Mold, resin molding device, and method for producing resin molded article

Abstract

The present invention makes the temperature distribution on the surface of a cavity block of an upper mold and / or a lower mold uniform. A mold 14 includes a cavity formed in an upper mold 141 and / or a lower mold 142. One of the upper mold 141 and the lower mold 142 includes: a cavity block, of which the surface opposed to the other mold serves as an opposed face; and a heating plate that is provided on the rear surface of the cavity block and includes a built-in heater. The cavity block and / or the heating plate is formed with, between the heater and the opposed face in the thickness direction, at least one space part for uniformizing the temperature distribution on the opposed face.

Description

Mold, resin molding device, and method for manufacturing resin molded product

[0001] The present invention relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product.

[0002] Conventionally, as disclosed in Patent Document 1, a resin sealing apparatus has been considered in which a lower mold set equipped with a cavity block having a cavity portion on its upper surface is moved horizontally between a molding position and a standby position.

[0003] In this resin sealing apparatus, the lower mold set is moved from the molding position to the standby position, and then a dispenser device injects liquid resin material into the cavity portion.

[0004] JP 2012-79937 A

[0005] However, when the lower mold set is moved to a standby position outside the mold clamping mechanism, the temperature of the cavity block drops, so it is conceivable to provide a heater in the lower mold set to prevent the temperature drop of the cavity block.

[0006] However, providing a heater in the lower mold set shortens the distance between the cavity block and the heater, resulting in greater variations in temperature distribution on the surface of the cavity block. Such variations in temperature distribution on the surface of the cavity block adversely affect the resin material and ultimately lead to reduced quality of the resin molded product. This problem also occurs when the upper mold slides outside the mold clamping mechanism. Furthermore, even in resin molding devices where the mold does not slide outside, the same problem occurs when the distance between the cavity block and the heater is shortened.

[0007] SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and its main object is to make the temperature distribution on the surface of the cavity block uniform.

[0008] In other words, the molding die of the present invention has an upper mold and a lower mold arranged opposite each other, with a cavity formed in the upper mold or the lower mold, and one of the upper mold or the lower mold has a cavity block whose surface faces the other mold, and a heating plate provided on the back surface of the cavity block and having a built-in heater, and is characterized in that at least one of the cavity block or the heating plate has one or more spaces formed therein to uniformly distribute the temperature on the surface of the cavity block.

[0009] According to the present invention configured as described above, the temperature distribution on the surface of the cavity block can be made uniform.

[0010] FIG. 1 is a schematic diagram showing the configuration of a resin molding apparatus according to an embodiment of the present invention; FIG. 2 is a cross-sectional view showing the configuration of a resin molding module according to the embodiment; FIG. 3 is a cross-sectional view showing the configuration of a mold slide mechanism according to the embodiment; FIG. 4 is a cross-sectional view showing the specific configuration of a lower mold according to the embodiment; (a) a perspective view and (b) a plan view showing the configuration of a back mold plate according to the embodiment; (a) a temperature distribution in a conventional example, (b) a temperature distribution in a comparative example (high thermal conductivity member only), and (c) a temperature distribution in this embodiment (space portion + high thermal conductivity member); (b) a cross-sectional view showing the configuration of a space portion according to a modified embodiment; and (c) a plan view showing the configuration of a space portion according to a modified embodiment.

[0011] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0012] A molding die according to a first aspect of the present invention includes an upper mold and a lower mold arranged opposite each other, with a cavity formed in the upper mold or the lower mold. One of the upper mold or the lower mold includes a cavity block whose front surface faces the other mold, and a heating plate provided on the back surface of the cavity block and incorporating a heater. At least one of the cavity block or the heating plate has one or more spaces formed therein for uniforming the temperature distribution on the surface of the cavity block. With this resin molding apparatus, in a configuration in which the heating plate is provided on the back surface of the cavity block, at least one of the cavity block or the heating plate has one or more spaces formed therein for uniforming the temperature distribution on the surface of the cavity block. Specifically, by forming the spaces corresponding to the high-temperature portions on the surface of the cavity block, heat from the heater is less likely to be transmitted to the surface of the cavity block, thereby uniforming the temperature distribution on the surface of the cavity block. As a result, the adverse effects of uneven temperature distribution on the resin material can be reduced, and the quality of the resin molded product can be improved.

[0013] As a specific embodiment of the molding die, in addition to the configuration of the above-mentioned technology 1, the molding die of technology 2 according to the present invention has the following configuration: the cavity block has a front-side plate whose front surface faces the other mold, and a back-side plate provided on the back surface of the front-side plate, and it is desirable that one or more recesses or one or more through holes are formed in the back-side plate along the thickness direction, and the space is formed by the recesses or through holes. With this configuration, it is only necessary to form the recesses or through holes in the back-side plate, which makes it easy to form the space in the cavity block.

[0014] In addition to the configuration of the above-described Technique 1 or 2, the molding die of Technique 3 according to the present invention is preferably configured such that the one or more spaces are formed inside the cavity as viewed from the clamping direction of the molding die. With this configuration, the temperature distribution in the portion of the surface of the cavity block corresponding to the cavity can be made uniform, reducing the adverse effects of uneven temperature distribution on the resin material and improving the quality of the resin molded product.

[0015] A molding die according to a fourth aspect of the present invention has the same configuration as any one of the first to third aspects, but preferably has a rectangular cavity when viewed from the clamping direction of the molding die, and the one or more spaces are formed along the longitudinal direction of the cavity. In the case of a rectangular cavity, the temperature distribution along the longitudinal direction of the portion of the cavity block surface corresponding to the cavity tends to vary greatly. For example, the central portion along the longitudinal direction tends to be a high-temperature portion, and the ends along the longitudinal direction tend to be low-temperature portions. In the molding die according to the fourth aspect, one or more spaces are formed along the longitudinal direction of the cavity, thereby efficiently uniforming the temperature distribution along the longitudinal direction of the portion of the cavity block surface corresponding to the cavity.

[0016] A molding die according to a fifth aspect of the present invention has the configuration of any one of the first to third aspects, and further has the following characteristics: the cavity is rectangular when viewed from the clamping direction of the molding die, and the one or more spaces have a first space formed along the longitudinal direction of the cavity and a second space formed along the lateral direction of the cavity so as to intersect with the first space. With this configuration, it is possible to efficiently uniform the temperature distribution in the longitudinal direction of the surface of the cavity block in the portion corresponding to the cavity, as well as the temperature distribution in the lateral direction.

[0017] A molding die according to a sixth aspect of the present invention has the same configuration as any one of the first to third aspects, but preferably has a circular cavity when viewed from the clamping direction of the molding die, and the one or more spaces are formed in the center of the cavity. A circular cavity tends to result in large variations in the temperature distribution in the radial direction of the cavity on the surface of the cavity block corresponding to the cavity. For example, the central portion tends to be a high-temperature portion and the peripheral portion tends to be a low-temperature portion. In the molding die according to the sixth aspect, the one or more spaces are formed in the center of the cavity, thereby efficiently uniforming the temperature distribution in the radial direction of the cavity on the surface of the cavity block corresponding to the cavity.

[0018] A molding die according to a seventh aspect of the present invention has the same configuration as any one of the first to sixth aspects, and preferably further includes a highly thermally conductive member disposed in the cavity block along the thickness direction at a position different from the space when viewed from the clamping direction of the molding die. With this configuration, the space makes it difficult for heat from the heater to be transferred to the surface of the cavity block, while the highly thermally conductive member disposed at a position different from the space facilitates transfer of heat from the heater to the cavity block. For example, by forming a space corresponding to a high-temperature portion on the surface of the cavity block and disposing a highly thermally conductive member corresponding to a low-temperature portion on the surface of the cavity block, the temperature distribution on the surface of the cavity block can be efficiently uniformed.

[0019] A molding die according to Technology 8 of the present invention has the same configuration as any one of Technologies 1 to 7, and preferably further includes a base plate on which the cavity block and the heating plate are mounted, and a heat insulating plate is provided between the heating plate and the base plate. With this configuration, heat is less likely to be transferred from the heating plate to the base plate, allowing for efficient transfer of heat from the heating plate to the cavity block and achieving energy savings.

[0020] If the heating plate is fastened to the base plate with bolts, heat from the heating plate will be wasted and transferred to the base plate through the bolts. To solve this problem, in addition to the configuration of the above-mentioned technology 8, the molding die of technology 9 according to the present invention preferably has the heating plate and the heat insulating plate fixed with a first fixing device, and the heat insulating plate and the base plate fixed with a second fixing device. With this configuration, the heating plate is fixed to the base plate not directly but via the heat insulating plate, so heat is not wasted and energy is saved.

[0021] A resin molding apparatus according to a tenth aspect of the present invention is characterized by including the molding die according to any one of the first to ninth aspects, and a press unit that clamps the molding die.

[0022] In addition to the configuration of the above-described technique 10, the resin molding apparatus of technique 11 according to the present invention preferably further comprises a mold slide mechanism that slides the mold to the outside of the press section.

[0023] Furthermore, a method for manufacturing a resin molded product according to a twelfth aspect of the present invention is characterized in that a resin molding apparatus according to the tenth or eleventh aspect is used to mold a resin onto a molding object.

[0024] <One embodiment of the present invention> Hereinafter, one embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, parts are appropriately omitted or exaggerated for clarity. Identical components are given the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0025] <Overall Configuration of Resin Molding Apparatus> The resin molding apparatus 100 of this embodiment resin-seals a substrate W, which is a molding object having electronic components Wx fixed to one surface, by resin molding using a resin material J to manufacture a resin-molded product P. Note that, hereinafter, the molding object (substrate W) before resin molding is referred to as a "pre-molding substrate W," and the molding object (substrate W) after resin molding is referred to as a "molded substrate W" or a "resin-molded product P."

[0026] Here, the substrate W is rectangular in plan view, and examples thereof include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. Alternatively, the substrate W may be a carrier without wiring.

[0027] Examples of the resin material J include powdered or granular resin (including granular resin), liquid resin, etc. Examples of the electronic component Wx include electronic elements such as semiconductor chips, resistor elements, and capacitor elements, or electronic components in which at least one of these electronic elements is sealed with resin.

[0028] 1, the resin molding apparatus 100 includes, as its components, a substrate supply and storage module A, two resin molding modules B, and a resin material supply module C. Each component (each of modules A to C) is detachable and replaceable with respect to the other components.

[0029] The substrate supply / storage module A has a substrate receiving section 10a that receives pre-molded substrates W from the outside, a substrate storage section 10b that stores molded substrates W (resin molded products P), a substrate transport mechanism 11 that transports the pre-molded substrates W and the resin molded products P, and a transfer mechanism 12, such as a transport robot, that transports, i.e., transfers, the pre-molded substrates W and the resin molded products P to the substrate transport mechanism 11.

[0030] The substrate transport mechanism 11 transports the pre-molding substrate W from the substrate supply and storage module A to the resin molding module B, and supplies the pre-molding substrate W to the molding die 14 in the resin molding module B. After the pre-molding substrate W has been resin molded, the substrate transport mechanism 11 receives a resin molded product P, which is the molded substrate W after resin molding, from the molding die 14 in the resin molding module B, and transports it to the substrate supply and storage module A. In addition, the transfer mechanism 12 transfers the pre-molding substrate W from the substrate receiving unit 10a to the substrate transport mechanism 11, and transfers the resin molded product P from the substrate transport mechanism 11 to the substrate storage unit 10b.

[0031] 1, the substrate transport mechanism 11 has a substrate supply unit 111 that supplies a substrate W to the upper mold 141, and a substrate receiving unit 112 that receives a resin molded product P from the upper mold 141. The substrate supply unit 111 and the substrate receiving unit 112 are arranged side by side in the left-right direction. The substrate transport mechanism 11 successively performs a receiving operation of the substrate receiving unit 112 and a supply operation of the substrate supply unit 111 with respect to the upper mold 141.

[0032] As shown in FIG. 2, each resin molding module B has a molding die 14 and a press unit 15 that presses and clamps the molding die 14 .

[0033] The forming mold 14 has an upper mold 141 and a lower mold 142 arranged opposite each other in the vertical direction. The upper mold 141 is adapted to hold the substrate W by suction. The lower mold 142 has a cavity 14C formed therein. The upper mold 141 is provided on the lower surface of a fixed platen 151 directly or via another member, and the lower mold 142 is provided on the upper surface of a movable platen 152 directly or via another member. The specific configuration of the forming mold 14 will be described later.

[0034] The press section 15 of this embodiment includes a fixed platen 151, which is a base member on which the upper mold 141 is provided, a movable platen 152, which is a base member that is movable up and down relative to the fixed platen 151, and a mold clamping mechanism 153 that raises and lowers the movable platen 152 relative to the fixed platen 151.

[0035] The fixed platen 151 is supported by a pair of sidewall members 154 and 155, and the movable platen 152 is supported slidably relative to the pair of sidewall members 154 and 155 by an elevation slide mechanism (not shown).

[0036] The mold clamping mechanism 153 is of a linear motion type that uses a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement to raise and lower the movable platen 152. Note that the mold clamping mechanism 153 may also be of a link type that transmits a power source such as a servo motor to the movable platen using a link mechanism such as a toggle link.

[0037] The resin material supply module C has a moving table 17, a resin material accommodation unit 18 placed on the moving table 17, a resin material supply mechanism 19 that measures and supplies resin material J to the resin material accommodation unit 18, and a resin material transport mechanism 20 that transports the resin material accommodation unit 18 and supplies resin material J to the cavity 14C of the lower mold 142. Here, the resin material accommodation unit 18 is configured using a holding frame that holds a release film F, and the resin material J is supplied by the resin material supply mechanism 19 onto the release film F held in the holding frame.

[0038] The moving table 17 moves within the resin material supplying module C between a resin charging position where a resin material charging mechanism 19 charges the resin material and a transfer position where the resin material accommodation unit 18 is handed over to the resin material transfer mechanism 20. The resin material transfer mechanism 20 also transfers the resin material accommodation unit 18 containing the resin material J from the resin material supplying module C to the resin molding module B, where it supplies the release film F and the resin material J to the lower die 142 of the molding die 14. The resin material transfer mechanism 20 then transfers the resin material accommodation unit 18, after the resin material J has been supplied, from the resin molding module B to the resin material supplying module C.

[0039] 1, the resin material conveying mechanism 20 has a resin material supplying section 201 that supplies resin material J and an unused release film F to the lower mold 142, and a film collecting section 202 that collects used release film F from the lower mold 142. The resin material supplying section 201 and the film collecting section 202 are arranged side by side in the left-right direction. The resin material conveying mechanism 20 successively performs the collecting operation of the film collecting section 202 and the supply operation of the resin material supplying section 201 with respect to the lower mold 142.

[0040] <Specific configuration of molding die 14> In the resin molding apparatus 100 of this embodiment, the upper die 141 and the lower die 142 of the molding die 14 are each configured to be slidable in a direction intersecting the mold clamping direction (specifically, the front-to-rear direction) by the molding die slide mechanism 16, as shown in Figures 1 and 3.

[0041] As shown in Figure 3, this mold slide mechanism 16 has an upper mold support frame 161 that supports the upper mold 141, a lower mold support frame 162 that supports the lower mold 142, and a frame drive unit 163 that moves the upper mold support frame 161 and the lower mold support frame 162 in the slide direction.

[0042] The upper die support frame 161 and the lower die support frame 162 are slidable in the front-rear direction by a guide mechanism (not shown) relative to the pair of side wall members 154, 155. A frame drive unit 163 selectively moves either the upper die support frame 161 or the lower die support frame 162. This frame drive unit 163 may be configured, for example, using a ball screw mechanism, a rack and pinion, or an air cylinder. The frame drive unit 163 may be provided on each of the upper die support frame 161 and the lower die support frame 162.

[0043] Specifically, the mold slide mechanism 16 slides the upper mold 141 and the lower mold 142 between a mold clamping position Q where the molds are clamped in the press unit 15 and a transfer position R located outside the press unit 15 in the sliding direction. The transfer position R is a position outside the fixed platen 151, the movable platen 152, and the pair of side wall members 154, 155 in the press unit 15, and is a position where a transported object is transferred to the mold 14. Note that FIG. 3 shows a state in which the upper mold 141 has moved to the transfer position R.

[0044] The substrate W and the resin molded product P are transported by the substrate transport mechanism 11 to the upper mold 141, which is located at the transfer position R. The resin material transport mechanism 20 transports the resin material J and the release film F to the lower mold 142, which is located at the transfer position R. After the substrate W is transported to the upper mold 141 and the resin material J and the release film F are transported to the lower mold 142, the upper mold 141 and the lower mold 142 are clamped together, whereby resin is molded onto the substrate W to produce the resin molded product P.

[0045] 2, the upper mold 141 has a cavity block 141a whose front surface faces the lower mold 142, and a heating plate 141b provided on the back surface of the cavity block 141a. In this specification, the "front surface" of the cavity block of one molding mold refers to the surface facing the other molding mold (molding surface), and if one molding mold has a cavity, the "front surface" of the cavity block refers to the surface that forms the bottom surface of the cavity.

[0046] The heating plate 141b has a built-in heater 21. This heater 21 is, for example, a rod-shaped cartridge heater, and the temperature is controlled by controlling the current supplied to the heating wire of the cartridge heater. The temperature control by the heater 21 is performed by a control unit COM (see FIG. 1) that is provided in, for example, the substrate supply / storage module A and controls each part of the resin molding apparatus 100. This control unit COM is a dedicated or general-purpose computer that has a CPU, internal memory, an input / output interface, an AD converter, etc.

[0047] The upper mold 141 also has a base plate 141c on which the cavity block 141a and the heating plate 141b are mounted. The base plate 141c is provided with a sealing structure 141d, which is made up of a sidewall portion and a sealing member such as an O-ring, for drawing a vacuum around the cavity block 141a during resin molding. Note that the sealing structure 141d is not shown in Figure 3.

[0048] <Configuration of lower mold 142> As shown in Figures 2 and 4, the lower mold 142 has a cavity block 142a whose surface faces the upper mold 141 and in which the cavity 14C is formed, and a heating plate 142b provided on the back surface of the cavity block 142a.

[0049] The heating plate 142b has a built-in heater 22. The heater 22 is, for example, a rod-shaped cartridge heater, and the temperature is controlled by controlling the current supplied to the heating wire of the cartridge heater. The temperature control by the heater 22 is performed by a control unit COM (see FIG. 1) that is provided in, for example, the substrate supply / storage module A and controls each part of the resin molding apparatus 100.

[0050] The lower mold 142 also has a base plate 142c on which the cavity block 142a and the heating plate 142b are mounted. The base plate 142c is provided with a sealing structure 142d, which is made up of a sidewall for drawing a vacuum around the cavity block 142a during resin molding, and a sealing member such as an O-ring. Note that the sealing structure 142d is not shown in Figure 3.

[0051] 2 and 4, the cavity block 142a of the lower mold 142 has a bottom block 142a1 that forms the bottom surface of the cavity 14C, and a side block 142a2 that surrounds the bottom block 142a1 and forms the side surface of the cavity 14C. The side block 142a2 is supported by an elastic member 142a3 provided on the base plate 142c so as to be able to move up and down relative to the bottom block 142a1.

[0052] 4, one or more spaces 14S are formed in the cavity block 142a of the lower mold 142 to uniform the temperature distribution on the surface of the cavity block 142a. In this embodiment, one or more spaces 14S are formed in the bottom block 142a1 of the cavity block 142a.

[0053] Specifically, the bottom block 142a1 has a surface side plate 2 whose surface (upper surface) faces the upper mold 141 and forms the bottom surface of the cavity 14C, and a back side plate 3 provided on the back surface (lower surface) of the surface side plate 2.

[0054] As shown in FIGS. 4 and 5 , one or more through holes 3h are formed in the rear plate 3 along the thickness direction. Here, the through holes 3h are formed penetrating from the upper surface to the lower surface of the rear plate 3. The through holes 3h may have a uniform cross-sectional shape along the thickness direction, or may have a cross-sectional shape that varies from the lower surface to the upper surface. The upper opening of the through hole 3h is blocked by the front plate 2, and the lower opening of the through hole 3h is blocked by the heating plate 142b. This forms a space 14S, which is a closed space, by the through hole 3h. The through hole 3h is formed by punching the rear plate 3. In this embodiment, the through holes 3h are formed by drilling multiple holes and then cutting the sidewalls between adjacent drill holes.

[0055] The one or more spaces 14S are formed in the back surface plate 3 of the bottom block 142a1, and are formed inside the cavity 14C when viewed from the clamping direction of the molding die 14 (i.e., in a plan view). The cavity 14C in this embodiment has a rectangular shape when viewed from the clamping direction of the molding die 14, and the one or more spaces 14S are formed along the longitudinal direction of the cavity 14C.

[0056] In this embodiment, the heater 22, a rod-shaped cartridge heater, is provided on the heating plate 142b along the longitudinal direction of the cavity 14C (rear plate 3), as shown in FIG. 5(b). Specifically, two cartridge heaters are provided on either side of the center of the cavity 14C in the transverse direction. The number of turns of the heating wire in the cartridge heater varies in the axial direction, with a larger number of turns formed on both sides of the longitudinal center. Therefore, if the space 14S is not provided, high-temperature zones are formed on both sides of the center of the cavity bottom in the longitudinal direction, as shown in FIG. 6(a). If the number of turns of the heating wire were uniform in the axial direction, one high-temperature zone would be formed in the center of the cavity 14C.

[0057] In this embodiment, two spaces 14S (through holes 3h) are formed on either side of the center of the rectangular back plate 3, and each space 14S (through hole 3h) is formed along the longitudinal direction. Each space 14S (through hole 3h) is also formed in the center of the width direction (short direction) of the back plate 3. This configuration makes it difficult for heat from the heater 22 to be transferred to the high-temperature portion of the bottom of the cavity, reducing the temperature difference between the high-temperature portion and the low-temperature portion of the bottom of the cavity and achieving a uniform temperature distribution on the bottom of the cavity.

[0058] Furthermore, a highly thermally conductive member 4 is provided along the thickness direction of the back surface plate 3 of the bottom block 142a1 at a position different from the space 14S when viewed from the mold clamping direction of the forming die 14. This highly thermally conductive member 4 is made of a material with better thermal conductivity than the back surface plate 3, such as copper or aluminum.

[0059] Specifically, the high thermal conductivity member 4 has its lower surface in contact with the upper surface of the heating plate 142b and its upper surface in contact with the lower surface of the front-side plate 2. This allows the high thermal conductivity member 4 to easily transfer heat from the heating plate 142b to the front-side plate 2. The high thermal conductivity member 4 is provided on the periphery of the bottom surface of the cavity, and in this embodiment, is provided along the longitudinal direction on both sides of each space 14S. The high thermal conductivity member 4 in this embodiment is fitted into an attachment through-hole formed in the back-side plate 3. It is considered that the high thermal conductivity member 4 is provided within a range of 30% of the short-side dimension of the back-side plate 3 from each side of the back-side plate 3.

[0060] 2 and 4, a first heat insulating plate 51 is provided between the heating plate 142b and the base plate 142c. This makes it difficult for heat to be transferred from the heating plate 142b to the base plate 142c, and allows heat to be transferred efficiently from the heating plate 142b to the cavity block 142a.

[0061] 4, a second heat insulating plate 52 is provided between the side block 142a2 and the base member 142a4 that supports the side block 142a2. This makes it difficult for heat to be transferred from the bottom block 142a1 to the base member 142a4, and allows heat to be transferred efficiently from the heating plate 142b to the cavity block 142a.

[0062] 4, a third heat insulating plate 53 is provided between the base member 142a4 of the side block 142a2 and the elastic member 142a3. This makes it difficult for heat to be transferred from the bottom block 142a1 to the elastic member 142a3 via the side block 142a2, and allows heat to be transferred efficiently from the heating plate 142b to the cavity block 142a.

[0063] 2, a fourth insulating plate 54 is provided between the heating plate 141b and the base plate 141c in the upper mold 141. This makes it difficult for heat to be transferred from the heating plate 141b to the base plate 141c, and allows heat to be transferred efficiently from the heating plate 141b to the cavity block 141a.

[0064] Furthermore, in this embodiment, as shown in FIG. 4 , the heating plate 142b and the first insulating plate 51 are fixed together by a first fixing device 61, and the first insulating plate 51 and the base plate 142c are fixed together by a second fixing device 62. Specifically, a countersunk hole 511 is formed in the rear surface (lower surface) of the first insulating plate 51. The first insulating plate 51 is fixed through this countersunk hole 511 by threading a fixing screw, which serves as the first fixing device 61, into a female threaded hole formed in the rear surface (lower surface) of the heating plate 142b. A through hole 142b1 is also formed in the heating plate 142b. The first insulating plate 51 is fixed through this through hole 142b1 by threading a fixing screw, which serves as the second fixing device 62, into a female threaded hole formed in the base plate 142c. The heating plate 141b and the fourth insulating plate 54 are fixed to the upper mold 141 in the same manner.

[0065] Finally, Figure 6 shows (a) the surface temperature distribution of a conventional cavity block (conventional example) without a space or a high thermal conductivity member, (b) the surface temperature distribution of a cavity block (comparative example) with only a high thermal conductivity member, and (c) the surface temperature distribution of a cavity block of this embodiment (this example) with a space and a high thermal conductivity member. The comparative example has a configuration in which a high thermal conductivity member is provided around the periphery of the cavity bottom, as described above. This example has a configuration in which two spaces 14S are provided on either side of the center of the cavity bottom, and a high thermal conductivity member is provided around the periphery of the cavity bottom, as described above.

[0066] In the conventional example, the maximum temperature at the bottom of the cavity was 173.4°C and the minimum temperature was 165.7°C, resulting in a temperature difference of 7.7°C. In the comparative example, the maximum temperature at the bottom of the cavity was 173.7°C and the minimum temperature was 167.7°C, resulting in a temperature difference of 6.0°C. On the other hand, in this example, the maximum temperature at the bottom of the cavity was 174.4°C and the minimum temperature was 169.2°C, resulting in a temperature difference of 5.2°C. As described above, the temperature difference in the comparative example is smaller than that of the conventional example, but by providing a space as in this example, the temperature difference is further reduced. In other words, it was found that by providing a space as in this example, the variation in temperature distribution at the bottom of the cavity is reduced.

[0067] Effect of the Present Embodiment According to the resin molding apparatus 100 of the present embodiment, the bottom block 142a1 of the cavity block 142a in the lower mold 142 is provided with one or more spaces 14S for uniforming the temperature distribution on the surface of the bottom block 142a1, thereby uniforming the temperature distribution on the surface (cavity bottom) of the bottom block 142a1. Specifically, by forming the spaces 14S corresponding to high-temperature areas on the surface of the bottom block 142a1, the spaces 14S make it difficult for heat from the heater 22 to be transmitted to the surface of the bottom block 142a1, thereby uniforming the temperature distribution on the surface of the bottom block 142a1. As a result, the adverse effects of non-uniform temperature distribution on the resin material J can be reduced, and the quality of the resin molded product P can be improved.

[0068] Other Modified Embodiments The present invention is not limited to the above-described embodiments.

[0069] For example, the resin molding module B may have a configuration in which a plurality of molding dies 14 (upper dies 141 and lower dies 142) are arranged vertically.

[0070] Furthermore, although the space 14S in the above embodiment is configured by one or more through holes 3h formed in the rear plate 3, it may also be configured as shown in FIGS. 7(a) to 7(d).

[0071] 7A shows an example in which one or more recesses 3M that become the space 14S are formed in the upper surface of the rear plate 3. Note that one or more recesses 3M that become the space 14S may also be formed in the lower surface (the surface that contacts the heating plate 142b) of the rear plate 3. Even with this configuration, heat from the heater 22 is less likely to be transmitted to the surface of the bottom block 142a1, making it possible to uniformize the temperature distribution on the surface of the bottom block 142a1.

[0072] 7(b) shows an example in which one or more recesses 142aM that become the space 14S are formed on the underside of the bottom block 142a1 (the surface that contacts the heating plate 142b) without dividing the bottom block 142a1 into the front plate 2 and the back plate 3. Even with this configuration, heat from the heater 22 is less likely to be transmitted to the surface of the bottom block 142a1, making it possible to uniformize the temperature distribution on the surface of the bottom block 142a1.

[0073] 7C shows an example in which the space 14S is formed in the heating plate 142b, and one or more recesses 142bM that become the space 14S are formed in the upper surface of the heating plate 142b (the surface that contacts the cavity block 142a). Even with this configuration, heat from the heater 22 is less likely to be transmitted to the surface of the bottom block 142a1, and the temperature distribution on the surface of the bottom block 142a1 can be made uniform.

[0074] 7(d) shows an example in which the heating plate 142b is divided into a front plate 7 and a back plate 8, and one or more through holes 7h that become the space 14S are formed in the front plate 7. One or more recesses that become the space 14S may be formed in the upper surface of the back plate 8. Even with this configuration, heat from the heater 22 is less likely to be transmitted to the surface of the bottom block 142a1, and the temperature distribution on the surface of the bottom block 142a1 can be made uniform.

[0075] The number, arrangement, and shape of the spaces 14S can be set appropriately depending on the temperature distribution on the surface of the cavity block 142a, i.e., the number, arrangement, and shape of the spaces 14S can be set appropriately depending on the configuration and arrangement of the heater 22 that heats the cavity block 142a.

[0076] For example, the shape of each space 14S may be a shape extending in the longitudinal direction in a plan view as in the above embodiment, or may be a shape other than a circular shape in a plan view, or the shapes of the spaces 14S may be different from each other. Furthermore, one or more spaces 14S may be arranged in the lateral direction in a plan view.

[0077] 8(a) , in a rectangular cavity 14C, one or more spaces 14S may include a first space 14S1 formed along the longitudinal direction of the cavity 14C and a second space 14S2 formed along the lateral direction of the cavity 14C so as to intersect with the first space 14S1. The first space 14S1 may have a shape extending along the longitudinal direction in a plan view (see (1) and (2) in FIG. 8(a)), or may have another shape such as a circular shape (see (3) and (4) in FIG. 8(a)). The second space 14S2 may have a shape extending along the lateral direction in a plan view (see (1) and (2) in FIG. 8(a)), or may have another shape such as a circular shape (see (3) and (4) in FIG. 8(a)).

[0078] Furthermore, as shown in Fig. 8(b), in the case of a circular cavity 14C, one or more spaces 14S may be formed in the center of the cavity 14C. Fig. 8(b) shows an example in which multiple spaces 14S are formed in the center, and each space 14S has the same shape, but the shapes of each space 14S may be different from each other.

[0079] Furthermore, a heat insulating material may be provided inside one or more of the spaces 14S in the above embodiment.

[0080] In addition, in the above embodiment, one or more spaces 14S are provided in the cavity block 142a of the lower mold 142, but one or more spaces 14S may also be provided in the cavity block 141a of the upper mold 141 or the heating plate 141b.

[0081] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

[0082] According to the present invention, the temperature distribution on the surface of the cavity block of the upper mold and / or the lower mold can be made uniform.

[0083] REFERENCE SIGNS LIST 100: Resin molding apparatus W: Pre-molded substrate (molded object) P: Resin molded product (molded object) 14: Molding mold 141: Upper mold 141a: Cavity block 141b: Heating plate 141c: Base plate 142: Lower mold 142a: Cavity block 142b: Heating plate 142c: Base plate 14C: Cavity 14S: Space portion 14S1: First space portion 14S2: Second space portion 15: Press portion 16: Molding mold slide mechanism 21, 22: Heater 2: Front side plate 3: Back side plate 3M: Recess 3h: Through hole 4: High thermal conductivity member 51: First heat insulating plate 52: Second heat insulating plate 53: Third heat insulating plate 54: Fourth heat insulating plate 61: First fixing device 62: Second fixing device

Claims

1. A molding die having an upper die and a lower die arranged opposite each other, with a cavity formed in the upper die or the lower die, wherein one of the upper die or the lower die comprises a cavity block whose surface faces the other die, and a heating plate provided on the back surface of the cavity block and having a built-in heater, and at least one of the cavity block or the heating plate has one or more spaces formed therein to make the temperature distribution on the surface of the cavity block uniform.

2. The molding die according to claim 1, wherein the cavity block has a front surface plate whose front surface faces the other die, and a back surface plate provided on the back surface of the front surface plate, and the back surface plate has one or more recesses or one or more through holes formed along the thickness direction, and the space is formed by the recesses or through holes.

3. A molding die according to claim 1 or 2, wherein the one or more spaces are formed inside the cavity when viewed from the clamping direction of the molding die.

4. A mold according to any one of claims 1 to 3, wherein the cavity is rectangular when viewed from the clamping direction of the mold, and the one or more spaces are formed along the longitudinal direction of the cavity.

5. A molding die according to any one of claims 1 to 3, wherein the cavity has a rectangular shape when viewed from the clamping direction of the molding die, and the one or more spaces have a first space formed along the longitudinal direction of the cavity, and a second space formed along the lateral direction of the cavity so as to intersect with the first space.

6. A mold according to any one of claims 1 to 3, wherein the cavity has a circular shape when viewed from the clamping direction of the mold, and the one or more spaces are formed in the center of the cavity.

7. A molding die according to any one of claims 1 to 6, wherein the cavity block is provided with a high thermal conductivity member along the thickness direction at a position different from the space portion when viewed from the mold clamping direction of the molding die.

8. A molding die according to any one of claims 1 to 7, wherein said one die further comprises a base plate on which said cavity block and said heating plate are provided, and an insulating plate is provided between said heating plate and said base plate.

9. The mold according to claim 8, wherein the heating plate and the heat insulating plate are fixed together by a first fixing device, and the heat insulating plate and the base plate are fixed together by a second fixing device.

10. A resin molding device comprising: a molding die according to any one of claims 1 to 9; and a press unit that clamps the molding die.

11. The resin molding apparatus according to claim 10, further comprising a mold slide mechanism for sliding the mold to the outside of the press section.

12. A method for manufacturing a resin molded product by using the resin molding device according to claim 10 or 11 to mold a resin onto a molding object.

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