Dual-receiver integrated to optical assembly with vertical and horizontal hybrid packaging, and optical module

Abstract

The present invention relates to the technical field of optical communications, and particularly relates to a dual-receiver integrated TO optical assembly with vertical and horizontal hybrid packaging, and an optical module. The optical assembly comprises a TO base, a TO cap, a plurality of optical chips, and an optical refraction unit, wherein the plurality of optical chips and the optical refraction unit are fixedly mounted on the TO base; the TO base is provided with at least one mounting post, which is fixedly connected to the TO base, each mounting post has an optical chip fixedly mounted thereon, and optical chips are mounted on the surface of the TO base, the optical refraction unit being used for transmitting optical signals into each optical chip; and either a spherical lens or a flat window lens is mounted at the top center of the TO cap, the spherical lens being used for transmitting converging light to the optical refraction unit, and the flat window lens being used for transmitting parallel light to the optical refraction unit.

Description

A hybrid vertical and horizontal packaged dual-integrated TO optical component and module

[0001] Cross-reference of related applications

[0002] This application claims priority to the following patent application:

[0003] (1) A Chinese patent application filed on June 19, 2024, with application number 202410789612.7 and titled “A dual-integrated TO optical component and optical module with vertical and horizontal hybrid packaging”. Technical Field

[0004] This invention relates to the field of optical communication technology, and in particular to a dual-integrated TO optical component and optical module with a hybrid vertical and horizontal package. Background Technology

[0005] In the current field of communications, COMBOPON OLT / ONU bidirectional optical sub-assembly (BOSA) coaxial devices play a crucial role, especially in fiber optic access networks. These devices are responsible for transmitting optical signals from the Optical Network Unit (ONU) to the Optical Line Terminal (OLT), and vice versa. For existing conventional COMBOPON OLT / ONU BOSA coaxial devices, their uplink wavelength design typically employs two independent transistor outline can (TO-CAN) packages.

[0006] Specifically, each of the two TO-CAN packages contains an optical chip targeting two different uplink wavelengths. During manufacturing, these packages are coupled and solidified in stages, ultimately integrating into the device's baseband signal (BASE) to form a four-way device. While this design meets communication requirements to some extent, it also presents several challenges. To address these challenges, some manufacturers have attempted to package the chips that originally received the two uplink wavelengths separately into a single TO-CAN unit, simplifying the packaging process and reducing the overall device size, ultimately creating a three-way device.

[0007] However, despite the numerous advantages this design offers, some significant drawbacks remain. First, the chip encapsulation within a single TO-CAN assembly places higher demands on packaging technology, increasing manufacturing difficulty and cost. Second, the reduced device size makes it difficult to arrange more components within a limited space (i.e., mounting all chips onto the surface of the TO connector), leading to insufficient mounting space. Furthermore, mounting all chips onto the TO connector surface requires multiple spherical lenses to form a multi-spherical cap, increasing the difficulty of capping and preventing chips from sharing a single optical path. Additionally, the use of more advanced technologies and materials also results in a relatively higher overall cost.

[0008] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field.

[0009] Application content

[0010] The technical problem to be solved by the present invention is that the existing optical devices using TO packaging are packaged in a TO-CAN, which leads to insufficient surface mount space, inability to share optical paths, and relatively high cost.

[0011] The present invention adopts the following technical solution:

[0012] In a first aspect, the present invention provides a dual-integrated TO optical component with vertical and horizontal hybrid packaging, comprising: a TO base 1, a TO cap 2, multiple optical chips 3 and optical refraction units 4; the multiple optical chips 3 and the optical refraction units 4 are fixedly mounted on the TO base 1;

[0013] At least one mounting post 10 is provided on the TO base 1. The mounting post 10 is fixedly connected to the TO base 1. An optical chip 3 is fixedly mounted on each mounting post 10. An optical chip 3 is mounted on the surface of the TO base 1. The light refraction unit 4 is used to transmit light signals to each optical chip 3.

[0014] The top center of the TO cap 2 is provided with either a spherical lens 20 or a flat window mirror 21. The spherical lens 20 is used to transmit converging light to the light refraction unit 4, and the flat window mirror 21 is used to transmit parallel light to the light refraction unit 4.

[0015] Preferably, when one mounting post 10 is provided, the optical chip 3 includes a first optical chip 30 and a second optical chip 31, the first optical chip 30 is mounted on the surface of the mounting post 10, and the second optical chip 31 is mounted on the surface of the TO seat 1.

[0016] Preferably, the light refraction unit 4 includes a first support 400, a first transmission glass plate 401, a second transmission glass plate 402, and a first beam splitter glass plate 403, wherein the first transmission glass plate 401, the second transmission glass plate 402, and the first beam splitter glass plate 403 are fixedly mounted on the first support 400.

[0017] The first transmissive glass plate 401 is arranged parallel to the first optical chip 30, and the second transmissive glass plate 402 is arranged parallel to the second optical chip 31. The first beam-splitting glass plate 403 is located directly below the light-transmitting opening of the TO cap 2. The first beam-splitting glass plate 403 is mounted on the first inclined surface 4000 of the first bracket 400. The inclination angle of the first inclined surface 4000 is 45°±0.01°, so that the light wavelength received by the first optical chip 30 in the optical signal is reflected back to the first optical chip 30, and the light wavelength received by the second optical chip 31 in the optical signal is transmitted back to the second optical chip 31.

[0018] Preferably, the center of the first beam-splitting glass plate 403 is aligned with the centers of the first transmission glass plate 401 and the second transmission glass plate 402, respectively. The center of the first transmission glass plate 401 is aligned with the center of the APD on the first optical chip 30, and the center of the second transmission glass plate 402 is aligned with the center of the APD on the second optical chip 31.

[0019] Preferably, the first support 400 has notches in the areas where the first transmission glass plate 401, the second transmission glass plate 402 and the first beam-splitting glass plate 403 are installed, so that light can pass through.

[0020] Preferably, a beam-splitting film is attached to the first beam-splitting glass slide 403, and an anti-reflection film is attached to the surfaces of the first transmission glass slide 401 and the second transmission glass slide 402.

[0021] Preferably, when the optical signal is converging light, the top of the TO cap 2 is equipped with the spherical lens 20, and the center point of the spherical lens 20 is collinear with the center point of the first beam-splitting glass plate 403.

[0022] Preferably, when the optical signal is parallel light, a flat window mirror 21 is installed on the top of the TO cap 2, and an external lens 22 is provided above the flat window mirror 21. The central axis of the external lens 22 is collinear with the center of the first beam splitter 403. The external lens 22 is used to converge the parallel light and transmit it into the flat window mirror 21.

[0023] Preferably, when the optical signal is parallel light, a flat window mirror 21 is provided on the TO cap 2;

[0024] The light refraction unit 4 includes a second bracket 404, a first convex lens 405, and a second convex lens 406. The first convex lens 405 and the second convex lens 406 are fixedly mounted on the second bracket 404. The first convex lens 405 is arranged parallel to the first optical chip 30. The first convex lens 405 is used to converge the light signal into the first optical chip 30, and the second convex lens 406 is used to converge the light signal into the second optical chip 31.

[0025] The light refraction unit 4 further includes a third transmission glass plate 407, a second beam-splitting glass plate 408, and a first reflection glass plate 409. The third transmission glass plate 407 is arranged parallel to the first convex lens 405. The second beam-splitting glass plate 408 is arranged directly below the flat window mirror 21 and is mounted on the second inclined surface 4040 of the second bracket 404. The inclination angle of the second inclined surface 4040 is 13°±0.01°. The first reflection glass plate 409 is mounted on the third inclined surface 4041 of the second bracket 404. The inclination angle of the third inclined surface 4041 is 32°±0.01°.

[0026] Preferably, the third transmissive glass slide 407 is provided with an antireflective film, the second beam-splitting glass slide 408 is provided with a filter film, and the first reflective glass slide 409 is provided with a reflective film.

[0027] Preferably, when three mounting posts 10 are provided, the optical chip 3 includes a third optical chip 32, a fourth optical chip 33, a fifth optical chip 34 and a sixth optical chip 35. The third optical chip 32, the fourth optical chip 33 and the fifth optical chip 34 are respectively mounted on the mounting posts 10, and the sixth optical chip 35 is mounted on the surface of the TO seat 1.

[0028] The light refraction unit 4 includes a third support 410 and a beam splitter 411. The beam splitter 411 is fixedly connected to the third support 410 and is placed vertically. The beam splitter 411 includes a first plane 4110, a second plane 4111, and a third plane 4112. The first plane 4110 is parallel to the third optical chip 32, the second plane 4111 is parallel to the fourth optical chip 33, and the third plane 4112 is parallel to the fifth optical chip 34.

[0029] The beam splitter 411 is internally provided with a first beam splitter 4113, a second beam splitter 4114, and a third beam splitter 4115. The first beam splitter 4113, the second beam splitter 4114, and the third beam splitter 4115 all pass through the center of the beam splitter 411. The first beam splitter 4113 is inclined at an angle of 45°±0.01° to the first plane 4110, the second beam splitter 4114 is inclined at an angle of 45°±0.01° to the second plane 4111, and the third beam splitter 4115 is inclined at an angle of 45°±0.01° to the third plane 4112.

[0030] Preferably, the first plane 4110 is provided with a first filter film, and the light wavelengths that the third optical chip 32 can receive can pass through the first filter film, while other wavelengths are reflected; the second plane 4111 is provided with a second filter film, and the light wavelengths that the fourth optical chip 33 can receive can pass through the second filter film, while other wavelengths are reflected; the third plane 4112 is provided with a third filter film, and the light wavelengths that the fifth optical chip 34 can receive can pass through the fifth filter film, while other wavelengths are reflected.

[0031] An anti-reflection film is attached to the upper surface of the beam splitter 411, and a fourth filter film is attached to the lower surface of the beam splitter 411. The fourth filter film allows light wavelengths that can be received by the sixth optical chip 35 to pass through, while other wavelengths are reflected.

[0032] Preferably, when the light signal is converging light, the spherical lens 20 is installed on the top of the TO cap 2; when the light signal is parallel light, the flat window mirror 21 is installed on the top of the TO cap 2, and an external lens 22 is provided on the outside of the TO cap 2, the external lens 22 being used to converge the light signal.

[0033] Preferably, the mounting column 10 is either a square or an arc-shaped column.

[0034] In a second aspect, the present invention provides a dual-integrated optical module with a hybrid vertical and horizontal package, comprising the dual-integrated TO optical component with a hybrid vertical and horizontal package as described in the first aspect.

[0035] Compared with the prior art, the beneficial effects of the present invention are as follows: Compared with the prior art of attaching multiple optical chips 3 onto the TO base 1 to form a three-way device, the present invention provides a mounting post 10 on the TO base 1, and the optical chips 3 can be attached to the surface of the mounting post 10 and the TO base 1, which increases the area that can be attached and solves the problem of limited mounting space caused by attaching multiple optical chips 3 to the surface of the TO base 1 at the same time; and then the light signal is reflected or refracted to the receiving area of ​​each optical chip 3 through the light refraction unit 4. The vertical double receiving structure allows the optical chips 3 located on the mounting post 10 and the optical chips 3 located on the surface of the TO base 1 to share a single optical path. Only one spherical lens 20 needs to be installed on the TO cap 2, which effectively solves the problems in the prior art that it is impossible to share a single spherical lens 20 due to optical path limitations and the difficulty of sealing multiple spherical caps. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0037] Figure 1 is a schematic diagram of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided by an embodiment of the present invention, wherein the TO cap is a spherical lens.

[0038] Figure 2 is a schematic diagram of a vertical and horizontal hybrid packaged dual-capsule TO optical component provided by an embodiment of the present invention, with the TO cap removed from Figure 1.

[0039] Figure 3 is a schematic diagram of a vertical and horizontal hybrid packaged dual-integrated TO optical component with the light refraction unit removed from Figure 2, according to an embodiment of the present invention.

[0040] Figure 4 is a schematic diagram of a flat window mirror as the TO cap of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0041] Figure 5 is a schematic diagram of an optical chip of a dual-integrated TO optical component with vertical and horizontal hybrid packaging provided in an embodiment of the present invention.

[0042] Figure 6 is a cross-sectional schematic diagram of the first type of light refraction unit of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0043] Figure 7 is a schematic diagram of the first beam-splitting glass of a vertical and horizontal hybrid packaged dual-integrated TO optical module provided in an embodiment of the present invention.

[0044] Figure 8 is a schematic diagram of the external lens of a vertical and horizontal hybrid packaged dual-collection TO optical component provided in an embodiment of the present invention.

[0045] Figure 9 is a cross-sectional schematic diagram of the second type of light refraction unit of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0046] Figure 10 is a schematic diagram of the first reflective glass sheet of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0047] Figure 11 is a schematic diagram of the second and third inclined surfaces of a vertical and horizontal hybrid packaged dual-integrated TO optical module provided in an embodiment of the present invention.

[0048] Figure 12 is a schematic diagram of the optical path of the first optical chip of a dual-integrated TO optical component with vertical and horizontal hybrid packaging provided in an embodiment of the present invention.

[0049] Figure 13 is a schematic diagram of the optical path of the second optical chip of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0050] Figure 14 is a schematic diagram of a third type of light refraction unit of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0051] Figure 15 is a schematic diagram of an optical chip of a dual-integrated TO optical component with vertical and horizontal hybrid packaging provided in an embodiment of the present invention.

[0052] Figure 16 is a schematic diagram of the beam splitter of a vertical and horizontal hybrid packaged dual-integrated TO optical module provided in an embodiment of the present invention.

[0053] Figure 17 is a perspective view of the beam splitter of a vertical and horizontal hybrid packaged dual-integrated TO optical module provided in an embodiment of the present invention.

[0054] Figure 18 is a schematic diagram of the optical path of a dual-integrated TO optical component with vertical and horizontal hybrid packaging provided in an embodiment of the present invention.

[0055] The attached figures are labeled as follows:

[0056] 1-TO base, 10-mounting post, 2-TO cap, 20-spherical lens, 21-flat window mirror, 22-external lens, 3-optical chip 30-First optical chip, 31-Second optical chip, 32-Third optical chip, 33-Fourth optical chip, 34-Fifth optical chip, 35-Sixth optical chip, 4-Light refraction unit, 400-First support, 4000-First inclined plane, 401-First transmission glass slide, 402-Second transmission glass slide, 403-First beam splitting glass slide, 404-Second support, 4040-Second inclined plane, 4041-Third inclined plane, 405-First convex lens, 406-Second convex lens, 407-Third transmission glass slide, 408-Second beam splitting glass slide, 409-First reflective glass slide, 410-Third support, 411-Beam splitting prism, 4110-First plane, 4111-Second plane, 4112-Third plane, 4113-First beam splitting film, 4114-Second beam splitting film, 4115-Third beam splitting film, 5-Transimpedance amplifier, 6-High voltage capacitor. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0058] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as openly inclusive, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0059] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0060] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, for example, the description may use the prefix "A" or "B" to describe the same type of nouns as two independent entities. In this case, the corresponding features defined with "A" and "B" are used only to distinguish between similar entities and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0061] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling," "wireless connection," etc. The embodiments disclosed herein are not necessarily limited to the scope of this invention.

[0062] In the description of this invention, the expression “A and / or B” (where A and B are used to formally represent specific features) will be used. The corresponding expression includes the following three combinations: only A, only B, and a combination of A and B.

[0063] As used in this invention, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from a particular value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0064] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0065] Example 1:

[0066] Embodiment 1 of this invention provides a hybrid vertical and horizontal packaged dual-integrated TO optical module, as shown in Figures 1 and 2, comprising: a TO base 1, a TO cap 2, multiple optical chips 3, and an optical refraction unit 4; the multiple optical chips 3 and the optical refraction unit 4 are fixedly mounted on the TO base 1. In addition to the above structure, as shown in Figure 3, the optical module also includes a transimpedance amplifier 5 and a high-voltage capacitor 6. The transimpedance amplifier 5 is used to convert the current signal generated by the avalanche photodiode (APD) on the optical chip 3 into a voltage signal, facilitating the detection and measurement of photoelectric signals. The high-voltage capacitor 6 is used for power supply stabilization, reducing electromagnetic interference, improving operational stability, protecting the circuit, and improving the signal-to-noise ratio, ensuring that the optical module can operate stably and reliably in complex environments. In this embodiment, the TO base 1 is provided with 9 pins, which are used to realize the electrical connection between the optoelectronic device and the external circuit, signal transmission, and the mounting and positioning of the optical device on the TO base 1.

[0067] As shown in Figure 2, at least one mounting post 10 is provided on the TO base 1. The mounting post 10 is fixedly connected to the TO base 1, and an optical chip 3 is fixedly mounted on each mounting post 10. The optical chip 3 is mounted on the surface of the TO base 1, and the light refraction unit 4 is used to transmit optical signals to the optical chip 3. The mounting post 10 can be an arc-shaped post or a square post. Figure 2 shows an arc-shaped mounting post 10. The optical chip 3 is attached to the planar area of ​​the arc-shaped post. In one embodiment, each optical chip 3 is electrically connected to other optical devices using a flip-wire bonding method, making the connection between the optical chip 3 and other devices more stable and with higher precision.

[0068] As shown in Figures 1 and 4, a spherical lens 20 or a flat window mirror 21 is installed at the center of the top of the TO cap 2. The spherical lens 20 is used to transmit converging light to the light refraction unit 4, and the flat window mirror 21 is used to transmit parallel light to the light refraction unit 4. Specifically, whether a spherical lens 20 or a flat window mirror 21 is installed on the top of the TO cap 2 depends on whether the light signal is converging or parallel.

[0069] Compared to the existing technology of attaching multiple optical chips 3 onto the TO base 1 to form a three-way device, the present invention provides a mounting post 10 on the TO base 1, allowing the optical chips 3 to be attached to the surfaces of the mounting post 10 and the TO base 1, increasing the area available for mounting and solving the problem of limited mounting space caused by attaching multiple optical chips 3 simultaneously to the surface of the TO base 1. Furthermore, the light signal is reflected or refracted to the receiving area of ​​each optical chip 3 through the light refraction unit 4. The vertical double-receiving structure allows the optical chips 3 located on the mounting post 10 and the optical chips 3 located on the surface of the TO base 1 to share a single optical path. Only one spherical lens 20 needs to be installed on the TO cap 2, effectively solving the problems in the existing technology where it is impossible to share a single spherical lens 20 due to optical path limitations and the difficulty of sealing multiple spherical caps.

[0070] Based on the above scheme, subsequent embodiments will provide a more detailed description of the structures mentioned in the above scheme, especially the structural interaction between the optical chip 3, the mounting post 10 and the optical refraction unit 4. Multiple schemes will be provided in the subsequent implementation of the present invention.

[0071] Example 2:

[0072] This embodiment provides a first structural scheme for an optical chip 3, a mounting post 10, and an optical refraction unit 4 based on embodiment 1, as shown in Figure 5. When one mounting post 10 is provided, the optical chip 3 includes a first optical chip 30 and a second optical chip 31. The first optical chip 30 is mounted on the surface of the mounting post 10, and the second optical chip 31 is mounted on the surface of the TO seat 1. As shown in Figure 6, the optical refraction unit 4 includes a first support 400, a first transmission glass plate 401, a second transmission glass plate 402, and a first beam-splitting glass plate 403. The first transmission glass plate 401, the second transmission glass plate 402, and the first beam-splitting glass plate 403 are fixedly mounted on the first support 400. The first beam-splitting glass plate 403 is used to reflect light of a specific wavelength in the optical signal and allow light of other wavelengths to pass through, so that the optical signal enters the optical chip 3. The first transmissive glass plate 401 is arranged parallel to the first optical chip 30, and the second transmissive glass plate 402 is arranged parallel to the second optical chip 31. The first beam-splitting glass plate 403 is positioned directly below the light-transmitting opening of the TO cap 2, as shown in Figure 7. The first beam-splitting glass plate 403 is mounted on the first inclined surface 4000 of the first support 400. The inclination angle of the first inclined surface 4000 is 45°±0.01°, so that the light wavelength received by the first optical chip 30 in the optical signal is reflected back to the first optical chip 30, and the light wavelength received by the second optical chip 31 in the optical signal is transmitted back to the second optical chip 31. The center of the first beam-splitting glass plate 403 is aligned with the centers of the first transmissive glass plate 401 and the second transmissive glass plate 402, respectively. The center of the first transmissive glass plate 401 is aligned with the center of the APD on the first optical chip 30, and the center of the second transmissive glass plate 402 is aligned with the center of the APD on the second optical chip 31. Furthermore, the first support 400 has notches in the areas where the first transmission glass plate 401, the second transmission glass plate 402, and the first beam-splitting glass plate 403 are installed, so that light can pass through.

[0073] A beam-splitting film is attached to the first beam-splitting glass slide 403. The beam-splitting film can reflect the light wavelength that the first optical chip 30 can receive, and allow the light wavelength that the second optical chip 31 can receive to be transmitted. An anti-reflection film is attached to the surface of the first transmissive glass slide 401 and the second transmissive glass slide 402.

[0074] In one embodiment, taking the first optical chip 30 receiving light with a wavelength of 1270nm and the second optical chip 31 receiving light with a wavelength of 1290nm as an example, the beam splitting film attached to the first beam splitting glass 403 can reflect the 1270nm light in the optical signal into the first optical chip 30, so that the 1290nm light passes through and enters the second optical chip 31.

[0075] When the optical signal is a converging light, referring to Figure 6, a spherical lens 20 is installed on the top of the TO cap 2, and the center point of the spherical lens 20 is collinear with the center point of the first beam-splitting glass plate 403. Specifically, since the center point of the spherical lens 20 is located on the central axis of the TO cap 2, the center point of the spherical lens 20 is collinear with the center point of the first beam-splitting glass plate 403, taking the central axis of the TO cap 2 as a reference. Taking the above embodiment as an example, the optical path of the converging light entering the first optical chip 30 is as follows: the light source emits an optical signal containing wavelengths of 1270nm and 1290nm, the optical signal is converged on the first beam-splitting glass plate 403 by the spherical lens 20, the first beam-splitting glass plate 403 reflects the 1270nm wavelength light, the 1270nm light passes through the first transmission glass plate 401 and enters the first optical chip 30; the 1290nm light passes through the first beam-splitting glass plate 403 and the second transmission glass plate 402 and enters the second optical chip 31.

[0076] When the optical signal is parallel light, as shown in Figure 8, a flat window mirror 21 is installed on the top of the TO cap 2, and an external lens 22 is set above the flat window mirror 21. The central axis of the external lens 22 is collinear with the center of the first beam splitter 403. The external lens 22 is used to converge the parallel light and transmit it into the flat window mirror 21. Due to the small area of ​​the spherical lens 20 and the limitations of the optical path structure, it is not possible to directly use the spherical lens 20 to converge the parallel light into the interior of the TO. In order to meet the optical path design requirements, a structure design of flat window mirror 21 and external lens 22 must be used. The external lens 22 has a larger area and can converge a wide range of parallel light, replacing the function of the spherical lens 20 in converging light. Therefore, when the optical signal is parallel light, the optical signal first passes through the external lens 22 for convergence, and then passes through the flat window mirror 21 to the first beam splitter 403. The subsequent optical path is the same as the optical path using the spherical lens 20 mentioned above, and will not be described again here.

[0077] For parallel light, in addition to the above-mentioned method of using an external lens 22 for focusing, as shown in Figure 9, when the light signal is parallel light, a flat window mirror 21 is provided on the TO cap 2, and the parallel light can directly enter the interior of the TO through the flat window mirror 21; the light refraction unit 4 includes a second bracket 404, a first convex lens 405 and a second convex lens 406. The first convex lens 405 and the second convex lens 406 are fixedly installed on the second bracket 404. The first convex lens 405 is used to focus the light signal into the first optical chip 30, and the second convex lens 406 is used to focus the light signal into the second optical chip 31; the focal point of the first convex lens 405 is located on the photosensitive surface of the APD of the first optical chip 30, and the focal point of the second convex lens 406 is located on the photosensitive surface of the APD of the second optical chip 31. The light refraction unit 4 further includes a third transmission glass plate 407, a second beam-splitting glass plate 408, and a first reflective glass plate 409. The third transmission glass plate 407 is arranged parallel to the first convex lens 405. The second beam-splitting glass plate 408 is arranged directly below the flat window mirror 21, as shown in Figure 10. The second beam-splitting glass plate 408 is mounted on the second inclined surface 4040 of the second support 404, with an inclination angle of 13°±0.01°. The first reflective glass plate 409 is mounted on the third inclined surface 4041 of the second support 404, with an inclination angle of 32°±0.01°. The centers of the APD on the second optical chip 31, the optical center of the first convex lens 405, the third transmission glass plate 407, and the first reflective glass plate 409 are all on the same straight line; the optical center of the second convex lens 406 and the center of the second beam-splitting glass plate 408 are also on the same straight line. To ensure that the light signal can be collimated into the first optical chip 30 after being reflected by the second beam-splitting glass plate 408 and the first reflective glass plate 409, as shown in Figures 10 and 11, taking the direction shown in the figures as an example, the second inclined surface 4040 of the second beam-splitting glass plate 408 is at a 13° angle to the horizontal direction, and the third inclined surface 4041 of the first reflective glass plate 409 is at a 32° angle to the vertical direction, so that the light signal can be collimated and reflected into the first optical chip 30.

[0078] Specifically, the third transmissive glass plate 407 is fitted with an antireflective film, the second beam-splitting glass plate 408 is fitted with a filter film, and the first reflective glass plate 409 is fitted with a reflective film. Based on this structure, taking the first optical chip 30 receiving light with a wavelength of 1270nm and the second optical chip 31 receiving light with a wavelength of 1290nm as an example, the optical path of the light signal transmission into the first optical chip 30 is shown in Figure 12. The light source emits light signals with wavelengths of 1270nm and 1290nm. The light signals pass through the flat window mirror 21 and illuminate the second beam-splitting glass plate 408. The second beam-splitting glass plate 408 reflects the 1270nm wavelength light onto the first reflective glass plate 409. The 1290nm light passes through the second beam-splitting glass plate 408 and the first reflective glass plate 409... The glass plate 409 reflects the 1270nm light back to the third transmission glass plate 407. The 1270nm light passes through the third transmission glass plate 407 and then through the first convex lens 405, converging the light signal into the APD of the first optical chip 30. Similarly, the light path for the light signal to enter the second optical chip 31 is shown in Figure 13. The light source emits light signals with wavelengths of 1270nm and 1290nm. The light signals pass through the flat window mirror 21 and illuminate the second beam splitter glass plate 408. The second beam splitter glass plate 408 reflects the 1270nm wavelength light, and the 1290nm light passes through the second beam splitter glass plate 408 and illuminates the second convex lens 406. The second convex lens 406 converges the light signal into the APD of the second optical chip 31.

[0079] Example 3:

[0080] Based on Embodiments 1 and 2, this invention provides a second structural scheme for the optical chip 3, mounting posts 10, and light refraction unit 4, as shown in Figures 14 and 15. When three mounting posts 10 are provided, the optical chip 3 includes a third optical chip 32, a fourth optical chip 33, a fifth optical chip 34, and a sixth optical chip 35. The third optical chip 32, the fourth optical chip 33, and the fifth optical chip 34 are respectively mounted on the mounting posts 10, and the sixth optical chip 35 is mounted on the surface of the TO seat 1. As shown in Figure 14, in this embodiment, the mounting post 10 is square; however, the mounting post 10 can also be an arc-shaped post.

[0081] As shown in Figures 14 and 16, the light refraction unit 4 includes a third support 410 and a beam splitter 411. The beam splitter 411 is fixedly connected to the third support 410 and is placed vertically. The beam splitter 411 includes a first plane 4110, a second plane 4111, and a third plane 4112. The first plane 4110 is parallel to the third optical chip 32, the second plane 4111 is parallel to the fourth optical chip 33, and the third plane 4112 is parallel to the fifth optical chip 34. The beam splitter 411 has an internal structure... As shown in Figure 17, the first beam splitter 4113, the second beam splitter 4114, and the third beam splitter 4115 all pass through the center of the beam splitter prism 411. The first beam splitter 4113 is inclined at an angle of 45°±0.01° to the first plane 4110, the second beam splitter 4114 is inclined at an angle of 45°±0.01° to the second plane 4111, and the third beam splitter 4115 is inclined at an angle of 45°±0.01° to the third plane 4112. Specifically, the first beam splitter 4113 is used to reflect light of wavelengths that can be received by the third optical chip 32 into the third optical chip 32, while allowing light of other wavelengths to pass through; the second beam splitter 4114 is used to reflect light of wavelengths that can be received by the fourth optical chip 33 into the fourth optical chip 33, while reflecting light of other wavelengths; the third beam splitter 4115 is used to reflect light of wavelengths that can be received by the fifth optical chip 34 into the fifth optical chip 34, while reflecting light of other wavelengths. In practical applications, the center of the light source, the center of the beam splitter prism 411, and the center of the APD of the sixth optical chip 35 are located on the same straight line, and the center of the beam splitter prism 411 and the centers of the APDs of the third, fourth, and fifth optical chips 32 and 33 are located on the same horizontal plane.

[0082] In addition to the first beam splitter 4113, the second beam splitter 4114, and the third beam splitter 4115, to prevent light of wavelengths other than those that can be received by the optical chip 3 from entering the optical chip 3, the first plane 4110 is covered with a first filter film, allowing light wavelengths that can be received by the third optical chip 32 to pass through the first filter film, while other wavelengths are reflected; the second plane 4111 is covered with a second filter film, allowing light wavelengths that can be received by the fourth optical chip 33 to pass through the second filter film, while other wavelengths are reflected; the third plane 4112 is covered with a third filter film, allowing light wavelengths that can be received by the fifth optical chip 34 to pass through the fifth filter film, while other wavelengths are reflected; the upper surface of the beam splitter prism 411 is covered with an anti-reflection film, and the lower surface of the beam splitter prism 411 is covered with a fourth filter film, which allows light wavelengths that can be received by the sixth optical chip 35 to pass through, while other wavelengths are reflected.

[0083] Similar to that described in Example 2, when the light signal is converging light, the spherical lens 20 is installed on the top of the TO cap 2; when the light signal is parallel light, the flat window mirror 21 is installed on the top of the TO cap 2, and an external lens 22 is provided on the outside of the TO cap 2, which is used to converge the light signal.

[0084] As shown in Figure 18, taking the third optical chip 32 receiving 1290nm light, the fourth optical chip 33 receiving 1310nm light, the fifth optical chip 34 receiving 1330nm light, and the sixth optical chip 35 receiving 1270nm light as an example, the first beam splitter 4113 can reflect 1290nm light, the second beam splitter 4114 can reflect 1310nm light, and the third beam splitter 4115 can reflect 1330nm light; the first filter film only allows 1290nm light to pass through, the second filter film only allows 1310nm light to pass through, the third filter film only allows 1330nm light to pass through, and the fourth filter film only allows 1290nm light to pass through. Based on this, the optical paths for receiving optical signals by the third optical chip 32, the fourth optical chip 33, the fifth optical chip 34, and the sixth optical chip 35 are as follows: the light source emits a mixed beam of light with wavelengths of 1270nm, 1290nm, 1310nm, and 1330nm. The beam passes through the TO cap 2 and converges onto the first beam splitter 4113, the second beam splitter 4114, and the third beam splitter 4115 at the center of the beam splitter 411. The first beam splitter 4113 reflects the 1290nm light, while the 1270nm, 1310nm, and 1330nm light passes through. The reflected 1290nm light passes through the first filter and is transmitted into the APD of the third optical chip 32; the second beam splitter 4114... The optical film 4114 reflects 1310nm light, while 1270nm, 1290nm, and 1330nm light pass through. The reflected 1310nm light passes through the second filter film and is transmitted into the APD of the fourth optical chip 33. The third beam splitter 4115 reflects 1330nm light, while 1270nm, 1290nm, and 1310nm light pass through. The reflected 1330nm light passes through the third filter film and is transmitted into the APD of the fifth optical chip 34. The 1270nm light in the optical signal passes through the first beam splitter 4113, the second beam splitter 4114, the third beam splitter 4115, and the fourth filter film and is transmitted to the APD of the sixth optical chip 35.

[0085] Example 4:

[0086] This invention provides a dual-integrated optical module with a hybrid vertical and horizontal package, based on embodiments 1-3, including the dual-integrated TO optical component with a hybrid vertical and horizontal package described in embodiments 1-3. Therefore, it also possesses all the advantages of the aforementioned optical components, allowing all optical chips 3 located within the TO to share a single optical path, and features a simple structure, low cost, and overcomes the packaging difficulties of existing packaging structures.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A dual-integrated TO optical module with hybrid vertical and horizontal packaging, characterized in that, include: TO base (1), TO cap (2), multiple optical chips (3) and optical refraction unit (4); the multiple optical chips (3) and the optical refraction unit (4) are fixedly installed on the TO base (1); The TO base (1) is provided with at least one mounting post (10), the mounting post (10) and the TO base (1) are fixedly connected, each mounting post (10) is fixedly mounted with an optical chip (3), the surface of the TO base (1) is mounted with an optical chip (3), and the light refraction unit (4) is used to transmit light signals to each optical chip (3); The top center of the TO cap (2) is provided with either a spherical lens (20) or a flat window mirror (21). The spherical lens (20) is used to transmit converging light to the light refraction unit (4), and the flat window mirror (21) is used to transmit parallel light to the light refraction unit (4).

2. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 1, characterized in that, When one mounting post (10) is provided, the optical chip (3) includes a first optical chip (30) and a second optical chip (31). The first optical chip (30) is mounted on the surface of the mounting post (10), and the second optical chip (31) is mounted on the surface of the TO seat (1).

3. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 2, characterized in that, The light refraction unit (4) includes a first support (400), a first transmission glass slide (401), a second transmission glass slide (402), and a first beam splitting glass slide (403), wherein the first transmission glass slide (401), the second transmission glass slide (402), and the first beam splitting glass slide (403) are fixedly mounted on the first support (400); The first transmission glass plate (401) is arranged parallel to the first optical chip (30), the second transmission glass plate (402) is arranged parallel to the second optical chip (31), the first beam splitter glass plate (403) is arranged directly below the light-transmitting port of the TO cap (2), the first beam splitter glass plate (403) is mounted on the first inclined surface (4000) of the first bracket (400), the inclination angle of the first inclined surface (4000) is 45°±0.01°, so that the light wavelength received by the first optical chip (30) in the optical signal is reflected back to the first optical chip (30), and the light wavelength received by the second optical chip (31) in the optical signal is transmitted back to the second optical chip (31).

4. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 3, characterized in that, The center of the first beam-splitting glass slide (403) is aligned with the center of the first transmission glass slide (401) and the center of the second transmission glass slide (402), respectively. The center of the first transmission glass slide (401) is aligned with the center of the APD on the first optical chip (30), and the center of the second transmission glass slide (402) is aligned with the center of the APD on the second optical chip (31).

5. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 4, characterized in that, The first support (400) has notches in the areas where the first transmission glass slide (401), the second transmission glass slide (402), and the first beam-splitting glass slide (403) are installed, so that light can pass through.

6. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 4, characterized in that, A beam-splitting film is attached to the first beam-splitting glass slide (403), and an anti-reflection film is attached to the surface of the first transmission glass slide (401) and the second transmission glass slide (402).

7. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 3, characterized in that, When the light signal is a converging light, the top of the TO cap (2) is equipped with the spherical lens (20), and the center point of the spherical lens (20) is collinear with the center point of the first beam splitter (403).

8. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 3, characterized in that, When the light signal is parallel light, a flat window mirror (21) is installed on the top of the TO cap (2), and an external lens (22) is provided above the flat window mirror (21). The central axis of the external lens (22) is collinear with the center of the first beam splitter (403). The external lens (22) is used to converge the parallel light and transmit it into the flat window mirror (21).

9. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 2, characterized in that, When the optical signal is parallel light, a flat window mirror (21) is provided on the TO cap (2); The light refraction unit (4) includes a second bracket (404), a first convex lens (405), and a second convex lens (406). The first convex lens (405) and the second convex lens (406) are fixedly mounted on the second bracket (404). The first convex lens (405) is used to converge the light signal into the first optical chip (30), and the second convex lens (406) is used to converge the light signal into the second optical chip (31). The light refraction unit (4) further includes a third transmission glass plate (407), a second beam splitter glass plate (408), and a first reflection glass plate (409). The second beam splitter glass plate (408) is disposed directly below the flat window mirror (21). The second beam splitter glass plate (408) is mounted on the second inclined surface (4040) of the second bracket (404), and the inclination angle of the second inclined surface (4040) is 13°±0.01°. The first reflection glass plate (409) is mounted on the third inclined surface (4041) of the second bracket (404), and the inclination angle of the third inclined surface (4041) is 32°±0.01°.

10. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 9, characterized in that, The third transmissive glass slide (407) is covered with an anti-reflection film, the second beam-splitting glass slide (408) is covered with a filter film, and the first reflective glass slide (409) is covered with a reflective film.

11. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 1, characterized in that, When three mounting posts (10) are provided, the optical chip (3) includes a third optical chip (32), a fourth optical chip (33), a fifth optical chip (34) and a sixth optical chip (35). The third optical chip (32), the fourth optical chip (33) and the fifth optical chip (34) are respectively mounted on the mounting posts (10), and the sixth optical chip (35) is mounted on the surface of the TO seat (1). The light refraction unit (4) includes a third support (410) and a beam splitter (411). The beam splitter (411) is fixedly connected to the third support (410). The beam splitter (411) is placed vertically. The beam splitter (411) includes a first plane (4110), a second plane (4111), and a third plane (4112). The first plane (4110) is parallel to the third optical chip (32), the second plane (4111) is parallel to the fourth optical chip (33), and the third plane (4112) is parallel to the fifth optical chip (34). The beam splitter (411) is internally provided with a first beam splitter (4113), a second beam splitter (4114), and a third beam splitter (4115). The first beam splitter (4113), the second beam splitter (4114), and the third beam splitter (4115) all pass through the center of the beam splitter (411). The first beam splitter (4113) is inclined at an angle of 45°±0.01° to the first plane (4110), the second beam splitter (4114) is inclined at an angle of 45°±0.01° to the second plane (4111), and the third beam splitter (4115) is inclined at an angle of 45°±0.01° to the third plane (4112).

12. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 11, characterized in that, The first plane (4110) is covered with a first filter film, and the light wavelengths that the third optical chip (32) can receive can pass through the first filter film, while the light of other wavelengths is reflected; the second plane (4111) is covered with a second filter film, and the light wavelengths that the fourth optical chip (33) can receive can pass through the second filter film, while the light of other wavelengths is reflected; the third plane (4112) is covered with a third filter film, and the light wavelengths that the fifth optical chip (34) can receive can pass through the fifth filter film, while the light of other wavelengths is reflected; The upper surface of the beam splitter (411) is covered with an anti-reflection film, and the lower surface of the beam splitter (411) is covered with a fourth filter film. The fourth filter film allows light wavelengths that can be received by the sixth optical chip (35) to pass through, while other wavelengths are reflected.

13. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 12, characterized in that, When the light signal is converging light, the spherical lens (20) is installed on the top of the TO cap (2); when the light signal is parallel light, the flat window mirror (21) is installed on the top of the TO cap (2), and an external lens (22) is provided on the outside of the TO cap (2), which is used to converge the light signal.

14. The vertical and horizontal hybrid encapsulated dual-integration TO optical module according to any one of claims 1-13, characterized in that, The mounting column (10) is either a square or an arc-shaped column.

15. A dual-integrated optical module with hybrid vertical and horizontal packaging, characterized in that, Includes the dual-integrated TO optical module with vertical and horizontal hybrid packaging as described in any one of claims 1-14.

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