Cutting device and method for producing cut article

Abstract

The present invention prevents an object to be cut that is clamped to a cutting table from rising up, without the need to provide a drive source to the cutting table. The present invention comprises: a cutting table 2A, 2B; a conveyance mechanism 3, 6 that conveys an object W to be cut to the cutting table 2A, 2B; and a pressing mechanism 22 that presses the object W to be cut which is held on the cutting table 2A, 2B. The pressing mechanism 22 is provided with a pressing part 23 that presses the object W to be cut, a switching part 24 that receives a pressing force from the conveyance mechanism 3, 6 and switches the pressing part 23 from an open position OP to a pressing position HP, and a locking mechanism 25 that keeps, in the pressing position HP, the pressing part 23 that has been placed in the pressing position HP by the switching part 24.

Description

Cutting device and method for manufacturing cut products

[0001] The present invention relates to a cutting device and a method for manufacturing a cut product.

[0002] Conventionally, as disclosed in Patent Document 1, an apparatus has been proposed for cutting a plate-shaped workpiece placed on a chuck table with a blade. In this apparatus, a clamp unit is provided on the chuck table, and the clamp unit presses against the top surface of the workpiece to fix it in place. The clamp unit is driven by a clamp unit drive mechanism provided on the chuck table.

[0003] However, in the above-described device, the chuck table is provided with a clamp unit drive mechanism, which serves as a drive source, which results in a problem of an increased size of the chuck table.Furthermore, providing a drive source on the chuck table also complicates the surrounding structure, such as the routing of power supply wiring to the chuck table.

[0004] Japanese Patent Application Laid-Open No. 2020-116719

[0005] The present invention has been made to solve the above problems, and its main objective is to prevent the workpiece adsorbed to the cutting table from floating up without providing a drive source for the cutting table.

[0006] That is, the cutting device of the present invention comprises a cutting table that adsorbs and holds the object to be cut, a transport mechanism that transports the object to the cutting table, a pressing mechanism that presses the object to be cut held on the cutting table, and a cutting mechanism that cuts the object to be cut held on the cutting table, and the pressing mechanism comprises a pressing section that presses down an end of the object to be cut, a switching section that receives a pressing force from the transport mechanism and switches the position of the pressing section from an open position that releases the end to a pressing position that presses down the end, and a locking mechanism that maintains the pressing section in the pressing position once set to the pressing position by the switching section.

[0007] According to the present invention configured as described above, the workpiece attracted to the cutting table can be prevented from floating up without providing a drive source for the cutting table.

[0008] 1 is a plan view showing an example of an object to be cut (sealed substrate); FIG. 2 is a diagram schematically showing the configuration of a cutting device according to an embodiment of the present invention; (a) a cross-sectional view and (b) a bottom view schematically showing the configuration of a first holding mechanism of a transport mechanism (loader) in the embodiment; (b) a cross-sectional view schematically showing the configuration of a cutting table and a table inverting mechanism in the embodiment; (c) a plan view schematically showing the configuration of a cutting table and a pressing mechanism in the embodiment; (a) a partially enlarged cross-sectional view perpendicular to the scanning direction of the laser light and (b) a partially enlarged cross-sectional view along the scanning direction of the laser light of the cutting table in the embodiment; (b) a partially enlarged cross-sectional view along the scanning direction of the laser light of the cutting table in the embodiment; (c) a schematic diagram showing the procedure of laser cutting in the embodiment; (a) a schematic diagram showing a state in which the pressing part of the pressing mechanism in the embodiment is in an open position and (b) a state in which the pressing part is in a pressing position; (a) a schematic diagram showing the state of the pressing mechanism before the sealed substrate is transported in the embodiment, and (b) a schematic diagram showing the positional relationship between the pressing part and the table main body; (a) a schematic diagram showing the state of the pressing mechanism immediately after the sealed substrate is placed in the embodiment, and (b) a schematic diagram showing the positional relationship between the pressing part and the table main body. 10A and 10B are schematic diagrams showing the state of the pressing mechanism after pressing the sealed substrate in the embodiment, and the positional relationship between the pressing unit and the table body in FIG. 10A and 10B after the transport mechanism has been retracted in FIG. 10A and 10B, respectively.

[0009] The present invention will now be described in more detail with reference to examples, although the present invention is not limited to the following description.

[0010] As described above, the cutting device of the first aspect of the present invention includes a cutting table that adsorbs and holds the workpiece, a transport mechanism that transports the workpiece to the cutting table, a press mechanism that presses the workpiece held on the cutting table, and a cutting mechanism that cuts the workpiece held on the cutting table. The press mechanism includes a press member that presses an edge of the workpiece, a switch that receives pressure from the transport mechanism and switches the position of the press member from an open position that releases the edge to a press position that presses the edge, and a locking mechanism that maintains the press member in the press position once set to the press position by the switch member. This cutting device receives pressure from the transport mechanism to switch the position of the press member from the open position to the press position, and maintains the press member in the press position using the locking mechanism. This prevents the workpiece adsorbed to the cutting table from floating up without requiring a drive source for the cutting table. For example, if the workpiece is significantly warped, simply holding the workpiece by adsorption on the cutting table can result in the end of the workpiece being released and floating up during cutting. In this case, the cutting of the object to be cut cannot be performed with high precision, resulting in a deterioration in product quality. In the cutting device of the present technology 1, the locking mechanism maintains the pressing part in the pressing position, so even if the object to be cut is significantly warped, the end portion does not lift up during cutting, and the cutting of the object to be cut can be performed with high precision, thereby preventing a deterioration in product quality.

[0011] In a cutting device according to a second aspect of the present invention, in addition to the configuration of the first aspect described above, it is desirable that the switching unit include a movable member that receives a pressing force from the transport mechanism and moves linearly toward the cutting table, and an interlocking mechanism that moves the pressing unit from the open position to the pressing position in accordance with the linear movement of the movable member. With this configuration, the pressing force from the transport mechanism causes the movable member to move linearly, and the interlocking mechanism uses this linear movement to move the pressing unit from the open position to the pressing position, thereby simplifying the configuration of the switching unit.

[0012] In a cutting device according to a third aspect of the present invention, in addition to the configuration of the second aspect, the interlocking mechanism preferably includes a rotational movement unit provided on the pressing unit and rotatably connected to the movable member, a first elastic member provided between the movable member and the rotational movement unit and applying an elastic force to the rotational movement unit so that the pressing unit is in the pressing position, and a first cam mechanism provided between the cutting table and the rotational movement unit and rotating the rotational movement unit in accordance with the linear movement of the movable member, thereby moving the pressing unit from the open position to the pressing position. With this configuration, the rotational movement unit rotatably provided on the movable member is rotated by the first cam mechanism to move the pressing unit from the open position to the pressing position, thereby simplifying the configuration of the interlocking mechanism.

[0013] As a specific embodiment for stably moving the movable member linearly, the cutting device of Technology 4 according to the present invention preferably includes, in addition to the configuration of Technology 2 or 3 described above, a guide mechanism provided on the cutting table for guiding the linear movement of the movable member, and a second elastic member interposed between the cutting table and the movable member for applying an elastic force to the movable member in a direction away from the cutting table. In this configuration, in order to simplify the configuration of the guide mechanism and prevent the slider from coming off the guide rail by the second elastic member, it is preferable that the guide mechanism include a guide rail provided on the cutting table and a slider on which the movable member is provided and which moves along the guide rail, and the movable member is provided with a stopper portion that prevents the slider from coming off the guide rail by the second elastic member.

[0014] As a specific embodiment for receiving a pressing force from the conveying mechanism and linearly moving the movable member, the cutting device of Technology 5 according to the present invention preferably further comprises, in addition to the configuration of any one of Technologies 2 to 4 described above, a second cam mechanism that is interposed between the conveying mechanism and the movable member and that linearly moves the movable member by moving the conveying mechanism up and down relative to the cutting table.

[0015] As a specific embodiment of the locking mechanism, in addition to the configuration of any one of the above-mentioned technologies 1 to 5, the cutting device of Technology 6 according to the present invention preferably has a protrusion provided on the cutting table and a catch portion provided on the presser member that catches on the protrusion when the presser member moves to the presser position. With this configuration, the catch portion can be caught on the protrusion to maintain the presser member in the presser position, thereby simplifying the configuration of the locking mechanism.

[0016] The cutting device of Technology 7 according to the present invention has the same configuration as any one of Technology 1 to Technology 6, and preferably the locking mechanism is released from maintaining the pressing position when the transport mechanism lifts the workpiece and the workpiece lifts the pressing part, or when a release member provided in a transport mechanism that transports the cut product cut by the cutting mechanism lifts the pressing part. With this configuration, the locking mechanism can be released and the pressing part can be moved to the open position without providing a drive source for the cutting table.

[0017] A cutting device according to Technology 8 of the present invention may include any one of the configurations of Technology 1 to Technology 7, in which the cutting table holds a rectangular workpiece. In this case, if one pressing unit were configured to press down one entire longitudinal side of the workpiece, it would be difficult to reliably press down the entire longitudinal side due to deformation of the pressing unit or misalignment of the pressing unit in the longitudinal direction. While it is possible to provide a switching unit at each end of one longitudinal side, it would be difficult to synchronize the two switching units, making it difficult to reliably press down the entire longitudinal side. Therefore, it is desirable that the pressing mechanism be independently provided on both sides of each longitudinal side of the workpiece. With this configuration, since each pressing mechanism is independent, each pressing unit can reliably press down both sides of each longitudinal side of the workpiece.

[0018] A cutting device according to a ninth aspect of the present invention, in addition to the configuration of any one of the first to seventh aspects, further includes a table inversion mechanism for inverting the cutting table. The cutting mechanism includes a laser beam irradiator for irradiating a laser beam onto the workpiece to cut it. The cutting table has a through opening through which the laser beam can pass from one side to the other. While the workpiece is held down by the presser mechanism, the table inversion mechanism inverts the cutting table, and the workpiece is cut by irradiating the laser beam from both the front and back sides. With this configuration, the cutting table is inverted and laser beams are irradiated onto both sides of the workpiece to cut it. This eliminates the need for transferring the workpiece when inverted, shortening processing time such as cutting and improving productivity. Furthermore, by cutting from both sides, the processing depth from one side can be reduced, thereby reducing the required kerf width. As a result, the number of laser scanning rows can be reduced, improving productivity. Furthermore, the pitch between packages on the workpiece can be narrowed, allowing for a layout that allows for additional packages to be added, increasing the number of packages per frame and improving productivity. Furthermore, by cutting from both sides, the tapered shape created by laser cutting can be reduced, improving quality. In addition, since the cutting table is turned upside down while holding the workpiece, if the amount of shift in position when the processing table is turned upside down is measured once in advance, the position after turning can be corrected by calculation, eliminating the need for realignment (position adjustment) each time the table is turned upside down. Therefore, alignment (position adjustment) of the laser beam irradiation unit with respect to the workpiece only needs to be performed once after the workpiece is adsorbed, which also shortens processing time and improves productivity.

[0019] The method for producing a cut product according to the present invention is characterized by using the cutting device according to any one of the techniques 1 to 9 described above.

[0020] <One embodiment of the present invention> Hereinafter, one embodiment of a cutting device according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, parts are appropriately omitted or exaggerated for clarity. Identical components are given the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0021] <Overall Configuration of Cutting Apparatus> The cutting apparatus 100 of this embodiment cuts the sealed substrate W, which is the object to be cut, into a plurality of individual products P.

[0022] Here, the encapsulated substrate W is a substrate formed by resin molding so as to resin-encapsulate at least electronic elements such as semiconductor chips, resistor elements, and capacitor elements on a support to which the electronic elements are fixed. The support may be a substrate such as a lead frame or a printed wiring board, and other substrates such as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrate that constitutes the encapsulated substrate W may or may not be provided with wiring.

[0023] In addition, one surface of the sealed substrate W and the product P in this embodiment is a mounting surface on which mounting will be performed later. In the description of this embodiment, the surface on which mounting will be performed later is referred to as the "mounting surface," and the opposite surface is referred to as the "mark surface."

[0024] As shown in FIG. 1 , the sealed substrate W has a rectangular shape in a plan view. A plurality of divided elements W1, W2 are connected by connecting portions W3, and the cutting lines CL1, CL2 within adjacent divided elements W1, W2 are set on different straight lines. Each divided element W1, W2 is a row of multiple packages in which electronic elements are encapsulated by resin molding. Leads are provided corresponding to each package (electronic element). The divided elements W1, W2 are connected at both ends by connecting portions W3. Specifically, the divided elements W1 in odd-numbered rows and the divided elements W2 in even-numbered rows have leads that are staggered. As a result, the cutting lines CL1 of the divided elements W1 in odd-numbered rows are aligned on the same straight line, and the cutting lines CL2 of the divided elements W2 in even-numbered rows are aligned on the same straight line. The cutting lines CL1 of the divided elements W1 in odd-numbered rows and the cutting lines CL2 of the divided elements W2 in even-numbered rows are aligned on different straight lines. The cutting lines CL1 and CL2 shown in FIG. 1 are imaginary lines along which cutting is planned, and are not shown on the actual sealed substrate W.

[0025] 2, the cutting apparatus 100 includes two cutting tables 2A and 2B for holding the sealed substrate W, a first holding mechanism 3 for holding the sealed substrate W in order to transport the sealed substrate W to the cutting tables 2A and 2B, a cutting mechanism 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, a second holding mechanism 5 for holding a plurality of products P in order to transport the plurality of products P from the cutting tables 2A and 2B, and a transport moving mechanism 6 for moving the first holding mechanism 3 and the second holding mechanism 5. The first holding mechanism 3 and the transport moving mechanism 6 form a transport mechanism (loader) for transporting the sealed substrate W. The second holding mechanism 5 and the transport moving mechanism 6 form a transport mechanism (unloader) for transporting the plurality of products P.

[0026] In the following description, directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A, 2B are referred to as the X direction and the Y direction, respectively, and the vertical direction perpendicular to the X direction and the Y direction is referred to as the Z direction. Specifically, the left-right direction in Fig. 2 is referred to as the X direction (first direction), and the up-down direction is referred to as the Y direction (second direction).

[0027] <Cutting Tables 2A, 2B> The two cutting tables 2A, 2B adsorb and hold the sealed substrate W, and are provided so as to be movable at least in the Y direction. The cutting table 2A can be moved in the Y direction by a cutting movement mechanism 8A, and can be rotated in the θ direction by a rotation mechanism 9A. The cutting table 2B can be moved in the Y direction by a cutting movement mechanism 8B, and can be rotated in the θ direction by a rotation mechanism 9B. The specific configurations of the cutting tables 2A, 2B will be described later.

[0028] 2, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 10 to the cutting tables 2A and 2B. The first holding mechanism 3 is moved to a desired position by a transport moving mechanism 6 (described later) or the like, whereby the sealed substrate W is transported from the substrate supply mechanism 10 to the cutting tables 2A and 2B.

[0029] As shown in Figure 2, the substrate supply mechanism 10 has a substrate accommodating section 10a in which multiple sealed substrates W are accommodated from the outside, and a substrate supplying section 10b that moves the sealed substrates W accommodated in the substrate accommodating section 10a to a holding position RP where they are adsorbed and held by the first holding mechanism 3.

[0030] 3, the first holding mechanism 3 has a pair of holding claws 31 for holding the sealed substrate W. Specifically, the pair of holding claws 31 hold the sealed substrate W by hooking onto opposing longitudinal side portions of the sealed substrate W. The pair of holding claws 31 in this embodiment are provided at multiple locations (three locations in FIG. 3) on the longitudinal side portions (connecting portions W3 in FIG. 1) of the sealed substrate W.

[0031] The distance between these paired holding claws 31 is expanded and contracted by a drive unit (not shown) provided on the base member 30 of the first holding mechanism 3. By reducing the distance between the paired holding claws 31, the sealed substrate W is hooked and held, and by expanding the distance between the paired holding claws 31, the sealed substrate W is released from its hold.

[0032] The first holding mechanism 3 also has a pressing member 32 that presses down the sealed substrate W placed on the cutting tables 2A, 2B. The pressing member 32 can be moved up and down by a drive unit (not shown) provided on the base member 30 of the first holding mechanism 3. The pressing member 32 is in contact with or close to the top surface of the sealed substrate W held by the pair of holding claws 31.

[0033] <Cutting mechanism 4> As shown in FIG. 2, the cutting mechanism 4 irradiates laser light onto the sealed substrate W adsorbed on the cutting tables 2A and 2B to cut the sealed substrate W, and has two laser light irradiation units 41A and 41B.

[0034] The two laser light irradiation units 41A, 41B are provided along the Y direction and are configured so that each can independently irradiate laser light. Each laser light irradiation unit 41A, 41B has a laser oscillator, a laser light scanning unit such as a galvanometer scanner that linearly scans the laser from the laser oscillator, and a condensing lens that condenses the laser light. In each laser light irradiation unit 41A, 41B, the laser light is condensed by the condensing lens onto the sealed substrate W adsorbed on the cutting tables 2A, 2B, and linearly scanned along the surface of the sealed substrate W adsorbed on the cutting tables 2A, 2B by the laser light scanning unit.

[0035] In this embodiment, the two laser light irradiation units 41A, 41B are provided on a single processing head 40. This processing head 40 is movable between the two cutting tables 2A, 2B in the X direction by a processing head moving mechanism 11. The processing head moving mechanism 11 can also move the processing head 40 in the Y and Z directions. Alternatively, the two laser light irradiation units 41A, 41B may be configured to be movable at least in the X or Y direction relative to the processing head 40. Note that the two laser light irradiation units 41A, 41B may be configured to be movable independently between the two cutting tables 2A, 2B.

[0036] The cutting at the cutting table 2A involves moving the cutting table 2A and the two laser light irradiating units 41A, 41B relative to each other and scanning the laser light, thereby cutting and individualizing the sealed substrate W. The cutting at the cutting table 2B involves moving the cutting table 2B and the two laser light irradiating units 41A, 41B relative to each other and scanning the laser light, thereby cutting and individualizing the sealed substrate W. The cutting process at the cutting table 2A and the cutting process at the cutting table 2B can be performed alternately.

[0037] 2, the second holding mechanism 5 holds a plurality of products P in order to transport the plurality of products P from the two cutting tables 2A, 2B to a holding table 123a of the reversing mechanism 123, which will be described later. The second holding mechanism 5 has a plurality of suction portions (not shown) for suction-holding the plurality of products P. The second holding mechanism 5 is moved to a desired position by a transfer mechanism 6, which will be described later, or the like, thereby transporting the plurality of products P from the two cutting tables 2A, 2B to the holding table 123a of the reversing mechanism 123.

[0038] <Transport moving mechanism 6> As shown in FIG. 2, the transport moving mechanism 6 moves the first holding mechanism 3 to at least the substrate supply mechanism 10, the cutting table 2A, and the cutting table 2B, and moves the second holding mechanism 5 to at least the cutting table 2A, the cutting table 2B, and the holding table 123a.

[0039] 2, the transport movement mechanism 6 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and a holding table 123a (described later), and has a common transfer shaft 61 for moving the first holding mechanism 3 and the second holding mechanism 5. This transfer shaft 61 is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 10b of the substrate supply mechanism 10, and allows the second holding mechanism 5 to move above the holding table 123a (see FIG. 2). Note that the transfer shaft 61 may be provided separately for the first holding mechanism 3 and the second holding mechanism 5.

[0040] Furthermore, the transfer movement mechanism 6 is configured to be able to move the first holding mechanism 3 and the second holding mechanism 5 in the X direction and the Z direction relative to the transfer shaft 61. The movement mechanism in each direction may be, for example, one that uses a rack and pinion mechanism, one that uses a ball screw mechanism, one that uses an air cylinder, or one that uses a linear motor.

[0041] Furthermore, as shown in Figure 2, the cutting device 100 of this embodiment is equipped with an inspection unit 12 that inspects multiple products P, a transfer table 13 to which the multiple products P are transferred, and a sorting mechanism 14 that sorts the products P according to the inspection results by the inspection unit 12.

[0042] The inspection unit 12 is provided between the cutting table 2B and the transfer table 13, and inspects the multiple products P held by the second holding mechanism 5. The inspection unit 12 of this embodiment has a first inspection unit 121 that inspects the mark surface of the product P, and a second inspection unit 122 that inspects the mounting surface of the product P. The first inspection unit 121 is an imaging camera having an optical system for inspecting the mark surface, and the second inspection unit 122 is an imaging camera having an optical system for inspecting the mounting surface. The first inspection unit 121 and the second inspection unit 122 may be a common unit.

[0043] Also, in order to enable the inspection unit 12 to inspect both sides of the multiple products P, an inversion mechanism 123 is provided that inverts the multiple products P (see FIG. 2). This inversion mechanism 123 has a holding table 123a that holds the multiple products P, and an inversion unit 123b such as a motor that inverts the holding table 123a so that the front and back of the products P are reversed. Furthermore, the inversion mechanism 123 can be moved to the transfer table 13 by an inversion movement mechanism (not shown) that moves the inversion mechanism 123 in the X direction.

[0044] When the second holding mechanism 5 holds multiple products P from the two cutting tables 2A, 2B, the marked surfaces of the products P face downward. In this state, while the multiple products P are being transported from the two cutting tables 2A, 2B to the inverting mechanism 123, the marked surfaces of the products P are inspected by the first inspection unit 121. Thereafter, the multiple products P held by the second holding mechanism 5 are inverted by the inverting mechanism 123, and then the inverting mechanism 123 moves to the position of the transfer table 13 by the inverting movement mechanism. During this movement, the mounting surfaces of the products P facing downward are inspected by the second inspection unit 122. Thereafter, the products P are delivered to the transfer table 13.

[0045] The transfer table 13 is a table onto which the multiple products P inspected by the inspection unit 12 are transferred. This transfer table 13 is a so-called index table on which the multiple products P are temporarily placed before being sorted and stored in various trays T. Furthermore, the transfer table 13 is provided so as to be movable back and forth along the Y direction. The transfer table 13 is moved by a transfer movement mechanism 15 between a transfer position X1 where the multiple products P are placed by the second holding mechanism 5 and a take-out position X2 where the multiple products P are transported by the sorting mechanism 14.

[0046] The multiple products P placed on the transfer table 13 are sorted into various trays T by the sorting mechanism 14 according to the inspection results (good products, defective products, etc.) by the inspection unit 12. The various trays T are transported by the tray moving mechanism 16 from the tray storage unit 17 to the desired removal position X2, and the products P to be sorted by the sorting mechanism 14 are placed on the trays T. After being sorted, the various trays T are stored in the tray storage unit 17 by the tray moving mechanism 16. In this embodiment, the tray storage unit 17 is configured to store three types of trays T: trays T before storing the products P, trays T storing good products P, and trays T storing defective products P that require rework.

[0047] <Specific Configuration of Cutting Tables 2A, 2B> Next, the specific configuration of the cutting tables 2A, 2B will be described with reference to Figures 4 to 7. Since the cutting table 2A and the cutting table 2B have the same configuration, the following description will be given of the cutting table 2A as a representative.

[0048] 4 and 5, the cutting table 2A has a table body 20 on one surface 2x of which are provided a plurality of suction holes 2h capable of suctioning the sealed substrate W. The plurality of suction holes 2h communicate with a suction flow path 2R formed inside the cutting table 2A. The suction flow path 2R is connected to a vacuum pump (not shown).

[0049] Specifically, the table body 20 of the cutting table 2A has a roughly rectangular shape in a plan view, as shown in Fig. 5. The upper surface of this table body 20 is one surface 2x of the cutting table 2A, and the lower surface of the table body 20 is the other surface 2y of the cutting table 2A. Note that the table body 20 is formed with a recess or other relief portion 20M so that the holding claws 31 do not come into contact with it.

[0050] <Inversion Function of Cutting Table 2A> As shown in Fig. 4, the cutting table 2A is configured to be invertible by a table inversion mechanism 18. As a result, the cutting table 2A is configured to be switchable between a state in which one surface 2x faces upward (laser light irradiation units 41A, 41B) (see Fig. 7(a)), and a state in which the other surface 2y faces upward (laser light irradiation units 41A, 41B) (see Fig. 7(b)).

[0051] 4, the table inversion mechanism 18 rotatably supports both opposing sides (short sides) of the cutting table 2A. This makes it possible to reduce the area through which the cutting table 2A passes when the cutting table 2A is inverted. Furthermore, the cutting table 2A is configured to be detachable from the table inversion mechanism 18, and can be changed to a dedicated cutting table 2A depending on the shape of the sealed substrate W.

[0052] Specifically, the table inverting mechanism 18 has two rotating shafts 181 a, 181 b provided at both ends of the cutting table 2A in the longitudinal direction, a base member 182 that rotatably supports the rotating shafts 181 a, 181 b via bearings such as rolling bearings, and a rotation drive unit 183 such as a motor or rotary cylinder that is provided on one of the rotating shafts 181 a, 181 b and turns the cutting table 2A upside down. The table inverting mechanism 18 of the present embodiment is configured so that the sealed substrate W is located on the rotation axis for front-back inversion before and after the cutting table 2A is turned upside down.

[0053] 4 and 5, the cutting table 2A has mounting blocks 21 at both longitudinal ends of the table body 20, and rotation shafts 181a, 181b are connected to the mounting blocks 21. The base member 182 has two support walls 182a, 182b that rotatably support the two rotation shafts 181a, 181b, and a bottom wall 182c on which the two support walls 182a, 182b are provided. In this embodiment, one rotation shaft 181a is rotatably supported by the support wall 182a via a rotation drive unit 183.

[0054] As shown in Fig. 5, the two rotation shafts 181a, 181b are provided at the center of each of both longitudinal ends of the cutting table 2A in a plan view. The two rotation shafts 181a, 181b have their rotation centers aligned on the same straight line and extend horizontally. These two rotation shafts 181a, 181b extend in the longitudinal direction of the cutting table 2A. In addition, as shown in Fig. 4, at least one of the two rotation shafts 181a, 181b has an internal flow path 181R formed therein that communicates with a suction flow path 2R formed inside the cutting table 2A, and this internal flow path 181R is connected to a vacuum pump (not shown).

[0055] 5 to 7 , the cutting table 2A has a plurality of through openings 2T that allow laser light to pass through, penetrating from one surface 2x on which the suction holes 2h are provided to the other surface 2y that is the surface on the back side of the one surface 2x. The sealed substrate W is cut through these through openings 2T by laser light from two laser light irradiation units 41A and 41B of the cutting mechanism 4.

[0056] As shown in Figure 5, these multiple through openings 2T are formed in positions that do not overlap with the multiple suction holes 2h and the suction flow paths 2R that communicate with these multiple suction holes 2h when viewed in a plan view of the cutting table 2A, that is, when viewed from one surface 2x of the cutting table 2A.

[0057] The plurality of through openings 2T are formed at positions corresponding to the cutting lines CL1, CL2 (see FIG. 1) of the sealed substrate W, and are formed so as to include the cutting lines CL1, CL2 in a plan view of the cutting table 2A. Specifically, each through opening 2T is longer than the length of each cutting line CL1, CL2 in the cutting direction and has a width greater than the width of the kerf to be removed between the packages. Furthermore, the through opening 2T has an opening size that does not allow it to be hit by the laser light irradiated from the two laser light irradiating units 41A, 41B.

[0058] In this embodiment, as shown in FIG. 1, the sealing substrate W has the cutting lines CL1 of the odd-numbered rows of dividing elements W1 and the cutting lines CL2 of the even-numbered rows of dividing elements W2 positioned on different straight lines, and similarly, the multiple through openings 2T formed on the cutting table 2A have the through openings 2T corresponding to the cutting lines CL1 of the odd-numbered rows of dividing elements W1 and the through openings 2T corresponding to the cutting lines CL2 of the even-numbered rows of dividing elements W2 positioned on different straight lines (see FIG. 5).

[0059] 6 and 7, the through opening 2T has a shape that gradually widens from one surface 2x on which the suction holes 2h are provided toward the other surface 2y. Specifically, the through opening 2T has a shape that widens from one surface 2x toward the other surface 2y in a cross section perpendicular to the scanning direction of the laser light. Note that the through opening 2T may have a uniform cross-sectional shape or a shape that widens gradually from one surface 2x toward the other surface 2y as long as it is not irradiated with laser light.

[0060] Furthermore, in this embodiment, although the sealed substrate W is positioned on the rotation axis for front-to-back inversion before and after the cutting table 2A is inverted, the height position of the sealed substrate W may change before and after inversion depending on the sealed substrate W. For this reason, as shown in Fig. 7, a position change mechanism 19 is further provided that changes the relative position between the cutting table 2A and the two laser light irradiation units 41A, 41B before and after the cutting table 2A is inverted. This position change mechanism 19 changes the relative position between the cutting table 2A and the two laser light irradiation units 41A, 41B to adjust the focal position of the laser light on the sealed substrate W.

[0061] This position change mechanism 19 can be provided in the processing head moving mechanism 11 that moves the processing head 40 (see FIG. 2), and can change the height position of the processing head 40 (two laser light irradiation units 41A, 41B) before and after turning the cutting table 2A over. The position change mechanism 19 can also be configured by the processing head moving mechanism 11. Note that the height position of the cutting table 2A may be changed so that the height position is the same before and after turning the cutting table 2A over.

[0062] <Holding mechanism 22 for encapsulated substrate W> As shown in Fig. 5 and Fig. 8 to Fig. 12, the cutting device 100 of this embodiment is provided with a holding mechanism 22 that holds the encapsulated substrate W held on the cutting table 2A against the cutting table 2A. Note that the cutting table 2B is also provided with a holding mechanism 22, similar to the cutting table 2A.

[0063] 5, the pressing mechanisms 22 are provided independently on both sides of each long side of the sealed substrate W on the cutting table 2A. That is, in this embodiment, four pressing mechanisms 22 are provided. Furthermore, each pressing mechanism 22 is provided on both sides of the rotation shaft portions 181a, 181b on the mounting block 21 of the cutting table 2A.

[0064] As shown in Figures 5, 8 to 12, each pressing mechanism 22 includes a pressing section 23 that presses the edge of the sealed substrate W, a switching section 24 that receives a pressing force from the first holding mechanism 3 of the transport mechanism (loader) and switches the position of the pressing section 23 from an open position OP (see Figures 8(a), 9 and 10) that releases the edge to a pressing position HP (see Figures 8(b), 11 and 12) that presses the edge, and a locking mechanism 25 that maintains the pressing section 23, whose position has been switched to the pressing position HP by the switching section 24, at the pressing position HP.

[0065] The pressing portion 23 comes into contact with an end portion of a longitudinal side of the encapsulated substrate W. The pressing portion 23 has an elongated shape and is provided along the longitudinal side of the encapsulated substrate W. A switching portion 24 is connected to one end portion of the pressing portion 23 (the end portion on the outer side in the longitudinal direction of the encapsulated substrate W). The end portion that the pressing portion 23 comes into contact with is a portion of the encapsulated substrate W that does not become the product P (non-product portion), and in this embodiment, is the connecting portion W3.

[0066] The pressing unit 23 is switched between an open position OP and a pressing position HP by the switching unit 24. Here, the open position OP is a position where the sealed substrate W transported by the first holding mechanism 3 does not come into contact with the pressing unit 23 (see FIGS. 8( a), 9, and 10). The pressing position HP is a position where the lower surface of the pressing unit 23 comes into contact with the upper surface of the end of the long side of the sealed substrate W, presses the end against the cutting table 2A, and sandwiches the sealed substrate W between the pressing unit 23 and the cutting table 2A (see FIGS. 8( b), 11, and 12). Furthermore, as shown in FIG. 5, the pressing unit 23 has cutouts 23K formed in portions corresponding to the holding claws 31 of the first holding mechanism 3 so that the holding claws 31 do not interfere with the pressing unit 23 at the pressing position HP.

[0067] The switching portion 24 is pressed as the first holding mechanism 3 of the transport mechanism (loader) descends, and moves the pressing portion 23 from the open position OP to the pressing position HP.

[0068] Specifically, as shown in Figures 8 to 12, the switching unit 24 includes a movable member 241 that receives a pressing force from the first holding mechanism 3 and moves linearly toward the cutting table 2A, and an interlocking mechanism 242 that moves the pressing unit 23 from the open position OP to the pressing position HP in accordance with the linear movement of the movable member 241.

[0069] The movable member 241 moves linearly along the widthwise direction (X direction) of the cutting table 2 A. Specifically, the movable member 241 moves linearly by the guide mechanism 26 .

[0070] The guide mechanism 26 has a guide rail 261 provided on the mounting block 21 of the cutting table 2A, and a slider 262 on which the movable member 241 is provided and which moves along the guide rail 261. The guide rail 261 is provided on the mounting block 21 along the short side direction (X direction) of the cutting table 2A.

[0071] In this embodiment, a second elastic member 27 is provided between the mounting block 21 of the cutting table 2A and the movable member 241. This second elastic member 27 applies an elastic force to the movable member 241 in a direction away from the cutting table 2A.

[0072] Here, the movable member 241 is provided with a retaining portion 28 that prevents the slider 262 from coming off the guide rail 261 by the second elastic member 27. This retaining portion 28 hooks onto the inner end portion (the end portion on the rotation shaft side) of the guide rail 261, thereby preventing the slider 262 from coming off the guide rail 261. With this configuration, before the movable member 241 receives the pressing force from the first holding mechanism 3, the retaining portion 28 is in contact with the inner end portion of the guide rail 261. Note that the retaining portion 28 may be configured to hook onto a member other than the guide rail 261, thereby preventing the slider 262 from coming off the guide rail 261.

[0073] The interlocking mechanism 242 includes a rotational movement portion 242a rotatably mounted on the movable member 241, a first elastic member 242b that applies an elastic force to the rotational movement portion 242a, and a first cam mechanism 242c that rotates the rotational movement portion 242a in accordance with the linear movement of the movable member 241.

[0074] The rotational movement unit 242a is provided on the holding unit 23. Specifically, the rotational movement unit 242a is provided on one end of the holding unit 23. The rotational movement unit 242a and the holding unit 23 may be configured as a single member or may be configured as separate members. The rotational movement unit 242a is rotatably connected to the movable member 241 by, for example, a hinge 242d. The rotation axis of the rotational movement unit 242a is set in a direction along the longitudinal direction of the cutting table 2A. This hinge 242d allows the rotational movement unit 242a to rotate within a range in which the holding unit 23 can move between the open position OP and the holding position HP.

[0075] The first elastic member 242b is provided between the movable member 241 and the rotational movement portion 242a, and applies an elastic force to the rotational movement portion 242a so that the pressing portion 23 is at the pressing position HP. The first elastic member 242b is a tension spring, and one end thereof is provided on the movable member 241, and the other end is provided on the rotational movement portion 242a. The first elastic member 242b causes the rotational movement portion 242a to apply an elastic force to the rotational movement portion 242a around the hinge 242d so that the pressing portion 23 is at the pressing position HP.

[0076] The first cam mechanism 242c is interposed between the cutting table 2A and the rotational movement part 242a and rotates the rotational movement part 242a in accordance with the linear movement of the movable member 241, thereby moving the presser 23 from the open position OP to the presser position HP. In this embodiment, the first cam mechanism 242c includes a first roller member 242c1 provided on the mounting block 21 of the cutting table 2A and a first roller contact part 242c2 provided on the rotational movement part 242a and in contact with the first roller member 242c1. The first roller contact part 242c2 has an inclined surface such that the presser 23 provided on the rotational movement part 242a rotates toward the presser position HP as the rotational movement part 242a moves in the direction toward the cutting table 2A. The first roller member 242c1 may be, for example, a rolling element (bearing) or bushing rotatably provided on the cutting table 2A.

[0077] Furthermore, as shown in FIGS. 3, 5, and 8 to 12, the cutting device 100 of this embodiment has a second cam mechanism 29 for applying a pressing force from the first holding mechanism 3 of the transport mechanism (loader) to the movable member 241 to linearly move the movable member 241 toward the cutting table 2A.

[0078] The second cam mechanisms 29 are provided corresponding to the four presser mechanisms 22, and operate the four presser mechanisms 22 in synchronization with the descent of the first holding mechanisms 3. When the first holding mechanisms 3 are positioned above the cutting table 2A, the second cam mechanisms 29 are interposed between the first holding mechanisms 3 and the movable member 241. When the first holding mechanisms 3 are lowered toward the cutting table 2A, the second cam mechanisms 29 move the movable member 241 linearly toward the cutting table 2A.

[0079] The second cam mechanism 29 of this embodiment has a second roller member 291 provided on the upper end of the movable member 241, and a second roller contact portion 292 provided on the base member 30 of the first holding mechanism 3 and in contact with the second roller member 291. The second roller contact portion 292 has an inclined surface that causes the movable member 241 to move toward the cutting table 2A as the first holding mechanism 3 descends. Note that the second roller member 291 may be formed, for example, by a rolling element (bearing) or bushing rotatably provided on the cutting table 2A.

[0080] As shown in Figures 5 and 8 to 12, the locking mechanism 25 has a protrusion 251 provided on the cutting table 2A and a catch 252 provided on the presser unit 23 or the rotationally moving unit 242a. The protrusion 251 in this embodiment is configured by one end of a guide rail 261 of the guide mechanism 26. The protrusion 251 may be provided separately from the guide rail 261. The catch 252 catches on the protrusion 251 due to the elastic force of the second elastic member 27 when the presser unit 23 moves to the presser position HP.

[0081] When the first holding mechanism 3 is raised while the presser 23 has moved to the presser position HP and the catch 252 is caught on the protrusion 251, the second elastic member 27 tries to move the movable member 241 in a direction away from the cutting table 2A. At this time, the catch 252 of the locking mechanism 25 is caught on the protrusion 251, so the movement of the movable member 241 in a direction away from the cutting table 2A is restricted. As a result, the locking mechanism 25 maintains the position of the presser 23 at the presser position HP.

[0082] Furthermore, the first holding mechanism 3 lifts the sealed substrate W and brings it into contact with the holding portion 23 at the holding position HP, and the sealed substrate W lifts the holding portion 23. This disengages the catch portion 252 of the locking mechanism 25, and the locking mechanism 25 releases the lock at the holding position HP. The locking mechanism 25 also releases the holding position HP from the transport mechanism (unloader) that transports the cut products (products P) cut by the cutting mechanism 4. A release member (not shown) provided on the second holding mechanism 5 of the unloader contacts the holding portion 23, and the release member lifts the holding portion 23. This disengages the catch portion 252, and the locking mechanism 25 releases the holding position HP from the holding position HP.

[0083] <Transporting Operation of Sealed Substrate W and Substrate Pressing Operation by Pressing Mechanism 22> Next, the transporting operation of the sealed substrate W and the pressing operation of the sealed substrate W by the pressing mechanism 22 of this embodiment will be described with reference to FIGS.

[0084] 9, before the sealed substrate W is transported to the cutting table 2A, the pressing portion 23 of the pressing mechanism 22 is in the open position OP. That is, the retaining portion 28 provided on the movable member 241 is hooked on the guide rail 261. In this state, the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2A, and the first holding mechanism 3 is lowered toward the cutting table 2A.

[0085] 10 , when the first holding mechanism 3 is lowered, the holding claws 31 of the first holding mechanism 3 descend within the recessed portion 20M of the table main body 20, and the sealed substrate W is transferred from the holding claws 31 to the upper surface of the table main body 20 of the cutting table 2A. When the sealed substrate W is placed on the table main body 20, the pressing members 32 of the first holding mechanism 3 press the upper surface of the sealed substrate W against the upper surface of the table main body 20. In this state, the sealed substrate W is held by suction on the table main body 20.

[0086] 11 , when the first holding mechanism 3 is further lowered, the second roller contact portion 292 of the first holding mechanism 3 comes into contact with the second roller member 291 of the movable member 241, and the movable member 241 moves toward the cutting table 2A. Note that the lowering of the first holding mechanism 3 is enabled by the holding claws 31 further descending within the recessed portion 20M of the table main body 20. As the movable member 241 moves toward the cutting table 2A, the rotational movement portion 242a moves toward the cutting table 2A. Here, the movement of the movable member 241 and the rotational movement portion 242a is along the surface of the table main body 20. When the rotational movement portion 242a moves toward the cutting table 2A, the first roller contact portion 242c2 of the rotational movement portion 242a moves while contacting the first roller member 242c1 of the cutting table 2A, and the rotational movement portion 242a rotates so that the presser portion 23 is at the presser position HP.

[0087] When the holding unit 23 moves to the holding position HP, as shown in FIG. 11 , the catch portion 252 of the locking mechanism 25 catches on one end of the guide rail 261, which is the protrusion 251, and the holding unit 23 is fixed at the holding position HP. Thereafter, the spacing between the holding claws 31 of the first holding mechanism 3 widens. Here, because the notch 23K is formed in the holding unit 23, the holding claws 31, whose spacing has widened, do not come into contact with the holding unit 23. Thereafter, as shown in FIG. 12 , when the first holding mechanism 3 is raised, an elastic force is applied to the movable member 241 by the second elastic member 27 in a direction away from the cutting table 2A, and the catch portion 252 of the locking mechanism 25 is maintained in a state of being caught on the protrusion 251. In other words, the position of the holding unit 23 is maintained at the holding position HP. With the above, transportation of the sealed substrate W and substrate holding by the holding mechanism 22 are completed. The sealed substrate W may be sucked and held by the table body 20 after the pressing portion 23 is fixed to the pressing position HP.

[0088] If the sealed substrate W is a defective product or the like and is to be transported out before being cut, the sealed substrate W is held and lifted by the first holding mechanism 3 from the state shown in Figure 10 or 11. Then, the sealed substrate W abuts against the underside of the holding part 23 at the holding position HP, and the sealed substrate W lifts the holding part 23. This disengages the catch of the catch part 252 of the locking mechanism 25, and the maintenance (lock) of the holding position HP by the locking mechanism 25 is released. Then, the second elastic member 27 moves the movable member 241 in a direction away from the cutting table 2A, and the holding part 23 moves to the open position OP.

[0089] <Example of Operation of Cutting Apparatus 100> Next, a description will be given of an example of operation of the cutting apparatus 100. In this embodiment, all operations and controls of the cutting apparatus 100, such as transporting the sealed substrate W, laser cutting the sealed substrate W, inspecting the product P, and storing the product P in a tray, are performed by the control unit CTL (see FIG. 2). Below, the operation of the cutting table 2A will be described, but the same applies to the cutting table 2B.

[0090] The substrate supply unit 10 b of the substrate supply mechanism 10 moves the sealed substrate W accommodated in the substrate accommodation unit 10 a toward the holding position RP where the sealed substrate W is held by the first holding mechanism 3 .

[0091] Next, the transport movement mechanism 6 moves the first holding mechanism 3 to the holding position RP (see FIG. 2), and the first holding mechanism 3 sucks and holds the sealed substrate W. Thereafter, the transport movement mechanism 6 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A, and the first holding mechanism 3 places the sealed substrate W on the cutting table 2A. The cutting table 2A then sucks and holds the sealed substrate W. Note that, together with this transport operation of the sealed substrate W, the substrate pressing operation by the pressing mechanism 22 is performed as described above.

[0092] In this state, the cutting movement mechanisms 8A and 8B move the cutting table 2A to a predetermined cutting position (the rear side of the transfer shaft 61). Then, the cutting movement mechanisms 8A and 8B and the processing head movement mechanism 11 relatively move the cutting table 2A and the two laser light irradiation units 41A and 41B in the X direction and the Y direction to cut and separate the sealed substrate W. Note that the cutting table 2A is rotated by the rotation mechanisms 9A and 9B as needed.

[0093] Here, as shown in FIG. 7( a), without inverting the cutting table 2A using the table inversion mechanism 18, laser light is irradiated from the laser light irradiating units 41A and 41B onto the surface of the sealed substrate W to cut a portion of the substrate W and perform a groove processing (half cut). FIG. 7( a) shows an example in which two grooves are processed between the packages to match the kerf width when cutting with a blade. After the above groove processing, as shown in FIG. 7( b), the cutting table 2A is inverted by the table inversion mechanism 18. Then, laser light is irradiated from the laser light irradiating units 41A and 41B onto the back surface of the sealed substrate W through the through-opening 2T to cut the portion grooved by the half cut and perform a complete cut (full cut). Processing waste, such as scraps, generated by this full cut falls into a processing waste storage unit (not shown) and is stored therein.

[0094] In the above-described half cut and full cut, when the laser light irradiation units 41A and 41B are moved to different cutting lines CL1 and CL2, the irradiation of laser light by the laser light irradiation units 41A and 41B is stopped. Furthermore, the reversal by the table reversal mechanism 18 may be repeated multiple times depending on the type of the sealed substrate W, the cutting process, etc.

[0095] After cutting of the sealed substrate W is completed, the cutting movement mechanisms 8A and 8B move the cutting table 2A to a predetermined transport position (on the front side of the transfer shaft 61).

[0096] Next, the transport movement mechanism 6 moves the second holding mechanism 5 to the post-cutting cutting table 2A, and the second holding mechanism 5 suction-holds the multiple products P. Thereafter, the transport movement mechanism 6 moves the second holding mechanism 5 holding the multiple products P to the first inspection unit 121. As a result, the multiple products P held by the second holding mechanism 5 are inspected on the underside (mark surface) by the first inspection unit 121.

[0097] After this inspection, the transport movement mechanism 6 moves the second holding mechanism 5 to the inversion mechanism 123 and transfers the multiple products P to the inversion mechanism 123. The inversion mechanism 123 suction-holds the marked surfaces of the multiple products P, and then inverts them. After inversion, the inversion mechanism 123 moves using the inversion movement mechanism, and the mounting surfaces of the products P are inspected by the second inspection unit 122. After double-sided inspection in this manner, the products P are transferred from the inversion mechanism 123 to the transfer table 13. The transfer table 13 on which the products P are placed is moved to the removal position X2 by the transfer movement mechanism 15. The multiple products P placed on the transfer table 13 are then sorted into various trays T by the sorting mechanism 14 according to the inspection results (good product, defective product, etc.) by the inspection unit 12.

[0098] <Effects of this embodiment> According to the cutting device 100 of this embodiment, the position of the pressing part 23 is switched from the open position OP to the pressing position HP in response to the pressing force from the first holding mechanism 3 of the transport mechanism, and the pressing part 23 is maintained at the pressing position HP by the locking mechanism 25. Therefore, without providing a driving source for each of the cutting tables 2A, 2B, the pressing part 23 can be moved to the pressing position HP to prevent the sealed substrate W adsorbed to each of the cutting tables 2A, 2B from floating up.

[0099] For example, in the case of a sealed substrate W with a large warp, simply holding the sealed substrate W by suction on each cutting table 2A, 2B will cause the edges of the sealed substrate W to lose suction and float up during cutting, etc. This will prevent the sealed substrate W from being cut accurately, resulting in a deterioration in the quality of the product P. In the cutting device 100 of this embodiment, the locking mechanism 25 maintains the pressing part 23 at the pressing position HP, so that even if the sealed substrate W has a large warp, the edges will not float up during cutting, etc., allowing the sealed substrate W to be cut accurately and preventing a deterioration in the quality of the product P.

[0100] Other Modified Embodiments The present invention is not limited to the above-described embodiments.

[0101] For example, in the first cam mechanism 242c of the above embodiment, the first roller member 242c1 is provided on each cutting table 2A, 2B, and the first roller contact portion 242c2 is provided on the rotational movement portion 242a, but the first roller member 242c1 may be provided on the rotational movement portion 242a, and the first roller contact portion 242c2 may be provided on each cutting table 2A, 2B.

[0102] Furthermore, in the second cam mechanism 29 of the above embodiment, the second roller member 291 is provided on the movable member 241 and the second roller contact portion 292 is provided on the first holding mechanism 3, but the second roller member 291 may be provided on the first holding mechanism 3 and the second roller contact portion 292 may be provided on the movable member 241.

[0103] The cutting device 100 in the above embodiment cuts the sealed substrate W by turning over the cutting tables 2A, 2B, but the sealed substrate W may be cut only from the front side without turning over the cutting tables 2A, 2B, depending on the type of sealed substrate W. Also, the cutting tables 2A, 2B may be turned over and the sealed substrate W may be cut only from the back side. Also, the cutting tables 2A, 2B may not be turned over, i.e., the cutting device 100 may not have the table turning mechanism 18.

[0104] In the sealed substrate W of the above embodiment, the cutting lines CL1 and CL2 in the adjacent dividing elements W1 and W2 are set on different straight lines, but these cutting lines CL1 and CL2 may be set on the same straight line. In this case, the multiple through openings 2T provided in each cutting table 2A and 2B are provided on the same straight line corresponding to the cutting lines CL1 and CL2. Here, the multiple through openings 2T provided on the same straight line may be combined into a single through opening.

[0105] The cutting mechanism 4 in the above embodiment cuts the sealed substrate W by irradiating it with laser light, but it may cut the sealed substrate W by using a rotary blade.

[0106] In the above embodiment, a cutting device of a twin-cut table type having two cutting tables and a twin-laser configuration having two laser light irradiation units has been described, but the invention is not limited to this and may also be a cutting device of a single-cut table type having one cutting table and a single-laser configuration having one laser light irradiation unit, or a cutting device of a single-cut table type having one cutting table and a twin-laser configuration having two laser light irradiation units.

[0107] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

[0108] According to the present invention, the workpiece attracted to the cutting table can be prevented from floating up without providing a driving source to the cutting table.

[0109] DESCRIPTION OF SYMBOLS 100: Cutting device W: Sealed substrate (object to be cut) P: Product 2A, 2B: Cutting table 2x: One surface 2y: Other surface 2T: Through opening 3: First holding mechanism (transport mechanism) 4: Cutting mechanism 41A, 41B: Laser light irradiation unit 6: Transport movement mechanism (transport mechanism) 18: Table inversion mechanism 22: Pressing mechanism 23: Pressing unit OP: Open position HP: Pressing position 24: Switching unit 241: Movable member 242: Interlocking mechanism 242a: Rotational movement unit 242b: First elastic member 242c: First cam mechanism 25: Locking mechanism 251: Protrusion 252: Hook portion 26: Guide mechanism 261: Guide rail 262: Slider 27: Second elastic member 28: Anti-pullout portion 29: Second cam mechanism

Claims

1. A cutting device comprising: a cutting table that adsorbs and holds an object to be cut onto the cutting table; a transport mechanism that transports the object to the cutting table; a press mechanism that presses down the object held on the cutting table; and a cutting mechanism that cuts the object held on the cutting table, wherein the press mechanism comprises: a press section that presses down an edge of the object to be cut; a switching section that receives a pressing force from the transport mechanism and switches the position of the press section from an open position that releases the edge to a pressing position that presses down the edge; and a locking mechanism that maintains the press section in the pressing position once set to the pressing position by the switching section.

2. The cutting device according to claim 1, wherein the switching unit comprises a movable member that receives a pressing force from the transport mechanism and moves linearly toward the cutting table, and a linkage mechanism that moves the pressing unit from the release position to the pressing position in accordance with the linear movement of the movable member.

3. The cutting device according to claim 2, wherein the interlocking mechanism comprises: a rotational movement part provided on the pressing part and rotatably connected to the movable member; a first elastic member provided between the movable member and the rotational movement part and applying an elastic force to the rotational movement part so that the pressing part is in the pressing position; and a first cam mechanism provided between the cutting table and the rotational movement part and rotating the rotational movement part in accordance with the linear movement of the movable member, thereby moving the pressing part from the release position to the pressing position.

4. A cutting device as described in claim 2 or 3, wherein the switching unit comprises: a guide mechanism provided on the cutting table for guiding the linear movement of the movable member; and a second elastic member interposed between the cutting table and the movable member for applying an elastic force to the movable member in a direction away from the cutting table; the guide mechanism has a guide rail provided on the cutting table; and a slider on which the movable member is provided and which moves along the guide rail; and the movable member is provided with a stopper portion which prevents the slider from coming off the guide rail by the second elastic member.

5. A cutting device as claimed in any one of claims 2 to 4, further comprising a second cam mechanism interposed between the transport mechanism and the movable member, which moves the movable member linearly as the transport mechanism moves up and down relative to the cutting table.

6. A cutting device as claimed in any one of claims 1 to 5, wherein the locking mechanism has a protrusion provided on the cutting table and a catch provided on the holding part that catches on the protrusion when the holding part is moved to the holding position.

7. A cutting device as claimed in any one of claims 1 to 6, wherein the locking mechanism releases the holding position when the transport mechanism lifts the object to be cut and the object to be cut lifts the holding part, or when a release member provided in a transport mechanism that transports the cut product cut by the cutting mechanism lifts the holding part.

8. A cutting device as claimed in any one of claims 1 to 7, wherein the cutting table holds the rectangular object to be cut, and the holding mechanism is provided independently on both sides of each long side of the object to be cut.

9. A cutting device according to any one of claims 1 to 8, further comprising a table inversion mechanism for inverting the cutting table, wherein the cutting mechanism has a laser light irradiating unit that irradiates laser light onto the object to be cut to cut it, the cutting table has a through opening that penetrates from one side to the other and allows the laser light to pass through, and wherein the cutting table is inverted by the table inversion mechanism while the object to be cut is held down by the holding mechanism, and the laser light is irradiated from both the front and back sides of the object to cut it.

10. A method for manufacturing cut products using the cutting device according to any one of claims 1 to 9.

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