Electronic device and display device including transistor

Abstract

A display device is provided. The display device may comprise a display panel. The display panel may include pixels, and each of the pixels may include sub-pixels. Each of the sub-pixels may include a first transistor, a second transistor, and an electrical path which electrically connects an electrode of the first transistor and an electrode of the second transistor.

Description

Display devices and electronic devices including transistors

[0001] The disclosed embodiments relate to displays and electronic devices including transistors.

[0002] A display device or an electronic device including a display may include a display driving circuit and a display panel. The display driving circuit may be connected to transistors for pixels of the display panel. Each subpixel of the display panel may be configured to provide current to a light-emitting diode included within the subpixel through a transistor included in each subpixel.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] A display device is provided. The display device may include a display panel. The display panel may include pixels, and each of the pixels may include sub-pixels. Each of the sub-pixels may include a first transistor, a second transistor, and an electrical path electrically connecting an electrode of the first transistor to an electrode of the second transistor. The display panel may include a first layer including the first transistor and the second transistor. The display panel may include a second layer disposed on the first layer. The electrical path may include a first trace connected to the electrode of the first transistor and disposed within the first layer. The display panel may include a second trace connected to the electrode of the second transistor and disposed within the first layer. The display panel may include a conductive portion connecting the first trace of the electrical path to the second trace of the electrical path and disposed within the second layer.

[0005] An electronic device is provided. The electronic device may include a housing and a display disposed on the housing. The display may include a light-emitting layer and a semiconductor circuit disposed under the light-emitting layer. The semiconductor circuit may include a first transistor, a second transistor, and an electrical path electrically connecting an electrode of the first transistor to an electrode of the second transistor. The display panel may include a first layer including the first transistor and the second transistor. The display panel may include a second layer disposed on the first layer. The electrical path may include a first trace connected to the electrode of the first transistor and disposed within the first layer. The display panel may include a second trace connected to the electrode of the second transistor and disposed within the first layer. The display panel may include a conductive portion connecting the first trace of the electrical path to the second trace of the electrical path and disposed within the second layer.

[0006] An electronic device is provided. The electronic device may include a housing and a display disposed on the housing. The display may include a light-emitting layer and a semiconductor circuit disposed below the light-emitting layer. The semiconductor circuit may include a first non-conductive layer, a second non-conductive layer, an active layer disposed between the first non-conductive layer and the second non-conductive layer, a metal layer disposed on a surface of the first non-conductive layer opposite to a surface of the first non-conductive layer proximate the active layer, and contacts penetrating the first non-conductive layer to connect the active layer and the metal layer. The active layer may include a first trace connected to an electrode of a first transistor, and a second trace spaced apart from the first transistor and connected to an electrode of a second transistor. The metal layer may include a conductive portion electrically connected to the first trace of the active layer and the second trace of the active layer through the contacts.

[0007] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0008] FIG. 1A illustrates an example of an unfolded state of a foldable electronic device according to one embodiment.

[0009] FIG. 1B illustrates an example of a folded state of a foldable electronic device according to one embodiment.

[0010] FIG. 1C is an exploded view of a foldable electronic device according to one embodiment.

[0011] FIG. 2 illustrates a light-emitting layer and a semiconductor layer within a display according to one embodiment.

[0012] FIG. 3 illustrates the arrangement of wires connecting thin film transistors included in a semiconductor layer included in a display according to one embodiment.

[0013] FIG. 4 illustrates an example of each of a plurality of sub-pixels within a display, according to one embodiment.

[0014] FIG. 5 illustrates a light-emitting layer and a semiconductor layer within a display, wherein some of the conductive paths are included within a layer disposed beneath the transistors, according to one embodiment.

[0015] FIGS. 6A and 6B illustrate a light-emitting layer and a semiconductor layer within a display, wherein some of the conductive paths are included within a layer disposed over a transistor, according to one embodiment.

[0016] FIGS. 7A and 7B illustrate an emitting layer and a semiconductor layer within a display, wherein some of the conductive paths are contained within another layer disposed beneath the transistors, according to one embodiment.

[0017] FIGS. 8a, 8b, 8c, 9 and 10 illustrate various shapes of a portion of a conductive path according to one embodiment.

[0018] FIG. 11 is a block diagram of an electronic device within a network environment according to various embodiments.

[0019] FIG. 12 is a block diagram (1200) of a display device (1160) according to various embodiments.

[0020] FIG. 1A illustrates an example of an unfolded state of an electronic device according to one embodiment, FIG. 1B illustrates an example of a folded state of an electronic device according to one embodiment, and FIG. 1C is an exploded view of the electronic device according to one embodiment.

[0021] Referring to FIGS. 1A, 1B, and 1C, the electronic device (100) may include a first housing part (110), a second housing part (120), and a foldable display (130). The electronic device (100) may be referred to as a foldable electronic device at the point where it folds around a folding axis (137).

[0022] The electronic device (100) may include a first housing part (110), a second housing part (120), a hinge structure (160), a foldable display (130), a printed circuit board (150), a display (135), and / or a back plate (190). According to one embodiment, the electronic device (100) may omit at least one of the components or additionally include other components.

[0023] In one embodiment, the first housing part (110) may form a portion of an outer surface of the electronic device (100). The first housing part (110) may include a first surface (111), a second surface (112) facing away from the first surface (111), and a first side surface (113) surrounding at least a portion of the first surface (111) and the second surface (112). In one embodiment, the first housing part (110) may provide a space defined by the first surface (111), the second surface (112), and the first side surface (113) as a space for arranging components of the electronic device (100).

[0024] In one embodiment, the second side (123) may be pivotally connected to the first side (113) via a hinge structure (160) disposed on a hinge cover (165). The hinge structure (160) may include a hinge module and hinge plates (166, 167). The hinge plates may include a first hinge plate (166) and a second hinge plate (167), and the first hinge plate (166) may be connected to the first housing part (110), and the second hinge plate (167) may be connected to the second housing part (120).

[0025] In one embodiment, the second housing part (120) may include a third face (121), a fourth face (122) facing and spaced from the third face (121), and a second side (123) surrounding at least a portion of the third face (121) and the fourth face (122). The second housing part (120) may provide a space defined by the third face (121), the fourth face (122), and the second side (123) as a space for arranging components of the electronic device (100).

[0026] In one embodiment, the foldable display (130) may include a window exposed to the outside. The window may protect the surface of the foldable display (130) and may be formed of a transparent material to transmit visual information provided from the foldable display (130) to the outside. The window may include a glass material such as ultra-thin glass (UTG) or a polymer material such as polyimide (PI).

[0027] In one embodiment, the foldable display (130) may form at least a portion of a first side (111) of the first housing part (110) (e.g., a front side of the first housing part (110)) and a third side (121) of the second housing part (120) (e.g., a front side of the second housing part (120)). The foldable display (130) may be disposed on the first side (111) of the first housing part (110) and the third side (121) of the second housing part (120) across a hinge structure (160) within a hinge cover (165). The foldable display (130) may be configured to bend within a folded state of the electronic device (100) by the hinge structure (160). The foldable display (130) may include a first display area (131), a second display area (132), and a third display area (133). For example, the foldable display (130) may include a first display area (131) disposed on a first surface (111) of a first housing part, a second display area (132) disposed on a third surface (121) of a second housing part, and a third display area (133) between the first display area (131) and the second display area (132). The foldable display (130) may be supported by a first support portion (170) of the first housing part (110) and a second support portion (180) of the second housing part (120).

[0028] According to one embodiment, the foldable display (130) may include an opening formed in a portion of the screen display area, or a supporting portion (e.g., a bracket) that supports the foldable display (130) may include a recess or an opening. The electronic device (100) may include at least one camera aligned with the recess or the opening. For example, the first display area (131) may further include at least one camera (136) that can acquire an image from the outside through a portion of the first display area (131). According to one embodiment, at least one camera (136) may be included on the rear surface of the foldable display (130) corresponding to the first display area (131) or the second display area (132) of the foldable display (130). For example, the at least one camera (136) may be disposed below the foldable display (130) and may be surrounded by the foldable display (130). At least one camera (136) may be an under-display camera (UDC) that is covered by the foldable display (130) and is not exposed to the outside. However, the present invention is not limited thereto, and the foldable display (130) may include an opening that exposes at least one camera (136) to the outside. In one embodiment, the camera (136) may acquire images of the external environment and / or external objects through the opening.

[0029] In one embodiment, the fourth side (122) of the second housing part (120) may further include at least one camera (134) and display (135) exposed through a portion of the fourth side (122).

[0030] In one embodiment, the hinge structure (160) may be configured to pivotally connect a first support portion (170) forming a first housing part (110) and a second support portion (180) forming a second housing part (120).

[0031] In one embodiment, the electronic device (100) may be in one of a folded state, an unfolded state, or an intermediate state. The folded state may be a state in which the first surface (111) of the first housing part (110) and the third surface (121) of the second housing part (120) face each other. In the folded state, the direction in which the first surface (111) faces and the direction in which the third surface (121) faces may be opposite to each other. The unfolded state may be a state in which the first surface (111) of the first housing part (110) and the third surface (121) of the second housing part (120) are substantially continuous planes. In the unfolded state, the direction in which the first surface (111) faces and the direction in which the third surface (121) faces may be the same. The intermediate state may be a state between the unfolded state and the folded state. In the intermediate state, the direction in which the first side (111) faces and the direction in which the third side (121) faces may be different.

[0032] In one embodiment, while the electronic device (100) is in a folded state, the hinge cover (165) surrounding the hinge structure (160) may be at least partially exposed between the first housing part (110) and the second housing part (120). In another embodiment, while the electronic device (100) is in an unfolded state, the hinge cover (165) may be covered by the first housing part (110) and the second housing part (120).

[0033] In one embodiment, the electronic device (100) can be folded about a folding axis (137) passing through the hinge cover (165) or the hinge structure (160). For example, the hinge structure (160) within the hinge cover (165) can be positioned between the first housing part (110) and the second housing part (120) of the electronic device (100) to enable the electronic device (100) to be bent, curved, or folded. For example, the first housing part (110) can be connected to the second housing part (120) through the hinge structure (160) positioned within the hinge cover (165) and can be rotated about the folding axis (137).

[0034] In one embodiment, the electronic device (100) can be folded such that the first housing part (110) and the second housing part (120) face each other by rotating about the folding axis (137). In one embodiment, the electronic device (100) can be folded such that the first housing part (110) and the second housing part (120) cover or overlap each other.

[0035] The hinge structure (160) may include a hinge module and a hinge plate (166, 167). The hinge module may include a hinge gear (162) that enables the first housing part (110) and the second housing part (120) to pivot.

[0036] The first housing part (110) may include a first support part (170), and the second housing part (120) may include a second support part (180). The first support part (170) may be partially surrounded by the first side (113), and the second support part (180) may be partially surrounded by the second side (123). The first support part (170) may be formed integrally with the first side (113), and the second support part (180) may be formed integrally with the second side (123). According to one embodiment, the first support part (170) may be formed separately from the first side (113), and the second support part (180) may be formed separately from the second side (123). The first side (113) and the second side (123) may be formed of a metallic material, a non-metallic material, or a combination thereof. For example, the first side (113) may include a conductive portion (118) and a non-conductive portion (119). The conductive portion (118) may be used as a radiator of an antenna.

[0037] One side of the first support portion (170) can be coupled with the rear plate (190), and the other side of the first support portion (170) can be coupled with the foldable display (130). One side of the second support portion (180) can be coupled with the display (135), and the other side of the second support portion (180) can be coupled with the foldable display (130).

[0038] A printed circuit board (150) and a battery may be placed in the space between the surface formed by the first support portion (170) and the second support portion (180) and the surface formed by the display (135) and the rear plate (190). The printed circuit board (150) may be separated so that it may be placed in each of the first support portion (170) of the first housing part (110) and the second support portion (180) of the second housing part (120). Components for implementing various functions of the electronic device (100) may be placed on the printed circuit board (150).

[0039] FIG. 2 illustrates a light-emitting layer and a semiconductor layer within a display according to one embodiment.

[0040] Referring to FIG. 2, the electronic device (101) may include a display (130). The electronic device (101) may be a foldable device having a folding axis in the longitudinal direction (e.g., the folding axis (137) of FIG. 1A) as illustrated in FIGS. 1A, 1B, and 1C. The electronic device (101) may be replaced with an electronic device (291) which is a foldable device having a folding axis in the width direction perpendicular to the longitudinal direction, or with an electronic device (292) which is a foldable device (or a multi-foldable device) having two or more folding axes, or with an electronic device (293) which is a rollable device that slides into or out of a housing. The electronic device (101) may be replaced with an electronic device (294) which does not change state. The following descriptions exemplified for the electronic device (101) are merely exemplary, and the following descriptions may be applied to the electronic device (291), the electronic device (292), and the electronic device (293). For example, the window (230) exemplified by the descriptions below may be included in the electronic device (291) with the window (230) rotated 90 degrees.

[0041] The electronic device (101) may include a display (130) (or display panel). The display (130) may include pixels, and each of the pixels may include sub-pixels.

[0042] Each sub-pixel of the display (130) may include a cathode terminal and an anode terminal (240). The sub-pixel may emit light to the outside through an organic light-emitting diode.

[0043] The portion illustrated in FIG. 2 may be one sub-pixel. The display (130) may include layers including semiconductors. For example, the display (130) may include layers constituting a thin film transistor. The illustrated examples in FIG. 2 illustrate layers constituting a thin film transistor. Each of the sub-pixels may include a first transistor and a second transistor. The electrode of the first transistor illustrated in FIG. 2 may represent a gate electrode. The electrode of the second transistor may represent a gate electrode. Each of the sub-pixels may include an electrical path that electrically connects the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor.

[0044] The display (130) may include a first layer (201) formed of a polymer material. The polymer material may include polyimide (PI). The first layer (201) may function as a substrate of the display (130). A semiconductor for driving the display (130) or a semiconductor layer including the semiconductor may be disposed on the first layer (201). A plurality of materials may be laminated on the first layer (201), which is the substrate. An array of pixels including sub-pixels or sub-pixels may be disposed on the first layer (201). For example, rows and columns of pixels including sub-pixels or sub-pixels may be disposed on the first layer (201). A display driving circuit may be connected to a conductive path disposed on the first layer (201) via solder or a conductive adhesive material.

[0045] The display (120) may further include a second layer (202). The second layer (202) may surround the first transistor and the second transistor included in the second layer (202). The second layer (202) may be an interlayer interposed between the first layer (201) and the third layer (203). The second layer (202) may include a silicon nitride layer and / or a silicon oxide layer (224). The electrodes (221-1, 221-2) of the transistor may be covered by the second layer (202). The source-drain contacts (225) may contact the polysilicon layer that contacts the electrodes (221-1, 221-2) of the transistor, thereby forming a thin film transistor.

[0046] The electrode (221-1) of the first transistor may be electrically connected to the electrode (221-2) of the second transistor. An electrical path between the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor may include a first portion (223-1), a second portion (223-2), and a third portion (231). The first portion (223-1), the second portion (223-2), and the third portion (231) may be formed of a conductive material. The first portion (223-1), the second portion (223-2), and the third portion (231) may be represented as conductive portions. The first portion (223-1), the second portion (223-2), and the third portion (231) may provide an electrical path together with traces.

[0047] The display (130) may further include a third layer (203). Metal layers (or metal wires) disposed on the third layer may be electrically connected to electrodes (221-1, 221-2) of the transistor via contacts (225). However, the present invention is not limited thereto. For example, some of the metal layers disposed on the third layer may be replaced with conductive layers. For example, the conductive layer may include wires formed from indium tin oxide (ITO). Some of the wires constituting the transistor may be disposed on the third layer (203). For example, some of the wires or conductive traces electrically connecting the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor may be disposed on the third layer (203). Among the above wiring or conductive traces, a portion disposed between the first layer (201) and the second layer (202) may include polysilicon or a semiconductor material, and a portion disposed between the second layer (202) and the third layer (203) may include a metal or a conductive material. The third layer (203) may be a polymer layer that functions as an insulating layer. The third layer (203) may be interposed between layers on which semiconductors are disposed and electrodes of sub-pixels (e.g., anode electrode (240)). The wiring or conductive trace may be connected to electrodes of each of the transistors and may transmit an electrical signal, voltage, or current to the electrodes of the transistors.

[0048] The display (130) may further include a fourth layer (204). The fourth layer (204) may be a pixel definition layer (PDL). The fourth layer (204) may define a location where an organic light-emitting material or an organic light-emitting layer disposed on the anode electrode (240) is to be disposed. The organic light-emitting material may be disposed in an open portion of the fourth layer (204) where the anode electrode (240) is disposed. The fourth layer (204) may distinguish a light-emitting area of ​​each sub-pixel.

[0049] The display (130) may include a second layer (202) including a first transistor (or an electrode (221-1) of the first transistor) and a second transistor (or an electrode (221-2) of the second transistor). The electrode (221-1) of the first transistor may be connected to a first portion (223-1) of a conductive path. For example, the first portion (223-1) of the conductive path may be connected to a portion of a trace (211-1) extending from the electrode (221-1) of the first transistor. The electrode (221-2) of the second transistor may be connected to a second portion (223-2) of the conductive path. For example, the second portion (223-2) of the conductive path may be connected to a portion of a trace (211-2) extending from the electrode (221-2) of the second transistor. Trace (211-1) and trace (211-2) may include a semiconductor material. For example, the trace may include a polyceramic or ceramic material. Trace (211-1) and trace (211-2) including a semiconductor material may transmit electrical signals, currents, and voltages to electrodes of a transistor. For example, the trace may function as a wiring. The trace may provide an electrical path.

[0050] The first portion (223-1) and the second portion (223-2) may be identical to or similar to the contacts (225) penetrating the second layer (202). For example, the first portion (223-1) and the second portion (223-2) may electrically connect the electrode of the transistor or the portion connected to the electrode with a metal or conductive portion disposed on the second layer (202) similar to a contact. For example, the first portion (223-1) may be connected to one end of the third portion (231) disposed between the second layer (202) and the third layer (203) and the trace (211-1) connected to the electrode (221-1) of the first transistor. The second part (223-2) can be connected to a trace (211-2) that is connected to another end of the third part (231) disposed between the second layer (202) and the third layer (203) and the electrode (221-2) of the second transistor.

[0051] The first portion (223-1) and the second portion (223-2) may be formed by protruding from each end of the third portion (231). For example, the first portion (223-1) and the second portion (223-2) may be protruding portions that penetrate the second layer (202) from the third portion (231) disposed on the second layer (202). For example, the first portion (223-1) may protrude into the second layer (202) from one end of the third portion (231) to contact the trace (211-1) connected to the electrode (221-1) of the first transistor. The second portion (223-2) may protrude into the second layer (202) from one end of the third portion (231) to contact the trace (211-2) connected to the electrode (221-2) of the second transistor.

[0052] The electrical path may replace a portion of the wiring or trace (211-1 or 211-2) connecting the first transistor and the second transistor. The electrical path disposed in the thin film transistor disposed within the display (130) may be formed of silicon or crystalline silicon. The wiring connecting the thin film transistor, which is a semiconductor formed of silicon, may be vulnerable to external impact. A break in the trace or wiring may cause pixel defects in the sub-pixels of the display (130).

[0053] In a foldable electronic device (e.g., electronic device (101), electronic device (291), electronic device (292)) or a rollable electronic device (e.g., electronic device (293)), the outer protective layers of the display (130) may also be flexible to allow deformation of the display. The display (130) of the foldable electronic device or rollable electronic device may be relatively more vulnerable to external impact than the electronic device (294). Due to frequent deformation of the display (130), the trace (211-1 or 211-2) may be disconnected.

[0054] In order to resolve defects (e.g., bright spots or dark spots) of the display (130) due to trace disconnection, a metal film having higher ductility than the silicon material trace may be used as a conductive path. The portion where the trace is arranged may be the lower part of the display. The lower part of the display (130) may be spaced farther away from the neutral plane of the display (130) of the foldable electronic device or the rollable electronic device, where tensile strain is low. In a portion arranged further down from the neutral plane, a stronger tensile stress may be applied, which may increase the breakage of the trace. The first part (223-1), the second part (223-2), and the third part (231) of the conductive path replacing the trace may be formed from a metal having a lower Young's modulus than silicon. The third part (231) of the conductive path may be arranged in a layer (e.g., the third layer) arranged above the layer where the transistors are arranged so as to be adjacent to the neutral plane of the display (130).

[0055] Through Figure 3, the part where the trace is replaced with a conductive path is described.

[0056] FIG. 3 illustrates the arrangement of wires connecting thin film transistors included in a semiconductor layer included in a display according to one embodiment. FIG. 4 illustrates examples of each of a plurality of sub-pixels within a display according to one embodiment.

[0057] Referring to FIGS. 3 and 4, each of the plurality of sub-pixels may include a light-emitting element (300) (e.g., a light-emitting diode (300) or an OLED (300)), a first transistor (301) (e.g., the driving transistor), a second transistor (302) (e.g., the switching transistor), a third transistor (303) (e.g., the compensation transistor), a fourth transistor (304) (e.g., the initialization transistor), a fifth transistor (305) (e.g., the operation control transistor), a sixth transistor (306) (e.g., the light-emitting control transistor), a seventh transistor (307) (e.g., a bypass transistor), an eighth transistor (308) (e.g., a threshold voltage adjustment transistor), a capacitor (309) (e.g., a storage capacitor), and a capacitor (310) (e.g., a boost capacitor). The components, their relationships, and their functions within each of the plurality of sub-pixels illustrated in FIGS. 3 and 4 are exemplary only and do not limit the implementations described or claimed in this document.

[0058] Referring to FIG. 3, the electrical paths connecting the transistors may have portions overlapping with the gate lines (311-1, 311-2). The overlapping portions may function as channels. The electrodes of the transistors may be one of the overlapping portions (P1, P2, P3, P4). The traces extending between the portions functioning as channels may be extended to a long length. Among the portions of the traces, a portion that is relatively vulnerable to external impact may be replaced with a third portion (231) of a conductive path made of a conductive material. The third portion (231) may be connected to a trace (e.g., trace (211-1) or trace (211-2) of FIG. 2) that is connected to an electrode of the transistor by a contact defined by the first portion (223-1) and the second portion (223-2). Transistors (391, 392) connected to the parts corresponding to the channels (P1, P2, P3, P4) are explained through Fig. 4, which will be described later.

[0059] Referring to FIG. 4, the gate (G) of the first transistor (301) may be connected to the drain (D) of the third transistor (303). For example, the gate (G) of the first transistor (301) may be connected to the drain (D) of the fourth transistor (304). For example, the gate (G) of the first transistor (301) may be connected to a capacitor (309) used to store a data voltage (Vdata). For example, the gate (G) of the first transistor (301) may be connected to a capacitor (310) used to compensate for a voltage drop caused by stopping providing the third signal (S3). For example, the source of the first transistor (301) may be connected to the drain of the second transistor (302). For example, the source of the first transistor (301) may be connected to the drain of the fifth transistor (305). For example, the drain of the first transistor (301) may be connected to the source of the third transistor (303). For example, the drain of the first transistor (301) may be connected to the source of the sixth transistor (306). For example, the first transistor (301) may be used to provide a current (320) according to a data voltage (Vdata) to the light emitting diode (300).

[0060] For example, the gate of the second transistor (302) may be configured to receive a third signal (S3). For example, the source of the second transistor (302) may be configured to obtain a data voltage (Vdata).

[0061] For example, the gate of the third transistor (303) may be configured to receive the second signal (S2).

[0062] For example, the gate of the fourth transistor (304) may be configured to receive a first signal (S1). For example, the source of the fourth transistor (304) may be configured to obtain a first initialization voltage (Vint1) (e.g., about -3.5 (V)).

[0063] For example, the gate of the fifth transistor (305) may be configured to receive the light emission signal (S5). For example, the source of the fifth transistor (305) may be configured to obtain the first driving voltage (VDD).

[0064] For example, the gate of the sixth transistor (306) may be configured to receive a light emitting signal (SE). For example, the drain of the sixth transistor (306) may be connected to the source of the seventh transistor (307). For example, the drain of the sixth transistor (306) may be connected to the anode of the light emitting element (300).

[0065] For example, the gate of the seventh transistor (307) may be configured to receive a third signal (S3). For example, the drain of the seventh transistor (307) may be configured to obtain a second initialization voltage (Vint2) (e.g., about -3 (V)).

[0066] For example, the cathode of the light emitting element (300) can be configured to obtain a second driving voltage (VSS).

[0067] For example, the display driving circuit (220) can display an image on the display panel (240) based on providing a first signal (S1), a second signal (S2), a third signal (S3), and a light emitting signal (SE) to each of the plurality of sub-pixels.

[0068] Referring to FIGS. 3 and 4, if the wiring (or trace) between the drain of the first transistor (301) and the source of the sixth transistor (306) is disconnected, the current transmitted to the light-emitting element (300) cannot be supplied, and thus a dark spot in which the sub-pixel does not operate may occur. If the wiring between the drain of the first transistor (301) and the source of the sixth transistor (306) is disconnected, the current (320) transmitted to the light-emitting element may not be generated.

[0069] If the wiring (or trace) between the drain of the second transistor (302) and the drain of the fifth transistor (305) is short-circuited, the fifth transistor (301) may not be able to obtain the data signal through the data line, thereby providing a bright spot during light-emitting operation. For example, according to the third signal (S3), the current of the data voltage (Vdata) transmitted through the drain of the second transistor (302) may not be transmitted to the first transistor (301).

[0070] By arranging a conductive path (contact portion (223) and third portion (231)) formed of a metal material in the area where wiring is arranged between the drain of the first transistor (301) and the source of the sixth transistor (306) (306), trace disconnection can be reduced.

[0071] According to the above-described embodiment, the display device can maintain a conductive path without being disconnected by replacing the wiring in a portion vulnerable to external impact for the thin film transistor with a wiring formed of a metal having a low Young's modulus and high ductility.

[0072] FIG. 5 illustrates a light-emitting layer and a semiconductor layer within a display, wherein some of the conductive paths are included within a layer disposed beneath the transistors, according to one embodiment.

[0073] Referring to FIG. 5, the display (130) of FIG. 5 may further include a fifth layer (505) positioned below the second layer (202) in the lower structure of the display of FIG. 2. For example, the fifth layer (505) may be interposed between the first layer (201) and the second layer (202).

[0074] The electrode (221-1) of the first transistor may be electrically connected to the electrode (221-2) of the second transistor. The electrical path between the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor may include a first portion (523-1), a second portion (523-2), and a third portion (531).

[0075] The electrode (221-1) of the first transistor may be connected to a first portion (523-1) of the conductive path. For example, the first portion (523-1) of the conductive path may be connected to a portion of the trace (211-1) extending from the electrode (221-1) of the first transistor. The electrode (221-2) of the second transistor may be connected to a second portion (523-2) of the conductive path. For example, the second portion (523-2) of the conductive path may be connected to a portion of the trace (211-2) extending from the electrode (221-2) of the second transistor. The first portion (523-1) and the second portion (523-2) may electrically connect the electrode of the transistor or a portion connected to the electrode with a metal or conductive portion disposed under the fifth layer (505), similar to a contact. For example, the first portion (523-1) may be connected to a trace (211-1) that is connected to one end of the third portion (531) disposed between the first layer (201) and the fifth layer (505) and the electrode (221-1) of the first transistor. The second portion (523-2) may be connected to a trace (211-2) that is connected to the other end of the third portion (531) disposed between the first layer (201) and the fifth layer (205) and the electrode (221-2) of the second transistor.

[0076] The first portion (523-1) and the second portion (523-2) may be formed by protruding from each end of the third portion (531). For example, the first portion (523-1) and the second portion (523-2) may be protruding portions that penetrate the fifth layer (505) from the third portion (531) that is positioned between the first layer (201) and the fifth layer (505). For example, the first portion (523-1) may protrude into the fifth layer (505) from one end of the third portion (531) to contact the trace (211-1) that is connected to the electrode (221-1) of the first transistor. The second portion (523-2) may protrude into the fifth layer (505) so as to contact the trace (211-2) connected to the electrode (221-2) of the second transistor from one end of the third portion (531).

[0077] The widths of the third portion (531) formed of metal and the first trace (211-1) and second trace (211-2) formed of ceramic or polyceramic may be different. For example, the width of the third portion (531) having low electrical resistance and high ductility may be formed relatively narrow.

[0078] If the electronic device (100) on which the display (130) is disposed is an infoldable electronic device, the tensile stress applied to the lower portion of the display (130) can be reduced. By replacing a portion of the trace with a high possibility of disconnection with a third portion (531) disposed below the traces (211-1, 211-2), the robustness of the wiring can be increased. However, the present invention is not limited thereto, and if the electronic device (100) on which the display (130) is disposed is an outfoldable electronic device, the tensile stress applied to the upper portion of the display (130) can be reduced. The third portion (531), which is a portion of the trace with a high possibility of disconnection, can be disposed above the traces (211-1, 211-2). For example, the third portion (531) can be disposed on the second layer (202). The third part (531) positioned above the traces (211-1, 211-2) can increase the robustness of the wiring.

[0079] The third portion (531) may be formed from a material having higher ductility and lower Young's modulus than the traces (211-1, 211-2) connected to the electrodes of the transistor. For example, the third portion (531) may be formed from a metal material having a lower Young's modulus than the traces (211-1, 211-2) formed from polysilicon or silicon. For example, since the third portion (531) has a low Young's modulus, even when subjected to external impact or deformation of the electronic device, the tensile stress applied to the third portion (531) is small, thereby reducing the possibility of disconnection and reducing defects in the display (130) due to use. The third portion (531) may be moved lower than the existing traces from the surface of the display (130), thereby reducing external impact.

[0080] FIGS. 6A and 6B illustrate a light-emitting layer and a semiconductor layer within a display, wherein some of the conductive paths are included within a layer disposed over a transistor, according to one embodiment.

[0081] Unlike FIG. 5, the display (130) of FIG. 6A may further include a fifth layer (605) disposed on the second layer (202) in the lower structure of the display of FIG. 2. For example, the fifth layer (605) may be interposed between the second layer (202) and the third layer (203).

[0082] The electrode (221-1) of the first transistor may be electrically connected to the electrode (221-2) of the second transistor. The electrical path between the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor may include a first portion (625-1), a second portion (625-2), and a third portion (631).

[0083] The electrode (221-1) of the first transistor may be connected to a first portion (625-1) of the conductive path. For example, the first portion (625-1) of the conductive path may be connected to a portion of the trace (211-1) extending from the electrode (221-1) of the first transistor. The electrode (221-2) of the second transistor may be connected to a second portion (625-2) of the conductive path. For example, the second portion (625-2) of the conductive path may be connected to a portion of the trace (211-2) extending from the electrode (221-2) of the second transistor. The first portion (625-1) and the second portion (625-2) may electrically connect the electrode of the transistor or a portion connected to the electrode with a metal or conductive portion disposed on the fifth layer (505), similar to a contact. For example, the first portion (625-1) may be connected to a trace (211-1) that is connected to one end of the third portion (531) disposed between the first layer (201) and the fifth layer (505) and the electrode (221-1) of the first transistor. The second portion (625-2) may be connected to a trace (211-2) that is connected to the other end of the third portion (631) disposed between the first layer (201) and the fifth layer (205) and the electrode (221-2) of the second transistor.

[0084] The first portion (625-1) and the second portion (625-2) may be connected to conductive vias (655-1, 655-2) formed by protruding from each end of the third portion (531), respectively. For example, the first portion (625-1) and the second portion (625-2) may be contacts penetrating the second layer (202), and each contact may be connected to a corresponding conductive via. The first portion (625-1) may extend from the trace (211-1) of the first transistor toward the fifth layer (605) and may protrude or extend to be connected to the first conductive via (655-1). The second portion (625-2) may extend from the trace (211-2) of the second transistor toward the fifth layer (605) and may be connected to the second conductive via (655-2) by protruding or extending. The conductive path may be formed from the first portion (625-1), the second portion (625-2), the third portion (631), and the conductive vias (655-1, 655-2). The conductive path may be further spaced upward from the surface on which the traces (211-1, 211-2) are arranged, thereby further separating the conductive path from the neutral plane.

[0085] The widths of the third portion (631) formed of metal and the first trace (211-1) and second trace (211-2) formed of ceramic or polyceramic may be different. For example, the width of the third portion (631) having low electrical resistance and high ductility may be formed relatively narrow.

[0086] If the electronic device (100) on which the display (130) is disposed is an out-foldable electronic device, the tensile stress applied to the upper portion of the display (130) can be reduced. The third portion (631), which is a portion of the trace with a high possibility of disconnection, can be disposed above the traces (211-1, 211-2). However, the present invention is not limited thereto, and if the electronic device (100) on which the display (130) is disposed is an in-foldable electronic device, the tensile stress applied to the lower portion of the display (130) can be reduced. By replacing a portion of the trace with a high possibility of disconnection with the third portion (631) disposed below the traces (211-1, 211-2), the robustness of the wiring can be increased. A structure in which the third portion (631) is disposed below the traces (211-1, 211-2) will be described later with reference to FIGS. 7A and 7B.

[0087] The third part (631) formed of a metal having a lower Young's modulus than silicon has a lower Young's modulus, so that even when subjected to external impact or deformation of the electronic device, the tensile stress applied is small, thereby reducing the possibility of short circuiting and reducing defects in the display (130) due to use.

[0088] Referring to FIG. 6B, the display (130) may include an electrical path between the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor, including a first portion (725-1), a second portion (725-2), a third portion (631), and a fourth portion (631a). The display (130) of FIG. 6B may be substantially the same as the display (130) of FIG. 6A, except for the fourth portion (631a).

[0089] The electrode (221-1) of the first transistor may be connected to the first portion (625-1) of the conductive path. The electrode (221-2) of the second transistor may be connected to the second portion (625-2) of the conductive path. The first portion (625-1) and the second portion (625-2) may be connected to conductive vias (655-1, 655-2) formed by protruding from each end of the third portion (631), respectively. The first portion (625-1) may extend from the trace (211-1) of the first transistor toward the fifth layer (605) and may be connected to the first conductive via (655-1) by protruding or extending. The second portion (625-2) may protrude or extend from the trace (211-2) of the second transistor toward the fifth layer (605) and be connected to the second conductive via (655-2).

[0090] The fourth portion (631a) forming a conductive path can connect the first conductive via (655-1) and the second conductive via (655-2). The fourth portion (631a) can be disposed on the fifth layer (605). The fourth portion (631a) can provide a conductive path that complements the third portion (631). For example, when the third portion (631) (or the fourth portion (631a)) is disconnected, the conductive path can be provided through the fourth portion (631a) (or the third portion (631)).

[0091] The widths of the third portion (631) and the fourth portion (631a) may be formed differently. For example, the width of the third portion (631) positioned at the top may be thinner. In the case of an outfolding electronic device, the tensile stress applied to the fourth portion (631a) may increase while changing to a folded state, and thus, in order to reduce short circuits, the fourth portion (631a) may be formed thicker than the third portion (631). For example, the width of the third portion (631) positioned at the top may be thicker. In the case of an infolding electronic device, the tensile stress applied to the third portion (631) may increase while changing to a folded state, and thus, in order to reduce short circuits, the third portion (631) may be formed thicker than the fourth portion (631a).

[0092] FIGS. 7A and 7B illustrate an emitting layer and a semiconductor layer within a display, wherein some of the conductive paths are contained within another layer disposed beneath the transistors, according to one embodiment.

[0093] Referring to FIG. 7A, the display (130) may further include a fifth layer (705) positioned below the second layer (202) in the lower structure of the display of FIG. 2, similar to FIG. 5. The display (130) may further include a sixth layer (706) positioned below the fifth layer (705) in the display of FIG. 5.

[0094] The electrode (221-1) of the first transistor may be electrically connected to the electrode (221-2) of the second transistor. The electrical path between the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor may include a first portion (725-1), a second portion (725-2), and a third portion (731).

[0095] The electrode (221-1) of the first transistor may be connected to a first portion (725-1) of the conductive path. For example, the first portion (725-1) of the conductive path may be connected to a portion of the trace (211-1) extending from the electrode (221-1) of the first transistor. The electrode (221-2) of the second transistor may be connected to a second portion (725-2) of the conductive path. For example, the second portion (625-2) of the conductive path may be connected to a portion of the trace (211-2) extending from the electrode (221-2) of the second transistor. The first portion (725-1) and the second portion (725-2) may electrically connect the electrode of the transistor or a portion connected to the electrode with a metal or conductive portion disposed between the sixth layer (706) and the first layer (201), similar to a contact. For example, the first portion (725-1) may be connected to a trace (211-1) that is connected to one end of the third portion (731) disposed between the first layer (201) and the sixth layer (506) and the electrode (221-1) of the first transistor. The second portion (725-2) may be connected to a trace (211-2) that is connected to the other end of the third portion (731) disposed between the first layer (201) and the sixth layer (706) and the electrode (221-2) of the second transistor.

[0096] The first portion (725-1) and the second portion (725-2) may be connected to conductive vias (755-1, 755-2) formed by protruding from each end of the third portion (731), respectively. For example, the first portion (725-1) and the second portion (725-2) may be contacts penetrating the fifth layer (705), and each contact may be connected to a corresponding conductive via. The first portion (725-1) may extend from the trace (211-1) of the first transistor toward the sixth layer (706) and may protrude or extend to be connected to the first conductive via (755-1). The second portion (725-2) may protrude or extend from the trace (211-2) of the second transistor toward the sixth layer (706) and be connected to the second conductive via (755-2). The conductive path may be formed from the first portion (725-1), the second portion (725-2), the third portion (731), and the conductive vias (755-1, 755-2). The conductive path may be spaced further upward from the surface on which the traces (211-1, 211-2) are arranged, thereby further separating the conductive path from the neutral plane. When the electronic device (100) on which the display (130) is arranged is an infoldable electronic device, the tensile stress applied to the lower portion of the display (130) may be reduced. The robustness of the wiring can be improved by replacing a portion of the trace with a third portion (631) positioned lower than the traces (211-1, 211-2), which is likely to be short-circuited. The conductive path moved upward can be subjected to a tensile stress lower than that applied to the traces (211-1, 211-2).

[0097] The widths of the third portion (731) formed of metal and the first trace (211-1) and second trace (211-2) formed of ceramic or polyceramic may be different. For example, the width of the third portion (731) having low electrical resistance and high ductility may be formed relatively narrow.

[0098] The third part (731) formed of a metal having a lower Young's modulus than silicon has a lower Young's modulus, so that even when subjected to external impact or deformation of the electronic device, the tensile stress applied is small, thereby reducing the possibility of short circuiting and reducing defects in the display (130) due to use.

[0099] Referring to FIG. 7B, the display (130) may include an electrical path between the electrode (221-1) of the first transistor and the electrode (221-2) of the second transistor, including a first portion (725-1), a second portion (725-2), a third portion (731), and a fourth portion (731a). The display (130) of FIG. 7B may be substantially the same as the display (130) of FIG. 7A, except for the fourth portion (731a).

[0100] The electrode (221-1) of the first transistor may be connected to the first portion (725-1) of the conductive path. The electrode (221-2) of the second transistor may be connected to the second portion (725-2) of the conductive path. The first portion (725-1) and the second portion (725-2) may be connected to conductive vias (755-1, 755-2) formed by protruding from each end of the third portion (731), respectively. The first portion (725-1) may extend from the trace (211-1) of the first transistor toward the sixth layer (706) and may be connected to the first conductive via (755-1) by protruding or extending. The second portion (725-2) may protrude or extend from the trace (211-2) of the second transistor toward the sixth layer (706) and be connected to the second conductive via (755-2).

[0101] The fourth portion (731a) forming a conductive path can connect the first conductive via (755-1) and the second conductive via (755-2). The fourth portion (731a) can be disposed on the sixth layer (706). The fourth portion (731a) can provide a conductive path that complements the third portion (731). For example, when the third portion (731) (or the fourth portion (731a)) is disconnected, the conductive path can be provided through the fourth portion (731a) (or the third portion (731)).

[0102] The widths of the third portion (731) and the fourth portion (731a) may be formed differently. For example, the width of the fourth portion (731a) positioned at the top may be thicker. In the case of an infolding electronic device, the tensile stress applied to the fourth portion (731a) may increase while changing to a folded state, and thus, in order to reduce short circuits, the fourth portion (731a) may be formed thicker than the third portion (731). For example, the width of the fourth portion (731a) positioned at the top may be thinner. In the case of an outfolding electronic device, the tensile stress applied to the third portion (731) may increase while changing to a folded state, and thus, in order to reduce short circuits, the third portion (731) may be formed thicker than the fourth portion (731a).

[0103] FIGS. 8a, 8b, 8c, 9 and 10 illustrate various shapes of a portion of a conductive path according to one embodiment.

[0104] Referring to FIGS. 8a, 8b, and 8c, the conductive portions (810, 820, and 830) corresponding to the third portion (the third portion of FIG. 2, the third portion (531) of FIG. 5, the third portion (631) of FIG. 6a, and the third portion (731) of FIG. 7a) may have various shapes.

[0105] The shape of the conductive portions (810, 820, 830) may be determined depending on the device positioned beneath the subpixel. For example, if an optical sensor (e.g., an ambient light sensor or a camera) is positioned beneath the display panel, the shape of the wiring may be modified to provide an optical path. For example, the conductive portions (810, 820, 830) may be positioned along the periphery of the optical sensor to avoid the optical path of the optical sensor.

[0106] Referring to FIGS. 8a and 8b, the conductive portion (810) may include trace portions (811, 821) and connection portions (812, 813, 822, 823). The connection portions (812, 813, 822, 823) may be positioned at each end of the trace portion (811).

[0107] As shown above, the trace portion (811) of FIG. 8A can be bent so as to be spaced apart from the edge of the optical sensor. The trace portion (811) of FIG. 8B can be rounded so as to be spaced apart from the edge of the optical sensor.

[0108] Referring to FIG. 8C, the conductive portion (830) may include a trace portion (831) that is bent multiple times. The conductive portion (830) may be formed to be bent in order to avoid other structures within the display other than the optical sensor. For example, if another conductive material (e.g., a conductive via or another connecting portion) is arranged between the connecting portion (832) and the connecting portion (833), the conductive portion (830) may be bent to avoid it. However, the present invention is not limited thereto, and although the trace portion (831) has been described as being bent on a plane, the trace portion (831) may be configured to be bent up and down with respect to the plane of the layer on which the trace portion (831) is arranged in order to avoid other conductive materials.

[0109] Referring to FIGS. 9 and 10, the conductive portion (900, 1000) may include trace portions (901, 1001a, 1001b). The conductive portion (900) of FIG. 9 may have a slit (901) arranged within the trace portion (901). The slit (901) may have a length in a direction parallel to the extending direction of the trace portion (901). The slit (901) may divide the trace portion (901) into a plurality of portions. For example, the slit (901) may divide the trace portion (901) into two traces. A trace portion (901) having two traces may maintain an electrical connection between transistors even when one trace is disconnected. To include a plurality of traces, the conductive portion (900) may include more slits.

[0110] A plurality of traces included in the trace portion (901) can meet each other at the connection portion (902, 903).

[0111] Referring to FIG. 10, the first trace (1001a) and the second trace (1001b) included in the trace portion may be arranged to be bent or rounded relative to each other. The first trace (1001a) and the second trace (1001b) may be arranged between the connection portions (1002, 1003). Since it is formed of a plurality of traces, even if one trace is disconnected, an electrical connection can be maintained, and an optical path of an optical sensor arranged under the conductive portion (1000) can be provided.

[0112] According to the above-described embodiment, the display (130) or the electronic device (101) may configure one of the layers constituting the window disposed on the display panel as a layer having shear thickening properties. The coating layer (402, 902, 1002, 1102) having shear thickening properties may be applied to the surface of the polymer layer (403) or the glass layer (401) and bonded to the polymer layer (403) or the glass layer (401) without an adhesive layer. The coating layer having shear thickening properties may provide flexibility according to a state change of the electronic device while providing rigidity against external impact, thereby increasing the thickness of the glass layer (401). Through the increased glass layer (401), wrinkles visible from the surface of the display (130) may be reduced.

[0113] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this document pertains.

[0114] According to the above-described embodiment, a display device (e.g., the display (130) of FIG. 2) may include a display panel. The display panel may include pixels, and each of the pixels may include a display panel including sub-pixels. Each of the sub-pixels may include a first transistor (e.g., the first transistor (301) of FIG. 4), a second transistor (e.g., the second transistor (302) or the fifth transistor (305) of FIG. 4), and an electrical path electrically connecting an electrode of the first transistor (e.g., the electrode (221-1) of the first transistor of FIG. 2) and an electrode of the second transistor (e.g., the electrode (221-2) of the second transistor of FIG. 2). The display panel may include a first layer (e.g., the second layer (202) of FIG. 2) including the first transistor and the second transistor, and a second layer (e.g., the third layer (203) of FIG. 2) disposed on the first layer. The electrical path may include a first trace (e.g., the first trace (211-1) of FIG. 2) connected to the electrode of the first transistor and disposed within the first layer, a second trace (e.g., the second trace (211-2) of FIG. 2) connected to the electrode of the second transistor and disposed within the first layer, and a conductive portion (e.g., the third portion (231) of FIG. 2) connecting the first trace of the electrical path and the second trace of the electrical path and disposed within the second layer. Each of the pixels may further include light-emitting elements (e.g., the light-emitting elements (300) of FIG. 4) corresponding to each of the sub-pixels.

[0115] In one embodiment, the first transistor may be configured to obtain a data voltage from a display driving circuit. The second transistor may be configured to obtain a light emission signal.

[0116] In one embodiment, the first trace and the second trace of the electrical path may be spaced apart from the neutral plane of the display panel, and the conductive portion of the electrical path may be closer to the neutral plane of the flexible display than the first trace of the electrical path and the second trace of the electrical path.

[0117] In one embodiment, the Young's modulus of the conductive portion of the electrical path may be lower than the Young's modulus of the first trace and the second trace of the electrical path.

[0118] In one embodiment, the width of the conductive portion of the electrical path may be different from the widths of the first trace and the second trace of the electrical path.

[0119] In one embodiment, the conductive portion of the electrical path may include first and second wires bent within the second non-conductive layer.

[0120] According to one embodiment, the conductive portion of the electrical path may include a slit arranged along an extending direction of the conductive portion of the electrical path.

[0121] In one embodiment, a first trace of the electrical path may be connected to an end of a conductive portion of the electrical path via a first contact, and a second trace of the electrical path may be connected to another end of the conductive portion of the electrical path via a second contact.

[0122] In one embodiment, the first contact may penetrate the second layer from the end of the first trace toward the end of the conductive portion. The second contact may penetrate the second layer from the end of the second trace toward the other end of the conductive portion.

[0123] According to one embodiment, the display device may further include a third non-conductive layer disposed between the first non-conductive layer and the second non-conductive layer, and conductive vias penetrating the third non-conductive layer and connected to a conductive portion of the electrical path.

[0124] According to one embodiment, a first conductive via among the conductive vias may penetrate the third non-conductive layer toward a first contact protruding from an end of the first trace of the conductive path to the second layer from one end of the conductive portion of the conductive path, and a second conductive via among the conductive vias may penetrate the third non-conductive layer toward a second contact protruding from an end of the second trace of the conductive path to the third layer from the other end of the conductive portion of the conductive path.

[0125] According to one embodiment, the first trace of the electrical path may be connected to a drain terminal of the first transistor, and the second trace of the electrical path may be connected to a drain terminal of the second transistor.

[0126] According to one embodiment, the first trace of the electrical path may be connected to a source terminal of the first transistor, and the second trace of the electrical path may be connected to a drain terminal of the second transistor.

[0127] According to one embodiment, the display device may further include a third non-conductive layer disposed on the second non-conductive layer, and an anode electrode disposed on the third non-conductive layer and electrically connected to the first transistor.

[0128] In one embodiment, the anode electrode may be electrically connected to a first transistor included in the first layer through the fourth non-conductive layer.

[0129] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a housing (e.g., the first housing and the second housing (110, 120) of FIGS. 1A to 1C) and a display disposed on the housing. The display may include a light-emitting layer and a semiconductor circuit disposed under the light-emitting layer. The semiconductor circuit may include a first transistor (e.g., the first transistor (301) of FIG. 4), a second transistor (e.g., the second transistor (302) or the fifth transistor (305) of FIG. 4), and an electrical path electrically connecting an electrode of the first transistor (e.g., the electrode (221-1) of the first transistor of FIG. 2) and an electrode of the second transistor (e.g., the electrode (221-2) of the second transistor of FIG. 2). The display panel may include a first layer (e.g., the second layer (202) of FIG. 2) including the first transistor and the second transistor, and a second layer (e.g., the third layer (203) of FIG. 2) disposed on the first layer. The electrical path may include a first trace (e.g., the first trace (211-1) of FIG. 2) connected to the electrode of the first transistor and disposed within the first layer, a second trace (e.g., the second trace (211-2) of FIG. 2) connected to the electrode of the second transistor and disposed within the first layer, and a conductive portion (e.g., the third portion (231) of FIG. 2) connecting the first trace of the electrical path and the second trace of the electrical path and disposed within the second layer. Each of the above pixels may further include light-emitting elements (e.g., light-emitting elements (300) of FIG. 4) corresponding to each of the above sub-pixels.

[0130] According to one embodiment, the first transistor may be configured to obtain a data voltage from a display driving circuit, and the second transistor may be configured to obtain a light emission signal.

[0131] In one embodiment, the conductive portion may include a first wire and a second wire bent on the first non-conductive layer.

[0132] In one embodiment, the electronic device may further include an optical sensor disposed below the display. In one embodiment, the bent portion of the first wire and the bent portion of the second wire may be spaced apart from an edge of the optical sensor when viewed from above.

[0133] In one embodiment, the Young's modulus of the conductive portion of the electrical path may be lower than the Young's modulus of the first trace and the second trace of the electrical path comprising the ceramic.

[0134] FIG. 11 is a block diagram of an electronic device (1101) within a network environment (1100) according to various embodiments. Referring to FIG. 11, in the network environment (1100), the electronic device (1101) may communicate with the electronic device (1102) via a first network (1198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1104) or the server (1108) via a second network (1199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1101) may communicate with the electronic device (1104) via the server (1108). According to one embodiment, the electronic device (1101) may include a processor (1120), a memory (1130), an input module (1150), an audio output module (1155), a display module (1160), an audio module (1170), a sensor module (1176), an interface (1177), a connection terminal (1178), a haptic module (1179), a camera module (1180), a power management module (1188), a battery (1189), a communication module (1190), a subscriber identification module (1196), or an antenna module (1197). In some embodiments, the electronic device (1101) may omit at least one of these components (e.g., the connection terminal (1178)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1176), camera module (1180), or antenna module (1197)) may be integrated into a single component (e.g., display module (1160)).

[0135] The processor (1120) may, for example, execute software (e.g., a program (1140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1101) connected to the processor (1120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1120) may store commands or data received from other components (e.g., a sensor module (1176) or a communication module (1190)) in a volatile memory (1132), process the commands or data stored in the volatile memory (1132), and store result data in a non-volatile memory (1134). According to one embodiment, the processor (1120) may include a main processor (1121) (e.g., a central processing unit or an application processor) or an auxiliary processor (1123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1121). For example, when the electronic device (1101) includes the main processor (1121) and the auxiliary processor (1123), the auxiliary processor (1123) may be configured to use less power than the main processor (1121) or to be specialized for a given function. The auxiliary processor (1123) may be implemented separately from the main processor (1121) or as a part thereof.

[0136] The auxiliary processor (1123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (1160), a sensor module (1176), or a communication module (1190)) of the electronic device (1101), for example, on behalf of the main processor (1121) while the main processor (1121) is in an inactive (e.g., sleep) state, or together with the main processor (1121) while the main processor (1121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1180) or a communication module (1190)). In one embodiment, the auxiliary processor (1123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0137] The memory (1130) can store various data used by at least one component (e.g., the processor (1120) or the sensor module (1176)) of the electronic device (1101). The data can include, for example, software (e.g., the program (1140)) and input data or output data for commands related thereto. The memory (1130) can include a volatile memory (1132) or a non-volatile memory (1134).

[0138] The program (1140) may be stored as software in memory (1130) and may include, for example, an operating system (1142), middleware (1144), or an application (1146).

[0139] The input module (1150) can receive commands or data to be used in a component of the electronic device (1101) (e.g., a processor (1120)) from an external source (e.g., a user) of the electronic device (1101). The input module (1150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0140] The audio output module (1155) can output audio signals to the outside of the electronic device (1101). The audio output module (1155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0141] The display module (1160) can visually provide information to an external party (e.g., a user) of the electronic device (1101). The display module (1160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0142] The audio module (1170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1170) can acquire sound through the input module (1150), output sound through the sound output module (1155), or an external electronic device (e.g., electronic device (1102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1101).

[0143] The sensor module (1176) can detect the operating status (e.g., power or temperature) of the electronic device (1101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0144] The interface (1177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1101) with an external electronic device (e.g., the electronic device (1102)). In one embodiment, the interface (1177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0145] The connection terminal (1178) may include a connector through which the electronic device (1101) may be physically connected to an external electronic device (e.g., the electronic device (1102)). In one embodiment, the connection terminal (1178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0146] The haptic module (1179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1179) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0147] The camera module (1180) can capture still images and videos. In one embodiment, the camera module (1180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0148] The power management module (1188) can manage the power supplied to the electronic device (1101). According to one embodiment, the power management module (1188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0149] A battery (1189) may power at least one component of the electronic device (1101). In one embodiment, the battery (1189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0150] The communication module (1190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1101) and an external electronic device (e.g., electronic device (1102), electronic device (1104), or server (1108)), and the performance of communication through the established communication channel. The communication module (1190) may operate independently from the processor (1120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1190) may include a wireless communication module (1192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1104) via a first network (1198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1196) to verify or authenticate the electronic device (1101) within a communication network such as the first network (1198) or the second network (1199).

[0151] The wireless communication module (1192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1192) may support various requirements specified in the electronic device (1101), an external electronic device (e.g., the electronic device (1104)), or a network system (e.g., the second network (1199)). According to one embodiment, the wireless communication module (1192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0152] The antenna module (1197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1198) or the second network (1199), may be selected from the plurality of antennas by, for example, the communication module (1190). A signal or power may be transmitted or received between the communication module (1190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1197).

[0153] According to various embodiments, the antenna module (1197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0154] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0155] According to one embodiment, commands or data may be transmitted or received between the electronic device (1101) and an external electronic device (1104) via a server (1108) connected to a second network (1199). Each of the external electronic devices (1102 or 1104) may be the same or a different type of device as the electronic device (1101). According to one embodiment, all or part of the operations executed in the electronic device (1101) may be executed in one or more of the external electronic devices (1102, 1104, or 1108). For example, when the electronic device (1101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1101). The electronic device (1101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (1104) may include an Internet of Things (IoT) device. The server (1108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1104) or server (1108) may be included within the second network (1199). The electronic device (1101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0156] FIG. 12 is a block diagram (1200) of a display device (1160) according to various embodiments.

[0157] Referring to FIG. 12, a display device (1160) may include a display (1210) and a display driver IC (DDI) (1230) for controlling the display (1210). The DDI (1230) may include an interface module (1231), a memory (1233) (e.g., a buffer memory), an image processing module (1235), or a mapping module (1237). The DDI (1230) may receive, for example, image data or image control signals corresponding to commands for controlling the image data, from other components of the electronic device 1101 through the interface module (1231). For example, according to one embodiment, image information may be received from a processor (1120) (e.g., a main processor (1121) (e.g., an application processor) or an auxiliary processor (1123) (e.g., a graphics processing unit) that operates independently of the function of the main processor (1121). The DDI (1230) may communicate with a touch circuit (1250) or a sensor module (1176) through the interface module (1231). In addition, the DDI (1230) may store at least a part of the received image information in the memory (1233), for example, in units of frames. The image processing module (1235) may, for example, perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a part of the image data based at least on the characteristics of the image data or the characteristics of the display (1210). The mapping module (1237) may output a voltage value or a value corresponding to the image data preprocessed or postprocessed through the image processing module (1135). A current value can be generated. In one embodiment, the generation of the voltage value or current value can be performed at least in part based on the properties of the pixels of the display (1210), for example, the arrangement of the pixels (e.g., an RGB stripe or pentile structure), or the size of each sub-pixel.At least some pixels of the display (1210) may be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, an image, or an icon) corresponding to the image data may be displayed through the display (1210).

[0158] According to one embodiment, the display device (1160) may further include a touch circuit (1250). The touch circuit (1250) may include a touch sensor (1251) and a touch sensor IC (1253) for controlling the same. The touch sensor IC (1253) may control the touch sensor (1251) to detect, for example, a touch input or a hovering input for a specific location of the display (1210). For example, the touch sensor IC (1253) may detect the touch input or the hovering input by measuring a change in a signal (e.g., voltage, light amount, resistance, or charge amount) for a specific location of the display (1210). The touch sensor IC (1253) may provide information (e.g., location, area, pressure, or time) regarding the detected touch input or hovering input to the processor (1120). According to one embodiment, at least a portion of the touch circuit (1250) (e.g., touch sensor IC (1253)) may be included as part of the display driver IC (1230), or as part of the display (1210), or as part of another component (e.g., auxiliary processor (1123)) disposed external to the display device (1160).

[0159] According to one embodiment, the display device (1160) may further include at least one sensor (e.g., a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module (1176), or a control circuit therefor. In this case, the at least one sensor or the control circuit therefor may be embedded in a part of the display device (1160) (e.g., the display (1210) or the DDI (1230)) or a part of the touch circuit (1250). For example, when the sensor module (1176) embedded in the display device (1160) includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor may obtain biometric information (e.g., a fingerprint image) associated with a touch input through a part of the display (1210). For another example, if the sensor module (1176) embedded in the display device (1160) includes a pressure sensor, the pressure sensor may obtain pressure information associated with a touch input through a portion or the entire area of ​​the display (1210). According to one embodiment, the touch sensor (1251) or the sensor module (1176) may be disposed between pixels of a pixel layer of the display (1210), or above or below the pixel layer.

[0160] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0161] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0162] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0163] Various embodiments of the present document may be implemented as software (e.g., a program (1140)) including one or more instructions stored in a storage medium (e.g., an internal memory (1136) or an external memory (1138)) readable by a machine (e.g., an electronic device (1101)). For example, a processor (e.g., a processor (1120)) of the machine (e.g., an electronic device (1101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0164] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0165] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the display device, The display panel includes pixels, each of the pixels including sub-pixels, Each of the above sub-pixels, 1st transistor; a second transistor; and An electrical path electrically connecting the electrode of the first transistor and the electrode of the second transistor; The above display panel, a first layer including the first transistor and the second transistor; and a second layer disposed on the first layer; The above electrical path is, A first trace connected to the electrode of the first transistor and disposed within the first layer; a second trace connected to the electrode of the second transistor and disposed within the first layer; and A conductive portion connecting the first portion of the electrical path and the second trace of the electrical path, and disposed within the second layer; Display device.

2. In paragraph 1, Each of the above pixels, Further comprising light emitting elements corresponding to each of the above sub-pixels, The first transistor is configured to obtain a data voltage from the display driving circuit, The second transistor is configured to obtain a light-emitting signal, Display device.

3. In paragraph 1, The first trace and the second trace of the electrical path, spaced apart from the neutral plane of the above display panel, The conductive portion of the above electrical path is, closer to the neutral plane of the flexible display than the first trace of the electrical path and the second trace of the electrical path, Display device.

4. In paragraph 1, The Young's modulus of the conductive portion of the above electrical path is lower than the Young's modulus of the first trace and the second trace of the above electrical path, Display device.

5. In paragraph 1, The width of the conductive portion of the above electrical path is Different from the width of the first trace and the second trace of the electrical path, Display device.

6. In paragraph 1, The conductive portion of the above electrical path is, Including a first wire and a second wire bent within the second non-conductive layer, Display device.

7. In paragraph 1, The conductive portion of the above electrical path is, comprising a slit arranged along the extending direction of the conductive portion of the electrical path; Display device.

8. In paragraph 1, The first trace of the electrical path is connected to an end of the conductive portion of the electrical path through a first contact, A second trace of said electrical path is connected to the other end of the conductive portion of said electrical path via a second contact, Display device.

9. In paragraph 8, The above first contact is, Penetrating the second layer from the end of the first trace toward the end of the conductive portion, The second contact above is, Penetrating the second layer from the end of the second trace toward the other end of the conductive portion, Display device.

10. In paragraph 1, a third non-conductive layer disposed between the first non-conductive layer and the second non-conductive layer; and Further comprising conductive vias penetrating the third non-conductive layer and connected to the conductive portion of the electrical path, Display device.

11. In paragraph 10, Among the above conductive vias, the first conductive via is: From one end of the conductive portion of the conductive path, towards the first contact protruding from the end of the first trace of the conductive path to the second layer, penetrating through the third non-conductive layer, Among the above conductive vias, the second conductive via is From the other end of the conductive portion of the conductive path, towards the second contact protruding from the end of the second trace of the conductive path to the third layer, penetrating the third non-conductive layer, Display device.

12. In paragraph 1, The first trace of the electrical path is connected to the drain terminal of the first transistor, The second trace of the electrical path is connected to the drain terminal of the second transistor. Display device.

13. In paragraph 1, The first trace of the electrical path is connected to the source terminal of the first transistor, The second trace of the electrical path is connected to the drain terminal of the second transistor. Display device.

14. In paragraph 1, a third non-conductive layer disposed on the second non-conductive layer; and further comprising an anode electrode disposed on the third non-conductive layer and electrically connected to the first transistor; The anode electrode is electrically connected to the first transistor included in the first layer through the fourth non-conductive layer. Display device.

15. In electronic devices, Housing; and A display device disposed within the housing, comprising: the display device of claims 1 to 14; Electronic devices.

Images