Optical module

Abstract

An optical module (200), comprising: a circuit board (300), wherein a first light-emitting chip (304) and a first light-receiving chip (303) are provided on the surface thereof; a first signal processing chip (305), which is electrically connected to the circuit board (300), wherein the first signal processing chip (305) is located on the same surface of the circuit board (300) as the first light-emitting chip (304) and the first light-receiving chip (303), the first signal processing chip (305) is electrically connected to the first light-emitting chip (304) and / or the first light-receiving chip (303), and heat on the surface of the first signal processing chip (305) is dissipated by means of a thermally conductive medium; and a first lens assembly (400), which is located on the same surface of the circuit board (300) as the first signal processing chip (305), wherein an open cavity (400b) is formed between the first lens assembly (400) and the surface of the circuit board (300), the open cavity (400b) has an opening which opens towards the first signal processing chip (305), the first light-emitting chip (304) and the first light-receiving chip (303) are located in the open cavity (400b), and the first lens assembly (400) covers the surfaces of the first light-receiving chip (303) and the first light-emitting chip (304), so as to change the transmission direction of optical signals to be transmitted to the first light-receiving chip (303) and change the transmission direction of light-emitting signals generated by the first light-emitting chip (304). The optical module (200) further comprises a cover assembly or a heat dissipation assembly.

Description

Optical module

[0001] This application claims priority to the application filed on June 28, 2024 with the China National Intellectual Property Office and application number 202410870837.5; the application filed on June 28, 2024 with the China National Intellectual Property Office and application number 202421522081.7; the application filed on June 28, 2024 with the China National Intellectual Property Office and application number 202410870863.8; the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the field of optical fiber communication technology, in particular to an optical module. BACKGROUND

[0003] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the progress of optical communication technology becomes increasingly important. In optical communication technology, optical modules, as one of the key devices in optical communication equipment, can realize optical-electrical signal conversion; in the development process of optical communication technology, the data transmission rate of optical modules is required to be continuously improved.

[0004] SUMMARY

[0005] The present disclosure provides an optical module, comprising:

[0006] A circuit board, a surface of which is provided with a first optical transmitting chip and a first optical receiving chip;

[0007] A first signal processing chip, which is electrically connected to the circuit board, is located on the same surface of the circuit board as the first optical transmitting chip and the first optical receiving chip, and is electrically connected to the first optical transmitting chip and / or the first optical receiving chip; the surface of the first signal processing chip is cooled by a heat-conducting medium;

[0008] A first lens assembly, which is located on the same surface of the circuit board as the first signal processing chip, forms an open cavity between the surface of the circuit board and the first lens assembly, the open cavity has an opening that is open towards the first signal processing chip, the first optical transmitting chip and the first optical receiving chip are located in the open cavity, and the first lens assembly is arranged on the surface of the first optical receiving chip and the first optical transmitting chip to change the transmission direction of the optical signal to be transmitted to the first optical receiving chip and the transmission direction of the optical transmitting signal generated by the first optical transmitting chip;

[0009] The optical module further comprises a cover assembly or a heat dissipation assembly;

[0010] The cover assembly at least partially overlaps the first lens assembly, and at least part of the cover assembly faces the opening to form a barrier between the opening and the first signal processing chip to prevent the heat-conducting medium from entering the open cavity through the opening.

[0011] The heat dissipation assembly is arranged above the first signal processing chip, at least part of the surface of the heat dissipation assembly is provided with the heat-conducting medium to dissipate heat of the first signal processing chip, and at least part of the heat dissipation assembly faces the opening to form a barrier between the opening and the first signal processing chip to prevent the heat-conducting medium from entering the open cavity through the opening. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0013] FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0014] FIG. 2 is a partial structure diagram of a host computer according to some embodiments of the present disclosure;

[0015] FIG. 3 is a structure diagram of an optical module according to some embodiments of the present disclosure;

[0016] FIG. 4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0017] FIG. 5 is a layout structure diagram of an optical module according to some embodiments of the present disclosure;

[0018] FIG. 6 is a layout cross-sectional structure diagram of an optical module according to some embodiments of the present disclosure;

[0019] FIG. 7 is a partial cross-sectional structure diagram of an optical module according to some embodiments of the present disclosure;

[0020] FIG. 8 is an optical path diagram corresponding to a layout of an optical module according to some embodiments of the present disclosure;

[0021] FIG. 9 is an optical path diagram corresponding to a layout of an optical module according to some embodiments of the present disclosure;

[0022] FIG. 10 is an assembly diagram of a first lens assembly and a first signal processing chip according to some embodiments of the present disclosure;

[0023] Fig. 11 is a structure diagram of a first lens assembly facing a first signal processing chip end surface according to some embodiments of the present disclosure;

[0024] Fig. 12 is a layout structure diagram of an optical module according to some embodiments of the present disclosure;

[0025] Fig. 13 is a layout exploded diagram one of an optical module according to some embodiments of the present disclosure;

[0026] Fig. 14 is a layout exploded diagram two of an optical module according to some embodiments of the present disclosure;

[0027] Fig. 15 is a layout side view diagram of an optical module according to some embodiments of the present disclosure;

[0028] Fig. 16 is a layout structure diagram of still another optical module according to some embodiments of the present disclosure;

[0029] Fig. 17 is a layout exploded structure diagram one of still another optical module according to some embodiments of the present disclosure;

[0030] Fig. 18 is a layout exploded structure diagram two of still another optical module according to some embodiments of the present disclosure;

[0031] Fig. 19 is a layout structure diagram of yet another optical module according to some embodiments of the present disclosure;

[0032] Fig. 20 is a layout exploded diagram one of yet another optical module according to some embodiments of the present disclosure;

[0033] Fig. 21 is a layout exploded diagram two of yet another optical module according to some embodiments of the present disclosure;

[0034] Fig. 22 is a layout structure diagram of another optical module according to some embodiments of the present disclosure;

[0035] Fig. 23 is a layout circuit board surface structure diagram of another optical module according to some embodiments of the present disclosure;

[0036] Fig. 24 is a structure diagram of a circuit board surface provided with a first signal processing chip and a second signal processing chip according to some embodiments of the present disclosure;

[0037] Fig. 25 is a structure diagram of a circuit board surface provided with a first lens assembly and a second lens assembly according to some embodiments of the present disclosure;

[0038] Fig. 26 is a light path schematic diagram one of an optical module according to some embodiments of the present disclosure;

[0039] Fig. 27 is a light path schematic diagram two of an optical module according to some embodiments of the present disclosure;

[0040] Fig. 28 is a circuit board surface structure diagram one according to some embodiments of the present disclosure;

[0041] Fig. 29 is a circuit board surface structure diagram two according to some embodiments of the present disclosure;

[0042] Fig. 30 is a circuit board surface structure diagram three according to some embodiments of the present disclosure;

[0043] Fig. 31 is a circuit board surface layout schematic diagram one according to some embodiments of the present disclosure;

[0044] Fig. 32 is a circuit board surface layout schematic diagram two according to some embodiments of the present disclosure;

[0045] Fig. 33 is a first lens assembly side view structure diagram according to some embodiments of the present disclosure;

[0046] Fig. 34 is a first heat dissipation piece structure diagram according to some embodiments of the present disclosure;

[0047] Fig. 35 is a circuit board surface layout schematic diagram three according to some embodiments of the present disclosure;

[0048] Fig. 36 is a circuit board surface layout schematic diagram four according to some embodiments of the present disclosure;

[0049] Fig. 37 is a third heat dissipation piece structure diagram according to some embodiments of the present disclosure;

[0050] Fig. 38 is a circuit board surface layout schematic diagram five according to some embodiments of the present disclosure;

[0051] Fig. 39 is a circuit board surface layout schematic diagram six according to some embodiments of the present disclosure;

[0052] Fig. 40 is a first lens assembly bottom structure diagram according to some embodiments of the present disclosure;

[0053] Fig. 41 is a first lens assembly and first optical fiber support assembly exploded view according to some embodiments of the present disclosure;

[0054] Fig. 42 is a first lens assembly towards optical port end surface structure diagram according to some embodiments of the present disclosure;

[0055] Fig. 43 is a first lens assembly and first optical fiber support assembly assembly cross-sectional structure diagram according to some embodiments of the present disclosure;

[0056] Fig. 44 is a first lens assembly cross-sectional structure diagram according to some embodiments of the present disclosure;

[0057] FIG. 45 is a diagram of a bottom surface structure of a first lens assembly according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0058] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0059] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is to be interpreted as open, inclusive, meaning "including, but not limited to"; the terms "first", "second" are not to be interpreted as indicating or implying relative importance or indicating the upper limit of the number; the term "multiple" means two or more; the term "connected" should be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted to or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush" and the like are not limited to absolute mathematical theoretical relationship, but also include acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0060] In optical communication technology, in order to establish information transmission between information processing devices, information needs to be loaded onto light, and the transmission of information is realized by the propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so as to realize high-speed, long-distance and low-cost information transmission. The signal that can be recognized and processed by the information processing device is an electrical signal. The information processing device usually includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and the information transmission device usually includes an optical fiber and an optical waveguide, etc.

[0061] The optical module can realize mutual conversion between optical signals and electrical signals between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since information transmission can be performed between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as a host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be referred to as an electrical port.

[0062] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0063] One end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.

[0064] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 can be detachably connected with the optical module 200 or fixedly connected. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0065] The host computer 100 includes a housing substantially in the shape of a rectangular cuboid, and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to access the optical module 200, so as to establish a one-way or two-way electrical signal connection between the host computer 100 and the optical module 200.

[0066] The host computer 100 further comprises an external electrical interface configured to access an electrical signal network. For example, the external electrical interface comprises a Universal Serial Bus (USB) interface or a network cable interface 104 configured to access a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and the fourth electrical signal is transmitted to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and the information does not change in the conversion process of the optical signals and the electrical signals, and the encoding and decoding mode of the information can change.

[0067] In addition to the optical network terminal, the host computer 100 further comprises an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0068] FIG. 2 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG. 2, the host computer 100 further comprises a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a fin or other protruding structure to increase the heat dissipation area.

[0069] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 are connected in a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 are connected in a bidirectional optical signal connection.

[0070] Fig. 3 is a structural diagram of an optical module according to some embodiments, and Fig. 4 is an exploded view of an optical module according to some embodiments. As shown in Figs. 3 and 4, the optical module 200 includes a shell, a circuit board 300 arranged in the shell, and a lens assembly. In some embodiments, the surface of the circuit board 300 is provided with a first lens assembly 400 and a second lens assembly 500. The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 is covered on the lower shell 202 to form the above-mentioned shell with two openings 204 and 205. The outer contour of the shell generally presents a square body.

[0071] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011, which is covered on the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0072] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011 and two upper side plates arranged perpendicularly to the cover plate 2011 on both sides of the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper shell 201 is covered on the lower shell 202.

[0073] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of Fig. 3), and the opening 205 is also located at the end of the optical module 200 (the left end of Fig. 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers 301 of the circuit board 300 extend out of the opening 204 and are inserted into the electrical connector of the host computer 100. The opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the first lens assembly 400 and the second lens assembly 500 in the optical module 200.

[0074] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300 and the like into the shells, and the shells can encapsulate and protect the devices. In addition, when the circuit board 300 and the like are installed, the positioning components, heat dissipation components, and electromagnetic shielding components of the devices can be arranged, which facilitates the automated production.

[0075] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0076] In some embodiments, the optical module 200 further includes an unlocking component 600 outside the shell. The unlocking component 600 is configured to achieve the fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0077] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202 and includes a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, releasing the fixation between the optical module 200 and the host computer, and enabling the optical module 200 to be pulled out of the cage 106.

[0078] The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and chips are connected according to the circuit design through the circuit traces to achieve power supply, electrical signal transmission, and grounding functions. The electronic components may, for example, include capacitors, resistors, transistors, and metal oxide semiconductor field effect transistors (MOSFETs). The chips may, for example, include microcontroller units (MCUs), laser drive chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0079] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing effect. For example, the rigid circuit board can stably bear the electronic components and chips described above. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0080] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is in electrical connection with the electrical connector in the cage 106. The gold finger 301 can be provided only on the surface (for example, the upper surface shown in FIG. 4) of one side of the circuit board 300, or can be provided on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish electrical connection with the host computer to achieve power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, and the like. Of course, a flexible circuit board can also be used in some optical modules. The flexible circuit board is generally used in combination with the rigid circuit board to supplement the rigid circuit board.

[0081] In some embodiments, the lens assembly is connected with a fiber holder. The fiber holder can pass through the fiber array and fix the fiber array. For example, the first lens assembly 400 is connected with a first fiber holder 700, and the second lens assembly 500 is connected with a second fiber holder 800.

[0082] FIG. 5 is a schematic diagram of a layout structure inside an optical module according to some embodiments of the present disclosure. As shown in FIG. 5, in some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged along the length direction of the circuit board 300. For example, the second lens assembly 500 is arranged between the first lens assembly 400 and the signal processing chip 302. For example, the signal processing chip 302 is a DSP chip.

[0083] In some embodiments, the second lens assembly 500 is farther away from the optical port than the first lens assembly 400. The fiber array connected with the second fiber holder 800 passes through the surface of the first lens assembly 400 until it is connected with the second lens assembly 500.

[0084] In some embodiments, a first fiber array is arranged between the first fiber holder 700 and the fiber adapter, and a second fiber array is arranged between the second fiber holder 800 and the fiber adapter.

[0085] The first fiber array and the second fiber array are arranged parallel to the surface of the circuit board 300, so that the direction of optical signal transmission is parallel to the surface of the circuit board 300.

[0086] In some embodiments, the surface of the circuit board 300 is provided with a light receiving chip 303, a TIA 3031, a light emitting chip 304, and a laser driving chip 3041.

[0087] In some embodiments, the light receiving chip 303 is arranged adjacent to the TIA 3031. The light receiving chip 303 is used to convert the received optical signal into a photoelectric current signal, and the TIA 3031 is used to convert the photoelectric current signal into a voltage signal and amplify the voltage signal.

[0088] In some embodiments, the light emitting chip 304 is arranged adjacent to the laser driving chip 3041. The laser driving chip 3041 is used to generate a driving signal and send the driving signal to the light emitting chip 304. The light emitting chip 304 converts the received electrical signal into an optical signal under the action of the driving signal.

[0089] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are in a clasp type form. Both can be clamped on the surface of the circuit board 300.

[0090] In some embodiments, the first lens assembly 400 and the surface of the circuit board 300 form an open cavity 400b. Exemplarily, the light receiving chip 303, the TIA 3031, the light emitting chip 304, and the laser driving chip 3041 are located on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0091] In some embodiments, the first lens assembly 400 covers the surface of the light receiving chip 303, the TIA 3031, the light emitting chip 304, and the laser driving chip 3041. The second lens assembly 500 also covers the surface of another group of light receiving chip 303, TIA 3031, light emitting chip 304, and laser driving chip 3041.

[0092] In some embodiments, the end of the first lens assembly 400 and the second lens assembly 500 is formed with a cover tail cavity to cover the TIA 3031 and the laser driving chip 3041.

[0093] In some embodiments, the first lens assembly 400 and the second lens assembly 500 have a light path turning function, which can turn the transmission direction of the optical signal transmitted in the first optical fiber array 700a and the second optical fiber array 800a from parallel to the surface of the circuit board 300 to perpendicular to the circuit board 300, so as to be transmitted to the light receiving chip 303.

[0094] In some embodiments, the first lens assembly 400 and the second lens assembly 500 have a light path turning function, which can turn the light signal transmission direction of the light emitting chip 304 upward along the surface of the circuit board 300 to be parallel to the surface of the circuit board 300, so as to output the light signal emitted by the light emitting chip 304 along the first optical fiber array and the second optical fiber array to the outside of the optical module.

[0095] FIG. 6 is a layout cross-sectional structure diagram of an optical module according to some embodiments of the present disclosure, and FIG. 7 is a partial cross-sectional structure diagram of an optical module according to some embodiments of the present disclosure. As shown in FIG. 6 and FIG. 7, in some embodiments, the second lens assembly 500 is arranged between the first lens assembly 400 and the DSP 302.

[0096] In some embodiments, the first lens assembly 400 is arranged on the surface of a group of light receiving chips 303 and light emitting chips 304.

[0097] In some embodiments, the second lens assembly 500 is arranged on the surface of another group of light receiving chips 303 and light emitting chips 304.

[0098] In some embodiments, a TIA 3031 is arranged between the light receiving chip 303 and the signal processing chip 302, and a laser driving chip 3041 is arranged between the light emitting chip 304 and the signal processing chip 302.

[0099] In some embodiments, the signal processing chip 302 is electrically connected to the gold finger 301.

[0100] In some embodiments, the signal processing chip 302 can be inverted on the surface of the circuit board 300. For example, the solder bumps on the bottom surface of the signal processing chip 302 are connected downward to the surface of the circuit board 300. The wires on the surface of the circuit board 300 are connected to the gold finger 301 from the solder bumps.

[0101] In some embodiments, after the solder bumps of the signal processing chip 302 are connected to the pads on the surface of the circuit board 300 by heating and pressing, the gap between the signal processing chip 302 and the circuit board 300 is filled with viscous filler from both sides of the edge of the signal processing chip 302. The viscous filler is sucked into the gap between the signal processing chip 302 and the circuit board 300 and flows to the center, so as to realize the stable adhesion between the signal processing chip 302 and the circuit board 300.

[0102] In some embodiments, the signal processing chip 302 is electrically connected to the gold finger 301 through the wires on the surface of the circuit board 300 from the solder bumps.

[0103] In some embodiments, the light receiving chip 303 and the light emitting chip 304 under the second lens assembly 500 are electrically connected to the signal processing chip 302 by wire bonding.

[0104] The light receiving chip 303 and the light emitting chip 304 under the first lens assembly 400 are electrically connected to the signal processing chip 302 by via hole plating.

[0105] In some embodiments, the surface of the first lens assembly 400 is formed with a first light path turning surface 401, and the surface of the second lens assembly 500 is formed with a second light path turning surface 501. The first light path turning surface 401 and the second light path turning surface 501 have the same structure and function, and the first light path turning surface 401 is exemplarily described below.

[0106] Specifically, the light receiving chip 303 and the light emitting chip 304 are arranged under the first light path turning surface 401. The light receiving chip 303 and the light emitting chip 304 are arranged along the width direction of the circuit board 300. The light receiving direction of the light receiving chip 303 is perpendicular to the surface of the circuit board 300, and the light emitting direction of the light emitting chip 304 is perpendicular to the surface of the circuit board 300.

[0107] In some embodiments, the light path turning of the light receiving chip 303 and the light emitting chip 304 is realized by the first light path turning surface 401. The first light path turning surface 401 has a reflecting function. The light signal transmitted into the optical module can be turned by the reflection of the first light path turning surface 401 to be received by the light receiving chip 303, or the light signal emitted by the light emitting chip 304 can be turned by the reflection of the first light path turning surface 401 to be transmitted to the outside of the optical module along the optical fiber array.

[0108] Exemplarily, the light signal transmitted into the optical module is reflected by the first light path turning surface 401 to realize light path turning, and the light path is turned from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300, so that the light signal transmitted into the optical module can be received by the light receiving chip 303.

[0109] Exemplarily, the light signal generated by the light emitting chip 304 is reflected by the first light path turning surface 401 to realize light path turning, and the light path is turned from perpendicular to the surface of the circuit board 300 to parallel to the surface of the circuit board 300, so that the light signal generated by the light emitting chip 304 can be transmitted to the outside of the optical module along the optical fiber array.

[0110] FIG. 8 is a light path schematic diagram I of an internal layout of an optical module according to some embodiments of the present disclosure, and FIG. 9 is a light path schematic diagram II of an internal layout of an optical module according to some embodiments of the present disclosure. As shown in FIGS. 8 and 9, in some embodiments, the first lens assembly 400 has a light path turning function.

[0111] In some embodiments, the light path turning of the light receiving chip 303 and the light emitting chip 304 is realized by the first light path turning surface 401.

[0112] In some embodiments, the light signal transmitted to the inside of the optical module along the optical fiber array reaches the first light path turning surface 401, and the light path turning is realized by the downward reflection of the first light path turning surface 401, so as to turn the light path to the direction perpendicular to the circuit board 300 to be received by the light receiving chip 303.

[0113] In some embodiments, the light signal generated by the light emitting chip 304 is transmitted upward along the surface of the circuit board 300 to the first light path turning surface 401, and the light path turning is realized by the reflection of the first light path turning surface 401. For example, the first light path turning surface 401 reflects the light signal output by the light emitting chip 304 towards the optical port direction, so as to turn the light path transmission direction to be transmitted along the optical fiber array, so as to transmit the light signal generated by the light emitting chip 304 to the outside of the optical module.

[0114] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, the other end of the signal processing chip 302 is respectively electrically connected to the laser drive chip 3041 and the TIA 3031, then the laser drive chip 3041 is electrically connected to the light emitting chip 304, and the TIA 3031 is electrically connected to the light receiving chip 303.

[0115] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is directly electrically connected to the light emitting chip 304 and / or the light receiving chip 303.

[0116] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is directly electrically connected to the light emitting chip 304. For example, the laser drive chip 3041 can be integrated in the signal processing chip 302, thereby reducing power consumption.

[0117] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is directly electrically connected to the light receiving chip 303. For example, the TIA 3031 can be integrated in the signal processing chip 302, thereby reducing power consumption.

[0118] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is respectively electrically connected to the light receiving chip 303 and the light emitting chip 304. For example, the laser drive chip 3041 and the TIA 3031 are respectively integrated in the signal processing chip 302, thereby reducing power consumption.

[0119] In some embodiments, the laser driving chip 3041 and / or the TIA 3031 are integrated in the signal processing chip 302, and then the signal processing chip 302 generates a large amount of heat and has a large heat dissipation requirement.

[0120] In some embodiments, the surface of the signal processing chip 302 is cooled by a heat conducting medium. For example, the heat conducting medium is a heat conducting gel. The heat conducting gel has a certain fluidity.

[0121] In some embodiments, the heat conducting medium such as the heat conducting gel is filled between the signal processing chip 302 and the upper shell 201, so that the heat generated by the signal processing chip 302 is conducted to the upper shell 201 through the heat conducting gel, and then dissipated to the outside through the upper shell 201, thereby cooling the signal processing chip 302.

[0122] In some embodiments, the first lens assembly 400 covers the surface of the first light emitting chip 304 and the first light receiving chip 303. The first lens assembly 400 is used to change the transmission direction of the light signal to be transmitted to the first light receiving chip 303, and change the transmission direction of the light emitting signal generated by the first light emitting chip 304.

[0123] Since the signal processing chip 302 is electrically connected to the first light emitting chip 304 and / or the first light receiving chip 303, and the first lens assembly 400 covers the surface of the first light emitting chip 304 and the first light receiving chip 303, the signal processing chip 302 and the first lens assembly 400 should be arranged in close proximity to ensure the electrical connection distance between the signal processing chip 302 and the first light emitting chip 304 and the first light receiving chip 303, and further ensure the high frequency signal transmission performance between the first signal processing chip 305 and the first light emitting chip 304 and the first light receiving chip 303.

[0124] FIG. 10 is an assembly view of a first lens assembly and a first signal processing chip according to some embodiments of the present disclosure, and FIG. 11 is a structure view of a first lens assembly towards a first signal processing chip end face according to some embodiments of the present disclosure. As shown in FIG. 10 and FIG. 11, in some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light emitting chip 304 and the first light receiving chip 303 are located in the open cavity 400b. The open cavity 400b is open towards the signal processing chip.

[0125] In some embodiments, the open cavity 400b has an opening open towards the first signal processing chip 305. The open cavity 400b is arranged to miniaturize the first lens assembly 400.

[0126] In some embodiments, the open cavity 400b is open towards the first signal processing chip 305, and the bottom of the first lens assembly 400 is open to the signal processing chip. The light path of the first lens assembly 400 determines the height of the opening of the open cavity 400b, and the opening space of the open cavity 400b is relatively large. The heat-conducting gel on the surface of the signal processing chip is easy to overflow into the open cavity 400b, which pollutes the optical chip. The height of the opening of the open cavity 400b is sufficient to avoid the surface wiring of the circuit board 300 and is sufficient to allow the heat-conducting gel to pass through.

[0127] In some embodiments, a side wall can be formed on the side of the first lens assembly 400 facing the signal processing chip to block the opening of the open cavity 400b. Based on the material and process of the first lens assembly 400, the thickness of the formed side wall is relatively large, which undoubtedly increases the distance between the first lens assembly 400 and the signal processing chip.

[0128] In some embodiments, in order to avoid the heat-conducting gel on the surface of the signal processing chip overflowing into the open cavity 400b through the opening of the open cavity 400b, a heat dissipation member is provided on the surface of the signal processing chip. The surface of the heat dissipation member can carry the heat-conducting medium and can establish a barrier between the signal processing chip and the open cavity 400b. The barrier faces the opening of the open cavity 400b and establishes a barrier between the opening and the signal processing chip, thereby limiting the heat-conducting medium to the surface of the heat dissipation member, preventing the heat-conducting medium from overflowing into the open cavity 400b through the opening, and avoiding pollution of the optical chip.

[0129] In some embodiments, in order to avoid the heat-conducting gel on the surface of the signal processing chip overflowing into the open cavity 400b through the opening of the open cavity 400b, a first cover is provided on the first lens assembly 400. The first cover includes a baffle. The baffle is arranged towards the opening. The baffle forms a barrier between the opening and the signal processing chip, thereby limiting the heat-conducting medium to one side of the baffle to prevent the heat-conducting medium on the surface of the signal processing chip from entering the open cavity through the opening, thereby avoiding pollution of the optical chip in the open cavity.

[0130] FIG. 12 is a schematic diagram of a light module layout according to some embodiments of the present disclosure, FIG. 13 is a schematic diagram of a light module layout according to some embodiments of the present disclosure, and FIG. 14 is a schematic diagram of a light module layout according to some embodiments of the present disclosure. As shown in FIGS. 12-14, in some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the same surface of the circuit board 300.

[0131] In some embodiments, the upper shell 201 of the optical module forms a heat dissipation air duct with the cage 106 of the host computer 100, so that the upper shell 201 has better heat dissipation effect than the lower shell 202.

[0132] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300 to make full use of the space between the circuit board 300 and the upper shell 201, and to take advantage of the heat dissipation characteristics of the upper shell 201.

[0133] In some embodiments, the first lens assembly 400 is connected to the first fiber holder 710, and the first fiber array is fixed in the first fiber holder 710; the second lens assembly 500 is connected to the second fiber holder 720, and the second fiber array is fixed in the second fiber holder 720.

[0134] In some embodiments, the first fiber holder 710, the first lens assembly 400, and the first signal processing chip 305 cooperate with each other to realize the emission and reception of four optical signals; the second fiber holder 720, the second lens assembly 500, and the second signal processing chip 306 cooperate with each other to realize the emission and reception of another four optical signals.

[0135] In some embodiments, compared with using one signal processing chip, respectively using the first signal processing chip 305 and the second signal processing chip 306 can simultaneously ensure that the first lens assembly 400 and the first signal processing chip 305 are arranged in close proximity, and the second lens assembly 500 and the second signal processing chip 306 are arranged in close proximity.

[0136] In some embodiments, the first signal processing chip 305, the first light receiving chip 303, and the first light emitting chip 304 are located on the same surface of the circuit board 300, and the first lens assembly 400 and the first signal processing chip 305 are located on the same surface of the circuit board 300.

[0137] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304 and / or the first light receiving chip 303.

[0138] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located in the open cavity 400b. For example, the first light receiving chip 303 and the first light emitting chip 304 are arranged on the surface of the circuit board 300, and are covered by the first lens assembly 400 above them.

[0139] In some embodiments, the second lens assembly 500 and the surface of the circuit board 300 form an open cavity 400b. The second light receiving chip 303a and the second light emitting chip 304a are located in the open cavity. Exemplarily, the second light receiving chip 303a and the second light emitting chip 304a are arranged on the surface of the circuit board 300, and are covered by the second lens assembly 500.

[0140] In some embodiments, the open cavity 400b is arranged to miniaturize the first lens assembly 400, and facilitate the first signal processing chip 305 to be close to the first lens assembly 400.

[0141] In some embodiments, the open cavity 400b has an opening that is open to the first signal processing chip 305.

[0142] The presence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the heat-conducting gel on the surface of the first signal processing chip 305 can overflow through the opening of the open cavity 400b and contaminate the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0143] In some embodiments, the surface of the first signal processing chip 305 is covered with a first heat dissipation member 810, and the surface of the second signal processing chip 306 is covered with a second heat dissipation member 820. The first heat dissipation member 810 and the second heat dissipation member 820 have the same structure and function, and the structure and function of the heat dissipation member will be exemplarily described below by taking the first heat dissipation member 810 as an example.

[0144] In some embodiments, the first heat dissipation member 810 includes a first bearing surface 811, a first barrier surface 812, and a first support portion 813. The first bearing surface 811 is arranged horizontally relative to the surface of the circuit board 300, and the first barrier surface 812 is arranged vertically relative to the surface of the circuit board 300. The first barrier surface 812 is connected to the end of the first bearing surface 811, and the first support portion 813 is arranged at the bottom of the first bearing surface 811.

[0145] In some embodiments, the second heat dissipation member 820 includes a second bearing surface 821, a second barrier surface 822, and a second support portion 823. Each surface has the same arrangement and function as the first heat dissipation member 810. The structure and function of the heat dissipation member will be exemplarily described below by taking the first heat dissipation member 810 as an example.

[0146] In some embodiments, the first bearing surface 811 is located above the first signal processing chip 305. The first bearing surface 811 can be provided with a heat-conducting medium to dissipate heat from the first signal processing chip 305. For example, the heat-conducting medium is a heat-conducting gel, which is in thermal contact with the heat-dissipating boss provided on the bottom surface of the upper housing 201, and thus the heat generated by the first signal processing chip 305 is transmitted out of the upper housing 201.

[0147] In some embodiments, the first barrier surface 812 is arranged towards the opening of the open cavity 400b. The first barrier surface 812 is located on one side of the first lens assembly 400. The first barrier surface 812 is erected between the opening of the open cavity 400b and the first bearing surface 811, thereby forming a barrier between the first signal processing chip 305 and the first lens assembly 400, and limiting the heat-conducting gel on the first bearing surface 811, so as to prevent the heat-conducting gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b through the opening of the open cavity 400b.

[0148] In some embodiments, the first support portion 813 is connected to the surface of the circuit board 300 at the bottom end, and is used to support the first bearing surface 811 to a certain height, so as to support the first bearing surface 811 above the first signal processing chip 305. At the same time, the first support portion 813 can realize the connection between the first heat-dissipating member 810 and the circuit board 300.

[0149] In some embodiments, the first signal processing chip 305 is electrically connected to the first light-receiving chip 303 and the first light-emitting chip 304, respectively. For example, the first signal processing chip 305 is integrated with a laser driving chip and a TIA.

[0150] In some embodiments, the first signal processing chip 305 is arranged towards the first light-receiving chip 303 and the first light-emitting chip 304 at the same time. The first light-receiving chip 303 and the first light-emitting chip 304 are located on the same side of the first signal processing chip 305.

[0151] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are electrically connected to the gold finger 301, respectively.

[0152] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 through the bottom surface. The bottom surface of the first signal processing chip 305 is formed with a solder bump, which is electrically connected to the surface wiring of the circuit board 300, so as to realize the electrical connection between the first signal processing chip 305 and the circuit board 300.

[0153] In some embodiments, the surface wiring of the circuit board 300 passes through one side of the first barrier surface 812 to the other side of the first barrier surface 812, and extends into the open cavity 400b, and the end of the wiring is formed with a solder pad.

[0154] The first light receiving chip 303 and the first light emitting chip 304 are electrically connected with the pads at the ends of the traces, so as to realize the electrical connection between the first signal processing chip 305 and the first light receiving chip 303 and the first light emitting chip 304.

[0155] In some embodiments, the first blocking surface 812 has a gap on the surface of the circuit board 300 to avoid the traces on the surface of the circuit board 300.

[0156] In some embodiments, the bottom surface of the upper shell 201 is provided with two heat dissipation bosses which are in thermal connection with the first signal processing chip 305 and the second signal processing chip 306 respectively, so as to transfer the heat generated by the signal processing chips to the upper shell 201 through the heat dissipation bosses.

[0157] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged on the same surface of the circuit board 300 in a staggered manner, so that the two lens assemblies are arranged in a staggered manner corresponding to the fiber array, avoiding the fiber array connected to the second lens assembly 500 from penetrating through the surface of the first signal processing chip 305 and the first lens assembly 400, and further avoiding the fiber array connected to the second lens assembly 500 from being pressed by the heat dissipation boss which is in thermal connection with the first signal processing chip 305, thereby protecting the fiber array.

[0158] In some embodiments, the surface of the first lens assembly 400 is provided with a back light detector 307. The back light detector 307 is arranged on the surface of the circuit board 300.

[0159] In some embodiments, the back light detector 307 is located on the side of the first light emitting chip 304 facing the first fiber support 710, so as to monitor the emission power of the first light emitting chip 304.

[0160] In some embodiments, the first light emitting chip 304 is arranged between the back light detector 307 and the first signal processing chip 305.

[0161] In some embodiments, the optical surface of the first lens assembly 400 is fixed in position, and the relative positional relationship between the back light detector 307 and the first light emitting chip 304 is fixed. For example, the back light detector 307 is located on the side of the first light emitting chip 304 facing the first fiber support 710.

[0162] FIG. 15 is a schematic side view of a layout of an optical module according to some embodiments of the present disclosure. As shown in FIG. 15, in some embodiments, the surface of the first signal processing chip 305 is provided with a first heat dissipation member 810. The first heat dissipation member 810 includes a first bearing surface 811, a first blocking surface 812, and a first support portion 813.

[0163] The first barrier surface 812 forms a barrier between the first signal processing chip 305 and the first lens assembly 400 to prevent the heat-conducting gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b, thereby preventing the heat-conducting gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0164] In the above embodiment, the first heat dissipation member 810 not only bears the heat-conducting gel to dissipate heat for the first signal processing chip 305, but also limits the heat-conducting gel on the first heat dissipation member 810, thereby preventing the heat-conducting gel from overflowing into the open cavity 400b through the opening, thereby providing the necessary conditions for the close arrangement of the first lens assembly 400 and the first signal processing chip 305, thereby ensuring the signal transmission performance between the first light receiving chip and the built-in TIA of the first signal processing chip 305 under the first lens assembly 400, and ensuring the signal transmission performance between the first light emitting chip and the built-in laser drive chip of the first signal processing chip 305 under the first lens assembly 400.

[0165] FIG. 16 is a layout structure of an optical module according to some embodiments of the present disclosure, FIG. 17 is a layout exploded structure diagram one of an optical module according to some embodiments of the present disclosure, and FIG. 18 is a layout exploded structure diagram two of an optical module according to some embodiments of the present disclosure. As shown in FIGS. 16-18, in some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are located on the same surface of the circuit board 300.

[0166] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300 to make full use of the space between the circuit board 300 and the upper housing 201, and to make full use of the heat dissipation characteristics of the upper housing 201.

[0167] In some embodiments, the end surface of the first lens assembly 400 facing the first signal processing chip 305 is relatively flat, and the end surface of the second lens assembly 500 facing the second signal processing chip 306 is relatively flat.

[0168] In some embodiments, the first lens assembly 400 is covered by the first light receiving chip 303 and the first light emitting chip 304 to realize the reception and emission of optical signals. The second lens assembly 500 is covered by the second light receiving chip 303a and the second light emitting chip 304a. The following embodiments take the first lens assembly 400, the first light receiving chip 303, and the first light emitting chip 304 as examples for description.

[0169] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304, and the first lens assembly 400 is located on the same surface of the circuit board 300 as the first signal processing chip 305.

[0170] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304. The first signal processing chip 305 is built-in with a laser driving chip.

[0171] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located in the open cavity 400b. Exemplarily, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0172] As described above, the presence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the heat-conducting gel on the surface of the first signal processing chip 305 can overflow through the opening of the open cavity 400b into the open cavity 400b, thereby contaminating the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0173] In some embodiments, the TIA 3031 is disposed inside the first signal processing chip 305, and the laser driving chip is disposed outside the first signal processing chip 305.

[0174] In some embodiments, the laser driving chip is disposed inside the first signal processing chip 305, and the TIA 3031 is disposed outside the first signal processing chip 305.

[0175] In some embodiments, the laser driving chip is disposed inside the first signal processing chip 305, and the TIA 3031 is disposed outside the first lens assembly 400.

[0176] In some embodiments, the laser driving chip is disposed inside the first signal processing chip 305, and the TIA 3031 is disposed inside the open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board 300. Exemplarily, the TIA 3031 is disposed on the surface of the circuit board 300 and is covered by the first lens assembly 400.

[0177] In some embodiments, the TIA is arranged in the open cavity 400b between the first lens assembly 400 and the surface of the circuit board 300, which is limited by the size of the open cavity 400b. Different types of TIA 3031 have different sizes. In order to ensure the structure and size of the first lens assembly 400 are fixed, arranging the TIA in the open cavity 400b between the first lens assembly 400 and the surface of the circuit board 300 is more suitable for smaller TIA. Of course, the size of the first lens assembly 400 can also be adjusted to adapt to different sizes of TIA.

[0178] In some embodiments, the TIA 3031 is arranged on the side of the first light receiving chip 303 facing the first fiber holder 710, that is, the TIA 3031 is located on the side of the first light receiving chip 303 away from the first signal processing chip 305, thereby shortening the distance between the first lens assembly 400 and the first signal processing chip 305.

[0179] In some embodiments, the optical path of the first lens assembly 400 determines that the open cavity 400b has a certain height, so the open space of the open cavity 400b is relatively large, and the heat-conducting gel on the surface of the first signal processing chip 305 is easy to overflow into the open cavity 400b, causing pollution to the optical chip.

[0180] In some embodiments, the surface of the first signal processing chip 305 can be covered with the first heat dissipation member 810 described above. The first blocking surface 812 in the first heat dissipation member 810 forms a certain barrier between the first signal processing chip 305 and the opening of the open cavity 400b, limiting the heat-conducting gel on the first bearing surface 811, thereby blocking the heat-conducting gel from overflowing into the open cavity 400b, and thereby avoiding the heat-conducting gel polluting the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0181] In some embodiments, the surface of the first signal processing chip 305 can be covered with the third heat dissipation member 850, and the surface of the second signal processing chip 306 can be covered with the fourth heat dissipation member 860.

[0182] In some embodiments, the third heat dissipation member 850 has a structure similar to that of the first heat dissipation member 810, so in different embodiments, these two heat dissipation members are in parallel, and either one of the structures of the heat dissipation members can be used.

[0183] In some embodiments, the third heat dissipation member 850 includes a third bearing surface 851, a third blocking surface 852, and a third support portion 853.

[0184] In some embodiments, the surface of the third bearing surface 851 can be provided with a heat-conducting medium, such as heat-conducting gel, to transfer the heat generated by the first signal processing chip 305 to the upper housing 201.

[0185] In some embodiments, the third blocking surface 852 is arranged on the third supporting surface 851 close to one end of the first lens assembly 400. The third blocking surface 852 faces the opening of the open cavity 400b, and limits the thermally conductive gel on the third supporting surface 851, thereby preventing the thermally conductive gel from overflowing into the open cavity 400b. The third blocking surface 852 establishes a barrier between the third supporting surface 851 and the open cavity 400b, thereby preventing the thermally conductive gel from overflowing into the open cavity 400b, and thereby preventing contamination of the optical chip.

[0186] In some embodiments, the third supporting portion 853 is arranged at the bottom end of the third supporting surface 851 to support the third supporting surface 851 above the first signal processing chip 305. For example, the length of the third supporting portion 853 is longer than the length of the first supporting portion 813. For example, the third supporting surface 851 and the first signal processing chip 305 have a gap therebetween.

[0187] In some embodiments, the first signal processing chip 305 faces both the first light receiving chip 303 and the first light emitting chip 304.

[0188] In some embodiments, the first light receiving chip 303 is arranged between the TIA 3031 and the first signal processing chip 305. For example, the TIA 3031, the first light receiving chip 303, and the first signal processing chip 305 are arranged in sequence.

[0189] In some embodiments, the surface pads of the TIA 3031 and the surface pads of the first light receiving chip 303 are connected by wire bonding, thereby achieving electrical connection between the TIA 3031 and the first light receiving chip 303.

[0190] In some embodiments, the surface pads of the TIA 3031 and the surface of the circuit board 300 are connected by wire bonding, thereby achieving electrical connection between the TIA 3031 and the circuit board 300.

[0191] In some embodiments, the TIA 3031 has surface pads formed around the periphery thereof, wherein the pads on the side close to the first light receiving chip 303 are electrically connected to the surface pads of the first light receiving chip 303, and the pads on the other three sides are electrically connected to the surface of the circuit board 300.

[0192] In some embodiments, when the TIA 3031 is arranged on the side of the first light receiving chip 303 facing the first optical fiber holder 710, the pads of the TIA 3031 for electrical connection with the first light receiving chip 303 are arranged adjacent to the surface pads of the first light receiving chip 303, so as to ensure that the wire bonding length between the TIA 3031 and the first light receiving chip 303 is short.

[0193] In some embodiments, the TIA 3031 surface and the pad position of the first light receiving chip 303 electrically connected are fixed, the first light receiving chip 303 surface and the pad position of the TIA 3031 electrically connected are fixed, and the relative position relationship between the first light receiving chip 303 and the TIA 3031 can be rotated by 180° towards the direction of the first optical fiber support 710.

[0194] In some embodiments, the first light emitting chip 304 is located on one side of the first signal processing chip 305, which can ensure the high-frequency signal transmission performance between the first light emitting chip 304 and the first signal processing chip 305.

[0195] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 through the bottom surface. The bottom surface of the first signal processing chip 305 is formed with a solder bump, and the solder bump is electrically connected to the surface wiring of the circuit board 300, thereby realizing the electrical connection between the first signal processing chip 305 and the circuit board 300.

[0196] In some embodiments, the surface wiring of the circuit board 300 passes through the other side of the third barrier surface 852 from one side of the third barrier surface 852 and extends into the open cavity 400b, and the end of the wiring is formed with a pad.

[0197] The first light emitting chip 304 is electrically connected to the pad at the end of the wiring, thereby realizing the electrical connection between the first signal processing chip 305 and the first light emitting chip 304.

[0198] In some embodiments, the first light emitting chip 304 is provided with a back light detector 307 away from one side of the first signal processing chip 305. The back light detector 307 is located in the open cavity 400b.

[0199] In some embodiments, the back light detector 307 is located on one side of the first light emitting chip 304 facing the first optical fiber support 710. The first lens assembly 400 splits light to the back light detector 307 to monitor the emission power of the first light emitting chip 304.

[0200] In some embodiments, the first light emitting chip 304 is arranged between the back light detector 307 and the first signal processing chip 305.

[0201] In some embodiments, the optical surface position of the first lens assembly 400 is fixed, and the relative position relationship between the back light detector 307 and the first light emitting chip 304 is fixed. For example, the back light detector 307 is located on one side of the first light emitting chip 304 facing the first optical fiber support 710.

[0202] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303. The TIA is integrated in the first signal processing chip 305.

[0203] The laser driving chip is arranged on the side of the first light emitting chip 304 away from the first signal processing chip 305, and in this case, the first lens assembly 400 does not split light. That is, no back light detector 307 is arranged on the side of the first light emitting chip 304 away from the first signal processing chip 305.

[0204] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged on the surface of the circuit board 300 in a staggered manner, so that the fiber arrays connected by the two lens assemblies are correspondingly staggered on the surface of the circuit board 300, avoiding the fiber array connected by the second lens assembly 500 from passing through the surface of the first signal processing chip 305 and the first lens assembly 400, and further avoiding the fiber array connected by the second lens assembly 500 from being pressed by the heat dissipation boss in heat conduction connection with the first signal processing chip 305, thereby protecting the fiber array.

[0205] In the above embodiments, the TIA is arranged in the open cavity 400b surrounded by the first lens assembly 400 and the circuit board 300, and the TIA is located on the side of the first light receiving chip 303, thereby ensuring the signal transmission performance between the TIA and the first light receiving chip 303. The laser driving chip is built-in the first signal processing chip 305, and the first signal processing chip 305 is electrically connected with the first light emitting chip 304. The third heat dissipation member 850 is arranged above the first signal processing chip 305, which can not only bear the heat conduction gel to dissipate heat for the first signal processing chip 305, but also block the heat conduction gel on the surface from overflowing into the open cavity 400b, thereby ensuring the close arrangement of the first lens assembly 400 and the first signal processing chip 305, and further ensuring the high-frequency signal transmission performance between the first light emitting chip 304 below the first lens assembly 400 and the built-in laser driving chip in the first signal processing chip 305.

[0206] FIG. 19 is a structural diagram of an optical module according to some embodiments of the present disclosure, FIG. 20 is an exploded diagram I of an optical module according to some embodiments of the present disclosure, and FIG. 21 is an exploded diagram II of an optical module according to some embodiments of the present disclosure. As shown in FIGS. 19-21, in some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the same surface of the circuit board 300.

[0207] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300, so as to make full use of the space between the circuit board 300 and the upper shell 201, and make full use of the heat dissipation characteristics of the upper shell 201.

[0208] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304, and the first lens assembly 400 is located on the same surface of the circuit board 300 as the first signal processing chip 305.

[0209] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304 and / or the first light receiving chip 303.

[0210] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located in the open cavity 400b. For example, the first light receiving chip 303 and the first light emitting chip 304 are arranged on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0211] As described above, the presence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the heat-conducting gel on the surface of the first signal processing chip 305 can overflow through the opening of the open cavity 400b and contaminate the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0212] In some embodiments, the first lens assembly 400 is covered by a first cover 910.

[0213] In some embodiments, the first cover 910 includes a top plate 911, a support plate 912, and a baffle plate 913.

[0214] Specifically, the top plate 911 is coupled to the first lens assembly 400. One end of the top plate 911 is arranged on the surface of the first lens assembly 400, and the other end is connected to the baffle plate 913. The support plates 912 on both sides are arranged on the surface of the circuit board 300, and the bottom ends of the support plates 912 are arranged on the surface of the circuit board 300. The support plates 912 have a certain height, which can support the top plate 911 to a certain height, so that the top plate 911 can be coupled to the surface of the first lens assembly 400. The support plates 912 on both sides can block and protect the TIA 3031 from both sides.

[0215] One side of the baffle plate 913 faces the first signal processing chip 305, and the other side faces the opening of the open cavity 400b. The baffle plate 913 forms a barrier between the opening of the open cavity 400b and the first signal processing chip 305, and limits the heat-conducting medium to one side of the baffle plate 913, so as to block the heat-conducting medium on the surface of the first signal processing chip 305 from entering the open cavity 400b through the opening, thereby preventing the optical chips in the open cavity 400b from being contaminated.

[0216] In some embodiments, the first signal processing chip 305 is electrically connected with the first light emitting chip 304. The laser driving chip is built in the first signal processing chip 305.

[0217] In some embodiments, the material of the first cover 910 is different from that of the first lens assembly 400. Based on the material and process of the first cover 910, the first cover 910 forms a side wall to block the opening by itself, which can have a smaller thickness, thereby shortening the distance between the first lens assembly 400 and the first signal processing chip 305.

[0218] In some embodiments, the TIA 3031 is placed outside the first signal processing chip 305 and also outside the open cavity 400b.

[0219] In some embodiments, the TIA 3031 is arranged between the first lens assembly 400 and the first signal processing chip 305.

[0220] In some embodiments, the TIA 3031 is located below the first cover 910. The first cover 910 is arranged on the surface of the TIA 3031.

[0221] The top plate 911 can fix the first cover 910 on the surface of the first lens assembly 400, and also can cover and protect the TIA 3031 from above.

[0222] In some embodiments, the TIA 3031 is electrically connected with the first light receiving chip 303. The surface pads of the TIA 3031 and the surface pads of the first light receiving chip 303 are connected by wire, thereby realizing the electrical connection between the TIA 3031 and the first light receiving chip 303.

[0223] In some embodiments, the opening of the open cavity 400b can avoid the wire connection between the TIA 3031 and the first light receiving chip 303.

[0224] In some embodiments, the first signal processing chip 305 is electrically connected with the circuit board 300 through the bottom surface. The bottom surface of the first signal processing chip 305 is formed with a solder bump, and the solder bump is electrically connected with the surface trace of the circuit board 300, thereby realizing the electrical connection between the first signal processing chip 305 and the circuit board 300.

[0225] In some embodiments, the surface trace of the circuit board 300 passes through the other side of the baffle 913 from one side of the baffle 913 and extends into the open cavity 400b, and the end of the trace is formed with a pad.

[0226] The first light emitting chip 304 is electrically connected with the pad at the end of the trace, thereby realizing the electrical connection between the first signal processing chip 305 and the first light emitting chip 304.

[0227] In some embodiments, the baffle 913 has a certain gap from the surface of the circuit board 300 to avoid the surface wiring of the circuit board 300.

[0228] In some embodiments, the top plate 911 is expanded outward on both sides and bent to form a bent portion 9111, and the first lens assembly 400 has a boss 400a formed on the side wall of each side, and the bent portion 9111 on each side is arranged on the boss 400a on the corresponding side, thereby fixing the first cover 910 to the side wall of the first lens assembly 400. It can be understood that the first cover 910 can also be fixed without forming the boss 400a.

[0229] In some embodiments, the surface of the first signal processing chip 305 is covered with a fifth heat dissipation member 830, and the surface of the second signal processing chip 306 is covered with a sixth heat dissipation member 840.

[0230] In some embodiments, the fifth heat dissipation member 830 includes a bearing surface 831 and a support portion 832 located at the bottom surface of the bearing surface 931.

[0231] The bearing surface 831 is arranged on the surface of the first signal processing chip 305, and the surface of the bearing surface 831 can be provided with a heat-conducting medium such as a heat-conducting gel. The heat-conducting gel is in thermal contact with the heat dissipation boss on the upper housing 201, so that the heat generated by the first signal processing chip 305 is transmitted to the upper housing 201 in sequence through the heat-conducting gel and the heat dissipation boss, and then transmitted to the outside of the optical module through the upper housing 201.

[0232] The bottom end of the support portion 832 is connected to the circuit board 300, and the support portion 832 is used to support the bearing surface 831 to a certain height, so that the bearing surface 831 is arranged above the first signal processing chip 305.

[0233] In some embodiments, the bearing surface 831 is arranged on the surface of the first signal processing chip 305, and the baffle 913 can form a barrier between the first lens assembly 400 and the first signal processing chip 305, thereby preventing the heat-conducting gel on the surface of the bearing surface 831 from overflowing into the open cavity 400b and preventing the optical chip from being contaminated by the heat-conducting gel.

[0234] In some embodiments, the TIA 3031 is arranged outside the first lens assembly 400, and the first cover 910 is arranged to cover and protect the TIA 3031. This structure is not limited by the internal space of the first lens assembly 400, and is suitable for different sizes of TIA 3031 while keeping the structure of the first fixed assembly 400 fixed. For example, the size of the first cover 910 can be adjusted according to the size of the TIA.

[0235] In some embodiments, the TIA 3031 is arranged on one side of the first light receiving chip 303 facing the first signal processing chip 305, so as to ensure close arrangement of the TIA 3031 and the first light receiving chip 303, thereby ensuring high-frequency signal transmission performance therebetween.

[0236] In some embodiments, the first lens assembly 400 is provided with a back light detector 307. The back light detector 307 is arranged on the surface of the circuit board 300.

[0237] In some embodiments, the back light detector 307 is arranged on one side of the first light emitting chip 304, so as to monitor the emission power of the light emitting chip 304.

[0238] In some embodiments, the first light emitting chip 304 is arranged between the back light detector 307 and the first signal processing chip 305.

[0239] It can be understood that, in the above embodiments, the TIA is arranged outside the signal processing chip, and the laser driving chip is arranged inside the signal processing chip. Therefore, the technical solutions disclosed in the above embodiments are also applicable to the embodiments in which the laser driving chip is arranged outside the signal processing chip, and the TIA is arranged inside the signal processing chip.

[0240] In the above embodiments, the TIA 3031 is electrically connected with the first light receiving chip 303, and the TIA 3031 is arranged on one side of the first light receiving chip 303, so as to ensure close arrangement therebetween and high-frequency signal transmission performance. The first signal processing chip 305 is electrically connected with the first light emitting chip 304. The first lens assembly 400 is provided with a first cover 910, and the baffle of the first cover 910 is arranged between the first lens assembly 400 and the first signal processing chip 305, so as to prevent the heat-conducting gel from overflowing into the open cavity 400b, thereby providing necessary conditions for close arrangement among the first lens assembly 400, the TIA, and the first signal processing chip 305, and ensuring close arrangement of the first laser driving chip 304 arranged below the first lens assembly 400 and the laser driving chip arranged inside the first signal processing chip 305, thereby ensuring signal transmission performance therebetween.

[0241] FIG. 22 is another layout structure diagram of an optical module according to some embodiments of the present disclosure, and FIG. 23 is another layout surface structure diagram of a circuit board of an optical module according to some embodiments of the present disclosure. As shown in FIGS. 22 and 23, in some embodiments, the signal processing chip and the lens assembly are arranged on two surfaces of the circuit board 300, respectively.

[0242] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are disposed on one surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are disposed on another surface of the circuit board 300, and the first lens assembly 400 is arranged on the surface of the first light receiving chip 303 and the first light emitting chip 304. The second lens assembly 500 is arranged on the other surface of the circuit board 300.

[0243] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively disposed on different surfaces of the circuit board 300, and the second signal processing chip 306 and the second lens assembly 500 are respectively disposed on different surfaces of the circuit board 300.

[0244] In some embodiments, the circuit board 300 includes a first surface and a second surface. For example, the first signal processing chip 305 and the second signal processing chip 306 are disposed on the first surface of the circuit board 300, and the first lens assembly 400 and the second lens assembly 500 are disposed on the second surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are disposed on the second surface.

[0245] In some embodiments, the first surface of the circuit board 300 is the upper surface of the circuit board 300, and the first signal processing chip 305 and the second signal processing chip 306 are disposed on the upper surface of the circuit board 300 to make full use of the upper shell 201 to dissipate heat from the two signal processing chips.

[0246] In some embodiments, the second surface of the circuit board 300 is the lower surface of the circuit board 300, and the first lens assembly 400 and the second lens assembly 500 are disposed on the lower surface of the circuit board 300.

[0247] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively disposed on different surfaces of the circuit board 300, and the second signal processing chip 306 and the second lens assembly 500 are respectively disposed on different surfaces of the circuit board 300, so that the first signal processing chip 305 and the first lens assembly are arranged separately, and the second signal processing chip 306 and the second lens assembly 500 are arranged separately, effectively avoiding the heat-conducting gel on the surface of the signal processing chip from overflowing to the corresponding lens assembly, thereby avoiding pollution of the light-sensitive surface of the lens assembly, the light receiving chip and the light emitting chip.

[0248] In some embodiments, the first lens assembly 400 is arranged on the surface of the first light receiving chip 303 and the first light emitting chip 304 to change the transmission direction of the optical signal to be transmitted to the first light receiving chip 303 and the transmission direction of the optical emission signal generated by the first light emitting chip 304, so as to realize the reception and emission of optical signals. The second lens assembly 500 is arranged in the same way.

[0249] The first lens assembly 400 covers the surface of the first light receiving chip 303 and the first light emitting chip 304, so as to change the transmission direction of the optical signal to be transmitted to the first light receiving chip 303 and the transmission direction of the optical signal emitted by the first light emitting chip 304.

[0250] In some embodiments, the first signal processing chip 305 is integrated with a TIA and a laser driving chip, and the second signal processing chip 306 is integrated with a TIA and a laser driving chip.

[0251] In some embodiments, since the first signal processing chip 305 is integrated with a TIA and a laser driving chip, the first lens assembly 400 and the first signal processing chip 305 are arranged in a vertical direction of the circuit board 300 to ensure that the first light receiving chip and the TIA integrated in the first signal processing chip 305 are arranged in close proximity, and the first light emitting chip and the laser driving chip integrated in the first signal processing chip 305 are arranged in close proximity, thereby ensuring signal integrity and improving high-frequency signal transmission performance. The same is true for the second signal processing chip 306 and the second lens assembly 500.

[0252] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are arranged in a vertical direction, so that the first light receiving chip and the first light emitting chip covered by the first lens assembly 400 are arranged in close proximity to the first signal processing chip 305.

[0253] In some embodiments, the second signal processing chip 306 and the second lens assembly 500 are arranged in a vertical direction, so that the first light receiving chip and the first light emitting chip covered by the second lens assembly 500 are arranged in close proximity to the second signal processing chip 306.

[0254] In some embodiments, the bottom surface of the upper housing 201 is formed with a first heat dissipation boss 2012 and a second heat dissipation boss 2013. The first heat dissipation boss 2012 is in thermal contact with the first signal processing chip 305, and the heat generated by the first signal processing chip 305 is transmitted to the upper housing 201 through the first heat dissipation boss 2012, and then transmitted to the outside through the upper housing 201. The second heat dissipation boss 2013 is in thermal contact with the second signal processing chip 306, and the heat generated by the second signal processing chip 306 is transmitted to the outside through the second heat dissipation boss 2013.

[0255] In some embodiments, the first signal processing chip 305 is integrated with a TIA or a laser driving chip, and the second signal processing chip 306 is integrated with a TIA or a laser driving chip. In this case, the first signal processing chip 305 and the second signal processing chip 306 can be arranged on the upper surface of the circuit board 300.

[0256] In some embodiments, the first signal processing chip is integrated with a laser driving chip, and a TIA is arranged outside the first signal processing chip.

[0257] In some embodiments, the TIA can be arranged outside the first lens assembly 400 as in the above embodiments, and the TIA and the first lens assembly 400 are arranged on the lower surface of the circuit board 300.

[0258] In some embodiments, the TIA can be arranged inside the open cavity 400b formed by the first lens assembly 400 and the circuit board 300 as in the above embodiments, and the TIA and the first lens assembly 400 are arranged on the lower surface of the circuit board 300.

[0259] FIG. 24 is a structural diagram of a circuit board surface arrangement of a first signal processing chip and a second signal processing chip according to some embodiments of the present disclosure. As shown in FIG. 24, in some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are arranged on the same surface of the circuit board 300.

[0260] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300, respectively, so as to take advantage of the better heat dissipation of the upper housing 201.

[0261] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300 in a staggered manner, so as to disperse the heat generated by the two signal processing chips to different areas of the circuit board 300.

[0262] FIG. 25 is a structural diagram of a circuit board surface arrangement of a first lens assembly and a second lens assembly according to some embodiments of the present disclosure. As shown in FIG. 25, in some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged on the same surface of the circuit board 300.

[0263] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged on the lower surface of the circuit board 300.

[0264] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged on the lower surface of the circuit board 300 in a staggered manner.

[0265] In some embodiments, the space between the lower surface of the circuit board 300 and the lower housing 202 is smaller than the space between the upper surface of the circuit board 300 and the upper housing 201, and the first lens assembly 400 and the second lens assembly 500 are thinned to fit the space between the lower surface of the circuit board 300 and the lower housing 202.

[0266] In some embodiments, the end surface of the first lens assembly 400 and the end surface of the first fiber holder 710 are butted together to reduce the thickness of the first lens assembly 400 to fit the space between the lower surface of the circuit board 300 and the lower housing 202.

[0267] In some embodiments, the first light receiving chip 303 is arranged on the lower surface of the circuit board 300 and covered by the first lens assembly 400.

[0268] In some embodiments, the first light emitting chip 304 is arranged on the lower surface of the circuit board 300 and covered by the first lens assembly 400.

[0269] In some embodiments, the external optical signal is coupled to the optical surface of the first lens assembly 400 through the optical fiber array connected by the first fiber holder 710 and coupled to the first light receiving chip 303 through the first lens assembly 400.

[0270] In some embodiments, the optical emission signal generated by the first light emitting chip 304 is coupled to the optical fiber array connected by the first fiber holder 710 through the first lens assembly 400, so that the optical emission signal is output along the optical fiber array.

[0271] In some embodiments, the surface of the first lens assembly 400 is formed with a first light path turning surface 401, and the surface of the second lens assembly 500 is formed with a light path turning surface 501. The first light path turning surface 401 and the light path turning surface 501 have the same structure and function.

[0272] In some embodiments, the light path turning of the first light receiving chip 303 and the first light emitting chip 304 is realized through the first light path turning surface 401.

[0273] In some embodiments, the first light path turning surface 401 is an inclined surface with a reflecting function.

[0274] In some embodiments, the external optical signal is coupled to the first light path turning surface 401 of the first lens assembly 400 through the optical fiber array connected by the first fiber holder 710, and the transmission direction of the optical signal is changed through the reflection of the first light path turning surface 401, and then coupled to the first light receiving chip 303 to realize optical signal reception.

[0275] In some embodiments, the light emission signal generated by the first light emission chip 304 is reflected by the first light path turning surface 401 of the first lens assembly 400 via the first lens assembly 400, changes the transmission direction of the light emission signal, and then is coupled into the optical fiber array connected by the first optical fiber holder 710 to output the light emission signal to the outside of the optical module, thereby realizing light signal emission.

[0276] FIG. 26 is a schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure, and FIG. 27 is a schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure. As shown in FIGS. 26 and 27, in some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively located on different surfaces of the circuit board 300.

[0277] In some embodiments, the first optical fiber holder 710 is connected to the first lens assembly 400 in a butt joint manner, so that the first lens assembly 400 is thinned.

[0278] In some embodiments, the first lens assembly 400 is covered towards the lower surface of the circuit board 300.

[0279] In some embodiments, the first lens assembly 400 and the lower surface of the circuit board 300 form an open cavity 400b.

[0280] In some embodiments, the first light receiving chip 303 is arranged on the lower surface of the circuit board 300 and is covered from below by the first lens assembly 400.

[0281] In some embodiments, the first light emission chip 304 is arranged on the lower surface of the circuit board 300 and is covered from below by the first lens assembly 400.

[0282] In some embodiments, the surface of the first lens assembly 400 is formed with a first light path turning surface 401. Exemplarily, the first light path turning surface 401 is exposed.

[0283] In some embodiments, the first light path turning surface 401 is arranged obliquely relative to the surface of the circuit board 300 and has a reflecting effect, thereby playing a role of light path turning.

[0284] In some embodiments, the first light path turning surface 401 is located at a position where the light path of the first optical fiber holder 710 intersects with the light-in light path of the first light receiving chip 303. This position is also a position where the light path of the first optical fiber holder 710 intersects with the light-out light path of the first light emission chip 304.

[0285] In some embodiments, the external light signal reaches the first light path turning surface 401 along the optical fiber array connected by the first optical fiber holder 710, is reflected by the first light path turning surface 401, so that the external light signal is coupled onto the first light receiving chip 303, thereby realizing light signal reception.

[0286] In some embodiments, the light emission signal generated by the first light emission chip 304 reaches the first light path turning surface 401, is reflected by the first light path turning surface 401 so as to be coupled into the optical fiber array connected with the first optical fiber holder 710, and is outputted to the outside of the optical module, thereby realizing light signal emission.

[0287] In some embodiments, the first signal processing chip 305 is electrically connected with the first light receiving chip 303. The TIA is built in the first signal processing chip 305.

[0288] In some embodiments, the first signal processing chip 305 is arranged on the upper surface of the circuit board 300 in a flip-chip manner, and the first light receiving chip 303 is also arranged on the lower surface of the circuit board 300 in a flip-chip manner. The first signal processing chip 305 is electrically connected with the first light receiving chip 303 by punching a hole along the upper and lower surfaces of the circuit board 300.

[0289] For example, the solder bumps on the bottom surface of the first signal processing chip 305 are connected downward to the upper surface of the circuit board 300, and the solder bumps on the bottom surface of the first light receiving chip 303 are connected upward to the lower surface of the circuit board 300. The solder bumps on the first signal processing chip 305 for electrical connection with the first light receiving chip 303 are electrically connected with the solder bumps on the first light receiving chip 303 for electrical connection with the first signal processing chip 305 through the hole.

[0290] For example, the solder bumps on the first signal processing chip 305 for electrical connection with the first light receiving chip 303 are aligned with the solder bumps on the first light receiving chip 303 for electrical connection with the first signal processing chip 305 in an up-down manner, so as to shorten the height of the hole and improve the high-frequency signal transmission performance.

[0291] In some embodiments, the first signal processing chip 305 is arranged on the upper surface of the circuit board 300 in a flip-chip manner, and a hole is punched along the solder bumps of the first signal processing chip 305 to the lower surface of the circuit board 300, so as to electrically connect the first signal processing chip 305 with the lower surface of the circuit board 300. The first light receiving chip 303 is electrically connected with the lower surface of the circuit board 300 by wire bonding, thereby electrically connecting the first signal processing chip 305 with the first light receiving chip 303.

[0292] In some embodiments, the first signal processing chip 305 can be sunken toward the lower surface of the circuit board 300, or the first light receiving chip 303 can be moved upward toward the upper surface of the circuit board 300, so as to shorten the electrical connection distance between the first signal processing chip 305 and the first light receiving chip 303 and improve the high-frequency signal transmission performance.

[0293] In some embodiments, the first light emitting chip 304 is electrically connected with the first signal processing chip 305. The laser driving chip is built in the first signal processing chip 305. The electrical connection between the first light emitting chip 304 and the first signal processing chip 305 can refer to the electrical connection between the first light receiving chip and the first signal processing chip 305 described above.

[0294] FIG. 28 is a circuit board surface structure diagram I according to some embodiments of the present disclosure. As shown in FIG. 28, in some embodiments, the surface of the circuit board 300 is provided with the first signal processing chip 305 and the second signal processing chip 306.

[0295] In some embodiments, the first signal processing chip 305 is electrically connected with the first light receiving chip 303 and the first light emitting chip 304 respectively. The TIA and the laser driving chip are built in the first signal processing chip 305.

[0296] In some embodiments, one side of the first signal processing chip 305 faces the first light receiving chip 303 and the first light emitting chip 304 at the same time. For example, the first light receiving chip 303 and the first light emitting chip 304 are arranged on the same side of the first signal processing chip 305.

[0297] In some embodiments, the first light receiving chip 303 and the first signal processing chip 305 are arranged in close proximity, so that the first light receiving chip 303 and the TIA in the first signal processing chip 305 are arranged in close proximity, ensuring the high-frequency signal transmission performance between the first light receiving chip 303 and the first signal processing chip 305.

[0298] In some embodiments, the first light emitting chip 304 and the first signal processing chip 305 are arranged in close proximity, so that the first light emitting chip 304 and the laser driving chip in the first signal processing chip 305 are arranged in close proximity, ensuring the high-frequency signal transmission performance between the first light emitting chip 304 and the first signal processing chip 305.

[0299] In some embodiments, the first light receiving chip 303 is electrically connected with the first signal processing chip 305. For example, the surface pad of the first light receiving chip 303 is wire-bonded with the surface pad of the circuit board 300, and the solder bump on the bottom surface of the first signal processing chip 305 is electrically connected with the surface pad of the circuit board 300 through the surface wiring of the circuit board 300, so as to realize the electrical connection between the first light receiving chip 303 and the first signal processing chip 305.

[0300] In some embodiments, the first light emitting chip 304 is electrically connected with the first signal processing chip 305. Exemplarily, the surface pads of the first light emitting chip 304 are wire-bonded with the surface pads of the circuit board 300, and the solder bumps on the bottom surface of the first signal processing chip 305 are electrically connected with the surface pads of the circuit board 300 through the surface traces of the circuit board 300, so as to realize the electrical connection between the first light emitting chip 304 and the first signal processing chip 305.

[0301] In some embodiments, a backlight detector 307 is arranged on one side of the first light emitting chip 304 to monitor the light power emitted by the first light emitting chip 304. Exemplarily, the first light emitting chip 304 is arranged between the backlight detector 307 and the first signal processing chip 305.

[0302] In some embodiments, a heating element 308 is arranged on one side of the first light emitting chip 304 to make the first light emitting chip 304 work within a certain range and avoid the deterioration of the high-frequency performance of the first light emitting chip 304 at low temperature.

[0303] In some embodiments, the heating element 308 faces both the first light emitting chip 304 and the backlight detector 307.

[0304] In some embodiments, the first light emitting chip 304 and the heating element 308 are arranged below a local copper metallization area, so as to be on the same copper metallization area. The heat generated by the heating element 308 is conducted to the first light emitting chip 304 through the copper metallization area, thereby increasing the heat conduction efficiency between the heating element 308 and the first light emitting chip 304.

[0305] In some embodiments, the copper metallization area is limited below the first light emitting chip 304 and the heating element 308, so as to avoid the heat generated by the heating element 308 from being conducted to other areas, reduce power loss, and increase the temperature regulation efficiency of the first light emitting chip 304.

[0306] In some embodiments, the surface of the first signal processing chip 305 is covered with the first heat dissipation element 810 mentioned in the foregoing embodiments, and the first heat dissipation element 810 comprises a first blocking surface 812. The specific structure and function of the first heat dissipation element 810 can be referred to the above embodiments.

[0307] In some embodiments, the first light receiving chip 303, the first light emitting chip 304, the backlight detector 307, and the heating element 308 are arranged on the surface of the circuit board 300 and covered by the first lens assembly 400.

[0308] In some embodiments, the first blocking surface 812 is located on one side of the first lens assembly 400. A certain barrier can be formed between the first signal processing chip 305 and the first lens assembly 400 through the first blocking surface 812, so as to prevent the heat-conductive gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b, thereby avoiding the pollution of the optical chip by the heat-conductive gel.

[0309] FIG. 29 is a diagram of a circuit board surface structure II according to some embodiments of the present disclosure. As shown in FIG. 29, in some embodiments, the surface of the circuit board 300 is provided with a first signal processing chip 305 and a second signal processing chip 306. The first signal processing chip 305 and the second signal processing chip 306 are arranged in the same way, and the first signal processing chip 305 is exemplarily described below.

[0310] In some embodiments, the first signal processing chip 305 is internally provided with a laser driving chip and externally provided with a TIA 3031.

[0311] In some embodiments, the TIA 3031 is arranged on the side of the first light receiving chip 303 away from the first signal processing chip 305. Exemplarily, the first light receiving chip 303 is arranged between the TIA 3031 and the first signal processing chip 305.

[0312] In some embodiments, the first light emitting chip 304 and the first light receiving chip 303 are arranged on the same side of the first signal processing chip 305.

[0313] In some embodiments, the first light emitting chip 304 is provided with a back light detector 307 on one side, and the first light emitting chip 304 and the back light detector 307 are provided with a heating element 308 on one side. The relative relationship among the first light emitting chip 304, the back light detector 307, and the heating element 308 is shown in FIG. 28, and will not be described again.

[0314] In some embodiments, the first light receiving chip 303, the TIA 3031, the first light emitting chip 304, the back light detector 307, and the heating element 308 are arranged on the surface of the circuit board 300 and covered by the first lens assembly 400.

[0315] In some embodiments, the relative position relationship between the surface pads of the first light receiving chip 303 and the surface pads of the TIA 3031 in FIG. 30 is rotated counterclockwise by 180° to obtain the relative position relationship between the surface pads of the first light receiving chip 303 and the surface pads of the TIA 3031 in FIG. 29.

[0316] In some embodiments, the surface of the first signal processing chip 305 can be covered by the first heat dissipation element 810, so as to prevent the heat-conductive gel on the surface of the first heat dissipation element 810 from overflowing into the open cavity 400b and polluting the optical chip.

[0317] In some embodiments, the first signal processing chip 305 surface can cover the third heat dissipation member 850 to prevent the heat-conductive gel on the surface of the third heat dissipation member 850 from overflowing into the open cavity 400b and contaminating the optical chip.

[0318] In some embodiments, the TIA is limited by the size of the open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board 300 when it is arranged in the open cavity 400b. Different types of TIAs 3031 have different sizes. In order to ensure the structure and size of the first lens assembly 400 are fixed, arranging the TIA in the open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board 300 is more suitable for smaller TIAs.

[0319] The structure shown in FIG. 29 is suitable for embodiments in which the signal processing chip is built-in with the laser driving chip, and the TIA is arranged in the open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board. In some embodiments, the surface of the TIA 3031 adjacent to the first light receiving chip 303 is provided with a pad 3033, and the surface of the first light receiving chip 303 adjacent to the TIA 3031 is provided with a pad 3032. The pad 3033 and the pad 3032 are arranged adjacent to each other and electrically connected to realize electrical connection between the TIA 3031 and the first light receiving chip 303.

[0320] FIG. 30 is a diagram of a circuit board surface structure III according to some embodiments of the present disclosure. As shown in FIG. 30, in some embodiments, the surface of the circuit board 300 is provided with a first signal processing chip 305 and a second signal processing chip 306. The first signal processing chip 305 and the second signal processing chip 306 are arranged the same way. Hereinafter, the first signal processing chip 305 will be exemplarily described.

[0321] In some embodiments, the first signal processing chip 305 is electrically connected with the first light emitting chip 304. The laser driving chip is arranged in the first signal processing chip 305.

[0322] In some embodiments, the TIA 3031 is arranged on the side of the first light receiving chip 303 facing the first signal processing chip 305. Exemplarily, the TIA 3031 is arranged between the first light receiving chip 303 and the first signal processing chip 305.

[0323] In some embodiments, the first light emitting chip 304 and the first light receiving chip 303 are arranged on the same side of the first signal processing chip 305.

[0324] In some embodiments, the first light emitting chip 304 is electrically connected with the first signal processing chip 305. The first signal processing chip 305 is electrically connected with the surface trace of the circuit board 300 through the bottom surface, the surface trace of the circuit board 300 extends into the open cavity 400b and forms a pad at the end. The surface pad of the first light emitting chip 304 is electrically connected with the pad at the end of the trace, so as to realize the electrical connection between the first light emitting chip 304 and the first signal processing chip 305.

[0325] In some embodiments, the first light receiving chip 303 is electrically connected with the TIA 3031. Exemplarily, the electrical connection between the surface pad of the first light receiving chip 303 and the surface pad of the TIA 3031 is realized through wire bonding.

[0326] In some embodiments, the TIA 3031 is provided with a pad close to the surface of one side of the first light receiving chip 303 for wire bonding with the first light receiving chip 303, and the surface pad of the first light receiving chip 303 is provided close to the TIA 3031 to shorten the wire bonding distance between the first light receiving chip 303 and the TIA 3031.

[0327] In some embodiments, the first light emitting chip 304 is provided with a back light detector 307 on one side, and the first light emitting chip 304 and the back light detector 307 are provided with a heating element 308 on one side. The relative relationship among the first light emitting chip 304, the back light detector 307 and the heating element 308 is shown in FIG. 28, which will not be described herein.

[0328] In some embodiments, the surface of the TIA 3031 is provided with the first cover 910 mentioned in the foregoing embodiments to protect the TIA 3031. The top surface of the first cover 910 is arranged on the surface of the first lens assembly 400 to protect the TIA 3031 located outside the first lens assembly 400.

[0329] In some embodiments, the first light receiving chip 303, the first light emitting chip 304, the back light detector 307 and the heating element 308 are arranged on the surface of the circuit board 300 and covered by the first lens assembly 400. The TIA 3031 is arranged outside the first lens assembly 400.

[0330] In some embodiments, the surface of the first signal processing chip 305 is covered by the fifth heat sink 830 mentioned in the foregoing embodiments. The fifth heat sink 830 includes a bearing surface 831, and the specific structure of the fifth heat sink 830 will not be described herein.

[0331] The bearing surface 831 is arranged on the surface of the first signal processing chip 305, and the bearing surface 831 can be provided with a heat-conducting gel. The heat-conducting gel is in thermal connection with the heat-dissipating boss on the upper shell 201, so that the heat generated by the first signal processing chip 305 is sequentially transmitted to the upper shell 201 through the heat-conducting gel and the heat-dissipating boss, and then transmitted to the outside of the optical module through the upper shell 201.

[0332] In some embodiments, the TIA 3031 is arranged outside the first lens assembly 400 and is shielded and protected by the first cover 910. This structure is not limited by the internal space of the first lens assembly 400, and is suitable for TIA 3031 of different sizes while keeping the structure of the first lens assembly 400 fixed. For example, the size of the first cover 910 can be adjusted according to the size of the TIA.

[0333] The structure shown in FIG. 30 is suitable for the embodiment in which the signal processing chip is built-in with the laser driving chip, and the TIA is arranged outside the first lens assembly 400 and between the first lens assembly 400 and the first signal processing chip 305. In some embodiments, the surface of the TIA 3031 adjacent to the first light receiving chip 303 is provided with a pad 3033, and the surface of the first light receiving chip 303 adjacent to the TIA 3031 is provided with a pad 3032. The pad 3033 and the pad 3032 are arranged adjacent to each other and are electrically connected, so as to realize the electrical connection between the TIA 3031 and the first light receiving chip 303.

[0334] The TIA 3031 and the first light receiving chip 303 in FIG. 30 are rotated counterclockwise by 180° to obtain the positional relationship between the TIA 3031 and the first light receiving chip 303 in FIG. 29.

[0335] FIG. 31 is a schematic diagram of the surface layout of a circuit board according to some embodiments of the present disclosure, and FIG. 32 is a schematic diagram of the surface layout of a circuit board according to some embodiments of the present disclosure. As shown in FIGS. 31 and 32, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are arranged close to each other on the same surface of the circuit board 300. The structures shown in FIGS. 31 and 32 can be suitable for the scheme in which the first signal processing chip 305 is built-in with the TIA and the laser driving chip.

[0336] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300 to shorten the distance between the first lens assembly 400 and the first signal processing chip 305. The open cavity 400b is open towards the first signal processing chip 305. However, the presence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the heat-conducting gel on the surface of the first signal processing chip 305 can overflow into the open cavity 400b, contaminating the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0337] In some embodiments, the surface of the first signal processing chip 305 is covered with a first heat dissipation member 810. The first bearing surface 811 in the first heat dissipation member 810 bears heat-conducting gel on its surface to conduct the heat generated by the first signal processing chip 305 to the upper housing 201.

[0338] In some embodiments, the first barrier surface 812 in the first heat dissipation member 810 is located on one side of the first lens assembly 400. The first barrier surface 812 is erected between the first lens assembly 400 and the first bearing surface 811, thereby forming a barrier between the first signal processing chip 305 and the first lens assembly 400 to prevent the heat-conducting gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b, thereby preventing the heat-conducting gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0339] In some embodiments, one end of the first heat dissipation member 810 away from the first lens assembly 400 extends beyond the end surface of the first signal processing chip 305, thereby providing sufficient space for the heat-conducting gel on the surface to prevent the heat-conducting gel from overflowing along the end surface of the first signal processing chip to the surface of the circuit board 300.

[0340] In some embodiments, the first bearing surface 811 includes an expanded portion and a contracted portion. The expanded portion is disposed close to the first lens assembly 400, and the contracted portion is connected to the expanded portion.

[0341] Since the width of the first lens assembly 400 is greater than the width of the first signal processing chip 305, the width of the expanded portion is greater than the width of the contracted portion to enclose the end surface of the first lens assembly 400 in a larger range, thereby protecting the end surface of the first lens assembly 400 in a larger range.

[0342] In some embodiments, the first lens assembly 400 is formed with a first light folding surface 410 from the side, and the first light folding surface 410 is located above the first light receiving chip 303.

[0343] In some embodiments, the first light folding surface 410 is inclined relative to the surface of the circuit board 300.

[0344] In some embodiments, the first lens assembly 400 is connected with the first fiber support 710.

[0345] In some embodiments, the first light receiving chip 303 is arranged below the first light folding surface 410. The first light folding surface 410 faces downward to the first light receiving chip 303.

[0346] In some embodiments, the light path of the first light folding surface 410 faces the first fiber support 710, and the light path faces the first light receiving chip 303.

[0347] In some embodiments, the external light signal is transmitted along the first fiber support 710 to the first light folding surface 410, the first light folding surface 410 reflects the external light signal towards the first light receiving chip 303, so as to turn the external light signal to the surface of the first light receiving chip 303, and the first light receiving chip 303 converts the received light signal into an electrical signal, completing the reception of the light signal.

[0348] In some embodiments, the first lens assembly 400 is formed with a second light folding surface 420, a third light folding surface 430 connected with the second light folding surface 420, and a fourth light folding surface 440 connected with the third light folding surface 430 from the side. The second light folding surface 420 is arranged above the first light emitting chip 304, the third light folding surface 430 is arranged above the second light folding surface 420, and the fourth light folding surface 440 is arranged above the third light folding surface 430.

[0349] In some embodiments, the third light folding surface 430 connects one end of the second light folding surface 420 and one end of the fourth light folding surface 440.

[0350] In some embodiments, the second light folding surface 420, the third light folding surface 430, and the fourth light folding surface 440 are respectively inclined relative to the surface of the circuit board 300.

[0351] In some embodiments, the second light folding surface 420 and the third light folding surface 430 have different inclination directions, and the second light folding surface 420 and the third light folding surface 430 form a bending area in the shape of a less-than sign.

[0352] In some embodiments, the third light folding surface 430 and the fourth light folding surface 440 have different inclination directions, the second light folding surface 420 and the fourth light folding surface 440 have the same inclination direction, and the third light folding surface 430 and the fourth light folding surface 440 form a bending area in the shape of a greater-than sign.

[0353] In some embodiments, the light signal emitted by the first light emitting chip 304 is transmitted upward along a direction perpendicular to the circuit board 300 to the second light folding surface 420. A portion of the light signal is reflected by the second light folding surface 420 to the back light detector 307, achieving light splitting, thereby monitoring the emission light power of the first light emitting chip 304; another portion of the light signal is refracted upward from the surface of the second light folding surface 420 to the third light folding surface 430, and is refracted upward from the third light folding surface 430 to the fourth light folding surface 440, the fourth light folding surface 440 is directed towards the first optical fiber holder 710, thus the light signal reaching the fourth light folding surface 440 is reflected by the fourth light folding surface 440 to the first optical fiber holder 710, thereby the light signal generated by the first light emitting chip 304 is transmitted to the outside of the optical module through the first optical fiber holder 710, completing the emission of the light signal.

[0354] In some embodiments, the first light folding surface 410, the second light folding surface 420, the third light folding surface 430, and the fourth light folding surface 440 are respectively located on the side surface of the first lens assembly 400. Exemplarily, these light folding surfaces are respectively formed by inwardly excavating from the side surface of the first lens assembly 400. These light folding surfaces are all concealed within the first lens assembly 400, thereby preventing these light folding surfaces from being contaminated.

[0355] In some embodiments, the top surface 450 of the first lens assembly 400 protrudes to shield the first light folding surface 410 and the fourth light folding surface 440 from above, preventing these light folding surfaces from being contaminated.

[0356] In some embodiments, the first blocking surface 812 is erected on the side surface of these light folding surfaces of the first lens assembly 400, thereby the heat-conducting gel can be blocked from overflowing to these light folding surfaces, thereby ensuring the cleanliness of the light folding surfaces.

[0357] FIG. 33 is a structure diagram of a lens assembly according to some embodiments of the present disclosure. As shown in FIG. 33, in some embodiments, the first lens assembly 400 is formed with a top surface 450 above.

[0358] In some embodiments, the first lens assembly 400 is formed with the first light folding surface 410 above the first light receiving chip 303, to reflect the light signal to the first light receiving chip 303.

[0359] In some embodiments, the first lens assembly 400 is sequentially formed with the second light folding surface 420, the third light folding surface 430, and the fourth light folding surface 440 above the first light emitting chip 304, to gradually transmit the light signal generated by the first light emitting chip 304 to the fourth light folding surface 440, to transmit the light signal to the first optical fiber holder 710 through the reflection of the fourth light folding surface 440, thereby transmitting to the outside.

[0360] In some embodiments, the top surface 450 covers the first light refraction surface 410 and the fourth light refraction surface 440 from above, so as to cover and shield the first light refraction surface 410 and the fourth light refraction surface 440 from above, respectively, to avoid other objects from touching the first light refraction surface 410 and the fourth light refraction surface 440, so as to avoid the surfaces of the first light refraction surface 410 and the fourth light refraction surface 440 from being contaminated, and to protect the optical surfaces.

[0361] In some embodiments, the first lens assembly 400 is provided with a first groove 460 and a second groove 470 on both sides of the bottom surface of the first lens assembly 400. The first groove 460 and the second groove 470 are concave upwards.

[0362] In some embodiments, the bottom surface of the first lens assembly 400 is fixedly connected to the surface of the circuit board 300, and the bottom surface of the first lens assembly 400 covers the first light emitting chip 304, the first light receiving chip 303, and the like.

[0363] In some embodiments, the adhesive medium is filled bidirectionally along the edges of both sides of the bottom surface of the first lens assembly 400, so as to fix the first lens assembly 400 to the surface of the circuit board 300. The gap between the first lens assembly 400 and the circuit board 300 has a capillary siphon effect, the filled adhesive medium is sucked and flows towards the center. The first groove 460 and the second groove 470 are arranged to avoid the adhesive filler from continuing to flow towards the center to the surfaces of the first light emitting chip 304, the first light receiving chip 303, and the like, so as to cause certain contamination to the first light emitting chip 304, the first light receiving chip 303, and the like, and to affect the pasting and fixing effect of the first lens assembly 400. Exemplarily, the adhesive medium is glue.

[0364] In some embodiments, the adhesive medium is filled bidirectionally along the edges of both sides of the bottom surface of the first lens assembly 400, and the adhesive medium on both sides is sucked into the first groove 460 and the second groove 470, so as to avoid continuing to flow towards the center of the first lens assembly 400.

[0365] The arrangement of the first groove 460 and the second groove 470 can make the bottom surfaces of the edges of both sides of the first lens assembly 400 form a height difference with the surfaces of the first groove 460 and the second groove 470, respectively, to reduce the capillary siphon phenomenon of the adhesive medium, so that the first groove 460 and the second groove 470 play a role of glue isolation.

[0366] FIG. 34 is a structure diagram of a first heat dissipation member according to some embodiments of the present disclosure. As shown in FIG. 34, in some embodiments, the first heat dissipation member 810 includes a first bearing surface 811, a first barrier surface 812 located on one side of the first bearing surface 811, and a first support portion 813 located below the first bearing surface 811.

[0367] In some embodiments, the first support portion 813 is distributed on both sides below the first blocking surface 812 and on both sides below the first bearing surface 811.

[0368] In some embodiments, the first blocking surface 812 has a clearance gap 814 to the surface of the circuit board 300 to avoid the wiring between the first light receiving chip 303, the first light emitting chip 304, and the first signal processing chip 305 covered by the first lens assembly 400 below.

[0369] FIG. 35 is a schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure, and FIG. 36 is a schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure. As shown in FIGS. 35 and 36, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are located on the same surface of the circuit board 300. The structures provided in FIGS. 35 and 36 are suitable for the first signal processing chip 305 having a laser drive chip built-in and a TIA externally connected. Alternatively, the first signal processing chip 305 has a TIA built-in and a laser drive chip externally connected.

[0370] In some embodiments, the first lens assembly 400 forms an open cavity 400b with the surface of the circuit board 300 below.

[0371] In some embodiments, the TIA 3031 is located in the open cavity 400b surrounded by the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the TIA 3031 are located in the open cavity 400b. The first light receiving chip 303 and the TIA 3031 are located on the surface of the circuit board 300 and covered by the first lens assembly 400.

[0372] In some embodiments, the surface of the first signal processing chip 305 is covered by a third heat dissipation member 850. The third heat dissipation member 850 can seal the open cavity 400b, thereby preventing the conductive gel from overflowing into the open cavity 400b.

[0373] In some embodiments, the first light receiving chip 303 is located between the TIA 3031 and the first signal processing chip 305.

[0374] In some embodiments, the TIA 3031 is located in the open cavity 400b surrounded by the first lens assembly 400 and the surface of the circuit board 300, thereby shortening the distance between the first lens assembly 400 and the first signal processing chip 305 and making them close to each other.

[0375] FIG. 37 is a third heat dissipation structure diagram according to some embodiments of the present disclosure. As shown in FIG. 37, in some embodiments, the third heat dissipation member 850 includes a third bearing surface 851, a second barrier surface 852 above one side of the third bearing surface 851, and a third support portion 853 below the third bearing surface 851.

[0376] In some embodiments, the surface of the third bearing surface 851 can be provided with a heat-conducting gel to transfer the heat generated by the first signal processing chip 305 to the upper housing 201.

[0377] In some embodiments, the third barrier surface 852 is located at one end of the third bearing surface 851 close to the first lens assembly 400, which can block the heat-conducting gel on the surface of the third bearing surface 851 from overflowing into the open cavity 400b, and can also avoid the wiring between the first light emitting chip 304 and the first signal processing chip 305.

[0378] In some embodiments, the third support portion 853 is provided at the bottom end of the third bearing surface 851 to support the third bearing surface 851 above the first signal processing chip 305. The length of the third support portion 853 is longer than the length of the first support portion 813.

[0379] FIG. 38 is a fifth circuit board surface layout diagram according to some embodiments of the present disclosure, and FIG. 39 is a sixth circuit board surface layout diagram according to some embodiments of the present disclosure. As shown in FIGS. 38 and 39, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are located on the same surface of the circuit board 300. The structures shown in FIGS. 38 and 39 are suitable for the first signal processing chip 305 having a laser drive chip built-in and a TIA 3031 externally provided. Alternatively, the first signal processing chip 305 has a TIA 3031 built-in and a laser drive chip externally provided.

[0380] In some embodiments, the TIA 3031 is provided outside the first lens assembly 400. The TIA 3031 is provided between the first lens assembly 400 and the first signal processing chip 305.

[0381] In some embodiments, the surface of the TIA 3031 is covered with a first cover 910, which is arranged on the top surface of the first lens assembly 400 to protect the TIA 3031.

[0382] FIG. 40 is a first lens assembly bottom structure diagram according to some embodiments of the present disclosure. As shown in FIG. 40, in some embodiments, the first lens assembly 400 is connected with the first fiber support 710.

[0383] In some embodiments, the first optical fiber support 710 is tapered towards one end of the first lens assembly 400, and the tapered region does not enter the first lens assembly 400 completely, so that there is a clearance between the first optical fiber support 710 and the first lens assembly 400 to avoid interference between them due to manufacturing errors, thereby ensuring that they are tightly engaged with each other.

[0384] In some embodiments, the first lens assembly 400 is covered with a first light receiving chip 303 at one end and a first light emitting chip 304, a back light detector 307 and a heating element 308 at the other end.

[0385] FIG. 41 is an exploded view of the assembly of a first lens assembly and a first optical fiber support according to some embodiments of the present disclosure. As shown in FIG. 41, in some embodiments, the first lens assembly 400 is connected with the first optical fiber support 710.

[0386] In some embodiments, the first lens assembly 400 is formed with a supporting surface 480 at the tail end to support the first optical fiber support 710. For example, the first optical fiber support 710 is arranged on the surface of the supporting surface 480.

[0387] In some embodiments, the end surface of the first optical fiber support 710 connected with the first lens assembly 400 is formed with a first assembly hole 711 and a second assembly hole 712 on both sides, respectively, to realize the assembly connection with the first lens assembly 400.

[0388] In some embodiments, the first assembly hole 711 and the second assembly hole 712 are respectively formed with a first optical fiber array fixing hole 713 and a second optical fiber array fixing hole 714. The first optical fiber array fixing hole 713 is arranged with a first optical fiber array, which is used to transmit external light signals to the surface of the first lens assembly 400. The second optical fiber array fixing hole 714 is arranged with a second optical fiber array, which is used to transmit light signals generated by the first light emitting chip 304 to the outside of the optical module.

[0389] FIG. 42 is a side view of a first lens assembly according to some embodiments of the present disclosure. As shown in FIG. 42, in some embodiments, the first lens assembly 400 is formed with a supporting surface 480 at the tail end to support the first optical fiber support 710.

[0390] In some embodiments, the first optical fiber support 710 is formed with a first limiting column 491 and a second limiting column 492 on both sides of the abutting surface. The first assembly hole 711 is nested on the first limiting column 491, and the second assembly hole 712 is nested on the second limiting column 492, thereby limiting the first optical fiber support 710 on the first lens assembly 400 to realize the fixed connection between the first optical fiber support 710 and the first lens assembly 400.

[0391] In some embodiments, the first lens array 493 and the second lens array 494 are formed between the first limiting post 491 and the second limiting post 492, respectively, to improve the light coupling efficiency.

[0392] In some embodiments, the first lens array 493 is coupled to the first optical fiber array, and the second lens array 494 is coupled to the second optical fiber array. In some embodiments, the first lens array 493 includes a plurality of collimating lenses, and the second lens array 494 includes a plurality of converging lenses.

[0393] In some embodiments, the first lens array 493 receives the light signal from the first optical fiber array, and the collimating lenses included in the first lens array 493 collimate the signal light to obtain parallel light, which enters the first lens assembly 400.

[0394] In some embodiments, the light signal emitted by the first light emitting chip 304 enters the second lens array 494 after the change of the transmission direction, and the converging lenses included in the second lens array 494 converge the signal light, which is then converged to the end face of the optical fiber and enters the second optical fiber array.

[0395] In some embodiments, the first lens array 493 and the second lens array 494 are optical surfaces that need to be precisely machined, and a height difference is formed between the first lens array 493 and the second lens array 494 during the precise machining. Therefore, a stepped surface 495 is formed between the first lens array 493 and the second lens array 494.

[0396] FIG. 43 is a cross-sectional structure diagram of the assembly of the first lens assembly and the first optical fiber support according to some embodiments of the present disclosure. As shown in FIG. 43, in some embodiments, one end of the first optical fiber support 710 is embedded into the first lens assembly 400, so as to realize the connection between the first optical fiber support 710 and the first lens assembly 400.

[0397] In some embodiments, the end face 715 of the first optical fiber support 710 is connected to the first lens assembly 400.

[0398] In some embodiments, the end face 715 is polished to form an inclined end face, so that the light reflected by the end face of the optical fiber is guided to the cladding of the optical fiber, thereby preventing the light from being returned to the core of the optical fiber and ensuring the signal quality.

[0399] In some embodiments, the included angle between the end face 715 and the vertical face is 9°-10°. For example, the included angle is 8°, so as to improve the return loss.

[0400] FIG. 44 is a cross-sectional structure diagram of the first lens assembly according to some embodiments of the present disclosure. As shown in FIG. 44, in some embodiments, one side of the first limiting post 491 forms a first inclined boss 496, and one side of the second limiting post 492 forms a second inclined boss 497.

[0401] In some embodiments, the first inclined boss 496 and the second inclined boss 497 are closely fitted with the end surface 715, so that the physical contact between the first optical fiber holder 710 and the first lens assembly 400 is more closely.

[0402] In some embodiments, the two ends of the end surface 715 are closely fitted with the first inclined boss 496 and the second inclined boss 497, respectively.

[0403] In some embodiments, the surface of the first inclined boss 496 is protruding relative to the root of the first limiting column 491, and the surface of the second inclined boss 497 is protruding relative to the root of the second limiting column 492.

[0404] In some embodiments, the first inclined boss 496 and the second inclined boss 497 can provide a better fitting surface for the fixation of the end surface 715, and it is also easier to process the inclined surface from the roots of the first limiting column 491 and the second limiting column 492.

[0405] FIG. 45 is a structure diagram of a bottom surface of a first lens assembly according to some embodiments of the present disclosure. As shown in FIG. 45, in some embodiments, a first light folding surface 410 is formed on one side of the surface of the first lens assembly 400, and a second light folding surface 420, a third light folding surface 430 and a fourth light folding surface 440 are formed on the other side.

[0406] In some embodiments, a third lens array 498 is formed at the bottom end of the first lens assembly 400 corresponding to the first light folding surface 410 side, and a fourth lens array 499 is formed at the bottom end of the first lens assembly 400 corresponding to the second light folding surface 420 side.

[0407] In some embodiments, a first light receiving chip 303 is arranged below the third lens array 498. The third lens array 498 includes a plurality of converging lenses to couple the converged light signal into the first light receiving chip 303, thereby increasing the light coupling efficiency.

[0408] In some embodiments, a first light emitting chip 304 is arranged below the fourth lens array 499. Exemplarily, the fourth lens array 499 includes a plurality of collimating lenses to couple the collimated light emitted by the first light emitting chip 304 into the first lens assembly 400, thereby increasing the light coupling efficiency.

[0409] In some embodiments, the surface on which the third lens array 498 is arranged is protruding from the surface on which the fourth lens array 499 is arranged, so that the focal length of the third lens array 498 falls on the first light receiving chip 303, and the focal length of the fourth lens array 499 falls on the first light emitting chip 304.

[0410] In some embodiments, the third lens array 498 and the fourth lens array 499 are optical surfaces that require precision machining, which will form a height difference with the surroundings.

[0411] In some embodiments, the bottom end of the first lens assembly 400 is formed with a first groove 460 and a second groove 470, respectively.

[0412] In some embodiments, the first groove 460 and the second groove 470 can make the bottommost surface of the two side edges of the first lens assembly 400 form a height difference with the surface of the first groove 460 and the second groove 470, respectively, thereby reducing the capillary siphon phenomenon of the gap between the first lens assembly 400 and the surface of the circuit board 300. The first groove 460 and the second groove 470 can act as a glue barrier.

[0413] In some embodiments, if the gap between the surface of the third lens array 498 and the fourth lens array 499 and the circuit board 300 is large, the capillary siphon phenomenon of the gap is weak, and the first groove 460 and the second groove 470 can not be formed.

[0414] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who thinks of changes or replacements within the technical scope disclosed by the present disclosure should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A light module comprising: a circuit board, a surface of which is provided with a first light emitting chip and a first light receiving chip; a first signal processing chip, which is electrically connected to the circuit board, is located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip, and is electrically connected to the first light emitting chip and / or the first light receiving chip; a surface of the first signal processing chip is cooled by a heat conducting medium; a first lens assembly, which is located on the same surface of the circuit board as the first signal processing chip, forms an open cavity between the surface of the circuit board and the first lens assembly, the open cavity has an opening that is open towards the first signal processing chip, the first light emitting chip and the first light receiving chip are located in the open cavity, and the first lens assembly covers the surface of the first light receiving chip and the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and the transmission direction of the light emitting signal generated by the first light emitting chip; the light module further comprises a cover assembly or a heat dissipation assembly; the cover assembly at least partially overlaps the first lens assembly, and at least part of the cover assembly is directed towards the opening to form a barrier between the opening and the first signal processing chip to prevent the heat conducting medium from entering the open cavity through the opening; the heat dissipation assembly covers the first signal processing chip, at least part of the surface of the heat dissipation assembly is provided with the heat conducting medium to cool the first signal processing chip, and at least part of the heat dissipation assembly is directed towards the opening to form a barrier between the opening and the first signal processing chip to prevent the heat conducting medium from entering the open cavity through the opening.

2. The optical module according to claim 1, wherein the cover assembly comprises a first cover, the first cover comprises a top plate and a baffle, the top plate overlaps the first lens assembly, and the baffle is directed towards the opening and forms a barrier between the opening and the first signal processing chip.

3. The optical module according to claim 1, wherein the first signal processing chip is electrically connected to the first light emitting chip and the first light receiving chip, respectively; the heat dissipation assembly comprises a first heat dissipation member; the first heat dissipation member comprises: a first bearing surface, a surface of which is provided with the heat conducting medium to cool the first signal processing chip; a first barrier surface, which is located on one side of the first bearing surface, is located between the first lens assembly and the first bearing surface, and forms a barrier between the opening and the first signal processing chip to prevent the heat conducting medium from overflowing into the open cavity; a first support portion, which is located at the bottom of the first bearing surface, supports the first bearing surface above the first signal processing chip.

4. The optical module of claim 1, wherein, the heat dissipation assembly further comprises a third heat dissipation member; the third heat dissipation member comprises: a third bearing surface, a surface of which is provided with the heat conducting medium to cool the first signal processing chip; A third barrier surface is arranged at one end of the third supporting surface close to the first lens assembly, and forms a barrier between the opening and the first signal processing chip to prevent the heat conducting medium from overflowing into the open cavity; A third supporting portion is arranged at the bottom of the third supporting surface to support the third supporting surface above the first signal processing chip.

5. The optical module according to any one of claims 1 to 4, wherein The first signal processing chip is electrically connected to the circuit board through a bottom surface; The surface of the circuit board is provided with a wire, which passes through the baffle, the first barrier surface or the third barrier surface from one side and extends into the open cavity, and the end of the wire is provided with a solder pad, and the first light emitting chip and / or the first light receiving chip are wire-connected to the solder pad.

6. The optical module according to any one of claims 1 to 4, wherein The baffle, the first barrier surface or the third barrier surface has a clearance with the surface of the circuit board.

7. The optical module according to any one of claims 1 to 4, wherein The first lens assembly is provided with a first light folding surface from the side, which is arranged above the first light receiving chip to change the transmission direction of the optical signal to be transmitted into the first light receiving chip; The first lens assembly is provided with a second light folding surface, a third light folding surface connected to the second light folding surface, and a fourth light folding surface connected to the third light folding surface from bottom to top from the side, and the second light folding surface is arranged above the first light emitting chip; the transmission direction of the optical signal generated by the first light emitting chip is changed in sequence through the second light folding surface, the third light folding surface and the fourth light folding surface; The top surface of the first lens assembly protrudes, and the top surface shields the first light folding surface and the fourth light folding surface from above.

8. The optical module according to claim 2, wherein The first signal processing chip is electrically connected to the first light emitting chip, and the optical module further comprises a TIA, which is arranged in the open cavity; The TIA is located on the side of the first light receiving chip away from the first signal processing chip, and the first light receiving chip is located between the TIA and the first signal processing chip; the TIA is wire-connected to the first light receiving chip; The first cover is arranged on the surface of the TIA.

9. The optical module of claim 2, wherein, The first signal processing chip is arranged on one surface of the circuit board, and the first signal processing chip is electrically connected to the first light receiving chip and the first light emitting chip respectively; The first light receiving chip and the first light emitting chip are arranged on the other surface of the circuit board, and the first lens assembly covers the surface of the first light receiving chip and the first light emitting chip; the first lens assembly and the first signal processing chip are arranged in a one-up-and-one-down manner along the thickness direction of the circuit board, and the first lens assembly covers the surface of the first light receiving chip and the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and the transmission direction of the optical signal generated by the first light emitting chip.

10. The optical module of claim 1, wherein, One side of the first light emitting chip is provided with a back light detector, and the first light emitting chip is arranged between the back light detector and the first signal processing chip. The first light emitting chip and one side of the back light detector are provided with a heating element, and the first light emitting chip and the heating element are on the same copper coating area.

11. The optical module of claim 3, wherein, The optical module further comprises: A second signal processing chip is arranged on the surface of the circuit board in a staggered manner. A second lens assembly is arranged on the surface of the circuit board in a staggered manner. A second heat dissipation element is arranged on the surface of the circuit board in a staggered manner.

12. An optical module, comprising: A circuit board, the surface of which is provided with a first light receiving chip and a first light emitting chip; A first signal processing chip is electrically connected to the circuit board, and is located on the same surface of the circuit board as the first light receiving chip and the first light emitting chip, and is electrically connected to the first light receiving chip and the first light emitting chip, respectively; A first lens assembly is located on the same surface of the circuit board as the first signal processing chip, and an open cavity is formed between the first lens assembly and the surface of the circuit board, the open cavity has an opening that is open towards the first signal processing chip, the first light emitting chip and the first light receiving chip are located in the open cavity, and the first lens assembly covers the surface of the first light receiving chip and the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and the transmission direction of the optical signal emitted by the first light emitting chip; A first heat dissipation element covers the surface of the first signal processing chip, the first heat dissipation element comprises a first bearing surface, a first blocking surface arranged on one side of the first bearing surface, and a first support portion arranged at the bottom of the first bearing surface, and the surface of the first bearing surface is used to bear a heat conducting medium to dissipate heat for the first signal processing chip; The first blocking surface faces the opening, and the first blocking surface forms a barrier between the opening and the first signal processing chip to block the heat conducting medium from entering the open cavity through the opening; and the first support portion is configured to support the first bearing surface above the first signal processing chip.

13. The optical module of claim 12, wherein, The first signal processing chip is electrically connected to the circuit board through a bottom surface; The surface of the circuit board forms a wire, the wire passes through the first blocking surface from one side and extends into the open cavity, and the end of the wire forms a solder pad, and the first light emitting chip and the first light receiving chip are respectively wire-bonded to the solder pad.

14. The optical module of claim 12, wherein, The first lens assembly forms a first light folding surface from the side, and the first light folding surface is arranged above the first light receiving chip to turn the transmission direction of the optical signal to be transmitted into the first light receiving chip; The first lens assembly forms a second light folding surface, a third light folding surface connected to the second light folding surface in a bent manner, and a fourth light folding surface connected to the third light folding surface in a bent manner from bottom to top from the side, and the second light folding surface is arranged above the first light emitting chip; the transmission direction of the optical signal emitted by the first light emitting chip is turned in sequence through the second light folding surface, the third light folding surface, and the fourth light folding surface. The first lens assembly includes a top surface that shields the first light folding surface and the fourth light folding surface from above.

15. The optical module of claim 12, wherein, One side of the first light emitting chip is provided with a back light detector, and the first light emitting chip is arranged between the back light detector and the first signal processing chip. One side of the first light emitting chip and the back light detector is provided with a heating element, and the first light emitting chip and the heating element are on the same copper area.

16. The optical module of claim 12, wherein, The first blocking surface and the circuit board surface have an avoiding gap.

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