Substrate processing apparatus and substrate processing method

Abstract

The present disclosure describes a substrate processing apparatus and a substrate processing method that make it possible to suppress adhesion of foreign matter (for example, particles, chemical residue, and the like) to a peripheral part of an upper surface of a substrate.　The substrate processing apparatus comprises: a support part configured so as to support the substrate; a supply part configured so as to supply a cleaning liquid toward the upper surface of the substrate supported by the support part; another supply part configured so as to supply a processing liquid toward a lower surface of the substrate supported by the support part; and a control unit. The control unit is configured so as to perform a first process of supplying a chemical liquid, which is a processing liquid, at least once toward the lower surface of the substrate supported by the support part, a second process of supplying a different cleaning liquid, which is another processing liquid, toward the lower surface of the substrate supported by the support part after the first process, and a third process of supplying a cleaning liquid toward the upper surface of the substrate supported by the support part at least during a period spanning the first process and the second process.

Description

Substrate processing apparatus and substrate processing method

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.

[0002] Patent Document 1 discloses a liquid processing apparatus configured to process the backside of a substrate with a processing liquid (e.g., a chemical liquid, a rinse liquid, etc.). The apparatus includes a support unit that supports the substrate, a rotation unit that rotates the substrate supported by the support unit, a supply unit that supplies a cleaning liquid to the backside of the substrate supported by the support unit, and a cup arranged to surround the periphery of the substrate supported by the support unit. When the cleaning liquid is supplied from the supply unit to the backside of the rotating substrate, centrifugal force causes the cleaning liquid to flow from the center to the periphery of the backside of the substrate. This processes the backside of the substrate. The cleaning liquid shaken off from the substrate splashes toward the cup, is collected in the cup, and then discharged outside the liquid processing apparatus.

[0003] JP 2010-021279 A

[0004] The present disclosure describes a substrate processing apparatus and a substrate processing method that can suppress adhesion of foreign matter (for example, particles, chemical residue, etc.) to the peripheral portion of the upper surface of a substrate.

[0005] An example of a substrate processing apparatus includes a support configured to support a substrate, a supply unit configured to supply a cleaning liquid toward an upper surface of the substrate supported by the support unit, another supply unit configured to supply a processing liquid toward a lower surface of the substrate supported by the support unit, and a controller configured to control the other supply unit to perform a first process of supplying a chemical liquid, which is one of the processing liquids, toward the lower surface of the substrate supported by the support unit at least once, a second process of controlling the other supply unit to supply a different cleaning liquid, which is one of the processing liquids, toward the lower surface of the substrate supported by the support unit after the first process, and a third process of controlling the supply unit to supply the cleaning liquid toward the upper surface of the substrate supported by the support unit at least during a period spanning the first process and the second process.

[0006] The substrate processing apparatus and substrate processing method according to the present disclosure can prevent foreign matter (for example, particles, chemical residue, etc.) from adhering to the peripheral portion of the upper surface of the substrate.

[0007] FIG. 1 is a schematic cross-sectional view showing an example of a substrate processing apparatus. FIG. 2 is a perspective view showing an example of an imaging unit. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4(a) is a perspective view showing an example of an upper structure of the imaging unit in a retracted position, and FIG. 4(b) is a perspective view showing an example of an upper structure of the imaging unit in an imaging position. FIG. 5 is a block diagram showing an example of the main components of the substrate processing apparatus of FIG. 1. FIG. 6 is a schematic view showing an example of the hardware configuration of a controller. FIG. 7 is a diagram for explaining an example of a substrate cleaning process. FIG. 8 is a diagram for explaining an example of a processing liquid flowing around to the peripheral portion of the upper surface of a substrate. FIG. 9 is a diagram for explaining another example of a substrate cleaning process.

[0008] In the following description, the same elements or elements having the same functions will be designated by the same reference numerals, and redundant explanations will be omitted. Note that in this specification, when referring to the top, bottom, right, and left of a figure, the directions of the reference numerals in the figure will be used as the reference.

[0009] [Configuration of Substrate Processing Apparatus] First, with reference to FIG. 1 , the configuration of an example of a substrate processing apparatus 1 will be described. The substrate processing apparatus 1 is configured to clean the lower surface Wb of a substrate W with a processing liquid. The substrate W may be, for example, a semiconductor substrate (silicon wafer). The diameter of the substrate W may be, for example, approximately 200 mm to 450 mm. The substrate W may be in the shape of a disk, or may be in the shape of a plate other than a circle, such as a polygon. The substrate W may have a cutout portion cut out of a portion. The cutout portion may be, for example, a notch (a groove such as a U-shape or V-shape) or a linear portion extending in a straight line (a so-called orientation flat).

[0010] As illustrated in FIG. 1, the substrate processing apparatus 1 includes a housing 10, a rotating unit 20, a lifting unit 30, a cover member 40, a supply unit 50, a straightening member 60, a lifting unit 70, an upper supply unit 80 (supply unit), a drive unit 90, an imaging unit 100, a blower B, and a controller Ctr (control unit).

[0011] The housing 10 mainly houses a rotating unit 20, an elevating unit 30, a cover member 40, a rectifying member 60, an elevating unit 70, a drive unit 90, an imaging unit 100, and a blower B. A load / unload port 12 is formed in a side wall 11 of the housing 10. A substrate W is loaded into the housing 10 and unloaded from the housing 10 to the outside through the load / unload port 12 by a transport mechanism (e.g., a robot arm) (not shown). An exhaust pipe H1 extending downward is provided in a bottom wall 13 of the housing 10. The exhaust pipe H1 is connected to a suction pump (not shown) and functions as an exhaust flow path for discharging gas inside the cover member 40 to the outside of the housing 10.

[0012] The rotating unit 20 includes a rotating shaft 21, a drive mechanism 22, a support plate 23 (supporting unit), a plurality of support pins 24 (supporting units), and an annular member 25. The rotating shaft 21 is a hollow tubular member extending in the vertical direction. The rotating shaft 21 is attached to the bottom wall 13 of the housing 10 so as to be rotatable around a central axis Ax1.

[0013] The drive mechanism 22 is connected to the rotary shaft 21. The drive mechanism 22 is configured to operate based on an operation signal from the controller Ctr and rotate the rotary shaft 21. The drive mechanism 22 may be a power source such as an electric motor.

[0014] The support plate 23 is, for example, a flat plate having an annular shape and extending horizontally. That is, a through-hole is formed in the center of the support plate 23. The inner periphery of the support plate 23 is connected to the tip end of the rotating shaft 21. Therefore, the support plate 23 is configured to rotate around the central axis Ax1 of the rotating shaft 21 in conjunction with the rotation of the rotating shaft 21.

[0015] The multiple support pins 24 are provided on the support plate 23 so as to protrude upward from the upper surface of the support plate 23. The multiple support pins 24 are configured to support the substrate W approximately horizontally by abutting their tips against the underside Wb of the substrate W. The multiple support pins 24 may have, for example, a cylindrical shape or a frustum shape. The multiple support pins 24 may be arranged at approximately equal intervals near the outer periphery of the support plate 23 so as to form a circle as a whole when viewed from above. For example, when there are 12 multiple support pins 24, the multiple support pins 24 may be arranged at intervals of approximately 30°.

[0016] The annular member 25 has a circular ring shape and is arranged to surround the outer periphery of the support plate 23. In other words, the annular member 25 is configured to surround from the outside the periphery of the substrate W supported by the plurality of support pins 24. The annular member 25 is connected to the outer periphery of the support plate 23 by a plurality of connecting members 26. Therefore, the annular member 25 is configured to rotate around the central axis Ax1 of the rotation shaft 21 in conjunction with the rotation of the rotation shaft 21.

[0017] The annular member 25 may include an upper wall portion 25a and a side wall portion 25b. The upper wall portion 25a is, for example, a plate-like body having an annular shape and extending horizontally. The inner peripheral surface of the upper wall portion 25a forms an inclined surface S1 that is inclined relative to the horizontal. The inclined surface S1 inclines downward in the radial direction of the annular member 25 as it approaches the center of the annular member 25. In other words, the inclined surface S1 inclines downward as it extends radially inward. The height position of the lower surface S2 of the upper wall portion 25a may be higher than, equal to, or lower than the height position of the upper surface Wa of the substrate W supported by the multiple support pins 24.

[0018] The side wall portion 25b may have, for example, a cylindrical shape. The upper end of the side wall portion 25b may be integrally connected to the outer periphery of the upper wall portion 25a. The side wall portion 25b may have a tapered shape that narrows downward.

[0019] The lifting unit 30 includes a shaft member 31, a drive mechanism 32, and a plurality of support pins 33. The shaft member 31 is a hollow tubular member extending in the vertical direction. The shaft member 31 is configured to be rotatable around a central axis Ax1 and to be able to move up and down. The shaft member 31 is inserted inside the rotation shaft 21.

[0020] The drive mechanism 32 is connected to the shaft member 31. The drive mechanism 32 is configured to operate based on an operation signal from the controller Ctr and to raise and lower the shaft member 31. By the drive mechanism 32 raising and lowering the shaft member 31, the shaft member 31 may move up and down between an elevated position (not shown) where the plurality of support pins 33 are positioned above the plurality of support pins 24 and a lowered position (see FIG. 1) where the plurality of support pins 33 are positioned below the plurality of support pins 24. The drive mechanism 22 may be a power source such as a linear actuator, for example.

[0021] The multiple support pins 33 are provided on the shaft member 31 so as to protrude upward from the upper end of the shaft member 31. The multiple support pins 33 are configured to support the substrate W by abutting their tips against the underside Wb of the substrate W. The multiple support pins 33 may have, for example, a cylindrical shape or a frustum shape. The multiple support pins 33 may be arranged at approximately equal intervals so as to form a circular shape as a whole when viewed from above.

[0022] The cover member 40 has an overall annular shape and is provided so as to surround from the outside the annular member 25 and the support plate 23. The cover member 40 functions as a liquid collection container that receives the processing liquids L1, L2 that are supplied to the lower surface Wb of the substrate W and shaken off from the substrate W, and the cleaning liquid L3 that is supplied to the upper surface Wa of the substrate and shaken off from the substrate.

[0023] The cover member 40 may include an upper wall portion 41, a side wall portion 42, and a bottom wall portion 43. The upper wall portion 41 is, for example, a plate-like body having an annular shape and extending horizontally. When viewed from above, the upper wall portion 41 may or may not overlap with the inclined surface S1. For example, the inner peripheral surface of the upper wall portion 41 may be located radially outward from the inclined surface S1. In other words, the inclined surface S1 may be located closer to the center of the annular member 25 than the inner peripheral surface of the upper wall portion 41. When viewed from above, the upper wall portion 41 does not overlap with the substrate W supported by the multiple support pins 24.

[0024] The side wall portion 42 may have, for example, a cylindrical shape. The upper end of the side wall portion 42 may be integrally connected to the outer periphery of the upper wall portion 41. The lower end of the side wall portion 42 may be integrally connected to the outer periphery of the bottom wall portion 43. The bottom wall portion 43 may be inclined upward as it extends radially inward. A through hole H2 is provided in the bottom of the bottom wall portion 43. The through hole H2 functions as a drainage flow path for discharging the processing liquids L1, L2 and the cleaning liquid L3 collected in the cover member 40 to the outside of the housing 10.

[0025] The supply unit 50 includes supply units 51 and 52 (separate supply units) configured to supply the processing liquids L1 and L2 via the shaft member 31, and a supply unit 53 (gas supply unit) configured to supply the drying gas G via the shaft member 31. In other words, the shaft member 31 functions as a nozzle for supplying the processing liquids L1 and L2 and the drying gas G to the lower surface Wb of the substrate W.

[0026] The supply unit 51 includes a liquid source, a valve, a pump, etc. (not shown), and is configured to supply a processing liquid L1 (chemical liquid) to the lower surface Wb of the substrate W through the inside of the shaft member 31 based on a signal from the controller Ctr. The processing liquid L1 may be, for example, a cleaning chemical liquid for removing an unnecessary film such as SiN adhering to the lower surface Wb of the substrate W. The chemical liquid may be, for example, a DHF liquid (dilute hydrofluoric acid), an SC-1 liquid (a mixture of ammonia, hydrogen peroxide, and pure water), or HNO ３ +HF solution (a mixed solution of nitric acid and hydrofluoric acid) may also be included.

[0027] The supply unit 52 includes a liquid source, a valve, a pump, etc. (not shown), and is configured to supply a processing liquid L2 (another cleaning liquid, a first cleaning liquid) to the lower surface Wb of the substrate W through the inside of the shaft member 31 based on a signal from the controller Ctr. The processing liquid L2 may be, for example, a cleaning liquid (rinse liquid) for washing away foreign matter (for example, particles, chemical residues, etc.). The cleaning liquid may include, for example, deionized water (DIW).

[0028] The supply unit 53 includes a liquid source, a valve, a pump, etc. (not shown), and is configured to supply the dry gas G to the lower surface Wb of the substrate W through the inside of the shaft member 31 based on a signal from the controller Ctr. The dry gas G may be, for example, an inert gas (e.g., nitrogen gas).

[0029] The flow rectifying member 60 is disposed above the cover member 40. The flow rectifying member 60 includes a base portion 61, a protruding portion 62, and a sealing member 63. The base portion 61 is, for example, a plate-like body having an annular shape and extends horizontally. The outer periphery of the base portion 61 overlaps with the upper wall portion 41 when viewed from above. The outer periphery of the base portion 61 is a portion of the base portion 61 that is located radially outward from the protruding portion 62. On the other hand, the inner periphery of the base portion 61 does not overlap with the upper wall portion 41 when viewed from above, but overlaps with the peripheral edge portion We of the substrate W supported by the multiple support pins 24.

[0030] The protrusion 62 is provided so as to protrude downward from the lower surface of the inner periphery of the base portion 61. Therefore, when viewed from above, the protrusion 62 overlaps (faces) the peripheral portion Wc of the substrate W supported by the plurality of support pins 24, and also overlaps with the plurality of support pins 24.

[0031] The sealing member 63 is a cylindrical body having an annular shape. The sealing member 63 may have a cylindrical frustum shape that widens radially outward from the top to the bottom. The sealing member 63 may be provided on the bottom surface of the outer periphery of the base portion 61 so as to protrude downward from the bottom surface. Although not shown, the sealing member 63 may be provided on the top surface of the upper wall portion 41 so as to protrude upward from the top surface.

[0032] When the flow rectifying member 60 is located in a lowered position (processing position) adjacent to the upper wall portion 41 (see FIG. 1 ), the sealing member 63 is sandwiched between the lower surface of the outer periphery of the base portion 61 and the upper surface of the upper wall portion 41. This allows the sealing member 63 to seal the space V between the lower surface of the outer periphery of the base portion 61 and the upper surface of the upper wall portion 41. The sealing member 63 may be made of a flexible material (e.g., fluororubber, silicone rubber, ethylene propylene rubber, etc.). In this case, when the sealing member 63 seals the space V, the sealing member 63 deforms between the base portion 61 and the upper wall portion 41, improving the sealing performance.

[0033] The lifting unit 70 is configured to move the flow rectifying member 60 in the up and down direction based on instructions from the controller Ctr. Specifically, the lifting unit 70 is configured to move the flow rectifying member 60 up and down between an elevated position (see FIG. 4 ) for loading and unloading the substrate W onto and from the plurality of support pins 24 and a lowered position (processing position) (see FIG. 1 ) in which the flow rectifying member 60 is positioned near the upper wall portion 41 of the cover member 40 for processing the substrate W.

[0034] The lifting unit 70 may be, for example, a linear cylinder. The lifting unit 70 may include a base member 71, a rod 72, and a slider 73. The rod 72 extends linearly upward from the base member 71. The slider 73 is connected to the flow straightening member 60 and is configured to move up and down along the extension direction (vertical direction) of the rod 72 based on instructions from the controller Ctr. When the slider 73 descends to the lower end of the rod 72, it abuts against the base member 71 and stops. Therefore, the base member 71 and the slider 73 have the function of preventing the flow straightening member 60 from moving downward below the processing position.

[0035] The upper supply unit 80 includes a liquid source, a valve, a pump, etc. (not shown), and is configured to supply a cleaning liquid L3 (second cleaning liquid) toward the upper surface Wa of the substrate W based on a signal from the controller Ctr. The upper supply unit 80 is configured to supply the cleaning liquid L3, for example, toward a peripheral portion Wc of the upper surface Wa of the substrate W supported by the plurality of support pins 24 (a region of the upper surface Wa of the substrate W that overlaps with the protrusion 62 when viewed from the top-bottom direction). The cleaning liquid L3 may include, for example, deionized water (DIW).

[0036] The upper supply unit 80 may be disposed in a slit ST partially provided in the flow straightening member 60 (the base portion 61 and the protruding portion 62). That is, the flow straightening member 60 may have a C-shape (major arc shape) with a notch of a width corresponding to the size of the upper supply unit 80. The upper supply unit 80 includes a main body portion 81 and a nozzle 82.

[0037] The main body 81 is configured to supply the cleaning liquid L3 from a liquid source (not shown) to the nozzle 82. The nozzle 82 is configured to discharge the cleaning liquid onto the upper surface Wa of the substrate W. When viewed from above, the discharge outlet of the nozzle 82 may face in a direction along a tangent to the outer periphery of the substrate W. When viewed from above, the tangent may pass through an intersection where an imaginary line connecting the center of the substrate W and the discharge outlet of the nozzle 82 intersects with the outer periphery of the substrate W. The discharge outlet of the nozzle 82 may face radially outward of the substrate W with respect to the tangent. The discharge outlet of the nozzle 82 may face in the same direction as the rotation direction of the substrate W.

[0038] The drive unit 90 is configured to move the upper supply unit 80 above the substrate W supported by the plurality of support pins 24 based on a signal from the controller Ctr. The drive unit 90 may be connected to the main body 81 via a connection member 91. The drive unit 90 may be configured to move the upper supply unit 80 along the radial direction of the substrate W when viewed from above. The drive unit 90 may be configured to move the upper supply unit 80 along the vertical direction.

[0039] The imaging section 100 is configured to, based on a signal from the controller Ctr, mainly image a peripheral portion Wc of the upper surface Wa of the substrate W supported by the plurality of support pins 24. The imaging section 100 is configured to transmit the captured image to the controller Ctr. Details of the imaging section 100 will be described later.

[0040] The blower B is disposed within the housing 10 above the rotating unit 20, the lifting unit 30, the cover member 40, and the rectifying member 60. The blower B operates based on an operation signal from the controller Ctr, and is configured to form a downward flow that passes through the inner space of the rectifying member 60 and flows toward the upper surface Wa of the substrate W.

[0041] The controller Ctr is configured to partially or entirely control the substrate processing apparatus 1. Details of the controller Ctr will be described later.

[0042] 2 to 4, the imaging unit 100 will be described in detail. As illustrated in Fig. 2, the imaging unit 100 includes a base unit 110, a rotating unit 120 (drive unit), a support unit 130, linear motion units 140 and 150 (drive units), a support unit 160, a linear motion unit 170 (drive unit), a support unit 180, an imaging device 190, and drive mechanisms AC1 to AC4 (drive units).

[0043] The base unit 110 forms a foundation that supports the other elements (rotation unit 120, support units 130, 160, 180, linear motion units 140, 150, 170, and imaging device 190) that make up the imaging unit 100. The rotation unit 120 is disposed on the base unit 110 and is configured to be rotatable around a rotation axis Ax2 that extends along the vertical direction.

[0044] The support unit 130 has a flat plate shape and is configured to support elements (linear motion units 140, 150, 170, support units 160, 180, and image capture device 190) that are directly or indirectly placed on the support unit 130. The support unit 130 is disposed on the rotating unit 120. Therefore, the support unit 130 and the elements (linear motion units 140, 150, 170, support units 160, 180, and image capture device 190) that are directly or indirectly placed on the support unit 130 rotate around the rotation axis Ax2 as the rotating unit 120 rotates.

[0045] The linear motion unit 140 is disposed on the support unit 130 and configured to move linearly in a predetermined first direction (X direction in FIG. 2 ) along the horizontal direction. The linear motion unit 140 includes, for example, a rail unit 141 and a slider unit 142, and forms a linear motion bearing (linear guide). In the example of FIG. 2 , the rail unit 141 is attached to the support unit 130. The slider unit 142 is attached to the rail unit 141 so as to be linearly movable along the extension direction of the rail of the rail unit 141 (X direction in FIG. 2 ). Therefore, elements directly or indirectly placed on the slider unit 142 (the linear motion units 150 and 170, the support units 160 and 180, and the imaging device 190) move horizontally in accordance with the linear movement of the slider unit 142.

[0046] The linear motion unit 150 is disposed on the linear motion unit 140 (slider unit 142) and configured to move linearly in a second direction (Y direction in FIG. 2 ) that is horizontal and perpendicular to the first direction. The linear motion unit 150 includes, for example, a rail unit 151 and a slider unit 152, and constitutes a linear motion bearing (linear guide). In the example of FIG. 2 , the rail unit 151 is attached on the slider unit 142. The slider unit 152 is attached to the rail unit 151 so as to be linearly movable along the extension direction of the rail of the rail unit 151 (Y direction in FIG. 2 ). Therefore, elements (support units 160, 180, linear motion unit 170, and imaging device 190) directly or indirectly placed on the slider unit 152 move horizontally in accordance with the linear movement of the slider unit 152.

[0047] The support section 160 is configured to support elements (the linear motion section 170, the support section 180, and the imaging device 190) that are placed directly or indirectly on the support section 160. The support section 160 is a plate-like body bent into an L-shape, and includes a horizontal section 161 that extends along the horizontal direction and a vertical section 162 that extends along the vertical direction. The horizontal section 161 is disposed on the slider section 152.

[0048] The linear motion unit 170 is disposed on the main surface of the vertical unit 162 and configured to move linearly in a predetermined third direction (Z direction in FIG. 2 ) along the vertical direction. The linear motion unit 170 includes, for example, a slider unit 171 and a rail unit 172, and configures a linear motion bearing (linear guide). In the example of FIG. 2 , the slider unit 171 is attached to the vertical unit 162. The rail unit 172 is attached to the slider unit 171 so as to be linearly movable along the extension direction of the rail of the rail unit 172 (Z direction in FIG. 2 ). Therefore, elements (the support unit 180 and the imaging device 190) directly or indirectly placed on the rail unit 172 move up and down in accordance with the linear movement of the rail unit 172.

[0049] The support section 180 is configured to support an element (imaging device 190) that is placed directly or indirectly on the support section 180. The support section 180 is a plate-like body bent into an L-shape, and includes a vertical section 181 that extends vertically and a horizontal section 182 that extends horizontally. The vertical section 181 is disposed on the rail section 172.

[0050] 2 and 3, the imaging device 190 includes a camera 191, a lens 192, a reflecting unit 193, an illumination unit 194, and a support unit 195. The camera 191 has an imaging element 191a (e.g., a CCD image sensor, a CMOS image sensor, or the like) built in, and is configured to generate a captured image based on light captured by the imaging element 191a.

[0051] Lens 192 is attached to the opening of camera 191 so as to face image pickup element 191a. Reflecting section 193 is attached to the tip of lens 192 and includes mirror 193a. Mirror 193a is disposed within reflecting section 193 at an angle of approximately 45° with respect to the horizontal direction.

[0052] The illumination unit 194 is attached to the lower part of the reflecting unit 193. The illumination unit 194 includes at least one light source 194a. The light source 194a may have an annular shape, an arc shape, a linear shape, or a point shape. The light source 194a may be disposed at any position on the inner wall surface of the illumination unit 194. That is, the light source 194a may be disposed on the top wall or side wall of the illumination unit 194.

[0053] 3, when the peripheral edge Wc of the substrate W is located below the illumination unit 194, light emitted from the light source 194a is reflected by the peripheral edge Wc of the upper surface Wa of the substrate W. The reflected light passes through the illumination unit 194, is reflected again by the mirror 193a of the reflector 193, passes through the lens 192, and is incident on the image sensor 191a of the camera 191. That is, the camera 191 can capture an image of an object present in the irradiation area of ​​the light source 194a via the mirror 193a.

[0054] Support portion 195 is an L-shaped flat plate, and its base end is attached to the main surface of horizontal portion 182. Support portion 195 is configured to support camera 191, lens 192, reflecting portion 193, and lighting portion 194 at its tip end. In other words, camera 191, lens 192, and reflecting portion 193 are aligned in a straight line in the horizontal direction on support portion 195.

[0055] The drive mechanism AC1 is connected to the rotating unit 120. The drive mechanism AC1 is configured to operate based on an operation signal from the controller Ctr and rotate the rotating unit 120 around the rotation axis Ax2. The drive mechanism AC1 may be, for example, a power source such as an electric motor.

[0056] The drive mechanism AC2 is connected to the linear motion unit 140. The drive mechanism AC2 is configured to operate based on an operation signal from the controller Ctr and to linearly move the slider unit 142 relative to the rail unit 141. The drive mechanism AC2 may be a power source such as a hydraulic actuator, a pneumatic actuator, an electric actuator, or an electromagnetic solenoid, for example.

[0057] The drive mechanism AC3 is connected to the linear motion unit 150. The drive mechanism AC3 is configured to operate based on an operation signal from the controller Ctr and to linearly move the slider unit 152 relative to the rail unit 151. The drive mechanism AC3 may be a power source such as a hydraulic actuator, a pneumatic actuator, an electric actuator, or an electromagnetic solenoid, for example.

[0058] The drive mechanism AC4 is connected to the linear motion unit 170. The drive mechanism AC4 is configured to operate based on an operation signal from the controller Ctr and to linearly move the rail unit 172 relative to the slider unit 171. The drive mechanism AC4 may be a power source such as a hydraulic actuator, a pneumatic actuator, an electric actuator, or an electromagnetic solenoid, for example.

[0059] According to the imaging section 100 configured as above, the imaging device 190 can move linearly in each of the X direction, Y direction, and Z direction in Fig. 2 in accordance with the operation of the linear motion sections 140, 150, and 170. According to the imaging section 100 configured as above, the imaging device 190 can rotate around the rotation axis Ax2 in accordance with the operation of the rotation section 120.

[0060] 4( a), when the rectifying member 60 is positioned in the raised position by the elevating unit 70, the imaging device 190 may be rotated to move between the cover member 40 and the rectifying member 60 (see arrow Ar1 in FIG. 4( a)). In this case, as illustrated in FIG. 3, the imaging device 190 is in a state in which the illumination unit 194 is positioned above the peripheral portion Wc of the upper surface Wa of the substrate W supported by the plurality of support pins 24. In other words, the imaging device 190 is positioned at a first position where it images the peripheral portion Wc of the upper surface Wa of the substrate W supported by the plurality of support pins 24 from above.

[0061] As illustrated in Figure 4(b), when the rectifying member 60 is positioned in the raised position by the lifting unit 70, the imaging device 190 may be rotated to move out from between the cover member 40 and the rectifying member 60 (see arrow Ar2 in Figure 4(b)). In this case, the imaging device 190 is positioned at a second position that is horizontally outward from the outer periphery of the substrate W supported by the plurality of support pins 24. When the imaging device 190 is at the second position, the rectifying member 60 can be moved up and down between the raised position and the lowered position by the lifting unit 70 without interfering with the imaging device 190.

[0062] [Configuration of Controller] Next, the controller Ctr will be described in detail with reference to Figures 5 and 6. As shown in Figure 5, the controller Ctr has a reading unit M1, a memory unit M2, a processing unit M3, and an instruction unit M4 as functional modules. These functional modules are merely a division of the functions of the controller Ctr into multiple modules for convenience, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being realized by executing a program, but may also be realized by a dedicated electric circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates such a circuit.

[0063] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM records programs for operating each unit of the substrate processing apparatus 1 (e.g., drive mechanisms 22, 32, AC1 to AC4, supply units 51 to 53, lift unit 70, upper supply unit 80, drive unit 90, blower B, etc.). The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. The recording medium RM may be built into the substrate processing apparatus 1 or may be separate from the substrate processing apparatus 1.

[0064] The storage unit M2 is configured to store various data. For example, the storage unit M2 may store a program read from the recording medium RM by the reading unit M1, setting data input by an operator via an external input device (not shown), etc. The storage unit M2 may also store captured images received from the imaging unit 100.

[0065] The processing unit M3 is configured to process various types of data, and may be configured to generate operation signals for operating each unit of the substrate processing apparatus 1 based on the various types of data stored in the storage unit M2, for example.

[0066] The instruction unit M4 is configured to transmit the operation signal generated in the processing unit M3 to each unit of the substrate processing apparatus 1.

[0067] The hardware of the controller Ctr may be configured, for example, by one or more control computers. The controller Ctr may include, for example, a circuit C1 illustrated in FIG. 5 as a hardware configuration. The circuit C1 may be configured by electrical circuit elements. The circuit C1 may include, for example, a processor C2, a memory C3 (storage unit), a storage C4 (storage unit), a driver C5, and an input / output port C6. The processor C2 executes programs in cooperation with at least one of the memory C3 and the storage C4 and inputs and outputs signals via the input / output port C6, thereby configuring the above-mentioned functional modules. The memory C3 and the storage C4 function as the storage unit M2. The driver C5 is a circuit that drives each component of the substrate processing apparatus 1. The input / output port C6 inputs and outputs signals between the driver C5 and each component of the substrate processing apparatus 1.

[0068] The substrate processing apparatus 1 may include a single controller Ctr, or a controller group (controller) composed of multiple controllers Ctr. In the latter case, each of the above-mentioned functional modules may be implemented by a single controller Ctr or by a combination of two or more controllers Ctr. When the controller Ctr is composed of multiple computers (circuits C1), each of the above-mentioned functional modules may be implemented by a single computer (circuit C1) or by a combination of two or more computers (circuits C1). The controller Ctr may include multiple processors C2. In this case, each of the above-mentioned functional modules may be implemented by a single processor C2 or by a combination of two or more processors C2.

[0069] [Presetting] Next, the presetting using a sample substrate W (another substrate) will be described.

[0070] First, a substrate W is carried into the housing 10 by a transport mechanism (not shown). At this time, the controller Ctr controls the drive mechanism 32 to position the shaft member 31 in the raised position. The controller Ctr also controls the lifting unit 70 to position the rectifying member 60 in the raised position. The substrate W carried into the housing 10 through the loading / unloading port 12 is transferred from the transport mechanism to the support pins 33. As a result, the substrate W is placed on the support pins 33 (lifting unit 30) so that the lower surface Wb abuts against the support pins 33.

[0071] Next, the controller Ctr controls the drive mechanism 32 to lower the shaft member 31 to the lowered position. As the shaft member 31 is lowered, the substrate W is transferred from the support pins 33 to the support pins 24. As a result, the substrate W is placed on the support pins 24 (rotating part 20) so that the lower surface Wb of the substrate W abuts against the support pins 24.

[0072] Next, the controller Ctr controls the drive mechanism AC1 to rotate the imaging device 190 so that the imaging device 190 enters between the cover member 40 and the rectifying member 60, thereby positioning the imaging device 190 at the first position. In this state, the controller Ctr controls the drive mechanism 22 and the camera 191 to rotate the substrate W once and cause the imaging device 190 to capture an image of the peripheral portion Wc of the upper surface Wa of the substrate W. This results in an image in which mainly the entire outer periphery of the substrate W and the entire circumference of the inclined surface S1 of the annular member 25 are continuously captured.

[0073] The controller Ctr determines, based on the captured image, whether the separation distance between the outer circumferential edge of the substrate W and the inclined surface S1 of the annular member 25 is within a predetermined range. In making this determination, if a notch is provided in the substrate W, the controller Ctr may calculate the separation distance between the outer circumferential edge of the substrate W and the inclined surface S1 of the annular member 25 based on a corrected image obtained by correcting the captured image, assuming that the notch does not exist (that is, assuming that the substrate W is circular).

[0074] If the controller Ctr determines that the separation distance is within the predetermined range, it determines that the substrate W is supported approximately at the center of the rotating part 20 and therefore does not need to be corrected in position. On the other hand, if the controller Ctr determines that the separation distance is outside the predetermined range, it determines that the substrate W is not supported approximately at the center of the rotating part 20 and therefore needs to be corrected in position.

[0075] The controller Ctr calculates the amount and direction of positional deviation of the substrate W in the horizontal plane as correction values ​​based on the variation in the separation distance in order to correct the position of the substrate W. The controller Ctr corrects parameters for the placement position of the substrate W on the support pins 33 by the transport mechanism by feeding back the calculated correction value to the transport mechanism. This completes the presetting of the placement position of the substrate W to be actually processed. The feedback of the calculated correction value to the transport mechanism may be performed automatically by the controller Ctr or by an input operation by an operator.

[0076] Furthermore, with the rectifying member 60 in the raised position, the controller Ctr controls the drive mechanism AC1 to position the imaging device 190 at the first position. In this state, the controller Ctr controls the camera 191 to start imaging the peripheral portion Wc of the upper surface Wa of the substrate W with the substrate W supported at approximately the center of the rotating part 20.

[0077] Next, the controller Ctr controls the drive mechanism 22 to rotate the rotating shaft 21 at a predetermined rotation speed. At this time, the support plate 23 and the annular member 25 rotate via the rotating shaft 21, and the substrate W placed on the support pins 24 also rotates. The controller Ctr also controls the blower B to form a downward flow that passes through the inner space of the flow straightening member 60 and flows toward the upper surface Wa of the substrate W.

[0078] Next, the controller Ctr controls the upper supply unit 80 to supply the cleaning liquid L3 from the nozzle 82 toward the peripheral portion Wc of the upper surface Wa of the rotating substrate W. The cleaning liquid L3 supplied to the peripheral portion Wc of the upper surface Wa of the substrate W flows along the upper surface Wa toward the outer periphery of the substrate W due to centrifugal force, and is then thrown off outward from the outer periphery of the substrate W. Thereafter, the controller Ctr controls the upper supply unit 80 to stop the supply of the cleaning liquid L3 from the nozzle 82. Since the substrate W continues to rotate, the cleaning liquid L3 is removed from the upper surface Wa of the substrate W over time.

[0079] In the captured image, the contrast is significantly different between an area where the cleaning liquid L3 is present on the upper surface Wa of the substrate W and an area where the cleaning liquid L3 is not present. Therefore, the controller Ctr can calculate the elapsed time ET from the time when the supply of the cleaning liquid L3 from the nozzle 82 is stopped until the cleaning liquid L3 is removed from the upper surface Wa of the substrate W, for example, by processing the captured image in real time. The calculated elapsed time ET may be used to set the timing for stopping the supply of the processing liquid L2 to the lower surface Wb of the substrate W that is actually being processed. This completes the pre-processing for obtaining the elapsed time ET.

[0080] [Substrate Processing Method] Next, a method for cleaning the substrate W in the substrate processing apparatus 1 will be described with reference to FIG.

[0081] First, a substrate W is carried into the housing 10 by a transport mechanism (not shown). At this time, the controller Ctr controls the drive mechanism 32 to position the shaft member 31 in the raised position. The controller Ctr also controls the lifting unit 70 to position the rectifying member 60 in the raised position. The substrate W carried into the housing 10 through the loading / unloading port 12 is transferred from the transport mechanism to the support pins 33. As a result, the substrate W is placed on the support pins 33 (lifting unit 30) so that the lower surface Wb abuts against the support pins 33.

[0082] Next, the controller Ctr controls the drive mechanism 32 to lower the shaft member 31 to the lowered position. As the shaft member 31 is lowered, the substrate W is transferred from the support pins 33 to the support pins 24. As a result, the substrate W is placed on the support pins 24 (rotating unit 20) so that the lower surface Wb of the substrate W abuts against the support pins 24. Note that, since the placement position of the substrate W can be corrected by the above-described pre-processing, the substrate W is supported at approximately the center of the rotating unit 20.

[0083] Next, the controller Ctr controls the lifting unit 70 to lower the rectifying member 60 to the lowered position, whereby the sealing member 63 is sandwiched between the lower surface of the outer periphery of the base portion 61 and the upper surface of the upper wall portion 41, thereby sealing the space V.

[0084] Next, the controller Ctr controls the drive mechanism 22 to rotate the rotating shaft 21 at a predetermined rotation speed. At this time, the support plate 23 and the annular member 25 rotate via the rotating shaft 21, and the substrate W placed on the support pins 24 also rotates. The controller Ctr also controls the blower B to form a downward flow that passes through the inner space of the flow straightening member 60 and flows toward the upper surface Wa of the substrate W.

[0085] Next, the controller Ctr controls the supply unit 50 to supply the processing liquid L1 through the shaft member 31 toward the central portion of the lower surface Wb of the rotating substrate W (see FIGS. 7A and 7B). As a result, the processing liquid L1 flows along the lower surface Wb toward the outer periphery of the substrate W due to centrifugal force, and is then thrown outward from the outer periphery of the substrate W. As a result, the entire lower surface Wb is cleaned with the processing liquid L1. At the same time, the controller Ctr controls the upper supply unit 80 to supply the cleaning liquid L3 through the nozzle 82 toward the peripheral portion Wc of the upper surface Wa of the rotating substrate W (see the same). Therefore, the cleaning liquid L3 prevents the processing liquid L1 supplied to the lower surface Wb of the substrate W from reaching the upper surface Wa of the substrate W by wrapping around the outer periphery of the substrate W.

[0086] Next, after a predetermined time has elapsed, the controller Ctr controls the supply unit 50 to stop the supply of the processing liquid L1 and then supply the processing liquid L2 via the shaft member 31 toward the central portion of the lower surface Wb of the rotating substrate W (see FIGS. 7A and 7C). During this switchover from the processing liquid L1 to the processing liquid L2, the upper supply unit 80 continues to supply the cleaning liquid L3 (see the same). That is, during the period spanning the supply processes of the processing liquids L1 and L2 to the lower surface Wb of the substrate W, the cleaning liquid L3 is supplied toward the peripheral portion We of the upper surface Wa of the substrate W.

[0087] Next, after a predetermined time has elapsed, the controller Ctr controls the upper supply unit 80 to stop the supply of the cleaning liquid L3, while the supply unit 50 continues to supply the treatment liquid L2 (see FIGS. 7A and 7D).

[0088] Next, the controller Ctr controls the supply unit 50 to stop the supply of the treatment liquid L2 after a predetermined time has elapsed since the upper supply unit 80 stopped supplying the cleaning liquid L3 (see FIGS. 7A and 7E). The predetermined time from when the upper supply unit 80 stopped supplying the cleaning liquid L3 to when the supply of the treatment liquid L2 is stopped may be the elapsed time ET obtained in the above-described pre-processing.

[0089] Next, the controller Ctr continues the rotation of the substrate W for a predetermined time, and then controls the drive mechanism 22 to stop the rotation of the rotation shaft 21. This causes the liquid to be shaken off from the substrate W, completing the drying of the substrate W. At this time, the controller Ctr may control the supply unit 53 to supply a drying gas G to the lower surface Wb of the substrate W. In this case, the substrate W is also dried by the drying gas G.

[0090] Next, the controller Ctr controls the lifting unit 70 to raise the rectifying member 60 to the raised position. Next, the controller Ctr controls the drive mechanism 32 to raise the shaft member 31 to the raised position. In the process of raising the shaft member 31, the substrate W is transferred from the support pins 24 to the support pins 33, and the substrate W also rises. As a result, the substrate W is placed on the support pins 33 so that the lower surface Wb abuts against the support pins 33.

[0091] Thereafter, a transport mechanism (not shown) receives the substrate W from the support pins 33 and transports the substrate W out of the housing 10. In this way, the cleaning process for the lower surface Wb of the substrate W is completed.

[0092] [Operation] As shown in FIG. 8A, assume that the processing liquid L2 is supplied from the shaft member 31 to the lower surface Wb of the rotating substrate W, while the cleaning liquid L3 is supplied from the nozzle 82 to the peripheral edge Wc of the upper surface Wa of the rotating substrate W. After the state shown in FIG. 8A, the supply of the processing liquid L2 from the shaft member 31 to the lower surface Wb of the rotating substrate W is stopped, and the processing liquid L1 is supplied from the shaft member 31 (see FIG. 8B). At the same time, the supply of the cleaning liquid L3 from the nozzle 82 to the peripheral edge Wc of the upper surface Wa of the rotating substrate W is stopped (see FIG. 8C). In this case, the processing liquid L1 mixes with the cleaning liquid L3 remaining on the peripheral edge Wc of the upper surface Wa of the substrate W (see FIG. 8C). As a result, the processing liquid L1 may flow around the peripheral edge Wc, potentially causing foreign matter to adhere to the peripheral edge Wc.

[0093] On the other hand, as illustrated in Fig. 8(d), assume a state in which the processing liquid L1 is supplied from the shaft member 31 to the underside Wb of the rotating substrate W, while the cleaning liquid L3 is supplied from the nozzle 82 to the peripheral edge Wc of the upper surface Wa of the rotating substrate W. After the state illustrated in Fig. 8(d), the supply of the processing liquid L1 from the shaft member 31 to the underside Wb of the rotating substrate W is stopped, and the processing liquid L2 is supplied from the shaft member 31 (see Fig. 8(e)). At the same time, the supply of the cleaning liquid L3 from the nozzle 82 to the peripheral edge Wc of the upper surface Wa of the rotating substrate W is stopped (see Fig. 8(e)). In this case, the processing liquid L1 is pushed radially outward on the underside Wb of the substrate W by the processing liquid L2, and the processing liquid L1 mixes with the cleaning liquid L3 remaining on the peripheral edge Wc of the upper surface Wa of the substrate W (see Fig. 8(f)). Therefore, the processing liquid L1 may flow around the peripheral edge Wc, which may lead to the adhesion of foreign matter to the peripheral edge Wc.

[0094] However, according to the above example, the cleaning liquid L3 continues to be supplied to the upper surface Wa of the substrate W even after the supply of the processing liquid L1 to the lower surface Wb of the substrate W is stopped. Therefore, even if the processing liquid L1 that was being supplied to the lower surface Wb of the substrate W flows around the edge of the substrate W and reaches the upper surface Wa of the substrate W while mixing with the cleaning liquid L3 being supplied to the upper surface Wa of the substrate W just before the supply of the processing liquid L1 is stopped, the processing liquid L1 is removed from the upper surface Wa of the substrate W by the cleaning liquid L3 that is continuously supplied to the upper surface Wa of the substrate W. Therefore, the processing liquid L1 that flows around to the peripheral portion We of the upper surface Wa of the substrate W is less likely to remain on the peripheral portion We. As a result, it is possible to suppress the adhesion of foreign matter (e.g., particles, chemical residues, etc.) to the peripheral portion We.

[0095] Incidentally, foreign matter is particularly likely to be generated at the peripheral edge Wc of the upper surface Wa of the substrate W due to the processing liquid L1 flowing around from the lower surface Wb of the substrate W. However, according to the above example, the cleaning liquid L3 can be supplied toward the peripheral edge Wc, where foreign matter is particularly likely to be generated. As a result, the processing liquid L1 flowing around from the lower surface Wb of the substrate W is more effectively removed from the upper surface Wa of the substrate W. This makes it possible to further suppress the adhesion of foreign matter to the peripheral edge Wc. Furthermore, by supplying the cleaning liquid L3 toward the peripheral edge Wc of the upper surface Wa of the substrate W, the consumption of the cleaning liquid L3 is reduced compared to when the cleaning liquid L3 is supplied toward the center of the upper surface Wa of the substrate W. This makes it possible to reduce the processing cost of the substrate W.

[0096] According to the above example, the supply of the cleaning liquid L3 to the upper surface Wa of the substrate W is stopped before the supply of the processing liquid L2 to the lower surface Wb of the substrate W is stopped. Therefore, the processing liquid L1 on the upper surface Wa of the substrate W is removed from the upper surface Wa before the processing liquid L2 flowing on the lower surface Wb is removed from the lower surface Wb. Therefore, the processing liquid L2 supplied to the lower surface Wb of the substrate W flows around the edge of the substrate W and is attracted to the cleaning liquid L3 remaining on the upper surface Wa of the substrate W, thereby preventing the processing liquid L2 from reaching the upper surface Wa of the substrate W. Therefore, even if a small amount of the processing liquid L1 remains on the lower surface Wb of the substrate W and the processing liquid L1 mixes with the processing liquid L2 flowing on the lower surface Wb of the substrate W, the processing liquid L2 mixed with the processing liquid L1 is less likely to reach the upper surface Wa of the substrate W. As a result, it is possible to further prevent foreign matter from adhering to the peripheral edge portion Wc of the upper surface Wa of the substrate W.

[0097] According to the above example, the supply of the processing liquid L2 to the lower surface Wb of the substrate W can be stopped after the cleaning liquid L3 has been removed from the peripheral edge Wc (after the remaining amount of the cleaning liquid L3 in the peripheral edge Wc becomes zero). Therefore, most of the cleaning liquid L3 on the upper surface Wa of the substrate W is removed from the upper surface Wa before the processing liquid L2 flowing on the lower surface Wb is removed from the lower surface Wb. Therefore, even if a small amount of the processing liquid L1 remains on the lower surface Wb of the substrate W, even if the processing liquid L1 mixes with the processing liquid L2 flowing on the lower surface Wb of the substrate W, the processing liquid L2 mixed with the processing liquid L1 is extremely unlikely to reach the upper surface Wa of the substrate W. As a result, it is possible to further suppress adhesion of foreign matter to the peripheral edge Wc of the upper surface Wa of the substrate W.

[0098] According to the above example, the supply of the treatment liquid L2 by the supply unit 50 can be stopped after a predetermined time has elapsed since the supply of the cleaning liquid L3 by the upper supply unit 80 was stopped. In this case, by previously acquiring the elapsed time ET as the predetermined time, it becomes possible to very easily set the timing for stopping the supply of the treatment liquid L2 by the supply unit 50.

[0099] According to the above example, the elapsed time ET can be obtained in advance using the sample substrate W. Therefore, by using the elapsed time ET obtained in advance as the timing for stopping the supply of the treatment liquid L2 by the supply unit 50, it becomes possible to very easily set the timing for stopping the supply.

[0100] According to the above example, the imaging unit 100 can image, from above, the peripheral portion Wc of the upper surface Wa of the substrate W supported by the plurality of support pins 24. In this case, the imaging unit 100 can more accurately grasp the state of the cleaning liquid L3 at the peripheral portion Wc of the upper surface Wa of the substrate W. This allows the supply unit 50 to stop supplying the processing liquid L2 at an even more accurate timing.

[0101] According to the above example, the imaging device 190 can move between a first position where it images the upper surface Wa of the substrate W supported by the plurality of support pins 24 from above the peripheral portion Wc, and a second position that is located horizontally outward from the outer peripheral edge of the substrate W supported by the plurality of support pins 24. In this case, since the imaging device 190 retreats to the second position while imaging by the imaging section 100 is not being performed, it is possible to suppress interference between the imaging device 190 and other equipment, etc.

[0102] According to the above example, the rotation of the substrate W continues for a predetermined time after the supply of the processing liquid L2 by the supply unit 50 is stopped. In this case, the rotation of the substrate W causes the substrate W to be dried.

[0103] According to the above example, after the supply of the processing liquid L2 by the supply unit 50 is stopped, the drying gas G can be supplied to the lower surface Wb of the substrate W. In this case, the drying gas G dries the substrate W.

[0104] [Modifications] The disclosure in this specification should be considered to be illustrative in all respects and not restrictive. Various omissions, substitutions, modifications, etc. may be made to the above examples without departing from the scope and spirit of the claims.

[0105] (1) The upper supply unit 80 may supply the cleaning liquid L3 not to the peripheral edge Wc of the upper surface Wa of the substrate W, but to a region of the upper surface Wa of the substrate W other than the peripheral edge Wc (for example, the central portion).

[0106] (2) In the above example, the controller Ctr calculates the elapsed time ET from when the supply of the cleaning liquid L3 from the nozzle 82 stops until the cleaning liquid L3 is removed from the upper surface Wa of the substrate W, for example, by processing the captured image in real time. However, the controller Ctr may calculate the elapsed time ET as the time from when the supply of the cleaning liquid L3 from the nozzle 82 stops until the cleaning liquid L3 moves outward from the outer periphery of the substrate W to a predetermined position radially inward (until the remaining amount of the cleaning liquid L3 at the peripheral portion We of the upper surface Wa of the substrate W becomes equal to or less than a predetermined amount). Note that the time from when the supply of the cleaning liquid L3 from the nozzle 82 stops until the remaining amount of the cleaning liquid L3 at the peripheral portion We of the upper surface Wa of the substrate W becomes equal to or less than a predetermined amount may be determined based on the captured image captured by the imaging unit 100. In this case, the supply unit 50 can stop the supply of the processing liquid L2 at a more accurate timing.

[0107] (3) After the supply of the processing liquid L2 by the supply unit 50 has stopped, the substrate W may be dried by supplying the drying gas G to the lower surface Wb of the substrate W without rotating the substrate W.

[0108] (4) The imaging unit 100 may be configured to be detachable within the housing 10. In this case, when the imaging unit 100 is not capturing images, the imaging device 190 is retracted, for example, to the outside of the housing 10, thereby making it possible to suppress interference between the imaging device 190 and other devices.

[0109] (5) The supply unit 50 may be configured to supply the processing liquid L1 multiple times to the lower surface Wb of the substrate W. Specifically, the controller Ctr controls the supply unit 50 to supply the processing liquid L1 through the shaft member 31 toward the central portion of the lower surface Wb of the rotating substrate W (see FIGS. 9A and 9B). At the same time, the controller Ctr controls the upper supply unit 80 to supply the cleaning liquid L3 through the nozzle 82 toward the peripheral portion Wc of the upper surface Wa of the rotating substrate W (see the same).

[0110] Next, after a predetermined time has elapsed, the controller Ctr controls the supply unit 50 to stop the supply of the processing liquid L1, and then to supply the processing liquid L2 through the shaft member 31 toward the central portion of the underside Wb of the rotating substrate W (see FIGS. 9A and 9C). During this switchover from the processing liquid L1 to the processing liquid L2, the upper supply unit 80 continues to supply the cleaning liquid L3 (see the same).

[0111] Next, after a predetermined time has elapsed, the controller Ctr controls the supply unit 50 to stop the supply of the processing liquid L2, and then causes the processing liquid L1 to be supplied via the shaft member 31 toward the central portion of the underside Wb of the rotating substrate W (see FIGS. 9A and 9D). During this switchover from the processing liquid L1 to the processing liquid L2, the upper supply unit 80 continues to supply the cleaning liquid L3 (see the same).

[0112] Next, after a predetermined time has elapsed, the controller Ctr controls the supply unit 50 to stop the supply of the processing liquid L1 and then supply the processing liquid L2 through the shaft member 31 toward the central portion of the underside Wb of the rotating substrate W (see FIGS. 9A and 9E). During this switchover from the processing liquid L1 to the processing liquid L2, the upper supply unit 80 continues to supply the cleaning liquid L3 (see the same).

[0113] Next, after a predetermined time has elapsed, the controller Ctr controls the upper supply unit 80 to stop the supply of the cleaning liquid L3, while the supply unit 50 continues to supply the treatment liquid L2 (see FIGS. 9A and 9F).

[0114] Next, the controller Ctr controls the supply unit 50 to stop the supply of the treatment liquid L2 after a predetermined time has elapsed since the upper supply unit 80 stopped supplying the cleaning liquid L3 (see FIGS. 9A and 9G). The predetermined time from when the upper supply unit 80 stopped supplying the cleaning liquid L3 to when the supply of the treatment liquid L2 is stopped may be the elapsed time ET obtained in the above-described pre-processing.

[0115] Next, the controller Ctr continues to rotate the substrate W for a predetermined time, and then controls the drive mechanism 22 to stop the rotation of the rotation shaft 21. This causes the liquid to be shaken off from the substrate W, completing the drying of the substrate W.

[0116] When the processing liquid L1 is supplied to the lower surface Wb of the substrate W multiple times, the types of the processing liquids L1 supplied to the lower surface Wb may be the same or different. When the types of the processing liquids L1 supplied to the lower surface Wb are different, the supply order is not particularly limited.

[0117] [Other Examples] Example 1. An example of a substrate processing apparatus includes a support configured to support a substrate, a supply unit configured to supply a cleaning liquid toward an upper surface of the substrate supported by the support unit, another supply unit configured to supply a processing liquid toward an underside of the substrate supported by the support unit, and a controller. The controller is configured to perform the following operations: a first process in which the other supply unit supplies a chemical liquid, which is one of the processing liquids, toward the underside of the substrate supported by the support unit at least once; a second process in which the other supply unit supplies a cleaning liquid, which is one of the processing liquids, toward the underside of the substrate supported by the support unit after the first process; and a third process in which the supply unit supplies the cleaning liquid toward the upper surface of the substrate supported by the support unit at least during a period spanning the first process and the second process. In this case, the cleaning liquid continues to be supplied to the upper surface of the substrate even after the supply of the chemical liquid to the underside of the substrate is stopped. Therefore, even if the chemical liquid supplied to the underside of the substrate flows around the edge of the substrate and mixes with the cleaning liquid supplied to the upper surface of the substrate just before the supply of the chemical liquid is stopped, the chemical liquid is removed from the upper surface of the substrate by the cleaning liquid that continues to be supplied to the upper surface of the substrate. Therefore, the chemical liquid that flows around to the peripheral portion of the upper surface of the substrate is less likely to remain on the peripheral portion. As a result, it is possible to suppress the adhesion of foreign matter (e.g., particles, chemical liquid residue, etc.) to the peripheral portion.

[0118] Example 2. In the apparatus of Example 1, the supply unit may be configured to supply the cleaning liquid toward the peripheral portion of the upper surface of the substrate supported by the support unit. However, foreign matter is particularly likely to be generated at the peripheral portion of the upper surface of the substrate due to the chemical liquid flowing around from the underside of the substrate. Therefore, by supplying the cleaning liquid toward the peripheral portion where foreign matter is particularly likely to be generated, as in Example 2, the chemical liquid flowing around from the underside of the substrate is more effectively removed from the upper surface of the substrate. Therefore, it is possible to further suppress the adhesion of foreign matter to the peripheral portion. Furthermore, by supplying the cleaning liquid toward the peripheral portion of the upper surface of the substrate, the amount of cleaning liquid consumed is reduced compared to when the cleaning liquid is supplied toward the center of the upper surface of the substrate. Therefore, it is possible to reduce substrate processing costs.

[0119] Example 3. In the apparatus of Example 1 or Example 2, the second process may include stopping the supply of another cleaning liquid after stopping the supply of the cleaning liquid in the third process. In this case, the supply of the cleaning liquid to the upper surface of the substrate is stopped before the supply of the other cleaning liquid to the lower surface of the substrate is stopped. Therefore, the cleaning liquid on the upper surface of the substrate is removed from the upper surface before the other cleaning liquid flowing on the lower surface is removed from the lower surface. Therefore, the other cleaning liquid supplied to the lower surface of the substrate is prevented from reaching the upper surface of the substrate by wrapping around the edge of the substrate and being attracted to the cleaning liquid remaining on the upper surface of the substrate. Therefore, even if a small amount of chemical liquid remains on the lower surface of the substrate, even if the chemical liquid mixes with the other cleaning liquid flowing on the lower surface of the substrate, the other cleaning liquid mixed with the chemical liquid is less likely to reach the upper surface of the substrate. As a result, it is possible to further suppress the adhesion of foreign matter to the peripheral portion of the upper surface of the substrate.

[0120] Example 4. In the apparatus of Example 3, the control unit may further be configured to perform a fourth process in which the supply of the other cleaning liquid in the second process is stopped after the remaining amount of cleaning liquid at the peripheral portion of the upper surface of the substrate falls below a predetermined amount. However, there is a slight time lag between when the supply of cleaning liquid from the supply unit to the upper surface of the substrate is stopped and when the remaining amount of cleaning liquid at the upper surface of the substrate falls below a predetermined amount (e.g., when the remaining amount of cleaning liquid is zero). Therefore, as in Example 4, by stopping the supply of the other cleaning liquid to the lower surface of the substrate after the remaining amount of cleaning liquid at the peripheral portion falls below a predetermined amount (e.g., after the remaining amount is zero), most of the cleaning liquid on the upper surface of the substrate is removed from the upper surface before the other cleaning liquid flowing along the lower surface is removed from the lower surface. Therefore, even if a small amount of chemical liquid remains on the lower surface of the substrate, even if the other cleaning liquid flows along the lower surface of the substrate and mixes with the other cleaning liquid, the other cleaning liquid mixed with the chemical liquid is unlikely to reach the upper surface of the substrate. As a result, adhesion of foreign matter to the peripheral portion of the upper surface of the substrate can be further suppressed.

[0121] Example 5. In the apparatus of Example 4, the fourth process may include stopping the supply of the other cleaning liquid in the second process when a predetermined time has elapsed since the end of the first process. In this case, for example, by acquiring in advance the time from when the supply of the cleaning liquid from the supply unit to the upper surface of the substrate is stopped to when the remaining amount of the cleaning liquid at the peripheral portion of the upper surface of the substrate becomes equal to or less than a predetermined amount, it becomes possible to very easily set the timing for stopping the supply of the other cleaning liquid in the second process.

[0122] Example 6. The apparatus of Example 4 may further include an imaging unit configured to capture an image of a peripheral portion of an upper surface of the substrate supported by the support unit, and the fourth process may include determining, based on the image captured by the imaging unit, whether the remaining amount of cleaning liquid at the peripheral portion of the upper surface of the substrate has reached a predetermined level or less. In this case, the determination of whether the remaining amount of cleaning liquid at the peripheral portion of the upper surface of the substrate has reached a predetermined level or less is performed in real time based on the image captured by the imaging unit. This allows for more accurate timing of stopping the supply of another cleaning liquid in the second process.

[0123] Example 7. The apparatus of Example 4 further includes an imaging unit configured to capture an image of a peripheral portion of an upper surface of the other substrate supported by the support unit, and the control unit is configured to further execute a fifth process of acquiring, based on the image captured by the imaging unit, an elapsed time from when the supply unit stops supplying the cleaning liquid to the upper surface of the other substrate until the remaining amount of cleaning liquid at the peripheral portion of the upper surface of the other substrate becomes equal to or less than a predetermined amount. The fourth process may include stopping the supply of the other cleaning liquid in the second process when the elapsed time acquired by the fifth process has elapsed since the first process was completed. In this case, the elapsed time is acquired in advance using the other substrate. Therefore, by stopping the supply of the other cleaning liquid in the second process when the elapsed time has elapsed, it is possible to very easily set the timing for stopping the supply of the other cleaning liquid in the second process.

[0124] Example 8. In the apparatus of Example 6, the imaging unit may be configured to image a peripheral portion of the upper surface of the substrate supported by the support unit from above the peripheral portion. In this case, the imaging unit can more accurately grasp the state of the cleaning liquid at the peripheral portion of the upper surface of the substrate. Therefore, it is possible to stop the supply of another cleaning liquid in the second process at a more accurate timing.

[0125] Example 9. In the apparatus of Example 6 or Example 8, the imaging unit may include an imaging device and a drive unit configured to move the imaging device between a first position where an image of a peripheral portion of the upper surface of the substrate supported by the support unit is captured from above the peripheral portion, and a second position that is positioned horizontally outward from the outer peripheral edge of the substrate supported by the support unit. In this case, the imaging device is retracted to the second position while imaging by the imaging unit is not being performed, thereby making it possible to suppress interference between the imaging device and other equipment, etc.

[0126] Example 10. In the device of any of Examples 6 to 9, the imaging unit may be configured to be detachable within a housing that houses the support unit. In this case, when imaging by the imaging unit is not being performed, the imaging device is retracted, for example, to the outside of the housing, making it possible to suppress interference between the imaging device and other devices, etc.

[0127] Example 11 The apparatus of any of Examples 1 to 10 may further include a rotation unit configured to rotate the substrate supported on the support unit, and the controller may be configured to further perform a sixth process of drying the substrate by controlling the rotation unit after stopping the supply of the other cleaning liquid toward the lower surface of the substrate in the second process and after stopping the supply of the cleaning liquid toward the upper surface of the substrate in the third process.

[0128] Example 12 The apparatus of any of Examples 1 to 11 may further include a gas supply unit configured to blow a gas toward the substrate supported on the support unit, and the controller may be configured to control the gas supply unit to further perform a seventh process of drying the substrate by blowing a gas toward the substrate after stopping the supply of the other cleaning liquid toward the bottom surface of the substrate in the second process and after stopping the supply of the cleaning liquid toward the top surface of the substrate in the third process.

[0129] Example 13 In the apparatus of any of Examples 1 to 12, the first process may include controlling another supply unit to supply a first chemical liquid that is one of the processing liquids toward the underside of the substrate supported by the support unit, and then supplying a second chemical liquid that is also one of the processing liquids.

[0130] Example 14. An example of a substrate processing method includes a first step of supplying a chemical liquid, which is one of the processing liquids, at least once toward the underside of the substrate supported on a support, a second step of supplying a first cleaning liquid, which is one of the processing liquids, toward the underside of the substrate supported on the support after the first step, and a third step of supplying a second cleaning liquid toward the upper surface of the substrate supported on the support during at least a period spanning the first step and the second step. In this case, the same effects as those of the apparatus of Example 1 can be obtained.

[0131] Example 15 In the method of Example 14, the third step may include supplying the second cleaning liquid toward a peripheral portion of the upper surface of the substrate supported by the support. In this case, the same effects as those of the apparatus of Example 2 can be obtained.

[0132] Example 16 In the method of Example 14 or Example 15, the second step may include stopping the supply of the first cleaning liquid after the supply of the second cleaning liquid in the third step has stopped.

[0133] Example 17 The method of Example 16 may further include a fourth step of stopping the supply of the first cleaning liquid in the second step after the remaining amount of the second cleaning liquid at the peripheral portion of the upper surface of the substrate becomes equal to or less than a predetermined amount. In this case, the same effects as those of the apparatus of Example 4 can be obtained.

[0134] Example 18 In the method of Example 17, the fourth step may include stopping the supply of the first cleaning solution in the second step when a predetermined time has elapsed since the end of the first step. In this case, the same effects as those of the device of Example 5 can be obtained.

[0135] Example 19. In the method of Example 17, the fourth step may include capturing an image of a peripheral portion of an upper surface of the substrate supported by the support with an imaging unit, and determining whether or not the remaining amount of the second cleaning liquid at the peripheral portion of the upper surface of the substrate has become equal to or less than a predetermined amount based on the captured image captured by the imaging unit. In this case, the same effects as those of the apparatus of Example 6 can be obtained.

[0136] Example 20. The method of Example 17 may further include a fifth step of capturing an image of a peripheral portion of an upper surface of another substrate supported by a support using an imaging unit; a sixth step of supplying a second cleaning liquid toward the upper surface of the another substrate during the imaging in the fifth step; and a seventh step of acquiring, based on the captured image captured in the fifth step, an elapsed time from when the supply of the second cleaning liquid to the another substrate is stopped until the remaining amount of the second cleaning liquid in the peripheral portion of the upper surface of the another substrate becomes equal to or less than a predetermined amount, and the fourth step may include stopping the supply of the first cleaning liquid in the second step when the elapsed time acquired in the seventh step has elapsed since the end of the first step. In this case, the same effects as those of the apparatus of Example 7 can be obtained.

[0137] 1...substrate processing apparatus, 10...housing, 20...rotating section, 23...support plate (support section), 24...support pin (support section), 50...supply section, 51, 52...supply section (another supply section), 53...supply section (gas supply section), 80...upper supply section (supply section), 100...imaging section, 120...rotating section (drive section), 140, 150, 170...linear motion section (drive section), 190...imaging device, AC1 to AC4...drive mechanism (drive section), Ctr...controller (control section), ET...elapsed time, W...substrate, Wa...upper surface, Wb...lower surface, Wc...periphery, L1...processing liquid (chemical liquid), L2...processing liquid (another cleaning liquid, first cleaning liquid), L3...cleaning liquid (second cleaning liquid).

Claims

1. A substrate processing apparatus comprising: a support section configured to support a substrate; a supply section configured to supply a cleaning liquid toward an upper surface of the substrate supported by the support section; another supply section configured to supply a processing liquid toward an underside of the substrate supported by the support section; and a control section, wherein the control section is configured to perform the following processes: a first process of controlling the other supply section to supply a chemical liquid that is one of the processing liquids toward the underside of the substrate supported by the support section at least once; a second process of controlling the other supply section after the first process to supply another cleaning liquid that is one of the processing liquids toward the underside of the substrate supported by the support section; and a third process of controlling the supply section to supply the cleaning liquid toward the upper surface of the substrate supported by the support section at least during a period spanning the first process and the second process.

2. The apparatus according to claim 1, wherein the supply unit is configured to supply the cleaning liquid toward a peripheral portion of the upper surface of the substrate supported by the support unit.

3. The apparatus of claim 1, wherein the second process includes stopping the supply of the other cleaning liquid after the supply of the cleaning liquid in the third process has stopped.

4. The apparatus of claim 3, wherein the control unit is further configured to perform a fourth process of stopping the supply of the other cleaning liquid in the second process after the remaining amount of the cleaning liquid at the peripheral portion of the upper surface of the substrate becomes equal to or less than a predetermined amount.

5. The apparatus according to claim 4, wherein the fourth process includes stopping the supply of the other cleaning liquid in the second process when a predetermined time has elapsed since the first process was completed.

6. The apparatus according to claim 4, further comprising an imaging unit configured to capture an image of the peripheral portion of the upper surface of the substrate supported by the support unit, wherein the fourth process includes determining whether or not the remaining amount of the cleaning liquid on the peripheral portion of the upper surface of the substrate has fallen below a predetermined amount based on the image captured by the imaging unit.

7. The apparatus of claim 4, further comprising an imaging unit configured to image a peripheral portion of an upper surface of another substrate supported by the support unit, wherein the control unit is configured to further execute a fifth process of acquiring, based on the image captured by the imaging unit, the elapsed time from when the supply unit stops supplying the cleaning liquid to the upper surface of the other substrate until the remaining amount of the cleaning liquid on the peripheral portion of the upper surface of the other substrate becomes equal to or less than a predetermined amount, and wherein the fourth process includes stopping the supply of the other cleaning liquid in the second process when the elapsed time acquired by the fifth process has elapsed since the first process was completed.

8. The apparatus according to claim 6, wherein the imaging section is configured to image the peripheral portion of the upper surface of the substrate supported by the support section from above the peripheral portion.

9. The apparatus described in claim 6, wherein the imaging section includes an imaging device and a drive section configured to move the imaging device between a first position at which an image of the peripheral portion of the upper surface of the substrate supported by the support section is captured from above the peripheral portion, and a second position located horizontally outward from the outer peripheral edge of the substrate supported by the support section.

10. The device according to any one of claims 6 to 9, wherein the imaging unit is configured to be detachable within a housing that houses the support unit.

11. The apparatus of claim 1, further comprising a rotation unit configured to rotate the substrate supported on the support unit, wherein the control unit is configured to further perform a sixth process of drying the substrate by controlling the rotation unit after stopping the supply of the other cleaning liquid toward the bottom surface of the substrate in the second process and after stopping the supply of the cleaning liquid toward the top surface of the substrate in the third process.

12. The apparatus of claim 1, further comprising a gas supply unit configured to spray a gas onto the substrate supported on the support unit, wherein the control unit is configured to control the gas supply unit to further perform a seventh process of drying the substrate by spraying a gas onto the substrate after stopping the supply of the other cleaning liquid toward the underside of the substrate in the second process and after stopping the supply of the cleaning liquid toward the upper surface of the substrate in the third process.

13. The apparatus of claim 1, wherein the first process includes controlling the other supply unit to supply a first chemical liquid, which is one of the processing liquids, toward the underside of the substrate supported by the support unit, and then supplying a second chemical liquid, which is one of the processing liquids.

14. A substrate processing method comprising: a first step of supplying a chemical liquid, which is one of processing liquids, at least once toward the underside of a substrate supported on a support; a second step of supplying a first cleaning liquid, which is one of the processing liquids, toward the underside of the substrate supported on the support after the first step; and a third step of supplying a second cleaning liquid toward the upper surface of the substrate supported on the support during at least a period spanning the first step and the second step.

15. The method according to claim 14, wherein the third step includes supplying the second cleaning liquid toward a peripheral portion of the upper surface of the substrate supported by the support.

16. The method of claim 14, wherein the second step includes stopping the supply of the first cleaning liquid after the supply of the second cleaning liquid in the third step has stopped.

17. The method according to claim 16, further comprising a fourth step of stopping the supply of the first cleaning liquid in the second step after the remaining amount of the second cleaning liquid at the peripheral portion of the upper surface of the substrate becomes equal to or less than a predetermined amount.

18. The method according to claim 17, wherein the fourth step includes stopping the supply of the first cleaning liquid in the second step when a predetermined time has elapsed since the end of the first step.

19. The method according to claim 17, wherein the fourth step includes: capturing an image of the peripheral portion of the upper surface of the substrate supported by the support portion using an imaging unit; and determining, based on the image captured by the imaging unit, whether the remaining amount of the second cleaning liquid on the peripheral portion of the upper surface of the substrate has fallen below a predetermined amount.

20. The method of claim 17, further comprising: a fifth step of imaging the peripheral portion of the upper surface of another substrate supported on the support portion using an imaging unit; a sixth step of supplying the second cleaning liquid toward the upper surface of the other substrate while imaging is being performed in the fifth step; and a seventh step of acquiring, based on the image captured in the fifth step, the elapsed time from when the supply of the second cleaning liquid to the other substrate is stopped until the remaining amount of the second cleaning liquid on the peripheral portion of the upper surface of the other substrate becomes a predetermined amount or less, wherein the fourth step comprises stopping the supply of the first cleaning liquid in the second step when the elapsed time acquired in the seventh step has elapsed since the first step was completed.

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