Substrate processing system, and substrate processing system installation method

Abstract

The present invention relates to a substrate processing system and a substrate processing system installation method and, more specifically, to a substrate processing system having a combination of a substrate processing device and a substrate transfer device, and a substrate processing system installation method. According to the present invention, disclosed is a substrate processing system comprising: a processing module (100) which has an opening so that a substrate (1) is carried in and out therethrough, and which carries out substrate processing; a transfer module (200) which is installed at a position adjacent to the processing module (100) and transfers the substrate (1) between the processing module (100) and the transfer module (200); and a gate valve (500) which is installed on at least one of the processing module (100) and the transfer module (200) to open and close the opening and couples to the other one by means of magnetic force.

Description

Substrate processing system and substrate processing system installation method

[0001] The present invention relates to a substrate processing system and a method for installing a substrate processing system, and more particularly, to a substrate processing system having a combination of a substrate processing device and a substrate transport device, and a method for installing a substrate processing system.

[0002] In general, a substrate processing system includes a load lock module that introduces a substrate and switches the pressure between the outside and the inside of the substrate processing system, a substrate return device that returns the substrate introduced through the load lock module, and a substrate processing device that is installed adjacent to the substrate return device and processes the introduced substrate.

[0003] At this time, the conventional substrate processing system is installed so that the processing module of the substrate processing device and the return module of the substrate return device are connected to each other through a gate valve, and the gate valve installed at this time is generally connected to the processing module and the return module using a clamp or the like.

[0004] In the conventional substrate processing system, a number of substrate processing devices are installed in a limited space centered around a single substrate transport device. Due to the narrow working space, installation and replacement of the processing module and gate valve due to combination and separation are difficult and take a long time to perform.

[0005] In particular, in the case of a substrate processing system in which a plurality of processing modules are stacked and installed in a vertical direction and a plurality of return modules are stacked and installed correspondingly, there is a problem in that not only the space between the return module and the processing module, but also the space above and below the gate valve is very narrow, making access limited, making it difficult to install and remove the processing module.

[0006] The purpose of the present invention is to provide a substrate processing system and a substrate processing system installation method that enable easy coupling and separation between a processing module and a gate valve in order to solve the above-mentioned problems.

[0007] The present invention has been created to achieve the above-described object of the present invention, and discloses a substrate processing system including a processing module (100) in which an opening is formed to allow a substrate (1) to be loaded and unloaded and in which substrate processing is performed; a return module (200) installed at a position adjacent to the processing module (100) to return the substrate (1) between the processing module (100) and the processing module (100); and a gate valve (500) installed in at least one of the processing module (100) and the return module (200) to open and close the opening, and coupled to the other one through magnetic force.

[0008] The above processing module (100) may include a process chamber (110) that forms an internal space in which the substrate (1) is introduced and substrate processing is performed, and a magnetic body (120) installed in the process chamber (110) so as to be coupled to the gate valve (500) through magnetic force.

[0009] The above magnetic body (120) may be provided at a position adjacent to the opening on the surface of the return module (200) of the process chamber (110).

[0010] The above gate valve (500) may include a valve housing (510) installed between the processing module (100) and the return module (200), and a magnetic force generating unit (520) installed in the valve housing (510) and generating the magnetic force.

[0011] The magnetic force generating unit (520) is coupled to the processing module (100) through the magnetic force, and the gate valve (500) may include a coupling plate (530) that is provided in the valve housing (510) and coupled to the return module (200).

[0012] The above magnetic force generating unit (520) may be provided as a pair on both sides of the valve housing (510).

[0013] The magnetic force generating unit (520) above can release the magnetic force when power is applied, and maintain the magnetic force when power is not applied.

[0014] The processing module (100) is provided with one of a groove and a protrusion for alignment with the gate valve (500) on the surface facing the gate valve (500), and the gate valve (500) may be provided with the other at a position corresponding to one of the groove and the protrusion on the surface facing the processing module (100).

[0015] The above processing module (100) can be arranged in multiple vertical directions.

[0016] It may include a frame part (400) in which a plurality of arrangement spaces (S3) are formed in the vertical direction so that the above processing modules (100) can be respectively installed and secured.

[0017] The above frame part (400) may include a plurality of vertical frames (410) installed to have a vertical length, and a support frame (420) provided horizontally on the vertical frame (410) to divide the arrangement spaces (S3) in the upper and lower directions and support the processing module (100).

[0018] The above frame part (400) may include a moving rail part (430) installed on the support frame (420) so that the processing module (100) supported on the support frame (420) slides toward the processing module (200), and a moving part (440) coupled to the processing module (100) and movably installed on the moving rail part (430).

[0019] The above return module (200) can be arranged in multiple vertical directions corresponding to the plurality of processing modules (100).

[0020] In addition, the present invention discloses a method for installing a substrate processing system for installing and replacing the processing module (100) of the substrate processing system, the method including a processing module transfer step (S100) of moving the processing module (100) to align it with the gate valve (500); a magnetic coupling step (S200) of generating a magnetic force in the gate valve (500) to magnetically couple the processing module (100) and the gate valve (500); and a processing module fixing step (S400) of fixing the position of the processing module (100) after the magnetic coupling step (S200).

[0021] A vacuum pressure setting step (S300) for pumping and setting the inside of the processing module (100) to a vacuum may be additionally included between the self-coupling step (S200) and the processing module fixing step (S400).

[0022] The above magnetic coupling step (S200) can generate the magnetic force by releasing the power supply to the gate valve (500).

[0023] The above substrate processing system includes a frame portion (400) in which a placement space (S3) is formed so that the processing module (100) is installed and secured, and the processing module fixing step (S400) can fix the processing module (100) fixed to the gate valve (500) to the frame portion (400) through the magnetic coupling step (S300).

[0024] In addition, the present invention discloses a substrate processing system installation method for installing and replacing the processing module (100) of the substrate processing system, comprising: a coupling release step (S600) of releasing the magnetic force on the gate valve (500) to release the magnetic coupling between the processing module (100) and the gate valve (500); a processing module fixation release step (S700) of releasing the fixation of the processing module (100) after the coupling release step (S600); and a processing module removal step (S800) of removing the processing module (100) whose fixation has been released through the processing module fixation release step (S700).

[0025] It may include an atmospheric pressure setting step (S500) for setting the inside of the processing module (100) to atmospheric pressure before the above-mentioned de-bonding step (S600).

[0026] The above-mentioned decoupling step (S600) can prevent the generation of the magnetic force by applying power to the gate valve (500).

[0027] The above substrate processing system includes a frame portion (400) in which a placement space (S3) is formed so that the processing module (100) is installed and secured, and the processing module fixing release step (S700) can release the connection between the processing module (100) separated from the gate valve (500) and the frame portion (400) through the coupling release step (S600).

[0028] The substrate processing system and the substrate processing system installation method according to the present invention have the advantage of easy coupling and separation during installation and replacement by installing the processing module through magnetic coupling that is relatively easy to couple and separate from the gate valve.

[0029] In addition, the substrate processing system and the substrate processing system installation method according to the present invention have the advantage of being able to improve work efficiency and accuracy for the processing module by enabling installation and separation through magnetic coupling even in a relatively narrow space where a gate valve is installed between the return module and the processing module.

[0030] In particular, the substrate processing system and the substrate processing system installation method according to the present invention have the advantage of allowing easy installation and replacement of the processing module by enabling installation and separation through magnetic coupling even when the space for the installation location of the processing module is narrow and access is restricted according to the substrate processing system having a plurality of processing modules and return modules arranged in the vertical direction.

[0031] In addition, the substrate processing system according to the present invention has the advantage of solving particle issues due to friction and enabling rapid substrate return by applying a planar motor through magnetic levitation to the return module and the upper and lower return modules.

[0032] Figure 1 is a perspective view showing a substrate processing system according to the present invention.

[0033] Fig. 2 is a plan view schematically showing the substrate processing system according to Fig. 1.

[0034] Fig. 3 is a side cross-sectional view showing a cross-sectional view of the substrate processing system according to Fig. 2 in the direction of Ⅲ-Ⅲ'.

[0035] Fig. 4 is a side cross-sectional view showing a cross-sectional appearance of the substrate processing system according to Fig. 2 in the direction of Ⅳ-Ⅳ'.

[0036] Fig. 5 is a cross-sectional view showing the upper and lower transport modules of the substrate processing system according to Fig. 1.

[0037] Figures 6a and 6b are perspective views showing the installation of the frame portion of the processing module in the substrate processing system according to Figure 1.

[0038] Fig. 7 is a cross-sectional view showing the connection between the processing module and the frame part of the substrate processing system according to Fig. 1.

[0039] FIGS. 8A and 8B are side views showing before and after magnetic coupling between a processing module and a gate valve in the substrate processing system according to FIG. 1.

[0040] Fig. 9 is a perspective view showing the gate valve of the substrate processing system according to Fig. 1.

[0041] Figures 10a and 10b are conceptual diagrams showing the appearance of the magnetic force generating unit of the gate valve according to Figure 9 before and after the magnetic force is generated.

[0042] Figure 11 is a plan view showing another embodiment of a substrate processing system according to the present invention.

[0043] Figure 12 is a flowchart showing one embodiment of a method for installing a substrate processing system according to the present invention.

[0044] Figure 13 is a flowchart showing another embodiment of a method for installing a substrate processing system according to the present invention.

[0045] The substrate processing system and the substrate processing system installation method according to the present invention are described in detail with reference to the attached drawings as follows.

[0046] The substrate processing system according to the present invention, as illustrated in FIGS. 1 to 3, includes a substrate processing device (10) having a plurality of processing modules (100) arranged in an up-and-down direction; a substrate transport device (20) having a plurality of transport modules (200) arranged in an up-and-down direction corresponding to each of the processing modules (100); and an upper and lower transport module (300) that is installed to communicate with the plurality of transport modules (200) simultaneously and transports the substrate (1) in an up-and-down direction so as to transfer the substrate (1) between the transport modules (200).

[0047] Here, the substrate (1) to be processed can be understood to mean all substrates, such as substrates used in display devices such as LEDs, LCDs, and OLEDs, semiconductor substrates, solar cell substrates, and glass substrates.

[0048] In addition, any process disclosed in the related art can be applied to the process performed in the substrate processing system according to the present invention as long as it is a process for processing a substrate, and for example, processes such as deposition, etching, and heat treatment can be performed.

[0049] In addition, the substrate processing system according to the present invention may additionally include a plurality of load lock modules (30) that are installed corresponding to each of the return modules (200) in the vertical direction, as illustrated in FIG. 1, and perform at least one of bringing in the substrate (1) from the outside and taking out the substrate (1) to the outside.

[0050] In addition, the substrate processing system according to the present invention may additionally include an equipment shear module (40) of atmospheric pressure, which is arranged in front of the load lock module (30) to mutually transfer the load lock module (30) and the substrate (1).

[0051] The above load lock module (30) is installed on the side of the substrate transport device (20) described later and is configured to transport the substrate (1) to and from the outside, and various configurations are possible.

[0052] In particular, the load lock module (30) is installed corresponding to each of the return modules (200) in the vertical direction, and may be provided in multiple units as a configuration that performs at least one of bringing in a substrate (1) from the outside and taking out a substrate (1) to the outside.

[0053] More specifically, the function and use of a plurality of load lock modules (30) provided in the vertical direction can be specified so that a substrate (1) is brought in from an upper or lower layer and a substrate (1) is taken out from a lower or upper layer, thereby inducing a consistent return flow of the substrate (1).

[0054] To this end, some of the plurality of load lock modules (30) may be load lock modules for only carrying in a substrate (1) from the outside, and others may be load lock modules for only carrying out a substrate (1) from the outside.

[0055] That is, among the plurality of load lock modules (30), some may be load lock modules for bringing in the substrate (1) from the outside, and at least one of the remaining may be load lock modules for taking out the substrate (1) to the outside.

[0056] Meanwhile, unlike what was previously mentioned, it is also obvious that each load lock module (30) can perform both import and export.

[0057] In addition, the load lock module (30) is installed in a single unit adjacent to a single return module (200) to maintain vacuum pressure between the vacuum return module (200) and the equipment shear module (40) in an atmospheric pressure state arranged in front, and to mutually transfer the substrate (1).

[0058] In addition, as shown in FIG. 4, when a plurality of return modules (200) are arranged in the vertical direction, the load lock module (30) may be provided in a plurality of vertical directions corresponding to each of the plurality of return modules (200). As another example, a load lock module (30) forming a single load lock space may be provided in common with a plurality of return modules (200).

[0059] The above equipment shear module (40) is arranged in front of the load lock module (30) and is configured to have an atmospheric pressure atmosphere for mutually transferring the load lock module (30) and the substrate (1), and various configurations are possible.

[0060] For example, the equipment front end module (40) is a device for returning a substrate (1) between the outside of the EFEM (Equipment Front End Module) and a return module (200). For example, the equipment front end module (40) may include a port on which a carrier on which the substrate (1) is transported is installed, and a robot for transporting the substrate (1) between the port and the load lock module (30).

[0061] The above substrate processing device (10) is a configuration in which substrate processing such as deposition, etching, and heat treatment is performed on the substrate (1), and various configurations are possible.

[0062] The above substrate processing device (10) may be equipped with a plurality of processing modules (100) in the vertical direction. To this end, it may include a frame part (400) in which a plurality of arrangement spaces (S3) are formed in the vertical direction, and a plurality of processing modules (100) that are installed and secured in each of the arrangement spaces (S3).

[0063] The above processing module (100) is a configuration that performs processing on a substrate (1), and may be a configuration that introduces a substrate (1) therein, performs substrate processing, and transports the processed substrate (1) to a return module (200).

[0064] At this time, the processing module (100) may be arranged in multiple units in the vertical direction as one module in the frame section (400) described later, and more specifically, may be installed and seated in each vertical arrangement space (S3).

[0065] In addition, the processing module (100) can be installed in the frame (400) as a module itself for easy installation and replacement, and more specifically, it can be installed adjacent to the return module (200) and separated and released by being linearly moved in a sliding manner while being supported and secured in the frame (400).

[0066] To this end, the processing module (100) can be supported by being mounted on the moving part (440) of the frame part (400) described later, and can be linearly moved as one with the moving part (440) that linearly moves the moving rail part (430) by being connected to the moving part (440) through a fastening bolt (450).

[0067] In addition, the processing module (100) can be indirectly fixed to the support frame (420) by fastening the movable unit (440) to the support frame (420) through a fastening bolt (450) when the movable unit (440) is moved to a preset position through the movable unit (440), that is, moved to an installation position adjacent to the return module (200).

[0068] Meanwhile, as another example, it is also obvious that the processing module (100) can be directly connected to and fixed to the support frame (420) through a separate bolt (not shown).

[0069] The above frame portion (400) is configured to install and support the processing module (100), as shown in FIGS. 6a and 6b, and various configurations are possible.

[0070] That is, the frame portion (400) may be configured to have a certain height and a plurality of arrangement spaces (S3) for installing processing modules (100) in the vertical direction.

[0071] For example, the frame portion (400) may include a plurality of vertical frames (410) installed to have a vertical length, and a support frame (420) provided horizontally on the vertical frame (410) to divide the vertical arrangement spaces (S3) and support the processing module (100).

[0072] In addition, the frame part (400) may include a moving rail part (430) installed on the support frame (420) so that the processing module (100) supported on the support frame (420) slides and moves toward the return module (200), as shown in FIG. 7, and a moving part (440) coupled to the processing module (100) and movably installed on the moving rail part (430).

[0073] The above vertical frame (410) may be configured to be installed with a length in the vertical direction so that a layout space (S3) of a certain area divided on a plane is formed.

[0074] The above support frame (420) is provided horizontally on the vertical frame (410) and is configured to divide the vertical arrangement spaces (S3) and support the processing module (100), and various configurations are possible.

[0075] For example, the support frame (420) may be installed horizontally at a predetermined height of the vertical frame (410) and may be installed to connect at least two sides facing each other among a plane square formed by four vertical frames (410).

[0076] At this time, the support frame (420) may be formed with a support surface (421) that protrudes with a step toward the arrangement space (S3) so that a moving rail portion (430) is installed on the support frame (420) to support the processing module (100).

[0077] The above moving rail part (430) is configured to be installed on the support frame (420) so that the processing module (100) supported on the support frame (420) slides and moves toward the return module (200), and various configurations are possible.

[0078] For example, the above-mentioned moving rail part (430) may be a rail configuration of an LM guide formed so that the moving part (440) can move along the moving rail part (430) while the processing module (100) is supported by being coupled to the moving part (440), and may be provided as a pair on a support frame (420) facing each other to form a linear movement path in the direction of installation and removal of the processing module (100).

[0079] The above moving part (440) is configured to be coupled to the processing module (100) and movably installed on the moving rail part (430), and various configurations are possible.

[0080] For example, the moving part (440) may be configured as a bracket and moving block that can move along the moving rail part (430) and be fastened to the processing module (100) and the support frame (420).

[0081] To this end, the moving part (440) may include a moving block (441) that is movably installed on the moving rail part (430), and a fastening part (442) that extends outward from the moving block (441) and has a fastening hole (442a) formed therein so that it can be connected to the processing module (100) and the support frame (420) via a fastening bolt (450), respectively.

[0082] Meanwhile, unlike the above-described moving part (440), it is also obvious that the moving part may be configured as a moving roller that is provided to be movable along the moving rail part (430) and on which the processing module (100) is supported.

[0083] The above substrate return device (20) is configured such that a plurality of return modules (200) are provided in the vertical direction corresponding to each of the processing modules (100), and various configurations are possible.

[0084] That is, the substrate return device (20) may be configured to include a plurality of return modules (200) arranged in the vertical direction corresponding to each of a plurality of processing modules (100) provided in the vertical direction, and an installation frame (not shown) for installing the plurality of return modules (200).

[0085] The above return module (200) is arranged to be in communication with the load lock module (30) and the processing module (100), respectively, and may be configured to receive a substrate to be processed (1) from the load lock module (30) or the upper and lower return module (300) described below and deliver it to the processing module (100), and to receive a processed substrate (1) from the processing module (100) and deliver it to the load lock module (30) or the upper and lower return module (300).

[0086] At this time, the return module (200) can return the substrate (1) in a horizontal direction by magnetic levitation using a flat motor.

[0087] For example, the above-described return module (200) may include a return chamber (210) forming a first return space (S1) therein, a stator unit (220) installed in the return chamber (210) to generate electromagnetic force for magnetic levitation, and a return unit (230) that returns a substrate (1) by moving by magnetic levitation through the electromagnetic force through the stator unit (220).

[0088] The above return chamber (210) is configured to form a first return space (S1) inside, and various configurations are possible.

[0089] For example, the above-described return chamber (210) is provided corresponding to the processing module (100) described above, and can form a first return space (S1) for returning a substrate (1) while maintaining a vacuum inside.

[0090] The above stator part (220) is installed in the return chamber (210) and is configured to generate electromagnetic force for magnetic levitation, and various configurations are possible.

[0091] For example, the stator unit (220) may include a coil unit for applying electromagnetic force to the return unit (230) and a circuit unit for controlling the coil unit and receiving power from the outside.

[0092] Accordingly, the stator section (220) can apply and control electromagnetic force by controlling the coil section by receiving power from the outside through the circuit section, and accordingly, generate electromagnetic force through electromagnetic interaction with the permanent magnet within the return unit (230) and move the return unit (230) in a magnetically levitated state.

[0093] At this time, the stator part (220) may be provided in the return chamber (210) to form a travel path of the return unit (230), and for example, may be provided to form the bottom surface of the return chamber (210), so that the return unit (230) may be induced to move horizontally in a magnetically levitated state by a magnetic force formed from the bottom surface to transport the substrate (1).

[0094] The above-mentioned return unit (230) is configured to return the substrate (1) by moving by magnetic levitation through electromagnetic force via the stator unit (220), and various configurations are possible.

[0095] For example, the above-mentioned return unit (230) may include a return mover including a permanent magnet for magnetic levitation by interacting with an electromagnetic field according to a stator part (220), and a support member that is coupled to the return mover and supports the substrate (1).

[0096] At this time, the support member can be combined with the return mover and move integrally with the return mover, and can be formed as a pair to stably support the substrate (1) while minimizing the contact area with the substrate (1).

[0097] At this time, the support member is configured to support and return the substrate (1), and in particular, can mutually transfer the substrate (1) to the end effector (332) of the upper and lower transfer unit (330) described later, and in this process, can be formed so as not to overlap with the end effector (332) in the upper and lower direction in order to prevent interference with the end effector (332) and to stably transfer the substrate (1).

[0098] For example, a pair of the support members may be configured to be arranged on the outside of the end effector (332), and as another example, the pair of support members may be arranged on the inside of the end effector (332) having the pair of support members or may be arranged to be staggered from each other.

[0099] The above upper and lower transport module (300) is installed to communicate with a plurality of transport modules (200) at the same time, and is configured to transport the substrate (1) in the upper and lower directions so as to transfer the substrate (1) between the transport modules (200), and various configurations are possible.

[0100] That is, the upper and lower transport module (300) is configured to transport the substrate (1) in the upper and lower directions in order to transfer the substrate (1) between the processing modules (100) provided in the upper and lower directions, as illustrated in FIG. 5, and can be installed to be in common communication with the return modules (200) provided in the upper and lower directions corresponding to the plurality of processing modules (100).

[0101] At this time, the upper and lower transport module (300) can vertically transport the substrate (1) by using magnetic levitation through a plane motor, and for this purpose, the upper and lower transport module (300) may include an upper and lower transport chamber (310) forming a second transport space (S2) therein, an upper and lower stator unit (320) installed on at least one side wall of the upper and lower transport chamber (310) to generate an electromagnetic force for magnetic levitation, and an upper and lower transport unit (330) that transports the substrate (1) by moving up and down by magnetic levitation through the electromagnetic force through the upper and lower stator unit (320).

[0102] The above upper and lower transport chamber (310) may be configured to have a height so as to form a second transport space (S2) inside and to be commonly connected to a plurality of transport modules (200).

[0103] At this time, the upper and lower return chambers (310) may have return openings (311) formed at a height corresponding to the return modules (200) for communicating with each other.

[0104] The above upper and lower stator portion (320) is installed on at least one side wall of the upper and lower transport chamber (310) and is configured to generate electromagnetic force for magnetic levitation, and various configurations are possible.

[0105] The specific configuration of the upper and lower stator portions (320) is the same as the configuration of the stator portion (220) described above, so a duplicate description is omitted.

[0106] The above upper and lower stator portion (320) may be provided on at least one side wall of the upper and lower transport chamber (310) to form an upper and lower travel path along which the upper and lower transport unit (330) moves up and down.

[0107] That is, the upper and lower stator portion (320) may be installed on the inner wall of the upper and lower transport chamber (310), and as another example, may be provided to form one side wall of the upper and lower transport chamber (310).

[0108] The above upper and lower transport unit (330) is configured to transport the substrate (1) by magnetically levitating and moving up and down through electromagnetic force via the upper and lower stator unit (320), and various configurations are possible.

[0109] At this time, the specific configuration of the upper and lower transport unit (330) is the same as that of the above-described transport unit (230), so a duplicate description is omitted.

[0110] The above-mentioned upper and lower transport unit (330) can be arranged so that one side of the mover (331) including a permanent magnet that moves up and down through the upper and lower stator unit (320) has an opposite side that is parallel to the magnetic levitation surface of the upper and lower stator unit (320), and an end effector (332) is installed on the other side to support and transport the substrate (1).

[0111] At this time, the end effector (332) is installed to protrude horizontally from the other side of the mover and can directly or indirectly support the substrate (1) being returned by moving horizontally from the return module (200), and can return the substrate (1) in the up-and-down direction according to the up-and-down movement of the mover (331).

[0112] Meanwhile, at this time, the end effector (332) may be formed as a pair of support members so that loading and unloading of the substrate (1) can be performed smoothly, and may be formed so as not to overlap on a plane with the support member of the aforementioned return unit (230) in the return module (200) so as to give and receive the substrate (1).

[0113] Meanwhile, the aforementioned processing module (100), return module (200), and upper and lower return module (300) can maintain a vacuum state, and can be sealed and communicated with each other through opening and closing doors.

[0114] Below, the arrangement of the substrate processing system according to the present invention is described.

[0115] As shown in FIG. 1, the substrate processing system according to the present invention may have an upper and lower transport module (300) installed on one side of a single substrate transport device (20) and a substrate processing device (10) installed on at least one of the remaining sides.

[0116] More specifically, a single substrate transport device (20) forming a square shape on a plane may be centered on which an upper and lower transport module (300) may be installed on one side, and a substrate processing device (10) may be installed on each of the remaining three sides.

[0117] Meanwhile, in this case, the load lock module (30) can be installed on the same side as the side where the upper and lower transport modules (300) of the substrate transport device (20) are installed at a position adjacent to the upper and lower transport modules (300), and the equipment shear module (40) can be installed connected to the front side of the load lock module (30).

[0118] That is, the load lock module (30) is installed on one side of the substrate transport device (20) that is the same side as the side on which the upper and lower transport modules (300) are installed, so that the substrate processing device (10) can be installed on the remaining sides of the substrate transport device (20), thereby increasing the installation space of the substrate processing device (10) and the number of substrate processing devices (10) installed.

[0119] At this time, at least some of the plurality of processing modules (100) may perform different processes. For example, among the processing modules (200) included in the plurality of substrate processing devices (10) installed on each side of the substrate transport device (20), processing modules (200) provided at the same height may perform the same process, and different processes may be performed between processing modules (200) provided at different heights.

[0120] In this case, for processes that need to be performed sequentially, the first process is performed through the processing modules (100) located at the bottom, and the substrate (1) is transferred to the upper side through the corresponding return module (200) and upper and lower return modules (300), and then introduced to the processing module (100) through the return module (200) to perform the subsequent second process.

[0121] Afterwards, the processed substrate (1) can be transported to the outside via the return module (200), load lock module (30), and equipment shear module (40).

[0122] Accordingly, the substrate processing system according to the present invention has the advantage of increasing the efficiency of substrate processing and reducing the footprint of equipment for substrate processing by sequentially transmitting the substrate (1) to different processing modules (100) in the vertical direction while maintaining a vacuum without the need to transmit the substrate (1) between substrate processing systems for a complex process that needs to be performed sequentially, thereby performing substrate processing.

[0123] Hereinafter, another embodiment of a substrate processing system according to the present invention will be described in detail with reference to the attached drawings.

[0124] Among the substrate processing systems described below, the same configuration as the configuration described above is applied to the same drawing number and the same description is applied, so duplicate description is omitted.

[0125] The substrate processing system according to the present invention comprises, as illustrated in FIGS. 1 and 11, a processing module (100) in which an opening is formed to allow a substrate (1) to be loaded and unloaded and in which substrate processing is performed; a return module (200) installed at a position adjacent to the processing module (100) to return the substrate (1) between the processing module (100) and the return module (200); and a gate valve (500) installed in at least one of the processing module (100) and the return module (200) to open and close the opening, and coupled to the other one through magnetic force.

[0126] Meanwhile, the substrate processing system according to the present embodiment can be applied to a configuration that includes a substrate processing device (10) and a substrate transport device (20) as described above, and is provided with a plurality of processing modules (100) and a plurality of transport modules (200) corresponding thereto in the vertical direction, and a load lock module (30).

[0127] In addition, unlike the above, it is also obvious that the substrate processing device (10) and the substrate return device (20) can be applied to a configuration in which a single processing module (100) and a corresponding return module (200) and load lock module (30) are provided.

[0128] Therefore, the substrate processing system according to the present embodiment is not limited to a substrate processing device (10) equipped with a plurality of processing modules (100) in the vertical direction and a substrate transport device (20) equipped with a plurality of return modules (200), and may also be applied to a configuration equipped with a single processing module (100) and return module (200).

[0129] The above processing module (100) can have an opening formed to allow the substrate (1) to be loaded and unloaded, and can communicate with the return module (200) through the opening as needed to introduce the substrate (1) to be processed and unload the substrate (1) that has been processed.

[0130] Meanwhile, the above processing module (100) can be connected to the return module (200) through a gate valve (500) described later, and can be installed in an aligned manner so that the opening can be opened and closed through the gate valve (500).

[0131] At this time, the processing module (100) can be coupled with the gate valve (500) through magnetic force, and for this purpose, can include a magnetic body (120) for magnetic coupling with the gate valve (500) that generates magnetic force.

[0132] For example, the processing module (100) may include a process chamber (110) that forms an internal space in which a substrate (1) is introduced and substrate processing is performed, and a magnetic body (120) installed in the process chamber (110) to be coupled to a gate valve (500) through magnetic force.

[0133] The above process chamber (110) is configured to form a sealed internal space for processing a substrate (1) therein, and has an opening that is opened and closed through a gate valve (500) described later, so that the substrate (1) can be introduced and removed.

[0134] The above process chamber (110) has a configuration with a square bottom on a plane, and can be arranged adjacent to the return chamber (210) of the return module (200) with a gate valve (500) interposed therebetween so as to be in communication with each other.

[0135] The above magnetic body (120) is installed in the process chamber (110) to be coupled to the gate valve (500) through magnetic force, and various configurations are possible.

[0136] For example, the magnetic body (120) may be any configuration that exerts a magnetic force as a conventionally disclosed magnetic material, and a permanent magnet or a metal body having magnetism may be applied.

[0137] At this time, the magnetic body (120) may be arranged in a position facing the magnetic force generating unit (520) of the gate valve (500) described later, and may be configured to generate an attractive force according to the magnetic action with the magnetic force generating unit (520) and to magnetically couple to each other, and may be provided as a pair corresponding to a pair of magnetic force generating units (520).

[0138] That is, the magnetic body (120) may be provided as a pair at a position adjacent to the opening among the opposing surfaces of the return module (200) of the process chamber (110), for example, on both sides.

[0139] Meanwhile, the magnetic body (120) may be formed in a shape corresponding to the magnetic force generating unit (520) described later, and for example, may be formed in a rectangular shape with a square front.

[0140] In addition, the magnetic body (120) may be formed with steps that are interlocked with each other so that alignment is performed during magnetic coupling between the magnetic body (120) and the gate valve (500) for alignment between the processing module (100) and the gate valve (500).

[0141] As another example, the processing module (100) may be formed with a groove or a protrusion for setting the position so that magnetic coupling is performed after alignment with the gate valve (500) at the correct position, and the protrusion or the groove may be formed at a corresponding position of the gate valve (500).

[0142] Accordingly, the processing module (100), as shown in FIGS. 8a and 8b, can be aligned with the gate valve (500) in the fixed position while being mounted on the aforementioned frame portion (400) and moved in a sliding manner, and can be magnetically coupled with the magnetic body (120) according to the magnetic force generated by the magnetic force generating portion (520) so that coupling can be induced in the aligned state with the gate valve (500) in the fixed position.

[0143] Meanwhile, it is also obvious that the aforementioned magnetic body (120) may be omitted and the process chamber (110) itself may be provided with a magnetic body so that it can be magnetically coupled and separated from the gate valve (500).

[0144] The above return module (200) is installed at a position adjacent to the processing module (100) and is configured to return the substrate (1) between the processing module (100) and the processing module (100), and various configurations are possible.

[0145] The above return module (200) can be coupled to the gate valve (500) described later through magnetic coupling, and as another example, the processing module (100) can be connected to the gate valve (500) through physical components such as bolts and shafts as the processing module (100) is coupled to the gate valve (500) through magnetic coupling.

[0146] More specifically, the return module (200) can be fixedly connected to the gate valve (500) by engaging a bolt that penetrates the fastening hole (531) of the coupling plate (530) provided in the valve housing (510) described later.

[0147] The above gate valve (500) is installed in at least one of the processing module (100) and the return module (200) to open and close the opening, and is configured to be coupled to the other one through magnetic force, and various configurations are possible.

[0148] For example, the gate valve (500) may include a valve housing (510) installed between the processing module (100) and the return module (200), as illustrated in FIG. 9, and a magnetic force generating unit (520) installed in the valve housing (510) and generating a magnetic force.

[0149] In addition, the gate valve (500) may include a coupling plate (530) that is provided in the valve housing (510) and coupled to the return module (200).

[0150] The above valve housing (510) is installed between the processing module (100) and the return module (200), and various configurations are possible.

[0151] That is, the valve housing (510) is provided to form a sealed valve space so that the internal space of the processing module (100) and the first return space (S1) of the return module (200) are connected to each other, and an opening / closing door (540) that is driven within the valve space is provided to open or close the opening of the processing module (100).

[0152] Meanwhile, the valve housing (510) is installed between the processing module (100) and the return module (200), and a sealing member is applied between them so that the sealing of the interior and the space between the processing module (100) and the return module (200) can be maintained.

[0153] The above magnetic force generating unit (520) is installed in the valve housing (510) and is configured to generate magnetic force, and various configurations are possible.

[0154] At this time, the magnetic force generating unit (520) may be installed on the outer surface of the valve housing (510), and as another example, may be installed on the inner surface or inside of the valve housing (510).

[0155] For example, the magnetic force generating unit (520) may be positioned at a position corresponding to the magnetic body (120) of the processing module (100) in the valve housing (510) so that coupling between the processing module (100) and the gate valve (500) is performed by magnetic coupling with the magnetic body (120), and may be provided as a pair on both sides of the valve housing (510) corresponding to a pair of magnetic bodies (120).

[0156] To this end, the magnetic force generating unit (520) can generate magnetic force according to the user's intention to magnetically couple with the magnetic body (120), and prevent the generation of magnetic force to release the magnetic coupling with the magnetic body (120) and separate the processing module (100) and the gate valve (500).

[0157] At this time, the magnetic force generating unit (520) is configured such that whether or not the magnetic force is generated varies depending on whether or not power is supplied, and the magnetic force is released when power is supplied, and the magnetic force can be maintained when power is not supplied.

[0158] Meanwhile, it is also obvious that the magnetic force can be maintained when power is supplied and released when power is not supplied.

[0159] To this end, the magnetic force generating unit (520) includes a first magnetic body (521) that maintains the same magnetic field direction, as shown in FIGS. 10a and 10b, and a second magnetic body (522) whose magnetic field direction changes depending on the application of power, and when power is not applied, the magnetic field direction of the second magnetic body (522) is arranged to be the same as that of the first magnetic body (521), thereby generating a magnetic force of attraction that pulls the magnetic body (120) depending on the strengthened magnetic field direction.

[0160] Meanwhile, when power is supplied, the magnetic field direction of the second magnetic body (522) is changed by 180 degrees according to the applied current, thereby inducing the direction to be opposite to the magnetic field direction of the first magnetic body (521), thereby limiting the magnetic action between the first magnetic body (521) and the second magnetic body (522), thereby suppressing the magnetic action with the magnetic body (120).

[0161] In this case, the magnetic force generating unit (520) may be configured to change the direction of the magnetic field induced in the second magnetic body (522) by using the current according to the power supply, and as another example, a configuration may be applied to change the direction of the magnetic field by changing the physical position of the second magnetic body (522) through a rotating body such as a motor according to the power supply.

[0162] Meanwhile, the first magnetic body (521) and the second magnetic body (522) described above can be applied as permanent magnets.

[0163] The above-mentioned coupling plate (530) is provided in the valve housing (510) and is configured to be coupled to the return module (200), and various configurations are possible.

[0164] For example, the above-mentioned coupling plate (530) is a plate provided in the valve housing (510), and has a fastening hole formed therein to physically couple with the return module (200), so that it can be coupled to the return module (200) through bolt fastening.

[0165] In this way, the gate valve (500) can maintain a coupled state with the return module (200).

[0166] Meanwhile, as described above, the gate valve (500) may be provided with a protrusion or groove on the surface facing the processing module (100) corresponding to the groove or protrusion formed on the surface facing the gate valve (500) of the processing module (100) for alignment with the processing module (100).

[0167] The substrate processing system described above can be applied by providing a gate valve (500) between a single processing module (100) and a return module (200), and in particular, can be applied to a configuration in which a plurality of processing modules (100) and return modules (200) are installed in the vertical direction by providing a plurality of gate valves (500).

[0168] At this time, when a plurality of processing modules (100) are arranged in the vertical direction by being installed on the frame (400), when installing and removing the processing modules (100) for the first time and replacing them, the working space is narrow and the access area is limited due to the application of the processing modules (100) in a stacked form within a limited space. Therefore, there is an advantage in that the installation and replacement of the processing modules (100) is easy by applying the magnetic coupling and release between the gate valve (500) and the processing modules (100).

[0169] Hereinafter, a method for installing a substrate processing system for installing and replacing a substrate processing system processing module according to the present invention will be described in detail with reference to the attached drawings.

[0170] The method for installing a substrate processing system according to the present invention includes, as illustrated in FIG. 12, a processing module transfer step (S100) of moving the processing module (100) and aligning it with the gate valve (500); a magnetic coupling step (S200) of generating a magnetic force in the gate valve (500) to magnetically couple the processing module (100) and the gate valve (500); and a processing module fixing step (S400) of fixing the position of the processing module (100) after the magnetic coupling step (S200).

[0171] In addition, the method for installing a substrate processing system according to the present invention may additionally include a vacuum pressure setting step (S300) for pumping and setting the inside of the processing module (100) to a vacuum between the self-coupling step (S200) and the processing module fixing step (S400).

[0172] The above processing module transfer step (S100) may be a step of moving the processing module (100) and aligning it with the gate valve (500).

[0173] For example, in the above processing module transfer step (S100), the processing module (100) can be mounted on the moving part (440) on the frame part (400) and the moving part (440) and the processing module (100) can be connected by fastening them using a fastening bolt (450).

[0174] In addition, the above processing module transfer step (S100) can position the processing module (100) adjacent to the return module (200), i.e. aligned with the gate valve (500), by moving the moving unit (440) along the moving rail unit (430) while the moving unit (440) and the processing module (100) are combined.

[0175] Meanwhile, the processing module transfer step (S100) can align the position between the processing module (100) and the gate valve (500) to the correct position by positioning the processing module (100) adjacent to the gate valve (500) by moving it through the moving part (440) so that the aforementioned protrusion is inserted into the groove.

[0176] Thereafter, in the above processing module transfer step (S100), the processing module (100) can be connected to the gate valve (500) by connecting various connection cables to be connected to the processing module (100) while the processing module (100) is positioned adjacent to the gate valve (500), thereby completing preliminary preparations for connection with the gate valve (500).

[0177] The above magnetic coupling step (S200) may be a step of generating a magnetic force in the gate valve (500) to magnetically couple the processing module (100) and the gate valve (500).

[0178] That is, the magnetic coupling step (S200) can be used to magnetically couple the magnetic body (120) of the processing module (100) and the magnetic force generating unit (520) by releasing the power supply to the magnetic force generating unit (520) of the gate valve (500) to generate a magnetic force, thereby primarily coupling the processing module (100) and the gate valve (500).

[0179] At this time, the magnetic coupling step (S200) can generate magnetic force by releasing the power supply to the gate valve (500) as described above.

[0180] The above vacuum pressure setting step (S300) may be a step of setting the inside of the processing module (100) to a vacuum by pumping between the self-coupling step (S200) and the processing module fixing step (S400).

[0181] That is, the above vacuum pressure setting step (S300) may be a step of forming a vacuum pressure by pumping the internal space inside the process chamber (100), thereby strengthening the adhesion due to the vacuum pressure formed between the processing module (100) and the gate valve (500), and forming the inside of the processing module (100) with a vacuum pressure similar to the process environment.

[0182] Meanwhile, the vacuum pressure setting step (S300) may be performed after the self-coupling step (S200) described above, and, of course, may also be performed before the self-coupling step (S200) as needed.

[0183] The above processing module fixing step (S400) may be a step of fixing the position of the processing module (100) after the self-coupling step (S200).

[0184] At this time, the processing module fixing step (S400) is a step of fixing the processing module (100) fixed to the gate valve (500) through the self-coupling step (S300) to the frame part (400), and by fixing the moving part (440) to the support frame (420) of the frame part (400) through the fixing bolt (450), the processing module (100) can be fixed to the frame part (400) and its position can be fixed.

[0185] In addition, the substrate processing system installation method according to the present invention includes, as illustrated in FIG. 13, a coupling release step (S600) of releasing the magnetic force on the gate valve (500) to release the magnetic coupling between the processing module (100) and the gate valve (500); a processing module fixing release step (S700) of releasing the fixation of the processing module (100) after the coupling release step (S600); and a processing module removal step (S800) of removing the processing module (100) whose fixation has been released through the processing module fixing release step (S700).

[0186] In addition, the method for installing a substrate processing system according to the present invention may include an atmospheric pressure setting step (S500) for setting the inside of the processing module (100) to atmospheric pressure before the debonding step (S600), as illustrated in FIG. 13.

[0187] The above atmospheric pressure setting step (S500) may be a step of weakening the sealing force between the processing module (100) and the gate valve (500) by setting the internal space of the processing module (100) to be removed to atmospheric pressure.

[0188] In addition, the atmospheric pressure setting step (S500) can complete the preparatory step by disconnecting and removing various connection cables connected to the processing module (100) to be removed before the uncoupling step (S600) described later.

[0189] The above-mentioned decoupling step (S600) may be a step of releasing the magnetic force on the gate valve (500) to release the magnetic coupling between the processing module (100) and the gate valve (500).

[0190] That is, the above-mentioned decoupling step (S600) may be a step of separating the iron processing module (100) and the gate valve (500) by releasing the magnetic force on the gate valve (500), and for example, may be performed by preventing the generation of magnetic force by applying power to the gate valve (500).

[0191] Accordingly, power can be continuously applied to the gate valve (500) during the subsequent processing module release step (S700) to prevent the generation of magnetic force.

[0192] The above processing module fixing release step (S700) may be a step of releasing the fixation of the processing module (100) after the uncoupling step (S600).

[0193] That is, the above processing module fixing release step (S700) can release the connection between the frame part (400) of the processing module (100) separated from the gate valve (500) through the coupling release step (S600).

[0194] More specifically, the above processing module fixing release step (S700) can release the position fixation of the processing module (100) by removing the fastening bolt (450) fastened between the moving part (440) and the support frame (420) to remove the connection between the moving part (440) and the support frame (420).

[0195] The above processing module removal step (S800) is a step for removing the processing module (100) that has been released through the processing module release step (S700). The processing module (100) can be removed by moving the moving part (440) along the moving rail part (430) in the opposite direction to the return module (200) to transfer the processing module (100) to the outside, and removing the fastening bolt (450) fastened between the moving part (440) and the processing module (100).

[0196] As described above, a new processing module (100) to be replaced can be installed in place of the processing module (100) removed, and the processing module (100) can be replaced and installed according to the installation method described above.

[0197]

[0198] The above is only a description of some of the preferred embodiments that can be implemented by the present invention, and as is well known, the scope of the present invention should not be construed as being limited to the above embodiments, and the technical ideas of the present invention described above and the technical ideas that are fundamental to the present invention are all included in the scope of the present invention.

Claims

1. A processing module (100) in which an opening is formed to allow a substrate (1) to be loaded and unloaded and in which substrate processing is performed; A return module (200) installed at a position adjacent to the processing module (100) and returning the substrate (1) between the processing module (100) and the processing module (100); A substrate processing system characterized by including a gate valve (500) installed in at least one of the processing module (100) and the return module (200) to open and close the opening, and coupled with the other one through magnetic force.

2. In claim 1, The above processing module (100) is A substrate processing system characterized by including a process chamber (110) forming an internal space in which the substrate (1) is introduced and substrate processing is performed, and a magnetic body (120) installed in the process chamber (110) so as to be coupled to the gate valve (500) through magnetic force.

3. In claim 2, The above magnetic material (120) is A substrate processing system characterized in that it is provided at a position adjacent to the opening among the surfaces of the return module (200) of the process chamber (110).

4. In claim 1, The above gate valve (500) is A substrate processing system characterized by including a valve housing (510) installed between the processing module (100) and the return module (200), and a magnetic force generating unit (520) installed in the valve housing (510) and generating the magnetic force.

5. In claim 4, The above magnetic force generating unit (520) is It is coupled to the above processing module (100) through the magnetic force, The above gate valve (500) is A substrate processing system characterized by including a coupling plate (530) provided in the valve housing (510) and coupled to the return module (200).

6. In claim 4, The above magnetic force generating unit (520) is A substrate processing system characterized in that a pair is provided on both sides of the above valve housing (510).

7. In claim 4, The above magnetic force generating unit (520) is A substrate processing system characterized in that the magnetic force is released when power is applied and the magnetic force is maintained when power is not applied.

8. In claim 1, The above processing module (100) is One of a groove and a protrusion for alignment with the gate valve (500) is provided on the surface facing the gate valve (500). The above gate valve (500) is A substrate processing system characterized in that one of the grooves and the protrusions on the surface facing the processing module (100) is provided at a position corresponding to the other.

9. In claim 1, The above processing module (100) is A substrate processing system characterized by having multiple substrates arranged in an up-down direction.

10. In claim 9, A substrate processing system characterized by including a frame portion (400) in which a plurality of arrangement spaces (S3) are formed in the vertical direction so that the above processing modules (100) are respectively installed and secured.

11. In claim 10, The above frame part (400) is A substrate processing system characterized by including a plurality of vertical frames (410) installed to have a vertical length, and a support frame (420) provided horizontally on the vertical frames (410) to divide the arrangement spaces (S3) in the upper and lower directions and support the processing module (100).

12. In claim 11, The above frame part (400) is A substrate processing system characterized by including a moving rail part (430) installed on the support frame (420) so that the processing module (100) supported on the support frame (420) slides toward the processing module (200), and a moving part (440) coupled to the processing module (100) and movably installed on the moving rail part (430).

13. In claim 9, The above return module (200) is A substrate processing system characterized in that a plurality of processing modules (100) are arranged in a vertical direction corresponding to the above.

14. A substrate processing system installation method for installing and replacing the processing module (100) of the substrate processing system according to claim 1, A processing module transfer step (S100) for moving the above processing module (100) and aligning it with the gate valve (500); A magnetic coupling step (S200) that generates the magnetic force in the gate valve (500) to magnetically couple the processing module (100) and the gate valve (500); A method for installing a substrate processing system, characterized in that it includes a processing module fixing step (S400) for fixing the position of the processing module (100) after the self-coupling step (S200).

15. In claim 14, A method for installing a substrate processing system, characterized in that it additionally includes a vacuum pressure setting step (S300) for pumping and setting the inside of the processing module (100) to a vacuum between the self-coupling step (S200) and the processing module fixing step (S400).

16. In claim 14, The above self-coupling step (S200) is A method for installing a substrate processing system, characterized in that the magnetic force is generated by releasing the power supply to the gate valve (500).

17. In claim 14, The above substrate processing system, It includes a frame part (400) in which a placement space (S3) is formed so that the above processing module (100) can be installed and secured. The above processing module fixing step (S400) is A method for installing a substrate processing system, characterized in that the processing module (100) fixed to the gate valve (500) is fixed to the frame portion (400) through the self-coupling step (S300).

18. A substrate processing system installation method for installing and replacing the processing module (100) of the substrate processing system according to claim 1, A coupling release step (S600) for releasing the magnetic force on the gate valve (500) to release the magnetic coupling between the processing module (100) and the gate valve (500); A processing module fixing release step (S700) for releasing the fixation of the processing module (100) after the above-mentioned debonding step (S600); A method for installing a substrate processing system, characterized in that it includes a processing module removal step (S800) for removing the processing module (100) that has been released through the processing module release step (S700).

19. In claim 18, A method for installing a substrate processing system, characterized in that it includes an atmospheric pressure setting step (S500) for setting the inside of the processing module (100) to atmospheric pressure before the above-mentioned debonding step (S600).

20. In claim 18, The above-mentioned decoupling step (S600) is A method for installing a substrate processing system characterized in that the generation of the magnetic force is prevented by applying power to the gate valve (500).

21. In claim 18, The above substrate processing system, It includes a frame part (400) in which a placement space (S3) is formed so that the above processing module (100) can be installed and secured. The above processing module release step (S700) is A method for installing a substrate processing system, characterized in that the coupling between the frame part (400) of the processing module (100) separated from the gate valve (500) is released through the coupling release step (S600).

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