Optical module and electronic device comprising same

Abstract

According to an embodiment of the present disclosure, an optical module and / or an electronic device comprising same may comprise: a first substrate; a light-emitting element assembly disposed on the first substrate and configured to emit light in a designated wavelength band; a light-receiving element disposed on the first substrate at one side of the light-emitting element assembly and including a first detection area configured to receive first light reflected by a subject after being emitted by the light-emitting element assembly; and a first casing disposed on the first substrate and configured to provide a second accommodation space for accommodating the first detection area, a guide structure disposed between the light-emitting element assembly and the second accommodation space, and a second partition wall extending from the inner side between the guide structure and the second accommodation space and disposed to face the light-receiving element. In an embodiment, the light-receiving element may further include a second detection area provided on one side of the first detection area and at least partially disposed inside the guide structure. In an embodiment, the second detection area may be configured to receive second light that is a portion of light emitted by the light-emitting element assembly and that is guided by the guide structure. Other various embodiments may also be possible.

Description

Optical module and electronic device including the same

[0001] The present disclosure relates to an optical module and / or an electronic device including the same.

[0002] With the advancement of electronics, information, and communication technologies, a variety of functions are being integrated into a single electronic device. For example, smartphones incorporate functions such as communication, audio playback, imaging, and electronic organizers. Furthermore, with the installation of additional applications, even more functions can be implemented on smartphones. As a single electronic device becomes more diverse, specialized electronic devices like electronic organizers, multimedia players, and compact digital cameras are being replaced by multifunctional devices like smartphones.

[0003] As diverse functions are implemented within a single electronic device and people carry and use them on a daily basis, users increasingly demand ease of use, portability, and high performance (e.g., fast information processing or high-quality images and audio). For example, electronic devices are incorporating increasingly sophisticated displays and speakers to deliver higher-quality images and audio, and the performance of programs and integrated circuit chips for processing image and audio signals is increasing.

[0004] In miniaturized electronic devices such as smartphones, improving the quality of captured images or videos can be challenging. For example, while cameras equipped on electronic devices can improve the quality of captured images or videos by incorporating high-resolution image sensors, there may be limitations in integrating lenses (or lens assemblies) that simultaneously satisfy telephoto, wide-angle, or macro capabilities into the miniaturized electronic device. By integrating multiple cameras (e.g., a telephoto camera, a wide-angle camera, a macro camera, or a portrait camera) into a single electronic device, the quality of captured images or videos can be improved while miniaturizing the electronic device. For example, implementing a single camera with good telephoto, wide-angle, and / or macro capabilities requires a large number of lenses and a mechanism for adjusting the relative positions of the lenses, which can be difficult to integrate into a miniaturized electronic device. On the other hand, combining multiple cameras with different angles of view can improve the quality of captured images while making it easier to integrate into a miniaturized electronic device.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0006] According to one embodiment of the present disclosure, an optical module and / or an electronic device including the same may include a first substrate, a light-emitting element assembly disposed on the first substrate and configured to emit light of a specified wavelength band, a light-receiving element disposed on the first substrate at one side of the light-emitting element assembly and including a first detection area configured to receive first light emitted by the light-emitting element assembly and then reflected by a subject, and a first casing disposed on the first substrate and configured to provide a second receiving space accommodating the first detection area, a guide structure disposed between the light-emitting element assembly and the second receiving space, and a second partition wall extending from an inner surface between the guide structure and the second receiving space and disposed to face the light-receiving element. In one embodiment, the light-receiving element may further include a second detection area provided on one side of the first detection area and disposed at least partially inside the guide structure. In one embodiment, the second detection area may be configured to receive a second light guided by the guide structure that is part of the light emitted by the light emitting element assembly.

[0007] According to one embodiment of the present disclosure, an electronic device may include a housing, an optical module disposed in the housing and configured to emit light of a specified wavelength band and receive a first light reflected by a subject among the emitted light, at least one processor, and a memory storing instructions that, when individually or collectively executed by the at least one processor, cause the electronic device to calculate distance information to the subject based on at least the first light. In one embodiment, the optical module may include a first substrate, a light-emitting element assembly disposed in the first substrate and configured to emit light of a specified wavelength band, a light-receiving element including a first detection area disposed in the first substrate at one side of the light-emitting element assembly and configured to receive the first light, and a first casing disposed in the first substrate and configured to provide a first receiving space for accommodating the light-emitting element assembly, a second receiving space for accommodating the first detection area, and a guide structure disposed between the first receiving space and the second receiving space. In one embodiment, the light-receiving element may further include a second detection area provided on one side of the first detection area and positioned at least partially within the guide structure. In one embodiment, the second detection area may be configured to receive a second light guided by the guide structure that is part of the light emitted by the light-receiving element assembly.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to embodiments.

[0010] FIG. 2 is a perspective view showing the front of an electronic device according to embodiments.

[0011] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to embodiments.

[0012] FIG. 4 is an exploded perspective view showing the front side of an electronic device according to embodiments.

[0013] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to embodiments.

[0014] Figure 6 is a perspective view showing an optical module according to embodiments.

[0015] FIG. 7 is a drawing showing an optical module according to embodiments, cut along line L1 of FIG. 6.

[0016] FIG. 8 is a drawing showing an optical module according to embodiments, cut along line L2 of FIG. 6.

[0017] FIG. 9 is a perspective view showing a light emitting element assembly of an optical module according to embodiments.

[0018] Fig. 10 is a perspective view illustrating a state in which a light-emitting element assembly of an optical module according to embodiments is arranged in a first casing.

[0019] Fig. 11 is a plan view showing a portion of a light emitting element assembly of an optical module according to embodiments.

[0020] Fig. 12 is a drawing for explaining a light emitting element assembly of an optical module according to embodiments.

[0021] Fig. 13 is a drawing for explaining the path along which the reference light of the optical module according to the embodiments proceeds.

[0022] Fig. 14 is a graph illustrating the first measurement results of an optical module according to embodiments.

[0023] Fig. 15 is a graph illustrating the second measurement results of the optical module according to the embodiments.

[0024] Fig. 16 is a flowchart illustrating a method for measuring reception deviation in an optical module according to embodiments.

[0025] Fig. 17 is a flowchart illustrating a method for measuring subject distance information using an optical module according to embodiments.

[0026] FIG. 18 is a perspective view illustrating the internal configuration of a wearable electronic device according to embodiments.

[0027] FIGS. 19 and 20 are drawings showing the front and back of a wearable electronic device according to embodiments.

[0028] FIG. 21 is a drawing showing a portion of a wearable electronic device according to embodiments.

[0029] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0030] By utilizing distance to a subject (or depth of field) information, the quality of captured images or videos can be improved even in miniaturized electronic devices. This distance information can be utilized to implement security features such as user facial recognition. For example, distance information can be detected by emitting light (e.g., infrared) from an electronic device, receiving the light reflected by a subject, and measuring the time between the emission and the reception. For example, an electronic device can detect distance information to a subject by including an infrared light source and an infrared receiver. Infrared laser light can be effectively utilized to measure distance information to a subject. Emitting infrared laser light can generate high temperatures, and if the operating environment changes due to the generated heat, the distance information for a subject at the same distance can be detected differently.

[0031] One embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and at least provide the advantages described below, and can provide an optical module and / or an electronic device including the same that facilitates the dispersion or release of generated heat.

[0032] One embodiment of the present disclosure can provide an optical module and / or an electronic device including the same in which deviation of detection information for a subject distance according to an operating environment is suppressed.

[0033] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0034] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0035] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0036] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could refer to one or more of the surfaces of a component.

[0037] FIG. 1 is a block diagram of an electronic device (1001) within a network environment (1000) according to embodiments. Referring to FIG. 1, in the network environment (1000), the electronic device (1001) may communicate with the electronic device (1002) via a first network (1098) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1004) or the server (1008) via a second network (1099) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1001) may communicate with the electronic device (1004) via the server (1008). According to one embodiment, the electronic device (1001) may include a processor (1020), a memory (1030), an input module (1050), an audio output module (1055), a display module (1060), an audio module (1070), a sensor module (1076), an interface (1077), a connection terminal (1078), a haptic module (1079), a camera module (1080), a power management module (1088), a battery (1089), a communication module (1090), a subscriber identification module (1096), or an antenna module (1097). In one embodiment, the electronic device (1001) may omit at least one of these components (e.g., the connection terminal (1078)), or may have one or more other components added. In one embodiment, some of these components (e.g., sensor module (1076), camera module (1080), or antenna module (1097)) may be integrated into one component (e.g., display module (1060)).

[0038] The processor (1020) may, for example, execute software (e.g., a program (1040)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1001) connected to the processor (1020) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1020) may store commands or data received from other components (e.g., a sensor module (1076) or a communication module (1090)) in a volatile memory (1032), process the commands or data stored in the volatile memory (1032), and store result data in a non-volatile memory (1034). According to one embodiment, the processor (1020) may include a main processor (1021) (e.g., a central processing unit or an application processor), or an auxiliary processor (1023) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1021). For example, when the electronic device (1001) includes the main processor (1021) and the auxiliary processor (1023), the auxiliary processor (1023) may be configured to use less power than the main processor (1021) or to be specialized for a given function. The auxiliary processor (1023) may be implemented separately from the main processor (1021) or as a part thereof.

[0039] The auxiliary processor (1023) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1060), the sensor module (1076), or the communication module (1090)) of the electronic device (1001), for example, on behalf of the main processor (1021) while the main processor (1021) is in an inactive (e.g., sleep) state, or together with the main processor (1021) while the main processor (1021) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1023) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1080) or a communication module (1090)). In one embodiment, the auxiliary processor (1023) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1001) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1008)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0040] The memory (1030) can store various data used by at least one component (e.g., the processor (1020) or the sensor module (1076)) of the electronic device (1001). The data can include, for example, software (e.g., the program (1040)) and input data or output data for commands related thereto. The memory (1030) can include volatile memory (1032) or non-volatile memory (1034).

[0041] The program (1040) may be stored as software in memory (1030) and may include, for example, an operating system (1042), middleware (1044), or an application (1046).

[0042] The input module (1050) can receive commands or data to be used in a component of the electronic device (1001) (e.g., a processor (1020)) from an external source (e.g., a user) of the electronic device (1001). The input module (1050) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0043] The audio output module (1055) can output audio signals to the outside of the electronic device (1001). The audio output module (1055) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0044] The display module (1060) can visually provide information to an external party (e.g., a user) of the electronic device (1001). The display module (1060) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display module (1060) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0045] The audio module (1070) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1070) can acquire sound through the input module (1050), output sound through the sound output module (1055), or an external electronic device (e.g., electronic device (1002)) (e.g., speaker or headphone)) directly or wirelessly connected to the electronic device (1001).

[0046] The sensor module (1076) can detect the operating status (e.g., power or temperature) of the electronic device (1001) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1076) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0047] The interface (1077) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1001) to an external electronic device (e.g., the electronic device (1002)). In one embodiment, the interface (1077) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0048] The connection terminal (1078) may include a connector through which the electronic device (1001) may be physically connected to an external electronic device (e.g., electronic device (1002)). According to one embodiment, the connection terminal (1078) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The haptic module (1079) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1079) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0050] The camera module (1080) can capture still images and videos. In one embodiment, the camera module (1080) may include one or more lenses, image sensors, image signal processors, or flashes.

[0051] The power management module (1088) can manage power supplied to the electronic device (1001). According to one embodiment, the power management module (1088) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0052] A battery (1089) may power at least one component of the electronic device (1001). In one embodiment, the battery (1089) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0053] The communication module (1090) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1001) and an external electronic device (e.g., electronic device (1002), electronic device (1004), or server (1008)), and the performance of communication through the established communication channel. The communication module (1090) may operate independently from the processor (1020) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1090) may include a wireless communication module (1092) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1094) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (1098) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1099) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1092) can verify or authenticate the electronic device (1001) within a communication network such as the first network (1098) or the second network (1099) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1096).

[0054] The wireless communication module (1092) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1092) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1092) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1092) may support various requirements specified in the electronic device (1001), an external electronic device (e.g., the electronic device (1004)), or a network system (e.g., the second network (1099)). According to one embodiment, the wireless communication module (1092) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0055] The antenna module (1097) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1097) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1098) or the second network (1099), may be selected from the plurality of antennas, for example, by the communication module (1090). A signal or power may be transmitted or received between the communication module (1090) and an external electronic device via the at least one selected antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1097).

[0056] In one embodiment, the antenna module (1097) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0057] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0058] According to one embodiment, commands or data may be transmitted or received between the electronic device (1001) and an external electronic device (1004) via a server (1008) connected to a second network (1099). Each of the external electronic devices (1002 or 104) may be the same or a different type of device as the electronic device (1001). According to one embodiment, all or part of the operations executed in the electronic device (1001) may be executed in one or more of the external electronic devices (1002, 1004, or 1008). For example, when the electronic device (1001) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1001) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1001). The electronic device (1001) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1001) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (1004) may include an Internet of Things (IoT) device. The server (1008) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (1004) or the server (1008) may be included in the second network (1099).The electronic device (1001) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0059] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0060] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it is understood that the component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component.

[0061] The term "module" used in the embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0062] Embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0063] According to one embodiment, a method according to the embodiment(s) of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online (e.g., by download or upload). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0064] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0065] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In embodiments, with respect to the direction in which the components are oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device and / or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In embodiments, the side of the electronic device and / or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In embodiments, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of such directions or components does not limit the embodiment(s) of the present disclosure. For example, depending on the design specifications of the electronic device or the user's usage habits, the orthogonal coordinate system may be defined differently from that in the present disclosure.

[0066] Fig. 2 is a perspective view showing the front side of an electronic device (100) according to embodiments. Fig. 3 is a perspective view showing the rear side of the electronic device (100) illustrated in Fig. 2 according to embodiments.

[0067] Referring to FIGS. 2 and 3, an electronic device (100) according to embodiments (e.g., the electronic device (1001) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In embodiments, the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B), and the side surface (110C) of FIG. 3. According to embodiments, the first side (110A) may be formed by a front plate (102) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The rear plate (111) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (102) and the rear plate (111) and comprises a metal and / or polymer. In embodiments, the rear plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0068] The front plate (102) may include a region(s) that is(areas) that is(areas) that is(areas) that is(are) curved and extends seamlessly toward the rear plate (111) at least at a portion of an edge thereof. In embodiments, the front plate (102) (or the rear plate (111)) may include only one of the regions that is(areas) that is(are) curved and extends toward the rear plate (111) (or the front plate (102)) at one edge of the first surface (110A). According to embodiments, the front plate (102) or the rear plate (111) may be substantially flat. For example, it may not include a curved and extending region. When it includes a curved and extending region, the thickness of the electronic device (100) in the portion that includes the curved and extending region may be smaller than that of other portions.

[0069] According to embodiments, the electronic device (100) may include at least one of a display (101), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (104), a second sensor module, a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (108), a second connector hole (109)). In embodiments, the electronic device (100) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include another component.

[0070] The display (101) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (102)). In embodiments, at least a portion of the display (101) may be visually exposed through the front plate (102) forming the first surface (110A) or through a portion of the side surface (110C). In embodiments, the corners of the display (101) may be formed to be substantially the same as the adjacent outer shape of the front plate (102). In embodiments, in order to expand the area in which the display (101) is visually exposed, the gap between the outer edge of the display (101) and the outer edge of the front plate (102) may be formed to be substantially the same.

[0071] In embodiments, a recess or opening may be formed in a part of a screen display area of ​​the display (101), and at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In embodiments, at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), a fingerprint sensor, and a light-emitting element (106) may be included on a back surface of the screen display area of ​​the display (101). In embodiments, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one embodiment, when the front plate (102) or the rear plate (111) includes a curved and extended area(s), at least a portion of the sensor module (e.g., the first sensor module (104), the third sensor module (119)) and / or at least a portion of the key input device (117) may be disposed in the curved and extended area(s).

[0072] The audio modules (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed inside to acquire external sound, and in embodiments, multiple microphones may be disposed to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In embodiments, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0073] The sensor module can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module may include, for example, a first sensor module (104) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (101)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (100) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0074] The camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (100), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light-emitting diode or a xenon lamp. In embodiments, one or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (100). In embodiments, the flash (113) may emit infrared light, and infrared light emitted by the flash (113) and reflected by a subject may be received via the third sensor module (119). The electronic device (100) or the processor of the electronic device (100) (e.g., the processor (1020) of FIG. 1) can detect distance information to the subject based on the point in time when infrared rays are received from the third sensor module (119).

[0075] The key input device (117) may be disposed on a side surface (110C) of the housing (110). In embodiments, the electronic device (100) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101). In embodiments, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0076] The light emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light emitting element (106) may provide, for example, status information of the electronic device (100) in the form of light. In embodiments, the light emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light emitting element (106) may include, for example, a light emitting diode (LED), an infrared LED, and a xenon lamp.

[0077] The connector hole (e.g., the first connector hole (108), the second connector hole (109)) may include a first connector hole (108) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0078] FIG. 4 is an exploded perspective view showing a front side of an electronic device (200) according to embodiments (e.g., the electronic device (100) illustrated in FIG. 2). FIG. 5 is an exploded perspective view showing a rear side of an electronic device (200) according to embodiments (e.g., the electronic device (100) illustrated in FIG. 3).

[0079] Referring to FIGS. 4 and 5, the electronic device (200) (e.g., the electronic device (1001, 1002, 1004, 100) of FIG. 1, FIG. 2 or FIG. 3) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (102) of FIG. 2), a display (230) (e.g., the display (101) of FIG. 2), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna (e.g., the antenna module (1097) of FIG. 1), a camera assembly (207) and a rear plate (280) (e.g., the rear plate (111) of FIG. 3). In embodiments, the electronic device (200) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include another component. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (100) of FIG. 2 or FIG. 3, and any redundant description may be omitted below.

[0080] The first support member (211) may be disposed inside the electronic device (200) and connected to the side structure (210), or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., a processor (1020) of FIG. 1), a memory (e.g., a memory (1030) of FIG. 1), and / or an interface (e.g., an interface (1077) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In embodiments, the processor and / or memory may refer to one of the circuit devices mounted on an integrated circuit chip.

[0081] According to embodiments, the first support member (211) and the side structure (210) may be combined to be referred to as a front case or housing (201). According to embodiments, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In embodiments, the housing (201) may be understood as including a structure that can be visually or tactilely recognized by a user in the appearance of the electronic device (200), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In embodiments, the 'front or rear surface of the housing (201)' may refer to the first surface (110A) of FIG. 2 or the second surface (110B) of FIG. 3. In embodiments, the first support member (211) is disposed between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the rear plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0082] The display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In embodiments, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In embodiments, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to embodiments, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0083] The memory may include, for example, volatile memory or non-volatile memory.

[0084] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0085] The second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In embodiments, the upper support member (260a) may be arranged to surround the printed circuit board (240) together with a portion of the first support member (211). For example, the printed circuit board (240) may be substantially arranged between the first support member (211) and the second support member (260) (e.g., the upper support member (260a)). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to embodiments, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In embodiments, at least one shield can (249) may be arranged on the printed circuit board (240). For example, the shield can (249) may provide an electromagnetic shielding environment to a portion or space on a printed circuit board (240). In embodiments, the shield can (249) may be arranged to surround at least a portion of an integrated circuit chip having a processor, memory, and / or communication module mounted thereon.

[0086] According to embodiments, the lower support member (260b) can be utilized as a structure for arranging electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In embodiments, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) can be arranged on an additional printed circuit board. For example, the lower support member (260b) can be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board or the lower support member (260b) can be arranged corresponding to the audio module (e.g., the microphone hole (103) or the speaker hole (e.g., the external speaker hole (107), the call receiver hole (114))) or the connector hole (e.g., the first connector hole (108), the second connector hole (109)) of FIG. 2.

[0087] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

[0088] The antenna may include a conductive pattern implemented on the surface of the first support member (211) and / or the surface of the second support member (260), for example, through a laser direct structuring (LDS) method. In embodiments, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In embodiments, another antenna structure may be formed by the side structure (210) and / or a portion of the first support member (211), or a combination thereof.

[0089] The camera assembly (207) may include at least one camera module. Within the electronic device (200), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212a, 212b, 212c, 213, 219). In embodiments, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In embodiments, the camera module(s) of the camera assembly (207) may be generally aligned with any one of the camera windows (212a, 212b, 212c, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)). When the electronic device (200) includes a distance information detection function, a portion of the camera assembly (207) may include a light-emitting element. In embodiments, when the electronic device (200) includes a distance information detection function, additional light-emitting elements and / or additional light-receiving elements may be provided in the camera assembly (207).

[0090] The configuration of the electronic devices (1001, 1002, 1004, 100, 200) described above may be referenced in the detailed description below. Even if not directly mentioned, the configuration of the above-described embodiment may be similarly applied to the embodiments described below. Although the electronic device illustrated is a bar type device, the embodiments of the present disclosure are not limited thereto, and the optical module described below may be similarly or substantially identically arranged in a foldable type, a rollable type, and / or a slide type device.

[0091] Fig. 6 is a perspective view showing an optical module (307) according to embodiments. Fig. 7 is a drawing showing an optical module (307) according to embodiments, cut along line L1 of Fig. 6. Fig. 8 is a drawing showing an optical module (307) according to embodiments, cut along line L2 of Fig. 6.

[0092] Referring to FIGS. 6 to 8, the optical module (307) may include a first substrate (371), a light emitting element assembly (373), a light receiving element (375), and / or a first casing (377). In embodiments, the optical module (307) may include a flexible printed circuit board (371a). The flexible printed circuit board (371a) may extend from the first substrate (371) and be electrically connected to a main circuit board (e.g., the printed circuit board (240) of FIG. 4 or 5), for example. In embodiments, the light receiving element (375) may include a first detection area (375a) configured to receive first light (RL1) that is emitted by the light emitting element assembly (373) and then reflected by a subject. In embodiments, the light receiving element (375) may include a second detection area (375b) configured to receive a second light (RL2) (e.g., the second light (RL2) of FIG. 13) that is part of the light emitted by the light emitting element (373d) and guided through a path within the optical module (307). For example, the light receiving element (375) may receive light (e.g., the first light (RL1) and the second light (RL2)) incident through at least two different paths, and the optical module (307) and / or an electronic device (e.g., the electronic devices 1001, 1002, 1004, 100, and 200 of FIGS. 1 to 5) may calculate or determine a distance to a subject based on the light(s) received by the light receiving element (375).

[0093] According to embodiments, the optical module (307) includes a first casing (377), thereby guiding a portion of the light (e.g., the second light (RL2) of FIG. 13) output from the light emitting element assembly (373) to the light receiving element (375) (e.g., the second detection area (375b)) through an independent path for light emitted toward the subject (e.g., the radiated light (EL)). In embodiments, the second light (RL2) may be at least a portion of the light that is reflected or refracted inside the first casing (377) and is not emitted toward the subject. In embodiments, it may be understood that the internal structure or internal shape of the first casing (377) guides or guides a portion of the light (e.g., the second light (RL2) of FIG. 13) output from the light emitting element assembly (373) to the light receiving element (375).

[0094] According to embodiments, the first substrate (371) may be a mechanical structure that arranges a light emitting element assembly (373), a light receiving element (375), and / or a first casing (377), and may provide wiring for transmitting power or an electrical signal to the light emitting element assembly (373) and the light receiving element (375). In embodiments, the first substrate (371) may be electrically connected to another component (e.g., a printed circuit board (or substrate assembly) (240) of FIG. 4 or 5) via a flexible printed circuit board. An active or passive component other than the light emitting element assembly (373) or the light receiving element (375) may be arranged on the first substrate (371). In embodiments, the first substrate (371) may be made of a dielectric material or a ceramic material (e.g., low temperature co-fired ceramic (LTCC) or high temperature co-fired ceramic (HTCC)). For example, the first substrate (371) may be made of a material with high thermal conductivity, such as ceramic, and may be made of a material other than ceramic, taking into consideration the specifications or manufacturing cost required for the optical module (307) and / or the electronic device (e.g., the electronic device (1001, 1002, 1004, 100, 200) of FIGS. 1 to 5).

[0095] According to embodiments, the light emitting element assembly (373) may be arranged on the first substrate (371) to receive power or a control signal and configured to emit light of a specified wavelength band. For example, when the optical module (307) is used to detect distance information, the light emitting element assembly (373) may be configured to emit laser light of an infrared wavelength band. In embodiments, the light emitting element assembly (373) may include a second substrate (373a) including a ceramic material (e.g., LTCC or HTCC), a driving circuit (e.g., an integrated circuit chip (373b)) mounted on the second substrate (373a), and / or a light emitting element (373d). The light emitting element (373d) may be configured to emit light of a specified wavelength band under control of the driving circuit. In embodiments, when the optical module (307) is used to detect distance information, the light emitting element (373d) may emit infrared laser light. In embodiments, the light emitting element (373d) may include a vertical cavity surface emitting laser (VCSEL). In embodiments, light output from the light emitting element (373d) is substantially provided as radiant light (EL), and a portion of the light output from the light emitting element (373d) may be incident on the second detection area (375b) inside the first casing (377).

[0096] According to embodiments, the second substrate (373a) may be a structure in which an integrated circuit chip (373b) having a built-in driving circuit and / or a light-emitting element (373d) is disposed, and may provide wiring for transmitting power or an electric signal to the integrated circuit chip (373b) and / or the light-emitting element (373d). An active element or a passive element different from the driving circuit or the light-emitting element (373d) may be disposed on the second substrate (373a). In embodiments, the second substrate (373a) may be made of a ceramic material (e.g., LTCC or HTCC). For example, the second substrate (373a) may be made of LTCC or HTCC with high thermal conductivity, thereby quickly dissipating generated heat (e.g., heat generated by the light-emitting element (373d)) to another structure or another area.

[0097] According to embodiments, the light emitting element assembly (373) may be disposed on the first substrate (371) through surface mounting technology (SMT). For example, the light emitting element assembly (373) may be assembled on the first substrate (371) with the driving circuit and the light emitting element (373d) disposed on the second substrate (373a). In embodiments, the light emitting element assembly (373) may further include a second casing (373c), thereby preventing the light emitting element (373d) or the integrated circuit chip (373b) from being damaged during the process of assembling the assembly on the first substrate (371). For example, the second casing (373c) may be disposed on the second substrate (373a) while housing the integrated circuit chip (373b) and / or the light emitting element (373d). With the second casing (373c) placed, the second substrate (373a) is at least partially exposed to the external space of the light emitting element assembly (373), thereby allowing heat generated inside the second casing (373c) to be moved or released to the outside of the second casing (373c).

[0098] According to embodiments, the light emitting element assembly (373) may further include a first guide hole (373g) provided in the second casing (373c). The first guide hole (373g) may be disposed, for example, between the light emitting element (373d) and the light receiving element (375) (e.g., the second detection area (375b)). In embodiments, a portion of the light output from the light emitting element (373d) may not be emitted outside the optical module (307) but may be reflected or refracted by another structure inside the second casing (373c) and guided to the second detection area (375b) through the first guide hole (373g). In embodiments, the position or size of the first guide hole (373g) may be implemented in various ways by considering the relative positions of the light emitting element (373d) and the second detection area (375b), and / or the path of light reflected or refracted within the second casing (373c).

[0099] According to embodiments, when the light-emitting element (373d) emits infrared laser light for detecting distance information, the optical module (307) and / or the light-emitting element assembly (373) may include optical element(s), such as a diffractive optical element (DOE) (373f) and / or a collimator (373e). For example, by providing optical element(s), such as a diffractive optical element and / or a collimator, at least a portion of the light output from the light-emitting element (373d) may be guided or aligned in a designated direction. Here, the direction in which the output light is aligned may refer to the direction in which a camera (e.g., the camera assembly (207) of FIG. 4 or 5) is directed when photographing a subject. In embodiments, an optical element such as a diffractive optical element (373f) or a collimator (373e) may be disposed in another structure such as an opening (377e) of the first casing (377). In embodiments, an optical element such as a diffractive optical element (373f) or a collimator (373e) may be disposed in a light emitting element assembly (373) (e.g., a second casing (373c)) as a component that aligns or focuses light (e.g., radiated light (EL)) emitted from a light emitting element (373d), thereby facilitating setting of the direction of propagation of the radiated light (EL).

[0100] According to embodiments, as optical elements for aligning the output light, a diffractive optical element and a collimator are exemplified, but embodiments of the present disclosure are not limited thereto, and the type or number of optical elements may be implemented differently from the exemplified embodiment depending on the specifications required for the optical module (307). For example, the diffractive optical element and the collimator may be replaced with an optical element such as a meta-lens, or additional optical elements not mentioned may be selectively combined. In embodiments, when including a diffractive optical element and / or a collimator, during the process of assembling the light emitting element assembly (373), the optical elements may be aligned and / or fixed at a designated position with respect to the light emitting element (373d) in accordance with the design specifications.

[0101] In embodiments, as mentioned above, the light receiving element (375) may include a first detection area (375a) configured to receive externally incident light, and a second detection area (375b) provided on one side (e.g., adjacent to one side) of the first detection area (375a). The light received by the first detection area (375a) may be, for example, first light (RL1) reflected by the subject after being emitted by the light emitting element assembly (373). In embodiments, the second detection area (375b) may detect at least a portion of light reflected or refracted within the second casing (373c) among the light emitted by the light emitting element (373d). For example, most of the light output by the light emitting element (373d) at a given point in time is reflected by the subject and detected by the first detection area (375a), and some of the light output by the light emitting element (373d) at a given point in time can travel through the interior of the first casing (377) and be detected by the second detection area (375b).

[0102] According to embodiments, the optical module (307) and / or the electronic device may calculate or determine the subject distance from the time from when light is emitted from the light emitting element assembly (373) to when the first detection area (375a) receives the first light (RL1). In embodiments, the time from when light is emitted from the light emitting element assembly (373) may be calculated or determined based on the time from when the second detection area (375b) receives the second light (RL2) under conditions of substantially performing an operation of detecting distance information. For example, the distance information may be calculated or determined based on the time from when the second light (RL2) reaches the second detection area (375b) to when the first light (RL1) reaches the first detection area (375a). In embodiments, when the amount of light (e.g., the amount of light of the first light (RL1) and / or the amount of light of the second light (RL2)) reaching the first detection area (375a) and / or the second detection area (375b) satisfies a specified size (e.g., 'TL' of FIG. 14 or 15), the point in time at which light is emitted from the light emitting element assembly (373) can be determined and / or the subject distance can be calculated or determined. In embodiments, the light emitting element assembly (373) may emit the first light (RL1) in the form of approximately 60,000 or more pulses toward the subject, and the point in time at which the first light (RL1) is received or the subject distance can be calculated or determined based on the point in time at which the largest number of pulses is received in the first detection area (375a). Such calculation or determination of the point in time or distance can suppress noise caused by interference from natural light or reflected light incident from an unintended direction.

[0103] According to embodiments, when a deviation occurs due to the operating environment (e.g., temperature), the deviation in the arrival time of the first light (RL1) may be substantially the same as the deviation in the arrival time of the second light (RL2). For example, even if there is a deviation due to the operating environment, when determining information about the distance based on the arrival times of the first light (RL1) and the second light (RL2), distortion of the distance information due to the operating environment can be suppressed. This will be discussed again with reference to FIGS. 14 and 15. For example, since a deviation in the operating environment, such as temperature, may occur due to the arrival time of the first light (RL1) and the arrival time of the second light (RL2) being substantially the same, when determining the distance to the subject based on the time difference between the arrival time of the first light (RL1) in the first detection area (375a) and the arrival time of the second light (RL2) in the second detection area (375b), deviation in distance measurement due to the operating environment can be suppressed.

[0104] According to embodiments, the first casing (377) may include a first receiving space (307a) for receiving a light-emitting element assembly (373), a second receiving space (307b) for receiving at least a portion of the first detection area (375a), and / or a guide structure (307c) disposed between the first receiving space (307a) and the second receiving space (307b). In embodiments, when the first detection area (375a) is disposed in the second receiving space (307b), at least a portion of the second detection area (375b) may be disposed inside the guide structure (307c). For example, the second receiving space (307b) and the guide structure (307c) may be provided as an area (or space) for receiving the light-receiving element (375). In embodiments, the light emitting element assembly (373) may be disposed in the first receiving space (307a) with the first guide hole (373g) aligned with the guide structure (307c). As a result, the first guide hole (373g) may function as a path for guiding the second light (RL2) from the inside of the second casing (373c) to the inside of the guide structure (307c). In embodiments, by being aligned with the first guide hole (373g), the guide structure (307c) may function as a structure for guiding or guiding the second light (RL2) to be incident on the second detection area (375b). In embodiments, the first casing (377) may be disposed on the first substrate (371) with the light emitting element assembly (373) and the light receiving element (375) disposed on the first substrate (371) by surface mounting technology.

[0105] According to embodiments, the first casing (377) may include a first partition wall (377c) disposed between the guide structure (307c) and the first receiving space (307a) and / or a second partition wall (377a) disposed between the guide structure (307c) and the second receiving space (307b). In embodiments, the first partition wall (377c) may be a portion of a structure that substantially guides the assembly position of the light emitting element assembly (373). For example, the first partition wall (377c) may extend from an inner surface of the first casing (377) toward the first substrate (371), and a portion of an outer surface of the light emitting element assembly (373) (e.g., the second casing (373c)) may be disposed to substantially face the first partition wall (377c). In embodiments, the second partition wall (377a) may be disposed to extend from the inner surface of the first casing (377) between the guide structure (307c) and the second receiving space (307b) and face the first substrate (371) and / or the light receiving element (375). In embodiments, the second partition wall (377a) may be disposed to correspond at least partially to the boundary between the first detection area (375a) and the second detection area (375b).

[0106] According to embodiments, the first partition wall (377c) may provide a second guide hole (377d) aligned with the first guide hole (373g). The second guide hole (377d) may be, for example, a hole at least partially surrounded by the first partition wall (377c) and the first substrate (371) and may provide a path for the second light (RL2) to enter the interior of the guide structure (307c). In embodiments, the second guide hole (377d) may provide a larger cross-sectional area or a larger space than the first guide hole (373g).

[0107] According to embodiments, the second partition wall (377a) may be disposed at least partially between the second receiving space (307b) and the guide structure (307c). For example, the second partition wall (377a) may allow the first light (RL1) reflected by the subject to be incident on the first detection area (375a) but may inhibit or block the light from being incident on the second detection area (375b). In embodiments, the second partition wall (377a) may inhibit or block the second light (RL2) guided to the second detection area (375b) through the guide structure (307c) from being incident on the first detection area (375a). In embodiments, the second partition wall (377a) may have a closed curve trajectory corresponding to the edge of the first detection area (375a). For example, the second bulkhead (377a) may be provided as a structure that divides or separates the space in which the first detection area (375a) is arranged from the remaining space inside the first casing (377).

[0108] According to embodiments, the optical module (307) may include a lens assembly (379) configured to focus or guide the first light (RL1) to the first detection area (375a). The lens assembly (379) may include, for example, at least one lens, and may guide the first light (RL1) reflected by the subject to the first detection area (375a). For example, a diffractive optical element (373f) or a collimator (373e) may be an optical system that focuses or guides light (e.g., radiated light (EL)) emitted from the light emitting element assembly (373) toward the subject, and the lens assembly (379) may be an optical system that guides light (e.g., first light (RL1)) reflected by the subject to the first detection area (375a).

[0109] According to embodiments, the light emitting element (373d), the diffractive optical element (373f), the collimator (373e), the lens assembly (379), and / or the light receiving element (375) (e.g., the first detection area (375a)) may be arranged or aligned to emit light (e.g., infrared laser light) toward a subject and receive light that is reflected by the subject after being emitted toward the subject. In embodiments, the light receiving element (375) may include a first detection area (375a) configured to receive first light (RL1) that is reflected by the subject after being emitted by the light emitting element assembly (373). In embodiments, the light receiving element (375) may include a second detection area (375b) configured to receive a second light (RL2) (e.g., the second light (RL2) of FIG. 13) that is part of the light emitted by the light emitting element (373d) and guided through a path within the optical module (307).

[0110] According to embodiments, the light emitting element (373d), the diffractive optical element, the collimator, the lens assembly (379), and / or the light receiving element (375) (e.g., the first detection area (375a)) may be assembled to the first substrate (371) within a specified error range. In embodiments, when the light emitting element (373d), the diffractive optical element (373f), the collimator (373e), the lens assembly (379), and / or the light receiving element (375) are individually assembled to the first substrate (371), if a defect occurs, a considerable amount of time may be required in the process of correcting the alignment state or error of the individual components, or the individual components may be damaged in the process of removing / replacing the individual components. In embodiments, during the process of manufacturing / assembling the light emitting element (373d), the diffractive optical element, and / or the collimator into the light emitting element assembly (373), defects or errors in the light emitting element assembly (373) can be confirmed / corrected, thereby facilitating improvement in the defect rate. In embodiments, when the light emitting element assembly (373) is already placed on the first substrate (371), defects or errors confirmed during the process of assembling the light receiving element (375) and / or the lens assembly (379) can be corrected during the process of assembling the light receiving element (375) and / or the lens assembly (379), thereby reducing the time and cost required for manufacturing / assembling the optical module (307) and facilitating improvement in the defect rate.

[0111] According to embodiments, the optical module (307) may include at least one reflective member (e.g., the reflective member (473) of FIG. 11 or 12) and / or an inclined surface (377f). For example, in providing a portion of the light output from the light emitting element (373d) to the second detection area (375b), the optical module (307) may use at least one reflective member (473) and / or an inclined surface (377f) to guide the second light (RL2) from the inside of the first receiving space (307a) (or the inside of the second casing (373c)) to the guide structure (307c) and / or to the second detection area (375b). In embodiments, when light is reflected by a structure such as an inner wall of the second casing (373c) or a collimator (373e), the optical module (307) can guide the reflected light to the guide structure (307c) and / or to the second detection area (375b) using at least one reflective member (473) and / or an inclined surface (377f). For example, by providing a portion of the output light as the second light (RL2) using at least one reflective member (473) and / or an inclined surface (377f), light loss due to reflection, refraction, and / or scattering within the optical module (307) can be suppressed. In embodiments, by including at least one reflective member (473) and / or an inclined surface (377f), the optical module (307) can have improved power efficiency and / or improved light efficiency.

[0112] In embodiments, the inclined surface (377f) may be provided as at least a portion of the inner surface of the first casing (377) on the guide structure (307c). In embodiments, the inclined surface (377f) may be subjected to a reflective surface treatment (e.g., plating, printing, or coating) to guide the second light (RL2) along a designated path. In embodiments, it may be understood that at least one reflective member (473) includes a reflective surface provided on the inclined surface (377f). In embodiments, the inclined surface (377f) may be provided between the second detection area (375b) and the first partition wall (377c) (e.g., the second guide hole (377d)). In embodiments, the inclined surface (377f) may refer to a surface inclined with respect to the first substrate (371) on the guide structure (307c) (e.g., the inner surface of the first casing (377). In embodiments, the distance from the first substrate (371) to the inclined surface (377f) at a position adjacent to the second guide hole (377d) may be greater than the distance from the first substrate (371) to the inclined surface (377f) at a position adjacent to the second detection area (375b). In embodiments, the inclined surface (377f) may be positioned so as not to substantially interfere with the second light (RL2) in the path along which the second light (RL2) travels from the first guide hole (373g) to the second detection area (375b).

[0113] In embodiments, at least one reflective member (473) may be provided on at least a portion of a structure facing the light-emitting element (373d) (e.g., an inner surface of the second casing (373c) or a collimator (373e)), an integrated circuit chip (373b), a second substrate (373a), a first partition wall (377c), and / or an inner surface of the guide structure (307c). For example, the at least one reflective member (473) may be understood as a configuration that sets a propagation path of the second light (RL2) from the light-emitting element (373d) to the second detection area (375b). The arrangement of the at least one reflective member (473) will be discussed again with reference to FIGS. 11 to 13.

[0114] Fig. 9 is a perspective view showing a light emitting element assembly (373) of an optical module (307) according to embodiments. Fig. 10 is a perspective view for explaining a state in which a light emitting element assembly (373) (e.g., a second casing (373c)) of an optical module (307) according to embodiments is placed in a first casing (377).

[0115] FIGS. 9 and 10 may illustrate, for example, a state in which a light-emitting element assembly (373) (e.g., a second casing (373c)) is disposed within a first casing (377) with a first guide hole (373g) aligned with a guide structure (307c). Referring to FIGS. 9 and 10 , the interior of the first casing (377) may include a first receiving space (307a) configured to receive the light-emitting element assembly (373) (e.g., a second casing (373c) may be provided within the first receiving space (307a), a second receiving space (307b) configured to receive a portion of a light-receiving element (375) (e.g., at least a portion of the first detection area (375a) of FIG. 7), and / or a guide structure (307c) disposed between the first receiving space (307a) and the second receiving space (307b). In embodiments, another portion of the light receiving element (375), for example, at least a portion of the second detection area (375b), may be disposed in the guide structure (307c).

[0116] According to embodiments, the first partition wall (377c) may be disposed between the first receiving space (307a) and the guide structure (307c), and may provide a second guide hole (377d) connecting the guide structure (307c) to the first receiving space (307a). When the first casing (377) is disposed on the first substrate (371) of FIG. 7, the second guide hole (377d) may be at least partially surrounded by the first substrate (371) and the first partition wall (377c). In embodiments, the second partition wall (377a) may be disposed between the guide structure (307c) and the second receiving space (307b). In embodiments, the second partition wall (377a) may have a shape disposed to form a closed curved trajectory. For example, the second partition wall (377a) may be provided in a closed curve shape or a polygonal ring shape corresponding to the edge of the first detection area (375a). For example, when the shape is arranged to form a closed curve trajectory, a part of the second partition wall (377a) may be arranged in the guide structure (307c) and the second receiving space (307b), and the second receiving space (307b) may be arranged at least partially between two different parts of the second partition wall (377a).

[0117] According to embodiments, as described above, the light output by the light emitting element (373d) inside the second casing (373c) is substantially radiated toward the subject, but a portion of the output light (e.g., the second light (RL2)) may be reflected or refracted by an internal structure (e.g., an optical element such as a collimator (373e) or an inner wall of the second casing (373c)) and provided to the second detection area (375b). In embodiments, when the second casing (373c) is arranged in the first receiving space (307a), the first guide hole (373g) may be aligned with the guide structure (307c). For example, the light emitting element assembly (373) may be arranged in the first receiving space (307a) at a position where the first guide hole (373g) and the second guide hole (377d) are aligned to face each other.

[0118] According to embodiments, the relative positions of the light-emitting element (373d) and the light-receiving element (375) (e.g., the second detection area (375b)) may be determined differently depending on the specifications of the optical module (307). In order to secure the amount of light of the second light (RL2) from the light-emitting element assembly (373) to the second detection area (375b), the sizes of the first guide hole (373g) and the second guide hole (377d) may be determined. In embodiments, when the second guide hole (377d) is implemented to be sufficiently larger than the first guide hole (373g), the degree of design freedom in the position or size of the first guide hole (373g) may be increased. For example, considering the relative positions of the light-emitting element (373d) and the light-receiving element (375) (e.g., the second detection area (375b)), and / or the amount of light of the second light (RL2) received in the second detection area (375b), the design of the size of the first guide hole (373g) or the position of the first guide hole (373g) in the D1 direction may be facilitated. In embodiments, the power of light reaching the second detection area (375b) may be higher in a structure in which the first guide hole (373g) is disposed closer to the light-receiving element (375) (e.g., the second detection area (375b)) compared to a state in which the first guide hole (373g) is disposed closer to the center of the light-emitting element (373d). For example, the size or position of the first guide hole (373g) can be determined by considering the amount of light of the second light (RL2) received in the second detection area (375b).

[0119] Fig. 11 is a plan view showing a portion of a light emitting element assembly (373) of an optical module (307) according to embodiments. Fig. 12 is a drawing for explaining a light emitting element assembly (373) of an optical module (307) according to embodiments. Fig. 13 is a drawing for explaining a path along which a reference light (e.g., a second light (RL2)) of an optical module (307) according to embodiments proceeds.

[0120] Referring to FIGS. 11 to 13, light output from a light-emitting element (373d) is generally radiated toward a subject, and a portion of the light output from the light-emitting element (373d) (e.g., second light (RL2)) may be reflected or refracted inside the optical module (307) and / or the light-emitting element assembly (373) and provided to the second detection area (375b) via the guide structure (307c). The point in time when the second light (RL2) is detected in the second detection area (375b) may serve as a basis for calculating or determining subject distance information, together with the point in time when the first light (RL1) is reflected by the subject and detected in the first detection area (375a), for example. In embodiments, a deviation may occur in distance information for a subject at the same distance depending on the operating environment (e.g., temperature). For example, distance information based solely on the time at which the first light (RL1) is detected may contain deviations depending on the operating environment, and the time at which the second light (RL2) is detected may be used to compensate for these deviations. Compensation for these deviations depending on the operating environment will be further discussed with reference to FIGS. 14 and 15.

[0121] According to embodiments, the optical module (307) may include at least one reflective member (473) to guide or direct light reflected or refracted within the optical module (307) to the second detection area (375b). For example, the at least one reflective member (473) may increase the amount or power of light (e.g., second light (RL2)) reaching the first guide hole (373g) and / or the second detection area (375b) compared to a structure in which the reflective member is not arranged. The at least one reflective member (473) may be arranged on, for example, an integrated circuit chip (373b) or a second substrate (373a), but may be sufficiently insulated so as not to affect electrical operation. In embodiments, at least one reflective member (473) may be provided on at least a portion of the collimator (373e), the inner wall of the second casing (373c), and / or the inner wall of the second guide hole (377d). The at least one reflective member (473) may include a plating layer, a printing layer, and / or a coating layer provided on the inner surface (e.g., the inclined surface (377f)) of the first casing (377) on the guide structure (307c). For example, by providing at least one reflective member (473) inside the optical module (307), a structure that guides or guides light that is not emitted toward the subject to the second detection area (375b) may be implemented.

[0122] According to embodiments, when the light emitting element (373d) is a vertical cavity surface emitting laser including multiple channels, the amount of light reaching the second detection area (375b) may vary depending on the relative position of each channel. In embodiments, considering the ratio of light reaching the second detection area (375b) among the light emitted from each channel, the size and position of the first guide hole (373g), the size and position of the second guide hole (377d), and / or the size and position of at least one reflective member (473) may be selected. For example, by using the size and position of the first guide hole (373g), the size and position of the second guide hole (377d), and / or the size and position of at least one reflective member (473), the deviation of distance information depending on the operating environment can be further suppressed. As the accuracy of the distance information increases, the quality of the subject image or the accuracy in user authentication can increase.

[0123] Fig. 14 is a graph illustrating a first measurement result of an optical module (307) according to embodiments. Fig. 15 is a graph illustrating a second measurement result of an optical module (307) according to embodiments.

[0124] FIGS. 14 and 15 are graphs that measure the time from the time light is emitted toward a subject at the same distance to the time light reflected by the subject is received, wherein the horizontal axis represents the time at which light is emitted and / or the time at which light is received by the light receiving element (375), and the vertical axis may represent the amount of light received. The 'TL' exemplified on the vertical axis may exemplify a threshold value for determining that the amount of light received is valid. For example, the optical module (307), the electronic device (e.g., the electronic devices (1001, 1002, 1004, 100, 200) of FIGS. 1 to 5), and / or at least one processor (e.g., the processor (1020) of FIG. 1) may utilize the time at which the amount of light is received as the basis for calculating or determining distance information when the amount of light greater than or equal to 'TL' is received. In embodiments, a light source (e.g., a light emitting element assembly (373)) may emit a plurality of pulses (e.g., approximately 60,000 pulses), and distance information may be determined based on the point in time when the largest number of pulses are reflected by a subject and received by a light receiving element (375) among the emitted pulses.

[0125] FIG. 14 may illustrate a first reference time point (TR1) at which a portion of light (e.g., the second light (RL2) of FIG. 13) emitted from a light-emitting element assembly (373) is received in a second detection area (375b) and a first detection time point (TD1) at which the first light (RL1) emitted from the light-emitting element assembly (373) and then reflected by the subject is received in a first detection area (375a) when detecting distance information of a subject at a designated location for, for example, an optical module (307) or an electronic device (e.g., the electronic devices 1001, 1002, 1004, 100, 200 of FIGS. 1 to 5). In embodiments, the distance measurement of FIG. 14 may be understood to have been performed at room temperature. The subject distance at a specified location at room temperature can be calculated or determined based on the time taken from the first reference time point (TR1) to the first detection time point (TD1). For example, the subject distance information can be calculated based on the first detection time point (TD1) without considering the first reference time point (TR1), but the optical module (307), the electronic device (200), and / or at least one processor (1020) according to the embodiment(s) of the present disclosure can determine the subject distance information by considering both the first reference time point (TR1) and the first detection time point (TD1).

[0126] FIG. 15 may illustrate a second reference time point (TR2) at which a portion of the light emitted from the light emitting element assembly (373) (e.g., the second light (RL2) of FIG. 13) is received in the second detection area (375b) and a second detection time point (TD2) at which the first light (RL1) emitted from the light emitting element assembly (373) and then reflected by the subject is received in the first detection area (375a), for example, in detecting distance information of a subject at substantially the same distance as the measurement in FIG. 14. In embodiments, the distance measurement in FIG. 15 may be understood to have been performed in a state where the light emitting element assembly (373) is raised to a temperature higher than room temperature (by approximately 10 degrees) through repeated photographing and / or repeated distance measurement. The distance to the subject at a high temperature (e.g., a temperature state approximately 10 degrees higher than room temperature) can be determined based on the time taken from the second reference time point (TR2) to the second detection time point (TD2). For example, the subject distance information can be calculated or determined based on the second detection time point (TD2) without considering the second reference time point (TR2). However, in this case, even if light that has traveled the same distance is received, the time point may be different from the time point received at room temperature due to the difference in the operating environment (e.g., temperature). This time point deviation due to the operating environment may correspond to the reception deviation (TC). For example, when the light emitting element assembly (373) operates at a temperature approximately 10 degrees higher than room temperature, there may be a deviation equal to the difference between the first reference time point (TR1) and the second reference time point (TR2). According to embodiments, the optical module (307), the electronic device (e.g., the electronic device (1001, 1002, 1004, 100, 200) of FIGS. 1 to 5), and / or at least one processor (e.g., the processor (1020) of FIG. 1) can suppress deviation in distance measurement depending on the operating environment by determining the subject distance by considering the second reference time point (TR2) and the second detection time point (TD2) together.

[0127] According to embodiments, the distance to the subject can be calculated or determined based on the difference between the first reference time point (TR1) and the first detection time point (TD1) of FIG. 14. For example, the time value according to the difference between the first reference time point (TR1) and the first detection time point (TD1) and the speed of the light emitted from the light emitting element assembly (373) can be variables used to determine the distance to the subject. In embodiments, the distance to the subject can be calculated or determined based on the difference between the second reference time point (TR2) and the second detection time point (TD2) of FIG. 15. For example, since the deviation according to temperature change can occur substantially equally at the second reference time point (TR2) and the second detection time point (TD2) compared to the time points (TD1, TR1) of FIG. 14, the time variable for determining the distance to the subject can be determined by directly comparing the second reference time point (TR2) and the second detection time point (TD2). In embodiments, the reception deviation (TC) according to the operating environment may be stored in the memory as data in the form of a table, and the reception deviation (TC) may be compared with the information stored in the memory based on a detected reference time point (e.g., the first reference time point (TR1) of FIG. 14 or the second reference time point (TR2) of FIG. 15) when measuring the distance to the subject, and a time variable for determining the distance to the subject may be determined or determined based on the difference between the detection time point (e.g., the first detection time point (TD1) of FIG. 14 or the second detection time point (TD2) of FIG. 15) and the reception deviation (TC). A method for measuring (or determining) the reception deviation (TC) and / or the distance information to the subject will be further described with reference to FIGS. 16 and 17.

[0128] Fig. 16 is a flowchart illustrating a method for measuring a reception deviation in an optical module (e.g., the optical module (307) of Figs. 6 to 8) according to embodiments. Fig. 17 is a flowchart illustrating a method for measuring subject distance information using an optical module (e.g., the optical module (307) of Figs. 6 to 8) according to embodiments.

[0129] According to embodiments, after the reception deviation (TC) according to temperature is measured in advance by the measuring method (500) of FIG. 16, the measured information can be stored in a memory (e.g., the memory (1030) of FIG. 1). At a point in time when a distance is to be measured, the reception deviation (TC) corresponding to the point in time when light is received in the second detection area (375b) by the measuring method (600) of FIG. 17 can be confirmed based on the data stored in the memory.

[0130] Referring to FIG. 16, a method (500) for measuring a reception deviation (TC) may include an operation (501) of measuring a reception deviation (TC) and an operation (502) of storing the measured reception deviation (TC). The operation 501 of measuring the reception deviation (TC) may be, for example, an operation of measuring a point in time when light emitted from a light-emitting element assembly (373) passes through the interior of an optical module (307) and reaches a second detection area (375b). The operation 502 of storing the measured reception deviation (TC) may be, for example, an operation of storing data in a memory in the form of a table matching a current measurement temperature with a corresponding reference point in time. For example, the method (500) for measuring the reception deviation (TC) may be performed or completed by determining a reference point measured at a specified temperature (e.g., room temperature of approximately 20 degrees) as a first reference point (TR1), repeatedly measuring the reference point (e.g., the second reference point (TR2) of FIG. 15) while changing the temperature of the surrounding environment, and / or storing the reception deviation (TC) according to the temperature at the time of measurement (e.g., the time difference between the first reference point (TR1) and the second reference point (TR2)) in the form of tabulated data in a memory.

[0131] Referring to FIG. 17, the method (600) for measuring subject distance information may include an operation (601) for measuring a distance, an operation (602) for compensating for a deviation, an operation (603) for determining a distance, and / or an operation (604) for acquiring an image. In embodiments, when the electronic device (100, 200) of FIGS. 2 to 5 acquires a subject image, the distance information determined by the method (600) for measuring subject distance information may be used for processing or post-processing of the acquired image.

[0132] According to embodiments, in operation 601, the electronic device (100, 200) and / or the optical module (307) may emit light using the light emitting element assembly (373). In embodiments, a portion of the light emitted from the light emitting element assembly (373) may be reflected by the subject and reach the first detection area (375a), and another portion of the light emitted from the light emitting element assembly (373) may travel through the interior of the optical module (307) and reach the second detection area (375b). In embodiments, even if the distance from the electronic device (100, 200) and / or the optical module (307) to the subject is the same, a deviation may occur in the distance measurement value depending on the temperature at the time of measuring the distance information.

[0133] According to embodiments, in operation 602, the electronic device (100, 200) and / or the optical module (307) determines a reception deviation (TC) corresponding to the time point (e.g., the second reference time point (TR2)) when light reaches the second detection area (375b) or based on the amount of light, and excludes the reception deviation (TC) determined at the time point (e.g., the second detection time point (TD2)) when light reaches the first detection area (375a), thereby compensating for the deviation of the measurement value due to the temperature difference. In embodiments, operation 603 may be an operation of determining the measurement value with the deviation compensated as the distance to the subject. As described above, when the distance measuring method (600) of FIG. 17 is performed when capturing an image of a subject, the determined distance (e.g., the distance to the subject) can be used to improve the quality of the acquired image. For example, the distance measuring method (600) of FIG. 17 may be performed while capturing an image of a subject, and the distance information to the subject measured (or determined) in operation 603 may be used as one of the information(s) that form the basis of the image acquired in operation 604.

[0134] FIG. 18 is a perspective view illustrating the internal configuration of a wearable electronic device (700) according to embodiments.

[0135] According to embodiments of the present disclosure, the wearable electronic device (700) of FIG. 18 (or the wearable electronic device (800) of FIGS. 19 and 20 described below) may be substantially the same as the electronic device (1001) of FIG. 1 and may be implemented to be wearable on a user's body. In embodiments, each of the external electronic devices (1002, 1004) of FIG. 1 may be the same or a different type of device as the electronic device (1001) or the wearable electronic device (700, 800). According to embodiments, all or part of the operations executed in the electronic device (1001) or the wearable electronic device (700, 800) may be executed in one or more of the external electronic devices (1002, 1004, or 1008). For example, when an electronic device (1001) or a wearable electronic device (700, 800) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1001) or the wearable electronic device (700, 800) may, instead of or in addition to executing the function or service on its own, request one or more external electronic devices to execute at least a part of the function or service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1001) or the wearable electronic device (700, 800). The electronic device (1001) or the wearable electronic device (700, 800) may process the result as is or additionally and provide it as at least a part of a response to the request.For example, an external electronic device (1002) renders content data executed in an application and transmits it to an electronic device (1001) or a wearable electronic device (700, 800), and the electronic device (1001) or the wearable electronic device (700, 800) that receives the data can output the content data to a display module (e.g., the display module (1060), the light output module (711), the display (821) of FIG. 1). When the electronic device (1001) or the wearable electronic device (700, 800) detects user movement through an inertial measurement unit sensor or the like, the processor (e.g., the processor (1020) of the electronic device (1001) or the wearable electronic device (700, 800) can correct the rendering data received from the external electronic device (1002) based on the movement information and output the corrected data to the display module. Alternatively, the motion information may be transmitted to an external electronic device (1002) to request rendering so that screen data is updated accordingly. According to embodiments, the external electronic device (1002) may be a variety of devices, such as a case device capable of storing and charging the electronic device (1001).

[0136] Referring to FIG. 18, a wearable electronic device (700) according to embodiments may include at least one of a light output module (711), a display member (701), and a camera module (750). According to embodiments, the light output module (711) may include a light source capable of outputting an image (e.g., a projector or a display panel (911a) of FIG. 21), and a lens (e.g., a lens (911b) of FIG. 21) that guides the image to the display member (701). According to one embodiment of the present disclosure, the light output module (711) may include at least one of a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), an organic light emitting diode (OLED), or a micro light emitting diode (micro LED).

[0137] According to embodiments, the display member (701) may include a light waveguide (e.g., the light waveguide (913a) of FIG. 21). According to embodiments, an image output from the light output module (711) incident on one end of the light waveguide may be propagated within the light waveguide and provided to a user. For example, the display member (701) may be an optical system that guides or focuses an image output from the light output module (711) along a designated path (e.g., the first path (P1) of FIG. 21) to the user's naked eye.

[0138] According to embodiments, the display member (701) may include at least one of a diffractive optical element (DOE), a holographic optical element (HOE), or a reflective element (e.g., a reflective mirror) provided in the optical waveguide (e.g., the couplers (913b, 913c)(s) of FIG. 21). For example, the display member (701) may guide an output image of the optical output module (711) to a user's eye by including at least one diffractive optical element, a holographic optical element, or a reflective element, and / or by including an optical waveguide.

[0139] According to embodiments, the camera module (750) can capture still images and / or moving images. According to embodiments, the camera module (750) can be disposed within a lens frame and can be disposed around the display member (701). In embodiments, the wearable electronic device (700) can obtain information about the distance to the subject by including the optical module (307) of FIGS. 6 to 8 when capturing still images and / or moving images using the camera module (750).

[0140] According to embodiments, the first camera module (751) can capture and / or recognize the trajectory of the user's eye (e.g., pupil, iris) or gaze. According to embodiments of the present disclosure, the first camera module (751) can periodically or aperiodically transmit information related to the trajectory of the user's eye or gaze (e.g., trajectory information) to a processor (e.g., processor (1020) of FIG. 1).

[0141] According to embodiments, the second camera module (753) can capture external images.

[0142] According to embodiments, the third camera module (755) may be used for hand detection and tracking, and user gesture (e.g., hand movement) recognition. According to embodiments, the third camera module (755) may be used for 3 degrees of freedom (3DoF), 6DoF head tracking, location (spatial, environmental) recognition, and / or movement recognition. According to embodiments, the second camera module (753) may also be used for hand detection and tracking, and user gesture recognition. According to embodiments, at least one of the first camera module (751) to the third camera module (755) may be replaced with a sensor module (e.g., a LiDAR sensor). For example, the sensor module may include at least one of a vertical cavity surface emitting laser (VCSEL), an infrared sensor, and / or a photodiode. In embodiments, the sensor module may be implemented by the optical module (307) of FIGS. 6 to 8.

[0143] According to embodiments, a wearable electronic device (700) may include a pair of display elements (701) arranged parallel to one side of each other. For example, a user may wear the wearable electronic device (700) on the face, and the display elements (701) may be arranged to correspond to any one of the user's eyes while the wearable electronic device (700) is worn on the user's face. In embodiments, when including a pair of display elements (701), the wearable electronic device (700) may provide visual information to the user through any one of the display elements (701) and / or through each display element (701).

[0144] According to embodiments, the wearable electronic device (700) may include at least one wearing member (702a, 702b) extending from or rotatably coupled to the display member (701). In embodiments, the wearing member (702a, 702b) may be exemplified as a structure that is rotatably coupled (or connected) to the display member (701) by a hinge structure (H). For example, the wearing member (702a, 702b) may be in a position overlapped or folded with the display member (701), in which case the user may easily carry or store the wearable electronic device (700). In embodiments, the wearable electronic device (700) can be easily worn on the user's face at a position where the wearing member (702a, 702b) is rotated by a specified angle (e.g., approximately 90 degrees) from a position overlapping the display member (701). For example, the wearable electronic device (700) can be stably worn by supporting the display member (701) on the user's face and supporting the wearing member (702a, 702b) on the side of the user's head (e.g., the ear).

[0145] FIG. 19 and FIG. 20 are drawings showing the front and back of a wearable electronic device (800) according to embodiments.

[0146] Referring to FIGS. 19 and 20, in embodiments, camera modules (811, 812, 813, 814, 815, 816) and / or depth sensors (817) for obtaining information related to the surrounding environment of the wearable electronic device (800) may be arranged on the first surface (810) of the housing.

[0147] In embodiments, the camera modules (811, 812) can acquire images related to the environment surrounding the wearable electronic device (800).

[0148] In embodiments, the camera modules (813, 814, 815, 816) can acquire images while the wearable electronic device (800) is worn by the user. In embodiments, the wearable electronic device (800) includes the optical module (307) of FIGS. 6 to 8, so that when acquiring images using the camera modules (813, 814, 815, 816), information about the distance to the subject can be acquired. The camera modules (813, 814, 815, 816) can be used for hand detection, tracking, and recognition of user gestures (e.g., hand movements). The camera modules (813, 814, 815, 816) can be used for 3DoF, 6DoF head tracking, position (spatial, environmental) recognition, and / or movement recognition. In embodiments, camera modules (811, 812) may be used for hand detection and tracking, and user gestures.

[0149] In embodiments, the depth sensor (817) may be configured to transmit a signal and receive a signal reflected from a subject, and may be used for purposes such as time of flight (TOF) to determine the distance to an object. Instead of or in addition to the depth sensor (817), camera modules (813, 814, 815, 816) may determine the distance to an object. In embodiments, the depth sensor (817) may be implemented by the optical module (307) of FIGS. 6 to 8.

[0150] According to embodiments, a camera module (825, 826) for facial recognition and / or a display (821) (and / or a lens) may be arranged on the second side (820) of the housing.

[0151] In embodiments, a face recognition camera module (825, 826) adjacent to the display (821) may be used to recognize a user's face, or may recognize and / or track both eyes of the user.

[0152] In embodiments, the display (821) (and / or lens) may be disposed on the second side (820) of the wearable electronic device (800). In embodiments, the wearable electronic device (800) may not include the camera module(s) indicated as '815' and / or '816' among the plurality of camera modules (813, 814, 815, 816). The wearable electronic device (800) may further include at least one of the configurations illustrated in FIG. 18.

[0153] As described above, the wearable electronic device (800) according to the embodiments may have a form factor for being worn on a user's head. The wearable electronic device (800) may further include a strap for being fixed on a body part of the user, and / or a wearing member (e.g., the wearing member (702a, 702b) of FIG. 18). The wearable electronic device (800) may provide a user experience based on augmented reality, virtual reality, and / or mixed reality while being worn on the user's head.

[0154] FIG. 21 is a drawing showing a portion of a wearable electronic device (e.g., the electronic device (1001) of FIG. 1 and / or the wearable electronic devices (700, 800) of FIGS. 18 to 20) according to embodiments.

[0155] Referring to FIG. 21, the wearable electronic device may include a light output module (911) (e.g., the light output module (711) of FIG. 18), a display member (901) (e.g., the display member (701) of FIG. 18), a first polarizing reflector (961), a polarizing modulator (963), and / or a second polarizing reflector (965). The display member (901) may be, for example, a see-through optical element that transmits light or an image about an environment or an object (O) around the user and provides the light or image to the user along a designated path (e.g., a second path (P2)). In embodiments, the display member (901) may be a see-through optical element and provide a first path (P1) that guides or directs light (e.g., visual information such as characters or images) output from the light output module (911) to the user's naked eye (E). For example, a wearable electronic device can provide an environment in which a user can visually recognize a surrounding space or object (O) by including a transparent optical element (e.g., a display member (901)), and can visually provide stored or received information to the user by using a light output module (911) and a display member (901).

[0156] According to embodiments, when visually providing various information to a user, a portion of the light output by the light output module (911) may leak into the external space. In embodiments, the first polarizing reflector (961), the polarizing modulator (963), and / or the second polarizing reflector (965) may reflect at least a portion of the light leaking into the external space and provide it to the user, and / or absorb a portion of the light leaking into the external space. In embodiments, when the first polarizing reflector (961), the polarizing modulator (963), and / or the second polarizing reflector (965) reflects the light leaking into the external space, the wearable electronic device may provide visual information to the user more clearly or more brightly. For example, the wearable electronic device may have improved light efficiency or improved power efficiency.

[0157] According to embodiments, the light output module (911) may include a display panel (911a) that outputs light (e.g., visual information such as an image) and at least one lens (911b). The display panel (911a) may include, for example, the above-described liquid crystal display, digital mirror display, silicon liquid crystal display, organic light emitting diode, or micro LED. In embodiments, the lens (911b) may guide or focus light output from the display panel (911a) to the display member (901). In embodiments, in guiding or aligning the light to the display member (901), the light output module (911) may further include a reflective member (e.g., a mirror) or a refractive member (e.g., a prism). For example, depending on the direction in which the display panel (911a) is aligned, the light output module (911) may further include a reflective member or a refractive member to output light in a direction toward the display member (901).

[0158] According to embodiments, the display member (901) may include a first surface (F1) and a second surface (F2) opposite to the first surface (F1). In embodiments, when the wearable electronic device is worn on a user's face, the first surface (F1) may be arranged to substantially face the user's face or the user's eyes, and the second surface (F2) may be arranged to face an external space (e.g., an environment around the user). In embodiments, an image of the surrounding environment or an object (O) may be provided to the user by being incident on the second surface (F2) along a second path (P2) and output through the first surface (F1). For example, the display member (901) may transmit at least a portion of light incident on the second surface (F2) to the first surface (F1). In embodiments, light output from the light output module (911) may be provided to a user by traveling through the interior of the display member (901) along the first path (P1) and being output through the first surface (F1). For example, the display member (901) may guide light output from the light output module (911) to the user's eyes.

[0159] According to embodiments, the display member (901) may include an optical waveguide (913a) and couplers (913b, 913c), thereby providing light output from the optical output module (911) to a user. Among the couplers (913b, 913c), a first coupler (913b) may be provided at one end of the optical waveguide (913a) and aligned with the optical output module (911). For example, light guided or focused by a lens (911b) may be input into the optical waveguide (913a) through the first coupler (913b). Among the couplers (913b, 913c), a second coupler (913c) may be provided at the other end of the optical waveguide (913a). In embodiments, when the wearable electronic device is worn on the user's face, the second coupler (913c) may be substantially aligned with the user's eyes. For example, light guided or focused by the lens (911b) may be input into the optical waveguide (913a) through the first coupler (913b) and may travel along the optical waveguide (913a), and the light traveling along the optical waveguide (913a) may be provided to the user's eyes by the second coupler (913c).

[0160] According to embodiments, the first coupler (913b) and / or the second coupler (913c) may include at least one of a diffractive optical element, a holographic optical element, and / or a reflective element. For example, light output from the light output module (911) may be input to the optical waveguide (913a) by the first coupler (913b), and light propagating through the optical waveguide (913a) may be output to the first surface (F1) by the second coupler (913c). At a point in time when the propagation direction of the light is controlled by the first coupler (913b) and / or the second coupler (913c), and / or at a point in time when the light propagating through the optical waveguide (913a) is reflected within the optical waveguide (913a), a portion of the light may leak out to the outside. A wearable electronic device according to an embodiment(s) of the present disclosure can suppress light output from a light output module (911) from leaking to the outside by including a first polarizing reflector (961), a polarizing modulator (963), and / or a second polarizing reflector (965).

[0161] In the embodiments, the first polarizing reflector (961), the polarizing modulator (963), and / or the second polarizing reflector (965) are illustrated as being arranged at a position corresponding to the second coupler (913c), but when there is a part in which the light output from the light output module (911) may leak out of the path along the display member (901), the first polarizing reflector (961), the polarizing modulator (963), and / or the second polarizing reflector (965) may be further extended or additionally arranged at an appropriate position. For example, the first polarizing reflector (961), the polarizing modulator (963), and / or the second polarizing reflector (965) may be extended or additionally arranged at a position corresponding to the first coupler (913b) or the optical waveguide (913a). In embodiments, the first polarizing reflector (961), the polarizing modulator (963), and / or the second polarizing reflector (965) may be disposed substantially over the entire area of ​​the second surface (F2). In embodiments, when the structure sufficiently suppresses leakage of light traveling along the first path (P1), the first polarizing reflector (961), the polarizing modulator (963), and / or the second polarizing reflector (965) may be omitted in the wearable electronic device.

[0162] According to embodiments, the first polarizing reflector (961) may be disposed on one surface (e.g., the second surface (F2)) of the display member (901) and configured to reflect or absorb at least a portion of light leaking to the outside via the second coupler (913c). For example, when visual information to be provided to the user is provided to the user, a portion of the light output from the light output module (911) may be output to the second surface (F2) via the second coupler (913c). The first polarizing reflector (961) may increase the light efficiency of the wearable electronic device by reflecting the light output to the second surface (F2) via the second coupler (913c) to the first surface (F1).

[0163] According to embodiments, when the first polarizing reflector (961) is configured to reflect light of a first polarization component (e.g., horizontal linear polarization (p-pol)), light of a second polarization component different from the first polarization component (e.g., vertical linear polarization (s-pol)) may be transmitted through the first polarizing reflector (961). In embodiments, similar to the first polarizing reflector (961), the second polarizing reflector (965) may be configured to reflect light of the first polarization component, and the polarization modulator (963) may modulate at least a portion of the light transmitted through the first polarizing reflector (961) into light of the first polarization component and transmit the modulated light to the second polarizing reflector (965). For simplicity of explanation, in the embodiments, light of the first polarization component may be referred to as horizontal linear polarization, and light of the second polarization component may be referred to as vertical linear polarization. However, it should be noted that the embodiments of the present disclosure are not limited thereto. In the embodiments, when light of a third polarization component, such as circular polarization or elliptically polarized light, is incident on the first polarization reflector (961) (or the second polarization reflector (965)), some of the light of the third polarization component may transmit through the first polarization reflector (961) (or the second polarization reflector (965)), and at least some of the remaining light of the third polarization component may be reflected by the first polarization reflector (961) (or the second polarization reflector (965)).

[0164] According to embodiments, the polarization modulator (963) may be disposed on the first polarization reflector (961). For example, the polarization modulator (963) may be disposed substantially facing the second surface (F2) with the first polarization reflector (961) therebetween. In embodiments, the polarization modulator (963) may be disposed between the first polarization reflector (961) and the second polarization reflector (965) to modulate a polarization component of at least a portion of the light transmitted through the first polarization reflector (961). For example, the polarization modulator (963) may modulate at least a portion of the light transmitted through the first polarization reflector (961) into light having a polarization component reflected by the second polarization reflector (965). In embodiments, the polarization modulator (963) can substantially transmit light transmitted through the first polarizing reflector (961) while modulating at least a portion of the polarization component of the light transmitted through the polarization modulator (963). In embodiments, the polarization modulator (963) can include a wave plate (963a) (e.g., a half-wave phase retarder) and a rotator (963b) (e.g., a Faraday rotator). In embodiments, the wave plate (963a) can change the polarization direction of light passing through the polarization modulator (963) by a specified angle, and the rotator (963b) can modulate the polarization axis of light passing through the polarization modulator (963) in a specified direction. Depending on the specifications of the wearable electronic device (700, 800) or the display member (901), the optical elements included in the polarization modulator (963) (e.g., phase retarder (963a) and / or rotator (963b)) may be implemented differently from those illustrated.

[0165] According to embodiments, the second polarizing reflector (965) may be disposed on the polarization modulator (963). For example, the second polarizing reflector (965) may be disposed substantially facing the second surface (F2) with the first polarizing reflector (961) and the polarization modulator (963) interposed therebetween. In embodiments, the second polarizing reflector (965) may reflect at least a portion of the light transmitted through the polarization modulator (963) and guide the light to the second surface (F2) and / or the first surface (F1). For example, the second polarizing reflector (965) may reflect light of the first polarization component, and at least a portion of the light transmitted through the polarization modulator (963) may be light of the first polarization component.

[0166] According to embodiments, when including the optical module (307) of FIGS. 6 to 8, the wearable electronic device (700, 800) can detect (or determine) information regarding the distance to the subject when acquiring an image of the subject. For example, by including subject distance information when processing an image provided to the user, the wearable electronic device (700, 800) can provide the user with an image of improved quality.

[0167] As described above, the optical module according to the embodiments (e.g., the optical module (307) of FIGS. 6 to 8) and / or the electronic device including the same (e.g., the electronic device (1001, 1002, 1004, 100, 200) of FIGS. 1 to 5) is provided with a structure in which a light-emitting element assembly (e.g., the light-emitting element assembly (373) of FIG. 7) including a light-emitting element (e.g., the light-emitting element (373d) of FIG. 7) and / or a driving circuit thereof (e.g., the integrated circuit chip (373b) of FIG. 7) is disposed on a substrate (e.g., the first substrate (371) of FIG. 7) on which a light-receiving element (e.g., the light-receiving element (375) of FIG. 7) is disposed) is disposed through a surface mounting technique, thereby suppressing damage to components that may occur during the manufacturing process or in the correction of defects. In embodiments, the substrate of the light-emitting element assembly (e.g., the second substrate (373a) on which the light-emitting element and / or its driving circuit are disposed in FIG. 7) and / or the substrate of the optical module on which such substrate is disposed (e.g., the first substrate (371) on which the light-emitting element assembly and / or the light-receiving element are disposed in FIG. 7) may include a ceramic material such as LTCC or HTCC, thereby quickly dissipating or releasing heat generated during the operation of the light-emitting element. For example, the deterioration of the operating environment of the light-emitting element or electronic device due to heat generation may be suppressed. In embodiments, the optical module may guide or direct light reflected or refracted within it to the light-receiving element (e.g., the second detection area (375b) in FIG. 7) to be used for distance measurement. For example, the optical efficiency and / or power efficiency of the optical module may be improved, and the accuracy of distance measurement may be increased. In embodiments, by appropriately designing (or manufacturing) the shape of the internal space of the light-emitting element assembly or the size of the internal space of the first casing (377), the amount of light (e.g., the second light (RL2)) guided to the first guide hole (373g) or the second detection area (375b) can be sufficiently secured.When the amount of light (e.g., second light (RL2)) guided to the first guide hole (373g) or the second detection area (375b) is sufficiently secured, deviation in subject distance measurement due to changes in the operating environment (e.g., temperature) can be suppressed.

[0168] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0169] According to embodiments, an optical module (e.g., an optical module (307) of FIGS. 6 to 8) includes a first substrate (e.g., a first substrate (371) of FIG. 7), a light-emitting element assembly (e.g., a light-emitting element assembly (373) of FIG. 7) disposed on the first substrate and configured to emit light of a specified wavelength band, a light-receiving element (e.g., a light-receiving element (375) of FIG. 7) disposed on one side of the light-emitting element assembly and configured to receive first light (e.g., the first light (RL1) of FIG. 6) reflected by a subject after being emitted by the light-emitting element assembly) including a first detection area (e.g., a first detection area (375a) of FIG. 7), and a second receiving space (e.g., a second receiving space (307b) of FIG. 7) disposed on the first substrate and accommodating the first detection area, a guide structure (e.g., a guide of FIG. 7) disposed between the light-emitting element assembly and the second receiving space. The light receiving element may include a first casing (e.g., the first casing (377) of FIG. 7) including a second partition wall (e.g., the second partition wall (377a) of FIG. 7) extending from an inner side between the guide structure and the second receiving space and positioned toward the light receiving element. In embodiments, the light receiving element may further include a second detection area (e.g., the second detection area (375b) of FIG. 7) provided on one side of the first detection area and positioned at least partially inside the guide structure. In embodiments, the second detection area may be configured to receive a second light (e.g., the second light (RL2) of FIG. 13) guided by the guide structure and which is part of the light emitted by the light emitting element assembly.

[0170] According to embodiments, the light-emitting element assembly may include a second substrate including a ceramic material (e.g., a second substrate (373a) of FIG. 7), a driving circuit mounted on the second substrate (e.g., an integrated circuit chip (373b) of FIG. 7), and a light-emitting element configured to emit light of a specified wavelength band by being controlled by the driving circuit (e.g., a light-emitting element (373d) of FIG. 7).

[0171] According to embodiments, the light emitting element assembly may further include a second casing (e.g., the second casing (373c) of FIG. 7) disposed on the second substrate and accommodating at least the light emitting element, and a first guide hole (e.g., the first guide hole (373g) of FIG. 7) provided in the second casing and aligned with the guide structure within the first casing. In embodiments, the first guide hole may be configured to guide the second light into the interior of the guide structure.

[0172] According to embodiments, the optical module as described above may further include at least one reflective member (e.g., reflective member (473) of FIG. 11 or FIG. 12) disposed in the interior space of the second casing or inside the guide structure.

[0173] According to embodiments, the optical module as described above may further include a first partition wall (e.g., the first partition wall (377c) of FIG. 7) disposed inside the first casing between the guide structure and the light emitting element assembly, and a second guide hole (e.g., the second guide hole (377d) of FIG. 7) at least partially surrounded by the first partition wall and the first substrate. In embodiments, the first guide hole may be aligned with the second guide hole.

[0174] According to embodiments, the light emitting element assembly may further include a diffractive optical element (e.g., the diffractive optical element (373f) of FIG. 7) and a collimator (e.g., the collimator (373e) of FIG. 7). In embodiments, the diffractive optical element and the collimator may be configured to guide or align at least a portion of the light emitted from the light emitting element in a designated direction.

[0175] According to embodiments, the light emitting device may include a vertical cavity surface emitting laser (VCSEL).

[0176] According to embodiments, the optical module as described above may further include a lens assembly (e.g., lens assembly (379) of FIG. 7) arranged in the first casing and configured to guide or focus the first light to the first detection area.

[0177] According to embodiments, the first casing may be configured to further provide a first receiving space (e.g., the first receiving space (307a) of FIG. 7) for receiving the light-emitting element assembly. In embodiments, the guide structure may be disposed between the first receiving space and the second receiving space.

[0178] According to embodiments, the second barrier may be configured to suppress or block the first light from entering the second detection area.

[0179] According to embodiments, the second barrier may be configured to suppress or block the second light from entering the first detection area.

[0180] According to embodiments, the second bulkhead may be arranged to form a closed curve trajectory corresponding to the edge of the first detection area.

[0181] According to embodiments, at least a portion of the inner surface of the first casing on the guide structure (e.g., the inclined surface (377f) of FIG. 7) may be inclined with respect to the first substrate.

[0182] According to embodiments, an electronic device (e.g., an electronic device (1001, 1002, 1004, 100, 200) of FIGS. 1 to 5) may include a housing (e.g., a housing (201) of FIG. 4 or 5), an optical module (e.g., an optical module (307) of FIGS. 6 to 8) disposed in the housing and configured to emit light of a designated wavelength band and receive a first light (e.g., a first light (RL1) of FIG. 6) reflected by a subject among the emitted light, at least one processor (e.g., a processor (1020) of FIG. 1), and a memory (e.g., a memory (1030) of FIG. 1) storing instructions that, when individually or collectively executed by the at least one processor, cause the electronic device to determine distance information to the subject based on at least the first light. In embodiments, the optical module includes a first substrate (e.g., a first substrate (371) of FIG. 7), a light-emitting element assembly (e.g., a light-emitting element assembly (373) of FIG. 7) disposed on the first substrate and configured to emit light of a specified wavelength band, a light-receiving element (e.g., a light-receiving element (375) of FIG. 7) disposed on the first substrate at one side of the light-emitting element assembly and configured to receive the first light, including a first detection area (e.g., a first detection area (375a) of FIG. 7), and a first casing (e.g., a first accommodating space (307a) of FIG. 7) disposed on the first substrate and accommodating the light-emitting element assembly, a second accommodating space (e.g., a second accommodating space (307b) of FIG. 7) accommodating the first detection area, and a guide structure (e.g., a guide structure (307c) of FIG. 7) disposed between the first accommodating space and the second accommodating space. A first casing (377) may be included. In embodiments, the light-receiving element may further include a second detection area (e.g., the second detection area (375b) of FIG. 7) provided on one side of the first detection area and positioned at least partially inside the guide structure.In embodiments, the second detection area may be configured to receive a second light (e.g., the second light (RL2) of FIG. 13) that is part of the light emitted by the light emitting element assembly and guided by the guide structure.

[0183] According to embodiments, the light-emitting element assembly may further include a second substrate including a ceramic material (e.g., a second substrate (373a) of FIG. 7), a driving circuit mounted on the second substrate (e.g., an integrated circuit chip (373b) of FIG. 7), a light-emitting element configured to emit light of a specified wavelength band under control of the driving circuit (e.g., a light-emitting element (373d) of FIG. 7), a second casing disposed on the second substrate and accommodating at least the light-emitting element (e.g., a second casing (373c) of FIG. 7), and a first guide hole provided in the second casing and aligned with the guide structure within the first casing (e.g., a first guide hole (373g) of FIG. 7). In embodiments, the first guide hole may be configured to guide the second light into the interior of the guide structure.

[0184] According to embodiments, the light emitting element assembly may further include at least one reflective member (e.g., reflective member (473) of FIG. 11 or FIG. 12) disposed in the interior space of the second casing or inside the guide structure.

[0185] According to embodiments, the light emitting element assembly may further include a diffractive optical element (e.g., the diffractive optical element (373f) of FIG. 7) and a collimator (e.g., the collimator (373e) of FIG. 7). In embodiments, the diffractive optical element and the collimator may be configured to guide or align at least a portion of the light emitted from the light emitting element in a designated direction.

[0186] According to embodiments, the light emitting device may include a vertical cavity surface emitting laser.

[0187] According to embodiments, the light-emitting element assembly may further include a second partition wall (e.g., the second partition wall (377a) of FIG. 7) extending from the inner surface of the first casing between the guide structure and the second receiving space and positioned toward the light-receiving element.

[0188] According to one embodiment, the second barrier may be configured to suppress or block the first light from entering the second detection area, and may be configured to suppress or block the second light from entering the first detection area.

[0189] While the present disclosure has been described by way of example with respect to embodiments, it should be understood that the embodiments are intended to be illustrative and not limiting of the present disclosure. It will be apparent to those skilled in the art that various changes in form and detailed configuration may be made without departing from the overall scope of the present disclosure, including the appended claims and their equivalents. For example, when describing reception deviations according to operating environments, the difference in operating environments is described as an example of a temperature difference of approximately 10 degrees, but it should be noted that the embodiment(s) of the present disclosure are not limited thereto. In the embodiments, the deviation in the operating environment may differ from that mentioned in the above-described embodiments depending on the duration and cycle of shooting (or distance measurement), the operating mode of the optical module (or electronic device), and the temperature of the current location.

Claims

1. In the optical module (307), First substrate (371); A light emitting element assembly (373) arranged on the first substrate and configured to emit light of a specified wavelength band; A light receiving element (375) disposed on the first substrate adjacent to one side of the light emitting element assembly and including a first detection area (375a) configured to receive first light (RL1) emitted by the light emitting element assembly and then reflected by a subject; and A first casing (377) is provided that is arranged on the first substrate and includes a second receiving space (307b) that receives the first detection area, a guide structure (307c) that is arranged between the light-emitting element assembly and the second receiving space, and a second partition wall (377a) that extends from the inner surface between the guide structure and the second receiving space and is arranged to face the light-receiving element. The above light-receiving element further includes a second detection area (375b) disposed adjacent to one side of the first detection area and at least partially inside the guide structure, An optical module configured to receive second light (RL2) guided by the guide structure while the second detection area is a portion of light emitted by the light emitting element assembly.

2. In the first paragraph, the light emitting element assembly, A second substrate (373a) comprising a ceramic material; A driving circuit (373b) mounted on the second substrate; and An optical module including a light emitting element (373d) configured to emit light of a specified wavelength band controlled by the above driving circuit.

3. In the second paragraph, the light emitting element assembly, A second casing (373c) disposed on the second substrate and accommodating at least the light emitting element; and Further comprising a first guide hole (373g) provided in the second casing and aligned with the guide structure of the first casing, The above first guide hole is an optical module configured to guide the second light into the interior of the above guide structure.

4. In paragraph 3, An optical module further comprising at least one reflective member (473) arranged in the internal space of the second casing or inside the guide structure.

5. In any one of paragraphs 3 to 4, A first bulkhead (377c) disposed inside the first casing between the guide structure and the light emitting element assembly; and Further comprising a second guide hole (377d) at least partially surrounded by the first bulkhead and the first substrate, An optical module in which the first guide hole is aligned with the second guide hole.

6. In any one of the second to fifth clauses, the light emitting element assembly, diffractive optical element (DOE) (373f); and Including a collimator (373e), An optical module in which the diffractive optical element and the collimator are configured to guide or align at least a portion of the light emitted from the light emitting element in a specified direction.

7. An optical module according to any one of claims 2 to 6, wherein the light-emitting element includes a vertical cavity surface emitting laser (VCSEL).

8. In any one of paragraphs 1 to 7, An optical module further comprising a lens assembly (379) arranged in the first casing and configured to guide or focus the first light to the first detection area.

9. In any one of the first to eighth clauses, the first casing is configured to further provide a first receiving space (375) for receiving the light emitting element assembly, An optical module in which the above guide structure is arranged between the first receiving space and the second receiving space.

10. An optical module according to any one of claims 1 to 9, wherein the second partition is configured to suppress or block the first light from being incident on the second detection area.

11. An optical module according to any one of claims 1 to 10, wherein the second partition is configured to suppress or block the second light from being incident on the first detection area.

12. An optical module according to any one of claims 1 to 11, wherein the second partition wall is arranged to form a closed curve trajectory corresponding to the edge of the first detection area.

13. An optical module according to any one of claims 1 to 12, wherein at least a portion of the inner surface of the first casing on the guide structure is inclined with respect to the first substrate.

14. In electronic devices (1001; 1002; 1004; 100; 200), Housing (201); An optical module (307) according to any one of claims 1 to 13, arranged in the housing; At least one processor (1020); and An electronic device comprising a memory (1030) having stored therein instructions that, when executed by at least one processor, cause the electronic device to determine distance information to a subject based on at least the first light.

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