Speaker module and electronic device comprising same

The speaker module design with a first and second magnet configuration and conductive wire path addresses the issue of reduced magnetic strength in thin devices, maintaining sound quality and reducing module thickness.

WO2026005247A1PCT designated stage Publication Date: 2026-01-02SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2025/005632
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-09
Filing Date
2025-04-25
Publication Date
2026-01-02

AI Technical Summary

Technical Problem

As electronic devices become thinner, the magnetic strength of speaker modules decreases, leading to a loss of sound pressure and output characteristics.

Method used

A speaker module design incorporating a first magnet surrounded by a second magnet, with a conductive wire forming an electrical path between the coil and external electrode through the space between the diaphragm and frame, enhancing magnetic field efficiency.

Benefits of technology

The design increases magnetic field efficiency, maintaining sound pressure and output characteristics while allowing the speaker module to be slimmed down.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to one embodiment of the present invention, a speaker module may comprise: a yoke forming one surface of the speaker module; a diaphragm forming the other surface of the speaker module; a frame forming a side surface of the speaker module; a first magnet disposed between the yoke and the diaphragm; a second magnet substantially surrounding the first magnet and spaced apart from the first magnet; a coil attached to an area of the diaphragm substantially corresponding to a space between the first magnet and the second magnet; and conductive wiring for providing power to the coil, wherein the conductive wiring may include a first wiring portion extending from the coil toward the frame, a second wiring portion extending from the first wiring portion toward the yoke, and a third wiring portion extending from the second wiring portion toward the frame.
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Description

Speaker module and electronic device including same

[0001] Embodiments of the present disclosure relate to a speaker module and an electronic device including the same.

[0002] As electronic devices become more sophisticated, they are increasingly equipped with electronic components that perform a variety of functions. One example of such components is a speaker module for sound output. A speaker module utilizes a surround sound chamber embedded in a diaphragm to facilitate air vibration, converting electrical signals generated by the electronic device into audible sound signals that can be heard by the user.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] Meanwhile, as electronic devices become thinner, the thickness of speaker modules may also be required to be thinner. In this case, the magnetic circuitry constituting the speaker may become thinner, which may result in a loss of magnetic strength relative to the speaker module's magnetic field, thereby degrading the speaker module's output characteristics (e.g., sound pressure).

[0005] A speaker module according to various embodiments of the present disclosure may include a first magnet for securing magnetic force and a second magnet substantially surrounding the first magnet and positioned spaced apart from the first magnet. The speaker module may include a conductive wire (e.g., a flexible circuit board and / or a rigid circuit board) for connecting a coil included in the speaker module and an external electrode. The conductive wire included in the speaker module may form an electrical path connecting the coil and the external electrode through a space between the surround of the diaphragm and the frame, in an external space of the second magnet.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing and a speaker module accommodated in the housing. The speaker module according to one embodiment may include a yoke forming one side of the speaker module, a diaphragm forming the other side of the speaker module, a frame forming a side surface of the speaker module, a first magnet disposed between the yoke and the diaphragm, a second magnet substantially surrounding the first magnet and disposed spaced apart from the first magnet, a coil attached to a region of the diaphragm substantially corresponding to a space between the first magnet and the second magnet, and a conductive wire for providing power to the coil. The conductive wire of the speaker module according to one embodiment may include a first wiring portion extending from the coil toward the frame, a second wiring portion extending from the first wiring portion toward the yoke, and a third wiring portion extending from the second wiring portion toward the frame.

[0007] A speaker module according to one embodiment of the present disclosure may include a yoke forming one side of the speaker module, a diaphragm forming the other side of the speaker module, a frame forming a side surface of the speaker module, a first magnet disposed between the yoke and the diaphragm, a second magnet substantially surrounding the first magnet and disposed spaced apart from the first magnet, a coil attached to a region of the diaphragm substantially corresponding to a space between the first magnet and the second magnet, and a conductive wire for providing power to the coil. The conductive wire of the speaker module according to one embodiment may include a first wiring portion extending from the coil toward the frame, a second wiring portion extending from the first wiring portion toward the yoke, and a third wiring portion extending from the second wiring portion toward the frame.

[0008] The speaker module and the electronic device including the same according to various embodiments of the present disclosure include a first magnet and a second magnet substantially surrounding the first magnet and spaced apart from the first magnet, thereby increasing magnetic field efficiency and reducing deterioration of output characteristics (e.g., sound pressure) of the speaker module.

[0009] The speaker module and electronic device including the same according to various embodiments of the present disclosure can contribute to slimming down the speaker module by forming an electrical path connecting the coil and the external electrode through the space between the surround and the frame of the diaphragm to the external space of the second magnet using conductive wiring (e.g., a flexible circuit board and / or a rigid circuit board).

[0010] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0011] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0013] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 2B is a perspective view of the rear surface of the electronic device of FIG. 2A, according to one embodiment of the present disclosure.

[0015] FIG. 3 is an exploded perspective view of the electronic device of FIGS. 2A and 2B according to one embodiment of the present disclosure.

[0016] FIG. 4 is an exploded perspective view of a speaker module according to one embodiment of the present disclosure.

[0017] FIG. 5 is a drawing for explaining the arrangement of a coil, a first conductive plate portion, a second conductive plate portion, a first magnet, and / or a second magnet of a speaker module according to one embodiment of the present disclosure.

[0018] FIG. 6A is a cross-sectional view schematically showing the configuration of a speaker module according to one embodiment of the present disclosure.

[0019] FIG. 6b is a diagram illustrating a speaker module according to one embodiment of the present disclosure.

[0020] FIG. 6c is a drawing for explaining conductive wiring of a speaker module according to one embodiment of the present disclosure.

[0021] FIG. 7 is a drawing for explaining the effective area of ​​a diaphragm of a speaker module according to one embodiment of the present disclosure.

[0022] FIG. 8 is a drawing for explaining a first conductive plate portion and / or a second conductive plate portion of a speaker module according to one embodiment of the present disclosure.

[0023] FIG. 9 is a drawing for explaining a first magnet and / or a second magnet of a speaker module according to one embodiment of the present disclosure.

[0024] FIG. 10 is a cross-sectional view schematically showing the configuration of a speaker module according to one embodiment of the present disclosure.

[0025] FIG. 11 is an explanatory drawing showing a second conductive plate portion of a speaker module according to one embodiment of the present disclosure.

[0026] FIG. 12 is a graph comparing the output of speaker modules according to one embodiment of the present disclosure.

[0027] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0028] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] FIG. 2A is a perspective view of the front of an electronic device (200) according to one embodiment of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device (200) of FIG. 2A according to one embodiment of the present disclosure.

[0052] According to various embodiments, the electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (101) of FIG. 1 or may include other embodiments of the electronic device.

[0053] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIGS. 2A and 2B . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0054] In the illustrated embodiment, the front plate (202) may include a first region (210D) extending seamlessly from the first surface (210A) toward the rear plate (211), at both ends of a long edge of the front plate (202). In the illustrated embodiment (e.g., see FIG. 2B), the rear plate (211) may include a second region (210E) extending seamlessly from the second surface (210B) toward the front plate (202), at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region (210D) and the second region (210E), and may only include a flat plane that is arranged parallel to the second side (210B). In the above embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0055] According to one embodiment, the electronic device (200) may include at least one of a display (201) (e.g., a display module (160) of FIG. 1), an input device (203) (e.g., an input module (150) of FIG. 1), an audio output device (207, 214) (e.g., an audio output module (155) of FIG. 1), a sensor module (204, 219) (e.g., a sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., a camera module (180) of FIG. 1), a key input device (217), an indicator (not shown), and a connector (208) (e.g., a connection terminal (178) of FIG. 1). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0056] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0057] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0058] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). The fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (201) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0059] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0060] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0061] An indicator (not shown) may be disposed, for example, on a first surface (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0062] The connector hole (208) may include a connector hole that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0063] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, some of the camera modules (205), some of the sensor modules (204), or indicators may be arranged to be exposed to the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and some of the camera modules (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of some camera modules (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, some camera modules (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device (200). For example, in such a case, an area of ​​the display (201) facing some sensor modules (204) may not require a perforated opening.

[0064] According to one embodiment, the electronic device (200) has a bar type or plate type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be a part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms “foldable electronic device,” “slidable electronic device,” “stretchable electronic device,” and / or “rollable electronic device” may refer to an electronic device in which a display (e.g., the display (330) of FIG. 3) is capable of bending deformation, such that at least a portion thereof is folded, wound, or rolled, at least a portion thereof is expanded, and / or the electronic device can be accommodated inside a housing (e.g., the housing (210) of FIGS. 2A and 2B). Foldable electronic devices, slideable electronic devices, stretchable electronic devices, and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display (330) or exposing a wider area of ​​the display (330) to the outside, depending on the user's needs.

[0065] FIG. 3 is an exploded perspective view of the electronic device (200) of FIGS. 2A and 2B according to one embodiment of the present disclosure.

[0066] According to various embodiments, the electronic device (200) of FIG. 3 may be at least partially similar to the electronic device (101) of FIG. 1 or the electronic device (200) of FIGS. 2A and 2B, or may include other embodiments of the electronic device.

[0067] Referring to FIG. 3, the electronic device (200) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or a support structure), a front plate (320) (e.g., a front cover) (e.g., the front plate (202) of FIG. 2A), a display (330) (e.g., the display (201) of FIG. 2A), a printed circuit board (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover) (e.g., the rear plate (211) of FIG. 2B). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIGS. 2A and 2B, and any overlapping description will be omitted below.

[0068] The first support member (311) may be disposed inside the electronic device (200) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340) coupled to the other surface. The printed circuit board (340) may be equipped with a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), and / or an interface (e.g., an interface (177) of FIG. 1).

[0069] The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0070] The memory may include, for example, volatile memory (e.g., volatile memory (132) of FIG. 1) or non-volatile memory (e.g., non-volatile memory (134) of FIG. 1).

[0071] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0072] A battery (350) (e.g., battery (189) of FIG. 1) is a device for supplying power to at least one component of an electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, a printed circuit board (340). The battery (350) may be integrally disposed within the electronic device (200). In another embodiment, the battery (350) may be disposed so as to be detachable from the electronic device (200).

[0073] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure (310) and / or the first support member (311).

[0074] FIG. 4 is an exploded perspective view of a speaker module (400) according to one embodiment of the present disclosure.

[0075] Referring to FIG. 4, a speaker module (400) (e.g., an audio output module (155) of FIG. 1) may include a frame (460) (e.g., a housing), a diaphragm (420), a conductive wiring (430), a coil (440), a first conductive plate portion (445), a second conductive plate portion (450), a first magnet (465), a second magnet (470), an air vent, and / or a yoke (490).

[0076] In one embodiment, the frame (460) (e.g., a housing) may form a side surface of the speaker module (400). For example, the frame (460) may form an outer surface (e.g., a side wall) of the speaker module (400). For example, the frame (460) may be made of plastic, but is not limited thereto.

[0077] In one embodiment, the diaphragm (420) may include a surround (410) (or edge, or peripheral area) that expands the vibration area and contributes to efficient air vibration. The surround (410) may have a shape that facilitates vibration of the diaphragm (420). The surround (410) may be formed adjacent to and along the edge of the diaphragm (420). The diaphragm (420) may include a center cap (415) positioned substantially corresponding to the coil (440). For example, the center cap (415) may contribute to determining the directionality of sound waves. The center cap (415) may serve to prevent foreign substances such as dust from entering the interior of the coil (440).

[0078] In one embodiment, the diaphragm (420) may be implemented as an integral form including a surround (410) and a center cap (415). For example, the surround (410) and the center cap (415) may be formed integrally. However, this is not limited thereto.

[0079] In one embodiment, the diaphragm (420) may be coupled with a coil (440). For example, the diaphragm (420) may be arranged with the coil (440) mounted on its inner surface. In one embodiment, the diaphragm (420) may be configured to output sound toward a speaker hole (e.g., speaker hole (207, 214) of FIG. 2A) of an electronic device (e.g., electronic device (101) of FIG. 1, electronic device (200) of FIGS. 2A to 3). The diaphragm (420) may generate sound by vibrating together with the coil (440). The diaphragm (420) may be formed of a thin film.

[0080] In one embodiment, the yoke (490) can secure the first magnet (465) and the second magnet (470). In one embodiment, the yoke (490) can be made of a material that conducts magnetic force well. For example, the yoke (490) can be made of a cobalt alloy (FeCo), but is not limited thereto.

[0081] In one embodiment, the first magnet (465) and the second magnet (470) may be positioned between the yoke (490) and the diaphragm (420). For example, the first magnet (465) and the second magnet (470) may be mounted on the yoke (490) to form a magnetic field. In another example, the first magnet (465) and the second magnet (470) may be positioned to be supported by the yoke (490). Preferably, the yoke (490) may be positioned (or arranged) on the opposite side of the diaphragm (420), as illustrated in FIG. 4.

[0082] In one embodiment, the first magnet (465) and the second magnet (470) may include, but are not limited to, neodymium magnets, alnico magnets, or ferrite magnets, for example.

[0083] In one embodiment, the first magnet (465) may be positioned in a central region of the speaker module (400). The second magnet (470) may substantially surround the first magnet (465) and may be positioned spaced apart from the first magnet (465). For example, the second magnet (470) may have a closed-loop structure or an annular structure.

[0084] In one embodiment, the first magnet (465) and the second magnet (470) can cause the coil (440) to vibrate up and down according to Fleming's left-hand rule.

[0085] In one embodiment, the coil (440) may be disposed on the inner surface of the diaphragm (420). The coil (440) may be configured by winding a conductor around at least one axis disposed on the inner surface of the diaphragm (420). The coil (440) may vibrate the diaphragm (420) by an electric signal applied from the outside.

[0086] In one embodiment, the first conductive plate portion (445) can be disposed at a position corresponding to the first magnet (465) in a first direction (e.g., in the z-axis direction). For example, the first conductive plate portion (445) can be disposed on a first side (e.g., a side facing the z-axis direction) of the first magnet (465). The second conductive plate portion (450) can be disposed at a position corresponding to the second magnet (470) in the first direction (e.g., in the z-axis direction). For example, the second conductive plate portion (450) can be disposed on a first side (e.g., a side facing the z-axis direction) of the second magnet (470). For example, the second conductive plate portion (450) can substantially surround the first conductive plate portion (445) and be disposed spaced apart from the first conductive plate portion (445). For example, the second conductive plate portion (450) may have a closed loop structure or annular structure.

[0087] In one embodiment, the first conductive plate portion (445) and the second conductive plate portion (450) can perform the function of collecting the magnetic field generated from the first magnet (465) and the second magnet (470).

[0088] In one embodiment, the first conductive plate portion (445) and the second conductive plate portion (450) may be composed of a material that conducts magnetic force well. For example, the first conductive plate portion (445) and the second conductive plate portion (450) may be composed of a cobalt alloy (FeCo).

[0089] In one embodiment, the first conductive plate portion (445) and the second conductive plate portion (450) may, together with the yoke (490), the first magnet (465), and the second magnet (470), form a magnetic circuit of the speaker module (400). For example, the first conductive plate portion (445), the second conductive plate portion (450), the yoke (490), the first magnet (465), and the second magnet (470) may form a magnetic circuit of the speaker module (400) to maximize the magnetic field density at a location where the coil (440) is disposed. For example, the magnetic flux generated from the first magnet (465) and the second magnet (470) may form a magnetic flux path that enters the yoke (490) through the first conductive plate portion (445) and the second conductive plate portion (450).

[0090] In one embodiment, the first conductive plate portion (445), the first magnet (465), and the yoke (490) may be configured to not be ventilated to the outside.

[0091] In one embodiment, although not shown, an air vent may allow air to be vented to a first surface (e.g., a surface facing the z-axis) of the diaphragm (420) to ensure smooth vibration.

[0092] In one embodiment, the conductive wiring (430) can electrically connect the coil (440) to an external electrode (e.g., an external power terminal). For example, the conductive wiring (430) can electrically connect the coil (440) to the external electrode through a space between the surround (410) of the diaphragm (420), which is an external space of the second magnet (470) (e.g., a protruding area of ​​the surround (410)), and the frame (460). The external electrode can include a component arranged on a printed circuit board (e.g., the board (340) of FIG. 3) arranged outside the speaker module (400). The conductive wiring (430) can provide power to the coil (440).

[0093] In one embodiment, the conductive wiring (430) may include a flexible printed circuit board (FPCB) and / or a rigid flexible printed circuit board.

[0094] FIG. 5 is a drawing for explaining the arrangement of a coil (440), a first conductive plate portion (445), a second conductive plate portion (450), a first magnet (465), and / or a second magnet (470) of a speaker module (400) according to one embodiment of the present disclosure.

[0095] Referring to FIG. 5, FIG. 5 according to one embodiment <510> This is a drawing of a coil (e.g., coil (440) of FIG. 4), a first magnet (e.g., first magnet (465) of FIG. 4), and a second magnet (e.g., second magnet (470) of FIG. 4) viewed from the rear (e.g., the side facing the -z axis) of a speaker module (e.g., speaker module (400) of FIG. 4).

[0096] In one embodiment, the first magnet (465) may be formed in a central region of the speaker module (400) when viewed from the rear side (e.g., the side facing the -z-axis) of the speaker module (400). The second magnet (470) may substantially surround the first magnet (465) and be positioned spaced apart from the first magnet (465). For example, the second magnet (470) may have a closed-loop structure or an annular structure.

[0097] In one embodiment, when the coil (440), the first magnet (465), and the second magnet (470) are viewed from the rear side (e.g., the side facing the -z-axis) of the speaker module (400), the coil (440) may be structured to be at least partially disposed in the space (440a) between the first magnet (465) and the second magnet (470).

[0098] FIG. 5 according to one embodiment <530> This is a drawing of the speaker module (400) as viewed from the front (e.g., the side facing the z-axis) of the silver, coil (440), second conductive plate portion (e.g., second conductive plate portion (450) of FIG. 4), and yoke (e.g., yoke (490) of FIG. 4).

[0099] In one embodiment, when the coil (440), the second conductive plate portion (450), and the yoke (490) are viewed from the front side (e.g., the side facing the z-axis) of the speaker module (400), the second conductive plate portion (450) may be positioned to overlap the yoke (490).

[0100] In one embodiment, when the coil (440), the second conductive plate portion (450), and the yoke (490) are viewed from the front side (e.g., the side facing the z-axis) of the speaker module (400), the second conductive plate portion (450) may be arranged to surround the outer peripheral surface of the coil (440).

[0101] FIG. 5 according to one embodiment <550> This is a drawing of the coil (440), the first conductive plate portion (e.g., the first conductive plate portion (445) of FIG. 4), and the yoke (490) viewed from the front side (e.g., the side facing the z-axis) of the speaker module (400).

[0102] In one embodiment, when the coil (440), the first conductive plate portion (445), and the yoke (490) are viewed from the front side (e.g., the side facing the z-axis) of the speaker module (400), the first conductive plate portion (445) may be arranged to surround the inner peripheral surface of the coil (440) (or the outer peripheral surface of the first conductive plate portion (445)).

[0103] FIG. 5 according to one embodiment <570> This is a side view of the first conductive plate portion (445), the second conductive plate portion (450), the first magnet (465), and the second magnet (470).

[0104] In one embodiment, the first conductive plate portion (445) may be arranged to overlap the first magnet (465) in a first direction (e.g., in the z-axis direction), and the second conductive plate portion (450) may be arranged to overlap the second magnet (470) in the first direction (e.g., in the z-axis direction).

[0105] FIG. 6a is a cross-sectional view schematically illustrating the configuration of a speaker module (400) according to one embodiment of the present disclosure. FIG. 6b is a diagram illustrating a speaker module (400) according to one embodiment of the present disclosure. FIG. 6c is a diagram for explaining conductive wiring (430) of a speaker module (400) according to one embodiment of the present disclosure.

[0106] FIG. 6A according to one embodiment is a side view (e.g., a side facing the y-axis) of a speaker module (e.g., a speaker module (400) of FIG. 4). FIG. 6B according to one embodiment is a rear view of the speaker module (400).

[0107] Referring to FIGS. 6A and 6B, the speaker module (400) may include a frame (460) that forms a side (e.g., an outer shape) of the speaker module (400).

[0108] In one embodiment, the speaker module (400) may include a yoke (490) that forms one side (e.g., a side facing the -z-axis) of the speaker module (400). In one embodiment, the yoke (490) may secure a first magnet (e.g., the first magnet (465) of FIG. 4) and a second magnet (470). For example, the yoke (490) may be formed of a material that conducts magnetic force well, such as a cobalt alloy (FeCo).

[0109] In one embodiment, the first magnet (465) may be positioned in the central region of the speaker module (400). The second magnet (470) may substantially surround the first magnet (465) and may be positioned spaced apart from the first magnet (465). For example, the second magnet (470) may have a closed-loop structure or an annular structure.

[0110] In one embodiment, the speaker module (400) may include a frame (460) (e.g., a housing), a diaphragm (420), a conductive wiring (430), a second conductive plate portion (450), a second magnet (470), and / or a yoke (490). Although not shown, the speaker module (400) may further include a coil (440), a first conductive plate portion (445), a first magnet (465), and / or an air vent (not shown).

[0111] In one embodiment, the second conductive plate portion (450) can be disposed at a position corresponding to the second magnet (470) in the first direction (e.g., the direction toward the z-axis). The second conductive plate portion (450) can substantially surround the first conductive plate portion (e.g., the first conductive plate portion (445) of FIG. 4) and can be disposed spaced apart from the first conductive plate portion (445). In one embodiment, the second conductive plate portion (450) can be formed of a material that conducts magnetic force well, for example, a cobalt alloy (FeCo).

[0112] In one embodiment, although not shown, the speaker module (400) may include a coil (e.g., coil (440) of FIG. 4). For example, the coil (440) may be attached to an area of ​​the diaphragm (420) that substantially corresponds to the space between the first magnet (465) and the second magnet (470). In one embodiment, the coil (440) may vibrate the diaphragm (420) by an electrical signal applied from the outside.

[0113] In one embodiment, the diaphragm (420) may include a surround (410) and a center cap (415). For example, the center cap (415) may be positioned corresponding to the coil (440) in a first direction (e.g., toward the z-axis). The center cap (415) may contribute to determining the directionality of sound waves. The surround (410) may be formed adjacent to and along an edge of the diaphragm (420). In one embodiment, the surround (410) may include a protruding region (615) formed to protrude in a second direction (e.g., along the -z-axis direction) along the edge of the diaphragm (420).

[0114] In one embodiment, the conductive wire (430) can electrically connect the coil (440) to an external electrode (e.g., an electrode disposed externally of the speaker module (400)). For example, the conductive wire (430) can provide power to the coil (440).

[0115] In one embodiment, the conductive wiring (430) can electrically connect the coil (440) and the external electrode through a space between the protruding area of ​​the surround (410) of the diaphragm (420), which is an external space of the second magnet (470), and the frame (460). For example, the conductive wiring (430) can include a first wiring portion (4301), a second wiring portion (4302), and a third wiring portion (4303). The first wiring portion (4301) of the conductive wiring (430) can be connected to a portion of the coil (440) and coupled to at least a portion of the center cap (415) of the diaphragm (420). For example, at least a portion (4301) of the conductive wiring (430) can be coupled to at least a portion of the center cap (415) of the diaphragm (420) through bonding or printing. The first wiring portion (4301) of the conductive wiring (430) can extend from the coil (440) toward the frame (460).

[0116] In one embodiment, the second wiring portion (4302) of the conductive wiring (430) may extend from the first wiring portion (4301) toward the yoke (490).

[0117] In one embodiment, the third wiring portion (4303) of the conductive wiring (430) can extend from the second wiring portion (4302) toward the frame (460).

[0118] In one embodiment, the first wiring portion (4301), the second wiring portion (4302), and the third wiring portion (4303) of the conductive wiring (430) may be formed of a flexible material.

[0119] Not limited thereto, at least a portion of the first wiring portion (4301) and the third wiring portion (4303) of the conductive wiring (430) may be formed of a rigid material. For example, at least a portion of the first wiring portion (4301) and the third wiring portion (4303) of the conductive wiring (430) may be formed of a rigid material. In one embodiment, the third wiring portion (4303) may include a 3-1 wiring portion (43031), a 3-2 wiring portion (43032), and a 3-3 wiring portion (43033). The 3-1 wiring portion (43031) may be a portion extending from the 2nd wiring portion (4302) toward the frame (460). The 3-2 wiring portion (43032) may be a portion that extends from the 3-1 wiring portion (43031) (e.g., extends in the x-axis direction) and may be a portion that extends toward the frame (460) to have a length longer than the length of the 3-1 wiring portion (43031). The 3-3 wiring portion (43033) may be a portion that extends from the 3-2 wiring portion (43032) (e.g., extends in the x-axis direction) and is connected to an external electrode.

[0120] In one embodiment, at least a portion of the first wiring portion (4301) and the third wiring portion (4303) of the conductive wiring (430) (e.g., the 3-1 wiring portion (43031) and the 3-3 wiring portion (43033)) may be formed of a rigid material. For example, at least a portion of the first wiring portion (4301) and the third wiring portion (4303) of the conductive wiring (430) (e.g., the 3-1 wiring portion (43031) and the 3-3 wiring portion (43033)) may be formed of a rigid material so as not to come into contact with the magnets (e.g., the first magnet (465) and the second magnet (470)) and / or the conductive plate portions (e.g., the first conductive plate portion (445) and the second conductive plate portion (450)) due to the vibration of the diaphragm (420). For example, at least a portion of the first wiring portion (4301) and the third wiring portion (4303) of the conductive wiring (430) (e.g., the 3-1 wiring portion (43031) and the 3-3 wiring portion (43033)) may be a region that is bonded (or fixed) (e.g., bonded or printed) to at least a portion of the diaphragm (420), and thus may be formed of a rigid material. However, the present invention is not limited thereto, and at least a portion of the first wiring portion (4301) and the third wiring portion (4303) of the conductive wiring (430) (e.g., the 3-1 wiring portion (43031) and the 3-3 wiring portion (43033)) may also be formed of a flexible material.

[0121] In one embodiment, at least another portion (e.g., the 3-2 wiring portion (43032)) of the second wiring portion (4302) and the third wiring portion (4303) of the conductive wiring (430) may be formed of a flexible material. For example, at least another portion (e.g., the 3-2 wiring portion (43032)) of the second wiring portion (4302) and the third wiring portion (4303) may be a region that is not coupled (or fixed) to at least a portion of the diaphragm (420), and thus may be formed of a flexible material. Forming the region that is not coupled (or fixed) to at least a portion of the diaphragm (420), which is the second wiring portion (4302) and the third wiring portion (4303) of the conductive wiring (430), of a flexible material may be advantageous in the design and manufacturing processes.

[0122] In one embodiment, a peripheral area (e.g., surround (410)) of the diaphragm (420) may include a protruding area (615) protruding toward the yoke (490). At least a portion of the second wiring portion (4302) of the conductive wiring (430) may be positioned opposite the frame (460) with respect to the protruding area (615). In one embodiment, at least a portion of the third wiring portion (4303) of the conductive wiring (430) may be formed below the protruding area (615).

[0123] In the aforementioned FIGS. 6A and 6B according to various embodiments, the second wiring portion (4302) of the conductive wiring (430) is described as extending from the first wiring portion (4301) toward the yoke (490), and the third wiring portion (4303) of the conductive wiring (430) is described as extending from the second wiring portion (4302) toward the frame (460), but is not limited thereto.

[0124] Specifically, in one embodiment, the first wiring portion (4301) may extend from the coil (440) toward the frame (460). In one embodiment, the second wiring portion (4302) may extend from an end (4301a) of the first wiring portion (4301) that is distant from (or spaced apart from) the coil (440) toward the yoke (490). In one embodiment, the third wiring portion (4303) may extend from an end (4302a) of the second wiring portion (4302) that is distant from (or spaced apart from) the first wiring portion (4301) toward the frame (460).

[0125] For example, referring to FIGS. 6b and 6c, the second wiring portion (4302) of the conductive wiring (430) may include an extension portion (43021) that extends in a direction substantially parallel to one side of the second magnet (470) that the second wiring portion (4302) faces (e.g., in the y-axis direction) and includes a portion formed lower than the lowest point height of the protruding area (615) of the surround (410). In this case, the third wiring portion (4303) may also extend from the extension portion (43021) toward the frame (460) (e.g., in the x-axis direction).

[0126] According to one embodiment, the coil (440) and the external electrode can be electrically connected using conductive wiring (430) (e.g., the first wiring portion (4301), the second wiring portion (4302), and the third wiring portion (4303)) without interfering with the movement of the diaphragm (420) through the space between the protruding area of ​​the surround (410) of the diaphragm (420), which is the external space of the second magnet (470), and the frame (460). Accordingly, it can contribute to the slimming of the speaker module (400). In addition, by including the first magnet (465) and the second magnet (470) arranged in a form that substantially surrounds the first magnet (465), the magnetic field efficiency can be increased, so that the acoustic performance of the speaker module (400) can be improved.

[0127] FIG. 7 is a drawing for explaining the effective area of ​​a vibration plate (420) of a speaker module (400) according to one embodiment of the present disclosure.

[0128] As described in various embodiments, as shown in FIGS. 4, 5, and 6A, a conductive wire (e.g., a conductive wire (430) of FIG. 4) can electrically connect a coil (e.g., a coil (440) of FIG. 4)) and an external electrode (e.g., an electrode disposed outside the speaker module (400). For example, the conductive wire (430) can connect the coil (440) and the external electrode through a space between a protruding area of ​​a surround (e.g., a surround (410) of FIG. 4) formed to protrude in a second direction (e.g., a -z-axis direction) along an edge of a diaphragm (e.g., a diaphragm (420) of FIG. 4), which is an external space of a second magnet (e.g., a second magnet (470) of FIG. 4), and a frame (e.g., a frame (460) of FIG. 4). However, the present invention is not limited thereto.

[0129] Referring to FIG. 7 according to one embodiment, at least a portion of a center cap (e.g., the center cap (415) of FIG. 4) of a diaphragm (420) that is coupled with at least a portion of a conductive wiring (430) (e.g., the first wiring portion (4301) of the conductive wiring (430) of FIG. 6A) may be at least a portion of an effective area (710) of the diaphragm (420). In one embodiment, at least another portion of the conductive wiring (430) (e.g., the second wiring portion (4302), the third wiring portion (4303)) may be bent in a second direction (e.g., the -z-axis direction) and a third direction (e.g., the x-axis direction) by a specified length from one end of the at least a portion of the effective area (710) of the diaphragm (420) to be electrically connected to an external electrode.

[0130] FIG. 8 is a drawing for explaining a first conductive plate portion (445) and / or a second conductive plate portion (450) of a speaker module (400) according to one embodiment of the present disclosure.

[0131] In one embodiment, the first conductive plate portion (e.g., the first conductive plate portion (445) of FIG. 4) and / or the second conductive plate portion (e.g., the second conductive plate portion (450) of FIG. 4) may include steps to increase magnetic field efficiency (or magnetic field density).

[0132] Referring to FIG. 8, the first conductive plate portion (445) and / or the second conductive plate portion (450) may be formed of a material that conducts magnetic force well. For example, the material that conducts magnetic force well may include a cobalt alloy (FeCo), but is not limited thereto.

[0133] In one embodiment, the first conductive plate portion (445) and / or the second conductive plate portion (450) may include a step. For example, in FIG. 8 <810> As illustrated, the first conductive plate portion (445) may include a first step (815) formed along the outer peripheral surface of the first conductive plate portion (445) (e.g., formed in the outer edge region). For another example, FIG. 8 <850> As illustrated, the second conductive plate portion (450) may include a second step (855) formed along an inner peripheral surface of the second conductive plate portion (450) (e.g., formed in an inner edge region).

[0134] In one embodiment, the first conductive plate portion (445) includes a first step (815), and / or the second conductive plate portion (450) includes a second step (855), thereby contributing to an increase in the efficiency of the magnetic field of the magnetic field lines or magnetic circuit (e.g., the first conductive plate portion (445), the second conductive plate portion (450), the first magnet (465), the second magnet (470), and the yoke (490)) generated by interaction with the coil (440) to reduce the deterioration of the output characteristics (e.g., sound pressure) of the speaker module (400).

[0135] In FIG. 8 according to various embodiments, the first conductive plate portion (445) and / or the second conductive plate portion (450) are described as including steps (e.g., the first step (815) and / or the second step (855)), but are not limited thereto. For example, the first magnet (e.g., the first magnet (465) of FIG. 4) and / or the second magnet (e.g., the second magnet (470) of FIG. 4) of the speaker module (400) may include steps to increase magnetic field efficiency (or magnetic field density). In this regard, various embodiments will be described in FIG. 9 described below.

[0136] FIG. 9 is a drawing for explaining the first magnet (465) and / or the second magnet (470) of the speaker module (400) according to one embodiment of the present disclosure.

[0137] Referring to FIG. 9, the first magnet (465) may be arranged in a central region of the speaker module (400) when viewed from the rear side (e.g., the side facing the -z axis) of the speaker module (e.g., the speaker module (400) of FIG. 4). The second magnet (470) may substantially surround the first magnet (465) and may be arranged to be spaced apart from the first magnet (465). For example, the second magnet (470) may have a closed-loop structure or annular structure. For example, the second magnet (470) may have a closed-loop structure or annular structure and may have a circular, square, oval, or track-shaped shape.

[0138] In one embodiment, when viewed from the rear (e.g., the side facing the -z-axis) of the speaker module (400), the coil (e.g., the coil (440) of FIG. 4) may be at least partially disposed in the space (440a) between the first magnet (465) and the second magnet (470).

[0139] In one embodiment, the first magnet (465) and the second magnet (470) may be mounted on a yoke (e.g., the yoke (490) of FIG. 4). The first magnet (465) and the second magnet (470) may form a magnetic field to cause the coil (440) to vibrate up and down.

[0140] In one embodiment, the first magnet (465) and / or the second magnet (470) may include steps to increase magnetic field efficiency (or magnetic field density).

[0141] For example, in Fig. 9 <910> As illustrated, the first magnet (465) may include a protruding region (4655) formed in the central region of the first magnet (465). In this case, the first conductive plate portion (445) positioned to correspond to the first magnet (465) may include an opening (4455) formed to correspond to the protruding region (4655) formed in the central region of the first magnet (465).

[0142] For example, in Fig. 9 <950> As illustrated, the second magnet (470) may include a step (4705) formed along the outer peripheral surface of the second magnet (470). In this case, the second conductive plate portion (450) arranged to correspond to the second magnet (470) may be formed to be arranged on one side of the second magnet (470) (e.g., one side having a height lower than the height of the step (4705) formed along the outer peripheral surface of the second magnet (470)).

[0143] In one embodiment, the first magnet (465) includes a protruding area (4655), and / or the second magnet (470) includes a step (4705), thereby contributing to an increase in the efficiency of the magnetic field of the magnetic field lines or magnetic circuit (e.g., the first conductive plate portion (445), the second conductive plate portion (450), the first magnet (465), the second magnet (470), and the yoke (490)) generated by interaction with the coil (440) to reduce the deterioration of the output characteristics (e.g., sound pressure) of the speaker module (400).

[0144] FIG. 10 is a cross-sectional view schematically showing the configuration of a speaker module (400) according to one embodiment of the present disclosure.

[0145] Referring to Fig. 10, Fig. 10 <1010> and <1050> is a drawing of a speaker module (e.g., speaker module (400) of FIG. 4) viewed from the side (e.g., the side facing the y-axis).

[0146] In one embodiment, the speaker module (400) may include a frame (460), a diaphragm (420), a conductive wire (430), a coil (440), a first conductive plate portion (445), a second conductive plate portion (450), a first magnet (465), a second magnet (470), and / or a yoke (490). Although not shown, the speaker module (400) may further include a conductive wire (e.g., the conductive wire (430) of FIG. 4) and an air vent (not shown).

[0147] In one embodiment, the yoke (490) may form one side (e.g., a side facing the -z-axis) of the speaker module (400). In one embodiment, the yoke (490) may secure the first magnet (465) and the second magnet (470). For example, the yoke (490) may be formed of a material that conducts magnetic force well, such as a cobalt alloy (FeCo).

[0148] In one embodiment, the first magnet (465) may be positioned in the central region of the speaker module (400). The second magnet (470) may substantially surround the first magnet (465) and may be positioned spaced apart from the first magnet (465). For example, the second magnet (470) may have a closed-loop structure or an annular structure.

[0149] In one embodiment, the first conductive plate portion (445) can be disposed at a position corresponding to the first magnet (465) in a first direction (e.g., toward the z-axis). The second conductive plate portion (450) can be disposed at a position corresponding to the second magnet (470) in the first direction (e.g., toward the z-axis). The second conductive plate portion (450) can substantially surround the first conductive plate portion (445) and be disposed spaced apart from the first conductive plate portion (445). In one embodiment, the second conductive plate portion (450) can be formed of a material that conducts magnetic force well, for example, a cobalt alloy (FeCo).

[0150] In one embodiment, the coil (440) may be disposed on the inner surface of the diaphragm (420). In one embodiment, the coil (440) may vibrate the diaphragm (420) by an electrical signal applied from the outside. In one embodiment, the coil (440) is configured to vibrate in a direction perpendicular to the plane of the diaphragm (420), and during the vibration, the coil may at least partially enter the space (440a) defined between the first magnet (465) and the second magnet (470). This configuration (or arrangement) may also facilitate slimming of the speaker module (400). As described above, when not generating sound, the coil (440) may be at least partially located in the space (440a). In this case, the range in which the coil (440) is located in the space (440a) when generating sound may be changed.

[0151] In one embodiment, the diaphragm (420) may include a surround (410) and a center cap (415). For example, the center cap (415) may be positioned at a position corresponding to the coil (440) in a first direction (e.g., toward the z-axis). The center cap (415) may contribute to determining the directionality of sound waves. The surround (410) may be formed adjacent to and along an edge of the diaphragm (420). In one embodiment, the surround (410) may include a protruding region (e.g., a protruding region (615) of FIG. 6A) formed to protrude in a second direction (e.g., in the -z-axis direction) along the edge of the diaphragm (420).

[0152] In one embodiment, although not shown, the conductive wiring (430) may electrically connect the coil (440) and an external electrode (e.g., an electrode disposed outside the speaker module (400). For example, the conductive wiring (430) may electrically connect the coil (440) and the external electrode through a space between the protruding area (615) of the surround (410) of the diaphragm (420), which is an external space of the second magnet (470), and the frame (460).

[0153] In one embodiment, the first conductive plate portion (445), the second conductive plate portion (450), the first magnet (465), the second magnet (470), and the yoke (490) of the speaker module (400) may constitute a magnetic circuit of the speaker module (400). For example, the first conductive plate portion (445), the second conductive plate portion (450), the first magnet (465), the second magnet (470), and the yoke (490) may constitute a magnetic circuit of the speaker module (400) and serve to maximize the magnetic field density at a location where the coil (440) is disposed.

[0154] In FIG. 4 according to various embodiments, among the components constituting the magnetic circuit of the speaker module (400), the first conductive plate portion (445), the first magnet (465), and the yoke (490) are described as being configured not to be ventilated to the outside, but are not limited thereto. For example, in FIG. 10 <1010> As shown in , among the components constituting the magnetic circuit of the speaker module (400), a part of the first magnet (465) and a part (1015) of the first conductive plate portion (445) may be removed. In this case, the inside of the speaker module (400) may not be ventilated to the outside by the yoke (490). For another example, in FIG. 10 <1050> As shown in , among the components constituting the magnetic circuit of the speaker module (400), only a part (1055) of the first conductive plate portion (445) may be removed. In this case, the interior of the speaker module (400) may not be ventilated to the outside by the first magnet (465) and the yoke (490).

[0155] FIG. 11 is a drawing for explaining a second conductive plate portion (450) of a speaker module (400) according to one embodiment of the present disclosure.

[0156] In various embodiments, the second conductive plate portion (e.g., the second conductive plate portion (450) of FIG. 4) is described as having a closed loop structure or annular structure in FIGS. 4 to 10, but is not limited thereto.

[0157] For example, referring to FIG. 11, the second conductive plate portion (450) may be composed of two or more conductive plate portions. For example, a speaker module (e.g., speaker module (400) of FIG. 4) may include two or more plates, for example, a second-first conductive plate portion (4501) and a second-second conductive plate portion (4503). The second-first conductive plate portion (4501) and the second-second conductive plate portion (4503) may be spaced apart from each other with a space (1105, 1110) therebetween.

[0158] FIG. 12 is a graph comparing the output of a speaker module (400) according to one embodiment of the present disclosure.

[0159] Referring to FIG. 12, the x-axis may represent a frequency band (Hz) (1205), and the y-axis may represent a sound pressure level (SPL) (dB) (1210).

[0160] In one embodiment, graph 1215 is a graph representing the sound pressure of a general speaker module, and graph 1220 is a graph representing the sound pressure of a speaker module (e.g., speaker module (400) of FIG. 4) according to one embodiment of the present disclosure.

[0161] As described above with reference to FIGS. 4 to 11, the speaker module (400) according to one embodiment can contribute to slimming down the speaker module (400) by forming a path for electrically connecting a coil (e.g., a coil (440) of FIG. 4) and an external electrode (e.g., an electrode disposed on the outside of the speaker module (400)) through a space between a surround (e.g., a surround (410) of FIG. 4) (e.g., a protruding area (615) of FIG. 6A) of the surround (410)) and a frame (e.g., a frame (460) of FIG. 4)) to an external space of a second magnet (e.g., a second magnet (470) of FIG. 4) using a conductive wire (e.g., a conductive wire (430) of FIG. 4), thereby contributing to slimming down the speaker module (400).

[0162] Even when the speaker module (400) is slimmed down according to one embodiment of the present disclosure, the magnetic efficiency can be increased by including the first magnet (465) and the second magnet (470), and accordingly, as shown in graph 1220 of FIG. 12, the output characteristics (e.g., sound pressure) of the speaker module (400) can be increased (e.g., the sound pressure can be increased by about 1 dB) compared to graph 1215.

[0163] A speaker module (400) according to one embodiment of the present disclosure may include a yoke (490) forming one side of the speaker module (400). A speaker module (400) according to one embodiment may include a diaphragm (420) forming the other side of the speaker module (400). A speaker module (400) according to one embodiment may include a frame (460) forming a side surface of the speaker module (400). A speaker module (400) according to one embodiment may include a first magnet (465) disposed between the yoke (490) and the diaphragm (420). A speaker module (400) according to one embodiment may include a second magnet (470) substantially surrounding the first magnet (465) and disposed spaced apart from the first magnet (465). A speaker module (400) according to one embodiment may include a coil (440) attached to an area of ​​a diaphragm (420) substantially corresponding to a space between a first magnet (465) and a second magnet (470). A speaker module (400) according to one embodiment may include a conductive wire (430) for providing power to the coil (440). A conductive wire (430) according to one embodiment may include a first wire portion (4301) extending from the coil (440) toward the frame (460). A conductive wire (430) according to one embodiment may include a second wire portion (4302) extending from the first wire portion (4301) toward the yoke (490). According to one embodiment, the conductive wiring (430) may include a third wiring portion (4303) extending from the second wiring portion (4302) toward the frame (460).

[0164] According to one embodiment, the first wiring portion (4301), the second wiring portion (4302), and the third wiring portion (4303) of the conductive wiring (430) may be formed of a flexible material.

[0165] According to one embodiment, the first wiring portion (4301) of the conductive wiring (430) and at least a portion (43031, 43033) of the third wiring portion (4303) may be formed of a rigid material or a flexible material. According to one embodiment, the second wiring portion (4302) of the conductive wiring (430) and at least another portion (43032) of the third wiring portion (4303) may be formed of a flexible material.

[0166] The peripheral area of ​​the vibration plate (420) according to one embodiment may include a protruding area (615) protruding toward the yoke (490). At least a portion of the second wiring portion (4302) of the conductive wiring (430) according to one embodiment may be positioned opposite the frame (460) with respect to the protruding area (615).

[0167] At least a portion of the third wiring portion (4303) of the conductive wiring (430) according to one embodiment may be formed under the protruding region (615).

[0168] The second wiring portion (4302) of the conductive wiring (430) according to one embodiment may include an extension portion (43021) that extends in a direction substantially parallel to one side of the second magnet (470) that the second wiring portion (4302) faces and includes a portion formed lower than the lowest point height of the protruding region (615). The third wiring portion (4303) of the conductive wiring (430) according to one embodiment may extend from the extension portion (43021) of the second wiring portion (4302) toward the frame (460).

[0169] A speaker module (400) according to one embodiment may include a first conductive plate portion (445) arranged on a side opposite to a yoke (490) of a first magnet (465). A speaker module (400) according to one embodiment may include a second conductive plate portion (450) arranged on a side opposite to a yoke (490) of a second magnet (470) and surrounding the first conductive plate portion (445).

[0170] According to one embodiment, the first conductive plate portion (445) and the second conductive plate portion (450) may be spaced apart.

[0171] According to one embodiment, at least one of the first conductive plate portion (445) or the second conductive plate portion (450) may include a step (815, 855) formed in an edge area of ​​at least one of the first conductive plate portion (445) or the second conductive plate portion (450).

[0172] According to one embodiment, the second magnet (470) may have a closed loop shape.

[0173] According to one embodiment, the first magnet (465) may include a protruding region (4655) formed in the central region of the first magnet (465).

[0174] A second magnet (470) according to one embodiment may include a step (4705) formed along an edge area of ​​the second magnet (470).

[0175] An electronic device (101, 200) according to one embodiment of the present disclosure may include a housing (210) and a speaker module (400) accommodated in the housing (210). The speaker module (400) according to one embodiment may include a yoke (490) forming one side of the speaker module (400). The speaker module (400) according to one embodiment may include a diaphragm (420) forming the other side of the speaker module (400). The speaker module (400) according to one embodiment may include a frame (460) forming a side surface of the speaker module (400). The speaker module (400) according to one embodiment may include a first magnet (465) arranged between the yoke (490) and the diaphragm (420). A speaker module (400) according to one embodiment may include a second magnet (470) substantially surrounding a first magnet (465) and spaced apart from the first magnet (465). A speaker module (400) according to one embodiment may include a coil (440) attached to an area of ​​a diaphragm (420) substantially corresponding to a space between the first magnet (465) and the second magnet (470). A speaker module (400) according to one embodiment may include a conductive wire (430) for providing power to the coil (440). A conductive wire (430) according to one embodiment may include a first wire portion (4301) extending toward a frame (460) from the coil (440). The conductive wiring (430) according to one embodiment may include a second wiring portion (4302) extending from the first wiring portion (4301) toward the yoke (490). The conductive wiring (430) according to one embodiment may include a third wiring portion (4303) extending from the second wiring portion (4302) toward the frame (460).

[0176] According to one embodiment, the first wiring portion (4301), the second wiring portion (4302), and the third wiring portion (4303) of the conductive wiring (430) may be formed of a flexible material.

[0177] According to one embodiment, the first wiring portion (4301) of the conductive wiring (430) and at least a portion (43031, 43033) of the third wiring portion (4303) may be formed of a rigid material or a flexible material. According to one embodiment, the second wiring portion (4302) of the conductive wiring (430) and at least another portion (43032) of the third wiring portion (4303) may be formed of a flexible material.

[0178] The peripheral area of ​​the vibration plate (420) according to one embodiment may include a protruding area (615) protruding toward the yoke (490). At least a portion of the second wiring portion (4302) of the conductive wiring (430) according to one embodiment may be positioned opposite the frame (460) with respect to the protruding area (615).

[0179] At least a portion of the third wiring portion (4303) of the conductive wiring (430) according to one embodiment may be formed under the protruding region (615).

[0180] The second wiring portion (4302) of the conductive wiring (430) according to one embodiment may include an extension portion (43021) that extends in a direction substantially parallel to one side of the second magnet (470) that the second wiring portion (4302) faces and includes a portion formed lower than the lowest point height of the protruding region (615). The third wiring portion (4303) of the conductive wiring (430) according to one embodiment may extend from the extension portion (43021) of the second wiring portion (4302) toward the frame (460).

[0181] A speaker module (400) according to one embodiment may include a first conductive plate portion (445) arranged on a side opposite to a yoke (490) of a first magnet (465). A speaker module (400) according to one embodiment may include a second conductive plate portion (450) arranged on a side opposite to a yoke (490) of a second magnet (470) and surrounding the first conductive plate portion (445).

[0182] According to one embodiment, the first conductive plate portion (445) and the second conductive plate portion (450) may be spaced apart.

[0183] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0184] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0185] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. In one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0186] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0187] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0188] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

In the speaker module (400), A yoke (490) forming one side of the speaker module (400); A diaphragm (420) forming the other side of the speaker module (400) opposite to one side of the speaker module (400); A frame (460) forming a side surface of the speaker module (400) and positioned between the one surface and the other surface; A first magnet (465) placed between the yoke (490) and the vibration plate (420); A second magnet (470) substantially surrounding the first magnet (465) and positioned spaced apart from the first magnet (465); A coil (440) attached to an area of ​​the vibration plate (420) substantially corresponding to the space between the first magnet (465) and the second magnet (470); and Contains a conductive wire (430) for providing power to the above coil (440), The above conductive wiring (430) is A first wiring portion (4301) extending from the coil (440) toward the frame (460), A second wiring portion (4302) extending from the end (4301b) of the first wiring portion (4301) toward the yoke (490), and A speaker module including a third wiring portion (4303) extending from an end (4302b) of the second wiring portion (4302) toward the frame (460). In the first paragraph, A speaker module in which the first wiring portion (4301), the second wiring portion (4302), and the third wiring portion (4303) are formed of a flexible material. In the first paragraph, The first wiring portion (4301) and at least a portion (43031, 43033) of the third wiring portion (4303) are formed of a rigid material or a flexible material, and A speaker module in which at least another portion (43032) of the second wiring portion (4302) and the third wiring portion (4303) are formed of a flexible material. In any one of claims 1 to 3, The peripheral area of ​​the above vibration plate (420) includes a protruding area (615) protruding toward the yoke (490), and A speaker module, wherein at least a portion of the second wiring portion (4302) is positioned opposite the frame (460) with respect to the protruding area (615). In paragraph 4, A speaker module, wherein at least a portion of the third wiring portion (4303) is formed below the protruding area (615). In paragraph 4, The second wiring portion (4302) includes an extension portion (43021) that extends in a direction substantially parallel to one side of the second magnet (470) that the second wiring portion (4302) faces, and includes a portion formed lower than the lowest point height of the protruding area (615), and The third wiring portion (4303) is a speaker module that extends from the extension portion (43021) toward the frame (460). In any one of claims 1 to 6, A first conductive plate portion (445) arranged on one side opposite to the yoke (490) of the first magnet (465); and It further includes a second conductive plate portion (450) surrounding the first conductive plate portion (445) and arranged on one side opposite to the yoke (490) of the second magnet (470), The first conductive plate portion (445) and the second conductive plate portion (450) are spaced apart, and A speaker module, wherein at least one of the first conductive plate portion (445) or the second conductive plate portion (450) includes a step (815, 855) formed in an edge area of ​​at least one of the first conductive plate portion (445) or the second conductive plate portion (450). In any one of claims 1 to 7, The first magnet (465) includes a protruding area (4655) formed in the central area of ​​the first magnet (465), The second magnet (470) includes a step (4705) formed along the edge area of ​​the second magnet (470), and The above second magnet (470) is a speaker module having a closed loop shape. In electronic devices (101, 200), Housing (210); and A speaker module (400) accommodated in the housing (210) is included, and the speaker module (400) comprises: A yoke (490) forming one side of the speaker module (400); A diaphragm (420) forming the other side of the speaker module (400) opposite to one side of the speaker module (400); A frame (460) forming a side surface of the speaker module (400) and positioned between the one surface and the other surface; A first magnet (465) placed between the yoke (490) and the vibration plate (420); A second magnet (470) substantially surrounding the first magnet (465) and positioned spaced apart from the first magnet (465); A coil (440) attached to an area of ​​the vibration plate (420) substantially corresponding to the space between the first magnet (465) and the second magnet (470); and Contains a conductive wire (430) for providing power to the above coil (440), The above conductive wiring (430) is A first wiring portion (4301) extending from the coil (440) toward the frame (460), A second wiring portion (4302) extending from the end (4301b) of the first wiring portion (4301) toward the yoke (490), and An electronic device comprising a third wiring portion (4303) extending from an end (4302b) of the second wiring portion (4302) toward the frame (460). In paragraph 9, An electronic device wherein the first wiring portion (4301), the second wiring portion (4302), and the third wiring portion (4303) are formed of a flexible material. In paragraph 9, At least a portion (43031, 43033) of the first wiring portion (4301) and the third wiring portion (4303) are formed of a rigid material or a flexible material, and An electronic device wherein at least another portion (43032) of the second wiring portion (4302) and the third wiring portion (4303) are formed of a flexible material. In paragraph 9, The peripheral area of ​​the above vibration plate (420) includes a protruding area (615) protruding toward the yoke (490), and An electronic device, wherein at least a portion of the second wiring portion (4302) is positioned opposite the frame (460) with respect to the protruding area (615). In paragraph 12, An electronic device, wherein at least a portion of the third wiring portion (4303) is formed below the protruding area. In paragraph 12, The second wiring portion (4302) includes an extension portion (43021) that extends in a direction substantially parallel to one side of the second magnet (470) that the second wiring portion (4302) faces, and includes a portion formed lower than the lowest point height of the protruding area (615), and The third wiring portion (4303) is an electronic device that extends from the extension portion (43021) toward the frame (460). In paragraph 9, A first conductive plate portion (445) arranged on one side opposite to the yoke (490) of the first magnet (465); It further includes a second conductive plate portion (450) surrounding the first conductive plate portion (445) and arranged on one side opposite to the yoke (490) of the second magnet (470), An electronic device in which the first conductive plate portion (445) and the second conductive plate portion (450) of the speaker module (400) are spaced apart from each other.

Citation Information

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