Vacuum coating installation having a plurality of source arrangements

Abstract

The invention relates to a vacuum coating installation (1) for coating three-dimensional substrates (6), comprising: an evacuable coating chamber (2), which has a first coating region (7.1) for rotatably receiving a substrate (6); a first source arrangement (8.1), which is directed in a first main direction (10.1) onto the first coating region (7.1) and has at least one coating source (9.1, 9.2, 9.3); a second source arrangement (8.2), which is directed in a second main direction (10.2) onto the first coating region (7.1) and has at least one coating source (13.1, 13.2, 13.3); and means (16) for measuring a spacing between the second source arrangement (8.2) and the substrate (6), wherein main directions (10.1, 10.2) are at a first angle of at least 45° to one another and the power consumption of the second source arrangement (8.2) and / or the rotational speed of the substrate (6) can be controlled and / or regulated corresponding to the measured spacing between the second source arrangement (8.2) and the substrate (6). The invention also relates to a method (30) for coating a three-dimensional substrate (6) using a vacuum coating installation (1).

Description

[0001] Vacuum coating system with multiple source arrangements

[0002] Technical field

[0003] The following descriptions relate to a vacuum coating system for coating three-dimensional substrates, comprising an evacuable coating chamber with at least one first coating area for rotatably receiving a single substrate and a first source arrangement directed in a first principal direction towards the first coating area with at least one coating source.

[0004] Furthermore, the following explanations concern a method for coating a three-dimensional substrate with such a vacuum coating system.

[0005] Technical background

[0006] Systems and processes for coating substrates, for example according to the principle of physical vapor deposition (PVD), are fundamentally known. In this process, the starting material is converted into the gas phase using physical methods. The gaseous material is then fed to the substrate to be coated, where it condenses and forms the target layer. Sputtering (especially DC sputtering, RF sputtering, magnetron sputtering, ion beam sputtering, or reactive sputtering) is one example of a PVD process.

[0007] Typically, such processes utilize a coating chamber containing a source assembly. A vacuum is generated within the coating chamber, and the substrate is positioned opposite the source assembly and, in particular, rotates. The gaseous material spreads hemispherically within the coating chamber, radiating from a specific coating source. This results in varying material thicknesses and deposition rates on the substrate, depending on the distance from the coating source. Furthermore, surfaces not at least approximately perpendicular to the coating source, such as substrate sides, surfaces in recesses like bores, and concealed surfaces (e.g., behind handles), are typically not reached, or only poorly reached, by the gaseous material.The known methods have therefore so far only been successfully used for substrates with simple geometries, such as sheet metal or flat glass.

[0008] From DE 10 2010 048 270 Al, a sputtering system with a normally oriented coating source and inclined coating sources for forming a coating on a substrate by sputtering is known. A disadvantage of this sputtering system is that it is limited to relatively simple substrate geometries where a homogeneous coating can be achieved.

[0009] Based on this situation, the present task is to enable a uniform / homogeneous coating of different surfaces of a three-dimensional substrate using a PVD process.

[0010] Description - Technical Solution

[0011] The present problem is solved by the features of the independent claims. Advantageous embodiments are specified in the dependent claims, the description, and the drawings. Where technically feasible, the teachings of the dependent claims can be combined arbitrarily with those of the main and dependent claims.

[0012] In particular, the problem is solved by a vacuum coating system for coating three-dimensional substrates, comprising an evacuable coating chamber with at least a first coating area for rotatably receiving a single substrate, a first source arrangement directed in a first principal direction towards the first coating area with at least one coating source, at least a second source arrangement directed in a second principal direction towards the first coating area with at least one coating source, and means for detecting a distance between the second source arrangement and the substrate.wherein the first principal direction and the second principal direction are at a first angle of at least 45° to each other and wherein the power consumption of the at least one second source arrangement and / or the rotational speed of the substrate is controllable and / or adjustable according to the detected distance between the second source arrangement and the substrate.

[0013] The following sections explain advantageous aspects and subsequently describe preferred modified embodiments. Explanations, particularly regarding advantages and definitions of features, are descriptive and preferred, but not limiting. If an explanation is limiting, this will be explicitly stated.

[0014] Where ordinal numbers, for example "first," "second," etc., are used, for instance to designate a component, an element, a process step, or a process action, these ordinal numbers are solely for differentiation in the designation and do not indicate any dependencies or sequences. This means, in particular, that a device does not need to have a "first component" to have a "second component." A device can also have a "first component" and a "third component" without necessarily having a "second component." Multiple units with the same ordinal number are also possible, for example, multiple "first components."

[0015] A three-dimensional substrate is defined as a substrate comprising at least two surfaces whose normal directions form an angle to each other, for example, an angle of at least 15°. In particular, three-dimensional substrates may also have recesses, protrusions, recesses, or the like. Three-dimensional substrates can, for example, be cuboids, cubes, spheres, prisms, shells, cylinders, cones, or undefined shapes in their basic form. Thus, three-dimensional substrates are understood to be, in particular, components that have both regular and irregular spatial dimensions and surface areas. Specifically, according to the present understanding, it is intended that such substrates are designed to have a coating applied to several, and especially all, surfaces.

[0016] A coating area is formed, in particular, by a rotatable support or a rotatable clamp for holding the substrate. A coating area can also be a free space in which the substrate is rotatably held, for example, suspended from a thread or a strut. Rotation of the substrate is usually relatively slow. A source arrangement can consist of a single coating source or of several coating sources oriented relative to each other in a specific way. If a source arrangement is oriented in a principal direction, all coating sources are aligned in this principal direction or with only a small angular deviation, for example, a maximum of 10°, a maximum of 20°, or a maximum of 30°, relative to this principal direction.The orientation of a coating source is understood to be the normal direction of the coating source, which forms a center line of the hemispherical shape of the coating material extending from the coating source. A coating source, for example, has several coating sources positioned at a slight angle to each other in order to uniformly coat a surface of the substrate located in front of the source arrangement in the main direction.

[0017] For example, one of the first principal directions and the second principal direction can be aligned parallel or approximately parallel to the axis of rotation of the substrate. In this case, the other principal direction can, for example, be aligned approximately perpendicular to the axis of rotation of the substrate.

[0018] Means for detecting the distance between the second source arrangement and the substrate can be designed in any way and may, for example, include means for measuring a distance. In particular, such means for measuring a distance may be based on an optical or acoustic measuring principle. Alternatively or additionally, means for detecting the distance between the second source arrangement and the substrate may also include data processing means by which stored information about the geometry of the substrate is combined with a rotational position of the substrate to calculate a current distance between the surface of the substrate facing the second source arrangement and the second source arrangement. In this case, means for detecting the rotational position of the substrate are also provided, for example.

[0019] The present disclosure relates in particular to a sputtering process. Sputtering, also known as cathode sputtering, is a physical process in which atoms are ejected from a solid, the so-called sputtering target, by bombardment with high-energy noble gases and transition into the gas phase. Depending on the materials used, as well as the desired layer properties and deposition rates, various sputtering technologies are employed.

[0020] Sputtering takes place in a coating system under vacuum conditions. Depending on the sputtering technology used (DC sputtering, RF sputtering, magnetron sputtering, ion beam sputtering, reactive sputtering, etc.), a voltage is applied between two electrodes and a working gas is introduced into the gas chamber. Impact ionization of the atoms in the working gas, e.g., argon, forms a plasma in the gas chamber. The sputtering target usually forms the negative electrode, and a process chamber / coating chamber, a defined anode, or the substrate to be coated usually forms the positively charged electrode.

[0021] In magnetron sputtering, an additional magnetic field is positioned behind the cathode plate. In reactive sputtering, one or more reactive gases are added to the inert working gas (argon). These gases react with the sputtered layer atoms at the sputtering target in the vacuum chamber or on the substrate, forming new materials. In ion beam sputtering, a beam of noble gas ions (argon, krypton, xenon) from an ion source is directed onto the sputtering target, resulting in sputtering by the impacting ion beam.

[0022] The solution to the problem with the aforementioned vacuum coating system comprises the teaching that at least two source arrangements are positioned in different principal directions, such that different surfaces of the three-dimensional substrate are positioned in front of a source arrangement in these principal directions and are thus coated homogeneously by the respective source arrangement. Due to the substrate's rotation, all surfaces of the substrate come into contact with a source arrangement at least temporarily during the coating process and can be coated during this time. Even with complex geometries, it can be achieved that each surface to be coated is at least temporarily perpendicular to, or with an acceptable deviation from, a source arrangement, and thus, when all source arrangements are in operation, layer build-up occurs on all surfaces.

[0023] Based on the understanding that the distance between a given substrate surface and its associated source arrangement varies depending on the geometry, the solution further includes the teaching that at least the power consumption of the second source arrangement and / or the rotational speed of the substrate is controlled and / or regulated according to the distance to the substrate in order to achieve a uniform and homogeneous coating of consistent material thickness across the entire substrate in such a situation. When controlling / regulating the power consumption, it can then advantageously be adjusted so that the material thickness or layer buildup rate produced by the second source arrangement on the associated substrate surface(s) is equal to that produced by the first source arrangement on the same surface(s).Over the course of time that each surface remains in front of a source arrangement during the substrate's rotation, the same coating thickness is deposited as on all other surfaces of the substrate. Accordingly, when the rotation speed is controlled, each surface is held in front of the second source arrangement for as long as necessary to build up a specific layer thickness at the measured distance to the second source arrangement. Due to the different transit times of the various surfaces, the same layer thickness increase per revolution of the substrate can be achieved for each surface. The coating can then be advantageously produced uniformly and homogeneously with a consistent layer thickness across the entire substrate, even with relatively complex geometries.It is also optionally possible to intentionally create coating thicknesses of unequal thickness across the substrate, should this be the intention of the coating process.

[0024] In accordance with the present disclosure, more than one second source arrangement may also be provided, wherein the principal directions of all second source arrangements form an angle of at least 45° to the principal direction of the first source arrangement and preferably also to each other. The more source arrangements are provided in the aforementioned controlled and / or regulated embodiment of the vacuum coating system, the more complex a substrate can be in three dimensions to achieve a uniform, homogeneous coating. For example, a total of up to eight source arrangements may be provided.

[0025] Control is understood as adjusting the power consumption or rotational speed directly as a function of the measured distance and / or according to a predefined time profile, without feedback. In contrast, regulation considers a feedback variable and forms a control loop. Examples of feedback variables include distance, power consumption, rotational speed, achieved coating thickness, or deposition rate.

[0026] Alternatively or additionally, the vacuum coating system can be provided with means for detecting the distance between the first source arrangement and the substrate, wherein the power consumption of the first source arrangement and / or the rotational speed of the substrate can be controlled and / or regulated according to the detected distance between the first source arrangement and the substrate. This makes it possible to regulate and / or control the entire coating process. In particular, it is advantageous to achieve a uniform coating thickness on all surfaces by means of controlled / regulated power consumption, especially when the individual surfaces of the substrate spend a cumulative amount of time in front of a source arrangement due to the substrate's rotation, as this results in very different total exposure times.By means of controlled / regulated rotation, a distance-dependent time per surface can be achieved, during which the surface remains in front of the source arrangement.

[0027] Alternatively or additionally, the means for measuring the distance between the second source arrangement and the substrate and / or the means for measuring the distance between the first source arrangement and the substrate can be arranged on the respective source arrangement. In particular, a measuring device such as a laser measuring device or an ultrasonic measuring device is arranged there, which measures the current distance to the surface of the substrate facing the source arrangement without protruding into the coating area. In this way, even with relatively fast rotation of non-rotationally symmetrical substrates, the current distance can be measured at any time without restricting the coating area and without requiring information about the geometry of the substrate to be known and / or stored in the vacuum coating system.

[0028] Alternatively or additionally, the first coating area can be formed by a rotatable substrate carrier. A substrate of any geometry can advantageously be securely held on such a substrate carrier, for example, a rotatable plate. Alternatively or additionally, the vacuum coating system can have a rotary table for holding several substrate carriers, each rotatable about itself, with a substrate carrier positioned at a first angular position on the rotary table forming the first coating area. The substrate can then be easily and automatically or semi-automatically rotated into the coating area and rotated out after the coating process, with a defined positioning.While the substrate is positioned in the coating area, it is rotated by means of the rotatable substrate carrier to achieve uniform coating. Specifically, the evacuable coating chamber can be formed around the entire turntable or, alternatively, only around the individual coating area.

[0029] Alternatively or additionally, a substrate carrier positioned at a second angular position on the rotary table can form a second coating area, with the vacuum coating system comprising at least one third source arrangement directed towards the second coating area, including at least one coating source. This enables the simultaneous coating of multiple substrates, whereby, for example, a coating process can consist of passing through only one coating area. Alternatively, a coating process can consist of passing through both coating areas, where, for example, the coating areas contain the same material as coating sources and different areas or surfaces of the substrate are coated in the different coating areas.

[0030] Alternatively or additionally, at least one coating source of the third source arrangement can be made of a different coating material than the coating sources of the first and / or second source arrangements. This allows for the production of various coatings and / or a coating consisting of layers of different materials in the vacuum coating system during the sequential processing of the coating areas. However, at least one coating source of the third source arrangement can also be made of the same coating material as the coating sources of the first and / or second source arrangements.

[0031] Alternatively or additionally, the first source arrangement and / or the second source arrangement may have several coating sources directed towards the first coating area in different secondary directions, with the secondary directions being at a second angle to each other. This second angle is, for example, a maximum of 30°. The source arrangement then produces a particularly uniform and homogeneous coating on a surface. In particular, the coating on a surface is also produced with exceptional uniformity even when the surface is at a small angle to the main direction of the source arrangement, for example, a maximum of 30° or a maximum of 45°.In particular, a source arrangement comprises a coating source oriented in the main direction and two, four, or eight coating sources arranged around this main-direction-oriented coating source, oriented in a secondary direction, to enable uniform coating over a large surface area of ​​the substrate. The source arrangement can also include multiple coating sources, for example, three, all oriented in a secondary direction, with the main direction being defined by the angle dividing all secondary directions, without any coating source being oriented in the main direction. Furthermore, such a source arrangement also allows for layer build-up in a recess such as a bore.

[0032] Alternatively or additionally, the vacuum coating system can be provided with an airlock and a handling robot, the handling robot being configured to move substrates between a substrate carrier and the airlock. The coating chamber can then remain evacuated during a multitude of coating processes, with the handling robot handling the substrates without interrupting the vacuum. Specifically, the handling robot moves the substrates to / from a substrate carrier that is not currently located within a coating area.

[0033] Alternatively or additionally, it can be provided that the coating sources are powered by MF power supply, which also enables reactive processes.

[0034] (e.g., oxides or nitrides) can be implemented. Alternatively, power can be supplied via DC / DC power supply or RF power supply.

[0035] Alternatively or additionally, the first source arrangement can be mounted on a first support element and the second source arrangement on a second support element. The source arrangements can then be adjustable, particularly on their respective support elements, so that the angles of the main directions relative to each other can be adjusted to optimize the coating of a specific three-dimensional substrate geometry.

[0036] Substrates can be adjusted.

[0037] Alternatively or additionally, the coating sources can be configured as magnetron sputtering targets, diode sputtering targets, and / or ion beam sputtering targets. In particular, the coating sources are configured as planar targets, for example, in a circular shape. Using coating sources configured in this way, the homogeneous coating of a variety of substrates with a variety of coating materials can be achieved.

[0038] The problem is further solved by a method for coating a three-dimensional substrate with a previously described vacuum coating system, comprising the steps of: arranging a single substrate in the first coating area and coating the substrate arranged in the first coating area by simultaneously or sequentially operating the first source arrangement and the second source arrangement with the substrate rotating, wherein the distance between the at least one second source arrangement and the substrate is detected, particularly during coating, and wherein the power consumption of the at least one second source arrangement and / or the rotational speed of the substrate is controlled or regulated according to the detected distance between the second source arrangement and the substrate. The advantages previously described with respect to the vacuum coating system are achieved accordingly with this method.In particular, even with relatively complex three-dimensional geometries of a substrate, a uniform, homogeneous coating of the substrate with a constant layer thickness can be achieved across the entire substrate.

[0039] Alternatively or additionally, the distance between the first source arrangement and the substrate can be detected, particularly during coating, with the power consumption of the first source arrangement and / or the rotational speed of the substrate being controlled or regulated according to the detected distance between the first source arrangement and the substrate. This makes it possible to regulate and / or control the entire coating process. Particularly advantageous is the ability to achieve a uniform coating thickness or deposition rate on all surfaces when the individual surfaces of the substrate remain in front of a source arrangement for varying sums of time due to the substrate's rotation, provided the power consumption is controlled / regulated. Accordingly, controlled / regulated rotation allows for a distance-dependent time per surface during which the surface remains in front of the source arrangement.

[0040] source arrangement is delayed.

[0041] Brief description of the drawings

[0042] A preferred technical solution is explained in more detail below with reference to the accompanying drawings and preferred embodiments. The term "figure" is abbreviated as "Fig." in the drawings.

[0043] The drawings show

[0044] Fig. 1 shows a schematic representation of a vacuum coating system in a first embodiment according to the present disclosure;

[0045] Fig. 2 shows a perspective view of part of a vacuum coating system in a second embodiment according to the present disclosure;

[0046] Fig. 3 shows a perspective view of part of a vacuum coating system in a third embodiment according to the present disclosure;

[0047] Fig. 4a shows a perspective view of a three-dimensional substrate as a first example;

[0048] Fig. 4b shows a perspective view of a three-dimensional substrate as a second example;

[0049] Fig. 4c shows a perspective view of a three-dimensional substrate as a third example; and

[0050] Fig. 5 is a diagram of a process according to the present disclosure.

[0051] Detailed description of the drawings

[0052] The described embodiments are merely examples that can be modified and / or supplemented in various ways within the scope of the claims. Each feature described for a particular embodiment can be used independently or in combination with other features in any other embodiment. Each feature described for an embodiment of a particular claim category can also be used accordingly in an embodiment of a different claim category.

[0053] Figure 1 shows a schematic representation of a vacuum coating system 1 from a bottom view, with the components arranged in a coating chamber 2 shown without a detailed illustration of the enclosure of the coating chamber 2. The vacuum coating system 1 comprises a rotary table 3 with several substrate carriers 4.1, 4.2 designed as rotatable plates (another substrate carrier 4.3 is shown in Figure 2), each supporting a three-dimensional substrate 6. The substrate carriers 4.1, 4.2, 4.3 are rotatable about their vertical axis, as indicated by arrows in one possible direction of rotation.

[0054] In the arrangement of the rotary table 3 shown in Figure 1, the first substrate support 4.1 forms a first coating area 7.1 or is located in a first coating area 7.1, and the second substrate support 4.2 forms a second coating area 7.2. The coating areas 7.1, 7.2 are designed, for example, for coatings made of different materials, for coating different substrates 6, or for forming several layers of a coating on the same substrate 6.

[0055] In the first coating area 7.1, a first source arrangement 8.1 is arranged above the substrate 6. The first source arrangement 8.1 has three coating sources 9.1, 9.2, 9.3, which are tilted relative to each other in secondary directions 26.1, 26.2, 26.3 and about a first principal direction 10.1, which is perpendicular to the plane of the drawing and thus perpendicular to the first substrate support 4.1. The coating sources 9.1, 9.2, 9.3 are designed as round planar magnetron sputtering targets and are mounted on a common first support element 11, which, for example, may be tiltable (though this is not shown in detail). Furthermore, the first source arrangement 8.1 includes means 12 for detecting a distance between the first source arrangement 8.1 and the substrate 6, for example, a measuring device that uses a laser to measure the distance to the substrate 6.

[0056] Furthermore, a second source arrangement 8.2 is arranged laterally to the substrate 6, which also has three coating sources 13.1, 13.2, 13.3. The first coating source 13.1 is directed towards the substrate 6 in a second principal direction 10.2, and the other two coating sources 13.2, 13.3 are directed towards the substrate 6 in secondary directions 14.1, 14.2, each forming an angle of 30° with the second principal direction 10.2. The coating sources 13.1, 13.2, 13.3 are also designed as round planar magnetron sputtering targets.

[0057] The first principal direction 10.1 and the second principal direction 10.2 are at a first angle of 90° to each other. The coating sources 13.1, 13.2, 13.3 are mounted on a common second support element 15, which, for example, may be tiltable (though this is not shown in detail). Furthermore, the second source arrangement 8.2 includes means 16 for detecting a distance between the second source arrangement 8.2 and the substrate 6, for example, a measuring device that uses a laser to measure the distance.

[0058] Around the second coating area 7.2, a third source arrangement 8.3 and a fourth source arrangement 8.4 are further arranged, each comprising only one coating source 18, 19. The source arrangements 8.3, 8.4 and the coating sources 18, 19, respectively, are directed perpendicularly to each other from two directions onto the substrate 6. The coating sources 18, 19 are also designed as round planar magnetron sputtering targets and are each mounted on a support element 21, 22, which may be tiltable without further illustration. The source arrangements 8.3, 8.4 also include means 24, 25 for detecting a distance between the respective source arrangement 8.3, 8.4 and the substrate 6, for example, a measuring device that measures the distance using a laser.

[0059] The substrate 6 is rectangular in shape, so that when the first substrate support 4.1 rotates, the distance between the substrate 6 and the second source arrangement 8.2 varies depending on the orientation of the substrate 6. It is therefore intended to control and / or regulate the power consumption of the coating sources 13.1, 13.2, 13.3 of the second source arrangement 8.2 and / or the rotational speed of the substrate according to the distance detected by the means 16 for sensing the distance between the second source arrangement 8.2 and the substrate 6.

[0060] Figure 2 shows a perspective view of a vacuum coating system 1 in an embodiment similar to that of Figure 1, showing a detailed view of the first coating area 7.1. The substrate 6 is, for example, cross-shaped with a top surface 6.1 and several sides 6.2 arranged perpendicular to the top surface 6.1. In Figure 2, the first source arrangement 8.1 is shown with a coating source 9.1 oriented perpendicular to the top surface 6.1 of the substrate 6 in the first principal direction 10.1 and two coating sources 9.2, 9.3 oriented in secondary directions 26.1, 26.2. The secondary directions 26.1, 26.2 are tilted by 30° relative to the first principal direction 10.1. The second source arrangement 8.2 is essentially designed and arranged as in Figure 1, except that the first principal direction 10.1 and the second principal direction 10.2 form an angle of less than 90° to each other.

[0061] Figure 3 shows a further embodiment of a vacuum coating system 1 in a view of the first coating area 7.1, in which the first source arrangement 8.1 has only one first coating source 9.1 oriented in the first principal direction 10.1. The first principal direction 10.1 is perpendicular to the top surface 6.1 of the substrate. The second source arrangement 8.2 has two coating sources 13.1, 13.2, which are oriented in secondary directions 14.1, 14.2 around the second principal direction 10.2, without either coating source of the second source arrangement 8.2 being oriented in the second principal direction 10.2.

[0062] Figures 4a to 4c show various embodiments of three-dimensional substrates 6, each with a top surface 6.1 and one or more sides 6.2. According to Figure 4a, the substrate 6 can, for example, have a rectangular base shape. According to Figure 4b, the substrate 6 can, for example, have a round base shape. According to Figure 4c, the substrate 6 can, for example, have a triangular base shape.

[0063] Figure 5 shows a process flow diagram of a method 30 for coating a three-dimensional substrate 6 with the vacuum coating system 1. In a first step 31, a single substrate 6 is arranged in the first coating area 7.1. In a second step 32, the substrate 6 arranged in the first coating area 7.1 is coated by simultaneous or sequential operation of the first source arrangement 8.1 and the second source arrangement 8.2 while the substrate 6 is rotating. The distance between the at least one second source arrangement 8.2 and the substrate 6 is detected, particularly during coating – for example, by means of the means 16 for detecting a distance between the second source arrangement 8.2 and the substrate 6 – and the power consumption of the at least one second source arrangement 8.2 and / or the rotational speed of the substrate 6 is correlated with the detected distance between the second source arrangement 8.2 and the substrate 6.2 and the substrate 6 are controlled or regulated accordingly. Preferably, the distance between the first source arrangement 8.1 and the substrate 6 is also detected, particularly during coating – for example, by means of the means 12 for detecting a distance between the first source arrangement 8.1 and the substrate 6 – and the power consumption of the first source arrangement 8.1 and / or the rotational speed of the substrate 6 is controlled or regulated accordingly.

[0064] Reference number list

[0065] 1 vacuum coating system

[0066] 2 coating chambers

[0067] 3 turntables

[0068] 4.1 First substrate carrier

[0069] 4.2 Second substrate carrier

[0070] 4.3 Third substrate carrier

[0071] 6 Substrat

[0072] 6.1 Top side of the substrate

[0073] 6.2 Side of the substrate

[0074] 7.1 First coating area

[0075] 7.2 Second coating area

[0076] 8.1 First source arrangement

[0077] 8.2 Second source arrangement

[0078] 8.3 Third source arrangement

[0079] 8.4 fourth source arrangement

[0080] 9.1 First coating source of the first source arrangement

[0081] 9.2 Second coating source of the first source arrangement

[0082] 9.3 Third coating source of the first source arrangement

[0083] 10.1 First main direction

[0084] 10.2 second main direction

[0085] 11 first support element of the first source arrangement

[0086] 12 Means for measuring the distance between the first source arrangement and the substrate

[0087] 13.1 First coating source of the second source arrangement

[0088] 13.2 Second coating source of the second source arrangement

[0089] 13.3 Third coating source of the second source arrangement

[0090] 14.1 Side direction to the second main direction

[0091] 14.2 Side direction to the second main direction

[0092] 15 second support element of the second source arrangement

[0093] 16 Means for detecting a distance between the second source arrangement and the substrate 18 Coating source of the third source arrangement

[0094] 19 Coating source of the fourth source arrangement

[0095] 21 Support element of the third source arrangement

[0096] 22 Support element of the fourth source arrangement 24 Means for detecting a distance between the third source arrangement and the

[0097] substrate

[0098] 25 Means for measuring the distance between the fourth source arrangement and the substrate

[0099] 26.1 Secondary direction to the first main direction 26.2 Secondary direction to the first main direction

[0100] 26.3 Secondary direction to the first main direction

[0101] 30 methods for coating a three-dimensional substrate

[0102] 31 First step - Arranging a single substrate

[0103] 32 Second step - Coating the substrate

Claims

Claims 1. A vacuum coating system (1) for coating three-dimensional substrates (6), comprising an evacuable coating chamber (2) with at least one first coating area (7.1) for rotatable reception of a single substrate (6); a first source arrangement (8.1) directed in a first main direction (10.1) towards the first coating area (7.1) with at least one coating source (9.1, 9.2, 9.3); at least one second source arrangement (8.2) directed in a second main direction (10.2) towards the first coating area (7.1) with at least one coating source (13.1, 13.2, 13.3); and Means (16) for detecting a distance between the second source arrangement (8.2) and the substrate (6); wherein the first main direction (10.1) and the second main direction (10.2) are at an angle of at least 45° to each other; and the power absorption of the at least one second source arrangement (8.2) and / or the rotational speed of the substrate (6) is controllable and / or adjustable in accordance with the detected distance between the second source arrangement (8.2) and the substrate (6).

2. The vacuum coating system (1) according to the preceding claim, comprising means (12) for detecting a distance between the first source arrangement (8.1) and the substrate (6), wherein the power absorption of the first source arrangement (8.1) and / or the rotational speed of the substrate (6) is controllable and / or adjustable in accordance with the detected distance between the first source arrangement (8.1) and the substrate (6).

3. Vacuum coating system (1) according to any one of the preceding claims, wherein the means (16) for detecting a distance between the second source arrangement (8.2) and the substrate (6) and / or the means (12) for detecting a distance between the first source arrangement (8.1) and the substrate (6) are arranged on the respective source arrangement (8.1, 8.2).

4. Vacuum coating system (1) according to any one of the preceding claims, wherein the first coating area (7.1) is formed by a rotatable substrate carrier (4.1).

5. Vacuum coating system (1) according to any one of the preceding claims, comprising a turntable (3) for receiving a plurality of substrate carriers (4.1, 4.2, 4.3) each rotatable about itself, wherein a substrate carrier (4.1) standing in a first angular position of the turntable (3) forms the first coating area (7.1).

6. Vacuum coating system (1) according to the preceding claim, wherein a substrate carrier (4.2) standing in a second angular position of the turntable (3) forms a second coating area (7.2), and wherein the vacuum coating system (1) has at least one third source arrangement (8.3) directed at the second coating area (7.2) with at least one coating source (18).

7. Vacuum coating system (1) according to the preceding claim, wherein the at least one coating source (18) of the third source arrangement (8.3) is formed from a different coating material than the coating sources (9.1, 9.2, 9.3, 13.1, 13.2, 13.3) of the first source arrangement (8.1) and / or the second source arrangement (8.2).

8. The vacuum coating system (1) according to any one of the three preceding claims, further comprising a lock and a handling robot, wherein the handling robot is configured to move substrates (6) between a substrate carrier (4.1, 4.2, 4.3) and the lock.

9. The vacuum coating system (1) according to any one of the preceding claims, wherein the first source arrangement (8.1) and / or the second source arrangement (8.2) has a plurality of coating sources (9.1, 9.2, 9.3, 13.1, 13.2, 13.3) directed at the first coating area (7.1) in different side directions (14.1, 14.2, 26.1, 26.2), and the side directions (14.1, 14.2, 26.1, 26.2) are at a second angle to each other, in particular at a second angle of at most 30°.

10. The vacuum coating system (1) according to any one of the preceding claims, wherein a power supply of the coating sources (9.1, 9.2, 9.3, 13.1, 13.2, 13.3, 18, 19) is effected by means of an MF power supply, a DC / DC power supply or an RF power supply.

11. The vacuum coating system (1) according to any one of the preceding claims, wherein the first source arrangement (8.1) is accommodated on a first carrier element (11) and the second source arrangement (8.2) is accommodated on a second carrier element (15).

12. The vacuum coating system (1) according to any one of the preceding claims, wherein the coating sources (9.1, 9.2, 9.3, 13.1, 13.2, 13.3, 18, 19) are formed as magnetron sputter targets, diode sputter targets and / or ion beam sputter targets.

13. A method (30) for coating a three-dimensional substrate (6) with a vacuum coating system (1) according to any one of the preceding claims, comprising the steps: Arranging (31) a single substrate (6) in the first coating area (7.1); and Coating (32) the substrate (6) arranged in the first coating area (7.1) by simultaneously or sequentially operating the first source arrangement (8.1) and the second source arrangement (8.2) with the substrate (6) rotating; wherein the distance between the at least one second source arrangement (8.2) and the substrate (6), in particular during coating, is detected; and the power consumption of the at least one second source arrangement (8.2) and / or the rotational speed of the substrate (6) is controlled or regulated in accordance with the detected distance between the second source arrangement (8.2) and the substrate (6).

14. The method (30) according to the preceding claim, wherein the distance between the first source arrangement (8.1) and the substrate (6), in particular during coating, is detected; and the power consumption of the first source arrangement (8.1) and / or the rotational speed of the substrate (6) is controlled or regulated in accordance with the detected distance between the first source arrangement (8.1) and the substrate (6).

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