Continuous analyte monitor

Abstract

Provided is a continuous analyte monitor, comprising a sensor assembly and an electronic assembly coupled to the sensor assembly. The sensor assembly comprises a sensor, a conductive member, and a mounting base for mounting the sensor and the conductive member. The sensor comprises an implant portion and a connection portion electrically connected to the electronic assembly. The electronic assembly comprises an electronic module. The electronic module comprises a switch member and an electrical contact point. When the sensor assembly is coupled to the electronic assembly, the connection portion is electrically connected to the electrical contact point, and the conductive member is electrically connected to the switch member, thereby improving the monitoring stability of the continuous analyte monitor.

Description

Continuous analyte monitor TECHNICAL FIELD

[0001] The present disclosure relates to the field of biomedical engineering industry, in particular, to a continuous analyte monitor. BACKGROUND

[0002] The concentration of analytes (e.g. glucose, blood ketones, lactic acid, etc.) in the human body generally needs to be within a normal range to keep the human body in good health. When the concentration of analytes is higher or lower than the normal range, the human body usually has abnormalities. For example, when blood sugar is too high, it can cause diseases in the kidneys, eyes and other parts of the human body. Therefore, people usually need to measure the concentration of analytes in the human body in real time through a continuous analyte monitor, which helps people to understand their physical condition in time and take appropriate measures (e.g. adjusting the concentration of analytes by adjusting diet or applying drug treatment, etc.).

[0003] In order to make the continuous analyte monitor have a desired service life, the prior art usually controls the continuous analyte monitor to switch between the non-working (e.g. standby) and working states through a switch provided on the continuous analyte monitor, so as to reduce unnecessary power consumption of the power supply due to the continuous analyte monitor starting to work too early, thereby affecting the service life of the continuous analyte monitor. The continuous analyte monitor usually includes a sensor implanted subcutaneously to obtain an analyte concentration signal and electronic devices for sending the analyte concentration signal to the outside. The continuous analyte monitor in the prior art generally provides a switch component on the sensor, and closes the switch component to make the continuous analyte monitor switch to the working state when the sensor and the electronic devices are connected.

[0004] However, since the switch component generally contains a conductor, providing the switch component on the sensor can cause the switch component to short-circuit the electrodes of the sensor and damage the sensor. SUMMARY

[0005] The present disclosure is proposed in view of the above-mentioned prior art, and aims to provide a continuous analyte monitor capable of improving the stability of monitoring.

[0006] To this end, the present disclosure provides a continuous analyte monitor, comprising a sensor assembly and an electronic assembly coupled with the sensor assembly, the sensor assembly comprising a sensor, a conductive piece and a mounting seat for mounting the sensor and the conductive piece, the sensor comprising an implanted part and a connecting part electrically connected with the electronic assembly; the electronic assembly comprising an electronic module, the electronic module comprising a switch piece and an electrical contact, when the sensor assembly is coupled with the electronic assembly, the connecting part is electrically connected with the electrical contact and the conductive piece is electrically connected with the switch piece.

[0007] In the present disclosure, by arranging the sensor and the conductive piece on the sensor assembly, and arranging the switch piece and the electrical contact on the electronic module of the electronic assembly, when the sensor assembly is coupled with the electronic assembly, the connecting portion of the sensor can be electrically connected with the electrical contact, and the conductive piece can be electrically connected with the switch piece, thereby facilitating the continuous analyte monitoring meter to switch to the working state. In addition, by mounting the sensor and the conductive piece on the mounting seat of the sensor assembly, the sensor and the conductive piece can be separated in space, thereby reducing the possibility of damage to the sensor caused by the conductive piece short-circuiting the connecting portion, and improving the stability of the monitoring of the continuous analyte monitoring meter.

[0008] In addition, in the continuous analyte monitoring meter related to the present disclosure, optionally, the sensor assembly further comprises an electrical connecting piece for electrically connecting the connecting portion and the electrical contact. In this case, by arranging the electrical connecting piece between the connecting portion and the electrical contact, the connecting portion and the electrical contact can be connected, i.e. the connecting portion and the electrical contact are conducted through the electrical connecting piece.

[0009] In addition, in the continuous analyte monitoring meter related to the present disclosure, optionally, the conductive piece and the electrical connecting piece are located on the same side of the connecting portion. In this way, the conductive piece can be matched with the switch piece of the electronic assembly, and the electrical connecting piece can be matched with the electrical contact of the electronic assembly.

[0010] In addition, in the continuous analyte monitoring meter related to the present disclosure, optionally, the mounting seat further comprises a sealing piece for sealing the connecting portion, the electrical contact and the electrical connecting piece. In this way, the connecting portion, the electrical contact and the electrical connecting piece can be sealed, thereby reducing the interference of external factors on the connecting portion, the electrical contact and the electrical connecting piece.

[0011] In addition, in the continuous analyte monitoring meter related to the present disclosure, optionally, the conductive piece is arranged on the sealing piece, and the sealing piece is used to seal the conductive piece and the switch piece. In this way, the conductive piece and the switch piece can be sealed, thereby reducing the interference of external factors on the conductive piece and the switch piece. In addition, when the sensor assembly is coupled with the electronic assembly, the conductive piece can be facilitated to contact the switch piece.

[0012] In addition, in the continuous analyte monitoring meter related to the present disclosure, optionally, the sealing piece has a first mounting position and a second mounting position, the electrical connecting piece is arranged at the first mounting position, and the conductive piece is arranged at the second mounting position. In this case, by arranging the electrical connecting piece and the conductive piece at the first mounting position and the second mounting position of the sealing piece respectively, the sealing piece can separate the electrical connecting piece and the conductive piece, thereby reducing the possibility of the conductive piece conducting the electrical connecting piece, and improving the stability of the monitoring of the continuous analyte monitoring meter.

[0013] In addition, in the continuous analyte monitor according to the present disclosure, optionally, the hardness of the portion of the seal between the first mounting position and the second mounting position is greater than the hardness of the electrical connecting member and the conductive member. In this case, after the sensor assembly is coupled to the electronic assembly, the electrical connecting member and the conductive member can be deformed due to the extrusion of the electrical contact and the switch member, causing the electrical connecting member and the conductive member to approach each other and contact to form a short circuit. By making the hardness of the barrier portion greater than the hardness of the electrical connecting member and the conductive member, the deformation of the electrical connecting member and the conductive member can be reduced, thereby reducing the possibility of the electrical connecting member and the conductive member contacting and conducting, and improving the stability of the monitoring of the continuous analyte monitor.

[0014] In addition, in the continuous analyte monitor according to the present disclosure, optionally, the electronic assembly further includes a housing for accommodating the electronic module, the housing forming a first mounting space and a second mounting space in communication with the first mounting space, the electronic module being disposed in the first mounting space, and the mounting seat being disposed in the second mounting space. In this case, by forming the first mounting space and the second mounting space by the housing, the electronic module can be sealed by the housing before the sensor assembly is coupled to the electronic assembly.

[0015] In addition, in the continuous analyte monitor according to the present disclosure, optionally, the switch member includes at least two conductive contacts having a predetermined spacing. In this case, by the conductive member simultaneously contacting and conducting at least two conductive contacts, the continuous analyte monitor can be switched to an operating state.

[0016] In addition, in the continuous analyte monitor according to the present disclosure, optionally, the predetermined spacing is 0.02 mm to 4 mm. In this case, by setting the predetermined spacing to 0.02 mm to 4 mm, the possibility of mis-conducting between the conductive contacts can be reduced while facilitating the miniaturization of the continuous analyte monitor.

[0017] According to the present disclosure, a continuous analyte monitor with improved monitoring stability can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0018] The present disclosure will now be explained in further detail by way of example only with reference to the accompanying drawings.

[0019] FIG. 1 is a diagram illustrating an application scenario of a continuous analyte monitor according to an example of the present disclosure.

[0020] FIG. 2 is a diagram illustrating a structure of a guide member according to an example of the present disclosure.

[0021] FIG. 3A is a block diagram illustrating an electronic assembly according to an example of the present disclosure.

[0022] FIG. 3B is an exploded view showing an electronic assembly according to an example of the present disclosure.

[0023] FIG. 3C is a structural view showing another view direction of the electronic assembly according to an example of the present disclosure.

[0024] FIG. 4A is a structural view showing a sensor assembly according to an example of the present disclosure.

[0025] FIG. 4B is a structural view showing another view direction of the sensor assembly according to an example of the present disclosure.

[0026] FIG. 5 is a structural view showing a sensor according to an example of the present disclosure.

[0027] FIG. 6A is a structural view showing a mount according to an example of the present disclosure.

[0028] FIG. 6B is a structural view showing a guide member mounted to the sensor assembly according to an example of the present disclosure.

[0029] FIG. 7 is a structural view showing a seal according to an example of the present disclosure.

[0030] FIG. 8 is a coupling structural view showing a sensor assembly and an electronic assembly according to an example of the present disclosure.

[0031] FIG. 9A is a schematic view showing a first embodiment in which a conductive member contacts a switch member according to an example of the present disclosure.

[0032] FIG. 9B is a schematic view showing a second embodiment in which a conductive member contacts a switch member according to an example of the present disclosure.

[0033] FIG. 10 is a flowchart showing a first embodiment in which an electronic module is controlled by a switch module according to an example of the present disclosure.

[0034] FIG. 11 is a flowchart showing a second embodiment in which an electronic module is controlled by a switch module according to an example of the present disclosure. DETAILED DESCRIPTION

[0035] The preferred embodiments of the present disclosure will be described in detail below with reference to the drawings. In the following description, identical components are denoted by identical reference numerals, and repetitive explanations will be omitted. In addition, the drawings are schematic diagrams, and the ratio of the dimensions of the components to each other or the shape of the components, etc. can be different from the actual ones. It should be noted that the terms "comprise" and "have" and any variations thereof, such as a process, a method, a system, a product, or an apparatus including or having a series of steps or units, are not necessarily limited to those steps or units clearly listed, but can include or have other steps or units that are not clearly listed or inherent to the process, the method, the product, or the apparatus.

[0036] The continuous analyte monitor according to the present disclosure can switch to the working state by arranging the sensor, the electrical connector, and the conductive member on the sensor assembly, arranging the switch member and the electrical contact on the electronic module of the electronic assembly, and electrically connecting the connecting portion of the sensor with the electrical contact through the electrical connector and electrically connecting the conductive member with the switch member when the sensor assembly is coupled with the electronic assembly. In addition, the sensor and the conductive member can be separated in space by being mounted on the mounting seat of the sensor assembly, thereby reducing the possibility of damage to the sensor caused by the short circuit of the connecting portion by the conductive member and improving the stability of the monitoring of the continuous analyte monitor.

[0037] In some examples, the continuous analyte monitor according to the present disclosure can also be referred to as a monitor, a continuous analyte monitoring device, a detection device, a sensor assembly, or an information acquisition device, etc. In addition, the sensor according to the present disclosure can also be referred to as a monitoring probe, a sensing probe, or an electrode probe, etc. In some examples, the electrical connection according to the present disclosure can refer to the contact relationship between two objects that can allow the flow of current.

[0038] In some examples, the analyte can be glucose, the sensor can be a glucose sensor, and the analyte level can be the glucose concentration. However, the analyte level can not be limited to the glucose concentration. For example, by changing the sensing layer of the sensor, other body fluid components can also be obtained, such as one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, chorionic gonadotropin, creatine kinase, creatine, creatinine, DNA, fructosamine, glutamine, growth hormone, hormones, ketones, lactic acid, oxygen, peroxide, prostate specific antigen, prothrombin, RNA, thyroid stimulating hormone, or troponin.

[0039] For the convenience of description, some examples are described below by taking glucose as an example of the analyte, and accordingly, the analyte level is the glucose concentration. It should be noted that this does not represent a limitation on the present disclosure, and the relevant description is also applicable to other analyte levels unless there is a contradiction.

[0040] The following will describe a continuous analyte monitor (hereinafter can be referred to as monitor) related to the examples of the present disclosure in detail with reference to the accompanying drawings.

[0041] FIG. 1 is a diagram showing an application scenario of a monitor 1 related to the examples of the present disclosure. In FIG. 1, the structure of the monitor 1 is simplified for a clearer illustration, but should not be understood as a limitation of the present disclosure.

[0042] In some examples, the monitor 1 can be a sensing device. In some examples, the monitor 1 can be an analyte sensor device. In some examples, the monitor 1 can be configured to generate information of a specific analyte in a body fluid of a host 2, for example, subcutaneous interstitial fluid, and the like, based on the body fluid. For example, the monitor 1 can react with the analyte in the body fluid and generate analyte information. In this case, by the monitor 1 reacting with the analyte in the body fluid, the host 2 can be facilitated to obtain the analyte information in the body fluid.

[0043] In some examples, the analyte information can be an analyte concentration in the body fluid. For example, when the analyte is glucose, the analyte information can be a glucose concentration in the body fluid. In some examples, the host 2 can be a human body or an animal body.

[0044] In some examples, referring to FIG. 1, an applicator 3 can be used to apply the monitor 1 to the host 2, for example, to attach the monitor 1 to a body surface of the host 2, or to place the monitor 1 wholly or partially under the skin of the host 2, and the like. In this way, the monitor 1 can be facilitated to obtain the analyte information in the body fluid of the host 2.

[0045] In some examples, before the applicator 3 applies the monitor 1 to the host 2 (i.e., when the monitor 1 and the applicator 3 are in a shelf period), the monitor 1 can be wholly or partially received in the applicator 3. For example, the applicator 3 can receive an electronic assembly 11 (described later) of the monitor 1. In some examples, a cartridge device 4 can be used to wholly or partially receive the monitor 1. In some examples, before the monitor 1 is applied to the host 2, the monitor 1 can be wholly or partially received in the cartridge device 4. For example, the cartridge device 4 can receive a sensor assembly 12 (described later) of the monitor 1.

[0046] In some examples, referring to FIG. 1, the monitor 1 can send the analyte information to an external device 5. In this case, by viewing the external device 5, the host 2 can be facilitated to obtain the analyte information. In some examples, the monitor 1 can send the analyte information to the external device 5 in a wireless transmission manner, for example, a Bluetooth transmission. In some examples, the external device 5 can be a smart terminal, for example, a computer or a mobile phone.

[0047] FIG. 2 is a structural diagram showing a guide member 6 according to an example of the present disclosure.

[0048] In some examples, the guide member 6 can be configured to guide the monitor 1 to be applied at least partially to the host 2 (see FIG. 1 and FIG. 2). In some examples, the guide member 6 can be located within the cartridge device 4 when the monitor 1 is located wholly or partially in the cartridge device 4. Thus, the guide member 6 can be safely stored before the monitor 1 is applied and the situation that the guide member 6 causes unnecessary injury to the host 2 or other people can be reduced. In addition, the guide member 6 can be kept in a sealed and sterile environment of the cartridge device 4 (described later).

[0049] In some examples, the guide member 6 can move relative to other parts of the applicator 3 when the applicator 3 applies the monitor 1. Thus, the guide member 6 can facilitate guiding the monitor 1 to be applied to the host 2.

[0050] In some examples, referring to FIG. 2, the guide member 6 can further include a sharp 61 and a support seat 62. In some examples, the sharp 61 can be configured to guide the monitor 1 to be applied at least partially to the host 2.

[0051] In some examples, the sharp 61 can be fixed to the support seat 62. In some examples, the sharp 61 and the support seat 62 can move relative to other parts of the applicator 3. Thus, the guide member 6 can facilitate guiding the monitor 1 to be applied to the host 2.

[0052] In some examples, the sharp 61 can partially enter the subcutaneous of the host 2. In some examples, the sharp 61 can be configured to at least partially accommodate the monitor 1. In some examples, the sharp 61 can have an accommodation groove 611. In some examples, the accommodation groove 611 of the sharp 61 can at least partially accommodate the monitor 1. Thus, the monitor 1 can be facilitated to be applied to the host 2.

[0053] In some examples, when the applicator 3 applies the monitor 1, an end of the sharp 61 close to the host 2 can be a distal end. In some examples, the distal end of the sharp 61 can be pointed. In this case, by contacting the pointed distal end of the sharp 61 with the host 2, the sharp 61 can be facilitated to pierce into the subcutaneous of the host 2, thereby facilitating the sharp 61 to guide the monitor 1 to be wholly or partially located in the subcutaneous of the host 2.

[0054] FIG. 3A is a block diagram showing an electronic assembly 11 according to an example of the present disclosure. FIG. 3B is an exploded view showing the electronic assembly 11 according to an example of the present disclosure. FIG. 3C is a structural diagram showing another view direction of the electronic assembly 11 according to an example of the present disclosure.

[0055] In some examples, the monitor 1 can include an electronics assembly 11. In some examples, the electronics assembly 11 can also be referred to as a transmitter assembly. In some examples, the electronics assembly 11 can receive analyte information generated by the sensor assembly 12 and transmit to the external device 5. In this way, analyte information in a bodily fluid can be conveniently obtained.

[0056] In some examples, referring to FIGS. 3A and 3B, the electronics assembly 11 can include an electronics module 111. In some examples, the electronics module 111 can be configured to process signals generated by the sensor 121 (described later) and transmit to the external device 5.

[0057] In some examples, the signals generated by the sensor 121 can refer to electrical signals generated by the sensor 121 based on the bodily fluid of the host 2. For example, the electronics module 111 can process electrical signals of analyte concentration generated by the sensor 121 and transmit to the external device 5 to enable the host 2 to obtain analyte information. In some examples, the electronics module 111 can be an electrical device on the monitor 1, such as a PCB board, a sampling module, a signal processing module, or a wireless communication module, among others.

[0058] In some examples, referring to FIGS. 3A and 3B, the electronics assembly 11 can include a power module 112. In some examples, the power module 112 can be configured to provide electrical energy. For example, the power module 112 can provide electrical energy to the sensor 121 and / or the electronics module 111. In some examples, the power module 112 can include a battery. In some examples, the battery can be a coin cell battery.

[0059] In some examples, referring to FIGS. 3A and 3B, the electronics assembly 11 can include a housing 113. In some examples, the housing 113 can be used to house the electronics module 111. In some examples, the housing 113 can also be used to house the power module 112.

[0060] In some examples, referring to FIG. 3C, the housing 113 can have a bayonet 1131. In some examples, the bayonet 1131 can be used to secure the sensor assembly 12. In this way, the sensor assembly 12 can be conveniently coupled to the electronics assembly 11. In some examples, the number of bayonets 1131 can be one or more.

[0061] In some examples, referring to FIG. 3B, the housing 113 can form a first mounting space 1132 and a second mounting space 1133. In some examples, the electronic module 111 can be disposed in the first mounting space 1132, and the sensor assembly 12 can be at least partially disposed in the second mounting space 1133. In other words, the first mounting space 1132 can be configured to accommodate the electronic module 111, and the second mounting space 1133 can be configured to accommodate at least part of the sensor assembly 12. In this case, by forming the first mounting space 1132 and the second mounting space 1133 with the housing 113, the electronic module 111 can be sealed by the housing 113 before the sensor assembly 12 is coupled to the electronic assembly 11.

[0062] In some examples, the power module 112 can be disposed in the first mounting space 1132. In other words, the first mounting space 1132 can be configured to accommodate the power module 112.

[0063] In some examples, the first mounting space 1132 can be in communication with the second mounting space 1133. In this way, the electrical contacts 1111 and the switch 1112 can be electrically connected to the electronic assembly 11 in the first mounting space 1132 and the sensor assembly 12 (described later) in the second mounting space 1133. For ease of description, the portion of the first mounting space 1132 in communication with the second mounting space 1133 is referred to as a communication portion.

[0064] In some examples, referring to FIG. 3B and FIG. 3C, the housing 113 of the electronic assembly 11 can include a first housing 1134 and a second housing 1135. In some examples, the first mounting space 1132 can be formed by an inner surface of the first housing 1134 and an inner surface of the second housing 1135, and the second mounting space 1133 can be formed by an outer surface of the second housing 1135.

[0065] In some examples, referring to FIG. 3C, the bayonet 1131 can be located in the second mounting space 1133, for example, the bayonet 1131 can be formed by the outer surface of the second housing 1135. In this case, by forming the second mounting space 1133 and the bayonet 1131 with the outer surface of the second housing 1135, the sensor assembly 12 can be coupled to the electronic assembly 11.

[0066] In some examples, referring to FIG. 3B, the electronic assembly 11 can further include an adhesive 114. In some examples, the adhesive 114 can be configured to adhere the monitor 1 to the skin surface of the host 2. In some examples, the adhesive 114 can be disposed on the side of the housing 113 that is in contact with the skin surface of the host 2. For example, the adhesive 114 can be disposed on the outer surface of the second housing 1135. In this way, the electronic assembly 11 can be fixed to the body surface of the host 2.

[0067] In some examples, referring to FIG. 3C, the electronic module 111 can include electrical contacts 1111. In some examples, the electrical contacts 1111 can be electrically connected with the sensor assembly 12 when the sensor assembly 12 is coupled with the electronic assembly 11. In some examples, the electrical contacts 1111 can be disposed on the electronic module 111, for example, the electrical contacts 1111 can be disposed on a side of the electronic module 111 close to the second housing 1135.

[0068] In some examples, the number of the electrical contacts 1111 can be at least two, for example, two, three, or four.

[0069] In some examples, the electrical contacts 1111 can be at least partially exposed to the outer shell 113. In some examples, the electrical contacts 1111 can be at least partially located in the second mounting space 1133. For example, the electrical contacts 1111 can be located in the communication portion, that is, a portion of the electrical contacts 1111 can be in the first mounting space 1132 and another portion of the electrical contacts 1111 can be in the second mounting space 1133. In this way, when the sensor assembly 12 is coupled with the electronic assembly 11, the electrical contacts 1111 can be facilitated to electrically connect the sensor assembly 12 and the electronic assembly 11.

[0070] In some examples, referring to FIG. 3C, the electronic module 111 can include a switching member 1112. In some examples, the switching member 1112 can be used to switch the standby state and the working state (to be described later) of the monitor 1. In some examples, the switching member 1112 can be electrically connected with the sensor assembly 12 when the sensor assembly 12 is coupled with the electronic assembly 11.

[0071] In some examples, the switching member 1112 can be disposed on the electronic module 111, for example, the switching member 1112 can be disposed on a side of the electronic module 111 close to the second housing 1135. In this way, the switching member 1112 can be facilitated to contact the conductive member 123 (to be described later) of the sensor assembly 12.

[0072] In some examples, referring to FIG. 3C, the switching member 1112 can include conductive contacts 11121. In some examples, the conductive contacts 11121 can be disposed on the electronic module 111, for example, the conductive contacts 11121 can be pads of a PCB board, elastic pins, or elastic sheets, etc. In some examples, the number of the conductive contacts 11121 can be at least two, for example, can be two, three, four, or five. In this case, by coupling the sensor assembly 12 with the electronic assembly 11, the conductive member 123 of the sensor assembly 12 can be facilitated to contact and conduct the conductive contacts 11121, so that the monitor 1 can be switched to the working state.

[0073] In some examples, a predetermined interval can be provided between every two conductive contacts 11121. In some examples, the predetermined interval is 0.02 mm to 4 mm, for example, can be 0.02 mm, 0.05 mm, 1 mm, 2 mm, 3 mm or 4 mm. In this case, by setting the predetermined interval to 0.02 mm to 4 mm, the possibility of misconnection between the conductive contacts 11121 can be reduced while facilitating the miniaturization of the monitor 1. Preferably, the predetermined interval can be 0.05 mm to 2 mm.

[0074] In some examples, the switch member 1112 can be at least partially exposed to the housing 113. In some examples, referring to FIG. 3C, the switch member 1112 can be at least partially located in the second mounting space 1133. For example, the switch member 1112 can be located in a communication portion, i.e., a portion of the conductive contacts 11121 of the switch member 1112 can be in the first mounting space 1132 and another portion of the conductive contacts 11121 of the switch member 1112 can be in the second mounting space 1133. In this way, the sensor assembly 12 can be facilitated to be electrically connected to the switch member 1112.

[0075] In some examples, the electric contacts 1111 and the switch member 1112 can be made of a flexible conductive material. In this case, when the sensor assembly 12 is coupled to the electronic assembly 11, as the electric contacts 1111 and the electrical connectors 122 (to be described later) of the sensor assembly 12 are electrically connected and the switch member 1112 and the conductive member 123 of the sensor assembly 12 are in contact, the electric contacts 1111 and the switch member 1112 can be deformed by being pressed against each other. By making the electric contacts 1111 and the switch member 1112 of a flexible conductive material, the amount of deformation of the electric contacts 1111 and the switch member 1112 can be increased, thereby increasing the contact area of the electric contacts 1111 and the switch member 1112 and reducing the possibility of false connection of the electric contacts 1111 and the electrical connectors 122 and the switch member 1112 and the conductive member 123. In addition, the possibility of collision damage of the electric contacts 1111 and the electrical connectors 122 and the switch member 1112 and the conductive member 123 due to excessive rigidity of the electric contacts 1111 and the switch member 1112 can be reduced.

[0076] In some examples, referring to FIG. 3C, taking an example of three electric contacts 1111 and one switch member 1112, the electric contacts 1111 can be arranged in an isosceles triangle and the switch member 1112 can be located in the middle of the two electric contacts 1111 forming the isosceles triangle.

[0077] In some examples, the electric contacts 1111 and the switch member 1112 can be made of conductive silicone.

[0078] FIG. 4A is a structural schematic diagram showing the sensor assembly 12 involved in the example of the present disclosure. FIG. 4B is a schematic diagram showing another view direction of the structure of the sensor assembly 12 involved in the example of the present disclosure. FIG. 5 is a structural schematic diagram showing the sensor 121 involved in the example of the present disclosure.

[0079] In some examples, the monitor 1 can include a sensor assembly 12. In some examples, the sensor assembly 12 can be configured to generate a signal based on the body fluid of the host 2.

[0080] In some examples, the sensor assembly 12 can be coupled with the electronic assembly 11. In some examples, the sensor assembly 12 can be at least partially mounted on the electronic assembly 11. In some examples, when the sensor assembly 12 is coupled with the electronic assembly 11, the sensor assembly 12 can transmit the signal generated based on the body fluid of the host 2 to the electronic assembly 11.

[0081] In some examples, referring to FIG. 4A, the sensor assembly 12 can include a sensor 121. The sensor 121 can be partially or entirely implanted subcutaneously in the host 2. In some examples, the sensor 121 implanted subcutaneously can generate a signal based on the body fluid of the host 2 (see FIG. 1) and transmit the signal to the electronic assembly 11. In some examples, the sensor 121 can be a flexible material sensor.

[0082] In some examples, referring to FIG. 5, the sensor 121 can include a connecting portion 1211 and an implanted portion 1212.

[0083] In some examples, the connecting portion 1211 can be configured to be electrically connected with the electronic assembly 11. In some examples, when the sensor assembly 12 is coupled with the electronic assembly 11, the connecting portion 1211 can be electrically connected with the electrical contact 1111 of the electronic assembly 11. In this way, the electronic assembly 11 can receive the signal generated by the sensor 121.

[0084] In some examples, the implanted portion 1212 can be configured to be implanted subcutaneously in the host 2 to react with the analyte in the interstitial fluid and generate a signal.

[0085] In some examples, the implanted portion 1212 can be flexible. In this case, when the implanted portion 1212 is located subcutaneously in the host 2, the foreign body sensation of the host 2 can be reduced.

[0086] In some examples, referring to FIG. 4A and FIG. 4B, the connecting portion 1211 can be mounted on and located within the mount 124, and the implanted portion 1212 can extend out of the mount 124.

[0087] In some examples, referring to FIG. 4A, the sensor assembly 12 can include electrical connectors 122. In some examples, the electrical connectors 122 can be used to electrically connect with the connecting portions 1211 and can also be used to electrically connect with the electrical contacts 1111 of the electronic module 111. In other words, the electrical connectors 122 can be used to electrically connect the connecting portions 1211 and the electrical contacts 1111 (see FIG. 3C and FIG. 4A). In this case, by providing the electrical connectors 122 between the connecting portions 1211 and the electrical contacts 1111, it can be facilitated for the connecting portions 1211 to establish electrical connection with the electrical contacts 1111, i.e., to electrically connect the connecting portions 1211 and the electrical contacts 1111 via the electrical connectors 122.

[0088] In some examples, the number of the electrical connectors 122 can be at least two. For example, two, three, four, or five.

[0089] In some examples, the number of the electrical connectors 122 can be the same as the number of the electrical contacts 1111, and the electrical connectors 122 can correspond to the electrical contacts 1111 one-to-one. In other words, each of the electrical connectors 122 can electrically connect with one of the electrical contacts 1111 corresponding thereto.

[0090] In some examples, the sensor assembly 12 can include conductive members 123 (see FIG. 4A). In some examples, the conductive members 123 can be used to electrically connect with the electronic assembly 11. In some examples, the conductive members 123 can electrically connect with the switch members 1112 of the electronic assembly 11.

[0091] In some examples, the conductive members 123 can electrically connect at least two of the conductive contacts 11121 of the switch members 1112. In some examples, the number of the conductive members 123 can be one or more. For example, when the conductive members 123 is one and the conductive contacts 11121 are two, the conductive member 123 can electrically connect the two conductive contacts 11121.

[0092] In some examples, referring to FIG. 4A, the electrical connectors 122 and the conductive members 123 can be located on the same side of the connecting portions 1211. In this case, it can be facilitated for the electrical connectors 122 to cooperate with the electrical contacts 1111 of the electronic assembly 11 and for the conductive members 123 to cooperate with the switch members 1112 of the electronic assembly 11. In addition, by locating the electrical connectors 122 and the conductive members 123 on the same side of the connecting portions 1211, it can be facilitated for a sealing member 1244 (to be described later) to simultaneously seal the electrical connectors 122 and the conductive members 123. In some examples, the electrical connectors 122 and the conductive members 123 can be made of conductive materials. For example, the conductive materials can be conductive silicone.

[0093] FIG. 6A is a structural schematic diagram illustrating a mount 124 according to an example of the present disclosure. FIG. 6B is a structural schematic diagram illustrating a guide member 6 mounted to a sensor assembly 12 according to an example of the present disclosure.

[0094] In some examples, referring to FIG. 4A and FIG. 6A, the sensor assembly 12 can include the mount 124. In some examples, the mount 124 can be used to mount the sensor 121 and the conductive member 123. In this case, by mounting the sensor 121 and the conductive member 123 to different positions on the mount 124, the sensor 121 and the conductive member 123 can be spatially separated by the mount 124, thereby reducing the possibility of damage to the sensor 121 caused by the conductive member 123 shorting the connection portion 1211, thereby improving the stability of the monitoring by the monitor 1.

[0095] In some examples, when the sensor assembly 12 is coupled to the electronic assembly 11, the mount 124 can be disposed in the second mounting space 1133 (see FIG. 3C).

[0096] In some examples, referring to FIG. 4B or FIG. 6A, the mount 124 can have a buckle 1241. The buckle 1241 can form a snap-fit with the bayonet 1131. In some examples, the buckle 1241 can be disposed in a surrounding form on the mount 124. In this way, when the sensor assembly 12 is coupled to the electronic assembly 11, the stability of the coupling of the sensor assembly 12 to the electronic assembly 11 can be improved.

[0097] As described above, the bayonet 1131 can be used to secure the sensor assembly 12. In some examples, when the sensor assembly 12 is coupled to the electronic assembly 11, the bayonet 1131 can be used to secure the mount 124. In some examples, the bayonet 1131 can cooperate with the buckle 1241, specifically, the buckle 1241 can snap into the bayonet 1131 to secure the mount 124 to the electronic assembly 11.

[0098] In some examples, the number of buckles 1241 can be one. In this way, the sensor assembly 12 can be easily mounted to or detached from the electronic assembly 11.

[0099] In some examples, the number of buckles 1241 can be multiple. For example, two, three, four, or five. In this way, the tightness of the coupling of the sensor assembly 12 to the electronic assembly 11 can be improved.

[0100] In some examples, the number of buckles 1241 can be the same as the number of bayonets 1131, and the buckles 1241 can correspond one-to-one to the bayonets 1131.

[0101] In some examples, referring to FIGS. 6A and 6B, the mount 124 can have a through hole 1242. In some examples, the guide member 6 can be inserted through the mount 124. In some examples, the guide member 6 can be configured to guide the sensor 121 to be applied to the host 2. Specifically, when the guide member 6 is inserted through the mount 124, the sharp 61 of the guide member 6 can be at least partially located within the through hole 1242. Thus, the guide member 6 can be facilitated to guide the sensor assembly 12 to be applied to the host 2.

[0102] In some examples, referring to FIG. 6B, the sharp 61 can be configured to at least partially accommodate the sensor 121, for example, the accommodation groove 611 of the sharp 61 can accommodate the implant portion 1212 of the sensor 121. In some examples, the guide member 6 can be configured to guide the implant portion 1212 to be applied to the host 2. In other words, when the guide member 6 is mounted to the mount 124, the implant portion 1212 of the sensor 121 can be located within the accommodation groove 611. Thus, the sharp 61 can be facilitated to guide the implant portion 1212 to be applied to the host 2.

[0103] In some examples, the inner profile of the through hole 1242 can at least partially match the outer profile of the sharp 61. For example, the inner profile of the through hole 1242 can be at least partially similar to the outer profile of the sharp 61. Thus, when the guide member 6 is mounted to the mount 124, the wobbling of the guide member 6 can be reduced.

[0104] FIG. 7 is a structural schematic diagram of a seal 1244 involved in the examples of the present disclosure.

[0105] In some examples, referring to FIG. 6A, the mount 124 can have a third mounting space 1243. In some examples, referring to FIG. 6B, the mount 124 can include a seal 1244, which can be disposed in the third mounting space 1243 of the mount 124. In some examples, the seal 1244 can be used to seal the connection portion 1211 of the sensor 121. Thus, the interference of external factors (e.g., liquid) to the connection portion 1211 can be reduced.

[0106] In some examples, referring to FIGS. 4A and 7, the seal 1244 can have an upper portion 12441 and a lower portion 12442. In some examples, the connection portion 1211 of the sensor 121 can be located between the upper portion 12441 and the lower portion 12442, for example, the upper portion 12441 can press the connection portion 1211 against the lower portion 12442. Thus, the sensor 121 can be facilitated to be fixed and the connection portion 1211 can be sealed.

[0107] In some examples, referring to FIG. 7, the seal 1244 can have a fourth installation space 12443. In some examples, the fourth installation space 12443 can be a sealing space formed by the upper portion 12441 and the lower portion 12442. In some examples, the connection portion 1211 can be located in the fourth installation space 12443. In this way, the seal 1244 can seal the connection portion 1211.

[0108] In some examples, the upper portion 12441 and the lower portion 12442 can press the connection portion 1211 to seal the connection portion 1211 in a manner of pressing against each other. In this case, by pressing the upper portion 12441 and the lower portion 12442 against each other, the periphery of the connection portion 1211 can be sealed by the deformation of the upper portion 12441 and the lower portion 12442, thereby facilitating the sealing of the connection portion 1211.

[0109] In some examples, the fourth installation space 12443 can have a similar contour to the connection portion 1211 and can be slightly larger than the contour of the connection portion 1211. In this way, the movement of the connection portion 1211 in the fourth installation space 12443 can be reduced.

[0110] In some examples, the upper portion 12441 can be integrally formed with the lower portion 12442. In this way, the processing of the seal 1244 can be facilitated.

[0111] In some examples, the upper portion 12441 and the lower portion 12442 can be separate. In this way, the installation of the connection portion 1211 into the fourth installation space 12443 can be facilitated.

[0112] In some examples, the seal 1244 can be used to seal an electrical connection portion, which can refer to any two electrically connected portions or components. In this way, the electrical connection portion can be protected from external factors. In some examples, the external factors can refer to factors that can damage the electrical connection of the electrical connection portion, such as moisture or body fluid. In this disclosure, the electrical connection portion can include the connection portion 1211, the electrical connector 122, the electrical contact 1111, the conductive member 123, and the switch member 1112.

[0113] In some examples, the seal 1244 can be used to seal the electrical connector 122 and the electrical contact 1111. In some examples, the seal 1244 can have a first installation site 12444 and a second installation site 12445. In some examples, the electrical connector 122 can be disposed on the seal 1244. Specifically, the electrical connector 122 can be disposed on the first installation site 12444 of the seal 1244.

[0114] In some examples, referring to FIG. 7, the first mounting positions 12444 can be distributed in an isosceles triangle, and the second mounting position 12445 can be located in the middle of the two first mounting positions 12444 forming the isosceles triangle, for example, when there are three first mounting positions 12444 and one second mounting position 12445.

[0115] In some examples, the first mounting positions 12444 can penetrate the upper portion 12441 of the seal 1244. In this case, the electrical connectors 122 arranged in the first mounting positions 12444 can pass through the upper portion 12441 of the seal 1244 to contact the connecting portions 1211 and the electrical contacts 1111 respectively, so as to facilitate the electrical connection between the electrical connectors 122 and the connecting portions 1211 and the electrical contacts 1111.

[0116] In some examples, the first mounting positions 12444 can surround and wrap the electrical connectors 122. In this way, the sealing effect of the seal 1244 on the electrical connectors 122 can be improved.

[0117] In some examples, referring to FIG. 3C and FIG. 4A, the seal 1244 can be used to seal the conductive member 123 and the switch member 1112. In some examples, the conductive member 123 can be arranged on the seal 1244. In this way, when the sensor assembly 12 is coupled to the electronic assembly 11, the conductive member 123 can be facilitated to contact the switch member 1112.

[0118] In some examples, referring to FIG. 7, the conductive member 123 can be arranged in the second mounting position 12445. In this case, by arranging the electrical connectors 122 and the conductive member 123 in the first mounting positions 12444 and the second mounting position 12445 of the seal 1244 respectively, the seal 1244 can separate the electrical connectors 122 and the conductive member 123, so as to reduce the possibility of the conductive member 123 short-circuiting the electrical connectors 122, thereby improving the stability of the monitoring of the monitor 1.

[0119] In some examples, the conductive member 123 can not contact the connecting portions 1211, for example, when the second mounting position 12445 does not penetrate the upper portion 12441 of the seal 1244, the upper portion 12441 can spatially separate the conductive member 123 from the connecting portions 1211. In this way, the possibility of the conductive member 123 short-circuiting the connecting portions 1211 and damaging the sensor 121 can be reduced, thereby improving the stability of the monitoring of the monitor 1.

[0120] In some examples, the first mounting positions 12444 can not communicate with the second mounting position 12445. In this way, the possibility of the electrical connectors 122 contacting and conducting with the conductive member 123 can be reduced.

[0121] In some examples, the hardness of the portion of the sealing member 1244 between the first mounting position 12444 and the second mounting position 12445 can be greater than the hardness of the electric connecting member 122 and the conductive member 123. Hereinafter, for the convenience of description, the portion of the sealing member 1244 between the first mounting position 12444 and the second mounting position 12445 is referred to as a blocking portion. In this case, after the sensor assembly 12 is coupled with the electronic assembly 11, the electric connecting member 122 and the conductive member 123 can be deformed due to the extrusion of the electric contact 1111 and the switch member 1112, so that the electric connecting member 122 and the conductive member 123 are close to each other and contact to form a short circuit. By making the hardness of the blocking portion greater than the hardness of the electric connecting member 122 and the conductive member 123, the deformation of the electric connecting member 122 and the conductive member 123 can be reduced, so that the possibility of the electric connecting member 122 and the conductive member 123 contacting to form a short circuit is reduced, and the stability of the monitoring of the monitor 1 is improved.

[0122] In some examples, the number of the first mounting position 12444 and the second mounting position 12445 can be multiple. In some examples, the number of the first mounting position 12444 can be the same as the number of the electric connecting member 122, and the number of the second mounting position 12445 can be the same as the number of the conductive member 123.

[0123] In some examples, referring to FIG. 7, the upper portion 12441 of the sealing member 1244 can be provided with a flange 12446. In some examples, the flange 12446 can be provided in a surrounding manner on the upper portion 12441. In some examples, when the sensor assembly 12 is coupled with the electronic assembly 11, the flange 12446 can abut against the electronic assembly 11. In this case, by providing the flange 12446 on the upper portion 12441, the upper portion 12441 can be prevented from being attached to the electronic assembly 11, so that the sealed space is facilitated to be formed.

[0124] In some examples, the upper surface of the upper portion 12441 (i.e., the surface close to the flange 12446) can cooperate with the flange 12446 to form a groove structure. In some examples, the electric connecting member 122, the conductive member 123, the electric contact 1111 and the switch member 1112 can be at least partially located in the groove structure. In this case, by attaching the electronic assembly 11 to the flange 12446, the groove structure can be sealed, so that the electric connecting member 122, the conductive member 123, the electric contact 1111 and the switch member 1112 in the groove structure are sealed.

[0125] In some examples, the sealing member 1244 can be made of an insulating material. For example, a high polymer material, a ceramic, silicon or other non-metal insulating materials.

[0126] In some examples, the seal 1244 can be made of a flexible material. In this case, the soft material can enhance the sealing performance, for example, the sealing between the electrical connector 122 and the electrical contact 1111 can be enhanced, and the sealing between the conductive member 123 and the switch member 1112 can be enhanced.

[0127] FIG. 8 is a schematic diagram showing the coupling structure of the sensor assembly 12 and the electronic assembly 11 involved in the example of the present disclosure.

[0128] As described above, referring to FIG. 8, the electronic assembly 11 can be coupled with the sensor assembly 12. Specifically, the applicator 3 containing the electronic assembly 11 can pick up the guide member 6 and the sensor assembly 12 from the cartridge 4, and when the applicator 3 completes the pickup of the guide member 6 and the sensor assembly 12, the buckle 1241 of the mounting seat 124 can be buckled into the socket 1131 of the housing 113, and the electronic assembly 11 can be coupled with the sensor assembly 12. Wherein, the pickup can refer to the applicator 3 taking the guide member 6 and the sensor assembly 12 out of the cartridge 4 and installing them on the electronic assembly 11, so that the electronic assembly 11 is coupled with the sensor assembly 12, and after the applicator 3 completes the pickup, the guide member 6, the sensor assembly 12 and the electronic assembly 11 can be collectively located in the applicator 3.

[0129] In some examples, before the pickup by the applicator 3, the electronic assembly 11 can be wholly or partially encapsulated in the applicator 3, and at least part of the guide member 6 and the sensor assembly 12 can be encapsulated together in the cartridge 4. In this case, by sealing the electronic assembly 11 by the applicator 3 and sealing the guide member 6 and the sensor assembly 12 by the cartridge 4, the applicator 3 can provide a sealed sterile environment for the electronic assembly 11, and the cartridge 4 can provide a sealed sterile environment for the guide member 6 and the sensor assembly 12, thereby facilitating the storage of the electronic assembly 11, the guide member 6 and the sensor assembly 12.

[0130] In some examples, the installation direction can be a moving direction of the sensor assembly 12 when the sensor assembly 12 is installed on the electronic assembly 11. In some examples, during the installation of the sensor assembly 12 on the electronic assembly 11, the conductive member 123 and the switch member 1112 can move relative to each other in the installation direction until the sensor assembly 12 is coupled to the electronic assembly 11 and the conductive member 123 contacts the switch member 1112. In this case, after the conductive member 123 contacts the switch member 1112, since the installation direction is perpendicular to the contact surface of the conductive member 123 and the switch member 1112, the interaction force between the conductive member 123 and the switch member 1112 is perpendicular to the contact surface, i.e., there is no relative movement between the conductive member 123 and the switch member 1112 along the contact surface, thereby reducing the friction between the conductive member 123 and the switch member 1112, and reducing the possibility of poor contact caused by damage of the conductive member 123 and the switch member 1112 due to friction, and improving the stability of the monitoring of the monitor 1.

[0131] In some examples, the sensor assembly 12 can be installed parallel to the electronic assembly 11. Specifically, during the installation of the sensor assembly 12 on the electronic assembly 11, the plane in which the connecting portion 1211 of the sensor assembly 12 is located can be parallel to the plane in which the electronic module 111 of the electronic assembly 11 is located. In some examples, the contact surface between the electrical connecting member 122 and the electrical contact 1111 can be parallel to the plane in which the connecting portion 1211 and the electronic module 111 are located.

[0132] In this case, after the sensor assembly 12 is coupled to the electronic assembly 11, the connecting portion 1211 and the electronic module 111 press the electrical connecting member 122 and the electrical contact 1111 against each other by the coupling force between the sensor assembly 12 and the electronic assembly 11, which can improve the tightness of the contact between the electrical connecting member 122 and the electrical contact 1111, thereby reducing the possibility of false connection of the electrical connecting member 122 and the electrical contact 1111.

[0133] It should be noted that the contact between the conductive member 123 and the switch member 1112 is similar to the contact between the electrical connecting member 122 and the electrical contact 1111 described above, and will not be described again.

[0134] In some examples, the monitor 1 can have a standby state and a working state. In some examples, the standby state can mean that the monitor 1 does not work to stop or reduce the power consumption of the power supply module 112, and the working state can mean that the power supply module 112 supplies power to the electronic module 111 and the sensor 121 to make the monitor 1 work.

[0135] In some examples, the switch piece 1112 can be used to control the power supply of the electronic module 111 by the power supply module 112. In some examples, the switch piece 1112 can have an open state and a closed state. The initial state of the switch piece 1112 can be the open state. In some examples, when the switch piece 1112 is in the open state, the power supply module 112 cannot supply power to the electronic module 111 (i.e., the electronic module 111 is powered off). When the switch piece 1112 is in the closed state, the power supply module 112 can supply power to the electronic module 111 (i.e., the electronic module 111 is powered on). Wherein, the switch piece 1112 in the closed state can mean that the conductive contact 11121 of the switch piece 1112 is turned on.

[0136] In some examples, when the monitor 1 is in the standby state, the electronic module 111 can be powered off; when the monitor 1 is in the working state, the electronic module 111 can be powered on.

[0137] In some examples, when the sensor assembly 12 is coupled with the electronic assembly 11, the mounting seat 124, the electrical connecting piece 122, the connecting portion 1211 and the conductive piece 123 can be collectively located in the second mounting space 1133.

[0138] In some examples, when the sensor assembly 12 is coupled with the electronic assembly 11, the electrical connecting piece 122 can be in contact with the electrical contact 1111, and the conductive piece 123 can be in contact with the switch piece 1112. In this case, by picking up the guide member 6 and the sensor assembly 12 through the applying device 3, the connecting portion 1211 of the sensor 121 can be electrically connected with the electrical contact 1111 through the electrical connecting piece 122, and the conductive piece 123 can be electrically connected with the switch piece 1112 to turn on the conductive contact 11121, thereby facilitating the monitor 1 to switch to the working state.

[0139] In some examples, the contact between the conductive piece 123 and the switch piece 1112 can be physical contact, which means that two objects are in direct contact and produce physical interaction. In this case, the conductive piece 123 contacts and turns on the switch piece 1112 through physical contact, which can make the conductive piece 123 and the switch piece 1112 contact and cooperate to form a mechanical switch. Compared with the case where the semiconductor switch has a leakage current, which can shorten the service life of the monitor 1, the use of the mechanical switch can prolong the service life of the monitor 1.

[0140] In some examples, the contact between the electrical connecting piece 122 and the electrical contact 1111, and the contact between the conductive piece 123 and the switch piece 1112 can be surface contact. In this way, the possibility of false connection can be reduced. In some examples, the contact can also be line contact or point contact.

[0141] In some examples, the electronics assembly 11 can have a third mounting location. In some examples, the guide member 6 can be positioned in the third mounting location when the sensor assembly 12 is coupled to the electronics assembly 11. Thereby, the guide member 6 can facilitate guiding the monitor 1 to be at least partially applied to the host 2.

[0142] In some examples, the applicator 3 can have a proximal end that is proximate to the host 2 when in operation, and a distal end that is distal from the host 2. In some examples, the applicator 3 can apply a force to the guide member 6 and the monitor 1 that is directed towards the proximal end when the applicator 3 is applying the monitor 1. Thereby, the guide member 6 and the monitor 1 can be caused to move towards the proximal end of the applicator 3 to apply the monitor 1 to the host 2.

[0143] In some examples, the applicator 3 can also apply a force to the guide member 6 that is directed towards the distal end after the applicator 3 has applied the monitor 1 to the host 2. Thereby, the guide member 6 can be caused to move relative to the monitor 1 and towards the distal end of the applicator 3.

[0144] FIG. 9A is a schematic view showing a first embodiment in which the conductive member 123 contacts the switch member 1112. FIG. 9B is a schematic view showing a second embodiment in which the conductive member 123 contacts the switch member 1112.

[0145] In some examples, referring to FIG. 9A, the switch member 1112 can contact one side of the conductive member 123, for example, the lower surface of the conductive contact 11121 of the switch member 1112 can contact the upper surface of the conductive member 123. Thereby, the conductive member 123 can be facilitated to contact the switch member 1112. In addition, the possibility of damage due to friction between the conductive member 123 and the switch member 1112 can be reduced.

[0146] In some examples, the width of the conductive member 123 can be greater than the distance between the two conductive contacts 11121, i.e. the width of the conductive member 123 can be greater than the predetermined pitch. Thereby, the conductive member 123 can be caused to conduct the two conductive contacts 11121.

[0147] In some examples, referring to FIG. 9B, the switch member 1112 can contact two sides of the conductive member 123, in other words, the conductive member 123 can be positioned between the two conductive contacts 11121 of the switch member 1112. In this case, by increasing the contact area between the conductive member 123 and the switch member 1112, the possibility of the switch member 1112 and the conductive member 123 being in a false contact can be reduced.

[0148] In some examples, the shape of the conductive member 123 and the conductive contacts 11121 of the switch member 1112 can be cylindrical or cuboid.

[0149] FIG. 10 is a flowchart illustrating a first embodiment of controlling the electronic module 111 by the switch module 115 according to examples of the present disclosure. FIG. 11 is a flowchart illustrating a second embodiment of controlling the electronic module 111 by the switch module 115 according to examples of the present disclosure.

[0150] In some examples, the electronic assembly 11 can further include a switch module 115 and a control module 116 (see FIG. 3A). In some examples, the switch module 115 can include a switch piece 1112. For convenience of description, some examples are described with two conductive contacts 11121 and one conductive piece 123 as an example.

[0151] In some examples, the switch module 115 can have an open state and a closed state. In some examples, the open state can be a state of the switch module 115 when the two conductive contacts 11121 are not conductive, and the closed state can be a state of the switch module 115 when the two conductive contacts 11121 are conductive.

[0152] In some examples, when the sensor assembly 12 is not coupled with the electronic assembly 11, i.e., the conductive piece 123 on the mounting base 124 does not contact the two conductive contacts 11121, the two conductive contacts 11121 can be open, i.e., the two contacts are not conductive by the conductive piece 123; when the sensor assembly 12 is coupled with the electronic assembly 11, i.e., the conductive piece 123 on the mounting base 124 contacts the two conductive contacts 11121, the two conductive contacts 11121 can be closed, i.e., the two conductive contacts 11121 are conductive by the conductive piece 123. In this case, by mounting the sensor assembly 12 on the electronic assembly 11, the switch module 115 can be switched from the open state to the closed state.

[0153] In some examples, referring to FIG. 10, when the switch module 115 is in the open state, the power module 112 can stop supplying power to the electronic module 111 to turn off the electronic module 111. In some examples, when the electronic module 111 is turned off, the electronic module 111 can stop sending the power-on signal to the control module 116. In this case, by the switch module 115 being in the open state, the electronic module 111 can be turned off.

[0154] In some examples, referring to FIG. 10, when the switch module 115 is in the closed state, the power module 112 can supply power to the electronic module 111 to turn on the electronic module 111. In some examples, when the electronic module 111 is turned on, the electronic module 111 can send the power-on signal to the control module 116. In this case, by the switch module 115 being in the closed state, the electronic module 111 can be turned on.

[0155] In some examples, the control module 116 can lock the power module 112 based on the power-on signal to cause the power module 112 to be in a locked state. In some examples, the locked state can cause the power module 112 to maintain power to the electronic module 111 regardless of the state of the switch module 115. In other words, the power module 112 in the locked state can maintain power to the electronic module 111 to cause the electronic module 111 to remain powered on when the switch module 115 is in either of the open state or the closed state.

[0156] It is noted that in the second embodiment of the control module 116, the open state and the closed state of the switch module 115 are the same as the first embodiment and will not be repeated.

[0157] In some examples, referring to FIG. 11, the control module 116 can detect the state of the switch module 115. In particular, when the control module 116 detects that the switch module 115 is in the open state, the control module 116 can send an off signal to the electronic module 111. In some examples, the off signal can change the pin level of the electronic module 111. In some examples, when the pin level of the electronic module 111 is changed by the off signal, the power module 112 can detect that the pin level of the electronic module 111 has changed, thereby stopping power to the electronic module 111 to cause the electronic module 111 to power off. In some examples, when the electronic module 111 powers off, the electronic module 111 can stop locking the power module 112. In this case, the electronic module 111 can be caused to power off by the switch module 115 being in the open state.

[0158] In some examples, referring to FIG. 11, when the control module 116 detects that the switch module 115 is in the closed state, the control module 116 can stop sending the off signal to the electronic module 111. In some examples, when the pin level of the electronic module 111 is not changed by the off signal, the power module 112 can detect that the pin level of the electronic module 111 has not changed, thereby powering the electronic module 111 to cause the electronic module 111 to power on. In some examples, when the electronic module 111 powers on, the electronic module 111 can lock the power module 112. In this case, the electronic module 111 can be caused to power on by the switch module 115 being in the closed state.

[0159] In some examples, the electronic module 111 locking the power module 112 can refer to the electronic module 111 sending a lock signal (not shown in FIG. 11) to the power module 112. In some examples, the lock signal can cause the power module 112 to be in a locked state. In some examples, the locked state can cause the power module 112 to maintain power to the electronic module 111 regardless of the pin level of the electronic module 111. In other words, the power module 112 in the locked state can maintain power to the electronic module 111 to keep the electronic module 111 powered on regardless of whether the pin level of the electronic module 111 changes or does not change.

[0160] Although the present disclosure is specifically illustrated in the above with reference to the drawings and examples, it is understood that the above description is not to limit the present disclosure in any form. Those skilled in the art can make modifications and changes to the present disclosure as needed without departing from the spirit and scope of the present disclosure, and these modifications and changes all fall within the scope of the present disclosure.

Claims

1. A continuous analyte monitor, characterized in that, A sensor assembly and an electronic assembly coupled with the sensor assembly, the sensor assembly comprising a sensor, a conductive member, and a mount for mounting the sensor and the conductive member, the sensor comprising an implanted portion and a connecting portion electrically connected with the electronic assembly; the electronic assembly comprising an electronic module, the electronic module comprising a switch member and an electrical contact, the connecting portion being electrically connected with the electrical contact and the conductive member being electrically connected with the switch member when the sensor assembly is coupled with the electronic assembly.

2. The continuous analyte monitor of claim 1, wherein, The sensor assembly further comprises an electrical connector for electrically connecting the connecting portion and the electrical contact.

3. The continuous analyte monitor of claim 2, wherein, The conductive member and the electrical connector are located on the same side of the connecting portion.

4. The continuous analyte monitor of claim 2, wherein, The mount further comprises a seal for sealing the connecting portion, the electrical contact, and the electrical connector.

5. The continuous analyte monitor of claim 4, wherein, The conductive member is disposed on the seal, the seal being used for sealing the conductive member and the switch member.

6. The continuous analyte monitor of claim 4, wherein, The seal has a first mounting position and a second mounting position, the electrical connector being disposed at the first mounting position and the conductive member being disposed at the second mounting position.

7. The continuous analyte monitor of claim 6, wherein, The seal has a hardness greater than that of the electrical connector and the conductive member at a portion between the first mounting position and the second mounting position.

8. The continuous analyte monitor of claim 1, wherein, The electronic assembly further comprises a housing for accommodating the electronic module, the housing forming a first mounting space and a second mounting space in communication with the first mounting space, the electronic module being disposed at the first mounting space and the mount being disposed at the second mounting space.

9. The continuous analyte monitor of claim 1, wherein, The switch member comprises at least two conductive contacts with a predetermined spacing.

10. The continuous analyte monitor of claim 9, wherein, The predetermined spacing is 0.02 millimeters to 4 millimeters.

Images