Camera module, and electronic device including camera module

Abstract

A camera module according to various embodiments disclosed in the present document may comprise: a lens assembly including one or more lenses that are substantially aligned along an optical axis; an image sensor configured to sense light obtained via the lens assembly; an auto focus (AF) housing that includes a first sidewall, accommodates at least a portion of the lens assembly, and moves substantially along the optical axis; an upper housing that surrounds at least a portion of the AF housing and includes a second sidewall that faces the first sidewall and is spaced apart from the first sidewall; a lower housing that surrounds at least a portion of the image sensor, includes a third sidewall positioned between the first sidewall and the second sidewall, and is coupled to the upper housing; and an elastic member disposed between the third sidewall of the lower housing and the first sidewall of the AF housing.

Description

Camera module and electronic device including camera module

[0001] Various embodiments disclosed in this document relate to a camera module and an electronic device including a camera module.

[0002] Various electronic devices, such as smart phones, tablet PCs, portable multimedia players (PMPs), personal digital assistants (PDAs), laptop personal computers, and wearable devices such as wrist watches and head-mounted displays (HMDs), contain cameras and can capture images using cameras.

[0003] As the number of users using electronic devices to take photos and videos increases, the performance of cameras embedded in these devices is also improving. For example, when taking images using a camera embedded in an electronic device, adjusting the focus of the subject or compensating for any camera shake (e.g., hand shake) that may occur during the capture may be necessary to obtain a clear image.

[0004] A camera module used in an electronic device may include an auto focus (AF) function that automatically adjusts the focus of a lens on a subject and / or an optical image stabilizer (OIS) function that compensates for shaking that occurs in the camera module when photographing a subject. The AF function and the optical image stabilizer function of the camera module may be driven based on an electromagnetic force using a magnet and a coil.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] In one embodiment of the present disclosure, a camera module may include a lens assembly including one or more lenses substantially aligned along an optical axis, an image sensor configured to detect light acquired through the lens assembly, an auto focus (AF) housing having a first sidewall and at least partially accommodating the lens assembly and moving substantially along the optical axis, an upper housing including a second sidewall at least partially surrounding the AF housing and facing the first sidewall and spaced apart from the first sidewall, a lower housing including a third sidewall at least partially surrounding the image sensor and positioned between the first sidewall and the second sidewall, and coupled to the upper housing, and an elastic member disposed between the third sidewall of the lower housing and the first sidewall of the AF housing.

[0007] In one embodiment of the present disclosure, an electronic device including a camera module may include a lens assembly including one or more lenses substantially aligned along an optical axis, an image sensor configured to detect light acquired through the lens assembly, an auto focus (AF) housing having a first sidewall and at least partially accommodating the lens assembly and moving substantially along the optical axis, an upper housing including a second sidewall at least partially surrounding the AF housing and facing the first sidewall and spaced apart from the first sidewall, a lower housing coupled to the upper housing, the lower housing including a third sidewall at least partially surrounding the image sensor and positioned between the first sidewall and the second sidewall, and an elastic member disposed between the third sidewall of the lower housing and the first sidewall of the AF housing.

[0008] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0010] FIG. 2 is a block diagram illustrating a camera module according to various embodiments.

[0011] FIG. 3A is a perspective view of a camera module according to one embodiment of the present disclosure.

[0012] FIG. 3b is a front view of the lens assembly of a camera module according to one embodiment of the present disclosure.

[0013] FIG. 4 is a perspective view of the combined camera modules illustrated in FIGS. 3a and 3b according to one embodiment of the present disclosure.

[0014] Figure 5a is a cross-sectional view taken along line 5a-5a of Figure 3b.

[0015] Figure 5b is a drawing explaining the arrangement relationship of the AF housing, elastic member, and lower housing of Figure 5a.

[0016] FIG. 6 is a perspective view of a camera module according to one embodiment of the present disclosure, with the upper housing, shield can, and lens assembly located on the upper portion of the AF housing removed.

[0017] FIGS. 7A, 7B, and 7C are drawings illustrating a coupling relationship between an AF housing and a lower housing and a position where an elastic member is arranged, according to one embodiment of the present disclosure.

[0018] FIGS. 8A, 8B, and 8C are drawings illustrating a coupling relationship between an AF housing and a lower housing and a position where an elastic member is arranged according to one embodiment of the present disclosure.

[0019] FIGS. 9A and 9B are drawings illustrating the positional relationship of a spring member and an elastic member arranged in a lower housing according to one embodiment of the present disclosure.

[0020] FIGS. 10A, 10B, 10C and 10D are drawings illustrating the deformability of the arrangement area of ​​the elastic member according to the shape of the spring member, according to one embodiment of the present disclosure.

[0021] FIGS. 11A and 11B are drawings illustrating a camera module including an AF magnet and an AF coil having a different arrangement relationship from the AF magnet and AF coil of FIG. 4.

[0022] FIGS. 12A and 12B are drawings illustrating a camera module including an elastic member positioned at a different location from the elastic member illustrated in FIG. 6 within the camera module, according to one embodiment of the present disclosure.

[0023] FIG. 13a is a graph showing the vibration applied to the AF housing over time when an external impact is applied to a camera module that does not include an elastic member in a comparative example.

[0024] FIG. 13b is a diagram showing a graph showing vibration applied to an AF housing over time when an external impact is applied to a camera module including an elastic member of the present disclosure.

[0025] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0026] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0027] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0028] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0033] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0034] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0038] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0040] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0043] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0044] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0045] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] FIG. 2 is a block diagram illustrating a camera module (180) according to various embodiments. Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0048] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0049] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows at least a portion of the image shake caused by the movement to be captured to be compensated for. According to one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). The memory (250) can at least temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to a shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) may be configured as at least a portion of the memory (130), or as a separate memory that operates independently therefrom.

[0050] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) for at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0051] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties (e.g., angle of view) or functions. In this case, for example, the plurality of camera modules (180) may include at least one of a wide-angle camera, a telephoto camera, or an IR Camera (time of flight camera, structured light camera). For example, a plurality of camera modules including lenses having different angles of view are configured, and the electronic device may be controlled to change the angle of view variably according to a user's selection. According to one embodiment, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0052] FIG. 3A is a perspective view of a camera module according to one embodiment of the present disclosure. FIG. 3B is a front view of a lens assembly of a camera module according to one embodiment of the present disclosure. FIG. 4 is a combined perspective view of the camera modules illustrated in FIGS. 3A and 3B according to one embodiment of the present disclosure.

[0053] According to one embodiment of the present disclosure, as illustrated in FIGS. 3A, 3B, and 4, a camera module (300) (e.g., the camera module (180) of FIG. 1) includes a lens assembly (310) (e.g., a lens assembly, the lens assembly (210) of FIG. 2), a shield can (320), an upper housing (330) (e.g., a first housing, a cover housing, or a cover member), an auto focus (AF) housing (340) (e.g., an AF carrier), a lower housing (350) (e.g., a second housing, a base housing, or a base member), a first spring member (SP1), a second spring member (SP2), at least one AF magnet (510) (e.g., a first drive magnet or a first magnet), at least one AF coil (520) (e.g., a first drive coil or a first coil), an IR filter (360), an IR bracket (370), an image sensor (381), and a substrate (380) electrically connected to the image sensor (381) (e.g., a flexible printed circuit board). The camera module (300) described above may include a substrate) and / or one or more elastic members (e.g., an elastic member (400) of FIG. 5A) (e.g., a buffer member or a damper). The configuration of the camera module (300) described above is an example, and the camera module (300) may have at least one of the above-described configurations omitted or at least one configuration added.

[0054] According to one embodiment, as illustrated in FIG. 4, the camera module (300) may include an AF housing (340) accommodated in a lower housing (350). In one embodiment, the lower housing (350) may be a housing facing an image sensor (381) connected to a substrate (380). In one embodiment, the camera module (300) may have a stacked structure of a substrate (380), an image sensor (381), an IR bracket (370) in which an IR filter (360) is arranged, a lower housing (350), a second spring member (SP2), an AF housing (340) in which a lens assembly (310) is accommodated, an upper housing (330), and a shield can (320), as illustrated in FIG. 4.

[0055] According to one embodiment, as illustrated in FIG. 4, the AF housing (340) may be a housing that accommodates the lens assembly (310). The AF housing (340) may be placed inside the lower housing (350) while accommodating the lens assembly (310). In one embodiment, the AF housing (340) may have an open upper surface so that the lens assembly (310) may be placed therein. In one embodiment, the lower housing (350) may have an open upper surface so that the AF housing (340) may be placed therein.

[0056] According to one embodiment, as illustrated in FIG. 4, the upper housing (330) may be coupled with the lower housing (350) to enclose the AF housing (340) and a portion of the lens assembly (310) accommodated in the AF housing (340). In one embodiment, the upper housing (330) may be formed to enclose the lens assembly (310) so as to accommodate at least a portion of the lens assembly (310) accommodated in the AF housing (340). As described below, the upper housing (330) may be coupled with the lower housing (350) such that a side wall (e.g., the second side wall (331) or the second bulkhead of FIG. 5A)) is disposed between side walls formed in the lower housing (350) (e.g., the third side wall (351), the fourth side wall (352) of FIG. 5A). In one embodiment, at least a portion of the second side wall (331) of the upper housing (330) (e.g., a side wall, a partition, a portion of the upper housing (330)) may protrude toward the lower housing (350) so as to cover at least a portion of one or more elastic members (400) disposed in the lower housing (350) when the camera module (300) is viewed from above (e.g., in the -Z direction of FIG. 4). For example, referring to FIG. 5A described below, a portion of the second side wall (331) of the upper housing (330) may extend toward the lens assembly (310). Accordingly, the one or more elastic members (400) may be at least partially covered by the second side wall (331) when the camera module is viewed from above (e.g., in the -Z direction of FIG. 5A).

[0057] According to one embodiment, with reference to FIGS. 3A, 3B, 4, and 5A described below, the lens assembly (310) may include at least one lens (312) and a lens barrel (311) (e.g., a barrel) in which the lens (312) is disposed. In one embodiment, the lens barrel (311) may be a housing that accommodates a plurality of lenses (312). In one embodiment, the plurality of lenses (312) may be arranged inside the lens barrel (311) along an optical axis of the lens (e.g., the Z-axis of FIG. 4).

[0058] In one embodiment, the lens assembly (310) is movable for auto focus (AF) to automatically adjust the focus of the lens (312) on a subject. In one embodiment, the lens assembly (310) can be moved along the optical axis with the AF housing (340) as the AF housing (340) moves along the optical axis (e.g., the Z-axis direction of FIG. 4) relative to the lower housing (350) to adjust the focus of the lens (312). In one embodiment, the camera module (300) can include an AF actuator that provides a driving force necessary to move the AF housing (340) along the optical axis relative to the lower housing (350). In one embodiment, the AF actuator can include an AF magnet (510) (e.g., a first drive magnet or a first magnet) and an AF coil (520) (e.g., a first drive coil or a first coil). In one embodiment, the AF housing (340) may be provided with either an AF magnet (510) or an AF coil (520). The other of the AF magnet (510) and the AF coil (520) may be disposed within the camera module (300) to face one of the AF magnets (510) and the AF coils (520) disposed within the AF housing (340). For example, as illustrated in FIG. 4, the AF coil (520) may be disposed along the periphery of the AF housing (340). The AF magnet (510) may be disposed within the shield can (320) to face the AF coil (520). However, as illustrated in FIG. 11A, the AF coils (620) (e.g., the AF coils (520)) may be configured in plurality and disposed to face each other within the AF housing (340). Similarly, the AF magnet (610) (e.g., the AF magnet (510)) may be configured in multiples to face the AF coil (620). The processor (120) may control the AF coil (520) to induce an electromagnetic phenomenon between the AF magnet (510) and the AF coil (520) and move the AF housing (340) in the optical axis direction relative to the lower housing (350).Accordingly, the camera module (300) can adjust the focus of the lens (312) as the lens assembly (310) disposed in the AF housing (340) moves in the optical axis direction together with the AF housing (340).

[0059] In one embodiment, the lens assembly (310) can be moved for an optical image stabilizer (OIS) to compensate for shake that occurs in the camera module (300) when capturing a subject. In one embodiment, the lower housing (350) can be disposed in a separate optical image stabilizer (OIS) housing (not shown). In one embodiment, the OIS housing can be disposed at least partially between the lower housing (350) and the IR bracket (370). In one embodiment, as the lower housing (350) moves in a direction substantially perpendicular to the optical axis (e.g., the X-axis direction and / or the Y-axis direction of FIG. 3A) relative to the OIS housing for image shake compensation or cancellation, the lens assembly (310) can be moved together with the lower housing (350) in a direction substantially perpendicular to the optical axis. In one embodiment, the camera module (300) may include an OIS actuator that provides a driving force necessary to move the lower housing (350) in a direction substantially perpendicular to the optical axis relative to the OIS housing. In one embodiment, the OIS actuator may include an OIS magnet (e.g., a second drive magnet or a second magnet) and an OIS coil (e.g., a second drive coil or a second coil). In one embodiment, one of the OIS magnet and the OIS coil may be disposed in one of the lower housing (350) and the OIS housing. The other of the OIS magnet and the OIS coil may be disposed in the other of the OIS housing and the lower housing (350) to face one of the OIS magnet and the OIS coil. The processor (120) may control the OIS coil to induce an electromagnetic phenomenon between the OIS magnet and the OIS coil and to move the lower housing (350) in a direction substantially perpendicular to the optical axis relative to the OIS housing.Accordingly, the camera module (300) can compensate for image shake as the lens assembly (310) moves in a direction in which image shake is canceled (e.g., perpendicular to the optical axis) together with the lower housing (350).

[0060] According to one embodiment, as illustrated in FIGS. 3A, 3B, and 4, the shield can (320) may be positioned at the outermost portion of the camera module (300) and at least partially surround the lower housing (350). In one embodiment, the shield can (320) may block or reduce electromagnetic waves generated from the outside of the camera module (300), thereby reducing malfunctions of the camera module (300). In one embodiment, the shield can (320) may be formed of a material that shields electromagnetic waves, such as copper, iron, aluminum, and / or nickel, and may be formed of various materials that can be performed by a person skilled in the art in addition to the materials described above.

[0061] According to one embodiment, as illustrated in FIG. 4, an upper housing (330) and an AF magnet (510) may be disposed inside the shield can (320). In one embodiment, at least a portion of the upper housing (330) may be disposed in the lower housing (350) while being coupled with the shield can (320) inside the shield can (320). For example, when the lower housing (350) containing the AF housing (340) is assembled with the shield can (320), a portion (e.g., the second side wall (331) of FIG. 5A) of the upper housing (330) disposed inside the shield can (320) may be disposed in a portion (e.g., the area between the third side wall (351) and the fourth side wall (352) of FIG. 5A) of the lower housing (350).

[0062] In one embodiment, the AF magnet (510) may be fixed inside the shield can (320). The AF magnet (510) may face the AF coil (520) disposed in the AF housing (340) when the shield can (320) is disposed in the lower housing (350) and a portion of the upper housing (330) is disposed in the lower housing (350). In one embodiment, the AF housing (340) may move in the optical axis direction through an electromagnetic force acting between the AF coil (520) and the AF magnet (510) to perform an AF (auto focus) function that automatically adjusts the focus of the lens (312) on a subject. In one embodiment, the AF magnet (510) may be disposed inside the shield can (320) so that its N pole and S pole face the AF coil (520) disposed in the AF housing (340). In this case, the AF housing (340) can be moved in the optical axis direction with respect to the lower housing (350) while maintaining a vertical distance between the AF coil (520) and the AF magnet (510). However, in the above description, the AF magnet (510) is described as being disposed inside the shield can (320) and the AF coil (520) is disposed in the AF housing (340), but this may not be limited thereto. For example, the AF coil (520) may be disposed inside the shield can (320), and the AF magnet (510) facing the AF coil (520) may be disposed in the AF housing (340). The AF magnet (510) may be disposed in the AF housing (340) so that its N pole and S pole may face the AF coil (520) disposed in the shield can (320). In this case, the AF housing (340) can be moved in the optical axis direction with respect to the lower housing (350) while maintaining a vertical distance between the AF coil (520) and the AF magnet (510).

[0063] In one embodiment not shown in the drawing, one of the AF coil (520) and the AF magnet (510) is disposed on the back surface of the AF housing (340) (e.g., the side facing the -Z direction in FIG. 4), and the other of the AF coil (520) and the AF magnet (510) is disposed on the lower housing (350) so as to face one of the AF coil (520) and the AF magnet (510). For example, when the AF coil (520) is disposed on the back surface of the AF housing (340), the AF magnet (510) may be disposed on the lower housing (350), and vice versa. In one embodiment, the AF magnet (510) may be disposed on the AF housing (340) or the lower housing (350) such that one of the N pole and the S pole faces the AF coil (520). In this case, the vertical distance of the AF magnet (510) to the AF coil (520) can be changed through the electromagnetic force acting on the AF coil (520). Accordingly, the AF housing (340) can perform an AF (auto focus) function that automatically adjusts the focus of the lens (312) on the subject by moving in the direction of the optical axis through the electromagnetic force acting between the AF coil (520) and the AF magnet (510).

[0064] In one embodiment, the camera module (300) may include a flexible printed circuit board (not shown) electrically connected to the AF coil (520) and / or the OIS coil. The processor (120) may be disposed on the main board (not shown) of the electronic device (101) and may supply current to the AF coil (520) through the flexible printed circuit board to provide a driving force in the direction of the optical axis to the AF housing (340). Furthermore, in one embodiment, the processor (120) may supply current to the OIS coil through the flexible printed circuit board to provide a driving force in the direction perpendicular to the optical axis to the lower housing (350).

[0065] According to one embodiment, as illustrated in FIG. 4, the camera module (300) may include a first spring member (SP1) and a second spring member (SP2) connected to the AF housing (340). In one embodiment, the first spring member (SP1) may be fixed to the upper housing (330) and the AF housing (340). For example, at least a portion of the first spring member (SP1) may be disposed in the upper housing (330) and a portion may be bonded to the AF housing (340) by welding or bonding using an adhesive member (e.g., tape, bond). In one embodiment, the second spring member (SP2) may be fixed to the lower housing (350) and the AF housing (340). For example, at least a portion of the second spring member (SP2) may be disposed in the lower housing (350) and a portion may be bonded to the AF housing (340) by welding or bonding using an adhesive member (e.g., tape, bond). In one embodiment, referring to FIG. 7c described below, one end (SP21) of the second spring member (SP2) may be fixed to the lower housing (350) via one or more elastic members (400).

[0066] In one embodiment, the first spring member (SP1) and the second spring member (SP2) can elastically support the movement of the AF housing (340) in the optical axis direction (e.g., the Z-axis direction of FIG. 4). In one embodiment, the AF housing (340) can perform an auto-focus function by moving in the optical axis direction through an electromagnetic force acting between the AF coil (520) and the AF magnet (510). Referring to FIG. 5A described below, when the AF housing (340) moves in the + Z direction of FIG. 5A, the first spring member (SP1) and the second spring member (SP2) can apply a spring force in a direction opposite to the movement of the AF housing (340) (e.g., the - Z direction of FIG. 5A). Conversely, when the AF housing (340) moves in the - Z direction of FIG. 5A, the first spring member (SP1) and the second spring member (SP2) can apply a spring force in a direction opposite to the movement of the AF housing (340) (e.g., the + Z direction of FIG. 5A). The spring members (SP1, SP2) can control the movement of the AF housing (340) due to external shock or vibration by applying a spring force in a direction opposite to the movement direction of the AF housing (340). In one embodiment, the AF housing (340) can be moved by the electromagnetic force between the AF coil (520) and the AF magnet (510), and then returned to the reference position before the movement by the spring force applied from the spring members (SP1, SP2) as the current applied to the AF coil (520) is cut off or reduced. The reference position may be the position of the AF housing (340) within the camera module (300) before the current is applied to the AF coil (520).

[0067] In one embodiment, the first spring member (SP1) and the second spring member (SP2) may be formed in various shapes and / or from various materials. In one embodiment, the first spring member (SP1) and the second spring member (SP2) may be formed as a plate spring. In one embodiment, the first spring member (SP1) may be formed of a metallic material such as stainless steel, beryllium copper, nickel copper, or carbon steel, and may be formed of a non-metallic material such as polyacetal, polycarbonate, carbon fiber, urethane, or rubber.

[0068] According to one embodiment, as illustrated in FIG. 4, an IR bracket (370) having an IR filter (360) disposed thereon and a substrate (380) having an image sensor (381) disposed thereon may be disposed at a lower portion of the lower housing (350). In one embodiment, the image sensor (381) may be disposed at a lower portion of the IR bracket (370) to face the IR filter (360). In one embodiment, the IR filter (360) may be a filter that selectively reflects or absorbs near-infrared wavelengths to block them from entering the image sensor (381). In one embodiment, the IR filter (360) may be disposed at the IR bracket (370) and between a lens (312) of the lens assembly (310) and the image sensor (381). The image sensor (381) can detect light emitted or reflected from a subject and transmitted through the lens assembly (310) - IR filter (360) and convert the light into an electrical signal, thereby obtaining an image corresponding to the subject. In one embodiment, the substrate (380) connected to the image sensor (381) can be electrically connected to a main substrate on which the processor (120) is disposed, which is electrically connected to the processor (120) through a connector.

[0069] FIG. 5A is a cross-sectional view taken along line 5A-5A of FIG. 3B. FIG. 5B is a drawing illustrating the arrangement relationship of the AF housing, elastic member, and lower housing of FIG. 5A. FIG. 6 is a perspective view of a camera module according to one embodiment of the present disclosure, with the upper housing, shield can, and lens assembly located above the AF housing removed.

[0070] According to one embodiment, as illustrated in FIGS. 5A and 5B , the AF housing (340) may include a first sidewall (341) (e.g., a sidewall, a partition, a portion, a first partition, or a first portion). In one embodiment, the first sidewall (341) may be a portion of an edge (e.g., a corner) of the AF housing (340). In one embodiment, the first sidewall (341) may face a portion of the lower housing (350) (e.g., a third sidewall (351)) when the AF housing (340) is disposed in the lower housing (350). In one embodiment, the lower housing (350) may include a third sidewall (351) (e.g., a third bulkhead, a third portion, a first sidewall of the lower housing (350), a first bulkhead of the lower housing (350), or a first portion of the lower housing (350)) and / or a fourth sidewall (352) (e.g., a fourth bulkhead, a fourth portion, a first sidewall of the lower housing (350), a first bulkhead of the lower housing (350), or a first portion of the lower housing (350). In one embodiment, the fourth sidewall (352) may be disposed outward with respect to the third sidewall (351). In one embodiment, the third sidewall (351) and / or the fourth sidewall (352) may be formed to extend in a direction perpendicular to a bottom surface (3511) of the lower housing (350) (e.g., a +Z direction with respect to FIG. 5A). In one embodiment, the third side wall (351) of the lower housing (350) may be formed at a position facing the first side wall (341) located at the corner of the AF housing (340) when the AF housing (340) is placed in the lower housing (350). In one embodiment, the first side wall (341) of the AF housing (340), the third side wall (351) of the lower housing (350), and the fourth side wall (352) of the lower housing (350) may be placed side by side when the AF housing (340) is placed in the lower housing (350).

[0071] According to one embodiment, as illustrated in FIG. 5A, the third side wall (351) and the fourth side wall (352) of the lower housing (350) may be positioned outside the image sensor (381) when the camera module (300) is viewed from above (e.g., in the -Z direction of FIG. 5A). In other words, the third side wall (351) and the fourth side wall (352) of the lower housing (350) may at least partially surround the image sensor (381) when the camera module (300) is viewed from above. In one embodiment, the bottom surface (3511) of the lower housing (350) may include a first support surface (3501) (e.g., the first support surface (3501) of FIG. 9A) positioned between the third sidewall (351) of the lower housing (350) and the first sidewall (341) of the AF housing (340), and a second support surface (3502) (e.g., the second support surface (3502) of FIG. 9A) positioned between the third sidewall (351) and the fourth sidewall (352) of the lower housing (350). In one embodiment, with reference to FIG. 7C described below, at least a portion of the second spring member (SP2) may be disposed on the first support surface (3501) and the second support surface (3502) of the lower housing (350), respectively. For example, a portion (SP22) of the second spring member (SP2) may be disposed on the second support surface (3502), and an end (SP21) extending from the portion (SP22) disposed on the second support surface (3502) may be disposed on the first support surface (3501). In one embodiment, the end (SP21) of the second spring member (SP2) may be in contact with one or more elastic members (400).

[0072] According to one embodiment, as illustrated in FIG. 5A, the upper housing (330) may include a second side wall (331) (e.g., a second partition or a second portion). In one embodiment, the upper housing (330) may be coupled to the lower housing (350) to accommodate the lens assembly (310) and the AF housing (340). In one embodiment, the second side wall (331) of the upper housing (330) may face the first side wall (341) positioned at the edge of the AF housing (340) when coupled with the lower housing (350). In one embodiment, at least a portion of the second side wall (331) of the upper housing (330) may protrude toward the lower housing (350) to cover at least a portion of the second spring member (SP2) disposed in the lower housing (350) when viewed from above the camera module (300). In one embodiment, the second sidewall (331) of the upper housing (330) may be positioned between the third sidewall (351) and the fourth sidewall (352) of the lower housing (350) when the upper housing (330) is coupled to the lower housing (350). In other words, the third sidewall (351) of the lower housing (350) may be positioned between the first sidewall (341) of the AF housing (340) and the second sidewall (331) of the upper housing (330). Accordingly, as illustrated in FIG. 5A, the first sidewall (341) of the AF housing (340) - the third sidewall (351) of the lower housing (350) - the second sidewall (331) of the upper housing (330) - the fourth sidewall (352) of the lower housing (350) may be positioned in this order.

[0073] According to one embodiment, as illustrated in FIGS. 5A, 5B, and 6, the camera module (300) may include one or more elastic members (400) disposed in a space (e.g., a gap) between a first side wall (341) of the AF housing (340) and a third side wall (351) of the lower housing (350). In one embodiment, the gap between the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350) may be greater than or equal to about 0.2 mm and less than or equal to about 0.5 mm. In one embodiment, the one or more elastic members (400) may not be disposed between the second side wall (331) of the upper housing (330) and the third side wall (351) of the lower housing (350). In one embodiment, one or more elastic members (400) may be bonded to the first side wall (341) and the third side wall (351). In one embodiment, the one or more elastic members (400) may be formed of a soft material and thus may be stretched when the AF housing (340) moves in the optical axis direction. The one or more elastic members (400) may be restored through an elastic restoring force as the AF housing (340) returns to its original position relative to the lower housing (350). Therefore, the deformation of the one or more elastic members (400) may be reversible.

[0074] In one embodiment, one or more elastic members (400) can dampen vibration of the AF housing (340) due to external impact, etc., on the camera module (300). In one embodiment, one or more elastic members (400) can fill a gap between the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350). Therefore, when an external impact is applied to the camera module (300), the phenomenon of the AF housing (340) vibrating in the X-axis direction or the Y-axis direction of FIG. 6 relative to the lower housing (350) can be alleviated. In one embodiment, when one or more elastic members (400) are disposed between the first side wall (341) and the third side wall (351) as illustrated in FIG. 12b, which will be described later, the rate at which the amplitude of vibration generated in the AF housing (340) is attenuated can increase compared to when one or more elastic members (400) are not disposed between the first side wall (341) and the third side wall (351) as illustrated in FIG. 13a. Accordingly, when vibration occurs in the AF housing (340), the lens assembly (310) accommodated in the AF housing (340) also vibrates, thereby alleviating the image shaking phenomenon that occurs.

[0075] In one embodiment, the one or more elastic members (400) may be formed of various materials. The materials may have a stiffness of from about 1 MPa to about 10 GPa. In one embodiment, a material having a stiffness of from about 10 MPa to 1 GPa may be used. In one embodiment, the one or more elastic members (400) may be formed of a liquid material (e.g., epoxy, polyurethane, silicone) and applied between the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350). In one embodiment, the one or more elastic members (400) may be formed by applying the liquid material between the first side wall (341) and the third side wall (351) through a dispenser (e.g., an injector) and then curing the liquid material. In one embodiment, one or more elastic members (400) can be converted into a fluid, solid, or semi-solid state through a curing process. In one embodiment, one or more elastic members (400) in a liquid state can be cured through UV curing or thermal curing. In addition, one or more elastic members (400) can be formed into a solid state and bonded to the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350) through an adhesive member (e.g., double-sided tape, bond).

[0076] FIGS. 7A, 7B, and 7C are drawings illustrating a coupling relationship between an AF housing and a lower housing and a position where an elastic member is arranged, according to one embodiment of the present disclosure.

[0077] According to one embodiment, as illustrated in FIGS. 7A and 7B , the AF housing (340) may be disposed in the lower housing (350) such that the first sidewall (341) and the third sidewall (351) of the lower housing (350) face each other. In one embodiment, the first sidewall (341) of the AF housing (340) may include a first region (341a) of the first sidewall (341) and a second region (341b) of the first sidewall (341). In one embodiment, the first region (341a) of the first sidewall (341) may be substantially perpendicular to the second region (341b) of the first sidewall (341). The third side wall (351) of the lower housing (350) may include a first region (351a) of the third side wall (351) facing the first region (341a) of the first side wall (341) and a second region (351b) of the third side wall (351) facing the second region (341b) of the first side wall (341). The first region (351a) of the third side wall (351) may be substantially perpendicular to the second region (351b) of the third side wall (351).

[0078] According to one embodiment, at least one or more elastic members (400) may be disposed in a space between a first side wall (341) of the AF housing (340) and a third side wall (351) of the lower housing (350), as illustrated in FIGS. 7A and 7B . In one embodiment, the one or more elastic members (400) may include a first elastic member (401) disposed between a first region (341a) of the first side wall (341) and a first region (351a) of the third side wall (351), and a second elastic member (402) disposed between a second region (341b) of the first side wall (341) and a second region (351b) of the third side wall (351). In one embodiment, the first elastic member (401) and the second elastic member (402) may be separated from each other and bonded to the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350), as illustrated in FIG. 7B. In some embodiments, the first elastic member (401) and the second elastic member (402) may be formed integrally. In such a case, the first elastic member (401) and the second elastic member (402) may be conceptually distinguished according to their positions between the first side wall (341) and the third side wall (351).

[0079] According to one embodiment, as illustrated in FIG. 7c, the first elastic member (401) may cover one end (e.g., one end (SP21) of the second spring member (SP2) of FIG. 7c) of the second spring member (SP2) disposed on the first support surface (3501) of the lower housing (350) (e.g., the first support surface (3501) of FIG. 9a) when the camera module (300) is viewed from above. In one embodiment, the first elastic member (401) may fix one end (SP21) of the second spring member (SP2) disposed on the first support surface (3501) of the lower housing (350) to the lower housing (350). In one embodiment, the first elastic member (401) may be applied in a liquid state between the first region (341a) of the first side wall (341) and the first region (351a) of the third side wall (351) and may be cured through various curing methods (e.g., UV curing or thermal curing). In this case, one end (SP21) of the second spring member (SP2) disposed on the first support surface (3501) may penetrate the first elastic member (401) and be at least partially disposed inside the first elastic member (401). Accordingly, the second spring member (SP2) may be fixed to the lower housing (350) through the first elastic member (401).

[0080] The description of FIG. 7c described above can be equally applied to a case where, when the camera module (300) is viewed from above, the second elastic member (402) covers a portion of the second spring member (SP2) disposed on the first support surface (3501) of the lower housing (350). For example, the second elastic member (402) can secure one end of the second spring member (SP2) disposed on the first support surface (3501) of the lower housing (350) to the lower housing (350).

[0081] In addition, in the embodiment of FIG. 7c, the arrangement relationship of the first elastic member (401), the second elastic member (402), and the second spring member (SP2) disposed between any one of the plurality of first side walls (341) formed in the AF housing (340) and any one of the plurality of third side walls (351) formed in the lower housing (350) is exemplarily described. The description related to FIG. 7c may be equally applied to the first elastic member (401), the second elastic member (402), and the second spring member (SP2) disposed between the remaining side walls of the plurality of first side walls (341) formed in the AF housing (340) and the remaining side walls of the plurality of third side walls (351) formed in the lower housing (350).

[0082] According to one embodiment of the present disclosure, the first elastic member (401) and the second elastic member (402) may be disposed in a space (gap) between the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350). When an external impact is applied to the camera module (300), vibration of the AF housing (340) relative to the lower housing (350) in the X-axis direction or the Y-axis direction of FIG. 7C may be buffered by one or more elastic members (400). Therefore, when an external force is applied to the camera module (300), the first elastic member (401) and the second elastic member (402) may dampen vibration of the AF housing (340) and alleviate shaking of the lens assembly (310).

[0083] According to one embodiment of the present disclosure, an elastic member (e.g., the first elastic member (401) and the second elastic member (402) of FIG. 7B) may be in contact with the AF housing (340) and the lower housing (350). The AF housing (340) and the lower housing (350) are separate components and may be connected through the elastic member (400).

[0084] FIGS. 8A, 8B, and 8C are drawings illustrating a coupling relationship between an AF housing and a lower housing and a position where an elastic member is arranged according to one embodiment of the present disclosure.

[0085] The description of FIGS. 8A to 8C below may be a description of the first side wall (341) of the AF housing (340) formed in a different shape from the first side wall (341) of the AF housing (340) described in the embodiment of FIGS. 7A to 7C described above. In the description below, the same content as FIGS. 7A to 7C will be omitted.

[0086] According to one embodiment, as illustrated in FIGS. 8A to 8C, the first side wall (341) of the AF housing (340) may include a protrusion (342) protruding toward the third side wall (351) of the lower housing (350). In one embodiment, the protrusion (342) of the AF housing (340) may be in contact with an elastic member (400) (e.g., the first elastic member (401) and / or the second elastic member (402)) disposed between the first side wall (341) and the third side wall (351).

[0087] According to one embodiment, as illustrated in FIGS. 8A to 8C, the first side wall (341) of the AF housing (340) may include a recess (343) formed adjacent to the protrusion (342). In one embodiment, the recess (343) may be formed in an opposite direction from the third side wall (351). For example, the recess (343) may be formed in a first area (341a) of the first side wall (341) facing the first area (351a) of the third side wall (351) (e.g., the first area (341a) of FIG. 7C) and / or in a second area (341b) of the first side wall (341) facing the second area (351b) of the third side wall (351) (e.g., the second area (341b) of FIG. 7C).

[0088] According to one embodiment, as illustrated in FIGS. 8A to 8C, the first elastic member (401) may be at least partially disposed in a recess (343) formed in a first region (341a) of the first side wall (341) and adhered to the protrusion (342) and the first region (351a) of the third side wall (351). The second elastic member (402) may be at least partially disposed in a recess (343) formed in a second region (341b) of the first side wall (341) and adhered to the protrusion (342) and the second region (351b) of the third side wall (351). Therefore, when an external impact is applied to the camera module (300), vibration of the AF housing (340) relative to the lower housing (350) in the X-axis direction or the Y-axis direction of FIG. 8C may be buffered by one or more elastic members (400). Therefore, when an external force is applied to the camera module (300), the first elastic member (401) and the second elastic member (402) can dampen the vibration of the AF housing (340) and alleviate the shaking phenomenon of the lens assembly (310).

[0089] FIGS. 9A and 9B are drawings illustrating the positional relationship of a spring member and an elastic member arranged in a lower housing according to one embodiment of the present disclosure.

[0090] According to one embodiment, as illustrated in FIGS. 9A and 9B , the bottom surface (3511) of the lower housing (350) may include a first support surface (3501) positioned between the third sidewall (351) of the lower housing (350) and the first sidewall (341) of the AF housing (340), and a second support surface (3502) positioned between the third sidewall (351) and the fourth sidewall (352) of the lower housing (350). In one embodiment, the first support surface (3501) may be formed lower than the second support surface (3502). For example, the first support surface (3501) may be positioned in the -Z direction of FIG. 9B with respect to the second support surface (3502) to form a step with the second support surface (3502). However, in some embodiments, the first support surface (3501) and the second support surface (3502) may be positioned substantially on the same plane. Additionally, in some embodiments, the first support surface (3501) may be positioned above the second support surface (3502) to form a step with the second support surface (3502).

[0091] According to one embodiment, as illustrated in FIGS. 9A and 9B , the lower housing (350) may include a third sidewall (351) and a fourth sidewall (352) positioned outwardly relative to the third sidewall (351). In one embodiment, the third sidewall (351) and the fourth sidewall (352) may be formed with different heights (e.g., lengths in the Z-axis direction in FIGS. 9A and 9B ). For example, the height (H1) of the third sidewall (351) with respect to the second support surface (3502) may be formed lower than the height (H2) of the fourth sidewall (352) with respect to the second support surface (3502). In this case, the upper surface of the third sidewall (351) may be positioned lower than the upper surface of the fourth sidewall (352). Conversely, in some embodiments, the height (H1) of the third side wall (351) may be formed higher than the height (H2) of the fourth side wall (352). For example, the height (H1) of the third side wall (351) with respect to the second support surface (3502) may be formed higher than the height (H2) of the fourth side wall (352) with respect to the second support surface (3502). In one embodiment, the height (H1) of the third side wall (351) with respect to the second support surface (3502) may be the same with a constant length. Similarly, the height (H2) of the fourth side wall (352) with respect to the second support surface (3502) may be the same with a constant length. In one embodiment, the fourth side wall (352) may be formed with a length (L2) that surrounds the third side wall (351). For example, the length (L1) in the extension direction of the third side wall (351) (e.g., the length in the direction extending from the first region (351a) to the second region (351b) of the third side wall (351)) may be shorter than the length (L2) in the extension direction of the fourth side wall (352).

[0092] According to one embodiment, as illustrated in FIGS. 9A and 9B , the second spring member (SP2) may be disposed at least partially on the first support surface (3501) and the second support surface (3502) of the lower housing (350), respectively. In one embodiment, the second spring member (SP2) may be partially connected to the AF housing (340), and one end (SP21) (e.g., one end (SP21) of FIG. 7C ) may be disposed on the first support surface (3501) between the first side wall (341) and the third side wall (351) to be adjacent to the elastic member (400) (e.g., the first elastic member (401) and / or the second elastic member (402)). For example, one end (SP21) of the second spring member (SP2) (e.g., one end (SP21) of FIG. 7c) may overlap the first elastic member (401) or the second elastic member (402) when the camera module (300) is viewed from above (e.g., in the -Z direction of FIG. 9b). In one embodiment, one end (SP21) of the second spring member (SP2) (e.g., one end (SP21) of FIG. 7c) may be fixed to the first support surface (3501) of the lower housing (350) or a portion of the lower housing (350) (e.g., the third bulkhead (351)) via the first elastic member (401) and / or the second elastic member (402). In one embodiment, referring to FIGS. 9A and 9B, a portion (SP22) of the second spring member (SP2) may be disposed on a second support surface (3501) of the lower housing (350).

[0093] FIGS. 10A, 10B, 10C and 10D are drawings illustrating the deformability of the arrangement area of ​​the elastic member according to the shape of the spring member, according to one embodiment of the present disclosure.

[0094] According to one embodiment, as illustrated in FIGS. 10A to 10D , at least a portion of the second spring member (SP2) may be disposed on the first support surface (3501) (e.g., the first support surface (3501) of FIG. 9A ) and the second support surface (3502) (e.g., the second support surface (3502) of FIG. 9A ) of the lower housing (350), respectively. In one embodiment, one end (SP21) of the second spring member (SP2) may be disposed on the first support surface (3501) located between the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350). In one embodiment, one end (SP21) of the second spring member (SP2) may overlap one or more elastic members (400) when the camera module (300) is viewed from above (e.g., in the -Z direction of FIG. 9B described above). In one embodiment, one or more elastic members (400) can secure one end (SP21) of the second spring member (SP2) to the first support surface (3501) of the lower housing (350) or a portion of the lower housing (350) (e.g., the third bulkhead (351)). In one embodiment, referring to FIGS. 10A to 10D , one or more elastic members (400) can be applied along the shape of one end (SP21) of the second spring member (SP2). For example, when sequentially checking FIGS. 10A to 10D , as the shape of one end (SP21) of the second spring member (SP2) expands, an area where one or more elastic members (400) are applied between the first sidewall (341) of the AF housing (340) and the third sidewall (351) of the lower housing (350) can increase. Accordingly, one or more elastic members (400) can have their application area changed based on the extent of expansion of one end (SP21) of the second spring member (SP2).

[0095] FIGS. 11A and 11B are drawings illustrating a camera module including an AF magnet and an AF coil having a different arrangement relationship from the AF magnet and AF coil of FIG. 4.

[0096] The description of FIGS. 11a and 10b below may be a description of a camera module (600) (e.g., the camera module (180) of FIG. 1) including an AF magnet (510) and an AF coil (520) having a different arrangement relationship from the AF magnet (510) and the AF coil (520) of the camera module (300) described through FIGS. 3a to 9b described above. In the description below, descriptions of configurations identical or similar to the configurations described above will be omitted, and may be replaced with the contents described through FIGS. 3a to 9b described above.

[0097] According to one embodiment, as illustrated in FIGS. 11A and 11B , a camera module (600) (e.g., the camera module (180) of FIG. 1 and / or the camera module (300) of FIG. 3A ) may be disposed in an AF housing (340) and include AF magnets (610) (e.g., the AF magnets (510) of FIG. 4 ) that face each other and AF coils (620) (e.g., the AF coils (520) of FIG. 4 ) that face the AF magnets (610). In one embodiment, the AF coils (620) may be disposed in the AF housing (340) and may face each other. In one embodiment, the AF coils (620) may be disposed within a shield can (320) that accommodates the AF housing (340) and covers a portion of the lower housing (350).

[0098] According to one embodiment, as illustrated in FIGS. 11A and 11B , the camera module (600) may include one or more elastic members (400) disposed in a space between a first side wall (341) of the AF housing (340) and a third side wall (351) of the lower housing (350). In one embodiment, the one or more elastic members (400) may include a first elastic member (401) bonded between a first region (341a) of the first side wall (341) and a first region (351a) of the third side wall (351), and a second elastic member (402) bonded between a second region (341b) of the first side wall (341) and a second region (351b) of the third side wall (351), as illustrated in FIGS. 7A to 8C . In one embodiment, the first elastic member (401) and the second elastic member (402) may be physically separated. In some embodiments, the first elastic member (401) and the second elastic member (402) may be formed integrally. Accordingly, when an external impact is applied to the camera module (300), the shaking of the AF housing (340) may be buffered by the elastic member (400) as one or more elastic members (e.g., the first elastic member (401) and / or the second elastic member (402)) are disposed between the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350).

[0099] FIGS. 12A and 12B are drawings illustrating a camera module including an elastic member positioned at a different location from the elastic member illustrated in FIG. 6 within the camera module, according to one embodiment of the present disclosure.

[0100] The camera module (700) illustrated in FIGS. 12a and 12b below (e.g., the camera module (180) of FIG. 1 and / or the camera module (300) of FIG. 3a) may include the AF magnets (610) and AF coils (620) of the camera module (600) illustrated in FIGS. 11a and 11b.

[0101] The elastic member (800) illustrated in FIGS. 12A and 12B below (e.g., the elastic member (400) of FIG. 6) may be positioned in a region different from one or more of the elastic members (400) described through FIGS. 3A to 11B in the region between the AF housing (340) and the lower housing (350). In the following description, descriptions of configurations identical or similar to the configurations described above will be omitted, and may be replaced with the contents described through FIGS. 3A to 11B above.

[0102] According to one embodiment, as illustrated in FIGS. 12A and 12B, the elastic member (800) may be disposed in a space between a portion of the AF housing (340) where the AF coils (520) are not disposed and the lower housing (350). In one embodiment, the portion where the AF coils (620) are not disposed may be a portion that is substantially perpendicular to the portion where the AF coils (620) are disposed. In one embodiment, the lower housing (350) may include a fifth side wall (353) that faces the portion of the AF housing (340) where the AF coils (620) are not disposed. In one embodiment, the fifth side wall (353) may be formed to extend in a direction that is substantially perpendicular to the bottom surface (3511) of the lower housing (350) (e.g., the +Z direction in FIG. 12A). In one embodiment, a plurality of fifth side walls (353) may be formed to face each other.

[0103] According to one embodiment, as illustrated in FIGS. 12A and 12B, the elastic member (800) may be bonded to the AF housing (340) and the fifth side wall (353) in the space between the portion of the AF housing (340) where the AF coils (520) are not arranged and the fifth side wall (353). In one embodiment, the elastic member (800) may dampen vibration of the AF housing (340) due to external impact, etc., to the camera module (300). For example, when an external impact is applied to the camera module (300), the shaking of the AF housing (340) relative to the lower housing (350) may be cushioned by the elastic member (800) being arranged between the AF housing (340) and the fifth side wall (353). Therefore, when an external force is applied to the camera module (700), the elastic member (800) can dampen the vibration of the AF housing (340) and alleviate the shaking phenomenon of the lens assembly (310).

[0104] FIG. 13a is a graph showing the vibration applied to the AF housing over time when an external impact is applied to a camera module that does not include an elastic member, in a comparative example. FIG. 13b is a graph showing the vibration applied to the AF housing over time when an external impact is applied to a camera module that includes an elastic member of the present disclosure.

[0105] FIG. 13a below is a graph (701) showing the amplitude (μm, micrometer) of vibration applied to the AF housing (340) versus time (ms, millisecond) when no elastic member (400) is placed between the first side wall (341) and the third side wall (351) according to an exemplary simulation. FIG. 13b is a graph (702) showing the amplitude (μm, micrometer) of vibration applied to the AF housing (340) versus time (ms, millisecond) when one or more elastic members (400) are placed between the AF housing (340) and the lower housing (350) illustrated in FIGS. 7a to 8c. This is according to an exemplary simulation.

[0106] In one embodiment, when one or more elastic members (400) are disposed between the first side wall (341) and the third side wall (351), the speed at which vibration occurring in the AF housing (340) is damped may increase compared to when the elastic members (400) are not disposed between the first side wall (341) and the third side wall (351). For example, referring to the graphs (701, 702) of FIGS. 13A and 13B at each time point (t1 to t7), it can be confirmed that the amplitude of vibration of the AF housing (340) according to time shown in the graph (702) of FIG. 13B is lower than the amplitude of vibration of the AF housing (340) according to time shown in the graph (701) of FIG. 13A. In addition, it can be confirmed that the time at which the amplitude of vibration is reduced is faster in the graph (702) of FIG. 13B than in the graph (701) of FIG. 13A. Accordingly, when one or more elastic members (400) are placed between the first side wall (341) of the AF housing (340) and the third side wall (351) of the lower housing (350), vibrations occurring in the AF housing (340) can be attenuated. In addition, when vibrations occur in the AF housing (340), the lens assembly (310) accommodated in the AF housing (340) also vibrates, so that the resulting image shaking phenomenon can be alleviated.

[0107] According to one embodiment, the camera module (180, 300) may include an AF housing (340) used for an AF (auto focus) function that automatically adjusts the focus of the lens (312) on a subject. The AF housing (340) may accommodate a lens assembly (310) including at least one lens (312). The focus of the lens (312) may be adjusted as the AF housing (340) moves in the optical axis direction of the lens (312) (e.g., the Z-axis direction of FIG. 4 described above). The AF housing (340) may be disposed in a lower housing (350) disposed below the AF housing (340) and may move in the optical axis direction of the lens (312) with respect to the lower housing (350). For example, the AF housing (340) can move in the optical axis direction of the lens (312) with respect to the lower housing (350) through an electromagnetic force generated from an AF actuator (e.g., an AF magnet (510, 610) and an AF coil (520, 620)). A certain gap can be formed between the AF housing (340) and the lower housing (350) to facilitate movement of the AF housing (340) in the optical axis direction and to take into account the assembly tolerance of the AF housing (340) with respect to the lower housing (350).

[0108] Meanwhile, when an external impact is applied to the electronic device (101) in which the camera module (180, 300) is disposed, the AF housing (340) may shake relative to the lower housing (350). In this case, the lens assembly (310) disposed in the AF housing (340) may shake together with the AF housing (340). Accordingly, a shaking phenomenon may occur in the image of the subject being photographed by the camera module (180, 300).

[0109] Therefore, including one or more elastic members (400) can contribute to improving image quality because the shaking of the AF housing (340) can be alleviated by the damping of the one or more elastic members (400).

[0110] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned can be clearly understood by a person having ordinary knowledge in the technical field to which this document belongs from the description below.

[0111] According to one embodiment of the present disclosure, a camera module (180, 300) may include a lens assembly (310) including one or more lenses (312) substantially aligned along an optical axis, an image sensor (381) configured to detect light acquired through the lens assembly, an auto focus (AF) housing (340) having a first sidewall (341) and configured to at least partially accommodate the lens assembly and move substantially along the optical axis, an upper housing (330) including a second sidewall (331) at least partially surrounding the AF housing and facing the first sidewall and spaced apart from the first sidewall, a lower housing (350) coupled to the upper housing, including a third sidewall (351) at least partially surrounding the image sensor and positioned between the first sidewall and the second sidewall, and an elastic member (400) disposed between the third sidewall of the lower housing and the first sidewall of the AF housing.

[0112] In one embodiment, the lower housing further comprises a spring member (SP2), one ending portion of the spring member being connected to the AF housing and another ending portion of the spring member being extending between the first side wall and the third side wall and positioned adjacent to the elastic member.

[0113] In one embodiment, at least a portion of the other ending portion of the spring member may be arranged to penetrate the elastic member.

[0114] In one embodiment, the third side wall may be formed to substantially face an edge of the AF housing.

[0115] In one embodiment, the third side wall comprises a first region (351a) and a second region (351b) that are substantially perpendicular to each other, and the elastic member may comprise a first elastic member (401) and a second elastic member (402) disposed in the first region and the second region, respectively.

[0116] In one embodiment, the first elastic member and the second elastic member may be spaced apart from each other.

[0117] In one embodiment, the first side wall may include a protrusion (342) protruding toward the third side wall to contact the elastic member.

[0118] In one embodiment, the protrusion includes a recess (343) formed in an opposite direction from the third side wall at one end, and at least a portion of the recess can contact the elastic member.

[0119] In one embodiment, a portion of the second side wall may protrude toward the lower housing so as to cover at least a portion of the elastic member when viewed from above the camera module.

[0120] In one embodiment, the lower housing may include a fourth side wall (352) disposed outside the second side wall of the upper housing.

[0121] In one embodiment, one end of the second sidewall of the upper housing may be positioned between the third sidewall and the fourth sidewall of the lower housing.

[0122] In one embodiment, the height (H1) of the third side wall may be formed lower than the height (H2) of the fourth side wall.

[0123] In one embodiment, the length (L1) of the third side wall may be shorter than the length (L2) of the fourth side wall.

[0124] In one embodiment, the third side wall and the fourth side wall protrude from the bottom surface (3511) of the lower housing, and the bottom surface includes a first support surface (3501) between the third side wall and the first side wall and a second support surface (3502) between the third side wall and the fourth side wall, and the first support surface can be formed lower than the second support surface.

[0125] In one embodiment, the camera module has a height (H1) of the third side wall that is substantially the same throughout its length.

[0126] In one embodiment, no elastic member may be disposed between the second side wall and the third side wall.

[0127] In one embodiment of the present disclosure, an electronic device (101) including a camera module (180, 300), wherein the camera module comprises: a lens assembly (310) including one or more lenses (312) substantially aligned along an optical axis; an image sensor (381) configured to detect light acquired through the lens assembly; an auto focus (AF) housing (340) having a first sidewall (341) and configured to at least partially accommodate the lens assembly and move substantially along the optical axis; an upper housing (330) including a second sidewall (331) at least partially surrounding the AF housing and facing the first sidewall and spaced apart from the first sidewall; a lower housing (350) coupled to the upper housing, including a third sidewall (351) at least partially surrounding the image sensor and positioned between the first sidewall and the second sidewall; and an elastic member disposed between the third sidewall of the lower housing and the first sidewall of the AF housing. Absence (400) may be included.

[0128] In one embodiment, the lower housing further comprises a spring member (SP2), one ending portion of the spring member being connected to the AF housing and another ending portion of the spring member being extending between the first side wall and the third side wall and positioned adjacent to the elastic member.

[0129] In one embodiment, the third side wall is formed to substantially face the edges of the AF housing and includes a first region (351a) and a second region (351b) that are substantially perpendicular to each other, and the elastic member may include a first elastic member (401) and a second elastic member (402) that are respectively (respectively) disposed in the first region and the second region.

[0130] In one embodiment, a portion of the second side wall may protrude toward the lower housing so as to cover at least a portion of the spring member when viewed from above of the camera module.

[0131] According to various embodiments disclosed in this document, an elastic member (400) may be disposed between one side wall (341) of the AF housing (340) and one side wall (351) of the lower housing (350). The elastic member (400) may dampen vibration (e.g., shaking) of the AF housing (340) relative to the lower housing (350) when an external impact is applied to the camera module (180, 300). Accordingly, when vibration occurs in the AF housing (340), the lens assembly (310) accommodated in the AF housing (340) also vibrates, thereby alleviating the image shaking phenomenon that occurs.

[0132] In a comparative example, when the AF housing (340), the lower housing (350), and the upper housing (330) are assembled, an elastic member (400) may be applied between one side wall (341) of the AF housing (340) and one side wall (351) of the lower housing (350). In this case, the elastic member (400) may be applied to an unintended location (e.g., an area other than between one side wall (341) of the AF housing (340) and one side wall (351) of the lower housing (350), and the elastic member (400) may be contaminated by foreign substances. According to one embodiment of the present disclosure, after the elastic member (400) is applied between one side wall (341) of the AF housing (340) and one side wall (351) of the lower housing (350), the upper housing (330) may be assembled to the lower housing (350). Accordingly, the elastic member (400) can be accurately applied to one side wall (341) of the AF housing (340) and one side wall (351) of the lower housing (350), and the possibility of contamination of the elastic member (400) by foreign substances can be reduced.

[0133] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0134] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0135] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0136] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0137] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0138] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0139] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the camera module (180, 300), A lens assembly (310) comprising one or more lenses (312) substantially aligned along an optical axis; An image sensor (381) set to detect light acquired through the above lens assembly; An auto focus (AF) housing (340) comprising a first side wall (341), at least partially accommodating the lens assembly and moving substantially along the optical axis; An upper housing (330) comprising a second side wall (331) at least partially surrounding the AF housing and facing the first side wall and spaced apart from the first side wall; A lower housing (350) comprising a third side wall (351) that surrounds at least a portion of the image sensor and is positioned between the first side wall and the second side wall, and is coupled to the upper housing; and A camera module comprising an elastic member (400) disposed between the third side wall of the lower housing and the first side wall of the AF housing.

2. In paragraph 1, Further comprising a spring member (SP2) arranged in the lower housing; A camera module, wherein one ending portion of the spring member is connected to the AF housing and another ending portion of the spring member extends between the first side wall and the third side wall and is positioned adjacent to the elastic member.

3. In paragraph 2, A camera module, wherein at least a portion of the other ending portion of the spring member is arranged to penetrate the elastic member.

4. In any one of paragraphs 1 to 3, A camera module wherein the third side wall is formed to substantially face the corner of the AF housing.

5. In paragraph 4, A camera module, wherein the third side wall comprises a first region (351a) and a second region (351b) that are substantially perpendicular to each other, and the elastic member comprises a first elastic member (401) and a second elastic member (402) disposed in the first region and the second region, respectively.

6. In paragraph 5, A camera module wherein the first elastic member and the second elastic member are spaced apart from each other.

7. In any one of paragraphs 1 to 6, A camera module, wherein the first side wall includes a protrusion (342) protruding toward the third side wall so as to contact the elastic member.

8. In paragraph 7, A camera module, wherein the protrusion includes a recess (343) formed in an opposite direction from the third side wall at one end, and at least a portion of the recess comes into contact with the elastic member.

9. In any one of paragraphs 1 to 8, A camera module, wherein a portion of the second side wall protrudes toward the lower housing so as to cover at least a portion of the elastic member when viewed from above the camera module.

10. In any one of paragraphs 1 to 9, The camera module, wherein the lower housing includes a fourth side wall (352) arranged on the outer side of the second side wall of the upper housing.

11. In any one of paragraphs 1 to 10, A camera module, wherein one end of the second side wall of the upper housing is positioned between the third side wall and the fourth side wall of the lower housing.

12. In any one of paragraphs 1 to 11, A camera module in which the height (H1) of the third side wall is formed lower than the height (H2) of the fourth side wall.

13. In any one of paragraphs 1 to 12, A camera module wherein the length (L1) of the third side wall is shorter than the length (L2) of the fourth side wall.

14. In any one of paragraphs 1 to 13, The third side wall and the fourth side wall protrude from the bottom surface (3511) of the lower housing, A camera module, wherein the bottom surface includes a first support surface (3501) between the third side wall and the first side wall and a second support surface (3502) between the third side wall and the fourth side wall, and the first support surface is formed lower than the second support surface.

15. In an electronic device (101) including a camera module (180, 300), The above camera module, A lens assembly (310) comprising one or more lenses (312) substantially aligned along an optical axis; An image sensor (381) set to detect light acquired through the above lens assembly; An auto focus (AF) housing (340) including a first side wall (341), which accommodates at least a portion of the lens assembly and moves substantially along the optical axis; An upper housing (330) including a second side wall (331) that surrounds at least a portion of the AF housing and faces the first side wall and is spaced apart from the first side wall; A lower housing (350) that surrounds at least a portion of the image sensor and includes a third side wall (351) positioned between the first side wall and the second side wall and is coupled to the upper housing, and An electronic device comprising an elastic member (400) disposed between the third side wall of the lower housing and the first side wall of the AF housing.

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