Electronic device comprising speaker

Abstract

The present invention relates to an electronic device. An electronic device according to one embodiment of the present invention may comprise: a speaker including a coil; a sound hole visually exposed to the outside of the electronic device and configured to output sound generated by the speaker; a frame in which the speaker is disposed and which defines an open space at a position adjacent to the sound hole; and a conductive loop at least partially disposed inside the open space, elongated in a loop shape, and configured to generate a magnetic field.

Description

Electronic devices containing speakers

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including speakers.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] An electronic device according to one embodiment of the present disclosure may include a speaker including a coil, a sound hole visually exposed to the outside of the electronic device and configured to output sound generated from the speaker, a frame in which the speaker is disposed and defining an open space adjacent to the sound hole, and a conductive loop disposed at least partially inside the open space, elongated in a loop shape, and configured to generate a magnetic field.

[0005] An electronic device according to one embodiment of the present disclosure may include a speaker including a coil, a sound hole visually exposed to the outside of the electronic device and configured to radiate sound generated from the speaker, a frame in which the speaker is disposed and in which an open space is formed at a position adjacent to the sound hole, a conductive loop disposed at least partially inside the open space and extending in a loop shape, a first audio circuit electrically connected to the coil, and a second audio circuit electrically connected to the conductive loop, and at least one processor connected to each of the first audio circuit and the second audio circuit and configured to generate a magnetic field through at least one of the coil and the conductive loop.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2 is a perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is a perspective view of an electronic device showing a rear side of the electronic device according to one embodiment of the present disclosure.

[0009] FIG. 4 is an exploded perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0010] FIG. 5 is an exploded perspective view of an electronic device showing a rear side of the electronic device according to one embodiment of the present disclosure.

[0011] FIG. 6 illustrates a user wearing a hearing aid using an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 7 is a front view of a portion of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 8 is an exploded perspective view of a speaker according to one embodiment of the present disclosure.

[0014] FIG. 9 is a rear view of a frame according to one embodiment of the present disclosure.

[0015] FIG. 10 is a rear view of a frame and a conductive loop according to one embodiment of the present disclosure.

[0016] Fig. 11 is a rear view of the frame according to a comparative example.

[0017] FIG. 12 is a rear view of a portion of an electronic device showing a state in which a frame cover is mounted, according to one embodiment of the present disclosure.

[0018] Figure 13 is a cross-sectional view of a portion of the area shown in Figure 12.

[0019] FIG. 14 is a block diagram of a portion of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 15 is a block diagram of a portion of an electronic device illustrating an audio circuit according to one embodiment of the present disclosure.

[0021] FIG. 16 is a block diagram of a portion of an electronic device illustrating audio circuits according to another embodiment of the present disclosure.

[0022] FIG. 17 illustrates a signal region, which is a region in which the strength of the magnetic field formed by the coil and conductive loop of the speaker is relatively strong, according to one embodiment of the present disclosure.

[0023] FIG. 18 illustrates a noise region, which is a region where the strength of a magnetic field formed by an electronic component placed in an electronic device is relatively weak, according to one embodiment of the present disclosure.

[0024] Figure 19 illustrates an overlapping region, which is an region where the signal region illustrated in Figure 17 and the noise region illustrated in Figure 18 overlap.

[0025] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0026] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0027] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0028] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0029] The various embodiments and terminology used in this document are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or alternatives of the embodiments. In connection with the description of the drawings, similar reference numerals may be used to refer to similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise.

[0030] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0031] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another, and do not qualify the components in any other respect (e.g., importance or order).

[0032] When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 is a perspective view of an electronic device (101) showing a front side (210A) of the electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device (101) showing a rear side (210B) of the electronic device (101) according to one embodiment of the present disclosure.

[0063] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B) of FIG. 3 , and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0064] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0065] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0066] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0067] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas and / or the second areas.

[0068] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0069] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] According to one embodiment of the present disclosure, the camera modules (205, 212, 213) may include a first camera module (205) disposed on a first side (210A) of the electronic device (101), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include at least one lens (205a), an image sensor (not shown), and / or a camera housing (205b). The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0071] According to one embodiment of the present disclosure, the first camera module (205) may include at least one lens (205a) and a camera housing (205b) that accommodates the at least one lens (205a). The camera housing (205b) may support the at least one lens (205a). The camera housing (205b) may be mounted inside the electronic device (101).

[0072] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0073] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0074] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0075] FIG. 4 is an exploded perspective view of an electronic device (101) showing a front side (e.g., front side (210A) of FIG. 2) of the electronic device (101) according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view of an electronic device (101) showing a rear side (e.g., rear side (210B) of FIG. 3) of the electronic device (101) according to one embodiment of the present disclosure.

[0076] Referring to FIGS. 4 and 5 , according to one embodiment of the present disclosure, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 or FIG. 2 ) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1 ), a display (330) (e.g., the display (220) of FIG. 1 ), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2 ). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above the battery (350) and a second circuit board (340b) positioned below, and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0077] According to one embodiment of the present disclosure, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include another component. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2 , and any redundant description will be omitted below.

[0078] According to one embodiment of the present disclosure, the first support member (311) may be provided in at least a portion in a flat shape. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is at least partially formed of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0079] According to one embodiment of the present disclosure, the first support member (311) may be referred to as a “support member.” The housing (301) may include the support member (311). The support member (311) may face the front plate (320). The support member (311) may face the rear plate (380). The support member (311) may be made of reinforced plastic or metal.

[0080] According to one embodiment of the present disclosure, the support member (311) may include a support body (3111). The support body (3111) may have a flat shape. The support body (3111) may provide a space in which a battery (350) or a printed circuit board (340a, 340b) is placed.

[0081] According to one embodiment of the present disclosure, the support member (311) may include an end portion (3112). The end portion (3112) may be integral with the support body (3111). The end portion (3112) may be formed along the perimeter of the support body (3111). The end portion (3112) may extend along the perimeter of the side structure (310). The end portion (3112) may be integral with the side structure (310).

[0082] According to one embodiment of the present disclosure, the front plate (320) may be referred to as a “cover” or a “front cover.” The rear plate (380) may be referred to as a “cover” or a “rear cover.” The cover (380) may face the support member (311).

[0083] According to one embodiment of the present disclosure, the cover (380) may include a cover body (381). The cover body (381) may be flat. The cover body (381) may face the support body (3111). The cover (380) may include a cover edge (382). The cover edge (382) may be integral with the cover body (381). The cover edge (382) may extend along the direction in which the end portion (3112) of the support member (311) extends. The cover edge (382) may face the end portion (3112) of the support member (311). The cover edge (382) may be coupled to the end portion (3112) of the support member (311) through an adhesive member.

[0084] According to one embodiment of the present disclosure, the first support member (311) and the side structure (310) may be combined to be referred to as a front case or housing (301). According to one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including a structure that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). The housing (301) may include the side structure (310), the first support member (311), the front plate (320), and the rear plate (380). In one embodiment, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first surface (210A) of FIG. 1) and the rear plate (380) (e.g., the second surface (210B) of FIG. 2), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0085] According to one embodiment of the present disclosure, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0086] According to one embodiment of the present disclosure, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be placed to surround the additional printed circuit board together with another part of the first support member (311). A speaker module or interface arranged on an additional printed circuit board or lower support member (360b) not shown may be arranged corresponding to the audio module (207) or connector hole (208, 309) of FIG. 1.

[0087] According to one embodiment of the present disclosure, the battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0088] According to one embodiment of the present disclosure, although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or a combination of the first support member (311).

[0089] In one embodiment, the camera assembly (307) may include at least one camera module (e.g., camera module (212, 213) of FIG. 2). Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (312, 313, 319) and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0090] FIG. 6 illustrates a user wearing a hearing aid (1000) using an electronic device (101) according to an embodiment of the present disclosure. FIG. 7 is a front view of a portion of an electronic device (101) according to an embodiment of the present disclosure. By way of example, FIG. 6 illustrates a user wearing a hearing aid (1000) making a call through an electronic device (101) according to an embodiment of the present disclosure.

[0091] Referring to FIG. 6, as an example, a hearing aid (1000) may include an ear tip (1001) configured to be inserted into a user's ear and generate sound, a body (1002) that houses components of the hearing aid (1000) (e.g., an amplifier, a battery, etc.) and is placed in the user's ear, and a hearing aid coil (1003) disposed inside the body (1002).

[0092] The components (1001, 1002, 1003) of the above hearing aid (1000) are merely exemplary, and the hearing aid (1000) can be understood as a device that receives a signal from an electronic device (101) through electromagnetic induction, and it goes without saying that the configuration of the ear tip (1001) and the like can be replaced with another form that is placed on the user's ear.

[0093] According to one embodiment of the present disclosure, an electronic device (101) may be configured to generate a magnetic field in a voice band. An electrical signal may be induced in a hearing aid coil (1003) of a hearing aid (1000) by the magnetic field in the voice band generated by the electronic device (101). The electronic device (101) may be configured to communicate with the hearing aid (1000) through electromagnetic induction. According to one embodiment of the present disclosure, the magnetic field in the voice band may mean, for example, a magnetic field of approximately 300 Hz to 3400 Hz, but is not necessarily limited thereto.

[0094] According to one embodiment of the present disclosure, the electronic device (101) may include a sound hole (214) (e.g., the receiver hole (214) of FIG. 2). The sound hole (214) is a hole through which sound is output, and may refer to a hole that is brought closer to the user's ear during a call. Accordingly, the compatibility of the electronic device (101) and the hearing aid (1000) during a call may be affected by the strength of the magnetic field of the voice band formed around the sound hole (214).

[0095] Referring to FIGS. 6 and 7, an electronic device (101) according to an embodiment of the present disclosure may include a frame (400). The description of the housing (210) described with reference to FIGS. 2 and 3 may be substantially equally applied to the frame (400) described with reference to FIGS. 6 to 19 to the extent that they are not arranged with each other. The description of the housing (301) described with reference to FIGS. 4 and 5 may be substantially equally applied to the frame (400) described with reference to FIGS. 6 to 19 to the extent that they are not arranged with each other.

[0096] According to one embodiment of the present disclosure, an electronic device (101) may include a frame (400). The frame (400) may include a plurality of conductive segments (410, 420, 430, 440) of the electronic device (101). The plurality of conductive segments (410, 420, 430, 440) may form a side surface of the electronic device (101) (e.g., the side surface (210C) of FIG. 2 and / or the side structure (310) of FIG. 3). The plurality of conductive segments (410, 420, 430, 440) may include a first conductive segment (420), a second conductive segment (430), a third conductive segment (410), and / or a fourth conductive segment (440).

[0097] According to one embodiment of the present disclosure, a plurality of conductive segments (41, 420, 430, 440) may function as an antenna configured to transmit / receive a signal of a predetermined band by being connected to an antenna module (197, see FIG. 1) of an electronic device (101).

[0098] According to one embodiment of the present disclosure, an electronic device (101) may include a non-conductive member (D). The non-conductive member (D) may include a plurality of segmented portions (D1, D2, D3, D4) inserted between a plurality of conductive segments (410, 420, 430, 440). By the non-conductive member (D), the plurality of conductive segments (410, 420, 430, 440) may be electrically disconnected from each other. The plurality of segmented portions (D1, D2, D3, D4) may include a first segmented portion (D2), a second segmented portion (D3), a third segmented portion (D1), and / or a fourth segmented portion (D4).

[0099] According to one embodiment of the present disclosure, an electronic device (101) may include a speaker (600). The speaker (600) may be placed in a frame (400). Sound generated from the speaker (600) may be output to the outside of the electronic device (101) through a sound hole (214). The speaker (600) may be positioned adjacent to the sound hole (214).

[0100] According to one embodiment of the present disclosure, a speaker (600) may be configured to generate a magnetic field in a voice band. The speaker (600) may include a coil (640, see FIG. 8). An electronic device (101) may be configured to generate a magnetic field in a voice band through the coil (640), and an electrical signal may be induced in a hearing aid coil (1003) by the generated magnetic field.

[0101] According to one embodiment of the present disclosure, the electronic device (101) may include a display (330). The description of the display (220) described with reference to FIG. 2 may be substantially identically applied to the description of the display (330) described with reference to FIGS. 6 to 19 to the extent that they are not mutually arranged.

[0102] According to one embodiment of the present disclosure, the display (330) may be disposed on the frame (400). As an example, the speaker (600) and the display (330) may be disposed on two opposite sides of the frame (400), respectively. The display (330) may include a hole edge (331) that defines at least a portion of the sound hole (214). The hole edge (331) may extend along a side surface of the electronic device (101) (e.g., the side surface (210C) of FIG. 2 and / or the side structure (310) of FIG. 3). As an example, the hole edge (331) may have a sunken notch shape.

[0103] According to one embodiment of the present disclosure, the sound hole (214) may be visually exposed to the outside of the electronic device (101). The sound hole (214) may be configured to output sound generated from the speaker (600). The sound generated from the speaker (600) may sequentially pass through the speaker hole (SH, see FIG. 9), the space between the frame (400) and the display (330), and the sound hole (214) to be transmitted to the outside of the electronic device (101). The audio path of the sound generated from the speaker (600) may include the speaker hole (SH, see FIG. 9), the space between the frame (400) and the display (330), and the sound hole (214).

[0104] According to one embodiment of the present disclosure, the camera module (205) may be positioned adjacent to the sound hole (214). The camera module (205) may be positioned adjacent to an edge of the electronic device (101). As an example, the camera module (205) and the sound hole (214) may be aligned on a predetermined axis (e.g., the Y-axis).

[0105] According to one embodiment of the present disclosure, an electronic device (101) may include a conductive loop (900). The conductive loop (900) may be elongated in a loop shape. The conductive loop (900) may be extended to at least partially surround the camera module (205). FIG. 7 exemplarily illustrates a loop shape of the conductive loop (900) according to one embodiment of the present disclosure in a closed shape, but the loop shape described in this document may be understood to include not only a completely closed loop but also a loop with one side open (see FIG. 10). The loop shape of the conductive loop (900) will be described in detail below with reference to FIGS. 9 to 11.

[0106] According to one embodiment of the present disclosure, the conductive loop (900) may be positioned at an edge of the electronic device (101). The conductive loop (900) may overlap the sound hole (214) when viewed from above the sound hole (214). The conductive loop (900) may be positioned adjacent to the sound hole (214). As an example, the conductive loop (900) may be positioned closer to the sound hole (214) than to the speaker (600).

[0107] According to one embodiment of the present disclosure, a conductive loop (900) may be electrically connected to a processor (120, see FIG. 1). The processor (120) may be configured to cause the electronic device (101) to generate a magnetic field in a voice band through the conductive loop (900). Accordingly, an electrical signal may be induced in the hearing aid coil (1003) by the magnetic field in the voice band generated in the conductive loop (900).

[0108] According to one embodiment of the present disclosure, the conductive loop (900) may be visually exposed to the exterior of the electronic device (101). As an example, the conductive loop (900) may form a portion of a side surface of the electronic device (101) (e.g., side surface (210C) of FIGS. 2 and 3 and / or side structure (310) of FIG. 3).

[0109] According to one embodiment of the present disclosure, the conductive loop (900) may be positioned between the first conductive segment (420) and the second conductive segment (430). The first conductive segment (420) and the second conductive segment (430) may be positioned on either side of the conductive loop (900).

[0110] According to one embodiment of the present disclosure, the first segment portion (D2) and the second segment portion (D3) may be positioned on both sides of the conductive loop (900). By the first segment portion (D2), the conductive loop (900) and the first conductive segment (420) may be electrically disconnected. By the second segment portion (D3), the conductive loop (900) and the second conductive segment (430) may be electrically disconnected.

[0111] According to one embodiment of the present disclosure, the first segment portion (D2) may be interposed between the first conductive segment (420) and the conductive loop (900). The second segment portion (D3) may be interposed between the second conductive segment (430) and the conductive loop (900). The third segment portion (D1) may be interposed between the first conductive segment (420) and the third conductive segment (410). The fourth segment portion (D4) may be interposed between the second conductive segment (430) and the fourth conductive segment (440).

[0112] FIG. 8 is an exploded perspective view of a speaker (600) according to one embodiment of the present disclosure.

[0113] Referring to FIG. 8, according to one embodiment of the present disclosure, a speaker (600) may include a coil (640). The coil (640) included in the speaker (600) may be referred to as a speaker coil. The speaker (600) may be implemented as a part of an audio output module (155, see FIG. 1) of an electronic device (101). The coil (640) may be wound around a first axis (e.g., the Z-axis). A magnetic field generated in the coil (640) may be concentrated in the axial direction of the first axis.

[0114] According to one embodiment of the present disclosure, the speaker (600) may include a speaker cover (610) and a speaker frame (650) forming a speaker housing (610, 650). A coil (640) of the speaker (600) may be disposed inside the speaker housing (610, 650). According to one embodiment of the present disclosure, the speaker housing (610, 650) may include a screen (690) covering a ventilation hole (not shown) for maintaining a pressure inside the speaker housing within a predetermined range, and a mesh (695) disposed on the screen (690). According to one embodiment of the present disclosure, the speaker (600) may include a diaphragm (630). The diaphragm (630) may be configured to vibrate by a coil (640) that moves up and down by an applied alternating current. It may include a magnet (670) that forms magnetic energy, a conductive plate (660) for concentrating a magnetic field by the magnet, and a yoke (680).

[0115] FIG. 9 is a rear view of a frame (400) according to one embodiment of the present disclosure. FIG. 10 is a rear view of a frame (400) and a conductive loop (900) according to one embodiment of the present disclosure.

[0116] Referring to FIGS. 9 and 10 , according to one embodiment of the present disclosure, a frame (400) may include a base (450). The base (450) may support electronic components of an electronic device (101). A speaker (600, see FIG. 7 ) may be placed on and supported by the base (450). A display (330, see FIG. 7 ) may be placed on and supported by the base (450). As an example, the base (450) may have a plate shape.

[0117] According to one embodiment of the present disclosure, the frame (400) may include a plurality of conductive segments (410, 420, 430, 440). The plurality of conductive segments (410, 420, 430, 440) may be arranged around a base (450). The plurality of conductive segments (410, 420, 430, 440) may be arranged to at least partially surround the base (450).

[0118] According to one embodiment of the present disclosure, the conductive loop (900) may include a first segment (910) extending along an edge of the display (330). The first segment (910) of the conductive loop (900) may overlap the sound hole (214, see FIG. 7) when viewed from above the sound hole. The first segment (910) of the conductive loop (900) may be visually exposed to the outside of the electronic device (101). The first segment (910) of the conductive loop (900) may form a part of a side surface (e.g., side surface 210C of FIG. 2 and / or side structure 310 of FIG. 3) of the electronic device (101).

[0119] According to one embodiment of the present disclosure, the conductive loop (900) may be extended in a loop shape based on a second axis (e.g., a predetermined axis parallel to the Z-axis) extending along the first axis (Z-axis, see FIG. 8), which is the winding axis of the coil (640). As an example, the second axis may be an axis substantially parallel to the first axis. The sound hole (214, see FIG. 7) may be opened in the axial direction of the second axis.

[0120] According to one embodiment of the present disclosure, the conductive loop (900) may include a second segment (920) extending from one end of the first segment (910) toward an inner portion of the frame (400). For example, the second segment (920) of the conductive loop (900) may be substantially orthogonal to the first segment (910). The conductive loop (900) may include a third segment (930) extending from the other end of the first segment (910) toward an inner portion of the frame (400). For example, the third segment (930) of the conductive loop (900) may be substantially orthogonal to the first segment (910). The first segment (910), the second segment (920), and / or the third segment (930) of the conductive loop (900) may extend in a loop shape with respect to the second axis.

[0121] According to one embodiment of the present disclosure, the conductive loop (900) may include a first fastening hole (921) and a second fastening hole (931). The first fastening hole (921) may be positioned in the second segment (920) of the conductive loop (900). The second fastening hole (931) may be positioned in the third segment (930) of the conductive loop (900). The first fastening hole (921) and the second fastening hole (931) will be described in detail later with reference to FIGS. 12 and 13 .

[0122] According to one embodiment of the present disclosure, the conductive loop (900) may include a fourth segment (940). The fourth segment (940) may extend from the second segment (920) or the third segment (930). The third segment (930) and the fourth segment (940) may be defined based on the second fastening hole (931). FIG. 10 illustrates an embodiment in which the fourth segment (940) extends from the third segment (930). According to another embodiment (not shown), the second fastening hole (931) may be positioned on the fourth segment (940) (e.g., at the end of the fourth segment (940).

[0123] According to one embodiment of the present disclosure, an electrical signal (SI) applied to a conductive loop (900) may sequentially pass through a second segment (920), a first segment (910), and a third segment (930) of the conductive loop (900). However, according to another embodiment, an electrical signal (not shown) applied to the conductive loop (900) may sequentially pass through a third segment (930), a first segment (910), and a second segment (920) of the conductive loop (900), unlike as illustrated in FIG. 10.

[0124] According to one embodiment of the present disclosure, the frame (400) can define an open space (OS) adjacent to the sound hole (214, see FIG. 7). The open space (OS) can be formed at an edge of the base (450). The conductive loop (900) can be at least partially disposed within the open space (OS). As an example, at least a portion of the conductive loop (900) positioned within the open space (OS) and the base (450) can be substantially coplanar. Accordingly, the mounting structure of the electronic device (101) for disposing the conductive loop (900) can be optimized.

[0125] According to one embodiment of the present disclosure, the frame (400) may include an open edge (OE) defining the open space (OS). The base (450) may include the open edge (OE). The open edge (OE) may have a shape that is recessed into the inner portion of the base (450). The open edge (OE) may extend to at least partially surround the conductive loop (900).

[0126] According to one embodiment of the present disclosure, the open edge (OE) may extend along the conductive loop (900). As an example, the open edge (OE) may extend substantially parallel to the first segment (910), the second segment (920), and / or the third segment (930) of the conductive loop (900). The open edge (OE) may include a first section (OE1), a second section (OE2), and / or a third section (OE3).

[0127] According to one embodiment of the present disclosure, a first section (OE1) of an open edge (OE) may be spaced from an edge of the base (450) toward an inner portion of the base (450). The first section (OE1) may extend along a fourth segment (940) of the conductive loop (900). The first section (OE1) may extend along a first segment (910) of the conductive loop (900).

[0128] According to one embodiment of the present disclosure, a second section (OE2) of an open edge (OE) may connect an edge of a base (450) and a first section (OE1). The second section (OE2) may intersect the first section (OE1) of the open edge (OE). As an example, the first section (OE1) and the second section (OE2) of the open edge (OE) may be substantially orthogonal.

[0129] According to one embodiment of the present disclosure, a third section (OE3) of an open edge (OE) may connect an edge of a base (450) and a first section (OE1). The third section (OE3) may intersect the first section (OE1) of the open edge (OE). As an example, the first section (OE1) and the third section (OE3) of the open edge (OE) may be substantially orthogonal.

[0130] According to one embodiment of the present disclosure, the first segment portion (D2) may be disposed in a first area (A2) between the first conductive segment (420) and the first segment (910) of the conductive loop (900). The second segment portion (D3) may be disposed in a second area (A3) between the second conductive segment (430) and the first segment (910) of the conductive loop (900). The third segment portion (D1) may be disposed in a third area (A1) between the first conductive segment (420) and the third conductive segment (410). The fourth segment portion (D4) may be disposed in a fourth area (A4) between the second conductive segment (430) and the fourth conductive segment (440).

[0131] According to one embodiment of the present disclosure, a portion of the non-conductive member (D) may be intervened in a fifth region (A5) between the frame (400) and the conductive loop (900). The fifth region (A5) may include a region between the conductive loop (900) and the open edge (OE). A portion of the non-conductive member (D) disposed in the fifth region (A5) may be joined to the frame (400) and the conductive loop (900) to support the conductive loop (900). A portion of the non-conductive member (D) disposed in the fifth region (A5) may surround the conductive loop (900).

[0132] According to one embodiment of the present disclosure, the conductive loop (900) can support a camera module (205, see FIG. 7). The conductive loop (900) can extend to surround the camera housing (205b, see FIG. 2). The conductive loop (900) can support the camera housing (205b, see FIG. 2).

[0133] According to one embodiment of the present disclosure, the electronic device (101) may include a region (CH) at least partially surrounded by the conductive loop (900). The region (CH) surrounded by the conductive loop (900) may be referred to as a camera hole (CH). The camera hole (CH) may overlap with at least one lens (205a, see FIG. 2) of a camera module (205, see FIG. 7), and the camera module (205, see FIG. 7) may obtain an image of the outside of the electronic device (101) through the camera hole (CH).

[0134] Fig. 11 is a rear view of a frame (400') according to a comparative embodiment. Compared to the frame (400) according to an embodiment of the present disclosure illustrated in Fig. 10, the frame (400') according to the comparative embodiment illustrated in Fig. 11 differs in that it is formed integrally with the conductive loop (900). Hereinafter, as an example, a manufacturing process of the frame (400) according to an embodiment of the present disclosure will be described with reference to Figs. 10 and 11.

[0135] The description of the components (frame (400) and / or second conductive segment (430)) described with reference to FIGS. 7 to 10 may be substantially identically applied to the description of the components (e.g., frame (400') and / or second conductive segment (430')) illustrated in FIG. 11 to the extent that they are not mutually inconsistent.

[0136] Referring to FIGS. 10 and 11 , a frame (400) and a conductive loop (900) according to an embodiment of the present disclosure can be formed by cutting the frame (400') and the second conductive segment (430') of the comparative embodiment illustrated in FIG. 11 along a cutting area (CA). As an example, the frame (400) and the conductive loop (900) illustrated in FIG. 10 can be formed by machining the frame (400') illustrated in FIG. 10 through a computer numerical control (CNC) cutting process, which can be understood as a path along which a CNC cutting tool passes. The cutting area (CA) can extend along an edge of the camera hole (CH). The cutting area (CA) can partially surround the camera hole (CH).

[0137] Accordingly, according to one embodiment of the present disclosure, the electronic device (101) can increase the generation area and intensity of the magnetic field in the voice band by additionally arranging the conductive loop (900) compared to the comparative embodiment, thereby improving compatibility with a hearing aid (1000, see FIG. 6).

[0138] Accordingly, according to one embodiment of the present disclosure, the electronic device (101) forms a part of the frame (400') as a conductive loop (900) for generating a magnetic field, thereby eliminating the need for additional placement space, thereby improving compatibility with a hearing aid (1000, see FIG. 6) while simultaneously optimizing the mounting structure of the electronic device (101).

[0139] According to one embodiment of the present disclosure, the conductive loop (900) may be formed of the same material as the frame (400). Since the conductive loop (900) and the frame (400) according to one embodiment of the present disclosure are formed by cutting the frame (400') according to the comparative embodiment, they may be formed of the same material. For example, the conductive loop (900) and the frame (400) may include stainless steel. The conductive loop (900) may be formed of a different material from the coil (640) of the speaker (600). For example, the coil (640) of the speaker (600) may be formed of copper, and the conductive loop (900) may be formed of stainless steel.

[0140] Fig. 12 is a rear view of a portion of an electronic device (101) showing a state in which a frame cover (500) is mounted according to one embodiment of the present disclosure. Fig. 13 is a cross-sectional view of a portion (X) shown in Fig. 12, and more specifically, Fig. 13 can be understood as a longitudinal cross-sectional view of a first fastening member (F1).

[0141] Referring to FIGS. 12 and 13, an electronic device (101) according to an embodiment of the present disclosure may include a frame cover (500). The frame cover (500) may cover a portion of the frame (400). The frame cover (500) may cover the camera module (205). An area (510) of the frame cover (500) that overlaps the camera module (205) may be referred to as a camera area (510). The frame cover (500) may cover a space (CH, see FIG. 10) surrounded by the conductive loop (900).

[0142] According to one embodiment of the present disclosure, the frame cover (500) may be non-conductive. The frame cover (500) may be fixed to the frame (400) and the conductive loop (900) via conductive fastening members (e.g., a first fastening member (F1) and a second fastening member (F2)). The plurality of conductive fastening members may include a first fastening member (F1) and a second fastening member (F2). The frame cover (500) may be fixed to the conductive loop (900) and the frame (400), and the conductive loop (900) and the frame (400) may be connected via the frame cover (500).

[0143] According to one embodiment of the present disclosure, an electronic device (101) may include a printed circuit board (700) (e.g., the printed circuit board (340a) of FIGS. 4 and 5). The printed circuit board (700) may be disposed on a frame (400). As an example, a processor (120, see FIG. 1) may be disposed on the printed circuit board (700).

[0144] According to one embodiment of the present disclosure, a printed circuit board (700) may be provided with a processor (120, see FIG. 1) and a signal line (710) connected to a conductive loop (900). The signal line (710) may include a signal in line through which a signal input to the conductive loop (900) passes and a signal out line through which a signal output from the conductive loop (900) passes.

[0145] According to one embodiment of the present disclosure, a conductive loop (900) can be fastened to a printed circuit board (700) via conductive fastening members (F1, F2). The fastening members (F1, F2) can include a first fastening member (F1) that couples a second segment (920) of the conductive loop (900) to the printed circuit board (700). The first conductive fastening member (F1) can be electrically connected to the signal in line. The first conductive fastening member (F1) can be in contact with the signal in line.

[0146] According to one embodiment of the present disclosure, the fastening member (F1, F2) may include a second fastening member (F2) that couples the third segment (930) of the conductive loop (900) and the printed circuit board (700). The second conductive fastening member (F2) may be electrically connected to the signal outline line. The second conductive fastening member (F2) may be in contact with the signal outline line.

[0147] According to one embodiment of the present disclosure, the first fastening member (F1) and the second fastening member (F2) can secure the camera area (510) of the frame cover (500) to the frame (400). Accordingly, the first fastening member (F1) and the second fastening member (F2) stably secure the camera module (205) while functioning as part of a circuit including the conductive loop (900), thereby minimizing parts and reducing manufacturing costs.

[0148] According to one embodiment of the present disclosure, the signal in line may be electrically connected to the second segment (920) of the conductive loop (900), and the signal out line may be electrically connected to the third segment (930) of the conductive loop (900). Therefore, as illustrated in FIG. 10, the electrical signal (SI) applied to the conductive loop (900) may sequentially pass through the second segment (920), the first segment (910), and the third segment (930) of the conductive loop (900). However, according to another embodiment of the present disclosure in which the signal in line is electrically connected to the third segment (930) of the conductive loop (900), and the signal out line is electrically connected to the second segment (920) of the conductive loop (900), the electrical signal applied to the conductive loop (900) may flow in the opposite direction to the direction illustrated in FIG. 10.

[0149] According to one embodiment of the present disclosure, the first fastening member (F1) may include a head portion (F11) and a body portion (F12). The body portion (F12) may be connected to the head portion (F11). The body portion (F12) may penetrate the frame cover (500) and the printed circuit board (700). The body portion (F12) may be inserted into the frame (400). According to another embodiment, the body portion (F12) may simultaneously penetrate the frame cover (500), the printed circuit board (700), and the frame (400). The body portion (F12) of the conductive first fastening member (F1) may be electrically connected to the signal line (710) by contacting the signal line (710). The description of the head portion (F11) and the body portion (F12) of the first fastening member (F1) described above may be substantially equally applied to the second fastening member (F2).

[0150] FIG. 14 is a block diagram of a portion of an electronic device (101) according to one embodiment of the present disclosure.

[0151] Referring to FIG. 14, according to one embodiment of the present disclosure, an electronic device (101) may include at least one processor (120). The processor (120) may be operatively connected to a memory (130). The processor (120) may be configured to cause the electronic device (101) to perform a predetermined function through a predetermined module (e.g., an audio module (150)) based on instructions stored in the memory (130). As an example, the processor (120) may be configured to cause the electronic device (101) to generate a magnetic field in a voice band through a conductive loop (900, see FIG. 10).

[0152] According to one embodiment of the present disclosure, an electronic device (101) may include an audio module (150). The audio module (150) may be connected to an audio output module (155). The audio module (150) may include at least one audio circuit (R). As an example, the audio circuit (R) may be controlled by a processor (120). The audio circuit (R) will be described in detail below with reference to FIGS. 15 and 16.

[0153] According to one embodiment of the present disclosure, the electronic device (101) may include an audio output module (155). The audio output module (155) may include a speaker (600). The audio output module (155) may be connected to a processor (120) and controlled by the processor (120). As an example, the processor (120) may be configured to cause the electronic device (101) to generate a magnetic field in a voice band through a coil (640, see FIG. 8) of the speaker (600).

[0154] FIG. 15 is a block diagram of a portion of an electronic device (101) illustrating an audio circuit (R) according to one embodiment of the present disclosure.

[0155] Referring to FIGS. 14 and 15 , an electronic device (101) according to an embodiment of the present disclosure may include audio circuitry (R). The audio circuitry (R) may include an amplifier (800). The amplifier (800) may be configured to amplify a signal input to a speaker (600). The audio circuitry (R) may include a first conductive fastening member (F1), a conductive loop (900), and a second conductive fastening member (F2). Accordingly, a signal amplified through the amplifier (800) may sequentially pass through the conductive loop (900) and the speaker (600), so that a magnetic field of a sound band generated through the coil (640, see FIG. 8 ) of the conductive loop (900) and the speaker (600) may be more smoothly generated.

[0156] FIG. 16 is a block diagram of a portion of an electronic device (101) illustrating audio circuits (R1, R2) according to another embodiment of the present disclosure.

[0157] Referring to FIGS. 14 and 16, according to another embodiment of the present disclosure, the audio circuit (R) may include a first audio circuit (R1) and a second audio circuit (R2). The first audio circuit (R1) may include a speaker (600). The second audio circuit (R2) may include a conductive loop (900). The first audio circuit (R1) and the second audio circuit (R2) may be controlled by a processor (120). The first audio circuit (R1) and the second audio circuit (R2) may be controlled independently of each other.

[0158] According to another embodiment of the present disclosure, the processor (120) may control at least one of the first audio circuit (R1) and the second audio circuit (R2). The processor (120) may be configured to control the first audio circuit (R1) to cause the electronic device (101) to generate a magnetic field in the audio band through the coil (640, see FIG. 8) of the speaker (600). The processor (120) may be configured to control the second audio circuit (R2) to cause the electronic device (101) to generate a magnetic field in the audio band through the conductive loop (900).

[0159] According to another embodiment of the present disclosure, the amplifier (800) may include a first amplifier (810) included in a first audio circuit (R1) and a second amplifier (820) included in a second audio circuit (R2). The description of the amplifier (800) described with reference to FIG. 15 may be substantially equally applied to the first amplifier (810) and the second amplifier (820) described with reference to FIG. 16 to the extent that they are not mutually arranged.

[0160] The magnetic field area (MA) illustrated in FIGS. 17 to 19 may be understood as a virtual area in which a predetermined area (e.g., 50 mm*50 mm) set around the sound hole (214) of the electronic device (101) according to one embodiment of the present disclosure is divided into a plurality of grids (G) having a constant width. As an example, the first width (d1) and the second width (d2) of the grid (G) may be approximately 2 mm. FIGS. 17 to 19 illustrate grids in which the strength of the magnetic field of the passing voice band falls within a predetermined range among the plurality of grids (G).

[0161] FIG. 17 illustrates a signal area (SA), which is a region in which the strength of the magnetic field formed by the conductive loop (900) of the coil (640) of the speaker (600) is relatively strong, according to one embodiment of the present disclosure.

[0162] Referring to FIG. 17, according to one embodiment of the present disclosure, a signal area (SA) may include grids in which the strength of a magnetic field generated from a coil (640) and a conductive loop (900) of a speaker (600, see FIG. 8) is greater than or equal to a predetermined value (e.g., -18 dBA / m). The signal area (SA) may be understood as an area through which a magnetic field of a strength capable of stably inducing an electrical signal to a hearing aid coil (1003, see FIG. 6) passes.

[0163] According to one embodiment of the present disclosure, since the strength of the magnetic field increases toward the center of the coil (640) of the speaker (600, see FIG. 8) or the center of the conductive loop (900), most (about 70% or more) of the grids included in the signal area (SA) may include grids that primarily overlap with the electronic device (101).

[0164] FIG. 18 illustrates a noise area (NA), which is an area where the strength of the magnetic field formed by electronic components (E1, E2) arranged in an electronic device (101) is relatively weak, according to one embodiment of the present disclosure.

[0165] Referring to FIG. 17, according to one embodiment of the present disclosure, a noise area (NA) may include grids in which the intensity of a magnetic field generated from electronic components (E1, E2) of an electronic device (101) excluding a coil (640) of a speaker (600, see FIG. 8) and a conductive loop (900) is less than or equal to a predetermined value (e.g., -38 dBA / m). The noise area (NA) may be understood as an area through which a magnetic field of an intensity that does not inhibit an electrical signal from being induced in a hearing aid coil (1003, see FIG. 6) passes.

[0166] According to one embodiment of the present disclosure, the noise area (NA) may be affected by the position and shape of the electronic components (E1, E2). As an example, the first electronic component (E1) may include a camera assembly (307, see FIG. 12), and the second electronic component (E2) may include a printed circuit board (700, see FIG. 13) on which a plurality of circuits and / or integrated devices are mounted.

[0167] According to one embodiment of the present disclosure, since the influence of noise decreases as one goes toward the outside of the electronic device (101), most (about 70% or more) of the grids included in the noise area (NA) may include grids that do not primarily overlap with the electronic device (101).

[0168] Fig. 19 illustrates an overlap area (OA), which is an area where the signal area (SA) illustrated in Fig. 17 and the noise area (NA) illustrated in Fig. 18 overlap. The overlap area (OA) is an area where the strength of the magnetic field in the voice band is strong and the strength of the magnetic field acting as noise is low, and can be understood as an area where communication between the electronic device (101) and the hearing aid (1000, see Fig. 6) is stably established.

[0169] Referring to FIGS. 17 to 19, according to one embodiment of the present disclosure, a sound hole (214) may be located at an edge of an electronic device (101). A noise area (NA) may be located around the electronic device (101). According to one embodiment of the present disclosure, the electronic device (101) may improve communication compatibility with a hearing aid coil (1000, see FIG. 6) by arranging a conductive loop (900) at a location adjacent to a sound hole (214, see FIG. 7) such that an area where a magnetic field generated by the conductive loop (900) has a strong intensity and the noise area (NA) overlap.

[0170] When a user wearing a hearing aid uses an electronic device (e.g., making a phone call), the electronic device may include a magnetic field generating member for communicating with the hearing aid. The magnetic field generating member may include a coil included in a speaker, or a separate conductive member separate from the speaker. In this case, in order to improve the hearing aid compatibility of the electronic device, it is necessary to add a magnetic field generating member or to place the magnetic field generating member in a required location to avoid noise. However, due to structural constraints resulting from the thinning and miniaturization of electronic devices, it is difficult to add a magnetic field generating member or to place it in a required location. Accordingly, much research is being conducted to improve the hearing aid compatibility of electronic devices.

[0171] A problem to be solved in the present disclosure may be to improve hearing aid compatibility of an electronic device.

[0172] A problem to be solved in the present disclosure may be to optimize the mounting structure of an electronic device including a conductive member for hearing aid communication.

[0173] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0174] An electronic device according to various embodiments of the present disclosure can improve hearing aid compatibility of the electronic device by placing a conductive loop for hearing aid communication at a location adjacent to a receiver (e.g., a sound hole).

[0175] An electronic device according to various embodiments of the present disclosure can optimize the mounting structure of an electronic device including a conductive loop by forming a portion of a metal frame as a conductive loop for hearing aid communication.

[0176] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0177] According to one embodiment of the present disclosure, an electronic device (101) may include a speaker (600) including a coil (640).

[0178] According to one embodiment of the present disclosure, an electronic device (101) may include a sound hole (214) that is visually exposed to the outside of the electronic device (101).

[0179] According to one embodiment of the present disclosure, the sound hole (214) may be configured to output sound generated from the speaker (600).

[0180] According to one embodiment of the present disclosure, an electronic device (101) may include a frame (400) in which the speaker (600) is placed.

[0181] According to one embodiment of the present disclosure, the frame (400) can define an open space (OS) adjacent to the sound hole (214).

[0182] According to one embodiment of the present disclosure, an electronic device (101) may include a conductive loop (900) disposed at least partially within the open space (OS).

[0183] According to one embodiment of the present disclosure, the conductive loop (900) can be elongated in a loop shape.

[0184] According to one embodiment of the present disclosure, the conductive loop (900) can be configured to generate a magnetic field.

[0185] According to one embodiment of the present disclosure, the coil (640) may be wound around a first axis (Z), and the conductive loop (900) may be extended in a loop shape (L) around a second axis extending along the first axis.

[0186] According to one embodiment of the present disclosure, the sound hole (214) can be opened in the axial direction of the second axis.

[0187] According to one embodiment of the present disclosure, when viewed from above the sound hole (214), the conductive loop (900) may overlap the sound hole (214).

[0188] According to one embodiment of the present disclosure, the electronic device (101) may include a printed circuit board (700) having a signal line (710) electrically connected to the conductive loop (900) arranged thereon.

[0189] According to one embodiment of the present disclosure, a fastening member (F1, F2) may be included to connect the conductive loop (900) and the printed circuit board (700).

[0190] According to one embodiment of the present disclosure, the fastening member (F1, F2) is conductive and can be electrically connected to the signal line (710).

[0191] According to one embodiment of the present disclosure, the electronic device (101) may include a frame cover (500) covering a space (CH) surrounded by the conductive loop (900).

[0192] According to one embodiment of the present disclosure, the frame cover (500) may be non-conductive.

[0193] According to one embodiment of the present disclosure, the frame cover (500) can be coupled to the conductive loop (900) by the fastening member (F1).

[0194] According to one embodiment of the present disclosure, the frame cover (500) is fastened to the conductive loop (900) and the frame (400), and the conductive loop (900) and the frame (400) can be connected through the frame cover (500).

[0195] According to one embodiment of the present disclosure, an electronic device (101) may include a camera module (205) including at least one lens (205a) and a camera housing (205b) that accommodates the at least one lens (205a).

[0196] According to one embodiment of the present disclosure, the conductive loop (900) extends to surround the camera housing (205b) and can support the camera housing (205b).

[0197] According to one embodiment of the present disclosure, the electronic device (101) may include a camera hole (CH) at least partially defined by the conductive loop (900) and overlapping with the at least one lens (205a).

[0198] According to one embodiment of the present disclosure, an electronic device (101) may include a display (330) disposed in a frame (400).

[0199] According to one embodiment of the present disclosure, the display (330) may include a hole edge (331) that defines at least a portion of the sound hole (214).

[0200] According to one embodiment of the present disclosure, the electronic device (101) may include a non-conductive member (D) intervened between the frame (400) and the conductive loop (900).

[0201] According to one embodiment of the present disclosure, the conductive loop (900) may be formed of the same material as the frame (400).

[0202] According to one embodiment of the present disclosure, the conductive loop (900) may be formed of a different material from the coil (640) of the speaker (600).

[0203] According to one embodiment of the present disclosure, the conductive loop (900) may include a first segment (910) extending along an edge of the display (330).

[0204] According to one embodiment of the present disclosure, the conductive loop (900) may include a second segment (920) extending from one end of the first segment (910) toward the interior of the frame (400).

[0205] According to one embodiment of the present disclosure, the conductive loop (900) may include a third segment (930) extending from the other end of the first segment (910) toward the interior of the frame (400).

[0206] According to one embodiment of the present disclosure, a signal-in line and a signal-out line electrically connected to the conductive loop (900) may be arranged on a printed circuit board (700).

[0207] According to one embodiment of the present disclosure, the fastening member (F1, F2) may include a first conductive fastening member (F1) that couples the second segment (920) and the printed circuit board (700) and is electrically connected to the signal-in line.

[0208] According to one embodiment of the present disclosure, the fastening member (F1, F2) may include a conductive second fastening member (F2) that couples the third segment (930) and the printed circuit board (700) and is electrically connected to the signal-out line.

[0209] According to one embodiment of the present disclosure, the first segment (910) may be visually exposed to the outside of the electronic device (101).

[0210] According to one embodiment of the present disclosure, the first segment (910) may form a part of a side surface (210C, see FIG. 2) of the electronic device (101).

[0211] According to one embodiment of the present disclosure, when viewed from above the sound hole (214), the first segment (910) may overlap the sound hole (214).

[0212] According to one embodiment of the present disclosure, the frame (400) may include a base (450) having an open space (OS) formed at an edge thereof.

[0213] According to one embodiment of the present disclosure, the base (450) can support the speaker (600).

[0214] According to one embodiment of the present disclosure, the frame (400) may include a plurality of conductive segments (410, 420, 430, 440) arranged to at least partially surround the base (450).

[0215] According to one embodiment of the present disclosure, the plurality of conductive segments (410, 420, 430, 440) may include a first conductive segment (420) and a second conductive segment (430) disposed on both sides of the conductive loop (900).

[0216] According to one embodiment of the present disclosure, at least a portion of the conductive loop (900) positioned in the open space (OS) and the base (450) can be substantially coplanar.

[0217] According to one embodiment of the present disclosure, the frame (400) may include an open edge (OE) extending along the conductive loop (900) and defining the open space (OS).

[0218] According to one embodiment of the present disclosure, an electronic device (101) may include at least one processor (120) and a memory (130) that stores instructions.

[0219] According to one embodiment of the present disclosure, the instructions stored in the memory (130), when executed by the at least one processor (120), may cause the electronic device (101) to generate a magnetic field in a voice band through at least one of the conductive loop (900) and the coil (640) when calling.

[0220] According to one embodiment of the present disclosure, the electronic device (101) may include a first audio circuit (R1) electrically connected to the coil (640).

[0221] According to one embodiment of the present disclosure, the electronic device (101) may include a second audio circuit (R2) electrically connected to the conductive loop (900).

[0222] According to one embodiment of the present disclosure, at least one processor (120) may be connected to each of the first audio circuit (R1) and the second audio circuit (R2).

[0223] According to one embodiment of the present disclosure, at least one processor (120) may be configured to generate a magnetic field through at least one of the coil (640) and the conductive loop (900).

[0224] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), A speaker (600) including a coil (640); A sound hole (214) visually exposed to the outside of the electronic device (101) and configured to output sound generated from the speaker (600); A frame (400) in which the speaker (600) is placed and which defines an open space (OS) adjacent to the sound hole (214); An electronic device comprising a conductive loop (900) disposed at least partially within the open space (OS), elongated in a loop shape, and configured to generate a magnetic field.

2. In paragraph 1, The above coil (640) is wound around the first axis (Z), The above conductive loop (900) is an electronic device extended in a loop shape wound around a second axis extending along the first axis.

3. In paragraph 1 or 2, The above sound hole (214) is An electronic device that is open in the axial direction of the second axis and overlaps the conductive loop (900) when viewed from above the sound hole (214).

4. In any one of paragraphs 1 to 3, An electronic device in which the above open space (OS) is located closer to the sound hole (214) than the above speaker (600).

5. In any one of paragraphs 1 to 4, A printed circuit board (700) disposed on the frame (400) and having a signal line (710) electrically connected to the conductive loop (900); and An electronic device further comprising a conductive fastening member (F1) that combines the conductive loop (900) and the printed circuit board (700) and is electrically connected to the signal line (710).

6. In paragraph 5, It further includes a non-conductive frame cover (500) that covers the space (CH) surrounded by the conductive loop (900) and is coupled to the conductive loop (900) by the fastening member (F1), An electronic device in which the frame cover (500) is fastened to the conductive loop (900) and the frame (400), and the conductive loop (900) and the frame (400) are connected through the frame cover (500).

7. In any one of paragraphs 1 to 6, Further comprising a camera module (205) including at least one lens (205a) and a camera housing (205b) accommodating the at least one lens (205a), The above conductive loop (900) extends to surround the camera housing (205b), and is an electronic device that supports the camera housing (205b).

8. In paragraph 7, An electronic device further comprising a camera hole (CH) at least partially defined by the conductive loop (900) and overlapping the at least one lens (205a).

9. In any one of paragraphs 1 to 8, An electronic device further comprising a display (330) disposed on the frame (400), the display comprising a hole edge (331) defining at least a portion of the sound hole (214).

10. In any one of paragraphs 1 to 9, An electronic device further comprising a non-conductive member (D) intervened between the frame (400) and the conductive loop (900).

11. In any one of paragraphs 1 to 4 and paragraphs 7 to 10, The above-mentioned conductive loop (900) is: A first segment (910) extending along the edge of the display (330) and visually exposed to the outside of the electronic device (101); A second segment (920) extending from one end of the first segment (910) toward the inside of the frame (400); and An electronic device comprising a third segment (930) extending from the other end of the first segment (910) toward the interior of the frame (400).

12. In paragraph 11, A printed circuit board (700) having a signal-in line and a signal-out line electrically connected to the above conductive loop (900); A first conductive fastening member (F1) that combines the second segment (920) and the printed circuit board (700) and is electrically connected to the signal-in line; and An electronic device comprising a second conductive connecting member (F2) electrically connected to the signal-out line and combining the third segment (930) with the printed circuit board (700).

13. In any one of paragraphs 1 to 12, The above frame (400) is: A base (450) supporting the speaker (600) and having an open space (OS) formed at the edge; and A plurality of conductive segments (410, 420, 430, 440) connected to the base (450) and arranged to at least partially surround the base (450), An electronic device in which the plurality of conductive segments (410, 420, 430, 440) include a first conductive segment (420) and a second conductive segment (430) arranged on both sides of the conductive loop (900).

14. In paragraph 13, An electronic device wherein at least a portion of the conductive loop (900) located in the open space (OS) and the base (450) are substantially coplanar.

15. In any one of paragraphs 1 to 14, At least one processor (120); and It further includes a memory (130) for storing instructions, The above instructions, when executed by the at least one processor (120), cause the electronic device (101) to: An electronic device that generates a magnetic field in the voice band through at least one of the conductive loop (900) and the coil (640) during a call.

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