Combined sensor, microphone, and electronic device

Abstract

The present application discloses a combined sensor, a microphone, and an electronic device. The combined sensor comprises a substrate, an outer housing, an isolation housing, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip, and a pressure ASIC chip. The substrate is provided with a sound hole; the outer housing is arranged on the surface of the substrate, and the outer housing and the substrate define an accommodating cavity; the isolation housing is arranged on the surface of the substrate and covers the sound hole; the pressure ASIC chip is arranged on the side of the isolation housing facing the substrate and is electrically connected to the substrate; the pressure MEMS chip is arranged on any side of the isolation housing and is electrically connected to the pressure ASIC chip; and the microphone MEMS chip and the microphone ASIC chip are both arranged on the side of the isolation housing facing the outer housing.

Description

Combining sensors, microphones, and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202410810428.6, filed with the Chinese Patent Office on June 21, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of sensor technology, and in particular to a combined sensor, microphone, and electronic device. Background Technology

[0003] Currently, integrated microphone and pressure sensor devices (i.e., combined sensors) are used in smart wearable devices to achieve dual functions of voice calls and altitude positioning. These combined sensors have a sound hole, and the voice sensing chip (microphone MEMS chip) and voice signal processing chip (microphone ASIC chip), as well as the pressure sensing chip (pressure MEMS chip) and pressure signal processing chip (pressure ASIC chip), are housed within the combined sensor's cavity, sensing external voice and pressure signals respectively through the sound hole. While this combined sensor achieves functional integration and device miniaturization, when the pressure sensor is operating, its signal processing chip, the pressure ASIC chip, generates intermittent heat. This intermittent heat causes air disturbance within the device's cavity, resulting in the microphone MEMS chip receiving noise signals other than voice signals, reducing the effectiveness of voice signal pickup. In other words, the combined sensor has poor crosstalk immunity. Technical issues

[0004] The main objective of this application is to propose a combined sensor, microphone, and electronic device designed to improve the anti-crosstalk performance of the combined sensor. Technical solutions

[0005] To achieve the above objectives, this application proposes a combined sensor, comprising a substrate, a housing, an isolation housing, a microphone MEMS (Micro-Electro-Mechanical System) chip, a microphone ASIC (Application Specific Integrated Circuit) chip, a pressure MEMS chip, and a pressure ASIC chip. The substrate has an acoustic aperture. The housing is disposed on the surface of the substrate and encloses the substrate to form a cavity. The isolation housing is disposed on the surface of the substrate within the cavity and covers the acoustic aperture. The isolation housing has a through-hole. The pressure ASIC chip is disposed on the side of the isolation housing facing the substrate and is electrically connected to the substrate. The pressure MEMS chip is disposed on either the side of the isolation housing facing the substrate or the side of the isolation housing facing the housing and is electrically connected to the pressure ASIC chip. Both the microphone MEMS chip and the microphone ASIC chip are disposed on the side of the isolation housing facing the housing, and the microphone ASIC chip is electrically connected to both the microphone MEMS chip and the substrate.

[0006] In one embodiment, the pressure ASIC chip is mounted upright on the surface of the substrate located inside the isolation shell, and the pressure MEMS chip is disposed on the surface of the isolation shell facing the outer shell.

[0007] In one embodiment, the pressure ASIC chip is flip-chip mounted on the surface of the substrate located inside the isolation shell, and the pressure MEMS chip is disposed on the surface of the isolation shell facing the outer shell.

[0008] In one embodiment, the pressure ASIC chip is embedded in the substrate, and the pressure MEMS chip is disposed on the surface of the isolation shell facing the outer shell.

[0009] In one embodiment, the through-hole corresponds to the microphone MEMS chip; and / or, the through-hole is provided in a plurality of locations, with the plurality of through-holes spaced apart in the isolation shell.

[0010] In one embodiment, the thickness of the isolation shell ranges from 0.1 to 0.2 mm.

[0011] In one embodiment, the size of the acoustic aperture is larger than the size of the through aperture.

[0012] In one embodiment, the radial dimension of the acoustic hole is defined as D1, and the radial dimension of the through hole is defined as D2, then D1 = (4~6)D2.

[0013] This application also proposes a microphone that includes the combined sensor described above.

[0014] This application also proposes an electronic device that includes a microphone as described above. Beneficial effects

[0015] The technical solution of this application includes a combined sensor comprising a substrate, a housing, an isolation housing, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip, and a pressure ASIC chip. The substrate has an acoustic aperture. The housing is disposed on the surface of the substrate and forms a cavity with the substrate. The isolation housing is disposed on the surface of the substrate within the cavity and covers the acoustic aperture. The isolation housing has a through-hole. The pressure ASIC chip is disposed on the side of the isolation housing facing the substrate and is electrically connected to the substrate. The pressure MEMS chip is disposed on the side of the isolation housing facing the substrate or the side of the isolation housing facing the housing and is electrically connected to the pressure ASIC chip. Both the microphone MEMS chip and the microphone ASIC chip are disposed on the side of the isolation housing facing the housing, and the microphone ASIC chip is electrically connected to both the microphone MEMS chip and the substrate. This configuration isolates the pressure ASIC chip and the microphone MEMS chip and changes the heat transfer path. The intermittent heat generated by the pressure ASIC chip during operation can be directly transferred and diffused from the substrate side to the outside, without being transferred and diffused to the cavity through the microphone MEMS chip. This effectively avoids heat disturbance affecting the microphone MEMS chip and causing noise, thus effectively improving the anti-crosstalk effect of the combined sensor. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 is a cross-sectional structural schematic diagram of an embodiment of the combined sensor provided in this application;

[0018] Figure 2 is a cross-sectional structural schematic diagram of another embodiment of the combined sensor provided in this application;

[0019] Figure 3 is a cross-sectional structural schematic diagram of another embodiment of the combined sensor provided in this application.

[0020] Explanation of icon numbers:

[0021] 100. Combined sensor; 1. Substrate; 11. Acoustic hole; 2. Housing; 3. Isolation shell; 31. Through hole; 3a. First cavity; 3b. Second cavity; 4. Microphone MEMS chip; 5. Microphone ASIC chip; 6. Pressure MEMS chip; 7. Pressure ASIC chip.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Embodiments of the present invention

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0024] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0026] To improve the anti-crosstalk effect of the combined sensor 100, this application proposes a combined sensor 100.

[0027] Please refer to Figures 1 to 3. In one embodiment of this application, the combined sensor 100 includes a substrate 1, a housing 2, an isolation shell 3, a microphone MEMS (Micro-Electro-Mechanical System) chip 4, a microphone ASIC (Application Specific Integrated Circuit) chip 5, a pressure MEMS chip 6, and a pressure ASIC chip 7. The substrate 1 has a sound hole 11. The housing 2 is disposed on the surface of the substrate 1 and surrounds the substrate 1 to form a cavity. The isolation shell 3 is disposed on the surface of the substrate 1 located within the cavity and covers the sound hole 11. The isolation shell 3 has a through hole 31. The pressure ASIC chip 7 is disposed on the side of the isolation shell 3 facing the substrate 1 and is electrically connected to the substrate 1. The pressure MEMS chip 6 is disposed on the side of the isolation shell 3 facing the substrate 1 or the side of the isolation shell 3 facing the housing 2 and is electrically connected to the pressure ASIC chip 7. The microphone MEMS chip 4 and the microphone ASIC chip 5 are both disposed on the side of the isolation shell 3 facing the housing 2. The microphone ASIC chip 5 is electrically connected to the microphone MEMS chip 4 and the substrate 1, respectively.

[0028] Specifically, substrate 1 is a circuit board 1, and outer shell 2 is fixedly attached to one surface of substrate 1. The outer shell 2 and substrate 1 enclose a cavity (not shown). Substrate 1 has a sound hole 11 that penetrates the two opposite surfaces of substrate 1 and connects to the cavity. The isolation shell 3 is made of metal or plastic and is fixedly attached to the surface of substrate 1 facing the cavity, dividing the cavity into a first cavity 3a and a second cavity 3b. The first cavity 3a is connected to the sound hole 11. The isolation shell 3 has a through hole 31 that penetrates the two opposite surfaces of the isolation shell 3 and connects the first cavity 3a and the second cavity 3b. Pressure ASIC chip 7 can be disposed in the first cavity 3a. For example, pressure ASIC chip 7 can be directly attached to the surface of substrate 1 located in the first cavity 3a, or pressure ASIC chip 7 can be mounted in the first cavity 3a by a support frame. Of course, pressure ASIC chip 7 can also be embedded in substrate 1. The pressure MEMS chip 6 can be disposed within the first cavity 3a. For example, the pressure MEMS chip 6 can be directly mounted on the surface of the substrate 1 located within the first cavity 3a, or the pressure MEMS chip 6 can be mounted within the first cavity 3a via a support frame. Alternatively, the pressure MEMS chip 6 can be disposed within the second cavity 3b. For example, the pressure MEMS chip 6 can be directly mounted on the surface of the isolation shell 3 located within the second cavity 3b, or the pressure MEMS chip 6 can be mounted within the second cavity 3b via a support frame. Both the microphone MEMS chip 4 and the microphone ASIC chip 5 are disposed within the second cavity 3b. For example, both the microphone MEMS chip 4 and the microphone ASIC chip 5 can be directly mounted on the surface of the isolation shell 3 located within the second cavity 3b, or both the microphone MEMS chip 4 and the microphone ASIC chip 5 can be mounted within the second cavity 3b via a support frame. When the pressure MEMS chip 6 is positioned on the side of the isolation shell 3 facing the substrate 1, it is electrically connected to the pressure ASIC chip 7 via connecting wires. When the pressure MEMS chip 6 is positioned on the side of the isolation shell 3 facing the outer shell 2, it is electrically connected to the substrate 1 via connecting wires and then to the pressure ASIC chip 7 via circuitry within the substrate 1, transmitting its output signal to the pressure ASIC chip 7. The pressure ASIC chip 7 is electrically connected to the substrate 1 via connecting wires or solder balls, receives the output signal from the pressure MEMS chip 6, and outputs the processed signal to a pad on the other surface of the substrate 1 for easy connection to downstream processing devices. The microphone MEMS chip 4 is connected to the microphone ASIC chip 5 via connecting wires, and the microphone ASIC chip 5 is electrically connected to the substrate 1 via connecting wires. The microphone MEMS chip 4 transmits its output signal to the microphone ASIC chip 5, which receives and processes the signal and outputs the processed signal to a pad on the other surface of the substrate 1 for easy connection to downstream processing devices.A sound hole 11 is provided on the substrate 1, and a through hole 31 is provided on the isolation shell 3. External sound signals and pressure signals can be transmitted to the microphone MEMS chip 4 and the pressure MEMS chip 6 through the sound hole 11 and the through hole 31.

[0029] It should be noted that the shape of the sound hole 11 can be circular, square, elliptical or other reasonable shape, and the shape of the through hole 31 can be circular, square, elliptical or other reasonable shape. There are no limitations here, and they are all within the protection scope of this application.

[0030] The above-described structure isolates the pressure ASIC chip 7 and the microphone MEMS chip 4 through the isolation shell 3, and changes the path of heat disturbance transfer. That is, the intermittent heat generated when the pressure ASIC chip 7 is working can be directly transferred and diffused to the outside from the substrate 1 side (i.e. through the substrate 1 and the sound hole 11), without being transferred and diffused to the accommodating cavity through the microphone MEMS chip 4. This effectively avoids the heat disturbance from affecting the microphone MEMS chip 4 and causing noise, thus effectively improving the anti-crosstalk effect of the combined sensor 100.

[0031] As shown in Figure 1, in one embodiment of this application, the pressure ASIC chip 7 is mounted in a positive mounting manner on the surface of the substrate 1 located inside the isolation shell 3, and the pressure MEMS chip 6 is disposed on the surface of the isolation shell 3 facing the outer shell 2.

[0032] In this embodiment, the pressure ASIC chip 7 is mounted and fixed to the surface of the substrate 1 located in the first cavity 3a in a top-mount manner, and is electrically connected to the substrate 1 via connecting wires. The pressure MEMS chip 6 is mounted and fixed to the surface of the isolation shell 3 located in the second cavity 3b, and is connected to the substrate 1 via connecting wires. The microphone MEMS chip 4 and the microphone ASIC chip 5 are mounted and fixed at intervals on the surface of the isolation shell 3 located in the second cavity 3b, and are electrically connected via connecting wires. The microphone ASIC chip 5 is electrically connected to the substrate 1 via connecting wires. This arrangement isolates the pressure ASIC chip 7 and the microphone MEMS chip 4 through the isolation shell 3 and changes the heat disturbance transfer path. The intermittent heat generated by the pressure ASIC chip 7 during operation can be directly transferred and diffused to the outside from the substrate 1 and the sound hole 11, without being transferred and diffused to the accommodating cavity through the microphone MEMS chip 4. This effectively avoids the heat disturbance affecting the microphone MEMS chip 4 and causing noise. Therefore, the combined sensor 100 of this application has a better anti-crosstalk effect.

[0033] As shown in Figure 2, in another embodiment of this application, the pressure ASIC chip 7 is mounted on the surface of the substrate 1 located inside the isolation shell 3 in a flip-chip manner, and the pressure MEMS chip 6 is disposed on the surface of the isolation shell 3 facing the outer shell 2.

[0034] In this embodiment, the pressure ASIC chip 7 is flip-chip mounted on the surface of the substrate 1 located in the first cavity 3a and electrically connected to the substrate 1 via solder balls. The pressure MEMS chip 6 is mounted on the surface of the isolation shell 3 located in the second cavity 3b and connected to the substrate 1 via connecting wires. The microphone MEMS chip 4 and the microphone ASIC chip 5 are mounted alternately on the surface of the isolation shell 3 located in the second cavity 3b and electrically connected via connecting wires. The microphone ASIC is also electrically connected to the substrate 1 via connecting wires. This configuration isolates the pressure ASIC chip 7 and the microphone MEMS chip 4 through the isolation shell 3 and changes the heat transfer path. The intermittent heat generated by the pressure ASIC chip 7 during operation can be directly transferred and diffused from the substrate 1 and the sound hole 11 to the outside without being transferred and diffused to the accommodating cavity through the microphone MEMS chip 4. This effectively avoids heat disturbance affecting the microphone MEMS chip 4 and causing noise. Therefore, the combined sensor 100 of this application has a better anti-crosstalk effect.

[0035] As shown in Figure 3, in another embodiment of this application, the pressure ASIC chip 7 is embedded in the substrate 1, and the pressure MEMS chip 6 is disposed on the surface of the isolation shell 3 facing the outer shell 2.

[0036] In this embodiment, the pressure ASIC chip 7 is embedded inside the substrate 1 and electrically connected to the substrate 1 through internal circuitry. Specifically, the signal receiving port and output signal port of the pressure ASIC chip 7 are connected to the substrate 1 through internal circuitry. The specific embedding and fabrication operation follows existing technology. The pressure MEMS chip 6 is mounted on the surface of the isolation shell 3 located in the second cavity 3b and connected to the substrate 1 via connecting wires. The microphone MEMS chip 4 and microphone ASIC chip 5 are spaced apart and fixed on the surface of the isolation shell 3 located in the second cavity 3b. The microphone MEMS chip 4 and microphone ASIC chip 5 are electrically connected via connecting wires, and the microphone ASIC is electrically connected to the substrate 1 via connecting wires. This configuration isolates the pressure ASIC chip 7 and the microphone MEMS chip 4 through the isolation shell 3, and changes the path of heat disturbance transfer. The intermittent heat generated when the pressure ASIC chip 7 is working can be directly transferred and diffused to the outside from the substrate 1 and the sound hole 11, without being transferred and diffused to the accommodating cavity through the microphone MEMS chip 4. This effectively avoids the heat disturbance from affecting the microphone MEMS chip 4 and causing noise. Therefore, the combined sensor 100 of this application has a better anti-crosstalk effect.

[0037] It should be noted that, in the above embodiment, the pressure MEMS chip 6 is mounted and fixed on the surface of the isolation shell 3 located in the second cavity 3b. Compared with the solution of mounting and fixing the pressure MEMS chip 6 on the surface of the substrate 1 located in the first cavity 3a, the size of the isolation shell 3 can be effectively reduced, thereby reducing the overall size of the combined sensor 100.

[0038] In one embodiment of this application, the through hole 31 is provided for the microphone MEMS chip 4. With this arrangement, the microphone MEMS chip 4 can sense external sound signals more promptly, more sensitively and more quickly.

[0039] In one embodiment of this application, multiple through holes 31 are provided, and the multiple through holes 31 are spaced apart in the isolation shell 3, that is, the multiple through holes 31 are all connected to the first cavity 3a and the second cavity 3b, for sensing and receiving external sound signals and pressure signals. The multiple through holes 31 are all provided corresponding to the microphone MEMS chip 4, so that the microphone MEMS chip 4 can sense external sound signals more timely, more sensitively and faster.

[0040] In one embodiment of this application, the thickness of the isolation shell 3 is in the range of 0.1~0.2mm (e.g., 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm and any interval between two endpoints). By selecting the isolation shell 3 within the above thickness range, the heat disturbance transfer path can be changed to improve the anti-crosstalk effect, while also reducing its weight to a certain extent.

[0041] In the above embodiments of this application, the size of the sound hole 11 is larger than the size of the through hole 31. Therefore, the resistance of the sound hole 11 is less than that of the through hole 31. Consequently, the intermittent heat generated when the pressure ASIC chip 7 is working can be easily transferred and diffused to the outside through the less resistant sound hole 11, effectively changing the heat disturbance transfer path and thus improving the anti-crosstalk effect of the combined sensor 100. At the same time, the relatively small size of the through hole 31 can effectively prevent foreign objects from entering the second cavity 3b and damaging the microphone MEMS chip 4 and the pressure MEMS chip 6, thereby extending the service life of the combined sensor 100.

[0042] Define the radial dimension of the sound hole 11 as D1 and the radial dimension of the through hole 31 as D2. Then D1 = (4~6)D2, such as D1 = 4D2, D1 = 5D2, D1 = 6D2 and the interval between any two endpoints.

[0043] In one embodiment, the acoustic aperture 11 is a circular aperture with a radial dimension (i.e., diameter) D1 of 0.2~0.3mm (e.g., 0.2mm, 0.25mm, 0.3mm and any range between two endpoints). The through aperture 31 is a circular aperture with a radial dimension (i.e., diameter) D2 of 40~60μm (e.g., 40μm, 45μm, 50μm, 55μm, 60μm and any range between two endpoints). That is, the through aperture 31 is a microporous structure, while the acoustic aperture 11 is a non-microporous structure. This allows the intermittent heat generated when the pressure ASIC chip 7 is working to be more easily transferred and diffused to the outside through the acoustic aperture 11 with less resistance, which more effectively changes the heat disturbance transfer path and thus more effectively improves the anti-crosstalk effect of the combined sensor 100.

[0044] This application also proposes a microphone, which includes the above-described combined sensor 100. The specific structure of the combined sensor 100 is as described in the above embodiments. Since the microphone adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0045] This application also proposes an electronic device, which includes the microphone described above. The electronic device is a smart wearable device, such as a mobile phone, smartwatch, or smart bracelet. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0046] The above description is merely an exemplary embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A combined sensor, wherein, The combined sensor includes a substrate, a housing, an isolation shell, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip, and a pressure ASIC chip. The substrate has an acoustic hole. The housing is disposed on the surface of the substrate and surrounds the substrate to form a cavity. The isolation shell is disposed on the surface of the substrate located within the cavity and covers the acoustic hole. The isolation shell has a through hole. The pressure ASIC chip is disposed on the side of the isolation shell facing the substrate and is electrically connected to the substrate; The pressure MEMS chip is disposed on the side of the isolation shell facing the substrate or on the side of the isolation shell facing the outer shell, and is electrically connected to the pressure ASIC chip; Both the microphone MEMS chip and the microphone ASIC chip are disposed on the side of the isolation shell facing the outer shell, and the microphone ASIC chip is electrically connected to the microphone MEMS chip and the substrate, respectively.

2. The combined sensor as described in claim 1, wherein, The pressure ASIC chip is mounted upright on the surface of the substrate located inside the isolation shell, and the pressure MEMS chip is disposed on the surface of the isolation shell facing the outer shell.

3. The combined sensor as described in claim 1, wherein, The pressure ASIC chip is mounted on the surface of the substrate located inside the isolation shell in a flip-chip manner, and the pressure MEMS chip is disposed on the surface of the isolation shell facing the outer shell.

4. The combined sensor as described in claim 1, wherein, The pressure ASIC chip is embedded in the substrate, and the pressure MEMS chip is disposed on the surface of the isolation shell facing the outer shell.

5. The combined sensor as described in claim 1, wherein, The through-hole is configured corresponding to the microphone MEMS chip; and / or, The through holes are configured as a plurality of holes, which are spaced apart in the isolation shell.

6. The combined sensor as claimed in claim 1, wherein, The thickness of the isolation shell ranges from 0.1 to 0.2 mm.

7. The combined sensor as described in any one of claims 1 to 6, wherein, The size of the acoustic aperture is larger than the size of the through aperture.

8. The combined sensor as claimed in claim 7, wherein, The radial dimension of the acoustic hole is D1, and the radial dimension of the through hole is D2, where D1 = (4~6)D2.

9. A microphone, wherein, The microphone comprises the combined sensor as described in any one of claims 1 to 8.

10. An electronic device, wherein, The electronic device includes the microphone as described in claim 9.

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