7) that corresponds to the spacing of the multiple molding dies 14a to 14c, and a second state (see (second state) in FIGS. 6 and 7) that is narrower than the spacing in the first state and causes the release film F to drop off by the film dropping mechanism 4. Note that the second state is a state in which the bottommost film supporter 3c is closer to the storage box 5 than in the first state.

[0051] Specifically, as shown in Figures 6 and 7, the spacing change mechanism 6 includes an upper and lower guide section 61 that guides the vertical movement of the multiple film supports 3a to 3c, a support drive section 62 that moves the topmost film support 3a of the multiple film supports 3a to 3c up and down, and a connecting section 63 that connects the vertically adjacent film supports 3a to 3c in a manner that allows the spacing to be changed as the topmost film support 3a moves up and down.

[0052] The vertical guide section 61 has a guide rail 611 extending in the vertical direction and sliders (not shown) that move along the guide rail 611 and are connected to the multiple film support bodies 3a to 3c. In this embodiment, the guide rail 611 and sliders are provided on the rear end side (opposite the film feed side) of the multiple film support bodies 3a to 3c. Two guide rails 611 are provided, one on each side of the multiple film support bodies 3a to 3c.

[0053] The support drive unit 62 moves the uppermost film support 3a up and down along the vertical guide unit 61. The support drive unit 62 in this embodiment can be configured using, for example, a rodless cylinder. A slider 621 of this support drive unit 62 is connected to the uppermost film support 3a (see FIG. 7). Note that, in addition to a rodless cylinder, the support drive unit 62 may also be configured using, for example, a ball screw mechanism and a motor, a rack and pinion mechanism and a motor, or an air cylinder.

[0054] The connecting portions 63 connect the vertically adjacent film support members 3a to 3c, and when the vertically adjacent film support members 3a to 3c expand to a predetermined distance, they restrain the distance between them so that it does not expand any further. Specifically, as shown in Fig. 7, the connecting portions 63 can be composed of, for example, protrusions 63a provided on each of the film support members 3a to 3c and frames 63b spanning the protrusions 63a provided on the vertically adjacent film support members 3a to 3c. Note that the connecting portions 63 may be configured to have protrusions 63a and frames 63b, or may have any other configuration in which the vertically adjacent film support members 3a to 3c hook together to prevent the distance between them from expanding any further.

[0055] In the first state, adjacent film support members 3a to 3c are constrained by connecting portions 63 to form a predetermined gap (see FIG. 7 (first state)). This predetermined gap is the same as the gap between adjacent lower molds 142 in the opened molds 14a to 14c.

[0056] When the top film support 3a is lowered from this first state, the second and third film support members 3b and 3c are also lowered. Then, the third film support member 3c is placed on the stopper member 64, narrowing the gap between the third film support member 3c and the second film support member 3b (see FIG. 7(1)). The stopper member 64 is located above the storage box 5. When the top film support member 3a is subsequently lowered, the second film support member 3b is also lowered. Then, the second film support member 3b is placed on the third film support member 3c, narrowing the gap between the second film support member 3b and the top film support member 3a (see FIG. 7(2)). After that, the top film support member 3a is lowered until it is placed on the second film support member 3b. This places the multiple film support members 3a-3c in the second state (see FIG. 7 (second state)). Cushion members for absorbing shock may be provided between the film support members 3a to 3c.

[0057] On the other hand, when the topmost film support 3a is raised from the second state, the topmost film support 3a and the second-level film support 3b expand to a predetermined distance, the distance between them is constrained by the connecting portion 63, and the second-level film support 3b rises. When the topmost film support 3a is subsequently raised, the second-level film support 3b and the third-level film support 3c expand to a predetermined distance, the distance between them is constrained by the connecting portion 63, and the third-level film support 3c rises. This places the multiple film support members 3a to 3c in the first state.

[0058] <Film dropping mechanism 4> The film dropping mechanism 4 pushes downward between both sides of the used release film F supported by the multiple film supports 3a to 3c, causing the used release film F to drop off from the film supports 3a to 3c.

[0059] The film dropping mechanism 4 of this embodiment pushes downward the central portion of the longitudinal direction of the rectangular release film F, causing the used release film F to drop from the passing portion 32 of the film support bodies 3a to 3c. Furthermore, after the spacing between the plurality of film support bodies 3a to 3c is narrowed by the spacing change mechanism 6 (after the second state is reached), the film dropping mechanism 4 causes the used release film F to drop from the plurality of film support bodies 3a to 3c all at once.

[0060] Specifically, as shown in Figures 4, 6 and 8, the film dropping mechanism 4 includes a push-down member 41 that pushes downward the used release film F supported by the film supporters 3a to 3c, and a push-down member drive unit 42 that moves the push-down member 41 up and down relative to the film supporters 3a to 3c.

[0061] 8(a), the press-down member 41 of this embodiment has a flat press-down portion 411 that presses down the space between both side portions (the center portion) of the used release film F. The flat press-down portion 411 has a size that allows it to pass through the passing portion 32 of the film supporters 3a to 3c.

[0062] The configuration of the press-down member 41 is not limited to a configuration having a flat press-down portion 411. For example, as shown in FIG. 8( b), the press-down member 41 may have a configuration having a plurality (two in this case) of rod-shaped press-down portions 411 that press down between both side portions (the center portion) of the used release film F. All of the rod-shaped press-down portions 411 are configured to be able to pass through the passage portions 32 of the film supporters 3a to 3c. When there are two rod-shaped press-down portions 411, the positions of the two press-down portions 411 are configured to be changeable. Specifically, the positions of the two press-down portions 411 are changeable in the left-right direction, i.e., the horizontal direction. This allows the left-right positions of the two press-down portions 411 to be changed to appropriate positions even if the sizes of the substrate W and the release film F are changed by changing the forming molds 14a to 14c.

[0063] As shown in FIG. 4, the push-down member driving unit 42 has a guide rail 421 that guides the push-down member 41 in the up-down direction, and a driving actuator 422 that moves the push-down member 41 up and down along the guide rail 421.

[0064] The guide rails 421 guide the base ends of the press-down members 41 in the up and down direction. The guide rails 421 are provided facing the multiple film supporters 3a to 3c. The drive actuator 422 has a movable part 422a that comes into contact with the base ends of the press-down members 41, and the movable part 422a lifts the press-down members 41 along the guide rails 421, thereby moving the press-down members 41 up and down. The drive actuator 422 may be, for example, one that uses a rodless cylinder, one that uses a ball screw mechanism and a motor, one that uses a rack and pinion mechanism and a motor, or one that uses an air cylinder.

[0065] 4, the press-down member 41 is configured to be rotatable relative to the press-down member drive unit 42 between a press-down position S where the press-down member 41 presses down the used release film F supported by the film supports 3a to 3c, and a retracted position T where the press-down member 41 is retracted from the press-down position S and assumes an attitude along the vertical direction. The press-down position S is a position where the flat press-down portion 411 or the rod-shaped press-down portion 411 assumes an attitude along the horizontal direction. Specifically, a rotation unit 43 is provided at the base end of the press-down member 41, which rotates the press-down member 41 around a rotation axis along the horizontal direction (X direction). This rotation unit 43 can be configured using an actuator such as a motor, for example.

[0066] 4, 6, and 7, the storage box 5 is disposed below the plurality of film supporters 3a to 3c, and stores the used release film F that has been dropped by the film dropping mechanism 4. This storage box 5 has an opening at the top, and the size of the opening in a plan view is larger than the size of the used release film F in a plan view.

[0067] 6, a notch 51a through which the push-down member 41 that moves up and down is formed in the side wall 51 of this storage box 5 (the side wall 51 on the film dropping mechanism 4 side). This notch 51a extends downward from the upper end of the side wall 51 of the storage box 5. This notch 51a allows the push-down member 41 to store the used release film F in the storage box 5 while entering the notch 51a.

[0068] <Recovery Operation of Used Release Film F> Next, a description will be given of the recovery operation of used release film F in the resin molding apparatus 100 of this embodiment. Note that the operation described below is performed by, for example, a control unit COM provided in the substrate supply / storage module A, controlling each unit of the resin molding apparatus 100. Note that the control unit COM is a dedicated or general-purpose computer having a CPU, internal memory, an input / output interface, an AD converter, etc.

[0069] After the resin molding process, the used release film F is collected from the lower molds 142 of the molding dies 14a to 14c that have been opened by the multiple film collection units 202 of the resin material transport mechanism 20 (film transport mechanism) (see FIG. 3).Then, the resin material transport mechanism 20 transports the used release film F to the multiple film supporters 3a to 3c (see FIG. 9(a), film transport process).At this time, the multiple film supporters 3a to 3c are in the first state.

[0070] Here, the resin material conveying mechanism 20 slides the multiple film recovery units 202 relative to the multiple film supporters 3a to 3c. Then, with the release film F positioned above the first support portions 31a and second support portions 31b of the film supporters 3a to 3c, the suction pads 202a are released from suction. This causes the release film F to fall onto the first support portions 31a and second support portions 31b of the film supporters 3a to 3c. The resin material conveying mechanism 20 also moves the multiple film recovery units 202 upward relative to the multiple film supporters 3a to 3c. Note that even if the suction of the suction pads 202a is released, the release film F may still stick to the suction pads 202a due to the pressure difference between the inside and outside of the suction pads 202a. In this case, when the multiple film recovery units 202 move upward relative to the multiple film supporters 3a to 3c, the suction pad 202a passes between the two film releasing units 34, while the release film F attached to the suction pad 202a comes into contact with the film releasing unit 34. This causes the release film F to be released from the suction pad 202a, and the release film F falls onto the first support unit 31a and the second support unit 31b of the film supporters 3a to 3c. As a result, both longitudinal ends of the used release film F are supported by each of the film supporters 3a to 3c (see FIG. 9B).

[0071] Furthermore, in this embodiment, the static eliminator 7 is configured to remove static electricity charged on the release film F while the release film F is adsorbed to the suction pads 202a of the multiple film recovery units 202 (see FIG. 6). Note that the static eliminator 7 is omitted from FIGS. 4, 7, and 9 to 11. Specifically, a static eliminator 7 is provided corresponding to each of the multiple film recovery units 202. Each static eliminator 7 removes static electricity by spraying ions onto the release film F so that the release film F does not stick to the lower surface of the film recovery unit 202 due to static electricity. The timing for removing static electricity using the static eliminator 7 is before or while the release film F is being stored in the film support bodies 3a to 3c.

[0072] After transporting the used release film F to the film support bodies 3a to 3c, the resin material transport mechanism 20 moves to a predetermined waiting position retreated from between the multiple film support bodies 3a to 3c and the film removal mechanism 4 (see Figure 10 (c)).

[0073] Thereafter, the spacing change mechanism 6 narrows the spacing between the multiple film supporters 3a to 3c (see FIG. 10(d)). Specifically, the supporter drive unit 62 of the spacing change mechanism 6 moves the topmost film supporter 3a downward, thereby placing the multiple film supporters 3a to 3c in the second state. Furthermore, by narrowing the spacing between the multiple film supporters 3a to 3c with the spacing change mechanism 6, the multiple film supporters 3a to 3c move closer to the storage box 5. Note that during the operation of conveying the release film F to the film supporters 3a to 3c and the operation of narrowing the spacing between the film supporters 3a to 3c, the press-down member 41 of the film dropping mechanism 4 is in the retracted position T.

[0074] After the spacing between the film supporters 3a to 3c is narrowed by the spacing change mechanism 6 (after the film supporters 3a to 3c are placed in the second state), the press-down member 41 of the film dropping mechanism 4 is rotated to the press-down position S (see FIG. 11(e)). The press-down member 41 in the press-down position S is located above the film supporters 3a to 3c. The press-down member drive unit 42 then moves the press-down member 41 downward, causing the used release film F to drop off from the film supporters 3a to 3c (see FIG. 11(f)). Specifically, the press-down member 41 presses downward between both sides (the center) of the release film F supported by the film supporters 3a to 3c, passing through the passing section 32 of the film supporters 3a to 3c, causing the used release film F to drop off from the passing section 32 of the film supporters 3a to 3c. At this time, the used release film F moves to the storage box 5 while remaining in contact with the press-down member 41 due to air resistance. As a result, the used release film F is stored in the storage box 5 (film storage step).

[0075] In this embodiment, the base end of the press-down member 41 is placed on the movable part 422a of the drive actuator 422. When the base end of the press-down member 41 is placed on the movable part 422a, when the press-down member drive part 42 moves the movable part 422a in the up-down direction, the press-down member 41 also moves along with the movement of the movable part 422a. When the press-down member 41 is placed on an object other than the movable part 422a, the press-down member 41 does not move up or down even when the press-down member drive part 42 moves the movable part 422a in the up-down direction. In this embodiment, when the press-down member 41 of the film dropping mechanism 4 is rotated to the pressed position S, the base end of the press-down member 41 is placed on the movable part 422a. Then, when the press-down member driving unit 42 moves the movable part 422a downward, the press-down member 41 rests on the used release film F in the storage box 5 while the movable part 422a is moving downward. Thereafter, the downward movement of the press-down member 41 stops, and only the movable part 422a moves downward. As a result, the movable part 422a of the driving actuator 422 and the press-down member 41 are separated, and the used release film F is pressed down from above by the weight of the press-down member 41. This prevents the release film F stored in the storage box 5 from being pushed in and becoming bulky. Furthermore, excessive force is not applied to the used release film F in the storage box 5.

[0076] The press-down member driver 42 moves the movable part 422a downward, and then moves the movable part 422a upward. While the movable part 422a is moving upward, the base end of the press-down member 41 is placed on the movable part 422a. Thereafter, the press-down member 41 moves upward along with the movement of the movable part 422a. As described above, the press-down member driver 42 moves the movable part 422a upward, thereby moving the press-down member 41 upward and removing the press-down member 41 from the storage box 5, and then moving the press-down member 41 and the movable part 422a to a height position (standby position) where the next film removal operation can be performed. Furthermore, after the press-down member 41 has moved to the standby position, the press-down member 41 is rotated to the retracted position T.

[0077] After the operation of the pressing member 41, the support driving unit 62 moves the uppermost film support 3a upward, and the film supports 3a to 3c are spaced apart (first state) so that the next film recovery operation can be performed.

[0078] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, after resin molding, the used release film F is transported to the plurality of film support bodies 3 a to 3 c by the film transport mechanism (resin material transport mechanism 20), and the used release film F supported on the plurality of film support bodies 3 a to 3 c is dropped by the film dropping mechanism 4 and stored in the storage box 5, so that the release film F used in the plurality of molding dies 14 a to 14 c can be efficiently stored in the storage box 5.

[0079] Furthermore, since the film dropping mechanism 4 drops the used release film F from the film supporters 3a to 3c after the spacing between the multiple film supporters 3a to 3c has been narrowed by the spacing change mechanism 6, the release film F supported on each of the multiple film supporters 3a to 3c can be reliably stored in the storage box 5. Furthermore, by narrowing the spacing between the multiple film supporters 3a to 3c, the range of the dropping operation by the film dropping mechanism 4 (specifically, the stroke amount of the push-down member 41) can be made compact, and the film dropping mechanism 4 can be made smaller.

[0080] Furthermore, the spacing change mechanism 6 narrows the spacing between the multiple film supporters 3a to 3c and brings the multiple film supporters 3a to 3c closer to the storage box 5, so that the used release film F that has been dropped by the film dropping mechanism 4 can be reliably stored in the storage box 5.

[0081] Other Modified Embodiments The present invention is not limited to the above-described embodiments.

[0082] For example, although the interval change mechanism 6 is configured to narrow the intervals between the plurality of film supporters 3a to 3c and move the plurality of film supporters 3a to 3c closer to the storage box 5, it is not necessary to be configured to move the plurality of film supporters 3a to 3c closer to the storage box 5. In this case, a height position adjustment mechanism that adjusts the height position of the storage box 5 may be provided, so that the storage box 5 can be moved closer to the plurality of film supporters 3a to 3c (the lowest film supporter 3c).

[0083] Furthermore, the film supporters 3a to 3c may be configured so that the distance between the first support portion 31a and the second support portion 31b (i.e., the width of the passage portion) is changeable. With this configuration, the distance between the first support portion 31a and the second support portion 31b can be adjusted depending on, for example, the type of release film F, and the release film F can be reliably supported.

[0084] Furthermore, the press-down member 41 may be configured to be changeable in width or spacing between the plurality of bar-shaped press-down portions 411. With this configuration, it is possible to adjust the configuration so that the release film F is reliably removed from the film support bodies 3a to 3c depending on the type of release film F, for example.

[0085] In addition, in the above embodiment, one release film F is transported to each of the film support bodies 3a to 3c and then stored in the storage box 5, but it is also possible to transport two or more release films F to each of the film support bodies 3a to 3c and then store them in the storage box 5.

[0086] Although the release film F in the above embodiment has a rectangular shape in a plan view, it may have various shapes such as a circular shape in a plan view. When the release film F has a circular shape in a plan view, the two end portions of the release film F are two end portions of the release film F that are opposite to each other in the radial direction.

[0087] In the above embodiment, the resin molding apparatus 100 is described in which one resin molding module B has three molding dies 14a to 14c, but the resin molding apparatus 100 may be configured so that one resin molding module B has two molding dies, or four or more molding dies. In these configurations, it is possible to match the number of suction holding units of the film transport mechanism and the number of film supports to the number of molding dies.

[0088] The film transport mechanism in the above embodiment is configured using the resin material transport mechanism 20 , but may be provided separately from the resin material transport mechanism 20 .

[0089] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

[0090] According to the present invention, release films used in a plurality of molding dies can be efficiently stored in a storage box.

[0091] DESCRIPTION OF SYMBOLS 100: Resin molding apparatus W: Pre-molded substrate (molding object) P: Resin molded product (molding object) 14a to 14c: Multiple molding dies F: Release film 20: Film transport mechanism (resin material transport mechanism) 202: Suction holding section (film recovery section) 3a to 3c: Multiple film support bodies 4: Film dropping mechanism 5: Storage box 6: Spacing change mechanism 61: Upper and lower guide section 62: Support body drive section 63: Connection section 31a: First support section 31b: Second support section 32: Passage section 34: Film release section 41: Pressing down member 42: Pressing down member drive section S: Pressing down position T: Retracted position 411: Pressing down section 51a: Notch section

Claims

1. A resin molding apparatus having a plurality of molding dies arranged one above the other, in which a release film is placed on the plurality of molding dies to perform resin molding, comprising: a plurality of film support members arranged one above the other and supporting both side portions of a used release film; a film transport mechanism that transports the used release film from the plurality of molding dies to the plurality of film support members; a film detachment mechanism that pushes downward a portion between the both side portions of the used release film supported by the plurality of film support members, causing the used release film to fall off from the film support members; and a storage box arranged below the plurality of film support members that stores the used release film that has fallen off by the film detachment mechanism.

2. The resin molding device according to claim 1, further comprising a spacing change mechanism that narrows the spacing between the plurality of film support bodies while the plurality of film support bodies are supporting the used release film, and the film dropping mechanism causes the used release film to drop off from the film support bodies after the spacing between the plurality of film support bodies has been narrowed by the spacing change mechanism.

3. The resin molding device according to claim 2, wherein the spacing change mechanism narrows the spacing between the plurality of film support members and moves the plurality of film support members closer to the storage box.

4. A resin molding device as described in claim 2 or 3, wherein the spacing change mechanism comprises: an upper and lower guide section that guides the vertical movement of the plurality of film supports; a support drive section that moves the uppermost film support of the plurality of film supports up and down; and a connecting section that connects two vertically adjacent film supports so as to change the spacing between the vertically adjacent film supports as the uppermost film support moves up and down.

5. A resin molding device as described in any one of claims 2 to 4, wherein the spacing change mechanism changes the spacing between the multiple film support bodies between a first state corresponding to the spacing between the multiple molding dies and a second state in which the spacing is narrower than the spacing in the first state and the used release film is dropped by the film dropping mechanism.

6. A resin molding device as described in any one of claims 1 to 5, wherein the film support has a first support portion and a second support portion that support both side portions of the release film, and a passage portion formed between the first support portion and the second support portion and through which the film dropping mechanism passes from top to bottom.

7. A resin molding device as claimed in any one of claims 1 to 6, wherein the film removal mechanism comprises: a pressing member that presses downward the used release film supported by the film support; and a pressing member drive unit that moves the pressing member up and down relative to the film support.

8. The resin molding device described in claim 7, wherein the pressing member is configured to be rotatable relative to the pressing member drive unit between a pressing position where it presses down the used release film supported by the film support, and a retracted position where it retracts from the pressing position and assumes a posture aligned in the vertical direction.

9. A resin molding device as described in claim 7 or 8, wherein the pressing member has two rod-shaped pressing portions that press down the portion between the two side portions of the used release film, and the positions of the two pressing portions are changeable.

10. A resin molding device as claimed in any one of claims 7 to 9, wherein a notch is formed in the side wall of the storage box through which the pressing member passes as it moves up and down, and the pressing member enters the notch and stores the used release film in the storage box.

11. A resin molding device according to any one of claims 1 to 10, wherein the film transport mechanism has a plurality of suction holding sections that suction and hold the used release films from the plurality of molding dies.

12. The resin molding device according to claim 11, wherein the plurality of film support members have a film releasing section that contacts the used release film held by the suction holding section and releases it from the suction holding section.

13. A resin molding apparatus according to claim 11 or 12, further comprising a static eliminator for removing static electricity from the used release film held by the suction holding section.

14. A method for manufacturing a resin molded product by using the resin molding device described in any one of claims 1 to 13 to mold resin onto a molding object, comprising: a resin molding process in which release films are placed on multiple molding dies and resin is molded onto the molding object; a film transport process in which, after resin molding, the used release films are transported to the multiple film support bodies by the film transport mechanism; and a film storage process in which the used release films supported on the multiple film support bodies are dropped off by the film dropping mechanism and stored in the storage box.

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